TW201501403A - Mobile device - Google Patents
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Abstract
Description
本發明係關於一種行動裝置,特別係關於包括一耦合式饋入天線結構(Coupled-fed Antenna Structure)之行動裝置。 The present invention relates to a mobile device, and more particularly to a mobile device including a coupled-fed Antenna Structure.
隨著行動通訊技術的發達,行動裝置在近年日益普遍,常見的例如:手提式電腦、行動電話、多媒體播放器以及其他混合功能的攜帶型電子裝置。為了滿足人們的需求,行動裝置通常具有無線通訊的功能。有些涵蓋長距離的無線通訊範圍,例如:行動電話使用2G、3G、LTE(Long Term Evolution)系統及其所使用700MHz、850 MHz、900MHz、1800MHz、1900MHz、2100MHz、2300MHz以及2500MHz的頻帶進行通訊,而有些則涵蓋短距離的無線通訊範圍,例如:Wi-Fi、Bluetooth以及WiMAX(Worldwide Interoperability for Microwave Access)系統使用2.4GHz、3.5GHz、5.2GHz和5.8GHz的頻帶進行通訊。 With the development of mobile communication technologies, mobile devices have become more and more popular in recent years, such as portable computers, mobile phones, multimedia players, and other portable electronic devices with mixed functions. In order to meet people's needs, mobile devices usually have the function of wireless communication. Some cover long-range wireless communication range, for example, mobile phones use 2G, 3G, LTE (Long Term Evolution) systems and the 700MHz, 850MHz, 900MHz, 1800MHz, 1900MHz, 2100MHz, 2300MHz and 2500MHz bands used for communication. Others cover short-range wireless communication ranges. For example, Wi-Fi, Bluetooth, and WiMAX (Worldwide Interoperability for Microwave Access) systems use 2.4 GHz, 3.5 GHz, 5.2 GHz, and 5.8 GHz bands for communication.
近年來,行動裝置常加入金屬外觀件(例如:金屬飾板)來增進外型時尚感。然而,這些金屬外觀件的存在往往對於無線通訊之天線元件造成負面影響,進而降低行動裝置之通訊品質。 In recent years, mobile devices often incorporate metal-like parts (such as metal plaques) to enhance the stylish look. However, the presence of these metal-looking components often has a negative impact on the antenna components of the wireless communication, thereby reducing the communication quality of the mobile device.
為了解決前述問題,本發明提供一種行動裝置,包括:一接地元件;一介質基板;一輻射部,設置於該介質基板;一饋入部,至少部份地設置於該介質基板,並耦接至一信號源,其中該饋入部係與該輻射部分離,並鄰近於該輻射部;一短路部,其中該輻射部係經由該短路部耦接至該接地元件;以及一外觀飾板,耦接至該輻射部,其中,該輻射部、該饋入部、該短路部,以及該外觀飾板共同形成一耦合式饋入天線結構。 In order to solve the foregoing problems, the present invention provides a mobile device comprising: a grounding member; a dielectric substrate; a radiating portion disposed on the dielectric substrate; a feeding portion disposed at least partially on the dielectric substrate and coupled to a signal source, wherein the feeding portion is separated from the radiating portion and adjacent to the radiating portion; a shorting portion, wherein the radiating portion is coupled to the grounding element via the shorting portion; and an exterior trim panel coupled To the radiation portion, the radiation portion, the feed portion, the short circuit portion, and the exterior trim panel together form a coupled feed antenna structure.
100、200、300、400‧‧‧行動裝置 100, 200, 300, 400‧‧‧ mobile devices
110‧‧‧接地元件 110‧‧‧ Grounding components
120‧‧‧介質基板 120‧‧‧Media substrate
130‧‧‧輻射部 130‧‧‧ Radiation Department
140、240、340‧‧‧饋入部 140, 240, 340‧‧ ‧Feeding Department
141、241、341‧‧‧饋入部之第一部份 141, 241, 341 ‧ ‧ the first part of the feeding department
142、242、342‧‧‧饋入部之第二部份 142, 242, 342‧‧ ‧ the second part of the feeding department
143、243、343‧‧‧饋入部之第三部份 143, 243, 343 ‧ ‧ the third part of the feeding department
150、450‧‧‧短路部 150, 450‧‧‧ Short circuit
160‧‧‧外觀飾板 160‧‧‧ appearance panels
165‧‧‧外觀飾板之開孔 165‧‧‧ openings in the exterior panel
170‧‧‧系統電路板 170‧‧‧System Board
172‧‧‧系統電路板之無接地區域 172‧‧‧Ungrounded area of the system board
190‧‧‧信號源 190‧‧‧Signal source
410‧‧‧電感元件 410‧‧‧Inductance components
E1‧‧‧介質基板之第一表面 The first surface of the E1‧‧• dielectric substrate
E2‧‧‧介質基板之第二表面 E2‧‧‧ second surface of the dielectric substrate
FB1‧‧‧第一頻帶 FB1‧‧‧ first frequency band
FB2‧‧‧第二頻帶 FB2‧‧‧second frequency band
G1‧‧‧耦合間隙 G1‧‧‧ coupling gap
第1A圖係顯示根據本發明一實施例所述之行動裝置之立體圖;第1B圖係顯示根據本發明一實施例所述之行動裝置之俯視圖;第2圖係顯示根據本發明一實施例所述之行動裝置之俯視圖;第3圖係顯示根據本發明一實施例所述之行動裝置之俯視圖;第4圖係顯示根據本發明一實施例所述之行動裝置之俯視圖;第5圖係顯示根據本發明一實施例所述之行動裝置之耦合式饋入天線結構之返回損失圖;以及第6圖係顯示根據本發明一實施例所述之行動裝置之耦合式饋入天線結構之天線效率圖。 1A is a perspective view showing a mobile device according to an embodiment of the present invention; FIG. 1B is a plan view showing a mobile device according to an embodiment of the present invention; and FIG. 2 is a view showing an embodiment of the present invention. FIG. 3 is a plan view showing a mobile device according to an embodiment of the present invention; FIG. 4 is a plan view showing a mobile device according to an embodiment of the present invention; Return loss map of a coupled feed antenna structure of a mobile device according to an embodiment of the invention; and FIG. 6 is a diagram showing antenna efficiency of a coupled feed antenna structure of a mobile device according to an embodiment of the invention Figure.
為讓本發明之目的、特徵和優點能更明顯易懂,下文特舉出本發明之具體實施例,並配合所附圖式,作詳細說明如下。 In order to make the objects, features and advantages of the present invention more comprehensible, the specific embodiments of the invention are set forth in the accompanying drawings.
第1A圖係顯示根據本發明一實施例所述之行動裝置100之立體圖。第1B圖係顯示根據本發明一實施例所述之行動裝置100之俯視圖。請一併參考第1A、1B圖。行動裝置100可以是一智慧型手機(Smart Phone)、一平板電腦(Tablet Computer),或是一筆記型電腦(Notebook Computer)。如第1A、1B圖所示,行動裝置100至少包括:一接地元件110、一介質基板120、一輻射部130、一饋入部140、一短路部150、一外觀飾板160,以及一信號源190。在較佳實施例中,接地元件110、輻射部130、饋入部140、短路部150,以及外觀飾板160皆以金屬製成,例如:銅、銀、鋁,或是鐵。必須注意的是,行動裝置100更可包括其他元件,例如:一處理器、一觸控面板、一無線模組、一揚聲器,以及一外殼(未顯示)。 1A is a perspective view showing a mobile device 100 according to an embodiment of the present invention. FIG. 1B is a plan view showing a mobile device 100 according to an embodiment of the present invention. Please refer to Figures 1A and 1B together. The mobile device 100 can be a smart phone, a tablet computer, or a notebook computer. As shown in FIGS. 1A and 1B , the mobile device 100 includes at least a grounding component 110 , a dielectric substrate 120 , a radiating portion 130 , a feeding portion 140 , a shorting portion 150 , an exterior trim 160 , and a signal source . 190. In the preferred embodiment, the grounding element 110, the radiating portion 130, the feed portion 140, the shorting portion 150, and the exterior trim 160 are all made of metal, such as copper, silver, aluminum, or iron. It should be noted that the mobile device 100 may further include other components, such as a processor, a touch panel, a wireless module, a speaker, and a casing (not shown).
輻射部130係設置於介質基板120。外觀飾板160係耦接至輻射部130。外觀飾板160可以是行動裝置100之一外殼(未顯示)之一部份。例如,外觀飾板160係位於該外殼之底部或頂部。外觀飾板160可以藉由一或複數個頂針(Pogo Pin)、金屬彈片(Metal Spring),或是螺絲(未顯示)固定至輻射部130。在一些實施例中,輻射部130大致為一矩形,而外觀飾板160大致為另一矩形。外觀飾板160之長度係大於輻射部130之長度。饋入部140係至少部份地設置於介質基板120,並耦接至信號源 190。另外,饋入部140係與輻射部130分離,並鄰近於輻射部130。輻射部130更經由短路部150耦接至接地元件110。在一些實施例中,短路部150包括一蜿蜒結構。例如,該蜿蜒結構可以大致為一S字形或一N字形。輻射部130、饋入部140、短路部150,以及外觀飾板160係共同形成一耦合式饋入天線結構(Coupled-fed Antenna Structure)。 The radiation portion 130 is provided on the dielectric substrate 120. The exterior trim 160 is coupled to the radiating portion 130. The exterior panel 160 can be part of one of the housings (not shown) of the mobile device 100. For example, the exterior trim 160 is located at the bottom or top of the outer casing. The exterior panel 160 may be secured to the radiation portion 130 by one or more thimbles, metal springs, or screws (not shown). In some embodiments, the radiating portion 130 is generally rectangular and the trim panel 160 is substantially another rectangle. The length of the exterior trim 160 is greater than the length of the radiating portion 130. The feeding portion 140 is at least partially disposed on the dielectric substrate 120 and coupled to the signal source 190. In addition, the feeding portion 140 is separated from the radiation portion 130 and adjacent to the radiation portion 130. The radiating portion 130 is further coupled to the grounding element 110 via the shorting portion 150. In some embodiments, the shorting portion 150 includes a meandering structure. For example, the structure of the crucible can be substantially an S-shape or an N-shape. The radiating portion 130, the feeding portion 140, the short-circuit portion 150, and the exterior trim 160 are collectively formed into a coupled-fed Antenna Structure.
在一些實施例中,行動裝置100更包括一系統電路板170。系統電路板170係與介質基板120分離,而接地元件110係設置於系統電路板170。更詳細地說,介質基板120係大致平行於系統電路板170,而外觀飾板160係大致垂直於介質基板120和系統電路板170。在一些實施例中,系統電路板170更具有一無接地區域172。輻射部130於系統電路板170之一投影係至少部份地與無接地區域172重疊。 In some embodiments, the mobile device 100 further includes a system circuit board 170. The system board 170 is separated from the dielectric substrate 120, and the ground element 110 is disposed on the system board 170. In more detail, the dielectric substrate 120 is substantially parallel to the system circuit board 170, and the exterior trim 160 is substantially perpendicular to the dielectric substrate 120 and the system circuit board 170. In some embodiments, system board 170 further has a ground free region 172. The projection of the radiating portion 130 on one of the system boards 170 at least partially overlaps the ungrounded region 172.
在一些實施例中,饋入部140包括一第一部份141、一第二部份142,以及一第三部份143。饋入部140之第一部份141係設置於介質基板120並鄰近於輻射部130。饋入部140之第二部份142係耦接於饋入部140之第一部份141和第三部份143之間。饋入部140之第三部份143係設置於系統電路板170並耦接至信號源190。饋入部140之第一部份141和第三部份143可以分別為設置於介質基板120和系統電路板170之二金屬佈線(Metal Traces)。饋入部140之第二部份142可以是一頂針或一金屬彈片,並可大致垂直於介質基板120和系統電路板170。介質基板120具有一第一表面E1和一第二表面E2,而第一表面E1係相對於第二表面E2。更詳細地說,輻射部130係設置於第一表 面E1,而饋入部140之第一部份141係設置於第二表面E2。在一些實施例中,饋入部140之第一部份141大致為一直條形。饋入部140之第二部份142係耦接至饋入部140之第一部份141之一端(L字形饋入結構)。 In some embodiments, the feeding portion 140 includes a first portion 141, a second portion 142, and a third portion 143. The first portion 141 of the feed portion 140 is disposed on the dielectric substrate 120 and adjacent to the radiation portion 130. The second portion 142 of the feeding portion 140 is coupled between the first portion 141 and the third portion 143 of the feeding portion 140. The third portion 143 of the feed portion 140 is disposed on the system circuit board 170 and coupled to the signal source 190. The first portion 141 and the third portion 143 of the feeding portion 140 may be two metal wires (Metal Traces) disposed on the dielectric substrate 120 and the system circuit board 170, respectively. The second portion 142 of the feed portion 140 can be a thimble or a metal dome and can be substantially perpendicular to the dielectric substrate 120 and the system circuit board 170. The dielectric substrate 120 has a first surface E1 and a second surface E2, and the first surface E1 is opposite to the second surface E2. In more detail, the radiation portion 130 is disposed in the first table. The surface E1 and the first portion 141 of the feeding portion 140 are disposed on the second surface E2. In some embodiments, the first portion 141 of the feed portion 140 is substantially straight. The second portion 142 of the feed portion 140 is coupled to one end of the first portion 141 of the feed portion 140 (L-shaped feed structure).
在一些實施例中,外觀飾板160更具有一開孔165。開孔165可以大致形成於外觀飾板160之中央,並可大致為一矩形、一圓形,或是一橢圓形。開孔165係用於容納一資料傳輸元件(未顯示),例如:一通用序列匯流排接頭(Universal Serial Bus Connector,USB Connector),或是一迷你通用序列匯流排接頭(Micro-USB Connector)。因此,行動裝置100可經由該資料傳輸元件與一外部裝置(例如,一桌上型電腦,或是一筆記型電腦)進行資料交換。必須注意的是,開孔165並非為必要結構。在其他實施例中,外觀飾板160亦可為一無開孔實體金屬板。 In some embodiments, the exterior trim 160 further has an opening 165. The opening 165 may be formed substantially in the center of the exterior panel 160 and may be substantially rectangular, circular, or elliptical. The aperture 165 is for receiving a data transmission component (not shown), such as a Universal Serial Bus Connector (USB Connector) or a Mini Universal Serial Bus Connector (Micro-USB Connector). Therefore, the mobile device 100 can exchange data with an external device (for example, a desktop computer or a notebook computer) via the data transmission component. It must be noted that the opening 165 is not an essential structure. In other embodiments, the exterior trim 160 can also be a non-perforated solid metal sheet.
對於本發明之行動裝置100而言,外觀飾板160係作為該耦合式饋入天線結構之一部份,此設計方式不僅能增加對應於低頻頻帶之共振電流路徑之長度,還能節省行動裝置100內之可用設計空間。由於外觀飾板160可視為該耦合式饋入天線結構之另一輻射部,外觀飾板160將不會對其天線輻射效能造成負面影響。相較於習知技術,本發明之行動裝置100至少具有改良外觀、縮小整體尺寸,以及維持良好通訊品質之多重優點。 For the mobile device 100 of the present invention, the exterior trim 160 is part of the coupled feed antenna structure, which not only increases the length of the resonant current path corresponding to the low frequency band, but also saves the mobile device. Available design space within 100. Since the exterior trim 160 can be considered as another radiating portion of the coupled feed antenna structure, the exterior trim 160 will not adversely affect its antenna radiation performance. Compared to the prior art, the mobile device 100 of the present invention has at least the multiple advantages of improved appearance, reduced overall size, and good communication quality.
第2圖係顯示根據本發明一實施例所述之行動裝置200之俯視圖。第2圖和第1圖相似。在第2圖之實施例中,行 動裝置200之一饋入部240包括一第一部份241、一第二部份242,以及一第三部份243。輻射部130係設置於介質基板120之第一表面E1,而饋入部240之第一部份241係設置於介質基板120之第二表面E2。饋入部240之第一部份241大致為一直條形,而饋入部240之第二部份242係耦接至饋入部240之第一部份241之中央(T字形饋入結構)。第2圖之行動裝置200之其餘特徵皆與第1圖之行動裝置100相似,故此二實施例均可達成相似之操作效果。 2 is a plan view showing a mobile device 200 according to an embodiment of the present invention. Figure 2 is similar to Figure 1. In the embodiment of Figure 2, the line The feeding portion 240 of the moving device 200 includes a first portion 241, a second portion 242, and a third portion 243. The radiation portion 130 is disposed on the first surface E1 of the dielectric substrate 120, and the first portion 241 of the feeding portion 240 is disposed on the second surface E2 of the dielectric substrate 120. The first portion 241 of the feed portion 240 is substantially straight and the second portion 242 of the feed portion 240 is coupled to the center of the first portion 241 of the feed portion 240 (T-shaped feed structure). The remaining features of the mobile device 200 of FIG. 2 are similar to those of the mobile device 100 of FIG. 1, so that the second embodiment can achieve similar operational effects.
第3圖係顯示根據本發明一實施例所述之行動裝置300之俯視圖。第3圖和第1圖相似。在第3圖之實施例中,行動裝置300之一饋入部340包括一第一部份341、一第二部份342,以及一第三部份343。饋入部340之第一部份341大致為一直條形,而饋入部340之第二部份342係耦接至饋入部340之第一部份341之一端(L字形饋入結構)。值得注意的是,輻射部130和饋入部340之第一部份341皆設置於介質基板120之第一表面E1,以形成一共平面耦合饋入結構(Coplanar Coupled-fed Structure)。在一些實施例中,輻射部130和饋入部340之第一部份341之間之一耦合間隙G1必須小於1mm或是0.5mm。第3圖之行動裝置300之其餘特徵皆與第1圖之行動裝置100相似,故此二實施例均可達成相似之操作效果。 Figure 3 is a plan view showing a mobile device 300 according to an embodiment of the present invention. Figure 3 is similar to Figure 1. In the embodiment of FIG. 3, one of the feeding portions 340 of the mobile device 300 includes a first portion 341, a second portion 342, and a third portion 343. The first portion 341 of the feed portion 340 is substantially straight and the second portion 342 of the feed portion 340 is coupled to one end of the first portion 341 of the feed portion 340 (L-shaped feed structure). It should be noted that the first portion 341 of the radiating portion 130 and the feeding portion 340 are disposed on the first surface E1 of the dielectric substrate 120 to form a Coplanar Coupled-Fed Structure. In some embodiments, one of the coupling gaps G1 between the radiating portion 130 and the first portion 341 of the feed portion 340 must be less than 1 mm or 0.5 mm. The remaining features of the mobile device 300 of FIG. 3 are similar to those of the mobile device 100 of FIG. 1, so that the two embodiments can achieve similar operational effects.
第4圖係顯示根據本發明一實施例所述之行動裝置400之俯視圖。第4圖和第1圖相似。在第4圖之實施例中,行動裝置400之一短路部450係串聯耦接一電感元件410。在一些實施例中,電感元件410為一晶片電感器(Chip Inductor)或一可 變電感器(Variable Inductor)。電感元件410可用於縮小短路部450之長度,並調整行動裝置400之一耦合式饋入天線結構之阻抗匹配(Impedance Matching)。第4圖之行動裝置400之其餘特徵皆與第1圖之行動裝置100相似,故此二實施例均可達成相似之操作效果。 Figure 4 is a plan view showing a mobile device 400 according to an embodiment of the present invention. Figure 4 is similar to Figure 1. In the embodiment of FIG. 4, one short circuit portion 450 of the mobile device 400 is coupled in series with an inductance element 410. In some embodiments, the inductive component 410 is a chip inductor or a chip inductor Variable Inductor. The inductive component 410 can be used to reduce the length of the shorting portion 450 and to adjust Impedance Matching of one of the coupled feed antenna structures of the mobile device 400. The remaining features of the mobile device 400 of FIG. 4 are similar to those of the mobile device 100 of FIG. 1, so that the two embodiments can achieve similar operational effects.
第5圖係顯示根據本發明一實施例所述之行動裝置100之該耦合式饋入天線結構之返回損失(Return Loss)圖,其中橫軸代表操作頻率(MHz),而縱軸代表返回損失(dB)。如第5圖所示,在6dB返回損失之標準下,該耦合式饋入天線結構至少可涵蓋一第一頻帶FB1和一第二頻帶FB2。在較佳實施例中,第一頻帶FB1約介於700MHz至960MHz之間,而第二頻帶FB2約介於1710MHz至2690MHz之間。因此,行動裝置100可操作於GSM850/900/1800/1900及LTE700/800/1800/2100/2600多重頻帶。 Figure 5 is a diagram showing the Return Loss of the coupled feed antenna structure of the mobile device 100 according to an embodiment of the present invention, wherein the horizontal axis represents the operating frequency (MHz) and the vertical axis represents the return loss. (dB). As shown in FIG. 5, the coupled feed antenna structure can cover at least a first frequency band FB1 and a second frequency band FB2 under the standard of 6 dB return loss. In the preferred embodiment, the first frequency band FB1 is between about 700 MHz and 960 MHz, and the second frequency band FB2 is between about 1710 MHz and 2690 MHz. Therefore, the mobile device 100 can operate in the GSM850/900/1800/1900 and LTE700/800/1800/2100/2600 multiple frequency bands.
第6圖係顯示根據本發明一實施例所述之行動裝置100之該耦合式饋入天線結構之天線效率(Antenna Efficiency)圖,其中橫軸代表操作頻率(MHz),而縱軸代表天線效率(%)。如第6圖所示,該耦合式饋入天線結構於GSM850/900/1800/1900頻帶中之天線效率約介於55%至83%之間,而於LTE700/800/1800/2100/2600頻帶中之天線效率約介於57%至83%之間,可符合實際應用需求。 Figure 6 is a diagram showing an antenna efficiency of the coupled feed antenna structure of the mobile device 100 according to an embodiment of the present invention, wherein the horizontal axis represents the operating frequency (MHz) and the vertical axis represents the antenna efficiency. (%). As shown in Figure 6, the antenna efficiency of the coupled feed antenna structure in the GSM850/900/1800/1900 band is between 55% and 83%, while in the LTE700/800/1800/2100/2600 band. The efficiency of the antenna is between 57% and 83%, which can meet the needs of practical applications.
在一些實施例中,本發明之元件尺寸和元件參數如下。請再次參考第1A、1B圖。系統電路板170之長度約為122mm,寬度約為65mm。接地元件110之長度約為110mm,寬 度約為65mm。無接地區域172之長度約為12mm,寬度約為65mm。介質基板120為一FR4(Flame Resistant-4)基板,其介電常數約為4.3。介質基板120之長度約為40mm,寬度約為8mm,厚度約為0.8mm。介質基板120和系統電路板170之間之距離約為5mm。輻射部130之長度約為40mm,寬度約為8mm。饋入部140(包括第一部份141、第二部份142,以及第三部份143)之長度約為18mm,寬度約為1.5mm。短路部150之長度約為17.5mm,寬度約為0.5mm。外觀飾板160之長度約為65mm,寬度約為5mm。外觀飾板160之開孔165之長度約為10mm,寬度約為4mm。 In some embodiments, the component sizes and component parameters of the present invention are as follows. Please refer to Figures 1A and 1B again. The system board 170 has a length of about 122 mm and a width of about 65 mm. The grounding element 110 has a length of about 110 mm and a width. The degree is about 65mm. The ungrounded region 172 has a length of about 12 mm and a width of about 65 mm. The dielectric substrate 120 is an FR4 (Flame Resistant-4) substrate having a dielectric constant of about 4.3. The dielectric substrate 120 has a length of about 40 mm, a width of about 8 mm, and a thickness of about 0.8 mm. The distance between the dielectric substrate 120 and the system board 170 is approximately 5 mm. The radiation portion 130 has a length of about 40 mm and a width of about 8 mm. The feed portion 140 (including the first portion 141, the second portion 142, and the third portion 143) has a length of about 18 mm and a width of about 1.5 mm. The short-circuit portion 150 has a length of about 17.5 mm and a width of about 0.5 mm. The exterior trim 160 has a length of approximately 65 mm and a width of approximately 5 mm. The opening 165 of the exterior trim 160 has a length of about 10 mm and a width of about 4 mm.
值得注意的是,以上所述之元件尺寸、元件參數、元件形狀,以及頻帶範圍並非作為本發明之限制條件。天線設計者可根據不同需要而調整這些設定值。 It is to be noted that the component sizes, component parameters, component shapes, and frequency band ranges described above are not intended to be limiting of the present invention. The antenna designer can adjust these settings according to different needs.
在本說明書以及申請專利範圍中的序數,例如「第一」、「第二」、「第三」等等,彼此之間並沒有順序上的先後關係,其僅用於標示區分兩個具有相同名字之不同元件。 The ordinal numbers in this specification and the scope of the patent application, such as "first", "second", "third", etc., have no sequential relationship with each other, and are only used to indicate that two are identical. Different components of the name.
本發明雖以較佳實施例揭露如上,然其並非用以限定本發明的範圍,任何熟習此項技藝者,在不脫離本發明之精神和範圍內,當可做些許的更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。 The present invention has been described above with reference to the preferred embodiments thereof, and is not intended to limit the scope of the present invention, and the invention may be modified and modified without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.
100‧‧‧行動裝置 100‧‧‧ mobile devices
110‧‧‧接地元件 110‧‧‧ Grounding components
120‧‧‧介質基板 120‧‧‧Media substrate
130‧‧‧輻射部 130‧‧‧ Radiation Department
140‧‧‧饋入部 140‧‧‧Feeding Department
141‧‧‧饋入部之第一部份 141‧‧ The first part of the feeding department
142‧‧‧饋入部之第二部份 142‧‧ The second part of the feeding department
143‧‧‧饋入部之第三部份 143‧‧The third part of the feeding department
150‧‧‧短路部 150‧‧‧ Short circuit
160‧‧‧外觀飾板 160‧‧‧ appearance panels
165‧‧‧外觀飾板之開孔 165‧‧‧ openings in the exterior panel
170‧‧‧系統電路板 170‧‧‧System Board
172‧‧‧系統電路板之無接地區域 172‧‧‧Ungrounded area of the system board
190‧‧‧信號源 190‧‧‧Signal source
E1‧‧‧介質基板之第一表面 The first surface of the E1‧‧• dielectric substrate
E2‧‧‧介質基板之第二表面 E2‧‧‧ second surface of the dielectric substrate
Claims (12)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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TW102122099A TW201501403A (en) | 2013-06-21 | 2013-06-21 | Mobile device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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TW102122099A TW201501403A (en) | 2013-06-21 | 2013-06-21 | Mobile device |
Publications (1)
Publication Number | Publication Date |
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TW201501403A true TW201501403A (en) | 2015-01-01 |
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ID=52718068
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW102122099A TW201501403A (en) | 2013-06-21 | 2013-06-21 | Mobile device |
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TW (1) | TW201501403A (en) |
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2013
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