TW201425354A - Negative photosensitive resin composition - Google Patents

Abstract

To provide a negative photosensitive resin composition which can form a thick film even if the composition is in the form of a solution having a low viscosity, and which is free from tack before exposure, is capable of forming a high-resolution pattern by alkali development, and provides a coating film that has high transparency and undergoes small shrinkage after post-bake. A photosensitive resin composition which contains the components (A), (B), (C), (D) and (E) described below; a cured film which is obtained using the resin composition; a interlayer insulating film for liquid crystal displays, which is formed of the cured film; and an optical filter which is formed of the cured film. Component (A): a copolymer which is obtained by copolymerizing a monomer mixture that contains at least (i) N-alkoxymethyl (meth)acrylamide and (ii) a monomer having an alkali-soluble group Component (B): a compound having two or more polymerizable groups Component (C): a photopolymerization initiator Component (D): a polymer having a hydroxy group Component (E): a solvent.

Description

Negative photosensitive resin composition

The present invention relates to a negative photosensitive resin composition and a cured film obtained therefrom. More specifically, the present invention relates to a photosensitive resin composition, a cured film, and various materials using the cured film.

It is known that an epoxy cationic polymerization-based UV-curable resin containing an epoxy compound and a photoacid generator has high transparency, and a photosensitive resin composition containing the resin has high sensitivity to exposure, and thick film photolithography It is possible to thicken the photosensitive resin composition layer obtained by applying the photosensitive resin composition (for example, Patent Document 1). However, after coating, the coating film before the exposure is sticky, so the handleability is poor. Further, since it cannot be developed by an aqueous alkali solution, it needs to be developed with an organic solvent. Alkali development is considered to be feasible by introducing a carboxyl group into the polymer, but in the copolymerization of a monomer having an epoxy group and a monomer having a carboxyl group, a reaction between an epoxy group and a carboxyl group is easily generated in the polymerization, and it is difficult to control the polymer. Synthesis. Further, even if the reaction and the synthetic polymer can be controlled, the storage stability is low.

As a substance which can be used for alkali development, a polymer having an acrylonitrile group, a radical polymerization system containing a polyfunctional propylene group monomer and a photoradical initiator is known (for example, Patent Document 2). In such an invention, when the amount of exposure at the time of pattern formation is such that the unreacted acrylonitrile group is sufficiently reliable to be reacted during post-baking, a high temperature of 200 ° C or higher is required, and the substrate which can be used is limited.

On the other hand, although the resolution of the positive-type material is high, the coating film obtained by the positive-type material is usually exposed and developed, and the solvent resistance is insufficient, and it is difficult to form a thick film and the transparency is low (for example, Patent Literature) 3).

From the viewpoints of such a viewpoint, it is desired to have high transparency and alkali-developability, and to have high workability when the coating film is thick, and to have small shrinkage during post-baking, thick film formation of the cured film, and low-temperature post-baking. As a viable material. Moreover, when a thermal radical generator is added to a conventional system, it is expected that the storage stability is lowered and development failure occurs when the pattern is formed.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] International Publication WO2008/007764

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2004-302389

[Patent Document 3] Japanese Patent Laid-Open No. Hei 8-339082

The present invention has been made in view of the above, and it is possible to provide a thick film of a coating film even in a low-viscosity solution, and the obtained coating film is not sticky before exposure, and can be formed by high-resolution development by alkali development. The pattern has excellent sensitivity, high transparency, and small shrinkage after post-baking. Thick film formation of the cured film is feasible, and even after baking at a low temperature, the cured film has high solvent resistance and is excellent. A negative photosensitive resin composition of the reliability, the cured film, and an interlayer insulating film and a filter for a display formed of the cured film.

The inventors of the present invention have made efforts to solve the above problems and have completed the present invention.

That is, the first aspect is a photosensitive resin composition characterized by containing the following components (A), (B), (C), (D), and (E) a solvent, and (A): a copolymer comprising at least (i) a copolymer mixture of (i) an N-alkoxymethyl (meth) acrylamide and (ii) a monomer having an alkali-soluble group, and a component (B) having two or more The polymerizable group compound, the component (C): a photopolymerization initiator, and the component (D): a polymer having a hydroxyl group; and (E) a solvent.

The photosensitive resin composition according to the first aspect of the invention, wherein the photosensitive resin composition further contains 0.1 to 10 parts by mass of the thermal acid generator as the (F) based on 100 parts by mass of the component (A). ingredient.

The photosensitive resin composition according to the first aspect, wherein the (A) component (ii) having an alkali-soluble group is maleimide.

The photosensitive resin composition according to the first or third aspect, wherein the component (A) is a copolymer of a monomer mixture further containing a monomer having a hydroxyl group.

The photosensitive resin composition according to any one of the first to fourth aspects, further comprising a crosslinking agent as the component (G).

The sixth aspect is a cured film obtained by using the photosensitive resin composition according to any one of the first to fifth aspects.

The seventh aspect is an interlayer insulating film for a liquid crystal display, which is characterized in that it is formed of a cured film described in the sixth aspect.

The eighth aspect is an optical filter characterized by the cured film described in the sixth aspect.

According to the present invention, by copolymerizing N-alkoxymethyl(meth)acrylamide in an alkali-soluble resin, it is possible to obtain no solvent effect, and even after low-temperature baking, it has sufficient solvent resistance and Reliable hardened film. Therefore, the photosensitive resin composition of the present invention can be used for no The method is resistant to the formation of a cured film of a material having a high temperature of 200 ° C or higher. Moreover, since the photosensitive resin composition of the present invention has no stickiness before exposure, alkali development is possible, and even a thick film can form a coating film having high transparency, resolution, and patterning sensitivity, and Since the shrinkage is small, a thick film cured film can be formed, and therefore it is most suitable as a structure of an optical member.

Moreover, according to the present invention, an interlayer insulating film for a display and a filter made of the cured film can be provided.

[Best Mode for Carrying Out the Invention]

The photosensitive resin composition of the present invention is a photosensitive resin composition containing the following components (A), (B), (C), (D), and (E).

(A) component: a copolymer copolymerized with a monomer containing at least (i) N-alkoxymethyl (meth) acrylamide and (ii) a monomer having an alkali-soluble group, (B) Component: a compound having two or more polymerizable groups, (C) component: a photopolymerization initiator, (D) component: a polymer having a hydroxyl group, and (E) a solvent.

<(A) component>

The component (A) is a copolymer obtained by copolymerizing a plurality of monomers containing at least (i) N-alkoxymethyl (meth) acrylamide and (ii) a monomer having an alkali-soluble group.

In the present invention, the copolymer refers to a polymer obtained by copolymerizing a monomer having an unsaturated double bond such as acrylate, methacrylate, acrylamide, methacrylamide or styrene.

The copolymer of the component (A) may be a copolymer having such a structure, and the skeleton of the polymer main chain constituting the copolymer and the type of the side chain are not particularly limited.

However, when the copolymer of the component (A) has an excessively large number average molecular weight of more than 100,000, the developability of the unexposed portion is lowered. On the other hand, if the number average molecular weight is less than 2,000, the hardening of the exposed portion is insufficient. There are occasions when the components are dissolved during development. Therefore, the copolymer of the component (A) has a number average molecular weight of 2,000 or more in the range of 100,000.

(i) N-alkoxymethyl (meth) acrylamide:

The N-alkoxymethyl (meth) acrylamide used in the component (A) is represented by the structure of the formula (1). In the formula, R ¹ is a hydrogen atom, a halogen atom or an alkyl group having 1 to 6 carbon atoms. In the formula, R ² is a hydrogen atom or an alkyl group having 1 to 10 carbon atoms.

Specific examples of such monomers include, for example, N-(methoxymethyl). Acrylamide, N-(methoxymethyl)methacrylamide, N-(n-butoxymethyl)propenamide, N-(n-butoxymethyl)methacrylamide N-(isobutoxymethyl) acrylamide, N-(isobutoxymethyl)methacrylamide, and the like.

(ii) a monomer containing an alkali soluble group:

The monomer having an alkali-soluble group may, for example, be a monomer having a carboxyl group, a phenolic hydroxyl group, an acid anhydride group, or a maleidino group.

The monomer having a carboxyl group may, for example, be acrylic acid, methacrylic acid, crotonic acid, mono-(2-(acryloxy)ethyl)phthalate, or mono-(2-(methacryloxy)oxy group. Ethyl phthalate, N-(carboxyphenyl)maleimide, N-(carboxyphenyl)methacrylamide, N-(carboxyphenyl) acrylamide, 4 vinyl Benzoic acid, etc.

The monomer having a phenolic hydroxyl group may, for example, be hydroxystyrene, N-(hydroxyphenyl)acrylamide, N-(hydroxyphenyl)methacrylamide, N-(hydroxyphenyl)malaya. Amines, etc.

The monomer having an acid anhydride group may, for example, be anhydrous maleic acid, anhydrous itaconic acid or the like.

The monomer having a maleidino group may, for example, be maleimide.

Further, in the present invention, when a copolymer having a specific functional group (N-alkoxymethyl group and alkali-soluble group) is obtained, a monomer copolymerizable with a monomer having a specific functional group may be used in combination.

Specific examples of such monomers include, for example, an acrylate compound, a methacrylate compound, an N-substituted maleimide compound, and an acrylonitrile compound. A compound, an acrylamide compound, a methacrylamide compound, a styrene compound, a vinyl compound, and the like.

Specific examples of the above monomers are listed below, but are not limited thereto.

Examples of the acrylate compound include methacrylate, ethacrylate, isopropyl acrylate, benzyl acrylate, naphthyl acrylate, methacrylate, decyl methacrylate, and phenyl acrylate. , 2,2,2-trifluoroethyl acrylate, tert-butyl acrylate, cyclohexyl acrylate, isobornyl acrylate, 2-methoxyethyl acrylate, methoxy triethylene glycol acrylate Ester, 2-ethoxyethyl acrylate, tetrahydrofurfuryl acrylate, 3-methoxybutyl acrylate, 2-methyl-2-adamantyl acrylate, 2-propyl-2-gold Alkyl acrylate, 8-methyl-8-tricyclodecyl acrylate, 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, 4-hydroxybutyl acrylate, 2,3-dihydroxypropyl Acrylate, diethylene glycol monoacrylate, caprolactone 2-(acryloxy)ethyl ester, poly(ethylene glycol) ethyl ether acrylate, 5-propenyloxy-6-hydroxyl Norbornene-2-carboxylic acid-6-lactone, acryloylethyl isocyanate, and 8-ethyl-8-tricyclodecyl acrylate, epoxypropyl acrylate, and the like.

Examples of the methacrylate compound include methyl methacrylate, ethyl methacrylate, isopropyl methacrylate, benzyl methacrylate, naphthyl methacrylate, and mercaptomethyl. Acrylate, mercaptomethyl methacrylate, phenyl methacrylate, 2,2,2-trifluoroethyl methacrylate, tert-butyl methacrylate, cyclohexyl methacrylate, isobornyl Methyl methacrylate, 2-methoxyethyl methacrylate, methoxy triethylene glycol methacrylate, 2-ethoxy B Methyl methacrylate, tetrahydrofurfuryl methacrylate, 3-methoxybutyl methacrylate, 2-methyl-2-adamantyl methacrylate, γ-butyrolactone methacrylate, 2-propyl-2-adamantyl methacrylate, 8-methyl-8-tricyclodecyl methacrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl methacrylate , 4-hydroxybutyl methacrylate, 2,3-dihydroxypropyl methacrylate, diethylene glycol monomethacrylate, caprolactone 2-(methacryloxy)ethyl ester, poly (ethylene glycol) ethyl ether methacrylate, 5-methylpropenyloxy-6-hydroxynorbornene-2-carboxylic acid-6-lactone, methacryloylethyl isocyanate, and 8-ethyl-8-tricyclodecyl methacrylate epoxypropyl methacrylate or the like.

Examples of the vinyl compound include methyl vinyl ether, benzyl vinyl ether, vinyl naphthalene, vinyl anthracene, vinyl biphenyl, vinyl carbazole, 2-hydroxyethyl vinyl ether, and phenylethylene. Alkyl ether, and propyl vinyl ether, and the like.

Examples of the styrene compound include styrene, methyl styrene, chlorostyrene, and bromostyrene.

Examples of the N-substituted maleimide compound include N-methylmaleimide, N-phenylmaleimide, and N-cyclohexylmaleimide.

The acrylonitrile compound may, for example, be acrylonitrile or the like.

Further, in the component (A), among the copolymerizable monomers, a copolymer obtained by copolymerizing a monomer having a hydroxyl group is preferable in that the thermosetting property is improved and the reliability of the cured film is improved. Examples of the monomer having a hydroxyl group include 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, and 2-hydroxyl. Propyl acrylate, 2-hydroxypropyl methacrylate, 4-hydroxybutyl acrylate, 4-hydroxybutyl methacrylate, 2,3-dihydroxypropyl acrylate, 2,3-dihydroxypropyl A methacrylate and a 5-propenyloxy-6-hydroxynorbornene-2-carboxylic acid-6-lactone.

The method for obtaining a copolymer having a specific functional group used in the present invention is not particularly limited, and may be, for example, a monomer having a specific functional group, a monomer having a non-reactive functional group copolymerizable therewith, and a desired A polymerization reaction agent such as a polymerization initiator is obtained by performing a polymerization reaction at a temperature of 50 to 110 ° C. In this case, a solvent which can be used is a monomer which occupies a specific functional group, and an acrylic copolymer which has a specific functional group, and is not particularly limited. Specific examples thereof include a solvent described in the solvent (E) described later.

The acrylic copolymer having a specific functional group thus obtained is usually in a solution state dissolved in a solvent.

Further, the solution of the copolymer obtained in the above manner is poured into diethyl ether or water under stirring to reprecipitate, and the resulting precipitate is filtered. After washing, it can be formed into a powder of a copolymer by drying at normal temperature or under reduced pressure at normal temperature or under reduced pressure. By this operation, a polymerization initiator or an unreacted monomer which coexists with the copolymer can be removed, and as a result, a powder of the purified copolymer can be obtained. In the case where the primary operation cannot be sufficiently purified, the obtained powder may be redissolved in a solvent, and it is preferred to repeat the above operation.

In the present invention, the polymerization solution of the acrylic copolymer may be used as it is, or the powder may be redissolved in a solvent solution such as the solvent (E) described later.

Further, in the present invention, the copolymer of the component (A) may be a mixture of a plurality of specific copolymers (the aforementioned copolymer having a specific functional group).

The copolymerization ratio of the monomer is preferably N-alkoxymethyl (meth) acrylate / alkali-soluble monomer / other = 10 or even 60/10 or even 40 / 0 or even 80 parts by mass. When the amount of the alkali-soluble monomer is too small, the unexposed portion is insoluble in the developer and tends to be a residual film or residue. In the case of too many cases, there is a possibility that the hardenability of the exposed portion is insufficient and the pattern cannot be formed. When the N-alkoxymethyl (meth) acrylate is too small, there is a possibility that the photocurability is insufficient and the exposed portion is dissolved at the time of development. In the case of too many cases, there is a possibility that the solubility of the unexposed portion is insufficient to cause a residual film or residue.

<(B) component>

The component (B) is a compound having two or more polymerizable groups. The term "compound having two or more polymerizable groups" as used herein means a compound having two or more polymerizable groups in one molecule, and the polymerizable group at the terminal of the molecule, and the polymerizable group of these groups means an acrylate group. At least one type of polymerizable group selected from the group consisting of a methacrylate group, a vinyl group, and an allyl group. The compound having two or more polymerizable groups of the component (B) has a good compatibility with each component in the solution of the negative photosensitive resin composition of the present invention, and does not affect the developability, and has a molecular weight ( When the compound is a polymer, the weight average molecular weight is preferably 1,000 or less.

Specific examples of such a compound include dipentaerythritol Hexaacrylate, dipentaerythritol hexamethacrylate, dipentaerythritol pentaacrylate, dipentaerythritol pentamethacrylate, pentaerythritol tetraacrylate, pentaerythritol tetramethacrylate, pentaerythritol triacrylate, pentaerythritol trimethacrylate, Pentaerythritol diacrylate, pentaerythritol dimethacrylate, tetramethylolpropane tetraacrylate, tetramethylolpropane tetramethacrylate, tetramethylol methane tetraacrylate, tetramethylol methane tetramethacrylate Ester, trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, 1,3,5-tripropenyl hexahydro-S-triazine, 1,3,5-trimethyl propylene Mercaptohexahydro-S-triazine, tris(hydroxyethylpropenyl)isocyanurate, tris(hydroxyethylmethacryloyl)isocyanurate, tripropylenesulfonyl formal, three Methyl propylene decyl formal, 1,6-hexane diol acrylate, 1,6-hexanediol methacrylate, neopentyl glycol diacrylate, neopentyl glycol dimethacrylate Ester, ethanediol diacrylate, ethanediol dimethyl propylene Acid ester, 2-hydroxypropanediol diacrylate, 2-hydroxypropanediol dimethacrylate, diethylene glycol diacrylate, diethylene glycol dimethacrylate, isopropyl glycol diacrylate, different Propylene glycol dimethacrylate, triethylene glycol diacrylate, triethylene glycol dimethacrylate, N, N'-bis(propylene decyl) cysteine, N, N'-bis (methyl Propylene oxime) cysteine, thiodiethylene glycol diacrylate, thiodiethylene glycol dimethacrylate, bisphenol A diacrylate, bisphenol A dimethacrylate, bisphenol F Diacrylate, bisphenol F dimethacrylate, bisphenol S diacrylate, bisphenol S dimethacrylate, bisphenoxyethanol hydrazine diacrylate, bisphenoxyethanol hydrazine dimethacrylate , Diallyl ether bisphenol A, o-diallyl bisphenol A, diallyl maleate, triallyl trimellitic acid, and the like.

The above polyfunctional acrylate compound can be easily obtained as a commercial product, and specific examples thereof include KYARAD T-1420, DPHA, DPHA-2C, D-310, D-330, DPCA-20, and DPCA. -30, with DPCA-60, with DPCA-120, with DN-0075, with DN-2475, with R-526, with NPGDA, with PEG400DA, with MANDA, with R-167, with HX-220, with HX620, Same as R-551, same R-712, same R-604, same R-684, same GPO-303, same TMPTA, same as THE-330, same TPA-320, same TPA-330, same PET-30, same RP -1040 (above, Nippon Chemical Co., Ltd.), Aronix M-210, M-240, M-6200, M-309, M-400, M-402, M-405, same M-450, the same M-7100, the same M-8030, the same M-8060, the same M-1310, the same M-1600, the same M-1960, the same M-8100, the same M-8530, the same M-8560, the same M-9050 (above, East Asia Synthetic (stock) system), VISCOAT 295, same 300, 360, GPT, 3PA, 400, 260, 312, 335HP (above, Osaka Organic Chemical Industry Co., Ltd.) System, A-9300, A-GLY-9E, A-GLY-20E, A-TMM-3, A-TMM-3L, A-TMM-3LM-N, A-TMPT, AD-TMP, ATM-35E , A-TMMT, A-9550, A-DPH, TMPT, 9PG, 701, 1206PE NPG, NOD-N, HD-N, DOD-N, DCP, BPE-1300N, BPE-900, BPE-200, BPE-100, BPE-80N, 23G, 14G, 9G, 4G, 3G, 2G, 1G ( Above, Xinzhongcun Chemical Industry Co., Ltd.).

These compounds having two or more polymerizable groups may be used singly or in combination of two or more kinds.

The content of the component (B) in the negative photosensitive resin composition of the present invention is preferably 5 to 100 parts by mass, more preferably 10 to 80 parts by mass, per 100 parts by mass of the component (A). Good for 20~70 parts by mass. When the ratio is too small, the exposed portion may be insufficiently hardened to form a pattern, and even if it is formed, it may become a film having low reliability. Moreover, when the ratio is too large, the coating film after prebaking may be sticky, and the unexposed portion may be poorly dissolved during development.

<(C) component>

The component (C) is a photopolymerization initiator. The photopolymerization initiator is a person which generates a radical by exposure, and is not particularly limited. Specific examples include benzophenone, Michler's ketone, 4,4'-bisdiethylaminobenzophenone, and 4-methoxy-4'-dimethylaminobenzophenone. Aromatic ketones such as 2-ethyl fluorene, phenanthrene, benzoin methyl ether, benzoin ethyl ether, benzoin phenyl ether, benzoin, methyl benzoin, ethyl benzoin, etc., 2-(o- Chlorophenyl)-4,5-phenylimidazole 2mer, 2-(o-chlorophenyl)-4,5-di(m-methoxyphenyl)imidazole 2 polymer, 2-(o- Fluorophenyl)-4,5-diphenylimidazole 2mer, 2-(o-methoxyphenyl)-4,5-diphenylimidazolium 2mer, 2,4,5-triarylimidazole 2-mer, 2-(o-chlorophenyl)-4,5-di(m-methylphenyl)imidazole 2 polymer, 2-benzyl-2-dimethylamino-1-(4- Morpholinylphenyl)-butanone, 2-trichloromethyl-5-styryl-1,3,4-oxadiazole, 2-trichloromethyl-5-(p-cyanostyryl )-1,3,4-oxadiazole, 2-trichloro Halogenated methyl oxadiazole compound of methyl-5-(p-methoxystyryl)-1,3,4-oxadiazole, 2,4-bis(trichloromethyl)-6- p-methoxystyryl-S-triazine, 2,4-bis(trichloromethyl)-6-(1-p-dimethylaminophenyl-1,3-butadiene)- S-triazine, 2-trichloromethyl-4-amino-6-p-methoxystyryl-S-triazine, 2-(naphtho-1-yl)-4,6-bis- Trichloromethyl-S-triazine, 2-(4-ethoxy-naphtho-1-yl)-4,6-bis-trichloromethyl-S-triazine, 2-(4-butoxy a halogenated methyl-S-triazine compound such as benzyl-naphtho-1-yl)-4,6-bis-trichloromethyl-S-triazine, 2,2-dimethoxy-1, 2-diphenylethane-1-one, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinylacetone, 1,2-benzyl-2-dimethyl Amino-1-(4-morpholinylphenyl)-butanone-1,1-hydroxy-cyclohexyl-phenyl ketone, benzyl, benzamidine benzoic acid, benzamidine benzoic acid methyl ester, 4-benzylidene-4'-methyldiphenyl sulfide, benzyl methyl ketal, dimethylamino benzoate, p-dimethylamino benzoic acid isoamyl ester, 2-n -butoxyethyl-4-dimethylaminobenzoate, 2-chlorothioxanthone, 2,4-diethylthioxanthone, 2,4-dimethylthioxanthone, isopropylthioxanthone, 1-(4-phenylthiophenyl)-1,2-octanedione-2-(O-benzene Methyl hydrazine, ethyl ketone, 1-[9-ethyl-6-(2-methylbenzhydrazide)-9H-carbazol-3-yl]-1-(O-ethylindenyl), 4 -benzimidyl-methyldiphenyl sulfide, 1-hydroxy-cyclohexyl-phenyl ketone, 2-benzyl-2-(dimethylamino)-1-[4-(4-morpholinyl) Phenyl]-1-butanone, 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl] 1-butanone, α-dimethoxy-α-phenylethyl benzene, phenylbis(2,4,6-trimethylbenzhydrazide)phosphine oxide, diphenyl (2,4,6 -trimethylbenzhydrazide)phosphine oxide, 2-methyl-1-[4-(methylthio)phenyl]-2-(4-morpholinyl)-1-propene Ketones, etc.

The above photopolymerization initiator can be easily obtained as a commercial product, and specific examples thereof include IRGACURE 173, IRGACURE 500, IRGACURE 2959, IRGACURE 754, IRGACURE 907, IRGACURE 369, IRGACURE 1300, IRGACURE 819, IRGACURE 819DW, IRGACURE 1880, and IRGACURE. 1870, DAROCURE TPO, DAROCURE 4265, IRGACURE 784, IRGACURE OXE01, IRGACURE OXE02, IRGACURE 250 (above, BASF), KAYACURE DETX-S, KAYACURE CTX, KAYACURE BMS, KAYACURE 2-EAQ (above, Japanese Chemicals) )), TAZ-101, TAZ-102, TAZ-103, TAZ-104, TAZ-106, TAZ-107, TAZ-108, TAZ-110, TAZ-113, TAZ-114, TAZ-118, TAZ- 122, TAZ-123, TAZ-140, TAZ-204 (the above green chemical (stock) system) and the like.

These photopolymerization initiators may be used singly or in combination of two or more kinds.

The content of the component (C) in the negative photosensitive resin composition of the present invention is preferably 0.1 to 30 parts by mass, more preferably 0.5 to 20 parts by mass, based on 100 parts by mass of the component (A). Good is 1~15 parts by mass. When the ratio is too small, the exposed portion may be insufficiently hardened to form a pattern, and even if it is formed, it may be a film having low reliability. Moreover, when the ratio is too large, there is a case where the transmittance of the coating film is lowered and development failure of the unexposed portion occurs.

<(D) component>

The component (D) is a polymer having a hydroxyl group. As the polymer having a hydroxyl group, for example, a polymer obtained by polymerizing a monomer having a hydroxyl group, a polymer obtained by copolymerizing a cellulose, a hydroxypropylcellulose, a diepoxy compound and a dicarboxylic acid, a diepoxide compound and two A polymer obtained by copolymerizing a phenol, a polyester polyol, a polyether polyol, a polycaprolactone polyol, or the like, but preferably a polymer obtained by polymerizing a monomer having a hydroxyl group or hydroxypropylcellulose.

The polymer which polymerizes the monomer which has a hydroxyl group mentioned above, for example, the copolymerizable monomer which is mentioned in the above-mentioned (A) component, and the polymerization|polymerization of the monomer which has a hydroxyl group, or the copolymerizable monomer separately. Things.

Among the copolymerizable monomers exemplified in the component (A), a monomer having a hydroxyl group may, for example, be 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate or 2-hydroxypropyl acrylate. 2-hydroxypropyl methacrylate, 4-hydroxybutyl acrylate, 4-hydroxybutyl methacrylate, 2,3-dihydroxypropyl acrylate, 2,3-dihydroxypropyl methacrylate 5-propenyloxy-6-hydroxynorbornene-2-carboxylic acid-6-lactone.

The monomer copolymerizable with the monomer having a hydroxyl group may, for example, be a monomer copolymerizable with a monomer having the component (A) and copolymerizable with a monomer having a specific functional group.

These polymers having a hydroxyl group may be used singly or in combination of two or more kinds.

In the negative photosensitive resin composition of the present invention, the content of the polymer of the component (D) which polymerizes the monomer having a hydroxyl group is preferably from 5 to 100 parts by mass based on 100 parts by mass of the copolymer of the component (A). More preferably, it is 10 to 80 parts by mass. When the ratio is too small, there is insufficient hardenability and cannot When solvent resistance is obtained. When the ratio is too large, there is a case where the developability of the unexposed portion is lowered and the residual film or residue is caused.

<(E) Solvent>

The dissolving power is dissolved in order to dissolve the component (A), the component (B), the component (C), and the component (D) used in the present invention, and the component (G) and the component (G) to be added which are added as desired. The type and structure of the solvent are not particularly limited.

Examples of the (E) solvent include ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, methyl cellulose acetate, ethyl cellulose acetate, diethylene glycol monomethyl ether, and diethylene glycol. Alcohol monoethyl ether, propylene glycol, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, propylene glycol propyl ether acetate, toluene, xylene, methyl ethyl ketone, cyclopentanone, cyclohexanone, 2-butanone, 3-methyl-2-pentanone, 2-pentanone, 2-heptanone, γ-butyrolactone, ethyl 2-hydroxypropionate, 2-hydroxy-2-methylpropionic acid Ethyl ester, ethyl ethoxyacetate, ethyl hydroxyacetate, methyl 2-hydroxy-3-methylbutanoate, methyl 3-methoxypropionate, 3-methoxypropane Acid ethyl ester, ethyl 3-ethoxypropionate, methyl 3-ethoxypropionate, methyl pyruvate, ethyl pyruvate, ethyl acetate, butyl acetate, lactic acid Ethyl ester, butyl lactate, N,N-dimethylformamide, N,N-dimethylacetamide, and N-methylpyrrolidone.

These solvents may be used alone or in combination of two or more.

Among these (E) solvents, propylene glycol monomethyl ether, diethylene glycol The alcohol monomethyl ether, propylene glycol monomethyl ether acetate, ethyl lactate, butyl lactate or the like is preferably from the viewpoint of good coating properties and high safety. These solvents are generally used as a solvent for a photoresist material.

<(F) component>

The component (F) is a thermal acid generator. By forming a pattern using the coating film formed of the negative photosensitive resin composition of the present invention, it is thermally cured by post-baking to obtain a highly reliable film, but the acid generated by the thermal acid generator becomes a touch. The medium can make the hardening speed up. That is, the compound which does not undergo thermal decomposition at a prebaking temperature of 80 ° C to 120 ° C and which generates an acid at 120 ° C or higher is not particularly limited. Specific examples of the thermal acid generator include methanesulfonic acid, ethanesulfonic acid, propanesulfonic acid, butanesulfonic acid, pentanesulfonic acid, octanesulfonic acid, benzenesulfonic acid, and p-toluenesulfonic acid. , camphorsulfonic acid, trifluoromethanesulfonic acid, p-phenolsulfonic acid, 2-naphthalenesulfonic acid, trimethylsulfonic acid, p-xylene-2-sulfonic acid, m-xylene-2-sulfonic acid, 4- Ethylbenzenesulfonic acid, 1H, 1H, 2H, 2H-perfluorooctane sulfonic acid, perfluoro(2-ethoxyethane)sulfonic acid, pentafluoroethanesulfonic acid, nonafluorobutane-1-sulfonate a salt of a pyridinium salt of a sulfonic acid such as an acid or dodecylbenzenesulfonic acid, a morpholine salt, a triethylamine salt, a trimethylamine salt or the like, a bis(toluenesulfonyloxy)ethane, and a bis (toluene) Sulfhydryloxy)propane, bis(toluenesulfonyloxy)butane, p-nitrobenzyl p-toluenesulfonate, o-nitrobenzyl p-toluenesulfonate, 1,2,3- Phenyl tris(methylsulfonate), ethyl p-toluenesulfonate, propyl p-toluenesulfonate, butyl p-toluenesulfonate, isobutyl p-toluenesulfonate, p -toluenesulfonic acid methyl ester, p-toluenesulfonic acid phenethyl ester, cyanomethyl p-toluenesulfonate, 2,2,2-trifluoroethyl p-toluenesulfonate, 2-hydroxybutyrate P-toluene Ester, N- ethyl -p- toluenesulfonamide Amides, Wait.

The content of the component (F) in the cured film formation composition of the present embodiment is preferably from 0.01 part by mass to 20 parts by mass, more preferably from 0.1 part by mass to 10 parts by mass, based on 100 parts by mass of the component (A). It is 0.5 parts by mass to 8 parts by mass. When the content of the component (F) is 0.01 parts by mass or more, sufficient thermosetting property and solvent resistance can be imparted. However, when the amount is more than 20 parts by mass, the unexposed portion may be poorly developed, and the storage stability of the composition may be lowered.

<(G) component>

The crosslinking agent which is the component (G) of the present invention may be a crosslinking agent which can be reacted with the component (A) or the component (D) by an acid generated by the component (F). The crosslinking agent may, for example, be a compound such as an epoxy compound or a methylol compound, but is preferably a methylol compound.

Specific examples of the above methylol compound include, for example, alkoxymethylated glycoluril, alkoxymethylated benzoguanamine, and alkoxymethylation. A compound such as melamine.

Specific examples of the alkoxymethylated glycoluril include, for example, 1,3,4,6-tetrakis(methoxymethyl)glycolil, and 1,3,4,6-tetra(butoxymethyl). Glycoluril, 1,3,4,6-tetrakis(hydroxymethyl)glycolil, 1,3-bis(hydroxymethyl)urea, 1,1,3,3-tetrakis(butoxymethyl)urea, 1,1,3,3-tetrakis(methoxymethyl)urea, 1,3-bis(hydroxymethyl)-4,5-dihydroxy-2-tetrahydroimidazolidone, and 1,3-double ( Methoxymethyl)-4,5-dimethoxy-2-tetrahydroimidazolidone and the like. For example, a compound such as a glycoluril compound (trade name: Cymel (registered trademark) 1170, Powderlink (registered trademark) 1174) manufactured by Mitsui Cytec Co., Ltd., and a methylated urea resin (trade name: UFR (registered) Trademark) 65), butylated urea resin (trade name: UFR (registered trademark) 300, U-VAN10S60, U-VAN10R, U-VAN11HV), urea/formaldehyde resin manufactured by Dainippon Ink Chemical Industry Co., Ltd. Condensation type, trade name: BECKAMINE (registered trademark) J-300S, same as P-955, same N).

Specific examples of the alkoxymethylated benzoguanamine include, for example, tetramethoxymethylbenzoguanamine. For the commercial product, for example, Mitsui Cytec Co., Ltd. (trade name: Cymel (registered trademark) 1123), (share), and chemical system (trade name: NIKALAC (registered trademark) BX-4000, same as BX-37, Same as BL-60, same as BX-55H).

Specific examples of the alkoxymethylated melamine include hexamethoxymethyl melamine and the like. Commercially available products include, for example, a methoxymethyl form melamine compound manufactured by Mitsui Cytec Co., Ltd. (trade name: Cymel (registered trademark) 300, same as 301, same as 303, same as 350), and Oxymethyl form melamine compound (trade name: shangke (registered trademark) 506, same as 508), bis-chemical methoxymethyl form melamine compound (trade name: NIKALAC (registered trademark) MW-30, same MW-22, same MW-11, same MS-001, same MX-002, same MX-730, same MX-750, same MX-035), butoxymethyl form melamine compound (trade name: NIKALAC (login Trademarks) MX-45, same as MX-410, with MX-302).

Further, it may be a compound obtained by condensing a melamine compound, a urea compound, a glycoluril compound, and a benzoguanamine compound in which a hydrogen atom of an amine group is substituted with a methylol group or an alkoxymethyl group. For example, a high molecular weight compound produced from a melamine compound and a benzoguanamine compound described in U.S. Patent No. 6,323,310. For the commercially available product of the melamine compound, for example, Cymel (registered trademark) 303 (manufactured by Mitsui Cytec Co., Ltd.), and the like, and a commercially available product of the benzoguanamine compound, for example, a product name: Cymel (registered) Trademark) 1123 (Mitsui Cytec (stock) system) and so on.

These crosslinking agents may be used alone or in combination of two or more.

The content of the crosslinking agent of the component (G) in the negative photosensitive resin composition of the present invention is preferably 100 parts by mass or less, more preferably 80 parts by mass or less based on 100 parts by mass of the copolymer of the component (A). . When the ratio is too large, there is a case where the developability of the unexposed portion is lowered to cause a residual film or residue.

<Other additives>

Further, the negative photosensitive resin composition of the present invention may contain a surfactant, a rheology modifier, a pigment, a dye, a storage stabilizer, an antifoaming agent, or the like, if necessary, without damaging the effects of the present invention. A dissolution promoter such as a polyhydric phenol or a polyvalent carboxylic acid.

<negative photosensitive resin composition>

The negative photosensitive resin composition of the present invention is a polymer having (A) component, a compound having two or more polymerizable groups as the component (B), a photopolymerization initiator (C) component, and (D) component. The polymer having a hydroxyl group is dissolved in the solvent (E), and may further contain one or more of the thermal acid generator according to the desired component (F), the crosslinking agent of the component (G), and other additives. .

Among them, preferred examples of the negative photosensitive resin composition of the present invention are as follows.

[1]: (B) component, 0.1 to 30 parts by mass of the component (C), and 5 to 100 parts by mass of the component (D), based on 100 parts by mass of the component (A), and A negative photosensitive resin composition in which the component is dissolved in the (E) solvent.

[2] The composition of the above [1], further comprising 0.01 to 20 parts by mass of the negative photosensitive resin composition of the component (F), based on 100 parts by mass of the component (A).

[3] The composition of the above [1] or [2], further containing 100 parts by mass or less of the negative photosensitive resin composition of the component (G), based on 100 parts by mass of the component (A).

The ratio of the solid content in the negative photosensitive resin composition of the present invention is not particularly limited, and is, for example, 1 to 80% by mass, for example 5 to 60% by mass, or 10 to 50 quality%. Here, the solid fraction refers to a solvent (E) solvent which is removed from the entire composition of the negative photosensitive resin composition.

The preparation method of the negative photosensitive resin composition of the present invention is not particularly limited, and the preparation method may be, for example, dissolving the component (A) (co) in (E) a solvent and mixing the solution in a specific ratio ( B) a component (a compound having two or more polymerizable groups), a component (C) (a photopolymerization initiator), and a component (D) (a polymer having a hydroxyl group), a method of forming a uniform solution, or the preparation In an appropriate stage of the method, a method of mixing (F) component (thermal acid generator), (G) component (crosslinking agent), and other additives may be added as necessary.

In the preparation of the negative photosensitive resin composition of the present invention, the solution of the specific copolymer obtained by the polymerization reaction in the solvent (E) can be used as it is. In this case, the solution of the component (A) is the same as described above. When a uniform solution is prepared by adding the component (B), the component (C), and the component (D), the solvent (E) may be further added for the purpose of concentration adjustment. At this time, the (E) solvent which can be used in the formation process of the specific copolymer and the concentration adjustment of the negative photosensitive resin composition can be used in the same or different (E) solvent.

The solution of the negative photosensitive resin composition prepared is preferably filtered using a filter having a pore diameter of about 0.2 μm or the like.

<Coating film and hardened film>

The negative photosensitive resin composition of the present invention is applied to a semiconductor substrate (for example, a ruthenium/yttrium oxide-coated substrate, a tantalum nitride substrate, a substrate coated with a metal such as aluminum, molybdenum or chromium, a glass substrate, a quartz substrate, an ITO substrate, or the like). Or a film substrate (for example, a triacetyl cellulose (TAC) film, a cycloolefin polymer film, a polyethylene terephthalate film, a propylene film, a resin film such as polyimide), or the like, Coating by spin coating, flow coating, roll coating, slit coating, spin coating after sewing, inkjet coating, or the like, followed by preliminary drying by a hot plate or an oven. A coating film is formed. Thereafter, the coating film is subjected to heat treatment to form a negative photosensitive resin film.

The conditions of the heat treatment include, for example, a heating temperature and a heating time which are suitably selected from a temperature of 70 ° C to 150 ° C and a time of 0.3 to 60 minutes. The heating temperature and heating time are preferably 80 ° C or even 120 ° C, 0.5 to 10 minutes.

Further, the film thickness of the negative photosensitive resin film formed of the negative photosensitive resin composition is, for example, 0.1 to 50 μm, for example, 0.5 to 30 μm, and further, for example, 1 to 25 μm.

The negative photosensitive resin film formed of the negative photosensitive resin composition of the present invention is exposed to light such as ultraviolet rays, ArF, KrF, or F ₂ laser light by using a mask having a specific pattern. The action of the radical generated by the photopolymerization initiator of the component (C) contained in the photosensitive resin film, and the exposed portion of the film becomes insoluble in the alkaline developer.

Thereafter, development was carried out using an alkaline developer. Take this negative The unexposed portion of the photosensitive resin film was removed to form a relief of the pattern.

The alkaline developing solution which can be used may, for example, be an aqueous solution of an alkali metal hydroxide such as potassium hydroxide or sodium hydroxide, or a fourth hydrogen hydroxide such as tetramethylammonium hydroxide, tetraethylammonium hydroxide or choline. An aqueous alkaline solution such as an aqueous solution of ammonium chloride, an aqueous amine solution such as ethanolamine, propylamine or ethylenediamine. Further, a surfactant or the like may be added to the developer.

The tetraethylammonium hydroxide 0.1 to 2.38 mass% aqueous solution is generally used as a photoresist developing solution, and the alkaline developer is used in the photosensitive resin composition of the present invention, so that problems such as swelling and the like are not caused. Developed well.

Further, as the developing method, a liquid holding method, a dipping method, a shaking dipping method, or the like can be used. The development time at this time is usually 15 or 180 seconds.

After the development, the negative photosensitive resin film is washed with running water, for example, 20 to 90 seconds, and then, by using compressed air or compressed nitrogen, or by air drying, the moisture on the substrate is removed, and formation is possible. There is a pattern of film.

Then, by forming a film on the pattern, post-baking is performed for thermal curing, and specifically, heating is performed by using a hot plate, an oven, or the like, whereby heat resistance, transparency, flatness, and low water absorption can be obtained. A film that is excellent in chemical resistance and has a good relief pattern.

As the post-baking, the heating temperature selected from the range of temperature 120 ° C or 250 ° C is generally used, and on the heating plate, 1 to 30 minutes, in the oven, for 1 to 90 minutes.

By this post-baking, a cured film having a good pattern shape for the purpose can be obtained.

As described above, the negative photosensitive resin composition of the present invention can be thickened (the coating film thickness becomes thicker when the same solid content is contained), and it is non-sticky and alkali-developable before exposure, and even if it is about 10 μm The film thickness is also sufficiently high-sensitivity and the film thickness of the exposed portion during development is extremely small, and a coating film having a fine pattern can be formed. Further, the cured film is excellent in transparency, heat resistance, solvent resistance, and the like, and has small shrinkage during post-baking, and can form a thick film. (In the present invention, the shrinkage means the longitudinal direction and the transverse direction. In addition, it includes dimensional shrinkage in the thickness direction). Therefore, it can be applied to various films such as an interlayer insulating film, a protective film, an insulating film, an optical film, and the like in a liquid crystal display, an organic EL display, a touch panel element, or the like.

[Examples]

The invention will be more specifically illustrated by the following examples, but the invention is not limited to the examples.

[Abbreviations used in the examples]

The meanings of the abbreviations used in the following examples are as follows.

MAA: Methacrylic acid

MI: Maleate

MMA: methyl methacrylate

BMAA: N-butoxymethyl acrylamide

HEMA: 2-hydroxyethyl methacrylate

ST: Styrene

AIBN: azobisisobutyronitrile

PRG1:1-(4-phenylthiophenyl)-1,2-octanedione-2-(O-benzamide)

PRG2: diphenyl (2,4,6-trimethylbenzhydrazide) phosphine oxide

HPC: hydroxypropyl cellulose

DPHA: dipentaerythritol penta/hexaacrylate

PETA: pentaerythritol triacrylate

PTSM: p-toluenesulfonic acid morpholine salt

PGME: propylene glycol monomethyl ether

PGMEA: propylene glycol monomethyl ether acetate

CYM: Cymel 303 (Mitsui Cytec Co., Ltd.)

[Determination of number average molecular weight and weight average molecular weight]

The number average molecular weight and the weight average molecular weight of the specific copolymer and the specific crosslinked product obtained by the following synthesis examples were determined by using a GPC apparatus (Shodex (registered trademark) column KF803L and KF804L) manufactured by JASCO Corporation. Tetrahydrofuran was flowed into the column at a flow rate of 1 ml/min (column temperature 40 ° C) to determine the conditions of the dissolution. Further, the following number average molecular weight (hereinafter referred to as Mn) and weight average molecular weight (hereinafter referred to as Mw) are expressed in terms of polystyrene.

<Synthesis Example 1>

MI (20.0 g), BMAA (34.6 g), and ST (22.3 g) were used as a monomer component constituting the copolymer, and AIBN (4 g) was used as a radical polymerization initiator, and the solvent was used in PGME. The polymerization reaction was carried out in (150 g) to obtain a copolymer solution (copolymer concentration: 35 mass%) of Mn 5,200 and Mw 12,000 (P1). Further, the polymerization temperature was adjusted to a temperature of 60 ° C or even 90 ° C.

<Synthesis Example 2>

As a monomer component constituting the copolymer, MAA (6.5 g), BMAA (16.3 g), and ST (9.8 g) were used, and as a radical polymerization initiator, AIBN (1.8 g) was used, and these were used in the solvent. Polymerization was carried out in PGME (64 g) to obtain a copolymer solution (copolymer concentration: 30% by mass) (P2) of Mn 6,000 and Mw 12,000. Further, the polymerization temperature was adjusted to a temperature of 60 ° C or even 90 ° C.

<Comparative Synthesis Example 1>

As a monomer component constituting the copolymer, MAA (20.0 g), HEMA (40.0 g), and MMA (40.0 g) were used as a radical polymerization initiator, and AIBN (5 g) was used, by making this in the solvent PGME. The polymerization reaction was carried out in (247 g) to obtain a copolymer solution (copolymer concentration: 30% by mass) (P3) of Mn 4,900 and Mw 8,700. Further, the polymerization temperature was adjusted to a temperature of 60 ° C or even 90 ° C.

<Examples 1 to 7 and Comparative Example 1 are 2>

According to the composition shown in the following Table 1, the components (B), (C), (D), and (E), and (F) and (() are mixed in a specific ratio in the solution of the component (A). The component G) was stirred at room temperature for 5 hours to prepare a uniform solution, and the negative photosensitive resin compositions of the respective examples and comparative examples were prepared.

With respect to the obtained negative photosensitive resin compositions of Examples 1 to 6 and Comparative Examples 1 and 2, the film thickness after curing, the presence or absence of viscosity, solvent resistance, and pattern sensitivity were measured.

[Evaluation of film thickness after pre-baking]

The negative photosensitive resin composition was applied by spin coating on a tantalum wafer, and then prebaked on a hot plate at a temperature of 110 ° C for 120 seconds to form a coating film. The film thickness of this coating film was measured using F20 by FILMETRICS. Further, evaluate the presence or absence of stickiness.

[Solvent tolerance (residual film rate) evaluation]

The negative photosensitive resin composition was applied onto a tantalum wafer by spin coating, and then prebaked on a hot plate at a temperature of 110 ° C for 120 seconds to form a coating film. The coating film was irradiated with ultraviolet light having a light intensity of 5.5 mW/cm ² at 365 nm for 33 seconds in a Canon ultraviolet irradiation apparatus PLA-600FA. Thereafter, the film was immersed in an aqueous solution of 2.38 mass% of tetramethylammonium hydroxide (hereinafter referred to as TMAH) for 60 seconds, and then post-baked in an oven at a temperature of 140 ° C for 5 minutes to form a cured film. The cured film was immersed in N-methylpyrrolidone (hereinafter referred to as NMP) for 3 minutes, and the residual film ratio of the film was measured.

[Evaluation of graphical sensitivity]

The negative photosensitive resin composition was applied by spin coating on an alkali-free glass, and then pre-baked on a hot plate at a temperature of 110 ° C for 120 seconds to form a coating film. The coating film was passed through a UV irradiation apparatus PLA-600FA manufactured by Canon Co., Ltd., and a UV light having a light intensity of 5.5 mW/cm ² at 365 nm was transmitted through a 20 μm line & interval pattern mask at 50 mJ/cm ^{2 .} Irradiation is performed. Thereafter, the film was immersed in a 2.38 mass% TMAH aqueous solution for 60 seconds, and after development, it was washed with ultrapure water for 20 seconds to form a pattern. The sensitivity is the lowest exposure amount that can form a pattern of 20 μm.

[evaluation result]

The results of the above evaluation are shown in Table 2 below.

As is clear from the results shown in Table 2, the negative photosensitive resin compositions of Examples 1 to 5 can be coated with a thick film of 15 μm or more and developed by alkali, and maintain high solvent resistance.

In Comparative Example 1, the coating film was not thickened and the residual film ratio after post-baking (after the solvent resistance test) was as low as 49% or less, and the cured film could not maintain the thickness of the coating film. Regarding Comparative Example 2, it was sticky after pre-baking and could not be patterned.

[Industrial use]

The negative-type photosensitive resin composition of the present invention can be used as a protective film, a planarizing film, an insulating film, or the like in various displays such as a thin film transistor (TFT) liquid crystal display device, an organic EL device, and a touch panel device. The material of the cured film is particularly suitable for forming an interlayer insulating film of a TFT-type liquid crystal element, a protective film of a color filter, an array planarizing film, an interlayer insulating film of a capacitive touch panel, an insulating film of an organic EL element, A material such as a structural sheet of the antireflection layer on the display surface.

Claims (8)

A photosensitive resin composition comprising the following components (A), (B), (C), (D), and (E) a solvent; (A) component: at least (i) N - a copolymer copolymerized with a monomer mixture of alkoxymethyl (meth) acrylamide and (ii) a monomer having an alkali-soluble group, and (B) component: a compound having two or more polymerizable groups, ( Component C: Photopolymerization initiator, (D) component: a polymer having a hydroxyl group, and (E) a solvent. The photosensitive resin composition according to claim 1, wherein the photosensitive resin composition further contains 0.1 to 10 parts by mass of the thermal acid generator as the component (F) per 100 parts by mass of the component (A). The photosensitive resin composition according to claim 1, wherein the (A) component (ii) having an alkali-soluble group is maleimide. The photosensitive resin composition according to claim 1 or 3, wherein the component (A) is a copolymer of a monomer mixture further containing a monomer having a hydroxyl group. The photosensitive resin composition according to any one of Claims 1 to 4, further comprising a crosslinking agent as the component (G). A cured film obtained by using the photosensitive resin composition according to any one of claims 1 to 5. An interlayer insulating film for a liquid crystal display, characterized by a request The cured film described in Item 6 was formed. A filter comprising the cured film described in claim 6.