TW201416228A - Sealing sheet and solar cell module obtained using same - Google Patents
Sealing sheet and solar cell module obtained using same Download PDFInfo
- Publication number
- TW201416228A TW201416228A TW102134432A TW102134432A TW201416228A TW 201416228 A TW201416228 A TW 201416228A TW 102134432 A TW102134432 A TW 102134432A TW 102134432 A TW102134432 A TW 102134432A TW 201416228 A TW201416228 A TW 201416228A
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- mass
- vinyl acetate
- solar cell
- ethylene
- Prior art date
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- 238000007789 sealing Methods 0.000 title abstract 3
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims abstract description 44
- 239000005038 ethylene vinyl acetate Substances 0.000 claims abstract description 43
- 239000002253 acid Substances 0.000 claims abstract description 36
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 20
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 14
- 238000002844 melting Methods 0.000 claims description 13
- 230000008018 melting Effects 0.000 claims description 13
- 230000000737 periodic effect Effects 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 9
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 claims description 7
- 150000007942 carboxylates Chemical class 0.000 claims description 4
- 229920005672 polyolefin resin Polymers 0.000 claims description 3
- 150000002739 metals Chemical class 0.000 claims description 2
- 150000003839 salts Chemical class 0.000 claims description 2
- 150000001642 boronic acid derivatives Chemical class 0.000 claims 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 claims 1
- 150000001860 citric acid derivatives Chemical class 0.000 claims 1
- 150000004679 hydroxides Chemical class 0.000 claims 1
- AQSJGOWTSHOLKH-UHFFFAOYSA-N phosphite(3-) Chemical class [O-]P([O-])[O-] AQSJGOWTSHOLKH-UHFFFAOYSA-N 0.000 claims 1
- 238000010248 power generation Methods 0.000 abstract description 7
- 230000006866 deterioration Effects 0.000 abstract description 5
- 230000007774 longterm Effects 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 97
- 239000000370 acceptor Substances 0.000 description 25
- -1 butylperoxy Chemical group 0.000 description 18
- 238000004049 embossing Methods 0.000 description 12
- 238000000034 method Methods 0.000 description 12
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 12
- 239000004611 light stabiliser Substances 0.000 description 11
- 150000001451 organic peroxides Chemical class 0.000 description 10
- 230000001681 protective effect Effects 0.000 description 10
- 230000000694 effects Effects 0.000 description 8
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 8
- 239000000347 magnesium hydroxide Substances 0.000 description 8
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 8
- 239000011342 resin composition Substances 0.000 description 8
- 150000001412 amines Chemical class 0.000 description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 6
- 239000006096 absorbing agent Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 6
- 239000005022 packaging material Substances 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 238000004132 cross linking Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 4
- 229910007857 Li-Al Inorganic materials 0.000 description 4
- 229910008447 Li—Al Inorganic materials 0.000 description 4
- 239000003513 alkali Substances 0.000 description 4
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 4
- 238000001125 extrusion Methods 0.000 description 4
- 239000003063 flame retardant Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 4
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 4
- 239000003566 sealing material Substances 0.000 description 4
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 239000003431 cross linking reagent Substances 0.000 description 3
- 238000000354 decomposition reaction Methods 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 3
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229940116351 sebacate Drugs 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- 229920001862 ultra low molecular weight polyethylene Polymers 0.000 description 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 2
- WFUGQJXVXHBTEM-UHFFFAOYSA-N 2-hydroperoxy-2-(2-hydroperoxybutan-2-ylperoxy)butane Chemical group CCC(C)(OO)OOC(C)(CC)OO WFUGQJXVXHBTEM-UHFFFAOYSA-N 0.000 description 2
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- ODINCKMPIJJUCX-UHFFFAOYSA-N Calcium oxide Chemical compound [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 2
- KRKNYBCHXYNGOX-UHFFFAOYSA-K Citrate Chemical compound [O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-K 0.000 description 2
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 235000011054 acetic acid Nutrition 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 150000001450 anions Chemical class 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- RSOILICUEWXSLA-UHFFFAOYSA-N bis(1,2,2,6,6-pentamethylpiperidin-4-yl) decanedioate Chemical compound C1C(C)(C)N(C)C(C)(C)CC1OC(=O)CCCCCCCCC(=O)OC1CC(C)(C)N(C)C(C)(C)C1 RSOILICUEWXSLA-UHFFFAOYSA-N 0.000 description 2
- WLYPWANJUSYTQP-UHFFFAOYSA-N bis[2-hydroxy-4-(hydroxymethyl)phenyl]methanone Chemical compound OC1=CC(CO)=CC=C1C(=O)C1=CC=C(CO)C=C1O WLYPWANJUSYTQP-UHFFFAOYSA-N 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 238000004040 coloring Methods 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 2
- 239000012948 isocyanate Substances 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- 229920000092 linear low density polyethylene Polymers 0.000 description 2
- 239000004707 linear low-density polyethylene Substances 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 230000003472 neutralizing effect Effects 0.000 description 2
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical compound OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 description 2
- 150000002978 peroxides Chemical class 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 150000003254 radicals Chemical class 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 229910052707 ruthenium Inorganic materials 0.000 description 2
- 229960004889 salicylic acid Drugs 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-L sebacate(2-) Chemical compound [O-]C(=O)CCCCCCCCC([O-])=O CXMXRPHRNRROMY-UHFFFAOYSA-L 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- XWKBMOUUGHARTI-UHFFFAOYSA-N tricalcium;diphosphite Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]P([O-])[O-].[O-]P([O-])[O-] XWKBMOUUGHARTI-UHFFFAOYSA-N 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- KDGNCLDCOVTOCS-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy propan-2-yl carbonate Chemical compound CC(C)OC(=O)OOC(C)(C)C KDGNCLDCOVTOCS-UHFFFAOYSA-N 0.000 description 1
- QEZDYNRKJXCIFE-WAYWQWQTSA-N (z)-3-carbonoperoxoylhept-2-enoic acid Chemical group CCCC\C(=C\C(O)=O)C(=O)OO QEZDYNRKJXCIFE-WAYWQWQTSA-N 0.000 description 1
- CWZQYRJRRHYJOI-UHFFFAOYSA-N 1,1,1-trimethoxydecane Chemical compound CCCCCCCCCC(OC)(OC)OC CWZQYRJRRHYJOI-UHFFFAOYSA-N 0.000 description 1
- NALFRYPTRXKZPN-UHFFFAOYSA-N 1,1-bis(tert-butylperoxy)-3,3,5-trimethylcyclohexane Chemical compound CC1CC(C)(C)CC(OOC(C)(C)C)(OOC(C)(C)C)C1 NALFRYPTRXKZPN-UHFFFAOYSA-N 0.000 description 1
- OTCWVYFQGYOYJO-UHFFFAOYSA-N 1-o-methyl 10-o-(1,2,2,6,6-pentamethylpiperidin-4-yl) decanedioate Chemical compound COC(=O)CCCCCCCCC(=O)OC1CC(C)(C)N(C)C(C)(C)C1 OTCWVYFQGYOYJO-UHFFFAOYSA-N 0.000 description 1
- VWCFQNQVNVMFGV-UHFFFAOYSA-N 1-octylsulfinyloctane Chemical compound CCCCCCCCS(=O)CCCCCCCC VWCFQNQVNVMFGV-UHFFFAOYSA-N 0.000 description 1
- HQOVXPHOJANJBR-UHFFFAOYSA-N 2,2-bis(tert-butylperoxy)butane Chemical compound CC(C)(C)OOC(C)(CC)OOC(C)(C)C HQOVXPHOJANJBR-UHFFFAOYSA-N 0.000 description 1
- JGBAASVQPMTVHO-UHFFFAOYSA-N 2,5-dihydroperoxy-2,5-dimethylhexane Chemical compound OOC(C)(C)CCC(C)(C)OO JGBAASVQPMTVHO-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- OBETXYAYXDNJHR-UHFFFAOYSA-N 2-Ethylhexanoic acid Chemical compound CCCCC(CC)C(O)=O OBETXYAYXDNJHR-UHFFFAOYSA-N 0.000 description 1
- FIYMNUNPPYABMU-UHFFFAOYSA-N 2-benzyl-5-chloro-1h-indole Chemical compound C=1C2=CC(Cl)=CC=C2NC=1CC1=CC=CC=C1 FIYMNUNPPYABMU-UHFFFAOYSA-N 0.000 description 1
- MCRZWYDXIGCFKO-UHFFFAOYSA-N 2-butylpropanedioic acid Chemical compound CCCCC(C(O)=O)C(O)=O MCRZWYDXIGCFKO-UHFFFAOYSA-N 0.000 description 1
- BWOITHKYQUJGSB-UHFFFAOYSA-N 2-methylbutan-2-ylperoxycyclohexane Chemical compound CCC(C)(C)OOC1CCCCC1 BWOITHKYQUJGSB-UHFFFAOYSA-N 0.000 description 1
- MWQYGACKKVIKFC-UHFFFAOYSA-N 3-butylperoxycarbonylbenzoic acid Chemical group CCCCOOC(=O)C1=CC=CC(C(O)=O)=C1 MWQYGACKKVIKFC-UHFFFAOYSA-N 0.000 description 1
- 229940090248 4-hydroxybenzoic acid Drugs 0.000 description 1
- QLZINFDMOXMCCJ-UHFFFAOYSA-N 7-(7-hydroxyheptylperoxy)heptan-1-ol Chemical compound OCCCCCCCOOCCCCCCCO QLZINFDMOXMCCJ-UHFFFAOYSA-N 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- FERIUCNNQQJTOY-UHFFFAOYSA-M Butyrate Chemical compound CCCC([O-])=O FERIUCNNQQJTOY-UHFFFAOYSA-M 0.000 description 1
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Natural products CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 1
- DBJFSFSBHGPDPG-UHFFFAOYSA-N C(C(=C)C)(=O)OCCCC(C(OC)(OC)OC)CCCCCCCC Chemical compound C(C(=C)C)(=O)OCCCC(C(OC)(OC)OC)CCCCCCCC DBJFSFSBHGPDPG-UHFFFAOYSA-N 0.000 description 1
- XVUNJOUEZSHVOQ-UHFFFAOYSA-N C(CCCCCCC)(=O)OO.C1(=CC=CC=C1)C(C)C Chemical compound C(CCCCCCC)(=O)OO.C1(=CC=CC=C1)C(C)C XVUNJOUEZSHVOQ-UHFFFAOYSA-N 0.000 description 1
- APARLUYYRFOLNU-UHFFFAOYSA-N CN1CCC(CC1)OC(=O)CCCCCCCCC(=O)O Chemical compound CN1CCC(CC1)OC(=O)CCCCCCCCC(=O)O APARLUYYRFOLNU-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920001651 Cyanoacrylate Polymers 0.000 description 1
- MHZGKXUYDGKKIU-UHFFFAOYSA-N Decylamine Chemical compound CCCCCCCCCCN MHZGKXUYDGKKIU-UHFFFAOYSA-N 0.000 description 1
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- MWCLLHOVUTZFKS-UHFFFAOYSA-N Methyl cyanoacrylate Chemical compound COC(=O)C(=C)C#N MWCLLHOVUTZFKS-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-N Sulfurous acid Chemical compound OS(O)=O LSNNMFCWUKXFEE-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- NFCXVNJSAQUFJH-UHFFFAOYSA-N [Sn+4].[Sn+4].[Sn+4].[O-]P([O-])[O-].[O-]P([O-])[O-].[O-]P([O-])[O-].[O-]P([O-])[O-] Chemical compound [Sn+4].[Sn+4].[Sn+4].[O-]P([O-])[O-].[O-]P([O-])[O-].[O-]P([O-])[O-].[O-]P([O-])[O-] NFCXVNJSAQUFJH-UHFFFAOYSA-N 0.000 description 1
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 229920001893 acrylonitrile styrene Polymers 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 150000001449 anionic compounds Chemical group 0.000 description 1
- RQPZNWPYLFFXCP-UHFFFAOYSA-L barium dihydroxide Chemical compound [OH-].[OH-].[Ba+2] RQPZNWPYLFFXCP-UHFFFAOYSA-L 0.000 description 1
- 229910001863 barium hydroxide Inorganic materials 0.000 description 1
- AYJRCSIUFZENHW-DEQYMQKBSA-L barium(2+);oxomethanediolate Chemical compound [Ba+2].[O-][14C]([O-])=O AYJRCSIUFZENHW-DEQYMQKBSA-L 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- UHOVQNZJYSORNB-UHFFFAOYSA-N benzene Substances C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- OSIVCXJNIBEGCL-UHFFFAOYSA-N bis(2,2,6,6-tetramethyl-1-octoxypiperidin-4-yl) decanedioate Chemical compound C1C(C)(C)N(OCCCCCCCC)C(C)(C)CC1OC(=O)CCCCCCCCC(=O)OC1CC(C)(C)N(OCCCCCCCC)C(C)(C)C1 OSIVCXJNIBEGCL-UHFFFAOYSA-N 0.000 description 1
- XITRBUPOXXBIJN-UHFFFAOYSA-N bis(2,2,6,6-tetramethylpiperidin-4-yl) decanedioate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)CCCCCCCCC(=O)OC1CC(C)(C)NC(C)(C)C1 XITRBUPOXXBIJN-UHFFFAOYSA-N 0.000 description 1
- 238000000071 blow moulding Methods 0.000 description 1
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical group C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- ADKBGLXGTKOWIU-UHFFFAOYSA-N butanediperoxoic acid Chemical compound OOC(=O)CCC(=O)OO ADKBGLXGTKOWIU-UHFFFAOYSA-N 0.000 description 1
- FSRYENDEMMDKMT-UHFFFAOYSA-N butoxy ethaneperoxoate Chemical group CCCCOOOC(C)=O FSRYENDEMMDKMT-UHFFFAOYSA-N 0.000 description 1
- BXIQXYOPGBXIEM-UHFFFAOYSA-N butyl 4,4-bis(tert-butylperoxy)pentanoate Chemical compound CCCCOC(=O)CCC(C)(OOC(C)(C)C)OOC(C)(C)C BXIQXYOPGBXIEM-UHFFFAOYSA-N 0.000 description 1
- UPIWXMRIPODGLE-UHFFFAOYSA-N butyl benzenecarboperoxoate Chemical group CCCCOOC(=O)C1=CC=CC=C1 UPIWXMRIPODGLE-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 235000010216 calcium carbonate Nutrition 0.000 description 1
- FNAQSUUGMSOBHW-UHFFFAOYSA-H calcium citrate Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O.[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O FNAQSUUGMSOBHW-UHFFFAOYSA-H 0.000 description 1
- 239000001354 calcium citrate Substances 0.000 description 1
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 1
- 239000000920 calcium hydroxide Substances 0.000 description 1
- 235000011116 calcium hydroxide Nutrition 0.000 description 1
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- 235000012255 calcium oxide Nutrition 0.000 description 1
- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical compound [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 description 1
- 239000008116 calcium stearate Substances 0.000 description 1
- 235000013539 calcium stearate Nutrition 0.000 description 1
- PYSZASIZWHHPHJ-UHFFFAOYSA-L calcium;phthalate Chemical compound [Ca+2].[O-]C(=O)C1=CC=CC=C1C([O-])=O PYSZASIZWHHPHJ-UHFFFAOYSA-L 0.000 description 1
- SHZIWNPUGXLXDT-UHFFFAOYSA-N caproic acid ethyl ester Natural products CCCCCC(=O)OCC SHZIWNPUGXLXDT-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229960003260 chlorhexidine Drugs 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000003484 crystal nucleating agent Substances 0.000 description 1
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- GDVKFRBCXAPAQJ-UHFFFAOYSA-A dialuminum;hexamagnesium;carbonate;hexadecahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Al+3].[Al+3].[O-]C([O-])=O GDVKFRBCXAPAQJ-UHFFFAOYSA-A 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 229960001545 hydrotalcite Drugs 0.000 description 1
- 229910001701 hydrotalcite Inorganic materials 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- OXUCOTSGWGNWGC-UHFFFAOYSA-N octane Chemical compound CCCCCCC[CH2-] OXUCOTSGWGNWGC-UHFFFAOYSA-N 0.000 description 1
- 150000002891 organic anions Chemical group 0.000 description 1
- 150000002923 oximes Chemical class 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000001782 photodegradation Methods 0.000 description 1
- OXNIZHLAWKMVMX-UHFFFAOYSA-N picric acid Chemical compound OC1=C([N+]([O-])=O)C=C([N+]([O-])=O)C=C1[N+]([O-])=O OXNIZHLAWKMVMX-UHFFFAOYSA-N 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920002098 polyfluorene Polymers 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- SCUZVMOVTVSBLE-UHFFFAOYSA-N prop-2-enenitrile;styrene Chemical compound C=CC#N.C=CC1=CC=CC=C1 SCUZVMOVTVSBLE-UHFFFAOYSA-N 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 238000003303 reheating Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- YXFVVABEGXRONW-UHFFFAOYSA-N toluene Substances CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 235000013337 tricalcium citrate Nutrition 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
- B32B7/027—Thermal properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/306—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl acetate or vinyl alcohol (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
- B32B2307/412—Transparent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2581/00—Seals; Sealing equipment; Gaskets
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photovoltaic Devices (AREA)
- Laminated Bodies (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
Abstract
Description
本發明係關於一種封裝材薄片。 The present invention relates to a package sheet.
太陽能電池模組係使用將封裝材薄片積層於包含單晶矽或多晶矽等之半導體晶圓的太陽能電池元件兩面、使玻璃或背面薄片等之保護構件重疊於該封裝材薄片之上下面而予以積層一體化者。 The solar cell module is formed by laminating a package material sheet on both sides of a solar cell element including a semiconductor wafer such as a single crystal germanium or a polycrystalline silicon, and superposing a protective member such as a glass or a back sheet on the underside of the package sheet. Integrator.
由於太陽能電池模組係曝露於高溫、高濕、紫外線、風雨之屋外的嚴苛環境下,歷經長期間使用,於封裝材要求所謂不會因水分、紫外線等而變質的耐候性或耐熱性、對保護構件或太陽能電池元件之接著力、由外部衝撞保護太陽能電池元件之柔軟性等。又,亦要求電氣絕緣電阻性或使光充分到達太陽能電池元件之透明性。 Since the solar cell module is exposed to high temperatures, high humidity, ultraviolet rays, and wind and rain, it has been used for a long period of time, and the package material requires weather resistance or heat resistance which is not deteriorated by moisture, ultraviolet rays, or the like. The adhesion of the protective member or the solar cell element, the flexibility of the solar cell element by external impact, and the like. Further, electrical insulation resistance or transparency of the solar cell element is required to be sufficiently obtained.
作為以低成本而符合上述要求特性之樹脂,主要使用乙烯-乙酸乙烯酯共聚物。但是,乙烯-乙酸乙烯酯共聚物係因滲入模組內部的水分所造成的水解、或因紫外線引起分解而副反應產生乙酸等之酸,該酸成為太陽能電池元件劣化或電極腐蝕之原因,使模組發電性能降低。 As the resin which meets the above-mentioned required characteristics at a low cost, an ethylene-vinyl acetate copolymer is mainly used. However, the ethylene-vinyl acetate copolymer generates an acid such as acetic acid due to hydrolysis due to moisture infiltrated into the inside of the module or decomposition by ultraviolet rays, and the acid causes deterioration of the solar cell element or corrosion of the electrode. Module power generation performance is reduced.
於專利文獻1中,提案將平均粒徑5μm以下之 酸受體(acid acceptor)粒子分散於乙烯-乙酸乙烯酯共聚物中,減低封裝材中之游離狀態的酸成分。 Patent Document 1 proposes an average particle diameter of 5 μm or less. The acid acceptor particles are dispersed in the ethylene-vinyl acetate copolymer to reduce the free acid component in the package.
[專利文獻1]日本特開2005-029588號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2005-029588
然而,於專利文獻1記載的封裝材中,由於酸產生源之乙烯-乙酸乙烯酯共聚物層與太陽能電池元件、電極接觸,有防止太陽能電池元件劣化、電極腐蝕為不充分之問題。 However, in the package material described in Patent Document 1, since the ethylene-vinyl acetate copolymer layer of the acid generation source is in contact with the solar cell element or the electrode, there is a problem that the solar cell element is prevented from being deteriorated and the electrode corrosion is insufficient.
有鑑於如上述之習知技術的問題點,於本發明中,目的在於提供一種封裝材薄片及使用其而得之太陽能電池模組,該封裝材薄片不會損害高的透明性,即使在高溫高濕下長期使用之情形,太陽能電池元件之劣化亦少,能夠維持高的發電性能。 In view of the problems of the prior art as described above, in the present invention, an object of the present invention is to provide a package sheet and a solar cell module using the same, which does not impair high transparency even at high temperatures. In the case of long-term use under high humidity, the deterioration of the solar cell element is small, and high power generation performance can be maintained.
本發明人等為了達成上述目的而進行鑽研探討,發現藉由採取以下之構成而能解決上述課題。 The present inventors have conducted intensive studies to achieve the above object, and have found that the above problems can be solved by adopting the following configuration.
亦即,關於本發明之封裝材薄片係如下所述。 That is, the package sheet of the present invention is as follows.
一種封裝材薄片,其特徵係具有層A及層B之封裝材薄片,該層A係以乙烯-乙酸乙烯酯共聚物作為主要成分之層, 該層B係以乙烯-乙酸乙烯酯共聚物以外的熱塑性樹脂作為主要成分而更含有酸受體之層。 A package sheet characterized by a package sheet of layer A and layer B, the layer A being a layer comprising an ethylene-vinyl acetate copolymer as a main component. This layer B is a layer containing an acid acceptor as a main component of a thermoplastic resin other than the ethylene-vinyl acetate copolymer.
若根據本發明,目的在於提供一種封裝材薄片、及使用其之太陽能電池模組,該封裝材薄片不會損害高的透明性,即使在高溫高濕下長期使用之情形,太陽能電池元件之劣化亦少,能夠維持高的發電性能。 According to the present invention, it is an object of the invention to provide a package sheet and a solar cell module using the same, which does not impair high transparency, and deteriorates solar cell elements even in a long-term use under high temperature and high humidity. It is also rare to maintain high power generation performance.
10‧‧‧封裝材薄片 10‧‧‧Package sheet
11‧‧‧層A 11‧‧‧A
12‧‧‧層B 12‧‧‧Layer B
101‧‧‧受光面側封裝材薄片 101‧‧‧Light-emitting side packaging material sheet
102‧‧‧背面側封裝材薄片 102‧‧‧ Back side packaging material sheet
20‧‧‧太陽能電池模組 20‧‧‧Solar battery module
21‧‧‧透明保護構件 21‧‧‧Transparent protective components
22‧‧‧太陽能電池元件 22‧‧‧Solar battery components
23‧‧‧背面保護構件 23‧‧‧Back protection member
第1圖係本發明之封裝材薄片剖面的示意圖。 BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing a cross section of a package sheet of the present invention.
第2圖係使用本發明之封裝材薄片的太陽能電池模組剖面的示意圖。 Fig. 2 is a schematic view showing a cross section of a solar cell module using the package sheet of the present invention.
關於本發明之封裝材薄片,其特徵係具有層A及層B之封裝材薄片,該層A係以乙烯-乙酸乙烯酯共聚物作為主要成分之層,該層B係以乙烯-乙酸乙烯酯共聚物以外的熱塑性樹脂作為主要成分而更含有酸受體之層。 The package sheet of the present invention is characterized by having a package sheet of layer A and layer B, the layer A being a layer mainly composed of an ethylene-vinyl acetate copolymer, and the layer B is ethylene-vinyl acetate. A thermoplastic resin other than the copolymer contains, as a main component, a layer of an acid acceptor.
以下,針對本發明之封裝材薄片、及太陽能電池模組加以說明。 Hereinafter, the package sheet and the solar cell module of the present invention will be described.
<封裝材薄片> <Package Sheet>
層A係以乙烯-乙酸乙烯酯共聚物作為主要成分之層。於此,所謂以乙烯-乙酸乙烯酯共聚物作為主要成分之層係意指於層中之全部成分100質量%中,含有50質量% 以上100質量%以下之乙烯-乙酸乙烯酯共聚物。重要的是,層A係以乙烯-乙酸乙烯酯共聚物作為主要成分,於層A未符合該條件之情形下,將此類封裝材薄片組裝進太陽能電池模組之情形,有損害由外部衝撞保護太陽能電池的柔軟性等之問題。層A中之乙烯-乙酸乙烯酯共聚物之含量較佳為70質量%以上99.5質量%以下,更佳為90質量%以上99質量%以下。 Layer A is a layer having an ethylene-vinyl acetate copolymer as a main component. Here, the layer having the ethylene-vinyl acetate copolymer as a main component means that 50% by mass of all the components in the layer is contained in 100% by mass. The above 100% by mass or less of the ethylene-vinyl acetate copolymer. It is important that layer A is based on an ethylene-vinyl acetate copolymer as a main component, and in the case where layer A does not meet the conditions, such a package sheet is assembled into a solar cell module, and damage is caused by external collision. Protects the softness of solar cells and the like. The content of the ethylene-vinyl acetate copolymer in the layer A is preferably 70% by mass or more and 99.5% by mass or less, more preferably 90% by mass or more and 99% by mass or less.
層A之主要成分的乙烯-乙酸乙烯酯共聚物之乙酸乙烯酯含率,於將乙烯-乙酸乙烯酯共聚物設為100質量%之際,較佳為15至40質量%。若層A之主要成分的乙烯-乙酸乙烯酯共聚物之乙酸乙烯酯含率低於15質量%,有太陽能電池模組之透明性降低、太陽能電池模組之發電性能降低之情形;又若超過40質量%,在太陽能電池模組製作步驟中有作業性降低之情形。層A之主要成分的乙烯-乙酸乙烯酯共聚物的乙酸乙烯酯含率更佳為20質量%以上35質量%以下,特佳為25質量%以上33質量%以下。 The vinyl acetate content of the ethylene-vinyl acetate copolymer of the main component of the layer A is preferably 15 to 40% by mass when the ethylene-vinyl acetate copolymer is 100% by mass. If the ethylene-vinyl acetate copolymer having a main component of the layer A has a vinyl acetate content of less than 15% by mass, the transparency of the solar cell module is lowered, and the power generation performance of the solar cell module is lowered; 40% by mass, the workability is lowered in the solar cell module manufacturing step. The vinyl acetate-containing copolymer of the main component of the layer A preferably has a vinyl acetate content of 20% by mass or more and 35% by mass or less, particularly preferably 25% by mass or more and 33% by mass or less.
又,該層A之厚度較佳為0.1mm以上1.0mm以下。若層A之厚度低於0.1mm,在太陽能電池模組製作步驟中,於積層時,有太陽能電池元件破損的情況;於層A之厚度超過1.0mm之情形,有成為成本提高之主因的情況。層A之厚度更佳為0.1mm以上0.7mm以下,特佳為0.3mm以上0.5mm以下。 Further, the thickness of the layer A is preferably 0.1 mm or more and 1.0 mm or less. If the thickness of the layer A is less than 0.1 mm, in the solar cell module manufacturing step, when the layer is laminated, the solar cell element is broken. When the thickness of the layer A exceeds 1.0 mm, there is a case where the cost is increased. . The thickness of the layer A is more preferably 0.1 mm or more and 0.7 mm or less, and particularly preferably 0.3 mm or more and 0.5 mm or less.
又,該層A中較佳為含有有機過氧化物。層A含有有機過氧化物之情形,在太陽能電池模組製作步驟 中,藉由加熱封裝材薄片而能夠使層A中之乙烯-乙酸乙烯酯共聚物交聯,能夠表現耐熱性或耐候性等。 Further, it is preferable that the layer A contains an organic peroxide. Layer A contains organic peroxide, in the solar cell module manufacturing steps In the middle, the ethylene-vinyl acetate copolymer in the layer A can be crosslinked by heating the sealing material sheet, and heat resistance, weather resistance, and the like can be expressed.
雖然作為適於使層A中含有之有機過氧化物並未被特別限制,但考量製造封裝材薄片時之溫度、製作太陽能電池模組時之加熱、貼合溫度、儲藏安定性等而加以選擇。尤其,較佳為半衰期10小時之分解溫度為70℃以上之有機過氧化物。作為此類有機過氧化物之例,可舉出過氧化二異丙苯、2,5-二氫過氧化-2,5-二甲基己烷、2,5-二甲基-2,5-雙(三級丁基過氧)己烷、2,5-二甲基-2,5-雙(三級丁基過氧)己烷-3-二(三級丁基)過氧化物、過氧化二(三級丁基)、三級丁基過氧化異丙苯基、2,5-二甲基-2,5-二(三級丁基過氧)己烷、α,α’-雙(三級丁基過氧異丙基)苯、正丁基-4,4-雙(三級丁基過氧)戊酸酯、2,2-雙(三級丁基過氧)丁烷、1,1-雙(三級丁基過氧)環己烷、1,1-雙(三級丁基過氧)-3,3,5-三甲基環己烷、三級丁基過氧苯甲酸酯、過氧化苯甲醯、三級丁基過氧乙酸酯、甲基乙基酮過氧化物、2,5-二甲基-2,5-雙(三級丁基過氧)-3,3,5-三甲基環己烷、1,1-雙(三級丁基過氧)環己烷、甲基乙基酮過氧化物、2,5-二甲基己基-2,5-雙過氧基苯甲酸酯、氫過氧化三級丁基、氫過氧化對烷(menthane)、過氧化對氯苯甲醯基、過氧化羥基庚基、過氧化氯己酮、過氧化辛醯基、過氧化癸醯基、過氧化月桂醯基、異丙苯過氧辛酸酯、過氧化琥珀酸、三級丁基過氧順丁烯二酸、過氧化乙醯基、三級丁基過氧(2-乙基己酸酯)、過氧化間甲苯醯基、三級丁基過氧異丁酸酯、過氧化 -2,4-二氯苯甲醯基、三級丁基過氧異丙基碳酸酯、三級丁基過氧-2-乙基己基碳酸酯、2,5-二甲基-2,5-雙(苯甲醯基過氧)己烷、三級丁基過氧異壬酸酯、三級丁基過氧苯甲酸酯、1,1-雙(三級戊基過氧)環己烷、乙基-3,3-二(三級丁基過氧)丁酸酯等。該等有機過氧化物亦可組合2種以上而含有。 Although the organic peroxide contained in the layer A is not particularly limited, it is selected in consideration of the temperature at which the package sheet is produced, the heating when the solar cell module is fabricated, the bonding temperature, the storage stability, and the like. . In particular, an organic peroxide having a half-life of 10 hours and a decomposition temperature of 70 ° C or more is preferred. Examples of such an organic peroxide include dicumyl peroxide, 2,5-dihydroperoxy-2,5-dimethylhexane, and 2,5-dimethyl-2,5. - bis (tertiary butyl peroxy) hexane, 2,5-dimethyl-2,5-bis(tertiary butylperoxy)hexane-3-di(tertiary butyl) peroxide, Di(tributyl) peroxide, tributyl butyl peroxyphenyl, 2,5-dimethyl-2,5-di(tri-butylperoxy)hexane, α,α'- Bis(tris-butylperoxyisopropyl)benzene, n-butyl-4,4-bis(tertiary butylperoxy)valerate, 2,2-bis(tertiary butylperoxy)butane 1,1-bis(tri-butylperoxy)cyclohexane, 1,1-bis(tertiary butylperoxy)-3,3,5-trimethylcyclohexane, tert-butyl Oxybenzoic acid ester, benzammonium peroxide, tertiary butyl peroxyacetate, methyl ethyl ketone peroxide, 2,5-dimethyl-2,5-bis (tributyl) Oxygen)-3,3,5-trimethylcyclohexane, 1,1-bis(tri-butylperoxy)cyclohexane, methyl ethyl ketone peroxide, 2,5-dimethylhexyl -2,5-diperoxybenzoate, tertiary butyl hydroperoxide, hydroperoxide pair Menchhane, p-chlorobenzylidene peroxide, hydroxyheptyl peroxide, chlorhexidine peroxide, octyl sulfoxide, ruthenium peroxide, ruthenium peroxide, cumene peroxyoctanoate , peroxy succinic acid, tertiary butyl peroxy maleic acid, ethoxylated oxime, tertiary butyl peroxy (2-ethylhexanoate), m-toluene peroxide, tertiary butyl Base peroxyisobutyrate, peroxy-2,4-dichlorobenzylidene, tert-butylperoxyisopropyl carbonate, tert-butylperoxy-2-ethylhexyl carbonate, 2 , 5-dimethyl-2,5-bis(benzylidene peroxy)hexane, tertiary butyl peroxyisophthalate, tertiary butyl peroxybenzoate, 1,1-double (tertiary pentylperoxy)cyclohexane, ethyl-3,3-di(tri-butylperoxy)butyrate, and the like. These organic peroxides may be contained in combination of two or more kinds.
相對於層A中之乙烯-乙酸乙烯酯共聚物100重量份而言,該等有機過氧化物的層A中之含量較佳為0.1至5質量份,更佳為0.1至3質量份,特佳為0.1至2質量份。相對於層A中之乙烯-乙酸乙烯酯共聚物100重量份而言,若層A中之有機過氧化物之含量低於0.1質量份,則有無法使乙烯-乙酸乙烯酯共聚物交聯之情形;即使含有超過5質量份,除了其含有效果低之外,亦有未分解之有機過氧化物殘存於層A中而成為逐年劣化之原因的可能性。 The content of the layer A of the organic peroxide is preferably from 0.1 to 5 parts by mass, more preferably from 0.1 to 3 parts by mass, based on 100 parts by weight of the ethylene-vinyl acetate copolymer in the layer A. It is preferably 0.1 to 2 parts by mass. With respect to 100 parts by weight of the ethylene-vinyl acetate copolymer in the layer A, if the content of the organic peroxide in the layer A is less than 0.1 part by mass, the ethylene-vinyl acetate copolymer may not be crosslinked. In other cases, even if it contains more than 5 parts by mass, in addition to the low effect of the inclusion, there is a possibility that the undecomposed organic peroxide remains in the layer A and becomes a cause of deterioration year by year.
又,該層A較佳為更含有交聯助劑。於此,所謂交聯助劑係意指分子內具有複數不飽和鍵之多官能性單體。分子內具有複數不飽和鍵之多官能性單體能夠與因有機過氧化物分解所產生的活性自由基化合物反應,使乙烯-乙酸乙烯酯共聚物均一而有效率地交聯。作為該等交聯助劑之例,可舉出三烯丙基異氰酸酯、三烯丙基氰酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、三[(甲基)丙烯醯氧基(acryloyloxy)乙基]異氰酸酯、二羥甲基丙烷四(甲基)丙烯酸酯、季戊四醇四(甲基)丙烯酸酯、季戊四醇乙氧基四(甲基)丙烯酸 酯、二季戊四醇五(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、二乙烯基苯等。該等交聯助劑可以各自單獨使用,亦可併用2種以上。 Further, the layer A preferably further contains a crosslinking assistant. Here, the crosslinking assistant means a polyfunctional monomer having a plurality of unsaturated bonds in the molecule. The polyfunctional monomer having a plurality of unsaturated bonds in the molecule can react with the living radical compound produced by decomposition of the organic peroxide to uniformly and efficiently crosslink the ethylene-vinyl acetate copolymer. Examples of such crosslinking assistants include triallyl isocyanate, triallyl cyanate, trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, and three. [(Meth)acryloyloxyethyl]isocyanate, dimethylolpropane tetra(meth)acrylate, pentaerythritol tetra(meth)acrylate, pentaerythritol ethoxytetra(meth)acrylic acid Ester, dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, divinyl benzene, and the like. These crosslinking assistants may be used alone or in combination of two or more.
又,於該層A中,更佳為更含有紫外線吸收劑。紫外線吸收劑係吸收照射光中之有害的紫外線,在分子內轉換成無害的熱能而防止高分子中之光劣化起始的活性種被激發之物。作為紫外線吸收劑能夠使用已知之物。例如,能夠使用二苯甲酮系、苯并三唑系、三系、水楊酸系、氰基丙烯酸酯系等。可以使用該等之1種,亦可組合2種以上而使用。 Further, in the layer A, it is more preferable to further contain an ultraviolet absorber. The ultraviolet absorbing agent absorbs harmful ultraviolet rays in the illuminating light and converts it into harmless heat energy in the molecule to prevent the active species which are initiated by photodegradation in the polymer from being excited. Known things can be used as the ultraviolet absorber. For example, a benzophenone type, a benzotriazole type, or a third can be used. System, salicylic acid, cyanoacrylate, and the like. One type of these may be used, or two or more types may be used in combination.
從紫外線吸收效果、與紫外線吸收劑本身的著色之觀點,在該等紫外線吸收劑之中,最好為二苯甲酮系之紫外線吸收劑。 From the viewpoint of the ultraviolet absorbing effect and the coloring of the ultraviolet absorbing agent itself, among these ultraviolet absorbing agents, a benzophenone-based ultraviolet absorbing agent is preferable.
相對於層A中之乙烯-乙酸乙烯酯共聚物100質量份而言,層A中之紫外線吸收劑之含量較佳為0.1至3質量份,更佳為0.1至2.0質量份。若層A中之紫外線吸收劑之含量低於0.1質量份,由於含有效果低,故不佳;若超過3質量份,由於有著色的傾向,故不佳。 The content of the ultraviolet absorber in the layer A is preferably from 0.1 to 3 parts by mass, more preferably from 0.1 to 2.0 parts by mass, per 100 parts by mass of the ethylene-vinyl acetate copolymer in the layer A. When the content of the ultraviolet absorber in the layer A is less than 0.1 part by mass, the effect is low because it is low, and if it is more than 3 parts by mass, it tends to be colored because it tends to be colored.
又,於該層A中較佳為含有光安定劑。光安定劑係捕捉對聚合物有害的自由基種而使其不產生新的自由基者。作為光安定劑,較佳使用受阻胺系光安定劑。 Further, it is preferable that the layer A contains a photostabilizer. Light stabilizers are those that capture free radical species that are harmful to the polymer so that no new free radicals are produced. As the light stabilizer, a hindered amine light stabilizer is preferably used.
作為受阻胺系光安定劑,可舉出癸二酸雙(2,2,6,6-四甲基-1-(辛氧基)-4-哌啶基)酯、包含氫過氧化-1,1-二甲基乙基及辛烷之反應生成物70質量%與聚丙烯30質量%者、雙(1,2,2,6,6-五甲基-4-哌啶基)[[3,5-雙(1,1- 二甲基乙基)-4-羥基苯基]甲基]丁基丙二酸酯、雙(1,2,2,6,6-五甲基-4-哌啶基)癸二酸酯及甲基-1,2,2,6,6-五甲基-4-哌啶基癸二酸酯混合物等。上述之受阻胺系光安定劑可以單獨使用1種,亦可混合2種以上而使用。 Examples of the hindered amine light stabilizer include bis(2,2,6,6-tetramethyl-1-(octyloxy)-4-piperidyl) sebacate and hydroperoxide-1. , 70% by mass of the reaction product of 1-dimethylethyl and octane and 30% by mass of polypropylene, bis(1,2,2,6,6-pentamethyl-4-piperidinyl)[[ 3,5-double (1,1- Dimethylethyl)-4-hydroxyphenyl]methyl]butylmalonate, bis(1,2,2,6,6-pentamethyl-4-piperidyl)sebacate and A mixture of methyl-1,2,2,6,6-pentamethyl-4-piperidinyl sebacate, and the like. The above-mentioned hindered amine-based light stabilizer may be used singly or in combination of two or more.
該等之中,作為受阻胺系光安定劑,較佳為使用雙(1,2,2,6,6-五甲基-4-哌啶基)癸二酸酯及甲基-1,2,2,6,6-五甲基-4-哌啶基癸二酸酯之混合物、以及甲基-4-哌啶基癸二酸酯、雙(2,2,6,6-四甲基-4-哌啶基)癸二酸酯。又,受阻胺系光安定劑較佳為使用熔點為60℃以上者。 Among these, as the hindered amine light stabilizer, bis(1,2,2,6,6-pentamethyl-4-piperidyl)sebacate and methyl-1,2 are preferably used. , a mixture of 2,6,6-pentamethyl-4-piperidinyl sebacate, and methyl-4-piperidinyl sebacate, bis(2,2,6,6-tetramethyl 4-piperidinyl) sebacate. Further, the hindered amine light stabilizer is preferably one having a melting point of 60 ° C or higher.
相對於層A中之乙烯-乙酸乙烯酯共聚物100質量份而言,層A中之受阻胺系光安定劑之含量較佳為0.1至3.0質量份,更佳為0.1至2.0質量份。若層A中之受阻胺系光安定劑之含量為低於0.1質量份,安定化效果為不足;即使含有超過3.0質量份,亦僅成為著色或成本提高之主因。 The content of the hindered amine-based light stabilizer in the layer A is preferably from 0.1 to 3.0 parts by mass, more preferably from 0.1 to 2.0 parts by mass, based on 100 parts by mass of the ethylene-vinyl acetate copolymer in the layer A. When the content of the hindered amine light stabilizer in the layer A is less than 0.1 part by mass, the effect of stabilization is insufficient; even if it contains more than 3.0 parts by mass, it is only the main cause of coloring or cost increase.
另外於層A中,於不妨害本發明效果之範圍內,因應必要亦可含有作為已知的添加劑之抗氧化劑、難燃劑、難燃助劑、塑化劑、潤滑劑等。 Further, in the layer A, an antioxidant, a flame retardant, a flame retardant auxiliary, a plasticizer, a lubricant or the like which is a known additive may be contained as long as it does not impair the effects of the present invention.
層B係以乙烯-乙酸乙烯酯共聚物以外的熱塑性樹脂作為主要成分而更含有酸受體之層。 The layer B is a layer containing an acid acceptor as a main component and a thermoplastic resin other than the ethylene-vinyl acetate copolymer.
於此,所謂以乙烯-乙酸乙烯酯共聚物以外的熱塑性樹脂作為主要成分係意指在層中之全部成分100質量%中,含有50質量%以上100質量%以下之乙烯-乙酸乙烯酯共聚物以外的熱塑性樹脂。重要的是,層B係以乙 烯-乙酸乙烯酯共聚物以外的熱塑性樹脂作為主要成分,若層B中使用乙烯-乙酸乙烯酯共聚物,將此類封裝材薄片組裝進太陽能電池模組之情形,由於該層B與太陽能電池元件、電極接觸,有無法防止太陽能電池元件劣化、電極腐蝕等之問題。層B中之乙烯-乙酸乙烯酯共聚物以外的熱塑性樹脂之含量較佳為70質量%以上99.5質量%以下,更佳為90質量%以上99.5質量%以下。 Here, the thermoplastic resin other than the ethylene-vinyl acetate copolymer as a main component means that the ethylene-vinyl acetate copolymer is contained in an amount of 50% by mass or more and 100% by mass or less based on 100% by mass of all the components in the layer. A thermoplastic resin other than the one. The important thing is that layer B is based on B. A thermoplastic resin other than the olefin-vinyl acetate copolymer is used as a main component, and if an ethylene-vinyl acetate copolymer is used in the layer B, such a package sheet is assembled into a solar cell module, since the layer B and the solar cell Contact between the element and the electrode may cause problems such as deterioration of the solar cell element and corrosion of the electrode. The content of the thermoplastic resin other than the ethylene-vinyl acetate copolymer in the layer B is preferably 70% by mass or more and 99.5% by mass or less, more preferably 90% by mass or more and 99.5% by mass or less.
作為該層B之主要成分的乙烯-乙酸乙烯酯共聚物以外的熱塑性樹脂,可舉出聚酯、聚苯乙烯、丙烯腈-苯乙烯共聚物、丙烯腈-丁二烯-苯乙烯共聚物等之苯乙烯系樹脂,聚乙烯、聚丙烯等之聚烯烴系樹脂,聚碳酸酯,聚醯胺,聚醚,聚胺基甲酸酯,聚苯硫醚,聚酯醯胺,聚醚酯,聚氯乙烯,聚甲基丙烯酸酯,改質聚苯醚,聚芳酯,聚碸,聚醚醯亞胺,聚醯胺醯亞胺,聚醯亞胺及以該等作為主要的成分之共聚物。又,該熱塑性樹脂能夠使用單獨1種或組合2種以上而使用。 Examples of the thermoplastic resin other than the ethylene-vinyl acetate copolymer as the main component of the layer B include polyester, polystyrene, acrylonitrile-styrene copolymer, acrylonitrile-butadiene-styrene copolymer, and the like. Styrene resin, polyolefin resin such as polyethylene or polypropylene, polycarbonate, polyamide, polyether, polyurethane, polyphenylene sulfide, polyester decylamine, polyether ester, Polyvinyl chloride, polymethacrylate, modified polyphenylene ether, polyarylate, polyfluorene, polyetherimine, polyamidimide, polyimine and copolymerization of these as main components Things. In addition, the thermoplastic resin can be used alone or in combination of two or more.
作為層B之主要成分的乙烯-乙酸乙烯酯共聚物以外的熱塑性樹脂,從減低在積層步驟的太陽能電池元件之損害、或提高透明性、生產性之觀點,較佳為聚烯烴系樹脂,特佳為聚乙烯。其中,密度為0.900g/cm3以下之範圍的超低密度聚乙烯、直鏈狀低密度聚乙烯,較佳為0.890g/cm3以下,更佳為0.870至0.885g/cm3之範圍。 The thermoplastic resin other than the ethylene-vinyl acetate copolymer which is a main component of the layer B is preferably a polyolefin resin from the viewpoint of reducing damage to the solar cell element in the lamination step or improving transparency and productivity. Good for polyethylene. Among them, the ultra-low density polyethylene and the linear low-density polyethylene having a density of 0.900 g/cm 3 or less are preferably 0.890 g/cm 3 or less, more preferably 0.870 to 0.885 g/cm 3 .
又,層B之主要成分的乙烯-乙酸乙烯酯共聚物以外的熱塑性樹脂之熔點(設為Tmb)較佳為較層A之 主要成分的乙烯-乙酸乙烯酯共聚物之熔點(設為Tma)為高。亦即,較佳為符合Tma<Tmb。更佳為符合Tma+10≦Tmb之型態,又更佳為符合Tma+10≦Tmb≦Tma+80之型態。若層B之主要成分的乙烯-乙酸乙烯酯共聚物以外的熱塑性樹脂之熔點為層A之主要成分的乙烯-乙酸乙烯酯共聚物之熔點以下(亦即,若為Tma≧Tmb),則在太陽能電池模組製作步驟中,連接至太陽能電池元件之層B會熔融而使層B之厚度成為不均,由於層A與太陽能電池元件直接連接,有減低層B中所含之酸受體的效果。 Further, the melting point (set to Tmb) of the thermoplastic resin other than the ethylene-vinyl acetate copolymer as the main component of the layer B is preferably the layer A The melting point (set to Tma) of the ethylene-vinyl acetate copolymer of the main component is high. That is, it is preferable to comply with Tma<Tmb. More preferably, it conforms to the Tma+10≦Tmb type, and more preferably conforms to the Tma+10≦Tmb≦Tma+80 type. If the melting point of the thermoplastic resin other than the ethylene-vinyl acetate copolymer of the main component of the layer B is below the melting point of the ethylene-vinyl acetate copolymer of the main component of the layer A (that is, if it is Tma≧Tmb), then In the solar cell module manufacturing step, the layer B connected to the solar cell element is melted to make the thickness of the layer B uneven, and since the layer A is directly connected to the solar cell element, the acid acceptor contained in the layer B is reduced. effect.
如上述,層B係以乙烯-乙酸乙烯酯共聚物以外的熱塑性樹脂作為主要成分,更含有酸受體之層。所謂於此所用之酸受體,一般而言,若為具有吸收或中和酸的功能之化合物,並未被特別限定,能夠使用任意之化合物。 As described above, the layer B contains a thermoplastic resin other than the ethylene-vinyl acetate copolymer as a main component and further contains a layer of an acid acceptor. The acid acceptor used herein is generally not particularly limited as long as it has a function of absorbing or neutralizing an acid, and any compound can be used.
作為層B所含之酸受體,可列舉週期表第(II)族金屬之氧化物、週期表第(II)族金屬之氫氧化物、週期表第(II)族金屬之碳酸鹽、週期表第(II)族金屬之羧酸鹽、週期表第(II)族金屬之硼酸鹽、週期表第(II)族金屬之矽酸鹽、週期表第(II)族金屬之亞磷酸鹽、週期表第(IV)族金屬之氧化物、週期表第(IV)族金屬之鹼性碳酸鹽、週期表第(IV)族金屬之鹼性羧酸鹽、週期表第(IV)族金屬之鹼性亞磷酸鹽、週期表第(IV)族金屬之鹼性亞硫酸鹽等、以通式(1)所示之Li-Al系包接化合物、以通式(2)所示之Li-Al系包接化合物。 Examples of the acid acceptor contained in the layer B include an oxide of a metal of the group (II) of the periodic table, a hydroxide of a metal of the group (II) of the periodic table, a carbonate of a metal of the group (II) of the periodic table, and a period. a carboxylate of a metal of Group (II), a borate of a metal of Group (II) of the periodic table, a citrate of a metal of Group (II) of the periodic table, a phosphite of a metal of Group (II) of the periodic table, An oxide of a metal of group (IV) of the periodic table, an alkali carbonate of a metal of group (IV) of the periodic table, an alkali carboxylate of a metal of group (IV) of the periodic table, and a metal of group (IV) of the periodic table An alkali phosphite, an alkali sulfite of a metal of Group (IV) of the periodic table, a Li-Al-based inclusion compound represented by the formula (1), and a Li- represented by the formula (2) The Al system encapsulates the compound.
通式(1):以MgxZnyAlz(OH)2(x+y)+3z-2CO3‧wH2O (1)(x與y係表示0至10之整數,但是x+y=1至10,z係表示1至5之整數,w係表示0至10之整數。)所表示的合成水滑石類;通式(2):[Al2Li(OH)6]nX‧mH2O (2)(式中,X係無機或有機之陰離子,n係陰離子X之價數,m係3以下之整數)。 Formula (1): Mg x Zn y Al z (OH) 2(x+y)+3z-2 CO 3 ‧wH 2 O (1) (x and y represent an integer of 0 to 10, but x+ y = 1 to 10, z represents an integer of 1 to 5, and w represents an integer of 0 to 10.) The synthetic hydrotalcite represented by the formula; (2): [Al 2 Li(OH) 6 ] n X ‧mH 2 O (2) (wherein X is an inorganic or organic anion, n is an valence of an anion X, and m is an integer of 3 or less).
作為此類酸受體的具體例,可舉出氧化鎂、氫氧化鎂、氫氧化鋇、碳酸鎂、碳酸鋇、生石灰、熟石灰、碳酸鈣、矽酸鈣、硬脂酸鈣、硬脂酸鋅、鄰苯二甲酸鈣、亞磷酸鈣、氧化錫、鹼性亞磷酸錫等。 Specific examples of such an acid acceptor include magnesium oxide, magnesium hydroxide, barium hydroxide, magnesium carbonate, barium carbonate, quicklime, slaked lime, calcium carbonate, calcium citrate, calcium stearate, and zinc stearate. , calcium phthalate, calcium phosphite, tin oxide, alkaline tin phosphite, and the like.
再者,針對通式(1)所示之Li-Al系包接化合物,例如,可舉出Mg3ZnAl2(OH)12CO3‧wH2O等。 In addition, as the Li-Al-based inclusion compound represented by the formula (1), for example, Mg 3 ZnAl 2 (OH) 12 CO 3 ‧ wH 2 O or the like can be given.
針對通式(2)所示之Li-Al系包接化合物,可舉出[Al2Li(OH)6]2X‧H2O等。 The Li-Al-based inclusion compound represented by the formula (2) may, for example, be [Al 2 Li(OH) 6 ] 2 X‧H 2 O or the like.
又,作為Li-Al系包接化合物之陰離子種,可舉出碳酸、硫酸、過氯酸、磷酸之含氧酸、乙酸、丙酸、己二酸、苯甲酸、鄰苯二甲酸、對苯二甲酸、順丁烯二酸、反丁烯二酸、琥珀酸、對羥基苯甲酸、水楊酸、苦味酸等。又,該等之酸受體能夠單獨地或混合2種以上而使用。 Further, examples of the anion species of the Li-Al-based inclusion compound include carbonic acid, sulfuric acid, perchloric acid, phosphoric acid oxyacid, acetic acid, propionic acid, adipic acid, benzoic acid, phthalic acid, and para-benzene. Dicarboxylic acid, maleic acid, fumaric acid, succinic acid, p-hydroxybenzoic acid, salicylic acid, picric acid, and the like. Further, these acid acceptors can be used singly or in combination of two or more kinds.
於此類酸受體中,層B中之酸受體較佳為使用選自包含週期表第(II)族金屬之氧化物、氫氧化物、碳 酸鹽、羧酸鹽、硼酸鹽、矽酸鹽、及亞磷酸鹽之群組的至少1種。 Among such acid acceptors, the acid acceptor in layer B is preferably an oxide, hydroxide or carbon selected from the group consisting of metals of group (II) of the periodic table. At least one of the group consisting of an acid salt, a carboxylate, a borate, a citrate, and a phosphite.
又,於酸受體為粒子之情形,作為該酸受體之平均粒徑並未被特別限定,但較佳的上限為平均粒徑5μm以下。於酸受體之平均粒徑較5μm為大之情形,有封裝材之透明性降低的情況,而有成為阻礙陽光入射太陽能電池元件之情形。 Further, when the acid acceptor is a particle, the average particle diameter of the acid acceptor is not particularly limited, but a preferred upper limit is an average particle diameter of 5 μm or less. When the average particle diameter of the acid acceptor is larger than 5 μm, the transparency of the encapsulating material may be lowered, and the solar cell element may be prevented from entering the sunlight.
針對層B中之酸受體,於將層B中之主要成分的熱塑性樹脂設為100質量份之際,層B中之酸受體之含量較佳為0.5質量份以下,更佳為0.01質量份以上0.3質量份以下。於將層B中之主要成分的熱塑性樹脂設為100質量份之際,若層B中之酸受體之含量較0.5質量份為多,則有封裝材薄片之透明性降低的情況,而有阻礙陽光入射太陽能電池元件之情形。 In the acid acceptor of the layer B, when the thermoplastic resin of the main component in the layer B is 100 parts by mass, the content of the acid acceptor in the layer B is preferably 0.5 parts by mass or less, more preferably 0.01 mass%. More than 0.3 parts by mass or less. When the amount of the acid acceptor in the layer B is more than 0.5 part by mass, the transparency of the package sheet is lowered when the amount of the thermoplastic resin in the layer B is 100 parts by mass. A situation in which sunlight is incident on a solar cell element.
又,該層B之厚度較佳為0.01mm以上1.0mm以下,更佳為0.05mm以上0.1mm以下。若層B之厚度低於0.01mm,則有吸收或中和酸之效果為不足之情形;若超過1.0mm,則有透明性降低、阻礙陽光入射太陽能電池元件之情形。 Further, the thickness of the layer B is preferably 0.01 mm or more and 1.0 mm or less, more preferably 0.05 mm or more and 0.1 mm or less. If the thickness of the layer B is less than 0.01 mm, the effect of absorbing or neutralizing the acid is insufficient, and if it exceeds 1.0 mm, the transparency is lowered and the sunlight is prevented from entering the solar cell element.
另外於層B中,在不妨害本發明效果之範圍內,因應必要亦可含有作為已知的添加劑之交聯劑、交聯助劑、抗氧化劑、難燃劑、難燃助劑、塑化劑、潤滑劑、結晶成核劑等。 Further, in the layer B, a crosslinking agent, a crosslinking assistant, an antioxidant, a flame retardant, a flame retardant, a plasticizer, which are known additives, may be contained as necessary within the range which does not impair the effects of the present invention. Agents, lubricants, crystal nucleating agents, and the like.
接著,針對本發明之封裝材薄片之製膜方法加以說明。 Next, a film forming method of the package sheet of the present invention will be described.
本發明之封裝材薄片係藉由使用T模頭擠出機、壓延成形機、吹塑成形機等之習知成形方法,無論為積層目的之多層,或是個別地成形各層薄片而積層該等皆能夠製造。亦即,封裝材薄片之積層方法能夠依照習知所謂的多層成形,亦能夠為將各層以各自的成形機成形後而積層之擠出積層方式。 The package sheet of the present invention is formed by a conventional molding method using a T-die extruder, a calender molding machine, a blow molding machine, or the like, regardless of the number of layers for the purpose of laminating, or by separately forming each layer of sheets. Can be manufactured. In other words, the method of laminating the package sheet can be carried out by a so-called multilayer molding, or can be an extrusion lamination method in which each layer is formed by a molding machine.
又,於本發明之封裝材薄片中,從太陽能電池模組製作時的作業或抽氣等之觀點,較佳為在單面或是雙面實施壓紋加工。還有,壓紋加工係採用習知之方法。例如,可舉出從T模頭等被擠出後立即利用成形輥進行壓紋加工之方法、或於將從T模頭等擠出的薄片再加熱後進行壓紋加工之方法。 Further, in the package sheet of the present invention, it is preferable to perform embossing on one side or both sides from the viewpoint of work at the time of production of the solar battery module or suction. Also, the embossing process is carried out by a conventional method. For example, a method of embossing by a forming roll immediately after being extruded from a T die or the like, or a method of embossing after reheating a sheet extruded from a T die or the like is performed.
接著,針對使用本發明之封裝材薄片之太陽能電池模組加以說明。還有,本發明之封裝材薄片無論作為在太陽能電池模組中配置於受光面側之封裝材薄片(以下,簡稱為受光面側封裝材薄片)使用,或作為配置於背面側之封裝材薄片使用皆為可能。 Next, a description will be given of a solar cell module using the package sheet of the present invention. In addition, the package sheet of the present invention is used as a package sheet (hereinafter simply referred to as a light-receiving side-side package sheet) disposed on the light-receiving surface side in the solar cell module, or as a package sheet disposed on the back side. It is possible to use.
顯示於第2圖之太陽能電池模組20,係具備利用受光面側封裝材薄片101所固定的透明保護構件21與利用背面側封裝材薄片102所固定的背面保護構件23,在受光面側封裝材薄片101及背面側封裝材薄片102之間配置太陽能電池元件22,使太陽能電池元件22之受光面側朝向透明保護構件21側而配置。 The solar battery module 20 shown in FIG. 2 includes a transparent protective member 21 fixed by the light-receiving surface side sealing material sheet 101 and a back surface protective member 23 fixed by the back side packaging material sheet 102, and is packaged on the light receiving surface side. The solar cell element 22 is disposed between the material sheet 101 and the back side package sheet 102, and the light receiving surface side of the solar cell element 22 is disposed toward the transparent protective member 21 side.
使用本發明之封裝材薄片所得之本發明之太陽能電池模組20係以如下方式來製造。 The solar cell module 20 of the present invention obtained by using the package sheet of the present invention is manufactured in the following manner.
製作一種積層體,其係以受光面側封裝材薄片101之層B 12成為太陽能電池元件22側、背面側封裝材薄片102之層B 12成為太陽能電池元件22側的方式,在太陽能電池元件22之外兩側配置受光面側封裝材薄片101、背面側封裝材薄片102,在受光面側封裝材薄片101、背面側封裝材薄片102之外面兩側配置透明保護構件21與背面保護構件23而成。 A layered body is formed in which the layer B 12 of the light-receiving side-side package sheet 101 is on the side of the solar cell element 22 and the layer B 12 of the back-side package sheet 102 is on the side of the solar cell element 22, and the solar cell element 22 is formed. The light-receiving surface side sealing material sheet 101 and the back side packaging material sheet 102 are disposed on the outer side, and the transparent protective member 21 and the back surface protective member 23 are disposed on both sides of the outer surface of the light receiving surface side sealing material sheet 101 and the back side packaging material sheet 102. to make.
接著,藉由利用真空積層機等,在溫度130至180℃、抽氣時間2至15分鐘加熱該積層體,接著以加壓壓力0.1至1.5kg/cm2、加壓時間8至45分鐘加熱加壓而壓黏,而能夠製造使用本發明之封裝材薄片所得之本發明之太陽能電池模組。加熱之溫度或時間能夠因應封裝材薄片之組成或厚度等而使其適度改變。 Next, the laminate is heated by a vacuum laminator or the like at a temperature of 130 to 180 ° C for 2 to 15 minutes, followed by heating at a pressurization pressure of 0.1 to 1.5 kg/cm 2 and a pressurization time of 8 to 45 minutes. The solar cell module of the present invention obtained by using the package sheet of the present invention can be produced by pressurization and pressure bonding. The temperature or time of heating can be moderately changed depending on the composition or thickness of the package sheet.
以下,藉由實施例及比較例而具體說明本發明。 Hereinafter, the present invention will be specifically described by way of examples and comparative examples.
(實施例1) (Example 1)
準備一種2層共擠出裝置,其係使2座擠出機透過進料構件(feed block)而連接至一個T模頭;作為層A成形用,將樹脂組成物供應至該等2座中之1座擠出機,該樹脂組成物係包含:100質量份之乙烯-乙酸乙烯酯共聚物(乙酸乙烯酯含率為28質量%、熔點71℃)、0.5質量份之作為交聯劑的2,5-二甲基-2,5-二(三級丁基過氧)己烷、0.2質量份之作為用以提高與玻璃基板的接著性之矽烷耦合劑的γ-甲基丙烯氧基(methacryloxy)丙基三甲氧基矽烷、0.1 質量份之作為紫外線吸收劑的2,2’-二羥基-4,4’-二(羥甲基)二苯甲酮、0.3質量份之作為光安定劑的雙(1,2,2,6,6-五甲基-4-哌啶基)癸二酸酯。 A 2-layer co-extrusion apparatus is prepared which connects two extruders to a T-die through a feed block; as a layer A for forming, a resin composition is supplied to the two seats In the extruder, the resin composition comprises 100 parts by mass of an ethylene-vinyl acetate copolymer (vinyl acetate content of 28% by mass, melting point of 71 ° C), and 0.5 parts by mass of a crosslinking agent. 2,5-Dimethyl-2,5-di(tri-butylperoxy)hexane, 0.2 parts by mass of γ-methylpropenyloxy group as a decane coupling agent for improving adhesion to a glass substrate (methacryloxy)propyltrimethoxydecane, 0.1 2 parts by mass of 2,2'-dihydroxy-4,4'-bis(hydroxymethyl)benzophenone as a UV absorber, and 0.3 parts by mass of double (1, 2, 2, 6 as a light stabilizer) , 6-pentamethyl-4-piperidinyl) sebacate.
作為層B成形用,將包含100質量份之超低密度聚乙烯(熔點115℃)、0.3質量份之作為酸受體的氫氧化鎂的樹脂組成物供應至另一座。 As a layer B, a resin composition containing 100 parts by mass of ultra low density polyethylene (melting point 115 ° C) and 0.3 parts by mass of magnesium hydroxide as an acid acceptor was supplied to the other seat.
接著,利用2座各自的擠出機,在120℃熔融混煉樹脂組成物,將熔融狀態之樹脂組成物供應至進料構件,藉由配置於進料構件尖端的T模頭,使層A之薄片厚度成為0.4mm、層B之薄片厚度成為0.05mm的方式來共擠出而製膜封裝材薄片10。然後,將剛藉由T模頭所共擠出之熔融狀態的封裝材薄片供應至壓紋輥與對向於該壓紋輥所配置的橡膠輥中間,使壓紋輥按壓於熔融狀態的封裝材薄片之層A側,在封裝材薄片之層A表面實施深度0.1mm之壓紋加工後,藉由以冷卻輥一面冷卻一面捲取而獲得厚度為0.45mm之2層的封裝材薄片。 Next, the resin composition was melt-kneaded at 120 ° C by two respective extruders, and the resin composition in a molten state was supplied to the feeding member, and the layer A was placed by the T-die disposed at the tip end of the feeding member. The package sheet 10 was formed by co-extrusion so that the sheet thickness became 0.4 mm and the sheet thickness of the layer B was 0.05 mm. Then, the package sheet of the molten state which has just been coextruded by the T die is supplied to the intermediate between the embossing roll and the rubber roll disposed opposite to the embossing roll, and the embossing roll is pressed against the molten state. On the layer A side of the material sheet, an embossing process having a depth of 0.1 mm was applied to the surface of the layer A of the package sheet, and then a two-layer package sheet having a thickness of 0.45 mm was obtained by winding on a cooling roll while being cooled.
(實施例2) (Example 2)
除了將層B之酸受體(氫氧化鎂)的添加量設為1.0質量份之外,與實施例1同樣地進行而製作封裝材薄片。 A package sheet was produced in the same manner as in Example 1 except that the amount of the acid acceptor (magnesium hydroxide) added to the layer B was 1.0 part by mass.
(實施例3) (Example 3)
除了將層B之酸受體的種類從氫氧化鎂變更成亞磷酸鈣之外,與實施例1同樣地進行而製作封裝材薄片。 A package sheet was produced in the same manner as in Example 1 except that the type of the acid acceptor of the layer B was changed from magnesium hydroxide to calcium phosphite.
(實施例4) (Example 4)
除了將層B之酸受體(氫氧化鎂)的添加量設為0.5質量份之外,與實施例1同樣地進行而製作封裝材薄片。 A package sheet was produced in the same manner as in Example 1 except that the amount of the acid acceptor (magnesium hydroxide) added to the layer B was 0.5 parts by mass.
(實施例5) (Example 5)
除了將層B主要成分之超低密度聚乙烯(熔點115℃)變更成直鏈狀低密度聚乙烯(熔點68℃)之外,與實施例1同樣地進行而製作封裝材薄片。 A package sheet was produced in the same manner as in Example 1 except that the ultra-low-density polyethylene (melting point: 115 ° C) of the main component of layer B was changed to a linear low-density polyethylene (melting point: 68 ° C).
(比較例1) (Comparative Example 1)
除了未添加層B之酸受體(氫氧化鎂)之外,與實施例1同樣地進行而製作封裝材薄片。 A package sheet was produced in the same manner as in Example 1 except that the acid acceptor (magnesium hydroxide) of the layer B was not added.
(比較例2) (Comparative Example 2)
準備一種單層擠出裝置,供應包含下列之樹脂組成物:100質量份之乙烯-乙酸乙烯酯共聚物(乙酸乙烯酯含率為28質量%)、0.5質量份之作為交聯劑的2,5-二甲基-2,5-二(三級丁基過氧)己烷、0.2質量份之作為用以提高與玻璃基板的接著性之矽烷耦合劑的γ-甲基丙烯氧基丙基三甲氧基矽烷、0.1質量份之作為紫外線吸收劑的2,2’-二羥基-4,4’-二(羥甲基)二苯甲酮、0.3質量份之作為光安定劑的雙(1,2,2,6,6-五甲基-4-哌啶基)癸二酸酯、及0.3質量份之作為酸受體的氫氧化鎂。 A single-layer extrusion apparatus was prepared, which supplied a resin composition comprising 100 parts by mass of an ethylene-vinyl acetate copolymer (vinyl acetate content of 28% by mass) and 0.5 parts by mass of a crosslinking agent 2, 5-Dimethyl-2,5-di(tri-butylperoxy)hexane, 0.2 parts by mass of γ-methacryloxypropyl group as a decane coupling agent for improving adhesion to a glass substrate Trimethoxy decane, 0.1 parts by mass of 2,2'-dihydroxy-4,4'-bis(hydroxymethyl)benzophenone as a UV absorber, and 0.3 parts by mass of a double as a light stabilizer , 2,2,6,6-pentamethyl-4-piperidinyl) sebacate, and 0.3 parts by mass of magnesium hydroxide as an acid acceptor.
接著,在120℃熔融混煉樹脂組成物,將熔融狀態之樹脂組成物供應至T模頭,擠出薄片厚度0.45mm而製膜封裝材薄片。然後,將剛從T模頭所共擠出之熔融狀態的封裝材薄片供應至壓紋輥與對向於該壓紋輥所配置的橡膠輥中間,使壓紋輥按壓於熔融狀態的封裝材薄片之層A側,在封裝材薄片之層A表面實施深度0.1mm之壓紋加工後,藉由以冷卻輥一面冷卻一面捲取而獲得厚度為0.45mm之單層封裝材薄片。 Next, the resin composition was melt-kneaded at 120 ° C, and the resin composition in a molten state was supplied to a T die, and the thickness of the sheet was extruded to 0.45 mm to form a film of the package. Then, the package sheet in a molten state which has just been coextruded from the T die is supplied to the intermediate portion of the embossing roll and the rubber roll disposed opposite to the embossing roll, and the embossing roll is pressed against the packaged material in a molten state. On the layer A side of the sheet, after embossing with a depth of 0.1 mm on the surface of the layer A of the package sheet, a single-layer package sheet having a thickness of 0.45 mm was obtained by winding on one side of the cooling roll while cooling.
(比較例3) (Comparative Example 3)
除了未添加層A之酸受體(氫氧化鎂)之外,與比較例2同樣地進行而製作封裝材薄片。 A package sheet was produced in the same manner as in Comparative Example 2 except that the acid acceptor (magnesium hydroxide) of the layer A was not added.
<封裝材薄片之全光線穿透率> <Full light transmittance of packaging sheet>
使用濁度計(NDH2000、日本電色工業製),根據JISK7361:1997而進行封裝材薄片厚度方向之全光線穿透率的測定。將所得之結果顯示於表1 The total light transmittance in the thickness direction of the package sheet was measured using a turbidimeter (NDH2000, manufactured by Nippon Denshoku Industries Co., Ltd.) in accordance with JIS K7361:1997. The results obtained are shown in Table 1.
<太陽能電池模組之耐濕熱評估> <Solid heat and humidity evaluation of solar cell modules>
使用上述實施例及比較例所製作的封裝材薄片,使其成為如下的方式來積層:作為受光面側保護構件之玻璃板(厚度3.2mm)、封裝材薄片、太陽能電池元件、封裝材薄片、作為背面保護構件之聚酯薄膜(0.05mm),藉由使用真空積層機而在135℃加熱處理20分鐘,製作經積層一體化之太陽能電池模組。使用高加速壽命測試裝置、依照150℃ 100%之環境下靜置240小時之條件而進行耐濕熱試驗。太陽能電池模組之最大輸出係依照JIS C8912:1998,使用陽光模擬器而實施測定。評估係從試驗前之太陽能電池模組的最大輸出值,減去試驗後之太陽能電池模組的最大輸出值,將該值除以試驗前之最大輸出值之值設為最大輸出變化率。 Using the package sheet produced in the above-described examples and the comparative examples, a glass sheet (thickness: 3.2 mm) as a light-receiving surface side protective member, a package sheet, a solar cell element, a package sheet, and the like were laminated. A polyester film (0.05 mm) as a back surface protective member was heat-treated at 135 ° C for 20 minutes by using a vacuum laminator to prepare a solar cell module integrated by lamination. The moisture-resistant heat test was carried out using a high-acceleration life test apparatus under the conditions of standing at 150 ° C for 100% in an environment of 240 hours. The maximum output of the solar cell module was measured in accordance with JIS C8912:1998 using a sunlight simulator. The evaluation is based on the maximum output value of the solar cell module before the test, minus the maximum output value of the solar cell module after the test, and dividing the value by the maximum output value before the test as the maximum output change rate.
<層厚測定方法> <Method for measuring layer thickness>
從寬度方向1m、長度方向1m長之試樣,將寬度方向3處(兩端部、中央部)、長度方向3處(兩端部、中央部)之組合共計9點作為厚度測定試樣使用。將薄膜之剖面切割成超薄切片,使用Keyence(股)製雷射顯微鏡VKX-100 觀察,從其剖面照片而測定各層之厚度。 A sample having a length of 1 m in the width direction and a length of 1 m was used as a thickness measurement sample by combining a total of three points in the width direction (both end portions, center portion) and three in the longitudinal direction (both end portions and center portion). . Cut the section of the film into ultra-thin sections, using the Keyence laser microscope VKX-100 It was observed that the thickness of each layer was measured from the photograph of the cross section.
<熔點之測定方法> <Method for measuring melting point>
封裝材原料的樹脂熔點之測定方法係依據塑膠之轉移溫度測定方法(JISK7121:1987),藉由微差掃描熱分析儀(DSC)而進行。將所得之結果顯示於表1。 The method for measuring the melting point of the resin of the packaging material is carried out by a differential scanning calorimeter (DSC) according to the method for measuring the transfer temperature of the plastic (JISK7121: 1987). The results obtained are shown in Table 1.
從顯示於表1之結果便可明確得知,使用本發明之封裝材薄片之情形(實施例)係全光線穿透率高、太陽能電池模組之耐濕熱試驗後之最大輸出變化率亦少,維持了高的發電性能。 From the results shown in Table 1, it is clear that the case of using the package sheet of the present invention (Example) is high in total light transmittance, and the maximum output change rate after the heat and humidity test of the solar cell module is small. , maintaining high power generation performance.
若根據本發明,能夠提供一種封裝材薄片及使用其而得之太陽能電池模組,該封裝材薄片不會損害高的透明性,即使在高溫高濕下長期使用之情形,太陽能電池元件亦不會劣化,能夠維持高的發電性能。 According to the present invention, it is possible to provide a package material sheet and a solar battery module using the same, which does not impair high transparency, and the solar battery element is not used even in a long-term use under high temperature and high humidity. It will deteriorate and maintain high power generation performance.
10‧‧‧封裝材薄片 10‧‧‧Package sheet
11‧‧‧層A 11‧‧‧A
12‧‧‧層B 12‧‧‧Layer B
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WO2016065937A1 (en) * | 2014-10-31 | 2016-05-06 | Byd Company Limited | Solar cell module and manufacturing method thereof |
WO2016065934A1 (en) * | 2014-10-31 | 2016-05-06 | Byd Company Limited | Solar cell module and manufacturing method thereof |
WO2016065944A1 (en) * | 2014-10-31 | 2016-05-06 | Byd Company Limited | Solar cell module and manufacturing method thereof |
WO2016065943A1 (en) * | 2014-10-31 | 2016-05-06 | Byd Company Limited | Solar cell module and manufacturing method thereof |
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JP2003152206A (en) * | 2001-11-13 | 2003-05-23 | Dainippon Printing Co Ltd | Reverse-surface protection sheet for solar battery module and solar battery module using the same |
JP4078589B2 (en) * | 2002-07-23 | 2008-04-23 | 富士電機ホールディングス株式会社 | Solar cell module and manufacturing method thereof |
JP4248312B2 (en) * | 2002-10-31 | 2009-04-02 | 株式会社日本触媒 | Method for producing metal oxide |
JP2008118073A (en) * | 2006-11-08 | 2008-05-22 | Bridgestone Corp | Sealing film on light-receiving surface side for photovoltaic cell |
JP2009033130A (en) * | 2007-06-28 | 2009-02-12 | Kyocera Corp | Solar battery module and manufacturing method of the same |
JP5457758B2 (en) * | 2009-08-24 | 2014-04-02 | 株式会社ブリヂストン | Solar cell sealing film and solar cell using the same |
JP5299180B2 (en) * | 2009-09-04 | 2013-09-25 | 東ソー株式会社 | Laminated body |
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2013
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WO2016065937A1 (en) * | 2014-10-31 | 2016-05-06 | Byd Company Limited | Solar cell module and manufacturing method thereof |
WO2016065934A1 (en) * | 2014-10-31 | 2016-05-06 | Byd Company Limited | Solar cell module and manufacturing method thereof |
WO2016065944A1 (en) * | 2014-10-31 | 2016-05-06 | Byd Company Limited | Solar cell module and manufacturing method thereof |
WO2016065943A1 (en) * | 2014-10-31 | 2016-05-06 | Byd Company Limited | Solar cell module and manufacturing method thereof |
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