TW201508566A - Touch screen module - Google Patents

Abstract

The present invention provides a touch screen module, which includes a substrate. A plurality of first sensing electrodes and a plurality of second sensing electrodes are arranged on the substrate. The plurality of first sensing lines and second sensing lines are configured for sensing touch operation coordinately. A plurality of metal pads are arranged on each edge of the substrate. Each metal pad corresponds to a conductive column electrically connected to a sensing line. The conductive column is electrically connected to a circuit board via a trace.

Description

Touch screen module

The invention relates to a touch screen module.

At present, touch devices with touch functions are becoming more and more popular. A touch sensing module is disposed on the touch screen module of the existing touch device to receive a touch operation of the user, and a trace is generally connected to the sensing string and the circuit board at the edge of the touch screen module. To provide the voltage signal of the board to the sensing series. However, since the circuit board is disposed on one side of the touch screen module, the surrounding area of the touch screen module occupies a large area. Therefore, the border of the touch screen module in the prior art is wider.

In view of the above, it is necessary to provide a touch screen module with a narrow frame and a manufacturing method thereof.

The present invention provides a touch screen module including a substrate, a plurality of first sensing electrodes and a plurality of second sensing electrodes disposed on the substrate, the plurality of first sensing electrodes and the plurality of strips The two sensing electrodes cooperate with each other for sensing a touch operation; the edge of the substrate is provided with a plurality of metal connection pads, each of the metal connection pads is connected to one sensing electrode, and each of the metal connection pads is correspondingly provided with a first conductive pillar structure Each first conductive pillar structure is connected to the circuit board via a trace.

Compared with the prior art, the touch screen module of the present invention is provided with a metal connection pad at the edge of the substrate and connected to the circuit board through the first conductive pillar structure and the trace, thereby reducing the trace area and making the border of the touch screen module. Narrower.

1 is a perspective view of a first embodiment of a touch screen module of the present invention.

2 is a cross-sectional view of the touch screen module of FIG. 1 taken along AA'.

3 is a cross-sectional view of the touch screen module of FIG. 1 .

4 is a perspective view of a second embodiment of the touch screen module of the present invention.

The invention will now be described in detail with reference to the accompanying drawings.

Referring to FIG. 1 , FIG. 2 and FIG. 3 , FIG. 1 is a schematic plan view of a preferred embodiment of the touch screen module 100 of the present invention; FIG. 2 is a schematic view of the touch screen module 100 of FIG. FIG. 3 is a cross-sectional view of the touch screen module 100 of FIG. 1 . The touch screen module 100 includes a substrate 11 , a plurality of first sensing electrodes 13 , and a plurality of second sensing electrodes 15 . The plurality of first sensing electrodes 13 and the plurality of second sensing electrodes 15 are disposed on the substrate 11 in parallel with each other, and the plurality of first sensing electrodes 13 and the plurality of second sensing electrodes 15 are mutually It is vertically disposed on the substrate 11. The substrate 11 is a glass substrate. A plurality of metal connection pads 17 are disposed on each edge of the substrate 11. Each of the metal connection pads 17 is connected to a first sensing electrode 13 or a second sensing electrode 15.

Each of the metal connection pads 17 is correspondingly provided with a first conductive pillar structure 19. In addition, the plurality of metal connection pads 17 may be disposed on the plurality of edges of the substrate 11, such as three other than the opposite edges of the circuit board. The position and shape of the plurality of metal connection pads 17 are adjusted by the edges, or with the design of the product.

The circuit board 210 includes a plurality of connection pads 2101, and a second conductive pillar structure 2103 is disposed on each of the connection pads 2101. The number of the connection pads 2101 is the same as the number of the metal connection pads 17. The first conductive pillar structure 19 is connected to the second conductive pillar structure 2103 via a trace 220. The traces 220 are insulated from each other and stacked. In the present embodiment, the traces 220 include a metal wire 2201 and an insulating sheath 2203. In this embodiment, the plurality of first sensing electrodes 13 are disposed in the same layer as the plurality of second sensing electrodes 15 , and the intersection of each of the first sensing electrodes 13 and the second sensing electrodes 15 The insulating layer 14 is disposed to electrically insulate the first sensing electrode 13 from the second sensing electrode 15 from each other. In the present embodiment, the insulating layer 14 is a transparent insulating material.

In order to make the touch screen module 100 have good transparency, the first sensing electrode 13 and the second sensing electrode 15 are transparent conductive materials, such as: Indium Tin Oxide (ITO), indium oxide. Indium zinc Oxide (IZO) or other transparent conductive material. The metal connection pad 17 may be made of a metal material such as aluminum, silver or copper, and the same conductive material as the first and second sensing electrodes may be used.

The substrate 11 includes a first side 11a, a second side 11b, a third side 11c, and a fourth side 11d. The first side 11a is opposite to the third side 11c. The second side 11b It is disposed opposite to the fourth side 11d. One end of each of the first sensing electrodes 13 is provided with a first connecting pad 13a connected to a metal connecting pad 17, in particular, an odd number of first sensing electrodes 13 in the plurality of first sensing electrodes 13 are The first side edge 11a of the substrate 11 is provided with a first connection pad 13a, and each of the first connection pads 13a is electrically connected to a metal connection pad 17; the even number of first sensing electrodes 13 are on the third side of the substrate 11. 11c is provided with a first connection pad 13a, and each of the first connection pads 13a is electrically connected to a metal connection pad 17.

One end of each of the second sensing electrodes 15 is provided with a second connection pad 15a connected to a metal connection pad 17. Specifically, an odd number of second sensing electrodes 15 of the plurality of second sensing electrodes 15 are disposed at the ends of the second side 11b of the substrate 11 with a second connection pad 15a, and each of the second connection pads 15a and a metal connection pad 17 is electrically connected; an even number of second sensing electrodes 15 of the plurality of second sensing electrodes 15 are provided with a second connection pad 15a at the end of the fourth side 11d of the substrate 11, and each The two connection pads 15a are electrically connected to a metal connection pad 17.

In this embodiment, in order not to increase the thickness of the touch screen module 100, the thickness of the metal connection pad 17 is smaller than the thickness of the first sensing electrode 13, and the thickness of the metal connection pad 17 is the same as the first The sum of the thicknesses of the conductive pillar structures 19 is equal to the thickness of the first sensing electrode 13.

In the embodiment, the first conductive pillar structure 19 is a cylindrical structure. In other embodiments, the first conductive pillar structure 19 is a thimble structure.

The first conductive pillar structure 19 may be made of the same material as the metal connection pad 17, and the first conductive pillar structure 19 may be integrally formed with the metal connection pad 17, or the metal connection pad 17 may be first deposited on the substrate. And then depositing the first conductive pillar structure 19 on the metal connection pad 17. In other embodiments, the first conductive pillar structure 19 may be made of a different material from the metal connection pad 17 . First, a metal connection pad 17 is deposited on the substrate 11 , and then the first conductive pillar structure 19 is deposited on the substrate. The metal is connected to the pad 17.

Please refer to FIG. 4. FIG. 4 is a perspective view of a second embodiment of the touch screen module of the present invention. The touch screen module 200 is different from the touch screen module 100 in that a plurality of first sensing electrodes 23 are disposed near one end of the third side 21c of the substrate 21, and a first connection pad 23a is disposed. A metal connection pad 27 is disposed correspondingly to the connection pad 23a. The metal connection pad 27 is correspondingly disposed with a first conductive pillar structure 29, and the first conductive pillar structure is connected to the circuit board 210 via the trace 220. A second connection pad 25a is disposed at one end of the second sensing electrode 25 adjacent to the fourth side edge 21d of the substrate. Each of the second connection pads 25a is correspondingly provided with a metal connection pad 27, and the metal connection pad 27 is correspondingly disposed. A first conductive pillar structure is connected to the circuit board 210 via a trace 220.

The touch screen module of the present invention is provided with a metal connection pad at the edge of the substrate and connected to the circuit board through the first conductive pillar structure and the trace, thereby reducing the wiring area and making the frame of the touch screen module narrower.

While the invention has been described above in terms of a preferred embodiment thereof, it is not intended to limit the invention, and various modifications may be made by those skilled in the art without departing from the spirit and scope of the invention. Changes are intended to be included within the scope of the claimed invention.

100,200‧‧‧ touch screen module

11, 21‧‧‧ substrate

11a‧‧‧ first side

11b‧‧‧Second side

11c, 21c‧‧‧ third side

11d, 21d‧‧‧ fourth side

13, 23‧‧‧ first sensing electrode

13a, 23a‧‧‧ first connection pad

14‧‧‧Insulation

15, 25‧‧‧Second sensing electrode

15a, 25a‧‧‧second connection pad

17, 27‧‧‧Metal connection pads

19, 29‧‧‧ First conductive column structure

210‧‧‧ boards

2101‧‧‧Connecting mat

2103‧‧‧Second conductive column structure

220‧‧‧Wiring

2201‧‧‧Metal wire

2203‧‧‧Insulated outer skin

no

100‧‧‧ touch screen module

11‧‧‧Substrate

11a‧‧‧ first side

11b‧‧‧Second side

11c‧‧‧ third side

11d‧‧‧4th side

13‧‧‧First sensing electrode

13a‧‧‧First connection pad

15‧‧‧Second sensing electrode

15a‧‧‧Second connection pad

17‧‧‧Metal connection pads

19‧‧‧First conductive column structure

210‧‧‧ boards

2101‧‧‧Connecting mat

2103‧‧‧Second conductive column structure

220‧‧‧Wiring

Claims (13)

A touch screen module includes a substrate, a plurality of first sensing electrodes and a plurality of second sensing electrodes disposed on the substrate, the plurality of first sensing electrodes and the plurality of second sensing electrodes The electrodes cooperate with each other for sensing a touch operation; the edge of the substrate is provided with a plurality of metal connection pads, each metal connection pad is connected to a sensing electrode, and each of the metal connection pads is correspondingly provided with a first conductive pillar structure, and each The first conductive pillar structure is connected to the circuit board via a trace. The touch screen module of claim 1, wherein the trace comprises a metal wire and an insulating sheath wrapped around the metal wire. The touch screen module of claim 1, wherein the circuit board includes a connection pad and a second conductive pillar structure disposed on the connection pad, and the trace is connected to the circuit board through the second conductive pillar structure The pads are electrically connected. The touch screen module of claim 1, wherein the plurality of first sensing electrodes are disposed in the same layer as the plurality of second sensing electrodes, and each of the first sensing electrodes and the second sensing An insulating layer is disposed at an intersection of the electrodes to electrically insulate the first sensing electrode from the second sensing electrode. The touch screen module of claim 1, wherein the metal connection pad has a thickness smaller than a thickness of the first sensing electrode. The touch screen module of claim 1, wherein a thickness of the metal connection pad and a thickness of the first conductive pillar structure are equal to a thickness of the first sensing electrode. The touch screen module of claim 1, wherein the first conductive pillar structure is a cylindrical structure. The touch screen module of claim 1, wherein the first conductive pillar structure is made of the same material as the metal connection pad, and the first conductive pillar structure is integrally formed with the metal connection pad. The touch screen module of claim 1, wherein the first conductive pillar structure is made of a different material from the metal connection pad, and a metal connection pad is first deposited on the substrate, and then the first conductive pillar is A structural deposit is formed on the metal connection pad. The touch screen module of claim 1, wherein the substrate comprises a first side, a second side, a third side, and a fourth side, wherein the first side is opposite to the third side The second side is disposed opposite to the fourth side; one end of each of the first sensing electrodes is disposed with a first connection pad connected to a metal connection pad, and one end of each of the second sensing electrodes is disposed The second connection pad is connected to a metal connection pad. The touch screen module of claim 10, wherein an odd number of first sensing electrodes of the plurality of first sensing electrodes are provided with a first connecting pad on a first side of the substrate, each of the first A connection pad is electrically connected to a metal connection pad; an even number of first sensing electrodes are provided with a first connection pad on a third side of the substrate, and each of the first connection pads is electrically connected to a metal connection pad. The touch screen module of claim 10, wherein an odd number of second sensing electrodes of the plurality of second sensing electrodes are provided with a second connection pad at an end of the second side of the substrate, and each a second connection pad is electrically connected to a metal connection pad; an even number of second sensing electrodes of the plurality of second sensing electrodes are provided with a second connection pad at an end of the fourth side of the substrate, and each The two connection pads are electrically connected to a metal connection pad. The touch screen module of claim 10, wherein the plurality of first sensing electrodes are disposed adjacent to one end of the third side of the substrate, and the first connecting pads are respectively provided with a metal. a connection pad, the metal connection pad is correspondingly disposed with a first conductive pillar structure, the first conductive pillar structure is connected to the circuit board via a trace; and the plurality of second sensing electrodes are disposed adjacent to one end of the fourth side of the substrate The two connection pads are respectively provided with a metal connection pad. The metal connection pad is correspondingly disposed with a first conductive pillar structure, and the first conductive pillar structure is connected to the circuit board via a trace.