TW201433001A - Dual-band antenna structure and a method of manufacturing the same - Google Patents
Dual-band antenna structure and a method of manufacturing the same Download PDFInfo
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本發明係有關於一種天線結構及其製作方法,尤指一種雙頻段天線結構及其製作方法。 The invention relates to an antenna structure and a manufacturing method thereof, in particular to a dual-band antenna structure and a manufacturing method thereof.
隨著通訊技術的發展,各種應用無線通訊技術之電子產品相繼誕生,例如手機、無線上網裝置、個人數位助理等等。而消費者對該些無線通訊裝置之效能、外觀設計及尺寸大小之要求亦不斷增加,以行動電話為例,其收訊頻率由單頻、雙頻,發展至三頻、四頻,並且消費者要求行動電話之外觀造型流線新穎,同時具有尺寸小、重量輕,便於攜帶之特性。再者,由於通訊科技的進步,一種具有雙頻及雙圓極化功能之天線因應而生,其中「雙頻」係指可讓此天線用於兩個頻帶,並且此種天線在被使用的那兩個頻帶上,會產生增益上的峰點,而且阻抗也能匹配。然而,在習知雙頻段設計上,大多以各自饋入方式來達到雙頻段圓極化的效果,或是各自以多Pin饋入,經由Wilkinson電路或是耦合器電路整合達到雙頻圓極化天線特性,但在經電路整合成單一輸入單一輸出雙頻電路系統下,在各自饋入或多Pin饋入合成單一饋入點下,會導致原天線特性失真問題。 With the development of communication technologies, various electronic products using wireless communication technologies have been born, such as mobile phones, wireless Internet devices, personal digital assistants, and the like. Consumers' requirements for the performance, design and size of these wireless communication devices are also increasing. Taking mobile phones as an example, the receiving frequency is from single frequency and dual frequency to tri-band and quad-band, and consumers. The appearance of the mobile phone is required to be novel, and has the characteristics of small size, light weight and portability. Furthermore, due to the advancement of communication technology, an antenna with dual-frequency and dual-circular polarization functions is generated, wherein "dual-frequency" means that the antenna can be used in two frequency bands, and such an antenna is used. In those two bands, peaks in the gain are produced and the impedances are matched. However, in the conventional dual-band design, the dual-band circular polarization effect is mostly achieved by the respective feeding modes, or the multiple-pin feeding is used, and the dual-frequency circular polarization is achieved through the Wilkinson circuit or the coupler circuit integration. Antenna characteristics, but in a single-input single-output dual-frequency circuit system that is integrated into a single input, a single feed point or a multiple Pin feed is combined to form a single feed point, which causes distortion of the original antenna characteristics.
本發明實施例在於提供一種雙頻段天線結構及其製作方法,以有效解決習知雙頻段天線的天線特性產生失真的問題。 The embodiment of the invention provides a dual-band antenna structure and a manufacturing method thereof, so as to effectively solve the problem that the antenna characteristics of the conventional dual-band antenna are distorted.
本發明其中一實施例所提供的一種雙頻段天線結構 ,其包括:一第一基板單元、一第二基板單元及一黏著單元。所述第一基板單元包括一第一絕緣基板及一設置於所述第一絕緣基板的頂端上的第一電極層。所述第二基板單元包括一設置於所述第一電極層上的第二絕緣基板及一設置於所述第二絕緣基板的頂端上的第二電極層。所述接腳單元包括至少一依序貫穿所述第二電極層、所述第二絕緣基板、所述第一電極層及所述第一絕緣基板的饋入接腳。其中,所述第一基板單元與所述接腳單元互相配合以形成一具有一第一預定工作頻段的第一天線,所述第二基板單元與所述接腳單元互相配合以形成一具有一第二預定工作頻段的第二天線,且所述第一天線的所述第一預定工作頻段大於所述第二天線的所述第二預定工作頻段。 A dual-band antenna structure provided by one embodiment of the present invention The method includes a first substrate unit, a second substrate unit, and an adhesive unit. The first substrate unit includes a first insulating substrate and a first electrode layer disposed on a top end of the first insulating substrate. The second substrate unit includes a second insulating substrate disposed on the first electrode layer and a second electrode layer disposed on a top end of the second insulating substrate. The pin unit includes at least one feed pin extending through the second electrode layer, the second insulating substrate, the first electrode layer, and the first insulating substrate. The first substrate unit and the pin unit cooperate to form a first antenna having a first predetermined operating frequency band, and the second substrate unit and the pin unit cooperate to form a a second antenna of a second predetermined operating frequency band, and the first predetermined operating frequency band of the first antenna is greater than the second predetermined operating frequency band of the second antenna.
本發明另外一實施例所提供的一種雙頻段天線結構的製作方法,其包括下列步驟:首先,提供一第一絕緣基板,且將一第一電極層設置於所述第一絕緣基板的頂端上;然後,提供一第二絕緣基板,且將一第二電極層設置於所述第二絕緣基板的頂端上;接著,將所述第二絕緣基板設置於所述第一電極層上;最後,將至少一饋入接腳依序貫穿所述第二電極層、所述第二絕緣基板、所述第一電極層及所述第一絕緣基板,其中所述第一基板單元與所述接腳單元互相配合以形成一具有一第一預定工作頻段的第一天線,且所述第二基板單元與所述接腳單元互相配合以形成一具有一第二預定工作頻段的第二天線。 A method for fabricating a dual-band antenna structure according to another embodiment of the present invention includes the following steps: first, providing a first insulating substrate, and disposing a first electrode layer on a top end of the first insulating substrate Then, a second insulating substrate is provided, and a second electrode layer is disposed on the top end of the second insulating substrate; then, the second insulating substrate is disposed on the first electrode layer; finally, Inserting at least one feed pin through the second electrode layer, the second insulating substrate, the first electrode layer and the first insulating substrate, wherein the first substrate unit and the pin The units cooperate to form a first antenna having a first predetermined operating frequency band, and the second substrate unit and the pin unit cooperate to form a second antenna having a second predetermined operating frequency band.
本發明的有益效果可以在於,本發明實施例所提供的雙頻段天線結構,其可透過“所述第一天線的所述第一預定工作頻段大於所述第二天線的所述第二預定工作頻段 ”的設計,以產生具有高增益、低軸比、阻抗匹配的天線特性。 The beneficial effects of the present invention may be that the dual-band antenna structure provided by the embodiment of the present invention is permeable to "the first predetermined working frequency band of the first antenna is greater than the second of the second antenna. Scheduled working frequency band Designed to produce antenna characteristics with high gain, low axial ratio, and impedance matching.
為使能更進一步瞭解本發明之特徵及技術內容,請參閱以下有關本發明之詳細說明與附圖,然而所附圖式僅提供參考與說明用,並非用來對本發明加以限制者。 For a better understanding of the features and technical aspects of the present invention, reference should be made to the accompanying drawings.
請參閱圖1所示,本發明第一實施例提供一種雙頻段天線結構Z,其包括:一第一基板單元1、一第二基板單元2及一接腳單元3。在第一實施例中,至少一饋入接腳30穿過第一電極穿孔110且與第一電極層11彼此絕緣,饋入接腳30穿過第二電極穿孔210且接觸第二電極層21,且第一天線A1的第一預定工作頻段大於第二天線A2的第二預定工作頻段。更進一步來說,當第一天線A1的第一預定工作頻段大於第二天線A2的第二預定工作頻段時,饋入接腳30穿過第一電極穿孔110且與第一電極層11彼此絕緣,並且饋入接腳30穿過第二電極穿孔210且接觸第二電極層21,因此饋入接腳30可電性接觸第二電極層21。 Referring to FIG. 1 , a first embodiment of the present invention provides a dual-band antenna structure Z including a first substrate unit 1 , a second substrate unit 2 , and a pin unit 3 . In the first embodiment, at least one feed pin 30 passes through the first electrode via 110 and is insulated from the first electrode layer 11, and the feed pin 30 passes through the second electrode via 210 and contacts the second electrode layer 21. And the first predetermined working frequency band of the first antenna A1 is greater than the second predetermined working frequency band of the second antenna A2. Further, when the first predetermined working frequency band of the first antenna A1 is greater than the second predetermined working frequency band of the second antenna A2, the feeding pin 30 passes through the first electrode through hole 110 and is opposite to the first electrode layer 11 They are insulated from each other, and the feed pin 30 passes through the second electrode via 210 and contacts the second electrode layer 21, so the feed pin 30 can electrically contact the second electrode layer 21.
請參閱圖2至圖5所示,本發明第二實施例提供一種雙頻段天線結構Z,其包括:一第一基板單元1、一第二基板單元2及一接腳單元3。 As shown in FIG. 2 to FIG. 5 , a second embodiment of the present invention provides a dual-band antenna structure Z including a first substrate unit 1 , a second substrate unit 2 , and a pin unit 3 .
首先,第一基板單元1包括一第一絕緣基板10及一設置於第一絕緣基板10的頂端上的第一電極層11,其中第一絕緣基板10的底端具有一第一接地層12,第一絕緣 基板10具有一第一基板穿孔100,且第一電極層11具有一對應於第一基板穿孔100且大於第一基板穿孔100的第一電極穿孔110。另外,第一絕緣基板10具有一第一介電係數。舉例來說,第一絕緣基板10可為陶瓷基板,且第一電極層11可為任何導電材料所製成的導電層。 First, the first substrate unit 1 includes a first insulating substrate 10 and a first electrode layer 11 disposed on the top end of the first insulating substrate 10. The bottom end of the first insulating substrate 10 has a first ground layer 12, First insulation The substrate 10 has a first substrate via 100, and the first electrode layer 11 has a first electrode via 110 corresponding to the first substrate via 100 and larger than the first substrate via 100. In addition, the first insulating substrate 10 has a first dielectric constant. For example, the first insulating substrate 10 may be a ceramic substrate, and the first electrode layer 11 may be a conductive layer made of any conductive material.
再者,第二基板單元2包括一設置於第一電極層11上的第二絕緣基板20及一設置於第二絕緣基板20的頂端上的第二電極層21,其中第二絕緣基板20的底端具有一第二接地層22,第二絕緣基板20具有一第二基板穿孔200,第二電極層21具有一對應於第二基板穿孔200且大於第二基板穿孔200的第二電極穿孔210。另外,第二絕緣基板20具有一第二介電係數,。舉例來說,第二絕緣基板20可為陶瓷基板,且第二電極層21可為任何導電材料所製成的導電層。 Furthermore, the second substrate unit 2 includes a second insulating substrate 20 disposed on the first electrode layer 11 and a second electrode layer 21 disposed on the top end of the second insulating substrate 20, wherein the second insulating substrate 20 The bottom end has a second ground layer 22, the second insulating substrate 20 has a second substrate via 200, and the second electrode layer 21 has a second electrode via 210 corresponding to the second substrate via 200 and larger than the second substrate via 200. . In addition, the second insulating substrate 20 has a second dielectric constant. For example, the second insulating substrate 20 may be a ceramic substrate, and the second electrode layer 21 may be a conductive layer made of any conductive material.
此外,接腳單元3包括至少一依序貫穿第二電極層21、第二絕緣基板20、第一電極層11及第一絕緣基板10的饋入接腳30,其中饋入接腳30與第一電極層11及第二電極層21兩者彼此絕緣,且饋入接腳30與第一接地層12及第二接地層22兩者彼此絕緣。另外,饋入接腳30從上到下依序穿過第二電極穿孔210、第二基板穿孔200、第一電極穿孔110及第一基板穿孔100,其中饋入接腳30穿過第二電極穿孔210且與第二電極層21彼此分離一預定距離,饋入接腳30穿過第二基板穿孔200且接觸第二絕緣基板20,饋入接腳30穿過第一電極穿孔110且與第一電極層11彼此分離一預定距離,且饋入接腳30穿過第一基板穿孔100且接觸第一絕緣基板10。更進一步來說,如 圖5所示,饋入接腳30具有一外露且設置於第二絕緣基板20的頂端上的凸出部30A、一從凸出部30A向下延伸且同時嵌入第二絕緣基板20與第一基板單元1內的內嵌部30B、及一從內嵌部30B向下延伸且從第一絕緣基板10的底端裸露而出的接腳部30C In addition, the pin unit 3 includes at least one feeding pin 30 that sequentially penetrates the second electrode layer 21, the second insulating substrate 20, the first electrode layer 11, and the first insulating substrate 10, wherein the feeding pin 30 and the Both the electrode layer 11 and the second electrode layer 21 are insulated from each other, and the feed pin 30 and the first ground layer 12 and the second ground layer 22 are insulated from each other. In addition, the feeding pin 30 sequentially passes through the second electrode through hole 210, the second substrate through hole 200, the first electrode through hole 110 and the first substrate through hole 100 from top to bottom, wherein the feeding pin 30 passes through the second electrode The through holes 210 are separated from the second electrode layer 21 by a predetermined distance, the feed pins 30 pass through the second substrate through holes 200 and contact the second insulating substrate 20, and the feed pins 30 pass through the first electrode through holes 110 and The electrode layers 11 are separated from each other by a predetermined distance, and the feed pins 30 pass through the first substrate vias 100 and contact the first insulating substrate 10. Further, such as As shown in FIG. 5, the feed pin 30 has an exposed portion 30A disposed on the top end of the second insulating substrate 20, a downward extending portion from the protruding portion 30A, and simultaneously embedded in the second insulating substrate 20 and the first The inner fitting portion 30B in the substrate unit 1 and a pin portion 30C extending downward from the inner fitting portion 30B and exposed from the bottom end of the first insulating substrate 10
藉此,第一基板單元1與接腳單元3可互相配合以形成一具有一第一預定工作頻段(例如用來接收SDARS(Satellite Digital Audio Radio Service)訊號)的第一天線A1,第二基板單元2與接腳單元3可互相配合以形成一具有一第二預定工作頻段(例如用來接收GPS(Global Positioning System)訊號)的第二天線A2,且第一天線A1的第一預定工作頻段大於第二天線A2的第二預定工作頻段。舉例來說,第一天線A1與第二天線A2可為線性、左旋、或右旋天線。 Thereby, the first substrate unit 1 and the pin unit 3 can cooperate to form a first antenna A1 having a first predetermined operating frequency band (for example, for receiving a SDARS (Satellite Digital Audio Radio Service) signal), and a second The substrate unit 2 and the pin unit 3 can cooperate to form a second antenna A2 having a second predetermined operating frequency band (for example, for receiving a GPS (Global Positioning System) signal), and the first antenna A1 is first. The predetermined working frequency band is greater than the second predetermined operating frequency band of the second antenna A2. For example, the first antenna A1 and the second antenna A2 may be linear, left-handed, or right-handed antennas.
更進一步來說,如圖4所示,第一電極層11具有兩個形成在第一電極層11的其中一第一對角線D10上的第一切邊111(例如約為45度的截角)及兩個形成在第一電極層11的另外一第一對角線D11上的第一轉角112(例如約為90度的轉角)。第二電極層21具有兩個形成在第二電極層21的其中一第二對角線D20上且分別鄰近兩個第一轉角112的第二切邊211(例如約為45度的截角)及兩個形成在第二電極層21的另外一第二對角線D21上且分別鄰近兩個第一切邊111的第二轉角212(例如約為90度的轉角),以使得第一天線A1與第二天線A2皆形成圓極化天線。 Furthermore, as shown in FIG. 4, the first electrode layer 11 has two first trims 111 formed on one of the first diagonals D10 of the first electrode layer 11 (for example, a cut of about 45 degrees). And a first corner 112 formed on the other first diagonal D11 of the first electrode layer 11 (for example, a corner of about 90 degrees). The second electrode layer 21 has two second trimming edges 211 formed on one of the second diagonal lines D20 of the second electrode layer 21 and adjacent to the two first corners 112, respectively (for example, a truncated angle of about 45 degrees) And two second corners 212 formed on the other second diagonal D21 of the second electrode layer 21 and adjacent to the two first trims 111, respectively (for example, a corner of about 90 degrees), so that the first day Both the line A1 and the second antenna A2 form a circularly polarized antenna.
另外,請參閱圖5與圖6所示,本發明雙頻段天線結構Z更進一步包括:一黏著單元4,其包括一設置於第一 接地層12的底端上的第一黏貼片41及一設置於第二接地層22與第一電極層11之間的第二黏貼片42。因此,第二基板單元2可通過第二黏貼片42以貼附且堆疊在第一基板單元1上,且第一基板單元1可通過第一黏貼片41以貼附在一主機板5上。 In addition, referring to FIG. 5 and FIG. 6, the dual-band antenna structure Z of the present invention further includes: an adhesive unit 4, which includes a first A first adhesive sheet 41 on the bottom end of the ground layer 12 and a second adhesive sheet 42 disposed between the second ground layer 22 and the first electrode layer 11. Therefore, the second substrate unit 2 can be attached and stacked on the first substrate unit 1 through the second adhesive sheet 42, and the first substrate unit 1 can be attached to a motherboard 5 through the first adhesive sheet 41.
請配合圖2與圖7所示,本發明另外提供一種雙頻段天線結構Z的製作方法,其包括下列步驟:首先,提供一第一絕緣基板10,且將一第一電極層11設置於第一絕緣基板10的頂端上,其中第一絕緣基板10的底端具有一第一接地層12,第一絕緣基板10具有一第一介電係數(S100);接著,提供一第二絕緣基板20,且將一第二電極層21設置於第二絕緣基板20的頂端上,其中第二絕緣基板20的底端具有一第二接地層22,第二絕緣基板20具有一第二介電係數,且第二絕緣基板20的第二介電係數大於第一絕緣基板10的第一介電係數(S102);然後,將第二絕緣基板20設置於第一電極層11上(S104);接下來,將至少一饋入接腳30依序貫穿第二電極層21、第二絕緣基板20、第一電極層11及第一絕緣基板10,其中第一基板單元1與接腳單元3互相配合以形成一具有一第一預定工作頻段的第一天線A1,且第二基板單元2與接腳單元3互相配合以形成一具有一第二預定工作頻段的第二天線A2(S106),其中當第一天線A1的第一預定工作頻段大於第二天線A2的第二預定工作頻段時,由於第一電極穿孔110大於第一基板穿孔100,並且第二電極穿孔210大於第二基板穿孔200,所以當饋入接腳30穿過第一電極穿孔110與第二電極穿孔210時,饋入接腳30與第一電極層11及 第二電極層21兩者彼此分離一預定距離,以產生彼此絕緣的效果。 As shown in FIG. 2 and FIG. 7 , the present invention further provides a method for fabricating a dual-band antenna structure Z, which includes the following steps: First, a first insulating substrate 10 is provided, and a first electrode layer 11 is disposed on the first On the top end of an insulating substrate 10, the bottom end of the first insulating substrate 10 has a first ground layer 12, the first insulating substrate 10 has a first dielectric constant (S100); and then, a second insulating substrate 20 is provided. And a second electrode layer 21 is disposed on the top end of the second insulating substrate 20, wherein the bottom end of the second insulating substrate 20 has a second ground layer 22, and the second insulating substrate 20 has a second dielectric constant. The second dielectric substrate 20 has a second dielectric constant greater than the first dielectric constant of the first insulating substrate 10 (S102); then, the second insulating substrate 20 is disposed on the first electrode layer 11 (S104); The at least one feed pin 30 sequentially penetrates the second electrode layer 21, the second insulating substrate 20, the first electrode layer 11, and the first insulating substrate 10, wherein the first substrate unit 1 and the pin unit 3 cooperate with each other. Forming a first antenna A1 having a first predetermined operating frequency band, The second substrate unit 2 and the pin unit 3 cooperate to form a second antenna A2 having a second predetermined operating frequency band (S106), wherein the first predetermined working frequency band of the first antenna A1 is greater than the next day. In the second predetermined working frequency band of the line A2, since the first electrode through hole 110 is larger than the first substrate through hole 100, and the second electrode through hole 210 is larger than the second substrate through hole 200, when the feeding pin 30 passes through the first electrode through hole 110 When the second electrode via 210 is used, the feed pin 30 and the first electrode layer 11 and The second electrode layers 21 are separated from each other by a predetermined distance to produce an effect of insulating each other.
本發明採用高介電係數基板或低介電係數基板產生低頻段與高頻段,採堆疊方式設計製作,再以接腳激發能量,使兩天線同時接收或發射到不同頻段訊號,在設計上,於饋入點上需作槽溝設計(亦即與電極層的絕緣設計)後才可產生雙頻段模態。利用此技術可使得高頻段天線產生與單一天線時特性一樣變化不大,而在低頻段天線也可以具有較佳的特性,在增益值上不會降低太多,並且可以使天線於阻抗值可做調節,在雙頻段軸比上也可保持小於3 dB軸比值。因為為單一饋入的設計,在單一饋入與單一輸出雙頻電路系統中,不會產生天線特性變異的問題。當然天線也可設計不需在第二天線饋入點上作槽溝設計便可產生雙頻特性(亦即第二實施例),當然在低頻特性上特性會較低,而高頻特性可與單一天線特性接近,在雙頻段軸比上也可保持小於3 dB軸比值。 The invention adopts a high dielectric constant substrate or a low dielectric constant substrate to generate a low frequency band and a high frequency band, is designed and manufactured by stacking method, and then uses the pin to excite energy, so that the two antennas simultaneously receive or transmit signals to different frequency bands, and in design, A dual-band modality can be produced after the groove design (ie, the insulation design with the electrode layer) is required at the feed point. This technology can make the high-band antennas have the same characteristics as the single antennas, but the low-band antennas can also have better characteristics, the gain value will not be reduced too much, and the antenna can be made to the impedance value. Adjustments can be made to maintain an axial ratio of less than 3 dB in the dual-band ratio. Because of the single feed design, in the single feed and single output dual frequency circuit system, the problem of antenna characteristic variation does not occur. Of course, the antenna can also be designed to generate dual-frequency characteristics (ie, the second embodiment) without using a groove design on the second antenna feed point. Of course, the characteristics of the low frequency characteristic are low, and the high frequency characteristic can be It is close to the single antenna characteristic and can maintain an axial ratio of less than 3 dB in the dual-band axial ratio.
以上所述僅為本發明之較佳可行實施例,非因此侷限本發明之專利範圍,故舉凡運用本發明說明書及圖式內容所為之等效技術變化,均包含於本發明之範圍內。 The above are only the preferred embodiments of the present invention, and are not intended to limit the scope of the invention, and the equivalents of the invention are included in the scope of the invention.
Z‧‧‧天線結構 Z‧‧‧Antenna structure
A1‧‧‧第一天線 A1‧‧‧first antenna
A2‧‧‧第二天線 A2‧‧‧second antenna
1‧‧‧第一基板單元 1‧‧‧First substrate unit
10‧‧‧第一絕緣基板 10‧‧‧First insulating substrate
100‧‧‧第一基板穿孔 100‧‧‧First substrate perforation
11‧‧‧第一電極層 11‧‧‧First electrode layer
110‧‧‧第一電極穿孔 110‧‧‧First electrode perforation
111‧‧‧第一切邊 111‧‧‧First trimming
112‧‧‧第一轉角 112‧‧‧First corner
D10、D11‧‧‧第一對角線 D10, D11‧‧‧ first diagonal
12‧‧‧第一接地層 12‧‧‧First ground plane
2‧‧‧第二基板單元 2‧‧‧Second substrate unit
20‧‧‧第二絕緣基板 20‧‧‧Second insulating substrate
200‧‧‧第二基板穿孔 200‧‧‧Second substrate perforation
21‧‧‧第二電極層 21‧‧‧Second electrode layer
210‧‧‧第二電極穿孔 210‧‧‧Second electrode perforation
211‧‧‧第二切邊 211‧‧‧Second trimming
212‧‧‧第二轉角 212‧‧‧second corner
D20、D21‧‧‧第二對角線 D20, D21‧‧‧ second diagonal
22‧‧‧第二接地層 22‧‧‧Second ground plane
3‧‧‧接腳單元 3‧‧‧ pin unit
30‧‧‧饋入接腳 30‧‧‧Feeding pins
30A‧‧‧凸出部 30A‧‧‧Protruding
30B‧‧‧內嵌部 30B‧‧‧Inline Department
30C‧‧‧接腳部 30C‧‧‧foot
4‧‧‧黏著單元 4‧‧‧Adhesive unit
41‧‧‧第一黏貼片 41‧‧‧First Adhesive
42‧‧‧第二黏貼片 42‧‧‧Second Adhesive Patch
5‧‧‧主機板 5‧‧‧ motherboard
圖1為本發明第一實施例的側視示意圖。 Figure 1 is a side elevational view of a first embodiment of the present invention.
圖2為本發明第二實施例的立體分解示意圖。 2 is a perspective exploded view of a second embodiment of the present invention.
圖3為本發明第二實施例的立體組合示意圖。 3 is a schematic perspective view of a second embodiment of the present invention.
圖4為本發明第二實施例的上視示意圖。 Figure 4 is a top plan view of a second embodiment of the present invention.
圖5為本發明第二實施例的側視示意圖。 Figure 5 is a side elevational view of a second embodiment of the present invention.
圖6為本發明第二實施例使用黏著單元時的側視示意圖。 Figure 6 is a side elevational view showing the second embodiment of the present invention using an adhesive unit.
圖7為本發明第二實施例的製作方法的流程圖。 Figure 7 is a flow chart of a method of fabricating a second embodiment of the present invention.
Z‧‧‧天線結構 Z‧‧‧Antenna structure
A1‧‧‧第一天線 A1‧‧‧first antenna
A2‧‧‧第二天線 A2‧‧‧second antenna
1‧‧‧第一基板單元 1‧‧‧First substrate unit
10‧‧‧第一絕緣基板 10‧‧‧First insulating substrate
100‧‧‧第一基板穿孔 100‧‧‧First substrate perforation
11‧‧‧第一電極層 11‧‧‧First electrode layer
110‧‧‧第一電極穿孔 110‧‧‧First electrode perforation
12‧‧‧第一接地層 12‧‧‧First ground plane
2‧‧‧第二基板單元 2‧‧‧Second substrate unit
20‧‧‧第二絕緣基板 20‧‧‧Second insulating substrate
200‧‧‧第二基板穿孔 200‧‧‧Second substrate perforation
21‧‧‧第二電極層 21‧‧‧Second electrode layer
210‧‧‧第二電極穿孔 210‧‧‧Second electrode perforation
22‧‧‧第二接地層 22‧‧‧Second ground plane
3‧‧‧接腳單元 3‧‧‧ pin unit
30‧‧‧饋入接腳 30‧‧‧Feeding pins
30A‧‧‧凸出部 30A‧‧‧Protruding
30B‧‧‧內嵌部 30B‧‧‧Inline Department
30C‧‧‧接腳部 30C‧‧‧foot
4‧‧‧黏著單元 4‧‧‧Adhesive unit
41‧‧‧第一黏貼片 41‧‧‧First Adhesive
42‧‧‧第二黏貼片 42‧‧‧Second Adhesive Patch
Claims (16)
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TWI741228B (en) * | 2017-11-22 | 2021-10-01 | 新加坡商星科金朋有限公司 | Semiconductor device and method of making the same |
US11469191B2 (en) | 2015-07-29 | 2022-10-11 | STATS ChipPAC Pte. Ltd. | Antenna in embedded wafer-level ball-grid array package |
TWI822024B (en) * | 2022-05-03 | 2023-11-11 | 台灣禾邦電子有限公司 | Dual band antenna module |
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TWI617084B (en) * | 2015-11-20 | 2018-03-01 | 宏碁股份有限公司 | Portable electronic apparatus and expandable antenna structure thereof |
TWI699040B (en) * | 2019-05-03 | 2020-07-11 | 啓碁科技股份有限公司 | Antenna structure |
TWI715438B (en) * | 2020-02-12 | 2021-01-01 | 和碩聯合科技股份有限公司 | Antenna structure |
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TW518803B (en) * | 2001-11-08 | 2003-01-21 | Jin-Lu Weng | Dual-band plastic chip antenna |
CN2596569Y (en) * | 2002-11-29 | 2003-12-31 | 蔡启发 | Double frequency range printed antenna |
JP5056846B2 (en) * | 2007-03-29 | 2012-10-24 | 株式会社村田製作所 | Antenna and wireless communication device |
TWI502818B (en) * | 2009-12-30 | 2015-10-01 | Hon Hai Prec Ind Co Ltd | Double-band patch antenna |
TWM422771U (en) * | 2011-05-27 | 2012-02-11 | Unictron Technologies Corp | Micro antenna and micro antenna device |
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US11469191B2 (en) | 2015-07-29 | 2022-10-11 | STATS ChipPAC Pte. Ltd. | Antenna in embedded wafer-level ball-grid array package |
TWI741228B (en) * | 2017-11-22 | 2021-10-01 | 新加坡商星科金朋有限公司 | Semiconductor device and method of making the same |
TWI822024B (en) * | 2022-05-03 | 2023-11-11 | 台灣禾邦電子有限公司 | Dual band antenna module |
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