TW201502075A - Nanoparticles, ink and process for making and using - Google Patents

Nanoparticles, ink and process for making and using Download PDF

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TW201502075A
TW201502075A TW103118867A TW103118867A TW201502075A TW 201502075 A TW201502075 A TW 201502075A TW 103118867 A TW103118867 A TW 103118867A TW 103118867 A TW103118867 A TW 103118867A TW 201502075 A TW201502075 A TW 201502075A
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nanoparticle
nanoparticles
layer
chalcogenide
ink
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Rebekah Hooker
Ranjan Deepak Deshmukh
Pawel Miskiewicz
Paul Craig Brookes
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Merck Patent Gmbh
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    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01GCOMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
    • C01G19/00Compounds of tin
    • C01G19/006Compounds containing, besides tin, two or more other elements, with the exception of oxygen or hydrogen
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B19/00Selenium; Tellurium; Compounds thereof
    • C01B19/002Compounds containing, besides selenium or tellurium, more than one other element, with -O- and -OH not being considered as anions
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    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00Inks
    • C09D11/52Electrically conductive inks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/0248Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
    • H01L31/0256Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
    • H01L31/0264Inorganic materials
    • H01L31/032Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312
    • H01L31/0322Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312 comprising only AIBIIICVI chalcopyrite compounds, e.g. Cu In Se2, Cu Ga Se2, Cu In Ga Se2
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    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
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    • C01P2002/50Solid solutions
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    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00Particle morphology
    • C01P2004/01Particle morphology depicted by an image
    • C01P2004/03Particle morphology depicted by an image obtained by SEM
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00Particle morphology
    • C01P2004/60Particles characterised by their size
    • C01P2004/64Nanometer sized, i.e. from 1-100 nanometer
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00Physical properties of inorganic compounds
    • C01P2006/40Electric properties
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/541CuInSe2 material PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P20/00Technologies relating to chemical industry
    • Y02P20/10Process efficiency
    • Y02P20/133Renewable energy sources, e.g. sunlight
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Abstract

This invention relates to ternary, quaternary or multinary chalcogenide semiconductor nanoparticles (NPs) stabilized by inorganic ions including tetrahalogenoborate, hexahalogenophosphate or hexahalogenoantimonate. The invention further relates to stable nanoparticle inks formulated with these modified nanoparticles, and semiconductor layers and devices generated using these inks. The nanoparticles are preferably semiconducting nanocrystals of the ternary, quaternary or multinary metal chalcogenide type. The specifically stabilized nanoparticles can be produced by a ligand exchange starting from conventional nanoparticles.

Description

奈米顆粒、墨水及製造與使用方法 Nanoparticles, inks, and methods of manufacture and use

本發明係關於藉由包括四鹵代硼酸根、六鹵代磷酸根或六鹵代銻酸根之無機離子穩定之三元、四元或多元硫族化物半導體奈米顆粒(NP)。本發明進一步係關於用此等改質奈米顆粒配製之穩定奈米顆粒墨水,及使用此等墨水生成之半導體層與器件。奈米顆粒較佳地為三元、四元或多元金屬硫族化物類型之半導體奈米晶體。特別穩定之奈米顆粒可藉由自習知奈米顆粒開始之配位體交換產生。 The present invention relates to ternary, quaternary or polychalcogenide semiconductor nanoparticles (NP) stabilized by inorganic ions comprising a tetrahalo borate, a hexahalophosphate or a hexahalogen ruthenate. The invention further relates to stabilized nanoparticle inks formulated with such modified nanoparticles, and semiconductor layers and devices formed using such inks. The nanoparticle is preferably a semiconductor nanocrystal of the ternary, quaternary or polymetallic chalcogenide type. Particularly stable nanoparticles can be produced by ligand exchange starting from the learned nanoparticle.

基於如CuInSe2(CIS)、CuIn(Sy,Se1-y)2(CISS)、CuInxGa1-x(Sey,S1-y)2(CIGS)等I-III-VI2型銅之半導體(黃銅礦式)為作為用於薄膜太陽能電池之吸收層而廣泛研究之半導體。CISS與CIGS具有直接帶隙,該帶隙可藉由改變In/Ga比率或藉由改變S/Se比率而調整以匹配太陽光譜。 Based on I-III-VI 2 type such as CuInSe 2 (CIS), CuIn(S y , Se 1-y ) 2 (CISS), CuIn x Ga 1-x (Se y , S 1-y ) 2 (CIGS) Copper semiconductor (chalcopyrite) is a semiconductor widely studied as an absorption layer for thin film solar cells. CISS and CIGS have a direct band gap that can be adjusted to match the solar spectrum by changing the In/Ga ratio or by changing the S/Se ratio.

基於多晶二硒化銅銦(CIS)及其鎵硫合金(CIGS)薄膜之太陽能電池在模組中表現出令人印象深刻的電池效率與意想不到的穩定性。近年來,濺鍍至軟塑膠上之實驗室規模CIGS電池達到20.4%能量轉換效率之新紀錄(www.empa.ch)。CIGS之效能已高於迄今為止關於競爭技術CdTe(16.5%)與a-Si(12%)之文獻中報告之最佳值。 Solar cells based on polycrystalline copper indium diselenide (CIS) and its gallium-sulfur alloy (CIGS) films exhibit impressive cell efficiencies and unexpected stability in the module. In recent years, laboratory-scale CIGS cells sputtered onto soft plastics have achieved a new record of 20.4% energy conversion efficiency (www.empa.ch). The performance of CIGS has been higher than the best reported so far in the literature on competitive technologies CdTe (16.5%) and a-Si (12%).

考慮到與光伏打器件製造有關之低利潤率,研究工作亦著重於一類含有地球中含量豐富且廉價之金屬之多元金屬硫族化物材料。硫 化銅錫(Cu2SnS3或「CTS」)及硫化銅鋅錫(Cu2ZnSnS4或「CZTS」)為此類材料特別有用之實例。與CIGS相似,CZTS可與元素(諸如Ge)摻雜以改變其帶隙。雖然CZTS之記錄效率近年來低於在IBM(Todorov等人,Adv.Energy Mater.2013,3,34-38)所展現之CIGS之11%電池效率,但與鎵及銦相比更高之鋅及錫豐度使其從成本角度來看引人關注。 Considering the low profit margins associated with the manufacture of photovoltaic devices, research has also focused on a class of multi-metal chalcogenide materials containing abundant and inexpensive metals in the earth. Copper sulfide tin (Cu 2 SnS 3 or "CTS") and copper zinc tin oxide (Cu 2 ZnSnS 4 or "CZTS") are particularly useful examples of such materials. Similar to CIGS, CZTS can be doped with an element such as Ge to change its band gap. Although the recording efficiency of CZTS has been lower than the 11% battery efficiency of CIGS exhibited by IBM (Todorov et al., Adv. Energy Mater. 2013 , 3, 34-38) in recent years, zinc is higher than gallium and indium. And the abundance of tin makes it attractive from a cost perspective.

習知用於沈積薄膜吸收劑之真空共蒸發及濺鍍法代價高、技術要求苛刻且浪費,因此阻礙了大規模光伏打器件製造之實施。為達成大規模生產,必需克服主要製造挑戰,諸如維護大面積之組成均勻性,獲得對通量/沈積速率之精確控制以避免中間相,及達成高材料利用率。 Conventional vacuum co-evaporation and sputtering processes for depositing thin film absorbers are costly, technically demanding, and wasteful, thus hindering the implementation of large scale photovoltaic device fabrication. In order to achieve mass production, major manufacturing challenges must be overcome, such as maintaining a uniform composition of large areas, achieving precise control of flux/deposition rates to avoid intermediate phases, and achieving high material utilization.

經由基於溶液之沈積法匹配基於碳之能量生產之市場價值為可能的。各種溶液沈積技術可用於將前驅體沈積至吸收層。 It is possible to match the market value of carbon-based energy production via solution-based deposition. Various solution deposition techniques can be used to deposit the precursor to the absorber layer.

文獻(Hibberd等人,Prog.Photovolt:Res.Appl. 2010,18,434-452)中已描述大量用於形成半導體之非真空操作方法。此等方法包括各種基於溶液之方法,包括基於金屬鹽或更複雜分子前驅體之熱解之彼等方法。替代途徑依賴於奈米顆粒懸浮物之沈積。 A number of non-vacuum operating methods for forming semiconductors have been described in the literature (Hibberd et al., Prog. Photovolt: Res. Appl. 2010 , 18, 434-452). These methods include various solution based methods, including those based on the pyrolysis of metal salts or more complex molecular precursors. An alternative approach relies on the deposition of nanoparticle suspensions.

CIGS奈米顆粒合成之第一份報告(Guo等人,NanoLett. 2008,8(9),第2982頁)五年之內,CIGS奈米顆粒墨水為達成12.0%之光子轉換效率之沈積與加工參數得以優化。為實現此點,由二硫化銅銦鎵(CIGS)奈米晶體形成於烷硫醇溶劑中之膜在硒化處理(Guo等人,Prog.Photovolt:Res.Appl. 2012,doi:10.1002/pip.2200)之前進行NaCl水性暴露處理。儘管達到有前景的效率值,由於本案中為油胺(C18一級胺)之脂族配位體,此等膜含有較高碳含量。熱處理後,配位體之降解產物被發現聚集於底部接觸體附近,限制了電池效率。 In the first report of CIGS nanoparticle synthesis (Guo et al., NanoLett. 2008 , 8(9), p. 2982), CIGS nanoparticle inks were deposited and processed to achieve 12.0% photon conversion efficiency within five years. The parameters are optimized. To achieve this, a film formed from a copper indium gallium disulfide (CIGS) nanocrystal in an alkanethiol solvent is selenized (Guo et al., Prog. Photovolt: Res. Appl. 2012 , doi: 10.1002/pip). .2200) Prior to aqueous NaCl exposure treatment. Despite the promising efficiency values, these films contain higher carbon contents due to the aliphatic ligands of oleylamine ( C18 primary amine) in this case. After heat treatment, the degradation products of the ligand were found to collect near the bottom contact, limiting battery efficiency.

因此,自基於奈米顆粒之CIGS器件達成甚至更高效率之一個主 要障礙為奈米顆粒慣常地藉由有機配位體,通常藉由油胺(OLA)穩定,該等配位體最終污染半導體層且降低器件效能。配位體於奈米顆粒合成期間為不可或缺之且已展示與控制奈米顆粒之尺寸及形態有關(Kar等人,J.Am.Chem.Soc. 2011,133(43),第17239-17247頁)。隨後,有機配位體用於在沈積之前及沈積期間於有機溶劑中溶解奈米顆粒。然而,形成膜之後,配位體之殘餘元素可影響器件。配位體之殘餘組分可阻止吸收層中所需微米級晶粒之形成。已記錄聚集於鉬界面之碳質殘餘物之不利影響(Kaelin等人,Thin Solid Films 2005,480-481(2005),第486頁)。 Therefore, a major obstacle to achieving even higher efficiencies from CIGS devices based on nanoparticles is that nanoparticles are conventionally stabilized by organic ligands, usually oleoamine (OLA), which eventually contaminate the semiconductor. Layer and reduce device performance. Ligands are indispensable during the synthesis of nanoparticles and have been shown to be related to the size and morphology of the controlled nanoparticles (Kar et al, J. Am. Chem. Soc. 2011 , 133(43), p. 17239- 17247 pages). Subsequently, the organic ligand is used to dissolve the nanoparticles in an organic solvent before and during deposition. However, after the film is formed, the residual elements of the ligand can affect the device. The residual components of the ligand prevent the formation of the desired micron-sized grains in the absorber layer. The adverse effects of carbonaceous residues that accumulate at the molybdenum interface have been documented (Kaelin et al, Thin Solid Films 2005 , 480-481 (2005), page 486).

藉由肼穩定之前驅體奈米顆粒已報告於文獻中且近來獲得已知之最高效率溶液加工型器件(Todorov等人,Advanced Materials 2010,22,E156-E159)。儘管如此,包含較少有害且有毒物質之奈米顆粒墨水對於工業應用具有極大優勢。 The precursor nanoparticles which have been stabilized by ruthenium have been reported in the literature and recently the most efficient solution-processed devices known to be known (Todorov et al., Advanced Materials 2010 , 22, E156-E159). Nonetheless, nanoparticle inks containing less harmful and toxic substances have great advantages for industrial applications.

WO 2009/137637與WO 2011/066205為報告三元金屬硫族化物奈米顆粒及其於膜形成中之用途之例示性文件。胺經常在合成及進一步使用中用作配位體。鹵基中之四氟硼酸鹽、六氟磷酸鹽或六氯銻酸鹽等無機配位體及其類似物並未作為配位體提及。 WO 2009/137637 and WO 2011/066205 are exemplary documents for reporting the use of ternary metal chalcogenide nanoparticles and their use in film formation. Amines are often used as ligands in the synthesis and further use. Inorganic ligands such as tetrafluoroborate, hexafluorophosphate or hexachloroantimonate in the halogen group and the like are not mentioned as ligands.

同樣存在對可順利轉換為具有高結晶形態及良好太陽能轉換之半導體膜之三元或多元金屬硫族化物材料之需要。 There is also a need for a ternary or multi-component metal chalcogenide material that can be smoothly converted to a semiconductor film having a high crystalline morphology and good solar conversion.

針對工業製程,用於產生半導體層之材料及組成應穩定、成本有效、環保且易於處理而不會暴露於過度危害。 For industrial processes, the materials and compositions used to create the semiconductor layer should be stable, cost effective, environmentally friendly, and easy to handle without exposure to excessive hazards.

定義definition

根據本發明之術語「硫族元素」限於硫(S)、硒(Se)及某種程度上碲(Te)。硒(Se)、硫(S)及S與Se之組合為較佳的硫族元素。 The term "chalcogen" in accordance with the invention is limited to sulfur (S), selenium (Se) and to some extent strontium (Te). Selenium (Se), sulfur (S), and a combination of S and Se are preferred chalcogen elements.

術語「金屬硫族化物」代表金屬硫化物、金屬硒化物或金屬碲化物,及其組合。 The term "metal chalcogenide" means metal sulfide, metal selenide or metal telluride, and combinations thereof.

「二元」硫族化物為由單種金屬與硫族化物構成者,諸如In2S3或Cu2Se。「三元」硫族化物意謂由兩種金屬與硫族化物構成之材料,諸如CIS(CuInS2)或CISS(CuIn(S,Se)2)。「四元」硫族化物類似地代表由三種金屬與硫族化物構成之材料,諸如CIGS。「多元」硫族化物類似地代表由甚至更多種金屬構成之材料。 A "binary" chalcogenide is composed of a single metal and a chalcogenide such as In 2 S 3 or Cu 2 Se. "Ternary" chalcogenide means a material composed of two metals and a chalcogenide such as CIS (CuInS 2 ) or CISS (CuIn(S, Se) 2 ). "Quaternary" chalcogenides similarly represent materials composed of three metals and chalcogenides, such as CIGS. "Diversified" chalcogenides similarly represent materials composed of even more metals.

本發明通篇使用之硫族化物半導體根據其元素組成由其類型引用。數字I(例如,用於Cu、Ag)、II(例如,用於Zn、Cd)、III(例如,用於Ga、In)、IV(例如,用於Ge、Sn)及VI(例如,用於S、Se、Te)用於代表具有相同價電子數之某族元素,此處添加至括號中。因此,「I-III-VI」型半導體通常意謂主要包含選自第11(亦稱IB)與13(亦稱IIIA)及硫族化物族(第I6族)之金屬之三元硫族化物。同樣地,「I-II/VI-VI」型半導體意謂主要包含選自第11(亦稱IB)與12(亦稱IIB)、14(亦稱IVA)及硫族化物族之金屬之四元硫族化物。化學計量於通常在此型半導體硫族化物中發現之值周圍變化。理想化學計量式,例如CuInS2或Cu2ZnSnSe2,可藉由互換不同族之金屬而顯著變化。 The chalcogenide semiconductor used throughout the present invention is referred to by its type according to its elemental composition. Number I (for example, for Cu, Ag), II (for example, for Zn, Cd), III (for example, for Ga, In), IV (for example, for Ge, Sn), and VI (for example, The S, Se, Te) are used to represent a certain family element having the same valence electron number, and are added here to the parentheses. Therefore, "I-III-VI" type semiconductor generally means a ternary chalcogenide mainly comprising a metal selected from the group consisting of 11th (also known as IB) and 13 (also known as IIIA) and chalcogenide group (Group I6). . Similarly, the "I-II/VI-VI" type semiconductor means mainly consisting of four metals selected from the 11th (also known as IB) and 12 (also known as IIB), 14 (also known as IVA) and chalcogenide families. Elemental chalcogenide. The stoichiometry varies around the values typically found in this type of semiconductor chalcogenide. An ideal stoichiometric formula, such as CuInS 2 or Cu 2 ZnSnSe 2 , can vary significantly by exchanging metals of different families.

本發明大體通篇使用之術語「CIGS」及「CZTS」與文獻中之常見理解類似。CIGS代表具有不同元素分佈之硒化銅銦鎵。CZTS代表具有不同元素分佈之硒化銅鋅錫。化合物常藉由變化之分子式,如Cu(In,Ga)(S,Se)2與Cu2ZnSn(S,Se)4而可替代地描述。當總量與公式之化學計量需求一致時,合併至括號中之元素指示元素中之任一者或其組合。例示性(S,Se)n代表Sn-xSex,且x為0與n之間的數值。舉例而言,當n為2時,x可代表0、0.1、0.2、0.5、1.0、1.5、1.8、1.9或2.0。大體而言,源自典型化學計量之弱銅元素組成物很實用,因為其展示有利的吸收特徵。在這個意義上,本發明通篇之分子式包括元素分佈中之此等變動。在CIGS與CZTS之兩種吸收劑中,可存在部分或全部代替硒之硫或反之亦然。可以更少之量存在其他元素,例如, 替代Cu之Ag,或CIGS中之Sn、Zn、Cd,或CZTS中之In、Ge、Cd,如Na、Sb、Te、As等等之痕量元素。 The terms "CIGS" and "CZTS" as used throughout the present invention are similar to the common understandings in the literature. CIGS stands for copper indium gallium selenide with different element distributions. CZTS represents selenized copper zinc tin with different elemental distributions. The compounds are often alternatively described by varying molecular formulas such as Cu(In,Ga)(S,Se) 2 and Cu 2 ZnSn(S,Se) 4 . When the total amount is consistent with the stoichiometric demand of the formula, the elements in parentheses are combined to indicate either or both of the elements. An exemplary (S, Se) n represents S nx Se x and x is a value between 0 and n. For example, when n is 2, x can represent 0, 0.1, 0.2, 0.5, 1.0, 1.5, 1.8, 1.9, or 2.0. In general, weak copper element compositions derived from typical stoichiometry are useful because they exhibit advantageous absorption characteristics. In this sense, the formula throughout the present invention includes such variations in the distribution of elements. In the two absorbents of CIGS and CZTS, there may be some or all of the sulfur instead of selenium or vice versa. Other elements may be present in a smaller amount, for example, instead of Cu, or Sn, Zn, Cd in CIGS, or In, Ge, Cd in CZTS, such as trace elements of Na, Sb, Te, As, etc. .

術語「奈米顆粒」意在包括含有硫族化物之顆粒,該等顆粒之特徵在於約1nm至約1000nm,或約1nm至約500nm,或約2nm至約300nm之平均最大尺寸。奈米顆粒可具有不同形狀,包括多面體、球體、棒體、線狀、管狀、片狀、晶鬚狀、環狀、圓盤狀或稜柱狀。多數奈米顆粒為結晶,常為單晶結構。此等奈米顆粒亦稱為「奈米晶體」。除非另作規定,否則奈米顆粒可具有用作分散助劑之「表面塗料」。本文中亦可稱為「表面配位體」或「封端劑」之表面塗料可藉由(例如)感應電荷或(部分)電荷物理吸附至奈米顆粒,或藉由(例如)氫鍵或共價鍵或多或少地化學接合至奈米顆粒。此表面塗料亦可為溶劑或可包含添加至反應混合物之一或多種配位體。本說明書通篇所有指代奈米顆粒之wt%意在包括表面塗料。 The term "nanoparticle" is intended to include particles containing chalcogenide characterized by an average maximum dimension of from about 1 nm to about 1000 nm, or from about 1 nm to about 500 nm, or from about 2 nm to about 300 nm. The nanoparticles may have different shapes including polyhedrons, spheres, rods, wires, tubes, sheets, whiskers, rings, discs or prisms. Most nanoparticles are crystalline and often have a single crystal structure. These nano particles are also known as "nano crystals". Unless otherwise specified, the nanoparticles may have a "surface coating" for use as a dispersing aid. Surface coatings, which may also be referred to herein as "surface ligands" or "blocking agents", may be physically adsorbed to the nanoparticles by, for example, an inductive charge or (partial) charge, or by, for example, hydrogen bonding or The covalent bond is more or less chemically bonded to the nanoparticle. The surface coating may also be a solvent or may comprise one or more ligands added to the reaction mixture. Throughout this specification, all references to wt% of nanoparticle are intended to include surface coatings.

除非另作特別定義,否則本文中術語「墨水」與「分散液」為同義詞。墨水意在描述奈米顆粒、液體介質及視情況選用之其他組分之均相混合物。 The term "ink" and "dispersion" are synonymous in this context unless otherwise specifically defined. The ink is intended to describe a homogeneous mixture of nanoparticles, a liquid medium, and optionally other components.

如本文中使用之用於奈米顆粒之「配位體」為中性或離子型分子或原子,其適於或多或少地緊密黏著至奈米顆粒表面。表面與配位體之間之相互作用可為離子型、共價型或任何其他類型。 A "ligand" for use in a nanoparticle as used herein is a neutral or ionic molecule or atom that is suitable for more or less tight adhesion to the surface of the nanoparticle. The interaction between the surface and the ligand can be ionic, covalent or any other type.

根據本發明之一或多個目的,如本文中體現與大致描述,本發明大體係關於自適合的膠態奈米顆粒之液體組成物(NP墨水)提供高效之半導體,具體為金屬硫族化物的結晶膜。本發明進一步著重於提供奈米顆粒及穩定奈米顆粒墨水,其可轉換為用於高效金屬硫族化物太陽能電池中之具有低碳含量之結晶吸收層。 In accordance with one or more objects of the present invention, as embodied and broadly described herein, the present invention provides a highly efficient semiconductor, in particular a metal chalcogenide, from a liquid composition (NP ink) of suitable colloidal nanoparticles. Crystalline film. The present invention is further directed to providing nanoparticle and stabilized nanoparticle inks that can be converted to a crystalline absorption layer having a low carbon content for use in high efficiency metal chalcogenide solar cells.

根據本發明之一個態樣,本發明係關於藉由包括四鹵代硼酸 根、六鹵代磷酸根或六鹵代銻酸根之無機離子穩定之三元、四元或多元金屬硫族化物奈米顆粒(NP),及製備此等NP之方法。 According to one aspect of the invention, the invention relates to the inclusion of tetrahalogenated boric acid An inorganic ion-stabilized ternary, quaternary or multi-component metal chalcogenide nanoparticle (NP) of a root, a hexahalophosphate or a hexahalogenated ruthenate, and a method of preparing the same.

根據本發明之另一態樣,揭示包含分散於液體介質中且藉由包括四鹵代硼酸根、六鹵代磷酸根或六鹵代銻酸根之無機離子穩定之三元、四元或多元金屬硫族化物奈米顆粒(NP)之奈米顆粒墨水。 According to another aspect of the present invention, there is disclosed a ternary, quaternary or multicomponent metal comprising an inorganic ion dispersed in a liquid medium and stabilized by an inorganic ion comprising a tetrahalo borate, a hexahalophosphate or a hexahalogen ruthenate Nanoparticle ink of chalcogenide nanoparticle (NP).

本發明之另一實施例包含將根據本發明之金屬硫族化物奈米顆粒與液體介質組合以提供墨水之方法。 Another embodiment of the invention comprises a method of combining a metal chalcogenide nanoparticle according to the invention with a liquid medium to provide an ink.

在本發明之另一態樣中,提供一種製備三元、四元或多元金屬硫族化物奈米顆粒(NP)之方法,藉由以選自四鹵代硼酸根、六鹵代磷酸根或六鹵代銻酸根之無機離子處理該等NP而使該等NP藉由前述無機離子穩定。 In another aspect of the invention, a method of preparing ternary, quaternary or polybasic metal chalcogenide nanoparticles (NP) is provided, which is selected from the group consisting of a tetrahalo borate, a hexahalophosphate or The inorganic ions of the hexahalogenated ruthenate treat the NPs such that the NPs are stabilized by the aforementioned inorganic ions.

在本發明之另一態樣中,提供一種製備(結晶)三元、四元或多元金屬硫族化物層之方法,其包含以彼順序或此等步驟中之兩者或三者同時進行之方法步驟:a)將包含該等奈米顆粒及液體介質之奈米顆粒墨水沈積於基板上b)移除液體介質,及c)在存在額外硫族元素源之情況下,視情況退火或熔合奈米顆粒。 In another aspect of the invention, there is provided a method of preparing (crystalline) a ternary, quaternary or multi-component metal chalcogenide layer comprising simultaneously or in combination with two or three of the steps or the steps Method steps: a) depositing a nanoparticle ink comprising the nanoparticle and liquid medium on a substrate b) removing the liquid medium, and c) annealing or fusing as appropriate in the presence of additional sources of chalcogen Nano particles.

在本發明之另一態樣中,本發明提供光伏打器件、薄膜電晶體、水裂解光電極、感測器及其他用於包含根據本發明製造之金屬硫族化物層之電子產品的組件。 In another aspect of the invention, the invention provides a photovoltaic device, a thin film transistor, a water-cleaving photoelectrode, a sensor, and other components for an electronic product comprising a metal chalcogenide layer made in accordance with the present invention.

(1)‧‧‧吸收層 (1) ‧ ‧ absorbing layer

(2)‧‧‧鉬背部觸點 (2) ‧ ‧ molybdenum back contacts

(3)‧‧‧基板玻璃 (3) ‧‧‧Substrate glass

結合隨附圖式(圖1至圖2),藉由上文之說明及實例將更加充分地解釋及說明本發明。 The invention will be more fully explained and illustrated by the following description and examples taken in conjunction with the accompanying drawings.

圖1:掃描電子顯微照相相片(SEM)展示如根據本發明之以下實例1至實例4產生之CIGS吸收層(1)之橫截面。此圖展示顯著較大之 CIGS半導體之晶粒密集分佈於吸收層(1)中且其間具有一些較小之晶粒。具有約2微米厚之膜在於550℃在管式爐中硒化30分鐘之後產生。鉬背部接觸體(2)及基板玻璃(3)展示於吸收層之下。 Figure 1: Scanning Electron Photomicrograph (SEM) shows a cross section of a CIGS absorber layer (1) produced as in Examples 1 to 4 below in accordance with the present invention. This picture shows a significantly larger The crystal grains of the CIGS semiconductor are densely distributed in the absorption layer (1) with some small crystal grains in between. A film having a thickness of about 2 microns was produced after selenization in a tube furnace at 550 ° C for 30 minutes. The molybdenum back contact (2) and the substrate glass (3) are shown below the absorbent layer.

圖2:該圖展示光伏打器件反應及根據本發明之以下實例5.a之CIGS光伏打器件於黑暗(虛線)及AM1.5光條件(實線;根據IEC 904-3(1989),第III部分之光條件)下之I-V特徵。 Figure 2: This figure shows the photovoltaic device response and the CIGS photovoltaic device of the following example 5.a in accordance with the invention in dark (dashed line) and AM1.5 light conditions (solid line; according to IEC 904-3 (1989), The IV characteristics under the light condition of Part III).

圖3:該圖展示光伏打器件反應及根據本發明之以下實例5.b之CZTS光伏打器件於黑暗(虛線)及AM1.5光條件(IEC 904-3(1989),第III部分)下之I-V特徵。 Figure 3: This figure shows the photovoltaic device response and the CZTS photovoltaic device according to the following example 5.b of the present invention under dark (dashed line) and AM1.5 light conditions (IEC 904-3 (1989), part III) The IV feature.

在用於器件應用之奈米膠態墨水之發展中,本發明之主要成就為在不減弱在溶液中穩定性之情況下減少墨水之碳載量。具有較高碳含量之習知製造層在退火後形成具有在表面附近之所需結晶層及在底層附近具有較小顆粒之次優層之雙層。雙層之分析顯示,碳渣聚集於底層(基板或例如Mo層)附近具有較小顆粒之層中,可能導致觀察到弱結晶度。相比之下,根據本發明具有較低碳含量之層展示更高之結晶度,具有跨越層之整個厚度之密集柱狀晶粒。根據本發明已發現可製造含微量碳含量之高度結晶層。作為本發明之一部分,提供奈米顆粒墨水,其導致半導體層之該所需低碳含量,同時墨水仍然具有結合易加工性之對抗沈澱及降解之高穩定性。 In the development of nanocolloidal inks for device applications, the primary achievement of the present invention is to reduce the carbon loading of the ink without compromising stability in solution. A conventionally produced layer having a higher carbon content forms a double layer having a desired crystalline layer near the surface and a suboptimal layer having smaller particles near the bottom layer after annealing. Analysis of the two layers shows that carbon slag is concentrated in the layer with smaller particles near the bottom layer (substrate or, for example, the Mo layer), which may result in the observation of weak crystallinity. In contrast, a layer having a lower carbon content in accordance with the present invention exhibits a higher degree of crystallinity with dense columnar grains spanning the entire thickness of the layer. It has been found in accordance with the present invention that a highly crystalline layer containing a trace amount of carbon can be produced. As part of the present invention, a nanoparticulate ink is provided which results in the desired low carbon content of the semiconductor layer while the ink still has high stability against precipitation and degradation in combination with ease of processing.

由根據本發明之顆粒製造之光伏打器件在器件效能方面優越。功率轉換效率幾乎是比較實例之兩倍。其他器件參數亦經改良。 Photovoltaic devices fabricated from particles according to the present invention are superior in device performance. The power conversion efficiency is almost twice that of the comparative example. Other device parameters have also been improved.

鑒於降低碳含量之優勢,經顯示僅僅沖刷烴墨水並不能獲得穩定墨水。已展示由如達成低碳含量所需經清洗3至4次以去除配位體的奈米顆粒製造之墨水在幾個小時內凝結成團。僅提供短期穩定性之墨水對於工業製程並不佳。 In view of the advantage of lowering the carbon content, it has been shown that only the hydrocarbon ink is washed and a stable ink cannot be obtained. It has been shown that inks made from nanoparticles which have been washed 3 to 4 times to achieve a low carbon content to remove the ligands condense into agglomerates within a few hours. Ink that provides only short-term stability is not good for industrial processes.

出乎意料地,已發現替換原生主要基於碳之配位體之便利途徑。在本發明之此態樣中,提供一種製備三元、四元或多元金屬硫族化物奈米顆粒(NP)之方法,藉由以選自四鹵代硼酸根、六鹵代磷酸根或六鹵代銻酸根之無機離子處理該等NP而使該等NP該等奈米顆粒由相應無機離子穩定。以無機離子進行處理之方法按以下方式執行:處理之後,奈米顆粒表面基本被此等無機離子覆蓋。處理較佳地藉由使用包含無機離子或其鹽之液體介質進行。在此方法中,較佳地替換先前大部分有機離子,且更佳地將其自奈米顆粒表面移除。此處移除意謂所得顆粒與先前配位體一樣少,即小於5wt%,或甚至小於2wt%或1wt%之奈米顆粒由殘餘配位體所致。在經常不穩定配位體之情況下,此配位體之量可藉由熱重分析法量測。因此,奈米顆粒由新無機配位體穩定。奈米顆粒隨後較佳地不存在有機配位體(包含碳原子之配位體)的情況下。較佳的情況亦為,奈米顆粒不含肼配位體。四鹵代硼酸根、六鹵代磷酸根或六鹵代銻酸根提供為含有可藉由溶解此等鹽或自相應酸及此等試劑之轉換提供之此陰離子之溶液。此等陰離子中之鹵素代表氟、氯、溴或碘。較佳地,此等陰離子中之鹵素代表氟或氯取代基。更佳地,四鹵代硼酸根、六鹵代磷酸根及六鹵代銻酸根獨立地分別為四氟硼酸鹽、六氟磷酸鹽及六氯銻酸鹽。 Unexpectedly, it has been found to replace the convenient route of natively based primarily on carbon ligands. In this aspect of the invention, there is provided a process for the preparation of ternary, quaternary or polybasic metal chalcogenide nanoparticles (NP) by selection from a tetrahalo borate, a hexahalophosphate or a hexa The inorganic ions of the halo citrate treat the NPs such that the NPs are stabilized by the corresponding inorganic ions. The method of treating with inorganic ions is carried out in the following manner: after the treatment, the surface of the nanoparticles is substantially covered by the inorganic ions. The treatment is preferably carried out by using a liquid medium containing inorganic ions or a salt thereof. In this method, most of the previous organic ions are preferably replaced, and more preferably removed from the surface of the nanoparticle. Removal herein means that the resulting particles are as small as the previous ligand, i.e., less than 5% by weight, or even less than 2% by weight or 1% by weight of the nanoparticles are caused by the residual ligand. In the case of often unstable ligands, the amount of this ligand can be measured by thermogravimetric analysis. Therefore, the nanoparticles are stabilized by the new inorganic ligand. The nanoparticle is then preferably in the absence of an organic ligand (a ligand comprising a carbon atom). Preferably, the nanoparticles also do not contain an anthracene ligand. The tetrahalo borate, hexahalophosphate or hexahalodecanoate is provided as a solution containing such an anion which can be provided by dissolving such salts or conversion from the corresponding acid and such agents. The halogen in these anions represents fluorine, chlorine, bromine or iodine. Preferably, the halogen in such anions represents a fluorine or chlorine substituent. More preferably, the tetrahalo borate, the hexahalophosphate and the hexahalogen decanoate are independently tetrafluoroborate, hexafluorophosphate and hexachloroantimonate, respectively.

與無機離子締合之可用且適用的陽離子包括三烷基氧鎓、亞硝鎓、H+、銨、單/二/三/四級烷基銨、烷基吡啶鎓(如1-丁基-4-甲基吡啶鎓)、烷基咪唑鎓(如1-乙基-3-甲基咪唑鎓)、吡咯啶鎓、嗎啉鎓、哌啶鎓、鏻、鋶及金屬陽離子,較佳地為Cu+。三烷基氧鎓中,烷基意謂較佳地且獨立地具有1至15個碳原子之直鏈或支鏈烷基,更佳地具有1至7個碳原子之直鏈烷基,且最佳為甲基或乙基。吡啶鎓、吡咯啶鎓、嗎啉鎓、哌啶鎓、鏻、鋶及咪唑鎓之烷基取代基較佳地為具有1至7個碳原子之直鏈或支鏈烷基。尤其較佳之試劑為三甲基氧鎓或三 乙基氧鎓。三乙基氧鎓四氟硼酸鹽為廣為人知之米爾文(Meerwein)鹽。一些如三烷基氧鎓及四烷基銨等之陰離子因為其使油胺配位體烷基化且從而失活之能力而展示出特別的益處。此點導致與未烷基化之替代系統相比更有利之配位體交換。另外,在例如H+及亞硝鎓陽離子之情況下,烷基銨及烷基氧鎓陽離子不太可能降解金屬硫族化物顆粒。 Useful and suitable cations for association with inorganic ions include trialkyl oxonium, nitrosonium, H + , ammonium, mono/di/tri/quaternary alkyl ammonium, alkyl pyridinium (eg 1-butyl-) 4-methylpyridinium), alkylimidazolium (such as 1-ethyl-3-methylimidazolium), pyrrolidinium, morpholinium, piperidinium, hydrazine, hydrazine and metal cations, preferably Cu + . In the trialkyloxindole, alkyl means a straight or branched alkyl group preferably having 1 to 15 carbon atoms, more preferably a linear alkyl group having 1 to 7 carbon atoms, and Most preferred is methyl or ethyl. The alkyl substituent of pyridinium, pyrrolidinium, morpholinium, piperidinium, hydrazine, hydrazine and imidazolium is preferably a linear or branched alkyl group having 1 to 7 carbon atoms. A particularly preferred reagent is trimethyloxonium or triethyloxonium. Triethyloxonium tetrafluoroborate is a well-known Meerwein salt. Some anions such as trialkyloxonium and tetraalkylammonium exhibit particular benefits because of their ability to alkylate oleylamine ligands and thereby inactivate. This results in a more favorable ligand exchange than an alternative system that is not alkylated. In addition, in the case of, for example, H + and nitrosonium cations, alkylammonium and alkyl oxonium cations are less likely to degrade metal chalcogenide particles.

基於溶液之沈積法可提供優於基於真空之方法的許多優點,包括高材料利用率、極佳之組成均勻性及削減成本之卷軸式大規模生產。(亦參見Hibberd等人,Prog.Photovolt:Res.Appl.,2009 )。許多溶液沈積技術根據本發明可用於沈積吸收層,諸如噴塗、旋塗、噴墨印刷、刮刀塗佈、狹縫式塗佈、柔性印刷/凹版印刷、滴塗、浸塗等等。奈米顆粒墨水可藉由轉移至待藉由上述沈積技術用半導體材料覆蓋之表面而容易加工。 Solution-based deposition provides many advantages over vacuum-based methods, including high material utilization, excellent composition uniformity, and cost-effective roll-to-roll mass production. (See also Hibberd et al., Prog. Photovolt: Res. Appl., 2009 ). Many solution deposition techniques can be used in accordance with the present invention to deposit an absorbent layer such as spray coating, spin coating, ink jet printing, knife coating, slit coating, flexographic/gravure printing, dispensing, dip coating, and the like. The nanoparticle ink can be easily processed by transfer to a surface to be covered with a semiconductor material by the above deposition technique.

根據本發明,可產生化學計量控制之吸收層以藉由控制奈米顆粒化學計量(亦即,構成奈米顆粒之材料之相對量)用於光伏打器件。在適合條件下,分散於墨水中之單化合物奈米顆粒以定義之化學計量轉換為固態單化合物吸收層。將兩種或兩種以上的不同奈米顆粒組合於硫族化物吸收層中亦為可能的。 In accordance with the present invention, a stoichiometrically controlled absorber layer can be produced for use in photovoltaic devices by controlling the stoichiometry of the nanoparticles (i.e., the relative amounts of materials comprising the nanoparticles). Under suitable conditions, the single compound nanoparticle dispersed in the ink is converted to a solid single compound absorbent layer by a defined stoichiometry. It is also possible to combine two or more different nanoparticles into the chalcogenide absorption layer.

根據本發明,本方法中使用且形成為層之半導體較佳地為I-III-VI2或I2-II-IV-VI4型,有時為I2-IV-VI3型且具有非整數索引化學計量之混合形式。針對I-III-VI2型半導體使用一或多種(+III)價金屬,較佳地該等金屬係選自In及Ga,更佳地為In及與Ga組合之In。單價金屬較佳地為銅或銀,更佳地為銅。少量銀(0.01至2mol%)可有益於結晶吸收層之形成及最終器件效能。(+III)價金屬較佳地選自銦或鎵。此等金屬之混合物可用於調整半導體之帶隙。典型且較佳的化學計量為Cu(In,Ga)(S,Se)2。另外,一或多種(+III)價金屬可與(+II)價及(+IV)價 金屬之組合(I-II-IV-VI2型半導體,例如Cu2(Zn/Sn)Se4、Cu2(Zn/Sn)S4、Cu2(Zn/Ge)Se4)或僅與(+IV)金屬部分或完全互換。(+II)價金屬較佳地為鎘或鋅,較佳地為鋅。(+IV)價金屬較佳地為鍺或錫,較佳地為錫。I2-II-IV-VI4型半導體之典型化學計量式為Cu2ZnSn(S,Se)4。Cu2SnSe3為I2-IV-VI3化學計量之實例。大體而言,偏離典型化學計量之弱銅元素組成物較佳且展示有利的吸收特徵。 According to the invention, the semiconductor used in the method and formed as a layer is preferably I-III-VI 2 or I 2 -II-IV-VI 4 type, sometimes I 2 -IV-VI 3 type and has a non- A mixed form of integer index stoichiometry. One or more (+III) valence metals are used for the I-III-VI 2 type semiconductor, preferably the metals are selected from In and Ga, more preferably In and In combined with Ga. The monovalent metal is preferably copper or silver, more preferably copper. A small amount of silver (0.01 to 2 mol%) may be beneficial for the formation of the crystalline absorption layer and the final device performance. The (+III) valence metal is preferably selected from indium or gallium. A mixture of such metals can be used to adjust the band gap of the semiconductor. A typical and preferred stoichiometry is Cu(In,Ga)(S,Se) 2 . In addition, one or more (+III) valence metals may be combined with (+II) valence and (+IV) valence metal (I-II-IV-VI 2 type semiconductor, such as Cu 2 (Zn/Sn) Se 4 , Cu 2 (Zn/Sn)S 4 , Cu 2 (Zn/Ge)Se 4 ) or only partially or completely interchangeable with (+IV) metal. The (+II) valence metal is preferably cadmium or zinc, preferably zinc. The (+IV) valence metal is preferably ruthenium or tin, preferably tin. A typical stoichiometric formula for the I 2 -II-IV-VI 4 type semiconductor is Cu 2 ZnSn(S,Se) 4 . Cu 2 SnSe 3 is an example of the stoichiometry of I 2 -IV-VI 3 . In general, weak copper element compositions that deviate from typical stoichiometry are preferred and exhibit advantageous absorption characteristics.

所得半導體層之帶隙影響光伏打器件中之吸收特徵。帶隙可藉由改變層之元素組成來調適為所需值,其主要藉由奈米顆粒墨水之元素組成及視情況選用之後沈積處理而控制。由於較廣光譜,各種有用之半導體組成物已報告於文獻中。CIGS之較佳化學計量可為CuxInyGa2-y-x(S,Se)2,其中x可自0.8至1.0變化且y可自0.2至0.6變化。 The band gap of the resulting semiconductor layer affects the absorption characteristics in the photovoltaic device. The band gap can be adjusted to a desired value by changing the elemental composition of the layer, which is mainly controlled by the elemental composition of the nanoparticle ink and, optionally, the deposition process. A variety of useful semiconductor compositions have been reported in the literature due to the broader spectrum. A preferred stoichiometry for CIGS can be Cu x In y Ga 2-yx (S, Se) 2 , where x can vary from 0.8 to 1.0 and y can vary from 0.2 to 0.6.

可製造I-III-VI2與I-II-IV-VI2型半導體且較佳地不含鎘,其為超出先前技術基於Cd之半導體之環境優勢。I-II-IV-VI2型半導體,尤其含有鋅-錫之變異體,自資源角度看來具有優勢,因為其僅使用地球中含量豐富之元素。 I-III-VI 2 and I-II-IV-VI 2 type semiconductors can be fabricated and preferably do not contain cadmium, which is an environmental advantage over prior art Cd based semiconductors. The I-II-IV-VI type 2 semiconductor, especially containing zinc-tin variants, is advantageous from a resource point of view because it uses only elements rich in the earth.

奈米顆粒墨水之液體介質通常包含基於液體之材料,如溶劑或其他液體。奈米顆粒墨水之液體介質較佳包含有機溶劑或兩種或兩種以上有機溶劑之混合物。通常地,當混合物塗覆於基板且加熱至至少高於溶劑之沸點時,溶劑快速蒸發。因此,在上文及下文所述方法之一個步驟中進行任何溶劑之蒸發。液體介質較佳地由沸點低於180℃,更較佳地低於125℃之溶劑組成。 The liquid medium of the nanoparticulate ink typically contains a liquid based material such as a solvent or other liquid. The liquid medium of the nanoparticulate ink preferably contains an organic solvent or a mixture of two or more organic solvents. Typically, the solvent evaporates quickly when the mixture is applied to the substrate and heated to at least above the boiling point of the solvent. Therefore, any solvent evaporation is carried out in one of the steps above and below. The liquid medium is preferably composed of a solvent having a boiling point of less than 180 ° C, more preferably less than 125 ° C.

液體介質用作金屬硫族化物奈米顆粒之載體媒劑。墨水包含0.5wt%至80wt%,較佳地1wt%至50wt%,更佳地2wt%至30wt%,最佳地3wt%至20wt%之金屬硫族化物奈米顆粒,及20wt%至98wt%,較佳地50wt%至95wt%,最佳地70wt%至95wt%之液體介質。包含高於約30wt%之NP之墨水為糊劑。與較低黏度墨水相比,糊劑需要 某種印刷技術,諸如刮刀塗佈。就噴塗墨水而言,奈米顆粒載荷通常較低,低至1wt%。奈米顆粒較佳地包含以顆粒重量計80wt%至100wt%,更佳地90wt%至100wt%之單配方金屬硫族化物部分。 The liquid medium is used as a carrier vehicle for the metal chalcogenide nanoparticles. The ink comprises from 0.5 wt% to 80 wt%, preferably from 1 wt% to 50 wt%, more preferably from 2 wt% to 30 wt%, most preferably from 3 wt% to 20 wt% of metal chalcogenide nanoparticles, and from 20 wt% to 98 wt% Preferably, from 50% to 95% by weight, optimally from 70% to 95% by weight of the liquid medium. An ink containing more than about 30% by weight of NP is a paste. Paste needs to be compared to lower viscosity inks Some printing technique, such as knife coating. For spray inks, nanoparticle loading is typically low, as low as 1% by weight. The nanoparticle preferably comprises from 80% by weight to 100% by weight, more preferably from 90% by weight to 100% by weight, based on the weight of the granule, of the single-formulated metal chalcogenide moiety.

液體介質較佳地包含一或多種選自由以下各物組成之群中之液體:水、芳族化合物、雜芳族化合物、烷烴、腈類、醚類、酮類、酯類、醋酸酯類、醯胺類、胺類、硫醇類、羧酸類、有機鹵化物類及醇類。適合的液體包括芳族化合物(甲苯、二甲苯、均三甲苯、苯)、水、二甲亞碸(DMSO)、吡啶、2-甲基吡啶、3-甲基吡啶、3,5-二甲基吡啶、5-第三丁基吡啶、己烷、庚烷、辛烷、環己烷、2,2,4-三甲基戊烷、乙腈、3-甲氧基丙腈、二甲氧基乙烷、乙二醇二乙醚、四氫呋喃、丙酮、2-戊酮、環戊酮、環己酮、乙酸乙酯、乙酸丁酯、二甲基甲醯胺(DMF)、N-甲基吡咯啶酮、四甲基乙二胺、3-甲氧基丙胺、二甲胺基乙醇、油胺、三乙胺、1-辛硫醇、1-癸硫醇、1-十二烷硫醇、巰基乙醇、硫代乙醇酸、油酸、二氯甲烷、氯仿、氯苯、1,2-二氯苯、甲醇、乙醇、異丙醇、正丙醇、2-甲氧基乙醇、2-乙氧基乙醇、2-丁氧基乙醇、單萜烯醇(α-、β-萜品醇,或異構體α-、β-及γ-萜品醇之組合)及2,2,4-三甲基-1,3-戊二醇單異丁酸酯(Texanol)。諸如吡啶、2-甲基吡啶、3-甲基吡啶、3,5-二甲基吡啶、5-第三丁基吡啶、乙腈、3-甲氧基丙腈、四甲基乙二胺、3-甲氧基丙胺、二甲胺基乙醇、油胺、三乙胺、1-辛硫醇、1-癸硫醇、1-十二烷硫醇、巰基乙醇、硫代乙醇酸、油酸、2-甲氧乙醇、2-乙氧基乙醇、2-丁氧基乙醇及2,2,4-三甲基-1,3-戊二醇單異丁酸酯(Texanol)等化合物可用作分散劑或封端基團,以及作為顆粒之載體媒劑。較佳的液體介質含有選自揮發性溶劑、極性溶劑及/或不充當NP封端劑之溶劑中之一或多者。尤其較佳為不充當封端劑之溶劑,亦即,僅由元素(C、H)構成之溶劑及由元素(C、H、O)構成之溶劑,如酯類、酮類、醇類等等。此等溶劑通常可 容易在製程中移除,而不會在層中引起殘餘物或空隙。 The liquid medium preferably comprises one or more liquids selected from the group consisting of water, aromatics, heteroaromatics, alkanes, nitriles, ethers, ketones, esters, acetates, Amidoximes, amines, thiols, carboxylic acids, organic halides and alcohols. Suitable liquids include aromatic compounds (toluene, xylene, mesitylene, benzene), water, dimethyl hydrazine (DMSO), pyridine, 2-methylpyridine, 3-methylpyridine, 3,5-dimethyl Pyridine, 5-tert-butylpyridine, hexane, heptane, octane, cyclohexane, 2,2,4-trimethylpentane, acetonitrile, 3-methoxypropionitrile, dimethoxy Ethane, ethylene glycol diethyl ether, tetrahydrofuran, acetone, 2-pentanone, cyclopentanone, cyclohexanone, ethyl acetate, butyl acetate, dimethylformamide (DMF), N-methylpyrrolidine Ketone, tetramethylethylenediamine, 3-methoxypropylamine, dimethylaminoethanol, oleylamine, triethylamine, 1-octylthiol, 1-anthracenethiol, 1-dodecanethiol, mercapto Ethanol, thioglycolic acid, oleic acid, dichloromethane, chloroform, chlorobenzene, 1,2-dichlorobenzene, methanol, ethanol, isopropanol, n-propanol, 2-methoxyethanol, 2-ethoxy Ethyl alcohol, 2-butoxyethanol, monoterpene alcohol (α-, β-terpineol, or a combination of isomers α-, β- and γ-terpineol) and 2, 2, 4-three Methyl-1,3-pentanediol monoisobutyrate (Texanol). Such as pyridine, 2-methylpyridine, 3-methylpyridine, 3,5-lutidine, 5-tributylpyridine, acetonitrile, 3-methoxypropionitrile, tetramethylethylenediamine, 3 - methoxypropylamine, dimethylaminoethanol, oleylamine, triethylamine, 1-octylmercaptan, 1-decyl mercaptan, 1-dodecanethiol, mercaptoethanol, thioglycolic acid, oleic acid, Compounds such as 2-methoxyethanol, 2-ethoxyethanol, 2-butoxyethanol, and 2,2,4-trimethyl-1,3-pentanediol monoisobutyrate (Texanol) can be used. A dispersing or blocking group, and a carrier vehicle as a particle. Preferred liquid media contain one or more selected from the group consisting of volatile solvents, polar solvents, and/or solvents that do not act as NP capping agents. Particularly preferred is a solvent which does not serve as a blocking agent, that is, a solvent composed only of the elements (C, H) and a solvent composed of the elements (C, H, O), such as esters, ketones, alcohols, etc. Wait. These solvents are usually available It is easy to remove in the process without causing residue or voids in the layer.

墨水可進一步包含高達約20wt%,或高達約10wt%,或高達約5wt%,或高達約2wt%,或高達約1wt%之一或多種添加劑,包含分散劑、界面活性劑、黏合劑、交聯劑、乳化劑、消泡劑、增塑劑、乾燥劑、填充劑、增量劑、增稠劑、膜調節劑、抗氧化劑、流平劑、均化劑、配位體、封端基團、硫族元素、摻雜劑及腐蝕抑制劑。雖然大多數添加劑可改良形成半導體層之方法,但需留心該等添加劑不會干擾最終層之結晶度及該層之電子(光伏打)效能。 The ink may further comprise up to about 20% by weight, or up to about 10% by weight, or up to about 5% by weight, or up to about 2% by weight, or up to about 1% by weight of one or more additives, including dispersants, surfactants, binders, Coupling agent, emulsifier, defoaming agent, plasticizer, desiccant, filler, extender, thickener, membrane regulator, antioxidant, leveling agent, leveling agent, ligand, end group Groups, chalcogens, dopants and corrosion inhibitors. While most additives may improve the method of forming the semiconductor layer, care should be taken that the additives do not interfere with the crystallinity of the final layer and the electron (photovoltaic) performance of the layer.

適合的黏合劑包括具有直鏈、分支鏈、梳狀/刷狀、星形、超支化或樹枝狀結構之聚合物與寡聚物,及分解溫度低於400℃,較佳地低於350℃之聚合物與寡聚物。適合的聚合物與寡聚物包括聚醚、聚乳酸交酯、聚碳酸酯、聚[3-羥丁酸]、聚甲基丙烯酸酯、聚(甲基丙烯酸)共聚物、聚(甲基丙烯酸)、聚(乙二醇)、聚(乳酸)、聚(DL-丙交酯/乙交酯)、聚(碳酸丙二酯)及聚(碳酸乙二酯)之均聚物及共聚物。若存在,則聚合或寡聚黏合劑不到墨水之20wt%,或不到10wt%,或不到5wt%,或不到2wt%,或不到1wt%。 Suitable binders include polymers and oligomers having linear, branched, comb/brush, star, hyperbranched or dendritic structures, and decomposition temperatures below 400 ° C, preferably below 350 ° C Polymers and oligomers. Suitable polymers and oligomers include polyethers, polylactide, polycarbonate, poly[3-hydroxybutyrate], polymethacrylates, poly(methacrylic acid) copolymers, poly(methacrylic acid) Homopolymers and copolymers of poly(ethylene glycol), poly(lactic acid), poly(DL-lactide/glycolide), poly(propylene carbonate) and poly(ethylene carbonate). If present, the polymeric or oligomeric binder is less than 20% by weight of the ink, or less than 10% by weight, or less than 5% by weight, or less than 2% by weight, or less than 1% by weight.

適合的界面活性劑包括經矽氧基-、氟基(fluoryl)-、烷基-及炔基-取代之界面活性劑。通常基於所觀察到之塗層及分散液性質及與基板之所需黏著力進行選擇。適合的界面活性劑為熟習此項技術者所熟知且包括市售之BYK®(Byk Chemie)、Zonyl®(DuPont)、Triton®(Dow)、Surfynol®(Air Products)及Dynol®(Air Products)界面活性劑。 Suitable surfactants include methoxy-, fluoryl-, alkyl-, and alkynyl-substituted surfactants. The choice is usually based on the nature of the coating and dispersion observed and the desired adhesion to the substrate. Suitable surfactants are well known to those skilled in the art and include commercially available BYK® (Byk Chemie), Zonyl® (DuPont), Triton® (Dow), Surfynol® (Air Products), and Dynol® (Air Products). Surfactant.

適合的摻雜劑尤其包括金屬陽離子(例如,Na、Li及K)、Sb、Bi、Cl及二元半導體。若存在,則摻雜劑通常介於墨水之百萬分之一與10wt%之間,較佳地介於0.1wt%至5wt%之間。若存在,則硫族元素添加劑通常介於墨水之0.1wt%與10wt%之間。 Suitable dopants include, inter alia, metal cations (eg, Na, Li, and K), Sb, Bi, Cl, and binary semiconductors. If present, the dopant is typically between one part per million and 10% by weight of the ink, preferably between 0.1 and 5% by weight. If present, the chalcogenide additive is typically between 0.1 wt% and 10 wt% of the ink.

適合的分散劑包括聚乙烯吡咯啶酮、聚羧酸酯、聚磷酸酯、多胺、聚乙二醇及包含半胱胺酸及/或組胺酸殘基之肽。 Suitable dispersing agents include polyvinylpyrrolidone, polycarboxylates, polyphosphates, polyamines, polyethylene glycols, and peptides comprising cysteine and/or histidine residues.

可將奈米顆粒墨水旋塗、噴塗、噴墨印刷、浸塗、刮刀塗佈、柔性印刷/凹版印刷、狹縫式塗佈及滴塗於任何基板上,該等基板例如玻璃,塗覆金屬或氧化物之玻璃、金屬箔或塑膠。墨水可沈積於預加熱之基板上以沈積半導體層。沈積之後可為進一步退火步驟以改良吸收層之電子性質、結晶度及晶粒大小。 Nanoparticle ink can be spin coated, spray coated, ink jet printed, dip coated, knife coated, flexographic/gravure printed, slot coated and dispensed onto any substrate, such as glass, coated with metal Or oxide glass, metal foil or plastic. The ink can be deposited on the preheated substrate to deposit a semiconductor layer. The deposition may be followed by a further annealing step to improve the electronic properties, crystallinity, and grain size of the absorber layer.

半導體層通常具有15nm至5μm,較佳地500nm至3.5μm之厚度。層厚度視在每種情況下使用之塗覆技術及其參數而定。在旋塗之情況下,舉例而言,該等參數為旋轉速度與旋轉持續時間。在噴塗之情況下,厚度可隨著噴塗時間而增加。在棒塗及刮刀塗佈之情況下,厚度可藉由重複沈積步驟而增加。藉由諸如滴塗、噴塗、棒塗、旋塗、狹縫式塗佈、滴塗、刮刀塗佈、噴墨印刷或柔性印刷/凹版印刷之方法將半導體墨水塗覆至基板上以類似於熟習此項技術者熟知之方法(參見M.A.Aegerter,M.Menning;Sol-Gel Technologies for Glass Producers and Users,Kluwer Academic Publishers,Dordrecht,Netherlands,2004)實現。 The semiconductor layer typically has a thickness of from 15 nm to 5 μm, preferably from 500 nm to 3.5 μm. The layer thickness depends on the coating technique used in each case and its parameters. In the case of spin coating, for example, the parameters are the rotational speed and the rotational duration. In the case of spraying, the thickness may increase with the spraying time. In the case of bar coating and blade coating, the thickness can be increased by repeating the deposition step. Coating the semiconductor ink onto the substrate by methods such as dispensing, spraying, bar coating, spin coating, slot coating, dispensing, knife coating, inkjet printing or flexographic/gravure printing to be similar to familiarity This is well known to those skilled in the art (see MAAegerter, M. Menning; Sol-Gel Technologies for Glass Producers and Users, Kluwer Academic Publishers, Dordrecht, Netherlands, 2004).

根據本發明,基板可為剛性基板,諸如玻璃、陶瓷、金屬或塑膠基板,或柔性基板,特別為塑膠膜或金屬箔。根據本發明,較佳使用塗佈有薄鉬層之基板,其用作電極且對於太陽能電池之效能十分有效。 According to the invention, the substrate can be a rigid substrate such as a glass, ceramic, metal or plastic substrate, or a flexible substrate, in particular a plastic film or a metal foil. According to the present invention, it is preferred to use a substrate coated with a thin molybdenum layer, which serves as an electrode and is very effective for the performance of the solar cell.

在本發明之一較佳實施例中,將包含S、Se及/或Te且不包含金屬之額外化合物添加至形成半導體層之製程中。可藉由添加化合物至半導體墨水或更佳地在退火該層期間/之後添加該額外化合物。此添加額外硫族元素之視情況選用之S/Se/Te源較佳地選自分子前驅體,如包含硒或硫之有機化合物,硫化氫(H2S)或硒化氫(H2Se);或選自元素 硒、硫或碲;更佳地選自硒脲/硫脲或藉由將氫與其他有機基團、硫代乙醯胺或元素S/Se/Te互換而得到之其衍生物。在這一點上,硫與硒為較佳的硫族元素。當將元素硫或硒添加至奈米顆粒墨水時,其較佳地以溶解或作為粉末懸浮於胺類(如,肼、乙二胺、乙醇胺等等)、膦類化合物(如,三丁基膦、三辛基膦、三苯基膦等等)、有機溶劑(如,醇類、DMF、DMSO等等)、前述之溶劑混合物、或其他適合的液體載劑中之形式添加。當元素硫或硒在退火該層期間/之後添加至製程中時,其較佳地以較佳稀釋於惰性載氣中之元素蒸氣形式添加。組合退火及用硒/硫處理之方法稱為硒化/硫化。 In a preferred embodiment of the invention, an additional compound comprising S, Se and/or Te and no metal is added to the process of forming the semiconductor layer. The additional compound can be added by adding a compound to the semiconductor ink or, more preferably, during/after annealing the layer. The S/Se/Te source optionally added to the additional chalcogen element is preferably selected from molecular precursors such as organic compounds containing selenium or sulfur, hydrogen sulfide (H 2 S) or hydrogen selenide (H 2 Se). Or; selected from the group consisting of selenium, sulfur or antimony; more preferably selected from selenourea/thiourea or by exchanging hydrogen with other organic groups, thioacetamide or element S/Se/Te derivative. At this point, sulfur and selenium are preferred chalcogen elements. When elemental sulfur or selenium is added to the nanoparticulate ink, it is preferably dissolved or suspended as a powder in an amine (eg, hydrazine, ethylenediamine, ethanolamine, etc.), a phosphine compound (eg, tributyl). Addition in the form of a phosphine, trioctylphosphine, triphenylphosphine, etc.), an organic solvent (eg, an alcohol, DMF, DMSO, etc.), a solvent mixture as described above, or other suitable liquid carrier. When elemental sulfur or selenium is added to the process during/after annealing of the layer, it is preferably added as an elemental vapor preferably diluted in an inert carrier gas. Combined annealing and treatment with selenium/sulfur are referred to as selenization/sulfidation.

為進一步改良結晶度及晶粒大小,可使用常規高溫爐或快速熱處理(具有較低熱成本及較高產量)於惰性氛圍中或真空中對層進行高溫處理,亦即350℃至600℃。另外,退火可在Se或S蒸氣存在之情況下進行以避免高溫處理期間硫族元素自膜丟失且促進晶粒生長及較高結晶度。在此階段中,硫族元素亦可互換,例如,硫可與硒互換或反之亦然。 To further improve crystallinity and grain size, the layer can be subjected to high temperature treatment in an inert atmosphere or in a vacuum using a conventional high temperature furnace or rapid heat treatment (having lower heat cost and higher yield), that is, 350 ° C to 600 ° C. In addition, annealing may be performed in the presence of Se or S vapor to avoid loss of chalcogen elements from the film during high temperature processing and to promote grain growth and higher crystallinity. At this stage, chalcogen elements may also be interchanged, for example, sulfur may be exchanged with selenium or vice versa.

例如藉由半導體層之退火、硒化或硫化而進行之沈積後處理可提供額外改良之器件效能。當附加硫族元素(通常為Se或S)視情況提供至高溫下之氣相中以保持硫族元素含量穩定時,晶粒大小及晶粒範圍可於此等溫度下優化,視情況在此操作期間同時用一個硫族元素替換另一個。通常,將額外硒提供至含硫層,其可部分或幾乎全部地替換硫。因此,在本發明之另一較佳實施例中,根據本發明製備金屬硫族化物半導體層之方法在沈積半導體層之後進一步包括硒化步驟及/或硫化步驟及/或退火步驟作為另一步驟。退火可在10-1至104秒之不同時間範圍內執行,包括所謂的快速熱退火。更短之間隔適於將層之化學計量保持幾乎恆定。元素互換及擴展之單晶晶粒之生長可能需要更長時間間隔。在一較佳實施例中,根據本發明產生硫族化物層之方 法在方法之步驟c)之後產生單晶層,而無任何與該結晶層相鄰之含碳層。 Post-deposition processing, for example by annealing, selenization or vulcanization of the semiconductor layer, provides additional improved device performance. When additional chalcogen elements (usually Se or S) are optionally supplied to the gas phase at elevated temperatures to maintain a stable chalcogen content, the grain size and grain range can be optimized at these temperatures, as appropriate Replace one chalcogen with another during operation. Typically, additional selenium is provided to the sulfur containing layer, which may replace sulfur in part or almost all. Therefore, in another preferred embodiment of the present invention, the method of preparing a metal chalcogenide semiconductor layer according to the present invention further comprises a selenization step and/or a vulcanization step and/or an annealing step as another step after depositing the semiconductor layer . Annealing can be performed in different time ranges from 10 -1 to 10 4 seconds, including so-called rapid thermal annealing. Shorter intervals are suitable to keep the stoichiometry of the layer almost constant. The growth of elemental interchange and expanded single crystal grains may require longer intervals. In a preferred embodiment, the method of producing a chalcogenide layer in accordance with the present invention produces a single crystal layer after step c) of the process without any carbonaceous layer adjacent to the crystalline layer.

典型光伏打器件包括基板、背部接觸層(例如,鉬)、吸收層(亦稱作半導體層)、緩衝層(亦稱作第二半導體層)及頂部接觸層。光伏打電池亦可包括金屬電接觸體(如頂部接觸層上之線或網格)及電池之向光面上之抗反射層以增強光透射至半導體層中。此處,根據本發明製備之半導體層以習知方式與接觸體一起提供至半導體且成了所需半導體器件。就光伏打器件而言,半導體層通常沈積於鉬底部電極及緩衝層(CdS)、由(例如)ZnO或氧化銦錫(簡化為ITO)製造之透明上電極之上,且與電極連接之金屬網格設置於半導體層之上。 A typical photovoltaic device includes a substrate, a back contact layer (eg, molybdenum), an absorber layer (also referred to as a semiconductor layer), a buffer layer (also referred to as a second semiconductor layer), and a top contact layer. Photovoltaic cells can also include metal electrical contacts (such as wires or grids on the top contact layer) and an anti-reflective layer on the light-facing side of the cell to enhance light transmission into the semiconductor layer. Here, the semiconductor layer prepared according to the invention is supplied to the semiconductor together with the contact body in a conventional manner and becomes a desired semiconductor device. In the case of a photovoltaic device, the semiconductor layer is typically deposited on a molybdenum bottom electrode and a buffer layer (CdS), a transparent upper electrode made of, for example, ZnO or indium tin oxide (simplified to ITO), and a metal connected to the electrode The grid is placed over the semiconductor layer.

緩衝層通常包含無機材料,諸如CdS、ZnS、氫氧化鋅、Zn(S,O,OH)、硫化鎘鋅、In(OH)3、In2S3,ZnSe、硒化鋅銦、硒化銦、氧化鋅鎂或n型有機材料或其組合。此等材料之層可藉由化學浴沈積法、原子層沈積、共蒸發、濺鍍法或化學表面沈積法沈積至5nm至500nm,較佳地40nm至100nm之厚度。 The buffer layer usually contains inorganic materials such as CdS, ZnS, zinc hydroxide, Zn(S, O, OH), cadmium zinc sulfide, In(OH) 3 , In 2 S 3 , ZnSe, indium zinc selenide, indium selenide. , zinc magnesium oxide or n-type organic materials or a combination thereof. The layers of such materials may be deposited to a thickness of from 5 nm to 500 nm, preferably from 40 nm to 100 nm, by chemical bath deposition, atomic layer deposition, co-evaporation, sputtering or chemical surface deposition.

頂部接觸層通常為透明導電氧化物,例如氧化鋅、摻鋁氧化鋅、氧化銦錫或錫酸鎘。適合的沈積技術包括濺鍍法、蒸發法、化學浴沈積法、電鍍法、化學蒸氣沈積法、物理蒸氣沈積法及原子層沈積法。可替代地,頂部接觸層可包含透明導電聚合層,例如摻雜聚(苯乙烯磺酸酯)(PSS)之聚-3,4-伸乙二氧基噻吩(PEDOT),可藉由包括旋塗、浸塗或噴塗法之標準方法沈積。在一些實施例中,處理PEDOT以移除酸性組分以降低光伏打電池組件之酸誘導之降解可能性。 The top contact layer is typically a transparent conductive oxide such as zinc oxide, aluminum-doped zinc oxide, indium tin oxide or cadmium stannate. Suitable deposition techniques include sputtering, evaporation, chemical bath deposition, electroplating, chemical vapor deposition, physical vapor deposition, and atomic layer deposition. Alternatively, the top contact layer may comprise a transparent conductive polymeric layer, such as poly-3,4-ethylenedioxythiophene (PEDOT) doped with poly(styrene sulfonate) (PSS), which may include Standard method of coating, dip coating or spray coating. In some embodiments, the PEDOT is treated to remove acidic components to reduce the acid induced degradation potential of the photovoltaic cell assembly.

在一個實施例中,吸收層置於硫化鎘浴中以沈積CdS層。可替代地,可藉由將經塗佈基板置於含硫脲之硫化鎘浴中來將CdS沈積於金屬硫族化物層之上。 In one embodiment, the absorber layer is placed in a cadmium sulfide bath to deposit a CdS layer. Alternatively, CdS can be deposited on the metal chalcogenide layer by placing the coated substrate in a cadmium sulfide bath containing thiourea.

在一個實施例中,使用絕緣氧化鋅(ZnO)而非CdS之濺鍍層製造 光伏打器件。在一些實施例中,CdS及ZnO層兩者均存在於光伏打電池中;在其他實施例中,僅存在CdS及ZnO中之一者。 In one embodiment, the insulating zinc oxide (ZnO) is used instead of the CdS sputtering layer. Photovoltaic devices. In some embodiments, both the CdS and ZnO layers are present in the photovoltaic cell; in other embodiments, only one of CdS and ZnO is present.

在一些實施例中,鈉化合物(例如,NaF、Na2S或Na2Se)層形成於金屬硫族化物層之上及/或之下。 In some embodiments, a layer of sodium compound (eg, NaF, Na 2 S, or Na 2 Se) is formed on and/or under the metal chalcogenide layer.

可採用額外的手段優化光伏打器件中之吸收層之效能。硒化/硫化(參見上文)、用含水氰化物處理以移除痕量硒化銅或硫化銅、用於帶隙優化之硫代乙醯胺/InCl3清洗可用於半導體層。 Additional means can be employed to optimize the performance of the absorber layer in the photovoltaic device. Selenization/sulfidation (see above), treatment with aqueous cyanide to remove traces of copper or copper sulfide, and thioacetamide/InCl 3 cleaning for band gap optimization can be used for the semiconductor layer.

如本文中所述之光伏打器件較佳地具有8%或更高,更佳地9%或更高,及更佳地12%或更高之功率轉換效率。 The photovoltaic device as described herein preferably has a power conversion efficiency of 8% or higher, more preferably 9% or higher, and still more preferably 12% or higher.

上文及下文中使用以下縮寫:PCE 功率轉換效率,等同於能量轉換效率η,FF 填充係數,VOC 開路電壓,JSC 短路電流密度,NP 奈米顆粒 The following abbreviations are used above and below: PCE power conversion efficiency, equivalent to energy conversion efficiency η, FF fill factor, V OC open circuit voltage, J SC short circuit current density, NP nanoparticle

以下實例將無限制地說明本發明。在單個實例中使用之材料之特性及組成可應用於申請專利範圍未明確提及但由其涵蓋之其他材料。 The following examples will illustrate the invention without limitation. The characteristics and composition of the materials used in a single instance can be applied to other materials not specifically mentioned in the scope of the patent application.

實例Instance

使用以下試劑合成材料:99.99%純度之CuCl(Strem)、99.999%純度之GaCl3(Sigma)、99.999%純度之InCl3(Sigma)、99.999%純度之Cu(O2CCH3)2(Sigma)、99.99%純度之Zn(O2CCH3)2(Sigma)、99.99%純度之SnCl2(Sigma)、99.999%純度之GeCl4(Sigma)、95%純度之NOBF4(Sigma)、80至90%純度之油胺(Acros)。試劑Et3OBF4(純度高於97%之米爾文試劑)及(C2H5)4N(BF4)(99%純度)自Signa獲得且無需進一步純化即可使用。 The following reagents were used to synthesize materials: 99.99% pure CuCl (Strem), 99.999% pure GaCl 3 (Sigma), 99.999% pure InCl 3 (Sigma), 99.999% pure Cu(O 2 CCH 3 ) 2 (Sigma) 99.99% pure Zn(O 2 CCH 3 ) 2 (Sigma), 99.99% pure SnCl 2 (Sigma), 99.999% pure GeCl 4 (Sigma), 95% pure NOBF 4 (Sigma), 80 to 90 % purity of oleic acid (Acros). The reagent Et 3 OBF 4 (Mirvin reagent with a purity higher than 97%) and (C 2 H 5 ) 4 N (BF 4 ) (99% purity) were obtained from Signa and used without further purification.

根據如文獻(Guo等人,Nano Letters,(2009)9(8),3060-3065)中所述之標準草案製備CIGS奈米顆粒。如文獻(Guo等人,J.Am.Chem.Soc.,(2009)131(33),11672-11673)中所述,此草案可容易採用以合成Cu2ZnSn(S,Se)4奈米顆粒。硫族化物之元素分佈較佳地為銅較弱(參見,例如,Guo等人,J.Am.Chem.Soc.(2010),132,17384-6)。 CIGS nanoparticles were prepared according to the draft standard as described in the literature (Guo et al, Nano Letters, (2009) 9(8), 3060-3065). As described in the literature (Guo et al, J. Am. Chem. Soc., (2009) 131 (33), 11672-11673), this draft can be easily employed to synthesize Cu 2 ZnSn(S, Se) 4 nm. Particles. The elemental distribution of the chalcogenide is preferably weaker in copper (see, for example, Guo et al, J. Am. Chem. Soc. (2010), 132, 17384-6).

實例1.a:Cu(In,Ga)S2奈米顆粒之合成 Example 1.a : Synthesis of Cu(In,Ga)S 2 Nanoparticles

在手套箱中,將油胺(160ml)、CuCl(20.0mmol,1.98g)、GaCl3(6.00mmol,1.06g)及InCl3(14mmol,3.01g)添加至500ml之三頸圓底燒瓶中。使用隔片密封燒瓶且轉移至風罩。沖刷管線,且於氮流下附接熱電偶及冷凝器。真空下,加熱溶液至130℃且使用氮氣淨化三次。真空下,除氣30分鐘。切換至氮流且升高溫度至225℃。使用塑膠注射器將硫溶液(40.0mmol,1.23g)快速注射至油胺(20ml)中且允許將溫度快速升高回225℃。反應30分鐘。30分鐘後,移除加熱壁爐架且冷卻至40℃。添加等量EtOH以沈澱奈米顆粒且以5.000rpm離心5分鐘。於甲苯中再分散。重複洗滌程序。 In a glove box, oleylamine (160 ml), CuCl (20.0 mmol, 1.98 g), GaCl 3 (6.00 mmol, 1.06 g) and InCl 3 (14 mmol, 3.01 g) were added to a 500 ml three-necked round bottom flask. The septum was sealed with a septum and transferred to a hood. The pipeline is flushed and a thermocouple and a condenser are attached under a nitrogen stream. The solution was heated to 130 ° C under vacuum and purged three times with nitrogen. Degas for 30 minutes under vacuum. Switch to nitrogen flow and raise the temperature to 225 °C. A sulfur solution (40.0 mmol, 1.23 g) was quickly injected into oleylamine (20 ml) using a plastic syringe and the temperature was allowed to rise rapidly back to 225 °C. Reaction for 30 minutes. After 30 minutes, the heated mantel was removed and cooled to 40 °C. An equal amount of EtOH was added to precipitate the nanoparticles and centrifuged at 5.000 rpm for 5 minutes. Redispersed in toluene. Repeat the washing procedure.

所得奈米顆粒使用合成期間用過之油胺來表面鈍化。X光繞射資料指示奈米顆粒為無雜質之純黃銅礦相。視合成而定,平均顆粒尺寸在7nm至10nm範圍內。產率超過90%,可經由前驅體比率很好地控制化學計量以達成CuxInyGazS2顆粒,其中x可自0.8至1.0變化且y可自0.2至0.6變化。熱重量資料指示油胺配位體占顆粒總質量之15%至20%。 The resulting nanoparticles were surface passivated using oleylamine used during the synthesis. The X-ray diffraction data indicates that the nanoparticle is a pure brass mineral phase free of impurities. Depending on the synthesis, the average particle size is in the range of 7 nm to 10 nm. With a yield of more than 90%, the stoichiometry can be well controlled via the precursor ratio to achieve Cu x In y Ga z S 2 particles, where x can vary from 0.8 to 1.0 and y can vary from 0.2 to 0.6. The thermogravimetric data indicates that the oleylamine ligand comprises from 15% to 20% of the total mass of the granule.

實例1.b:Cu2ZnSnS4奈米顆粒之合成 Example 1.b : Synthesis of Cu 2 ZnSnS 4 Nanoparticles

在手套箱中,將油胺(160ml)、Cu(acac)2(7mmol,1.83g)、SnCl2(4.0mmol,0.758g)及Zn(OAc)2(4.0mmol,0.734g)添加至500ml之三頸圓底燒瓶中。使用隔片密封燒瓶且轉移至風罩。沖刷管線,且於氮流下附接熱電偶及冷凝器。真空下,加熱溶液至130℃且使用 氮氣淨化三次。真空下,除氣30分鐘。切換至氮流且升高溫度至225℃。使用塑膠注射器快速注射硫溶液(14.0mmol,0.449g,於20ml之油胺中)中且允許將溫度快速升高回225℃。反應30分鐘。30分鐘後,移除加熱壁爐架且冷卻至40℃。添加等量EtOH以沈澱奈米顆粒且以5.000rpm離心5分鐘。於甲苯中再分散。重複洗滌程序。 In the glove box, oleylamine (160 ml), Cu(acac) 2 (7 mmol, 1.83 g), SnCl 2 (4.0 mmol, 0.758 g) and Zn(OAc) 2 (4.0 mmol, 0.734 g) were added to 500 ml. In a three-necked round bottom flask. The septum was sealed with a septum and transferred to a hood. The pipeline is flushed and a thermocouple and a condenser are attached under a nitrogen stream. The solution was heated to 130 ° C under vacuum and purged three times with nitrogen. Degas for 30 minutes under vacuum. Switch to nitrogen flow and raise the temperature to 225 °C. A sulfur solution (14.0 mmol, 0.449 g in 20 ml of oleylamine) was quickly injected using a plastic syringe and the temperature was allowed to rise rapidly back to 225 °C. Reaction for 30 minutes. After 30 minutes, the heated mantel was removed and cooled to 40 °C. An equal amount of EtOH was added to precipitate the nanoparticles and centrifuged at 5.000 rpm for 5 minutes. Redispersed in toluene. Repeat the washing procedure.

所得奈米顆粒使用合成期間用過之油胺來表面鈍化。X光繞射資料指示奈米顆粒為無雜質之純鋅黃錫礦相。視合成而定,平均顆粒尺寸在7nm至10nm範圍內。產率超過90%,可經由前驅體比率很好地控制化學計量以達成CuxZnySnzS4顆粒,其中視反應劑之比率而定,x可自1.4至2.2變化,y可自0.6至1.5變化且z可自0.7至1.5變化。熱重量資料指示油胺配位體占顆粒總質量之15%至20%。 The resulting nanoparticles were surface passivated using oleylamine used during the synthesis. X-ray diffraction data indicates that the nanoparticles are pure zinc-tin-tin phases without impurities. Depending on the synthesis, the average particle size is in the range of 7 nm to 10 nm. The yield is over 90%, and the stoichiometry can be well controlled via the precursor ratio to achieve Cu x Zn y Sn z S 4 particles, wherein depending on the ratio of the reactants, x can vary from 1.4 to 2.2, and y can be from 0.6. It varies by 1.5 and z can vary from 0.7 to 1.5. The thermogravimetric data indicates that the oleylamine ligand comprises from 15% to 20% of the total mass of the granule.

實例2:配位體與四氟硼酸鹽交換 Example 2 : Ligand exchange with tetrafluoroborate 金屬硫族化物奈米顆粒上之配位體交換之一般程序 General procedure for ligand exchange on metal chalcogenide nanoparticles: 版本1:version 1:

在氮氣填充之手套箱中,將己烷(20mg/ml)中之根據實例1之10ml硫族化物奈米顆粒(或其他硫族化物NP)添加至10ml之0.1M四氟硼酸三乙基氧鎓溶液(Et3OBF4)中,該溶液溶解於10ml之MeCN中以形成雙相溶液。攪拌30分鐘,裸奈米晶體將於此交換期間沈澱。30分鐘後,添加兩倍量之乙醇且以3500rpm離心4分鐘。在DMSO中分散丸粒且使用己烷清洗NP三次以移除殘餘OLA。 10 ml of chalcogenide nanoparticles (or other chalcogenide NP) according to Example 1 in hexane (20 mg/ml) was added to 10 ml of 0.1 M triethyloxonium tetrafluoroborate in a nitrogen-filled glove box. In a solution of hydrazine (Et 3 OBF 4 ), the solution was dissolved in 10 ml of MeCN to form a biphasic solution. After stirring for 30 minutes, the naked nanocrystals will precipitate during this exchange. After 30 minutes, twice the amount of ethanol was added and centrifuged at 3500 rpm for 4 minutes. The pellets were dispersed in DMSO and the NP was washed three times with hexane to remove residual OLA.

版本2:Version 2:

在氮氣填充之手套箱中,將甲苯(20mg/ml)中之10ml之硫族化物奈米顆粒添加至10ml之0.3M四氟硼酸三乙基氧鎓溶液(Et3OBF4)中,該溶液在250ml燒杯中溶解於MeCN中。攪拌30分鐘或直到所有NP已沈降至燒杯底部。添加10ml之DMSO以溶合NP。將溶液轉移至兩隻離心管中且移至通風櫥中。添加20ml丙酮至各離心管中且以3500 rpm離心4分鐘。丟棄上清液且使用氮氣噴射乾燥丸粒以移除任何剩餘丙酮。丸粒分散於DMSO中(添加攪拌棒至離心管中以打散丸粒)。將墨水轉移至玻璃燒杯中。將10ml己烷添加至DMSO中之NP-BF4墨水,該己烷應於頂部處形成層。使用移液管移除己烷層。重複己烷清洗2次以上。非常輕柔地使用氮氣噴射蒸發DMSO表面處之剩餘己烷。視情況,使用丙酮再一次沈澱NP以分離且再溶解於另一液體介質中。 10 ml of chalcogenide nanoparticles in toluene (20 mg/ml) were added to 10 ml of a 0.3 M solution of triethyloxonium tetrafluoroborate (Et 3 OBF 4 ) in a nitrogen-filled glove box. Dissolved in MeCN in a 250 ml beaker. Stir for 30 minutes or until all NP has settled to the bottom of the beaker. 10 ml of DMSO was added to dissolve the NP. Transfer the solution to two centrifuge tubes and move to a fume hood. 20 ml of acetone was added to each centrifuge tube and centrifuged at 3500 rpm for 4 minutes. The supernatant was discarded and the pellet was dried using a nitrogen sparge to remove any remaining acetone. The pellets were dispersed in DMSO (a stir bar was added to the centrifuge tube to break up the pellets). Transfer the ink to a glass beaker. 10 ml of hexane was added to the NP-BF 4 ink in DMSO which should form a layer at the top. Use a pipette to remove the hexane layer. Repeat hexane washing twice or more. The remaining hexane at the surface of the DMSO was very gently evaporated using a nitrogen sparge. NP was once again precipitated using acetone to separate and redissolve in another liquid medium, as appropriate.

所得分散液以超過約50mg/ml之濃度在數月內保持穩定。 The resulting dispersion remained stable for several months at a concentration of more than about 50 mg/ml.

實例2.aExample 2.a

在特定實例中,根據實例1.a之Cu(In,Ga)S2奈米顆粒為使用一般程序版本2交換之配位體。 In a particular example, the Cu(In,Ga)S 2 nanoparticle according to Example 1.a is a ligand exchanged using the general procedure version 2.

實例2.bExample 2.b

在另一特定實例中,根據實例1.b之Cu2ZnSnS4奈米顆粒為使用一般程序版本2交換之配位體。 In another specific example, the Cu 2 ZnSnS 4 nanoparticle according to Example 1.b is a ligand exchanged using the general procedure version 2.

在每種情況下,熱重量分析指示幾乎所有油胺均自顆粒移除。在200℃至500℃之溫度範圍內未觀察到質量之降低,同時原生油胺封端之奈米顆粒當加熱時丟失約20%之重量。 In each case, thermogravimetric analysis indicated that almost all of the oleylamine was removed from the particles. No decrease in mass was observed in the temperature range of 200 ° C to 500 ° C, while the native oleyl amine terminated nanoparticles lost about 20% by weight when heated.

實例3:奈米顆粒墨水配方 Example 3 : Nanoparticle ink formulation

實例2.a與2.b之經分離配位體交換顆粒再溶解於DMSO或視情況另一濃度與所選沈積方法適合的相容溶劑中。墨水存儲於濃度高達150mg/ml固相負載之周圍條件下。分散液可於室溫下在數天內保持穩定,而無降解或聚集。 The isolated ligand exchange particles of Examples 2.a and 2.b are redissolved in DMSO or, optionally, in a compatible solvent suitable for the chosen deposition method. The ink is stored at ambient concentrations up to 150 mg/ml solid phase load. The dispersion can remain stable for several days at room temperature without degradation or aggregation.

實例4:吸收層之形成 Example 4 : Formation of an absorbent layer

就噴塗而言,奈米顆粒墨水稀釋於DMSO中,至濃度為10mg/ml至30mg/ml奈米顆粒中。使用自動聲波音波處理噴霧器進行噴塗。不加入添加劑至墨水。於175℃至350℃之溫度下將墨水噴至基板(經Mo 塗佈之鹼石灰玻璃)上以確保溶劑蒸發且控制薄膜形態。通過數量取決於墨水之固體負載含量。達成想要之所需膜厚度可能需要通過4至20之通過量次。 For spraying, the nanoparticle ink is diluted in DMSO to a concentration of 10 mg/ml to 30 mg/ml of nanoparticle. Spray using an automatic sonic wave treatment sprayer. Do not add additives to the ink. Spraying ink onto the substrate at a temperature of 175 ° C to 350 ° C (via Mo Coated soda lime glass) to ensure solvent evaporation and control film morphology. The amount of passing depends on the solids loading of the ink. Achieving the desired film thickness may require a pass of 4 to 20 passes.

就刮刀塗佈而言,需要更濃之墨水。此處濃度可高達100mg/ml,較佳地50mg/ml左右。視所選之溶劑而定,刮刀塗佈可使用加熱至70℃至200℃之基板進行。3至4層已沈積後,基板於更高溫度(250℃至450℃)下退火以確保完整溶劑移除。 For blade coating, a thicker ink is required. The concentration here can be as high as 100 mg/ml, preferably about 50 mg/ml. Depending on the solvent selected, blade coating can be carried out using a substrate heated to 70 ° C to 200 ° C. After 3 to 4 layers have been deposited, the substrate is annealed at a higher temperature (250 ° C to 450 ° C) to ensure complete solvent removal.

實例5:光伏打器件之製造 Example 5 : Fabrication of photovoltaic devices 實例5.a:光伏打器件(CIGS吸收劑)及與習知器件之比較 Example 5.a : Photovoltaic device (CIGS absorber) and comparison with conventional devices

將實例4(噴塗)之具有Mo背部接觸體之基板上之乾燥Cu(In,Ga)S2膜轉移至具有蓋(非氣密)子帶有很少硒彈之石墨盒中。將石墨盒組件插入石英管中,且在插入預加熱管式爐之前使用氬氣將該管淨化三次。管式爐保持於550℃下且進行硒化30分鐘。在硒化製程期間,硒彈於所附石墨盒內之基板之上產生硒蒸氣且協助促進晶粒生長及膜內較高結晶度。另外,硫或多或少地由硒替換。 The dried Cu(In,Ga)S 2 film on the substrate with the Mo back contact of Example 4 (sprayed) was transferred to a graphite box with a lid (non-hermetic) with few selenium bombs. The graphite box assembly was inserted into a quartz tube and the tube was purged three times with argon before being inserted into the preheated tube furnace. The tube furnace was maintained at 550 ° C and selenized for 30 minutes. During the selenization process, the selenium bomb produces selenium vapor over the substrate within the attached graphite box and assists in promoting grain growth and higher crystallinity within the film. In addition, sulfur is more or less replaced by selenium.

為完成光伏打器件,約60nm厚之CdS層由溶液方法(M.A.Contreras等人,Thin Solid Films 2002,403-404,204-211)沈積。ZnO(50nm)及ITO(300nm)薄膜藉由RF濺鍍法依次沈積。隨後,藉由DC濺鍍法濺鍍銀網格線。總器件面積為24mm2To complete the photovoltaic device, a 60 nm thick CdS layer was deposited by a solution process (MAContreras et al., Thin Solid Films 2002, 403-404, 204-211). ZnO (50 nm) and ITO (300 nm) films were sequentially deposited by RF sputtering. Subsequently, silver grid lines were sputtered by DC sputtering. The total device area is 24mm 2 .

圖2展示於黑暗及AM1.5光條件下具有I-V特徵之光伏打器件之效能。器件特徵如下:PCE=12.05%,FF=61.9%,Voc=0.602V,Jsc=32.36mA/cm2Figure 2 shows the efficacy of a photovoltaic device with IV characteristics in dark and AM 1.5 light conditions. The device characteristics were as follows: PCE = 12.05%, FF = 61.9%, V oc = 0.620 V, J sc = 32.36 mA / cm 2 .

以上器件特徵係基於由銀網格區域(約5%)阻斷之光的未校正之 值。 The above device characteristics are based on uncorrected light blocked by the silver grid region (about 5%) value.

比較器件:Compare devices:

以與根據實例1之原生CIGS奈米顆粒類似的方式製造比較器件,但未經受根據實例2之配位體交換。 Comparative devices were fabricated in a similar manner to the native CIGS nanoparticles according to Example 1, but were not exchanged with the ligands according to Example 2.

器件特徵如下:PCE=6.71%,FF=57.8%,Voc=0.502V,Jsc=23.11mA/cm2The device characteristics were as follows: PCE = 6.71%, FF = 57.8%, V oc = 0.502 V, J sc = 23.11 mA / cm 2 .

本發明器件之功率轉換效率(PCE=12.05%)且其他特徵值遠遠高於由標準奈米顆粒製造之器件之值(PCE=6.71%)。 The power conversion efficiency (PCE = 12.05%) of the device of the present invention and other characteristic values are much higher than the value of the device manufactured by standard nanoparticle (PCE = 6.71%).

實例5.b:光伏打器件(CZTS吸收劑) Example 5.b : Photovoltaic device (CZTS absorber)

與實例5.a之器件類似,將實例2.b之Cu2ZnSnS4奈米顆粒調配為墨水,噴塗至經Mo塗佈之鹼石灰玻璃上,硒化且裝有緩衝層與透明導體層。 Similar to the device of Example 5.a, the Cu 2 ZnSnS 4 nanoparticle of Example 2.b was formulated into an ink, sprayed onto Mo-coated soda lime glass, selenized and equipped with a buffer layer and a transparent conductor layer.

器件特徵如下:PCE=9.53%,FF=55.3%,Voc=0.396V,Jsc=43.4mA/cm2The device characteristics were as follows: PCE = 9.53%, FF = 55.3%, V oc = 0.396 V, J sc = 43.4 mA/cm 2 .

以下申請專利範圍進一步揭示本發明之實施例與本發明之變體之組合。 The scope of the following patent application further discloses combinations of embodiments of the invention with variations of the invention.

(1)‧‧‧吸收層 (1) ‧ ‧ absorbing layer

(2)‧‧‧鉬背部觸點 (2) ‧ ‧ molybdenum back contacts

(3)‧‧‧基板玻璃 (3) ‧‧‧Substrate glass

Claims (15)

一種三元、四元或多元金屬硫族化物奈米顆粒(NP),其經包括四鹵代硼酸根、六鹵代磷酸根或六鹵代銻酸根之無機離子穩定。 A ternary, quaternary or polybasic metal chalcogenide nanoparticle (NP) stabilized by an inorganic ion comprising a tetrahalo borate, a hexahalophosphate or a hexahalogen ruthenate. 如請求項1之NP,其中該等NP未經有機配位體穩定。 The NP of claim 1, wherein the NPs are not stabilized by the organic ligand. 如請求項1或2之NP,其中該等NP包含銅。 The NP of claim 1 or 2, wherein the NPs comprise copper. 如請求項1至3中其中一項之NP,其中該等NP包含元素In、Ga、Zn、Sn及Ge中之一者、兩者或多者。 An NP as claimed in any one of items 1 to 3, wherein the NPs comprise one, two or more of the elements In, Ga, Zn, Sn and Ge. 如請求項1至4中其中一項之NP,其中該等NP包含元素S及Se中之一者或兩者。 An NP as claimed in any one of items 1 to 4, wherein the NPs comprise one or both of the elements S and Se. 如請求項1至5中其中一項之NP,其中該等NP包含95mol%或更多之以下元素組合之一者:(Cu、In、S)、(Cu、Ga、S)、(Cu、In、Se)、(Cu、Ga、Se)、(Cu、In、S、Se)、(Cu、Ga、S、Se)、(Cu、In、Ga、S)、(Cu、In、Ga、Se)、(Cu、In、Ga、S、Se)、(Cu、Sn、S)、(Cu、Sn、Se)、(Cu、Sn、S、Se)、(Cu、Zn、Sn、S)、(Cu、Zn、Sn、Se)、(Cu、Zn、Sn、S、Se)、(Cu、Zn、Ge、S)、(Cu、Zn、Ge、Se)、(Cu、Zn、Ge、S、Se)、(Cu、Zn、Sn、Ge、S)、(Cu、Zn、Sn、Ge、Se)、(Cu、Zn、Sn、Ge、S、Se)。 An NP according to any one of claims 1 to 5, wherein the NP comprises one of 95 mol% or more of the following element combinations: (Cu, In, S), (Cu, Ga, S), (Cu, In, Se), (Cu, Ga, Se), (Cu, In, S, Se), (Cu, Ga, S, Se), (Cu, In, Ga, S), (Cu, In, Ga, Se), (Cu, In, Ga, S, Se), (Cu, Sn, S), (Cu, Sn, Se), (Cu, Sn, S, Se), (Cu, Zn, Sn, S) , (Cu, Zn, Sn, Se), (Cu, Zn, Sn, S, Se), (Cu, Zn, Ge, S), (Cu, Zn, Ge, Se), (Cu, Zn, Ge, S, Se), (Cu, Zn, Sn, Ge, S), (Cu, Zn, Sn, Ge, Se), (Cu, Zn, Sn, Ge, S, Se). 如請求項1至6中其中一項之NP,其中該等NP為I-III-VI2、I2-II-IV-VI4、I2-IV-VI3或混合類型之半導體。 The NP of any one of claims 1 to 6, wherein the NPs are semiconductors of I-III-VI 2 , I 2 -II-IV-VI 4 , I 2 -IV-VI 3 or a mixed type. 一種用於產生三元、四元或多元金屬硫族化物奈米顆粒之方法,其特徵在於使用包括四鹵代硼酸根、六鹵代磷酸根或六鹵代銻酸根之無機離子處理該硫族化物奈米顆粒。 A method for producing ternary, quaternary or multi-component metal chalcogenide nanoparticles, characterized in that the chalcogenide is treated with an inorganic ion comprising a tetrahalo borate, a hexahalophosphate or a hexahalogen ruthenate Nanoparticles. 如請求項8之方法,其中使用包含三烷基氧鎓離子及包括四鹵代硼酸根、六鹵代磷酸根或六鹵代銻酸根之無機離子之組合之液 體介質處理該奈米顆粒,其中該三烷基氧鎓離子中之烷基獨立地代表具有1至15個碳原子之直鏈或分支鏈烷基。 The method of claim 8, wherein a liquid comprising a combination of a trialkyloxonium ion and an inorganic ion comprising a tetrahaloborate, a hexahalophosphate or a hexahalogenated ruthenate is used. The nanoparticle is treated by a bulk medium, wherein the alkyl group in the trialkyloxonium ion independently represents a linear or branched alkyl group having 1 to 15 carbon atoms. 一種包含液體介質及溶解於此液體介質中之奈米顆粒之奈米顆粒墨水,其特徵在於該等奈米顆粒包括如請求項1至7中任一項之奈米顆粒。 A nanoparticle ink comprising a liquid medium and a nanoparticle dissolved in the liquid medium, wherein the nanoparticle comprises the nanoparticle of any one of claims 1 to 7. 如請求項10之奈米顆粒墨水,其中其包含:0.5wt%至80wt%之金屬硫族化物奈米顆粒;及20wt%至98wt%之液體介質。 The nanoparticle ink of claim 10, wherein it comprises: 0.5 wt% to 80 wt% of metal chalcogenide nanoparticles; and 20 wt% to 98 wt% of a liquid medium. 如請求項10或11之奈米顆粒墨水,其中該液體介質包含選自由以下各物組成之群中之一或多種液體:芳族化合物、DMF、DMSO、水、雜芳族化合物、烷烴、腈類、醚類、酮類、酯類、醋酸酯類、醯胺類、胺類、硫醇類、羧酸類、有機鹵化物類及醇類。 The nanoparticle ink of claim 10 or 11, wherein the liquid medium comprises one or more liquids selected from the group consisting of aromatic compounds, DMF, DMSO, water, heteroaromatics, alkanes, nitriles Classes, ethers, ketones, esters, acetates, guanamines, amines, thiols, carboxylic acids, organic halides and alcohols. 一種用於產生硫族化物層之方法,其包含藉由以下步驟,按該順序,或此等步驟中的兩者或所有三個步驟同時進行,來沈積三元、四元或多元金屬硫族化物奈米顆粒,其特徵在於該等奈米顆粒係如請求項1至7中任一項之奈米顆粒:a)將包含該等奈米顆粒及液體介質之奈米顆粒墨水沈積於一基板上b)移除該液體介質,及c)視情況在額外硒或硫源存在下,視情況將該等奈米顆粒退火或熔合。 A method for producing a chalcogenide layer comprising depositing a ternary, quaternary or multi-component metal chalcogen by the following steps, in that order, or two or all three of the steps simultaneously a nanoparticle according to any one of claims 1 to 7: a) depositing a nanoparticle ink comprising the nanoparticle and a liquid medium on a substrate Upper b) removes the liquid medium, and c) optionally anneals or fuses the nanoparticles in the presence of additional selenium or sulfur sources, as appropriate. 如請求項13之方法,其中該所獲得的硫族化物層為結晶半導體層。 The method of claim 13, wherein the obtained chalcogenide layer is a crystalline semiconductor layer. 一種用於產生包含吸收層及電極之光伏打器件之方法,其特徵在於該吸收層為硫族化物層且其係藉由如請求項13或14之方法製得。 A method for producing a photovoltaic device comprising an absorber layer and an electrode, characterized in that the absorber layer is a chalcogenide layer and is obtained by the method of claim 13 or 14.
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