TW201414555A - Cooling of drills for printed circuit boards - Google Patents

Cooling of drills for printed circuit boards Download PDF

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Publication number
TW201414555A
TW201414555A TW102125286A TW102125286A TW201414555A TW 201414555 A TW201414555 A TW 201414555A TW 102125286 A TW102125286 A TW 102125286A TW 102125286 A TW102125286 A TW 102125286A TW 201414555 A TW201414555 A TW 201414555A
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TW
Taiwan
Prior art keywords
chamber
cooling
drill bit
drill
providing
Prior art date
Application number
TW102125286A
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Chinese (zh)
Inventor
Edward Feng
Original Assignee
Linde Ag
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Application filed by Linde Ag filed Critical Linde Ag
Publication of TW201414555A publication Critical patent/TW201414555A/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23QDETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q11/00Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
    • B23Q11/0042Devices for removing chips
    • B23Q11/005Devices for removing chips by blowing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23QDETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q11/00Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
    • B23Q11/10Arrangements for cooling or lubricating tools or work
    • B23Q11/1038Arrangements for cooling or lubricating tools or work using cutting liquids with special characteristics, e.g. flow rate, quality
    • B23Q11/1061Arrangements for cooling or lubricating tools or work using cutting liquids with special characteristics, e.g. flow rate, quality using cutting liquids with specially selected composition or state of aggregation

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Drilling And Boring (AREA)

Abstract

An apparatus for cooling a drill bit includes a housing having an open ended chamber therein which extends through the housing for receiving the drill bit, a first passage for providing a cooling substance to the chamber to cool the drill bit, and an outlet in communication with the chamber and through which the drill bit can extend for drilling. A method of cooling a drill bit is also provided.

Description

用於印刷電路板之鑽頭之冷卻 Cooling of drill bits for printed circuit boards

本發明實施例係關於用以在印刷電路板中鑽孔之裝置。 Embodiments of the invention relate to apparatus for drilling a hole in a printed circuit board.

用於電子工業之大多數類型之印刷電路板(PCB)係由複數個層(樹脂層及金屬層兩者)組成。PCB製造商需要在每一板中鑽製大量孔。隨後孔在其內部電鍍銅,且銅用作板之複數個層之間的連接器。在鑽製製程期間,PCB之樹脂層經加熱並可「塗抹」於孔中之銅層上,從而在銅電鍍之後防礙層間之電接觸。因此必須在電鍍製程之前將孔中之所得「膠渣(smear)」移除。此導致額外的不期望之PCB處理時間。 Most types of printed circuit boards (PCBs) used in the electronics industry consist of a plurality of layers (both resin layers and metal layers). PCB manufacturers need to drill a large number of holes in each board. The holes are then plated with copper inside and copper is used as a connector between the layers of the board. During the drilling process, the resin layer of the PCB is heated and "smeared" onto the copper layer in the hole to prevent electrical contact between the layers after copper plating. Therefore, the resulting "smear" in the holes must be removed prior to the electroplating process. This results in additional undesirable PCB processing time.

在PCB鑽製期間發生之切割及磨削製程期間產生熱。鑽製之溫度可高達300℃。在孔之所有側上自鑽製所產生之膠渣係由熱鑽頭鑽錐(drill bit)熔融PCB材料中樹脂層之環氧而引起。此外,鑽頭鑽錐因重複使用而開始磨損並且磨損鑽錐具有使發生塗抹加劇之傾向。降低塗抹之一種方式係相應地降低鑽頭速度,但此降低PCB之鑽製及裝配線製程之效率及有效性。規模經濟決定鑽製越快越經濟,即使需要在其後移除膠渣。 Heat is generated during the cutting and grinding processes that occur during PCB drilling. The temperature can be drilled up to 300 °C. The glue produced by self-drilling on all sides of the hole is caused by the epoxy bit of the resin layer in the drill bit of the hot drill drill. In addition, the drill bit begins to wear due to repeated use and the wear tap has a tendency to exacerbate the application. One way to reduce smear is to reduce the bit speed accordingly, but this reduces the efficiency and effectiveness of the PCB drilling and assembly line process. Economies of scale determine the faster and more economical the drilling, even if it is necessary to remove the glue later.

因此期望具有可與鑽頭一起使用以避免塗抹、但不犧牲鑽製製程之速度之裝置。 It is therefore desirable to have a device that can be used with a drill bit to avoid smearing without sacrificing the speed of the drilling process.

10‧‧‧裝置 10‧‧‧ device

12‧‧‧心軸 12‧‧‧ mandrel

14‧‧‧鑽頭鑽錐 14‧‧‧Drill drill cone

16‧‧‧印刷電路板 16‧‧‧Printed circuit board

18‧‧‧壓力蓋 18‧‧‧ Pressure cover

20‧‧‧側壁 20‧‧‧ side wall

22‧‧‧開口端室 22‧‧‧Open end room

23‧‧‧階梯 23‧‧‧Ladder

24‧‧‧蓋之下部部分 24‧‧‧Under the cover

25‧‧‧室之下部部分 25‧‧‧ below the room

26‧‧‧間隔部件/間隔件 26‧‧‧ Spacer/spacer

28‧‧‧側壁之底部表面 28‧‧‧Bottom surface of the side wall

30‧‧‧PCB之上表面 30‧‧‧Top surface of PCB

32‧‧‧第一埠 32‧‧‧ first

34‧‧‧第二埠 34‧‧‧Second

36‧‧‧排氣軟管 36‧‧‧Exhaust hose

38‧‧‧氣體管道 38‧‧‧ gas pipeline

40‧‧‧末端部分 40‧‧‧ end part

42‧‧‧二氧化碳 42‧‧‧ Carbon dioxide

43‧‧‧幫浦 43‧‧‧

44‧‧‧管道 44‧‧‧ Pipes

45‧‧‧噴霧 45‧‧‧ spray

46‧‧‧閥 46‧‧‧Valves

48‧‧‧流量計 48‧‧‧ Flowmeter

50‧‧‧壓力計 50‧‧‧ pressure gauge

52‧‧‧噴嘴 52‧‧‧Nozzles

54‧‧‧氣體或液體CO2 54‧‧‧ gas or liquid CO 2

56‧‧‧內管 56‧‧‧Inside

58‧‧‧氮氣 58‧‧‧Nitrogen

60‧‧‧管道分支 60‧‧‧ Pipeline branch

62‧‧‧外管 62‧‧‧External management

為更全面地理解本發明實施例,可結合附圖參考以下說明,其中:圖1顯示用於冷卻鑽頭鑽錐之本發明之裝置實施例;及 圖2顯示用於圖1之裝置實施例之噴嘴。 For a more complete understanding of the embodiments of the present invention, reference should be made to the following description in conjunction with the drawings in which: FIG. 1 shows an apparatus embodiment of the present invention for cooling a drill bit; and Figure 2 shows a nozzle for the embodiment of the apparatus of Figure 1.

在圖1中所示裝置實施例係大體上顯示在10處並與用於所示心軸12之鑽頭結合使用。 The device embodiment shown in Figure 1 is shown generally at 10 and used in conjunction with a drill bit for the illustrated mandrel 12.

鑽頭鑽錐14附接至鑽頭之心軸12,該鑽頭鑽錐用於在例如印刷電路板(PCB)16中鑽孔。應理解鑽頭鑽錐14可用於在其他物體及製品中鑽孔。 A drill collar 14 is attached to a mandrel 12 of a drill bit for drilling a hole in, for example, a printed circuit board (PCB) 16. It should be understood that the drill collar 14 can be used to drill holes in other objects and articles.

裝置10包括具有界定開口端室22或空間之側壁20之壓力蓋18或外殼。心軸12可藉由機械緊固件(例如螺釘)連接至壓力蓋18。可自金屬或塑膠製造壓力蓋18。如圖1所示,室22係於兩側末端開口,並經定大小及定形狀以接收心軸12及鑽頭鑽錐14。如圖1所示,室22經構造為具有階梯23,該階梯之直徑小於室直徑以接收心軸12至室內之某一深度,該深度與將鑽製穿過並穿透PCB 16之鑽頭鑽錐14之部分相稱。實際上,室22及蓋18之下部部分24協同作用以限制心軸12在開口端室22中之向下移動。室22之下部部分25經定大小及定形狀以接收鑽頭鑽錐14,並經定位與欲鑽製之PCB 16之區域對準。 The device 10 includes a pressure cap 18 or outer casing having a side wall 20 that defines an open end chamber 22 or space. The mandrel 12 can be coupled to the pressure cap 18 by mechanical fasteners such as screws. The pressure cap 18 can be fabricated from metal or plastic. As shown in Figure 1, the chamber 22 is open at both ends and is sized and shaped to receive the mandrel 12 and the drill collar 14. As shown in FIG. 1, chamber 22 is configured to have a step 23 having a diameter smaller than the chamber diameter to receive a certain depth of the mandrel 12 to the interior, the depth being drilled with a drill bit that will be drilled through and penetrated the PCB 16. The portion of the cone 14 is commensurate. In effect, chamber 22 and lower portion 24 of cover 18 cooperate to limit the downward movement of mandrel 12 in open end chamber 22. The lower portion 25 of the chamber 22 is sized and shaped to receive the drill collar 14 and is positioned to align with the area of the PCB 16 to be drilled.

間隔部件26或插入物毗鄰外殼佈置,且如所示位在側壁20之底部表面28與PCB 16之上表面30之間。間隔件26可經形成為壓力蓋18之一部分。在鑽製期間,當鑽錐14鑽過PCB 16時,間隔件26支撐鑽頭之頭部。在某些應用期間,當壓力蓋18及間隔件26經定位用於鑽製時,間隔件可形成氣密密封以便將室22密封使與壓力蓋及PCB外部之大氣隔離。可自金屬或塑膠製造間隔件26,但通常自比製造蓋18之材料硬之材料製造。 The spacer member 26 or insert is disposed adjacent the outer casing and is positioned between the bottom surface 28 of the side wall 20 and the upper surface 30 of the PCB 16 as shown. The spacer 26 can be formed as part of the pressure cap 18. During drilling, the spacer 26 supports the head of the drill bit as the drill cone 14 is drilled through the PCB 16. During certain applications, when the pressure cap 18 and the spacer 26 are positioned for drilling, the spacer may form a hermetic seal to seal the chamber 22 from the atmosphere of the pressure cap and the exterior of the PCB. The spacer 26 can be fabricated from metal or plastic, but is typically fabricated from a material that is harder than the material from which the cover 18 is made.

壓力蓋18包括位在側壁20中之埠或通路。位在側壁20中之第一埠32或通路係用於將冷卻物質引入至開口端室22中。第二埠34或通路係用於自室22藉助(例如)排氣軟管36排放或排出大氣及任何微粒物 質。 The pressure cap 18 includes a weir or passageway in the side wall 20. The first weir 32 or passageway in the side wall 20 is for introducing a cooling substance into the open end chamber 22. The second weir 34 or passageway is used to vent or vent the atmosphere and any particulate matter from the chamber 22 by, for example, the exhaust hose 36. quality.

參照第一埠32,氣體管道38可延伸穿過第一埠並包括於室22中終止且接近鑽頭鑽錐14之末端部分40。二氧化碳(CO2)42可藉助與氣體管道38連接之管道44自遠程來源(未顯示)引入。用於氣體之閥46、流量計48及壓力計50與管道44流體連通。將閥46佈置於流量計48之上游,並將流量計佈置於壓力計50之上游,該等皆佈置於管道38之上游。 Referring to the first weir 32, the gas conduit 38 can extend through the first weir and is included in the chamber 22 to terminate and approximate the end portion 40 of the drill collar 14. Carbon dioxide (CO 2 ) 42 can be introduced from a remote source (not shown) by means of a conduit 44 connected to a gas conduit 38. Valve 46 for gas, flow meter 48, and pressure gauge 50 are in fluid communication with conduit 44. The valve 46 is disposed upstream of the flow meter 48 and the flow meter is disposed upstream of the pressure gauge 50, all of which are disposed upstream of the conduit 38.

CO2 42係作為液體CO2提供,以便在其穿過氣體管道38以自管道之末端部分40注入期間其相變化為氣體及固體(乾冰)。可將CO2作為噴霧45噴射或以脈衝方式輸送至室22中。末端部分可包括噴嘴。隨著壓力沿管道38下降,液體CO2將變化為氣體及固體之混合物,且最終固體亦將變化為氣體。CO2氣體冷卻鑽頭鑽錐14。心軸12於極高之速度下旋轉以推進鑽頭鑽錐14穿過PCB 16。冷卻係發生在當鑽頭鑽錐14自其剛在PCB 16中所鑽製之孔抽出或縮回時之期間。此乃因鑽頭鑽錐14係暴露於室22中之冷卻氣體。PCB中之孔較小且係在幾分之一秒內鑽製。亦即,當鑽頭鑽錐14自其剛在PCB 16中所鑽製之孔縮回或移除時,鑽錐立即暴露於氣態二氧化碳以冷卻鑽錐,以便其在降低溫度下用於下一欲鑽製孔,從而降低樹脂層中將發生環氧熔融及塗抹之機會。僅舉例說明,由於使用CO2,室22中之溫度係自-10℃至5℃。 The CO 2 42 system is provided as liquid CO 2 so that its phase changes to gas and solids (dry ice) as it passes through the gas conduit 38 to be injected from the end portion 40 of the conduit. The CO 2 can be sprayed as a spray 45 or pulsed into the chamber 22. The end portion can include a nozzle. As the pressure drop along the duct 38, the liquid CO 2 will vary as a mixture of gas and solids, and finally the solid gas will also change. The CO 2 gas cools the drill cone 14 . The mandrel 12 rotates at a very high speed to propel the bit drill cone 14 through the PCB 16. The cooling system occurs during the time when the drill collar 14 is withdrawn or retracted from the hole it just drilled in the PCB 16. This is because the drill collar 14 is exposed to the cooling gas in the chamber 22. The holes in the PCB are small and are drilled in fractions of a second. That is, when the drill bit 14 is retracted or removed from the hole it has just drilled in the PCB 16, the drill cone is immediately exposed to gaseous carbon dioxide to cool the drill cone so that it is used for the next desire at reduced temperatures. Drill holes to reduce the chances of epoxy melting and smearing in the resin layer. By way of example only, the temperature in chamber 22 is from -10 ° C to 5 ° C due to the use of CO 2 .

若需要,液體二氧化碳可以脈衝方式輸送並將冷卻劑CO2之噴射直接瞄準鑽頭鑽錐。實際上,當鑽頭鑽錐抽出時其已冷卻,以致其係在降低溫度下用於下一鑽製操作,由此防止摩擦熱積聚而熔融樹脂板之環氧樹脂。或者,脈衝輸送CO2以接觸鑽頭鑽錐14可發生於鑽頭鑽錐自孔一抽出並直至鑽頭鑽錐即將開始在PCB 16中鑽製下一孔之時。為提供CO2之脈衝輸送,使用用於液體CO2之幫浦43。幫浦43與 管道44流體連通,並可位在閥46之上游。幫浦43可經定時以提供CO2至室22之脈衝簇,或該幫浦可藉由自鑽頭12傳輸之信號控制。亦即,當鑽錐14正自PCB 16縮回時,鑽頭可傳輸或觸發信號至幫浦43以將CO2提供至室22。CO2注入循環亦可起始於當鑽頭鑽錐14接觸PCB 16時開始並當鑽頭鑽錐自PCB抽出時停止之液體CO2脈衝。 If desired, the liquid carbon dioxide can be pulsed conveyance and the coolant of CO 2 aimed directly at the injection cone drill bit. In fact, the drill bit is cooled when it is withdrawn so that it is used at the lower temperature for the next drilling operation, thereby preventing the frictional heat from accumulating and melting the epoxy resin of the resin sheet. Alternatively, pulsed CO 2 in contact with the cone drill bit 14 may occur in the drill bit from the tapered bore until withdrawn and a drill bit about to start of the next cone of the hole drilled in the PCB 16. To provide a pulsed CO 2, the CO 2 used for the liquid pump 43. The pump 43 is in fluid communication with the conduit 44 and may be located upstream of the valve 46. Pump 43 may be timed to provide a CO 2 to pulse cluster housing 22, or the pump control signal may be transmitted by the drill bit 12 from. That is, when drilling the cone 14 when the PCB 16 is retracted from the timing, or the drill bit may transmit a trigger signal to the pump 43 CO 2 is supplied to the chamber 22. CO 2 injection loop also begins with start and stop pulse the liquid CO 2 when the cone drill bit withdrawn from the PCB when the contact cone drill bit 14 PCB 16.

或者,噴霧45可作為噴霧、脈衝流或射流連續地提供至室22。然而,PCB 16之鑽製通常將妨礙CO2進入已鑽製孔來冷卻鑽錐14,直至當鑽錐自孔抽出之時。因此,為節約CO2,可僅當鑽錐14實際上未鑽製PCB 16時才實施向室22提供CO2。亦即,在鑽製期間向室22提供CO2對鑽製程序或PCB 16係無害的;但其將導致使用較多CO2Alternatively, the spray 45 can be continuously supplied to the chamber 22 as a spray, pulse stream or jet. However, PCB's drill 16 is generally interfere with CO 2 has been drilled into the drill hole to cool the cone 14, when the hole until the cone drawn from the drilling. Thus, to save CO 2, only when the drill 14 may not actually drilled PCB 16 when CO is supplied to the chamber embodiment 222 cone. That is, during drilling to provide a chamber 22 CO 2 produced on well drilling program or sound-based PCB 16; but it will result in the use of more CO 2.

參照圖2,展示安裝至管道38之末端部分40之另一類型之噴嘴52。在此噴嘴52(亦稱為同軸管噴嘴)中,將氣體或液體CO2 54引入至內管56中,同時將氮氣58(例如在3巴下)引入至與外管62或用於氮氣之管道連通之管道分支60中。內管56係佈置於外管62內。CO2 54及氮氣58沿噴嘴52流動,以便氮氣係在二氧化碳54外部,且在某些應用中當氣體離開噴嘴以提供至鑽頭鑽錐14時氮氣覆蓋二氧化碳54。氮氣將降低於鑽頭鑽錐14處及在PCB 16上之濕氣凝結。內管56與外管可係同軸的。可自不銹鋼製造管道38、噴嘴40及同軸噴嘴52。 Referring to Figure 2, another type of nozzle 52 mounted to the end portion 40 of the conduit 38 is shown. The nozzle 52 (also referred to as a coaxial tube nozzle), the gas or liquid CO 2 54 introduced into the inner tube 56, while nitrogen gas 58 (e.g. 3 bar) is introduced into the outer tube 62 for nitrogen gas or The pipe is connected to the pipe branch 60. The inner tube 56 is disposed within the outer tube 62. CO 2 54 and nitrogen 58 flow along nozzle 52 such that nitrogen is external to carbon dioxide 54 and, in some applications, nitrogen blankets carbon dioxide 54 as it exits the nozzle to provide to drill bit 14 . Nitrogen will be reduced at the drill cone 14 and the moisture on the PCB 16 will condense. The inner tube 56 and the outer tube can be coaxial. The conduit 38, the nozzle 40 and the coaxial nozzle 52 can be fabricated from stainless steel.

本發明實施例降低用已知鑽製裝置發生之膠渣並消除相同裝置所需之後續除膠渣製程。本發明實施例亦降低鑽頭鑽錐14之磨損並延長其工作壽命。由於實質上降低鑽頭鑽錐之過熱及塗抹,因此使得PCB 16中之鑽製孔表面更光滑且鑽製速度增加。 Embodiments of the present invention reduce the amount of slag that occurs with known drilling equipment and eliminate the subsequent desmear process required for the same apparatus. Embodiments of the present invention also reduce wear on the drill bit 14 and extend its operational life. The drilled hole surface in the PCB 16 is smoother and the drilling speed is increased by substantially reducing the overheating and smearing of the drill cone.

應理解,本文所述之實施例僅為例示性的,且熟習此項技術者可作出各種改變及修改,此並不背離本發明之精神及範圍。所有該等改變及修改皆意欲納入本文所述及主張之本發明範圍內。另外,所揭示之所有實施例無需呈替代方式,此乃因本發明之各實施例可組合以 提供期望之結果。 It is understood that the embodiments described herein are illustrative only and that various changes and modifications may be made without departing from the spirit and scope of the invention. All such changes and modifications are intended to be included within the scope of the invention described and claimed herein. In addition, all of the disclosed embodiments are not required to be substituted, as the various embodiments of the present invention may be combined. Provide the desired results.

10‧‧‧裝置 10‧‧‧ device

12‧‧‧心軸 12‧‧‧ mandrel

14‧‧‧鑽頭鑽錐 14‧‧‧Drill drill cone

16‧‧‧印刷電路板 16‧‧‧Printed circuit board

18‧‧‧壓力蓋 18‧‧‧ Pressure cover

20‧‧‧側壁 20‧‧‧ side wall

22‧‧‧開口端室 22‧‧‧Open end room

23‧‧‧階梯 23‧‧‧Ladder

24‧‧‧蓋之下部部分 24‧‧‧Under the cover

25‧‧‧室之下部部分 25‧‧‧ below the room

26‧‧‧間隔部件/間隔件 26‧‧‧ Spacer/spacer

28‧‧‧側壁之底部表面 28‧‧‧Bottom surface of the side wall

30‧‧‧PCB之上表面 30‧‧‧Top surface of PCB

32‧‧‧第一埠 32‧‧‧ first

34‧‧‧第二埠 34‧‧‧Second

36‧‧‧排氣軟管 36‧‧‧Exhaust hose

38‧‧‧氣體管道 38‧‧‧ gas pipeline

40‧‧‧末端部分 40‧‧‧ end part

42‧‧‧二氧化碳 42‧‧‧ Carbon dioxide

43‧‧‧幫浦 43‧‧‧

44‧‧‧管道 44‧‧‧ Pipes

45‧‧‧噴霧 45‧‧‧ spray

46‧‧‧閥 46‧‧‧Valves

48‧‧‧流量計 48‧‧‧ Flowmeter

50‧‧‧壓力計 50‧‧‧ pressure gauge

Claims (20)

一種用於冷卻鑽頭鑽錐之裝置,其包含:外殼,在其中具有延伸穿過該外殼用於接收該鑽頭鑽錐之開口端室;第一通路,其用於向該室提供冷卻物質以冷卻該鑽頭鑽錐;及出口,其與該室連通且該鑽頭鑽錐可延伸穿過其用於鑽製。 An apparatus for cooling a drill cone, comprising: an outer casing having an open end chamber extending therethrough for receiving the drill tap; a first passage for providing cooling material to the chamber for cooling The drill bit is drilled; and an outlet is in communication with the chamber and the drill cone extends through it for drilling. 如請求項1之裝置,其進一步包含延伸穿過該第一通路用於提供該冷卻物質至該室中之管道。 The device of claim 1 further comprising a conduit extending through the first passage for providing the cooling material to the chamber. 如請求項1之裝置,其進一步包含與該室連通用於自該室排放大氣及微粒物質之第二通路。 The device of claim 1, further comprising a second passage in communication with the chamber for discharging atmospheric and particulate matter from the chamber. 如請求項3之裝置,其進一步包含與該第二通路連通之排放管道。 The device of claim 3, further comprising a discharge conduit in communication with the second passage. 如請求項1之裝置,其進一步包含具有貫穿孔之間隔部件,該間隔部件經定大小及定形狀用於毗鄰該外殼佈置以使該孔與該出口對準。 The device of claim 1, further comprising a spacing member having a through hole, the spacing member being sized and shaped for positioning adjacent the housing to align the aperture with the outlet. 如請求項5之裝置,其中該間隔部件係由選自由以下組成之群之材料製造:金屬、塑膠及硬度大於該外殼之硬度之組合物。 The device of claim 5, wherein the spacer member is made of a material selected from the group consisting of metal, plastic, and a composition having a hardness greater than the hardness of the outer shell. 如請求項1之裝置,其中該冷卻物質係選自由以下組成之群:二氧化碳(CO2)、氮氣(N2)及CO2與N2之組合。 The device of claim 1, wherein the cooling material is selected from the group consisting of carbon dioxide (CO 2 ), nitrogen (N 2 ), and a combination of CO 2 and N 2 . 如請求項2之裝置,其進一步包含噴嘴,該噴嘴連接至該管道末端並定位於該室中用於噴霧該冷卻物質以接觸該鑽頭鑽錐。 The device of claim 2, further comprising a nozzle coupled to the end of the conduit and positioned in the chamber for spraying the cooling material to contact the drill collar. 如請求項8之裝置,其中該噴嘴包含藉助其提供CO2之內管及圍繞該內管且藉助其提供N2之外管。 A device according to claim 8, wherein the nozzle comprises an inner tube through which the CO 2 is supplied and a tube surrounding the inner tube and providing N 2 therewith. 如請求項9之裝置,其中該等內管及外管係同軸的。 The device of claim 9, wherein the inner and outer tubes are coaxial. 如請求項1之裝置,其進一步包含與該冷卻物質流體連通之幫浦 用於以脈衝方式將該冷卻物質輸送至該室中。 The device of claim 1, further comprising a pump in fluid communication with the cooling substance For conveying the cooling substance to the chamber in a pulsed manner. 如請求項1之裝置,其中該外殼係自選自由金屬及塑膠組成之群之材料形成。 The device of claim 1, wherein the outer casing is formed from a material selected from the group consisting of metal and plastic. 一種冷卻鑽頭鑽錐之方法,其包含:在外殼之室中接收該鑽頭鑽錐;提供冷卻物質至該室用於冷卻該鑽頭鑽錐;及將該冷卻物質含納於該室中。 A method of cooling a drill bit of a drill bit, comprising: receiving the drill bit in a chamber of a casing; providing a cooling substance to the chamber for cooling the drill bit; and including the cooling material in the chamber. 如請求項13之方法,其中該提供該冷卻物質係在用該鑽頭鑽錐鑽製之後發生。 The method of claim 13, wherein the providing the cooling material occurs after drilling with the drill bit. 如請求項13之方法,其進一步包含自該室排放該冷卻物質。 The method of claim 13, further comprising discharging the cooled material from the chamber. 如請求項13之方法,其中該提供該冷卻物質包含將該冷卻物質以所選間隔以脈衝方式輸送至該室中。 The method of claim 13, wherein the providing the cooling material comprises pulsing the cooling material to the chamber at selected intervals. 如請求項13之方法,其中該冷卻物質係選自由以下組成之群:CO2、N2及CO2與N2之組合。 The method of claim 13, wherein the cooling material is selected from the group consisting of CO 2 , N 2 , and a combination of CO 2 and N 2 . 如請求項17之方法,其中提供CO2及N2之該組合包含將℃O2之第一流及毗鄰該第一流之N2之第二流提供至該室。 The method of the requested item 17, wherein providing the composition CO.'S 2 and N 2 of the first flow comprises ℃ O 2 of the first stream and the adjacent second stream of N 2 is supplied to the chamber of. 如請求項18之方法,其中該等第一及第二流係共軸的。 The method of claim 18, wherein the first and second streams are coaxial. 如請求項13之方法,其中該含納該冷卻物質包含密封該外殼之該室使與該外殼外部之大氣隔離。 The method of claim 13 wherein the containing the cooling material comprises sealing the chamber of the outer casing from the atmosphere outside the outer casing.
TW102125286A 2012-10-12 2013-07-15 Cooling of drills for printed circuit boards TW201414555A (en)

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