TW201415057A - Embedded ultrasonic transducer device and assembling method thereof - Google Patents

Embedded ultrasonic transducer device and assembling method thereof Download PDF

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Publication number
TW201415057A
TW201415057A TW101137107A TW101137107A TW201415057A TW 201415057 A TW201415057 A TW 201415057A TW 101137107 A TW101137107 A TW 101137107A TW 101137107 A TW101137107 A TW 101137107A TW 201415057 A TW201415057 A TW 201415057A
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Taiwan
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opening
ring
sensor
disposed
hollow
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TW101137107A
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Chinese (zh)
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Tzu-Chin Tsai
Shih-Feng Lee
Chiun-Hua Chang
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Tung Thih Electronic Co Ltd
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Priority to TW101137107A priority Critical patent/TW201415057A/en
Priority to US13/841,937 priority patent/US20140096609A1/en
Priority to EP13161179.0A priority patent/EP2717256A2/en
Priority to JP2013180976A priority patent/JP5640125B2/en
Publication of TW201415057A publication Critical patent/TW201415057A/en

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Abstract

An embedded ultrasonic transducer device comprising a housing, a transducer, a fixing ring, a circuit board, and a sealing cover. The housing comprises a hollow casing and at least one external pin, and the hollow casing has a first opening and an opposite second opening. The transducer comprises a hollow base and a piezoelectric piece and a damping member stacked in the base, and the base is disposed in the hollow casing and seals the second opening. The fixing ring is disposed corresponding to the transducer and fitted to the hollow casing to fix the transducer. The fixing ring comprises a ring body and at least one internal pin. The ring body has at least one rib extending toward the first opening, and the internal pin is electrically connected with the piezoelectric piece of the transducer. The circuit board, the external pin and the internal pin are electrically connected. The sealing cover closes the first opening and has an inner wall surface abutted against the rib of the fixing ring.

Description

嵌合式超聲波傳感器裝置及其組裝方法 Chimeric ultrasonic sensor device and assembly method thereof

本發明是有關於一種超聲波傳感裝置,特別是指一種車用測距雷達的超聲波傳感裝置。 The present invention relates to an ultrasonic sensing device, and more particularly to an ultrasonic sensing device for a vehicle ranging radar.

目前各式車輛為了行車安全,通常會安裝偵測障礙物或來車的測距雷達(如防撞雷達或倒車雷達),以輔助駕駛人注意車輛周遭的環境變化。其中,超聲波雷達是常見的車用雷達之一。 At present, various types of vehicles are usually equipped with ranging radars (such as anti-collision radars or reversing radars) that detect obstacles or come in to assist the driver in paying attention to environmental changes around the vehicle. Among them, ultrasonic radar is one of the common vehicle radars.

參照圖1與圖2,為一習知的車用超聲波傳感器裝置9。超聲波傳感器裝置9包含一外殼91、一傳感器92、一固定環93及一電路板94。 Referring to Figures 1 and 2, a conventional ultrasonic sensor device 9 for a vehicle is used. The ultrasonic sensor device 9 includes a housing 91, a sensor 92, a fixing ring 93 and a circuit board 94.

外殼91包括一殼體911及多根電連接於傳感器92與電路板94的外接腳912,殼體911的內壁面形成多個供固定環93組裝定位的限位滑槽913。 The housing 91 includes a housing 911 and a plurality of external pins 912 electrically connected to the sensor 92 and the circuit board 94. The inner wall surface of the housing 911 defines a plurality of limiting slots 913 for assembling and positioning the fixing ring 93.

傳感器92裝設於殼體911中對應其開口914處,且部分地凸出於開口914並封閉開口914。傳感器92包括一座體921及設置於座體921內的一壓電片921及一泡棉923,壓電片921用於產生及接收測距使用的超聲波,泡棉923用於吸收環境震盪以確保壓電片921穩定運作。 The sensor 92 is mounted in the housing 911 corresponding to its opening 914 and partially protrudes from the opening 914 and closes the opening 914. The sensor 92 includes a body 921 and a piezoelectric piece 921 disposed in the base 921 and a foam 923. The piezoelectric piece 921 is used to generate and receive ultrasonic waves used for ranging, and the foam 923 is used for absorbing environmental shock to ensure The piezoelectric piece 921 operates stably.

固定環93裝設於殼體911中,與殼體911相互配合以固定傳感器92於殼體911內的位置,並與電路板94形成電性連接。具體來說,固定環93包括一環本體931、多根電連接於電路板94的內接腳932及一設置於環本體931對應 傳感器92位置的減震環933。環本體931外緣對應殼體911之限位滑槽913處各形成一限位凸塊934,提供固定環93裝設於殼體911時的引導、對位作用。減震環933則抵壓於傳感器92,而對傳感器92產生限位效果。 The fixing ring 93 is mounted in the housing 911 and cooperates with the housing 911 to fix the position of the sensor 92 in the housing 911 and is electrically connected to the circuit board 94. Specifically, the fixing ring 93 includes a ring body 931, a plurality of inner pins 932 electrically connected to the circuit board 94, and a corresponding one disposed on the ring body 931. A damping ring 933 at the position of the sensor 92. A limiting protrusion 934 is formed on the outer edge of the ring body 931 corresponding to the limiting slot 913 of the housing 911 to provide a guiding and positioning function when the fixing ring 93 is mounted on the housing 911. The damper ring 933 is pressed against the sensor 92 to create a limit effect on the sensor 92.

電路板包括多個穿孔941,供該等外接腳912、內接腳932穿設並形成電性連接。 The circuit board includes a plurality of through holes 941 for the external pins 912 and the inner pins 932 to pass through and form an electrical connection.

上述超聲波傳感器裝置9於組裝固定環93時,會在限位凸塊934與限位滑槽913鄰近開口914的底端塗佈黏著膠(圖中未繪製),以將固定環93固著於內。但在後續組裝過程中,固定環93可能由塗佈黏著膠處剝離,而影響生產良率。 When the fixing ring 93 is assembled, the adhesive bumps 934 and the limiting slot 913 are coated with an adhesive (not shown) adjacent to the bottom end of the opening 914 to fix the fixing ring 93 to the fixing ring 93. Inside. However, during the subsequent assembly process, the retaining ring 93 may be peeled off by the applied adhesive, which affects the production yield.

此外,將上述傳感器92、固定環93與電路板94裝設於殼體911後,會進一步在殼體911中進行填膠、固化程序,以將上述構件固著、封裝於殼體911中。但是填膠、固化程序需要耗費大量時間(超過24小時),而影響生產效率。 Further, after the sensor 92, the fixing ring 93, and the circuit board 94 are mounted on the casing 911, a filling and curing process is further performed in the casing 911 to fix and package the member in the casing 911. However, the filling and curing process takes a lot of time (more than 24 hours), which affects production efficiency.

再者,填充封裝膠體(圖中未繪製)於殼體911後,封裝膠體會與電路板94產生化學反應,影響其正常運作,而降低超聲波傳感器裝置9的耐用程度。 Moreover, after filling the encapsulant (not shown) in the housing 911, the encapsulant will chemically react with the circuit board 94, affecting its normal operation, and reducing the durability of the ultrasonic sensor device 9.

因此,本發明之目的,即在提供一種能解決固定環剝離問題,且不需執行封裝膠體填充步驟與固化步驟,即能完成組裝程序的嵌合式超聲波傳感器裝置。 Accordingly, it is an object of the present invention to provide a chimeric ultrasonic sensor apparatus capable of solving the problem of fixing the peeling of a fixed ring without performing an encapsulating colloid filling step and a curing step, that is, an assembly procedure can be completed.

於是,本發明嵌合式超聲波傳感器裝置,包含一外殼 、一傳感器、一固定環、一電路板及一密封蓋。 Thus, the chimeric ultrasonic sensor device of the present invention comprises a housing , a sensor, a fixing ring, a circuit board and a sealing cover.

該外殼包括一中空殼體及設置於該中空殼體內的至少一外接腳,該中空殼體具有位置相對應的一第一開口與一第二開口。 The outer casing includes a hollow casing and at least one outer leg disposed in the hollow casing, the hollow casing having a first opening and a second opening corresponding to the position.

該傳感器包括一中空的座體及疊設於該座體內的一壓電片及一吸震件。該座體設置於該中空殼體內對應該第二開口處並封閉該第二開口。 The sensor comprises a hollow seat body and a piezoelectric piece and a shock absorbing member stacked in the seat body. The seat body is disposed in the hollow housing corresponding to the second opening and closes the second opening.

該固定環設置於該中空殼體內對應該傳感器處,且與該中空殼體相互配合以卡固該傳感器。該固定環包括一環本體及至少一設於該環本體的內接腳,該環本體具有至少一朝向該中空殼體的第一開口凸伸的肋柱,該內接腳與該傳感器的壓電片形成電性連接。 The fixing ring is disposed in the hollow housing corresponding to the sensor, and cooperates with the hollow housing to fix the sensor. The fixing ring includes a ring body and at least one inner leg disposed on the ring body, the ring body having at least one rib protruding toward the first opening of the hollow casing, the inner leg and the pressure of the sensor The electrical sheets form an electrical connection.

該電路板設置於該中空殼體內,並與該外接腳、該內接腳形成電性連接。 The circuit board is disposed in the hollow housing and electrically connected to the external pin and the inner leg.

該密封蓋裝設於該中空殼體並封閉該第一開口,且其內壁面抵壓於該固定環的肋柱。 The sealing cover is mounted on the hollow casing and closes the first opening, and an inner wall surface thereof is pressed against the rib of the fixing ring.

較佳地,該中空殼體的內壁面凹陷形成至少一個限位滑槽,該環本體的外緣形成至少一個對應該限位滑槽並容設於該限位滑槽中的限位凸塊,且該環本體的肋柱設於對應該限位凸塊處並容置於該限位滑槽中。 Preferably, the inner wall surface of the hollow casing is recessed to form at least one limiting sliding slot, and the outer edge of the ring body forms at least one limiting convex corresponding to the limiting sliding slot and received in the limiting sliding slot. And a rib of the ring body is disposed at the corresponding limiting protrusion and received in the limiting sliding slot.

更佳地,該等限位滑槽、該等限位凸塊與該等肋柱的數量為兩個,該等限位滑槽係形成於該中空殼體的內壁面且彼此相對,該等限位凸塊與該等肋柱係分別設置於該環本體的相反兩側,並分別容設於對應的限位滑槽中。 More preferably, the limit chutes, the limit protrusions and the number of the ribs are two, and the limit chutes are formed on the inner wall surface of the hollow casing and opposite to each other, The equipotential protrusions and the ribs are respectively disposed on opposite sides of the ring body, and are respectively accommodated in the corresponding limit chutes.

進一步來說,該等限位滑槽與該等限位凸塊的數量為三個,該等肋柱的數量為兩個;該等限位滑槽其中之二係形成於該中空殼體的內壁面且彼此相對,該等限位凸塊其中之二以及該等肋柱係分別設置於該環本體的相反兩側,且該等限位凸塊與該等肋柱係分別容設於對應的限位滑槽中。 Further, the number of the limit chutes and the limit bumps is three, and the number of the ribs is two; the second of the limit chutes is formed in the hollow shell The inner wall surfaces are opposite to each other, and two of the limiting protrusions and the rib columns are respectively disposed on opposite sides of the ring body, and the limiting protrusions and the rib columns are respectively accommodated Corresponding in the limit chute.

較佳地,該外殼還包括一第一減震環,該第一減震環以具彈性的材料製成,並設置於該中空殼體的第二開口處,而與該傳感器的座體相接觸地封閉該第二開口。 Preferably, the outer casing further includes a first damper ring, the first damper ring is made of a resilient material, and is disposed at the second opening of the hollow casing, and the base of the sensor The second opening is closed in contact.

較佳地,該固定環還包括一設置於該環本體對應該傳感器處的第二減震環,該第二減震環以具彈性的材料製成,並抵觸於該傳感器的座體。 Preferably, the fixing ring further comprises a second damper ring disposed at the sensor corresponding to the ring body, the second damper ring is made of a resilient material and is in contact with the seat of the sensor.

較佳地,該密封蓋是藉由超聲波熔接技術或雷射熔接技術而熔接於該中空殼體。 Preferably, the sealing cover is welded to the hollow casing by ultrasonic welding technology or laser welding technology.

本發明的另一目的,在提供前述嵌合式超聲波傳感器裝置的組裝方法。 Another object of the present invention is to provide a method of assembling the above-described chimeric ultrasonic sensor device.

於是本發明嵌合式超聲波傳感器裝置的組裝方法,包含以下步驟:(A)製備一具有相對應的一第一開口與一第二開口且包括至少一外接腳的外殼,並將一壓電片及一吸震件依序設置於一座體中而製備一傳感器;(B)將該傳感器裝設於該外殼,且藉由該傳感器封閉該外殼的第二開口;(C)將一具有至少一肋柱及至少一內接腳的固定環裝設於該外殼中並抵壓於該傳感器,並將該固定環的內接腳電連接於該傳感器,且令該肋柱朝向該外殼的第一開 口凸伸;(D)將一電路板裝設於該外殼中,並將該電路板電性連接於該外殼的外接腳及該固定環的內接腳;及(E)將一密封蓋裝設於該外殼且抵壓於該固定環的肋柱,並藉由該密封蓋封閉該外殼的第一開口。 Therefore, the assembling method of the chimeric ultrasonic sensor device of the present invention comprises the following steps: (A) preparing a housing having a corresponding first opening and a second opening and including at least one external pin, and a piezoelectric piece and a shock absorbing member is sequentially disposed in the body to prepare a sensor; (B) the sensor is mounted on the outer casing, and the second opening of the outer casing is closed by the sensor; (C) one having at least one rib column And a fixing ring of the at least one inner pin is mounted in the outer casing and pressed against the sensor, and electrically connects the inner leg of the fixing ring to the sensor, and the first opening of the rib is toward the outer casing (D) mounting a circuit board in the housing, and electrically connecting the circuit board to the outer leg of the outer casing and the inner leg of the fixing ring; and (E) mounting a sealing cover a rib disposed on the outer casing and pressed against the fixing ring, and the first opening of the outer casing is closed by the sealing cover.

較佳地,於步驟(B)該傳感器係經由該外殼的第一開口裝設於該外殼中,並部分地突出於該第二開口外。 Preferably, in step (B), the sensor is mounted in the outer casing via a first opening of the outer casing and partially protrudes outside the second opening.

較佳地,該外殼之中空殼體的內壁面形成至少一在該第一開口與該第二開口之間延伸的限位滑槽,該固定環的環本體係形成至少一個對應該限位滑槽的限位凸塊,且該肋柱係設置於對應該限位凸塊處;於步驟(C)該固定環係經由該外殼的第一開口裝設於該外殼中,且該限位凸塊與該肋柱係由該第一開口朝該第二開口的方向滑入該限位滑槽中。 Preferably, the inner wall surface of the hollow casing of the outer casing forms at least one limiting chute extending between the first opening and the second opening, and the ring system of the fixing ring forms at least one corresponding limit a limiting protrusion of the sliding groove, wherein the rib column is disposed at a corresponding limiting protrusion; and the fixing ring is installed in the outer casing through the first opening of the outer casing in the step (C), and the limit is The bump and the rib are slid into the limit chute from the first opening toward the second opening.

較佳地,於步驟(E)該密封蓋是藉由超聲波熔接技術或雷射熔接技術而熔接於該外殼。 Preferably, in step (E), the sealing cover is welded to the outer casing by ultrasonic welding technology or laser welding technology.

本發明之功效在於:該傳感器、固定環、電路板與密封蓋裝設於嵌合式超聲波傳感器裝置的外殼後,固定環鄰近第二開口的第二減震環抵觸於傳感器而對其產生限位效果,固定環朝向第一開口凸伸的肋柱被密封蓋的內壁面抵壓而將固定環固定限位。因此,本發明嵌合式超聲波傳感器裝置不需使用黏著膠及封裝膠體即能完成組裝程序,且可避免固定環的剝離問題,而有效提升其製程效率及製程良率。 The effect of the invention is that after the sensor, the fixing ring, the circuit board and the sealing cover are mounted on the outer casing of the fitting ultrasonic sensor device, the second damping ring of the fixing ring adjacent to the second opening is in contact with the sensor to limit the position thereof. As a result, the rib protruding from the fixing ring toward the first opening is pressed by the inner wall surface of the sealing cover to fix the fixing ring. Therefore, the chimeric ultrasonic sensor device of the present invention can complete the assembly process without using the adhesive and the encapsulant, and can avoid the peeling problem of the fixing ring, thereby effectively improving the process efficiency and the process yield.

有關本發明之前述及其他技術內容、特點與功效,在以下配合參考圖式之一個較佳實施例的詳細說明中,將可清楚地呈現。 The foregoing and other technical aspects, features and advantages of the present invention will be apparent from the following description of the preferred embodiments.

參閱圖3、圖4與圖5,為本發明嵌合式超聲波傳感器裝置1的較佳實施例。嵌合式超聲波傳感器裝置1可應用於車輛的倒車雷達或防撞雷達,以提升行車安全性,但其應用領域不以上述內容為限。 Referring to Figures 3, 4 and 5, a preferred embodiment of the chiseled ultrasonic sensor device 1 of the present invention is shown. The chimeric ultrasonic sensor device 1 can be applied to a reversing radar or an anti-collision radar of a vehicle to improve driving safety, but the application field is not limited to the above.

具體來說,嵌合式超聲波傳感器裝置1包含一外殼2,以及裝設於外殼2的一傳感器3、一固定環4、一電路板5及一密封蓋6。 Specifically, the chimeric ultrasonic sensor device 1 includes a casing 2, a sensor 3 mounted on the casing 2, a fixing ring 4, a circuit board 5, and a sealing cover 6.

參閱圖3、圖5、圖7與圖8,外殼2包括一中空殼體21、一第一減震環22、一第一外接腳23、一第二外接腳24及一第三外接腳25。 Referring to FIG. 3, FIG. 5, FIG. 7, and FIG. 8, the outer casing 2 includes a hollow casing 21, a first damper ring 22, a first outer leg 23, a second outer leg 24, and a third outer leg. 25.

中空殼體21概呈圓柱狀,其外緣形成一連通於中空殼體21的連接管部211。其中,中空殼體21具有相對應的一第一開口213及一第二開口214,且於內壁面凹陷形成三個在第一開口213及一第二開口214之間延伸以供固定環4裝設定位的限位滑槽212,並形成四個朝第一開口213凸伸以供電路板5裝設定位的定位板216。但上述限位滑槽212與定位板216的數量可視需要而彈性調整,不以此為限。 The hollow casing 21 has a substantially cylindrical shape, and its outer edge forms a connecting pipe portion 211 that communicates with the hollow casing 21. The hollow housing 21 has a corresponding first opening 213 and a second opening 214, and is recessed on the inner wall surface to form three extending between the first opening 213 and the second opening 214 for fixing the ring 4. The set position stop chute 212 is mounted, and four positioning plates 216 protruding toward the first opening 213 for mounting the circuit board 5 are formed. However, the number of the limiting slot 212 and the positioning plate 216 can be flexibly adjusted as needed, and is not limited thereto.

第一減震環22以具有彈性的材料(如橡膠)製成,設置於鄰近中空殼體21的第二開口214處,並與部分凸出於第二開口214的傳感器3相接觸,而封閉該第二開口214 。 The first damper ring 22 is made of a material having elasticity (such as rubber), is disposed adjacent to the second opening 214 of the hollow casing 21, and is in contact with the sensor 3 partially protruding from the second opening 214, and Closing the second opening 214 .

第一外接腳23、第二外接腳24與第三外接腳25設置於中空殼體21中,三者朝向第一開口213凸伸的一端分別電連接於電路板5,且其朝向第三開口215凸伸的另一端分別電連接於一外部控制電路(圖中未繪製)。其中,第一外接腳23提供接地作用,第二外接腳24透過電路板5將傳感器3產生的訊號傳輸至外部控制電路,第三外接腳25則透過外部控制電路提供電路板5所需的電源。 The first outer leg 23, the second outer leg 24 and the third outer leg 25 are disposed in the hollow housing 21, and the three ends that protrude toward the first opening 213 are electrically connected to the circuit board 5, respectively, and are oriented toward the third The other end of the opening 215 is electrically connected to an external control circuit (not shown). The first external pin 23 provides a grounding function, the second external pin 24 transmits the signal generated by the sensor 3 to the external control circuit through the circuit board 5, and the third external pin 25 provides the power required by the circuit board 5 through an external control circuit. .

本實施例中,第一外接腳23、第二外接腳24與第三外接腳25係緊鄰地設置於中空殼體21的一側,並與三個限位滑槽212等間隔地設置於該中空殼體21內。但該等外接腳23、24、25與限位滑槽212的設置位置可依需要而調整,不以此處揭露的內容為限。 In this embodiment, the first outer leg 23 and the second outer leg 24 are disposed adjacent to the third outer leg 25 on one side of the hollow housing 21 and are equally spaced from the three limiting slots 212. Inside the hollow casing 21. However, the positions of the external legs 23, 24, 25 and the limit chute 212 can be adjusted as needed, and are not limited to the contents disclosed herein.

參閱圖3、圖5、圖9與圖10,傳感器3可依據鄰近物體反射的超聲波而產生一用於測距的感測訊號,其設置於中空殼體21內對應第二開口214處,且卡固於第一減震環22中並部分地突出於中空殼體21之外,而封閉第二開口214。 Referring to FIG. 3, FIG. 5, FIG. 9 and FIG. 10, the sensor 3 can generate a sensing signal for ranging according to the ultrasonic wave reflected by the adjacent object, and is disposed in the hollow housing 21 corresponding to the second opening 214. And being fastened in the first damper ring 22 and partially protruding outside the hollow casing 21 to close the second opening 214.

具體來說,傳感器3包括一中空金屬座體31及依序疊設於座體31內的一壓電片32及一吸震件33。此處,壓電片32以壓電材料製成且設置於座體31的內底面,其受控產生振盪而發出超聲波,並接收反射的超聲波而產生感測訊號。吸震件33由泡棉製成且設於壓電片32之上,用於吸收外界環境產生的震盪,以避免壓電片32受干擾。 Specifically, the sensor 3 includes a hollow metal base 31 and a piezoelectric piece 32 and a shock absorbing member 33 which are sequentially stacked in the base 31. Here, the piezoelectric sheet 32 is made of a piezoelectric material and is disposed on the inner bottom surface of the base body 31, and is controlled to generate oscillation to emit ultrasonic waves, and receives the reflected ultrasonic waves to generate a sensing signal. The shock absorbing member 33 is made of foam and is disposed on the piezoelectric sheet 32 for absorbing shock generated by the external environment to prevent the piezoelectric sheet 32 from being disturbed.

參閱圖3、圖5、圖11與圖12,固定環4設置於中空殼體21內對應傳感器3處,包括一環本體41、一第二減震環42、一第一內接腳43與一第二內接腳44。 Referring to FIG. 3, FIG. 5, FIG. 11 and FIG. 12, the fixing ring 4 is disposed in the corresponding sensor 3 in the hollow casing 21, and includes a ring body 41, a second damping ring 42, and a first inner leg 43. A second inner pin 44.

環本體41於對應中空殼體21之三個限位滑槽212的位置分別向外凸伸形成一用於組裝定位的限位凸塊411,且於鄰近第一內接腳43、第二內接腳44的兩相對限位凸塊411處,分別朝向中空殼體21的第一開口213延伸形成一肋柱412。該等肋柱412分別頂抵於封閉第一開口213的密封蓋6,而對固定環4產生卡固、限位效果。 The ring body 41 protrudes outwardly from the position of the three limiting slots 212 of the hollow housing 21 to form a limiting protrusion 411 for assembling and positioning, and adjacent to the first inner leg 43 and the second At the two opposite limiting protrusions 411 of the inner leg 44, a rib 412 is formed to extend toward the first opening 213 of the hollow housing 21, respectively. The ribs 412 respectively abut against the sealing cover 6 that closes the first opening 213, and the fixing ring 4 is stuck and limited.

第二減震環42設於環本體41對應傳感器3的位置,以具有彈性的材料製成,並於固定環4組裝於中空殼體21後抵觸於傳感器3的座體31以及第一減震環22,而與中空殼體21相互配合對傳感器3產生固定作用。 The second damper ring 42 is disposed at a position corresponding to the sensor 3 of the ring body 41, is made of a material having elasticity, and is fixed to the seat body 31 of the sensor 3 after the fixing ring 4 is assembled to the hollow casing 21, and the first reduction The ring 22 is coupled to the hollow housing 21 to provide a fixed effect on the sensor 3.

第一內接腳43與第二內接腳44設置於環本體41且兩者的兩端各凸伸於外。其中,第一內接腳43的一端連接於傳感器3的金屬座體31,且其另一端電連接於電路板5,用以提供接地效果。另一方面,第二內接腳44的一端電連接於傳感器3的壓電片32,其另一端電連接於電路板5,而將壓電片32產生的感測訊號傳輸至電路板5。 The first inner leg 43 and the second inner leg 44 are disposed on the ring body 41 and both ends of the two protrude outward. The first inner leg 43 has one end connected to the metal base 31 of the sensor 3 and the other end electrically connected to the circuit board 5 for providing a grounding effect. On the other hand, one end of the second inner leg 44 is electrically connected to the piezoelectric piece 32 of the sensor 3, and the other end thereof is electrically connected to the circuit board 5, and the sensing signal generated by the piezoelectric piece 32 is transmitted to the circuit board 5.

參照圖3、圖5、圖13、圖14,電路板5設置於中空殼體21內的四個定位板216上,並與內接腳43、44以及外接腳23、24、25形成電性連接,而提供傳感器3與外部控制電路(圖中未繪製)產生電性連接的媒介。 3, 5, 13, and 14, the circuit board 5 is disposed on the four positioning plates 216 in the hollow casing 21, and is electrically connected to the inner legs 43, 44 and the external pins 23, 24, 25. The connection is made to provide a medium for the sensor 3 to be electrically connected to an external control circuit (not shown).

參照圖3、圖4與圖5,密封蓋6裝設於中空殼體21 並封閉第一開口213,且其內壁面抵壓於固定環4的肋柱412,而對固定環4與傳感器3產生限位效果。 Referring to FIGS. 3, 4 and 5, the sealing cover 6 is mounted on the hollow casing 21 The first opening 213 is closed, and the inner wall surface thereof is pressed against the rib 412 of the fixing ring 4 to generate a limiting effect on the fixing ring 4 and the sensor 3.

上述說明是將傳感器3、固定環4、電路板5及密封蓋6裝設於外殼2後的實施態樣,可使嵌合式超聲波傳感器裝置1據以執行其裝置功能。 The above description is an embodiment in which the sensor 3, the fixing ring 4, the circuit board 5, and the sealing cover 6 are mounted on the casing 2, and the fitting ultrasonic sensor device 1 can perform the function of the device.

以下配合圖6及相關圖式,說明嵌合式超聲波傳感器裝置1的組裝流程。 The assembly flow of the fitting ultrasonic sensor device 1 will be described below with reference to Fig. 6 and related drawings.

步驟S1:製備一外殼2,並組裝一傳感器3。Step S1: A casing 2 is prepared and a sensor 3 is assembled.

步驟S2:將傳感器3裝設於外殼2中。Step S2: The sensor 3 is mounted in the casing 2.

參照圖7至圖10。步驟S1是預準備步驟,先將外殼2的各式構件(中空殼體21、第一減震環22與外接腳23、24、25)以及傳感器3的各式構件(座體31、壓電片32與吸震件33)組裝完成,而後於步驟S2將傳感器3由第一開口213裝設於中空殼體21中。 Refer to Figures 7 to 10. Step S1 is a pre-preparation step of firstly forming various members of the outer casing 2 (the hollow casing 21, the first damper ring 22 and the outer legs 23, 24, 25) and the various members of the sensor 3 (the seat body 31, the pressure) The electric piece 32 is assembled with the shock absorbing member 33), and then the sensor 3 is installed in the hollow casing 21 from the first opening 213 in step S2.

步驟S3:將固定環4裝設於外殼2中,藉以固定傳感器3。Step S3: The fixing ring 4 is mounted in the outer casing 2, thereby fixing the sensor 3.

參閱圖3、圖11與圖12,此步驟將固定環4由第一開口213裝設於中空殼體21中,並將第一內接腳43、第二內接腳44電連接於傳感器3。其中,固定環4的三個限位凸塊411與兩個肋柱412分別對準中空殼體21的三個限位滑槽212,並由上而下滑入其中,至固定環4的第二減震環42接觸傳感器3以及第一減震環22為止,而初步對傳感器3產生定位作用。 Referring to FIG. 3, FIG. 11 and FIG. 12, the fixing ring 4 is installed in the hollow casing 21 from the first opening 213, and electrically connects the first inner leg 43 and the second inner leg 44 to the sensor. 3. The three limiting protrusions 411 and the two ribs 412 of the fixing ring 4 are respectively aligned with the three limiting sliding slots 212 of the hollow housing 21, and are slid into the fixed ring 4 from the top. The second damper ring 42 contacts the sensor 3 and the first damper ring 22, and initially positions the sensor 3.

步驟S4:將電路板5裝設於外殼2中,並與該等外接腳23Step S4: mounting the circuit board 5 in the outer casing 2, and the external pins 23 、24、25與內接腳43、44形成電性連接。24, 25 and the inner legs 43, 44 form an electrical connection.

參閱圖3、圖13與圖14,此步驟將電路板5由第一開口213裝設於中空殼體21中,並設置於定位板216上,且進一步與該等外接腳23、24、25與內接腳43、44相接而形成電性連接。 Referring to FIG. 3, FIG. 13, and FIG. 14, the circuit board 5 is mounted on the hollow housing 21 by the first opening 213, and is disposed on the positioning board 216, and further connected to the external pins 23, 24, 25 is connected to the inner pins 43, 44 to form an electrical connection.

步驟S5:藉由密封蓋6封閉外殼2的第二開口214,並對固定環4、傳感器3產生定位效果。Step S5: The second opening 214 of the outer casing 2 is closed by the sealing cover 6, and a positioning effect is generated on the fixing ring 4 and the sensor 3.

參閱圖3至圖5,此步驟藉由超聲波熔接技術或雷射熔接技術,將密封蓋6熔接於中空殼體21上,並封閉第一開口213。此處,密封蓋6的內壁面係抵壓於固定環4的肋柱412,而能進一步對固定環4及傳感器3產生限位效果。 Referring to FIG. 3 to FIG. 5, the sealing cover 6 is welded to the hollow casing 21 by an ultrasonic welding technique or a laser welding technique, and the first opening 213 is closed. Here, the inner wall surface of the sealing cover 6 is pressed against the rib 412 of the fixing ring 4, and the limiting effect of the fixing ring 4 and the sensor 3 can be further produced.

綜上所述,嵌合式超聲波傳感器裝置1藉由結構設計,使傳感器3、固定環4、電路板5與密封蓋6裝設於外殼2後,不需藉由黏著膠或封裝膠體即能對內部構件產生固著定位效果,而相對於圖1、圖2的習知超聲波傳感器裝置9有效提升生產效率與生產良率,因而能達成本發明的目的。 In summary, the chisel type ultrasonic sensor device 1 is configured such that the sensor 3, the fixing ring 4, the circuit board 5 and the sealing cover 6 are mounted on the outer casing 2 without the need of adhesive or encapsulant. The internal member produces a fixing positioning effect, and the conventional ultrasonic sensor device 9 of Figs. 1 and 2 effectively improves the production efficiency and the production yield, and thus the object of the present invention can be attained.

惟以上所述者,僅為本發明之較佳實施例而已,當不能以此限定本發明實施之範圍,即大凡依本發明申請專利範圍及發明說明內容所作之簡單的等效變化與修飾,皆仍屬本發明專利涵蓋之範圍內。 The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent.

1‧‧‧嵌合式超聲波傳感器裝置 1‧‧‧Chimeric ultrasonic sensor device

2‧‧‧外殼 2‧‧‧ Shell

21‧‧‧中空殼體 21‧‧‧ hollow housing

211‧‧‧連接管部 211‧‧‧Connected pipe department

212‧‧‧限位滑槽 212‧‧‧Limit chute

213‧‧‧第一開口 213‧‧‧ first opening

214‧‧‧第二開口 214‧‧‧ second opening

215‧‧‧第三開口 215‧‧‧ third opening

216‧‧‧定位板 216‧‧‧ positioning board

22‧‧‧第一減震環 22‧‧‧First damping ring

23‧‧‧第一外接腳 23‧‧‧First external pin

24‧‧‧第二外接腳 24‧‧‧Second external feet

25‧‧‧第三外接腳 25‧‧‧ Third external leg

3‧‧‧傳感器 3‧‧‧ Sensor

31‧‧‧座體 31‧‧‧

32‧‧‧壓電片 32‧‧‧ Piezo Pieces

33‧‧‧吸震件 33‧‧‧ Shock absorbers

4‧‧‧固定環 4‧‧‧Fixed ring

41‧‧‧環本體 41‧‧‧ Ring Ontology

411‧‧‧限位凸塊 411‧‧‧ Limit bumps

412‧‧‧肋柱 412‧‧‧ ribs

42‧‧‧第二減震環 42‧‧‧Second damping ring

43‧‧‧第一內接腳 43‧‧‧First internal pin

44‧‧‧第二內接腳 44‧‧‧Second internal pin

5‧‧‧電路板 5‧‧‧Circuit board

6‧‧‧密封蓋 6‧‧‧ Sealing cover

S1~S5‧‧‧流程步驟 S1~S5‧‧‧ Process steps

圖1是一立體分解圖,說明一習知的車用超聲波傳感 器裝置;圖2是該習知超聲波傳感器裝置的側剖視圖;圖3是一立體分解圖,說明本發明嵌合式超聲波傳感器裝置的較佳實施例;圖4是該嵌合式超聲波傳感器裝置的立體組合圖;圖5是該嵌合式超聲波傳感器裝置的側剖視圖;圖6是一流程圖,說明該嵌合式超聲波傳感器裝置的組裝步驟;圖7是一上視圖,說明該嵌合式超聲波傳感器裝置之外殼的實施態樣;圖8是該外殼的側剖視圖;圖9是一上視圖,說明一傳感器裝設於該外殼的設置態樣;圖10是圖9的側剖視圖;圖11是一上視圖,說明裝設一固定環於圖9之嵌合式超聲波傳感器裝置半成品的實施態樣;圖12是圖11的側剖視圖;圖13是一上視圖,說明裝設一電路板於圖11之嵌合式超聲波傳感器裝置半成品的實施態樣;及圖14是圖13的側剖視圖。 Figure 1 is an exploded perspective view showing a conventional ultrasonic sensor for vehicles Figure 2 is a side cross-sectional view of the conventional ultrasonic sensor device; Figure 3 is an exploded perspective view showing a preferred embodiment of the chimeric ultrasonic sensor device of the present invention; and Figure 4 is a perspective combination of the embedded ultrasonic sensor device Figure 5 is a side cross-sectional view of the fitting ultrasonic sensor device; Figure 6 is a flow chart illustrating the assembly steps of the fitting ultrasonic sensor device; Figure 7 is a top view showing the outer casing of the fitting ultrasonic sensor device Figure 8 is a side cross-sectional view of the outer casing; Figure 9 is a top view showing a sensor mounted on the outer casing; Figure 10 is a side cross-sectional view of Figure 9; and Figure 11 is a top view illustrating FIG. 12 is a side cross-sectional view of FIG. 11; FIG. 13 is a top view showing a fitting ultrasonic sensor with a circuit board mounted in FIG. An embodiment of the device semi-finished product; and FIG. 14 is a side cross-sectional view of FIG.

1‧‧‧嵌合式超聲波傳感器裝置 1‧‧‧Chimeric ultrasonic sensor device

2‧‧‧外殼 2‧‧‧ Shell

21‧‧‧中空殼體 21‧‧‧ hollow housing

211‧‧‧連接管部 211‧‧‧Connected pipe department

212‧‧‧限位滑槽 212‧‧‧Limit chute

213‧‧‧第一開口 213‧‧‧ first opening

214‧‧‧第二開口 214‧‧‧ second opening

215‧‧‧第三開口 215‧‧‧ third opening

22‧‧‧第一減震環 22‧‧‧First damping ring

23‧‧‧第一外接腳 23‧‧‧First external pin

24‧‧‧第二外接腳 24‧‧‧Second external feet

25‧‧‧第三外接腳 25‧‧‧ Third external leg

3‧‧‧傳感器 3‧‧‧ Sensor

31‧‧‧座體 31‧‧‧

32‧‧‧壓電片 32‧‧‧ Piezo Pieces

33‧‧‧吸震件 33‧‧‧ Shock absorbers

4‧‧‧固定環 4‧‧‧Fixed ring

41‧‧‧環本體 41‧‧‧ Ring Ontology

411‧‧‧限位凸塊 411‧‧‧ Limit bumps

412‧‧‧肋柱 412‧‧‧ ribs

42‧‧‧第二減震環 42‧‧‧Second damping ring

43‧‧‧第一內接腳 43‧‧‧First internal pin

44‧‧‧第二內接腳 44‧‧‧Second internal pin

5‧‧‧電路板 5‧‧‧Circuit board

6‧‧‧密封蓋 6‧‧‧ Sealing cover

Claims (11)

一種嵌合式超聲波傳感器裝置,包含:一外殼,包括一中空殼體及設置於該中空殼體內的至少一外接腳,該中空殼體具有位置相對應的一第一開口與一第二開口;一傳感器,包括一中空的座體及疊設於該座體內的一壓電片及一吸震件,該座體設置於該中空殼體內對應該第二開口處並封閉該第二開口;一固定環,設置於該中空殼體內對應該傳感器處,且與該中空殼體相互配合以卡固該傳感器,該固定環包括一環本體及至少一設於該環本體的內接腳,該環本體具有至少一朝向該中空殼體的第一開口凸伸的肋柱,該內接腳與該傳感器的壓電片形成電性連接;一電路板,設置於該中空殼體內,並與該外接腳、該內接腳形成電性連接;及一密封蓋,裝設於該中空殼體並封閉該第一開口,且該密封蓋的內壁面抵壓於該固定環的肋柱。 A fitting ultrasonic sensor device comprising: a housing comprising a hollow housing and at least one external leg disposed in the hollow housing, the hollow housing having a first opening and a second corresponding position a sensor, comprising a hollow body and a piezoelectric piece and a shock absorbing member stacked in the body, the seat body is disposed in the hollow casing corresponding to the second opening and closing the second opening a fixing ring disposed in the hollow housing corresponding to the sensor and cooperating with the hollow housing to fix the sensor, the fixing ring comprising a ring body and at least one inner pin disposed on the ring body The ring body has at least one rib protruding toward the first opening of the hollow casing, the inner leg being electrically connected to the piezoelectric piece of the sensor; a circuit board disposed in the hollow casing And forming an electrical connection with the external leg and the inner leg; and a sealing cover mounted on the hollow casing and closing the first opening, and the inner wall surface of the sealing cover is pressed against the fixing ring Ribs. 根據申請專利範圍第1項所述之嵌合式超聲波傳感器裝置,其中,該中空殼體的內壁面凹陷形成至少一個限位滑槽,該環本體的外緣形成至少一個對應該限位滑槽並容設於該限位滑槽中的限位凸塊,且該環本體的肋柱設於對應該限位凸塊處並容置於該限位滑槽中。 The fitting ultrasonic sensor device according to claim 1, wherein the inner wall surface of the hollow casing is recessed to form at least one limiting chute, and the outer edge of the ring body forms at least one corresponding limit chute. And a limiting protrusion disposed in the limiting slot, and the rib of the ring body is disposed at the corresponding limiting protrusion and received in the limiting sliding slot. 根據申請專利範圍第2項所述之嵌合式超聲波傳感器裝置,其中,該限位滑槽、該限位凸塊與該肋柱的數量為兩個 ,該等限位滑槽係形成於該中空殼體的內壁面且彼此相對,該等限位凸塊與該等肋柱係分別設置於該環本體的相反兩側,並分別容設於對應的限位滑槽中。 The chisel type ultrasonic sensor device according to claim 2, wherein the limit chute, the limit bump and the number of the ribs are two The limiting chutes are formed on the inner wall surface of the hollow casing and opposite to each other, and the limiting lugs and the ribbed columns are respectively disposed on opposite sides of the ring body, and are respectively accommodated in Corresponding in the limit chute. 根據申請專利範圍第2項所述之嵌合式超聲波傳感器裝置,其中,該限位滑槽與該限位凸塊的數量為三個,該肋柱的數量為兩個;該等限位滑槽其中之二係形成於該中空殼體的內壁面且彼此相對,該等限位凸塊其中之二以及該等肋柱係分別設置於該環本體的相反兩側,且該等限位凸塊與該等肋柱係分別容設於對應的限位滑槽中。 The chisel type ultrasonic sensor device of claim 2, wherein the number of the limit chutes and the limit bumps is three, and the number of the ribs is two; the limit chutes Two of the limiting protrusions are formed on the inner wall surface of the hollow housing and opposite to each other, and two of the limiting protrusions and the rib pillars are respectively disposed on opposite sides of the ring body, and the limiting protrusions are respectively The block and the ribs are respectively accommodated in the corresponding limit chutes. 根據申請專利範圍第1項所述之嵌合式超聲波傳感器裝置,其中,該外殼還包括一第一減震環,該第一減震環以具彈性的材料製成,並設置於該中空殼體的第二開口處,而與該傳感器的座體相接觸地封閉該第二開口。 The chisel type ultrasonic sensor device according to claim 1, wherein the outer casing further comprises a first damper ring, the first damper ring is made of a resilient material, and is disposed on the hollow shell The second opening of the body is closed in contact with the seat of the sensor. 根據申請專利範圍第1項所述之嵌合式超聲波傳感器裝置,其中,該固定環還包括一設置於該環本體對應該傳感器處的第二減震環,該第二減震環以具彈性的材料製成,並抵觸於該傳感器的座體。 The chisel type ultrasonic sensor device of claim 1, wherein the fixing ring further comprises a second damper ring disposed at the sensor corresponding to the ring body, the second damper ring being elastic Made of material and against the body of the sensor. 根據申請專利範圍第1項所述之嵌合式超聲波傳感器裝置,其中,該密封蓋是藉由超聲波熔接技術或雷射熔接技術而熔接於該中空殼體。 The fitting ultrasonic sensor device according to claim 1, wherein the sealing cover is welded to the hollow casing by an ultrasonic welding technique or a laser welding technique. 一種嵌合式超聲波傳感器裝置的組裝方法,包含以下步驟:(A)製備一具有相對應的一第一開口與一第二開口且包括至少一外接腳的外殼,並將一壓電片及一吸震件依 序設置於一座體中而製備一傳感器;(B)將該傳感器裝設於該外殼,且藉由該傳感器封閉該外殼的第二開口;(C)將一具有至少一肋柱及至少一內接腳的固定環裝設於該外殼中且抵壓於該傳感器,並將該固定環的內接腳電連接於該傳感器,且令該肋柱朝向該外殼的第一開口凸伸;(D)將一電路板裝設於該外殼中,並將該電路板電性連接於該外殼的外接腳及該固定環的內接腳;及(E)將一密封蓋裝設於該外殼且抵壓於該固定環的肋柱,並藉由該密封蓋封閉該外殼的第一開口。 A method for assembling a chimeric ultrasonic sensor device comprises the steps of: (A) preparing a housing having a corresponding first opening and a second opening and including at least one external pin, and a piezoelectric piece and a shock absorbing Piece a sensor is disposed in the body to prepare a sensor; (B) the sensor is mounted on the outer casing, and the second opening of the outer casing is closed by the sensor; (C) having at least one rib column and at least one inner portion a fixing ring of the pin is mounted in the outer casing and is pressed against the sensor, and electrically connects the inner leg of the fixing ring to the sensor, and protrudes the rib toward the first opening of the outer casing; a circuit board is mounted in the outer casing, and the circuit board is electrically connected to the outer leg of the outer casing and the inner leg of the fixing ring; and (E) a sealing cover is mounted on the outer casing and Pressing the rib of the retaining ring and closing the first opening of the outer casing by the sealing cover. 根據申請專利範圍第8項所述之組裝方法,其中,於步驟(B)該傳感器係經由該外殼的第一開口裝設於該外殼中,並部分地突出於該第二開口外。 The assembly method according to claim 8, wherein in the step (B), the sensor is installed in the outer casing via the first opening of the outer casing and partially protrudes outside the second opening. 根據申請專利範圍第8項所述之組裝方法,其中,該外殼之中空殼體的內壁面係形成至少一在該第一開口與該第二開口之間延伸的限位滑槽,該固定環的環本體係形成至少一個對應該限位滑槽的限位凸塊,且該肋柱係設置於對應該限位凸塊處;於步驟(C)該固定環係經由該外殼的第一開口裝設於該外殼中,且該限位凸塊與該肋柱係由該第一開口朝該第二開口的方向滑入該限位滑槽中。 The assembly method of claim 8, wherein the inner wall surface of the hollow casing of the outer casing forms at least one limit chute extending between the first opening and the second opening, the fixing The ring-shaped ring system forms at least one limiting protrusion corresponding to the limiting chute, and the rib column is disposed at the corresponding limiting protrusion; in the step (C), the fixing ring is first through the outer casing The opening is installed in the outer casing, and the limiting protrusion and the rib are slid into the limiting sliding slot from the first opening toward the second opening. 根據申請專利範圍第8項所述之組裝方法,其中,於步驟(E)該密封蓋是藉由超聲波熔接技術或雷射熔接技術而熔接於該外殼。 The assembly method according to claim 8, wherein in the step (E), the sealing cover is welded to the outer casing by an ultrasonic welding technique or a laser welding technique.
TW101137107A 2012-10-08 2012-10-08 Embedded ultrasonic transducer device and assembling method thereof TW201415057A (en)

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TW101137107A TW201415057A (en) 2012-10-08 2012-10-08 Embedded ultrasonic transducer device and assembling method thereof
US13/841,937 US20140096609A1 (en) 2012-10-08 2013-03-15 Ultrasonic sensor device and method for assembling the same
EP13161179.0A EP2717256A2 (en) 2012-10-08 2013-03-26 Ultrasonic sensor device and method for assembling the same
JP2013180976A JP5640125B2 (en) 2012-10-08 2013-09-02 Ultrasonic sensor device and method for assembling the ultrasonic sensor device

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106199615A (en) * 2016-09-12 2016-12-07 广州市佑航电子有限公司 Piezoelectric ceramic piece and there is the ultrasonic sensor of this piezoelectric ceramic piece
US10955279B2 (en) 2017-12-06 2021-03-23 The Boeing Company Ultrasonic fluid measurement probe with ultrasonically welded base cap

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106199615A (en) * 2016-09-12 2016-12-07 广州市佑航电子有限公司 Piezoelectric ceramic piece and there is the ultrasonic sensor of this piezoelectric ceramic piece
US10955279B2 (en) 2017-12-06 2021-03-23 The Boeing Company Ultrasonic fluid measurement probe with ultrasonically welded base cap

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