TW201432751A - Solid electrolytic capacitor - Google Patents

Solid electrolytic capacitor Download PDF

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TW201432751A
TW201432751A TW102134082A TW102134082A TW201432751A TW 201432751 A TW201432751 A TW 201432751A TW 102134082 A TW102134082 A TW 102134082A TW 102134082 A TW102134082 A TW 102134082A TW 201432751 A TW201432751 A TW 201432751A
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layer
electrolytic capacitor
conductive carbon
graphene
solid electrolytic
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TW102134082A
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TWI616911B (en
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Kazunori Naraya
Katsuhiro Kono
Shunsuke Endo
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Nippon Chemicon
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/15Solid electrolytic capacitors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004Details
    • H01G9/04Electrodes or formation of dielectric layers thereon

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Conductive Materials (AREA)
  • Electric Double-Layer Capacitors Or The Like (AREA)

Abstract

The purpose of the present invention is to reduce the ESR of a solid electrolytic capacitor. The present invention is a solid electrolytic capacitor in which are formed on the surface of an anode comprising a metal, in this order, a dielectric oxide coating layer, a solid electrolyte layer, a conductive carbon layer, and a cathode leadout layer, wherein the conductive carbon layer contains at least 0.5 weight percent of graphene and/or nanographene. Due to the conductive carbon layer containing graphene and/or nanographene, the electrical conductivity of the conductive carbon layer is reduced, and a low ESR can be achieved for the solid electrolytic capacitor.

Description

固體電解電容器 Solid electrolytic capacitor

本發明係關於一種固體電解電容器,特別是關於用以對CPU供給電力之高頻電路所使用的固體電解電容器。 The present invention relates to a solid electrolytic capacitor, and more particularly to a solid electrolytic capacitor used in a high frequency circuit for supplying power to a CPU.

以往,作為電解電容器,已知使用鋁或鉭等閥金屬作為陽極體,並使用電解液、固體電解質來作為真正陰極電解質的電容器。 Conventionally, as an electrolytic capacitor, a valve metal such as aluminum or ruthenium is used as an anode body, and an electrolytic solution or a solid electrolyte is used as a capacitor of a true cathode electrolyte.

近年來對於CPU的驅動電路,特別要求低驅動電壓化、低消費電力化、高頻對應化等,於是因此,電容器亦被要求要有更大的電容量、更低之串連等效電阻(以下,將串連等效電阻記為ESR)、以及更低之串連等效電感(以下,將串連等效電感記為ESL)。為了對應如此要求,特別以低ESR化為目的,檢討使用導電度高的導電性高分子來作為電解電容器的固體電解質,並將其開發。 In recent years, the drive circuit of the CPU particularly requires low drive voltage, low power consumption, high frequency correspondence, etc., and therefore, the capacitor is also required to have a larger capacitance and a lower series equivalent resistance ( Hereinafter, the series equivalent resistance is referred to as ESR) and the lower series equivalent inductance (hereinafter, the series equivalent inductance is referred to as ESL). In response to such a request, in particular, for the purpose of low ESR, a conductive polymer having high conductivity was used as a solid electrolyte of an electrolytic capacitor, and development thereof was carried out.

在此,針對將以往之導電性高分子作為固體電解質之電解電容器的構造,使用圖3進行說明。圖3為 表示將以往之導電性高分子作為固體電解質之電解電容器之構成的剖面圖。在圖3中,31為電極(陽極用鋁電極體)、32為介電質氧化物皮膜層、33為固體電解質層、34為導電性碳層、35為銀塗層、36為作為陰極端子之陰極引線。此種構造之固體電解電容器,是以銀塗層35構成陰極引出層。 Here, the structure of the electrolytic capacitor using the conventional conductive polymer as a solid electrolyte will be described with reference to FIG. 3 . Figure 3 is A cross-sectional view showing a configuration of an electrolytic capacitor in which a conventional conductive polymer is used as a solid electrolyte. In Fig. 3, 31 is an electrode (aluminum electrode body for an anode), 32 is a dielectric oxide film layer, 33 is a solid electrolyte layer, 34 is a conductive carbon layer, 35 is a silver coating layer, and 36 is a cathode terminal. The cathode lead. In the solid electrolytic capacitor of such a configuration, the silver coating layer 35 constitutes a cathode extraction layer.

如圖1所示,陽極用鋁電極體31之表面進行 過粗糙化處理,且於表面形成有介電質氧化物皮膜層32。像這樣於表面設有介電質氧化物皮膜層32之陽極用鋁電極體31的表面,形成有由聚吡咯、聚噻吩、聚苯胺及該等之衍生物等導電性高分子所成之固體電解質層33。此外,於固體電解質層33上,構成有電容元件,該電容元件依序形成有導電性碳層34與銀塗層35。對於該電容元件,係為了對外部電性連接,而分別將陽極端子(未圖示)連接於陽極用鋁電極體、將陰極引線36連接於銀塗層35,且進一步因應需要,以模具樹脂封裝電容元件,來形成以往的固體電解電容器。 As shown in FIG. 1, the anode is made of the surface of the aluminum electrode body 31. The roughening treatment is performed, and a dielectric oxide film layer 32 is formed on the surface. The surface of the aluminum electrode body 31 for an anode provided with the dielectric oxide film layer 32 on the surface thereof is formed of a solid polymer made of a conductive polymer such as polypyrrole, polythiophene, polyaniline or a derivative thereof. Electrolyte layer 33. Further, on the solid electrolyte layer 33, a capacitor element is formed which is sequentially formed with a conductive carbon layer 34 and a silver coating layer 35. For the capacitor element, an anode terminal (not shown) is connected to the anode aluminum electrode body, the cathode lead 36 is connected to the silver coating layer 35, and further, if necessary, a mold resin is used for external electrical connection. A capacitor element is packaged to form a conventional solid electrolytic capacitor.

此種將以往之導電性高分子作為固體電解質 的固體電解電容器,具有如下特徵:其ESR比使用電解液作為電解質的電解電容器、以及使用二氧化錳、TCNQ(四氰苯醌二甲烷)作為固體電解質的固體電解電容器都還要低。此係因導電性高分子的導電率比以往之電解液或二氧化錳、TCNQ等都來得高的緣故,此種使用導電性高分子作為固體電解質的固體電解電容器,與使用以往之電 解質的固體電解電容器相比,可謀求ESR的降低。 Such a conventional conductive polymer as a solid electrolyte The solid electrolytic capacitor has a characteristic that its ESR is lower than that of an electrolytic capacitor using an electrolytic solution as an electrolyte and a solid electrolytic capacitor using manganese dioxide and TCNQ (tetracyanoquinodimethane) as a solid electrolyte. This is because the conductivity of the conductive polymer is higher than that of the conventional electrolyte, manganese dioxide, TCNQ, etc., and the use of the conductive polymer as a solid electrolyte solid electrolytic capacitor, and the use of the conventional electricity Compared with a solid electrolyte capacitor that is desolved, a reduction in ESR can be achieved.

但是,隨著CPU的高頻動作,作為電力供給 源的電解電容器也被要求著進一步的低ESR化。在此,對電解電容器的構造進行檢討,以及對分別構成固體電解質層33、導電性碳層34、銀塗層35的材料進行各種檢討。 However, as the CPU's high frequency action, as a power supply The source electrolytic capacitor is also required for further low ESR. Here, the structure of the electrolytic capacitor is reviewed, and various materials constituting the solid electrolyte layer 33, the conductive carbon layer 34, and the silver coating layer 35 are examined.

當中,於陽極體的表面形成由導電性高分子 所成的固體電解質層的固體電解電容器中,因為固體電解質層與外部電極為電性連接,故一般於固體電解質層的上面形成導電性碳層及銀塗層。 Among them, a conductive polymer is formed on the surface of the anode body In the solid electrolytic capacitor of the formed solid electrolyte layer, since the solid electrolyte layer is electrically connected to the external electrode, a conductive carbon layer and a silver coating layer are generally formed on the upper surface of the solid electrolyte layer.

作為如此般之固體電解電容器的導電性碳層 所要求的特性,係與固體電解質層之密著性高者,又,要求著導電性碳層內部之內部電阻為低。因此,為了滿足如此般之特性,已知有使用相較之下較大的石墨(專利文獻1)、此外,使用碳黑等粒徑較小的碳粒(專利文獻2)、進一步,使用奈米碳管(專利文獻3)。 Conductive carbon layer as such a solid electrolytic capacitor The required characteristics are such that the adhesion to the solid electrolyte layer is high, and the internal resistance inside the conductive carbon layer is required to be low. Therefore, in order to satisfy such a characteristic, it is known to use graphite which is relatively large (Patent Document 1), and carbon particles having a small particle diameter such as carbon black are used (Patent Document 2), and further, Carbon tube (Patent Document 3).

且,混合該等碳材料來使用者亦為常見的手 段。混合如此般之碳材料來形成導電性碳層的理由將如下所述。亦即,僅由粒徑較小的碳粒來形成導電性碳層的情況時,與固體電解質層之間的接觸面積增大,對於減低與固體電解質層之間的界面接觸電阻而言較適合。另一方面,僅由粒徑較小的碳粒來形成導電性碳層的情況時,為了形成某一定厚度的導電性碳層,對於導電性碳層的厚度會變成碳粒多數存在,碳粒彼此之界面接觸電阻會變大。 因此,僅使用粒徑較小的碳粒來形成導電性碳層的情況時,與固體電解質層之間的界面接觸電阻雖然會減少,但導電性碳層的內部之內部電阻會增大,無法得到充分的ESR減低效果。 Moreover, mixing these carbon materials is also a common hand for users. segment. The reason for mixing such a carbon material to form a conductive carbon layer will be as follows. That is, in the case where the conductive carbon layer is formed only by the carbon particles having a small particle diameter, the contact area with the solid electrolyte layer is increased, and it is suitable for reducing the interface contact resistance with the solid electrolyte layer. . On the other hand, when a conductive carbon layer is formed only from carbon particles having a small particle diameter, in order to form a conductive carbon layer having a certain thickness, the thickness of the conductive carbon layer is often changed to carbon particles, and carbon particles are present. The interface contact resistance between each other becomes large. Therefore, when only a carbon particle having a small particle diameter is used to form a conductive carbon layer, the interfacial contact resistance with the solid electrolyte layer is reduced, but the internal resistance of the inside of the conductive carbon layer is increased. Get a full ESR reduction effect.

在此,有必要混合粒徑較大的碳材料,來減 少導電性碳層的內部電阻。在混合不同粒徑的碳材料時,粒徑較小的碳粒減低與固體電解質層之間的界面接觸電阻,且導電性碳層中因為存在有粒徑較大的碳材料,故可減少導電性碳層內部之碳粒彼此之間的接觸頻率,來降低內部電阻。其結果,作為從固體電解質層拉出之電極來發揮功能的導電性碳層全體,可實現內部電阻的降低。 Here, it is necessary to mix carbon materials with a larger particle size to reduce The internal resistance of the less conductive carbon layer. When carbon materials of different particle diameters are mixed, the carbon particles having a smaller particle diameter reduce the interface contact resistance with the solid electrolyte layer, and the conductive carbon layer has a carbon material having a larger particle diameter, thereby reducing the conductivity. The frequency of contact between the carbon particles inside the carbon layer reduces the internal resistance. As a result, the entire internal resistance can be reduced as a whole of the conductive carbon layer functioning as an electrode pulled out from the solid electrolyte layer.

作為如此般粒徑較大的碳材料,已知有來自 天然石墨的鱗片狀石墨,其中大多使用大小為0.1~50μm左右者。且,作為粒徑較小的碳元素,已知有碳黑,其中又已知特別以使用高導電率的科琴黑為佳。 As such a carbon material having a large particle size, it is known that The flaky graphite of natural graphite, which is mostly used in a size of about 0.1 to 50 μm. Further, as the carbon element having a small particle diameter, carbon black is known, and it is also known that it is particularly preferable to use a high conductivity Ketchen black.

此外,專利文獻3中,揭示有於如此般之導 電性碳層含有奈米碳管,藉此能提高與固體電解質層之間的密著性,抑制ESR的經時劣化。 Further, in Patent Document 3, it is disclosed in such a guide The electric carbon layer contains a carbon nanotube, whereby the adhesion to the solid electrolyte layer can be improved, and the deterioration of ESR over time can be suppressed.

先前技術文獻 Prior technical literature 專利文獻 Patent literature

專利文獻1:日本特開平2-265234號公報 Patent Document 1: Japanese Patent Laid-Open No. Hei 2-265234

專利文獻2:日本特開2004-79838號公報 Patent Document 2: Japanese Laid-Open Patent Publication No. 2004-79838

專利文獻3:日本特開2003-86464號公報 Patent Document 3: Japanese Laid-Open Patent Publication No. 2003-86464

但是,即使將以往之石墨、碳黑等碳材料以各種比率組合來形成碳層,亦難以將固體電解電容器的ESR更進一步地降低。 However, even if a conventional carbon material such as graphite or carbon black is combined at various ratios to form a carbon layer, it is difficult to further reduce the ESR of the solid electrolytic capacitor.

本發明係為了解決如上所述之以往技術上的問題點而提案者,其目的在於謀求進一步降低固體電解電容器的ESR。 The present invention has been made in order to solve the above-described problems of the prior art, and an object of the present invention is to further reduce the ESR of a solid electrolytic capacitor.

為了解決上述課題,請求項1所記載之發明為一種固體電解電容器,係在由具有閥作用的金屬材所成的陽極體表面上,依序形成介電質氧化皮膜層、固體電解質層、導電性碳層及陰極引出層之固體電解電容器,其特徵為,導電性碳層含有石墨烯及/或奈米石墨烯。 In order to solve the above problems, the invention described in claim 1 is a solid electrolytic capacitor in which a dielectric oxide film layer, a solid electrolyte layer, and a conductive layer are sequentially formed on a surface of an anode body made of a metal material having a valve action. A solid electrolytic capacitor of a carbon layer and a cathode lead layer, characterized in that the conductive carbon layer contains graphene and/or nanographene.

在此,所謂的石墨烯係指碳原子以1原子的厚度SP2鍵結,使碳原子呈二維六角形晶格結構者。且,所謂的奈米石墨烯,係指將前述石墨烯積層成複數層之構造者,其厚度大致上為10~1000nm左右。 Here, the term "graphene" means a carbon atom bonded to a thickness of 1 atom SP 2 to form a carbon atom having a two-dimensional hexagonal lattice structure. Further, the term "nano graphene" refers to a structure in which the graphene is laminated into a plurality of layers, and has a thickness of approximately 10 to 1000 nm.

石墨的各層呈ABA積層,或是被稱為Benel積層的構造。該構造中,接近之兩個層的電子能帶構造,係由兩組的電子.電洞能帶所成。具有此種電子能帶構造 的層積層有複數層時,藉由層間相互作用,使能帶的一部分摻雜電子,一部分摻雜電洞。據說因為該電子摻雜使得電阻增大,使石墨被稱為類金屬。 Each layer of graphite is an ABA layer or a structure called a Benel layer. In this configuration, the electron band structure of the two layers is close to the two sets of electrons. The hole can be made with a hole. Having such an electronic band structure When the laminated layer has a plurality of layers, a part of the energy band is doped with electrons and a part is doped with a hole by interlayer interaction. It is said that the graphite is called a metalloid because the electron doping increases the electrical resistance.

另一方面,奈米石墨烯,在積層有石墨烯的 構造中,呈被稱之為ABC積層的構造。該構造中,與上述之石墨的ABA積層,即AB-AB-AB……連續積層的構造不同,在AB積層之間存在有C層之構造。該C層,係具有石墨烯原本的電子能帶構造,且沒有來自接近之各層的層間相互作用(或是相互作用微弱)者,故不會有能帶的一部分摻雜電子,一部分摻雜電洞(或是該次數很稀少)。據說因此而不會使電阻增大。 On the other hand, nanographene, which is graphene-laminated In the structure, there is a structure called an ABC laminate. In this configuration, unlike the above-described structure of the ABA laminate of graphite, that is, the AB-AB-AB... continuous laminate, the structure of the C layer exists between the AB laminates. The C layer has the original electron band structure of graphene, and there is no interlayer interaction (or weak interaction) from the adjacent layers, so there is no part of the band doping electrons, a part of the doping Hole (or the number is very rare). It is said that this does not increase the resistance.

如此般,石墨烯、奈米石墨烯與一般石墨相 比,其導電率極高。作為此種石墨烯、奈米石墨烯,市面上有販售積層50層左右的奈米石墨烯。且,販售的奈米石墨烯之寬高比(奈米石墨烯的厚度:面積)為1:10~1:1000左右。但是,本案之發明並不限定於該等奈米石墨烯,只要具有石墨烯的電子能帶構造,且具有來自石墨烯構造之高導電率者即可,石墨烯的寬高比、奈米石墨烯的寬高比或積層數可任意地選擇。 In this way, graphene, nanographene and general graphite phase Its conductivity is extremely high. As such graphene and nano graphene, about 50 layers of nanographene are commercially available. Further, the aspect ratio of the commercially available nanographene (thickness of the nanographene: area) is about 1:10 to 1:1000. However, the invention of the present invention is not limited to such nanographenes, as long as it has an electron band structure of graphene and has a high electrical conductivity from a graphene structure, an aspect ratio of graphene, nanographite. The aspect ratio or the number of layers of the olefin can be arbitrarily selected.

如上述說明般,石墨烯、奈米石墨烯具有來 自其構造之高導電率。因此,導電性碳層藉由含有石墨烯及/或奈米石墨烯,可降低導電性碳層的電阻,作為固體電解電容器可實現低ESR。 As described above, graphene and nanographene have come High conductivity from its construction. Therefore, the conductive carbon layer can reduce the electric resistance of the conductive carbon layer by containing graphene and/or nanographene, and can realize low ESR as a solid electrolytic capacitor.

然後,石墨烯及/或奈米石墨烯的含量,以 形成導電性碳層之固體成份重量全體的重量比率為0.5重量%以上添加較佳。通常,為了形成導電性碳層,會塗布含有碳材料的塗劑狀材料,並乾燥除去分散介質來形成導電性碳層。在本發明中,並不是對用來形成導電性碳層的塗劑之重量比率進行規定,而是對乾燥塗劑之後使分散介質蒸發後之狀態的重量比率進行規定。換言之,是用來形成導電性碳層的塗劑中所含有之固體成份(不揮發成份)的重量比率。 Then, the content of graphene and/or nanographene is The weight ratio of the entire solid content of the conductive carbon layer to be formed is preferably 0.5% by weight or more. Usually, in order to form a conductive carbon layer, a coating material containing a carbon material is applied, and the dispersion medium is dried to form a conductive carbon layer. In the present invention, the weight ratio of the coating agent for forming the conductive carbon layer is not defined, but the weight ratio of the state in which the dispersion medium is evaporated after the coating agent is dried is defined. In other words, it is a weight ratio of a solid component (nonvolatile component) contained in a coating agent for forming a conductive carbon layer.

且,含有石墨作為碳材料時,在石墨的粉碎工程中,亦考慮生成有石墨烯及/或奈米石墨烯的情況。而且,亦有報告指出石墨中含有10%左右之具有石墨烯電子能帶構造者。但是,本發明中,石墨中原本就存在之具有石墨烯電子能帶構造者,或是在石墨之製造工程中生成,於石墨材料中所含有的石墨烯及/或奈米石墨烯,係被當成石墨材料的一部分。因此,對構成導電性碳的固體成份重量之含量,係以對石墨材料等作為石墨烯及/或奈米石墨烯添加的量作為算出的基準。 Further, when graphite is used as the carbon material, it is also considered that graphene and/or nanographene are formed in the pulverization process of graphite. Moreover, there are reports that graphite contains about 10% of graphene electron band structures. However, in the present invention, the graphene electron band structure originally present in the graphite or the graphene and/or nanographene contained in the graphite material is formed in the graphite manufacturing process. As part of the graphite material. Therefore, the content of the weight of the solid component constituting the conductive carbon is calculated based on the amount of the graphite material or the like added as graphene and/or nanographene.

作為石墨烯及/或奈米石墨烯之含量,設定為形成導電性碳層之固體成份重量全體之重量比率為0.5重量%以上,來得到固體電解電容器的減低ESR的效果。若含量未滿0.5重量%的話,固體電解電容器的ESR特性並不會出現太大差異。且,作為石墨烯及/或奈米石墨烯之含量,觀察有隨著其含量增加,ESR的降低效果也會隨之增加的傾向。另一方面,石墨烯及/或奈米石墨烯 之含量以超過所定量之設定來製作塗劑的話,塗劑的黏性會上升,會使塗劑之塗布工程的操作性顯著下降。此操作性,係取決於對有機溶劑之作為碳材料的石墨、碳黑、石墨烯及/或奈米石墨烯的總量、以及進一步作為黏合劑之樹脂的含量,該等之比率若是有變化,因為石墨烯及/或奈米石墨烯的添加量上限(引起操作性之惡化的上限)亦會有變化,故無法對添加量的上限明確地規定。 The content of graphene and/or nanographene is set to 0.5% by weight or more based on the total weight of the solid component forming the conductive carbon layer, thereby obtaining the effect of reducing the ESR of the solid electrolytic capacitor. If the content is less than 0.5% by weight, the ESR characteristics of the solid electrolytic capacitor do not vary too much. Further, as the content of graphene and/or nanographene, it has been observed that as the content thereof increases, the effect of lowering the ESR tends to increase. Graphene and/or nanographene on the other hand When the content of the coating agent is more than the quantitative setting, the viscosity of the coating agent rises, and the workability of the coating process of the coating agent is remarkably lowered. This operability depends on the total amount of graphite, carbon black, graphene and/or nanographene as a carbon material for an organic solvent, and the content of a resin further as a binder, and the ratios thereof are changed. Since the upper limit of the amount of addition of graphene and/or nanographene (the upper limit causing deterioration of workability) also changes, the upper limit of the amount of addition cannot be clearly defined.

依據本發明,可提供一種能夠降低固體電解電容器之ESR,並在高頻電路可優異地供給電荷之固體電解電容器。 According to the present invention, it is possible to provide a solid electrolytic capacitor which can reduce the ESR of a solid electrolytic capacitor and can supply electric charge excellently in a high frequency circuit.

1‧‧‧電容器元件 1‧‧‧ capacitor components

2‧‧‧連接板 2‧‧‧Connecting board

11‧‧‧鋁材 11‧‧‧Aluminum

12‧‧‧介電質氧化物皮膜層 12‧‧‧Dielectric oxide coating

13‧‧‧固體電解質層 13‧‧‧Solid electrolyte layer

14‧‧‧導電性碳層 14‧‧‧ Conductive carbon layer

15‧‧‧銀塗層 15‧‧‧Silver coating

16‧‧‧陰極部 16‧‧‧ Cathode

17‧‧‧陽極部 17‧‧‧Anode

21‧‧‧絕緣基板 21‧‧‧Insert substrate

22‧‧‧陽極導體 22‧‧‧Anode conductor

23‧‧‧陰極導體 23‧‧‧Cathode conductor

24‧‧‧陽極導體 24‧‧‧Anode conductor

25‧‧‧陰極導體 25‧‧‧Cathode conductor

31‧‧‧電極體 31‧‧‧Electrode body

32‧‧‧介電質氧化物皮膜層 32‧‧‧Dielectric oxide coating

33‧‧‧固體電解質層 33‧‧‧Solid electrolyte layer

34‧‧‧導電性碳層 34‧‧‧ Conductive carbon layer

35‧‧‧銀塗層 35‧‧‧Silver coating

36‧‧‧陰極引線 36‧‧‧Cathode lead

C‧‧‧固體電解電容器 C‧‧‧Solid electrolytic capacitor

圖1為關於本案發明之表示固體電解電容器之一例構造的剖面圖。 BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view showing the structure of an example of a solid electrolytic capacitor according to the present invention.

圖2為本案發明之固體電解電容器之一例構造所使用的搭載基板的立體圖。 Fig. 2 is a perspective view showing a mounting substrate used in an example of a solid electrolytic capacitor of the present invention.

圖3為表示以往之固體電解電容器的剖面圖。 3 is a cross-sectional view showing a conventional solid electrolytic capacitor.

用以實施發明之最佳形態 The best form for implementing the invention

以下,針對關於本發明之固體電解電容器之 實施的形態(以下,稱為實施形態)來進行具體說明。 Hereinafter, with respect to the solid electrolytic capacitor of the present invention The embodiment (hereinafter, referred to as an embodiment) will be specifically described.

適用於本發明之固體電解電容器的形狀並無 特別限制,舉例來說,可適用如下述構造的固體電解電容器。 The shape of the solid electrolytic capacitor suitable for the present invention is not Particularly, for example, a solid electrolytic capacitor having the following configuration can be applied.

固體電解電容器,具備有電容器元件、以及 搭載基板;該電容器元件,係於由閥作用金屬所成的陽極體之中央所形成之凹部的內面,依序形成介電質氧化皮膜層、固體電解質層、陰極部,並以該凹部周圍的陽極體作為陽極部;該搭載基板,具有:搭載前述電容器元件之面與面對配線基板之裝配面,在搭載電容器元件的面上,形成有分別與前述電容器元件的陽極部、陰極部對應之導體,在面對配線基板的裝配面上,形成有陰極電極與該陰極電極周圍的陽極電極,同時前述導體貫穿內部並分別與陽極電極及陰極電極電性連接。 a solid electrolytic capacitor having a capacitor element, and The substrate is mounted on the inner surface of the concave portion formed in the center of the anode body formed by the valve action metal, and a dielectric oxide film layer, a solid electrolyte layer, and a cathode portion are sequentially formed, and around the concave portion The anode substrate is an anode portion, and the mounting substrate has a surface on which the capacitor element is mounted and a mounting surface facing the wiring board, and the surface on which the capacitor element is mounted is formed to correspond to the anode portion and the cathode portion of the capacitor element, respectively. The conductor has a cathode electrode and an anode electrode around the cathode electrode on the mounting surface facing the wiring substrate, and the conductor penetrates the inside and is electrically connected to the anode electrode and the cathode electrode, respectively.

以下,與上述之固體電解電容器之構造,一 起說明本發明之實施形態。 Hereinafter, the structure of the solid electrolytic capacitor described above, An embodiment of the present invention will be described.

圖1(a)為表示本發明之固體電解電容器之 剖面圖,(b)為表示將固體電解電容器分解成電容器元件與搭載基板的剖面圖。 Figure 1 (a) is a view showing a solid electrolytic capacitor of the present invention In the cross-sectional view, (b) is a cross-sectional view showing the solid electrolytic capacitor being decomposed into a capacitor element and a mounted substrate.

關於本發明所使用的電容器元件1,與圖1(b)一起說明。首先,以薄板狀之鋁材作為陽極體11,於陽極體11之中央藉由切削、沖壓、蝕刻法等來形成所定大小的凹部。進一步對該凹部的內面藉由蝕刻進行擴面處理,進一步藉由陽極氧化來形成介電質氧化皮膜層 12。接著於成為陰極之凹部的內面之介電質氧化皮膜層12上,形成由導電性高分子所成之固體電解質層13,然後於固體電解質層13上形成導電性碳層14、銀塗層15,來作為陰極部16,成為電容器元件1。該電容器元件1,陽極體11之凹部周圍的部份成為陽極部17。 The capacitor element 1 used in the present invention will be described together with Fig. 1(b). First, a thin plate-shaped aluminum material is used as the anode body 11, and a recess having a predetermined size is formed at the center of the anode body 11 by cutting, pressing, etching, or the like. Further, the inner surface of the concave portion is subjected to a surface expansion treatment by etching, and the dielectric oxide film layer is further formed by anodization. 12. Then, a solid electrolyte layer 13 made of a conductive polymer is formed on the dielectric oxide film layer 12 which becomes the inner surface of the concave portion of the cathode, and then a conductive carbon layer 14 and a silver coating layer are formed on the solid electrolyte layer 13. 15. The cathode portion 16 serves as the capacitor element 1. In the capacitor element 1, a portion around the concave portion of the anode body 11 serves as the anode portion 17.

如此般的電容器元件1,係將初始原料之鋁材 的厚度設為100~500μm左右,蝕刻層的厚度為20~30μm,從蝕刻層最上部往凹部之深度為15~50μm左右,藉此可製造薄型的電容器元件。 Such a capacitor element 1 is an aluminum material of a starting material. The thickness is set to about 100 to 500 μm, the thickness of the etching layer is 20 to 30 μm, and the depth from the uppermost portion of the etching layer to the concave portion is about 15 to 50 μm, whereby a thin capacitor element can be manufactured.

將此電容器元件1之凹部的深度形成為較 淺,會使從介電質氧化皮膜層12至電容器元件之電力的取出口之陰極部16為止的導電距離較短,對減低ESL的效果而言較佳。但是,雖然於凹部的內面形成有介電質氧化皮膜層12,且於該介電質氧化皮膜層12上依序形成有固體電解質層13、陰極部16(導電性碳層14、銀塗層15),但該固體電解質層13與陰極部16,有必要各自不從凹部突出。因此,即使將固體電解質層13之厚度形成為3~10μm左右之厚度,並將陰極部16之厚度形成為10~15μm左右,為了使該等不從凹部突出,凹部之深度有必要成為15~50μm左右。 The depth of the recess of the capacitor element 1 is formed to be Shallowly, the conductive distance from the dielectric oxide film layer 12 to the cathode portion 16 of the power source of the capacitor element is short, and the effect of reducing the ESL is preferable. However, a dielectric oxide film layer 12 is formed on the inner surface of the concave portion, and a solid electrolyte layer 13 and a cathode portion 16 (conductive carbon layer 14, silver coating) are sequentially formed on the dielectric oxide film layer 12. Layer 15), but it is necessary for the solid electrolyte layer 13 and the cathode portion 16 not to protrude from the concave portion. Therefore, even if the thickness of the solid electrolyte layer 13 is formed to a thickness of about 3 to 10 μm, and the thickness of the cathode portion 16 is formed to be about 10 to 15 μm, in order to prevent the protrusion from protruding from the concave portion, the depth of the concave portion must be 15~. About 50μm.

且,為了將凹部形成為15~50μm左右之深 度,初始材料的鋁材之厚度有必要成為100μm左右。若是比這更薄,在形成凹部的時候,鋁材11本身會變形,形成凹部之後的陽極體之強度會變得極端弱化。 Moreover, in order to form the concave portion to a depth of about 15 to 50 μm The thickness of the aluminum material of the starting material needs to be about 100 μm. If it is thinner than this, when the concave portion is formed, the aluminum material 11 itself is deformed, and the strength of the anode body after the concave portion is formed becomes extremely weak.

但是,即使是使用厚度為100μm之鋁材來形 成電容器元件的情況,亦不能稱其強度一定夠強。在此,為了補強如此般之電容器元件的強度,亦可於電容器元件之凹部的反對面,貼上強度比鋁更高的鋼材來補強。又,亦可對鋁材之單面預先進行陽極氧化處理來提高強度。 However, even if it is made of aluminum having a thickness of 100 μm In the case of a capacitor element, it cannot be said that its strength must be strong enough. Here, in order to reinforce the strength of such a capacitor element, it is also possible to affix a steel material having a higher strength than aluminum to the opposing surface of the concave portion of the capacitor element. Further, the single side of the aluminum material may be anodized in advance to increase the strength.

且,當鋁材11的厚度設為500μm左右時, 在形成凹部時亦可確保充分的強度,故此時就沒有進行黏貼鋼材、陽極氧化處理等提高強度的必要。 Moreover, when the thickness of the aluminum material 11 is set to about 500 μm, Since sufficient strength can be ensured when the concave portion is formed, it is not necessary to increase the strength such as adhesion of the steel material or anodizing treatment.

此外,電容器元件之中,於介電質氧化皮膜 層及固體電解質層,有必要避免施加機械性壓力。要是對介電質氧化皮膜層及固體電解質層施加機械性壓力的話,會損傷介電質氧化皮膜,有使漏電流增加的顧慮。其他還有,要是對固體電解質層施加機械性壓力的話,會有使固體電解質層的導電率低下的顧慮。但是,該電容器元件中,介電質氧化皮膜層及固體電解質層,係形成於陽極體之凹部的內部,並藉由陽極體11包圍而受到保護。 In addition, among the capacitor elements, in the dielectric oxide film For the layer and the solid electrolyte layer, it is necessary to avoid the application of mechanical stress. If mechanical pressure is applied to the dielectric oxide film layer and the solid electrolyte layer, the dielectric oxide film is damaged, and there is a concern that the leakage current is increased. In addition, if mechanical pressure is applied to the solid electrolyte layer, there is a concern that the conductivity of the solid electrolyte layer is lowered. However, in the capacitor element, the dielectric oxide film layer and the solid electrolyte layer are formed inside the concave portion of the anode body and are surrounded by the anode body 11 to be protected.

(固體電解質層) (solid electrolyte layer)

針對於上述之電容器元件1所形成之固體電解質層13來進行說明。 The solid electrolyte layer 13 formed by the capacitor element 1 described above will be described.

固體電解質層13,係藉由導電性高分子所形成,作為導電性高分子,較佳為聚噻吩、聚吡咯、聚苯胺及該等之衍生物。作為固體電解質層之形成方法,可使用將前述導電性高分子作為前驅物的單體及氧化劑,以化學聚合來 形成固體電解質層的方法、藉由將單體電解聚合來形成固體電解質層之方法、將導電性高分子之微粒子分散後之導電性高分子分散液塗布於所定位置,並藉由乾燥來形成固體電解質層之方法等,以往周知之由導電性高分子所成之固體電解質層之形成方法。 The solid electrolyte layer 13 is formed of a conductive polymer, and as the conductive polymer, polythiophene, polypyrrole, polyaniline, and derivatives thereof are preferable. As a method of forming the solid electrolyte layer, a monomer and an oxidizing agent using the conductive polymer as a precursor can be used for chemical polymerization. A method of forming a solid electrolyte layer, a method of forming a solid electrolyte layer by electrolytically polymerizing a monomer, a conductive polymer dispersion obtained by dispersing fine particles of a conductive polymer at a predetermined position, and forming a solid by drying A method of forming an electrolyte layer, such as a method of forming a solid electrolyte layer made of a conductive polymer.

(導電性碳層) (conductive carbon layer)

於上述之固體電解質層13上形成導電性碳層14。導電性碳層14,係將所定量之石墨烯及/或奈米石墨烯,添加混合至將由石墨、碳黑所成之碳材料、以及作為黏合劑之聚酯樹脂、苯酚樹脂、丙烯酸樹脂等分散於有機溶劑所成之塗料之中,並將該混合塗料塗布於固體電解質層13上,乾燥後形成導電性碳層。作為將石墨、碳黑、以及進一步將作為黏合劑之聚酯樹脂、苯酚樹脂、丙烯酸樹脂等分散於有機溶劑所成之塗料,可使用固體電解電容器領域中的導電性碳塗料通常所使用者。且,塗布、乾燥的工程,亦可藉由通常之固體電解電容器之導電性碳層的形成方法。此外,作為構成導電性碳層的材料,亦可含有金屬微粉末。本案之特徵,係在該導電性碳層含有特定量之石墨烯及/或奈米石墨烯此點。 A conductive carbon layer 14 is formed on the solid electrolyte layer 13 described above. The conductive carbon layer 14 is obtained by adding and mixing a predetermined amount of graphene and/or nanographene to a carbon material made of graphite or carbon black, a polyester resin as a binder, a phenol resin, an acrylic resin, or the like. The mixture is dispersed in a coating material made of an organic solvent, and the mixed coating material is applied onto the solid electrolyte layer 13 to form a conductive carbon layer after drying. As a coating material in which graphite, carbon black, and a polyester resin, a phenol resin, an acrylic resin, or the like as a binder are further dispersed in an organic solvent, a conductive carbon coating material in the field of solid electrolytic capacitors can be generally used. Further, the coating and drying process may be carried out by a method of forming a conductive carbon layer of a usual solid electrolytic capacitor. Further, as the material constituting the conductive carbon layer, a metal fine powder may be contained. The feature of the present invention is that the conductive carbon layer contains a specific amount of graphene and/or nanographene.

作為構成導電性碳層14的碳材料,並不限定 於上述之石墨以及碳黑。但是作為一般導電性碳層,多為含有石墨以及碳黑。碳黑之粒徑為3~500nm左右,且粒子徑極小,廣泛地密著於固體電解質層。因此,藉由碳黑 可降低固體電解質層與導電性碳層之界面接觸電阻,故添加碳黑為較佳。作為該碳黑的含量,對形成導電性碳層之固體成份重量全體之重量比為5~20重量%為佳,更加為10~16重量%。在該範圍中可預期ESR的降低。並且作為碳黑較佳為球狀者。且,石墨之大小大多使用在0.1~50μm左右之相對粒徑較大者。石墨本身的導電率較石墨烯及/或奈米石墨烯為低,但石墨之粒徑較大,故在導電性碳層中可使碳材料彼此接觸的接觸頻率變少。因此,作為導電性碳層全體,可降低碳材料彼此之接觸電阻。藉由該理由,以添加石墨為佳。且,準備與如上述般之碳黑的粒徑或石墨的粒徑相同大小的石墨烯及/或奈米石墨烯,並混合各種大小的石墨烯及/或奈米石墨烯,來形成僅由石墨烯及/或奈米石墨烯所成之導電性碳層的話,可謀求進一步降低導電性碳層之電阻。 The carbon material constituting the conductive carbon layer 14 is not limited In the above graphite and carbon black. However, as a general conductive carbon layer, graphite and carbon black are often contained. The particle size of carbon black is about 3 to 500 nm, and the particle diameter is extremely small, and it is widely adhered to the solid electrolyte layer. Therefore, by carbon black The interface contact resistance between the solid electrolyte layer and the conductive carbon layer can be lowered, so that carbon black is preferably added. The content of the carbon black is preferably 5 to 20% by weight, and more preferably 10 to 16% by weight, based on the total weight of the solid component forming the conductive carbon layer. A decrease in ESR can be expected in this range. Further, as carbon black, it is preferably spherical. Further, the size of graphite is often used in a relatively large particle size of about 0.1 to 50 μm. The conductivity of graphite itself is lower than that of graphene and/or nanographene, but the particle size of graphite is large, so that the contact frequency of the carbon materials in contact with each other in the conductive carbon layer is reduced. Therefore, as a whole of the conductive carbon layer, the contact resistance between the carbon materials can be reduced. For this reason, it is preferred to add graphite. Further, graphene and/or nanographene having the same size as the particle diameter of carbon black or the particle diameter of graphite as described above are prepared, and graphene and/or nanographene of various sizes are mixed to form only When the conductive carbon layer formed of graphene and/or nanographene is used, the electric resistance of the conductive carbon layer can be further reduced.

石墨烯及/或奈米石墨烯之含量,對形成導 電性碳層之固體成份重量全體之重量比率為0.5重量%以上為佳。此理由係如同前述。 The content of graphene and/or nanographene The weight ratio of the solid content of the electric carbon layer to the entire weight is preferably 0.5% by weight or more. This reason is as described above.

(銀塗層) (silver coating)

作為形成銀塗層15之銀塗劑,係將導電材之銀粒子分散於樹脂等,大致可分類成高溫燒成型以及聚合物型。 高溫燒成型係藉由加熱至500~900℃左右使銀粒子彼此熔黏,來形成連續性的導電膜,得到導電性。另一方面,聚合物型係以提高塗膜性、銀粒子的分散性、以及與基材 之密著性為目的,含有樹脂,並藉由從室溫加熱到200℃左右之溫度來使樹脂硬化,藉此同時使金屬粒子彼此接觸形成導電膜,來顯現出導電性。 As the silver coating agent for forming the silver coating layer 15, the silver particles of the electrically conductive material are dispersed in a resin or the like, and can be roughly classified into a high-temperature firing molding and a polymer molding. In the high-temperature firing, the silver particles are fused to each other by heating to about 500 to 900 ° C to form a continuous conductive film to obtain conductivity. On the other hand, the polymer type improves the film properties, the dispersibility of the silver particles, and the substrate. For the purpose of adhesion, the resin is contained, and the resin is cured by heating from room temperature to a temperature of about 200 ° C, whereby the metal particles are brought into contact with each other to form a conductive film, thereby exhibiting conductivity.

使用導電性高分子作為固體電解質之固體電 解電容器的情況,較佳為使用聚合物型的銀塗劑,該聚合物型的銀塗劑為可在比導電性高分子之分解溫度還要低的溫度來形成銀塗層。 Solid electricity using a conductive polymer as a solid electrolyte In the case of the capacitor, it is preferred to use a polymer type silver coating agent which can form a silver coating layer at a temperature lower than the decomposition temperature of the conductive polymer.

更具體地來說,銀塗劑可使用將氧化銀奈米 粒子、以及有機銀化合物之新癸酸銀混合於指定的有機溶劑之混合塗劑。 More specifically, a silver coating agent can be used to oxidize silver nanoparticles. The particles, and the silver neodymium silicate of the organic silver compound are mixed in a mixed coating agent of a specified organic solvent.

且,作為於銀塗劑所使用的有機銀化合物, 除了新癸酸銀,亦可使用特戊酸、新庚酸、新壬酸等之三級脂肪酸之銀鹽。 Moreover, as an organic silver compound used in a silver coating agent, In addition to silver neodecanoate, a silver salt of a tertiary fatty acid such as pivalic acid, neoheptanoic acid or neodecanoic acid can also be used.

因該銀塗劑之氧化銀為奈米等級的細微粒 子,故前述之電容器元件之縫隙陷入表面的凹凸之中,可充分確保與固體電解質層的接觸面積。 Because the silver oxide of the silver coating agent is fine particles of nanometer grade Therefore, the gap of the capacitor element described above is trapped in the unevenness of the surface, and the contact area with the solid electrolyte layer can be sufficiently ensured.

然後,將銀塗劑先以150~160℃之溫度範圍 燒結30分鐘,使塗層硬化。然後以170~190℃之溫度範圍熱處理30分鐘,藉此使銀塗層表面的殘留有機物成份揮發。 Then, the silver coating agent first has a temperature range of 150 to 160 ° C Sintering for 30 minutes allowed the coating to harden. Then, it is heat-treated at a temperature of 170 to 190 ° C for 30 minutes to volatilize residual organic components on the surface of the silver coating.

藉由該熱處理,銀粒子彼此成為熔黏之構 造,確保銀塗層內部之導電通路,使銀塗層15全體的導電率提高。且,在上述的溫度範圍不會使銀塗層15產生微裂痕。因此,不會有因微裂痕而導致之導電通路的遮 斷,就此點來看亦可降低銀塗層15之電阻。 By this heat treatment, the silver particles become mutually fused The conductive path inside the silver coating is ensured to increase the electrical conductivity of the entire silver coating layer 15. Moreover, the silver coating layer 15 does not cause microcracks in the above temperature range. Therefore, there is no obstruction of the conductive path due to micro-cracks. Broken, at this point, the resistance of the silver coating 15 can also be lowered.

上述之銀塗層15,構成本發明之陰極引出 層。且,陰極引出層之形成方法,並不限定於上述之藉由銀塗劑來形成銀塗層之方法,可採用藉由金屬蒸鍍來形成陰極引出層之方法等各種方法。 The silver coating layer 15 described above constitutes the cathode lead of the present invention Floor. Further, the method for forming the cathode extraction layer is not limited to the above-described method of forming a silver coating layer by a silver coating agent, and various methods such as a method of forming a cathode extraction layer by metal vapor deposition may be employed.

接著說明搭載基板2。搭載基板係以環氧玻璃 基板等絕緣基板21為基底,在底面具備陽極電極22以及陰極電極23,在上面具備與電容器元件之陽極部、陰極部分別連接之陽極導體24、陰極導體25,並使上面與背面之陽極導體24與陽極電極22、陰極導體25與陰極電極23分別導通。 Next, the mounting substrate 2 will be described. Mounted substrate with epoxy glass The insulating substrate 21 such as a substrate is a base, and includes an anode electrode 22 and a cathode electrode 23 on the bottom surface, and an anode conductor 24 and a cathode conductor 25 which are respectively connected to the anode portion and the cathode portion of the capacitor element, and an anode conductor of the upper surface and the back surface. 24 is electrically connected to the anode electrode 22, the cathode conductor 25, and the cathode electrode 23, respectively.

且,搭載基板2的底面之電極的構成,係可 隨著所連接之CPU等的設計來形成為任意形狀,但是與電容器元件之陽極部、陰極部之形狀相同,以如圖2(b)所示般形成為以陽極電極22包圍陰極電極23之周圍的電極形狀為佳。 Moreover, the structure of the electrode on the bottom surface of the substrate 2 can be mounted. The shape of the connected CPU or the like is formed into an arbitrary shape, but is the same as the shape of the anode portion and the cathode portion of the capacitor element, and is formed to surround the cathode electrode 23 with the anode electrode 22 as shown in FIG. 2(b). The shape of the surrounding electrodes is better.

於搭載基板2之上面形成的陽極導體24、陰 極導體25,只要是與電容器元件1的陽極部17、陰極部16分別配合的形狀即可。圖2(a)表示搭載基板2之從上面所見的立體圖。如之前所示之電容器元件1之構造般,為於凹部形成陰極部16,並將凹部的周圍作為陽極部17之電容器元件1的形狀,配合該形狀,配置成使搭載基板2的陽極導體24包圍陰極導體25。 An anode conductor 24 formed on the upper surface of the mounting substrate 2, The pole conductor 25 may have a shape that fits the anode portion 17 and the cathode portion 16 of the capacitor element 1, respectively. Fig. 2(a) is a perspective view of the mounting substrate 2 as seen from above. As in the configuration of the capacitor element 1 described above, the cathode portion 16 is formed in the concave portion, and the periphery of the concave portion is formed as the shape of the capacitor element 1 of the anode portion 17, and the anode conductor 24 of the substrate 2 is mounted in accordance with the shape. The cathode conductor 25 is surrounded.

將該等陽極電極22、陰極電極23之厚度全部 設為相同厚度,藉此使陽極電極22及陰極電極23的裝配面成為水平的平面,在安裝於裝配基板時可穩定地搭載固體電解電容器。 The thicknesses of the anode electrode 22 and the cathode electrode 23 are all By setting the same thickness, the mounting surface of the anode electrode 22 and the cathode electrode 23 is a horizontal plane, and the solid electrolytic capacitor can be stably mounted when mounted on the mounting substrate.

且,像這樣的陽極電極22與陰極電極23,因 為互相靠近,流過陽極電極22與陰極電極23的電流為反向,故流過各自電極的電流所產生之磁場互相抵銷,可謀求ESL的降低。且,為了防止因為將陽極電極22與陰極電極23互相靠近,而在以焊料來安裝裝配基板時造成的短路,以在陽極電極22與陰極電極23之間形成焊料阻抗層26為佳。 And the anode electrode 22 and the cathode electrode 23 like this In order to approach each other, the current flowing through the anode electrode 22 and the cathode electrode 23 is reversed, so that the magnetic fields generated by the currents flowing through the respective electrodes cancel each other, and the ESL can be lowered. Further, in order to prevent short-circuiting caused by mounting the substrate with solder when the anode electrode 22 and the cathode electrode 23 are brought close to each other, it is preferable to form the solder resist layer 26 between the anode electrode 22 and the cathode electrode 23.

如此般之成為搭載基板之基底的絕緣基板, 使用厚度為200μm左右者就強度來說較適合,但亦可使用厚度為80μm左右者。且,絕緣基板上所形成的陽極電極、陰極電極、導體分別只要為電阻小且可與焊料黏合者即可,較佳為使用銅、鍍金鎳之導體。該電極、導體之厚度可以單面為30~100μm之厚度來形成。 In this way, it becomes an insulating substrate on which the substrate is mounted. A thickness of about 200 μm is suitable for strength, but a thickness of about 80 μm can also be used. Further, the anode electrode, the cathode electrode, and the conductor formed on the insulating substrate may each have a small electric resistance and can be bonded to the solder, and a copper or gold-plated nickel conductor is preferably used. The thickness of the electrode and the conductor can be formed by a thickness of 30 to 100 μm on one side.

作為導通搭載基板2上面的導體24、25與底 面的電極22、23之方法,可藉由雷射來將搭載基板2的特定位置穿孔,並對該孔的內面做通孔電鍍來形成導通。 為了該導通的通孔電鍍之位置、個數等,可因應固體電解電容器所要求的電流容量等特性來任意地設計。 Conducting the conductors 24, 25 and the bottom on the substrate 2 In the method of the electrodes 22 and 23, the specific position of the mounting substrate 2 can be perforated by laser, and the inner surface of the hole can be plated by via plating to form conduction. The position and number of the via plating for the conduction can be arbitrarily designed in accordance with characteristics such as the current capacity required for the solid electrolytic capacitor.

如此般之搭載基板,從電容器元件的陽極 部、陰極部,到電流出口之搭載基板的陽極電極、陰極電極為止的距離,可做成僅為搭載基板的厚度,可謀求電流 流路的縮短化。特別是搭載基板的厚度,以200μm左右的厚度較佳,但亦可以80μm左右的厚度來製造,且該搭載基板的導體、電極之厚度可以30μm左右的厚度來形成這點來看,相較於將電容器元件安裝於引線框架之樹脂模具成型的情況,可將從電容器元件之陰極部到搭載基板之陰極電極為止的距離極端縮短。因此,可謀求降低固體電解電容器的ESL,於暫態響應時可對CPU等迅速地供給電力。 Mounting the substrate in this way, from the anode of the capacitor element The distance between the anode electrode and the cathode electrode of the substrate and the cathode electrode at the current outlet can be set to only the thickness of the substrate to be mounted, and current can be obtained. The shortening of the flow path. In particular, the thickness of the mounting substrate is preferably about 200 μm, but it can be manufactured to a thickness of about 80 μm, and the thickness of the conductor and the electrode of the mounting substrate can be formed by a thickness of about 30 μm. When the capacitor element is mounted on the resin mold of the lead frame, the distance from the cathode portion of the capacitor element to the cathode electrode on which the substrate is mounted can be extremely shortened. Therefore, it is possible to reduce the ESL of the solid electrolytic capacitor, and it is possible to rapidly supply electric power to the CPU or the like in the transient response.

將如上述般的電容器元件1搭載於搭載基板 2,並將電容器元件1的陽極部17與陰極部16分別以導電性接著劑等連接於搭載基板的陽極導體24、陰極導體25,來做成固體電解電容器。 The capacitor element 1 as described above is mounted on a mounting substrate 2. The anode portion 17 and the cathode portion 16 of the capacitor element 1 are respectively connected to the anode conductor 24 and the cathode conductor 25 of the mounting substrate with a conductive adhesive or the like to form a solid electrolytic capacitor.

且,固體電解電容器的介電質皮膜層、固體 電解質層、陰極部係藉由搭載基板來保護,不僅是在製造時的機械壓力,於安裝時對固體電解電容器施加應力的情況,亦可緩衝該應力,來緩和對電容器元件內部所施加的應力。 Moreover, the dielectric film layer and solid of the solid electrolytic capacitor The electrolyte layer and the cathode portion are protected by mounting the substrate, and not only the mechanical pressure at the time of manufacture, but also stress applied to the solid electrolytic capacitor at the time of mounting, the stress can be buffered to alleviate the stress applied to the inside of the capacitor element. .

且,因應必要,亦可將電容器元件以模具樹 脂來模具成型。 And, if necessary, capacitor elements can also be used as mold trees The grease is molded into a mold.

如上述般,電容器元件為100μm左右之厚 度,搭載基板為包含兩面的電極、導體層之厚度共為140μm左右之厚度,因此可以得到最少有240μm左右之厚度的固體電解電容器。 As described above, the capacitor element is about 100 μm thick. In the mounting substrate, the electrode including both surfaces and the thickness of the conductor layer have a thickness of about 140 μm, so that a solid electrolytic capacitor having a thickness of at least 240 μm can be obtained.

且,欲進一步使厚度變薄時,可將作為上述 之搭載基板的基底,以柔性基板般的樹脂薄膜作為基底來製造,藉此來達成。 Moreover, if the thickness is to be further thinned, it can be used as the above The substrate on which the substrate is mounted is produced by using a flexible film-like resin film as a base.

上述實施形態之固體電解電容器中,從容量 形成部亦即介電質氧化物皮膜層與固體電解質層的界面,到成為外部電極的陰極電極為止的距離為短,成為使固體電解電容器的內部電阻極力降低之構造。如此般之謀求內部電阻降低之構造的固體電解電容器中,藉由提高本案發明的導電性碳層之導電率,來使固體電解電容器的ESR降低之效果係更加顯著。 In the solid electrolytic capacitor of the above embodiment, the capacity is The interface between the dielectric oxide film layer and the solid electrolyte layer, and the distance from the interface to the cathode electrode of the external electrode is short, and the internal resistance of the solid electrolytic capacitor is extremely lowered. In the solid electrolytic capacitor having such a structure that the internal resistance is lowered, the effect of lowering the ESR of the solid electrolytic capacitor by the conductivity of the conductive carbon layer of the present invention is more remarkable.

此外,作為固體電解電容器的形狀,並不限定於上述之形狀。例如亦可適用於以下的情況:於將鉭粉燒結而得之陽極體之上方形成由導電性高分子所成之固體電解質層,且進一步在固體電解質層上形成導電性碳層。且,亦可適用於以下的情況:在由鋁板所成之陽極體之上方形成固體電解質層、導電性碳層,且進一步將該陽極體積層複數片來形成固體電解電容器。 Further, the shape of the solid electrolytic capacitor is not limited to the above shape. For example, it is also applicable to a case where a solid electrolyte layer made of a conductive polymer is formed on the anode body obtained by sintering the tantalum powder, and a conductive carbon layer is further formed on the solid electrolyte layer. Further, the present invention can also be applied to a case where a solid electrolyte layer and a conductive carbon layer are formed over an anode body made of an aluminum plate, and the anode volume layer is further formed into a plurality of sheets to form a solid electrolytic capacitor.

實施例 Example

接著將針對本發明的實施例進行說明。 Next, an embodiment of the present invention will be described.

作為陽極體,準備尺寸為5×5mm、厚500μm的鋁材,然後在其中央部形成尺寸為3×3mm的凹部。於該凹部的內面施以蝕刻處理,進一步以形成電壓3.6V來做陽極氧化處理,來形成介電質氧化物皮膜層。 As the anode body, an aluminum material having a size of 5 × 5 mm and a thickness of 500 μm was prepared, and then a concave portion having a size of 3 × 3 mm was formed at the center portion thereof. An etching treatment was applied to the inner surface of the concave portion, and an anodic oxidation treatment was further performed at a voltage of 3.6 V to form a dielectric oxide film layer.

接著於凹部內,滴下聚-3,4-乙烯二氧噻吩(PEDOT: poly(3,4-ethylenedioxythiophene))之分散液,乾燥之後形成由PEDOT所成之固體電解質層。 Then, in the concave portion, poly-3,4-ethylenedioxythiophene (PEDOT: A dispersion of poly(3,4-ethylenedioxythiophene)), after drying, forms a solid electrolyte layer made of PEDOT.

進一步在固體電解質層上形成導電性碳層。 Further, a conductive carbon layer is formed on the solid electrolyte layer.

作為形成導電性碳層時所使用的塗劑,使用日本石墨公司製的電容器集電體塗料之Banihaito(商品名),於該塗劑秤量並添加Bridgestone KBG公司製的「石墨烯」,來調整塗劑材料。且,Bridgestone KBG公司製的「石墨烯」因其積層數為2~40層、厚度為40~100nm,故符合本案說明書中所說明的奈米石墨烯。以下,實施例中所記載的「石墨烯」為商品名,實際上係表示奈米石墨烯。 Banihaito (trade name) of a capacitor current collector coating made by Nippon Graphite Co., Ltd. was used as a coating agent for forming a conductive carbon layer, and the "graphene" manufactured by Bridgestone KBG Co., Ltd. was weighed and adjusted. Paint material. Moreover, "graphene" manufactured by Bridgestone KBG Co., Ltd. has a laminate of 2 to 40 layers and a thickness of 40 to 100 nm, so it conforms to the nanographene described in the specification. Hereinafter, "graphene" described in the examples is a trade name, and actually represents nanographene.

將「石墨烯」的添加量以0.3、1、3、10、20 重量%來調整塗劑材料時,添加10重量%來調整的塗劑其黏性有見增加。此外,即使欲添加20重量%來調整塗劑,會因其黏性過高而無法使各材料混合,無法制作均勻的塗劑。 Add "graphene" to 0.3, 1, 3, 10, 20 When the coating material was adjusted by weight %, the viscosity of the coating agent adjusted by adding 10% by weight was increased. Further, even if 20% by weight is to be added to adjust the coating agent, the viscosity of the coating agent is too high to mix the materials, and a uniform coating agent cannot be produced.

Banihaito係作為黏合劑含於聚酯樹脂之中,其含量大約為10重量%。因此,推測以Banihaito作為原料來調整塗劑的情況,「石墨烯」的添加量可以較少的量來提昇黏性。 Banihaito is contained as a binder in a polyester resin in an amount of about 10% by weight. Therefore, it is estimated that Banihaito is used as a raw material to adjust the amount of the coating agent, and the amount of "graphene" added can be increased to a small amount to improve the viscosity.

在此,為了比較「石墨烯」的添加量的極 限,以丁基卡必醇作為溶劑、以苯酚樹脂作為黏合劑,來變更「石墨烯」與其他碳材料之添加量,試著製作各種塗劑。其結果,即使將塗劑乾燥後的導電性碳層之構成材料 的重量比,以「石墨烯」為54重量%、科琴黑為1重量%、苯酚樹脂為46重量%來設定各材料的添加量,作為塗劑的黏性亦不會太高,確認可塗布於固體電解電容器的固體電解質層(各材料幾乎均勻地混合,且操作性良好)。 Here, in order to compare the amount of "graphene" added In addition, butyl carbitol was used as a solvent, and a phenol resin was used as a binder to change the amount of "graphene" and other carbon materials, and various coating agents were tried. As a result, even a constituent material of the conductive carbon layer after the coating agent is dried The weight ratio is set to 54% by weight of "graphene", 1% by weight of Ketjen black, and 46% by weight of phenol resin. The amount of each material added is not too high, and the viscosity of the coating agent is not too high. The solid electrolyte layer applied to the solid electrolytic capacitor (each material was almost uniformly mixed, and the workability was good).

因此,得知藉由變更塗劑的構成材料,「石墨烯」的添加量亦可成為50重量%以上。且,考慮作為電容器的ESR特性,「石墨烯」的添加量以未滿50重量%為佳。 Therefore, it has been found that the amount of "graphene" added can be 50% by weight or more by changing the constituent material of the coating agent. Further, considering the ESR characteristics of the capacitor, the amount of "graphene" added is preferably less than 50% by weight.

如下所示的表1,表示「石墨烯」的添加量、與將Banihaito作為原料來調整塗劑材料並乾燥之後的「石墨烯」的存在比率(含量)。且,Banihaito中亦含有球狀的科琴黑,該存在比率(含量)亦記載於該表。該表中於存在比率欄記載成具有範圍,是因為原料之Banihaito具有含於塗劑之固體成份之容許範圍的最大值及最小值,在該最大值及最小值的範圍內將塗劑中的有機溶劑成份全部乾燥之後,形成僅由固體成份所成導電性碳層者,並以此來算出存在比率。 Table 1 below shows the ratio (content) of "graphene" after the addition amount of "graphene" and the adjustment of the paint material by using Banihaito as a raw material. Moreover, Banihaito also contains a spherical Ketchen Black, and the existence ratio (content) is also shown in the table. The table is described as having a range in the presence ratio column because the raw material of Banihaito has a maximum value and a minimum value of the allowable range of the solid component contained in the coating agent, and the coating agent is in the range of the maximum value and the minimum value. After all the organic solvent components were dried, a conductive carbon layer formed only of a solid component was formed, and the ratio of existence was calculated.

使用上述之以往例、實施例1~實施例4所示 的塗劑種類,並塗布塗劑於固體電解質層,且以160℃乾燥之後形成導電性碳層。 The above conventional examples and the first to fourth embodiments are used. The type of the coating agent was applied to the solid electrolyte layer and dried at 160 ° C to form a conductive carbon layer.

進一步於導電性碳層上以周知的方法形成銀 塗層。 Further forming silver on a conductive carbon layer by a known method coating.

將以上述之方法所形成的電容器元件,搭載 於投影面積與電容器元件相同的搭載基板上,來完成以往例、實施例1~實施例4的固體電解電容器。 The capacitor element formed by the above method is mounted The solid electrolytic capacitors of the conventional examples and the first to fourth embodiments were completed on the same mounting substrate as the capacitor element.

測定上述以往例、實施例1~實施例4的固體 電解電容器的電容量及ESR。之後,將固體電解電容器以周圍溫度170℃無負載放置100小時,測定放置後的電容量、ESR的變化率。 The solids of the above conventional examples and Examples 1 to 4 were measured. Capacitance and ESR of electrolytic capacitors. Thereafter, the solid electrolytic capacitor was left unloaded at an ambient temperature of 170 ° C for 100 hours, and the rate of change in capacitance and ESR after standing was measured.

該結果表示於下述表2。 The results are shown in Table 2 below.

由表2所示之結果可得知,電容量在以往例 以及實施例1~實施例4,其初始值以及於170℃放置100小時後的變化率,看起來均無太大差異。但是,相對於以往ESR之初始值13.9mΩ,實施例1~實施例4的初始值為11.8~10.4mΩ,得知可使ESR大幅減低2.1~3.5mΩ。且得知科琴黑的含量為10~16重量%之各實施例相較於以往例,具有ESR之減低效果。且亦得知相較於科琴黑,「石墨烯」的含量較多的實施例4有著更進一步的ESR減低效果。 It can be seen from the results shown in Table 2 that the capacitance is in the past. As well as Examples 1 to 4, the initial values and the rate of change after leaving at 170 ° C for 100 hours did not seem to differ much. However, the initial values of the first to fourth embodiments were 11.8 to 10.4 mΩ with respect to the conventional initial value of ESR of 13.9 mΩ, and it was found that the ESR can be greatly reduced by 2.1 to 3.5 mΩ. Further, each of the examples in which the content of Ketjen black was 10 to 16% by weight was compared with the conventional example, and the ESR was reduced. Further, it was also found that Example 4 having a large content of "graphene" has a further ESR reducing effect as compared with Ketjen black.

由上述實施例的資料,計算「石墨烯」的添 加量與ESR初始值的關聯,並進行添加微量石墨烯時的模擬。與上述實施例同樣地添加「石墨烯」0.1重量%時,初始的ESR值為13.3mΩ(參考例1),添加0.2重量%時為12.7mΩ(參考例2)。該等之參考例1、參考例2之「石墨烯」的添加量,換算成「石墨烯」的存在比率時,各自為0.3~0.8重量%、0.6~1.6重量%。 Calculate the addition of "graphene" from the data of the above embodiment The addition is related to the initial value of ESR and the simulation when adding trace amounts of graphene. When 0.1% by weight of "graphene" was added in the same manner as in the above examples, the initial ESR value was 13.3 mΩ (Reference Example 1), and when 0.2% by weight was added, it was 12.7 mΩ (Reference Example 2). The amount of addition of "graphene" in Reference Example 1 and Reference Example 2 is 0.3 to 0.8% by weight and 0.6 to 1.6% by weight in terms of the ratio of "graphene".

該模擬的結果,如下表3所示。 The results of this simulation are shown in Table 3 below.

該表3所示之模擬結果指出,即使「石墨 烯」的存在比率為0.5重量%,亦可見固體電解電容器之ESR減低效果。 The simulation results shown in Table 3 indicate that even "graphite The existence ratio of the olefin is 0.5% by weight, and the ESR reduction effect of the solid electrolytic capacitor can also be seen.

此外,比較在170℃放置100小時後的ESR, 於以往例中,ESR的值上升25倍,相對於此,實施例2~實施例4為13~4.3倍,上升倍率較低。就此點來看亦可得知,隨著「石墨烯」的添加量增加,固體電解電容器的耐熱性會提高。 In addition, compare the ESR after placing at 170 ° C for 100 hours, In the conventional example, the value of ESR is increased by 25 times. On the other hand, Examples 2 to 4 are 13 to 4.3 times, and the rate of increase is low. From this point of view, it is also known that as the amount of "graphene" added increases, the heat resistance of the solid electrolytic capacitor increases.

1‧‧‧電容器元件 1‧‧‧ capacitor components

2‧‧‧連接板 2‧‧‧Connecting board

11‧‧‧鋁材 11‧‧‧Aluminum

12‧‧‧介電質氧化物皮膜層 12‧‧‧Dielectric oxide coating

13‧‧‧固體電解質層 13‧‧‧Solid electrolyte layer

14‧‧‧導電性碳層 14‧‧‧ Conductive carbon layer

15‧‧‧銀塗層 15‧‧‧Silver coating

16‧‧‧陰極部 16‧‧‧ Cathode

17‧‧‧陽極部 17‧‧‧Anode

21‧‧‧絕緣基板 21‧‧‧Insert substrate

22‧‧‧陽極導體 22‧‧‧Anode conductor

23‧‧‧陰極導體 23‧‧‧Cathode conductor

24‧‧‧陽極導體 24‧‧‧Anode conductor

25‧‧‧陰極導體 25‧‧‧Cathode conductor

26‧‧‧焊料阻抗層 26‧‧‧ solder resist layer

C‧‧‧固體電解電容器 C‧‧‧Solid electrolytic capacitor

Claims (3)

一種固體電解電容器,係在由金屬材料所成之陽極體的表面上,依序形成介電質氧化皮膜層、固體電解質層、導電性碳層及陰極引出層之固體電解電容器,其特徵為,前述導電性碳層含有石墨烯及/或奈米石墨烯。 A solid electrolytic capacitor is a solid electrolytic capacitor in which a dielectric oxide film layer, a solid electrolyte layer, a conductive carbon layer and a cathode lead layer are sequentially formed on a surface of an anode body made of a metal material, wherein The conductive carbon layer contains graphene and/or nanographene. 如請求項1所述之固體電解電容器,其中構成導電性碳層的固體成份重量之石墨烯及/或奈米石墨烯的含量為0.5重量%以上。 The solid electrolytic capacitor according to claim 1, wherein the content of the graphene and/or nanographene which constitutes the solid component of the conductive carbon layer is 0.5% by weight or more. 如請求項1或2所述之固體電解電容器,其中前述導電性碳層進一步含有碳黑,其含量相對於構成前述導電性碳層的固體成份重量,為5~20重量%之範圍。 The solid electrolytic capacitor according to claim 1 or 2, wherein the conductive carbon layer further contains carbon black in an amount of 5 to 20% by weight based on the weight of the solid component constituting the conductive carbon layer.
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