TW201510878A - Measurement device - Google Patents

Measurement device Download PDF

Info

Publication number
TW201510878A
TW201510878A TW103116706A TW103116706A TW201510878A TW 201510878 A TW201510878 A TW 201510878A TW 103116706 A TW103116706 A TW 103116706A TW 103116706 A TW103116706 A TW 103116706A TW 201510878 A TW201510878 A TW 201510878A
Authority
TW
Taiwan
Prior art keywords
matching
learning
algorithm
identification
pattern
Prior art date
Application number
TW103116706A
Other languages
Chinese (zh)
Inventor
Wataru Nagatomo
Yuichi Abe
Original Assignee
Hitachi High Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi High Tech Corp filed Critical Hitachi High Tech Corp
Publication of TW201510878A publication Critical patent/TW201510878A/en

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06VIMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00Arrangements for image or video recognition or understanding
    • G06V10/94Hardware or software architectures specially adapted for image or video understanding
    • G06V10/945User interactive design; Environments; Toolboxes
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00Pattern recognition
    • G06F18/20Analysing
    • G06F18/24Classification techniques
    • G06F18/241Classification techniques relating to the classification model, e.g. parametric or non-parametric approaches
    • G06F18/2411Classification techniques relating to the classification model, e.g. parametric or non-parametric approaches based on the proximity to a decision surface, e.g. support vector machines
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B2210/00Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
    • G01B2210/56Measuring geometric parameters of semiconductor structures, e.g. profile, critical dimensions or trench depth
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/22Treatment of data
    • H01J2237/221Image processing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/26Electron or ion microscopes
    • H01J2237/28Scanning microscopes
    • H01J2237/2813Scanning microscopes characterised by the application
    • H01J2237/2817Pattern inspection

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Software Systems (AREA)
  • Multimedia (AREA)
  • Data Mining & Analysis (AREA)
  • Bioinformatics & Computational Biology (AREA)
  • Artificial Intelligence (AREA)
  • Bioinformatics & Cheminformatics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Evolutionary Biology (AREA)
  • Evolutionary Computation (AREA)
  • General Engineering & Computer Science (AREA)
  • Image Analysis (AREA)
  • Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Image Processing (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

An objective of the present invention is to provide a measurement device whereby it is possible to easily reuse an identification screen which has been used in carrying out pattern matching in the past. A measurement device according to the present invention appends unique identification information to matching identification screens for determining matching success and/or algorithm identification screens for selecting algorithms, stores same in a storage unit, and calls the identification screens with the identification information as a key.

Description

計測裝置 Measuring device

關於一種利用圖形匹配的計測裝置,該圖形匹配係使用了試料之圖像。 Regarding a measuring device using pattern matching, the pattern matching uses an image of a sample.

在計測/檢查形成於半導體晶圓上之圖案的裝置中,係利用模板匹配技術,使檢查裝置之視野對準所期望的計測位置。模板匹配,係從搜尋對象之圖像找出與事先登錄之模板圖像最一致之區域的處理。 In an apparatus for measuring/inspecting a pattern formed on a semiconductor wafer, the field of view of the inspection apparatus is aligned with a desired measurement position using a template matching technique. The template matching is a process of finding an area that is most consistent with a previously registered template image from the image of the search target.

作為使用了模板匹配之計測/檢查裝置的例子,係舉例有使用掃描型電子顯微鏡來計測半導體晶圓上之圖案的裝置。本裝置,雖係藉由平台移動將裝置的視野移動至計測位置的大概位置,但僅藉由平台的定位精度,大多存在有在電子顯微鏡之高倍率所拍攝的圖像上產生較大偏移的情形。又,不限於使晶圓在每次相同方向載置於平台,且存在有載置於平台之晶圓的座標系統(例如,晶圓之晶片等的排列方向)與平台之驅動方向不完全一致之情形。此亦導致電子顯微鏡之高倍率所拍攝之圖像上偏移的原因。且,為了在所期望之觀察位置得到高倍率的電子 顯微鏡圖像,而有使電子束僅偏離微小量(例如數十μm以下),且照射於觀察試料上之目標位置的情形(有稱為電子束偏移之情形)。即使在該電子束偏移中,僅藉由射束之偏轉控制的精度,亦有造成照射位置從所期望之觀察位置產生偏移的情形。 As an example of a measurement/inspection apparatus using template matching, an apparatus for measuring a pattern on a semiconductor wafer using a scanning electron microscope is exemplified. In this device, although the field of view of the device is moved to the approximate position of the measurement position by the movement of the platform, only by the positioning accuracy of the platform, there is a large offset in the image taken at a high magnification of the electron microscope. The situation. Moreover, it is not limited to placing the wafer on the platform in the same direction every time, and there is a coordinate system of the wafer placed on the platform (for example, the arrangement direction of the wafers of the wafer, etc.) is not completely consistent with the driving direction of the platform. The situation. This also causes the shift in the image taken by the high magnification of the electron microscope. And, in order to obtain high magnification electrons at the desired viewing position The microscope image has a case where the electron beam is deviated only by a small amount (for example, several tens of μm or less) and is irradiated onto a target position on the observation sample (a case called electron beam shift). Even in this electron beam shift, the accuracy of the deflection control of the beam alone causes a shift in the irradiation position from the desired observation position.

為了修正像這樣的偏移並在正確位置實施計測/檢查,而實施模板匹配。首先,藉由使用比電子顯微鏡像更低倍率之光學式攝像機的對準及使用電子顯微鏡像的對準,多階段地實施對準。 Template matching is performed in order to correct such an offset and perform measurement/checking at the correct position. First, alignment is performed in multiple stages by using alignment of an optical camera of a lower magnification than that of an electron microscope image and alignment using an electron microscope image.

例如,在以光學式攝像機實施載置於平台之晶圓之座標系統的對準時,係使用位於晶圓上分離之位置的複數個晶片(例如晶圓之左右兩端的晶片)的圖像來實施對準。首先,將各晶片內、或位於附近之獨特的相同圖案(在各晶片內,相對地位於相同位置的圖案)登錄為模板。作為此時登錄的圖案,係大多使用在晶圓上製作成為光學用之對準圖案者。接下來,在各晶片中,以對模板登錄之圖案進行拍攝的方式,移動平台,進而在各晶片取得圖像。對所取得的圖像實施模板匹配,且基於其結果所得到的各匹配位置,計算出平台移動的偏移量,並將該偏移量作為平台移動的修正值,以對準平台移動之座標系統與晶圓之座標系統。 For example, when an optical camera is used to perform alignment of a coordinate system of a wafer placed on a platform, an image of a plurality of wafers (for example, wafers at the left and right ends of the wafer) located at a position separated on the wafer is used. alignment. First, a unique identical pattern (a pattern that is relatively located at the same position in each wafer) in each wafer or in the vicinity is registered as a template. As the pattern registered at this time, it is often used to form an alignment pattern for optics on a wafer. Next, in each of the wafers, the platform is moved so that the template is registered, and the image is acquired on each wafer. Perform template matching on the obtained image, and calculate the offset of the platform movement based on the obtained matching positions, and use the offset as the correction value of the platform movement to align the coordinates of the platform movement. System and wafer coordinate system.

在使用電子顯微鏡的對準時,係事先將靠近計測位置之獨特的圖案登錄為模板,並預先記憶從模板所觀察之計測位置的相對座標。從電子顯微鏡所拍攝的圖像 求出計測位置時,係在拍攝的圖像中實施模板匹配,並決定匹配位置,而使從此處起已預先記憶之移動了相對座標部分形成為計測位置。 When the alignment of the electron microscope is used, a unique pattern close to the measurement position is registered as a template in advance, and the relative coordinates of the measurement position observed from the template are memorized in advance. Image taken from an electron microscope When the measurement position is obtained, template matching is performed on the captured image, and the matching position is determined, and the relative coordinate portion that has been previously memorized from here is formed as the measurement position.

利用如上述般的模板匹配,使裝置之視野移動至所期望的計測位置。 The field of view of the device is moved to the desired measurement position using template matching as described above.

平台移動之偏移或電子束偏移之偏移較大的情況下,有對準用之圖案無法印在電子顯微鏡所拍攝之圖像內的情形。在該情況下,係以警報的方式將在攝像位置周邊再次尋找對準用之圖案(周邊搜尋)或中斷計測而對準失敗(計測中斷)的情形傳達給使用者。為了實施該處理,而需要判定在圖像內是否有對準用之圖案。 In the case where the offset of the platform movement or the offset of the electron beam shift is large, the pattern for alignment cannot be printed in the image captured by the electron microscope. In this case, the situation in which the alignment pattern (peripheral search) is again searched for in the vicinity of the imaging position or the measurement is interrupted and the alignment failure (measurement interruption) is transmitted to the user is performed by an alarm. In order to carry out this processing, it is necessary to determine whether or not there is a pattern for alignment in the image.

在該判定中,係使用例如模板匹配之匹配分數(例如正規化相關演算中的相關係數)。若匹配分數高於事先設定之基準值(以後,將該基準值稱為驗收分數(Score Acceptance)),則判定為視野內有圖案,若匹配分數低於驗收分數,則判定為視野內沒有圖案。 In this determination, a matching score such as a template matching is used (for example, a correlation coefficient in a normalized correlation calculus). If the matching score is higher than the preset reference value (hereinafter, the reference value is referred to as "Score Acceptance"), it is determined that there is a pattern in the field of view, and if the matching score is lower than the acceptance score, it is determined that there is no pattern in the field of view. .

在模板匹配中,模板與被搜尋圖像各外觀之乖離較大時,有匹配失敗的可能性。作為模板與被搜尋圖像各外觀之乖離變大的理由,例如有下述情形等,其包括:(1)登錄了模板時之檢查裝置的攝像條件與對被搜尋圖像進行拍攝時之檢查裝置的攝像條件之差變大;(2)登錄了模板時之所拍攝之半導體圖案的成果(performance)與對被搜尋圖像進行拍攝之半導體圖案的成果之差異變大;及(3)登錄了模板時之半導體圖案的製造工程與對被搜尋 圖像進行拍攝之半導體圖案的製造工程不同。不限於上述例子,有因各種因素而造成在模板與被搜尋圖像中圖像之外觀乖離變大的情形。 In template matching, when the appearance of the template and the image being searched are large, there is a possibility that the matching fails. The reason why the template is different from the appearance of each of the images to be searched is, for example, the following: (1) the imaging conditions of the inspection device when the template is registered and the inspection when the image to be searched is photographed. The difference between the imaging conditions of the device becomes large; (2) the difference between the performance of the semiconductor pattern captured when the template is registered and the result of the semiconductor pattern captured by the searched image becomes larger; and (3) registration The manufacturing process and the semiconductor pattern of the template are searched The manufacturing process of the semiconductor pattern in which the image is taken is different. Not limited to the above example, there is a case where the appearance of the image in the template and the image to be searched becomes large due to various factors.

作為避免因模板與被搜尋圖像各外觀之乖離而導致匹配失敗的方法之一,提出一種使用從模板或被搜尋圖像抽出之各種種類的圖像特徵量或從模板與被搜尋圖像之兩者的相互關係所計算出的各種圖像特徵量,來判斷匹配成功與否的方法(專利文獻1)。本方法,係在使用複數個種類之圖像特徵量而構成的特徵量空間中,藉由機械學習(Support Vector Machine:SVM等)來事前求出判別匹配成功與否的識別面(匹配判定邊界面(超表面))而對檢查對象進行匹配時,係使用該識別面來求出匹配正確位置。在本方法中,係藉由使用複數個從圖像得到的資訊(圖像特徵量),使匹配強健。 As one of the methods for avoiding the failure of matching due to the deviation of the template from the appearance of the image being searched, it is proposed to use various kinds of image feature quantities extracted from the template or the searched image or from the template and the image to be searched. A method of judging the success or failure of the matching of various image feature quantities calculated by the mutual relationship (Patent Document 1). In this method, in the feature amount space formed by using a plurality of types of image feature quantities, a recognition surface for judging whether the matching is successful or not is obtained by mechanical learning (Support Vector Machine: SVM, etc.) (matching determination side) When the interface (super surface) is matched and the object to be inspected is matched, the identification surface is used to find the correct matching position. In the method, the matching is made robust by using a plurality of pieces of information (image feature quantities) obtained from the images.

又,作為避免因模板與被搜尋圖像各外觀之乖離而導致匹配失敗的其他方法,考慮一種因應乖離的程度、傾向或因應形成為乖離主要原因之條件(圖案之尺寸、攝像倍率等)的差異,來變更匹配演算法或調整匹配之前處理(平滑化處理、邊緣強化等)的方法。又,亦存在有藉由變更裝置之攝像條件(攝像倍率、電子顯微鏡中之照射電子的加速電壓、檢測器之種類等)來使匹配成功的例子。 Further, as another method for avoiding the failure of the matching due to the deviation between the template and the appearance of the image to be searched, a condition (a size of the pattern, an imaging magnification, etc.) for the degree of the deviation, the tendency or the cause of the deviation (the size of the pattern, the imaging magnification, etc.) is considered. Differences, to change the matching algorithm or to adjust the method of matching before processing (smoothing, edge enhancement, etc.). Further, there is an example in which the matching is succeeded by changing the imaging conditions (the imaging magnification, the acceleration voltage of the irradiated electrons in the electron microscope, the type of the detector, and the like) of the apparatus.

[先前技術文獻] [Previous Technical Literature] [專利文獻] [Patent Literature]

[專利文獻1]日本特開2012-167363號申請 [Patent Document 1] Japanese Patent Application No. 2012-167363

記載於上述專利文獻1的技術,係當在檢查時,輸入新種類的圖像(未使用來作為學習時之圖像)時,有匹配不穩定之情形。在其情況下,係必需使用該新種類的圖像進行再次學習。但是,當進行再次學習時,有無法使用至此為止所使用之識別面及與此關聯之附加資訊的可能性。 The technique described in Patent Document 1 is a case where a new type of image (unused as an image at the time of learning) is input at the time of inspection, and the matching is unstable. In this case, it is necessary to use the new kind of image for learning again. However, when re-learning, there is a possibility that the identification surface used up to this point and the additional information associated therewith cannot be used.

例如在半導體生產線中,再現過去的製造工程時,即使在匹配實施時投入新種類的圖像,其新圖像在實際上仍為過去所使用的圖像。在該情況下,相較於再次學習識別面,再次利用以前所學習之識別面其匹配性能的可靠性較高。在該情況下,係考慮將裝置設定回復成以前的識別面為較佳。但是,由於識別面係多維特徵量空間中的多維平面,因此,難以藉由手動操作來再製作識別面。在上述專利文獻1中,並未說明關於消解該課題的方法。又,有不僅使識別面回復成以前的設定,亦有欲合併使用了同識別面時之其他裝置條件(輔助資訊)進而回復成以前之設定的例子。 For example, in a semiconductor production line, when a past manufacturing process is reproduced, even if a new type of image is input at the time of matching implementation, the new image is actually an image used in the past. In this case, the reliability of the matching performance of the previously learned recognition surface is higher than that of the learning surface that is learned again. In this case, it is preferable to consider returning the device setting to the previous recognition surface. However, since the recognition surface is a multi-dimensional plane in the multi-dimensional feature amount space, it is difficult to reproduce the recognition surface by manual operation. In the above Patent Document 1, a method for eliminating the problem is not described. Further, there is an example in which not only the recognition surface is restored to the previous setting, but also other device conditions (auxiliary information) when the same recognition surface is used in combination, and the previous setting is restored.

作為避免因模板與被搜尋圖像各外觀之乖離而導致匹配失敗的其他方法,如先前技術所說明,考慮變 更匹配演算法、調整前處理(圖像處理)之設定參數或調整攝像條件等。在該情況下,使用者必需從該些各種選擇項中來選擇並決定適於觀察對象的設定。該操作,係必需確認每個觀察對象,且為了決定匹配成功之設定而必需進行嘗試錯誤時,對使用者來說,因成為繁雜之作業的狀況多,又嘗試變更設定時需停止生產線,而有使生產效率下降之虞。且,亦有找不到適當的設定之虞。 As a way to avoid matching failures due to the separation of the templates from the appearance of the image being searched, as described in the prior art, consider changing Match the algorithm, adjust the pre-processing (image processing) setting parameters, or adjust the imaging conditions. In this case, the user must select and determine settings suitable for the observation object from among the various options. In this operation, it is necessary to confirm each observation object, and in order to determine the setting of the matching success, it is necessary to make an attempt error, and the user has to stop the production line when attempting to change the setting because of a lot of complicated work. There is a flaw in reducing production efficiency. Moreover, there are also cases where the appropriate settings cannot be found.

於是,期望能夠有一種因應觀察對象而自動選擇適當之設定的方法。由於該方法係在實施匹配時,使用者不需選擇(模式選擇)設定,因此,之後稱為非模式匹配。為了實現無模式匹配,而考慮使用機械學習之方法。亦即,考慮使用由機械學習所得到的識別面,來選擇因應於觀察對象之狀態的適當模式。但是,即使在本方法中,亦有當再次學習識別面時,難以回復成至此為止之識別面的設定之課題。 Therefore, it is desirable to have a method of automatically selecting an appropriate setting in response to an object of observation. Since the method is implemented when matching, the user does not need to select (mode selection) settings, and is therefore referred to as non-pattern matching. In order to achieve modeless matching, consider the method of mechanical learning. That is, it is considered to use an identification surface obtained by mechanical learning to select an appropriate mode in response to the state of the observation object. However, even in the present method, when the recognition surface is learned again, it is difficult to restore the problem of setting the recognition surface up to this point.

本發明,係有鑑於如上述般的課題進行研究者,以提供一種計測裝置為目的,該計測裝置係可輕易地再次利用過去實施圖形匹配時所使用的識別面。 The present invention has been made in view of the above-described problems, and it is an object of the present invention to provide a measuring device that can easily reuse the identification surface used in pattern matching in the past.

本發明之計測裝置,係針對用於判定匹配成功與否的匹配識別面與用於選擇演算法的演算法識別面中的至少任一個,賦予固有之識別資訊而事先儲存於記憶部,並將識別資訊設成為索引(KEY)而讀出該些識別面。 The measurement device of the present invention stores the unique identification information in at least one of the matching recognition surface for determining the success or failure of the matching and the algorithm recognition surface for selecting the algorithm, and stores the identification information in advance in the memory unit, and The identification information is set to be an index (KEY) and the identification faces are read.

根據本發明之計測裝置,藉由賦予至識別面之固有的識別資訊,可輕易地讀出過去實施圖形匹配時所使用的識別面並進行再次利用。 According to the measuring device of the present invention, the identification surface used in the past image matching can be easily read and reused by the identification information unique to the identification surface.

100‧‧‧學習用資料生成部 100‧‧‧Learning Data Generation Department

101‧‧‧學習用圖像取得部 101‧‧‧Image acquisition unit for learning

106‧‧‧資料生成部 106‧‧‧Data Generation Department

110‧‧‧履歷保存部 110‧‧‧ Resumekeeping Department

111‧‧‧識別面學習部 111‧‧‧ Identification Face Learning Department

113‧‧‧識別資訊附加部 113‧‧‧ Identification Information Addition Department

117‧‧‧履歷保存部 117‧‧‧ Resumekeeping Department

118‧‧‧記憶部 118‧‧‧Memory Department

120‧‧‧模板匹配部 120‧‧‧Template Matching Department

121‧‧‧演算法選擇部 121‧‧‧ Algorithm Selection Department

122‧‧‧匹配成功與否判定部 122‧‧‧ Matching success or failure determination department

140‧‧‧履歷資訊選擇部 140‧‧‧ Resume Information Selection Department

142‧‧‧履歷資訊讀出部 142‧‧‧ Resume Information Reading Department

1000‧‧‧計測裝置 1000‧‧‧Measurement device

[圖1]計測裝置1000之功能方塊圖。 FIG. 1 is a functional block diagram of the measuring device 1000.

[圖2]表示主要可被用於計測形成於半導體晶圓上之半導體元件的圖案尺寸之掃描型電子顯微鏡之裝置構成的圖。 Fig. 2 is a view showing a configuration of a scanning electron microscope which can be mainly used for measuring a pattern size of a semiconductor element formed on a semiconductor wafer.

[圖3]說明圖像集102與學習用資料107的圖。 FIG. 3 is a diagram for explaining an image set 102 and a learning material 107.

[圖4]說明以計測裝置1000來取得圖像集102與學習用資料107之處理的流程圖。 FIG. 4 is a flow chart for explaining processing of acquiring the image set 102 and the learning material 107 by the measuring device 1000.

[圖5]表示記述了學習用資料107之內容之文字檔500之例子的圖。 FIG. 5 is a view showing an example of a character file 500 in which the content of the learning material 107 is described.

[圖6]表示履歷資訊600之構成例的圖。 FIG. 6 is a view showing an example of the configuration of the history information 600.

[圖7]表示記述了履歷資訊600之內容之文字檔700之例子的圖。 FIG. 7 is a view showing an example of a character file 700 in which the content of the history information 600 is described.

[圖8]表示使用演算法識別面選擇匹配演算法,使用匹配識別面判定匹配成功與否之情況的圖。 [Fig. 8] A diagram showing a case where the matching face recognition matching algorithm is used to determine whether the matching is successful or not using the matching recognition face.

[圖9]說明以計測裝置1000再次學習識別面時之動作的功能方塊圖。 FIG. 9 is a functional block diagram illustrating an operation when the measuring device 1000 learns the recognition surface again.

[圖10]說明計測裝置1000之硬體構成例的圖。 FIG. 10 is a view for explaining an example of a hardware configuration of the measuring device 1000.

[圖11]例示表示及編輯履歷資訊600之GUI1100的圖。 FIG. 11 is a view showing a GUI 1100 showing and editing the history information 600.

[圖12]例示用以檢索記憶部118所儲存之履歷資訊600之GUI1200的圖。 FIG. 12 is a diagram illustrating a GUI 1200 for searching the history information 600 stored in the storage unit 118.

[圖13]例示用以監測計測裝置1000中之識別面之運作狀態之GUI1300的圖。 FIG. 13 is a diagram illustrating a GUI 1300 for monitoring an operation state of an identification surface in the measurement device 1000.

以下,使用圖面來說明本發明的實施形態。另外,圖中說明編號相同者,只要不特別規定則表示相同構件。 Hereinafter, embodiments of the present invention will be described using the drawings. In the drawings, the same reference numerals are used, and the same members are denoted unless otherwise specified.

圖1,係本發明之計測裝置1000的功能方塊圖。計測裝置1000,係藉由模板匹配來界定試料上的計測位置。又,被構成為能夠對匹配成功與否或演算法選擇所使用的識別面進行機械學習,且事先將固有之識別資訊賦予至所學習的識別面並加以記憶,之後,使用其識別資訊讀出過去所使用的識別面。 1 is a functional block diagram of a measuring device 1000 of the present invention. The measuring device 1000 defines the measurement position on the sample by template matching. Further, it is configured to mechanically learn the recognition surface used for the success or failure of the matching or the selection of the algorithm, and to give the unique identification information to the learned recognition surface and memorize it, and then read the information using the identification information. The identification surface used in the past.

計測裝置1000,係具備有學習用資料生成部100、履歷保存部110、模板匹配部120及履歷資訊選擇部140。學習用資料生成部100,係生成學習用資料,用於取得複數個試料圖像且學習識別面。履歷保存部110,係使用所生成的學習用資料,而對用以判定匹配成功與否之匹配識別面、用以選擇匹配演算法之演算法識別面中的 至少任一個(在以後的說明中,係具備雙方者)進行機械學習,且將固有的識別資訊予以相對應於由學習所得到的識別面並加以記憶。模板匹配部120,係使用識別面來實施模板匹配。履歷資訊選擇部140,係因應使用者之請求,將識別資訊設成為索引,從記憶部讀出識別面。 The measurement device 1000 includes a learning material generation unit 100, a history storage unit 110, a template matching unit 120, and a history information selection unit 140. The learning data generating unit 100 generates learning materials for acquiring a plurality of sample images and learning the recognition surface. The history storage unit 110 uses the generated learning material to identify the matching recognition surface for determining whether the matching is successful or not, and the algorithm identification surface for selecting the matching algorithm. At least one (in the following description, both of them have mechanical learning), and the unique identification information is associated with and recognized by the recognition surface obtained by the learning. The template matching unit 120 performs template matching using the recognition surface. The history information selection unit 140 sets the identification information as an index and reads the recognition surface from the storage unit at the request of the user.

學習用資料生成部100,係具備有學習用圖像取得部101、資料生成部106。學習用圖像取得部101,係取得學習用之圖像集102。圖像集102,係模板圖像103、匹配位置圖像的集成。匹配位置圖像,係包含匹配正確位置圖像104與匹配不正確位置圖像105中的至少任一個,且在每一幅模板圖像中包含有1幅以上之任一方或兩方的圖像。資料生成部106,係針對圖像集102,將之後機械學習所需的標籤賦予至圖像資料,且輸出為學習用資料107。 The learning material generation unit 100 includes a learning image acquisition unit 101 and a data generation unit 106. The learning image acquisition unit 101 acquires the image set 102 for learning. The image set 102 is an integration of the template image 103 and the matching position image. The matching position image includes at least one of the matching correct position image 104 and the matching incorrect position image 105, and each of the template images includes one or more images of one or more of the images. . The data generation unit 106 assigns a label necessary for the subsequent mechanical learning to the image data for the image set 102, and outputs it as the learning material 107.

另外,在後段的機械學習中,有學習用於判定匹配成功與否之匹配識別面的例子與學習用於選擇匹配演算法(匹配模式選擇)之演算法識別面的例子。學習匹配識別面時的標籤,具體而言,係指在匹配正確位置的圖像中表示正確位置之圖像的標籤(在此係稱為正面)、在匹配不正確位置的圖像中表示不正確位置之圖像的標籤(在此係稱為負面)。學習演算法識別面時的標籤,詳細如後述之圖8所說明,係指得到匹配正確位置圖像後的匹配演算法名稱(匹配模式名稱)。此時的圖像集102,並不是匹配正確位置圖像,亦可為被搜尋圖像本身。標籤及學習用資 料,並不限定於在此所示者,只要是可藉由機械學習得到用於判定匹配成功與否的識別面或用於選擇演算法的識別面即可。 Further, in the latter stage of mechanical learning, there are an example of learning a matching recognition surface for determining the success or failure of matching, and an example of learning an algorithm recognition surface for selecting a matching algorithm (matching mode selection). Learning the label when matching the recognition surface, specifically, the label indicating the image of the correct position in the image matching the correct position (herein referred to as the front side), indicating not in the image matching the incorrect position The label of the image in the correct position (referred to herein as negative). The label for learning the algorithm recognition surface is described in detail in FIG. 8 which will be described later, and refers to the matching algorithm name (matching pattern name) obtained after matching the correct position image. The image set 102 at this time does not match the correct position image, and may also be the searched image itself. Label and learning resources The material is not limited to those shown here, as long as the identification surface for determining the success or failure of the matching or the identification surface for selecting the algorithm can be obtained by mechanical learning.

履歷保存部110,係具備有識別面學習部111、識別資訊附加部113、履歷保存部117、記憶部118。識別面學習部111,係使用學習用資料107實施機械學習,進而求出所期望的識別面。識別面,係可藉由記載於專利文獻1等之已存在的方法來求出。作為機械學習手法,係只要使用例如SVM等即可。識別面,其具體例係以後述之圖8進行說明,識別面,係指在由從學習用資料抽出之複數個特徵量所構成的特徵量空間中,判別匹配成功與否的識別面(識別邊界,以下相同)或選擇匹配演算法的識別面。識別資訊附加部113,係將固有的識別資訊附加至識別面資料112,該識別面資料112係合併了所求出之識別面及與識別面相關的附加資訊(以圖6詳細進行說明)。作為識別資訊之例子,係以後述的圖6詳細進行說明,可列舉出記述了計測步驟的計測處理程式115、與計測相關的輔助資訊116等。履歷保存部117,係將附加了識別資訊的識別面資料112儲存於記憶部118。 The history storage unit 110 includes an identification surface learning unit 111, an identification information adding unit 113, a history storage unit 117, and a storage unit 118. The recognition surface learning unit 111 performs mechanical learning using the learning material 107, and further obtains a desired recognition surface. The identification surface can be obtained by a method already described in Patent Document 1 or the like. As a mechanical learning method, for example, an SVM or the like can be used. A specific example of the identification surface will be described later with reference to Fig. 8. The identification surface is an identification surface for identifying the success or failure of the matching in the feature amount space formed by the plurality of feature quantities extracted from the learning material (identification) Boundary, the same below) or select the matching face of the matching algorithm. The identification information adding unit 113 adds unique identification information to the identification surface data 112, which combines the obtained identification surface and additional information related to the identification surface (described in detail in FIG. 6). An example of the identification information will be described in detail with reference to FIG. 6 which will be described later, and includes a measurement processing program 115 describing the measurement procedure, auxiliary information 116 related to the measurement, and the like. The history storage unit 117 stores the identification surface data 112 to which the identification information is added, in the storage unit 118.

模板匹配部120,係具備有演算法選擇部121、匹配成功與否判定部122中的至少任一個。以下,係為了方便說明,而設為具備雙方。演算法選擇部121,係使用計測處理程式114(已賦予識別資訊),選擇對應於計測對象130之匹配演算法,而實施模板匹配。關於使用 識別面來選擇匹配演算法之具體例,係以後述圖8進行說明。匹配成功與否判定部122,係求出實施了模板匹配的匹配結果。匹配處理,係能夠使用記載於例如專利文獻2的方法。簡單進行說明,將計測對象、模板圖像或從該些相互關係所求出的特徵量描繪於識別面學習部111所求出之特徵量空間,且基於識別面資料112保持的識別面,來求出計測對象130的匹配正確位置。 The template matching unit 120 includes at least one of the algorithm selection unit 121 and the matching success/failure determination unit 122. Hereinafter, for convenience of explanation, both are provided. The algorithm selection unit 121 performs template matching by using the measurement processing program 114 (identification information is given) and selecting a matching algorithm corresponding to the measurement target 130. About use A specific example of the matching algorithm to select the matching algorithm will be described later with reference to FIG. 8. The matching success/failure determination unit 122 obtains a matching result in which template matching is performed. For the matching process, the method described in, for example, Patent Document 2 can be used. Briefly, the measurement target, the template image, or the feature amount obtained from the correlations are drawn on the feature amount space obtained by the recognition surface learning unit 111, and based on the recognition surface held by the recognition surface data 112. The matching correct position of the measurement target 130 is obtained.

演算法選擇部121所選擇的演算法,係除了演算法本身不同以外,即使為相同的演算法,亦包含設定參數不同者、圖像處理中之前處理不同者及前處理之參數不同者等。 The algorithm selected by the algorithm selection unit 121 is different from the algorithm itself, and includes the difference in the setting parameters, the difference in the previous processing in the image processing, and the difference in the parameters of the pre-processing, even if the algorithm is the same.

在計測裝置1000不使用演算法選擇部121的情況下,使用事先所指定的匹配演算法,且僅在匹配成功與否判定中使用識別面。在不使用匹配成功與否判定部122的情況下,使用識別面選擇匹配演算法,且在模板匹配之成否判定中,不使用識別面而使用一般的匹配方法(作為記載於例如專利文獻2之習知方法的圖像基準匹配等)。 When the measurement device 1000 does not use the algorithm selection unit 121, the matching algorithm specified in advance is used, and the recognition surface is used only in the determination of the success or failure of the matching. When the matching success determination unit 122 is not used, the matching plane selection matching algorithm is used, and in the template matching success determination, the general matching method is used without using the recognition surface (as described, for example, in Patent Document 2) Image reference matching of conventional methods, etc.).

在可取得由使用了識別面之模板匹配所得到的匹配結果136時,匹配結果136亦與上述之識別資訊予以相對應,並亦可儲存於記憶部118。 When the matching result 136 obtained by the template matching using the identification surface is available, the matching result 136 is also associated with the above-mentioned identification information, and may be stored in the storage unit 118.

履歷資訊選擇部140,係具備有履歷資訊讀出部142。履歷資訊讀出部142,係基於選擇用資訊141(檢索關鍵字(元件名稱、製作日期時間、製作者等)、外部條 件(元件圖案寬度20nm以下、2012年以後製成等)等),從記憶部118檢索滿足條件的識別面並讀出,該選擇用資訊141係指定用以讀出所期望之識別面及後述之履歷資訊600的條件。履歷資訊讀出部142,係將所讀出之識別面資料143傳送至識別資訊附加部113。識別資訊附加部113,係與前述相同將識別資訊143附加至計測處理程式115。藉此,可檢索記憶部118所儲存之所期望的識別面,並組合計測處理程式114從而實施圖形匹配。 The history information selection unit 140 is provided with a history information reading unit 142. The history information reading unit 142 is based on the selection information 141 (search keyword (component name, creation date and time, producer, etc.), external bar) The component (the element pattern width is 20 nm or less, made after 2012, etc.), etc., and the identification surface that satisfies the condition is searched from the memory unit 118 and read, and the selection information 141 is designated to read the desired recognition surface and described later. The conditions of the resume information 600. The history information reading unit 142 transmits the read identification surface information 143 to the identification information adding unit 113. The identification information adding unit 113 adds the identification information 143 to the measurement processing program 115 in the same manner as described above. Thereby, the desired recognition surface stored in the storage unit 118 can be searched, and the measurement processing program 114 can be combined to perform pattern matching.

圖2,係作為計測裝置1000之1例,表示用於計測形成於半導體晶圓上之半導體元件的圖案尺寸之掃描型電子顯微鏡(Scanning Electron Microscope:SEM)之裝置構成的圖。 2 is a view showing a configuration of a scanning electron microscope (SEM) for measuring a pattern size of a semiconductor element formed on a semiconductor wafer as an example of the measuring device 1000.

電子槍201,係用以使電子束發生。在作為被置於平台202上之試料的半導體晶圓203上的任意位置,以連結焦點照射電子束的方式,控制偏向器204及接物鏡205。二次電子係從照射了電子束的半導體晶圓203被釋放,且藉由二次電子檢測器206來檢測。所檢測之二次電子,係藉由A/D轉換器207轉換成數位訊號,並儲存於處理部214內的圖像記憶體215。CPU216,係用以實施使用了因應目的之圖像處理、機械學習的識別處理。本發明之模板匹配,係以處理部214來予以實施。顯示裝置220,係用以顯示處理結果。光學式攝像機211,係用於進行比前述之電子顯微鏡更低倍的光對準。藉由光學式攝像機211對半導體晶圓203進行拍攝所得到的訊號,亦藉由 A/D轉換器212被轉換成數位訊號(光學式攝像機211之輸出為數位訊號時,則不需要A/D轉換器212),並儲存於處理部214內的圖像記憶體215,而CPU216係因應目的對此進行圖像處理。在具備有反射電子檢測器208的情況下,係藉由反射電子檢測器208來檢測從半導體晶圓203所釋放的反射電子。所檢測之反射電子,係藉由A/D轉換器209或210來轉換成數位訊號,並儲存於處理部214內的圖像記憶體215,而CPU216係因應目的對此進行圖像處理。 The electron gun 201 is used to generate an electron beam. The deflector 204 and the objective lens 205 are controlled at any position on the semiconductor wafer 203 as a sample placed on the stage 202 so that the electron beam is irradiated to the focal point. The secondary electrons are released from the semiconductor wafer 203 irradiated with the electron beams, and are detected by the secondary electron detector 206. The detected secondary electrons are converted into digital signals by the A/D converter 207 and stored in the image memory 215 in the processing unit 214. The CPU 216 is for performing recognition processing using image processing and mechanical learning for the purpose. The template matching of the present invention is implemented by the processing unit 214. The display device 220 is for displaying the processing result. The optical camera 211 is used to perform light alignment lower than that of the aforementioned electron microscope. The signal obtained by taking the semiconductor wafer 203 by the optical camera 211 is also The A/D converter 212 is converted into a digital signal (when the output of the optical camera 211 is a digital signal, the A/D converter 212 is not required), and is stored in the image memory 215 in the processing unit 214, and the CPU 216 Image processing is performed for this purpose. In the case where the reflected electron detector 208 is provided, the reflected electrons emitted from the semiconductor wafer 203 are detected by the reflected electron detector 208. The detected reflected electrons are converted into digital signals by the A/D converter 209 or 210 and stored in the image memory 215 in the processing unit 214, and the CPU 216 performs image processing for this purpose.

圖3,係說明關於圖像集102與學習用資料107的圖。下述,說明圖3所示之各例。 FIG. 3 is a diagram for explaining the image set 102 and the learning material 107. The examples shown in Fig. 3 will be described below.

圖3(a),係表示為了學習識別面而取得的圖像。用於學習識別面的圖像,係指在圖形匹配中,作為搜出對象之模板圖像301與被搜尋圖像302。模板圖像301,係亦可使用實際上裝置所取得之圖像(例如,電子顯微鏡所取得的圖像或光學式攝像機211所取得的圖像),又亦可如記載於日本特開2002-328015號公報所示,基於半導體元件之設計資料來予以製作。基於設計資料來製作模板圖像時,不需特意為了製作模板而以計測裝置1000來取得圖像。在被搜尋圖像302內,符合所期望之匹配圖案的位置303將形成為匹配正確位置。匹配正確位置303以外的位置,全都是匹配不正確位置。在圖3(a)中,係表示以位置304作為匹配不正確位置的1例。 Fig. 3(a) shows an image obtained in order to learn the recognition surface. The image for learning the recognition surface refers to the template image 301 and the searched image 302 which are searched objects in the graphic matching. For the template image 301, an image obtained by an actual device (for example, an image obtained by an electron microscope or an image obtained by an optical camera 211) may be used, or may be as described in JP-A-2002- It is produced based on the design information of the semiconductor element as shown in the publication No. 328015. When the template image is created based on the design data, it is not necessary to specifically acquire the image by the measuring device 1000 in order to create the template. Within the searched image 302, the location 303 that conforms to the desired matching pattern will be formed to match the correct location. Matching positions other than the correct position 303 all match the incorrect position. In Fig. 3(a), the position 304 is used as an example of matching an incorrect position.

圖3(b),係表示包含於學習用資料107之圖 像資料之例的圖。如圖1所說明,在學習用資料107中,包含有模板圖像311與匹配位置圖像之組合,在匹配圖像附加有標籤。圖3(b),係表示用於學習判定匹配成功與否之識別面的附加標籤例子。對匹配正確位置圖像312附加正面之標籤,對匹配不正確位置圖像313附加負面之標籤。可藉由使用像這樣附加了標籤的資料,來機械學習識別面。 Fig. 3(b) shows the map included in the learning material 107. A picture like the example of the data. As illustrated in Fig. 1, the learning material 107 includes a combination of a template image 311 and a matching position image, and a label is attached to the matching image. Fig. 3(b) shows an example of an additional tag for learning the identification face of the success or failure of the match. A label of the front side is attached to the matching correct position image 312, and a negative label is attached to the matching incorrect position image 313. The recognition surface can be mechanically learned by using the material to which the label is attached.

在用於學習選擇匹配演算法之識別面的學習用資料107中,匹配演算法名稱會形成為標籤。該情況中的匹配演算法名稱,係不僅匹配手法的種類,即使在其演算法之設定參數不同的情況下或圖像處理中之前處理之設定參數不同的情況下,亦可賦予不同的演算法名稱。藉此,在設定參數不同的情況下,亦可處理為不同的匹配模式,且設定參數之差異亦納入範圍,而學習選擇適當之匹配模式的識別面。 In the learning material 107 for learning the identification face of the matching algorithm, the matching algorithm name is formed as a tag. The name of the matching algorithm in this case is not only the type of matching method, but also different algorithms can be given even if the setting parameters of the algorithm are different or the setting parameters of the previous processing in the image processing are different. name. Thereby, in the case where the setting parameters are different, it is also possible to process the different matching modes, and the difference of the setting parameters is also included in the range, and learning to select the matching face of the appropriate matching mode.

圖3(c),係表示使學習用資料107改變之條件的圖。在取得學習用資料107時,越是取得儘可能包含眾多在每個檢查對象中所設想之各種學習用資料的變異,則匹配變得更加強健之可能性越提高。作為使學習用資料107之變異產生的條件,係有圖案形狀的變異321、裝置條件的變異322、所選擇之匹配演算法設定的變異323。 Fig. 3(c) is a diagram showing conditions for changing the learning material 107. When the learning material 107 is acquired, the more the variation of the various learning materials that are expected to be included in each of the examination objects is obtained, the more likely the matching becomes stronger. The conditions for causing the variation of the learning material 107 include a variation 321 of the pattern shape, a variation 322 of the device condition, and a variation 323 set by the selected matching algorithm.

作為圖案形狀321,係有設計變異330(所設計之形狀)。例如,考慮線&空間之圖案、通孔陣列圖案、連接圖案、其他各種圖案,又,有各圖案之尺寸、配置之 間距等的變異。由於該些試料之圖案形狀類別會對識別面之學習結果帶來較大的影響,因此,期望可事先在每一種圖案形狀中學習識別面,且識別其圖案形狀類別。下述所說明之其他圖案形狀321亦相同。 As the pattern shape 321, there is a design variation 330 (designed shape). For example, consider the pattern of lines & spaces, the pattern of through holes, the pattern of connections, various other patterns, and the size and configuration of each pattern. Variations such as spacing. Since the pattern shape categories of the samples have a large influence on the learning result of the recognition surface, it is desirable to learn the recognition surface in each of the pattern shapes in advance and recognize the pattern shape category. The other pattern shapes 321 described below are also the same.

作為其他圖案形狀321,係有因半導體製造程序之條件改變所致之變異331。例如,有圖案之尺寸與設定資料乖離的將況或在線上產生粗糙度之情形。 As the other pattern shape 321, there is a variation 331 due to a change in conditions of the semiconductor manufacturing process. For example, there are cases where the size of the pattern is different from the setting data or the roughness is generated on the line.

作為其他圖案形狀321,係有因半導體元件之構造或製造工程所致之變異。例如,多層構造圖案中之上下層的對準偏移時,係在觀察像中亦觀察上下層時,因偏移的程度不同而所觀察的圖案形狀有所不同。又,因上下層之差異,而有觀察像之邊緣的外觀不同之情形。又,因圖案側壁之傾斜角度不同,即使在俯視圖之觀察像中拍入有側壁部,亦有設計資料與外觀不同的情形。或者因材質的差異,而有在圖像之對比產生差異的情形。又,在半導體製程之多重曝光(SADP等)中,有因各曝光層間的對準移位而造成外觀與設計資料不同的情形。 The other pattern shape 321 is a variation due to the structure or manufacturing process of the semiconductor element. For example, when the alignment of the upper and lower layers in the multilayer structure pattern is shifted, when the upper and lower layers are also observed in the observation image, the shape of the pattern observed differs depending on the degree of the offset. Moreover, due to the difference between the upper and lower layers, there is a case where the appearance of the edge of the image is different. Further, since the inclination angle of the side wall of the pattern is different, even if the side wall portion is captured in the observation image in the plan view, the design data and the appearance are different. Or depending on the material, there is a difference in the contrast of the images. Further, in the multiple exposure (SADP or the like) of the semiconductor process, there is a case where the appearance and the design data are different due to the alignment shift between the exposure layers.

作為裝置條件322之變異,係有裝置設定的變異335。例如,有攝像倍率、照射電子之加速電壓、探針電流、焦點設置值、圖像之框架加算數、檢測器之差異等之設定的差異。作為其他裝置條件322之變異,係有裝置設定間的機差336。作為其他裝置條件322之變異,係有裝置設定之執行值的經時程變化337。亦考慮增加了其他干擾條件338的圖案。例如,有受到來自外部之電磁場 雜訊或機械振動之影響的情形。 As a variation of the device condition 322, there is a variation 335 set by the device. For example, there are differences in settings such as imaging magnification, acceleration voltage of irradiated electrons, probe current, focus setting value, frame addition amount of an image, and difference in detector. As a variation of other device conditions 322, there is a machine difference 336 between device settings. The variation of the other device condition 322 is a time-history change 337 of the execution value set by the device. Patterns of other interference conditions 338 are also considered to be added. For example, there is an electromagnetic field from the outside. The situation of noise or mechanical vibration.

作為匹配演算法設定323之變異,係有所選擇之演算法手法的種類、演算法之設定參數的差異、圖像處理之前處理的差異或前處理之設定參數的差異等。 The variation of the matching algorithm setting 323 is the type of the algorithm to be selected, the difference in the setting parameters of the algorithm, the difference in the processing before the image processing, or the difference in the setting parameters of the pre-processing.

藉由改變如上述列舉出之學習用資料107的變化條件來取得圖像集102的方式,可在各種條件下取得圖像集102。考慮藉由使用包含有所設想之變異而生成學習用資料107來進行機械學習的方式,可形成更強健的匹配。但是,不一定要含有眾多條件而使匹配變得強健。又,變化條件並不限定於在此所列舉的條件,只要可使圖像之特徵改變的條件,則亦可使用其他條件來取得圖像集102。 The image set 102 can be obtained under various conditions by changing the manner in which the image set 102 is obtained by changing the condition of the learning material 107 listed above. It is considered that a more robust match can be formed by using the method of generating the learning material 107 using the imaginary variation to perform mechanical learning. However, it is not necessary to have many conditions to make the match strong. Further, the change condition is not limited to the conditions listed here, and the image set 102 may be acquired using other conditions as long as the condition of the image can be changed.

圖4,係說明以計測裝置1000來取得圖像集102與學習用資料107之處理的流程圖。學習用圖像取得部101係實施步驟S401~S410,資料生成部106係實施步驟421~S422。下述,說明圖4之各步驟。 FIG. 4 is a flow chart for explaining the process of acquiring the image set 102 and the learning material 107 by the measuring device 1000. The learning image acquisition unit 101 performs steps S401 to S410, and the data generation unit 106 performs steps 421 to S422. The steps of FIG. 4 will be described below.

(圖4:步驟S401) (Figure 4: Step S401)

學習用圖像取得部101,係取得模板圖像311。 The learning image acquisition unit 101 acquires the template image 311.

(圖4:步驟S402) (Fig. 4: step S402)

學習用圖像取得部101,係以使晶圓上之觀察對象進入到裝置視野內的方式,使視野移動(如先前技術所說明,由於視野移動產生偏移,因此,不一定限於觀察對象 進入視野內),且以計測裝置1000來取得其視野的圖像,進而成為被搜尋圖像。在本步驟中,記述了對圖像進行拍攝時之條件的攝影條件資訊430,係成為步驟S422之輸入。 The learning image acquisition unit 101 moves the visual field so that the observation target on the wafer enters the field of view of the apparatus (as explained in the prior art, since the movement of the visual field shifts, the observation target is not necessarily limited to the observation target. After entering the field of view, the measurement device 1000 acquires an image of the field of view and further becomes a searched image. In this step, the photographing condition information 430 describing the conditions when the image is taken is the input of step S422.

(圖4:步驟S403) (Fig. 4: Step S403)

學習用圖像取得部101,係實施模板圖像311與被搜尋圖像之間的模板匹配。記述了此時所使用之匹配演算法之設定的演算法設定資訊431,係成為步驟S422的輸入。 The learning image acquisition unit 101 performs template matching between the template image 311 and the image to be searched. The algorithm setting information 431 describing the setting of the matching algorithm used at this time is input to step S422.

(圖4:步驟S404) (Fig. 4: step S404)

在匹配或其匹配後所實施之計測成功後,前進到步驟S405,失敗時前進到步驟S408。 After the measurement performed after matching or matching is successful, the process proceeds to step S405, and if it fails, the process proceeds to step S408.

(圖4:步驟S405~S407) (Figure 4: Steps S405~S407)

學習用圖像取得部101,係切出匹配位置(S405),並將所切出之圖像登錄為匹配正確位置圖像312(S406)。且,亦可切出匹配正確位置圖像以外的任意位置(S407),並在後述之步驟S409中將其切出之圖像登錄為匹配不正確位置圖像313。 The learning image acquisition unit 101 cuts out the matching position (S405), and registers the cut image as the matching correct position image 312 (S406). Further, an arbitrary position other than the image corresponding to the correct position may be cut out (S407), and the image cut out in step S409, which will be described later, is registered as the matching incorrect position image 313.

(圖4:步驟S408~S409) (Figure 4: Steps S408~S409)

學習用圖像取得部101,係切出匹配位置(S408),並 將所切出之圖像登錄為匹配不正確位置圖像313(S409)。亦可將步驟S407所切出之圖像登錄為匹配不正確位置圖像313。 The learning image acquisition unit 101 cuts out the matching position (S408), and The cut image is registered as the matching incorrect position image 313 (S409). The image cut out in step S407 can also be registered as the matching incorrect position image 313.

(圖4:步驟S410) (Fig. 4: step S410)

學習用圖像取得部101,係針對所有的學習用資料條件,判定匹配處理是否結束。未結束時,返回步驟S401並針對剩餘的條件實施匹配。針對所有的條件(例如圖3(c)所說明之所有的條件),結束匹配處理而得到的圖像集會形成為圖像集102。在此,實際上,雖實施模板匹配而判定了匹配成功與否,但使用者亦可藉由目視確認來判定匹配成功與否。 The learning image acquisition unit 101 determines whether or not the matching processing is completed for all the learning material conditions. If it is not finished, the process returns to step S401 and a matching is performed for the remaining conditions. For all the conditions (for example, all the conditions described in FIG. 3(c)), the image set obtained by ending the matching process is formed as the image set 102. Here, in fact, although the template matching is performed to determine whether the matching is successful or not, the user can also determine whether the matching is successful or not by visual confirmation.

(圖4:步驟S421~S422) (Figure 4: Steps S421~S422)

資料生成部106,係對圖像集102賦予標籤(S421)。資料生成部106,係針對各模板圖像,將模板圖像與匹配圖像及所對應之標籤予以相對應,並儲存至記憶部118。針對相對應之例子,以後述之圖7來進行說明。且,亦可將攝像條件資訊430或演算法設定資訊431合併而予以相對應,並儲存於記憶部118。攝像條件資訊430及演算法設定資訊431之內容,係例如為圖3(c)所說明之內容的一部分或全部。 The data generation unit 106 assigns a label to the image set 102 (S421). The data generating unit 106 associates the template image with the matching image and the corresponding tag for each template image, and stores the template image in the storage unit 118. A corresponding example will be described with reference to Fig. 7 which will be described later. Further, the imaging condition information 430 or the algorithm setting information 431 may be combined and stored in the storage unit 118. The contents of the imaging condition information 430 and the algorithm setting information 431 are, for example, part or all of the contents described in FIG. 3(c).

圖5,係表示記述了學習用資料107之內容之文字檔500之例子的圖。針對模板圖像510、匹配結果圖 像511及512,係記述其圖像檔案名稱。針對匹配位置圖像,係在每個附加標籤之結果記述圖像檔案名稱。例如如圖5所示,記述為如正面之圖像檔案名稱一覽511、負面之圖像檔案名稱一覽512。此外,亦可記述攝像條件資訊430與演算法設定資訊431。該些記述內容,係指圖3(c)所示的資訊。文字檔500,係在步驟S422製作資料生成部106,並儲存於記憶部118。 FIG. 5 is a view showing an example of a character file 500 in which the content of the learning material 107 is described. For template image 510, matching result graph Like 511 and 512, the image file name is described. For the matching position image, the image file name is described in the result of each additional label. For example, as shown in FIG. 5, it is described as a front image file name list 511 and a negative image file name list 512. Further, the imaging condition information 430 and the algorithm setting information 431 may be described. These descriptions refer to the information shown in Figure 3(c). The text file 500 is created in step S422 and stored in the storage unit 118.

圖6,係表示履歷保存部117所儲存於記憶部118之資訊(在下述中,稱為履歷資訊600)之構成例的圖。履歷資訊600,係過去之圖形匹配所使用之識別面及與此相對應之資訊的組合,有管理編號/文字列610、演算法識別面屬性611、匹配識別面屬性612、計測處理程式名稱613、輔助資訊614、匹配性能資訊615、學習用資料資訊616。 FIG. 6 is a view showing an example of the configuration of information stored in the storage unit 118 by the history storage unit 117 (hereinafter referred to as history information 600). The history information 600 is a combination of the recognition surface used in the past pattern matching and the information corresponding thereto, and has a management number/character string 610, an algorithm recognition surface attribute 611, a matching recognition surface attribute 612, and a measurement processing program name 613. The auxiliary information 614, the matching performance information 615, and the learning information information 616.

管理編號/文字列610為固有的識別資訊,其係用於界定記憶部118所儲存的識別面,或界定計測裝置1000實施模板匹配時所利用的識別面。只要能夠固有地識別識別面,則不限記述形式。 The management number/character string 610 is inherent identification information that is used to define the identification surface stored by the memory unit 118 or to define the identification surface used by the measurement device 1000 to perform template matching. As long as the recognition surface can be uniquely identified, it is not limited to the description.

演算法識別面屬性611,係用於選擇匹配演算法之識別面的屬性資訊,且包含有學習方法類別620、學習方法附加資訊621、匹配演算法的個數及各匹配演算法的名稱622、在學習中所使用之特徵量類別623。演算法識別面屬性611,係不限於該些,亦可使用顯示演算法識別面之屬性的其他資訊。 The algorithm identification surface attribute 611 is used to select attribute information of the recognition surface of the matching algorithm, and includes a learning method category 620, a learning method additional information 621, a number of matching algorithms, and a name 622 of each matching algorithm. The feature quantity category 623 used in the learning. The algorithm identification surface attribute 611 is not limited to these, and other information that the display algorithm recognizes the attributes of the surface may also be used.

學習方法類別620,係指定以識別面學習部111實施機械學習時所使用之學習手法的種類(例如,非線形軟性邊界SVM)。演算法選擇部121,亦使用對應於學習方法類別620的識別手法。在SVM中的識別面構築中,亦可包含所需之支持向量資訊及每個前述支持向量所附帶之類別資訊(匹配成功與否或匹配演算法之種類)。 The learning method category 620 specifies the type of learning method (for example, the non-linear soft boundary SVM) used when the recognition surface learning unit 111 performs mechanical learning. The algorithm selection unit 121 also uses a recognition method corresponding to the learning method category 620. In the identification surface construction in the SVM, the required support vector information and the category information attached to each of the foregoing support vectors (the matching success or the type of matching algorithm) may also be included.

學習方法附加資訊621,係指記述識別面學習部111所實施之機械學習手法中之設定參數的資訊。例如若為非線形軟性邊界SVM,則包含有核心函數之種類(高斯函數、多項式核函數等)、核心函數之係數(若為高斯函數,γ值等)、設定施加於不滿足識別面所致之判別的樣品之損失程度的成本係數等。此外,亦可包含關於由機械學習所得到之支持向量的資訊。 The learning method additional information 621 is information describing the setting parameters in the mechanical learning method implemented by the recognition surface learning unit 111. For example, if it is a non-linear soft boundary SVM, it includes the type of core function (Gaussian function, polynomial kernel function, etc.), the coefficient of the core function (if Gaussian function, γ value, etc.), and the setting is imposed on the non-satisfied face. The cost coefficient of the degree of loss of the identified sample, and the like. In addition, information about the support vectors obtained by mechanical learning can also be included.

特徵量類別623,係指定在識別面學習部111實施的機械學習中所使用之特徵量的種類。亦可指定複數個種類。識別面學習部111,係求出由該特徵量所構成之特徵量空間中之識別面。又,以演算法選擇部121選擇匹配演算法時,亦在該特徵量空間描繪計測對象之特徵量,並識別識別面。特徵量之種類的例子,係記載於專利文獻2。 The feature amount category 623 specifies the type of the feature amount used in the machine learning performed by the recognition surface learning unit 111. Multiple categories can also be specified. The recognition surface learning unit 111 obtains the recognition surface in the feature amount space composed of the feature amount. Further, when the matching algorithm is selected by the algorithm selecting unit 121, the feature amount of the measurement target is also drawn in the feature amount space, and the recognition surface is recognized. An example of the type of the feature amount is described in Patent Document 2.

匹配識別面屬性612,係用於判定匹配成功與否之識別面的屬性資訊,且包含有學習方法類別624、學習方法附加資訊625、特徵量類別626。該些內容,係除了使用於判定匹配成功與否時的觀點之外,其餘與包含於 演算法識別面屬性611各資訊相同。 The matching identification surface attribute 612 is used to determine attribute information of the recognition surface of the matching success or not, and includes a learning method category 624, a learning method additional information 625, and a feature quantity category 626. These contents are used in addition to the viewpoints used to determine whether the match is successful or not. The algorithm identifies the polygon attribute 611 with the same information.

計測處理程式名稱613,係指記述了計測裝置1000所實施之計測步驟的檔案(處理程式檔案)名稱。本檔案,係記述用於實施所期望之計測之裝置的各種設定、處理執行步驟等。 The measurement processing program name 613 is a file (processing program file) name in which the measurement procedure performed by the measurement device 1000 is described. This file describes various settings, processing execution steps, and the like of the apparatus for performing the desired measurement.

輔助資訊614,係包含有一般屬性627、計測對象屬性628。一般屬性627,係指製作履歷資訊600之日期時間、製作者名、使用者任意記載內容的註解資訊等。計測對象屬性628,係指元件之原始資訊等之資訊。例如計測對象之工程名稱、元件結構名稱(線&空間、通孔陣列、SAxP、FinFET、DSA等)、元件之設想尺寸(線寬、孔徑等)等。除了上述內容以外,只要是可利用來界定識別情報600者,則可使用其他資訊。 The auxiliary information 614 includes a general attribute 627 and a measurement object attribute 628. The general attribute 627 refers to the date and time when the history information 600 is created, the name of the producer, and the annotation information of the content arbitrarily recorded by the user. The measurement object attribute 628 refers to information such as the original information of the component. For example, the engineering name of the measurement object, the component structure name (line & space, via array, SAxP, FinFET, DSA, etc.), the assumed size of the component (line width, aperture, etc.). In addition to the above, other information may be used as long as it is available to define the identification information 600.

匹配性能資訊615,係關於使用演算法識別面屬性611、對應於匹配識別面屬性612的各識別面,來實施模板匹配時之匹配性能的資訊。例如,匹配正確率、匹配正確位置之匹配分數與匹配失敗位置之匹配分數之間的分離性(例如匹配不正確位置的匹配分數/匹配正確位置的匹配分數)、匹配成功與否(界定之模板與被搜尋圖像之各組合中的匹配成功與否)。匹配性能資訊615,係並不限定於上述內容,只要是可表示匹配性能之資訊即可。 The matching performance information 615 is information about the matching performance when the template matching is performed by using the algorithm identification surface attribute 611 and the respective recognition surfaces corresponding to the matching recognition surface attribute 612. For example, the match between the correct rate, the matching score matching the correct position, and the matching score of the matching failure location (eg, matching scores for matching incorrect locations/matching scores matching the correct position), success of matching (delimited template) Success in matching with each combination of images being searched). The matching performance information 615 is not limited to the above content, and may be information that can indicate matching performance.

學習用資料資訊616,係學習用資料107及其屬性資訊。例如,學習用圖像629,係記述模板圖像的檔案名稱、匹配正確位置圖像的檔案名稱、匹配不正確位置 圖像的檔案名稱。攝像條件資訊630,係計測裝置ID、攝像倍率、攝像範圍、照射電子的加速電壓、探針電流、框架加算數、焦點特徵值等的資訊。計測對象資訊631,係記述線寬、邊緣粗度等。更新履歷資訊616,係記載本學習資料製作的履歷資訊者。例如,以某種學習用資料(在此,稱為原始學習用資料)為基礎進行再次學習而製作新的學習用資料時,係記載有原始學習用資料的管理編號/文字列610及再次學習執行條件(追加學習用資料的名稱等)。從複數個不同的原始學習用資料製作學習用資料時,記載有該複數個原始學習用資料。在進行複數次再次學習時,係可記載其所有的更新履歷。另外,亦可因應所需,記載僅關於一部分之再次學習的更新履歷。如此一來,更新履歷資訊616,係可追溯學習用資料的製作履歷。學習用資料資訊616,係並不限定於上述內容,只要是可表示學習用資料之原始的資訊即可。 The learning information 616 is the learning material 107 and its attribute information. For example, the learning image 629 describes the file name of the template image, the file name matching the image of the correct position, and the matching incorrect position. The file name of the image. The imaging condition information 630 is information such as a measurement device ID, an imaging magnification, an imaging range, an acceleration voltage of an irradiation electron, a probe current, a frame addition amount, and a focus characteristic value. The measurement target information 631 describes the line width, the edge thickness, and the like. The update history information 616 is a history information that describes the creation of the learning materials. For example, when a new learning material is created based on a certain learning material (herein referred to as original learning material), the management number/character string 610 of the original learning material is recorded and the learning is performed again. Execution conditions (name of additional learning materials, etc.). When a plurality of different original learning materials are used to create learning materials, the plurality of original learning materials are recorded. When performing multiple re-learning, all of the update histories can be recorded. In addition, an update history of only a part of the re-learning may be described as needed. In this way, the update history information 616 is used to trace the production history of the learning materials. The learning material information 616 is not limited to the above content, and may be information that can represent the original information of the learning materials.

履歷保存部117,係將管理編號/文字列610設成為索引,將包含於履歷資訊600之上述各資訊予以相對應,並儲存於記憶部118。其他的資訊,亦相同地能夠將管理編號/文字列610設成為索引並予以相對應,且加以儲存。藉此,可儲存識別面及相關聯之各資訊的過去履歷。 The history storage unit 117 sets the management number/character string 610 as an index, and associates the above-described respective information included in the history information 600 in the storage unit 118. For other information, the management number/character string 610 can be similarly indexed and corresponding, and stored. Thereby, the past history of the identification surface and the associated information can be stored.

圖7,係表示記述了履歷資訊600之內容之文字檔700之例子的圖。另外,履歷保存部117,係基於例如後述之圖11所說明之畫面上所輸入的資訊,製作文字 檔700,並儲存於記憶部118。管理編號/文字列610,係履歷保存部117對與已儲存之文字檔700之管理編號/文字列610不同的編號進行自動編號,或是,使用者在後述之圖11所說明的畫面上進行輸入。藉由將管理編號/文字列610附加至文字檔700,可將各資訊予以相對應並儲存於記憶部118。 FIG. 7 is a view showing an example of a character file 700 in which the content of the history information 600 is described. Further, the history storage unit 117 creates a text based on information input on the screen described in, for example, FIG. 11 which will be described later. The file 700 is stored in the memory unit 118. In the management number/character string 610, the history storage unit 117 automatically numbers the numbers different from the management number/character string 610 of the stored character file 700, or the user performs the screen on the screen described in FIG. 11 which will be described later. Input. By adding the management number/character string 610 to the text file 700, each piece of information can be associated and stored in the memory unit 118.

各資訊之記述形式,係並不限定於圖7所示者。又,亦可將各資訊分割成複數個檔案而進行記載。在該情況下,係藉由將管理編號/文字列610賦予至各檔案並予以相對應、基於檔案名稱將各檔案予以相對應等的手法,來保持對應關係。 The description form of each piece of information is not limited to those shown in FIG. Further, each piece of information may be divided into a plurality of files and described. In this case, the correspondence is maintained by assigning the management number/character string 610 to each file and correspondingly, and correspondingly matching the files based on the file name.

圖8,係表示使用演算法識別面選擇匹配演算法,且使用匹配識別面判定匹配成功與否之情況的圖。為了簡易記載,而例示使用了2個特徵量之2維特徵量空間中之識別面,但亦可使用3種以上的特徵量。 FIG. 8 is a diagram showing a case where the algorithm is used to identify the face selection matching algorithm, and the matching recognition surface is used to determine whether the matching is successful or not. For the sake of simple description, the identification surface in the two-dimensional feature quantity space using two feature quantities is exemplified, but three or more types of feature quantities may be used.

圖8(a),係表示使用匹配識別面800,來判定匹配成功與否之情況的圖。作為使用機械學習判定匹配成功與否的方法,係有專利文獻2所記載的方法。例如使用SVM時,在由學習時從學習用資料107所求出之複數個特徵量而構成的特徵量空間中,求出使特徵量分割成匹配成功與匹配失敗之2種類的匹配識別面800。實施匹配時,係從計測對象求出特徵量,且將同特徵量描繪於與學習時相同的特徵量空間,而基於其特徵量屬於被匹配識別面800分割的哪一個種類,來判定匹配成功與否。若所計 測之特徵量屬於匹配成功類別,則判定為匹配成功,若屬於匹配失敗類別,則判定匹配失敗。 Fig. 8(a) is a diagram showing a case where the matching recognition surface 800 is used to determine whether or not the matching is successful. The method described in Patent Document 2 is a method for determining whether or not the matching is successful using mechanical learning. For example, when the SVM is used, in the feature amount space formed by the plurality of feature quantities obtained from the learning material 107 at the time of learning, the matching recognition face 800 that divides the feature amount into two types of matching success and matching failure is obtained. . When the matching is performed, the feature quantity is obtained from the measurement target, and the same feature quantity is drawn in the same feature quantity space as that at the time of learning, and the matching is determined based on which type of the feature quantity belongs to the matched identification surface 800. Whether or not. If counted If the measured feature quantity belongs to the matching success category, it is determined that the matching is successful, and if it belongs to the matching failure category, it is determined that the matching fails.

圖8(b),係表示使用演算法識別面850,選擇匹配演算法之情況的圖。在此,雖表示了選擇3個匹配演算法中任一的例子,但,作為選擇候補之演算法個數可為任意。與圖8(a)相同,在由學習時從學習用資料107所求出之複數個特徵量而構成的特徵量空間中,求出使特徵量分割成與各匹配演算法相對應之3種類的演算法識別面850。實施匹配時,係從計測對象求出特徵量,且將同特徵量描繪於與學習時相同的特徵量空間,且基於其特徵量屬於被演算法識別面850分割的哪一個種類,來選定應使用的匹配演算法。 Fig. 8(b) is a diagram showing a case where the algorithm is used to identify the face 850 and the matching algorithm is selected. Here, although an example in which any of the three matching algorithms is selected is shown, the number of algorithms as selection candidates may be arbitrary. Similarly to FIG. 8(a), in the feature amount space formed by the plurality of feature quantities obtained from the learning material 107 at the time of learning, the feature amount is divided into three types corresponding to the matching algorithms. The algorithm identifies face 850. When the matching is performed, the feature amount is obtained from the measurement target, and the same feature amount is drawn in the same feature amount space as that at the time of learning, and the type of the feature amount belongs to which is divided by the algorithm recognition surface 850. The matching algorithm used.

圖9,係說明以計測裝置1000再次學習識別面時之動作的功能方塊圖。在追加與已使用於學習之學習資料107不同的新學習資料107而再次學習識別面時,係使用新追加的學習用資料107、已學習的學習用資料107、已儲存於記憶部118內的學習用資料資訊616等,來進行再次學習。因管理以前由學習所得到的履歷資訊600,因此,可輕易選擇使用於再次學習之既有的學習用資料,且有效率地進行再次學習。 FIG. 9 is a functional block diagram showing an operation when the measuring device 1000 learns the recognition surface again. When the new learning material 107 different from the learning material 107 used for learning is added and the recognition surface is learned again, the newly added learning material 107, the learned learning material 107, and the stored learning unit 107 are stored. Learn to use the information 616, etc. to learn again. Since the history information 600 obtained by the previous learning is managed, it is possible to easily select the existing learning materials for re-learning and to perform the learning again efficiently.

圖10,係說明計測裝置1000之硬體構成例的圖。計測裝置1000,係不一定需要在1台硬體內搭載所有的構成要素,亦可將其構成要素分散搭載於複數個機器。在如圖10所示的例子中,係在網絡1100中連接有計 測裝置1001~1003、記憶部118、電腦1004。 FIG. 10 is a view for explaining a hardware configuration example of the measuring device 1000. In the measurement device 1000, it is not always necessary to mount all the components in one hard body, and the components may be dispersed and mounted on a plurality of devices. In the example shown in FIG. 10, a connection is made in the network 1100. Measuring devices 1001 to 1003, memory unit 118, and computer 1004.

電腦1004,係實施具備有計測裝置1000之功能中的至少一部分。例如可在電腦1004上安裝履歷資訊選擇部140與輸出部135的功能,且經由後述圖11所說明之GUI接收來自使用者的操作輸入,或給予使用者提示匹配結果136。記憶部118,係可共用計測裝置1001~1003。履歷資訊600,係亦可在每計測裝置附加不同的管理編號/文字列610,只要是不會使管理編號/文字列610重複者則亦可共用。計測裝置1001~1003,係具備有計測裝置1000所具備的功能中安裝於電腦1004的功能及記憶部118以外的功能。 The computer 1004 is configured to implement at least a part of the functions of the measurement device 1000. For example, the function of the history information selection unit 140 and the output unit 135 can be installed on the computer 1004, and an operation input from the user can be received via the GUI described later with reference to FIG. 11, or the user can be presented with the matching result 136. The memory unit 118 can share the measurement devices 1001 to 1003. The history information 600 may be a different management number/character string 610 attached to each measurement device, and may be shared as long as the management number/character string 610 is not repeated. The measurement devices 1001 to 1003 include functions other than the functions of the computer 1004 and the memory unit 118 among the functions of the measurement device 1000.

計測裝置之台數為任意,並不限定為3台。電腦1004之台數,並不限定於1台,亦可將例如計測裝置1000所具備的功能分散而安裝於複數個電腦上。 The number of measuring devices is arbitrary, and is not limited to three. The number of the computers 1004 is not limited to one, and the functions of the measuring device 1000 may be dispersed and installed on a plurality of computers.

圖11,係例示表示及編輯履歷資訊600之GUI1100的圖。GUI1100,係可構成為例如顯示器上的操作畫面。GUI1100,係具備有對應於履歷資訊600之至少一部分的項目。在圖11所示的例子中,係可顯示管理編號/文字列1110、演算法識別面屬性1111、匹配識別面屬性1112、計測處理程式檔案名稱1113、輔助資訊1114、匹配性能1115、學習用資料資訊1116,並進行編輯。 FIG. 11 is a view showing a GUI 1100 showing and editing the history information 600. The GUI 1100 can be configured, for example, as an operation screen on a display. The GUI 1100 is provided with an item corresponding to at least a part of the history information 600. In the example shown in FIG. 11, the management number/character string 1110, the algorithm recognition plane attribute 1111, the matching recognition plane attribute 1112, the measurement processing program file name 1113, the auxiliary information 1114, the matching performance 1115, and the learning material can be displayed. Information 1116 and edited.

使用者,係將值輸入至管理編號/文字列1110,且按押識別面讀入按鈕1133。履歷資訊讀出部142,係從記憶部118讀出該識別資訊600,而顯示於 GUI1100上。當使用者在計測處理程式檔案名稱1113內指定計測裝置1000的計測處理程式檔案名稱且按壓連接按鈕1132時,可藉由相同的管理編號/文字列1100,連接所顯示的履歷資訊600與所指定的計測處理程式。當按押履歷資訊儲存按鈕1131時,履歷保存部117係將顯示的履歷資訊儲存於記憶部118。匹配性能1115,係亦可從記憶部118讀入並取得過去的匹配結果。在該情況下,按押匹配結果讀入按鈕1120,進而讀入記述了匹配結果的資料。學習用資料資訊1116,係可一覽顯示指定的圖像。又,可從其一覽來選擇用於學習之圖像。且,亦可從學習用資料107刪除圖像(按鈕1121),追加新圖像(按鈕1122)。當按壓學習按鈕1130或再次學習按鈕1134時,識別面學習部111,係根據顯示的內容來學習或再次學習識別面。 The user inputs the value to the management number/character column 1110, and presses the recognition face to read the button 1133. The history information reading unit 142 reads the identification information 600 from the storage unit 118 and displays it on On the GUI1100. When the user specifies the measurement processing program file name of the measurement device 1000 in the measurement processing program file name 1113 and presses the connection button 1132, the displayed history information 600 and the designated information can be connected by the same management number/character string 1100. Measurement processing program. When the history information storage button 1131 is pressed, the history storage unit 117 stores the displayed history information in the storage unit 118. The matching performance 1115 can also be read from the memory unit 118 and the past matching result can be obtained. In this case, the button 1120 is read by the matching result, and the data describing the matching result is read. The learning material information 1116 is a list of specified images. Also, an image for learning can be selected from the list. Further, an image (button 1121) may be deleted from the learning material 107, and a new image (button 1122) may be added. When the learning button 1130 or the learning button 1134 is pressed again, the recognition surface learning unit 111 learns or learns the recognition surface again based on the displayed content.

圖12,係例示用以檢索記憶部118儲存之履歷資訊600之GUI1200的圖。使用者,係輸入檢索關鍵字1201且按壓檢索按鈕1202。履歷資訊讀出部142,係對照履歷資訊600與檢索關鍵字1201,將符合之一覽顯示於一覽顯示部1210上。一覽顯示部1210,係顯示履歷資訊600的至少一部分。當選擇一覽顯示部1210所顯示之任一履歷資訊1211且按壓詳細顯示按鈕1212時,履歷資訊讀出部142,係從記憶部118詳細讀出履歷資訊1211,並顯示於例如GUI1100上。 FIG. 12 is a diagram showing a GUI 1200 for searching the history information 600 stored in the storage unit 118. The user inputs the search key 1201 and presses the search button 1202. The history information reading unit 142 displays the matching list on the list display unit 1210 in accordance with the history information 600 and the search key 1201. The list display unit 1210 displays at least a part of the history information 600. When any of the history information 1211 displayed on the list display unit 1210 is selected and the detailed display button 1212 is pressed, the history information reading unit 142 reads the history information 1211 from the storage unit 118 in detail and displays it on the GUI 1100, for example.

當按壓選擇按鈕1213時,將所選擇的履歷資訊1211 附加至計測處理程式,且在實施之後的匹配時使用此資料。 When the selection button 1213 is pressed, the selected history information 1211 is selected. Attached to the measurement handler and used this material for matching after implementation.

圖13,係例示用以監測計測裝置1000中之識別面之運作狀態之GUI1300的圖。由於使用於以計測裝置1000實施圖形匹配時的識別面係穩定實施匹配,因此,有因應計測對象等之條件進行切換的情形。藉由使用GUI1300,可目視確認是否要切換,或可目視確認至此為止之識別面的變更履歷。GUI1300,係在每個計測裝置1000顯示識別面的運作狀態。具體而言,係藉由圖表1310在每個計測裝置1000顯示以下資訊。 FIG. 13 is a diagram illustrating a GUI 1300 for monitoring an operational state of an identification surface in the measurement device 1000. Since the recognition surface used for pattern matching by the measurement device 1000 is stably performed, there is a case where the conditions of the measurement target or the like are switched. By using the GUI 1300, it is possible to visually confirm whether or not to switch, or to visually confirm the change history of the recognition surface up to this point. The GUI 1300 displays the operational status of the recognition surface in each of the measuring devices 1000. Specifically, the following information is displayed on each measurement device 1000 by the chart 1310.

圖表1310之橫軸,係表示日期時間及在各日期時間中計測裝置1000所使用之識別面的管理編號/文字列610。圖表1310之縱軸,係表示以計測裝置1000實施圖形匹配時之匹配誤差率及匹配分數。 The horizontal axis of the graph 1310 indicates the date and time and the management number/character string 610 of the identification surface used by the measuring device 1000 in each date and time. The vertical axis of the graph 1310 indicates the matching error rate and the matching score when the graph matching is performed by the measuring device 1000.

使用者了解到,在匹配分數經時日變化而下降時,有造成匹配不穩定之虞。相同地,可輕易了解,當誤差率上升時,匹配會變得不穩定。此外,當匹配分數成為預定閾值以下時,亦可在GUI1300上顯示有匹配不穩定之虞的要點,且促進識別面的變化或再次學習。 The user understands that when the matching score decreases with time and time, there is a problem that the matching is unstable. Similarly, it can be easily understood that when the error rate increases, the matching becomes unstable. Further, when the matching score is equal to or lower than the predetermined threshold, the point of the matching instability may be displayed on the GUI 1300, and the change of the recognition surface or the learning again may be promoted.

當按壓詳細顯示按鈕1311時,可顯示:顯示於圖表1310上之識別面的履歷資訊600、該計測裝置1000中之至此為止的匹配性能、使用了其他計測裝置1000中之該識別面的匹配性能等。 When the detailed display button 1311 is pressed, the history information 600 of the identification surface displayed on the graph 1310, the matching performance up to the measurement device 1000, and the matching performance of the identification surface in the other measurement device 1000 can be displayed. Wait.

<本發明之總結> <Summary of the Invention>

如上述,本發明之計測裝置1000,係能夠在用於判定匹配成功與否之識別面與選擇匹配演算法之識別面中的至少一方,賦予所例示為履歷資訊600的識別資訊,並將同識別資訊設成為索引而讀出過去所使用之該些的識別面。藉此,即使藉由例如再次學習來更新識別面時,亦可讀出以前所生成的識別面及相關連的履歷資訊600,且使用此來實施模板匹配。 As described above, the measurement device 1000 of the present invention can provide the identification information exemplified as the history information 600 to at least one of the identification surface for determining the success or failure of the matching and the identification surface of the selection matching algorithm. The identification information is set as an index to read out the identification faces used in the past. Thereby, even if the recognition surface is updated by, for example, re-learning, the previously generated recognition surface and the associated history information 600 can be read, and template matching can be performed using this.

又,由於可根據本發明之計測裝置1000而輕易地返回到過去所使用之識別面的設定,因此,使用者不需擔心匹配性能下降而可再次學習且更新識別面。 Moreover, since the setting of the identification surface used in the past can be easily returned to the measuring device 1000 according to the present invention, the user can learn again and update the identification surface without worrying about the deterioration of the matching performance.

又,根據本發明之計測裝置1000,相較於藉由機械學習選擇匹配演算法且使用複數個匹配演算法之組合的方式(集成學習),能夠以少數的匹配演算法來實施匹配。藉此,可縮短匹配處理時間並提升計測裝置1000的生產率。 Further, according to the measuring apparatus 1000 of the present invention, matching can be performed with a small number of matching algorithms as compared with a method of selecting a matching algorithm by mechanical learning and using a combination of a plurality of matching algorithms (integrated learning). Thereby, the matching processing time can be shortened and the productivity of the measuring device 1000 can be improved.

履歷資訊600,係期望構成為讓使用者在之後可輕易讀出各識別面。因此,履歷資訊600,係期望構成為可良好地顯示各識別面之學習結果的特徵,並使用讓使用者可輕易理解其特徵的資訊。識別面之學習結果,係因計測對象之形狀圖案類別而受到較大的影響,又,對於使用者來說,形狀圖案類別亦為輕易理解的資訊,因此,將此使用來作為履歷資訊600是有用的。又,由於圖案形狀係因攝影倍率而造成外觀或其學習結果顯著不同,因此, 同時使用圖案形狀與攝影倍率亦有用。且,因期望使用良好地學習了該圖案形狀的識別面,因此,使用該圖案形狀實施圖形匹配時的匹配性能作為履歷資訊600亦為有用。 The history information 600 is desirably configured so that the user can easily read each of the identification faces later. Therefore, the history information 600 is desirably configured to display the learning results of the respective recognition surfaces well, and to use information that allows the user to easily understand the characteristics. The learning result of the recognition surface is greatly affected by the shape pattern type of the measurement object, and the shape pattern category is also easy to understand for the user. Therefore, using this as the history information 600 is useful. Moreover, since the pattern shape is significantly different in appearance or learning result due to the photographing magnification, It is also useful to use pattern shapes and photographic magnification at the same time. Further, since it is desired to use the recognition surface of the pattern shape well, it is also useful to use the matching performance when the pattern matching is performed using the pattern shape as the history information 600.

本發明,並不限定於上述之實施形態,可包含各種變形例。上述實施形態,係為了使清楚理解本發明而詳細進行說明者,並不限定於具備所說明之所有構成者。例如本發明,係亦可適用於使用圖形匹配來檢查試料的檢查裝置。又,在以上的說明中,雖表示了以掃描電子顯微鏡作為計測裝置之例子,但並不限定於此,亦可廣泛地適用於使用試料圖像來實施模板匹配的計測裝置。 The present invention is not limited to the above embodiments, and various modifications can be included. The above embodiments are described in detail in order to clearly understand the present invention, and are not limited to having all of the constituents described. For example, the present invention is also applicable to an inspection apparatus for inspecting a sample using pattern matching. In the above description, an example in which a scanning electron microscope is used as the measuring device is shown. However, the present invention is not limited thereto, and can be widely applied to a measuring device that performs template matching using a sample image.

100‧‧‧學習用資料生成部 100‧‧‧Learning Data Generation Department

101‧‧‧學習用圖像取得部 101‧‧‧Image acquisition unit for learning

102‧‧‧圖像集 102‧‧‧Photo Collection

103‧‧‧模板圖像 103‧‧‧Template image

104‧‧‧匹配正確位置圖像 104‧‧‧ Matching the correct position image

105‧‧‧匹配不正確位置圖像 105‧‧‧Matched incorrect position image

106‧‧‧資料生成部 106‧‧‧Data Generation Department

107‧‧‧學習用資料 107‧‧‧Learning materials

110‧‧‧履歷保存部 110‧‧‧ Resumekeeping Department

111‧‧‧識別面學習部 111‧‧‧ Identification Face Learning Department

112‧‧‧識別面資料 112‧‧‧identification information

113‧‧‧識別資訊附加部 113‧‧‧ Identification Information Addition Department

114‧‧‧計測處理程式 114‧‧‧Measurement Processing Program

115‧‧‧計測處理程式 115‧‧‧Measurement Processing Program

116‧‧‧輔助資訊 116‧‧‧Auxiliary information

117‧‧‧履歷保存部 117‧‧‧ Resumekeeping Department

118‧‧‧記憶部 118‧‧‧Memory Department

120‧‧‧模板匹配部 120‧‧‧Template Matching Department

121‧‧‧演算法選擇部 121‧‧‧ Algorithm Selection Department

122‧‧‧匹配成功與否判定部 122‧‧‧ Matching success or failure determination department

130‧‧‧計測對象 130‧‧‧Measured objects

135‧‧‧輸出部 135‧‧‧Output Department

136‧‧‧匹配結果 136‧‧‧ Match results

140‧‧‧履歷資訊選擇部 140‧‧‧ Resume Information Selection Department

141‧‧‧選擇用資訊 141‧‧‧Select information

142‧‧‧履歷資訊讀出部 142‧‧‧ Resume Information Reading Department

143‧‧‧識別面資料 143‧‧‧identification information

Claims (12)

一種計測裝置,係對試料之圖像實施圖形匹配,其特徵,係具備:學習用資料生成部,將使用於實施前述圖形匹配時之模板圖像與由前述圖形匹配得到之結果圖像的組合製作為複數個學習用資料;機械學習部,使用前述學習用資料,藉由機械學習求出匹配識別面及演算法識別面中的至少任一個,該匹配識別面係用於判定前述圖形匹配成功與否之特徵量空間上的識別面,該演算法識別面係用於選擇使用於實施前述圖形匹配時之演算法之特徵量空間上的識別面;履歷保存部,將記述前述匹配識別面之匹配識別面資料或記述前述演算法識別面之演算法識別面資料中的至少任一個與固有的識別資訊予以相對應,並儲存於記憶部內;選擇部,將前述識別資訊設成為索引,讀出相對應之前述匹配識別面資料或相對應之前述演算法識別面資料;及匹配部,根據前述選擇部讀出的結果,使用過去實施之前述圖形匹配中所使用之前述匹配識別面資料或前述演算法識別面資料,判定前述圖形匹配成功與否或選擇前述演算法。 A measuring device that performs pattern matching on an image of a sample, and is characterized in that the learning data generating unit includes a combination of a template image used for performing the pattern matching and a result image obtained by matching the pattern. a plurality of learning materials are produced; the mechanical learning unit uses the learning data to obtain at least one of a matching recognition surface and an algorithm recognition surface by mechanical learning, and the matching recognition surface is used to determine that the graphic matching is successful. Whether the recognition surface of the feature quantity space is used for selecting an identification surface on a feature quantity space of an algorithm used for performing the pattern matching; the history storage unit is configured to describe the matching identification surface At least one of the matching recognition surface data or the algorithm recognition surface data describing the recognition surface of the algorithm corresponds to the unique identification information and is stored in the storage unit; the selection unit sets the identification information as an index and reads Corresponding to the aforementioned matching identification surface data or the corresponding algorithm identification surface data; and the matching part, according to the former Result selection unit read out using the face identification information or the matching algorithm to identify the surface of the pattern matching data used in the embodiment of the past, determining the success or pattern matching algorithm to select the foregoing. 如申請專利範圍第1項之計測裝置,其中,前述履歷保存部,係將前述試料之形狀圖案的類別與 前述識別資訊予以相對應,並儲存於前述記憶部,前述選擇部,係當將前述形狀圖案的類別設成為索引,而接受要求讀出前述匹配識別面資料或前述演算法識別面資料的請求時,從前述記憶部讀出對應於前述形狀圖案之類別的前述匹配識別面資料或前述演算法識別面資料。 The measuring device according to claim 1, wherein the history storage unit sets a type of the shape pattern of the sample and The identification information is associated with and stored in the storage unit, and the selection unit sets the type of the shape pattern as an index and receives a request to read the matching identification surface data or the algorithm identification surface data. And reading the matching identification surface data or the algorithm identification surface data corresponding to the type of the shape pattern from the memory unit. 如申請專利範圍第2項之計測裝置,其中,前述履歷保存部,係將前述形狀圖案的攝影倍率與前述識別資訊予以相對應,並儲存於前述記憶部,前述選擇部,係當將前述形狀圖案的類別與前述形狀圖案的攝影倍率設成為索引,而接受要求讀出前述匹配識別面資料或前述演算法識別面資料的請求時,從前述記憶部讀出對應於前述形狀圖案之類別及前述形狀圖案之攝影倍率的前述匹配識別面資料或前述演算法識別面資料。 The measurement device according to claim 2, wherein the history storage unit associates the imaging magnification of the shape pattern with the identification information, and stores the image in the memory unit, wherein the selection unit The type of the pattern and the imaging magnification of the shape pattern are indexed, and when a request for reading the matching identification surface data or the algorithm identification surface data is requested, the type corresponding to the shape pattern and the foregoing are read from the memory unit. The aforementioned matching identification surface data of the photographic magnification of the shape pattern or the aforementioned algorithm identification surface data. 如申請專利範圍第3項之計測裝置,其中,前述履歷保存部,係使用前述形狀圖案的類別及前述形狀圖案的攝影倍率,將實施了前述圖形匹配後的匹配正確率與前述識別資訊予以相對應,並儲存於前述記憶部,前述選擇部,係當將前述形狀圖案的類別、前述形狀圖案的攝影倍率及前述匹配正確率設成為索引,而接受要求讀出前述匹配識別面資料或前述演算法識別面資料的請求時,從前述記憶部讀出對應於前述形狀圖案之類別、前述形狀圖案之攝影倍率及前述匹配正確率的前述匹配識別面資料或前述演算法識別面資料。 In the measurement device of the third aspect of the invention, the history storage unit uses the type of the shape pattern and the imaging magnification of the shape pattern to match the matching accuracy rate of the pattern matching with the identification information. Correspondingly, the selection unit is configured to read the matching identification surface data or the calculation when the type of the shape pattern, the imaging magnification of the shape pattern, and the matching accuracy ratio are indexed. When the method of identifying the surface data is requested, the matching identification surface data or the algorithm identification surface data corresponding to the type of the shape pattern, the imaging magnification of the shape pattern, and the matching accuracy rate are read from the memory unit. 如申請專利範圍第4項之計測裝置,其中,前述履歷保存部,係將記述了前述匹配識別面之屬性的匹配識別面屬性、記述了前述演算法識別面之屬性的演算法識別面屬性、記述了前述計測裝置之計測步驟的處理程式資訊、與前述圖形匹配相關連的輔助資訊、記述了前述圖形匹配之性能指標的匹配性能資訊及前述學習用資料中的至少任一個與前述識別資訊予以相對應,並儲存於前述記憶部。 In the measurement device of the fourth aspect of the invention, the history storage unit stores the matching recognition surface attribute of the attribute of the matching recognition surface, and the algorithm recognition surface attribute in which the attribute of the algorithm recognition surface is described. The processing program information of the measurement step of the measuring device, the auxiliary information associated with the pattern matching, the matching performance information describing the performance index of the pattern matching, and at least one of the learning materials and the identification information are described. Corresponding to, and stored in the aforementioned memory. 如申請專利範圍第5項之計測裝置,其中,前述履歷保存部,係使用下述中的至少任一個作為前述匹配識別面屬性,其包括:使用於機械學習前述匹配識別面時的學習手法名稱、使用於機械學習前述匹配識別面時的核心函數類別、前述核心函數內的係數及使用於機械學習前述匹配識別面時的特徵量類別。 The measurement device of claim 5, wherein the history storage unit uses at least one of the following as the matching identification surface attribute, and includes: a learning method name used when mechanically learning the matching recognition surface And used for mechanically learning the core function category when matching the recognition surface, the coefficient in the core function, and the feature quantity category used when mechanically learning the matching recognition surface. 如申請專利範圍第5項之計測裝置,其中,前述履歷保存部,係使用下述中的至少任一個作為前述演算法識別面屬性,其包括:使用於機械學習前述演算法識別面時的學習手法名稱、使用於機械學習前述演算法識別面時的核心函數類別、前述核心函數內的係數、成為選擇候補之前述演算法的個數、成為選擇候補之前述演算法的名稱及使用於機械學習前述演算法識別面時的特徵量類別。 The measurement device of claim 5, wherein the history storage unit uses at least one of the following as the algorithm recognition surface attribute, and includes: learning for mechanically learning the recognition surface of the algorithm The name of the technique, the type of the core function used when the machine learns the recognition surface of the algorithm, the coefficient in the core function, the number of the algorithms that are candidates for selection, the name of the algorithm that is the candidate for selection, and the use of mechanical learning. The feature quantity category when the aforementioned algorithm recognizes a face. 如申請專利範圍第5項之計測裝置,其中, 前述履歷保存部,係使用下述中的至少任一個作為前述匹配性能資訊,其包括:前述圖形匹配中之匹配分數的分離性及前述機械學習中之匹配成功與否。 For example, the measuring device of claim 5, wherein The history storage unit uses at least one of the following as the matching performance information, and includes the separation of the matching score in the pattern matching and the success of the matching in the mechanical learning. 如申請專利範圍第1項之計測裝置,其中,前述學習用資料生成部,係具備有取得對前述試料進行拍攝之複數個圖像的學習用圖像取得部,使用複數個種類的匹配演算法對前述複數個圖像實施圖形匹配,且將前述圖像中,於前述圖形匹配已成功匹配的部位切出來作為正確位置圖像,並將除此之外的部位切出來作為不正確位置圖像,進而將前述正確位置圖像與前述不正確位置圖像使用來作為由前述圖形匹配所得到的結果圖像。 The measurement device according to the first aspect of the invention, wherein the learning data generating unit includes a learning image acquiring unit that acquires a plurality of images for capturing the sample, and uses a plurality of types of matching algorithms. Performing pattern matching on the plurality of images, and cutting out the portion of the image in which the pattern matching has been successfully matched as the correct position image, and cutting out the other portions as the incorrect position image Further, the aforementioned correct position image and the aforementioned incorrect position image are used as the resultant image obtained by the aforementioned pattern matching. 如申請專利範圍第5項之計測裝置,其中,前述計測裝置,係提供用於以畫面顯示下述中之至少任一個並進行變更的GUI,其包括:前述識別資訊、前述試料之形狀圖案的類別、前述形狀圖案的攝影倍率、前述匹配正確率、前述匹配識別面屬性、前述演算法識別面屬性、前述處理程式資訊、前述輔助資訊、前述匹配性能指標及前述學習用資料。 The measuring device according to claim 5, wherein the measuring device provides a GUI for displaying at least one of the following and changing the screen, and includes the identification information and the shape pattern of the sample. The type, the photographic magnification of the shape pattern, the matching correctness rate, the matching recognition surface attribute, the algorithm recognition surface attribute, the processing program information, the auxiliary information, the matching performance indicator, and the learning data. 如申請專利範圍第5項之計測裝置,其中,前述計測裝置,係提供用於指定下述中之至少任一個並進行檢索儲存於前述記憶部內所符合的前述識別資訊的GUI,其包括: 前述識別資訊、前述試料之形狀圖案的類別、前述形狀圖案的攝影倍率、前述匹配正確率、前述匹配識別面屬性、前述演算法識別面屬性、前述處理程式資訊、前述輔助資訊、前述匹配性能指標及前述學習用資料。 The measuring device of claim 5, wherein the measuring device provides a GUI for specifying at least one of the following and searching for the identification information that is stored in the memory unit, and includes: The identification information, the type of the shape pattern of the sample, the imaging magnification of the shape pattern, the matching accuracy rate, the matching recognition surface attribute, the algorithm recognition surface attribute, the processing program information, the auxiliary information, and the matching performance indicator And the aforementioned learning materials. 如申請專利範圍第1項之計測裝置,其中,前述計測裝置,係使用前述機械學習的匹配識別資訊或前述機械學習的演算法識別面資訊,針對實施了前述圖形匹配時之匹配分數、前述圖形匹配之誤差率中的至少任一個,輸出記述了其時間序列變化的資訊。 The measuring device according to claim 1, wherein the measuring device uses the mechanical learning matching identification information or the mechanical learning algorithm to recognize face information, and the matching score and the graphic are performed when the graphic matching is performed. At least one of the matched error rates outputs an information describing its time series change.
TW103116706A 2013-06-24 2014-05-12 Measurement device TW201510878A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013132107A JP2016173615A (en) 2013-06-24 2013-06-24 Measurement system

Publications (1)

Publication Number Publication Date
TW201510878A true TW201510878A (en) 2015-03-16

Family

ID=52141609

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103116706A TW201510878A (en) 2013-06-24 2014-05-12 Measurement device

Country Status (3)

Country Link
JP (1) JP2016173615A (en)
TW (1) TW201510878A (en)
WO (1) WO2014208257A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI807346B (en) * 2020-06-22 2023-07-01 日商日立全球先端科技股份有限公司 Dimension measuring device, semiconductor manufacturing device and semiconductor device manufacturing system

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6192880B2 (en) * 2015-05-26 2017-09-06 三菱電機株式会社 Detection apparatus and detection method
JP6693938B2 (en) 2017-11-17 2020-05-13 ファナック株式会社 Appearance inspection device
JP2020008481A (en) * 2018-07-11 2020-01-16 オムロン株式会社 Image processing apparatus, image processing method, and image processing program
JP7144244B2 (en) * 2018-08-31 2022-09-29 株式会社日立ハイテク Pattern inspection system
JP7062563B2 (en) * 2018-09-07 2022-05-06 キオクシア株式会社 Contour extraction method, contour extraction device, and program
JP2020123064A (en) * 2019-01-29 2020-08-13 Tasmit株式会社 Image matching determination method, image matching determination device, and computer-readable recording medium capable of recording programs for causing computers to execute image matching determination method
JP7175800B2 (en) * 2019-03-05 2022-11-21 株式会社日立製作所 Analysis support device and analysis support method
JP7392425B2 (en) * 2019-11-27 2023-12-06 オムロン株式会社 Learning devices, learning methods and programs
JP7440823B2 (en) 2020-02-21 2024-02-29 オムロン株式会社 Information processing device, information processing method and program
US11151710B1 (en) * 2020-05-04 2021-10-19 Applied Materials Israel Ltd. Automatic selection of algorithmic modules for examination of a specimen
CN112541475B (en) 2020-12-24 2024-01-19 北京百度网讯科技有限公司 Sensing data detection method and device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2644844B2 (en) * 1988-09-20 1997-08-25 株式会社日立製作所 Distributed image recognition system
JP4084263B2 (en) * 2002-08-13 2008-04-30 株式会社日立国際電気 Parameter setting method
JP2005065944A (en) * 2003-08-22 2005-03-17 Konica Minolta Medical & Graphic Inc Diagnostic supporting apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI807346B (en) * 2020-06-22 2023-07-01 日商日立全球先端科技股份有限公司 Dimension measuring device, semiconductor manufacturing device and semiconductor device manufacturing system

Also Published As

Publication number Publication date
JP2016173615A (en) 2016-09-29
WO2014208257A1 (en) 2014-12-31

Similar Documents

Publication Publication Date Title
TW201510878A (en) Measurement device
TWI475597B (en) Pattern evaluation method and pattern evaluation device
JP5948138B2 (en) Defect analysis support device, program executed by defect analysis support device, and defect analysis system
JP5525421B2 (en) Image capturing apparatus and image capturing method
JP5937878B2 (en) Pattern matching method and apparatus
US20210358101A1 (en) Processing image data sets
JP5164598B2 (en) Review method and review device
JP2014026521A (en) Matching processor, matching processing method and inspection apparatus using the same
JP2007047930A (en) Image processor and inspection device
CN108431936A (en) Grouping based on shape
JP5323457B2 (en) Observation condition determination support apparatus and observation condition determination support method
US10571406B2 (en) Method of performing metrology operations and system thereof
JP2017102405A (en) Microscope, image pasting method, and program
JP2004095657A (en) Semiconductor inspecting apparatus
JP4795146B2 (en) Electron beam apparatus, probe control method and program
JP6484031B2 (en) Beam condition setting device and charged particle beam device
KR102252326B1 (en) Systems, methods and computer program products for automatically generating wafer image-to-design coordinate mapping
WO2021240610A1 (en) Pattern inspection/measurement device, and pattern inspection/ measurement program
JP2020123064A (en) Image matching determination method, image matching determination device, and computer-readable recording medium capable of recording programs for causing computers to execute image matching determination method
CN117437602B (en) Dual-layer data calibration method, device, equipment and readable storage medium
JP7204504B2 (en) Object confirmation device
TWI767458B (en) Pattern matching device, pattern determination system and non-transitory computer readable medium
TWI833822B (en) Method and system for automatically mapping fluid objects on a substrate
JP5971746B2 (en) Template matching positioning method and charged particle beam apparatus
JP2014021684A (en) Template preparation device of measurement device