TW201431977A - Metal and electronic device coating process for marine use and other environments - Google Patents

Metal and electronic device coating process for marine use and other environments Download PDF

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TW201431977A
TW201431977A TW103116220A TW103116220A TW201431977A TW 201431977 A TW201431977 A TW 201431977A TW 103116220 A TW103116220 A TW 103116220A TW 103116220 A TW103116220 A TW 103116220A TW 201431977 A TW201431977 A TW 201431977A
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compound
article
parylene
conformal coating
coating
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TW103116220A
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Chinese (zh)
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Sidney Edward Martin
Eric Roger Dawicki
Angela Michele Dawicki
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Hzo Inc
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Abstract

The present disclosure relates, in part, to Parylene based conformal coating compositions having improved properties, e.g. improved heat transfer and durability characteristics, as well as a methods and apparatus to coat objects with these compositions, and objects coated with these compositions. In some aspects, coating compositions comprising Parylene and boron nitride are disclosed. The disclosure also includes objects (e.g., electronic equipment, textiles, etc.) having a conformal coating comprising a Parylene compound and boron nitride.

Description

於海洋使用和其它環境之金屬和電子元件塗覆製程 Metal and electronic component coating processes for marine use and other environments

本發明部分關於具有改良特性(舉例來說,改良的熱傳輸特徵及改良的耐受性特徵)的保形塗覆組成物,以及用以利用該些組成物來塗覆物件的方法及裝置,以及塗覆著該些組成物的物件,舉例來說,電子設備。 The present invention is directed, in part, to conformal coating compositions having improved properties, for example, improved heat transfer characteristics and improved resistance characteristics, and methods and apparatus for coating articles using such compositions, And articles coated with the compositions, for example, electronic devices.

保形塗覆物(舉例來說,具有高電阻係數和抗濕能力的塗覆)常被用來保護運用在消費性產業、自動汽車產業、軍事產業、醫療產業、以及航空產業中之商用元件中的器件。目前有各式各樣的方法用來塗敷此等塗覆物。舉例來說,低壓化學氣相沉積便能夠在各種表面上產生一薄的、均勻保形的(conformal)(亦稱為形狀相符的(conformational))塗覆層。需要有改良的方法來塗敷保形塗覆層,以便擴大它們的應用。再者,亦需要有其特徵會改良特定應用中之有效用的新型塗覆組成物。舉例來說,尤其是尋找出具有更大耐受性及更大熱傳輸特性的塗覆層。 Conformal coatings (for example, coatings with high resistivity and moisture resistance) are often used to protect commercial components used in the consumer, automotive, military, medical, and aerospace industries. In the device. A variety of methods are currently available for coating such coatings. For example, low pressure chemical vapor deposition can produce a thin, uniform conformal (also known as conformate) coating on various surfaces. There is a need for improved methods for coating conformal coatings in order to expand their use. Furthermore, there is a need for new coating compositions whose characteristics will improve their effectiveness in a particular application. For example, in particular, coating layers with greater tolerance and greater heat transfer characteristics are sought.

本案申請人已經找到某種程度上會阻止濕氣滲入的超薄、保形聚合物塗覆物,以及用以將此等塗覆物塗敷至物件上的方法與裝置。會阻止濕氣滲入的超薄、保形聚合物塗覆物可直接被塗敷至各種範圍的物 件,尤其是,其包含「現成的(off-the-shelf)」電子設備。據此,本發明的某些觀點包含用於塗覆物件的組成物、方法、以及裝置。於其它觀點中,本發明揭示能夠於一物件上形成一超薄、保形塗覆層的保形塗覆化合物,例如聚對二甲苯(parylene)化合物。於其它觀點中,本發明揭示塗覆組成物,其包括:能夠形成一超薄、保形塗覆層的保形塗覆化合物;以及一(或多種)添加劑(例如導熱材料,舉例來說,氮化硼),用以改性該保形塗覆層之數種特性(舉例來說,其包含電阻係數、導熱係數、透光性、硬度、以及耐受性)中的任一特性。於其它觀點中,本發明包含「現成的」電子設備,例如行動電話以及mp3播放機,其具有會阻止濕氣滲入的超薄、保形塗覆層(舉例來說,防水塗覆層)。本發明還揭示藉由氣相沉積用以於一物件的表面上塗敷一超薄、保形塗覆層的方法與裝置。於其它觀點中,本發明揭示用於氣相沉積超薄、保形聚合物塗覆層的多階段加熱裝置。本文所揭示之要藉由該等塗覆組成物與方法來塗覆的物件包含:電子設備,例如行動電話、無線電、電路板、以及揚聲器;用於海洋與空間探測的設備;有害廢棄物運送設備;醫療儀器;紙材產品;以及紡織品。一物件的任何固態表面均可被塗覆,其包含塑膠、金屬、木材、紙材以及紡織原料。生醫元件(舉例來說,助聽器、耳蝸植入器、義肢等)、自動車、電機系統、藝術品(繪畫、木製品、水彩、粉筆畫、油墨畫、木炭畫)、軍用系統器件、彈藥、槍枝、武器、以及雷同的物件皆可以使用本文所揭示的方法及塗覆組成物來塗覆。 Applicants have found ultra-thin, conformal polymer coatings that prevent moisture infiltration to some extent, and methods and apparatus for applying such coatings to articles. An ultra-thin, conformal polymer coating that prevents moisture from penetrating can be applied directly to a wide range of materials In particular, it includes "off-the-shelf" electronic devices. Accordingly, certain aspects of the invention include compositions, methods, and devices for coating articles. In other aspects, the present invention discloses conformal coating compounds capable of forming an ultra-thin, conformal coating on an article, such as a parylene compound. In other aspects, the present invention discloses a coating composition comprising: a conformal coating compound capable of forming an ultrathin, conformal coating layer; and one (or more) additives (eg, a thermally conductive material, for example, Boron nitride) is used to modify any of the properties of the conformal coating layer (for example, it includes resistivity, thermal conductivity, light transmission, hardness, and resistance). In other views, the present invention encompasses "off-the-shelf" electronic devices, such as mobile phones and mp3 players, having an ultra-thin, conformal coating (for example, a water-repellent coating) that prevents moisture from penetrating. The present invention also discloses a method and apparatus for applying an ultra-thin, conformal coating on the surface of an article by vapor deposition. In other aspects, the present invention discloses a multi-stage heating apparatus for vapor deposition of an ultrathin, conformal polymer coating. Articles disclosed herein to be coated by such coating compositions and methods include: electronic devices such as mobile phones, radios, circuit boards, and speakers; equipment for marine and space detection; hazardous waste transportation Equipment; medical equipment; paper products; and textiles. Any solid surface of an article can be coated, including plastic, metal, wood, paper, and textile materials. Biomedical components (for example, hearing aids, cochlear implants, prosthetic limbs, etc.), automatic vehicles, motor systems, art (painting, woodwork, watercolor, chalk, ink painting, charcoal painting), military system components, ammunition, guns Branches, weapons, and identical objects can be coated using the methods and coating compositions disclosed herein.

根據某些觀點,本發明提供的塗覆組成物包括一保形塗覆化合物以及一導熱材料。於某些具體實例中,該導熱材料會被交互散佈在該保形塗覆化合物的聚合物之中。於某些具體實例中,該塗覆組成物為固體(舉例來說,一保形塗覆層),其硬度為約R80至約R95。於某些具體實例中,該塗覆組成物為氣態混合物,其包括氣相的保形塗覆化合物單體。於特殊的具體實例中,該氣態混合物包括該導熱材料的固態粒子。 According to certain aspects, the coating composition provided by the present invention comprises a conformal coating compound and a thermally conductive material. In some embodiments, the thermally conductive material is interspersed among the polymers of the conformal coating compound. In some embodiments, the coating composition is a solid (for example, a conformal coating) having a hardness of from about R80 to about R95. In some embodiments, the coating composition is a gaseous mixture comprising a conformal coating compound monomer in the vapor phase. In a particular embodiment, the gaseous mixture comprises solid particles of the thermally conductive material.

於某些具體實例中,該保形塗覆化合物為聚對二甲苯化合物,其係視情況地選擇自由下面所組成的群之中:D型聚對二甲苯化合物、C型聚對二甲苯化合物、N型聚對二甲苯化合物以及HT型聚對二甲苯化合物®。於某些具體實例中,該塗覆組成物包括二或多種不同的聚對二甲苯化合物。於某些具體實例中,該塗覆組成物包括不同純度的二或多種聚對二甲苯化合物。於某些具體實例中,該塗覆組成物的導熱係數比單獨的聚對二甲苯化合物高出5至10%。於某些具體實例中,該塗覆組成物的導熱係數位準比單獨的聚對二甲苯化合物高出10%。於某些具體實例中,該塗覆組成物的導熱係數比單獨的聚對二甲苯化合物高出上達至約5%。 In some embodiments, the conformal coating compound is a parylene compound, optionally selected from the group consisting of: a D-type poly-p-xylene compound, a C-type poly-p-xylene compound. , N-type poly-p-xylene compound and HT-type parylene compound®. In some embodiments, the coating composition includes two or more different parylene compounds. In some embodiments, the coating composition comprises two or more parylene compounds of different purities. In some embodiments, the coating composition has a thermal conductivity that is 5 to 10% higher than the parylene compound alone. In some embodiments, the coating composition has a thermal conductivity level that is 10% higher than the individual parylene compound alone. In some embodiments, the coating composition has a thermal conductivity that is up to about 5% higher than the parylene compound alone.

於某些具體實例中,該導熱材料為陶瓷。於某些具體實例中,該導熱材料係選擇自由下面所組成的群之中:氮化鋁、氧化鋁以及氮化硼。於某些具體實例中,該導熱材料的體阻係數大於1010歐姆*公分。於某些具體實例中,該塗覆組成物中的導熱材料的質量高達該塗覆組成物中的保形塗覆化合物及導熱材料之總質量的約3%(甚至更高)。於某些具體實例中,該塗覆組成物中的導熱材料的質量高達該塗覆組成物中的保形塗覆化合物及導熱材料之總質量的約1%。 In some embodiments, the thermally conductive material is a ceramic. In some embodiments, the thermally conductive material is selected from the group consisting of aluminum nitride, aluminum oxide, and boron nitride. In some embodiments, the thermal conductivity of the thermally conductive material is greater than 1010 ohms*cm. In some embodiments, the amount of thermally conductive material in the coating composition is up to about 3% (or even higher) of the total mass of the conformal coating compound and the thermally conductive material in the coating composition. In some embodiments, the amount of thermally conductive material in the coating composition is up to about 1% of the total mass of the conformal coating compound and the thermally conductive material in the coating composition.

於某些觀點中,本發明提供的保形塗覆層係位於一物件之表面的至少一部分之上。於某些具體實例中,該保形塗覆層包括任何前述塗覆組成物。 In some aspects, the conformal coating provided by the present invention is positioned over at least a portion of the surface of an article. In some embodiments, the conformal coating layer comprises any of the foregoing coating compositions.

於某些具體實例中,該保形塗覆層係位於一物件之表面的至少一部分之上,其中,該物件為一電子元件。視情況,該電子元件可能係由下面之中所選出:通訊元件、揚聲器、行動電話、音頻播放器、照相機、視頻播放器、遙控元件、全球定位系統、電腦器件、雷達顯示器、深度探測器、魚群探測器、緊急指位無線電信標(EPIRB)、緊急定位訊號發射器(ELT)以及個人定位信標(PLB)。 In some embodiments, the conformal coating layer is over at least a portion of a surface of an article, wherein the article is an electronic component. Depending on the situation, the electronic component may be selected from the following: communication components, speakers, mobile phones, audio players, cameras, video players, remote controls, global positioning systems, computer devices, radar displays, depth detectors, Fish Detector, Emergency Positioning Radio Beacon (EPIRB), Emergency Positioning Signal Transmitter (ELT), and Personal Positioning Beacon (PLB).

於某些具體實例中,該保形塗覆層係位於一物件之表面的至少一部分之上,其中,該物件係選擇自由下面所組成的群之中:紙材產品、紡織產品、藝術品、電路板、海洋探測元件、空間探測元件、有害廢棄物運送元件、自動車元件、電機元件、軍用系統器件、彈藥、槍枝、武器、醫療儀器以及生醫元件,其中,該生醫元件係視情況地選擇自由下面所組成的群之中:助聽器、耳蝸植入器以及義肢。 In some embodiments, the conformal coating layer is positioned on at least a portion of a surface of an article, wherein the article is selected from the group consisting of: paper products, textile products, artwork, Circuit boards, marine detecting components, space detecting components, hazardous waste transporting components, automatic vehicle components, motor components, military system components, ammunition, firearms, weapons, medical instruments, and biomedical components, wherein the biomedical components are as appropriate The ground is chosen to be free among the following groups: hearing aids, cochlear implants, and prostheses.

於某些具體實例中,該保形塗覆層係位於一物件之表面的至少一部分之上,其中,該表面為塑膠、金屬、木材、紙材或是紡織原料。於特定的具體實例中,該表面係該物件的外表面。於特定的具體實例中,該表面係該物件的內表面。 In some embodiments, the conformal coating layer is on at least a portion of a surface of an article, wherein the surface is a plastic, metal, wood, paper, or textile material. In a particular embodiment, the surface is the outer surface of the article. In a particular embodiment, the surface is the inner surface of the article.

於某些觀點中,本發明提供的物件包括一位於一表面的至少一部分之上的保形塗覆層。於某些具體實例中,該物件之表面上的保形塗覆層包括任何前述塗覆組成物。 In some aspects, the invention provides an article comprising a conformal coating layer over at least a portion of a surface. In some embodiments, the conformal coating on the surface of the article comprises any of the foregoing coating compositions.

於某些具體實例中,該物件係一電子元件,該電子元件係視情況地由下面之中所選出:通訊元件、揚聲器、行動電話、音頻播放器、照相機、視頻播放器、遙控元件、全球定位系統、電腦器件、雷達顯示器、深度探測器、魚群探測器、緊急指位無線電信標(EPIRB)、緊急定位訊號發射器(ELT)以及個人定位信標(PLB)。 In some embodiments, the object is an electronic component that is optionally selected from the group consisting of: communication components, speakers, mobile phones, audio players, cameras, video players, remote controls, global Positioning systems, computer devices, radar displays, depth detectors, fish finder, emergency finger radio beacons (EPIRB), emergency location signal transmitters (ELTs), and personal location beacons (PLBs).

於某些具體實例中,該物件係選擇自由下面所組成的群之中:紙材產品、紡織產品、藝術品、電路板、海洋探測元件、空間探測元件、有害廢棄物運送元件、自動車元件、電機元件、軍用系統器件、彈藥、槍枝、武器、醫療儀器以及生醫元件,其中,該生醫元件係視情況地選擇自由下面所組成的群之中:助聽器、耳蝸植入器以及義肢。 In some embodiments, the article is selected from the group consisting of: paper products, textile products, artwork, circuit boards, marine detecting components, space detecting components, hazardous waste transport components, automated vehicle components, Motor components, military system components, ammunition, guns, weapons, medical instruments, and biomedical components, wherein the biomedical components are optionally selected from the group consisting of hearing aids, cochlear implants, and prosthetic limbs.

於某些具體實例中,該物件的該表面為塑膠、金屬、木材、紙材或是紡織原料。於特定的具體實例中,該物件會被塗覆在一外表面上。 於特定的具體實例中,該物件會被塗覆在一內表面上。於某些具體實例中,該表面實質上會被該保形塗覆層覆蓋。一實質上被覆蓋的表面可能係一被完全覆蓋或被充分覆蓋的表面,以便保護該物件的下方表面,使其不會接觸該保護作用希望隔離的物質(舉例來說,水)。 In some embodiments, the surface of the article is plastic, metal, wood, paper, or textile material. In a particular embodiment, the article will be coated on an outer surface. In a particular embodiment, the article will be coated on an inner surface. In some embodiments, the surface is substantially covered by the conformal coating. A substantially covered surface may be a fully covered or fully covered surface to protect the underlying surface of the article from contact with the material (e.g., water) that the protection desires to isolate.

於某些觀點中,本發明提供將保形塗覆層塗敷至一物件上的方法。於某些具體實例中,該等方法包括:A)加熱一保形塗覆化合物,用以形成該保形塗覆化合物的氣態單體;B)結合一導熱材料與該等氣態單體,從而形成一氣態混合物;以及C)於包括該保形塗覆化合物及該導熱材料的保形塗覆層會被形成在物件之表面的至少一部分上的條件下,讓該物件接觸該氣態混合物,從而塗敷一保形塗覆層至該物件。 In some aspects, the invention provides a method of applying a conformal coating to an article. In some embodiments, the method comprises: A) heating a conformal coating compound to form a gaseous monomer of the conformal coating compound; B) combining a thermally conductive material with the gaseous monomer, thereby Forming a gaseous mixture; and C) allowing the article to contact the gaseous mixture under conditions in which the conformal coating layer comprising the conformal coating compound and the thermally conductive material is formed on at least a portion of the surface of the article A conformal coating is applied to the article.

於該等方法的某些具體實例中,該保形塗覆化合物係視情況選擇自由下面所組成的群之中的聚對二甲苯化合物:D型聚對二甲苯化合物、C型聚對二甲苯化合物、N型聚對二甲苯化合物、以及HT型聚對二甲苯化合物®。 In some embodiments of the methods, the conformal coating compound is optionally selected from the group consisting of polyparaxylene compounds in the group consisting of: a D-type poly-p-xylene compound, a C-type parylene. Compound, N-type parylene compound, and HT-type parylene compound®.

於該等方法的某些具體實例中,該導熱材料為陶瓷。於其它具體實例中,該導熱材料係選擇自由下面所組成的群之中:氮化鋁、氧化鋁以及氮化硼。於特定的具體實例中,該導熱材料為固態粒子形式。於特殊的具體實例中,該等固態粒子為約1.8微米至約2.5微米。 In some embodiments of the methods, the thermally conductive material is a ceramic. In other embodiments, the thermally conductive material is selected from the group consisting of aluminum nitride, aluminum oxide, and boron nitride. In a particular embodiment, the thermally conductive material is in the form of solid particles. In a particular embodiment, the solid particles are from about 1.8 microns to about 2.5 microns.

於某些具體實例中,該等方法包括:A)將一聚對二甲苯化合物加熱至約125℃至約200℃的溫度,用以形成一氣態聚對二甲苯化合物,其中,該聚對二甲苯化合物的加熱會在二或多個加熱階段中來實施; B)將該氣態聚對二甲苯化合物加熱至約650℃至約700℃的溫度,用以裂解該氣態聚對二甲苯化合物,從而形成聚對二甲苯單體;C)於包括一聚對二甲苯聚合物的保形塗覆物會被形成在一物件之表面的至少一部分上的條件下,讓該物件接觸該等聚對二甲苯單體,從而塗敷一塗覆層至該物件。 In some embodiments, the method comprises: A) heating a parylene compound to a temperature of from about 125 ° C to about 200 ° C to form a gaseous parylene compound, wherein the poly pair Heating of the toluene compound can be carried out in two or more heating stages; B) heating the gaseous parylene compound to a temperature of from about 650 ° C to about 700 ° C for cracking the gaseous parylene compound to form a parylene monomer; C) comprising a poly-pair A conformal coating of the toluene polymer is formed on at least a portion of the surface of the article, the article being contacted with the parylene monomer to apply a coating to the article.

於該等方法的某些具體實例中,步驟A包括將該聚對二甲苯化合物加熱至約125℃至約180℃的溫度,以及將該聚對二甲苯化合物加熱至約200℃至約220℃的溫度。 In certain embodiments of the methods, step A includes heating the parylene compound to a temperature of from about 125 ° C to about 180 ° C, and heating the parylene compound to between about 200 ° C and about 220 ° C. temperature.

於該等方法的某些具體實例中,該氣態聚對二甲苯化合物的加熱會在二或多個階段中來實施。於某些具體實例中,步驟B包括將該氣態聚對二甲苯化合物加熱至約680℃的溫度,以及將該氣態聚對二甲苯化合物加熱至至少約700℃的溫度。 In certain embodiments of the methods, the heating of the gaseous parylene compound can be carried out in two or more stages. In some embodiments, step B includes heating the gaseous parylene compound to a temperature of about 680 ° C and heating the gaseous parylene compound to a temperature of at least about 700 ° C.

於某些具體實例中,該聚對二甲苯化合物係選擇自由下面所組成的群之中:D型聚對二甲苯化合物、C型聚對二甲苯化合物、N型聚對二甲苯化合物、以及HT型聚對二甲苯化合物®。 In some embodiments, the parylene compound is selected from the group consisting of a D-type poly-p-xylene compound, a C-type poly-p-xylene compound, an N-type poly-p-xylene compound, and HT. Type of parylene compound®.

於某些具體實例中,該等方法進一步包括於矽烷會活化該物件之表面的條件下,於步驟C之前先讓該物件接觸氣態矽烷。於某些具體實例中,該矽烷係選擇自由下面所組成的群之中的一或多種矽烷:矽烷偶聯劑(Silquest)® A-174,矽烷偶聯劑® 111,以及矽烷偶聯劑® A-174(NT)。 In some embodiments, the methods further comprise contacting the article with gaseous decane prior to step C under conditions in which the decane activates the surface of the article. In certain embodiments, the decane is selected from one or more of the following groups: silane coupling agent (Silquest)® A-174, decane coupling agent® 111, and decane coupling agent®. A-174 (NT).

在前面方法的某些具體實例中,該物件於步驟C期間係處於約5℃至約30℃的溫度。於某些具體實例中,被塗敷至該表面的保形塗覆層為約100埃至約3.0毫米。於某些具體實例中,被塗敷至該表面的保形塗覆層厚約0.0025mm至約0.050mm。 In some embodiments of the foregoing method, the article is at a temperature of from about 5 ° C to about 30 ° C during step C. In some embodiments, the conformal coating applied to the surface is from about 100 angstroms to about 3.0 millimeters. In some embodiments, the conformal coating applied to the surface is from about 0.0025 mm to about 0.050 mm thick.

在前面方法的某些具體實例中,該物件為一電子元件,視情況,該電子元件係由下面之中所選出:通訊元件、揚聲器、行動電話、音 頻播放器、照相機、視頻播放器、遙控元件、全球定位系統、電腦器件、雷達顯示器、深度探測器、魚群探測器、緊急指位無線電信標(EPIRB)、緊急定位訊號發射器(ELT)以及個人定位信標(PLB)。 In some specific examples of the foregoing method, the object is an electronic component, and the electronic component is selected from the following: a communication component, a speaker, a mobile phone, and a sound. Frequency players, cameras, video players, remote controls, global positioning systems, computer devices, radar displays, depth detectors, fish detectors, emergency finger radio beacons (EPIRB), emergency position transmitters (ELT), and Personal Location Beacon (PLB).

在前面方法的某些具體實例中,該物件係選擇自由下面所組成的群之中:紙材產品、紡織產品、藝術品、電路板、海洋探測元件、空間探測元件、有害廢棄物運送元件、自動車元件、電機元件、軍用系統器件、彈藥、槍枝、武器、醫療儀器以及生醫元件,其中,該生醫元件係視情況地選擇自由下面所組成的群之中:助聽器、耳蝸植入器以及義肢。 In some specific examples of the foregoing methods, the object is selected from the group consisting of: paper products, textile products, artwork, circuit boards, marine detecting elements, space detecting elements, hazardous waste transport elements, Automated vehicle components, motor components, military system components, ammunition, guns, weapons, medical instruments, and biomedical components, wherein the biomedical components are optionally selected from the following group: hearing aids, cochlear implants And prosthetic.

在前面方法的某些具體實例中,該表面為塑膠、金屬、木材、紙材以及紡織原料。 In some specific examples of the foregoing methods, the surface is plastic, metal, wood, paper, and textile materials.

於某些觀點中,本發明所提供的物件會藉由任何前面的方法將一塗覆層塗敷至一表面(外部或內部)的至少一部分。 In some aspects, the articles provided by the present invention will apply a coating to at least a portion of a surface (outer or interior) by any of the foregoing methods.

於某些觀點中,本發明提供一種用於將一保形塗覆層塗敷至一物件的裝置。於某些具體實例中,該裝置包括:一汽化室,其包括至少兩個溫度區;一熱解室,其在操作上可連結至該汽化室;以及一真空室,其在操作上可連結至該熱解室。於某些具體實例中,該裝置進一步包括一連接器,其在操作上會連結該熱解室與該真空室,其中,該連接器能夠在該熱解室與該真空室之間傳送氣體,且其中,該連接器包括一T埠口。於某些具體實例中,該T埠口在操作上會連結一注射構件,用以將一導熱材料注入一經由該連接器從該熱解室被傳送至該真空室的氣體之中。於某些具體實例中,該真空室中所產生的真空會經由該T埠口將該導熱材料吸入含有該氣體的連接器之中。 In some aspects, the present invention provides an apparatus for applying a conformal coating to an article. In some embodiments, the apparatus includes: a vaporization chamber including at least two temperature zones; a pyrolysis chamber operatively coupled to the vaporization chamber; and a vacuum chamber operatively linkable To the pyrolysis chamber. In some embodiments, the apparatus further includes a connector operatively coupled to the pyrolysis chamber and the vacuum chamber, wherein the connector is capable of transporting gas between the pyrolysis chamber and the vacuum chamber, And wherein the connector comprises a T port. In some embodiments, the T-port is operatively coupled to an injection member for injecting a thermally conductive material into a gas that is transferred from the pyrolysis chamber to the vacuum chamber via the connector. In some embodiments, the vacuum generated in the vacuum chamber draws the thermally conductive material into the connector containing the gas via the T-port.

於某些具體實例中,該真空室包括一沉積室,其在操作上可連結至該熱解室與一真空產生器件。於某些具體實例中,該真空產生器件(真空構件)包括一或多個真空唧筒。 In some embodiments, the vacuum chamber includes a deposition chamber operatively coupled to the pyrolysis chamber and a vacuum generating device. In some embodiments, the vacuum generating device (vacuum member) includes one or more vacuum cylinders.

於某些具體實例中,該汽化室具有兩個溫度區。於某些具體實例中,該汽化室係一管狀熔爐。 In some embodiments, the vaporization chamber has two temperature zones. In some embodiments, the vaporization chamber is a tubular furnace.

於某些具體實例中,該熱解室具有複數個溫度區。於某些具體實例中,該熱解室具有兩個溫度區。於某些具體實例中,該熱解室係一管狀熔爐。 In some embodiments, the pyrolysis chamber has a plurality of temperature zones. In some embodiments, the pyrolysis chamber has two temperature zones. In some embodiments, the pyrolysis chamber is a tubular furnace.

1‧‧‧汽化室 1‧‧‧vaporization room

1’‧‧‧物件 1’‧‧‧ objects

2‧‧‧器件 2‧‧‧Device

2’‧‧‧氮化硼層 2'‧‧‧ Boron Nitride Layer

3‧‧‧熱解室 3‧‧‧ Pyrolysis Room

3’‧‧‧聚對二甲苯化合物層 3'‧‧‧Polypylene compound layer

4‧‧‧閥門 4‧‧‧ Valve

4’‧‧‧物件 4’‧‧‧ objects

5‧‧‧器件 5‧‧‧Device

5’‧‧‧聚對二甲苯化合物層 5'‧‧‧Polypylene compound layer

6‧‧‧沉積室 6‧‧‧Deposition room

6’‧‧‧氮化硼 6'‧‧‧ Boron Nitride

7‧‧‧要被塗覆的物件 7‧‧‧Items to be coated

7’‧‧‧物件 7’‧‧‧ objects

8‧‧‧器件/連接器 8‧‧‧Devices/Connectors

8’‧‧‧塗覆層 8'‧‧‧ Coating

9‧‧‧真空構件 9‧‧‧Vacuum components

10‧‧‧溫度區 10‧‧‧ Temperature zone

11‧‧‧溫度區 11‧‧‧ Temperature zone

12‧‧‧溫度區 12‧‧‧ Temperature zone

13‧‧‧溫度區 13‧‧‧temperature zone

14‧‧‧真空室/系統 14‧‧‧vacuum room/system

15‧‧‧汽化室 15‧‧‧vaporization room

16‧‧‧器件 16‧‧‧Devices

17‧‧‧熱解室 17‧‧‧ Pyrolysis Room

18‧‧‧閥門 18‧‧‧ Valve

19‧‧‧器件 19‧‧‧Device

20‧‧‧T埠口 20‧‧‧T埠口

21‧‧‧沉積室 21‧‧‧Deposition room

22‧‧‧要被塗覆的物件 22‧‧‧ Items to be coated

23‧‧‧器件 23‧‧‧Device

24‧‧‧真空構件 24‧‧‧Vacuum components

25‧‧‧真空室/系統 25‧‧‧vacuum room/system

配合隨附圖式來參考下面的說明便可瞭解本發明的進一步優點,其中:圖1A至E所示的係各式各樣聚對二甲苯化合物與矽烷偶聯劑®的化學結構圖式。圖1A為N型聚對二甲苯化合物的圖式。圖1B為C型聚對二甲苯化合物的圖式。圖1C為D型聚對二甲苯化合物的圖式。圖1D為HT型聚對二甲苯化合物®的圖式。圖1E為矽烷偶聯劑® A-174矽烷(亦稱為矽烷偶聯劑® A-174(NT))的圖式。 Further advantages of the present invention will be apparent from the following description with reference to the accompanying drawings in which: FIG. 1A-E shows the chemical structure of various polyparaxylene compounds and decane coupling agent®. Figure 1A is a diagram of an N-type parylene compound. Figure 1B is a diagram of a C-type parylene compound. Figure 1C is a diagram of a D-type parylene compound. Figure 1D is a diagram of the HT-type parylene compound®. Figure 1E is a diagram of a decane coupling agent® A-174 decane (also known as decane coupling agent® A-174 (NT)).

圖2A所示的係用於化學氣相沉積聚對二甲苯化合物的裝置的其中一具體實例的概略示意圖。 Fig. 2A is a schematic view showing a specific example of a device for chemical vapor deposition of a parylene compound.

圖2B所示的係用於塗敷一聚對二甲苯化合物與粉末之塗覆層的裝置的其中一具體實例的概略示意圖。 Fig. 2B is a schematic view showing a specific example of a device for coating a coating layer of a parylene compound and a powder.

圖3A至C所示的係經聚對二甲苯化合物塗覆的物件的三個具體實例的概略示意圖。圖3A繪製的係塗覆著分離的聚對二甲苯化合物層與氮化硼層的物件,其中,該氮化硼層最靠近該物件。圖3B繪製的係塗覆著分離的聚對二甲苯化合物層與氮化硼層的物件,其中,該聚對二甲苯化合物層最靠近該物件。圖3C繪製的係塗覆著一與氮化硼交互散佈的聚對二甲苯化合物層的物件。 3A to C are schematic diagrams showing three specific examples of articles coated with a parylene compound. Figure 3A depicts an article coated with a layer of separated parylene compound and a layer of boron nitride, wherein the layer of boron nitride is closest to the article. Figure 3B depicts an article coated with a layer of separated parylene compound and a layer of boron nitride, wherein the layer of parylene compound is closest to the article. Figure 3C depicts an article coated with a layer of parylene compound interleaved with boron nitride.

本發明於某些觀點中提供用於以保形聚合物來塗覆物件的 組成物、方法、以及裝置。於某些觀點中,本發明提供能夠在一物件上形成一超薄、保形塗覆層的保形塗覆化合物(舉例來說,聚對二甲苯化合物)。於另一項觀點中,於其它觀點中,本發明提供的塗覆組成物包括一保形塗覆化合物(舉例來說,聚對二甲苯化合物)與一(或多種)添加劑(舉例來說,導熱材料),用以改性該塗覆層之數種特性(舉例來說,其包含電阻係數、導熱係數、透光性、硬度以及耐受性)中的任一特性。於其它觀點中,本發明提供物件,例如電子元件,其具有會阻止濕氣滲入的超薄、保形塗覆層(舉例來說,防水塗覆層)。本發明還提供藉由氣相沉積用以於一物件的一表面的至少一部分上塗敷一超薄、保形塗覆層的方法與裝置。於特定的觀點中,本發明提供用於氣相沉積超薄、保形聚合物塗覆層的多階段加熱裝置。 The present invention provides, in certain aspects, for coating articles with conformal polymers Compositions, methods, and devices. In some aspects, the present invention provides a conformal coating compound (e.g., a parylene compound) capable of forming an ultra-thin, conformal coating on an article. In another aspect, in other aspects, the coating composition provided by the present invention comprises a conformal coating compound (for example, a parylene compound) and one (or more) additives (for example, A thermally conductive material) for modifying any of a plurality of characteristics of the coating layer (for example, including resistivity, thermal conductivity, light transmittance, hardness, and resistance). In other aspects, the present invention provides articles, such as electronic components, having an ultra-thin, conformal coating (e.g., a water repellent coating) that prevents moisture from penetrating. The present invention also provides a method and apparatus for applying an ultra-thin, conformal coating layer on at least a portion of a surface of an article by vapor deposition. In a particular aspect, the present invention provides a multi-stage heating apparatus for vapor deposition of an ultrathin, conformal polymer coating.

本文所揭示的一項特別重要發現係,保形塗覆物可直接被塗敷至「已事先組裝」或「現成的」元件,例如消費性電子元件。因此,利用本文揭示的方法及組成物可以將保形塗覆物塗敷至「已事先組裝」或「現成的」元件的所有或一部分的外表面(舉例來說,用以創造密閉或接近密閉的密封),並且從而保護該等元件的內部器件,使其不會受到環境破壞(例如濕氣滲入與氧化)。據此,使用本文揭示的方法,不必拆開、塗覆、並且重新組裝特定的物件(舉例來說,電子元件(設備)),相反地,於其「現成的」狀態中便可以塗覆該物件。本文揭示的方法可以將一保形塗覆層(舉例來說,其包括一聚對二甲苯化合物)塗敷至一電子元件裡面的電路板以及該電子元件的外表面(舉例來說,在單一製程中)。因此,該等方法特別有利於配合「現成的」電子設備來使用。本文揭示的方法亦非常適用於改良保形塗覆其它物件的容易度與效率。 A particularly important finding disclosed herein is that the conformal coating can be applied directly to "pre-assembled" or "off-the-shelf" components, such as consumer electronic components. Thus, the conformal coating can be applied to the outer surface of all or a portion of the "pre-assembled" or "off-the-shelf" component using the methods and compositions disclosed herein (for example, to create a closed or nearly closed seal) The seals) and thus the internal components of the components are protected from environmental damage (eg, moisture infiltration and oxidation). Accordingly, it is not necessary to disassemble, coat, and reassemble a particular article (for example, an electronic component (device)) using the methods disclosed herein, and conversely, in the "off-the-shelf" state, it can be coated. object. The method disclosed herein can apply a conformal coating layer (including, for example, a parylene compound) to a circuit board inside an electronic component and an outer surface of the electronic component (for example, in a single In the process). Therefore, these methods are particularly advantageous for use with "off-the-shelf" electronic devices. The methods disclosed herein are also well suited for improving the ease and efficiency of conformal coating of other articles.

適合利用本文揭示的組成物與方法來進行保形塗覆的物件包含,但是並不受限於:電子設備、照相機、電路板、電腦晶片、紙材、紡織品、電池、揚聲器、固態燃料、醫療元件、有害廢棄物運送設備、有 害廢棄物、醫療儀器、用於海洋與空間探測的設備、太空裝備等。於某些具體實例中,該物件為一電子元件。該電子元件係視情況地由下面之中所選出:通訊元件、揚聲器、行動電話、音頻播放器、照相機、視頻播放器、遙控元件、全球定位系統、電腦器件、雷達顯示器、深度探測器、魚群探測器、緊急指位無線電信標(EPIRB)、緊急定位訊號發射器(ELT)以及個人定位信標(PLB)。 Objects suitable for conformal coating using the compositions and methods disclosed herein include, but are not limited to, electronic devices, cameras, circuit boards, computer chips, paper, textiles, batteries, speakers, solid fuels, medical Components, hazardous waste transportation equipment, Waste, medical equipment, equipment for marine and space exploration, space equipment, etc. In some embodiments, the object is an electronic component. The electronic components are selected from the following: communication components, speakers, mobile phones, audio players, cameras, video players, remote control components, global positioning systems, computer devices, radar displays, depth detectors, fish schools Detector, Emergency Positioning Radio Beacon (EPIRB), Emergency Positioning Signal Transmitter (ELT), and Personal Positioning Beacon (PLB).

於某些具體實例中,該等物件為無法沒入水中的物件,其包含,但是並不受限於現成的電子器件,例如膝上型電腦、照相機、無線電、行動電話、紙材、紡織品、電池、揚聲器、固態燃料、醫療元件、紙材、太空裝備、以及本文所揭示或本技術中已知的其它物件。於其它具體實例中,該等物件可能係沒入水中會受損的物件,例如,但是並不受限於金屬螺絲與其它硬體、紙材產品與紡織品。於其它具體實例中,該等物件可能係需要撓性以便發揮功能的物件,例如揚聲器。於進一步具體實例中,該等物件可能係需要保護避免受到氧氣破壞的物件,例如,但是並不受限於燃料電池、武器、彈藥筒、以及彈藥。於進一步具體實例中,該等物件可能係必須與環境隔離的物件,例如有害廢棄產物。於進一步具體實例中,該等物件可能係需要保護避免受到化學曝露破壞的物件,例如,但是並不受限於有害廢棄物運送設備。 In some embodiments, the items are items that cannot be submerged, including, but not limited to, off-the-shelf electronics such as laptops, cameras, radios, mobile phones, paper, textiles, Batteries, speakers, solid fuels, medical components, paper, space equipment, and other items disclosed herein or known in the art. In other embodiments, the items may be items that are damaged by immersion in water, for example, but are not limited to metal screws and other hardware, paper products, and textiles. In other embodiments, the items may be items that require flexibility to function, such as a speaker. In further embodiments, the items may be items that need to be protected from oxygen damage, such as, but not limited to, fuel cells, weapons, cartridges, and ammunition. In further embodiments, the items may be items that must be isolated from the environment, such as hazardous waste products. In further embodiments, such items may be items that need to be protected from chemical exposure, for example, but are not limited to hazardous waste transport equipment.

該等塗覆物可被塗敷至具有各式各樣表面材料的物件,舉例來說,其包含:陶瓷、聚合物、塑膠、金屬、冷凍液體等。於某些具體實例中,要被塗覆的物件可能係會產生或消耗熱及/或需要粗糙塗覆層的物件。於某些具體實例中,該物件可能會產生熱或吸收熱的物件,例如冷敷袋、冷凍液體與氣體、以及加熱唧筒。於某些具體實例中,該物件可能預期在其壽命期間會遭遇到嚴厲的物理衝擊。於某些觀點中,本發明提供可用來塗覆此等物件與表面的方法。 The coatings can be applied to articles having a wide variety of surface materials including, for example, ceramics, polymers, plastics, metals, frozen liquids, and the like. In some embodiments, the article to be coated may be an article that will generate or consume heat and/or require a rough coating. In some embodiments, the article may generate heat or heat absorbing articles such as cold packs, chilled liquids and gases, and heated cartridges. In some embodiments, the article may be expected to experience severe physical shocks during its lifetime. In some aspects, the present invention provides methods for coating such articles and surfaces.

本文所揭示的保形塗覆物可被塗敷至消費性電子業、營利性海洋業、休閒遊艇業、軍方(航空與防禦)、工業與醫界、以及其它業界中所使用的各種元件。於某些場合中,該等保形塗覆層會經過特別設計,用以「密封」元件。舉例來說,此等塗覆層可用於保護海洋及有害環境中常用的元件,避免因曝露於濕氣、沒入水中、灰塵、強風及化學藥劑作用的關係而造成操作上的誤動作。該等塗覆層可強化容易受到腐蝕與損毀的操作設備及高價專業產品的存活力及持續力。 The conformal coatings disclosed herein can be applied to various components used in the consumer electronics, for-profit marine, recreational marine, military (aviation and defense), industrial and medical, and other industries. . In some cases, the conformal coatings are specifically designed to "seal" the components. For example, such coatings can be used to protect marine and hazardous components in the environment, avoiding operational malfunctions due to exposure to moisture, submerged water, dust, strong winds, and chemical action. These coatings enhance the viability and sustainability of operating equipment and high-priced specialty products that are susceptible to corrosion and damage.

於某些具體實例中,該保形塗覆層可能係位於該物件的內表面與外表面之上,且明確地說,位於該物件外側上的保形塗覆層會與位於該物件內側上的保形塗覆層連貫。 In some embodiments, the conformal coating layer may be located on the inner and outer surfaces of the article, and in particular, the conformal coating on the outer side of the article may be located on the inside of the article. The conformal coating is coherent.

於需要利用化合物,舉例來說,有機化合物(例如矽烷),進行前置處理的某些場合中,非常適合具有能夠曝露在該前置處理化合物(舉例來說,曝露在其氣態中)中之固態表面的任何物件。據此,其中一具體實例提供已經過矽烷(例如矽烷偶聯劑®)前置處理之塗覆著至少一保形塗覆化合物的物件,其中,未被塗覆的物件便無法沒入水中。無法沒入水中之未經塗覆的物件可能為會在沒入水中之後部分或完全喪失功能的物件。於較佳的具體實例中,該等物件可能係於未經塗覆時會在沒入水中且接著進行烘乾之後變成至少部分沒有功能的物件,其包含,但是並不受限於現成的電子器件,例如膝上型電腦、無線電、以及行動電話。 In some applications where a compound, such as an organic compound (e.g., decane), is pretreated, it is highly desirable to have the ability to be exposed to the pretreatment compound (for example, exposed to its gaseous state). Any object on a solid surface. Accordingly, one embodiment provides an article coated with at least one conformal coating compound that has been pretreated with decane (e.g., decane coupling agent®), wherein the uncoated article cannot be submerged. An uncoated item that cannot be submerged may be an item that will partially or completely lose its function after it has fallen into the water. In a preferred embodiment, the articles may be at least partially non-functional after being uncoated and then dried, and include, but are not limited to, off-the-shelf electronics. Devices such as laptops, radios, and mobile phones.

倘若塗覆著至少一保形塗覆化合物(且視情況經矽烷前置處理過的)物件的外表面中有間隙讓保形塗覆化合物氣體(視情況,及/或矽烷氣體)進入該物件內部的話,那麼於該物件的外側上及該物件的內側上便可能均會有一保形塗覆層。於一較佳的具體實例中,外側的保形塗覆層會與內側的保形塗覆層連貫。 If there is a gap in the outer surface of the article coated with at least one conformal coating compound (and optionally pre-treated with decane), the conformal coating compound gas (as appropriate, and/or decane gas) enters the object. Internally, there may be a conformal coating on both the outside of the article and the inside of the article. In a preferred embodiment, the outer conformal coating layer will be continuous with the inner conformal coating layer.

該等經塗覆的物件可能特別適用在軍方所遭遇到的嚴厲環 境條件中。於某些具體實例中,該經塗覆的物件可以符合軍用規格MIL PRF-38534的應用要求,其為混合微型電路、多晶片模組(MCM)、以及雷同元件的一般效能要求。於某些具體實例中,該經塗覆的物件可以符合軍用規格MIL PRF-38535的應用要求,其為積體電路或微型電路的一般效能要求。於某些具體實例中,該經塗覆的物件可以同時符合軍用規格MIL PRF-38534及MIL PRF-38535兩者的應用要求。 These coated objects may be particularly suitable for the severe ring encountered by the military. In the context. In some embodiments, the coated article can meet the application requirements of the military specification MIL PRF-38534, which is a general performance requirement for hybrid microcircuits, multi-chip modules (MCMs), and similar components. In some embodiments, the coated article can meet the application requirements of the military specification MIL PRF-38535, which is a general performance requirement for an integrated circuit or microcircuit. In some embodiments, the coated article can simultaneously meet the application requirements of both military specifications MIL PRF-38534 and MIL PRF-38535.

另一具體實例包含塗覆著聚對二甲苯化合物及氮化硼組成物的物件(舉例來說,藉由本文所揭示的方法)。要藉由此方法來塗覆的物件包含具有一固態表面的任何物件,其中,該固態表面能夠在適合於該物件之該表面中的至少一部分上形成一保形塗覆層(其包括聚對二甲苯聚合物及氮化硼)的條件下接觸氣態的聚對二甲苯單體與氮化硼。此等物件包含,但是並不受限於:電子設備、電路板、紙材、紡織品、電池、揚聲器、固態燃料、醫療元件、有害廢棄物運送設備、有害廢棄物、用於海洋與空間探測的設備、太空裝備、以及本文所揭示及/或本技術中已知的其它物件。於某些具體實例中,該物件可能係會產生或消耗熱的物件,例如,但是並不受限於:電腦、用於深孔鑽鑿的鑽鑿設備、鑽油井上的外曝電子元件。於其它具體實例中,該物件可能係需要特別粗糙塗覆層的物件。 Another specific example includes articles coated with a parylene compound and a boron nitride composition (for example, by the methods disclosed herein). An article to be coated by such a method comprises any article having a solid surface, wherein the solid surface is capable of forming a conformal coating layer (including a poly-pair) on at least a portion of the surface suitable for the article The gaseous polyparaxylene monomer and boron nitride are contacted under the conditions of xylene polymer and boron nitride. These items are, but are not limited to, electronic equipment, circuit boards, paper, textiles, batteries, speakers, solid fuels, medical components, hazardous waste transport equipment, hazardous waste, for marine and space exploration. Equipment, space equipment, and other items disclosed herein and/or known in the art. In some embodiments, the item may be an item that generates or consumes heat, such as, but not limited to, a computer, a drilling apparatus for deep hole drilling, and an externally exposed electronic component on a well. In other embodiments, the article may be an article that requires a particularly rough coating.

倘若塗覆著至少一保形塗覆化合物與導熱材料(舉例來說,氮化硼)的物件的外表面中有間隙讓包括該保形塗覆化合物與該導熱材料(舉例來說,氮化硼粉末粒子)的氣態混合物進入該物件內部的話,那麼於該物件的外側上及該物件的內側上便可能均會有一保形塗覆層。於一較佳的具體實例中,外側的保形塗覆層會與內側的保形塗覆層連貫。舉例來說,一電子元件,例如行動電話,可能會在該元件裡面的電路板與電池上以及該行動電話的鍵盤與螢幕上具有一保形塗覆層。 If there is a gap in the outer surface of the article coated with at least one conformal coating compound and a thermally conductive material (for example, boron nitride), including the conformal coating compound and the thermally conductive material (for example, nitriding) If the gaseous mixture of boron powder particles enters the interior of the article, then a conformal coating may be present on both the outside of the article and the inside of the article. In a preferred embodiment, the outer conformal coating layer will be continuous with the inner conformal coating layer. For example, an electronic component, such as a mobile phone, may have a conformal coating on the circuit board and battery inside the component and on the keyboard and screen of the mobile phone.

於某些具體實例中,該聚對二甲苯化合物與該氮化硼可能會 交互散佈在圖3C中的物件7上的塗覆層8內。於某些具體實例中,該聚對二甲苯化合物與該氮化硼的交互散佈可能為分子層級。於某些具體實例中,該交互散佈的聚對二甲苯化合物與氮化硼塗覆層可能為約0.0025mm至約0.050mm。於其它具體實例中,該交互散佈的聚對二甲苯化合物與氮化硼塗覆層可能小於約2.0mm。 In some embodiments, the parylene compound and the boron nitride may be The interaction is interspersed within the coating layer 8 on the article 7 in Figure 3C. In some embodiments, the interdiffusion of the parylene compound with the boron nitride may be at a molecular level. In some embodiments, the inter-dispersed parylene compound and boron nitride coating layer may be from about 0.0025 mm to about 0.050 mm. In other embodiments, the inter-dispersed parylene compound and boron nitride coating layer may be less than about 2.0 mm.

於其它具體實例中,會在該物件上的分離層中發現至少一保形塗覆層(例如聚對二甲苯保形塗覆層)與該氮化硼。本發明感興趣的保形塗覆物包含,但是並不受限於:聚萘(1-4-萘)、二胺(聯鄰甲苯胺)、聚四氟乙烯(鐵氟龍®)、聚亞醯胺。於較佳的具體實例,該聚合物塗覆物可能為C型聚對二甲苯化合物。於其它具體實例中,可能會使用其它形式的聚對二甲苯化合物,其包含,但是並不受限於:N型聚對二甲苯化合物、D型聚對二甲苯化合物、以及HT型聚對二甲苯化合物®。於較佳的具體實例,該等氮化硼塗覆層與聚合物塗覆層可能各約為0.05mm厚。於其它較佳的具體實例,每一層可能基本上含有該聚合物塗覆層或是基本上含有氮化硼。於某些具體實例中,圖3A中的氮化硼層2可能比聚對二甲苯化合物層3更靠近物件1。於其它具體實例中,圖3B中的聚對二甲苯化合物層5可能比氮化硼6更靠近物件4。 In other embodiments, at least one conformal coating (e.g., a parylene conformal coating) and boron nitride are found in the separation layer on the article. Conformal coatings of interest to the present invention include, but are not limited to, polynaphthalene (1-4-naphthalene), diamine (toluidine), polytetrafluoroethylene (Teflon®), poly Amidoxime. In a preferred embodiment, the polymer coating may be a C-type parylene compound. In other embodiments, other forms of parylene compounds may be used, including, but not limited to, N-type parylene compounds, D-type parylene compounds, and HT-type poly-pairs. Toluene Compound®. In a preferred embodiment, the boron nitride coating layer and the polymer coating layer may each be about 0.05 mm thick. In other preferred embodiments, each layer may comprise substantially the polymer coating layer or substantially contain boron nitride. In some embodiments, the boron nitride layer 2 of FIG. 3A may be closer to the object 1 than the layer of the parylene compound 3. In other embodiments, the parylene compound layer 5 in FIG. 3B may be closer to the article 4 than the boron nitride 6.

保形組成物/塗覆物Conformal composition/coating

根據某些觀點,本發明提供塗覆組成物,其包括一保形塗覆化合物與一導熱材料。本文所使用的「保形塗覆化合物」為能夠在一表面上形成一與該表面之幾何形狀一致的超薄、無針孔、聚合塗覆層的化合物(舉例來說,部分純化的化合物、純化的化合物、合成的化合物、隔離的天然化合物)。此等塗覆物於本文中亦稱為「保形塗覆物」。一保形塗覆化合物亦可等效稱為「形狀相符的塗覆化合物」。保形塗覆化合物可藉由各種方法(舉例來說,化學氣相沉積)被當作一塗覆物塗敷至一物件的表面。舉例來說, 保形塗覆化合物的氣相單體可以在該等單體會濃縮、吸附至一物件之表面的條件下接觸該物件的表面,並且因而聚合在一起用以在該表面上形成一無針孔的保形塗覆層。該等塗覆層的厚度範圍可能從約10埃高達50微米甚至更高,端視應用而定。舉例來說,一塗覆層的厚度可能高達3毫米。於某些具體實例中,該塗覆層的厚度為約0.0025mm至約0.050mm。該等保形塗覆層可能為電絕緣體(舉例來說,體阻係數大於1010歐姆*公分)。或者,甚至除此之外,該等保形聚合物的硬度可能為約R70至約R90(洛氏硬度值)。該等保形塗覆物亦可能為疏水性,端視應用而定。保形塗覆化合物可能存在於各式各樣的形式,其包含單體形與聚合物形(舉例來說,二聚形、多聚形),以及各式各樣的相態(舉例來說,氣態、固態)。 According to certain aspects, the present invention provides a coating composition comprising a conformal coating compound and a thermally conductive material. As used herein, a "conformal coating compound" is an ultra-thin, pinhole-free, polymeric coating compound capable of forming a surface conforming to the geometry of the surface (for example, a partially purified compound, Purified compound, synthetic compound, isolated natural compound). Such coatings are also referred to herein as "conformal coatings." A conformal coating compound may also be equivalently referred to as a "shape-compatible coating compound". The conformal coating compound can be applied as a coating to the surface of an article by various methods (for example, chemical vapor deposition). for example, The vapor phase monomer of the conformal coating compound can contact the surface of the article under conditions in which the monomers are concentrated and adsorbed onto the surface of an article, and thus polymerized together to form a pinhole free surface on the surface. Conformal coating. The thickness of the coatings may range from about 10 angstroms up to 50 microns or even higher, depending on the application. For example, a coating layer may have a thickness of up to 3 mm. In some embodiments, the coating layer has a thickness of from about 0.0025 mm to about 0.050 mm. The conformal coating layer may be an electrical insulator (for example, a bulk resistance coefficient greater than 1010 ohms*cm). Alternatively, or even other than that, the conformal polymer may have a hardness of from about R70 to about R90 (Rockwell hardness value). The conformal coatings may also be hydrophobic, depending on the application. Conformal coating compounds may be present in a wide variety of forms, including monomeric and polymeric forms (e.g., dimeric, polymeric), as well as a wide variety of phases (for example, , gaseous, solid).

特別實用的保形塗覆化合物為聚對二甲苯化合物。聚對二甲苯化合物為一獨特化合物系列中各成員的通用名稱。該系列中的基本成員(稱為N型聚對二甲苯化合物)為聚對二甲苯,其係由對二甲苯二聚體([2,2]對環芳烷)所製成的化合物。N型聚對二甲苯化合物係一完全線性、高度結晶的材料。C型聚對二甲苯化合物,其為該系列中的第二種市售成員,其係由相同的單體所產出的,其僅藉由氯原子取代該等芳香氫中其中一者加以修正。D型聚對二甲苯化合物,其為該系列中的第三種成員,其係由相同的單體所產出的,其係藉由氯原子取代該等芳香氫中其中兩者加以修正。D型聚對二甲苯化合物的性質和C型聚對二甲苯化合物雷同,但增加了耐受更高使用溫度的能力。於某些具體實例中,該聚對二甲苯化合物可能係藉由對各種化學成分進行置換而衍生自聚對二甲苯。於較佳的具體實例中,該聚對二甲苯化合物可能能夠形成線性、高度結晶的材料。亦可以使用其它的聚對二甲苯化合物分子,舉例來說,前述的衍生物與類同物。於某些具體實例中,可以使用商用來源(舉例來說,Specialty Coating Systems(SCS),Inc.)所提供的聚對二甲苯化合物。 A particularly useful conformal coating compound is a parylene compound. The parylene compound is the common name for each member of a unique series of compounds. A basic member of this series (referred to as an N-type poly-p-xylene compound) is parylene, which is a compound made of p-xylene dimer ([2,2]-p-cycloalkane). The N-type parylene compound is a completely linear, highly crystalline material. a C-type parylene compound, which is a second commercially available member of the series, which is produced from the same monomer, which is corrected by replacing only one of the aromatic hydrogens with a chlorine atom. . A D-type parylene compound, which is a third member of the series, which is produced from the same monomer, is modified by replacing one of the aromatic hydrogens with a chlorine atom. The properties of the D-type parylene compound are similar to those of the C-type parylene compound, but increase the ability to withstand higher use temperatures. In some embodiments, the parylene compound may be derived from parylene by displacement of various chemical components. In a preferred embodiment, the parylene compound may be capable of forming a linear, highly crystalline material. Other polyparaxylene compound molecules can also be used, for example, the aforementioned derivatives and analogs. In some embodiments, a parylene compound provided by a commercial source (for example, Specialty Coating Systems (SCS), Inc.) can be used.

保形塗覆化合物可能還包含,但是並不受限於:聚萘(1,4-萘)、二胺(聯鄰甲苯胺)、聚四氟乙烯(鐵氟龍®)、以及聚亞醯胺。熟習本技術的人士便非常明瞭,該些聚合物可以藉由標準的技術來塗敷。 Conformal coating compounds may also include, but are not limited to, polynaphthalene (1,4-naphthalene), diamine (toluidine), polytetrafluoroethylene (Teflon®), and polyarylene amine. It will be readily apparent to those skilled in the art that the polymers can be applied by standard techniques.

包括聚對二甲苯化合物的保形塗覆層可能具有熱絕緣性,並且不會輕易地讓該經塗覆的物件釋放熱至環境中。聚對二甲苯化合物的此項特徵對於會產生熱的物件(例如電子設備)可能會有問題,熱如果未被消散的話便可能會導致該設備的早期失效。本文所揭示之某些以聚對二甲苯化合物為基礎的保形塗覆物包含導熱材料,其有助於從該經塗覆的物件處進行散熱。相較於單獨聚對二甲苯化合物的塗覆層,此等保形塗覆層可用於藉由釋放熱或吸收熱來塗覆需要散熱的物件。本文所揭示之該等以聚對二甲苯化合物為基礎的保形塗覆組成物的硬度亦可能會高於單獨聚對二甲苯化合物的塗覆層。所以,該等以聚對二甲苯化合物為基礎的塗覆組成物亦可用於塗覆需要有粗糙的保護塗覆層的物件,例如在它們的壽命期間會遭遇到嚴厲物理衝擊的物件。 The conformal coating layer comprising the parylene compound may be thermally insulating and does not readily allow the coated article to release heat to the environment. This feature of the parylene compound can be problematic for articles that generate heat, such as electronic devices, which, if not dissipated, can cause early failure of the device. Certain conformal coatings based on parylene compounds disclosed herein comprise a thermally conductive material that facilitates heat dissipation from the coated article. These conformal coating layers can be used to coat articles that require heat dissipation by releasing heat or absorbing heat as compared to coating layers of individual parylene compounds. The hardness of the conformal coating composition based on the parylene compound disclosed herein may also be higher than that of the coating layer of the individual parylene compound alone. Therefore, these coating compositions based on parylene compounds can also be used to coat articles that require a rough protective coating, such as articles that experience severe physical shock during their lifetime.

因此,根據本發明的某些觀點,保形塗覆化合物可結合其它(多種)添加劑,用以取得相較於單獨該保形塗覆化合物會具有一或多項改良效能特性的塗覆組成物。舉例來說,可以生產具有改良熱傳輸能力的塗覆組成物。本文所使用的「導熱材料」為能夠結合一保形塗覆化合物的材料,用以形成一導熱係數大於單獨該保形塗覆化合物之導熱係數的塗覆組成物。本文所使用的導熱材料的導熱係數通常會高於保形塗覆化合物本身。示範性導熱材料的導熱係數至少為1W/(m*K),至少為5W/(m*K),至少為10W/(m*K),至少為15W/(m*K),或是至少為20W/(m*K)。熟習本技術的人士便會明白,有各式各樣用於測量導熱係數的方法,舉例來說,其包含在下面標準中所提出的測試方法:IEEE標準98-2002,「固態電絕緣材料熱評估測試程序製備標準(Standard for the Preparation of Test Procedures for the Thermal Evaluation of Solid Electrical Insulating Materials)」,ISBN 0-7381-3277-2;ASTM標準D5470-06,「導熱電絕緣材料之熱傳遞特性的標準測試方法(Standard Test Method for Thermal Transmission Properties of Thermally Conductive Electrical Insulation Materials)」;ASTM標準E1225-04,「藉由防護-比較-縱向熱流技術之固體導熱係數的標準測試方法(Standard Test Method for Thermal Conductivity of Solids by Means of the Guarded-Comparative-Longitudinal Heat Flow Technique)」;ASTM標準D5930-01,「藉由瞬變線發射源技術之塑膠導熱係數的標準測試方法(Standard Test Method for Thermal Conductivity of Plastics by Means of a Transient Line-Source Technique)」;以及ISO 22007-2:2008「塑膠-導熱係數與熱擴散係數之決定-第2部;瞬變平面熱源(熱盤)法(Plastics-Determination of thermal conductivity and thermal diffusivity-Part 2;Transient plane heat source(hot disc)method)」。示範性導熱材料包含各種陶瓷材料,舉例來說,其包含二氧化矽與氮化矽。導熱材料亦可能係選擇自由下面所組成的群之中:氮化鋁、氧化鋁、以及氮化硼。舉例來說,其它的導熱材料包含二氧化鈦(TiO2)。又,熟習本技術的人士便會明白其它的導熱材料。於某些具體實例中,該塗覆組成物包括一保形塗覆化合物與六硼化鑭(LaB6)。於某些具體實例中,該塗覆組成物包括一保形塗覆化合物與二氧化矽(SiO2)。 Thus, in accordance with certain aspects of the present invention, the conformal coating compound can be combined with other additive(s) to achieve a coating composition that has one or more improved performance characteristics compared to the conformal coating compound alone. For example, a coating composition having improved heat transfer capability can be produced. As used herein, "thermally conductive material" is a material that is capable of bonding a conformal coating compound to form a coating composition having a thermal conductivity greater than the thermal conductivity of the conformal coating compound alone. The thermal conductivity of the thermally conductive materials used herein will generally be higher than the conformal coating compound itself. The exemplary thermally conductive material has a thermal conductivity of at least 1 W/(m*K), at least 5 W/(m*K), at least 10 W/(m*K), at least 15 W/(m*K), or at least It is 20W/(m*K). Those skilled in the art will appreciate that there are a variety of methods for measuring the thermal conductivity, for example, which include the test methods set forth in the following standards: IEEE Standard 98-2002, "Thermal Electrical Insulation Material Heat Standard for the Preparation of Test Procedures for the Thermal Evaluation of Solid Electrical Insulating Materials), ISBN 0-7381-3277-2; ASTM Standard D5470-06, "Standard Test Method for Thermal Transmission Properties of Thermally Conductive Electrical Insulation Materials)"; ASTM Standard E1225-04, "Standard Test Method for Thermal Conductivity of Solids by Means of the Guarded-Comparative-Longitudinal Heat Flow Technique ); ASTM Standard D5930-01, "Standard Test Method for Thermal Conductivity of Plastics by Means of a Transient Line-Source Technique"; and ISO 22007 -2:2008 "Plastics-Determination of thermal conductivity and thermal diffusivity-Part 2; Transient plane heat source (hot disc) - Part 2; Transient plane heat source (hot disc) method )method)". Exemplary thermally conductive materials include various ceramic materials including, for example, hafnium oxide and tantalum nitride. Thermally conductive materials may also be selected from the group consisting of aluminum nitride, aluminum oxide, and boron nitride. For example, other thermally conductive materials include titanium dioxide (TiO2). Moreover, those skilled in the art will appreciate other thermally conductive materials. In some embodiments, the coating composition comprises a conformal coating compound and lanthanum hexaboride (LaB6). In some embodiments, the coating composition comprises a conformal coating compound and cerium oxide (SiO2).

於某些觀點中,本發明提供的塗覆組成物包括:一聚對二甲苯化合物,作為一保形塗覆化合物;以及一導熱材料,其導熱係數大於單獨聚對二甲苯化合物的導熱係數,且於某些情況中,會比單獨聚對二甲苯化合物的導熱係數大了約10%。於某些具體實例中,此等塗覆組成物的導熱係數會比單獨聚對二甲苯化合物大了約5至10%。或者,甚至除此之外,該等塗覆組成物的硬度會比單獨聚對二甲苯化合物的硬度大了約10%。 In some aspects, the coating composition provided by the present invention comprises: a parylene compound as a conformal coating compound; and a thermally conductive material having a thermal conductivity greater than a thermal conductivity of the individual parylene compound, And in some cases, it is about 10% larger than the thermal conductivity of the parylene compound alone. In some embodiments, the thermal conductivity of such coating compositions can be about 5 to 10% greater than the parylene compound alone. Alternatively, or even otherwise, the hardness of the coating compositions may be about 10% greater than the hardness of the individual parylene compounds.

一示範性的導熱材料為氮化硼。氮化硼(BN)為二元化學化合物,其係由相等數量的硼原子與氮原子所組成。所以,其實驗式為BN。氮化硼和碳為等電子,並且和碳相同,氮化硼具有各種多構形式,其中一種類同於鑽石且其中一種類同於石墨。類鑽石的多構形為已知最硬材料中的其中一種,而類石墨的多構形則為有用的潤滑劑。此外,此兩種多構形皆呈現雷達吸收的特性(參見Silberberg,Martin S.所著,紐約的McGraw-Hill於2009年出版的Chemistry:The Molecular Nature of Matter and Change,第十五版,第483頁)。據此,於某些觀點中,本發明提供可能含有一聚對二甲苯化合物與氮化硼的塗覆組成物。於該些組成物中,該聚對二甲苯化合物與氮化硼的塗覆組成物可能會交互散佈(舉例來說,氮化硼粒子可能會散佈在聚對二甲苯聚合物之間)。於該些組成物中雖然可以使用任何的聚對二甲苯化合物;不過,可能以D型聚對二甲苯化合物、C型聚對二甲苯化合物、N型聚對二甲苯化合物、以及HT型聚對二甲苯化合物®為較佳,而且特佳的係C型聚對二甲苯化合物。於該些組成物中,該氮化硼可能具有六角板結構。於某些具體實例中,氮化硼的重量與聚對二甲苯化合物及氮化硼的總重量比可能小於約80%。於某些具體實例中,氮化硼的重量可能高達聚對二甲苯化合物及氮化硼的總重量的約1%、約2%、約3%、約5%、約10%、或是約20%。 An exemplary thermally conductive material is boron nitride. Boron nitride (BN) is a binary chemical compound composed of an equal number of boron atoms and nitrogen atoms. Therefore, its experimental formula is BN. Boron nitride and carbon are isoelectronic and, like carbon, boron nitride has various polymorphic forms, one of which is analogous to diamond and one of which is analogous to graphite. The multi-configuration of diamond-like diamonds is one of the hardest materials known, while the multi-structure of graphite-like graphite is a useful lubricant. In addition, both of these multiple configurations exhibit radar absorption characteristics (see Silberberg, Martin S., McGraw-Hill, New York, 2009, Chemistry: The Molecular Nature of Matter and Change, fifteenth edition, Page 483). Accordingly, in certain aspects, the present invention provides a coating composition that may contain a parylene compound and boron nitride. In such compositions, the coating composition of the parylene compound and boron nitride may be interspersed (for example, boron nitride particles may be interspersed between the parylene polymers). Any of the parylene compounds may be used in the compositions; however, it is possible to use a D-type parylene compound, a C-type parylene compound, an N-type parylene compound, and an HT type poly pair. Xylene compound® is preferred, and particularly preferred is a C-type parylene compound. In these compositions, the boron nitride may have a hexagonal plate structure. In some embodiments, the weight ratio of boron nitride to the total weight of the parylene compound and boron nitride may be less than about 80%. In some embodiments, the weight of boron nitride may be up to about 1%, about 2%, about 3%, about 5%, about 10%, or about the total weight of the parylene compound and boron nitride. 20%.

於某些具體實例中,一塗覆組成物可能基本上係由聚對二甲苯化合物與氮化硼所組成。於其它具體實例中,一塗覆組成物係由聚對二甲苯化合物與氮化硼所組成。於某些具體實例中,該聚對二甲苯化合物與氮化硼包括該組成物的至少約50%、至少約70%、至少約90%、至少約95%、至少約99%、或是至少約99.9%。 In some embodiments, a coating composition may consist essentially of a parylene compound and boron nitride. In other embodiments, a coating composition consists of a parylene compound and boron nitride. In some embodiments, the parylene compound and boron nitride comprise at least about 50%, at least about 70%, at least about 90%, at least about 95%, at least about 99%, or at least of the composition. About 99.9%.

於某些具體實例中,一物件上之塗覆層包括聚對二甲苯化合物與氮化硼,該氮化硼可能會交互散佈在該塗覆層中的聚對二甲苯化合物 之中(散佈在聚對二甲苯化合物的聚合物之中)。於該些物件中雖然可以使用任何的聚對二甲苯化合物;不過,可能以C型聚對二甲苯化合物、N型聚對二甲苯化合物、D型聚對二甲苯化合物、以及HT型聚對二甲苯化合物®為較佳,而且特佳的係C型聚對二甲苯化合物。於某些具體實例中,該塗覆層可能約0.0025mm至約0.050mm厚。 In some embodiments, the coating layer on an object includes a parylene compound and boron nitride, and the boron nitride may interdigitate the polyparaxylene compound dispersed in the coating layer. Among them (spread in a polymer of a parylene compound). Any of the parylene compounds may be used in the articles; however, it is possible to use a C-type parylene compound, an N-type poly-p-xylene compound, a D-type parylene compound, and an HT-type poly-pair. Toluene compound® is preferred, and particularly preferred is a C-type parylene compound. In some embodiments, the coating layer may be from about 0.0025 mm to about 0.050 mm thick.

於某些具體實例中,此聚對二甲苯化合物-氮化硼塗覆組成物雖然可能含有C型聚對二甲苯化合物;不過,於其它具體實例中,其亦可能含有D型聚對二甲苯化合物、N型聚對二甲苯化合物、或是HT型聚對二甲苯化合物®,參見圖1A、1B、1C、以及1D。於某些具體實例中,該聚對二甲苯化合物可能係藉由對各種化學成分進行置換而衍生自N型聚對二甲苯化合物,或聚對二甲苯。於較佳的具體實例中,該聚對二甲苯化合物會形成完全線性、高度結晶的材料。於某些具體實例中,該氮化硼可能具有六角板結構。於某些具體實例中,該聚對二甲苯化合物與氮化硼會形成該聚對二甲苯組成物內分離的層。於某些具體實例中,該聚對二甲苯組成物可能於該等聚對二甲苯層及氮化硼層內有很強的共價鍵。於其它具體實例中,該聚對二甲苯組成物可能於該等聚對二甲苯層及氮化硼層之間有微弱的凡得瓦爾力。 In some embodiments, the parylene compound-boron nitride coating composition may contain a C-type parylene compound, although in other embodiments, it may also contain a D-type parylene. Compounds, N-type parylene compounds, or HT-type parylene compounds®, see Figures 1A, 1B, 1C, and 1D. In some embodiments, the parylene compound may be derived from an N-type parylene compound, or parylene, by displacement of various chemical components. In a preferred embodiment, the parylene compound forms a completely linear, highly crystalline material. In some embodiments, the boron nitride may have a hexagonal plate structure. In some embodiments, the parylene compound and boron nitride form a layer that separates within the parylene composition. In some embodiments, the parylene composition may have strong covalent bonds within the parylene layer and the boron nitride layer. In other embodiments, the parylene composition may have a weak van der Waals force between the parylene layer and the boron nitride layer.

於某些具體實例中,一聚對二甲苯組成物的導熱係數可能大於單獨該聚對二甲苯化合物,舉例來說,測量單位為(cal/sec)/cm2/C。於特定的具體實例中,一聚對二甲苯-氮化硼組成物的導熱係數可能會比單獨該聚對二甲苯化合物大了約10%,大了約30%,或是大了約50%。於其它具體實例中,如洛氏硬度測試的定義,一聚對二甲苯組成物的硬度可能大於單獨的聚對二甲苯化合物,參見E.L.Tobolski & A.Fee所著的Macroindentation Hardness Testing ASM Handbook,第8冊:Mechanical Testing and Evaluation,第203至211頁(ASM International,2000)。於特定 的具體實例中,該聚對二甲苯-氮化硼組成物的硬度可能會比單獨的聚對二甲苯化合物大了約10%,大了約30%,大了約50%,或是大了約90%。該聚對二甲苯-氮化硼組成物中的該聚對二甲苯化合物與氮化硼的相對數量可能會決定該組成物的導熱係數與硬度。於某些具體實例中,氮化硼的重量與該組成物中的聚對二甲苯化合物及氮化硼的總重量比會小於約5%,小於約10%,小於約20%,小於約40%,小於約60%,或是小於約80%。於某些具體實例中,氮化硼的重量會高達該組成物中的聚對二甲苯化合物及氮化硼的總重量的約1%、約2%、約3%、或是約4%。 In some embodiments, the thermal conductivity of the parylene composition may be greater than the parylene compound alone, for example, the unit of measurement is (cal/sec)/cm2/C. In a specific embodiment, the thermal conductivity of a parylene-boron nitride composition may be about 10% larger, about 30% larger, or about 50% larger than the parylene compound alone. . In other embodiments, such as the definition of Rockwell hardness test, the hardness of a parylene composition may be greater than that of a single parylene compound, see Macroindentation Hardness Testing ASM Handbook by EL Tobolski & A. Feee. Volume 8: Mechanical Testing and Evaluation, pp. 203-211 (ASM International, 2000). Specific In a specific example, the parylene-boron nitride composition may be about 10% larger than the parylene compound alone, about 30% larger, about 50% larger, or larger. About 90%. The relative amount of the parylene compound and boron nitride in the parylene-boron nitride composition may determine the thermal conductivity and hardness of the composition. In some embodiments, the weight ratio of boron nitride to the total weight ratio of parylene compound and boron nitride in the composition will be less than about 5%, less than about 10%, less than about 20%, and less than about 40. %, less than about 60%, or less than about 80%. In some embodiments, the weight of boron nitride can be up to about 1%, about 2%, about 3%, or about 4% by weight of the total weight of the parylene compound and boron nitride in the composition.

於某些情況中,物件可能需要進行前置處理,以便讓該物件的表面更能黏附一保形塗覆層,例如藉由塗敷一矽烷。前置處理的方法可能會需要將該物件浸沒在一含有合適化合物(舉例來說,其包含有機化合物,例如矽烷)的溶液中,接著再從該矽烷溶液中移除該物件,並且烘乾該物件。此等前置處理能夠改良保形塗覆化合物的表面黏著效果並且提昇(改良)機械與電性特性。 In some cases, the article may need to be pre-treated to allow the surface of the article to adhere more to a conformal coating, such as by coating a decane. The pretreatment method may require immersing the article in a solution containing a suitable compound (for example, which contains an organic compound such as decane), then removing the article from the decane solution, and drying the article. object. These pretreatments improve the surface adhesion of the conformal coating compound and enhance (improve) mechanical and electrical properties.

於沒入溶液中可能會遭到破壞的物件的情況中(舉例來說,電子元件),可能會用到一替代的前置處理方法,其包含利用矽烷來塗覆該物件。舉例來說,矽烷可於氣相中被塗敷至一要被包括聚對二甲苯化合物的保形塗覆物塗覆的物件上。這便可以讓無法浸沒但卻需要利用矽烷來進行前置處理的某些物件被聚對二甲苯化合物塗覆。 In the case of objects that may be damaged in the solution (for example, electronic components), an alternative pre-treatment method may be used which involves coating the article with decane. For example, decane can be applied to an article to be coated with a conformal coating comprising a parylene compound in the vapor phase. This allows certain items that cannot be submerged but require pre-treatment with decane to be coated with a parylene compound.

於另一項觀點中,本發明包含具有至少一保形塗覆化合物塗覆層及至少一氮化硼塗覆層的物件。於某些具體實例中,該保形塗覆化合物可能為聚萘、二胺、聚四氟乙烯、聚亞醯胺、C型聚對二甲苯化合物、N型聚對二甲苯化合物、D型聚對二甲苯化合物、或是HT型聚對二甲苯化合物®,並且較佳的可能係C型聚對二甲苯化合物。於某些具體實例中,該氮化硼塗覆層可能會比該聚合物塗覆層更接近該物件;而於其它具體實例 中,該聚合物塗覆層可能會比該氮化硼塗覆層更接近該物件。於某些具體實例中,該等氮化硼塗覆層與聚合物塗覆層可能各約為至少0.05mm厚。 In another aspect, the invention comprises an article having at least one conformal coating compound coating layer and at least one boron nitride coating layer. In some embodiments, the conformal coating compound may be polynaphthalene, diamine, polytetrafluoroethylene, polyamidamine, C-type parylene compound, N-type poly-p-xylene compound, D-type poly The p-xylene compound or the HT-type parylene compound®, and preferably a C-type parylene compound. In some embodiments, the boron nitride coating layer may be closer to the object than the polymer coating layer; and other specific examples The polymer coating layer may be closer to the article than the boron nitride coating layer. In some embodiments, the boron nitride coating layer and the polymer coating layer may each be at least about 0.05 mm thick.

保形塗覆裝置Conformal coating device

本發明還揭示用於藉由氣相沉積於一物件的表面上塗敷一超薄、保形塗覆層的裝置。於其它觀點中,本發明揭示用於氣相沉積超薄、保形聚合物塗覆層的多階段加熱裝置。 The present invention also discloses an apparatus for applying an ultrathin, conformal coating layer by vapor deposition on the surface of an article. In other aspects, the present invention discloses a multi-stage heating apparatus for vapor deposition of an ultrathin, conformal polymer coating.

於某些觀點中,本發明提供一種用以塗敷一包括聚對二甲苯化合物之保形塗覆層的裝置,該裝置包含一汽化室,其具有複數個(二或多個)溫度區,該汽化室在操作上可連結至一熱解室,該熱解室在操作上可連結至一真空室。於某些具體實例中,該真空室可能包含一沉積室,其在操作上可連結至該熱解室及一真空構件,而該真空構件可能係一或多個真空唧筒。於某些具體實例中,該汽化室可能具有複數個溫度區,較佳的係,兩個溫度區。於其它具體實例中,該熱解室可能具有複數個溫度區,較佳的係,兩個溫度區。於某些具體實例中,該汽化室及/或該熱解室可能係一管狀熔爐。 In some aspects, the present invention provides an apparatus for applying a conformal coating comprising a parylene compound, the apparatus comprising a vaporization chamber having a plurality of (two or more) temperature zones, The vaporization chamber is operatively coupled to a pyrolysis chamber that is operatively coupled to a vacuum chamber. In some embodiments, the vacuum chamber may include a deposition chamber operatively coupled to the pyrolysis chamber and a vacuum member, and the vacuum member may be one or more vacuum tubes. In some embodiments, the vaporization chamber may have a plurality of temperature zones, preferably a system, and two temperature zones. In other embodiments, the pyrolysis chamber may have a plurality of temperature zones, preferably a system, and two temperature zones. In some embodiments, the vaporization chamber and/or the pyrolysis chamber may be a tubular furnace.

本技術中已知用以在物件上氣相沉積保形塗覆化合物的其它裝置。舉例來說,請參見美國專利案編號第4,945,856號,第5,078,091號,第5,268,033號,第5,488,833號,第5,534,068號,第5,536,319號,第5,536,321號,第5,536,322號,第5,538,758號,第5,556,473號,第5,641,358號,第5,709,753號,第6,406,544號,第6,737,224號,以及第6,406,544號,本文以引用的方式將它們全部併入。 Other means for vapor depositing a conformal coating compound on an article are known in the art. For example, see U.S. Patent Nos. 4,945,856, 5,078,091, 5,268,033, 5,488,833, 5,534,068, 5,536,319, 5,536,321, 5,536,322, 5,538,758, 5,556,473. No. 5, 641, 358, No. 5, 709, 753, No. 6, 406, 544, No. 6, 737, 224, and No. 6, 406, 544, all of which are incorporated herein by reference.

於另一項觀點中,本發明提供一種用以塗敷一包括一保形塗覆化合物與一導熱材料之保形塗覆層的裝置,該裝置可能包含一汽化室,其在操作上可連結至一熱解室,該熱解室在操作上可連結至一真空室,其中,一包括一T埠口的連接器在操作上會將該熱解室連結至該真空室。於 某些具體實例中,在操作上會連結該熱解室與該真空室的連接器可能係一傳送構件,用以將氣體從該熱解室傳送至該真空室。於其它具體實例中,該T埠口在操作上可被連接至一注射構件,用以將固態粒子(舉例來說,粉末)或是另一氣體注入經由該連接器被傳送的氣體之中。於某些具體實例中,該真空室可能含有一沉積室,其在操作上可連結至該熱解室及一真空構件,其中,該真空構件可能係一或多個真空唧筒。 In another aspect, the present invention provides an apparatus for applying a conformal coating comprising a conformal coating compound and a thermally conductive material, the apparatus possibly comprising a vaporization chamber operatively linkable To the pyrolysis chamber, the pyrolysis chamber is operatively coupled to a vacuum chamber, wherein a connector including a T-port is operatively coupled to the vacuum chamber. to In some embodiments, the connector that is operatively coupled to the pyrolysis chamber and the vacuum chamber may be a transfer member for transferring gas from the pyrolysis chamber to the vacuum chamber. In other embodiments, the T-port can be operatively coupled to an injection member for injecting solid particles (for example, powder) or another gas into the gas being delivered via the connector. In some embodiments, the vacuum chamber may contain a deposition chamber operatively coupled to the pyrolysis chamber and a vacuum member, wherein the vacuum member may be one or more vacuum tubes.

其中一具體實例係一種用以化學氣相沉積聚對二甲苯化合物的裝置,該裝置可能包括一改良的汽化室及/或熱解室。雖然此裝置可能特別適合用來化學氣相沉積聚對二甲苯化合物;不過,其亦可用來氣相沉積其它的保形塗覆化合物,其包含,但是並不受限於:聚萘(1,4-萘)、二胺(聯鄰甲苯胺)、聚四氟乙烯(鐵氟龍®)、聚亞醯胺,以及本技術中熟知的其它保形塗覆化合物。於某些具體實例中,該裝置包括一汽化室及/或一熱解室,其具有複數個溫度區。本發明雖然沒有限制該裝置的操作方式,不過,本發明認為讓每一個室內有不同的溫度設定點會改良聚對二甲苯化合物的加熱速率。該等多重溫度區的汽化室與熱解室可以將該聚對二甲苯化合物均勻地裂解成一單體,並且可更佳地控制該物件上的聚對二甲苯化合物塗覆層的最終厚度。該聚對二甲苯化合物在該沉積室中保持單體的時間可能較長,俾使其能夠更佳地分佈在整個沉積室中。 One specific example is a device for chemical vapor deposition of a parylene compound, which may include a modified vaporization chamber and/or pyrolysis chamber. Although this device may be particularly suitable for chemical vapor deposition of parylene compounds; however, it may also be used for vapor deposition of other conformal coating compounds, including, but not limited to, polynaphthalene (1, 4-naphthalene), diamine (di-toluidine), polytetrafluoroethylene (Teflon®), poly-liminamide, and other conformal coating compounds well known in the art. In some embodiments, the apparatus includes a vaporization chamber and/or a pyrolysis chamber having a plurality of temperature zones. Although the invention does not limit the mode of operation of the apparatus, the present invention contemplates that having different temperature set points in each chamber improves the heating rate of the parylene compound. The vaporization chamber and the pyrolysis chamber of the multiple temperature zones can uniformly cleave the parylene compound into a single monomer, and can more preferably control the final thickness of the parylene compound coating layer on the article. The parylene compound may remain in the deposition chamber for a longer period of time, allowing it to be better distributed throughout the deposition chamber.

圖2A所示的係一聚對二甲苯化合物塗覆裝置。汽化室1可能具有兩個溫度區10與11。熱解室3同樣可能具有兩個溫度區12與13。汽化室1可藉由器件2在操作上連結至該熱解室3,該器件2能夠將氣體從該汽化室1傳送至該熱解室3。該熱解室3在操作上可連結至真空室14,該真空室14可能包括一沉積室6並且可藉由器件8在操作上連結至一真空構件9,該器件8能夠將沉積室6抽成真空。在操作上可將該熱解室3連結至該真空室14的器件5能夠將氣體從該熱解室3傳送至該真空室14,並且 還可能包含一閥門4,該閥門4能夠調節從該熱解室3至該真空系統14的氣體流動。 A polyparaxylene compound coating apparatus shown in Fig. 2A. The vaporization chamber 1 may have two temperature zones 10 and 11. The pyrolysis chamber 3 may also have two temperature zones 12 and 13. The vaporization chamber 1 can be operatively coupled to the pyrolysis chamber 3 by means of a device 2 capable of transporting gas from the vaporization chamber 1 to the pyrolysis chamber 3. The pyrolysis chamber 3 is operatively coupled to a vacuum chamber 14, which may include a deposition chamber 6 and is operatively coupled to a vacuum member 9 by means of a device 8 capable of pumping the deposition chamber 6 Vacuum. A device 5 operatively connecting the pyrolysis chamber 3 to the vacuum chamber 14 is capable of transferring gas from the pyrolysis chamber 3 to the vacuum chamber 14, and It is also possible to include a valve 4 that is capable of regulating the flow of gas from the pyrolysis chamber 3 to the vacuum system 14.

汽化室1可為能夠將固體加熱至約150℃至約200℃的任何熔爐/加熱系統。於較佳的具體實例中,該汽化室能夠將氣體加熱至1200℃。於某些具體實例中,汽化室1可能含有氣體。汽化室1亦可能能夠在其加熱室內產生不同溫度的區域。最後,該汽化室1可能能夠保持極高的真空。於較佳的具體實例中,該汽化室可以支援至少約0.1陶爾的真空。 The vaporization chamber 1 can be any furnace/heating system capable of heating solids to between about 150 ° C and about 200 ° C. In a preferred embodiment, the vaporization chamber is capable of heating the gas to 1200 °C. In some embodiments, vaporization chamber 1 may contain a gas. The vaporization chamber 1 may also be capable of producing regions of different temperatures in its heating chamber. Finally, the vaporization chamber 1 may be able to maintain an extremely high vacuum. In a preferred embodiment, the vaporization chamber can support a vacuum of at least about 0.1 Torr.

汽化室1在操作上可藉由熟習本技術的人士所熟知的許多器件被連結至熱解室3。於某些具體實例中,介於該汽化室1與該熱解室3之間的可操作連接器可能係一可將氣體從該汽化室1傳送至該熱解室3的連接器。於某些具體實例中,就此來說,此器件2可能係一玻璃管、一曲頸瓶、或是一金屬管。於其它具體實例中,熟習本技術的人士便非常瞭解,此器件2可能還含有閥門、溫度感測器、其它感測器、以及其它習知器件。 The vaporization chamber 1 is operatively coupled to the pyrolysis chamber 3 by a number of devices well known to those skilled in the art. In some embodiments, the operable connector between the vaporization chamber 1 and the pyrolysis chamber 3 may be a connector that transfers gas from the vaporization chamber 1 to the pyrolysis chamber 3. In some embodiments, the device 2 may be a glass tube, a curved bottle, or a metal tube. In other embodiments, those skilled in the art will appreciate that the device 2 may also include valves, temperature sensors, other sensors, and other conventional devices.

該熱解室3可為能夠將氣體加熱至約650℃至約700℃的任何熔爐/加熱系統。於某些具體實例中,該熱解室3可能含有氣體。於某些具體實例中,該熱解室3可能能夠在其加熱室內產生不同溫度的區域。最後,於某些具體實例中,該熱解室3可能能夠保持極高的真空。於較佳的具體實例中,該汽化室可以支援至少約0.1陶爾的真空。 The pyrolysis chamber 3 can be any furnace/heating system capable of heating the gas to between about 650 ° C and about 700 ° C. In some embodiments, the pyrolysis chamber 3 may contain a gas. In some embodiments, the pyrolysis chamber 3 may be capable of producing regions of different temperatures within its heating chamber. Finally, in some embodiments, the pyrolysis chamber 3 may be capable of maintaining an extremely high vacuum. In a preferred embodiment, the vaporization chamber can support a vacuum of at least about 0.1 Torr.

較佳的係,該汽化室與該熱解室可為能夠在它們的室內產生二或多個溫度區的熔爐。於一較佳的具體實例中,該熔爐具有兩個溫度區。於某些具體實例中,該等溫度區係位於該熔爐室中,俾使一氣體會在離開該熔爐之前依序移動經過該等溫度區。較佳的係,該熔爐可能具有1200℃的最大溫度。於一較佳的具體實例中,該熔爐係一管狀熔爐。於其它具體實例中,該熔爐可能具有一玻璃曲頸瓶。在實施例2中可以找到適合作為該汽化室及/或該熱解室的一雙溫度區熔爐的其中一具體實例的特定參數。 Preferably, the vaporization chamber and the pyrolysis chamber may be furnaces capable of producing two or more temperature zones in their chambers. In a preferred embodiment, the furnace has two temperature zones. In some embodiments, the temperature zones are located in the furnace chamber such that a gas moves sequentially through the temperature zones prior to exiting the furnace. Preferably, the furnace may have a maximum temperature of 1200 °C. In a preferred embodiment, the furnace is a tubular furnace. In other embodiments, the furnace may have a glass retort. Specific parameters of one of the specific examples of a dual temperature zone furnace suitable for the vaporization chamber and/or the pyrolysis chamber can be found in Example 2.

該熱解室3在操作上可藉由熟習本技術的人士所熟知的許多器件被連結至真空系統14。於某些具體實例中,介於該熱解室3與該真空系統14之間的可操作連接器可能係一可將氣體從該熱解室3傳送至該真空系統14的連接器。於某些具體實例中,就此來說,此器件5可能係一玻璃管、一曲頸瓶、或是一金屬管。於其它具體實例中,熟習本技術的人士便非常瞭解,此器件5可能含有一或多個閥門4,藉由該等閥門可以調節流經該器件5的氣體。 The pyrolysis chamber 3 is operatively coupled to the vacuum system 14 by a number of devices well known to those skilled in the art. In some embodiments, the operable connector between the pyrolysis chamber 3 and the vacuum system 14 may be a connector that transfers gas from the pyrolysis chamber 3 to the vacuum system 14. In some embodiments, the device 5 may be a glass tube, a curved bottle, or a metal tube. In other embodiments, those skilled in the art will appreciate that the device 5 may contain one or more valves 4 by which the gas flowing through the device 5 can be adjusted.

真空系統14可能含有一沉積室6,該沉積室6在操作上可連接至一真空構件9。於某些具體實例中,該可操作的連接器8可能能夠保持高達至少約0.05陶爾的真空,並且可操作在至少約1x10-4陶爾處。於其它具體實例中,該真空構件9可能係一或多個真空唧筒,其能夠將沉積室中抽成至少約0.05陶爾的真空,且較佳的係,抽成至少約1x10-4陶爾的真空。於某些具體實例中,該沉積室6的大小可能足以容納要被塗覆的物件7。於其它具體實例,該沉積室6可能能夠保持高達至少約0.05陶爾的真空,並且可操作在至少約1x10-4陶爾範圍處。 The vacuum system 14 may contain a deposition chamber 6 that is operatively connectable to a vacuum member 9. In some embodiments, the operable connector 8 may be capable of maintaining a vacuum of up to at least about 0.05 Torr and is operable at at least about 1 x 10-4 Torr. In other embodiments, the vacuum member 9 may be one or more vacuum cartridges capable of drawing a vacuum into the deposition chamber of at least about 0.05 Torr, and preferably, drawing at least about 1 x 10-4 Torr. Vacuum. In some embodiments, the deposition chamber 6 may be sized to receive the article 7 to be coated. In other embodiments, the deposition chamber 6 may be capable of maintaining a vacuum of up to at least about 0.05 Torr and is operable at a range of at least about 1 x 10-4 Torr.

本文揭示的另一具體實例係一種用於化學氣相沉積該聚對二甲苯化合物與氮化硼組成物的裝置,其含有一注射構件,用以在沉積之前先將一粉末注入該化學氣相之中。圖2B所示的便係根據其中一具體實例的塗覆裝置。汽化室15可藉由器件16在操作上連結至熱解室17,該器件16能夠將氣體從該汽化室15傳送至該熱解室17。該熱解室17在操作上可連結至真空室25,該真空室25可能包括一沉積室21並且可藉由器件23在操作上連結至一真空構件24,該器件23能夠將沉積室21抽成真空。在操作上可將該熱解室17連結至該真空室25的器件19能夠將氣體從該熱解室17傳送至該真空室25,並且還可能包含一閥門18,該閥門18能夠調節從該熱解室17至該真空系統25的氣體流動。器件19可能還具有一T埠口20, 其亦稱為「tee接頭」。於某些具體實例中,該T埠口在操作上可連接至一注射構件,用以將粉末注入經由器件19被傳送的氣體之中。於某些具體實例中,用以注入粉末的構件包含,但是並不受限於:烤箱、動力塗覆設備、以及高壓空氣。於一較佳的具體實例中,用以注入粉末的構件包含一粉末容器,該粉末容器在操作上可連結至一電子閥門,該電子閥門在操作上可連結至該T埠口。 Another specific example disclosed herein is a device for chemical vapor deposition of the parylene compound and a boron nitride composition, comprising an injection member for injecting a powder into the chemical vapor phase prior to deposition Among them. The coating device shown in Fig. 2B is a coating device according to one of the specific examples. The vaporization chamber 15 can be operatively coupled to the pyrolysis chamber 17 by means of a device 16 that is capable of transporting gas from the vaporization chamber 15 to the pyrolysis chamber 17. The pyrolysis chamber 17 is operatively coupled to a vacuum chamber 25, which may include a deposition chamber 21 and is operatively coupled to a vacuum member 24 by means of a device 23 capable of pumping the deposition chamber 21 Vacuum. A device 19 operatively coupling the pyrolysis chamber 17 to the vacuum chamber 25 can transfer gas from the pyrolysis chamber 17 to the vacuum chamber 25, and may also include a valve 18 that can be adjusted from The gas from the pyrolysis chamber 17 to the vacuum system 25 flows. Device 19 may also have a T port 20, It is also known as "tee joint". In some embodiments, the T-port is operatively coupled to an injection member for injecting powder into the gas being delivered via device 19. In some embodiments, the means for injecting powder comprises, but is not limited to, an oven, a power coating apparatus, and high pressure air. In a preferred embodiment, the means for injecting the powder comprises a powder container operatively coupled to an electronic valve operatively coupled to the T port.

汽化室15可為能夠將固體加熱至約150℃至約200℃的任何熔爐/加熱系統。於某些具體實例中,汽化室15可能含有氣體。最後,該汽化室1可能能夠保持極高的真空。 The vaporization chamber 15 can be any furnace/heating system capable of heating solids to between about 150 ° C and about 200 ° C. In some embodiments, vaporization chamber 15 may contain a gas. Finally, the vaporization chamber 1 may be able to maintain an extremely high vacuum.

該汽化室15在操作上可藉由熟習本技術的人士所熟知的許多器件被連結至熱解室17。於某些具體實例中,介於該汽化室15與熱解室17之間的可操作連接器可能係一可將氣體從該汽化室15傳送至該熱解室17的連接器。於某些具體實例中,就此來說,此器件16可能係一玻璃管、一曲頸瓶、或是一金屬管。於其它具體實例中,熟習本技術的人士便非常瞭解,此器件16可能還含有閥門、溫度感測器、其它感測器、以及其它習知器件。 The vaporization chamber 15 is operatively coupled to the pyrolysis chamber 17 by a number of devices well known to those skilled in the art. In some embodiments, the operable connector between the vaporization chamber 15 and the pyrolysis chamber 17 may be a connector that transfers gas from the vaporization chamber 15 to the pyrolysis chamber 17. In some embodiments, the device 16 may be a glass tube, a curved bottle, or a metal tube. In other embodiments, those skilled in the art will appreciate that the device 16 may also include valves, temperature sensors, other sensors, and other conventional devices.

該熱解室17可為能夠將氣體加熱至約650℃至約700℃的任何熔爐/加熱系統。於某些具體實例中,該熱解室17可能含有氣體。最後,於某些具體實例中,該熱解室17可能能夠保持極高的真空,較佳的係至少0.1陶爾。 The pyrolysis chamber 17 can be any furnace/heating system capable of heating the gas to between about 650 ° C and about 700 ° C. In some embodiments, the pyrolysis chamber 17 may contain a gas. Finally, in some embodiments, the pyrolysis chamber 17 may be capable of maintaining an extremely high vacuum, preferably at least 0.1 Torr.

該熱解室17在操作上可藉由熟習本技術的人士所熟知的許多器件被連結至真空系統25。於某些具體實例中,介於該熱解室17與該真空系統25之間的可操作連接器可能係一可將氣體從該熱解室17傳送至該真空系統25的連接器。於某些具體實例中,就此來說,此器件19可能係一玻璃管、一曲頸瓶、或是一金屬管。於其它具體實例中,熟習本技術的 人士便非常瞭解,此器件19可能含有閥門、溫度感測器、其它感測器、以及其它習知器件。於一較佳的具體實例中,器件19可能含有一或多個閥門4,藉由該等閥門可以調節流經該器件19的氣體。 The pyrolysis chamber 17 is operatively coupled to the vacuum system 25 by a number of devices well known to those skilled in the art. In some embodiments, the operable connector between the pyrolysis chamber 17 and the vacuum system 25 may be a connector that can transfer gas from the pyrolysis chamber 17 to the vacuum system 25. In some embodiments, the device 19 may be a glass tube, a curved bottle, or a metal tube. In other specific examples, familiar with the technology It is well understood by those skilled in the art that this device 19 may contain valves, temperature sensors, other sensors, and other conventional devices. In a preferred embodiment, device 19 may contain one or more valves 4 by which the gas flowing through the device 19 can be adjusted.

真空系統25可能含有一沉積室21,該沉積室21在操作上可藉由器件23連接至一真空構件24。於某些具體實例中,該連接器23可能能夠保持高達至少約0.05陶爾的真空。於其它具體實例中,該真空構件24可能係一或多個真空唧筒,其能夠將沉積室中抽成至少約0.05陶爾的真空。於某些具體實例中,該沉積室21的大小可能足以容納要被塗覆的物件22。於其它具體實例,該沉積室21可能能夠保持至少約0.05陶爾的真空。 Vacuum system 25 may contain a deposition chamber 21 that is operatively coupled to a vacuum member 24 by means of device 23. In some embodiments, the connector 23 may be capable of maintaining a vacuum of up to at least about 0.05 Torr. In other embodiments, the vacuum member 24 may be one or more vacuum cartridges capable of drawing a vacuum into the deposition chamber of at least about 0.05 Torr. In some embodiments, the deposition chamber 21 may be sized to receive the article 22 to be coated. In other embodiments, the deposition chamber 21 may be capable of maintaining a vacuum of at least about 0.05 Torr.

保形塗覆方法Conformal coating method

本發明還揭示用以藉由氣相沉積在一物件的表面上塗敷一超薄、保形塗覆層的方法。於某些觀點中,本發明揭示用以氣相沉積超薄、保形塗覆層的多階段加熱方法。於其它觀點中,本發明揭示以氣相沉積包括添加劑的超薄、保形塗覆層的方法。 The present invention also discloses a method for applying an ultra-thin, conformal coating on the surface of an article by vapor deposition. In some aspects, the present invention discloses a multi-stage heating process for vapor deposition of ultra-thin, conformal coatings. In other aspects, the present invention discloses a method of vapor depositing an ultrathin, conformal coating comprising an additive.

較佳的係,本文所揭示的保形塗覆沉積製程可以在負壓下實行在一封閉系統中。舉例來說,聚對二甲苯化合物會在低壓(舉例來說,約0.1陶爾)下從氣相中被沉積,用以形成保形塗覆層。於此實施例中,第一步驟係在一汽化室中於約150℃處汽化固態的聚對二甲苯二聚物。第二步驟係在一熱解室中於約680℃處在兩個甲基-甲基鍵處定量裂解(熱解)該二聚物,用以產生穩定的雙自由基對二甲苯單體。最後,氣體形式的單體會進入室溫的沉積室,它們會於該處吸附並且聚合在要被塗覆的物件上。該封閉系統較佳的係具有分離的室,用以汽化、熱解、以及沉積該聚對二甲苯化合物,該等室會藉由合宜的管路或管狀連接器來相連。 Preferably, the conformal coating deposition process disclosed herein can be carried out in a closed system under negative pressure. For example, a parylene compound can be deposited from the vapor phase at a low pressure (for example, about 0.1 Torr) to form a conformal coating. In this embodiment, the first step vaporizes the solid parylene dimer at about 150 ° C in a vaporization chamber. The second step is the quantitative cleavage (pyrolysis) of the dimer at two methyl-methyl bonds at about 680 ° C in a pyrolysis chamber to produce a stable diradical para-xylene monomer. Finally, the monomer in gaseous form will enter the deposition chamber at room temperature where they will adsorb and polymerize on the article to be coated. Preferably, the closed system has separate chambers for vaporizing, pyrolyzing, and depositing the parylene compound, the chambers being connected by suitable tubing or tubular connectors.

該保形塗覆化合物可以各種形式與純度使用在該等方法 中。於某些具體實例中,該保形塗覆化合物的純度為約90%、約92.5%、約95%、約96%、約97%、約98%、約98.5%、約99%、約99.5%、約99.9%、甚至高達約100%的純度。於某些具體實例中,該保形塗覆化合物係由來自不同來源及/或不同純度的多種保形塗覆化合物(舉例來說,相同的類型,舉例來說,C型聚對二甲苯化合物)所組成的摻配物。於某些具體實例中,該保形塗覆化合物係由多種類型的保形塗覆化合物(舉例來說,C型聚對二甲苯化合物、N型聚對二甲苯化合物、D型聚對二甲苯化合物、HT型聚對二甲苯化合物®)所組成的摻配物。 The conformal coating compound can be used in various forms and purity in such methods in. In certain embodiments, the conformal coating compound has a purity of about 90%, about 92.5%, about 95%, about 96%, about 97%, about 98%, about 98.5%, about 99%, about 99.5. %, about 99.9%, even up to about 100% purity. In some embodiments, the conformal coating compound is comprised of a plurality of conformal coating compounds from different sources and/or different purities (for example, the same type, for example, a C-type parylene compound) The composition of the composition. In some embodiments, the conformal coating compound is comprised of a plurality of types of conformal coating compounds (for example, a C-type poly-p-xylene compound, an N-type poly-p-xylene compound, a D-type parylene) A compound consisting of a compound, a HT-type parylene compound®).

根據其它觀點,用以在一物件上塗敷一保形塗覆層的方法包含:將一聚對二甲苯化合物加熱至約125℃至約200℃的溫度,用以形成一氣態的聚對二甲苯化合物,其中,該聚對二甲苯化合物的加熱會在二或多個加熱階段中實施;將該氣態的聚對二甲苯化合物加熱至約650℃至約700℃的溫度,用以裂解該氣態的聚對二甲苯化合物,從而形成聚對二甲苯單體;以及於一物件之表面的至少一部分上會形成一包括一聚對二甲苯聚合物之保形塗覆層的條件下讓該物件接觸該等聚對二甲苯單體,從而塗敷一塗覆層至該物件。於某些具體實例中,該聚對二甲苯化合物會被加熱至約125℃至約180℃的溫度,並且接著會被加熱至約200℃至約220℃的溫度。於某些具體實例中,該氣態的聚對二甲苯化合物會在二或多個階段中被加熱。舉例來說,該氣態的聚對二甲苯化合物可能會先被加熱至約680℃的溫度,並且接著會被加熱至至少約700℃的溫度。 According to other aspects, a method for applying a conformal coating layer on an article comprises: heating a parylene compound to a temperature of from about 125 ° C to about 200 ° C to form a gaseous parylene. a compound, wherein the heating of the parylene compound is carried out in two or more heating stages; heating the gaseous parylene compound to a temperature of from about 650 ° C to about 700 ° C for cracking the gaseous state a parylene compound to form a parylene monomer; and contacting the article with a conformal coating comprising a parylene polymer on at least a portion of a surface of an article The parylene monomer is equalized to apply a coating layer to the article. In some embodiments, the parylene compound is heated to a temperature of from about 125 ° C to about 180 ° C and then heated to a temperature of from about 200 ° C to about 220 ° C. In some embodiments, the gaseous parylene compound will be heated in two or more stages. For example, the gaseous parylene compound may be first heated to a temperature of about 680 ° C and then heated to a temperature of at least about 700 ° C.

於某些情況中,該等方法可用來使用標準的化學氣相沉積粒子,在25℃處,於一真空室內塗敷一包括聚對二甲苯化合物之均勻的、保形塗覆薄層,並且可塗敷範圍從0.01毫米至3.0毫米的厚度,端視要被塗覆的物品而定。該物品一旦被塗覆之後便可以抵抗氣候並且防水,而且可以耐受曝露於極端的氣候條件及曝露於大部分的化學藥劑中。任何固態表 面均可以被塗覆,其包含塑膠、金屬、木材、紙材、以及紡織原料。本文所揭示的實施例應用包含,但是並不受限於:電子設備,例如行動電話、無線電;電路板以及揚聲器;用於海洋與空間探測的設備,或是用於鑽油井操作的設備;有害廢棄物運送設備;醫療儀器;紙材產品;以及紡織品。 In some cases, the methods can be used to apply a uniform, conformal coating layer comprising a parylene compound in a vacuum chamber at 25 ° C using standard chemical vapor deposited particles, and The coating can range from 0.01 mm to 3.0 mm, depending on the item to be coated. Once coated, the article is weather resistant and water resistant, and can withstand exposure to extreme weather conditions and exposure to most chemicals. Any solid state table The faces can be coated and include plastic, metal, wood, paper, and textile materials. Embodiment applications disclosed herein include, but are not limited to, electronic devices such as mobile phones, radios; circuit boards and speakers; devices for marine and space detection, or devices for drilling oil well operations; Waste transportation equipment; medical equipment; paper products; and textiles.

於某些具體實例中,可能會改變該物件可接觸該等氣態聚對二甲苯單體的時間長度,以便控制該物件上的聚對二甲苯化合物塗覆層的最終厚度。於各種具體實例中,該聚對二甲苯化合物塗覆層的最終厚度可能介於約100埃至約3.0毫米之間。於某些具體實例中,該聚對二甲苯化合物塗覆層的最終厚度可能介於約0.5毫米至約3.0毫米之間。於某些具體實例中,該聚對二甲苯化合物塗覆層的最終厚度可能介於約0.0025毫米至約0.050毫米之間。較佳的係,可以使用從約2個小時至約18個小時(舉例來說,5個小時)的沉積時間來達到約0.002英吋(0.050mm)的聚對二甲苯化合物塗覆層厚度,端視沉積室的溫度而定。聚對二甲苯化合物塗覆層之最終厚度的選擇可能會取決於要被塗覆之物件的特定度數及該物件的最終用途。需要進行某種移動以發揮功能的物件可能會希望有較薄的最終塗覆層,例如電力按鈕。會被沒入水中的物件則可能會希望有較厚的塗覆層。 In some embodiments, the length of time that the article can contact the gaseous parylene monomer may be altered to control the final thickness of the parylene coating layer on the article. In various embodiments, the final thickness of the parylene compound coating layer may be between about 100 angstroms and about 3.0 millimeters. In some embodiments, the final thickness of the parylene compound coating layer may be between about 0.5 mm to about 3.0 mm. In some embodiments, the final thickness of the parylene compound coating layer may be between about 0.0025 mm to about 0.050 mm. Preferably, a deposition time of from about 2 hours to about 18 hours (for example, 5 hours) can be used to achieve a coating thickness of about 0.002 inches (0.050 mm) of the parylene compound. It depends on the temperature of the deposition chamber. The choice of the final thickness of the parylene compound coating layer may depend on the particular degree of the article to be coated and the end use of the article. Objects that require some sort of movement to function may wish to have a thinner final coating, such as a power button. Objects that are immersed in water may wish to have a thicker coating.

特定塗覆組成物(舉例來說,包括聚對二甲苯化合物的塗覆組成物)吸附至各種物件的效果可藉由在塗敷該保形塗覆層之前先利用有機化合物(例如矽烷)對要被塗覆之物件的表面進行前置處理而獲得改良。矽烷處理會在聚對二甲苯能夠聯結的物件表面上形成自由基。二甲苯、異丙醇、或是氟利昂(Freon)任一者中的乙烯基三氯矽烷,以及甲醇-水溶劑中的γ-甲基丙烯醯基氧基丙基三甲氧基矽烷(gamma-methacryloxypropyltrimethoxysilane)(矽烷偶聯劑® A-174矽烷或是矽烷偶聯劑® A-174(NT)矽烷)等兩種矽烷已被用來達成此目的。不過,電子器件並無法忍受因直接接觸會導電的液體所產生的電路徑,亦無法適用於 它們被沒入的水或液體蒸發之後經常會遺留的殘餘離子。即使沒有立刻長出,稍後仍可能會因該電子器件上的導體之間的電壓的關係而長出樹狀導體。因導體流體與樹狀突瘤所造成的短路電路可能會耗盡電池的能量並且會讓高電流在非預期的區域中流動,並且造成非預期的電路操作甚至故障。最佳的是,電子設備中的器件(例如電路板)通常必須分開塗覆矽烷與聚對二甲苯化合物,並且接著再組裝成完成品。 The effect of adsorbing a particular coating composition (for example, a coating composition comprising a parylene compound) onto various articles can be achieved by utilizing an organic compound (e.g., decane) prior to application of the conformal coating layer. The surface of the article to be coated is pretreated to be improved. The decane treatment forms free radicals on the surface of the article to which the parylene can be coupled. Vinyl trichloromethane in either xylene, isopropanol or Freon, and gamma-methacryloxypropyltrimethoxysilane in methanol-water solvent Two kinds of decane, such as decane coupling agent® A-174 decane or decane coupling agent® A-174(NT) decane, have been used for this purpose. However, electronic devices cannot withstand the electrical path created by direct contact with conductive liquids, nor can they be applied to Residual ions that are often left behind by the immersed water or liquid. Even if it does not grow out immediately, it is still possible to grow a tree conductor later due to the voltage relationship between the conductors on the electronic device. Short circuit circuits caused by conductor fluids and dendritic tumors can deplete the energy of the battery and can cause high currents to flow in unintended areas and cause unintended circuit operation or even failure. Most preferably, devices in an electronic device, such as a circuit board, typically must be coated with a mixture of decane and parylene, and then assembled into a finished product.

於某些觀點中,本發明提供利用矽烷(例如矽烷偶聯劑®矽烷)來塗覆物件的方法。於某些具體實例中,該等方法可能包含:(A)藉由將矽烷加熱至其蒸發點來汽化它,用以形成氣態的矽烷;以及(B)利用步驟A的氣態矽烷來接觸要被塗覆之物件的表面的至少一部分(舉例來說,希望被塗覆一保形塗覆層(舉例來說,其包括聚對二甲苯化合物)的表面)。於某些具體實例中,該矽烷偶聯劑®可能為矽烷偶聯劑® A-174、矽烷偶聯劑® 111、或是矽烷偶聯劑® A-174(NT),且較佳的可能係矽烷偶聯劑® A-174。於某些具體實例中,在步驟A中,該矽烷可能會在含水的50:50溶液中被汽化。於某些具體實例中,在步驟A中,該矽烷可能會在80℃處被汽化2個小時。 In certain aspects, the present invention provides a method of coating an article with a decane such as a decane coupling agent® decane. In some embodiments, the methods may include: (A) vaporizing it by heating the decane to its evaporation point to form a gaseous decane; and (B) contacting the gaseous decane of step A to be At least a portion of the surface of the coated article (for example, it is desirable to apply a conformal coating layer (for example, which includes a surface of a parylene compound)). In some embodiments, the decane coupling agent® may be a decane coupling agent® A-174, a decane coupling agent® 111, or a decane coupling agent® A-174 (NT), and preferably矽 偶联 coupling agent ® A-174. In some embodiments, in step A, the decane may be vaporized in an aqueous 50:50 solution. In some embodiments, in step A, the decane may be vaporized at 80 ° C for 2 hours.

於某些觀點中,本發明提供利用矽烷進行前置處理並對一物件之表面的至少一部分塗敷一聚對二甲苯塗覆化合物的方法。該等方法可能包含:(A)藉由將聚對二甲苯二聚物加熱至150至200℃來汽化它,用以形成氣態的聚對二甲苯二聚物;(B)藉由將氣態的聚對二甲苯二聚物加熱至650至700℃來將氣態的聚對二甲苯二聚物裂解成氣態的聚對二甲苯單體;(C)藉由將矽烷加熱至其蒸發點來汽化它,用以形成氣態的矽烷;(D)利用步驟C的氣態矽烷來接觸要塗覆聚對二甲苯化合物的物件;以及(E)利用步驟B的氣態聚對二甲苯單體來接觸要塗覆聚對二甲苯化合物的物件,維持一段足夠的時間以便沉積具有最終厚度的聚對二甲苯化合物塗覆層。於某些 具體實例中,該聚對二甲苯化合物可能係選擇自由下面所組成的群之中:D型聚對二甲苯化合物、C型聚對二甲苯化合物、N型聚對二甲苯化合物、HT型聚對二甲苯化合物®、以及衍生自N型聚對二甲苯化合物的聚對二甲苯化合物,而較佳的可能係C型聚對二甲苯化合物。於某些具體實例中,該矽烷可能係矽烷偶聯劑® A-174,矽烷偶聯劑® 111,或是矽烷偶聯劑® A-174(NT),而較佳的可能係矽烷偶聯劑® A-174。 In some aspects, the present invention provides a method of pre-treating with decane and applying a parylene-coated compound to at least a portion of the surface of an article. The methods may comprise: (A) vaporizing the parylene dimer by heating it to 150 to 200 ° C to form a gaseous parylene dimer; (B) by bringing the gaseous The parylene dimer is heated to 650 to 700 ° C to cleave the gaseous parylene dimer to a gaseous parylene monomer; (C) to vaporize the decane by heating it to its evaporation point To form a gaseous decane; (D) to contact the article to be coated with the parylene compound using the gaseous decane of step C; and (E) to contact the gaseous polyparaxylene monomer of step B for contact The article of the parylene compound is maintained for a sufficient period of time to deposit a coating layer of the parylene compound having a final thickness. For some In a specific example, the parylene compound may be selected from the group consisting of a D-type poly-p-xylene compound, a C-type poly-p-xylene compound, an N-type poly-p-xylene compound, and an HT-type poly pair. A xylene compound®, and a parylene compound derived from an N-type parylene compound, and preferably a C-type parylene compound. In some embodiments, the decane may be a decane coupling agent® A-174, a decane coupling agent® 111, or a decane coupling agent® A-174 (NT), and preferably a decane coupling Agent® A-174.

於某些具體實例中,在步驟A中,該聚對二甲苯二聚物可能會藉由在二或多個階段中進行加熱而被汽化,且較佳的係,會在約170℃以及約200℃至約220℃的兩個階段中進行加熱。於某些具體實例中,在步驟B中,該聚對二甲苯二聚物可能會藉由在二或多個階段中進行加熱而被裂解,且較佳的係,會在約680℃以及大於約700℃的兩個階段中進行加熱。於某些具體實例中,在步驟C中,該矽烷可能會在含水的50:50溶液中被汽化。於其它具體實例中,在步驟C中,該矽烷可能會在80℃處被汽化2個小時。於某些具體實例中,該聚對二甲苯化合物塗覆層的最終厚度可能係從約100埃至約3.0mm。 In some embodiments, in step A, the parylene dimer may be vaporized by heating in two or more stages, and preferably, at about 170 ° C and about Heating is carried out in two stages of from 200 ° C to about 220 ° C. In some embodiments, in step B, the parylene dimer may be cleaved by heating in two or more stages, and preferably, at about 680 ° C and greater than Heating is carried out in two stages of about 700 °C. In some embodiments, in step C, the decane may be vaporized in an aqueous 50:50 solution. In other embodiments, in step C, the decane may be vaporized at 80 ° C for 2 hours. In some embodiments, the final thickness of the parylene compound coating layer may range from about 100 angstroms to about 3.0 mm.

包括利用矽烷化合物來前置處理物件的方法可能包含下面步驟:A.藉由加熱至150至200℃來汽化聚對二甲苯二聚物,用以形成氣態的聚對二甲苯二聚物;B.藉由將氣態的聚對二甲苯二聚物加熱至約650℃至約700℃來將氣態的聚對二甲苯二聚物裂解成氣態的聚對二甲苯單體;C.藉由將矽烷加熱至其蒸發點來汽化它,用以形成氣態的矽烷;D.利用氣態矽烷來接觸要被塗覆的物件;以及E.利用氣態的聚對二甲苯單體來接觸要被塗覆的物件,維 持一段足夠的時間以便沉積具有最終厚度的聚對二甲苯化合物塗覆層。熟習本技術的人士便會非常明白,步驟A、B、以及E可以目前用來對物件塗覆聚對二甲苯化合物的任何方式來實施。進一步言之,任何該等步驟亦可以和本文所提出者不同的順序來實施。舉例來說,可以在步驟A之前先實施步驟D。進一步言之,某些步驟亦可以和其它步驟同時實施,舉例來說,步驟D可以和步驟A同時實施。於較佳的具體實例中,可以使用C型聚對二甲苯化合物,參見圖1B。於其它具體實例中,可以使用其它型式的聚對二甲苯化合物,其包含,但是並不受限於:N型聚對二甲苯化合物、D型聚對二甲苯化合物、以及HT型聚對二甲苯化合物®,參見圖1A、1B、以及1D。於某些具體實例中,該聚對二甲苯化合物可能係藉由對各種化學成分進行置換而衍生自N型聚對二甲苯化合物,或聚對二甲苯。於較佳的具體實例中,該聚對二甲苯化合物可能會形成完全線性、高度結晶的材料。在下文實施例的段落中會更詳細說明如何實施該方法以便提出該方法的其中一具體實例。 A method comprising pretreating an article with a decane compound may comprise the steps of: A. vaporizing the parylene dimer by heating to 150 to 200 ° C to form a gaseous parylene dimer; The gaseous parylene dimer is cleaved into a gaseous parylene monomer by heating the gaseous parylene dimer to a temperature of from about 650 ° C to about 700 ° C; C. by decane Heating to its evaporation point to vaporize it to form gaseous decane; D. using gaseous decane to contact the object to be coated; and E. using gaseous parylene monomer to contact the object to be coated ,dimension Hold a sufficient period of time to deposit a coating layer of the parylene compound having a final thickness. Those skilled in the art will readily appreciate that steps A, B, and E can be practiced in any manner currently employed to coat a parylene compound with an article. Further, any such steps can be implemented in a different order than those presented herein. For example, step D can be implemented prior to step A. Further, some steps may be performed simultaneously with other steps. For example, step D may be performed simultaneously with step A. In a preferred embodiment, a C-type parylene compound can be used, see Figure IB. In other embodiments, other types of parylene compounds may be used, including, but not limited to, N-type parylene compounds, D-type parylene compounds, and HT-type parylenes. Compound®, see Figures 1A, 1B, and 1D. In some embodiments, the parylene compound may be derived from an N-type parylene compound, or parylene, by displacement of various chemical components. In a preferred embodiment, the parylene compound may form a completely linear, highly crystalline material. How to implement the method in order to present one of the specific examples of the method will be explained in more detail in the paragraphs of the following examples.

於某些具體實例中,可能會在一熔爐室中實施步驟A,藉由加熱至150至200℃來汽化聚對二甲苯二聚物用以形成氣態的聚對二甲苯二聚物。於較佳的具體實例中,該聚對二甲苯二聚物會在多個階段中被加熱至所希的150至200℃。於某些具體實例中,會在一具有多個溫度區的熔爐室中來進行該聚對二甲苯二聚物的分級式加熱,其允許該熔爐室的不同區域有不同的溫度設定點。雖然並不限制此分級式加熱程序的作動方法;不過,本案發明人認為本方法可以讓聚對二甲苯化合物被均勻地「碎裂」成單體並且可更佳地控制物件上之最終聚對二甲苯化合物塗覆層的厚度,因為其在沉積室中保持單體的時間較長,因此其能夠分佈在整個沉積室中。於某些具體實例中,該聚對二甲苯二聚物會藉由在2個階段、3個階段、4個階段、或是4個以上的階段中進行加熱而被汽化。於某些具體實例中, 該等階段的溫度為約170℃,以及約200℃至約220℃。雖然並未限制特殊的理論;不過,本案發明人相信,在第一階段的汽化中汽化該聚對二甲苯化合物以及在第二階段中於該蒸氣進入熱解室時預熱該蒸氣可以較高的速率將其裂解成單體。 In some embodiments, step A may be carried out in a furnace chamber to vaporize the parylene dimer to form a gaseous parylene dimer by heating to 150 to 200 °C. In a preferred embodiment, the parylene dimer will be heated to a desired 150 to 200 ° C in multiple stages. In some embodiments, the hierarchical heating of the parylene dimer is performed in a furnace chamber having a plurality of temperature zones that allow different temperature set points for different regions of the furnace chamber. Although the method of operation of the hierarchical heating procedure is not limited; however, the inventors believe that the method allows the parylene compound to be uniformly "cracked" into monomers and better control the final pairing on the article. The thickness of the coating layer of the xylene compound can be distributed throughout the deposition chamber because it takes a long time to hold the monomer in the deposition chamber. In some embodiments, the parylene dimer is vaporized by heating in two stages, three stages, four stages, or four or more stages. In some specific examples, The temperatures of the stages are about 170 ° C, and about 200 ° C to about 220 ° C. Although not limited to a particular theory; however, the inventors believe that vaporizing the parylene compound in the first stage of vaporization and preheating the vapor in the second stage as the vapor enters the pyrolysis chamber can be higher The rate is split into monomers.

於某些具體實例中,可能會在一熔爐室中實施步驟B,藉由將氣態的聚對二甲苯二聚物加熱至650至700℃來將氣態的聚對二甲苯二聚物裂解成氣態的聚對二甲苯單體。於較佳的具體實例中,該氣態的聚對二甲苯二聚物會在多個階段中被加熱至所希的650至700℃。於某些具體實例中,會在一具有多個溫度區的熔爐室中來進行該氣態聚對二甲苯二聚物的分級式加熱,其允許該熔爐室的不同區域有不同的溫度設定點。於某些具體實例中,該聚對二甲苯二聚物會藉由在2個階段、3個階段、4個階段、或是4個以上的階段中進行加熱而被裂解。於某些具體實例中,該等階段的溫度為約680℃,以及約700℃以上。雖然並未限制特殊的理論;不過,本案發明人則認為在第一階段的加熱中將該等氣態聚對二甲苯二聚物裂解成單體以及在第二加熱狀態中將該等氣態單體進一步加熱至約700℃以上用以確保該等氣態單體會在該沉積室中維持較長的時間以便更均勻地填充該沉積室。 In some embodiments, step B may be performed in a furnace chamber to cleave the gaseous parylene dimer to a gaseous state by heating the gaseous parylene dimer to 650 to 700 °C. Polyparaxylene monomer. In a preferred embodiment, the gaseous parylene dimer will be heated to a desired 650 to 700 ° C in multiple stages. In some embodiments, the hierarchical heating of the gaseous parylene dimer is carried out in a furnace chamber having a plurality of temperature zones that allow different temperature set points for different regions of the furnace chamber. In some embodiments, the parylene dimer is cleaved by heating in two stages, three stages, four stages, or four or more stages. In some embodiments, the temperatures of the stages are about 680 ° C and above about 700 ° C. Although no particular theory is limited; however, the inventors of the present invention believe that the gaseous polyparaxylene dimer is cleaved into monomers during the first stage of heating and the gaseous monomers are in the second heated state. Further heating to above about 700 °C is used to ensure that the gaseous monomers will remain in the deposition chamber for a longer period of time to more evenly fill the deposition chamber.

在該等方法所利用的一步驟中,氣態矽烷(圖1E)可能會接觸要被塗覆的物件(步驟D)。此步驟特別有利於幫助對物件的親水性表面進行聚對二甲苯化合物塗覆。於某些具體實例中,會在整個方法中使用矽烷偶聯劑®矽烷、矽烷偶聯劑® A-174(NT),或是矽烷偶聯劑® A-174來為物件塗覆一聚對二甲苯化合物。於其中一具體實例中,該物件可能會在一真空室中接觸該氣態矽烷。 In one step utilized by such methods, gaseous decane (Fig. 1E) may contact the article to be coated (step D). This step is particularly advantageous to aid in the application of the parylene compound to the hydrophilic surface of the article. In some embodiments, a mixture of decane coupling agent® decane, decane coupling agent® A-174 (NT), or decane coupling agent® A-174 is used throughout the process. Xylene compound. In one embodiment, the article may contact the gaseous decane in a vacuum chamber.

在步驟C中,該矽烷可藉由將其加熱至其蒸發點而被汽化。於較佳的具體實例中,此步驟可在要被前置處理的物件接觸氣態矽烷之前 先被實施。於其中一具體實例中,藉由將矽烷置入一坩堝之中,將該坩堝插入含有該要被塗覆之物件的真空室中的加熱處上的一1英吋熱偶之中,便可以實施此步驟。被灌入該坩堝之中的矽烷的數量可能會相依於該真空室中的物件的數量與大小。於各具體實例中,被汽化的矽烷的數量的範圍可能係從約10ml至約100ml,或者於某些情況中,數量可能更多。於其中一具體實例中,該加熱板可將該矽烷加熱至其蒸發點。於其它具體實例中,熟習本技術的人士便會非常明白,可以使用其它方法來將該矽烷加熱至其蒸發點。於另一具體實例中,可能會汽化含有蒸餾水的矽烷混合物。於其中一具體實例中,會加熱矽烷與蒸餾水的50/50混合物直到矽烷被汽化為止,其可能會在約80℃處持續約2個小時。 In step C, the decane can be vaporized by heating it to its evaporation point. In a preferred embodiment, this step can be performed before the object to be pretreated contacts the gaseous decane First implemented. In one embodiment, by placing the decane in a crucible, inserting the crucible into a 1 inch thermocouple on the heating chamber in the vacuum chamber containing the article to be coated, Implement this step. The amount of decane that is poured into the crucible may depend on the number and size of the objects in the vacuum chamber. In various embodiments, the amount of vaporized decane may range from about 10 ml to about 100 ml, or in some cases, the amount may be more. In one embodiment, the heating plate can heat the decane to its evaporation point. In other embodiments, it will be apparent to those skilled in the art that other methods can be used to heat the decane to its point of evaporation. In another embodiment, a mixture of decane containing distilled water may be vaporized. In one embodiment, a 50/50 mixture of decane and distilled water is heated until the decane is vaporized, which may last for about 2 hours at about 80 °C.

雖然於某些具體實例中,該物件可能會在相同的真空室中先利用矽烷進行前置處理且接著塗覆聚對二甲苯化合物;不過,於其它具體實例中,該等兩個塗覆層亦可在不同的室中及/或不同的時間處被塗敷。於一較佳的具體實例中,一旦完成將該物件曝露至要被蒸發的矽烷之後,該室便可被置放在真空下,並且在達到合宜的真空時便可立刻開始進行聚對二甲苯化合物沉積。較佳的係,亦可在引入該等氣態的聚對二甲苯化合物單體之前先完全排出該室中的矽烷蒸氣。於各具體實例中,施加該矽烷前置處理及塗覆該聚對二甲苯化合物塗覆層之間的時間週期可能會從約0分鐘至約120分鐘。矽烷的蒸發點的溫度為約80℃。雖然並不限制矽烷的作動機制;不過,本案發明人認為經汽化的矽烷會前置處理該物件,從而會藉由讓表面具有會鍵結該等聚對二甲苯單體的自由基而提高表面接受該聚對二甲苯單體氣體的能力。 Although in some embodiments, the article may be pre-treated with decane in the same vacuum chamber and then coated with the parylene compound; however, in other embodiments, the two coatings It can also be applied in different chambers and/or at different times. In a preferred embodiment, once the article is exposed to the decane to be evaporated, the chamber can be placed under vacuum and the parylene can be started immediately upon reaching a suitable vacuum. Compound deposition. Preferably, the decane vapor in the chamber is completely discharged prior to introduction of the gaseous parylene compound monomers. In various embodiments, the time period between application of the decane pretreatment and coating of the parylene compound coating layer may range from about 0 minutes to about 120 minutes. The temperature at the evaporation point of decane was about 80 °C. Although not limiting the mechanism of action of decane; however, the inventors believe that the vaporized decane will pretreat the article, thereby increasing the surface by having the surface have free radicals that will bond the parylene monomers. The ability to accept the parylene monomer gas.

在步驟D中,要被塗覆的物件可能會接觸氣態矽烷。於較佳的具體實例中,此接觸作用可以在稍後用來讓該等氣態聚對二甲苯單體接觸該物件的相同沉積室中完成。於某些具體實例中,該物件會接觸該氣 態矽烷持續約2個小時的時間。 In step D, the article to be coated may be exposed to gaseous decane. In a preferred embodiment, this contact can be accomplished in the same deposition chamber that is later used to contact the gaseous parylene monomer to the article. In some embodiments, the object will contact the gas The decane lasted for about 2 hours.

在步驟E中,可能會利用氣態的聚對二甲苯單體來接觸要被塗覆的物件,維持一段足夠的時間以便沉積聚對二甲苯化合物塗覆層。於較佳的具體實例中,此步驟可以在一沉積室中實施,且特佳的係,在該物件接觸矽烷的相同沉積室中實施。於其它較佳的具體實例中,該沉積室及該等要被塗覆的物件可能處於室溫處。於某些具體實例中,沉積溫度可能為約5℃至約30℃,較佳的係,約20℃至約25℃。於某些具體實例中,該沉積室可被冷凍以加速沉積製程。 In step E, a gaseous parylene monomer may be utilized to contact the article to be coated for a sufficient period of time to deposit the parylene compound coating. In a preferred embodiment, this step can be carried out in a deposition chamber, and a particularly preferred system is carried out in the same deposition chamber where the article contacts decane. In other preferred embodiments, the deposition chamber and the articles to be coated may be at room temperature. In some embodiments, the deposition temperature may range from about 5 ° C to about 30 ° C, preferably from about 20 ° C to about 25 ° C. In some embodiments, the deposition chamber can be frozen to speed up the deposition process.

另一具體實例提供一種利用矽烷來處理物件的方法。此方法包含下面步驟:A.藉由將矽烷加熱至其蒸發點來汽化它,用以形成氣態的矽烷;以及B.利用氣態矽烷來接觸要被塗覆的物件。 Another embodiment provides a method of treating an article using decane. The method comprises the steps of: A. vaporizing it by heating the decane to its evaporation point to form a gaseous decane; and B. contacting the article to be coated with gaseous decane.

在步驟A中,矽烷可能會藉由被加熱至其蒸發點而被汽化。於某些具體實例中,矽烷偶聯劑®、矽烷偶聯劑® A-174、矽烷偶聯劑® 111、或是矽烷偶聯劑® A-174(NT)為整個方法中使用的矽烷。於較佳的具體實例中,可能會在利用氣態矽烷接觸該要被塗覆的物件之前先實施此步驟。於其中一具體實例中,藉由將矽烷置入一坩堝之中,將該坩堝插入含有該要被塗覆之物件的真空室中的加熱處上的一2英吋熱偶之中,便可以實施此步驟,被灌入該坩堝之中的矽烷的數量可能會相依於該真空室中的物品的數量與大小。於各具體實例中,被汽化的矽烷的數量的範圍可能係從約10ml至約100ml,或者於某些情況中,數量可能更多。於其中一具體實例中,該加熱板可將該矽烷加熱至其蒸發點。於其它具體實例中,熟習本技術的人士便會非常明白,可以使用其它方法來將該矽烷加熱至其蒸發點。於另一具體實例中,可能會汽化含有蒸餾水的矽烷混合物。於其中一具體實例中, 可能會加熱矽烷與蒸餾水的50/50混合物直到矽烷被汽化為止,其可能會在約80℃處持續約2個小時。 In step A, the decane may be vaporized by being heated to its evaporation point. In some embodiments, decane coupling agent®, decane coupling agent® A-174, decane coupling agent® 111, or decane coupling agent® A-174 (NT) is the decane used throughout the process. In a preferred embodiment, this step may be performed prior to contacting the article to be coated with gaseous decane. In one embodiment, by placing the decane in a crucible, inserting the crucible into a 2 inch thermocouple on the heating chamber in the vacuum chamber containing the article to be coated, In carrying out this step, the amount of decane that is poured into the crucible may depend on the number and size of the items in the vacuum chamber. In various embodiments, the amount of vaporized decane may range from about 10 ml to about 100 ml, or in some cases, the amount may be more. In one embodiment, the heating plate can heat the decane to its evaporation point. In other embodiments, it will be apparent to those skilled in the art that other methods can be used to heat the decane to its point of evaporation. In another embodiment, a mixture of decane containing distilled water may be vaporized. In one specific example, A 50/50 mixture of decane and distilled water may be heated until the decane is vaporized, which may last for about 2 hours at about 80 °C.

在步驟B中,會利用氣態矽烷來接觸要被塗覆的物件。於某些具體實例中,該物件會接觸該氣態矽烷持續約2個小時的時間。 In step B, gaseous decane is used to contact the article to be coated. In some embodiments, the article will contact the gaseous decane for a period of about 2 hours.

本發明還提供用以塗敷包括一保形塗覆化合物與一導熱材料之塗覆層的方法。於某些具體實例中,該等方法包含:加熱一保形塗覆化合物,用以形成該保形塗覆化合物的氣態單體;結合一導熱材料與該等氣態單體,從而形成一氣態混合物;以及於包括該保形塗覆化合物及該導熱材料的保形塗覆層會被形成在一物件的一表面的至少一部分上的條件下讓該物件接觸該氣態混合物,從而塗敷一保形塗覆層至該物件。 The present invention also provides a method for applying a coating comprising a conformal coating compound and a thermally conductive material. In some embodiments, the method comprises: heating a conformal coating compound to form a gaseous monomer of the conformal coating compound; combining a thermally conductive material with the gaseous monomers to form a gaseous mixture And coating the conformal coating with a conformal coating comprising the conformal coating compound and the thermally conductive material on at least a portion of a surface of an article to coat the gaseous mixture Apply a layer to the article.

本文所使用的「氣態混合物」為包括至少一氣相(氣態)成分以及可能為氣相或可能為非氣相之至少另一成分的混合物。舉例來說,一氣態混合物可能包括一氣相的保形塗覆化合物以及懸浮在該等保形塗覆化合物蒸氣中的一固相化合物(舉例來說,粉末粒子)。同樣地,一氣態混合物亦可能包括一氣相的保形塗覆化合物以及懸浮在該等保形塗覆化合物蒸氣中的一液相化合物(舉例來說,霧化液體)。此外,一氣態混合物還可能包括多種氣相成分(舉例來說,複數種不同的氣相保形塗覆化合物)。應該瞭解的係,氣態混合物可能包含相同及/或不同態相成分的任何數量組合。於某些具體實例中,該氣態混合物包括至少一氣相保形塗覆化合物(舉例來說,聚對二甲苯化合物)以及至少一導熱材料。於某些具體實例中,一氣態混合物中的導熱材料為固相(舉例來說,粉末粒子)。於某些具體實例中,一氣態混合物中的導熱材料為液相。又,於其它具體實例中,一氣態混合物中的導熱材料為氣相。 As used herein, a "gaseous mixture" is a mixture comprising at least one gas phase (gaseous) component and possibly at least one other component of the gas phase or possibly the non-gas phase. For example, a gaseous mixture may include a gas phase conformal coating compound and a solid phase compound (for example, powder particles) suspended in the vapor of the conformal coating compound. Similarly, a gaseous mixture may also include a vapor phase conformal coating compound and a liquid phase compound (e.g., an atomized liquid) suspended in the vapor of the conformal coating compound. In addition, a gaseous mixture may also include a plurality of gas phase components (for example, a plurality of different gas phase conformal coating compounds). It should be understood that the gaseous mixture may comprise any number of combinations of the same and/or different phase components. In some embodiments, the gaseous mixture includes at least one vapor phase conformal coating compound (for example, a parylene compound) and at least one thermally conductive material. In some embodiments, the thermally conductive material in a gaseous mixture is a solid phase (for example, powder particles). In some embodiments, the thermally conductive material in a gaseous mixture is in the liquid phase. Also, in other embodiments, the thermally conductive material in a gaseous mixture is in the vapor phase.

本文所揭示的塗覆方法可以使用在營利性海洋業、休閒遊艇業、軍方(航空與防禦)、工業與醫界、以及本文所揭示及本技術中已知的其 它業界中所使用的產品上。於某些情況中,該塗覆製程可能會經過特別設計,用以「密封」元件。因此,該等塗覆方法可用於保護海洋及有害環境中常用的元件,避免因曝露於濕氣、沒入水中、灰塵、強風及化學藥劑作用的關係而造成操作上的誤動作。該塗覆層可強化容易受到腐蝕與損毀的操作設備及高價專業產品的存活力及持續力。 The coating methods disclosed herein can be used in for-profit marine, recreational yachting, military (aviation and defense), industrial and medical, and as disclosed herein and known in the art. It is used in products used in the industry. In some cases, the coating process may be specially designed to "seal" the component. Therefore, the coating methods can be used to protect components commonly used in the marine and harmful environments, and to avoid operational malfunction due to exposure to moisture, submerged water, dust, strong winds, and chemical action. The coating layer enhances the viability and sustainability of operating equipment and high-priced specialty products that are susceptible to corrosion and damage.

於另一項觀點中,本發明提供一種用以將一包括一聚對二甲苯化合物與氮化硼的保形塗覆層塗敷至一物件的一表面中至少一部分的方法,該方法可能具有下面步驟:(A)藉由將聚對二甲苯二聚物加熱至約150℃至約200℃來汽化它們,用以形成氣態的聚對二甲苯二聚物;(B)藉由將氣態的聚對二甲苯二聚物加熱至約650℃至約700℃來將氣態的聚對二甲苯二聚物裂解成氣態的聚對二甲苯單體;(C)將氮化硼注入步驟B的氣態聚對二甲苯單體之中;以及(D)利用步驟C的氣態聚對二甲苯單體與氮化硼來接觸要塗覆聚對二甲苯化合物的物件,維持一段足夠的時間以便沉積具有最終厚度的聚對二甲苯化合物與氮化硼塗覆層。雖然此方法中可以使用任何的聚對二甲苯化合物;不過,可能以D型聚對二甲苯化合物、C型聚對二甲苯化合物、N型聚對二甲苯化合物、以及HT型聚對二甲苯化合物®為佳,而特佳的可能係C型聚對二甲苯化合物。於某些較佳的具體實例中,該氮化硼可能會以粉末形式(較佳的係,藉於約18微米與約25微米之間)被注入該等氣態聚對二甲苯單體之中。於其它具體實例中,步驟D可能係發生在約5℃至約30℃之間。於某些具體實例中,該塗覆層的最終厚度可能係藉於約100埃與約3.0毫米之間。於某些具體實例中,該方法可能具有一額外步驟E,於該步驟中,該要被塗覆的物件可能會接觸一矽烷組成物,直到該物件被矽烷塗覆為止。 In another aspect, the present invention provides a method for applying a conformal coating layer comprising a parylene compound and boron nitride to at least a portion of a surface of an article, the method having The following steps: (A) vaporizing the parylene dimers by heating them to a temperature of from about 150 ° C to about 200 ° C to form a gaseous parylene dimer; (B) by means of a gaseous state The parylene dimer is heated to about 650 ° C to about 700 ° C to cleave the gaseous parylene dimer into a gaseous parylene monomer; (C) the boron nitride is injected into the gaseous state of step B Among the parylene monomers; and (D) using the gaseous polyparaxylene monomer of step C and boron nitride to contact the article to be coated with the parylene compound for a sufficient period of time for deposition to have a final A thickness of the parylene compound and a boron nitride coating layer. Although any parylene compound can be used in this method; however, it is possible to use a D-type parylene compound, a C-type parylene compound, an N-type parylene compound, and an HT-type parylene compound. ® is preferred, while the best one may be a C-type parylene compound. In certain preferred embodiments, the boron nitride may be injected into the gaseous parylene monomer in powder form (preferably between about 18 microns and about 25 microns). . In other embodiments, step D may occur between about 5 ° C and about 30 ° C. In some embodiments, the final thickness of the coating layer may be between about 100 angstroms and about 3.0 millimeters. In some embodiments, the method may have an additional step E in which the article to be coated may contact a decane composition until the article is coated with decane.

於某些具體實例中,該方法會使用標準的化學氣相沉積粒子,在25℃處,於一真空室內塗敷一包括聚對二甲苯化合物與氮化硼之均 勻的、保形塗覆薄層,其厚範圍從0.01毫米至3.0毫米,端視要被塗覆的物品而定。該物品一旦被塗覆之後便可以抵抗氣候並且防水,而且能夠耐受曝露於極端的氣候條件及曝露於大部分的化學藥劑中。任何固態表面均可以被塗覆,其包含塑膠、金屬、木材、紙材、以及紡織原料。實施例應用包含,但是並不受限於:電子設備,例如行動電話、無線電、電路板、以及揚聲器;用於海洋與空間探測的設備;有害廢棄物運送設備;醫療儀器;紙材產品;以及紡織品。 In some embodiments, the method uses standard chemical vapor deposited particles to coat a solution comprising a parylene compound and boron nitride in a vacuum chamber at 25 ° C. A uniform, conformal coating of a thin layer ranging in thickness from 0.01 mm to 3.0 mm, depending on the article to be coated. Once coated, the article is weather resistant and water resistant, and can withstand exposure to extreme weather conditions and exposure to most chemicals. Any solid surface can be coated, including plastic, metal, wood, paper, and textile materials. Embodiment applications include, but are not limited to, electronic devices such as mobile phones, radios, circuit boards, and speakers; equipment for marine and space detection; hazardous waste transport equipment; medical instruments; paper products; textile.

因此,利用由聚對二甲苯化合物與氮化硼組成之組成物來塗覆物件的方法可能包含下面數道步驟:A.藉由加熱至150至200℃來汽化聚對二甲苯二聚物,用以形成氣態的聚對二甲苯二聚物;B.藉由將氣態的聚對二甲苯二聚物加熱至650至700℃來將氣態的聚對二甲苯二聚物裂解成氣態的聚對二甲苯單體;C.將氮化硼注入步驟B的氣態聚對二甲苯單體之中;以及D.利用氣態聚對二甲苯單體與氮化硼來接觸要被塗覆的物件,維持一段足夠的時間以便沉積具有最終厚度的聚對二甲苯化合物塗覆層。 Therefore, the method of coating an article using a composition composed of a parylene compound and boron nitride may include the following steps: A. vaporizing the parylene dimer by heating to 150 to 200 ° C, Used to form a gaseous parylene dimer; B. The gaseous parylene dimer is cleaved into a gaseous poly pair by heating the gaseous parylene dimer to 650 to 700 °C. a xylene monomer; C. injecting boron nitride into the gaseous parylene monomer of step B; and D. contacting the object to be coated with gaseous parylene monomer and boron nitride, maintaining A sufficient period of time is required to deposit a coating layer of the parylene compound having a final thickness.

熟習本技術的人士便會非常明白,利用聚對二甲苯化合物與氮化硼來塗覆物件的該方法中的步驟A與B可以目前用來對物件氣相塗覆聚對二甲苯化合物的任何方式來實施。進一步言之,該等步驟亦可以和本文所提出者不同的順序來實施。於較佳的具體實例中,會使用C型聚對二甲苯化合物。於其它具體實例中,可以使用其它型式的聚對二甲苯化合物,其包含,但是並不受限於:N型聚對二甲苯化合物、D型聚對二甲苯化合物、以及HT型聚對二甲苯化合物®。於某些具體實例中,該聚對二甲苯化合物可能係藉由對各種化學成分進行置換而衍生自N型聚對二甲苯化合物,或聚對二甲苯。於較佳的具體實例中,該聚對二甲苯化合物會形成完全線性、高度結晶的材料。在下文實施例的段落中會更詳細說明如何實施該方法以便提出該方法的其中一具體實例。 Those skilled in the art will readily appreciate that steps A and B of the method of coating articles using a parylene compound and boron nitride can be used to vaporize any of the articles on the article. Way to implement. Further, the steps may also be performed in a different order than those presented herein. In a preferred embodiment, a C-type parylene compound is used. In other embodiments, other types of parylene compounds may be used, including, but not limited to, N-type parylene compounds, D-type parylene compounds, and HT-type parylenes. Compound®. In some embodiments, the parylene compound may be derived from an N-type parylene compound, or parylene, by displacement of various chemical components. In a preferred embodiment, the parylene compound forms a completely linear, highly crystalline material. How to implement the method in order to present one of the specific examples of the method will be explained in more detail in the paragraphs of the following examples.

於某些具體實例中,步驟A,藉由加熱至150至200℃來汽化聚對二甲苯二聚物用以形成氣態的聚對二甲苯二聚物可能會在一熔爐室中實施。於某些具體實例中,步驟B,藉由將氣態的聚對二甲苯二聚物加熱至650至700℃來將氣態的聚對二甲苯二聚物裂解成氣態的聚對二甲苯單體可能會在一熔爐室中實施。於某些具體實例中,步驟C,將氮化硼注入步驟B的氣態聚對二甲苯單體之中可能係在步驟B後面被實施。於某些具體實例中,該氮化硼可能會以粉末的形式被注入該氣態的聚對二甲苯單體之中。在實施例段落中會說明此步驟的其中一具體實例。於某些具體實例中,該氮化硼粉末可能至少為約500粒號。於某些具體實例中,該氮化硼粉末係介於約1.8微米與約2.5微米之間。 In some embodiments, step A, vaporizing the parylene dimer to form a gaseous parylene dimer by heating to 150 to 200 ° C may be carried out in a furnace chamber. In some embodiments, step B, the gaseous parylene dimer is cleaved into gaseous parylene monomer by heating the gaseous parylene dimer to 650 to 700 ° C. Will be implemented in a furnace room. In some embodiments, step C, injecting boron nitride into the gaseous parylene monomer of step B may be performed after step B. In some embodiments, the boron nitride may be injected into the gaseous parylene monomer in the form of a powder. One specific example of this step will be described in the examples section. In some embodiments, the boron nitride powder may be at least about 500 particles. In some embodiments, the boron nitride powder is between about 1.8 microns and about 2.5 microns.

在步驟D中,該要被塗覆的物件可能會接觸氣態聚對二甲苯單體與氮化硼,維持一段足夠的時間,以便在該物件上沉積一聚對二甲苯化合物塗覆層。於某些具體實例中,此步驟可能會在一沉積室中實施。於其它具體實例中,該沉積室及該等要被塗覆的物件可能處於室溫處,其係從約5℃至約30℃,或者更佳的係,從約20℃至約25℃。於某些具體實例中,可能會改變該物件可接觸該等氣態聚對二甲苯單體與氮化硼的時間長度,以便控制該物件上的聚對二甲苯化合物-氮化硼塗覆層的最終厚度。於各種具體實例中,該聚對二甲苯化合物-氮化硼塗覆層的最終厚度可能介於約100埃至約3.0毫米之間。於某些具體實例中,聚對二甲苯化合物會被沉積約8個小時至約18個小時,以便達到約0.05mm的塗覆層厚度。於某些具體實例中,聚對二甲苯化合物會被沉積約5個小時至約18個小時,以便達到約0.05mm的塗覆層厚度。於較佳的具體實例中,聚對二甲苯化合物塗覆層的最終厚度可能介於約0.5毫米至約3.0毫米之間。聚對二甲苯化合物塗覆層之最終厚度的選擇會相依於要被塗覆之物件的特定度數及該物件的最終用途。需要進行某種移動以發揮功能的物件可能會希望有較薄的最 終塗覆層,例如電力按鈕。會被沒入水中的物件則可能會希望有較厚的塗覆層。 In step D, the article to be coated may contact the gaseous parylene monomer and boron nitride for a sufficient period of time to deposit a parylene compound coating on the article. In some embodiments, this step may be performed in a deposition chamber. In other embodiments, the deposition chamber and the articles to be coated may be at room temperature, from about 5 ° C to about 30 ° C, or more preferably from about 20 ° C to about 25 ° C. In some embodiments, the length of time that the article can contact the gaseous parylene monomer and the boron nitride may be varied to control the parylene compound-boron nitride coating layer on the article. Final thickness. In various embodiments, the final thickness of the parylene compound-boron nitride coating layer may be between about 100 angstroms and about 3.0 millimeters. In some embodiments, the parylene compound is deposited for from about 8 hours to about 18 hours to achieve a coating thickness of about 0.05 mm. In some embodiments, the parylene compound is deposited for from about 5 hours to about 18 hours to achieve a coating thickness of about 0.05 mm. In a preferred embodiment, the final thickness of the parylene compound coating layer may be between about 0.5 mm and about 3.0 mm. The choice of the final thickness of the parylene coating layer will depend on the particular degree of the article to be coated and the end use of the article. Objects that need to be moved to function may want to have the thinnest The final coating, such as a power button. Objects that are immersed in water may wish to have a thicker coating.

於某些具體實例中,該方法可能具有額外的步驟E,用以讓該要被塗覆的物件接觸一矽烷組成物,直到矽烷前置處理過該物件為止。於較佳的具體實例中,可能會在步驟D之前先實施此步驟。於某些具體實例中,當該物件接觸該矽烷時,該矽烷組成物可能係在溶液中。於其它具體實例中,當該物件接觸該矽烷時,該矽烷組成物可能為氣體。於某些具體實例中,該矽烷組成物可能為矽烷偶聯劑® A-174矽烷(圖1E)。此步驟特別有利於幫助對物件的親水性表面進行聚對二甲苯化合物塗覆。 In some embodiments, the method may have an additional step E for contacting the article to be coated with a decane composition until the decane is pretreated to the article. In a preferred embodiment, this step may be performed prior to step D. In some embodiments, when the article contacts the decane, the decane composition may be in solution. In other embodiments, the decane composition may be a gas when the article contacts the decane. In some embodiments, the decane composition may be a decane coupling agent® A-174 decane (Fig. 1E). This step is particularly advantageous to aid in the application of the parylene compound to the hydrophilic surface of the article.

實施例Example

實施例1:利用聚對二甲苯化合物塗覆物件的方法與裝置 Example 1: Method and apparatus for coating articles with parylene compounds

本具體實例使用C型聚對二甲苯化合物。 This specific example uses a C-type parylene compound.

塗覆製程 Coating process

該裝置係由兩個區段所組成:(1)一熔爐/加熱區段;以及(2)一真空區段。該熔爐區段係由兩個熔爐所構成,該等兩個熔爐會藉由稱為曲頸瓶的玻璃管相連。該等熔爐區段與真空區段會藉由閥門相連,該等閥門允許在該等熔爐區段與真空區段之間進行氣體流動。 The device consists of two sections: (1) a furnace/heating section; and (2) a vacuum section. The furnace section is composed of two furnaces which are connected by a glass tube called a retort. The furnace sections and vacuum sections are connected by valves that allow gas flow between the furnace sections and the vacuum section.

Mellen Furnace Co.(位於美國新罕不什爾州協和市)已經製造出該設備的熔爐部分,參見實施例2。Laco Technologies Inc.(位於美國猶他州鹽湖城)則已經製造出真空部分。 Mellen Furnace Co. (Concord, New Hampshire, USA) has manufactured the furnace section of the equipment, see Example 2. Laco Technologies Inc. (Salt Lake City, Utah, USA) has created a vacuum section.

利用聚對二甲苯化合物來塗覆物品的製程如下: The process for coating articles using a parylene compound is as follows:

(1)第一熔爐室。數量足以塗覆該物品之二聚物形式(雙分子形式)的C型聚對二甲苯化合物會被置放在該熔爐室之中。該等物品被塗覆的厚度範圍會從0.01至3.0mm。該C型聚對二甲苯化合物會被置放在一不銹鋼「舟形器皿」(由金屬或玻璃製成的標準容器)之中,其會經由該管體的 真空固定開口被插入該熔爐之中(該舟形器皿會藉由一桿體被推入該熔爐之中)。於置入該C型聚對二甲苯化合物之後,該開口便會被密封。接著,該熔爐便會被加熱至150至200℃,用以創造會讓該固態該C型聚對二甲苯化合物變成氣體的環境。在兩個閥門張開之前,該氣體都會被保留在該第一熔爐室之中。兩個閥門中的第一個閥門於該真空區段中的冷阱(cold trap)充滿液態氮(LN2)且該等冷阱為「冰冷(cold)」之前並不會張開。LN2係向當地的供應商購得。LN2於供應商處係被置放在一加侖容器之中。LN2會從該容器中被灌入該「冷阱」之中。第二閥門為可變的並且會在氣體因真空而從該第一熔爐處被抽出時張開。 (1) First furnace chamber. A C-type parylene compound in an amount sufficient to coat the dimeric form (bimolar form) of the article is placed in the furnace chamber. The articles are coated to a thickness ranging from 0.01 to 3.0 mm. The C-type parylene compound is placed in a stainless steel "boat" (standard container made of metal or glass) through which the tube is A vacuum fixed opening is inserted into the furnace (the boat is pushed into the furnace by a rod). After the C-type parylene compound is placed, the opening is sealed. Next, the furnace is heated to 150 to 200 ° C to create an environment that will cause the solid C-type parylene compound to become a gas. The gas is retained in the first furnace chamber before the two valves are opened. The first of the two valves does not open until the cold trap in the vacuum section is filled with liquid nitrogen (LN2) and the cold traps are "cold". LN2 is purchased from local suppliers. LN2 is placed in a one gallon container at the supplier. LN2 will be poured into the "cold trap" from the container. The second valve is variable and opens when the gas is withdrawn from the first furnace due to vacuum.

(2)第二熔爐室。C型聚對二甲苯化合物氣體會移至該第二熔爐,其溫度為650至700℃。此熔爐中的熱量會讓該C型聚對二甲苯化合物氣體分離成個別的分子(單體)。該單體形式的氣體接著便會因真空而被送入沉積室之中。 (2) The second furnace chamber. The C-type parylene compound gas is moved to the second furnace at a temperature of 650 to 700 °C. The heat in the furnace separates the C-type parylene compound gas into individual molecules (monomers). The monomeric form of the gas is then fed into the deposition chamber by vacuum.

(3)真空室。該機器的真空部分係由一具有兩個真空唧筒的沉積室所組成。第一真空唧筒係一「粗略」唧筒,其會抽成初始真空。該初始壓力係在1x10-3陶爾範圍中。接著,第二階段唧筒便會抽成位於1x10-4陶爾範圍中的最終壓力。該等真空唧筒會受到液態氮冷阱的保護,液態氮冷阱會藉由冷凝冷阱表面上的氣體來保護該等唧筒避免因單體氣體的固化而受損。 (3) Vacuum chamber. The vacuum section of the machine consists of a deposition chamber with two vacuum cylinders. The first vacuum cylinder is a "rough" cartridge that is drawn into an initial vacuum. This initial pressure is in the range of 1 x 10-3 Torr. The second stage cylinder is then pumped to a final pressure in the range of 1x10-4 Torr. The vacuum cylinders are protected by a liquid nitrogen cold trap that protects the cylinders from condensation of the monomer gas by condensing the gas on the surface of the cold trap.

要被塗覆的物品會在開始進行塗覆製程之前被置放在該沉積室中的棚架上。該等要被塗覆的元件中不要被塗覆的元件之上與裡面的區域會被遮罩(利用熟知的方法)。在必須保持電性或機械性連接功能的區域中便會進行該遮罩作業。材料會在室溫處(華氏75度)被塗覆在該物品上。 The item to be coated is placed on the scaffolding in the deposition chamber before the coating process begins. The areas above and inside the elements to be coated that are to be coated are masked (using well-known methods). This masking operation is performed in an area where electrical or mechanical connection must be maintained. The material will be applied to the article at room temperature (75 degrees Fahrenheit).

在該真空室內部會有一充滿矽烷偶聯劑® A-174矽烷(購自位於美國康乃狄克州威爾頓市的Momentive Performance Materials Inc.)的坩 堝,該矽烷會被灌入一陶瓷坩堝之中。該坩堝會被插入該真空室中一加熱板上的一2英吋熱偶之中。被灌入的矽烷偶聯劑® A-174矽烷的數量會相依於該室中物品的數量,不過,會介於10至100ml之間。該平板會將該矽烷偶聯劑® A-174矽烷加熱至蒸發點,俾使其會塗覆該室內部的整個區域,其包含該室裡面的任何物件。 Inside the vacuum chamber there will be a cesium coupling agent® A-174 decane (available from Momentive Performance Materials Inc., Wilton, Conn.). Oh, the decane will be poured into a ceramic crucible. The crucible is inserted into a 2 inch thermocouple on a hot plate in the vacuum chamber. The amount of decane coupling agent® A-174 decane that is poured will depend on the amount of the item in the chamber, but will range from 10 to 100 ml. The plate will heat the decane coupling agent® A-174 decane to the point of evaporation, which will coat the entire area of the interior containing any items within the chamber.

一旦該矽烷偶聯劑蒸氣從該沉積室處被排出,該單體氣體便會因該真空室中較低的真空而被抽出。當該氣體被送入該室時,其會改變方向俾使其會噴灑在該室的整個區域內。該等物品會於該單體氣體冷卻時被塗覆。該氣體會從600℃冷卻至25℃並且會凝固在該室內的元件上。於該冷卻過程期間,該等單體會沉積在該要被塗覆的物品的表面上,從而產生一均勻且無針孔的聚合物三維串鏈。該沉積設備會控制塗覆速率及最終厚度。聚對二甲苯化合物塗覆層的必要厚度係取決於曝露於該單體氣體的時間。該厚度的範圍可能係從數百埃至數毫米。 Once the decane coupling agent vapor is withdrawn from the deposition chamber, the monomer gas is withdrawn due to the lower vacuum in the vacuum chamber. When the gas is fed into the chamber, it changes direction so that it will spray over the entire area of the chamber. The items are applied as the monomer gas cools. The gas will cool from 600 ° C to 25 ° C and will solidify on the components in the chamber. During the cooling process, the monomers are deposited on the surface of the article to be coated, resulting in a uniform and pinhole-free polymer three-dimensional chain. The deposition apparatus controls the coating rate and final thickness. The necessary thickness of the parylene compound coating layer depends on the time of exposure to the monomer gas. This thickness may range from hundreds of angstroms to several millimeters.

實施例2:可於該裝置中用來塗敷一聚對二甲苯化合物塗覆層的多溫度區熔爐 Example 2: Multi-temperature zone furnace for coating a parylene compound coating layer in the apparatus

Mellen Company,Inc.(位於美國新罕不什爾州協和市)已經製造出此熔爐裝配件。其中一者為Mellen型號TV 12-3x32-1/2Z。 Mellen Company, Inc. (Concord, New Hampshire, USA) has manufactured this furnace assembly. One of them is the Mellen model TV 12-3x32-1/2Z.

單溫度區或雙溫度區一實心管狀熔爐能夠於空氣中操作在高達1200℃的溫度處。該熔爐運用到Mellen標準系列的12V加熱元件(位於一特別設計支架內的裸露Fe-Cr-Al線圈)。該熔爐具有一附有多條2英吋長連接道的節能陶瓷纖維絕緣包裝。該等熱偶係被放置在每一個溫度區的中央。每一個溫度區中均會提供一十英尺長的電力纜線,用以幫助連接至電源。一熔爐會被設計成用於水平或垂直操作並且具有下面規格: A solid tubular furnace in a single temperature zone or a dual temperature zone is capable of operating in air at temperatures up to 1200 °C. The furnace utilizes a 12V heating element from the Mellen standard series (exposed Fe-Cr-Al coils in a specially designed bracket). The furnace has an energy-saving ceramic fiber insulation package with a plurality of 2 inch long connecting tracks. The thermocouples are placed in the center of each temperature zone. A ten-foot power cable is provided in each temperature zone to help connect to the power source. A furnace will be designed for horizontal or vertical operation and has the following specifications:

Mellen系列PS205電源供應器/溫度控制器 Mellen Series PS205 Power Supply / Temperature Controller

一個(1)Mellen型號PS205-208-(2)25-S,兩個溫度區,數位溫度控制器及固態繼電器。Mellen系列PS205係由下面所組成: One (1) Mellen model PS205-208-(2)25-S, two temperature zones, digital temperature controller and solid state relay. The Mellen series PS205 consists of the following:

a)針對以126個分節及31個程式為特點的「S」型熱偶校正過的兩個(2)數位溫度控制器。 a) Two (2) digital temperature controllers corrected for "S" type thermocouples featuring 126 sections and 31 programs.

b)一個(1)固態繼電器。 b) One (1) solid state relay.

c)一個(1)通用電氣或等效電路斷路器,雙極,其具有合宜的大小及合宜的額定安培數。 c) One (1) General Electric or Equivalent Circuit Breaker, Bipolar, which has a suitable size and a suitable rated amperage.

d)一個(1)Mellen外殼,用以容納上面器件。 d) A (1) Mellen housing to accommodate the above components.

e)兩個(2)「S」型熱偶,每一個溫度區包含10個已補償的熱偶延長線、終端電路板等。 e) Two (2) "S" type thermocouples, each of which contains 10 compensated thermocouple extensions, terminal boards, etc.

f)用以製作一完整可工作系統的所有必要電線、終端電路板、互連線等。 f) All necessary wires, terminal boards, interconnects, etc. used to make a complete workable system.

電源供應器/溫度控制器的過溫保護Over temperature protection of power supply / temperature controller

一個(1)過溫(O.T.)警示器,其會運用一獨立的數位指示數位設定點「高限警示」控制器。該O.T.警示封裝配有一合宜的熱偶,TIC延長線,以及足夠的(數個)機械式電力接觸器,用以在該過溫感測器的位置處發生過溫情形時中斷送往熔爐的電力。該O.T.警示選配件會被安置在主溫度控制機殼之中。 A (1) over temperature (O.T.) alerter that uses a separate digit to indicate the digital setpoint "high limit alert" controller. The OT warning package is equipped with a suitable thermocouple, TIC extension cable, and enough (several) mechanical power contactors to interrupt the delivery to the furnace when an overtemperature condition occurs at the location of the overtemperature sensor. electric power. The O.T. warning option will be placed in the main temperature control enclosure.

曲頸瓶型號:RTA-2.5x32-OBE Stem bottle model: RTA-2.5x32-OBE

上面所述的熔爐會用到一個(1)Mellen型號RTA-2.5-32-OBE,圓形,高純度鋁(實際的系統則具有石英曲頸瓶)的曲頸瓶。該曲頸瓶工作直徑約為2.5英吋內徑乘32英吋。該曲頸瓶的外徑約為2.75英吋,而長度為48英吋,並且含有可達到氣密操作的必要不銹鋼凸緣/密封裝配件以及隔熱屏蔽。於該曲頸瓶的遮蓋板中會提供饋通線用以供氣體內送/外送以及進行溫度測量。該曲頸瓶能夠配合不同類型的大氣來操作。 The furnace described above will use a (1) Mellen model RTA-2.5-32-OBE, a round, high-purity aluminum (the actual system has a quartz retort). The retort has a working diameter of approximately 2.5 inches and an inner diameter of 32 inches. The retort has an outer diameter of approximately 2.75 inches and a length of 48 inches and contains the necessary stainless steel flange/seal fittings for airtight operation and thermal barriers. A feedthrough line is provided in the cover of the curved bottle for gas in/out and temperature measurement. The retort can be operated with different types of atmospheres.

實施例3:利用聚對二甲苯化合物與氮化硼塗覆物件的方法與裝置 Example 3: Method and apparatus for coating articles using polyparaxylene compounds and boron nitride

本具體實例使用C型聚對二甲苯化合物。 This specific example uses a C-type parylene compound.

塗覆製程Coating process

該裝置係由兩個區段所組成:(1)一熔爐/加熱區段;以及(2)一真空區段。該熔爐區段係由兩個熔爐所構成,該等兩個熔爐會藉由稱為曲頸瓶的玻璃管相連。該等熔爐區段與真空區段會藉由閥門相連,該等閥 門允許在該等熔爐區段與真空區段之間進行氣體流動。 The device consists of two sections: (1) a furnace/heating section; and (2) a vacuum section. The furnace section is composed of two furnaces which are connected by a glass tube called a retort. The furnace sections and the vacuum section are connected by valves, the valves The door allows gas flow between the furnace sections and the vacuum section.

Mellen Furnace Co.(位於美國新罕不什爾州協和市)已經製造出該設備的熔爐部分。Laco Technologies Inc.(位於美國猶他州鹽湖城)則已經製造出真空部分。 Mellen Furnace Co. (Concord, New Hampshire, USA) has manufactured the furnace section of the equipment. Laco Technologies Inc. (Salt Lake City, Utah, USA) has created a vacuum section.

利用聚對二甲苯化合物與氮化硼來塗覆物品的製程如下: The process for coating articles using polyparaxylene compounds and boron nitride is as follows:

(1)第一熔爐室。數量足以塗覆該物品之二聚物形式(雙分子形式)的C型聚對二甲苯化合物會被置放在該熔爐室之中。該等物品被塗覆的厚度範圍會從0.01至3.0mm。該C型聚對二甲苯化合物會被置放在一不銹鋼「舟形器皿」(由金屬或玻璃製成的標準容器)之中,其會經由該管體的真空固定開口被插入該熔爐之中(該舟形器皿會藉由一桿體被推入該熔爐之中)。於置入該C型聚對二甲苯化合物之後,該開口便會被密封。接著,該熔爐便會被加熱至150至200℃,用以創造會讓該固態該C型聚對二甲苯化合物變成氣體的環境。在兩個閥門張開之前,該氣體都會被保留在該第一熔爐室之中。兩個閥門中的第一個閥門於該真空區段中的冷阱充滿液態氮(LN2)且該等冷阱為「冰冷(cold)」之前並不會張開。LN2係向當地的供應商購得。LN2於供應商處係被置放在一加侖容器之中。LN2會從該容器中被灌入該「冷阱」之中。第二閥門為可變的並且會在氣體因真空而從該第一熔爐處被抽出時張開。 (1) First furnace chamber. A C-type parylene compound in an amount sufficient to coat the dimeric form (bimolar form) of the article is placed in the furnace chamber. The articles are coated to a thickness ranging from 0.01 to 3.0 mm. The C-type parylene compound is placed in a stainless steel "boat" (standard container made of metal or glass) which is inserted into the furnace through the vacuum fixed opening of the tube ( The boat will be pushed into the furnace by a rod. After the C-type parylene compound is placed, the opening is sealed. Next, the furnace is heated to 150 to 200 ° C to create an environment that will cause the solid C-type parylene compound to become a gas. The gas is retained in the first furnace chamber before the two valves are opened. The first of the two valves does not open until the cold trap in the vacuum section is filled with liquid nitrogen (LN2) and the cold traps are "cold". LN2 is purchased from local suppliers. LN2 is placed in a one gallon container at the supplier. LN2 will be poured into the "cold trap" from the container. The second valve is variable and opens when the gas is withdrawn from the first furnace due to vacuum.

(2)第二熔爐室。C型聚對二甲苯化合物氣體會移至該第二熔爐,其溫度為650至700℃。此熔爐中的熱量會讓該C型聚對二甲苯化合物氣體分離成個別的分子(單體)。該單體形式的氣體接著便會因真空而被送入沉積室之中。 (2) The second furnace chamber. The C-type parylene compound gas is moved to the second furnace at a temperature of 650 to 700 °C. The heat in the furnace separates the C-type parylene compound gas into individual molecules (monomers). The monomeric form of the gas is then fed into the deposition chamber by vacuum.

粉末形式的氮化硼會被置放在一KF16管體中,該管體會被連接至一具有一「T」KF16埠口的KF連接管。此K1716管體會部分充滿氮化硼粉末(最小為500粒號)的「電荷」。該KF16管體會被遮蓋。於該塗 覆製程啟動之後,硼便會被注入該塗覆「流」之中。該硼會以粉末的形式流動並且會隨著該塗覆製程的沉積作用而被陷捕。 The boron nitride in powder form is placed in a KF16 tube that is connected to a KF connecting tube having a "T" KF16 port. This K1716 tube is partially filled with the "charge" of boron nitride powder (minimum 500 particles). The KF16 body will be covered. For the coating After the coating process is initiated, boron is injected into the coating "flow". The boron will flow in the form of a powder and will be trapped as the coating process is deposited.

該K1716管體在其正要進入該沉積室之前會被附接至垂直於該單體氣體之流動的曲頸瓶。會有一個張開的閥門可讓氮化硼流入該氣體之中。該氣體會摻配該單體並且會被沉積在要被塗覆的物品之上。此製程和粉末塗覆雷同。該製程可以反覆進行用以提高被置入該等物品上之塗覆層中的氮化硼的數量。雖然並不限制氮化硼/聚對二甲苯化合物塗覆層的特徵;不過,本案發明人認為氮化硼會改良塗覆層的硬度並且提供更好的方法讓熱量離開該被塗覆的物件,例如電子元件。氮化硼會以粉塵的形式被置入該聚對二甲苯化合物之中。 The K1716 body will be attached to the retort perpendicular to the flow of the monomer gas before it is about to enter the deposition chamber. There will be an open valve that allows boron nitride to flow into the gas. The gas will blend with the monomer and will be deposited on the item to be coated. This process is similar to powder coating. The process can be repeated to increase the amount of boron nitride in the coating applied to the article. Although not limiting the characteristics of the boron nitride/parylene compound coating layer; however, the inventors believe that boron nitride will improve the hardness of the coating layer and provide a better way to allow heat to leave the coated article. , for example, electronic components. Boron nitride is placed in the form of dust into the parylene compound.

(3)真空室。該機器的真空部分係由一具有兩個真空唧筒的沉積室所組成。第一真空唧筒係一「粗略」唧筒,其會抽成初始真空。該初始真空係在1x10-3陶爾範圍中。接著,第二階段唧筒便會抽成位於1x10-4陶爾範圍中的最終真空。該等真空唧筒會受到液態氮冷阱的保護,液態氮冷阱會藉由冷凝冷阱表面上的氣體來保護該等唧筒避免因單體氣體的固化而受損。 (3) Vacuum chamber. The vacuum section of the machine consists of a deposition chamber with two vacuum cylinders. The first vacuum cylinder is a "rough" cartridge that is drawn into an initial vacuum. The initial vacuum is in the range of 1 x 10-3 Torr. The second stage cylinder is then pumped to a final vacuum in the 1x10-4 Torr range. The vacuum cylinders are protected by a liquid nitrogen cold trap that protects the cylinders from condensation of the monomer gas by condensing the gas on the surface of the cold trap.

要被塗覆的物品會在開始進行塗覆製程之前被置放在該沉積室中的棚架上。該等要被塗覆的元件中不要被塗覆的元件之上與裡面的區域會被遮罩(利用熟知的方法)。在必須保持電性或機械性連接功能的區域中便會進行該遮罩作業。材料會在室溫處(華氏75度)被塗覆在該物品上。 The item to be coated is placed on the scaffolding in the deposition chamber before the coating process begins. The areas above and inside the elements to be coated that are to be coated are masked (using well-known methods). This masking operation is performed in an area where electrical or mechanical connection must be maintained. The material will be applied to the article at room temperature (75 degrees Fahrenheit).

在該真空室內部會有一充滿矽烷偶聯劑® A-174矽烷的坩堝,該矽烷會被灌入一陶瓷坩堝之中。該坩堝會被插入該真空室中一加熱板上的一2英吋熱偶之中。被灌入的矽烷偶聯劑® A-174矽烷的數量會相依於該室中物品的數量,舉例來說,會介於10至100ml之間。該平板會將該矽烷偶聯劑® A-174矽烷加熱至蒸發點,俾使其會塗覆該室內部的整個區 域,其包含該室裡面的任何物件。 Inside the vacuum chamber there is a helium filled with decane coupling agent® A-174 decane which is poured into a ceramic crucible. The crucible is inserted into a 2 inch thermocouple on a hot plate in the vacuum chamber. The amount of decane coupling agent® A-174 decane that is poured will depend on the amount of the item in the chamber, for example between 10 and 100 ml. The plate will heat the decane coupling agent® A-174 decane to the evaporation point, which will coat the entire area of the chamber. A domain that contains any objects in the room.

該單體氣體會因該真空室中較低的真空而被抽出。當該氣體被送入該室時,其會改變方向俾使其會噴灑在該室的整個區域內。該等物品會於該單體氣體冷卻時被塗覆。該氣體會從600℃冷卻至25℃並且會凝固在該室內的元件上。於該冷卻過程期間,該等單體會沉積在該要被塗覆的物品的表面上,從而產生一均勻且無針孔的聚合物三維串鏈。該沉積設備會控制塗覆速率及最終厚度。聚對二甲苯化合物塗覆層的必要厚度係取決於曝露於該單體氣體的時間。該厚度的範圍可能係從數百埃至數毫米。 The monomer gas is withdrawn due to the lower vacuum in the vacuum chamber. When the gas is fed into the chamber, it changes direction so that it will spray over the entire area of the chamber. The items are applied as the monomer gas cools. The gas will cool from 600 ° C to 25 ° C and will solidify on the components in the chamber. During the cooling process, the monomers are deposited on the surface of the article to be coated, resulting in a uniform and pinhole-free polymer three-dimensional chain. The deposition apparatus controls the coating rate and final thickness. The necessary thickness of the parylene compound coating layer depends on the time of exposure to the monomer gas. This thickness may range from hundreds of angstroms to several millimeters.

雖然本文已經說明本發明的數個觀點與具體實例;不過,應該明白的係,熟習本技術的人士便可對該些具體實例進行各種修正、變更、以及改變,其會達到本發明的某些或全部優點。舉例來說,於本文所揭示之本發明的某些具體實例中,單一器件可以多個器件來置換,多個器件可以單一器件來置換,用以實施一給定的功能或多項功能。除了無法對本發明之實際具體實例進行此替換的情況,此替換亦涵蓋在本發明的範疇內。所以,本文所揭示的具體實例希望包含所有此等修正、變更、以及改變,其並不會脫離隨附申請專利範圍所界定之本發明的範疇與精神。本發明每一項觀點及具體實例的較佳特點經過合宜修正便係其它觀點及具體實例的較佳特點。 While the invention has been described with respect to the embodiments of the present invention, it will be understood by those skilled in the art Or all advantages. For example, in some embodiments of the invention disclosed herein, a single device may be replaced by multiple devices, and multiple devices may be replaced by a single device for performing a given function or functions. This alternative is also intended to be encompassed within the scope of the present invention, except that this alternative is not made to the actual embodiments of the invention. Therefore, the specific examples disclosed herein are intended to embrace all such modifications, changes, and modifications, and the scope and spirit of the invention as defined by the appended claims. The preferred features of each of the aspects and specific examples of the present invention are susceptible to modification and other features.

應該進一步瞭解的係,本發明的圖式與說明已經過簡化用以解釋相關的元件以便清楚瞭解本發明;同時,為達清楚的目的,已經省略其它元件,舉例來說,習知保形塗覆方法或裝置的器件。舉例來說,一特定的保形塗覆系統可能還包含本文未說明的額外器件,例如,沉積室、閥門、真空唧筒。不過,熟習本技術的人士便會瞭解,典型的保形塗覆系統中可能需要用到該些與其它元件。但是,因為此等元件係本技術中非常熟知的且因為它們無助於更瞭解本發明,因此,本文並未討論此等元件。 The drawings and description of the present invention have been simplified to explain the related elements in order to clearly understand the present invention; at the same time, other elements have been omitted for clarity, for example, conventional conformal coating methods Or device device. For example, a particular conformal coating system may also include additional components not described herein, such as deposition chambers, valves, vacuum cylinders. However, those skilled in the art will appreciate that such and other components may be required in a typical conformal coating system. However, because such elements are well known in the art and because they do not help to better understand the present invention, such elements are not discussed herein.

另外,在本文隨附的申請專利範圍中,凡以用來實施一指定功能的構件來表示的任何元件會希望涵蓋實施該項功能的任何方式,舉例來說,實施該項功能之元件的組合。再者,在以「構件加功能(means plus function)」描述的申請專利項所定義的發明中,由該等各種所述構件提供的功能實際上會被組合並且以隨附申請專利範圍所定義的方式被結合在一起。所以,能夠提供此等功能的任何構件均可被視為等同於本文所示之構件。 In addition, any element that is represented by a component used to implement a specified function is intended to cover any means of performing the function, for example, a combination of components that perform the function. . Furthermore, in the invention defined by the patent application described in the "means plus function", the functions provided by the various described components are actually combined and defined by the scope of the attached patent application. The way is combined. Therefore, any component capable of providing such functionality can be considered equivalent to the components shown herein.

除非另外表示,否則應該瞭解的係,為達本說明書之目的而在本說明書中使用之用以表示構成要素之數量、時間、溫度、塗覆層厚度、及其它特性或參數的所有數字均會以用詞「約」來修飾。據此,除非另外表示,否則應該瞭解的係,在前面說明書及隨附申請專利範圍中所提出的數值參數皆為概略值。至少,且不具有將等效主要內容的應用範圍限制在申請專利範圍之範疇的任何意義,應該依照本文提出的重要數字的數值並應用常見的捨入技術來理解數值參數。 Unless otherwise indicated, all numbers that are used in this specification to indicate the quantity, time, temperature, coating thickness, and other characteristics or parameters used for the purposes of this specification will be It is decorated with the word "about". Accordingly, unless otherwise indicated, the numerical parameters set forth in the foregoing specification and the appended claims are intended to At the very least, and without any limitation of the scope of application of the equivalents of the subject matter of the invention, the numerical parameters should be understood in accordance with the numerical values of the important figures presented herein and the common rounding techniques.

除此之外,如上面的討論,雖然用以提出本發明之廣泛範疇的數值範圍與參數皆為概略值;不過,在實施例段落中則儘可能精確地描述所提出的數值。然而,應該瞭解的係,此等數值本質上就含有因測量設備及/或測量技術所造成的特定誤差。 In addition, as the above discussion, although the numerical ranges and parameters are set forth in the broad scope of the invention, the numerical values are set forth as much as possible. However, it should be understood that such values inherently contain specific errors due to measurement equipment and/or measurement techniques.

本文所併入之被視為以引用方式完整或部分併入的任何專利案、公開案、或其它揭示內容僅及於被併入的內容不違背本發明中所提出的既有定義、敘述、或是其它揭示內容。就此來說,且在某種必要的程度上,本文明確提出的揭示內容會取代本文以引用方式併入的任何違背內容。被視為本文以引用方式併入但卻違背本文中所提出之既有定義、敘述、或是其它揭示內容的任何材料,或是其一部分,本文僅以引用的方式將不會在被併入之材料和既有揭示材料之間造成違背的部分併入。 Any patents, publications, or other disclosures that are hereby incorporated by reference in their entirety, in their entirety, in their entirety, inso Or other disclosures. In this regard, and to the extent necessary, the disclosure explicitly set forth herein supersedes any content that is incorporated herein by reference. Any material that is incorporated herein by reference but that is contrary to the present definition, narrative, or other disclosures set forth herein, or a part thereof, is not incorporated herein by reference. The incorporation of the material and the existing disclosure material creates a violation.

1‧‧‧汽化室 1‧‧‧vaporization room

2‧‧‧器件 2‧‧‧Device

3‧‧‧熱解室 3‧‧‧ Pyrolysis Room

4‧‧‧閥門 4‧‧‧ Valve

5‧‧‧器件 5‧‧‧Device

6‧‧‧沉積室 6‧‧‧Deposition room

7‧‧‧要被塗覆的物件 7‧‧‧Items to be coated

8‧‧‧器件/連接器 8‧‧‧Devices/Connectors

9‧‧‧真空構件 9‧‧‧Vacuum components

10‧‧‧溫度區 10‧‧‧ Temperature zone

11‧‧‧溫度區 11‧‧‧ Temperature zone

12‧‧‧溫度區 12‧‧‧ Temperature zone

13‧‧‧溫度區 13‧‧‧temperature zone

14‧‧‧真空室/系統 14‧‧‧vacuum room/system

15‧‧‧汽化室 15‧‧‧vaporization room

16‧‧‧器件 16‧‧‧Devices

17‧‧‧熱解室 17‧‧‧ Pyrolysis Room

18‧‧‧閥門 18‧‧‧ Valve

19‧‧‧器件 19‧‧‧Device

20‧‧‧T埠口 20‧‧‧T埠口

21‧‧‧沉積室 21‧‧‧Deposition room

22‧‧‧要被塗覆的物件 22‧‧‧ Items to be coated

23‧‧‧器件 23‧‧‧Device

24‧‧‧真空構件 24‧‧‧Vacuum components

25‧‧‧真空室/系統 25‧‧‧vacuum room/system

Claims (56)

一種塗覆組成物,其包括一保形塗覆化合物與一導熱材料。 A coating composition comprising a conformal coating compound and a thermally conductive material. 如申請專利範圍第1項之塗覆組成物,其中,該保形塗覆化合物為聚對二甲苯化合物,其係視情況地選擇自由下面所組成的群之中:D型聚對二甲苯化合物、C型聚對二甲苯化合物、N型聚對二甲苯化合物以及HT型聚對二甲苯化合物®。 The coating composition of claim 1, wherein the conformal coating compound is a parylene compound, which is optionally selected from the group consisting of: a D-type parylene compound , a C-type poly-p-xylene compound, an N-type poly-p-xylene compound, and an HT-type parylene compound®. 如申請專利範圍第2項之塗覆組成物,其包括二或多種不同的聚對二甲苯化合物。 A coating composition according to claim 2, which comprises two or more different parylene compounds. 如申請專利範圍第2或3項之塗覆組成物,其包括不同純度的二或多種聚對二甲苯化合物。 A coating composition according to claim 2 or 3, which comprises two or more parylene compounds of different purities. 如申請專利範圍第1至3項中任一項之塗覆組成物,其中該導熱材料為陶瓷。 The coating composition of any one of claims 1 to 3, wherein the thermally conductive material is a ceramic. 如申請專利範圍第1至3項中任一項之塗覆組成物,其中該導熱材料係選擇自由下面所組成的群之中:氮化鋁、氧化鋁以及氮化硼。 The coating composition of any one of claims 1 to 3, wherein the thermally conductive material is selected from the group consisting of aluminum nitride, aluminum oxide, and boron nitride. 如申請專利範圍第1至3項中任一項之塗覆組成物,其中該導熱材料的體阻係數大於1010歐姆*公分。 The coating composition according to any one of claims 1 to 3, wherein the heat conductive material has a body resistance coefficient greater than 10 10 ohms * cm. 如申請專利範圍第1至3項中任一項之塗覆組成物,其中該導熱材料的質量高達該保形塗覆化合物及該導熱材料之總質量的約3%。 The coating composition of any one of claims 1 to 3, wherein the thermally conductive material has a mass of up to about 3% of the total mass of the conformal coating compound and the thermally conductive material. 如申請專利範圍第1至3項中任一項之塗覆組成物,其中該導熱材料的質量高達該保形塗覆化合物及該導熱材料之總質量的約1%。 The coating composition of any one of claims 1 to 3, wherein the thermally conductive material has a mass of up to about 1% of the total mass of the conformal coating compound and the thermally conductive material. 如申請專利範圍第2或3項之塗覆組成物,其導熱係數比單獨聚對二甲苯化合物的導熱係數高出5至10%。 The coating composition of claim 2 or 3 has a thermal conductivity higher than that of the individual parylene compound by 5 to 10%. 如申請專利範圍第1至3項中任一項之塗覆組成物,其硬度為約R80至約R95。 The coating composition according to any one of claims 1 to 3, which has a hardness of from about R80 to about R95. 如申請專利範圍第1至3項中任一項之塗覆組成物,其中該導熱材料會被散佈在該保形塗覆化合物的聚合物之中。 The coating composition of any one of claims 1 to 3, wherein the thermally conductive material is dispersed in the polymer of the conformal coating compound. 如申請專利範圍第1至3項中任一項之塗覆組成物,其中該塗覆組成物為氣態混合物,其包括氣相的保形塗覆化合物單體。 The coating composition according to any one of claims 1 to 3, wherein the coating composition is a gaseous mixture comprising a conformal coating compound monomer in a gas phase. 如申請專利範圍第13項之塗覆組成物,其中,該氣態混合物包括該導熱材料的固態粒子。 The coating composition of claim 13, wherein the gaseous mixture comprises solid particles of the thermally conductive material. 一種位於一物件之表面的至少一部分上的保形塗覆層,其包括如申請專利範圍第1至14項中任一項之塗覆組成物。 A conformal coating layer on at least a portion of a surface of an article comprising a coating composition according to any one of claims 1 to 14. 如申請專利範圍第15項之保形塗覆層,其中,該物件係一電子元件,該電子元件係視情況地由下面之中所選出:通訊元件、揚聲器、行動電話、音頻播放器、照相機、視頻播放器、遙控元件、全球定位系統、電腦器件、雷達顯示器、深度探測器、魚群探測器、緊急指位無線電信標(EPIRB)、緊急定位訊號發射器(ELT)以及個人定位信標(PLB)。 The conformal coating of claim 15 wherein the object is an electronic component selected from the group consisting of: a communication component, a speaker, a mobile phone, an audio player, a camera , video players, remote control components, global positioning systems, computer devices, radar displays, depth detectors, fish detectors, emergency finger radio beacons (EPIRB), emergency positioning signal transmitters (ELTs), and personal positioning beacons ( PLB). 如申請專利範圍第15項之保形塗覆層,其中,該物件係選擇自由下面所組成的群之中:紙材產品、紡織產品、藝術品、電路板、海洋探測元件、空間探測元件、有害廢 棄物運送元件、自動車元件、電機元件、軍用系統器件、彈藥、槍枝、武器、醫療儀器以及生醫元件,其中,該生醫元件係視情況地選擇自由下面所組成的群之中:助聽器、耳蝸植入器以及義肢。 The conformal coating layer of claim 15 wherein the object is selected from the group consisting of: paper products, textile products, artwork, circuit boards, marine detecting elements, space detecting elements, Harmful waste A waste transporting component, an automatic vehicle component, a motor component, a military system component, an ammunition, a firearm, a weapon, a medical instrument, and a biomedical component, wherein the biomedical component is optionally selected from the group consisting of: a hearing aid , cochlear implants and prosthetic limbs. 如申請專利範圍第15至17項中任一項之保形塗覆層,其中,該表面為塑膠、金屬、木材、紙材或是紡織原料。 The conformal coating of any one of claims 15 to 17, wherein the surface is a plastic, metal, wood, paper or textile material. 如申請專利範圍第15至17項中任一項之保形塗覆層,其中該表面係該物件的一外表面。 The conformal coating of any one of clauses 15 to 17, wherein the surface is an outer surface of the article. 如申請專利範圍第18項之保形塗覆層,其中該表面係該物件的一外表面。 The conformal coating of claim 18, wherein the surface is an outer surface of the article. 一種在一表面的至少一部分上包括保形塗覆層之物件,其中該保形塗覆層係由申請專利範圍第1至14項中任一項之塗覆組成物所組成。 An article comprising a conformal coating layer on at least a portion of a surface, wherein the conformal coating layer is comprised of the coating composition of any one of claims 1 to 14. 如申請專利範圍第21項之物件,其中該物件係一電子元件,該電子元件係視情況地由下面之中所選出:通訊元件、揚聲器、行動電話、音頻播放器、照相機、視頻播放器、遙控元件、全球定位系統、電腦器件、雷達顯示器、深度探測器、魚群探測器、緊急指位無線電信標(EPIRB)、緊急定位訊號發射器(ELT)以及個人定位信標(PLB)。 An object as claimed in claim 21, wherein the object is an electronic component, the electronic component being selected from the following: a communication component, a speaker, a mobile phone, an audio player, a camera, a video player, Remote control components, global positioning systems, computer devices, radar displays, depth detectors, fish detectors, emergency finger radio beacons (EPIRB), emergency location signal transmitters (ELTs), and personal positioning beacons (PLBs). 如申請專利範圍第21項之物件,其中,該物件係選擇自由下面所組成的群之中:紙材產品、紡織產品、藝術品、電路板、海洋探測元件、空間探測元件、有害廢棄物運送元件、自動車元件、電機元件、軍用系統器件、彈藥、槍枝、武器、醫療儀器以及生醫元件,其中,該生醫元件 係視情況地選擇自由下面所組成的群之中:助聽器、耳蝸植入器以及義肢。 For example, the object of claim 21, wherein the object is selected from the group consisting of: paper products, textile products, art, circuit boards, marine detecting elements, space detecting elements, hazardous waste transportation Components, automatic vehicle components, motor components, military system components, ammunition, guns, weapons, medical instruments, and biomedical components, wherein the biomedical components Choose from the group consisting of the following: Hearing aids, cochlear implants, and prostheses. 如申請專利範圍第21至23項中任一項之物件,其中,該表面為塑膠、金屬、木材、紙材或是紡織原料。 The article of any one of claims 21 to 23, wherein the surface is plastic, metal, wood, paper or textile material. 如申請專利範圍第21至23項中任一項之物件,其中該表面係一外表面。 The article of any one of claims 21 to 23, wherein the surface is an outer surface. 如申請專利範圍第24項之物件,其中該表面係一外表面。 An article of claim 24, wherein the surface is an outer surface. 如申請專利範圍第21至23項中任一項之物件,其中該表面實質上會被該保形塗覆層覆蓋。 The article of any one of claims 21 to 23, wherein the surface is substantially covered by the conformal coating layer. 如申請專利範圍第24項之物件,其中該表面實質上會被該保形塗覆層覆蓋。 An article of claim 24, wherein the surface is substantially covered by the conformal coating. 如申請專利範圍第25項之物件,其中該表面實質上會被該保形塗覆層覆蓋。 The article of claim 25, wherein the surface is substantially covered by the conformal coating. 如申請專利範圍第26項之物件,其中該表面實質上會被該保形塗覆層覆蓋。 The article of claim 26, wherein the surface is substantially covered by the conformal coating. 一種用以將保形塗覆物塗敷至一物件的方法,其包括:A)加熱一保形塗覆化合物,用以形成該保形塗覆化合物的氣態單體;B)結合一導熱材料與該等氣態單體,從而形成一氣態混合物;以及C)於包括該保形塗覆化合物及該導熱材料的保形塗覆物會被形成在一物件的一表面的至少一部分上的條件下讓該物件接觸該氣態混合物,從而塗敷一保形塗覆物至該 物件。 A method for applying a conformal coating to an article comprising: A) heating a conformal coating compound to form a gaseous monomer of the conformal coating compound; B) incorporating a thermally conductive material And the gaseous monomer to form a gaseous mixture; and C) the conformal coating comprising the conformal coating compound and the thermally conductive material is formed on at least a portion of a surface of the article Contacting the article with the gaseous mixture to apply a conformal coating to the object. 如申請專利範圍第31項之方法,其中,該保形塗覆化合物係視情況選擇自由下面所組成的群之中的聚對二甲苯化合物:D型聚對二甲苯化合物、C型聚對二甲苯化合物、N型聚對二甲苯化合物以及HT型聚對二甲苯化合物®。 The method of claim 31, wherein the conformal coating compound is selected from the group consisting of polyparaxylene compounds in the group consisting of: D-type poly-p-xylene compound, C-type poly-pair Toluene compound, N-type poly-p-xylene compound, and HT-type parylene compound®. 如申請專利範圍第31或32項之方法,其中,該導熱材料為陶瓷。 The method of claim 31, wherein the thermally conductive material is ceramic. 如申請專利範圍第31或32項之方法,其中,該導熱材料係選擇自由下面所組成的群之中:氮化鋁、氧化鋁以及氮化硼。 The method of claim 31, wherein the thermally conductive material is selected from the group consisting of aluminum nitride, aluminum oxide, and boron nitride. 如申請專利範圍第31或32項之方法,其中,該導熱材料為固態粒子形式。 The method of claim 31, wherein the thermally conductive material is in the form of solid particles. 如申請專利範圍第35項之方法,其中,該等固態粒子為約1.8微米至約2.5微米。 The method of claim 35, wherein the solid particles are from about 1.8 microns to about 2.5 microns. 如申請專利範圍第31或32項之方法,其進一步包括於矽烷會活化該物件之表面的條件下,於步驟C之前先讓該物件接觸氣態矽烷。 The method of claim 31, wherein the method further comprises contacting the article with gaseous decane prior to step C, under conditions in which the decane activates the surface of the article. 如申請專利範圍第37項之方法,其中,該矽烷係選擇自由下面所組成的群之中的一或多種矽烷:矽烷偶聯劑(Silquest)® A-174,矽烷偶聯劑® 111,以及矽烷偶聯劑® A-174(NT)。 The method of claim 37, wherein the decane is selected from the group consisting of one or more of decane: a silane coupling agent (Silquest)® A-174, a decane coupling agent® 111, and Hydrane coupling agent® A-174 (NT). 如申請專利範圍第31或32項之方法,其中,該物件於步驟C期間係處於約5℃至約30℃的溫度。 The method of claim 31, wherein the article is at a temperature of from about 5 ° C to about 30 ° C during step C. 如申請專利範圍第31或32項之方法,其中,該保形塗覆層為約100埃至約3.0毫米。 The method of claim 31, wherein the conformal coating layer is from about 100 angstroms to about 3.0 millimeters. 如申請專利範圍第31或32項之方法,其中,該保形塗覆層之厚度為約0.0025mm至約0.050mm。 The method of claim 31, wherein the conformal coating layer has a thickness of from about 0.0025 mm to about 0.050 mm. 如申請專利範圍第31或32項之方法,其中,該物件係一電子元件,該電子元件係視情況地由下面之中所選出:通訊元件、揚聲器、行動電話、音頻播放器、照相機、視頻播放器、遙控元件、全球定位系統、電腦器件、雷達顯示器、深度探測器、魚群探測器、緊急指位無線電信標(EPIRB)、緊急定位訊號發射器(ELT)以及個人定位信標(PLB)。 The method of claim 31, wherein the object is an electronic component selected from the group consisting of: a communication component, a speaker, a mobile phone, an audio player, a camera, a video. Players, remote control components, global positioning systems, computer devices, radar displays, depth detectors, fish detectors, emergency finger radio beacons (EPIRB), emergency positioning signal transmitters (ELT), and personal positioning beacons (PLB) . 如申請專利範圍第31或32項之方法,其中,該物件係選擇自由下面所組成的群之中:紙材產品、紡織產品、藝術品、電路板、海洋探測元件、空間探測元件、有害廢棄物運送元件、自動車元件、電機元件、軍用系統器件、彈藥、槍枝、武器、醫療儀器以及生醫元件,其中,該生醫元件係視情況地選擇自由下面所組成的群之中:助聽器、耳蝸植入器以及義肢。 The method of claim 31, wherein the object is selected from the group consisting of: paper products, textile products, artwork, circuit boards, marine detecting elements, space detecting elements, hazardous waste. Object transport components, automatic vehicle components, motor components, military system components, ammunition, firearms, weapons, medical instruments, and biomedical components, wherein the biomedical components are optionally selected from the group consisting of: hearing aids, Cochlear implants and prostheses. 如申請專利範圍第31或32項之方法,其中,該表面為塑膠、金屬、木材、紙材或是紡織原料。 The method of claim 31, wherein the surface is plastic, metal, wood, paper or textile material. 一種物件,其具有藉由根據申請專利範圍第31至44項中任一項之方法而塗敷至表面之至少一部分上之塗覆層。 An article having a coating applied to at least a portion of a surface by a method according to any one of claims 31 to 44 of the patent application. 如申請專利範圍第45項之物件,其中該表面係一外表面。 An article of claim 45, wherein the surface is an outer surface. 一種用以將保形塗覆物塗敷至物件的裝置,其包括:一汽化室,其包括至少兩個溫度區; 一熱解室,其係在操作上連結至該汽化室;以及一真空室,其係在操作上連結至該熱解室。 An apparatus for applying a conformal coating to an article, comprising: a vaporization chamber comprising at least two temperature zones; a pyrolysis chamber operatively coupled to the vaporization chamber; and a vacuum chamber operatively coupled to the pyrolysis chamber. 如申請專利範圍第47項之裝置,其進一步包括一連接器,其在操作上會連結該熱解室與該真空室,其中該連接器能夠在該熱解室與該真空室之間傳送氣體,且其中該連接器包括一T埠口。 The device of claim 47, further comprising a connector operatively coupled to the pyrolysis chamber and the vacuum chamber, wherein the connector is capable of transporting gas between the pyrolysis chamber and the vacuum chamber And wherein the connector comprises a T port. 如申請專利範圍第47或48項之裝置,其中該T埠口在操作上會連結一注射構件,用以將一導熱材料注入一經由該連接器從該熱解室被傳送至該真空室的氣體之中。 The device of claim 47, wherein the T-port is operatively coupled to an injection member for injecting a thermally conductive material from the pyrolysis chamber to the vacuum chamber via the connector. Among the gases. 如申請專利範圍第47或48項之裝置,其中該真空室包括一沉積室,其在操作上可連結至該熱解室與一真空產生器件。 The apparatus of claim 47 or 48, wherein the vacuum chamber includes a deposition chamber operatively coupled to the pyrolysis chamber and a vacuum generating device. 如申請專利範圍第50項之裝置,其中該真空產生器件包括一或多個真空唧筒。 The device of claim 50, wherein the vacuum generating device comprises one or more vacuum cylinders. 如申請專利範圍第47或48項之裝置,其中該汽化室具有兩個溫度區。 The apparatus of claim 47 or 48, wherein the vaporization chamber has two temperature zones. 如申請專利範圍第47或48項之裝置,其中該汽化室係一管狀熔爐。 The apparatus of claim 47 or 48, wherein the vaporization chamber is a tubular furnace. 如申請專利範圍第47或48項之裝置,其中該熱解室具有複數個溫度區。 The apparatus of claim 47 or 48, wherein the pyrolysis chamber has a plurality of temperature zones. 如申請專利範圍第47或48項之裝置,其中該熱解室具有兩個溫度區。 A device according to claim 47 or 48, wherein the pyrolysis chamber has two temperature zones. 如申請專利範圍第47或48項之裝置,其中該熱解室係一管狀熔爐。 A device according to claim 47 or 48, wherein the pyrolysis chamber is a tubular furnace.
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