TW201512120A - Scribing head, scribing device and scribing method - Google Patents

Scribing head, scribing device and scribing method Download PDF

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Publication number
TW201512120A
TW201512120A TW103123187A TW103123187A TW201512120A TW 201512120 A TW201512120 A TW 201512120A TW 103123187 A TW103123187 A TW 103123187A TW 103123187 A TW103123187 A TW 103123187A TW 201512120 A TW201512120 A TW 201512120A
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TW
Taiwan
Prior art keywords
substrate
cutter
force
scribing
body portion
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TW103123187A
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Chinese (zh)
Inventor
Hiroshi Soyama
Original Assignee
Mitsuboshi Diamond Ind Co Ltd
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Application filed by Mitsuboshi Diamond Ind Co Ltd filed Critical Mitsuboshi Diamond Ind Co Ltd
Publication of TW201512120A publication Critical patent/TW201512120A/en

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Classifications

    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/10Glass-cutting tools, e.g. scoring tools
    • C03B33/105Details of cutting or scoring means, e.g. tips
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/037Controlling or regulating
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033Apparatus for opening score lines in glass sheets
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00Technologies relating to the processing of minerals
    • Y02P40/50Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57Improving the yield, e-g- reduction of reject rates

Abstract

The present invention not only inhibits damage of the cutter, but truly forms a starting-point crack. A cutter 120 is installed in the machine body part 110; the load part 130, including a first actuator 131 for generating the force LD, applies a continuous force LD on the machine body part 110 by means of pressing the cutter 120 against the top of the substrate 4; the impact part 140, including a hitting member 142, a second actuator 141 and a stopping member 144, applies an abrupt impact force on the machine body part 110 by means of pressing the cutter 120 against the top of the substrate 4, wherein the hitting pin 142 can displace by means of hitting the machine body part 110, the second actuator 141 can apply a continuous force against the hitting member 142 toward the machine body part 110, and the stopping member 144 cam temporarily stop the hitting pin 142 at a location separated from the machine body part 110.

Description

劃線頭、劃線裝置及劃線方法 Dash head, scribing device and scribing method

本發明係關於一種劃線頭、劃線裝置及劃線方法,尤其關於一種包含切刀之劃線頭及劃線裝置、以及使用上述劃線裝置之劃線方法。 The present invention relates to a scribing head, a scribing apparatus, and a scribing method, and more particularly to a scribing head and scribing apparatus including a cutter, and a scribing method using the scribing apparatus.

於平面顯示面板或太陽電池面板等電氣設備之製造中,經常要將由例如玻璃、半導體、藍寶石、陶瓷等脆性材料製成之基板切斷。多數情況下,利用劃線裝置進行基板之劃線。即,於基板表面形成劃線。所謂劃線係指於基板之表面上呈線狀延伸且於基板之厚度方向行進至足以進行分斷之程度之裂紋。所謂分斷係指於形成劃線後進行之對基板賦予應力之步驟。藉由分斷而使裂紋於厚度方向完全行進,藉此沿劃線將基板完全切斷。 In the manufacture of electrical equipment such as flat display panels or solar cell panels, substrates made of brittle materials such as glass, semiconductor, sapphire, ceramics, etc. are often cut. In most cases, the scribing device is used to scribe the substrate. That is, a scribe line is formed on the surface of the substrate. The scribe line refers to a crack that extends linearly on the surface of the substrate and travels in the thickness direction of the substrate to a degree sufficient for breaking. The term "breaking" refers to a step of imparting stress to a substrate after forming a scribe line. The crack is completely traveled in the thickness direction by breaking, thereby completely cutting the substrate along the scribe line.

若以基板之邊緣為起點,則可容易地形成劃線。其原因在於,於基板之邊緣容易引起局部之破壞,可將該破壞作為起點使劃線延伸。然而,常常期望以與基板之邊緣隔開之位置為起點開始形成劃線。於該情形時,由於起點位於基板之表面之平坦面上而非基板之邊緣,故而切刀之刀尖容易打滑。因而,難以產生成為用以開始形成劃線之開端之破壞(以下稱為起點裂紋)。因此,研究形成起點裂紋之技術。 If the edge of the substrate is used as a starting point, the scribe line can be easily formed. The reason for this is that local damage is likely to occur at the edge of the substrate, and the damage can be used as a starting point to extend the scribe line. However, it is often desirable to begin forming a scribe line starting from a position spaced apart from the edge of the substrate. In this case, since the starting point is on the flat surface of the surface of the substrate instead of the edge of the substrate, the tip of the cutter is easy to slip. Therefore, it is difficult to generate damage (hereinafter referred to as a starting crack) which is used to start the formation of the scribe line. Therefore, the technique of forming a starting crack is studied.

根據日本專利特開2000-264656號公報(專利文獻1),公開有於工件面形成劃線之劃線方法。劃線裝置包含劃線本體,劃線本體具有切 刀、及對切刀賦予振動之振動產生構件。根據該方法,藉由使劃線本體以於上方與工件隔開之狀態沿著工件面相對移動,而使切刀位於劃線起始點之正上方。繼而,使劃線本體下降,藉此切刀之前端以劃線本體之自重抵接於劃線起始點。其後,藉由對劃線本體賦予衝擊,而於工件面在與邊緣隔開之劃線起始點形成起點裂紋。藉由對工件賦予振動,而以起點裂紋為開端形成劃線。 A method of forming a scribe line on a surface of a workpiece is disclosed in Japanese Laid-Open Patent Publication No. 2000-264656 (Patent Document 1). The scribing device includes a scribing body, and the scribing body has a cut The knife and the vibration generating member that imparts vibration to the cutter. According to this method, the cutter is positioned directly above the starting point of the scribing line by relatively moving the scribing body along the workpiece surface in a state of being spaced apart from the workpiece. Then, the scribing body is lowered, whereby the front end of the cutter abuts on the starting point of the scribing line with the self-weight of the scribing body. Thereafter, by applying an impact to the scribe line body, a starting point crack is formed on the workpiece surface at a starting point of the scribe line spaced apart from the edge. By applying vibration to the workpiece, a scribe line is formed starting from the starting crack.

[先前技術文獻] [Previous Technical Literature] [專利文獻] [Patent Literature]

[專利文獻1]日本專利特開2000-264656號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2000-264656

起點裂紋係藉由對劃線本體(劃線頭)賦予衝擊而形成。藉此,若衝擊過小,則無法形成起點裂紋,相反,若衝擊過大,則會對切刀造成不必要之損傷。因此,要求精確控制衝擊之大小。然而,於上述公報記載之技術中,衝擊之大小之偏差較大。 The starting point crack is formed by imparting an impact to the scribing body (the scribing head). Therefore, if the impact is too small, the starting point crack cannot be formed, and if the impact is too large, unnecessary damage to the cutter is caused. Therefore, it is required to precisely control the magnitude of the impact. However, in the technique described in the above publication, the variation in the magnitude of the impact is large.

本發明係為了解決如上所述之問題而完成者,其目的在於提供一種於以與基板之邊緣隔開之位置為起點形成劃線時可抑制對切刀之損傷且確實地形成起點裂紋的劃線頭、劃線裝置及劃線方法。 The present invention has been made in order to solve the above problems, and an object of the invention is to provide a method for suppressing damage to a cutter and reliably forming a starting point crack when a scribe line is formed at a position spaced apart from an edge of the substrate. Head, scribing and scribing methods.

本發明之劃線頭係用以於基板之表面形成劃線者,且包含機身部、切刀、負荷部及衝擊部。切刀安裝於機身部。負荷部以將切刀壓抵於基板之表面上之方式而可對機身部施加連續之力。負荷部包含用以產生力之第1致動器。衝擊部以將切刀壓抵於基板之表面上之方式而可對機身部施加衝擊性之力。衝擊部包含擊打構件、第2致動器及擋止部。擊打構件可以擊打機身部之方式移位。第2致動器可朝向機身部對擊打構件施加連續之力。擋止部可將擊打構件暫時地擋止於與 機身部隔開之位置。 The scribing head of the present invention is for forming a scribing surface on the surface of the substrate, and includes a fuselage portion, a cutter, a load portion, and an impact portion. The cutter is mounted on the fuselage section. The load portion applies a continuous force to the body portion by pressing the cutter against the surface of the substrate. The load portion includes a first actuator for generating a force. The impact portion can apply an impact force to the body portion by pressing the cutter against the surface of the substrate. The impact portion includes a striking member, a second actuator, and a stopper. The striking member can be displaced in a manner that hits the fuselage portion. The second actuator can apply a continuous force to the striking member toward the fuselage portion. The stopping portion temporarily blocks the striking member from The position where the fuselage section is separated.

較佳為劃線頭包含基座部,上述基座部具有將機身部可旋動地支持之支點。 Preferably, the scribing head includes a base portion, and the base portion has a fulcrum that rotatably supports the body portion.

較佳為劃線頭構成為可變更支點之高度。 Preferably, the scribing head is configured to change the height of the fulcrum.

本發明之劃線裝置包括上述劃線頭及驅動部。驅動部使基板與劃線頭相對移位。 The scribing device of the present invention includes the scribing head and the driving portion. The driving portion relatively displaces the substrate and the scribing head.

本發明之一態樣之劃線方法包括以下步驟。準備安裝有切刀之機身部。一面將擊打構件擋止於與機身部隔開之位置,一面朝向機身部對擊打構件施加連續之力。釋放被擋止之擊打構件。藉由被釋放之擊打構件擊打機身部,切刀以衝擊性之力壓抵於基板之表面上,藉此於基板之表面上形成起點裂紋。一面以將切刀壓抵於基板之表面上之方式對機身部施加連續之力,一面藉由基板與機身部之相對移位而使切刀於基板之表面上移行,藉此使劃線自起點裂紋延展。 The scribing method of one aspect of the present invention includes the following steps. Prepare the fuselage section with the cutter installed. The striking member is stopped at a position spaced apart from the body portion, and a continuous force is applied to the striking member toward the body portion. Release the struck member that is blocked. The striking member is struck by the released striking member, and the cutter is pressed against the surface of the substrate with an impact force, thereby forming a starting crack on the surface of the substrate. Applying a continuous force to the body portion by pressing the cutter against the surface of the substrate, the cutter is moved on the surface of the substrate by the relative displacement of the substrate and the body portion, thereby making the stroke The line extends from the starting point crack.

於上述一態樣之劃線方法中,較佳為準備機身部之步驟係藉由準備劃線頭而進行。劃線頭包含機身部及基座部。於機身部安裝有切刀。基座部具有將機身部可旋動地支持之支點。使切刀於基板之表面上移行之步驟可以支點位於切刀之後側之方式進行,或亦可以支點位於切刀之前側之方式進行。 In the above-described one-line scribing method, it is preferred that the step of preparing the fuselage portion is performed by preparing a scribing head. The scribing head includes a fuselage portion and a base portion. A cutter is attached to the fuselage section. The base portion has a fulcrum that supports the body portion in a rotatable manner. The step of moving the cutter on the surface of the substrate may be performed in such a manner that the fulcrum is located on the rear side of the cutter, or the fulcrum may be located on the front side of the cutter.

本發明之另一態樣之劃線方法包括以下步驟。一面將切刀靜置於基板之表面上,一面將切刀以力F1壓抵於基板之表面上。對靜置於基板之表面上且以力F1壓抵於基板之表面上之切刀施加較力F1大之力F2,以於基板之表面上形成起點裂紋。一面藉由基板與機身部之相對移位而使切刀於基板之表面上移行,一面將切刀以較力F1小之力F3壓抵於基板之表面上,以使劃線自起點裂紋延展。 Another aspect of the scribing method of the present invention includes the following steps. While the cutter is placed on the surface of the substrate, the cutter is pressed against the surface of the substrate by force F 1 . Static disposed on the upper surface of the substrate with a force F 1 and pressed against the cutter on the surface of the substrate than the force F 1 is applied to a large force F 2, to form a starting point of cracking on the surface of the substrate. The cutter is moved on the surface of the substrate by the relative displacement of the substrate and the body portion, and the cutter is pressed against the surface of the substrate by a force F 3 with a force F 1 to make the line The starting crack is extended.

於上述另一態樣之劃線方法中,較佳為力F2為衝擊性之力。 Another aspect of the above-described scribing method, a force F 2 is preferably a force of impact.

根據本發明之劃線頭及劃線裝置、以及本發明之一態樣之劃線方法,用以形成起點裂紋之擊打構件對機身部之擊打係藉由釋放自致動器被施加力且被擋止之擊打構件而進行。藉此,可使來自致動器之力之大小於擊打構件被擋止之期間穩定化。因此,可將於形成起點裂紋時對切刀施加之衝擊力精度良好地控制為所需充分之大小。藉此,可避免因衝擊力過大而對切刀造成不必要之損傷,或者相反因衝擊力過小而無法形成起點裂紋。因此,可抑制對切刀之損傷且確實地形成起點裂紋。 According to the scribing head and scribing device of the present invention, and the scribing method of one aspect of the present invention, the striking member for forming the starting point crack is applied to the fuselage portion by being released from the actuator Forced and struck by the striking member. Thereby, the magnitude of the force from the actuator can be stabilized during the period in which the striking member is blocked. Therefore, the impact force applied to the cutter at the time of forming the starting crack can be accurately controlled to a desired sufficient size. Thereby, it is possible to avoid unnecessary damage to the cutter due to excessive impact force, or conversely, the impact crack force is too small to form a starting crack. Therefore, damage to the cutter can be suppressed and the starting crack can be surely formed.

根據本發明之另一態樣之劃線方法,於為形成起點裂紋而對切刀施加衝擊力時,預先將切刀以較為形成劃線而施加之力大之力壓抵於基板之表面上。藉此,於以與基板之邊緣隔開之位置為起點形成劃線時,可充分地抑制切刀於基板之表面上回彈。因此,可抑制對切刀造成之損傷且確實地形成起點裂紋。 According to another aspect of the present invention, when an impact force is applied to the cutter to form a starting crack, the cutter is preliminarily pressed against the surface of the substrate by a force exerted by the scribe line. . Thereby, when the scribe line is formed at a position spaced apart from the edge of the substrate, the blade can be sufficiently suppressed from rebounding on the surface of the substrate. Therefore, damage to the cutter can be suppressed and the starting crack can be surely formed.

如上所述,根據本發明,於以與基板之邊緣隔開之位置為起點形成劃線時,可抑制對切刀之損傷且確實地形成起點裂紋。 As described above, according to the present invention, when the scribe line is formed at a position spaced apart from the edge of the substrate, damage to the cutter can be suppressed and the starting crack can be surely formed.

1‧‧‧劃線裝置 1‧‧‧ scribe device

4‧‧‧基板 4‧‧‧Substrate

10‧‧‧保持單元 10‧‧‧Holding unit

10a‧‧‧基部 10a‧‧‧ base

11‧‧‧平台 11‧‧‧ platform

11a‧‧‧吸附部 11a‧‧‧Adsorption Department

11b‧‧‧旋轉台 11b‧‧‧Rotary table

11c‧‧‧移動台 11c‧‧‧Mobile Station

11d‧‧‧旋轉軸 11d‧‧‧Rotary axis

12‧‧‧滾珠螺桿機構 12‧‧‧Rolling screw mechanism

12a‧‧‧進給螺桿 12a‧‧‧feed screw

12b‧‧‧螺母 12b‧‧‧Nuts

13‧‧‧馬達 13‧‧‧Motor

14a‧‧‧支持部 14a‧‧‧Support Department

14b‧‧‧支持部 14b‧‧‧Support Department

15、16‧‧‧導軌 15, 16‧‧‧ rails

17‧‧‧滑動部 17‧‧‧Sliding section

18‧‧‧滑動部 18‧‧‧Sliding section

20‧‧‧劃線單元 20‧‧‧dotted unit

30‧‧‧劃線頭 30‧‧‧Scribe head

30V‧‧‧劃線頭 30V‧‧‧Drawing head

70‧‧‧驅動部 70‧‧‧ Drive Department

71‧‧‧支柱 71‧‧‧ pillar

72‧‧‧導軌 72‧‧‧rails

73‧‧‧馬達 73‧‧‧Motor

80‧‧‧攝像部單元 80‧‧‧ camera unit

85‧‧‧相機 85‧‧‧ camera

90‧‧‧控制單元 90‧‧‧Control unit

91‧‧‧ROM 91‧‧‧ROM

91a‧‧‧程式 91a‧‧‧Program

92‧‧‧RAM 92‧‧‧RAM

93‧‧‧CPU 93‧‧‧CPU

110‧‧‧機身部 110‧‧‧Face Department

111‧‧‧機身本體 111‧‧‧ body body

112‧‧‧保持器支持構件 112‧‧‧Retainer support member

113‧‧‧旋動構件 113‧‧‧Rotating components

120‧‧‧切刀 120‧‧‧Cutter

121‧‧‧刀尖 121‧‧‧Tool tip

122‧‧‧保持器 122‧‧‧keeper

130‧‧‧負荷部 130‧‧‧Load Department

131‧‧‧缸(第1致動器) 131‧‧‧Cylinder (1st actuator)

132‧‧‧按壓銷 132‧‧‧ Press pin

140‧‧‧衝擊部 140‧‧‧ Impact Department

141‧‧‧缸(第2致動器) 141‧‧‧Cylinder (2nd actuator)

142‧‧‧擊打銷(擊打構件) 142‧‧‧ hitting pin (hitting component)

143‧‧‧開關 143‧‧‧ switch

144‧‧‧擋板(擋止部) 144‧‧‧Baffle (stop)

150‧‧‧基座部 150‧‧‧Base section

151‧‧‧基座本體 151‧‧‧Base body

152‧‧‧限制部 152‧‧‧Restrictions

153‧‧‧軸支持構件 153‧‧‧Axis support members

AG‧‧‧角度 AG‧‧‧ angle

AR1‧‧‧箭頭 AR1‧‧‧ arrow

AR2‧‧‧箭頭 AR2‧‧‧ arrow

AX‧‧‧支點 AX‧‧‧ pivot

CT‧‧‧延伸方向 CT‧‧‧Extension direction

DR1‧‧‧行進方向 DR1‧‧‧direction of travel

DR2‧‧‧行進方向 DR2‧‧‧direction of travel

EG‧‧‧邊緣 EG‧‧‧ edge

F‧‧‧力 F‧‧‧ force

F1‧‧‧力 F 1 ‧‧‧ force

F2‧‧‧力 F 2 ‧‧‧ force

F3‧‧‧力 F 3 ‧‧‧ force

FC‧‧‧表面 FC‧‧‧ surface

HL‧‧‧螺釘孔 HL‧‧‧ screw holes

HM‧‧‧螺釘孔 HM‧‧‧ screw holes

IP‧‧‧衝擊力 IP‧‧‧ impact

LD‧‧‧力 LD‧‧‧ force

LD1‧‧‧力 LD 1 ‧‧‧ force

LD2‧‧‧力 LD 2 ‧‧‧ force

LE‧‧‧力 LE‧‧‧力

NM‧‧‧法線方向 NM‧‧‧ normal direction

R1‧‧‧箭頭 R1‧‧‧ arrow

SL‧‧‧劃線 SL‧‧‧

TG‧‧‧起點裂紋 TG‧‧‧ starting crack

圖1係概略地表示本發明之實施形態1之劃線頭之構成的側視圖。 Fig. 1 is a side view schematically showing the configuration of a scribing head according to a first embodiment of the present invention.

圖2係圖1之切刀之局部放大圖。 Figure 2 is a partial enlarged view of the cutter of Figure 1.

圖3係概略地表示利用本發明之實施形態1之劃線方法而形成之劃線的俯視圖。 Fig. 3 is a plan view schematically showing a scribe line formed by the scribing method according to the first embodiment of the present invention.

圖4係概略地表示本發明之實施形態1之劃線方法之第1步驟的側視圖。 Fig. 4 is a side view schematically showing a first step of the scribing method according to the first embodiment of the present invention.

圖5係概略地表示本發明之實施形態1之劃線方法之第2步驟的側視圖。 Fig. 5 is a side view schematically showing a second step of the scribing method according to the first embodiment of the present invention.

圖6係概略地表示本發明之實施形態1之劃線方法之第3步驟的側 視圖。 Fig. 6 is a side view schematically showing the third step of the scribing method according to the first embodiment of the present invention; view.

圖7係概略地表示本發明之實施形態1之劃線方法之一態樣的流程圖。 Fig. 7 is a flow chart schematically showing an aspect of the scribing method according to the first embodiment of the present invention.

圖8係概略地表示本發明之實施形態1之劃線方法之另一態樣的流程圖。 Fig. 8 is a flow chart schematically showing another aspect of the scribing method according to the first embodiment of the present invention.

圖9係概略地表示本發明之實施形態1之劃線方法之動作圖表。 Fig. 9 is a view schematically showing the operation of the scribing method according to the first embodiment of the present invention.

圖10係概略地表示本發明之實施形態2之劃線方法之第1步驟的側視圖。 Fig. 10 is a side view schematically showing a first step of the scribing method according to the second embodiment of the present invention.

圖11係概略地表示本發明之實施形態2之劃線方法之第2步驟的側視圖。 Fig. 11 is a side view schematically showing a second step of the scribing method according to the second embodiment of the present invention.

圖12係概略地表示本發明之實施形態2之劃線方法之第3步驟的側視圖。 Fig. 12 is a side view schematically showing a third step of the scribing method according to the second embodiment of the present invention.

圖13係概略地表示本發明之實施形態3之劃線頭之構成的側視圖。 Fig. 13 is a side view schematically showing the configuration of a scribing head according to a third embodiment of the present invention.

圖14係概略地表示變更圖13之劃線頭之支點後之情況的側視圖。 Fig. 14 is a side view schematically showing a state in which the fulcrum of the scribing head of Fig. 13 is changed.

圖15係概略地表示本發明之實施形態4之劃線裝置之構成的前視圖。 Fig. 15 is a front elevational view schematically showing the configuration of a scribing apparatus according to a fourth embodiment of the present invention.

圖16係概略地表示本發明之實施形態4之劃線裝置之構成的側視圖。 Fig. 16 is a side view schematically showing the configuration of a scribing apparatus according to a fourth embodiment of the present invention.

以下,基於圖式對本發明之實施形態進行說明。再者,於以下之圖式中對相同或相當之部分標註相同之參照編號,且不進行重複說明。 Hereinafter, embodiments of the present invention will be described based on the drawings. In the following drawings, the same or corresponding components are designated by the same reference numerals, and the description is not repeated.

(實施形態1) (Embodiment 1)

圖1表示本實施形態之劃線頭30、基板4、支持基板4之平台11。 本實施形態之劃線頭30係與使劃線頭30相對於基板4相對移位之機構(於圖1中未圖示)一同組裝至劃線裝置中而使用。再者,以下有對藉由一面靜置基板4一面使劃線頭30移動而進行該相對移位之情形進行說明之情況,但只要可取得等效之相對移位,則亦可一面使劃線頭30靜止一面使基板4移動,或者亦可使兩者均移動。 Fig. 1 shows a stage 11 of a scribing head 30, a substrate 4, and a support substrate 4 of the present embodiment. The scribing head 30 of the present embodiment is used in combination with a mechanism (not shown in FIG. 1) for displacing the scribing head 30 with respect to the substrate 4, and is used in the scribing device. In the following, the case where the relative displacement is performed by moving the scribing head 30 while standing on the substrate 4 is described below. However, as long as the equivalent relative displacement can be obtained, the engraving may be performed. The wire head 30 moves while the substrate 4 is stationary, or both can be moved.

劃線頭30係用以於基板4之表面FC形成劃線。基板4係由例如玻璃、半導體、藍寶石或陶瓷等脆性材料製成。劃線頭30包含機身部110、切刀120、負荷部130、衝擊部140、及基座部150。 The scribing head 30 is used to form a scribe line on the surface FC of the substrate 4. The substrate 4 is made of a brittle material such as glass, semiconductor, sapphire or ceramic. The scribing head 30 includes a body portion 110, a cutter 120, a load portion 130, an impact portion 140, and a base portion 150.

切刀120安裝於機身部110。切刀120於來自機身部110之作用下以力F壓抵於基板4之表面FC。 The cutter 120 is attached to the body portion 110. The cutter 120 is pressed against the surface FC of the substrate 4 by the force F under the action of the body portion 110.

進而,參照圖2,切刀120具有刀尖121及保持刀尖121之保持器122。較佳為切刀120為金剛石尖(diamond point)。即,刀尖121較佳為由金剛石製成。金剛石為天然或經合成之單晶體金剛石、多晶體金剛石、或利用鐵族元素等結合材料使金剛石粒子結合而成之燒結金剛石。於劃線頭30之下述行進方向DR1與基板4之表面FC之法線方向NM所形成之平面上,行進方向DR1與保持器122朝向刀尖121延伸之延伸方向CT較佳為形成超過90°且未達180°之角度AG。 Furthermore, referring to FIG. 2, the cutter 120 has a blade edge 121 and a holder 122 that holds the blade tip 121. Preferably, the cutter 120 is a diamond point. That is, the blade tip 121 is preferably made of diamond. The diamond is a natural or synthetic single crystal diamond, a polycrystalline diamond, or a sintered diamond obtained by combining diamond particles using a bonding material such as an iron group element. In a plane formed by the following traveling direction DR1 of the scribing head 30 and the normal direction NM of the surface FC of the substrate 4, the traveling direction DR1 and the extending direction CT of the holder 122 extending toward the blade edge 121 preferably form over 90. ° and not at an angle of 180 ° AG.

再者,保持器122例如為呈圓柱狀或角柱狀延伸之棒體。刀尖121之形狀只要根據劃線決定即可,例如為四角錐台形形狀。於具有沿著延伸方向CT之法線之截面,保持器122較佳為具有2mm~6mm左右之最大尺寸(於保持器122為圓柱狀之情形時為直徑尺寸)。沿著延伸方向CT之保持器122之長度較佳為10~70mm左右。於刀尖121具有四角錐台形形狀之情形時,刀尖121之於與保持器122之前端部之接合部附近之一邊的尺寸較佳為0.5~3.0mm左右,更佳為0.8~2.0mm左右。 Further, the holder 122 is, for example, a rod extending in a cylindrical shape or a columnar shape. The shape of the blade edge 121 may be determined by a scribe line, and is, for example, a quadrangular frustum shape. The retainer 122 preferably has a maximum dimension of about 2 mm to 6 mm (having a diameter dimension when the retainer 122 is cylindrical) in a cross section having a normal line along the extending direction CT. The length of the holder 122 along the extending direction CT is preferably about 10 to 70 mm. When the blade tip 121 has a quadrangular frustum shape, the dimension of the blade edge 121 near one side of the joint portion with the front end portion of the retainer 122 is preferably about 0.5 to 3.0 mm, more preferably about 0.8 to 2.0 mm. .

機身部110具有機身本體111及保持器支持構件112。保持器支持 構件112可調整切刀120之保持器122延伸之延伸方向CT(圖2)地支持保持器122。 The body portion 110 has a body body 111 and a holder supporting member 112. Holder support The member 112 can support the retainer 122 in an extended direction CT (FIG. 2) in which the retainer 122 of the cutter 120 extends.

基座部150具有基座本體151及限制部152。基座本體151具有將機身部110可旋動地支持之支點AX。限制部152限制機身部110朝下方旋動之範圍。 The base portion 150 has a base body 151 and a restricting portion 152. The base body 151 has a fulcrum AX that rotatably supports the body portion 110. The restricting portion 152 limits the range in which the body portion 110 is swung downward.

負荷部130由基座部150支持。負荷部130可以將切刀120壓抵於基板4之表面FC上之方式對機身部110施加連續之力LD。負荷部130具有用以產生力LD之缸131(第1致動器)、及用以傳遞力之按壓銷132。 The load portion 130 is supported by the base portion 150. The load portion 130 can apply a continuous force LD to the body portion 110 in such a manner that the cutter 120 is pressed against the surface FC of the substrate 4. The load portion 130 has a cylinder 131 (first actuator) for generating a force LD, and a pressing pin 132 for transmitting a force.

衝擊部140由基座部150支持。衝擊部140可以將切刀120壓抵於基板4之表面FC上之方式對機身部110施加衝擊性之力。衝擊部140具有缸141(第2致動器)、擊打銷142(擊打構件)、開關143、及擋板144(擋止部)。 The impact portion 140 is supported by the base portion 150. The impact portion 140 can apply an impact force to the body portion 110 in such a manner that the cutter 120 is pressed against the surface FC of the substrate 4. The impact portion 140 has a cylinder 141 (second actuator), a striking pin 142 (strike member), a switch 143, and a baffle 144 (stop portion).

缸141可藉由朝向機身部110對擊打銷142施加連續之力LE而使擊打銷142突出。擊打銷142可藉由缸141而於返回端之位置與突出端之位置之間移位。當位於返回端時擊打銷142與機身部110隔開,當位於突出端時擊打銷142碰觸機身部110。藉此,擊打銷142可以擊打機身部110之方式移位。 The cylinder 141 can cause the striking pin 142 to protrude by applying a continuous force LE to the striking pin 142 toward the fuselage portion 110. The striking pin 142 is displaceable between the position of the return end and the position of the projecting end by the cylinder 141. The striking pin 142 is spaced from the fuselage portion 110 when in the return end, and the striking pin 142 is in contact with the fuselage portion 110 when in the protruding end. Thereby, the striking pin 142 can be displaced in such a manner as to hit the body portion 110.

開關143係將擋板144之位置於關閉位置與打開位置之間切換之致動器,例如為缸。位於關閉位置之擋板144(圖1)將擊打銷142欲朝向機身部110突出之路徑阻斷。於該情形時,因欲突出之擊打銷142壓抵於擋板144而阻礙擊打銷142移位。即,擋板144將擊打銷142擋止於與機身部110隔開之位置。若使擋板144移動至打開位置,即,使擋板144朝向圖1中之上方後退,則擋板144便不擋止擊打銷142。如上所述,擋板144構成為可將擊打銷142暫時地擋止於與機身部110隔開之位置。 Switch 143 is an actuator that switches the position of baffle 144 between a closed position and an open position, such as a cylinder. The baffle 144 (Fig. 1) in the closed position blocks the striking pin 142 from being projected toward the fuselage portion 110. In this case, the striking pin 142 is pressed against the baffle 144 to prevent the striking pin 142 from being displaced. That is, the flap 144 blocks the striking pin 142 from a position spaced apart from the body portion 110. If the flapper 144 is moved to the open position, i.e., the flapper 144 is retracted toward the upper side in FIG. 1, the flapper 144 does not stop the striker pin 142. As described above, the flapper 144 is configured to temporarily block the striking pin 142 from a position spaced apart from the body portion 110.

參照圖3,於本實施形態之劃線方法中,使劃線SL自起點裂紋TG 延展。即,首先形成起點裂紋TG,然後,自該起點裂紋TG形成劃線SL。起點裂紋TG形成於與基板4之邊緣EG隔開之位置。圖4~圖6分別表示劃線方法之第1~第3步驟之情況。又,圖7及圖8分別自不同之觀點表示概略之流程。圖9表示劃線裝置之動作圖表。以下,對劃線方法進行具體說明。 Referring to Fig. 3, in the scribing method of the present embodiment, the scribe line SL is made from the starting point crack TG. Extend. That is, the starting point crack TG is first formed, and then the scribe line SL is formed from the starting point crack TG. The starting crack TG is formed at a position spaced apart from the edge EG of the substrate 4. 4 to 6 show the first to third steps of the scribing method, respectively. In addition, FIG. 7 and FIG. 8 respectively show a schematic flow from a different viewpoint. Fig. 9 is a diagram showing the operation of the scribing device. Hereinafter, the scribing method will be specifically described.

參照圖4,準備劃線頭30,該劃線頭30包含:機身部110,其安裝有切刀120;及基座部150,其具有將機身部110可旋動地支持之支點AX(圖7:步驟S10)。以於基板4之表面FC應形成起點裂紋TG(圖3)之位置上配置切刀120之方式使劃線頭30進行水平移動與下降移動。 Referring to FIG. 4, a scribing head 30 is prepared. The scribing head 30 includes a body portion 110 to which a cutter 120 is mounted, and a base portion 150 having a pivot point AX for pivotally supporting the body portion 110. (Fig. 7: Step S10). The scribing head 30 is horizontally moved and lowered in such a manner that the cutter 120 is disposed at a position where the surface FC of the substrate 4 is formed with the starting crack TG (Fig. 3).

又,使擋板144處於關閉位置(圖4所示之位置)且提高缸141之壓力。藉此,一面將擊打銷142擋止於與機身部110隔開之位置,一面對擊打銷142施加連續之力LE(圖7:步驟S20)。缸141之壓力容易於壓力增大之瞬間變得不穩定,但隨著時間經過而穩定化。藉此,可精度良好地設定力LE之最終大小。 Further, the shutter 144 is placed in the closed position (the position shown in FIG. 4) and the pressure of the cylinder 141 is increased. Thereby, the striking pin 142 is stopped at a position spaced apart from the body portion 110, and a continuous force LE is applied to the striking pin 142 (FIG. 7: step S20). The pressure of the cylinder 141 tends to become unstable at the moment when the pressure is increased, but is stabilized as time passes. Thereby, the final size of the force LE can be accurately set.

又,一面將切刀120靜置於基板4之表面FC上,一面藉由使缸131產生連續之力LD1而將切刀120以力F1壓抵於基板4之表面FC上(圖8:步驟T10)。 Further, while the cutter 120 is placed on the surface FC of the substrate 4, the cutter 120 is pressed against the surface FC of the substrate 4 by the force F 1 by causing the cylinder 131 to generate a continuous force LD 1 (Fig. 8). :Step T10).

進而,參照圖5,使擋板144移動至打開位置。藉此,將被擋板144擋止之擊打銷142釋放(圖7:步驟S30)。其結果為,以力LE(圖4)被施力之擊打銷142於急遽地加速之後,以衝擊力IP擊打機身部110。典型而言,衝擊力IP持續之時間未達1秒。 Further, referring to Fig. 5, the shutter 144 is moved to the open position. Thereby, the striking pin 142 blocked by the flapper 144 is released (FIG. 7: step S30). As a result, after the striking pin 142 urged by the force LE (Fig. 4) is rapidly accelerated, the body portion 110 is struck with the impact force IP. Typically, the impact force IP lasts less than one second.

靜止於基板4之表面FC上且以力F1壓抵於基板4之表面FC上之切刀120(圖4)藉由擊打銷142擊打機身部110(圖5),而以衝擊性之力F2壓抵於基板4之表面FC上(圖8:步驟T20)。力F2係於由缸131產生之力F1上進而加上擊打銷142之力而產生者,故而當然大於力F1。藉由該衝擊性之力F2,而於基板4之表面FC上形成起點裂紋TG(圖3)(圖7:步驟 S40)。 The cutter 120 (Fig. 4) resting on the surface FC of the substrate 4 and pressed against the surface FC of the substrate 4 by the force F 1 hits the fuselage portion 110 (Fig. 5) by the hit pin 142, and is impacted The force F 2 is pressed against the surface FC of the substrate 4 (Fig. 8: step T20). The force F 2 is generated by the force F 1 generated by the cylinder 131 and the force of the striking pin 142, and is of course greater than the force F 1 . By the force of impact F 2, to form a starting point of cracking TG (FIG. 3) (FIG. 7: Step S40) on the surface of the substrate 4 FC.

參照圖6,於擊打銷142擊打機身部110之後,擊打銷142返回至與機身部110隔開之位置。又,擋板144移動至關閉位置。 Referring to FIG. 6, after the hit pin 142 hits the body portion 110, the hit pin 142 is returned to a position spaced apart from the body portion 110. Also, the shutter 144 is moved to the closed position.

藉由利用缸131對機身部110施加連續之力LD2,而將切刀120以力F3壓抵於基板4之表面FC上。力LD2較上述力LD1(圖4)小。因此,力F3小於力F1。反而言之,力F1大於力F3,較佳為力F3之約2倍以上且約5倍以下。 Continuous use of the force applied by the cylinder 131 pairs of body portion 110 LD 2, and the cutter 120 with a force F 3 pressed against the upper surface of the substrate 4 FC. The force LD 2 is smaller than the above force LD 1 (Fig. 4). Therefore, the force F 3 is smaller than the force F 1 . Conversely, a force greater than the force F 1 F 3, F 3 preferably of less than about 2 times and about 5 times less force.

於施加有力F3之狀態下,使劃線頭30朝向行進方向DR1移動,藉此使切刀120於基板4之表面FC上移行(圖8:步驟T30)。行進方向DR1沿著自支點AX朝向切刀120之方向。藉此,切刀120於基板4之表面FC上之移行係以支點AX位於切刀120之後側之方式進行。因此,如圖3所示,劃線SL自起點裂紋TG延展(圖7:步驟S50)。 In a state where the force F 3 is applied, the scribing head 30 is moved toward the traveling direction DR1, whereby the cutter 120 is moved on the surface FC of the substrate 4 (FIG. 8: Step T30). The traveling direction DR1 is along the direction from the fulcrum AX toward the cutter 120. Thereby, the transition of the cutter 120 on the surface FC of the substrate 4 is performed such that the fulcrum AX is located on the rear side of the cutter 120. Therefore, as shown in FIG. 3, the scribe line SL is extended from the starting point crack TG (FIG. 7: step S50).

根據本實施形態,用以形成起點裂紋TG之擊打銷142對機身部110之擊打係藉由釋放自缸141被施加力且被擋止之擊打銷142而進行。藉此,可使來自缸141之力之大小於擊打銷142被擋止之期間穩定化。因此,可將於形成起點裂紋TG時對切刀120施加之衝擊力精度良好地控制於所需充分之大小。藉此,可避免因衝擊力過大而對切刀120造成不必要之損傷,或者相反由於衝擊力過小而無法形成起點裂紋。因此,可抑制對切刀120之損傷且確實地形成起點裂紋TG。 According to the present embodiment, the striking pin 142 for forming the starting point crack TG strikes the body portion 110 by releasing the striking pin 142 by which the force is applied from the cylinder 141 and is blocked. Thereby, the magnitude of the force from the cylinder 141 can be stabilized during the period in which the hit pin 142 is blocked. Therefore, the impact force applied to the cutter 120 at the time of forming the starting crack TG can be accurately controlled to a desired sufficient size. Thereby, unnecessary damage to the cutter 120 due to excessive impact force can be avoided, or conversely, the starting point crack cannot be formed because the impact force is too small. Therefore, damage to the cutter 120 can be suppressed and the starting crack TG can be surely formed.

又,於為形成起點裂紋而對切刀120施加力F2時,預先將切刀120以較為形成劃線而施加之力F3大之力F1壓抵於基板4之表面FC上。藉此,於以與基板4之邊緣隔開之位置為起點形成劃線時,可充分地抑制切刀120於基板4之表面FC上回彈。因此,可抑制對切刀120造成之損傷且確實地形成起點裂紋。又,力F2為衝擊性之力。藉此,可更確實地形成起點裂紋。 And, starting at 2 to form cracks on the knife 120 exerts a force F., The force to advance the cutter 120 form a scribe line is applied more of a large force F 3 F 1 FC pressed against the upper surface of the substrate 4. Thereby, when the scribe line is formed at a position separated from the edge of the substrate 4, the cutter 120 can be sufficiently suppressed from rebounding on the surface FC of the substrate 4. Therefore, the damage to the cutter 120 can be suppressed and the starting point crack can be surely formed. Also, the force F 2 is the force of impact. Thereby, the starting point crack can be formed more surely.

又,基座部150具有將機身部110可旋動地支持之支點AX。藉 此,可將衝擊部140之衝擊力經由旋動運動而傳遞至切刀120。又,使切刀120於基板4之表面FC上移行之步驟係以支點AX位於切刀120之後側之方式進行。藉此,於劃線之形成時,切刀120容易咬入至基板4中。 Further, the base portion 150 has a fulcrum AX that rotatably supports the body portion 110. borrow Thereby, the impact force of the impact portion 140 can be transmitted to the cutter 120 via the swirling motion. Further, the step of moving the cutter 120 on the surface FC of the substrate 4 is performed such that the fulcrum AX is located on the rear side of the cutter 120. Thereby, the cutter 120 easily bites into the substrate 4 at the time of formation of the scribe line.

又,與於形成劃線時用以對切刀120施加負荷之缸131分開地,使用於形成起點裂紋時用以對切刀120施加衝擊力之缸141。藉此,可個別地選擇適於施加負荷之缸、及適於施加衝擊力之缸。 Further, the cylinder 131 for applying a load to the cutter 120 at the time of forming the scribe line is used separately for the cylinder 141 for applying an impact force to the cutter 120 when the starting point crack is formed. Thereby, a cylinder suitable for applying a load and a cylinder suitable for applying an impact force can be individually selected.

又,於形成起點裂紋時預先壓抵切刀120之力與於形成劃線時壓抵切刀120之力均藉由缸131而產生。藉此,與設置分別產生該等力之2個缸之情形相比,可使劃線頭之構成更簡單。 Further, the force which is pressed against the cutter 120 at the time of forming the starting point crack and the force which is pressed against the cutter 120 when the scribe line is formed are generated by the cylinder 131. Thereby, the configuration of the scribing head can be made simpler than in the case of providing two cylinders each generating the same force.

(實施形態2) (Embodiment 2)

於上述實施形態1中,於形成劃線SL時,使劃線頭30朝向行進方向DR1(圖6)移動。另一方面,於本實施形態中,使劃線頭30朝向與行進方向DR1相反之行進方向DR2(圖12)移動。更詳細而言,對應於實施形態1之圖4~圖6之各個步驟,進行圖10~圖12之步驟。再者,如該等圖所示,切刀120之保持器122之延伸方向CT(圖2)較佳為以基板4之表面FC之法線方向NM為基準向與實施形態1相反之方向傾斜。 In the first embodiment described above, when the scribe line SL is formed, the scribe head 30 is moved in the traveling direction DR1 (FIG. 6). On the other hand, in the present embodiment, the scribing head 30 is moved in the traveling direction DR2 (FIG. 12) opposite to the traveling direction DR1. More specifically, the steps of FIGS. 10 to 12 are performed in accordance with the respective steps of FIGS. 4 to 6 of the first embodiment. Further, as shown in the figures, the extending direction CT (Fig. 2) of the holder 122 of the cutter 120 is preferably inclined in the opposite direction to the first embodiment with respect to the normal direction NM of the surface FC of the substrate 4. .

關於上述以外之構成,由於與上述實施形態1之構成大致相同,故而對相同或對應之要素標註相同符號,且不進行重複說明。 The components other than the above are substantially the same as those of the above-described first embodiment, and the same or corresponding elements are designated by the same reference numerals, and the description thereof will not be repeated.

根據本實施形態,切刀120於基板4之表面FC上之移行係以支點AX位於切刀120之前側之方式進行(圖12)。藉此,於劃線SL(圖3)之形成時,切刀120之軌道不易偏移。尤其可有效地抑制因新延展之劃線SL與既有之劃線交叉而引發之切刀120之軌道偏移。 According to the present embodiment, the transition of the cutter 120 on the surface FC of the substrate 4 is performed such that the fulcrum AX is located on the front side of the cutter 120 (Fig. 12). Thereby, when the scribing SL (Fig. 3) is formed, the track of the cutter 120 is not easily displaced. In particular, it is possible to effectively suppress the orbital deviation of the cutter 120 caused by the intersection of the newly extended scribe line SL and the existing scribe line.

(實施形態3) (Embodiment 3)

參照圖13及圖14,本實施形態之劃線頭30V構成為可變更相對於切刀120之前端高度的支點AX之高度。具體而言,機身部110另外具 有與機身本體111不同之旋動構件113。旋動構件113由基座部150之支點AX支持為可旋動。於機身本體111,在不同高度設置有用以固定旋動構件113之螺釘孔HL,以便可選擇旋動構件113之高度。基座部150另外具有與基座本體151不同之軸支持構件153。支點AX設置於軸支持構件153。於基座本體151,在不同高度設置有用以固定軸支持構件153之螺釘孔HM,以便可選擇軸支持構件153之高度。 Referring to Figs. 13 and 14, the scribing head 30V of the present embodiment is configured to change the height of the fulcrum AX with respect to the height of the front end of the cutter 120. Specifically, the body portion 110 is additionally provided There is a rotation member 113 that is different from the body body 111. The turning member 113 is supported by the fulcrum AX of the base portion 150 to be rotatable. In the body body 111, screw holes HL for fixing the rotation member 113 are provided at different heights so that the height of the rotation member 113 can be selected. The base portion 150 additionally has a shaft support member 153 that is different from the base body 151. The fulcrum AX is disposed on the shaft support member 153. In the base body 151, screw holes HM for fixing the shaft support members 153 are provided at different heights so that the height of the shaft support members 153 can be selected.

再者,關於上述以外之構成,由於與上述實施形態1或2之構成大致相同,故而對相同或對應之要素標註相同之符號,且不進行重複說明。 The components other than the above are substantially the same as those of the above-described first or second embodiment, and the same or corresponding elements are denoted by the same reference numerals, and the description thereof will not be repeated.

根據本實施形態,可調整相對於切刀120之前端高度的機身部110之旋動中心之高度。藉此,可調整自切刀120之前端對基板4之表面FC施加之力F之方向。 According to this embodiment, the height of the center of the rotation of the body portion 110 with respect to the height of the front end of the cutter 120 can be adjusted. Thereby, the direction of the force F applied from the front end of the cutter 120 to the surface FC of the substrate 4 can be adjusted.

(實施形態4) (Embodiment 4)

於本實施形態中,對於實施形態1及2中所說明之具有劃線頭30之劃線裝置之細節部分進行說明。再者,亦可替代劃線頭30,而使用於實施形態3中說明之劃線頭30V。 In the present embodiment, the details of the scribing device having the scribing head 30 described in the first and second embodiments will be described. Further, instead of the scribing head 30, the scribing head 30V described in the third embodiment may be used.

參照圖15及圖16,劃線裝置1具有保持單元10、劃線單元20、攝像部單元80及控制單元90。再者,於圖15及圖16中,為明確該等之方向關係,標註有以Z軸方向為鉛垂方向、以XY平面為水平面之XYZ正交座標系統。 Referring to FIGS. 15 and 16 , the scribing device 1 includes a holding unit 10 , a scribing unit 20 , an imaging unit unit 80 , and a control unit 90 . In addition, in FIGS. 15 and 16, in order to clarify the direction relationship, an XYZ orthogonal coordinate system in which the Z-axis direction is the vertical direction and the XY plane is the horizontal plane is attached.

保持單元10藉由一面保持基板4一面使其移動,而使基板4相對於劃線單元20移動。如圖15所示,保持單元10設置於基部10a上,且具有平台11、滾珠螺桿機構12及馬達13。此處,基部10a例如由大致長方體狀之石定盤形成,且其上表面(與保持單元10對向之面)經平坦加工。 The holding unit 10 moves the substrate 4 relative to the scribing unit 20 by moving the substrate 4 while moving it. As shown in FIG. 15, the holding unit 10 is provided on the base 10a, and has a stage 11, a ball screw mechanism 12, and a motor 13. Here, the base portion 10a is formed, for example, by a substantially rectangular parallelepiped stone fixing plate, and its upper surface (surface facing the holding unit 10) is flattened.

平台11吸附保持所載置之基板4。又,平台11使所保持之基板4沿 箭頭AR1方向(X軸正方向或負方向,以下亦簡稱為「進退方向」)進退,且沿箭頭R1方向旋轉。平台11具有吸附部11a、旋轉台11b及移動台11c。吸附部11a設置於旋轉台11b之上側。於吸附部11a之上表面,可載置基板4。又,於吸附部11a之上表面,呈格子狀地配置有複數個吸附槽(未圖示)。因此,藉由在載置有基板4之狀態下將各吸附槽內之氣體排出,而將基板4吸附於吸附部11a。旋轉台11b設置於吸附部11a之下側,使吸附部11a以與Z軸大致平行之旋轉軸11d為中心進行旋轉。又,移動台11c設置於旋轉台11b之下側,且使吸附部11a及旋轉台11b沿進退方向移動。因此,由平台11吸附保持之基板4沿箭頭AR1方向進退,且以隨著吸附部11a之進退動作而移動之旋轉軸11d為中心進行旋轉。 The platform 11 adsorbs and holds the substrate 4 placed thereon. Moreover, the platform 11 causes the substrate 4 to be held along The direction of the arrow AR1 (the positive or negative direction of the X-axis, hereinafter also referred to as the "advance and retraction direction") is advanced and retracted, and is rotated in the direction of the arrow R1. The stage 11 has an adsorption unit 11a, a rotary table 11b, and a moving table 11c. The adsorption unit 11a is provided on the upper side of the rotary table 11b. The substrate 4 can be placed on the upper surface of the adsorption portion 11a. Further, a plurality of adsorption grooves (not shown) are arranged in a lattice on the upper surface of the adsorption portion 11a. Therefore, the gas in each adsorption tank is discharged while the substrate 4 is placed, and the substrate 4 is adsorbed to the adsorption portion 11a. The turntable 11b is provided below the suction portion 11a, and the adsorption portion 11a is rotated about the rotation shaft 11d substantially parallel to the Z axis. Further, the mobile station 11c is provided on the lower side of the turntable 11b, and moves the adsorption portion 11a and the rotary table 11b in the advancing and retracting direction. Therefore, the substrate 4 sucked and held by the stage 11 advances and retreats in the direction of the arrow AR1, and rotates around the rotating shaft 11d that moves in accordance with the forward and backward movement of the adsorption portion 11a.

滾珠螺桿機構12配置於平台11之下側,使平台11沿箭頭AR1方向進退。滾珠螺桿機構12具有進給螺桿12a、及螺母12b。進給螺桿12a係沿平台11之進退方向延伸之棒體。於進給螺桿12a之外周面設置有螺旋狀之槽(未圖示)。又,進給螺桿12a之一端由支持部14a支持為可旋轉,進給螺桿12a之另一端由支持部14b支持為可旋轉。 The ball screw mechanism 12 is disposed on the lower side of the platform 11 to advance and retreat the platform 11 in the direction of the arrow AR1. The ball screw mechanism 12 has a feed screw 12a and a nut 12b. The feed screw 12a is a rod extending in the advancing and retracting direction of the stage 11. A spiral groove (not shown) is provided on the outer peripheral surface of the feed screw 12a. Further, one end of the feed screw 12a is rotatably supported by the support portion 14a, and the other end of the feed screw 12a is rotatably supported by the support portion 14b.

馬達13與進給螺桿12a連動連結。當馬達13旋轉時,進給螺桿12a亦沿上述馬達13之旋轉方向旋轉。螺母12b隨著進給螺桿12a之旋轉,藉由滾珠(未圖示)之滾動運動而沿箭頭AR1方向進退。螺母12b固定於移動台11c之下部。因此,當馬達13被驅動,且馬達13之旋轉力被傳遞至進給螺桿12a時,螺母12b沿箭頭AR1方向進退。其結果為,固定有螺母12b之平台11與螺母12b同樣地沿箭頭AR1方向進退。 The motor 13 is coupled to the feed screw 12a. When the motor 13 rotates, the feed screw 12a also rotates in the rotational direction of the motor 13. The nut 12b advances and retreats in the direction of the arrow AR1 by the rolling motion of the balls (not shown) in accordance with the rotation of the feed screw 12a. The nut 12b is fixed to the lower portion of the moving table 11c. Therefore, when the motor 13 is driven and the rotational force of the motor 13 is transmitted to the feed screw 12a, the nut 12b advances and retreats in the direction of the arrow AR1. As a result, the stage 11 to which the nut 12b is fixed advances and retracts in the direction of the arrow AR1 in the same manner as the nut 12b.

一對導軌15、16限制平台11於行進方向上之移動。如圖16所示,一對導軌15、16係於箭頭AR2方向上僅隔開特定距離而固定於基部10a上。各滑動部17沿導軌15於箭頭AR1方向上滑動自如。各滑動部17係於箭頭AR1方向上僅隔開特定距離而固定於移動台11c之下部。 各滑動部18沿導軌16於箭頭AR1方向上滑動自如。各滑動部18與滑動部17同樣地,於箭頭AR1方向上僅隔開特定距離而固定於移動台11c之下部。 A pair of guide rails 15, 16 limits the movement of the platform 11 in the direction of travel. As shown in Fig. 16, the pair of guide rails 15, 16 are fixed to the base portion 10a by a predetermined distance in the direction of the arrow AR2. Each of the sliding portions 17 is slidable along the guide rail 15 in the direction of the arrow AR1. Each of the sliding portions 17 is fixed to the lower portion of the moving table 11c by a predetermined distance in the direction of the arrow AR1. Each of the sliding portions 18 is slidable along the guide rail 16 in the direction of the arrow AR1. Similarly to the sliding portion 17, each of the sliding portions 18 is fixed to the lower portion of the moving table 11c by a predetermined distance in the direction of the arrow AR1.

當如上所述般對滾珠螺桿機構12賦予馬達13之旋轉力時,平台11沿一對導軌15、16移動。因此,可確保平台11於進退方向上之直線性。再者,亦可替代滾珠螺桿機構12而設置線性導軌(線性馬達)。 When the rotational force of the motor 13 is imparted to the ball screw mechanism 12 as described above, the stage 11 moves along the pair of guide rails 15, 16. Therefore, the linearity of the platform 11 in the advancing and retracting direction can be ensured. Further, a linear guide (linear motor) may be provided instead of the ball screw mechanism 12.

劃線單元20具有劃線頭30及驅動部70。驅動部70使基板4與劃線頭30相對移位。具體而言,驅動部70係於形成劃線SL時,使劃線頭30沿箭頭AR2方向(Y軸負方向或正方向)往返移動。如圖16所示,驅動部70具有支柱71、導軌72及馬達73。 The scribing unit 20 has a scribing head 30 and a driving portion 70. The drive unit 70 displaces the substrate 4 and the scribing head 30 relative to each other. Specifically, when the scribe line SL is formed, the drive unit 70 reciprocates the scribe head 30 in the direction of the arrow AR2 (the Y-axis negative direction or the positive direction). As shown in FIG. 16, the drive unit 70 has a support 71, a guide rail 72, and a motor 73.

各支柱71自基部10a沿上下方向(Z軸方向)延伸。如圖16所示,各導軌72以夾於支柱71之間之狀態固定於該等支柱71。導軌72限制形成劃線SL時之劃線頭30之移動。如圖16所示,導軌72係於上下方向僅隔開特定距離而固定。馬達73與未圖示之進給機構(例如滾珠螺桿機構)連動連結。藉此,當馬達73旋轉時,劃線頭30沿導軌72於箭頭AR2方向上往返。 Each of the pillars 71 extends in the vertical direction (Z-axis direction) from the base portion 10a. As shown in FIG. 16, each of the guide rails 72 is fixed to the pillars 71 in a state of being sandwiched between the pillars 71. The guide rail 72 limits the movement of the scribing head 30 when the scribe line SL is formed. As shown in Fig. 16, the guide rails 72 are fixed only at a predetermined distance in the vertical direction. The motor 73 is coupled to a feed mechanism (for example, a ball screw mechanism) (not shown). Thereby, when the motor 73 rotates, the scribing head 30 reciprocates along the guide rail 72 in the direction of the arrow AR2.

攝像部單元80拍攝由保持單元10保持之基板4。如圖16所示,攝像部單元80具有相機85。各相機85配置於保持單元10之上方。相機85拍攝形成於基板4上之特徵部分(例如對準標記)之圖像。繼而,基於由相機85所拍攝之圖像,掌握基板4之位置及姿勢。 The imaging unit unit 80 captures the substrate 4 held by the holding unit 10. As shown in FIG. 16, the imaging unit unit 80 has a camera 85. Each camera 85 is disposed above the holding unit 10. The camera 85 captures an image of a feature portion (for example, an alignment mark) formed on the substrate 4. Then, based on the image captured by the camera 85, the position and posture of the substrate 4 are grasped.

控制單元90實現劃線裝置1之各要素之動作控制及資料運算。如圖15所示,控制單元90具有ROM91、RAM92及CPU93。ROM(Read Only Memory,唯讀記憶體)91為所謂之非揮發性之記憶部,例如儲存有程式91a。再者,ROM91亦可使用讀寫自如之非揮發性記憶體即快閃記憶體。RAM(Random Access Memory,隨機存取記憶體)92為揮發性之記憶部,例如儲存用於CPU93之運算之資料。CPU(Central Processing Unit,中央處理單元)93執行按照ROM91之程式91a之控制(例如保持單元10之進退、旋轉動作;劃線頭30之往返、升降動作;下述金剛石尖冷卻機構100之冷卻動作等之控制)、及各種資料運算處理等。 The control unit 90 realizes the operation control and data calculation of each element of the scribing device 1. As shown in FIG. 15, the control unit 90 has a ROM 91, a RAM 92, and a CPU 93. A ROM (Read Only Memory) 91 is a so-called non-volatile memory unit, and for example, a program 91a is stored. Furthermore, the ROM 91 can also use a non-volatile memory that is freely readable and writable, that is, a flash memory. A RAM (Random Access Memory) 92 is a volatile memory unit, for example, stores data for calculation of the CPU 93. CPU (Central The processing unit (Central Processing Unit) 93 performs control according to the program 91a of the ROM 91 (for example, the advancement and retreat of the holding unit 10, the rotation operation; the reciprocation and lifting operation of the scribing head 30; and the control of the cooling operation of the diamond tip cooling mechanism 100 described later). ), and various data processing and so on.

根據本實施形態,於劃線裝置1設置有劃線頭30(實施形態1或2)。藉此,如上所述,可抑制對切刀之損傷且確實地形成起點裂紋。 According to the present embodiment, the scribing head 30 is provided in the scribing device 1 (Embodiment 1 or 2). Thereby, as described above, damage to the cutter can be suppressed and the starting point crack can be surely formed.

再者,本發明可於本發明之範圍內自由地組合各實施形態,或者將各實施形態適當地變化、省略。例如,劃線頭之機身部不一定必須被支持為可旋動,亦可被支持為可於上下方向平行移動。又,亦可替代缸而使用其他致動器。 Further, the present invention can be freely combined with the respective embodiments within the scope of the present invention, or the respective embodiments can be appropriately changed or omitted. For example, the body portion of the scribing head does not necessarily have to be supported to be rotatable, and may be supported to be movable in parallel in the up and down direction. Further, other actuators may be used instead of the cylinder.

4‧‧‧基板 4‧‧‧Substrate

11‧‧‧平台 11‧‧‧ platform

30‧‧‧劃線頭 30‧‧‧Scribe head

110‧‧‧機身部 110‧‧‧Face Department

111‧‧‧機身本體 111‧‧‧ body body

112‧‧‧保持器支持構件 112‧‧‧Retainer support member

120‧‧‧切刀 120‧‧‧Cutter

130‧‧‧負荷部 130‧‧‧Load Department

131‧‧‧缸(第1致動器) 131‧‧‧Cylinder (1st actuator)

132‧‧‧按壓銷 132‧‧‧ Press pin

140‧‧‧衝擊部 140‧‧‧ Impact Department

141‧‧‧缸(第2致動器) 141‧‧‧Cylinder (2nd actuator)

142‧‧‧擊打銷(擊打構件) 142‧‧‧ hitting pin (hitting component)

143‧‧‧開關 143‧‧‧ switch

144‧‧‧擋板(擋止部) 144‧‧‧Baffle (stop)

150‧‧‧基座部 150‧‧‧Base section

151‧‧‧基座本體 151‧‧‧Base body

152‧‧‧限制部 152‧‧‧Restrictions

AX‧‧‧支點 AX‧‧‧ pivot

EG‧‧‧邊緣 EG‧‧‧ edge

F‧‧‧力 F‧‧‧ force

FC‧‧‧表面 FC‧‧‧ surface

LD‧‧‧力 LD‧‧‧ force

LE‧‧‧力 LE‧‧‧力

Claims (10)

一種劃線頭,其係用以於基板之表面形成劃線者,且包含:機身部;切刀,其安裝於上述機身部;及負荷部,其以將上述切刀壓抵於上述基板之表面上之方式而可對上述機身部施加連續之力;且上述負荷部包含用以產生力之第1致動器,上述劃線頭進而包含衝擊部,上述衝擊部以將上述切刀壓抵於上述基板之表面上之方式而可對上述機身部施加衝擊性之力,且上述衝擊部包含:擊打構件,其可以擊打上述機身部之方式移位;第2致動器,其可朝向上述機身部對上述擊打構件施加連續之力;及擋止部,其可將上述擊打構件暫時地擋止於與上述機身部隔開之位置。 A scribing head for forming a scribing surface on a surface of a substrate, comprising: a fuselage portion; a cutter attached to the fuselage portion; and a load portion for pressing the cutter to the above a continuous force is applied to the body portion on the surface of the substrate; and the load portion includes a first actuator for generating a force, and the scribe head further includes an impact portion for cutting the portion The blade is pressed against the surface of the substrate to apply an impact force to the body portion, and the impact portion includes: a striking member that can be displaced in a manner of striking the fuselage portion; The actuator is capable of applying a continuous force to the striking member toward the body portion, and a stopping portion for temporarily blocking the striking member at a position spaced apart from the body portion. 如請求項1之劃線頭,其進而包含基座部,上述基座部具有將上述機身部可旋動地支持之支點。 The scribe head of claim 1, further comprising a base portion, wherein the base portion has a fulcrum that rotatably supports the body portion. 如請求項2之劃線頭,其構成為可變更上述支點之高度。 The scribe head of claim 2 is configured to change the height of the fulcrum. 一種劃線裝置,其包括:如請求項1至3中任一項之劃線頭;及驅動部,其使上述基板與上述劃線頭相對移位。 A scribing device comprising: a scribing head according to any one of claims 1 to 3; and a driving portion that relatively displaces the substrate and the scribing head. 一種劃線方法,其包括以下步驟:準備安裝有切刀之機身部;一面將擊打構件擋止於與上述機身部隔開之位置,一面朝向上述機身部對上述擊打構件施加連續之力;釋放被擋止之上述擊打構件;藉由被釋放之上述擊打構件擊打上述機身部,上述切刀以衝擊性之力壓抵於基板之表面上,藉此於上述基板之表面上形成 起點裂紋;及一面以將上述切刀壓抵於上述基板之表面上之方式對上述機身部施加連續之力,一面藉由上述基板與上述機身部之相對移位,使上述切刀於上述基板之表面上移行,藉此使劃線自上述起點裂紋延展。 A scribing method comprising the steps of: preparing a body portion to which a cutter is mounted; and applying a striking member to a position spaced apart from the body portion, and applying the striking member toward the body portion a continuous force; releasing the struck member that is blocked; the striking member is struck by the released striking member, and the cutter is pressed against the surface of the substrate by an impact force, thereby Formed on the surface of the substrate a starting point crack; and applying a continuous force to the body portion such that the cutter is pressed against the surface of the substrate, and the cutter is displaced by the relative displacement of the substrate and the body portion The surface of the substrate is moved, whereby the scribe line is extended from the starting point crack. 如請求項5之劃線方法,其中準備上述機身部之步驟係藉由準備包含上述機身部及基座部之劃線頭而進行,上述機身部安裝有上述切刀,上述基座部具有將上述機身部可旋動地支持之支點。 The method of scribing the item 5, wherein the step of preparing the body portion is performed by preparing a scribing head including the body portion and the base portion, wherein the cutter portion is attached with the cutter, the base The portion has a fulcrum that supports the above-described body portion in a rotatable manner. 如請求項6之劃線方法,其中使上述切刀於上述基板之表面上移行之步驟係以上述支點位於上述切刀之後側之方式進行。 The method of scribing the item 6, wherein the step of moving the cutter on the surface of the substrate is performed such that the fulcrum is located on a rear side of the cutter. 如請求項6之劃線方法,其中使上述切刀於上述基板之表面上移行之步驟係以上述支點位於上述切刀之前側之方式進行。 The method of scribing the item 6, wherein the step of moving the cutter on the surface of the substrate is performed such that the fulcrum is located on a front side of the cutter. 一種劃線方法,其包括以下步驟:一面將切刀靜置於基板之表面上,一面將切刀以力F1壓抵於上述基板之表面上;對靜置於上述基板之表面上且以力F1壓抵於上述基板之表面上之上述切刀施加大於力F1之力F2,以於上述基板之表面上形成起點裂紋;及一面藉由上述基板與上述機身部之相對移位而使上述切刀於上述基板之表面上移行,一面將上述切刀以小於力F1之力F3壓抵於上述基板之表面上,以使劃線自上述起點裂紋延展。 One kind scribing method, comprising the steps of: one side of the stationary cutting blade placed on the surface of the substrate, one side of the cutting blade with a force F 1 will be pressed against the upper surface of the substrate; to stand in the upper surface of the substrate and with The force F 1 is applied to the cutter on the surface of the substrate to apply a force F 2 greater than the force F 1 to form a starting crack on the surface of the substrate; and a relative movement of the substrate and the body portion by the substrate The cutter is moved over the surface of the substrate, and the cutter is pressed against the surface of the substrate with a force F 3 smaller than the force F 1 so that the scribe line extends from the starting point crack. 如請求項9之劃線方法,其中上述力F2為衝擊性之力。 The scribing method of claim 9, wherein the force F 2 is an impact force.
TW103123187A 2013-09-24 2014-07-04 Scribing head, scribing device and scribing method TW201512120A (en)

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