TW201437543A - Light emitting diode lamp - Google Patents
Light emitting diode lamp Download PDFInfo
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- TW201437543A TW201437543A TW102108850A TW102108850A TW201437543A TW 201437543 A TW201437543 A TW 201437543A TW 102108850 A TW102108850 A TW 102108850A TW 102108850 A TW102108850 A TW 102108850A TW 201437543 A TW201437543 A TW 201437543A
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Abstract
Description
本發明係關於一種發光二極體燈泡，尤其利用一固定件將一發光二極體承載板、一散熱件、及一支撐件固定在一起。 The invention relates to a light-emitting diode bulb, in particular to fix a light-emitting diode carrier board, a heat sink and a support member together by using a fixing member.
用於固態照明裝置的發光二極體(light-emitting diode；LED)具有耗能低、低發熱、操作壽命長、防震、體積小、反應速度快以及輸出的光波長穩定等良好光電特性，因此發光二極體被廣泛地應用於家用照明以及儀器指示燈等光電產品。隨著光電科技的發展，固態照明在照明效率、操作壽命以及亮度等方面有顯著的進步，因此近年來發光二極體已經被應用於一般的照明用途上。 A light-emitting diode (LED) for a solid-state lighting device has good photoelectric characteristics such as low energy consumption, low heat generation, long operating life, shock resistance, small volume, fast response speed, and stable wavelength of output light. Light-emitting diodes are widely used in optoelectronic products such as home lighting and instrument indicators. With the development of optoelectronic technology, solid-state lighting has made significant progress in lighting efficiency, operating life and brightness. Therefore, in recent years, LEDs have been used in general lighting applications.
因此，本發明係關於一種低成本且易組裝之發光二極體燈泡。 Accordingly, the present invention is directed to a low cost and easy to assemble light emitting diode bulb.
發光二極體燈泡包含一散熱件，具有一腔體；一承載板，設置於散熱件上；一支撐件，係容納在腔體內；以及一固定件，係將承載板、散熱件、及支撐件固定在一起。 The light-emitting diode bulb comprises a heat sink having a cavity; a carrier plate disposed on the heat sink; a support member received in the cavity; and a fixing member for supporting the carrier, the heat sink, and the support The pieces are fixed together.
為讓本發明之上述和其他目的、特徵和優點能更明顯易懂，下文特舉較佳實施例，並配合所附圖式，作詳細說明如下 The above and other objects, features, and advantages of the present invention will become more apparent and understood.
10‧‧‧燈罩 10‧‧‧shade
20‧‧‧散熱件 20‧‧‧ Heat sink
201‧‧‧第一機構件 201‧‧‧First machine component
2011‧‧‧上表面 2011‧‧‧Upper surface
2012‧‧‧側表面 2012‧‧‧ side surface
2013‧‧‧下表面 2013‧‧‧ lower surface
202‧‧‧第二機構件 202‧‧‧Second machine components
203‧‧‧兩第一通孔 203‧‧‧Two first through holes
204‧‧‧第二通孔 204‧‧‧Second through hole
205‧‧‧腔體 205‧‧‧ cavity
30‧‧‧支撐件 30‧‧‧Support
301‧‧‧第一支撐部 301‧‧‧First support
3011‧‧‧兩通道 3011‧‧‧Two channels
302‧‧‧第二支撐部 302‧‧‧Second support
40‧‧‧承載板 40‧‧‧Loading board
401‧‧‧兩第一穿孔 401‧‧‧Two first perforations
402‧‧‧第二穿孔 402‧‧‧Second perforation
50‧‧‧發光二極體裝置 50‧‧‧Lighting diode device
60‧‧‧固定件 60‧‧‧Fixed parts
70‧‧‧電連接件 70‧‧‧Electrical connectors
第1圖為本發明之一實施例中一發光二極體燈泡之立體圖。 1 is a perspective view of a light-emitting diode bulb in an embodiment of the present invention.
第2圖為本發明之一實施例中一發光二極體燈泡之棒炸圖。 Fig. 2 is a view showing a rod explosion of a light-emitting diode bulb in an embodiment of the present invention.
第3圖為本發明之一實施例中一發光二極體燈泡之立體 圖，其無包含燈罩。 FIG. 3 is a perspective view of a light-emitting diode bulb according to an embodiment of the present invention; Figure, which does not contain a lampshade.
第4圖為本發明之一實施例中一發光二極體燈泡之立體圖。 Figure 4 is a perspective view of a light-emitting diode bulb in an embodiment of the present invention.
第5圖為本發明之一實施例中散熱件之剖面圖。 Figure 5 is a cross-sectional view of a heat sink in accordance with one embodiment of the present invention.
第6圖為本發明之一實施例中一製造發光二極體燈泡之流程圖。 Figure 6 is a flow chart of manufacturing a light-emitting diode bulb in an embodiment of the present invention.
第1及2圖顯示本發明之一實施例中一發光二極體燈泡。參照第1及2圖，發光二極體燈泡包含一燈罩10、一散熱件20、一支撐件30、一承載板40、發光二極體裝置50、兩固定件60；及一電連接件70。燈罩10係為半球形或類半球形，且可由透明、半透明、或不透明之材質所組成，例如聚丙烯(PP)、聚乙烯(PE)、聚氯乙烯(PVC)、聚碳酸酯(PC)、或聚氨酯(PU)。在本實施例中，燈罩10為不透明。 Figures 1 and 2 show a light-emitting diode bulb in an embodiment of the invention. Referring to Figures 1 and 2, the LED bulb comprises a lamp cover 10, a heat sink 20, a support member 30, a carrier plate 40, a light-emitting diode device 50, two fixing members 60, and an electrical connector 70. . The lampshade 10 is hemispherical or hemispherical and may be composed of a transparent, translucent or opaque material such as polypropylene (PP), polyethylene (PE), polyvinyl chloride (PVC), polycarbonate (PC). ), or polyurethane (PU). In the present embodiment, the globe 10 is opaque.
第3及4圖顯示本發明之一實施例中發光二極體燈泡。參照第2、3及4圖，發光二極體裝置50設置於承載板40上。散熱件20包含一第一機構件201及一第二機構件202。第一機構件201包含一上表面2011、一下表面2013及一側表面2012。側表面2012係從上表面2011延伸至下表面2013。第二機構件202係圍繞並全部或部份包覆第一機構件201之側表面2012及覆蓋第一機構件201之部分上表面2011。承載板40係設置在未被第二機構件202覆蓋之上表面2011上。第一機構件201係包含金屬，例如：鋁、銅、鐵、錫，以將發光二極體裝置50所產生之熱可利用傳導及對流方式帶離發光二極體燈泡。第二機構件202可為電絕緣材料，其包含塑膠，例如：聚丙烯(PP)、聚碳酸酯(PC)、聚對苯二甲酸丁二酯(PBT)、丙烯晴-丁二烯-苯乙烯共聚體(ABS)或ABS和PC的混和物、或陶瓷材料，例如：氧化鋁(Al2O3)，陶瓷材料可由厚膜製程(thick film)、低溫共燒製程(LTCC)與薄膜製程等方式製作而成。第二機構件202可幫助由發光二極體裝置50產生的熱藉由傳導、對流或輻射的方式離開發光二極體燈泡。藉由第一機構件201及第二機構件202之材料特性，散熱件20可以選擇不需形成鰭片於其外部，即可 有效將發光二極體裝置50產生的熱帶離發光二極體燈泡。因此，本實施例中之第二機構件202之外表面係為平整、平滑之結構。然而，若因設計之需求，亦可以選擇在散熱件20之適當位置上形成鰭片或其他輔助散熱結構。承載板40可為一電路板(PCB)，以與發光二極體裝置50以及電連接件70形成電連接。電路板的基板材料包含金屬、熱塑性材料、熱固性材料、或陶瓷材料。金屬包含鋁、銅等。熱固性材料包含酚醛樹脂(Phonetic)、環氧樹脂(Epoxy)、雙馬來醯亞胺三嗪樹脂(Bismaleimide Triazine)或其組合。熱塑性材料包含聚亞醯胺樹脂(Polyimide resin)、聚四氟乙烯(Polytetrafluorethylene)等。陶瓷材料包含氧化鋁、氮化鋁、碳化矽鋁等。 Figures 3 and 4 show a light-emitting diode bulb in an embodiment of the invention. Referring to Figures 2, 3 and 4, the LED device 50 is disposed on the carrier plate 40. The heat sink 20 includes a first machine member 201 and a second machine member 202. The first machine member 201 includes an upper surface 2011, a lower surface 2013, and a side surface 2012. The side surface 2012 extends from the upper surface 2011 to the lower surface 2013. The second machine member 202 surrounds and wholly or partially covers the side surface 2012 of the first machine member 201 and a portion of the upper surface 2011 covering the first machine member 201. The carrier plate 40 is disposed on the upper surface 2011 that is not covered by the second machine member 202. The first machine member 201 comprises a metal such as aluminum, copper, iron or tin to carry the heat generated by the light-emitting diode device 50 away from the light-emitting diode bulb by conduction and convection. The second machine component 202 can be an electrically insulating material comprising plastic such as polypropylene (PP), polycarbonate (PC), polybutylene terephthalate (PBT), acrylonitrile-butadiene-benzene Ethylene interpolymer (ABS) or a mixture of ABS and PC, or ceramic material, such as alumina (Al 2 O 3 ), ceramic material can be thick film, low temperature co-firing process (LTCC) and thin film process Made in other ways. The second machine component 202 can help the heat generated by the LED device 50 to exit the LED bulb by conduction, convection or radiation. By the material properties of the first machine member 201 and the second machine member 202, the heat sink 20 can select the tropical light-emitting diode bulb generated by the light-emitting diode device 50 without forming fins on the outside thereof. . Therefore, the outer surface of the second machine member 202 in this embodiment is a flat, smooth structure. However, fins or other auxiliary heat dissipation structures may also be formed at appropriate locations on the heat sink 20 if desired by the design. The carrier board 40 can be a circuit board (PCB) to form an electrical connection with the LED device 50 and the electrical connector 70. The substrate material of the circuit board comprises a metal, a thermoplastic material, a thermosetting material, or a ceramic material. The metal contains aluminum, copper, and the like. The thermosetting material comprises a phenolic resin (Phonetic), an epoxy resin (Epoxy), a Bismaleimide Triazine resin, or a combination thereof. The thermoplastic material comprises a polyimide resin, a polytetrafluorethylene or the like. The ceramic material includes aluminum oxide, aluminum nitride, tantalum aluminum carbide, and the like.
發光二極體裝置50可包含一個或複數個彼此串聯及/或並聯之發光二極體。本說明書中之發光二極體可為封裝後之發光二極體或是未封裝之發光二極體，未封裝之發光二極體係例如發光二極體晶粒。於一實施例中，發光二極體裝置50包含複數個固定於一載板上之發光二極體，發光二極體間係透過導線或預置電路形成串聯及/或並聯，且各個發光二極體的順向電壓約為2~3V(下稱「低壓發光二極體」)。於另一實施例中，發光二極體裝置50中至少一個發光二極體之順向電壓係大於低壓發光二極體，例如12V、24V、48V等(下稱「高壓發光二極體」)。具體言之，由別於打線方式，高壓發光二極體係藉由半導體製程在一共同基板上形成數個彼此電連結之發光二極體單元(即至少具有發光層之發光二極體結構)，即此數個發光二極體單元無個別基板而是形成於一共同基板之上，此共同基板可以為長晶基板或非長晶基板。此外，發光二極體可為藍光發光二極體，其波峰值大約位於430nm到480nm；或紅光發光二極體，其波峰值大約位於600nm到660nm之間。再者，藍光發光二極體上可設有一螢光粉層，其可受藍光發光二極體發出的光所激發而發出黃光或是黃綠光(其波峰值大約位於540nm到590nm之間)。螢光粉層可包含一種或多種螢光粉體(例如：紅色螢光粉、綠色螢光粉或黃色螢光粉)混在一膠質中。選擇性地，螢光粉層可包含多層結構，每一層結構包含不同之螢光粉體(例如：一層紅色螢光粉、一層綠色螢光粉或 一層黃色螢光粉)。在一實施例中，發光二極體可排成一陣列或一長條狀。當發光二極體係以長條狀排列在承載板40上時，承載板40之形狀亦可為長條狀，且其寬度可小於1cm、長度可大於3cm以形成發光二極體燈絲(Filament)。在另一實施例中，發光二極體可至少包含兩個發光層(active layer)互相垂直堆疊。兩個發光層可發出相同或不同的光。 The light emitting diode device 50 can include one or a plurality of light emitting diodes connected in series and/or in parallel with each other. The light-emitting diode in the present specification may be a packaged light-emitting diode or an unpackaged light-emitting diode, and an unencapsulated light-emitting diode system such as a light-emitting diode die. In one embodiment, the LED device 50 includes a plurality of LEDs fixed on a carrier, and the LEDs are connected in series and/or in parallel through wires or preset circuits, and each of the LEDs is The forward voltage of the polar body is about 2~3V (hereinafter referred to as "low-voltage light-emitting diode"). In another embodiment, the forward voltage of at least one of the light emitting diodes 50 is greater than the low voltage light emitting diode, such as 12V, 24V, 48V, etc. (hereinafter referred to as "high voltage light emitting diode") . Specifically, the high-voltage light-emitting diode system forms a plurality of light-emitting diode units (ie, at least a light-emitting diode structure having at least a light-emitting layer) electrically connected to each other on a common substrate by a semiconductor process. That is, the plurality of light emitting diode units are formed on a common substrate without individual substrates, and the common substrate may be a long crystal substrate or a non-long crystal substrate. In addition, the light emitting diode may be a blue light emitting diode having a peak value of approximately 430 nm to 480 nm; or a red light emitting diode having a peak value between approximately 600 nm and 660 nm. Furthermore, the blue light emitting diode may be provided with a phosphor layer which is excited by the light emitted by the blue light emitting diode to emit yellow light or yellow green light (having a peak value between about 540 nm and 590 nm). The phosphor layer may comprise one or more phosphor powders (for example: red phosphor, green phosphor or yellow phosphor) mixed in a gel. Optionally, the phosphor layer may comprise a multi-layer structure, each layer structure comprising a different phosphor powder (for example: a layer of red phosphor powder, a layer of green phosphor powder or A layer of yellow fluorescent powder). In an embodiment, the light emitting diodes may be arranged in an array or in an elongated strip shape. When the light-emitting diode system is arranged in a strip shape on the carrier plate 40, the shape of the carrier plate 40 may also be elongated, and the width thereof may be less than 1 cm and the length may be greater than 3 cm to form a light-emitting diode filament (Filament). . In another embodiment, the light emitting diode may include at least two active layers stacked perpendicular to each other. The two luminescent layers can emit the same or different light.
參照第3及4圖，在本實施例中，承載板40係為一圓形。於另一實施例中，承載板40可為長方形、正方形、或多邊形。承載板40具有兩第一穿孔401，係形成於承載板40之外緣上；及一第二穿孔402，亦係形成於承載板40之外緣。兩第一穿孔401彼此相間隔一定距離，例如大於26 mm且小於34 mm的距離。第一機構件201上亦設有兩第一通孔203，其位置係分別相對應於承載板40之兩第一穿孔401；一第二通孔204，其位置係分別相對應於承載板40之第二穿孔402。因此，兩固定件60係分別穿過兩第一穿孔401、及兩第一通孔203，以將承載板40卡固或鎖固於第一機構件201之上表面2011上。兩第一通孔203彼此相間隔一定距離，例如大於26 mm且小於34 mm的距離。在另一實施例中，兩第一穿孔401形成於承載板40之內部而非形成於承載板40之外緣。固定件60可包含螺栓、螺絲釘或自攻螺絲。散熱件20為一中空結構並具有一腔體205以容納支撐件30於其中。支撐件30亦係為一中孔結構以容納電控元件(未顯示)於其中，電控元件之導線係經由第一機構件201之第二通孔及承載板40之第二穿孔402與發光二極體裝置50電連接。支撐件30具有一第一支撐部301；及一第二支撐部302，係連接第一支撐部301。第一支撐部301設有兩通道3011位於其外緣，並從第一支撐部3011之上側延伸至下側。兩通道3011可為貫穿孔(through hole)或盲孔(blind hole)。兩固定件60更進一步延伸至支撐件30之兩通道3011內以將承載板40、第一機構件201與支撐件30固定在一起。兩通道3011彼此相間隔一定距離，例如大於26 mm且小於34 mm的距離。一導熱墊或導熱膏(圖未式)形成於承載板40與第一機構件201之間，以幫助將發光二極體裝置50所產生的熱利用傳導的方式傳至第一機構件201。固定件60亦係穿過導熱 墊或導熱膏以固定之。此外，承載板40的穿孔數目、散熱件20的通孔數目、及支撐件30的通道數目可分別為一個或三個以上，即依實際需求而做變化。 Referring to Figures 3 and 4, in the present embodiment, the carrier plate 40 is circular. In another embodiment, the carrier plate 40 can be rectangular, square, or polygonal. The carrier plate 40 has two first through holes 401 formed on the outer edge of the carrier plate 40, and a second through hole 402 formed on the outer edge of the carrier plate 40. The two first perforations 401 are spaced apart from one another by a distance, such as a distance greater than 26 mm and less than 34 mm. The first machine member 201 is also provided with two first through holes 203 corresponding to the two first through holes 401 of the carrier plate 40; a second through hole 204, the position of which corresponds to the carrier plate 40 respectively. The second perforation 402. Therefore, the two fixing members 60 pass through the two first through holes 401 and the two first through holes 203 respectively to clamp or lock the carrier plate 40 on the upper surface 2011 of the first machine member 201. The two first through holes 203 are spaced apart from each other by a distance, for example, a distance greater than 26 mm and less than 34 mm. In another embodiment, the two first through holes 401 are formed inside the carrier plate 40 instead of being formed on the outer edge of the carrier plate 40. The fixture 60 can include bolts, screws, or self-tapping screws. The heat sink 20 is a hollow structure and has a cavity 205 for receiving the support member 30 therein. The support member 30 is also a mesoporous structure for accommodating an electronic control component (not shown) therein. The lead wire of the electronic control component is illuminated via the second through hole of the first machine member 201 and the second through hole 402 of the carrier plate 40. The diode device 50 is electrically connected. The support member 30 has a first support portion 301 and a second support portion 302 connected to the first support portion 301. The first support portion 301 is provided with two channels 3011 at its outer edge and extends from the upper side to the lower side of the first support portion 3011. The two channels 3011 can be through holes or blind holes. The two fixing members 60 extend further into the two passages 3011 of the support member 30 to fix the carrier plate 40, the first machine member 201 and the support member 30 together. The two channels 3011 are spaced apart from one another by a distance, such as a distance greater than 26 mm and less than 34 mm. A thermal pad or a thermal paste (not shown) is formed between the carrier plate 40 and the first machine member 201 to help transfer heat generated by the LED device 50 to the first machine member 201 by conduction. The fixing member 60 also passes through the heat conduction Pad or thermal paste to fix it. In addition, the number of the perforations of the carrier plate 40, the number of through holes of the heat sink 20, and the number of channels of the support member 30 may be one or more, respectively, that is, vary according to actual needs.
第5圖為散熱件20之剖面圖。第一機構件201之剖面呈一梯形的形狀並具有一上側及一相對於上側之下側。上側具有一寬度(W1)、及下側具有一寬度(W2)；其中，W1>W2。再者，第一機構件201具有一均勻的厚度且其任兩部分的厚度差小於1.5 mm。第一機構件201具有一小於2 mm的最大厚度，及第二機構件202具有一小於2.5 mm的最大厚度。第一機構件201具有一高度(H1)，第二機構件202具有一高度(H2)；其中，H1<H2。第二機構件202亦可包覆或覆蓋第一機構件201之下表面2013。第二機構件202係形成在第一機構件201之上表面2011且與承載板40相距一距離(D1)。發光二極體裝置50發射的光有部分可能會射向第一機構件201之上表面2011，因此可以於上表面2011塗佈一層金屬反射層(例如：銀、銅)以反射光使之朝向燈罩10。此外，藉由選用適當的材料或加工方式，使得第二機構件202之外表面具有較佳的反射性或光散射效果。再者，於另一實施例中，第二機構件202可以覆蓋更多第一機構件201之上表面2011以縮小D1值，進而藉由第二機構件202反射或散射更多來自於發光二極體裝置50的光線。若D1<1 cm或<5 mm，發光二極體裝置50發射的光可被覆蓋於上表面2011之第二機構件202反射朝向燈罩10的方向行進。 Figure 5 is a cross-sectional view of the heat sink 20. The first machine member 201 has a trapezoidal shape in cross section and has an upper side and a lower side with respect to the upper side. The upper side has a width (W 1 ) and the lower side has a width (W 2 ); wherein W 1 > W 2 . Furthermore, the first machine member 201 has a uniform thickness and the difference in thickness between any two portions is less than 1.5 mm. The first machine member 201 has a maximum thickness of less than 2 mm, and the second machine member 202 has a maximum thickness of less than 2.5 mm. The first machine member 201 has a height (H 1 ), and the second machine member 202 has a height (H 2 ); wherein H 1 < H 2 . The second machine member 202 can also cover or cover the lower surface 2013 of the first machine member 201. The second machine member 202 is formed on the upper surface 2011 of the first machine member 201 and at a distance (D 1 ) from the carrier plate 40. A part of the light emitted by the LED device 50 may be directed to the upper surface 2011 of the first machine member 201, so a metal reflective layer (for example, silver or copper) may be coated on the upper surface 2011 to reflect the light. Lampshade 10. In addition, the outer surface of the second machine member 202 has a better reflective or light scattering effect by selecting an appropriate material or processing. Furthermore, in another embodiment, the second machine member 202 can cover more of the upper surface 2011 of the first machine member 201 to reduce the D 1 value, and then reflect or scatter more by the second machine member 202. Light from the diode device 50. If D 1 <1 cm or <5 mm, the light emitted by the LED device 50 can be traveled in a direction in which the second machine member 202 covering the upper surface 2011 reflects toward the globe 10.
第6圖為製造本發明之一實施例中製造發光二極體燈泡之流程圖。步驟901，提供一金屬板具有一矩形形狀。步驟902，利用一沖模技術將金屬板80加工呈一預定形狀並形成通孔203以形成中空之第一機構件201。步驟903，接著，將第一機構件201放置一模具中，利用埋入射出技術，使第二機構件202包覆第一機構件201以形成散熱件20。詳言之，在本實施例中，模具包含一公模及一母模，第一機構件201係夾置於公模及母模之間，接著，注入塑料並加壓使第二機構件202包覆第一機構件201之側表面2012及覆蓋第一機構件201之部分上表面2011以製成散熱件20。步驟904，提供支撐件30，其具有 通道301；電控元件(未顯示)；電連接件70；以及具有發光二極體裝置50之承載板40，並使電控元件電連接發光二極體裝置50。承載板40具有穿孔401。步驟905，提供固定件60，並利用固定件60，組裝承載板40、散熱件20、支撐件30以形成發光二極體燈泡之半成品(如第3圖)。在本實施例中，固定件60為自攻螺絲，因此承載板40之穿孔401、散熱件20之通孔201、及支撐件30之通道3011不需事先形成螺紋結構於其內部，進而減少製造成本及時間。步驟906，最後，提供一燈罩10，卡固於散熱件20上以形成發光二極體燈泡。需注意的是，在本實施例中，可設計各個元件皆具有凹槽部及卡部。因此，在組裝過程中，可利用凹槽部及卡部以將各個元件彼此固定，因而可不使用膠材來降低製造成本。在另一實施例中，於步驟903，利用烤漆技術將一具有熱輻射之材料塗佈在第一機構件201之側表面2012以形成第二機構件202。第二機構件202可未形成在第一機構件201之上表面2011。 Figure 6 is a flow chart for fabricating a light-emitting diode bulb in an embodiment of the present invention. Step 901, providing a metal plate having a rectangular shape. In step 902, the metal plate 80 is processed into a predetermined shape by a die technique and a through hole 203 is formed to form a hollow first machine member 201. Step 903, next, the first machine member 201 is placed in a mold, and the second machine member 202 is wrapped around the first machine member 201 to form the heat sink 20 by a burying technique. In detail, in the embodiment, the mold comprises a male mold and a female mold, and the first mechanical member 201 is sandwiched between the male mold and the female mold, and then the plastic is injected and pressurized to make the second mechanical member 202 The side surface 2012 of the first machine member 201 and a portion of the upper surface 2011 covering the first machine member 201 are covered to form the heat sink 20. Step 904, providing a support member 30 having Channel 301; an electronic control component (not shown); an electrical connector 70; and a carrier plate 40 having a light-emitting diode device 50, and electrically connecting the electronic control component to the light-emitting diode device 50. The carrier plate 40 has a perforation 401. In step 905, the fixing member 60 is provided, and the carrier 40, the heat sink 20, and the support member 30 are assembled by using the fixing member 60 to form a semi-finished product of the light-emitting diode bulb (as shown in FIG. 3). In this embodiment, the fixing member 60 is a self-tapping screw, so the through hole 401 of the carrying plate 40, the through hole 201 of the heat dissipating member 20, and the passage 3011 of the supporting member 30 do not need to be formed into a thread structure in advance, thereby reducing manufacturing. Cost and time. Step 906, finally, a lamp cover 10 is provided, which is fastened to the heat sink 20 to form a light-emitting diode bulb. It should be noted that in this embodiment, each component can be designed to have a groove portion and a card portion. Therefore, in the assembly process, the groove portion and the card portion can be utilized to fix the respective members to each other, so that the manufacturing cost can be reduced without using the rubber material. In another embodiment, in step 903, a material having heat radiation is applied to the side surface 2012 of the first machine member 201 using a baking varnish technique to form the second machine member 202. The second machine member 202 may not be formed on the upper surface 2011 of the first machine member 201.
在另一實施例中，可獨立形成第一機構件201與第二機構件202，再將第一機構件201埋入第二機構件202中，以使第二機構件202包覆第一機構件。此外，第一機構件201與第二機構件202間可以形成一空隙(air gap)，且可選擇性地於空隙中填入一填充材料。填充材料係如環氧樹酯、或矽膠。 In another embodiment, the first machine member 201 and the second machine member 202 may be independently formed, and then the first machine member 201 is embedded in the second machine member 202 such that the second machine member 202 covers the first mechanism. Pieces. In addition, an air gap may be formed between the first machine member 201 and the second machine member 202, and a filling material may be selectively filled in the gap. The filling material is such as epoxy resin or silicone.
10‧‧‧燈罩 10‧‧‧shade
20‧‧‧散熱件 20‧‧‧ Heat sink
201‧‧‧第一機構件 201‧‧‧First machine component
202‧‧‧第二機構件 202‧‧‧Second machine components
203‧‧‧兩第一通孔 203‧‧‧Two first through holes
204‧‧‧第二通孔 204‧‧‧Second through hole
30‧‧‧支撐件 30‧‧‧Support
301‧‧‧第一支撐部 301‧‧‧First support
3011‧‧‧兩通道 3011‧‧‧Two channels
302‧‧‧第二支撐部 302‧‧‧Second support
40‧‧‧承載板 40‧‧‧Loading board
401‧‧‧兩第一穿孔 401‧‧‧Two first perforations
402‧‧‧第二穿孔 402‧‧‧Second perforation
50‧‧‧發光二極體裝置 50‧‧‧Lighting diode device
60‧‧‧固定件 60‧‧‧Fixed parts
70‧‧‧電連接件 70‧‧‧Electrical connectors
Claims (9)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102108850A TWI539109B (en) | 2013-03-18 | 2013-03-18 | Light emitting diode lamp |
| CN201410100669.8A CN104061466A (en) | 2013-03-18 | 2014-03-18 | Light-emitting diode bulb |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102108850A TWI539109B (en) | 2013-03-18 | 2013-03-18 | Light emitting diode lamp |
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| Publication Number | Publication Date |
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| TW201437543A true TW201437543A (en) | 2014-10-01 |
| TWI539109B TWI539109B (en) | 2016-06-21 |
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| CN109882800A (en) * | 2019-03-08 | 2019-06-14 | 华域视觉科技(上海)有限公司 | Car light flame lighting effect implementation method and flame lighting emitter units |
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| CN201844273U (en) * | 2010-11-23 | 2011-05-25 | 广州广日电气设备有限公司 | Light emitting diode (LED) bulb |
| CN102691998B (en) * | 2012-04-28 | 2014-04-16 | 厦门阳光恩耐照明有限公司 | Lightweight insulating radiating structure and LED lamp having the same |
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