TW201420247A - Laser processing method and its device - Google Patents

Laser processing method and its device Download PDF

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TW201420247A
TW201420247A TW101144905A TW101144905A TW201420247A TW 201420247 A TW201420247 A TW 201420247A TW 101144905 A TW101144905 A TW 101144905A TW 101144905 A TW101144905 A TW 101144905A TW 201420247 A TW201420247 A TW 201420247A
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Taiwan
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laser processing
laser
module
parameter
unit
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TW101144905A
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Chinese (zh)
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Chun-Pin Chang
Gwo-Juh Tzeng
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Proradiant Opto Co Ltd
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Abstract

The present invention is mainly to provide an optical plate laser processing method with simplified manufacturing process and high-volume productivity. The laser processing method and its device are used to perform processing on mold block, where the laser processing unit receives graphic files of the machining patterns, sets the orientation parameters according to the graphic file, and then the processing parameters are inputted manually. The processing parameters include a predetermined depth and laser energy parameter, enabling the mold block to form with a plurality of network points. After that, the mold block is used to replicate an optical plate.

Description

雷射加工方法及其裝置 Laser processing method and device thereof

本發明係有關雷射加工方法及其裝置,特別是指一種製程簡化且高量產性,用以製作光學板件的雷射加工方法及其裝置。 The invention relates to a laser processing method and a device thereof, in particular to a laser processing method and a device thereof for fabricating an optical plate member with simplified process and high mass production.

由於液晶顯示器面板之液晶本身不具發光特性,因而,為達到顯示效果,需給液晶顯示器面板提供一面光源裝置,如背光系統,其作用在於向液晶顯示器面板供應輝度充分且分佈均勻之面光源。 Since the liquid crystal of the liquid crystal display panel itself has no illuminating property, in order to achieve the display effect, the liquid crystal display panel needs to provide a light source device, such as a backlight system, for supplying a surface light source with sufficient brightness and uniform distribution to the liquid crystal display panel.

先前技術之背光系統主要由光源、導光板、反射板、擴散板與稜鏡板組成。該光源可設置於導光板一側或兩相對側並將光線發射至該導光板。該導光板之作用在於引導光線傳輸方向,使光線由導光板之出光面均勻出射,反射板相對該導光板之底面設置,以將由導光板底面出射之光線再次反射入該導光板內,提高光線之利用率。擴散板與稜鏡板相對導光板之出光面依次設置,以使由導光板出射之光線分佈更加均勻,進而提高液晶顯示器面板之輝度與均勻性;因此導光板的設計與製造攸關背光模組光學設計與輝度、均細度的控制,為背光模組廠商最主要的技術與成本所在。 The backlight system of the prior art is mainly composed of a light source, a light guide plate, a reflection plate, a diffusion plate and a seesaw. The light source may be disposed on one side or opposite sides of the light guide plate and emit light to the light guide plate. The light guide plate is configured to guide the light transmission direction so that the light is uniformly emitted from the light exit surface of the light guide plate, and the reflector is disposed opposite to the bottom surface of the light guide plate to reflect the light emitted from the bottom surface of the light guide plate into the light guide plate to improve the light. Utilization rate. The light-emitting surface of the diffuser plate and the fascia plate opposite to the light guide plate are sequentially arranged to make the light distribution from the light guide plate more uniform, thereby improving the brightness and uniformity of the liquid crystal display panel; therefore, the design and manufacture of the light guide plate are related to the backlight module optical Design and control of brightness and average fineness are the most important technologies and costs for backlight module manufacturers.

一般而言,傳統導光板之製造方法如下: In general, the conventional light guide plate is manufactured as follows:

1.網版印刷(screen printing)方式,在壓克力平板上使用具「高反射率」且「不吸光」的材料,在導光板底面印上圓形或方形之圖樣。 1. Screen printing method, using a material with "high reflectivity" and "no light absorption" on an acrylic plate, and printing a circular or square pattern on the bottom surface of the light guide plate.

2.利用模具,直接射出成型形成具圖樣之導光板,其中圖樣可形成於導光板之出光面或入光面。先將具有導光板圖樣之一薄片金屬平貼於射出成型模具之一母模(或鏡面模仁)上,然後進行合模,使一公模與母模緊密結合。此時,將原料(通常為丙烯,俗稱壓克力)沿箭頭方向由公模的射出口注入一模穴中,並配合射出機、熱壓機等複製機台,以完成具有圖樣之導光板的製作,而其中導光板之圖樣則可利用刀具、車床、線切割、蝕刻、噴砂等加工技術形成於薄片金屬上。 2. Using a mold, direct injection molding to form a light guide plate with a pattern, wherein the pattern can be formed on the light exit surface or the light incident surface of the light guide plate. First, a sheet metal having a light guide plate pattern is flatly attached to one of the female molds (or mirror mold cores) of the injection molding mold, and then the mold is closed to form a male mold and the female mold. At this time, the raw material (usually propylene, commonly known as acrylic) is injected into the cavity from the injection port of the male mold in the direction of the arrow, and is matched with the copying machine such as the injection machine and the hot press to complete the light guide plate with the pattern. The production of the light guide plate can be formed on the sheet metal by using cutting tools, lathes, wire cutting, etching, sand blasting and the like.

然而於先前技術導光板製作技術中,由於製作導光板之模具是採取噴砂或刀具雕刻加工等以形成圖樣,若採取刀具雕刻加工技術會有刀具成本耗損大、製作時程長、精密度差,以及導光板圖樣缺乏多樣性之缺點;再者,噴砂與蝕刻之加工重現性不佳,故無法有效提升模具製作之重複性,造成模具製作時常會產生光分佈之偏移。 However, in the prior art light guide plate manufacturing technology, since the mold for manufacturing the light guide plate is formed by sandblasting or tool engraving, etc., if the tool engraving processing technology is adopted, the tool cost is large, the manufacturing time is long, and the precision is poor. And the lack of diversity of the light guide plate pattern; in addition, the reproducibility of the sandblasting and etching process is not good, so the repeatability of the mold making cannot be effectively improved, and the light distribution is often generated when the mold is produced.

此外,於導光板圖樣疏密分佈之控制方面,若欲利用噴砂面以不同粗糙度分佈來調整導光板圖樣疏密之分佈,進而藉以調整背光模組發光之均勻度,遺憾地於現行噴砂加工技術無法精確地做到控制導光板上不同區域之加工點疏密程度,然而倘若僅能製作成整面相同粗糙度之噴砂霧面,則背光模組發光之均勻度又不易被調整,其皆為現今導光板製作所面臨之瓶頸。 In addition, in the control of the dense distribution of the light guide plate pattern, if the blasting surface is to be used to adjust the distribution of the light guide plate with different roughness distribution, thereby adjusting the uniformity of the illumination of the backlight module, it is unfortunate that the current sandblasting process The technology cannot accurately control the density of processing points in different areas on the light guide plate. However, if only the same surface roughness of the same surface is applied, the uniformity of the backlight module is not easily adjusted. The bottleneck faced by today's light guide panels.

有鑒於此,本發明即在提供一種製程簡化且高量產性, 用以製作光學板件的雷射加工方法及其裝置,為其主要目的者。 In view of this, the present invention provides a process simplification and high mass productivity. The laser processing method and apparatus for fabricating the optical plate member are the main objects thereof.

為達上述目的,本發明之雷射加工方法用以在模塊上進行加工,其中,該雷射加工單元接收加工圖案之圖形檔,根據該圖形檔設置方位參數,並由手動輸入加工參數,該加工參數包括一預定深度及雷射能量參數,使模塊形成相對應之複數網點,再由該模塊翻版藉以形成一光學板件。 In order to achieve the above object, the laser processing method of the present invention is used for processing on a module, wherein the laser processing unit receives a graphic pattern of a processing pattern, sets an orientation parameter according to the graphic file, and manually inputs a processing parameter, The processing parameters include a predetermined depth and a laser energy parameter, such that the module forms a corresponding plurality of dots, and the module is retreaded to form an optical plate.

利用上述技術特徵,利用雷射加工技術製作光學板件(可以為導光板)之模塊,以使導光板之入光面形成雷射加工圖樣,進而大幅提高導光板之發光效率,並可有效地縮短製程加工時間、減少製作成本、可進行多樣化的圖樣設計、具有高精密度、因使用雷射加工,未與模塊作接觸式之加工,故未有如刀具耗損現象,以及可改善導光板入光側的光弧現象,達到混光效果,並能縮短混光距離等。此外,採用雷射加工之模塊由於其精密度高,故模塊之重現性佳,意即可提升模塊製作之重複性。 By using the above technical features, a module of an optical plate (which may be a light guide plate) is fabricated by using a laser processing technology, so that a light-emitting surface of the light guide plate forms a laser processing pattern, thereby greatly improving the light-emitting efficiency of the light guide plate, and effectively Shorten the processing time, reduce the production cost, make diversified pattern design, have high precision, use laser processing, and do not contact with the module. Therefore, there is no such phenomenon as tool wear and can improve the light guide plate. The light arc phenomenon on the light side achieves the light mixing effect and shortens the light mixing distance. In addition, due to its high precision, the module using laser processing has good reproducibility of the module, which can improve the repeatability of module production.

綜上所述,本發明可有效增加導光板之發光效率與品質以及降低導光板之製作成本,因而有助於提升市場競爭力和產品利潤。 In summary, the present invention can effectively increase the luminous efficiency and quality of the light guide plate and reduce the manufacturing cost of the light guide plate, thereby contributing to market competitiveness and product profit.

依據上述主要技術特徵,所述雷射能量參數包括一設計脈衝功率、一設計脈衝頻率與一設計加工時間。 According to the above main technical features, the laser energy parameters include a design pulse power, a design pulse frequency, and a design processing time.

依據上述主要技術特徵,所述預定深度可藉由控制該雷射加工單元之重複頻率來達成。 According to the above main technical features, the predetermined depth can be achieved by controlling the repetition frequency of the laser processing unit.

依據上述主要技術特徵,所述光學板件可以為一導光板,而該模塊各網點則相對應轉寫於該導光板之入光面。 According to the above main technical features, the optical plate member may be a light guide plate, and each dot of the module is correspondingly written on the light incident surface of the light guide plate.

依據上述主要技術特徵,所述加工參數中設定雷射能量參數小,而預定深度較深,用以於該模塊形成角錐狀之網點。 According to the above main technical features, the laser energy parameter is set to be small in the processing parameter, and the predetermined depth is deep, and the corner point is formed in the module.

依據上述主要技術特徵,所述模塊可藉由射出成型方式進行翻版。 According to the above main technical features, the module can be embossed by injection molding.

為達上述目的,本發明亦提供一種雷射加工裝置,用以在模塊上進行加工,至少包含有:圖檔設計單元、雷射加工單元以及手動設定單元;其中,該圖檔設計單元用以設計加工圖案,並形成有圖形檔;該雷射加工單元可接收該圖形檔,並根據該圖形檔設置方位參數;而該手動設定單元可手動輸入加工參數,並將該加工參數傳送至該雷射加工單元,由該雷射加工單元依據上述之方位參數以及加工參數對模塊進行加工,最後再利用該模塊翻版藉以形成一光學板件。 In order to achieve the above object, the present invention also provides a laser processing apparatus for processing on a module, comprising at least: a graphic design unit, a laser processing unit, and a manual setting unit; wherein the graphic design unit is used for Designing a processing pattern and forming a graphic file; the laser processing unit can receive the graphic file and set an orientation parameter according to the graphic file; and the manual setting unit can manually input the processing parameter and transmit the processing parameter to the lightning The laser processing unit processes the module according to the orientation parameter and the processing parameter, and finally uses the module to reticle to form an optical plate.

依據上述主要技術特徵,所述圖檔設計單元與該雷射加工單元可以有線或無線方式連接。 According to the above main technical features, the image design unit and the laser processing unit can be connected in a wired or wireless manner.

依據上述主要技術特徵,所述手動設定單元進一步設有相互連接之輸入按鍵以及螢幕。 According to the above main technical features, the manual setting unit is further provided with input buttons and a screen connected to each other.

本發明之特點,可參閱本案圖式及實施例之詳細說明而獲得清楚地瞭解。 The features of the present invention can be clearly understood by referring to the drawings and the detailed description of the embodiments.

如第一圖本發明雷射加工裝置之結構示意圖所示,本發明之雷射加工裝置1至少包含有:圖檔設計單元11、雷射加工單元12以及手動設定單元13;其中,圖檔設計單元11用以設計加工圖案,並形成有圖形檔;雷射加工單元12係與圖檔設計單元11連接,兩者可利用有線或無線方式連接,雷射 加工單元12可接收該圖形檔,並根據該圖形檔設置方位參數;而手動設定單元13連接雷射加工單元12,可手動輸入加工參數,並將該加工參數傳送至該雷射加工單元,由該雷射加工單元依據上述之方位參數以及加工參數對模塊進行加工。 As shown in the first schematic diagram of the laser processing apparatus of the present invention, the laser processing apparatus 1 of the present invention comprises at least: an image designing unit 11, a laser processing unit 12, and a manual setting unit 13; The unit 11 is used to design a processing pattern and is formed with a graphic file; the laser processing unit 12 is connected to the image design unit 11, and the two can be connected by wire or wirelessly, and the laser is connected. The processing unit 12 can receive the graphic file and set the orientation parameter according to the graphic file; and the manual setting unit 13 is connected to the laser processing unit 12, can manually input the processing parameter, and transmit the processing parameter to the laser processing unit, The laser processing unit processes the module according to the orientation parameters and the processing parameters described above.

而整體雷射加工方法,請同時參閱第二圖所示,本發明之雷射加工裝置1用以在模塊2上進行加工,由圖檔設計單元11所設計之圖形檔,傳送至雷射加工單元12,雷射加工單元可根據該圖形檔設置方位參數(可包含X、Y軸向之方位參數),並藉由手動設定單元13手動輸入加工參數,其加工參數包括一預定深度及雷射能量參數;當然,手動設定單元13可進一步設有相互連接之輸入按鍵131以及螢幕131,以方便進行輸入加工參數並加以顯示。 For the overall laser processing method, please refer to the second figure. The laser processing apparatus 1 of the present invention is used for processing on the module 2, and is transmitted to the laser processing by the graphic file designed by the graphic design unit 11. The unit 12, the laser processing unit can set the azimuth parameter according to the graphic file (which can include the orientation parameters of the X and Y axes), and manually input the machining parameters by the manual setting unit 13, the processing parameters including a predetermined depth and the laser The energy parameter; of course, the manual setting unit 13 may further be provided with an input button 131 and a screen 131 connected to each other to facilitate inputting and displaying the processing parameters.

其中,方位參數可包含X、Y軸向之座標位置,預定深度可藉由控制雷射加工單元之重複頻率來達成,而雷射能量參數包括一設計脈衝功率、一設計脈衝頻率與一設計加工時間,而雷射加工單元對應上述所設定之方位參數、預定深度以及雷射能量參數發出雷射光束,使模塊2形成相對應之複數網點21,再由模塊2翻版藉以形成一光學板件。 Wherein, the azimuth parameter may include a coordinate position of the X and Y axes, and the predetermined depth may be achieved by controlling a repetition frequency of the laser processing unit, and the laser energy parameter includes a design pulse power, a design pulse frequency, and a design process. The laser processing unit emits a laser beam corresponding to the azimuth parameter, the predetermined depth and the laser energy parameter set by the above, so that the module 2 forms a corresponding plurality of dots 21, and then the module 2 remakes to form an optical plate.

模塊可放置於模具內藉由射出成型方式進行翻版而完成光學板件之製作;當然,光學板件可以為一導光板,而模塊各網點則相對應轉寫於導光板之入光面,以使導光板之入光面形成雷射加工圖樣,進而大幅提高導光板之發光效率。 The module can be placed in the mold to complete the production of the optical plate by embossing by injection molding; of course, the optical plate member can be a light guide plate, and the dots of the module are correspondingly written on the light incident surface of the light guide plate, The light incident surface of the light guide plate is formed into a laser processing pattern, thereby greatly improving the light emitting efficiency of the light guide plate.

再者,雷射加工單元所發出之雷射光束,可於模塊形成不同形狀之網點,例如圓形或者角錐狀,其中,於加工參數 中設定雷射能量參數小,而預定深度較深,則可於模塊形成角錐狀之網點;當然,亦可由方位參數來控制於預定位置處形成網點,或者由控制雷射加工單元之重複頻率,來形成不同深度之網點,以及由雷射能量參數來控制形成網點之大小、形狀,以達到圖案多樣化之設計。 Furthermore, the laser beam emitted by the laser processing unit can form different shapes of dots in the module, such as a circular or pyramidal shape, wherein the processing parameters The laser energy parameter is set to be small, and the predetermined depth is deep, the corner point of the module may be formed; of course, the orientation parameter may be used to control the formation of the mesh point at the predetermined position, or the repetition frequency of the laser processing unit may be controlled. To form dots of different depths, and to control the size and shape of the dots formed by the laser energy parameters to achieve a diversified design.

值得一提的是,本發明之雷射加工方法可有效地縮短製程加工時間、減少製作成本、可進行多樣化的圖樣設計以及具有高精密度,因使用雷射加工,未與模塊作接觸式之加工,故未有如刀具耗損現象,以及可改善導光板入光側的光弧現象,達到混光效果,並能縮短混光距離等。此外,採用雷射加工之模塊由於其精密度高,故模塊之重現性佳,意即可提升模塊製作之重複性。 It is worth mentioning that the laser processing method of the invention can effectively shorten the processing time of the process, reduce the manufacturing cost, can carry out diversified pattern design and has high precision, and is not in contact with the module due to the use of laser processing. The processing is not like the tool wear phenomenon, and the light arc phenomenon on the light-incident side of the light guide plate can be improved, the light mixing effect can be achieved, and the light mixing distance can be shortened. In addition, due to its high precision, the module using laser processing has good reproducibility of the module, which can improve the repeatability of module production.

如上所述,本發明提供一較佳可行之雷射加工方法及其裝置,爰依法提呈發明專利之申請;本發明之技術內容及技術特點巳揭示如上,然而熟悉本項技術之人士仍可能基於本發明之揭示而作各種不背離本案發明精神之替換及修飾。因此,本發明之保護範圍應不限於實施例所揭示者,而應包括各種不背離本發明之替換及修飾,並為以下之申請專利範圍所涵蓋。 As described above, the present invention provides a preferred and feasible laser processing method and apparatus thereof, and an application for an invention patent according to law; the technical content and technical features of the present invention are disclosed above, but those skilled in the art may still The various alternatives and modifications may be made without departing from the spirit and scope of the invention. Therefore, the scope of the present invention should be construed as being limited by the scope of the appended claims

1‧‧‧雷射加工裝置 1‧‧‧ Laser processing equipment

11‧‧‧圖檔設計單元 11‧‧‧ graphic design unit

12‧‧‧雷射加工單元 12‧‧‧Laser processing unit

13‧‧‧手動設定單元 13‧‧‧Manual setting unit

131‧‧‧輸入按鍵 131‧‧‧ input button

131‧‧‧螢幕 131‧‧‧ screen

第一圖係為本發明中雷射加工裝置之結構示意圖。 The first figure is a schematic structural view of a laser processing apparatus in the present invention.

第二圖係為本發明中雷射加工裝置與模塊之結構立體圖。 The second figure is a perspective view of the structure of the laser processing apparatus and module in the present invention.

1‧‧‧雷射加工裝置 1‧‧‧ Laser processing equipment

11‧‧‧圖檔設計單元 11‧‧‧ graphic design unit

12‧‧‧雷射加工單元 12‧‧‧Laser processing unit

13‧‧‧手動設定單元 13‧‧‧Manual setting unit

Claims (10)

一種雷射加工方法,用以在模塊上進行加工,該雷射加工單元接收加工圖案之圖形檔,根據該圖形檔設置方位參數,並由手動輸入加工參數,該加工參數包括一預定深度及雷射能量參數,使模塊形成相對應之複數網點,再由該模塊翻版藉以形成一光學板件。 A laser processing method for processing on a module, the laser processing unit receiving a graphic file of a processing pattern, setting an orientation parameter according to the graphic file, and manually inputting a processing parameter, the processing parameter including a predetermined depth and a lightning The energy parameter is such that the module forms a corresponding plurality of dots, and the module is retreaded to form an optical plate. 如申請專利範圍第1項所述之雷射加工方法,其中,該雷射能量參數包括一設計脈衝功率、一設計脈衝頻率與一設計加工時間。 The laser processing method of claim 1, wherein the laser energy parameter comprises a design pulse power, a design pulse frequency, and a design processing time. 如申請專利範圍第1項所述之雷射加工方法,其中,該預定深度可藉由控制該雷射加工單元之重複頻率來達成。 The laser processing method of claim 1, wherein the predetermined depth is achieved by controlling a repetition frequency of the laser processing unit. 如申請專利範圍第1項至第3項其中任一項所述之雷射加工方法,其中,該光學板件可以為一導光板,而該模塊各網點則相對應轉寫於該導光板之入光面。 The laser processing method according to any one of the preceding claims, wherein the optical plate member can be a light guide plate, and each dot of the module is correspondingly written on the light guide plate. Into the glossy surface. 如申請專利範圍第1項至第3項其中任一項所述之雷射加工方法,其中,該加工參數中設定雷射能量參數小,而預定深度較深,用以於該模塊形成角錐狀之網點。 The laser processing method according to any one of claims 1 to 3, wherein the processing parameter has a small laser energy parameter and a predetermined depth is deep, and the pyramid is shaped to form a pyramid. The outlets. 如申請專利範圍第1項至第3項其中任一項所述之雷射加工方法,其中,該模塊可藉由射出成型方式進行翻版。 The laser processing method according to any one of claims 1 to 3, wherein the module is rewritable by injection molding. 一種雷射加工裝置,用以在模塊上進行加工,至少包含有:圖檔設計單元,用以設計加工圖案,並形成有圖形檔;雷射加工單元,連接該圖檔設計單元,接收該圖形檔,並根據該圖形檔設置方位參數;以及手動設定單元,連接該雷射加工單元,可手動輸入加工 參數,並將該加工參數傳送至該雷射加工單元,由該雷射加工單元依據上述之方位參數以及加工參數對模塊進行加工。 A laser processing device for processing on a module, comprising at least: a graphic design unit for designing a processing pattern and forming a graphic file; a laser processing unit connected to the graphic design unit to receive the graphic And set the orientation parameter according to the graphic file; and manually setting the unit, connecting the laser processing unit, and manually inputting the processing The parameter is transmitted to the laser processing unit, and the laser processing unit processes the module according to the orientation parameter and the processing parameter. 如申請專利範圍第7項所述之雷射加工方法,其中,該圖檔設計單元與該雷射加工單元可以有線或無線方式連接。 The laser processing method of claim 7, wherein the image design unit and the laser processing unit are connectable in a wired or wireless manner. 如申請專利範圍第7項所述之雷射加工方法,其中,該手動設定單元進一步設有相互連接之輸入按鍵以及螢幕。 The laser processing method of claim 7, wherein the manual setting unit is further provided with an input button and a screen connected to each other. 如申請專利範圍第7項至第9項其中任一項所述之雷射加工裝置,其中,該雷射能量參數包括一設計脈衝功率、一設計脈衝頻率與一設計加工時間,而該預定深度可藉由控制該雷射加工單元之重複頻率來達成。 The laser processing apparatus of any one of clauses 7 to 9, wherein the laser energy parameter comprises a design pulse power, a design pulse frequency, and a design processing time, and the predetermined depth This can be achieved by controlling the repetition frequency of the laser processing unit.
TW101144905A 2012-11-30 2012-11-30 Laser processing method and its device TW201420247A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113441780A (en) * 2021-05-11 2021-09-28 叶雨泓 Micro-nano structure diffuser plate positioning and processing device with combined surface and spherical surface

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113441780A (en) * 2021-05-11 2021-09-28 叶雨泓 Micro-nano structure diffuser plate positioning and processing device with combined surface and spherical surface

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