TW201416640A - Method and device for measuring 3-D article without contacting - Google Patents

Method and device for measuring 3-D article without contacting Download PDF

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Publication number
TW201416640A
TW201416640A TW101140096A TW101140096A TW201416640A TW 201416640 A TW201416640 A TW 201416640A TW 101140096 A TW101140096 A TW 101140096A TW 101140096 A TW101140096 A TW 101140096A TW 201416640 A TW201416640 A TW 201416640A
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dimensional
image
image capturing
contact
contour model
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TW101140096A
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Chinese (zh)
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TWI472711B (en
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Ming-Hung Chou
Yu-Ting Lin
Po-Yi Li
Jyh-Jye Jeng
Kai-Hsiang Chang
Yun-Te Su
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Ind Tech Res Inst
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Priority to CN201210549246.5A priority patent/CN103791851A/en
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Abstract

A method and a device for measuring a 3-D article without contacting are provided. The method for measuring the 3-D article without contacting comprises the following steps. A 3-D contour model of a 3-D article is provided. A capturing route is created according to the 3-D contour model. A 2-D image is captured by an image capturing unit according to the capturing route. A 2-D contour model is drawn on the 2-D image; or the size of the 2-D image is measured. The 2-D contour model is created according to the capturing route and the 3-D contour model.

Description

非接觸式三維物件量測方法與裝置 Non-contact three-dimensional object measuring method and device

本發明是有關於一種三維物件量測方法與裝置,且特別是有關於一種非接觸式三維物件量測方法與裝置。 The invention relates to a three-dimensional object measuring method and device, and in particular to a non-contact three-dimensional object measuring method and device.

隨著工業的蓬勃發展,傳統二維的檢測方式已經無法滿足複雜的三次元待測物件,因此目前市面上也有一種三次元量測儀來進行這種複雜待測物的量測。一般來說,三次元量測儀採用接觸式量測。接觸式的三次元量測儀是直接利用探針接觸待測物來量測尺寸,此種方式的缺點是速度較慢而且也會有傷害待測物表面之疑慮。 With the vigorous development of industry, the traditional two-dimensional detection method can not meet the complex three-dimensional object to be tested. Therefore, there is also a three-dimensional measuring instrument on the market to measure the complex object to be tested. In general, the three-dimensional measuring instrument uses contact measurement. The contact type three-dimensional measuring instrument directly measures the size by contacting the probe with the object to be tested. The disadvantage of this method is that the speed is slow and there is also a concern that the surface of the object to be tested is damaged.

本發明係有關於一種非接觸式三維物件量測方法與裝置,其利用非接觸之方式進行三維物件之量測。 The invention relates to a non-contact three-dimensional object measuring method and device, which utilizes a non-contact method for measuring three-dimensional objects.

根據本發明之一方面,提出一種非接觸式三維物件量測方法。非接觸式三維物件量測方法包括以下步驟。提供一三維物件之一三維輪廓模型。依據三維輪廓模型,建立一取像路徑。依據取像路徑,以一影像擷取單元擷取三維物件之一二維影像。於二維影像上繪製一二維輪廓模型、或量測二維影像之尺寸。二維輪廓模型係依據取像路徑及三維輪廓模型所建立。 According to an aspect of the invention, a non-contact three-dimensional object measuring method is proposed. The non-contact three-dimensional object measuring method includes the following steps. A three-dimensional contour model of a three-dimensional object is provided. According to the three-dimensional contour model, an image capturing path is established. According to the image capturing path, a two-dimensional image of the three-dimensional object is captured by an image capturing unit. Draw a 2D contour model on a 2D image, or measure the size of a 2D image. The 2D contour model is based on the image acquisition path and the 3D contour model.

根據本發明之另一方面,提出一種非接觸式三維物件量測裝置。非接觸式三維物件量測裝置包括一儲存單元、 一處理單元、一影像擷取單元、一移動單元及一顯示單元。儲存單元係儲存一三維物件之一三維輪廓模型。處理單元係依據三維輪廓模型建立一取像路徑或量測三維物件之一二維影像之尺寸。移動單元用以依據取像路徑移動影像擷取單元,以使影像擷取單元擷取三維物件之二維影像。顯示單元用以顯示二維影像。處理單元於二維影像上繪製一二維輪廓模型、或量測該二維影像之尺寸。處理單元係依據取像路徑及三維輪廓模型,建立二維輪廓模型。 According to another aspect of the present invention, a non-contact three-dimensional object measuring device is proposed. The non-contact three-dimensional object measuring device comprises a storage unit, a processing unit, an image capturing unit, a mobile unit and a display unit. The storage unit stores a three-dimensional contour model of a three-dimensional object. The processing unit establishes an image capturing path or measures the size of one of the two-dimensional images of the three-dimensional object according to the three-dimensional contour model. The moving unit is configured to move the image capturing unit according to the image capturing path, so that the image capturing unit captures the two-dimensional image of the three-dimensional object. The display unit is used to display a two-dimensional image. The processing unit draws a two-dimensional contour model on the two-dimensional image or measures the size of the two-dimensional image. The processing unit establishes a two-dimensional contour model according to the image capturing path and the three-dimensional contour model.

為讓本發明之上述內容能更明顯易懂,下文特舉各種實施例,並配合所附圖式,作詳細說明如下: In order to make the above-mentioned contents of the present invention more comprehensible, various embodiments are described below, and in conjunction with the drawings, the detailed description is as follows:

以下係提出各種實施例進行詳細說明,實施例僅用以作為範例說明,並不會限縮本發明欲保護之範圍。此外,實施例中之圖式係省略部份元件,以清楚顯示本發明之技術特點。 The following is a detailed description of various embodiments, which are intended to be illustrative only and not to limit the scope of the invention. Further, the drawings in the embodiments are omitted to partially illustrate the technical features of the present invention.

第一實施例 First embodiment

請參照第1圖,其繪示第一實施例之非接觸式三維物件量測裝置1000之示意圖。三維物件量測裝置1000包括一儲存單元110、一處理單元120、一影像擷取單元130、一移動單元140及一顯示單元150。儲存單元110用以儲存各種資料,例如是一硬碟、一記憶體或一光碟。處理單元120用以進行各種運算及處理程序,例如是一影像處理晶片、一微處理晶片、一韌體電路或儲存數個程式碼之一 記錄媒體。影像擷取單元130用以擷取一影像,例如是一照相機、一攝影機或具有鏡頭之一手持式電子裝置。移動單元140係以自動化技術移動某些物體。移動單元140例如是機器手臂、軌道設備、旋轉平台、懸吊設備或其組合。顯示單元150用以輸出各種畫面,例如是顯示螢幕、繪圖機或列印機。 Please refer to FIG. 1 , which is a schematic diagram of the non-contact three-dimensional object measuring device 1000 of the first embodiment. The three-dimensional object measuring device 1000 includes a storage unit 110, a processing unit 120, an image capturing unit 130, a moving unit 140, and a display unit 150. The storage unit 110 is configured to store various materials, such as a hard disk, a memory, or a compact disk. The processing unit 120 is configured to perform various operations and processing procedures, such as an image processing chip, a micro processing chip, a firmware circuit, or one of storing a plurality of codes. Record media. The image capturing unit 130 is configured to capture an image, such as a camera, a camera, or a handheld electronic device having a lens. The mobile unit 140 moves certain objects with automation techniques. The mobile unit 140 is, for example, a robotic arm, a track device, a rotating platform, a suspension device, or a combination thereof. The display unit 150 is configured to output various screens, such as a display screen, a plotter, or a printer.

本實施例透過上述各種元件進行三維物件900的非接觸式量測,以比對出三維物件900的長度、角度及輪廓是否符合預定規格。在量測過程中,三維物件900無須被任何機械設備或探針所接觸。 In this embodiment, the non-contact measurement of the three-dimensional object 900 is performed through the above various components to compare whether the length, angle and contour of the three-dimensional object 900 meet predetermined specifications. The three-dimensional object 900 does not need to be contacted by any mechanical device or probe during the measurement process.

請參照第2圖,其繪示第一實施例之非接觸式三維物件量測方法之流程圖。在本實施例中,係以第1圖之非接觸式三維物件量測裝置1000為例來說明此流程步驟。 Referring to FIG. 2, a flow chart of the non-contact three-dimensional object measuring method of the first embodiment is shown. In the present embodiment, the flow step is described by taking the non-contact three-dimensional object measuring device 1000 of FIG. 1 as an example.

在步驟S101中,以儲存單元110提供三維物件900之一三維輪廓模型。三維輪廓模型例如是由計算機輔助設計軟體(Computer Aided Design,CAD)所建構。三維輪廓模型包含了各個部位在各種視角的輪廓。請參照第1圖及第3圖,第3圖繪示第1圖之三維物件900之另一視角的示意圖。三維物件900的兩種視角分別繪示於第1圖及第3圖。也就是說,只要指定三維物件900之某個部位及某個視角,即可得到對應的二維輪廓模型。 In step S101, a three-dimensional contour model of the three-dimensional object 900 is provided by the storage unit 110. The three-dimensional contour model is constructed, for example, by Computer Aided Design (CAD). The 3D contour model contains contours of various parts at various angles of view. Please refer to FIG. 1 and FIG. 3 . FIG. 3 is a schematic diagram showing another perspective of the three-dimensional object 900 of FIG. 1 . The two perspectives of the three-dimensional object 900 are shown in Figures 1 and 3, respectively. That is to say, as long as a certain part of the three-dimensional object 900 and a certain angle of view are specified, a corresponding two-dimensional contour model can be obtained.

在步驟S102中,處理單元120依據三維輪廓模型,建立一取像路徑。取像路徑可以是多個取像點的順序集合,也可以是單一取像點。在三維物件體積較小時,取像路徑可以是單一個取像點;在三維物件體積較大,取像路 徑可以是多個取像點。取像路徑的設定包括一三維取像位置(影像擷取裝置所座落之X軸、Y軸、Z軸位置)及一θ軸向。 In step S102, the processing unit 120 establishes an image capturing path according to the three-dimensional contour model. The image capture path can be a sequential set of multiple capture points or a single capture point. When the volume of the three-dimensional object is small, the image taking path may be a single image taking point; in the three-dimensional object, the volume is large, and the image path is taken. The path can be multiple image points. The setting of the image capturing path includes a three-dimensional image capturing position (the X axis, the Y axis, and the Z axis position where the image capturing device is located) and a θ axis.

在另一實施例中,取像路徑的設定更包括一取像範圍。在影像擷取單元130具有變焦鏡頭的情況下,取像範圍可以透過影像擷取單元130的光學變焦系統或數位變焦系統來控制。當量測的精細度要求較高時,可以縮小取像範圍,以使細部的影像能夠被放大。當量測的範圍要求較廣時,可以放大取像範圍,以使大範圍的影像能夠被擷取。 In another embodiment, the setting of the image taking path further includes an image capturing range. In the case where the image capturing unit 130 has a zoom lens, the image capturing range can be controlled by the optical zoom system or the digital zoom system of the image capturing unit 130. When the fineness of the equivalent measurement is required to be high, the image capturing range can be reduced so that the detailed image can be enlarged. When the range of the equivalent measurement is required to be wide, the image capturing range can be enlarged to enable a wide range of images to be captured.

在步驟S103中,影像擷取單元130依據取像路徑擷取三維物件900之一二維影像800(繪示於第1圖之顯示單元150內及第4圖)。在本實施例中,移動單元140可以朝三個移動方向移動影像擷取單元130,例如是X軸向、Y軸向及Z軸向,以使影像擷取單元130能夠被移動到定義好的三維取像位置。移動單元140除了可以移動影像擷取單元130以外,更可以利用θ軸向旋轉影像擷取單元130,以使影像擷取單元130朝向定義好的三維取像方向。如此一來,影像擷取單元130能夠對準三維物件900所欲量測之部分。 In step S103, the image capturing unit 130 captures a two-dimensional image 800 of the three-dimensional object 900 according to the image capturing path (shown in the display unit 150 and FIG. 4 in FIG. 1). In this embodiment, the moving unit 140 can move the image capturing unit 130 in three moving directions, for example, an X axis, a Y axis, and a Z axis, so that the image capturing unit 130 can be moved to a defined shape. 3D image capture position. In addition to moving the image capturing unit 130, the moving unit 140 can further rotate the image capturing unit 130 by using the θ axis to make the image capturing unit 130 face the defined three-dimensional image capturing direction. In this way, the image capturing unit 130 can align the portion of the three-dimensional object 900 to be measured.

在另一實施例中,處理單元120更可以控制影像擷取單元130之變焦鏡頭,以使影像擷取單元130能夠對應到定義好的取像範圍。 In another embodiment, the processing unit 120 can further control the zoom lens of the image capturing unit 130 to enable the image capturing unit 130 to correspond to the defined imaging range.

請參照第4圖,其繪示第一實施例之三維物件900之二維影像800的示意圖。在步驟S104中,處理單元120於二維影像800上量測二維影像800之尺寸,例如是長度 D1。 Please refer to FIG. 4 , which is a schematic diagram of a two-dimensional image 800 of the three-dimensional object 900 of the first embodiment. In step S104, the processing unit 120 measures the size of the two-dimensional image 800 on the two-dimensional image 800, for example, the length. D1.

在步驟S105中,處理單元120於二維影像800上繪製一網格線700。網格線700之所有間距D700a、D700b可以實質上相同;或者網格線700之間距D700a可以不同於網格線700之間距D700b;或者網格線700之間距D700a之間可以不完全相同;或者網格線700之間距D700b之間可以不完全相同。透過網格線700的自動呈現,使用者也可以輕易地概略量測出二維影像800之尺寸(例如是長度D1)。 In step S105, the processing unit 120 draws a grid line 700 on the two-dimensional image 800. All of the spacings D700a, D700b of the gridlines 700 may be substantially the same; or the spacing between the gridlines 700 D700a may be different from the spacing of the gridlines 700 by D700b; or the spacing between the gridlines 700 may not be exactly the same; or The grid lines 700 may not be exactly the same distance between the D700b. Through the automatic presentation of the grid lines 700, the user can also easily measure the size of the two-dimensional image 800 (for example, the length D1).

在另一實施例中,也可以不執行步驟S105,而直接由處理單元120自動進行量測以計算出二維影像800之尺寸(例如是長度D1)。 In another embodiment, step S105 may not be performed, but the measurement is automatically performed by the processing unit 120 to calculate the size of the two-dimensional image 800 (for example, the length D1).

此外,步驟S105可以執行於步驟S103之後或者執行於步驟S104之後;或者與步驟S104同時執行。 Further, step S105 may be performed after step S103 or after step S104; or simultaneously with step S104.

透過上述非接觸式三維物件量測方法與裝置1000,無須接觸三維物件900之表面,可以避免三維物件900之表面被刮傷。並且在量測過程中只需擷取二維影像800即可進行比對,無須進行機械式的實體量測,使得量測速度可以加快。 Through the above non-contact three-dimensional object measuring method and apparatus 1000, the surface of the three-dimensional object 900 can be prevented from being scratched without contacting the surface of the three-dimensional object 900. In the measurement process, only the two-dimensional image 800 can be captured for comparison, and no mechanical physical measurement is required, so that the measurement speed can be accelerated.

第二實施例 Second embodiment

請參照第5圖,其繪示第二實施例之二維影像800之示意圖。本實施例與第一實施例不同之處在於二維影像800所量測之尺寸,其餘相同之處不再重複敘述。 Please refer to FIG. 5 , which illustrates a schematic diagram of a two-dimensional image 800 of the second embodiment. The difference between this embodiment and the first embodiment lies in the size measured by the two-dimensional image 800, and the rest of the same is not repeated.

在本實施例中,處理單元120可以直接量測二維影像 800之角度θ1,而無須接觸三維物件900之表面,可以避免三維物件900之表面被刮傷。並且在量測過程中只需擷取二維影像800即可進行比對,無須進行機械式的實體量測,使得量測速度可以加快。 In this embodiment, the processing unit 120 can directly measure the angle θ 1 of the two-dimensional image 800 without contacting the surface of the three-dimensional object 900, so that the surface of the three-dimensional object 900 can be prevented from being scratched. In the measurement process, only the two-dimensional image 800 can be captured for comparison, and no mechanical physical measurement is required, so that the measurement speed can be accelerated.

第三實施例 Third embodiment

請參照第6A~6B圖,第6A圖繪示第三實施例之二維輪廓模型930之示意圖,第6B圖繪示第三實施例之二維影像800之示意圖。本實施例與第一實施例不同之處在於繪製二維輪廓模型930之步驟,其餘相同之處不再重複敘述。 Please refer to FIG. 6A to FIG. 6B , FIG. 6A is a schematic diagram of a two-dimensional contour model 930 of the third embodiment, and FIG. 6B is a schematic diagram of a two-dimensional image 800 of the third embodiment. This embodiment differs from the first embodiment in the steps of drawing the two-dimensional contour model 930, and the rest of the similarities are not repeated.

如第6A圖所示,二維輪廓模型930係為三維物件900(繪示於第1圖)之一輪廓線。二維輪廓模型930具有一模型基準點930a,二維影像800具有一影像基準點800c,於二維影像800上繪製二維輪廓模型930之步驟S104(繪示於第2圖)中,係重疊模型基準點930a及影像基準點800c,以使二維輪廓模型930繪製於二維影像800之相對應位置。 As shown in FIG. 6A, the two-dimensional contour model 930 is an outline of a three-dimensional object 900 (shown in FIG. 1). The two-dimensional contour model 930 has a model reference point 930a. The two-dimensional image 800 has an image reference point 800c. The step S104 (shown in FIG. 2) of drawing the two-dimensional contour model 930 on the two-dimensional image 800 overlaps. The model reference point 930a and the image reference point 800c are such that the two-dimensional contour model 930 is drawn at a corresponding position of the two-dimensional image 800.

由於二維輪廓模型930與二維影像800都對應於相同的三維取像位置、三維取像方向及取像範圍,理論上二維輪廓模型930與二維影像800應該能夠吻合。 Since the two-dimensional contour model 930 and the two-dimensional image 800 all correspond to the same three-dimensional image capturing position, three-dimensional image capturing direction, and image capturing range, the two-dimensional contour model 930 and the two-dimensional image 800 should theoretically be compatible.

處理單元120可以針對二維影像800及二維輪廓模型930進行比對,以自動分析出二維影像800及二維輪廓模型930的差異,而無須接觸三維物件900之表面,可以避免三維物件900之表面被刮傷。並且在量測過程中只需擷 取二維影像800即可進行比對,無須進行機械式的實體量測,使得量測速度可以加快。 The processing unit 120 can compare the two-dimensional image 800 and the two-dimensional contour model 930 to automatically analyze the difference between the two-dimensional image 800 and the two-dimensional contour model 930 without contacting the surface of the three-dimensional object 900, thereby avoiding the three-dimensional object 900. The surface was scratched. And only need to 撷 during the measurement process The two-dimensional image 800 can be compared for comparison, and no mechanical physical measurement is required, so that the measurement speed can be accelerated.

綜上所述,雖然本發明已以各種實施例揭露如上,然其並非用以限定本發明。本發明所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾。因此,本發明之保護範圍當視後附之申請專利範圍所界定者為準。 In view of the above, the present invention has been disclosed in various embodiments, and is not intended to limit the present invention. A person skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

1000‧‧‧非接觸式三維物件量測裝置 1000‧‧‧ Non-contact three-dimensional object measuring device

110‧‧‧儲存單元 110‧‧‧ storage unit

120‧‧‧處理單元 120‧‧‧Processing unit

130‧‧‧影像擷取單元 130‧‧‧Image capture unit

140‧‧‧移動單元 140‧‧‧Mobile unit

150‧‧‧顯示單元 150‧‧‧ display unit

700‧‧‧網格線 700‧‧‧ grid lines

800‧‧‧二維影像 800‧‧‧2D image

800c‧‧‧影像基準點 800c‧‧ ‧ image reference point

900‧‧‧三維物件 900‧‧‧3D objects

930‧‧‧三維輪廓模型 930‧‧‧3D contour model

930a‧‧‧模型基準點 930a‧‧‧Model reference point

D1‧‧‧長度 D1‧‧‧ length

D700a、D700b‧‧‧間距 D700a, D700b‧‧‧ spacing

S101、S102、S103、S104、S105‧‧‧流程步驟 S101, S102, S103, S104, S105‧‧‧ process steps

X、Y、Z、θ‧‧‧軸向 X, Y, Z, θ ‧‧‧ axial

θ1‧‧‧角度 θ 1‧‧‧ angle

第1圖繪示第一實施例之非接觸式三維物件量測裝置之示意圖。 FIG. 1 is a schematic view showing the non-contact three-dimensional object measuring device of the first embodiment.

第2圖繪示第一實施例之非接觸式三維物件量測方法之流程圖。 FIG. 2 is a flow chart showing the non-contact three-dimensional object measuring method of the first embodiment.

第3圖繪示第1圖之三維物件之另一視角的示意圖。 Figure 3 is a schematic view showing another perspective of the three-dimensional object of Figure 1.

第4圖繪示第一實施例之三維物件之二維影像的示意圖。 FIG. 4 is a schematic view showing a two-dimensional image of the three-dimensional object of the first embodiment.

第5圖繪示第二實施例之二維影像之示意圖。 FIG. 5 is a schematic diagram showing a two-dimensional image of the second embodiment.

第6A圖繪示第三實施例之二維輪廓模型之示意圖。 FIG. 6A is a schematic diagram showing a two-dimensional contour model of the third embodiment.

第6B圖繪示第三實施例之二維影像之示意圖。 FIG. 6B is a schematic diagram showing a two-dimensional image of the third embodiment.

S101~S105‧‧‧流程步驟 S101~S105‧‧‧ Process steps

Claims (20)

一種非接觸式三維物件量測方法,包括:提供一三維物件之一三維輪廓模型;依據該三維輪廓模型,建立一取像路徑;依據該取像路徑,以一影像擷取單元擷取該三維物件之一二維影像;以及於該二維影像上繪製一二維輪廓模型、或量測該二維影像之尺寸,該二維輪廓模型係依據該取像路徑及該三維輪廓模型所建立。 A non-contact three-dimensional object measuring method includes: providing a three-dimensional contour model of a three-dimensional object; and establishing an image capturing path according to the three-dimensional contour model; and capturing the three-dimensional image by an image capturing unit according to the image capturing path A two-dimensional image of the object; and drawing a two-dimensional contour model on the two-dimensional image, or measuring the size of the two-dimensional image, the two-dimensional contour model is established according to the image capturing path and the three-dimensional contour model. 如申請專利範圍第1項所述之非接觸式三維物件量測方法,其中在建立該取像路徑之步驟中,該取像路徑包括一三維取像位置及一三維取像方向。 The non-contact three-dimensional object measuring method according to claim 1, wherein in the step of establishing the image capturing path, the image capturing path comprises a three-dimensional image capturing position and a three-dimensional image capturing direction. 如申請專利範圍第2項所述之非接觸式三維物件量測方法,其中在建立該取像路徑之步驟中,該取像路徑更包括一取像範圍。 The non-contact three-dimensional object measuring method of claim 2, wherein in the step of establishing the image capturing path, the image capturing path further comprises an image capturing range. 如申請專利範圍第1項所述之非接觸式三維物件量測方法,更包括:於該二維影像上繪製一網格線。 The non-contact three-dimensional object measuring method of claim 1, further comprising: drawing a grid line on the two-dimensional image. 如申請專利範圍第4項所述之非接觸式三維物件量測方法,其中在繪製該網格線之步驟中,該網格線之間距實質上相同。 The non-contact three-dimensional object measuring method according to claim 4, wherein in the step of drawing the grid lines, the grid lines are substantially the same distance. 如申請專利範圍第1項所述之非接觸式三維物件量測方法,其中該二維輪廓模型具有一模型基準點,該二維影像具有一影像基準點,於該二維影像上繪製該二維輪廓模型之步驟中,係重疊該模型基準點及該影像基準點, 以使該二維輪廓模型繪製於該二維影像之相對應位置。 The non-contact three-dimensional object measuring method according to claim 1, wherein the two-dimensional contour model has a model reference point, and the two-dimensional image has an image reference point, and the two-dimensional image is drawn on the two-dimensional image. In the step of the dimension contour model, the model reference point and the image reference point are overlapped. The two-dimensional contour model is drawn at a corresponding position of the two-dimensional image. 如申請專利範圍第1項所述之非接觸式三維物件量測方法,其中在量測該二維影像之尺寸之步驟中,該二維影像之尺寸包括長度。 The non-contact three-dimensional object measuring method according to claim 1, wherein in the step of measuring the size of the two-dimensional image, the size of the two-dimensional image comprises a length. 如申請專利範圍第1項所述之非接觸式三維物件量測方法,其中在量測該二維影像之尺寸之步驟中,該二維影像之尺寸包括角度。 The non-contact three-dimensional object measuring method according to claim 1, wherein in the step of measuring the size of the two-dimensional image, the size of the two-dimensional image includes an angle. 如申請專利範圍第1項所述之非接觸式三維物件量測方法,其中在建立該二維輪廓模型之步驟中,該二維輪廓模型包括該三維物件之一輪廓線。 The non-contact three-dimensional object measuring method according to claim 1, wherein in the step of establishing the two-dimensional contour model, the two-dimensional contour model includes an outline of the three-dimensional object. 一種非接觸式三維物件量測裝置,包括:一儲存單元,係儲存一三維物件之一三維輪廓模型;一處理單元,係依據該三維輪廓模型建立一取像路徑或量測該三維物件之一二維影像之尺寸;一影像擷取單元;一移動單元,用以依據該取像路徑移動該影像擷取單元,以使該影像擷取單元擷取該三維物件之一二維影像;以及一顯示單元,用以顯示該二維影像,該處理單元於該二維影像上繪製一二維輪廓模型、或量測該二維影像之尺寸,該處理單元係依據該取像路徑及該三維輪廓模型,建立該二維輪廓模型。 A non-contact three-dimensional object measuring device comprises: a storage unit for storing a three-dimensional contour model of a three-dimensional object; and a processing unit for establishing an image capturing path or measuring one of the three-dimensional objects according to the three-dimensional contour model The size of the two-dimensional image; an image capturing unit; a moving unit for moving the image capturing unit according to the image capturing path, so that the image capturing unit captures a two-dimensional image of the three-dimensional object; a display unit for displaying the two-dimensional image, the processing unit drawing a two-dimensional contour model on the two-dimensional image, or measuring the size of the two-dimensional image, the processing unit is based on the image capturing path and the three-dimensional contour Model to establish the two-dimensional contour model. 如申請專利範圍第10項所述之非接觸式三維物件量測裝置,其中該取像路徑包括一三維取像位置及一三維取像方向。 The non-contact three-dimensional object measuring device according to claim 10, wherein the image capturing path comprises a three-dimensional image capturing position and a three-dimensional image capturing direction. 如申請專利範圍第11項所述之非接觸式三維物件量測裝置,其中該取像路徑更包括一取像範圍。 The non-contact three-dimensional object measuring device according to claim 11, wherein the image taking path further comprises an image capturing range. 如申請專利範圍第10項所述之非接觸式三維物件量測裝置,其中該處理單元更於該二維影像上繪製一網格線。 The non-contact three-dimensional object measuring device according to claim 10, wherein the processing unit further draws a grid line on the two-dimensional image. 如申請專利範圍第13項所述之非接觸式三維物件量測裝置,其中該網格線之間距實質上相同。 The non-contact three-dimensional object measuring device according to claim 13, wherein the grid lines are substantially the same distance. 如申請專利範圍第10項所述之非接觸式三維物件量測裝置,其中該二維輪廓模型具有一模型基準點,該二維影像具有一影像基準點,該處理單元重疊該模型基準點及該影像基準點,以使該二維輪廓模型繪製於該二維影像之相對應位置。 The non-contact three-dimensional object measuring device according to claim 10, wherein the two-dimensional contour model has a model reference point, the two-dimensional image has an image reference point, and the processing unit overlaps the model reference point and The image reference point is such that the two-dimensional contour model is drawn at a corresponding position of the two-dimensional image. 如申請專利範圍第10項所述之非接觸式三維物件量測裝置,其中該二維影像之尺寸包括長度。 The non-contact three-dimensional object measuring device according to claim 10, wherein the size of the two-dimensional image comprises a length. 如申請專利範圍第10項所述之非接觸式三維物件量測裝置,其中該二維影像之尺寸包括角度。 The non-contact three-dimensional object measuring device according to claim 10, wherein the size of the two-dimensional image comprises an angle. 如申請專利範圍第10項所述之非接觸式三維物件量測裝置,其中該二維輪廓模型包括該三維物件之一輪廓線。 The non-contact three-dimensional object measuring device according to claim 10, wherein the two-dimensional contour model comprises an outline of the three-dimensional object. 如申請專利範圍第10項所述之非接觸式三維物件量測裝置,其中該移動單元用以朝三個移動方向移動該影像擷取單元。 The non-contact three-dimensional object measuring device according to claim 10, wherein the moving unit is configured to move the image capturing unit in three moving directions. 如申請專利範圍第19項所述之非接觸式三維物件量測裝置,其中該移動單元更用以擺動或轉動該影像擷取單元。 The non-contact three-dimensional object measuring device according to claim 19, wherein the moving unit is further configured to swing or rotate the image capturing unit.
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