TW201501039A - Memory card with smart chip - Google Patents

Memory card with smart chip Download PDF

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TW201501039A
TW201501039A TW103105375A TW103105375A TW201501039A TW 201501039 A TW201501039 A TW 201501039A TW 103105375 A TW103105375 A TW 103105375A TW 103105375 A TW103105375 A TW 103105375A TW 201501039 A TW201501039 A TW 201501039A
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Taiwan
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memory card
connection terminal
card
terminal group
smart chip
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TW103105375A
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Chinese (zh)
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TWI507995B (en
Inventor
Lei Zhang
Ying Chang
yong-hua Zhou
ming-cheng Tang
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Richint Technology Corp
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Priority to CN201410091690.6A priority Critical patent/CN103870871A/en
Priority to CN201420113274.7U priority patent/CN203733149U/en
Publication of TW201501039A publication Critical patent/TW201501039A/en
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Publication of TWI507995B publication Critical patent/TWI507995B/zh

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Abstract

The utility model relates to an intelligent SD card externally provided with a protocol interface. The intelligent SD card comprises an SD controller. The SD controller is packaged in a card body of a standard intelligent SD card. A front end of an upper surface of the standard intelligent SD card is provided with a standard SD interface which is connected with the SD controller through connection lines. The intelligent SD card also comprises an intelligent card chip and a protocol interface. The intelligent card chip is arranged in the card body of the standard intelligent SD card and is connected with the SD controller. The protocol interface is arranged in the upper surface of the standard intelligent SD card and is connected with the intelligent card chip through connection lines. By means of the scheme provided by the intelligent SD, the usage range of the intelligent SD is widened, the intelligent SD can be suitable for POS machines of contact-type and noncontact-type IC cards by combining a double-interface card sleeve, the user group is enlarged, and the intelligent SD can be suitable for the most of users and a part of non-phone users by combining the double-interface card sleeve.

Description

具智慧晶片的記憶卡Memory card with smart chip

本發明係關於一種記憶卡,更特別的是關於一種具智慧晶片的記憶卡。The present invention relates to a memory card, and more particularly to a memory card having a smart wafer.

隨著行動通訊技術的發展,例如:3G(3rd-Generation)、WiMAX(Worldwide Interoperability for Microwave Access)、LTE(Long Term Evolution)等行動通訊技術的開發,以及隨著無線通訊技術的發展,例如:近場無線傳輸(Near Field Communication, NFC)的技術,因而發展出一種行動支付機制(Mobile Payment),讓使用者能便於支付來達到行動消費的目的,因而各種實現行動支付機制的行動支付裝置、支付媒體也因此被不斷地開發出來。With the development of mobile communication technologies, such as 3G (3rd-Generation), WiMAX (Worldwide Interoperability for Microwave Access), LTE (Long Term Evolution) and other mobile communication technologies, and with the development of wireless communication technologies, for example: Near Field Communication (NFC) technology, thus developing a mobile payment mechanism (Mobile Payment), allowing users to easily pay for mobile consumption purposes, and thus various mobile payment mechanisms that implement mobile payment mechanisms, Payment media has therefore been continuously developed.

記憶卡(如安全數位卡,即SD卡)係為一種基於半導體存儲技術的記憶裝置,具有高記憶容量、資料傳輸快、體積小而便於攜帶及高安全性等特點,被廣泛的運用於可擕式電子裝置上使用。現有的一種智慧SD卡(Smart SD卡)是將智慧卡晶片和儲存功能結合在一起,行動通訊裝置可藉由SWP(Single Wire Protocol,單線連接協定)、CLF(Contactless Frontend,非接觸通訊模組)及天線進行與該智慧SD卡的通信,然而使用此種智慧SD卡,行動通訊裝置就必須具備CLF和天線,也無法通過外接設備(例如:7816-3IC讀取設備)來實現接觸式交易,更無法在行動通訊裝置電力不足時完成非接觸式交易。Memory card (such as secure digital card, ie SD card) is a memory device based on semiconductor storage technology. It has high memory capacity, fast data transmission, small size, easy portability and high security. It is widely used. Used on portable electronic devices. The existing smart SD card (Smart SD card) combines the smart card chip and the storage function, and the mobile communication device can be implemented by SWP (Single Wire Protocol), CLF (Contactless Frontend), contactless communication module. And the antenna communicates with the smart SD card. However, with such a smart SD card, the mobile communication device must have a CLF and an antenna, and cannot implement contact transactions through an external device (for example, a 7816-3IC reading device). It is even more difficult to complete contactless transactions when the mobile communication device is under-powered.

另一種的智慧SD卡是將智慧卡晶片、儲存功能、天線及SD控制器都放置在一張SD卡上,這樣做可降低對行動通訊裝置的要求,但是對於金屬外殼手機或者是其他手機結構遮罩了非接觸訊號的時候,就無法完成非接觸交易,此外,這樣的設計也無法通過外接設備,例如:使用7816-3IC讀取設備,來實現接觸式交易。Another smart SD card is to place the smart card chip, storage function, antenna and SD controller on an SD card, which can reduce the requirements for mobile communication devices, but for metal case phones or other mobile phone structures. When the non-contact signal is masked, the contactless transaction cannot be completed. Moreover, such a design cannot be contacted by an external device, for example, using a 7816-3IC reading device.

再者,習知的智慧SD卡都因形狀異于標準金融智慧卡片,而無法適配現有的標準金融智慧卡片讀取設備,同時因為智慧SD卡受到體積的限制,導致即使在理想環境下,智慧SD卡產品的非接觸性能仍是較標準雙介面(適用於接觸式及非接觸式通訊)智慧卡片的性能要差的多。Moreover, the conventional smart SD card is different in shape from the standard financial wisdom card, and cannot adapt to the existing standard financial smart card reading device. At the same time, because the smart SD card is limited in size, even in an ideal environment, The non-contact performance of smart SD card products is still much worse than the standard dual interface (for contact and contactless communication) smart cards.

本發明之一目的在於透過結合智慧晶片之記憶卡來實現更多的行動支付功能,以彌補現有技術的不足,進而達到多用途的目的。One of the objectives of the present invention is to achieve more action payment functions by combining a memory card of a smart chip to make up for the deficiencies of the prior art, thereby achieving the purpose of multi-purpose.

本發明之另一目的在於使結合智慧晶片之記憶卡除本身具有非接觸式的通訊能力外更可適用於既有之接觸式及非接觸式智慧晶片讀卡設備。Another object of the present invention is to make the memory card incorporating the smart chip more suitable for the existing contact and contactless smart chip reading device, in addition to the non-contact communication capability.

為達上述目的及其他目的,本發明提出一種具智慧晶片的記憶卡,係包含一基板及設置於該基板上的一智慧晶片、一記憶卡控制器及一記憶卡標準連接端子組,其特徵在於:該基板上係設置有符合該智慧晶片之通訊協定的一智慧晶片連接端子組,其中,該智慧晶片連接端子組係連接該智慧晶片,該智慧晶片係連接該記憶卡控制器,該記憶卡標準連接端子組及該智慧晶片連接端子組係外露於該記憶卡。To achieve the above and other objects, the present invention provides a memory card with a smart chip, comprising a substrate and a smart chip disposed on the substrate, a memory card controller and a memory card standard connection terminal group, the characteristics thereof The smart chip connection terminal group is connected to the smart chip connection terminal group, and the smart chip is connected to the memory card controller, and the memory is connected to the smart chip. The card standard connection terminal group and the smart chip connection terminal group are exposed on the memory card.

於本發明之一實施例中,於該基板上更包含:一感應天線連接端子組,係連接該智慧晶片並供獨立於該記憶卡外部之感應天線連接;一內部感應天線模組;及一天線訊號處理模組,係連接該內部感應天線模組、該記憶卡控制器及該感應天線連接端子組,其中該天線訊號處理模組係具有一訊號處理單元及一切換單元,該訊號處理單元係處理該內部感應天線模組所接收之訊號,該切換單元係連接該感應天線連接端子組以將所處理之訊號輸出予該智慧晶片,該切換單元係用於在該感應天線連接端子組連接該外部之感應天線時斷開該訊號處理單元與該感應天線連接端子組間的連接通路。In an embodiment of the present invention, the substrate further includes: an inductive antenna connection terminal group connected to the smart chip and connected to the sensing antenna independent of the external memory card; an internal sensing antenna module; and one day The line signal processing module is connected to the internal sensing antenna module, the memory card controller and the sensing antenna connection terminal group, wherein the antenna signal processing module has a signal processing unit and a switching unit, and the signal processing unit Processing the signal received by the internal sensing antenna module, the switching unit is connected to the sensing antenna connection terminal group to output the processed signal to the smart chip, and the switching unit is configured to be connected in the sensing antenna connection terminal group The external sensing antenna disconnects the connection path between the signal processing unit and the sensing antenna connection terminal group.

於本發明之一實施例中,該記憶卡控制器係用於在該記憶卡標準連接端子組接收到外部輸入電壓時,控制該切換單元使其導通該訊號處理單元與該感應天線連接端子組間的連接通路。In an embodiment of the present invention, the memory card controller is configured to control the switching unit to turn on the signal processing unit and the sensing antenna connection terminal group when the memory card standard connection terminal group receives an external input voltage. Connection path between.

於本發明之一實施例中,該訊號處理單元係包含一前級放大處理器,以放大該內部感應天線模組所接收之訊號。In an embodiment of the invention, the signal processing unit includes a preamplifier processor for amplifying the signal received by the internal sensing antenna module.

於本發明之一實施例中,該感應天線連接端子組係外露於該記憶卡且位於該記憶卡標準連接端子組及該智慧晶片連接端子組之間。In an embodiment of the invention, the sensing antenna connection terminal group is exposed on the memory card and located between the memory card standard connection terminal group and the smart chip connection terminal group.

於本發明之一實施例中,該智慧晶片連接端子組係由VCC端子、RST端子、CLK端子、IO端子及GND端子所組成。In an embodiment of the invention, the smart chip connection terminal group is composed of a VCC terminal, an RST terminal, a CLK terminal, an IO terminal, and a GND terminal.

藉此,採用本案之技術特徵後的效果如下:Therefore, the effect of using the technical features of the case is as follows:

1. 習知的智慧SD卡因為無用於智慧晶片之通訊協定的直接觸點(智慧晶片連接端子組),所以無法使用現有的接觸式讀取設備,如:銀行的ATM提款機,在本案之具智慧晶片之記憶卡的外部增加智慧晶片連接端子組(7816介面)後,即可直接經由轉接器(如外接卡套,以模擬成既有卡片的大小)插接現有的接觸式讀取設備,其係因本案之智慧晶片連接端子組係與現有銀行發卡系統之IC觸點的佈局和功能一致,智慧SD卡插入轉接器後,整體呈現的長寬均與標準銀行金融IC卡相同,且整體厚度不超過1mm,可以順利使用現有銀行發卡系統的接觸式讀取設備,不會被卡住,且現有銀行發卡系統的接觸式讀取設備可透過原有的讀取頭,將個人化資料傳輸給轉接器後直接傳給智慧SD卡,不用再經過其他協定的轉換,可實現在現有發行設備上之大量的卡片生產。1. The conventional smart SD card cannot use the existing contact reading device because there is no direct contact (smart chip connection terminal group) for the smart chip communication protocol, such as: the bank ATM cash machine, in this case After adding the smart chip connection terminal group (7816 interface) to the external memory card of the smart chip, the existing contact reading can be directly inserted through the adapter (such as an external card sleeve to simulate the size of the existing card). Take the equipment, because the smart chip connection terminal group in this case is consistent with the layout and function of the IC contact of the existing bank card issuance system. After the smart SD card is inserted into the adapter, the overall length and width of the smart SD card are compared with the standard bank financial IC card. The same, and the overall thickness does not exceed 1mm, can smoothly use the contact reading device of the existing bank card issuing system, will not be stuck, and the contact reading device of the existing bank card issuing system can pass through the original reading head, The personalized data is transmitted to the adapter and directly transmitted to the smart SD card, which can realize the production of a large number of cards on the existing distribution equipment without further conversion.

2.現有的智慧SD卡因為無直接觸點而無法直接使用7816介面的通訊協定,所以無法使用接觸式的刷卡機等支付設備,在智慧SD卡外部增加智慧晶片連接端子組(7816介面)後,經由轉接器,即可將轉接器的前端插刷卡機等設備的IC卡插口,無需其他協定的轉換,即可完成支付交易,例如應用於現今的金融卡信用卡。2. The existing smart SD card cannot directly use the 7816 interface communication protocol because there is no direct contact, so it is impossible to use a payment device such as a contact card reader, and add a smart chip connection terminal group (7816 interface) outside the smart SD card. Through the adapter, the front end of the adapter can be inserted into the IC card socket of the device such as the credit card machine, and the payment transaction can be completed without other agreement conversion, for example, to the current financial card credit card.

3.在智慧SD卡外部增加智慧晶片連接端子組(7816介面)後,在智慧SD卡結合轉接器的接觸式支付過程中,資料直接從刷卡機等終端設備透過轉接器傳遞給智慧SD卡內的智慧晶片,而不須經過記憶卡控制器,避免了記憶卡控制器和普通IC卡工作電壓不一致造成的元件損壞,亦免除了在記憶卡上或轉接器上需額外設置電壓轉換模組的成本,以及避免了記憶卡或轉接器會因該電壓轉換模組的設置而造成厚度增加的可能。3. After adding the smart chip connection terminal group (7816 interface) outside the smart SD card, in the contact payment process of the smart SD card combined with the adapter, the data is directly transmitted from the terminal device such as the credit card machine to the smart SD through the adapter. The smart chip in the card does not need to pass through the memory card controller, avoiding the component damage caused by the inconsistent working voltage between the memory card controller and the ordinary IC card, and eliminating the need for additional voltage conversion on the memory card or the adapter. The cost of the module and the possibility that the memory card or the adapter will increase in thickness due to the setting of the voltage conversion module.

4.在智慧SD卡外部增加智慧晶片連接端子組(7816介面)後,因保留了原有智慧SD卡的觸點結構及記憶卡控制器與智慧晶片的連接關係,智慧晶片裡的資料仍可透過記憶卡控制器而由該記憶卡標準連接端子組傳輸而出,故仍然可以插入手機中透過手機上的操作來實現線上交易。4. After adding the smart chip connection terminal group (7816 interface) outside the smart SD card, the information in the smart chip can still be retained by retaining the contact structure of the original smart SD card and the connection relationship between the memory card controller and the smart chip. It is transmitted from the memory card standard connection terminal group through the memory card controller, so it can still be inserted into the mobile phone to realize online transaction through the operation on the mobile phone.

5.在智慧SD卡外部增加智慧晶片連接端子組(7816介面)後,因保留了原有智慧SD卡的記憶卡標準連接端子組,故仍然可以插入既有之外接設備來作為行動儲存裝置用。5. After adding the smart chip connection terminal group (7816 interface) outside the smart SD card, since the memory card standard connection terminal group of the original smart SD card is retained, the existing external device can still be inserted as the mobile storage device. .

為充分瞭解本發明之目的、特徵及功效,茲藉由下述具體之實施例,並配合所附之圖式,對本發明做一詳細說明,說明如後:In order to fully understand the objects, features and advantages of the present invention, the present invention will be described in detail by the following specific embodiments and the accompanying drawings.

首先請參閱第1圖,係為本發明一實施例中具智慧晶片之記憶卡的功能方塊示意圖。具智慧晶片的記憶卡為一基板100加上外殼體而成為一個記憶卡產品,該記憶卡產品的外型在厚度允許的情況下係可為各種類型的記憶卡,於本發明中係以Micro SD卡作為示例。於本發明之實施例中,該基板100上係包含:智慧晶片110、記憶卡控制器120、記憶卡標準連接端子組122及智慧晶片連接端子組112。該基板100上之該智慧晶片連接端子組112係為符合該智慧晶片110之通訊協定規範下所設置的連接端子,舉例來說,當具智慧晶片的記憶卡為SD卡時,該智慧晶片連接端子組112係由VCC端子112a、RST端子112b、CLK端子112c、IO端子112d及GND112e端子所組成。First, please refer to FIG. 1 , which is a functional block diagram of a memory card with a smart chip according to an embodiment of the invention. The memory card with the smart chip is a memory card product for adding a substrate 100 to the outer casing. The appearance of the memory card product can be various types of memory cards when the thickness permits, and is Micro in the present invention. The SD card is taken as an example. In the embodiment of the present invention, the substrate 100 includes: a smart chip 110, a memory card controller 120, a memory card standard connection terminal group 122, and a smart wafer connection terminal group 112. The smart chip connection terminal group 112 on the substrate 100 is a connection terminal disposed under the communication protocol specification of the smart chip 110. For example, when the memory card with the smart chip is an SD card, the smart chip connection The terminal group 112 is composed of VCC terminal 112a, RST terminal 112b, CLK terminal 112c, IO terminal 112d, and GND112e terminals.

如第1圖所示,該智慧晶片連接端子組112係連接該智慧晶片110,該智慧晶片110係連接該記憶卡控制器120。此外,於第1圖中雖無法顯示出來但,該記憶卡標準連接端子組122及該智慧晶片連接端子組112係外露於該記憶卡,使得該記憶卡標準連接端子組122可對記憶體模組130發揮原有存取功能,該智慧晶片連接端子組112則可供外接轉接卡將該等端子導接至原智慧晶片卡之智慧晶片所位處的位置(可參閱後續之第4圖),另一方面,該智慧晶片連接端子組112亦可直接排列成智慧晶片之各接觸端子的位置,而可在接上轉接卡後無需再將該等端子導接而可直接被使用(可參閱後續之第3圖)。As shown in FIG. 1, the smart chip connection terminal group 112 is connected to the smart chip 110, and the smart chip 110 is connected to the memory card controller 120. In addition, although not shown in FIG. 1, the memory card standard connection terminal group 122 and the smart chip connection terminal group 112 are exposed on the memory card, so that the memory card standard connection terminal group 122 can be used for the memory phantom. The group 130 plays the original access function, and the smart chip connection terminal group 112 can be used for the external adapter card to guide the terminals to the position of the smart chip of the original smart chip card (refer to the following fourth figure). On the other hand, the smart chip connection terminal group 112 can also be directly arranged as the position of each contact terminal of the smart chip, and can be directly used after the adapter card is connected without being connected to the terminal ( See the third figure below).

接著請參閱第2圖,係為本發明另一實施例中具智慧晶片之記憶卡的功能方塊示意圖。於本實施例中,該基板100上係更包含:感應天線連接端子組140、內部感應天線模組150及天線訊號處理模組160。感應天線連接端子組140係連接該智慧晶片110並供獨立於該記憶卡外部之感應天線連接,亦即,該感應天線連接端子組140係供本發明之記憶卡在安裝至轉接卡上時可供轉接卡上之感應天線連接,進而使得轉接卡上之感應天線所接收之訊號可輸入至該智慧晶片110中。該天線訊號處理模組160則是連接該內部感應天線模組150、該記憶卡控制器120及該感應天線連接端子組112。2 is a functional block diagram of a memory card with a smart chip in another embodiment of the present invention. In this embodiment, the substrate 100 further includes: an inductive antenna connection terminal group 140, an internal inductive antenna module 150, and an antenna signal processing module 160. The sensing antenna connection terminal group 140 is connected to the smart chip 110 and is connected to the sensing antenna outside the memory card, that is, the sensing antenna connection terminal group 140 is used when the memory card of the present invention is mounted on the riser card. The sensing antenna on the adapter card can be connected, so that the signal received by the sensing antenna on the adapter card can be input into the smart wafer 110. The antenna signal processing module 160 is connected to the internal sensing antenna module 150, the memory card controller 120, and the sensing antenna connection terminal group 112.

值得一提的是,該天線訊號處理模組160包含一訊號處理單元162及一切換單元164,用以處理及切換內部感應天線模組150感應的訊號及外部之感應天線所感應的訊號。It is to be noted that the antenna signal processing module 160 includes a signal processing unit 162 and a switching unit 164 for processing and switching signals sensed by the internal sensing antenna module 150 and signals sensed by the external sensing antenna.

該訊號處理單元162係用於處理該內部感應天線模組150所接收之訊號,舉例來說,由於記憶卡上之內部感應天線模組150較小,該訊號處理單元162可包含一前級處理放大器,用以放大該內部感應天線模組150所接收之訊號。The signal processing unit 162 is configured to process the signal received by the internal sensing antenna module 150. For example, since the internal sensing antenna module 150 on the memory card is small, the signal processing unit 162 can include a pre-processing. The amplifier is configured to amplify the signal received by the internal sensing antenna module 150.

該切換單元164係連接該感應天線連接端子組140以將經由該訊號處理單元162所處理之訊號輸出予該智慧晶片110。其中,該切換單元164係用於在該感應天線連接端子組140有連接至該外部之感應天線時,斷開該訊號處理單元162與該感應天線連接端子組140間的連接通路;另一方面來說,係用於在該感應天線連接端子組140未連接至該外部之感應天線時,導通該訊號處理單元162與該感應天線連接端子組140間的連接通路。The switching unit 164 is connected to the sensing antenna connection terminal group 140 to output the signal processed by the signal processing unit 162 to the smart wafer 110. The switching unit 164 is configured to disconnect the connection between the signal processing unit 162 and the sensing antenna connection terminal group 140 when the sensing antenna connection terminal group 140 is connected to the external sensing antenna. For example, when the sensing antenna connection terminal group 140 is not connected to the external sensing antenna, the connection path between the signal processing unit 162 and the sensing antenna connection terminal group 140 is turned on.

該切換單元164的控制係可使內部與外部之天線可被正確的使用,進而讓感應訊號順利地被智慧晶片110所接收。舉例來說,當本發明之記憶卡被插入電子裝置中而接收到外部電壓時,該外部電壓係透過該記憶卡標準連接端子組122而傳送至該記憶卡控制器120,該記憶卡控制器120及可設定來控制該切換單元164,使該切換單元164導通該訊號處理單元162與該感應天線連接端子組140間的連接通路,反之,當本發明之記憶卡未被插入電子裝置中(或被插入電子裝置中但電子裝置未施加外部電壓)時,因該記憶卡控制器120未接收到電壓訊號,故不會控制該切換單元164,進而維持該切換單元164的未受電壓控制時的狀態。The control of the switching unit 164 allows the internal and external antennas to be used correctly, so that the sensing signals are smoothly received by the smart wafer 110. For example, when the memory card of the present invention is inserted into the electronic device and receives an external voltage, the external voltage is transmitted to the memory card controller 120 through the memory card standard connection terminal group 122, and the memory card controller 120 and can be configured to control the switching unit 164 to enable the switching unit 164 to open a connection path between the signal processing unit 162 and the sensing antenna connection terminal group 140. Conversely, when the memory card of the present invention is not inserted into the electronic device ( When the electronic card device is not inserted into the electronic device, the memory card controller 120 does not receive the voltage signal, so the switching unit 164 is not controlled, thereby maintaining the uncontrolled voltage of the switching unit 164. status.

舉例來說,該切換單元164可使用受電壓時(即該記憶卡控制器120給予控制訊號)係可維持短路狀態的開關元件,使內部感應天線模組150的感應訊號可經由該訊號處理單元162處理後輸出予該智慧晶片110;而當該切換單元164未受電壓作用時,此開關元件係產生斷開狀態,進而使該智慧晶片110得以接收記憶卡外部之感應天線所感應的訊號。For example, the switching unit 164 can use a switching element that can maintain a short circuit condition when the voltage is applied (ie, the memory card controller 120 gives a control signal), so that the sensing signal of the internal sensing antenna module 150 can pass through the signal processing unit. The 162 is processed and output to the smart wafer 110. When the switching unit 164 is not subjected to a voltage, the switching element generates an off state, thereby enabling the smart chip 110 to receive a signal sensed by the sensing antenna outside the memory card.

接著請參閱第3圖,係為本發明一實施例中具智慧晶片之記憶卡安裝於轉接器上的示意圖。於此實施例中,轉接器200上係承載(例如採用嵌入或插接等方式)有具智慧晶片的記憶卡300,而透過前述之智慧晶片連接端子組112(本圖未示)即可與轉接器200上之智慧晶片端子220相連接,透過前述之感應天線連接端子組140則可與轉接器200上之外部感應天線模組210相連接,以完成小卡轉成大卡進而可作為一般晶片卡使用,亦即可相容既有之智慧卡(如:IC金融卡、悠遊卡等)的讀取設備。Next, please refer to FIG. 3, which is a schematic diagram of a memory card with a smart chip mounted on an adapter according to an embodiment of the invention. In this embodiment, the adapter 200 carries (for example, embedded or plugged) a memory card 300 with a smart chip, and the smart chip connection terminal group 112 (not shown) can be used. The smart chip terminal 220 on the adapter 200 is connected to the external sensing antenna module 210 on the adapter 200 through the sensing antenna connecting terminal group 140 to complete the small card conversion into a large card. It can be used as a general chip card, and it can also be compatible with the reading devices of existing smart cards (such as IC financial cards, leisure cards, etc.).

接著請參閱第4圖,係為本發明一實施例中具智慧晶片之記憶卡的端子配置圖,該感應天線連接端子組140係外露於該記憶卡,且該智慧晶片連接端子組112係位於該感應天線連接端子組140之間。4 is a terminal configuration diagram of a memory card with a smart chip according to an embodiment of the present invention. The sensing antenna connection terminal group 140 is exposed on the memory card, and the smart chip connection terminal group 112 is located. The sensing antennas are connected between the terminal groups 140.

綜合上述,透過本發明之記憶卡上的智慧晶片連接端子組即可供外接的轉接器將記憶卡轉接成大卡,無需額外使用新的設備來讀取,不但解決了現有SD卡的問題,擴大了智慧SD卡的使用範圍,從而彌補習知技術中存在的不足。此外,在本發明之配置下,具有智慧晶片的記憶卡可用於手機、平板電腦、智慧手錶等可攜式或穿戴式的電子裝置,進而供使用者進行電子交易,達到多用途的目的。In summary, the smart chip connection terminal group on the memory card of the present invention can be used as an external adapter to transfer the memory card into a large card without using a new device to read, which not only solves the problem of the existing SD card. The problem is to expand the use of smart SD cards to make up for the shortcomings in the prior art. In addition, in the configuration of the present invention, the memory card with the smart chip can be used for a portable or wearable electronic device such as a mobile phone, a tablet computer, a smart watch, etc., and then the user can conduct electronic transactions for the purpose of multi-purpose.

本發明在上文中已以較佳實施例揭露,然熟習本項技術者應理解的是,該實施例僅用於描繪本發明,而不應解讀為限制本發明之範圍。應注意的是,舉凡與該實施例等效之變化與置換,均應設為涵蓋於本發明之範疇內。因此,本發明之保護範圍當以申請專利範圍所界定者為準。The invention has been described above in terms of the preferred embodiments, and it should be understood by those skilled in the art that the present invention is not intended to limit the scope of the invention. It should be noted that variations and permutations equivalent to those of the embodiments are intended to be included within the scope of the present invention. Therefore, the scope of protection of the present invention is defined by the scope of the patent application.

100‧‧‧基板
110‧‧‧智慧晶片
112‧‧‧智慧晶片連接端子組
112a‧‧‧VCC端子
112b‧‧‧RST端子
112c‧‧‧CLK端子
112d‧‧‧IO端子
112e‧‧‧GND
120‧‧‧記憶卡控制器
122‧‧‧記憶卡標準連接端子組
130‧‧‧記憶體模組
140‧‧‧感應天線連接端子組
150‧‧‧內部感應天線模組
160‧‧‧天線訊號處理模組
162‧‧‧訊號處理單元
164‧‧‧切換單元
200‧‧‧轉接器
210‧‧‧外部感應天線模組
220‧‧‧智慧晶片端子
300‧‧‧具智慧晶片之記憶卡
100‧‧‧Substrate
110‧‧‧Smart Wafer
112‧‧‧Smart chip connection terminal set
112a‧‧‧VCC terminal
112b‧‧‧RST terminal
112c‧‧‧CLK terminal
112d‧‧‧IO terminal
112e‧‧‧GND
120‧‧‧ Memory Card Controller
122‧‧‧Memory card standard connection terminal set
130‧‧‧ memory module
140‧‧‧Sensor antenna connection terminal set
150‧‧‧Internal induction antenna module
160‧‧‧Antenna Signal Processing Module
162‧‧‧Signal Processing Unit
164‧‧‧Switch unit
200‧‧‧Adapter
210‧‧‧External Induction Antenna Module
220‧‧‧Smart chip terminal
300‧‧‧ Memory card with smart chip

第1圖係為本發明一實施例中具智慧晶片之記憶卡的功能方塊示意圖。 第2圖係為本發明另一實施例中具智慧晶片之記憶卡的功能方塊示意圖。 第3圖係為本發明一實施例中具智慧晶片之記憶卡安裝於轉接器上的示意圖。 第4圖係為本發明一實施例中具智慧晶片之記憶卡的端子配置圖。1 is a functional block diagram of a memory card with a smart chip in accordance with an embodiment of the present invention. 2 is a functional block diagram of a memory card with a smart chip in another embodiment of the present invention. FIG. 3 is a schematic diagram of a memory card with a smart chip mounted on an adapter according to an embodiment of the invention. Fig. 4 is a block diagram showing the arrangement of a memory card with a smart chip in an embodiment of the invention.

100‧‧‧基板 100‧‧‧Substrate

110‧‧‧智慧晶片 110‧‧‧Smart Wafer

112‧‧‧智慧晶片連接端子組 112‧‧‧Smart chip connection terminal set

112a‧‧‧VCC端子 112a‧‧‧VCC terminal

112b‧‧‧RST端子 112b‧‧‧RST terminal

112c‧‧‧CLK端子 112c‧‧‧CLK terminal

112d‧‧‧IO端子 112d‧‧‧IO terminal

112e‧‧‧GND 112e‧‧‧GND

120‧‧‧記憶卡控制器 120‧‧‧ Memory Card Controller

122‧‧‧記憶卡標準連接端子組 122‧‧‧Memory card standard connection terminal set

130‧‧‧記憶體模組 130‧‧‧ memory module

Claims (6)

一種具智慧晶片的記憶卡,係包含一基板及設置於該基板上的一智慧晶片、一記憶卡控制器及一記憶卡標準連接端子組,其特徵在於:該基板上係設置有符合該智慧晶片之通訊協定的一智慧晶片連接端子組,其中,該智慧晶片連接端子組係連接該智慧晶片,該智慧晶片係連接該記憶卡控制器,該記憶卡標準連接端子組及該智慧晶片連接端子組係外露於該記憶卡。A memory card with a smart chip, comprising a substrate and a smart chip disposed on the substrate, a memory card controller and a memory card standard connection terminal set, wherein the substrate is provided with the wisdom A smart chip connection terminal group of the chip communication protocol, wherein the smart chip connection terminal group is connected to the smart chip, the smart chip is connected to the memory card controller, the memory card standard connection terminal group and the smart chip connection terminal The group is exposed to the memory card. 如請求項第1項所述之記憶卡,其中於該基板上更包含: 一感應天線連接端子組,係連接該智慧晶片並供獨立於該記憶卡外部之感應天線連接; 一內部感應天線模組;及 一天線訊號處理模組,係連接該內部感應天線模組、該記憶卡控制器及該感應天線連接端子組,其中該天線訊號處理模組係具有一訊號處理單元及一切換單元,該訊號處理單元係處理該內部感應天線模組所接收之訊號,該切換單元係連接該感應天線連接端子組以將所處理之訊號輸出予該智慧晶片,該切換單元係用於在該感應天線連接端子組連接該外部之感應天線時斷開該訊號處理單元與該感應天線連接端子組間的連接通路。The memory card of claim 1, wherein the substrate further comprises: a sensing antenna connection terminal group connected to the smart chip and connected to an inductive antenna independent of the external memory card; an internal sensing antenna module And an antenna signal processing module for connecting the internal sensing antenna module, the memory card controller and the sensing antenna connection terminal group, wherein the antenna signal processing module has a signal processing unit and a switching unit. The signal processing unit processes the signal received by the internal sensing antenna module, and the switching unit is connected to the sensing antenna connection terminal group to output the processed signal to the smart chip, and the switching unit is used in the sensing antenna. When the connection terminal group is connected to the external sensing antenna, the connection path between the signal processing unit and the sensing antenna connection terminal group is disconnected. 如請求項第2項所述之記憶卡,其中該記憶卡控制器係用於在該記憶卡標準連接端子組接收到外部輸入電壓時,控制該切換單元使其導通該訊號處理單元與該感應天線連接端子組間的連接通路。The memory card of claim 2, wherein the memory card controller is configured to control the switching unit to turn on the signal processing unit and the sensing when the memory card standard connection terminal group receives an external input voltage The connection path between the antenna connection terminal groups. 如請求項第2項所述之記憶卡,其中該訊號處理單元係包含一前級放大處理器,以放大該內部感應天線模組所接收之訊號。The memory card of claim 2, wherein the signal processing unit comprises a preamplifier processor for amplifying the signal received by the internal sensing antenna module. 如請求項第2項所述之記憶卡,其中該感應天線連接端子組係外露於該記憶卡且位於該記憶卡標準連接端子組及該智慧晶片連接端子組之間。The memory card of claim 2, wherein the sensing antenna connection terminal group is exposed on the memory card and located between the memory card standard connection terminal group and the smart chip connection terminal group. 如請求項第1項所述之記憶卡,其中該智慧晶片連接端子組係由VCC端子、RST端子、CLK端子、IO端子及GND端子所組成。The memory card of claim 1, wherein the smart chip connection terminal group is composed of a VCC terminal, an RST terminal, a CLK terminal, an IO terminal, and a GND terminal.
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