TW201414599A - Method of forming a case - Google Patents

Abstract

A method of forming a case is provided. The method of forming a case includes at least the following steps: providing a substrate; mixing a substrate, a first hardener, a second hardener and an epoxy resin in a mold for performing a first solidify process to form a semi-manufactured object, wherein a first hardener coated by a micro capsule; and heating the semi-manufactured object to make the micro capsule ruptured and vaporized, such that the first hardener contacts the semi-manufactured object and a second solidify process is reacted to form the case.

Description

Housing molding method

The present invention relates to a method of forming a casing, and in particular to a method of forming a casing which can be plastically deformed twice.

In order to achieve the slim design requirements of these portable electronic devices, conventional housings such as mobile phones, notebook computers or other portable electronic devices are mostly made of carbon fiber materials. The carbon fiber material is a thermosetting epoxy resin, and it is necessary to use a refrigerator that can keep the carbon fiber material at a low temperature before the step of generally forming. When forming, the material is usually heated to accelerate the molding speed by heating; once formed, the finished product cannot be plastically deformed.

The present invention provides a housing molding method that can be plastically deformed twice.

The housing molding method of the present invention comprises at least the steps of: providing a substrate; mixing the first hardener, the second hardener, and the epoxy resin in the mold to perform the first Forming a semi-finished product by a curing reaction, wherein the first hardener is coated by the microcapsule; and heating the semi-finished product to break and volatilize the microcapsule, so that the first hardener is in contact with the semi-finished product to perform a second curing reaction to form a shell .

Based on the above, the housing molding method of the present invention uses a molding method that is completely different from the conventional art, so that the housing can be molded twice, and in the first molding, in a sheet state, thus facilitating printing. , storage, management and transportation; and in the second molding, 3D solidification will be carried out for various needs. The step of reducing the rework or processing can be achieved by using the housing molding method of the present invention.

In order to make the above features and advantages of the present invention more comprehensible, the following embodiments are described in detail with reference to the accompanying drawings.

S112~S130‧‧‧Steps

110‧‧‧ container

120‧‧‧Microcapsule resin

130‧‧‧First hardener

140‧‧‧Second hardener

150‧‧‧ epoxy resin

160‧‧‧Semi-finished products

170‧‧‧Shell

180‧‧‧microcapsules

190‧‧‧Substrate

FIG. 1 is a flow chart showing the steps of a method for molding a casing according to an embodiment of the present invention.

2 is a schematic view of a method of forming a first hardener.

3 is a schematic view showing uniform mixing of a first hardener, a second hardener, and an epoxy resin.

Figure 4 is a schematic illustration of a semi-finished product.

Figure 5 is a schematic view of the housing.

1 is a flow chart of steps of a method for molding a casing according to an embodiment of the present invention, and FIG. 2 A schematic view of a method for forming a first hardener, and FIG. 3 is a schematic view of uniform mixing of a first hardener, a second hardener, and an epoxy resin. Referring to FIG. 1 , FIG. 2 and FIG. 3 simultaneously, the housing molding method of the embodiment includes at least the following steps: pouring the hardener and the liquid incompatible with the hardener into the container 110, and fully filling the container 110 Stirring, as in step S112; pouring the microcapsule epoxy resin 120 into the container 110 in which the hardening agent and the liquid have been sufficiently stirred, as in step S114; waiting for the microcapsule epoxy resin 120 to undergo polymerization to form a microcapsule 180 coated The first hardener 130 is as in step S116. Finally, after filtering the liquid in the container 110, the microcapsules can be taken out for use.

Thereafter, the first curing agent 130 coated with the microcapsules 180, the substrate 190, the second curing agent 140 not coated with the microcapsules 180, and the epoxy resin 150 are mixed in a mold to form a first curing reaction. The semi-finished product 160 (shown in Figure 4) is as in step S120. The first curing reaction may be that the first hardener 130, the second hardener 140, the substrate 190, and the epoxy resin 150 are placed in the mold, and the second hardener 140 and the ring not covered by the microcapsules 180 are placed. The oxy-resin 150 is combined and formed into a semi-finished product, and the shape of the semi-finished product is determined by the shape of the mold. Generally speaking, the semi-finished product formed by the first curing reaction is in the shape of a two-dimensional plate, which is convenient for printing, storage and management, and saves the refrigeration refrigerator equipment and storage space required for preserving the semi-finished products, and can also be conveniently followed. The processing is cut to a small size as required. Incidentally, the substrate 190 is a carbon fiber cloth, and the epoxy resin may be selected from the group consisting of a group consisting of the combination thereof; the first hardener 130 described above may be selected from a group consisting of the combination thereof; the second hardener 140 described above may be selected from And the group consisting of its combination. Alternatively, at least one of the first hardener 130 and the second hardener 140 may be an amine resin. Briefly, the materials of the first hardener 130 and the second hardener 140 may be the same or different, and are determined according to actual needs. In addition, the weight percentage of the first curing agent 130 coated by the microcapsules 180 in the mixture of the first curing agent 130, the second curing agent 140, and the epoxy resin 150 is about 40 to 60%, in the present case. In a preferred embodiment, the weight percentage is about 50%.

It should be noted that after the first curing reaction forms the semi-finished product 160 (shown in FIG. 4), since the first hardener 130 is covered by the microcapsules 180, in the case where the microcapsules 180 still exist, A hardener 130 does not react with the second hardener 140 or the epoxy resin 150 to have a curing reaction, so it can be maintained in a semi-finished product. The state, that is, the semi-finished product is not fully cured, but also has plasticity. Meanwhile, compared with the conventional art, it is necessary to prevent the curing reaction by additionally using the refrigerator to keep the first hardener 130, the second hardener 140 and the epoxy resin 150 at a low temperature, and the casing molding method of the present embodiment Because of the presence of the microcapsules 180, the first hardener 130 and the epoxy resin 150 are isolated from each other to prevent initiation of the curing reaction, so that the number of equipment (such as a refrigerator) required for preserving the semi-finished product can be reduced, thereby saving costs.

Next, the semi-finished product is heated to a temperature of about 180 to 200 degrees Celsius. In a preferred embodiment of the present invention, the heating temperature is 190 degrees, the microcapsule 180 is broken and volatilized, so that the first hardener 130 is in contact with the semi-finished product. The casing 170 is formed by performing the second curing reaction, as in step S130, and the casing 170 formed by the second curing reaction has a three-dimensional shape (as shown in FIG. 5). The housing 170 may be formed by a small-sized 2-dimensional sheet material after the semi-finished product 160 has been subjected to a cutting process, or may be formed of a large-sized 2-dimensional sheet material of the semi-finished product 160 that has not been subjected to cutting, depending on actual needs.

In summary, the housing molding method of the present invention uses a molding method that is completely different from the conventional art, and thus has at least the following advantages:

1. The housing molding method of the present invention utilizes microcapsules to block the contact of the first hardener with the epoxy resin, compared to the conventional art that allows the housing to have a three-dimensional shape and is difficult to receive only after one curing. The second curing agent not covered by the microcapsules is firstly cured after being contacted with the epoxy resin to form a plastic two-dimensional semi-finished product, thereby facilitating printing, storage, management and transportation.

Second, compared with the conventional art, it is necessary to prevent the curing reaction by keeping the first hardener, the second hardener and the epoxy resin at a low temperature by additionally using a refrigerator, in the present molding method because In the primary curing reaction, the first hardener coated by the microcapsule is separated from the epoxy resin to prevent the curing reaction from being initiated at a normal temperature, so that the number of equipment (such as a refrigerator) required for preserving the semi-finished product can be reduced. And thus save costs.

3. The microcapsule can prevent the second curing reaction from being generated at a normal temperature, so that the material of the first hardener and the second hardener is more elastic.

4. The temperature at which the microcapsules rupture and volatilize due to heating is low, so the heating temperature required for the shell molding method of the present invention is lower than that required by the prior art, in other words, it can be shorter than the conventional technique. The heating time is cured to form a casing.

5. The shell molding method of the present case uses the secondary molding method, so that the second molding can be performed for various requirements after the first molding, thereby achieving the steps of reducing the rework or processing.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present case. Any person having ordinary knowledge in the technical field can protect the case without making any changes or refinements without departing from the spirit and scope of the present case. The scope is subject to the definition of the scope of the patent application.

S112~S130‧‧‧Steps

Claims (10)

A method for molding a casing, comprising: providing a substrate; mixing the substrate, a first hardener, a second hardener, and an epoxy resin in a mold to perform a first curing reaction to form a half finished product Wherein the first hardener is coated with a microcapsule; and the semi-finished product is heated to cause the microcapsule to be broken and volatilized such that the first hardener contacts the semi-finished product to perform a second curing reaction to form a case. The method for molding a casing according to claim 1, wherein the first hardener is selected from the group consisting of And the group consisting of its combination. The method for molding a casing according to claim 1, wherein the second hardener is selected from the group consisting of And the group consisting of its combination. The method for molding a casing according to claim 1, wherein the epoxy resin is selected from the group consisting of And the group consisting of its combination. The method for molding a casing according to claim 1, wherein the method of forming the first hardener comprises: pouring a hardener and a liquid incompatible with the hardener into a container, and The container is thoroughly stirred; a microcapsule resin is poured into the hardener and the container in which the liquid is sufficiently stirred; and the microcapsule resin is awaited for polymerization to form the first hardener coated by the microcapsule . The method for molding a casing according to claim 1, wherein the first hardener is 40% to 60% by weight in a mixture of the first hardener, the second hardener and the epoxy resin. . The casing molding method according to claim 1, wherein the temperature at which the semi-finished product is heated is 180 to 200 degrees Celsius. The casing molding method according to claim 1, wherein the semi-finished product formed by the first curing reaction has a two-dimensional plate shape, and the casing formed by the second curing reaction has a three-dimensional shape. The method for molding a casing according to claim 1, wherein the substrate It is a carbon fiber cloth. The method of molding a casing according to claim 1, wherein at least one of the first hardener and the second hardener is an amine resin.