TW201437287A - Curable resin composition - Google Patents

Curable resin composition Download PDF

Info

Publication number
TW201437287A
TW201437287A TW103105211A TW103105211A TW201437287A TW 201437287 A TW201437287 A TW 201437287A TW 103105211 A TW103105211 A TW 103105211A TW 103105211 A TW103105211 A TW 103105211A TW 201437287 A TW201437287 A TW 201437287A
Authority
TW
Taiwan
Prior art keywords
group
organopolyoxane
curable resin
resin composition
block
Prior art date
Application number
TW103105211A
Other languages
Chinese (zh)
Inventor
Nao Sato
Kazunori Ishikawa
Original Assignee
Yokohama Rubber Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yokohama Rubber Co Ltd filed Critical Yokohama Rubber Co Ltd
Publication of TW201437287A publication Critical patent/TW201437287A/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/56Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/12Polysiloxanes containing silicon bound to hydrogen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/20Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42Block-or graft-polymers containing polysiloxane sequences
    • C08G77/442Block-or graft-polymers containing polysiloxane sequences containing vinyl polymer sequences
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52Encapsulations
    • H01L33/56Materials, e.g. epoxy or silicone resin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Engineering & Computer Science (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)

Abstract

Provided is a curable resin composition having excellent adhesiveness, especially adhesiveness after a moisture resistance reflow test. This curable resin composition contains: (A) a branched organopolysiloxane having an alkenyl group (B) a linear organopolysiloxane having at least two silicon atom-linked hydrogen atoms per molecule (C) a block copolymer containing (c1) a polysiloxane block and (c2) a hydrocarbon polymer block and (D) a catalyst for a hydrosilylation reaction.

Description

硬化性樹脂組成物 Curable resin composition

本發明係有關一種硬化性樹脂組成物。 The present invention relates to a curable resin composition.

以往已知一種含矽樹脂之硬化性樹脂組成物,其係例如作為光學半導體密封用組成物使用。 A curable resin composition containing a hydrazine resin has been known, and is used, for example, as a composition for optical semiconductor sealing.

例如,專利文獻1[請求項1]中記載有「一種硬化性有機聚矽氧烷組成物,其至少包括(A)一分子中至少具有3個烯基、鍵結於矽原子鍵結之全部有機基之至少30莫耳%為芳基之支鏈狀有機聚矽氧烷;(B)分子鏈兩末端由二有機氫矽氧基封端、具有芳基之直鏈狀有機聚矽氧烷......;(C)一分子中至少具有3個二有機氫矽氧基、鍵結於矽原子鍵結之全部有機基之至少15莫耳%為芳基之支鏈狀有機聚矽氧烷......;以及(D)矽氫化反應用觸媒......」。 For example, Patent Document 1 [Request 1] discloses "a curable organopolyoxane composition comprising at least (A) at least three alkenyl groups in one molecule and bonded to a ruthenium atom bond. a branched organopolyoxane having at least 30 mol% of an organic group as an aryl group; (B) a linear organopolyoxane having an aryl group at both ends of the molecular chain and terminated by a diorganohydroquinoneoxy group (C) a branched organopoly group having at least 3 diorganohydroquinoneoxy groups in one molecule and at least 15 mol% of all organic groups bonded to the ruthenium atom bonded to an aryl group a siloxane (...) and (D) a catalyst for hydrogenation reaction...".

[習知技術文獻] [Practical Technical Literature] [專利文獻] [Patent Literature]

[專利文獻1]日本特開2010-1336號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2010-1336

近年來,對於含矽樹脂之硬化性樹脂組成物所要求之性能等級不斷提高,例如要求其對被接著體具有更佳密著性。 In recent years, the performance level required for the curable resin composition containing an anthracene resin has been increasing, for example, it is required to have better adhesion to the adherend.

尤其於高濕度環境下長時間放置後進行迴焊試驗(耐濕迴焊試驗)時,亦要求顯現優異之密著性。 In particular, when the reflow test (wet resistance reflow test) is carried out after standing for a long time in a high-humidity environment, it is also required to exhibit excellent adhesion.

本發明係鑒於以上要點而完成,其目的係提供一種密著性、尤其耐濕迴焊試驗後之密著性優異之硬化性樹脂組成物。 The present invention has been made in view of the above points, and an object thereof is to provide a curable resin composition excellent in adhesion, particularly in adhesion after wet-resistance reflow test.

本發明人等為達成上述目的深入研究之結果,發現藉由於硬化性樹脂組成物中調配特定嵌段共聚物,能使耐濕迴焊試驗後之密著性良好,因而完成本發明。 As a result of intensive studies to achieve the above object, the present inventors have found that the adhesion of the specific block copolymer to the curable resin composition can improve the adhesion after the wet reflow test, and thus the present invention has been completed.

亦即,本發明提供以下之(I)~(V)。 That is, the present invention provides the following (I) to (V).

(I)一種硬化性樹脂組成物,其係含具有烯基之支鏈狀有機聚矽氧烷(A)、一分子中至少具有2個鍵結於矽原子之氫原子之直鏈狀有機聚矽氧烷(B)、含聚矽氧烷嵌段(c1)與烴系聚合物嵌段(c2)之嵌段共聚物(C)、以及矽氫化反應用觸媒(D)。 (I) A curable resin composition comprising a branched organopolysiloxane having an alkenyl group (A) and a linear organopoly group having at least two hydrogen atoms bonded to a halogen atom in one molecule A siloxane (B), a block copolymer (C) containing a polyoxyalkylene block (c1) and a hydrocarbon-based polymer block (c2), and a catalyst (D) for hydrogenation reaction.

(II)如上述(I)所記載之硬化性樹脂組成物,其中上述烴系聚合物嵌段(c2)係含(甲基)丙烯系聚合物嵌段及/或異丁烯系聚合物嵌段。 (II) The curable resin composition according to the above (I), wherein the hydrocarbon-based polymer block (c2) contains a (meth) propylene-based polymer block and/or an isobutylene-based polymer block.

(III)如上述(I)或(II)所記載之硬化性樹脂組成物,其中上述嵌段共聚物(C)中,上述聚矽氧烷嵌段(c1)與烴系聚合物嵌段(c2)之質量比(c1/c2)為20/80~80/20。 (III) The curable resin composition according to the above (I) or (II), wherein the block copolymer (C), the polyoxyalkylene block (c1) and the hydrocarbon-based polymer block ( The mass ratio (c1/c2) of c2) is 20/80~80/20.

(IV)如上述(I)~(III)中任一項所記載之硬化性樹脂組成物,其中上述支鏈狀有機聚矽氧烷(A)係以下述平均單位式(1)表示之有機聚矽氧烷,(R1SiO3/2)a(R1 2SiO2/2)b(R1 3SiO1/2)c(SiO4/2)d(X1O1/2)e…(1) The curable resin composition according to any one of the above-mentioned (1), wherein the branched organopolyoxane (A) is organic represented by the following average unit formula (1). Polyoxane, (R 1 SiO 3/2 ) a (R 1 2 SiO 2/2 ) b (R 1 3 SiO 1/2 ) c (SiO 4/2 ) d (X 1 O 1/2 ) e …(1)

(式(1)中,各R1獨自為取代或非取代之一價烴基,惟一分子中R1之至少1個為烯基,R1之至少1個為芳基,式(1)中,X1為氫原子或烷基。 (In the formula (1), each R 1 is a substituted or unsubstituted monovalent hydrocarbon group, and at least one of R 1 in the sole molecule is an alkenyl group, and at least one of R 1 is an aryl group, in the formula (1), X 1 is a hydrogen atom or an alkyl group.

式(1)中,a為正數,b為0或正數,c為0或正數,d為0或正數,e為0或正數,且b/a為0~10範圍內之數,c/a為0~5範圍內之數,d/(a+b+c+d)為0~0.3範圍內之數,e/(a+b+c+d)為0~0.4範圍內之數)。 In the formula (1), a is a positive number, b is 0 or a positive number, c is 0 or a positive number, d is 0 or a positive number, e is 0 or a positive number, and b/a is a number in the range of 0 to 10, c/a For the range of 0 to 5, d/(a+b+c+d) is a number in the range of 0 to 0.3, and e/(a+b+c+d) is a number in the range of 0 to 0.4).

(V)如上述(I)~(IV)中任一項所記載之硬化性樹脂組成物,其係光學半導體元件密封用組成物。 (V) The curable resin composition according to any one of the above (1) to (IV), which is a composition for sealing an optical semiconductor element.

根據本發明,可提供一種密著性、尤其是耐 濕迴焊試驗後之密著性優異之硬化性樹脂組成物。 According to the present invention, it is possible to provide a kind of adhesion, especially resistance A curable resin composition excellent in adhesion after the wet reflow test.

本發明之硬化性樹脂組成物(以下亦稱為「本發明之組成物」)係含有下述成分之硬化性樹脂組成物:含具有烯基之支鏈狀有機聚矽氧烷(A)、一分子中至少具有2個鍵結於矽原子之氫原子之直鏈狀有機聚矽氧烷(B)、含聚矽氧烷嵌段(c1)與烴系聚合物嵌段(c2)之嵌段共聚物(C)、以及矽氫化反應用觸媒(D)。 The curable resin composition of the present invention (hereinafter also referred to as "the composition of the present invention") is a curable resin composition containing a branched chain organopolyoxane (A) having an alkenyl group, a linear organopolyoxane (B) having at least two hydrogen atoms bonded to a halogen atom in one molecule, and a polyoxyalkylene-containing block (c1) and a hydrocarbon-based polymer block (c2) The segment copolymer (C) and the catalyst (D) for hydrogenation reaction.

以下針對本發明之組成物所含有之各成分進行詳細說明。 Hereinafter, each component contained in the composition of the present invention will be described in detail.

<支鏈狀有機聚矽氧烷(A)> <branched organopolyoxane (A)>

支鏈狀有機聚矽氧烷(A)係具有烯基之支鏈狀有機聚矽氧烷。 The branched organopolyoxane (A) is a branched organopolyoxane having an alkenyl group.

作為該烯基,例如可列舉乙烯基、烯丙基、丁烯基、戊烯基、己烯基、辛烯基等之碳數2~18之烯基,較佳為乙烯基(以下有時以「Vi」表示)。 Examples of the alkenyl group include an alkenyl group having 2 to 18 carbon atoms such as a vinyl group, an allyl group, a butenyl group, a pentenyl group, a hexenyl group or an octenyl group, and a vinyl group (hereinafter sometimes referred to as a vinyl group). Expressed as "Vi").

一分子中之烯基較好為2~12質量%,更好為3~10質量%。 The alkenyl group in one molecule is preferably from 2 to 12% by mass, more preferably from 3 to 10% by mass.

支鏈狀有機聚矽氧烷(A)較好至少具有1個芳基,更好鍵結於矽原子之全部有機基之至少30莫耳%為芳基,又更佳至少40莫耳%為芳基。 The branched organopolyoxane (A) preferably has at least one aryl group, more preferably at least 30 mol% of the total organic groups bonded to the fluorene atom, and more preferably at least 40 mol%. Aryl.

作為該芳基,例如可列舉苯基、甲苯基、二甲苯基等之碳數6~18之芳基,較佳為苯基。 The aryl group may, for example, be an aryl group having 6 to 18 carbon atoms such as a phenyl group, a tolyl group or a xylyl group, and is preferably a phenyl group.

由此,所得硬化物之因光的折射、反射、散射等所致之衰減將變小,且於後述之直鏈狀有機聚矽氧烷(B)同樣具有芳基時,與該直鏈狀有機聚矽氧烷(B)之相溶性優異,渾濁等受到抑制,硬化物之透明性優異。 Thereby, the attenuation of the obtained cured product due to refraction, reflection, scattering, and the like of light is reduced, and when the linear organopolyoxane (B) described later has an aryl group as well, the linear form The organic polyoxyalkylene (B) is excellent in compatibility, turbidity and the like are suppressed, and the cured product is excellent in transparency.

作為支鏈狀有機聚矽氧烷(A)中之鍵結於其他矽原子之基,例如可列舉除烯基及芳基以外之取代或非取代之一價烴基,具體可列舉例如甲基、乙基、正丙基、異丙基、正丁基、異丁基、第二丁基、第三丁基、各種戊基、各種己基、各種辛基、各種癸基、環戊基、環己基等之碳數1~18之烷基;苯甲基、苯乙基等之碳數7~18之芳烷基;3-氯丙基、3,3,3-三氟丙基等之碳數1~18之鹵化烷基;等,作為其他少量基,亦可具有鍵結於矽原子之羥基以及鍵結於矽原子之烷氧基。作為該烷氧基,例如可列舉甲氧基、乙氧基、丙氧基、丁氧基等。 Examples of the group bonded to the other ruthenium atom in the branched organopolyoxane (A) include, for example, a substituted or unsubstituted one-valent hydrocarbon group other than the alkenyl group and the aryl group, and specific examples thereof include a methyl group. Ethyl, n-propyl, isopropyl, n-butyl, isobutyl, t-butyl, tert-butyl, various pentyl groups, various hexyl groups, various octyl groups, various fluorenyl groups, cyclopentyl groups, cyclohexyl groups An alkyl group having 1 to 18 carbon atoms; an aralkyl group having 7 to 18 carbon atoms such as benzyl group or phenethyl group; and a carbon number of 3-chloropropyl group, 3,3,3-trifluoropropyl group or the like a halogenated alkyl group of 1 to 18; etc., as other small amount groups, may have a hydroxyl group bonded to a halogen atom and an alkoxy group bonded to a halogen atom. Examples of the alkoxy group include a methoxy group, an ethoxy group, a propoxy group, and a butoxy group.

此種支鏈狀有機聚矽氧烷(A)較好係以下述平均單位式(1)表示之有機聚矽氧烷。 Such a branched organopolyoxane (A) is preferably an organopolyoxane represented by the following average unit formula (1).

(R1SiO3/2)a(R1 2SiO2/2)b(R1 3SiO1/2)c(SiO4/2)d(X1O1/2)e…(1) (R 1 SiO 3/2 ) a (R 1 2 SiO 2/2 ) b (R 1 3 SiO 1/2 ) c (SiO 4/2 ) d (X 1 O 1/2 ) e (1)

式(1)中,各R1獨自為取代或非取代之一價烴基。作為該一價烴基,例如可列舉甲基、乙基、正丙基、異丙基、正丁基、異丁基、第二丁基、第三丁基、各種戊基、各種己基、各種辛基、各種癸基、環戊基、環己基等之碳數1~18之烷基;乙烯基、烯丙基、丁烯基、戊 烯基、己烯基、辛烯基等之碳數2~18之烯基;苯基、甲苯基、二甲苯基等之碳數6~18之芳基;苯甲基、苯乙基等之碳數7~18之芳烷基;3-氯丙基、3,3,3-三氟丙基等之碳數1~18之鹵化烷基;等。 In the formula (1), each R 1 is independently a substituted or unsubstituted one-valent hydrocarbon group. Examples of the monovalent hydrocarbon group include a methyl group, an ethyl group, a n-propyl group, an isopropyl group, a n-butyl group, an isobutyl group, a second butyl group, a t-butyl group, various pentyl groups, various hexyl groups, and various octane groups. a carbon number of 1 to 18, such as a fluorenyl group, a cyclopentyl group, a cyclohexyl group or the like; a carbon number of a vinyl group, an allyl group, a butenyl group, a pentenyl group, a hexenyl group, an octenyl group or the like Alkenyl group of ~18; aryl group having 6 to 18 carbon atoms such as phenyl group, tolyl group or xylyl group; aralkyl group having 7 to 18 carbon atoms such as benzyl group and phenethyl group; 3-chloropropyl group a halogenated alkyl group having 1 to 18 carbon atoms such as 3,3,3-trifluoropropyl group;

其中,一分子中R1之至少1個為烯基,為烯基的R1較好為2~12質量%之量,更好為3~10質量%。 Among them, at least one of R 1 in one molecule is an alkenyl group, and R 1 which is an alkenyl group is preferably from 2 to 12% by mass, more preferably from 3 to 10% by mass.

此外,一分子中,較好R1之至少1個為芳基,更好全部R1之至少30莫耳%為芳基,又更好至少40莫耳%為芳基。 Further, in one molecule, preferably at least one of R 1 is an aryl group, more preferably at least 30 mol % of all R 1 is an aryl group, and more preferably at least 40 mol% is an aryl group.

式(1)中,X1為氫原子或烷基。作為該烷基,例如可列舉甲基、乙基、正丙基、異丙基、正丁基、異丁基、第二丁基、第三丁基、各種戊基、各種己基、各種辛基、各種癸基、環戊基、以及環己基等之碳數1~18之烷基,較佳為甲基。 In the formula (1), X 1 is a hydrogen atom or an alkyl group. Examples of the alkyl group include a methyl group, an ethyl group, a n-propyl group, an isopropyl group, a n-butyl group, an isobutyl group, a second butyl group, a third butyl group, various pentyl groups, various hexyl groups, and various octyl groups. And an alkyl group having 1 to 18 carbon atoms, such as a mercapto group, a cyclopentyl group, and a cyclohexyl group, preferably a methyl group.

式(1)中,a為正數,b為0或正數,c為0或正數,d為0或正數,e為0或正數,且b/a為0~10範圍內之數,c/a為0~5範圍內之數,d/(a+b+c+d)為0~0.3範圍內之數,e/(a+b+c+d)為0~0.4範圍內之數。 In the formula (1), a is a positive number, b is 0 or a positive number, c is 0 or a positive number, d is 0 or a positive number, e is 0 or a positive number, and b/a is a number in the range of 0 to 10, c/a For the range of 0 to 5, d/(a+b+c+d) is a number in the range of 0 to 0.3, and e/(a+b+c+d) is a number in the range of 0 to 0.4.

支鏈狀有機聚矽氧烷(A)之重量平均分子量(Mw)較好為1,000~300,000,更好為2,000~100,000。 The weight average molecular weight (Mw) of the branched organopolyoxane (A) is preferably from 1,000 to 300,000, more preferably from 2,000 to 100,000.

本發明中,重量平均分子量指藉由以氯仿為溶劑之凝膠滲透層析儀(GPC)所測之聚苯乙烯換算之重量平均分子量。 In the present invention, the weight average molecular weight means a weight average molecular weight in terms of polystyrene measured by a gel permeation chromatography (GPC) using chloroform as a solvent.

另外,支鏈狀有機聚矽氧烷(A)為非常黏稠之半固狀物或固狀物,難以測定黏度。 Further, the branched organopolyoxane (A) is a very viscous semi-solid or solid, and it is difficult to measure the viscosity.

<直鏈狀有機聚矽氧烷(B)> <linear organic polyoxane (B)>

直鏈狀有機聚矽氧烷(B)為一分子中至少具有2個鍵結於矽原子之氫原子之有機聚矽氧烷。直鏈狀有機聚矽氧烷(B)只要主要為直鏈狀,則亦可具有少量(例如未達全部矽氧烷單位之2莫耳%)分支。 The linear organopolyoxane (B) is an organic polyoxyalkylene having at least two hydrogen atoms bonded to a halogen atom in one molecule. The linear organopolyoxane (B) may have a small amount (for example, less than 2 mol% of the total oxane unit) branch as long as it is mainly linear.

直鏈狀有機聚矽氧烷(B)對上述支鏈狀有機聚矽氧烷(A)之烯基進行加成反應(矽氫化反應)。此時,由於直鏈狀有機聚矽氧烷(B)至少具有2個鍵結於矽原子之氫原子(Si-H),因此可作為支鏈狀有機聚矽氧烷(A)間之交聯劑發揮作用。 The linear organopolyoxane (B) is subjected to an addition reaction (hydrazine hydrogenation reaction) to the alkenyl group of the above branched organopolyoxane (A). In this case, since the linear organopolyoxane (B) has at least two hydrogen atoms (Si-H) bonded to a halogen atom, it can be used as a branch between the branched organopolyoxane (A). The linker works.

直鏈狀有機聚矽氧烷(B)之聚合度較好超過10,更好超過30,有更好超過30且1,000以下,尤佳為超過30且500以下。由此,本發明之組成物之密著性更優異。其原因認為係藉由含高分子成分,使硬化物將產生韌性之故。此外,作業性亦變得良好。 The degree of polymerization of the linear organopolyoxane (B) is preferably more than 10, more preferably more than 30, more preferably more than 30 and 1,000 or less, still more preferably more than 30 and less than 500. Thereby, the composition of the present invention is more excellent in adhesion. The reason for this is considered to be that the hardened material will have toughness by containing a polymer component. In addition, workability has also become good.

基於使所得之硬化物因光折射、反射、散射等所致之衰減減小,直鏈狀有機聚矽氧烷(B)較好至少具有1個芳基,更好鍵結於矽原子之全部有機基之至少30莫耳%為芳基,又更佳至少40莫耳%為芳基。 The linear organopolyoxane (B) preferably has at least one aryl group, more preferably bonded to all of the ruthenium atoms, based on the reduction of the attenuation of the resulting cured product due to light refraction, reflection, scattering, and the like. At least 30 mole % of the organic group is an aryl group, and more preferably at least 40 mole % is an aryl group.

作為該芳基,例如可列舉苯基、甲苯基、二甲苯基等之碳數6~18之芳基,較佳為苯基。 The aryl group may, for example, be an aryl group having 6 to 18 carbon atoms such as a phenyl group, a tolyl group or a xylyl group, and is preferably a phenyl group.

作為直鏈狀有機聚矽氧烷(B)中之與矽原子鍵結之基,例如可列舉不具有脂肪族不飽和基之取代或非取代之一價烴基,具體可列舉為例如甲基、乙基、正丙基、異丙基、正丁基、異丁基、第二丁基、第三丁基、各種戊基、各種己基、各種辛基、各種癸基、環戊基、環己基等之碳數1~18之烷基;苯基、甲苯基、二甲苯基等之碳數6~18之芳基;苯甲基、苯乙基等之碳數7~18之芳烷基;3-氯丙基、3,3,3-三氟丙基等之碳數1~18之鹵化烷基;等。 Examples of the group bonded to the ruthenium atom in the linear organopolyoxane (B) include, for example, a substituted or unsubstituted one-valent hydrocarbon group having no aliphatic unsaturated group, and specific examples thereof include a methyl group. Ethyl, n-propyl, isopropyl, n-butyl, isobutyl, t-butyl, tert-butyl, various pentyl groups, various hexyl groups, various octyl groups, various fluorenyl groups, cyclopentyl groups, cyclohexyl groups An alkyl group having 1 to 18 carbon atoms; an aryl group having 6 to 18 carbon atoms such as a phenyl group, a tolyl group or a xylyl group; an aralkyl group having 7 to 18 carbon atoms such as a benzyl group or a phenethyl group; a halogenated alkyl group having 1 to 18 carbon atoms such as 3-chloropropyl group, 3,3,3-trifluoropropyl group or the like;

作為此種直鏈狀有機聚矽氧烷(B),較好為分子鏈兩末端由二有機氫矽氧基封端之直鏈狀有機聚矽氧烷,例如可列舉以下述式(2)表示之有機聚矽氧烷,HR2 2SiO(R2 2SiO)nSiR2 2H‧‧‧(2) The linear organopolyoxane (B) is preferably a linear organopolyoxane whose both ends of the molecular chain are blocked by a diorganohydroquinoneoxy group, and examples thereof include the following formula (2). The organic polyoxane represented by HR 2 2 SiO(R 2 2 SiO) n SiR 2 2 H‧‧‧(2)

式(2)中,各R2獨自為不具有脂肪族不飽和鍵之取代或非取代之一價烴基。作為R2之一價烴基,可列舉例如甲基、乙基、正丙基、異丙基、正丁基、異丁基、第二丁基、第三丁基、各種戊基、各種己基、各種辛基、各種癸基、環戊基、環己基等之碳數1~18之烷基;苯基、甲苯基、二甲苯基等之碳數6~18之芳基;苯甲基、苯乙基等之碳數7~18之芳烷基;3-氯丙基、3,3,3-三氟丙基等之碳數1~18之鹵化烷基;等,其中較佳為碳數1~18之烷基,更佳為甲基(以下有時以「Me」表示)。 In the formula (2), each R 2 is independently a substituted or unsubstituted one-valent hydrocarbon group having no aliphatic unsaturated bond. Examples of the monovalent hydrocarbon group of R 2 include a methyl group, an ethyl group, a n-propyl group, an isopropyl group, a n-butyl group, an isobutyl group, a second butyl group, a t-butyl group, various pentyl groups, and various hexyl groups. Alkyl groups having 1 to 18 carbon atoms such as various octyl groups, various fluorenyl groups, cyclopentyl groups and cyclohexyl groups; aryl groups having 6 to 18 carbon atoms such as phenyl, tolyl or xylyl; benzyl and benzene An aralkyl group having 7 to 18 carbon atoms such as an ethyl group; a halogenated alkyl group having 1 to 18 carbon atoms such as 3-chloropropyl group, 3,3,3-trifluoropropyl group or the like; etc., among which carbon number is preferred. The alkyl group of 1 to 18 is more preferably a methyl group (hereinafter sometimes referred to as "Me").

另外,較好R2之至少1個為芳基,更好至少30莫耳%為芳基,又更好至少40莫耳%為芳基。芳基為碳數 6~18之芳基,較好為苯基(以下有時以「Ph」表示)。 Further, it is preferred that at least one of R 2 is an aryl group, more preferably at least 30 mol % is an aryl group, and still more preferably at least 40 mol % is an aryl group. The aryl group is an aryl group having 6 to 18 carbon atoms, preferably a phenyl group (hereinafter sometimes referred to as "Ph").

式(2)中,n為1以上之整數,較好為超過10之整數,更好為超過30之整數,又更好為超過30且1,000以下之整數,尤佳為超過30且500以下之整數。若n為上述範圍,則密著性更優異。 In the formula (2), n is an integer of 1 or more, preferably an integer of more than 10, more preferably an integer of more than 30, more preferably an integer of more than 30 and 1,000 or less, and particularly preferably more than 30 and less than 500. Integer. When n is in the above range, the adhesion is more excellent.

基於硬化物可產生韌性之理由,直鏈狀有機聚矽氧烷(B)之重量平均分子量(Mw)較好為500~1,000,000,更好為1,000~30,000。 The weight average molecular weight (Mw) of the linear organopolyoxane (B) is preferably from 500 to 1,000,000, more preferably from 1,000 to 30,000, based on the reason that the cured product can produce toughness.

此外,直鏈狀有機聚矽氧烷(B)之於25℃之黏度較好為20~1,000,000mPa.s,更佳為200~100,000mPa.s。 In addition, the viscosity of the linear organopolyoxane (B) at 25 ° C is preferably 20 ~ 1,000,000 mPa. s, more preferably 200~100,000mPa. s.

另外,本發明中,黏度係指依據JISK7117-1之4.1(Brookfield形旋轉黏度計),於25℃下測定之黏度。 Further, in the present invention, the viscosity means a viscosity measured at 25 ° C according to 4.1 (Brookfield-type rotational viscometer) of JIS K7117-1.

(直鏈狀有機聚矽氧烷(B)之製造方法) (Method for producing linear organopolyoxane (B))

作為直鏈狀有機聚矽氧烷(B)之製造方法,並無特別限定,例如可列舉以下方法:使一分子中具有2個以上矽醇基之有機聚矽氧烷(b1)與具有鍵結於矽原子之氫原子之二矽氧烷(b2)進行反應,生成作為副生成物之水(H2O),藉由任意使該反應後殘留之矽醇基進行脫水縮合,從而獲得上述聚矽氧烷(B)作為主生成物。 The method for producing the linear organopolyoxane (B) is not particularly limited, and examples thereof include a method of forming an organopolyoxane (b1) having two or more sterol groups in one molecule and having a bond. The dioxane (b2) which is a hydrogen atom of a halogen atom is reacted to form water (H 2 O) as a by-product, and the sterol group remaining after the reaction is dehydrated and condensed to obtain the above Polyoxyalkylene (B) is used as the main product.

此時,例如可藉由1H-NMR進行反應追蹤,確認到源自有機聚矽氧烷(b1)所具有之矽醇基之峰消失,或者確認到出現源自反應中使用成分以外之成分的峰 出現,可視為已獲得含主生成物的直鏈狀有機聚矽氧烷(B)及副生成物之反應生成物,並視為反應結束。 In this case, for example, the reaction can be traced by 1 H-NMR, and it is confirmed that the peak derived from the sterol group of the organopolyoxane (b1) disappears, or the component derived from the component used in the reaction is confirmed to be present. The appearance of a peak can be regarded as a reaction product of a linear organopolyoxane (B) containing a main product and a by-product, and is considered to be the end of the reaction.

作為上述反應中使用之有機聚矽氧烷(b1),例如可列舉以下述式(3)表示之有機聚矽氧烷,此外,作為二矽氧烷(b2),例如可列舉以下述式(4)表示之二矽氧烷。 The organopolyoxane (b1) to be used in the above-mentioned reaction is, for example, an organic polyoxane represented by the following formula (3), and examples of the dioxane (b2) include the following formula ( 4) Indicates dioxane.

HO(R2 2SiO)mH‧‧‧(3) HO(R 2 2 SiO) m H‧‧‧(3)

HR2 2SiOSiR2 2H‧‧‧(4) HR 2 2 SiOSiR 2 2 H‧‧‧(4)

且,式(3)及式(4)中,R2與上述R2同義。又,式(3)中,m為上述n以下之整數。 Further, in the formulas (3) and (4), R 2 has the same meaning as the above R 2 . Further, in the formula (3), m is an integer of the above n or less.

上述製造方法中,例如以源自於式(4)二矽氧烷(b2)之-SiR2 2H,對式(3)之有機聚矽氧烷(b1)所具有之矽醇基之一部份進行封端,使殘留矽醇基進行縮合,而高分子化。因此,直鏈狀有機聚矽氧烷(B)之聚合度與二矽氧烷(b2)之饋入量有關。 In the above production method, for example, one of the sterol groups of the organopolyoxane (b1) of the formula (3) is derived from -SiR 2 2 H derived from the dioxane (b2) of the formula (4). Part of the blocking is carried out to condense the residual sterol group and polymerize. Therefore, the degree of polymerization of the linear organopolyoxane (B) is related to the amount of dioxane (b2) fed.

上述反應中之各成分調配比,較好相對於有機聚矽氧烷(b1)中之矽醇基10莫耳,二矽氧烷(b2)為0.001~0.2莫耳之量。 The compounding ratio of each component in the above reaction is preferably from 10 mol of the sterol group in the organopolyoxane (b1), and the amount of the dioxane (b2) is from 0.001 to 0.2 mol.

上述反應較好藉由攪拌進行。攪拌時,例如較好於50~65℃溫度範圍加熱,且,攪拌時間(反應時間)較好為例如1~5小時。 The above reaction is preferably carried out by stirring. When stirring, for example, it is preferably heated in a temperature range of 50 to 65 ° C, and the stirring time (reaction time) is preferably, for example, 1 to 5 hours.

關於直鏈狀有機聚矽氧烷(B)之含量,較好相對於上述支鏈狀有機聚矽氧烷(A)100質量份,為20~60質量份,更好為30~50質量份。若直鏈狀有機聚矽 氧烷(B)之含量為此範圍,則本發明之組成物之硬化性優異,且密著性亦更優異。 The content of the linear organopolyoxane (B) is preferably from 20 to 60 parts by mass, more preferably from 30 to 50 parts by mass, per 100 parts by mass of the branched organopolyoxane (A). . Linear organic poly When the content of the oxyalkylene (B) is in this range, the composition of the present invention is excellent in hardenability and more excellent in adhesion.

<嵌段共聚物(C)> <Block copolymer (C)>

本發明之組成物中所含有之嵌段共聚物(C)為含聚矽氧烷嵌段(c1)與烴系聚合物嵌段(c2)之嵌段共聚物(block copolymer)。 The block copolymer (C) contained in the composition of the present invention is a block copolymer containing a polyoxyalkylene block (c1) and a hydrocarbon-based polymer block (c2).

此種嵌段共聚物(C)例如可藉由以下方式獲得:使具有末端反應基之聚矽氧烷(c1')、與具有可與上述末端反應基反應之末端基之烴系聚合物(c2'),於上述末端反應基與上述末端基進行反應之條件下進行反應,形成含聚矽氧烷嵌段(c1)與烴系聚合物嵌段(c2)之共聚物鏈。 Such a block copolymer (C) can be obtained, for example, by a polyalkylene oxide (c1') having a terminal reactive group and a hydrocarbon-based polymer having a terminal group reactive with the above-mentioned terminal reactive group ( C2') The reaction is carried out under the conditions in which the terminal reaction group is reacted with the terminal group to form a copolymer chain containing the polyoxyalkylene block (c1) and the hydrocarbon-based polymer block (c2).

作為獲得嵌段共聚物(C)之方法,例如可列舉:使用矽氫化反應用觸媒,使上述末端反應基為鍵結於矽原子之氫原子(Si-H)之聚矽氧烷(c1')與上述末端基為烯基之烴系聚合物(c2')進行矽氫化反應之方法;使上述末端反應基為烯基之聚矽氧烷(c1')與上述末端基為鍵結於矽原子之氫原子(Si-H)之烴系聚合物(c2'),同樣進行矽氫化反應之方法;等。此時,作為矽氫化反應用觸媒,可使用後述之矽氫化反應用觸媒(D)。 As a method of obtaining the block copolymer (C), for example, a catalyst for hydrogenation reaction is used, and the terminal reactive group is a polyoxyalkylene (c1) bonded to a hydrogen atom (Si-H) of a halogen atom (c1). a method of performing a hydrazine hydrogenation reaction with the above-mentioned terminal group-based alkenyl group-based hydrocarbon polymer (c2'); bonding the above-mentioned terminal reactive group to an alkenyl group polyoxyalkylene oxide (c1') to the above terminal group A hydrocarbon-based polymer (c2') of a hydrogen atom (Si-H) of a halogen atom, a method of performing a hydrogenation reaction in the same manner; In this case, as the catalyst for the hydrogenation reaction, a catalyst (D) for hydrogenation reaction described later can be used.

本發明之組成物中,同時使用上述支鏈狀有機聚矽氧烷(A)及直鏈狀有機聚矽氧烷(B),且含此種嵌段共聚物(C),因此密著性、尤其是耐濕迴焊試驗 後之密著性優異。作為其理由認為如下。 In the composition of the present invention, the branched organopolysiloxane (A) and the linear organopolyoxane (B) are used together, and the block copolymer (C) is contained, so the adhesion is Especially the wet reflow test After the adhesion is excellent. The reason for this is considered as follows.

首先,由於嵌段共聚物(C)含聚矽氧烷嵌段(c1),因此對於上述支鏈狀有機聚矽氧烷(A)及直鏈狀有機聚矽氧烷(B)之相溶性高,能夠融入。 First, since the block copolymer (C) contains a polyoxyalkylene block (c1), compatibility with the above-mentioned branched organopolyoxane (A) and linear organopolyoxane (B) High, able to integrate.

其次,嵌段共聚物(C)雖含異丁烯系聚合物嵌段或(甲基)丙烯系聚合物嵌段等之烴系聚合物嵌段(c2),該等烴系聚合物嵌段(c2)中由於亦有主鏈係由烴鏈組成,且於側鏈亦有多數烴基之情況,故與聚矽氧烷相較,相對而言耐濕性較高(水蒸氣透過性低),因此認為本發明之組成物之硬化物即使於高濕度環境下,亦可抑制水分侵入,從而耐濕迴焊試驗後之密著性良好。 Next, the block copolymer (C) contains a hydrocarbon-based polymer block (c2) such as an isobutylene polymer block or a (meth) propylene-based polymer block, and the hydrocarbon-based polymer blocks (c2) In addition, since the main chain is composed of a hydrocarbon chain and a plurality of hydrocarbon groups are also present in the side chain, the moisture resistance is relatively high (the water vapor permeability is low) as compared with the polysiloxane. It is considered that the cured product of the composition of the present invention can suppress the intrusion of moisture even in a high-humidity environment, and the adhesion after the wet reflow-resistant test is good.

相對於此,若本發明之組成物中例如僅含未經嵌段共聚物化之聚異丁烯替代嵌段共聚物(C)時,則該聚合物不會融入支鏈狀有機聚矽氧烷(A)及直鏈狀有機聚矽氧烷(B)中,其成為離析狀態,因此抑制水分侵入硬化物之效果降低。此外,該聚合物與矽氧的支鏈狀有機聚矽氧烷(A)及直鏈狀有機聚矽氧烷(B)之相溶性不佳,因此硬化物渾濁,透明性差。 On the other hand, if the composition of the present invention contains, for example, only the polyisobutylene which is not block copolymerized in place of the block copolymer (C), the polymer does not blend into the branched organopolyoxane (A). In the linear organopolyoxane (B), since it is in an isolated state, the effect of suppressing moisture from entering the cured product is lowered. Further, since the polymer has poor compatibility with the branched organopolyoxane (A) and the linear organopolyoxane (B), the cured product is cloudy and has poor transparency.

(聚矽氧烷嵌段(c1)) (polyoxyalkylene block (c1))

嵌段共聚物(C)所含之聚矽氧烷嵌段(c1)具有由複數個矽氧烷單位所成之聚矽氧烷結構。另外,聚矽氧烷嵌段(c1)只要主要為直鏈狀,則亦可具有少量(例如未達全部矽氧烷單位之2莫耳%)分支。 The polyoxyalkylene block (c1) contained in the block copolymer (C) has a polyoxyalkylene structure composed of a plurality of units of a siloxane. Further, the polyoxyalkylene block (c1) may have a small amount (for example, less than 2 mol% of all units of helium oxide) branched as long as it is mainly linear.

聚矽氧烷嵌段(c1)如上所述,例如係源自具有上述末端反應基之聚矽氧烷(c1')。作為聚矽氧烷(c1')所具有之上述末端反應基,例如可列舉鍵結於矽原子之氫原子(Si-H);以及乙烯基、烯丙基、丁烯基、戊烯基、己烯基、辛烯基等之碳數2~18之烯基;等。 The polyoxyalkylene block (c1) is as described above, for example, derived from a polyoxyalkylene (c1') having the above terminal reactive group. Examples of the terminal reactive group of the polyoxyalkylene oxide (c1′) include a hydrogen atom (Si—H) bonded to a halogen atom; and a vinyl group, an allyl group, a butenyl group, a pentenyl group, and the like. An alkenyl group such as a hexenyl group or an octenyl group having 2 to 18 carbon atoms;

作為此種聚矽氧烷(c1'),例如可適當列舉以下述式(5)表示之聚矽氧烷。 As such a polyoxyalkylene (c1'), for example, a polyoxyalkylene represented by the following formula (5) can be suitably used.

R32R31 2SiO(R31 2SiO)kSiR31 2R32‧‧‧(5) R 32 R 31 2 SiO(R 31 2 SiO) k SiR 31 2 R 32 ‧‧‧(5)

式(5)中,R31獨自為氫原子或取代或非取代之一價烴基。作為該一價烴基,例如可列舉甲基、乙基、正丙基、異丙基、正丁基、異丁基、第二丁基、第三丁基、各種戊基、各種己基、各種辛基、各種癸基、環戊基、環己基等之碳數1~18之烷基;乙烯基、烯丙基、丁烯基、戊烯基、己烯基、辛烯基等之碳數2~18之烯基;苯基、甲苯基、二甲苯基等之碳數6~18之芳基;苯甲基、苯乙基等之碳數7~18之芳烷基;3-氯丙基、3,3,3-三氟丙基等之碳數1~18之鹵化烷基;等,其中,較佳為碳數1~18之烷基、碳數6~18之芳基,更好為甲基、苯基。 In the formula (5), R 31 is independently a hydrogen atom or a substituted or unsubstituted one-valent hydrocarbon group. Examples of the monovalent hydrocarbon group include a methyl group, an ethyl group, a n-propyl group, an isopropyl group, a n-butyl group, an isobutyl group, a second butyl group, a t-butyl group, various pentyl groups, various hexyl groups, and various octane groups. a carbon number of 1 to 18, such as a fluorenyl group, a cyclopentyl group, a cyclohexyl group or the like; a carbon number of a vinyl group, an allyl group, a butenyl group, a pentenyl group, a hexenyl group, an octenyl group or the like Alkenyl group of ~18; aryl group having 6 to 18 carbon atoms such as phenyl group, tolyl group or xylyl group; aralkyl group having 7 to 18 carbon atoms such as benzyl group and phenethyl group; 3-chloropropyl group And a halogenated alkyl group having 1 to 18 carbon atoms such as 3,3,3-trifluoropropyl group; and the like, wherein an alkyl group having 1 to 18 carbon atoms or an aryl group having 6 to 18 carbon atoms is preferred. Is a methyl group, a phenyl group.

另外,R31亦可為氫原子或烯基,此時,較好一分子中2~4個R31為氫原子或烯基,更好2~3個R31為氫原子或烯基。 Further, R 31 may be a hydrogen atom or an alkenyl group. In this case, preferably 2 to 4 R 31 in one molecule are a hydrogen atom or an alkenyl group, and more preferably 2 to 3 R 31 are a hydrogen atom or an alkenyl group.

式(5)中,R32獨自為上述末端反應基,具體可列舉例如氫原子;乙烯基、烯丙基、丁烯基、戊烯基、己烯基、辛烯基等之碳數2~18之烯基;等。 In the formula (5), R 32 is independently a terminal reactive group, and specific examples thereof include a hydrogen atom; a carbon number of a vinyl group, an allyl group, a butenyl group, a pentenyl group, a hexenyl group, an octenyl group or the like; 18 alkenyl; etc.

式(5)中,k為1以上之整數,較好為1~1,000,可為與聚矽氧烷(c1')之重量平均分子量相對應之數值。 In the formula (5), k is an integer of 1 or more, preferably 1 to 1,000, and may be a value corresponding to the weight average molecular weight of the polyoxyalkylene (c1').

鑑於延伸特性及透明性之觀點,聚矽氧烷(c1')之重量平均分子量較好為100~100,000,更好為500~50,000。 The polyoxymethane (c1') preferably has a weight average molecular weight of from 100 to 100,000, more preferably from 500 to 50,000, in view of elongation characteristics and transparency.

(烴系聚合物嵌段(c2)) (hydrocarbon polymer block (c2))

嵌段共聚物(C)所含之烴系聚合物嵌段(c2)具有由烴系聚合物所成之結構,有助於提高耐濕性。 The hydrocarbon-based polymer block (c2) contained in the block copolymer (C) has a structure composed of a hydrocarbon-based polymer, and contributes to improvement in moisture resistance.

作為此種烴系聚合物嵌段(c2),例如可列舉異丁烯系聚合物嵌段、(甲基)丙烯系聚合物嵌段、氫化聚丁二烯嵌段等。 Examples of such a hydrocarbon-based polymer block (c2) include an isobutylene polymer block, a (meth) propylene-based polymer block, and a hydrogenated polybutadiene block.

其中,基於耐濕性更優異、本發明之組成物之耐濕迴焊試驗後之密著性更良好之理由,較好為異丁烯系聚合物嵌段及/或(甲基)丙烯系聚合物嵌段,更佳為異丁烯系聚合物嵌段。 Among them, the isobutylene polymer block and/or the (meth) propylene polymer are preferred because the moisture resistance is more excellent and the adhesion of the composition of the present invention after the wet reflow test is better. The block is more preferably an isobutylene polymer block.

此種烴系聚合物嵌段(c2)如上所述,例如源自於具有上述末端基之烴系聚合物(c2')。 As described above, such a hydrocarbon-based polymer block (c2) is derived, for example, from a hydrocarbon-based polymer (c2') having the above terminal group.

作為烴系聚合物(c2')所具有之上述末端基,例如可列舉鍵結於矽原子之氫原子(Si-H);乙烯基、烯丙基、丁烯基、戊烯基、己烯基、辛烯基等之碳數2~18之烯基;等,其中,較佳為乙烯基、烯丙基。 Examples of the terminal group of the hydrocarbon-based polymer (c2') include a hydrogen atom (Si-H) bonded to a halogen atom; a vinyl group, an allyl group, a butenyl group, a pentenyl group, and a hexene group; The alkenyl group having 2 to 18 carbon atoms, such as a octyl group or the like; and the like, preferably a vinyl group or an allyl group.

作為此種烴系聚合物(c2'),例如可列舉具有上述 末端基之(甲基)丙烯系聚合物、具有上述末端基之異丁烯系聚合物等。 Examples of such a hydrocarbon-based polymer (c2') include the above-mentioned A (meth) propylene-based polymer having a terminal group, an isobutylene-based polymer having the above terminal group, and the like.

基於耐濕性更優異之理由,烴系聚合物(c2')之重量平均分子量較好為1,000~100,000,更好為2,000~50,000。 The weight average molecular weight of the hydrocarbon-based polymer (c2') is preferably from 1,000 to 100,000, more preferably from 2,000 to 50,000, for the reason that the moisture resistance is more excellent.

作為具有上述末端基之(甲基)丙烯系聚合物,較佳為其主鏈以(甲基)丙烯系單體為主進行聚合者。此處,所謂「為主」指構成主鏈之單體單位中,50莫耳%以上為上述單體,較佳為70莫耳%以上。 As the (meth) propylene-based polymer having the above terminal group, it is preferred that the main chain is polymerized mainly by a (meth) propylene monomer. Here, "mainly" means that 50 mol% or more of the monomer unit constituting the main chain is the above monomer, preferably 70 mol% or more.

作為上述(甲基)丙烯系單體,例如可列舉(甲基)丙烯酸單體、以及(甲基)丙烯酸酯單體等,較佳為(甲基)丙烯酸酯單體。 Examples of the (meth)acrylic monomer include a (meth)acrylic monomer and a (meth)acrylate monomer, and a (meth)acrylate monomer is preferred.

作為上述(甲基)丙烯酸酯單體之具體例,可列舉(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丁酯之等(甲基)丙烯酸烷酯。 Specific examples of the (meth) acrylate monomer include alkyl (meth) acrylate such as methyl (meth) acrylate, ethyl (meth) acrylate or butyl (meth) acrylate.

本發明中,亦可將上述(甲基)丙烯酸酯單體與其他單體共聚合,進而進行嵌段共聚合,此時,較好上述(甲基)丙烯酸酯單體以質量比計含40質量%以上。 In the present invention, the (meth) acrylate monomer may be copolymerized with another monomer to further perform block copolymerization. In this case, the (meth) acrylate monomer preferably has a mass ratio of 40. More than % by mass.

另外,上述末端基與(甲基)丙烯系聚合物主鏈之鍵結形式並無特別限定,例如可列舉碳-碳鍵、酯鍵、醚鍵、碳酸酯鍵、醯胺鍵、胺基甲酸酯鍵等之鍵結形式。 Further, the bonding form of the terminal group and the (meth)acrylic polymer main chain is not particularly limited, and examples thereof include a carbon-carbon bond, an ester bond, an ether bond, a carbonate bond, a guanamine bond, and an amine group. A bonding form of an ester bond or the like.

具有上述末端基之異丁烯系聚合物中,所謂「異丁烯系聚合物」,並不限定全部單體單位係由異丁烯單位形成,亦包含於異丁烯系聚合物中具有與異丁烯有共 聚性之單體者。作為此種單體成分,例如可列舉碳數4~12之烯烴、乙烯醚、芳香族乙烯化合物、乙烯基矽烷類、烯丙基矽烷類等。 In the isobutylene polymer having the above terminal group, the "isobutylene polymer" is not limited to all the monomer units formed of isobutylene units, and is also included in the isobutylene polymer. The monomer of aggregation. Examples of such a monomer component include an olefin having 4 to 12 carbon atoms, a vinyl ether, an aromatic vinyl compound, a vinyl decane, and an allyl decane.

但是,與異丁烯有共聚性之單體較好為50質量%以下,更好為30質量%以下,又更好為20質量%以下,尤佳為單體單位全部由異丁烯單位形成者。 However, the monomer having copolymerization with isobutylene is preferably 50% by mass or less, more preferably 30% by mass or less, still more preferably 20% by mass or less, and particularly preferably all monomer units are formed of isobutylene units.

作為此種具有上述末端基之異丁烯系聚合物,例如可適當列舉以下述式(6)表示之二烯丙基末端聚異丁烯。另外,下述式(6)中,PIB表示聚異丁烯。 As the isobutylene-based polymer having the terminal group, for example, a diallyl-terminated polyisobutylene represented by the following formula (6) can be suitably used. Further, in the following formula (6), PIB represents polyisobutylene.

CH2=CHCH2-PIB-CH2CH=CH2‧‧‧(6) CH 2 =CHCH 2 -PIB-CH 2 CH=CH 2 ‧‧‧(6)

本發明中,例如使上述式(5)所示之R32表示氫原子或烯基之聚矽氧烷(c1')、與式(6)所示之異丁烯系聚合物的烴系聚合物(c2')進行聚合,可獲得含聚矽氧烷嵌段(c1)及由聚異丁烯所成之烴系聚合物嵌段(c2)之嵌段共聚物(C)。 In the present invention, for example, R 32 represented by the above formula (5) represents a polyoxyalkylene (c1′) of a hydrogen atom or an alkenyl group, and a hydrocarbon-based polymer of an isobutylene polymer represented by the formula (6). C2') Polymerization is carried out to obtain a block copolymer (C) comprising a polyoxyalkylene block (c1) and a hydrocarbon-based polymer block (c2) composed of polyisobutylene.

基於聚矽氧烷嵌段(c1)與烴系聚合物嵌段(c2)之平衡性優異、耐濕迴焊試驗後密著性更良好之理由,嵌段共聚物(C)中,聚矽氧烷嵌段(c1)與烴系聚合物嵌段(c2)之質量比(c1/c2)較好為20/80~80/20,更好為35/65~65/35。 The block copolymer (C) is agglomerated based on the excellent balance between the polyoxyalkylene block (c1) and the hydrocarbon-based polymer block (c2) and the better adhesion after the wet-back reflow test. The mass ratio (c1/c2) of the oxyalkylene block (c1) to the hydrocarbon-based polymer block (c2) is preferably from 20/80 to 80/20, more preferably from 35/65 to 65/35.

關於嵌段共聚物(C)之含量,基於耐濕迴焊試驗後密著性更優異之理由,較好相對於上述支鏈狀有機聚矽氧烷(A)及直鏈狀有機聚矽氧烷(B)合計100質量份為1~50質量份,更好為3~30質量份,又更好為 10~25質量份。 The content of the block copolymer (C) is preferably based on the branched organopolyoxane (A) and the linear organopolyoxane based on the reason that the adhesion after the wet reflow-resistant test is more excellent. 100 parts by mass of the alkane (B) is 1 to 50 parts by mass, more preferably 3 to 30 parts by mass, and more preferably 10 to 25 parts by mass.

<矽氫化反應用觸媒(D)> <矽 Catalyst for hydrogenation reaction (D)>

本發明之組成物中所含有之矽氫化反應用觸媒(D)與具有鍵結於矽原子之氫原子之直鏈狀有機聚矽氧烷(B)併用,而發揮作為促進其對支鏈狀有機聚矽氧烷(A)之烯基進行加成反應(矽氫化反應)之觸媒之作用。 The catalyst (D) for hydrogenation reaction contained in the composition of the present invention is used in combination with a linear organopolyoxane (B) having a hydrogen atom bonded to a halogen atom to promote its pair of branches. The alkenyl group of the organopolyoxyalkylene (A) is subjected to an addition reaction (hydrazine hydrogenation reaction) as a catalyst.

此時,當嵌段共聚物(C)具有鍵結於矽原子之氫原子或烯基時,該等基亦會因矽氫化反應用觸媒(D)而進行反應。 At this time, when the block copolymer (C) has a hydrogen atom or an alkenyl group bonded to a halogen atom, the groups are also reacted by the catalyst (D) for hydrogenation reaction.

作為矽氫化反應用觸媒(D),可使用以往眾所周知者,例如可列舉鉑系觸媒、銠系觸媒、以及鈀系觸媒等,較佳為鉑系觸媒。作為鉑系觸媒之具體例,可列舉氯鉑酸、氯鉑酸-烯烴錯合物、氯鉑酸-二乙烯基四甲基二矽氧烷錯合物、氯鉑酸-醇配位化合物、以及鉑之二酮錯合物等,該等可單獨使用1種,亦可併用2種以上。 As the catalyst (D) for the hydrogenation reaction, a conventionally known one can be used, and examples thereof include a platinum-based catalyst, a ruthenium-based catalyst, and a palladium-based catalyst, and a platinum-based catalyst is preferable. Specific examples of the platinum-based catalyst include chloroplatinic acid, chloroplatinic acid-olefin complex, chloroplatinic acid-divinyltetramethyldioxane complex, and chloroplatinic acid-alcohol complex compound. And a platinum diketone complex or the like, which may be used alone or in combination of two or more.

矽氫化反應用觸媒(D)之含量為觸媒量,但基於本發明之組成物之硬化性優異之理由,較好相對於上述支鏈狀有機聚矽氧烷(A)及直鏈狀有機聚矽氧烷(B)合計100質量份為0.00001~0.1質量份,更佳為0.0001~0.01質量份。 The content of the catalyst (D) for the hydrogenation reaction is the amount of the catalyst, but it is preferably based on the branched organopolysiloxane (A) and the linear one based on the reason that the composition of the present invention is excellent in the hardenability. The total amount of the organic polysiloxane (B) is from 0.00001 to 0.1 parts by mass, more preferably from 0.0001 to 0.01 parts by mass.

<硬化延遲劑(E)> <hardening retarder (E)>

本發明之組成物進一步亦可含硬化延遲劑(E)。硬 化延遲劑(E)係用於調整本發明之組成物之硬化速度及作業操作時間之成分。 The composition of the present invention may further contain a hardening retarder (E). hard The retardation agent (E) is a component for adjusting the hardening speed and the operation time of the composition of the present invention.

作為硬化延遲劑(E),具體可列舉例如3-甲基-1-丁炔-3-醇、3,5-二甲基-1-己炔-3-醇、苯基丁炔醇、1-乙炔-1-環己醇等之具有碳-碳三鍵之醇衍生物;3-甲基-3-戊烯-1-炔、3,5-二甲基-3-己烯-1-炔等之烯炔化合物;四甲基四乙烯基環四矽氧烷、四甲基四己烯基環四矽氧烷等之含烯基低分子量矽氧烷;甲基-三(3-甲基-1-丁炔-3-氧基)矽烷、乙烯基-三(3-甲基-1-丁炔-3-氧基)矽烷等之含炔矽烷;等,該等可單獨使用1種,亦可併用2種以上。 Specific examples of the hardening retarder (E) include 3-methyl-1-butyn-3-ol, 3,5-dimethyl-1-hexyn-3-ol, and phenylbutynol, and 1 - an alcohol derivative having a carbon-carbon triple bond such as acetyl-1-cyclohexanol; 3-methyl-3-pentene-1-yne, 3,5-dimethyl-3-hexene-1- An alkyne compound such as an alkyne; an alkenyl group-containing low molecular weight oxirane such as tetramethyltetravinylcyclotetraoxane or tetramethyltetrahexenylcyclotetraoxane; methyl-tris(3-methyl) Alkyne-containing decane, such as -1-butyn-3-yloxy) decane, vinyl-tris(3-methyl-1-butyn-3-yloxy) decane, etc.; Two or more types may be used in combination.

硬化延遲劑(E)之含量雖係根據本發明之組成物之使用方法等適當選擇,但例如較好相對於上述支鏈狀有機聚矽氧烷(A)及直鏈狀有機聚矽氧烷(B)合計100質量份為0.00001~0.1質量份,更好為0.0001~0.01質量份。 The content of the hardening retarder (E) is appropriately selected depending on the method of use of the composition of the present invention, etc., but is preferably, for example, preferably relative to the above-mentioned branched organopolyoxane (A) and linear organopolyoxane. (B) The total amount of 100 parts by mass is 0.00001 to 0.1 part by mass, more preferably 0.0001 to 0.01 part by mass.

<密著賦予劑(F)> <Close agent (F)>

本發明之組成物進一步亦可含密著賦予劑(F)。 The composition of the present invention may further contain a binding agent (F).

作為密著賦予劑(F),例如可列舉矽烷偶合劑。作為矽烷偶合劑之具體例,可列舉胺基矽烷、乙烯基矽烷、環氧矽烷、甲基丙烯基矽烷、異氰酸酯矽烷、亞胺基矽烷、該等之反應物、以及該等與聚異氰酸酯反應而得之化合物等,較好為環氧矽烷。 Examples of the adhesion imparting agent (F) include a decane coupling agent. Specific examples of the decane coupling agent include amino decane, vinyl decane, epoxy decane, methacryl decane, isocyanate decane, imino decane, reactants thereof, and the like, and reacting with the polyisocyanate. The compound or the like obtained is preferably an epoxy decane.

作為環氧矽烷,只要為具有環氧基與烷氧基矽烷基之 化合物則為特別限定,作為其具體例,可列舉γ-縮水甘油氧基丙基甲基二甲氧基矽烷、γ-縮水甘油氧基丙基乙基二乙氧基矽烷、γ-縮水甘油氧基丙基甲基二乙氧基矽烷、β-(3,4-環氧基環己基)乙基甲基二甲氧基矽烷等之二烷氧基環氧矽烷;γ-縮水甘油氧基丙基三甲氧基矽烷、β-(3,4-環氧基環己基)乙基三甲氧基矽烷等之三烷氧基環氧矽烷;等。 As the epoxy decane, as long as it has an epoxy group and an alkoxyalkyl group The compound is particularly limited, and specific examples thereof include γ-glycidoxypropylmethyldimethoxydecane, γ-glycidoxypropylethyldiethoxydecane, and γ-glycidyloxygen. a dialkoxy epoxy decane such as propyl propyl diethoxy decane or β-(3,4-epoxycyclohexyl)ethyl methyl dimethoxy decane; γ-glycidoxy propyl propyl a trialkoxy epoxy decane such as a trimethoxy decane or a β-(3,4-epoxycyclohexyl)ethyltrimethoxydecane;

此外,黏著賦予劑(F)亦可為例如上述環氧矽烷之脫水縮合物,具體可列舉例如使γ-縮水甘油氧基丙基三甲氧基矽烷、苯基三甲氧基矽烷、及1,3-二乙烯基-1,1,3,3-四甲基二矽氧烷進行脫水縮合之環氧矽烷脫水縮合物等。 Further, the adhesion-imparting agent (F) may be, for example, a dehydrated condensate of the above-mentioned epoxy decane, and specific examples thereof include γ-glycidoxypropyltrimethoxydecane, phenyltrimethoxydecane, and 1,3. - an epoxy decane dehydration condensate obtained by dehydration condensation of divinyl-1,1,3,3-tetramethyldioxane.

密著賦予劑(F)之含量並未特別限定,較好相對於上述支鏈狀有機聚矽氧烷(A)及直鏈狀有機聚矽氧烷(B)合計100質量份為0.5~10質量份,更佳為1~5質量份。 The content of the adhesion-imparting agent (F) is not particularly limited, and is preferably 0.5 to 10 parts by mass based on 100 parts by mass of the branched organopolyoxane (A) and the linear organopolyoxane (B). The mass part is more preferably 1 to 5 parts by mass.

本發明之組成物之製造方法並未特別限定,例如可列舉將上述必需成分及任意成分混合而製造之方法。 The method for producing the composition of the present invention is not particularly limited, and examples thereof include a method in which the above-mentioned essential components and optional components are mixed and produced.

此外,使本發明之組成物硬化獲得硬化物之方法亦未特別限定,例如可列舉將本發明之組成物於80~200℃加熱10~720分鐘之方法。 Further, the method of curing the composition of the present invention to obtain a cured product is not particularly limited, and examples thereof include a method of heating the composition of the present invention at 80 to 200 ° C for 10 to 720 minutes.

本發明之組成物例如可於顯示器材料、光記錄媒體材料、光學儀器材料、光學零件材料、光纖材料、 光/電功能有機材料、半導體積體電路周邊材料等領域中,例如使用作接著劑、底塗劑、密封材等。 The composition of the present invention can be used, for example, in display materials, optical recording media materials, optical instrument materials, optical component materials, optical fiber materials, In the fields of optical/electrical functional organic materials, semiconductor integrated circuit peripheral materials, and the like, for example, an adhesive, a primer, a sealing material, or the like is used.

尤其,本發明之組成物由於密著性優異,其硬化物顯示良好透明性及高折射率,因此可適當用作光學半導體密封用組成物。 In particular, since the composition of the present invention is excellent in adhesion, and the cured product exhibits good transparency and high refractive index, it can be suitably used as a composition for optical semiconductor sealing.

可使用本發明之組成物之光學半導體並未特別限定,例如可列舉發光二極體(LED)、有機電致發光元件(有機EL)、雷射二極體、LED陣列等。 The optical semiconductor to which the composition of the present invention can be used is not particularly limited, and examples thereof include a light-emitting diode (LED), an organic electroluminescence device (organic EL), a laser diode, an LED array, and the like.

本發明之組成物作為光學半導體密封用組成物之使用方法例如可列舉以下方法:於光學半導體上賦予本發明之組成物,對賦予有本發明之組成物之光學半導體進行加熱,使本發明之組成物硬化。 The method of using the composition of the present invention as a composition for sealing an optical semiconductor, for example, is a method in which a composition of the present invention is provided on an optical semiconductor, and an optical semiconductor to which the composition of the present invention is applied is heated to make the present invention The composition hardens.

此時,賦予本發明之組成物並使其硬化之方法並未特別限定,例如可列舉使用佈膠器之方法、灌封法、網版印刷、轉模成型、射出成型等。 In this case, the method of applying the composition of the present invention and hardening it is not particularly limited, and examples thereof include a method using a cloth coater, a potting method, screen printing, transfer molding, and injection molding.

[實施例] [Examples]

以下列舉實施例對本發明進行具體說明,但本發明並不限定於此。 The present invention will be specifically described below by way of examples, but the invention is not limited thereto.

<Si-Vi系支鏈狀有機聚矽氧烷1之製造> <Manufacture of branched-chain organopolyoxane 1 of Si-Vi>

於附有攪拌機、回流冷凝管、投入口及溫度計之四頸燒瓶中投入1,3-二乙烯基-1,1,3,3-四甲基二矽氧烷21.4g、水60g、三氟甲磺酸0.14g以及甲苯200g並混合, 邊攪拌邊以1小時滴入苯基三甲氧基矽烷151.5g,滴加結束後,加熱回流1小時。冷卻後,分離下層,對甲苯溶液層水洗3次。在經水洗之甲苯溶液層中添加5%碳酸氫鈉水溶液100g,邊攪拌邊升溫至75℃後,回流1小時。 冷卻後,分離下層,對上層之甲苯溶液層水洗3次。使殘留之甲苯溶液層減壓濃縮,獲得於25℃為半固體狀之以下述平均單位式(7)表示之一分子中平均乙烯基含量為3.6質量%之甲基苯基乙烯基聚矽氧烷樹脂的支鏈狀有機聚矽氧烷1。 Into a four-necked flask equipped with a stirrer, a reflux condenser, an inlet, and a thermometer, 21.4 g of 1,3-divinyl-1,1,3,3-tetramethyldioxane, 60 g of water, and trifluoroethylene were placed. 0.14 g of methanesulfonic acid and 200 g of toluene, and mixed. 151.5 g of phenyltrimethoxydecane was added dropwise thereto over 1 hour while stirring, and the mixture was heated under reflux for 1 hour. After cooling, the lower layer was separated, and the toluene solution layer was washed with water three times. 100 g of a 5% sodium hydrogencarbonate aqueous solution was added to the water-washed toluene solution layer, and the mixture was heated to 75 ° C with stirring, and then refluxed for 1 hour. After cooling, the lower layer was separated, and the upper layer of the toluene solution was washed with water three times. The residual toluene solution layer was concentrated under reduced pressure to obtain a methylphenylvinylpolyoxyl group having an average vinyl content of 3.6% by mass in the molecule represented by the following average unit formula (7) at a temperature of 25 ° C. A branched organopolyoxane 1 of an alkane resin.

(ViMe2SiO1/2)0.25(Ph2SiO3/2)0.75‧‧‧(7) (ViMe 2 SiO 1/2 ) 0.25 (Ph 2 SiO 3/2 ) 0.75 ‧‧‧(7)

<Si-H系直鏈狀有機聚矽氧烷1之製造> <Manufacture of Linear-Organic Polyoxane 1 of Si-H System>

於附有攪拌機及回流冷凝管之燒瓶中投入以下述式(8)表示之具有矽醇基之直鏈狀有機聚矽氧烷100g、1,1,3,3-四甲基二矽氧烷1.5g以及三氟甲磺酸0.1g,攪拌後,於50℃加熱2小時。之後,添加甲苯150g,將生成之水排至系統外。對甲苯層水洗3次後,減壓濃縮,獲得以下述式(9)表示之直鏈狀有機聚矽氧烷1。 Into a flask equipped with a stirrer and a reflux condenser, 100 g of a linear organopolyoxane having a decyl group represented by the following formula (8), and 1,1,3,3-tetramethyldioxane are charged. 1.5 g and 0.1 g of trifluoromethanesulfonic acid were stirred and heated at 50 ° C for 2 hours. Thereafter, 150 g of toluene was added, and the generated water was discharged to the outside of the system. After washing the toluene layer three times, it was concentrated under reduced pressure to obtain a linear organopolyoxane 1 represented by the following formula (9).

HO(Ph2SiO)3(Me2SiO)3H‧‧‧(8) HO(Ph 2 SiO) 3 (Me 2 SiO) 3 H‧‧‧(8)

HMe2SiO(Ph2SiO)30(Me2SiO)30SiMe2H‧‧‧(9) HMe 2 SiO(Ph 2 SiO) 30 (Me 2 SiO) 30 SiMe 2 H‧‧‧(9)

<嵌段共聚物1之製造> <Manufacture of Block Copolymer 1>

使用0.001質量份後述之矽氫化反應用觸媒1,使分子鏈兩末端為二甲基氫矽氧基封端之二甲基矽氧烷‧二苯 基矽氧烷共聚物(重量平均分子量:12,000)100質量份及二烯丙基末端之聚異丁烯(重量平均分子量:12,000)50質量份,於70℃、4小時之條件下,進行矽氫化反應,獲得含聚矽氧烷嵌段與聚異丁烯嵌段之嵌段共聚物1。 Using 0.001 parts by mass of the catalyst 1 for hydrogenation reaction described later, the dimethyl hydrazine-terminated dimethyl oxa oxide ‧ diphenyl is terminated at both ends of the molecular chain 100 parts by mass of a polyoxyalkylene copolymer (weight average molecular weight: 12,000) and 50 parts by mass of a polyisobutylene (weight average molecular weight: 12,000) of a diallyl group, and hydrogenation reaction was carried out at 70 ° C for 4 hours. A block copolymer 1 comprising a polyoxyalkylene block and a polyisobutylene block is obtained.

所得嵌段共聚物1中之上述質量比(c1/c2)為50/50。 The above mass ratio (c1/c2) in the obtained block copolymer 1 was 50/50.

[實施例1~4、標準例1、比較例1] [Examples 1 to 4, Standard Example 1, Comparative Example 1]

<硬化性樹脂組成物之製造> <Manufacture of Curable Resin Composition>

以下述第1表所示量(單位:質量份)使用該表所示之成分,並使用真空攪拌機將其等混合均勻,製造硬化性樹脂組成物(以下亦簡稱為「組成物」)。 The components shown in the table are used in the amounts shown in the following Table (unit: parts by mass), and they are uniformly mixed using a vacuum mixer to produce a curable resin composition (hereinafter also simply referred to as "composition").

<透過率> <transmittance rate>

將所製造之組成物於150℃下加熱2小時,使其硬化,獲得硬化物(厚度=2.0mm)。針對所得硬化物,依據JIS K0115:2004,使用紫外線-可見光(UV-Vis)吸收光譜測定裝置(島津製作所公司製),測定於波長400nm下之透過率(單位:%)。測定結果示於下述第1表。若透過率之值為80%以上,則可評價為「透明性」優異者。 The produced composition was heated at 150 ° C for 2 hours to be hardened to obtain a cured product (thickness = 2.0 mm). The obtained cured product was measured for transmittance (unit: %) at a wavelength of 400 nm using an ultraviolet-visible (UV-Vis) absorption spectrometer (manufactured by Shimadzu Corporation) in accordance with JIS K0115:2004. The measurement results are shown in the first table below. When the value of the transmittance is 80% or more, it can be evaluated as "transparent".

<CF> <CF>

將所製造之組成物作成12.5mm×25mm接著面積, 夾在被接著體(鋁合金板,A1050P,PALTEK公司製)之間後,於150℃加熱2小時,使其硬化,獲得試驗體。使用所得試驗體,依據JIS K6850:1999進行拉伸試驗,測定凝聚破壞(CF)面積相對於接著面積之比例(單位:%)。結果示於下述第1表。CF值越接近100,則越可評價為接著性優異者。 The composition to be manufactured is made into a 12.5 mm × 25 mm joint area. After being sandwiched between the adherends (aluminum alloy plate, A1050P, manufactured by PALTEK Co., Ltd.), the mixture was heated at 150 ° C for 2 hours to be hardened to obtain a test piece. Using the obtained test piece, a tensile test was carried out in accordance with JIS K6850:1999, and the ratio (unit: %) of the area of the aggregation failure (CF) to the area of the subsequent layer was measured. The results are shown in the first table below. The closer the CF value is to 100, the more excellent the adhesion can be evaluated.

<剝離評估> <Exfoliation evaluation>

將所製造之組成物塗佈至LED封裝(ENOMOTO公司製)上,於150℃加熱2小時,使其硬化,每各例製作複數個試驗體。接著,每各例分別對以下3種試驗提供8個試驗體,計數未確認到硬化物剝離之試驗體個數。該個數越多,則越可評價為密著性優異者。 The composition to be produced was applied onto an LED package (manufactured by ENOMOTO Co., Ltd.), and heated at 150 ° C for 2 hours to be hardened, and a plurality of test pieces were produced for each of the examples. Next, for each of the following examples, eight test pieces were provided for the following three types of tests, and the number of test pieces in which the cured product was not peeled off was counted. The larger the number, the more excellent the adhesion can be evaluated.

(迴焊試驗) (reflow test)

將試驗體放置於加熱到280℃之加熱板上40秒後,以目視確認有無硬化物剝離。 The test piece was placed on a hot plate heated to 280 ° C for 40 seconds, and visually confirmed whether or not the cured product was peeled off.

(濕熱試驗) (wet heat test)

將試驗體放置於溫度85℃、濕度85%之環境下1000小時後,以目視確認有無硬化物剝離。 The test piece was placed in an environment of a temperature of 85 ° C and a humidity of 85% for 1,000 hours, and visually confirmed whether or not the cured product was peeled off.

(耐濕迴焊試驗) (wet resistance reflow test)

將試驗體放置於溫度30℃、濕度60%之環境下192小時後,進行上述迴焊試驗,以目視確認有無硬化物剝離。 After the test piece was placed in an environment of a temperature of 30 ° C and a humidity of 60% for 192 hours, the above-mentioned reflow test was carried out to visually confirm the presence or absence of peeling of the cured product.

第1表中各成分係使用以下者。 The following components are used for each component in the first table.

‧支鏈狀有機聚矽氧烷1:如上述者(乙烯基含量:5.6質量%、鍵結於矽原子之全部有機基中之苯基含有率:50莫耳%、Mw:2,500、黏度:非常黏稠之半固體狀物且無法測定黏度) ‧ Branched chain polyorganosiloxane 1: as described above (vinyl content: 5.6% by mass, phenyl content in all organic groups bonded to a ruthenium atom: 50 mol%, Mw: 2,500, viscosity: Very viscous semi-solid and unable to measure viscosity)

‧直鏈狀有機聚矽氧烷1:如上述者(鍵結於矽原子之氫原子含量:0.02質量%、鍵結於矽原子之全部有機基中之苯基含有率:49莫耳%、Mw:5,000、黏度:3,000mPa.s) ‧ linear organic polyoxane 1: as described above (the hydrogen atom content bonded to the ruthenium atom: 0.02 mass%, and the phenyl group content in all the organic groups bonded to the ruthenium atom: 49 mol%, Mw: 5,000, viscosity: 3,000 mPa.s)

‧嵌段共聚物1:如上述者 ‧ block copolymer 1: as above

‧聚異丁烯1:異丁烯之聚合物(重量平均分子量:12,000) ‧Polyisobutylene 1: Polymer of isobutylene (weight average molecular weight: 12,000)

‧矽氫化反應用觸媒1:氯鉑酸-二乙烯基四甲基二矽氧烷錯合物(Gelest公司製) ‧ Catalyst for hydrogenation reaction: chloroplatinic acid-divinyltetramethyldioxane complex (Gelest)

‧硬化延遲劑1:3-甲基-1-丁炔-3-醇(東京化成工業公司製) ‧ Hardening retarder 1: 3-methyl-1-butyn-3-ol (manufactured by Tokyo Chemical Industry Co., Ltd.)

‧密著賦予劑1:使γ-縮水甘油氧基丙基三甲氧基矽烷(信越化學工業公司製之KBM-403)、苯基三甲氧基矽烷(信越化學工業公司製之KBM-103)及1,3-二乙烯基-1,1,3,3-四甲基二矽氧烷進行脫水縮合之環氧矽烷脫水縮合物 ‧ adhesion imparting agent 1: γ-glycidoxypropyltrimethoxydecane (KBM-403, manufactured by Shin-Etsu Chemical Co., Ltd.), phenyltrimethoxydecane (KBM-103, manufactured by Shin-Etsu Chemical Co., Ltd.), and Dehydration condensation of epoxy decane by 1,3-divinyl-1,1,3,3-tetramethyldioxane

如由第1表所示結果所明瞭,使用嵌段共聚物1之實施例1~4中,剝離評價良好且密著性優異,尤其耐濕迴焊試驗結果為良好。 As is apparent from the results shown in the first table, in Examples 1 to 4 in which the block copolymer 1 was used, the peeling evaluation was good and the adhesion was excellent, and in particular, the wet-resistance test results were good.

相對於此,未使用嵌段共聚物1之標準例1中,耐濕迴焊試驗結果差。 On the other hand, in the standard example 1 in which the block copolymer 1 was not used, the wet-resistance reflow test result was inferior.

此外,可知未經嵌段共聚物化之單純使用聚異丁烯1之比較例1中,相溶性差、渾濁,因此透明性差,且耐濕迴焊試驗結果不充分。 Further, in Comparative Example 1 in which polyisobutylene 1 was used alone without block copolymerization, the compatibility was poor and turbid, and thus the transparency was poor, and the results of the wet reflow test were insufficient.

Claims (5)

一種硬化性樹脂組成物,其係含有具有烯基之支鏈狀有機聚矽氧烷(A)、一分子中至少具有2個鍵結於矽原子之氫原子之直鏈狀有機聚矽氧烷(B)、含聚矽氧烷嵌段(c1)與烴系聚合物嵌段(c2)之嵌段共聚物(C)、以及矽氫化反應用觸媒(D)。 A curable resin composition comprising a branched organopolyoxane having an alkenyl group (A) and a linear organopolyoxane having at least two hydrogen atoms bonded to a halogen atom in one molecule (B), a block copolymer (C) containing a polyoxyalkylene block (c1) and a hydrocarbon-based polymer block (c2), and a catalyst (D) for hydrogenation reaction. 如請求項1之硬化性樹脂組成物,其中前述烴系聚合物嵌段(c2)係含(甲基)丙烯系聚合物嵌段及/或異丁烯系聚合物嵌段。 The curable resin composition of claim 1, wherein the hydrocarbon-based polymer block (c2) contains a (meth) propylene-based polymer block and/or an isobutylene-based polymer block. 如請求項1或2之硬化性樹脂組成物,其中前述嵌段共聚物(C)中,前述聚矽氧烷嵌段(c1)與烴系聚合物嵌段(c2)之質量比(c1/c2)為20/80~80/20。 The curable resin composition of claim 1 or 2, wherein the mass ratio of the polyoxyalkylene block (c1) to the hydrocarbon-based polymer block (c2) in the block copolymer (C) (c1/ C2) is 20/80~80/20. 如請求項1~3中任一項之硬化性樹脂組成物,其中前述支鏈狀有機聚矽氧烷(A)係以下述平均單位式(1)表示之有機聚矽氧烷,(R1SiO3/2)a(R1 2SiO2/2)b(R1 3SiO1/2)c(SiO4/2)d(X1O1/2)e…(1)(式(1)中,各R1獨自為取代或非取代之一價烴基,惟一分子中R1之至少1個為烯基,R1之至少1個為芳基,式(1)中,X1為氫原子或烷基,式(1)中,a為正數,b為0或正數,c為0或正數,d為0或正數,e為0或正數,且b/a為0~10範圍內 之數,c/a為0~5範圍內之數,d/(a+b+c+d)為0~0.3範圍內之數,e/(a+b+c+d)為0~0.4範圍內之數)。 The curable resin composition according to any one of claims 1 to 3, wherein the branched organopolyoxane (A) is an organopolyoxane represented by the following average unit formula (1), (R 1 SiO 3/2 ) a (R 1 2 SiO 2/2 ) b (R 1 3 SiO 1/2 ) c (SiO 4/2 ) d (X 1 O 1/2 ) e (1) (Formula (1) In the formula, each R 1 is a substituted or unsubstituted one-valent hydrocarbon group, and at least one of R 1 in the sole molecule is an alkenyl group, and at least one of R 1 is an aryl group, and in the formula (1), X 1 is hydrogen. Atom or alkyl group, in the formula (1), a is a positive number, b is 0 or a positive number, c is 0 or a positive number, d is 0 or a positive number, e is 0 or a positive number, and b/a is in the range of 0-10 Number, c/a is the number in the range of 0~5, d/(a+b+c+d) is the number in the range of 0~0.3, and e/(a+b+c+d) is the range of 0~0.4 The number inside). 如請求項1~4中任一項之硬化性樹脂組成物,其係光學半導體元件密封用組成物。 The curable resin composition according to any one of claims 1 to 4, which is a composition for sealing an optical semiconductor element.
TW103105211A 2013-02-20 2014-02-18 Curable resin composition TW201437287A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013031179 2013-02-20

Publications (1)

Publication Number Publication Date
TW201437287A true TW201437287A (en) 2014-10-01

Family

ID=51391142

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103105211A TW201437287A (en) 2013-02-20 2014-02-18 Curable resin composition

Country Status (4)

Country Link
JP (1) JPWO2014129347A1 (en)
KR (1) KR20150119882A (en)
TW (1) TW201437287A (en)
WO (1) WO2014129347A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110536945A (en) * 2017-04-21 2019-12-03 3M创新有限公司 Barrier property adhesive composition and product

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107429115A (en) 2015-02-26 2017-12-01 道康宁东丽株式会社 Paint base composition, adhesion method and electricity/electronic unit
EP3892701A4 (en) * 2018-12-04 2022-08-24 Shin-Etsu Chemical Co., Ltd. Uv curable silicone adhesive composition and cured product thereof

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2630973B2 (en) * 1988-02-26 1997-07-16 日本ユニカー株式会社 Organopolysiloxane-polymethylene block alternating copolymer and method for producing the same
JP2700256B2 (en) * 1988-09-12 1998-01-19 鐘淵化学工業株式会社 Curable resin composition
JP3174713B2 (en) * 1995-04-21 2001-06-11 信越化学工業株式会社 Silicone adhesive composition
JPH09183903A (en) * 1995-12-28 1997-07-15 Toray Dow Corning Silicone Co Ltd Curable silicone composition
JP3579535B2 (en) * 1996-04-15 2004-10-20 孝志 澤口 Polypropylene-organopolysiloxane copolymer
JP3579536B2 (en) * 1996-04-15 2004-10-20 孝志 澤口 Method for producing polypropylene-organopolysiloxane copolymer
US5741859A (en) * 1997-02-03 1998-04-21 Dow Corning Corporation Block copolymers of polyisobutylene and polydimethylsiloxane
JP2000327920A (en) * 1999-05-18 2000-11-28 Kanegafuchi Chem Ind Co Ltd Curable composition
GB0003061D0 (en) * 2000-02-11 2000-03-29 Dow Corning Sa Silicone polymer emulsions
JP2006083299A (en) * 2004-09-16 2006-03-30 Nippon Shokubai Co Ltd Composition for photoelectronic part
JP2010242043A (en) * 2009-04-10 2010-10-28 Kaneka Corp Silicone based curable composition containing silicone based polymer particle
JP2011042732A (en) * 2009-08-20 2011-03-03 Kaneka Corp Led sealing agent

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110536945A (en) * 2017-04-21 2019-12-03 3M创新有限公司 Barrier property adhesive composition and product
CN110536945B (en) * 2017-04-21 2022-04-29 3M创新有限公司 Barrier adhesive compositions and articles

Also Published As

Publication number Publication date
KR20150119882A (en) 2015-10-26
JPWO2014129347A1 (en) 2017-02-02
WO2014129347A1 (en) 2014-08-28

Similar Documents

Publication Publication Date Title
JP5708824B2 (en) Curable resin composition
JP5766883B2 (en) Adhesiveness imparting agent, adhesive polyorganosiloxane composition, and optical semiconductor device
JP5972511B2 (en) Curable organopolysiloxane composition and cured product thereof
JP5587148B2 (en) Self-adhesive polyorganosiloxane composition
KR101913869B1 (en) Curable silicone resin composition
TWI477557B (en) And a hardened polysiloxane composition imparting a highly transparent polysiloxane
TWI544665B (en) Silicon oxide compositions for semiconductor encapsulation
TWI557181B (en) Cross-linkable silicone composition and cross-linked product thereof
TWI644986B (en) Curable resin composition
TW201437287A (en) Curable resin composition
TWI596160B (en) Curable resin composition
TW201514253A (en) Curable resin composition
TWI801654B (en) Addition hardening polysiloxane composition and semiconductor device
JP5913537B2 (en) Method for producing curable organopolysiloxane composition
JP7100600B2 (en) Curable organosilicon resin composition
KR20140070396A (en) Curable transparent silicone composition for optical device
JP2020143206A (en) Curable organosilicon resin composition