TW201414555A - Cooling of drills for printed circuit boards - Google Patents
Cooling of drills for printed circuit boards Download PDFInfo
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- TW201414555A TW201414555A TW102125286A TW102125286A TW201414555A TW 201414555 A TW201414555 A TW 201414555A TW 102125286 A TW102125286 A TW 102125286A TW 102125286 A TW102125286 A TW 102125286A TW 201414555 A TW201414555 A TW 201414555A
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- chamber
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- drill bit
- drill
- providing
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
- B23Q11/0042—Devices for removing chips
- B23Q11/005—Devices for removing chips by blowing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
- B23Q11/10—Arrangements for cooling or lubricating tools or work
- B23Q11/1038—Arrangements for cooling or lubricating tools or work using cutting liquids with special characteristics, e.g. flow rate, quality
- B23Q11/1061—Arrangements for cooling or lubricating tools or work using cutting liquids with special characteristics, e.g. flow rate, quality using cutting liquids with specially selected composition or state of aggregation
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Drilling And Boring (AREA)
Abstract
Description
本發明實施例係關於用以在印刷電路板中鑽孔之裝置。 Embodiments of the invention relate to apparatus for drilling a hole in a printed circuit board.
用於電子工業之大多數類型之印刷電路板(PCB)係由複數個層(樹脂層及金屬層兩者)組成。PCB製造商需要在每一板中鑽製大量孔。隨後孔在其內部電鍍銅,且銅用作板之複數個層之間的連接器。在鑽製製程期間,PCB之樹脂層經加熱並可「塗抹」於孔中之銅層上,從而在銅電鍍之後防礙層間之電接觸。因此必須在電鍍製程之前將孔中之所得「膠渣(smear)」移除。此導致額外的不期望之PCB處理時間。 Most types of printed circuit boards (PCBs) used in the electronics industry consist of a plurality of layers (both resin layers and metal layers). PCB manufacturers need to drill a large number of holes in each board. The holes are then plated with copper inside and copper is used as a connector between the layers of the board. During the drilling process, the resin layer of the PCB is heated and "smeared" onto the copper layer in the hole to prevent electrical contact between the layers after copper plating. Therefore, the resulting "smear" in the holes must be removed prior to the electroplating process. This results in additional undesirable PCB processing time.
在PCB鑽製期間發生之切割及磨削製程期間產生熱。鑽製之溫度可高達300℃。在孔之所有側上自鑽製所產生之膠渣係由熱鑽頭鑽錐(drill bit)熔融PCB材料中樹脂層之環氧而引起。此外,鑽頭鑽錐因重複使用而開始磨損並且磨損鑽錐具有使發生塗抹加劇之傾向。降低塗抹之一種方式係相應地降低鑽頭速度,但此降低PCB之鑽製及裝配線製程之效率及有效性。規模經濟決定鑽製越快越經濟,即使需要在其後移除膠渣。 Heat is generated during the cutting and grinding processes that occur during PCB drilling. The temperature can be drilled up to 300 °C. The glue produced by self-drilling on all sides of the hole is caused by the epoxy bit of the resin layer in the drill bit of the hot drill drill. In addition, the drill bit begins to wear due to repeated use and the wear tap has a tendency to exacerbate the application. One way to reduce smear is to reduce the bit speed accordingly, but this reduces the efficiency and effectiveness of the PCB drilling and assembly line process. Economies of scale determine the faster and more economical the drilling, even if it is necessary to remove the glue later.
因此期望具有可與鑽頭一起使用以避免塗抹、但不犧牲鑽製製程之速度之裝置。 It is therefore desirable to have a device that can be used with a drill bit to avoid smearing without sacrificing the speed of the drilling process.
10‧‧‧裝置 10‧‧‧ device
12‧‧‧心軸 12‧‧‧ mandrel
14‧‧‧鑽頭鑽錐 14‧‧‧Drill drill cone
16‧‧‧印刷電路板 16‧‧‧Printed circuit board
18‧‧‧壓力蓋 18‧‧‧ Pressure cover
20‧‧‧側壁 20‧‧‧ side wall
22‧‧‧開口端室 22‧‧‧Open end room
23‧‧‧階梯 23‧‧‧Ladder
24‧‧‧蓋之下部部分 24‧‧‧Under the cover
25‧‧‧室之下部部分 25‧‧‧ below the room
26‧‧‧間隔部件/間隔件 26‧‧‧ Spacer/spacer
28‧‧‧側壁之底部表面 28‧‧‧Bottom surface of the side wall
30‧‧‧PCB之上表面 30‧‧‧Top surface of PCB
32‧‧‧第一埠 32‧‧‧ first
34‧‧‧第二埠 34‧‧‧Second
36‧‧‧排氣軟管 36‧‧‧Exhaust hose
38‧‧‧氣體管道 38‧‧‧ gas pipeline
40‧‧‧末端部分 40‧‧‧ end part
42‧‧‧二氧化碳 42‧‧‧ Carbon dioxide
43‧‧‧幫浦 43‧‧‧
44‧‧‧管道 44‧‧‧ Pipes
45‧‧‧噴霧 45‧‧‧ spray
46‧‧‧閥 46‧‧‧Valves
48‧‧‧流量計 48‧‧‧ Flowmeter
50‧‧‧壓力計 50‧‧‧ pressure gauge
52‧‧‧噴嘴 52‧‧‧Nozzles
54‧‧‧氣體或液體CO2 54‧‧‧ gas or liquid CO 2
56‧‧‧內管 56‧‧‧Inside
58‧‧‧氮氣 58‧‧‧Nitrogen
60‧‧‧管道分支 60‧‧‧ Pipeline branch
62‧‧‧外管 62‧‧‧External management
為更全面地理解本發明實施例,可結合附圖參考以下說明,其中:圖1顯示用於冷卻鑽頭鑽錐之本發明之裝置實施例;及 圖2顯示用於圖1之裝置實施例之噴嘴。 For a more complete understanding of the embodiments of the present invention, reference should be made to the following description in conjunction with the drawings in which: FIG. 1 shows an apparatus embodiment of the present invention for cooling a drill bit; and Figure 2 shows a nozzle for the embodiment of the apparatus of Figure 1.
在圖1中所示裝置實施例係大體上顯示在10處並與用於所示心軸12之鑽頭結合使用。 The device embodiment shown in Figure 1 is shown generally at 10 and used in conjunction with a drill bit for the illustrated mandrel 12.
鑽頭鑽錐14附接至鑽頭之心軸12,該鑽頭鑽錐用於在例如印刷電路板(PCB)16中鑽孔。應理解鑽頭鑽錐14可用於在其他物體及製品中鑽孔。 A drill collar 14 is attached to a mandrel 12 of a drill bit for drilling a hole in, for example, a printed circuit board (PCB) 16. It should be understood that the drill collar 14 can be used to drill holes in other objects and articles.
裝置10包括具有界定開口端室22或空間之側壁20之壓力蓋18或外殼。心軸12可藉由機械緊固件(例如螺釘)連接至壓力蓋18。可自金屬或塑膠製造壓力蓋18。如圖1所示,室22係於兩側末端開口,並經定大小及定形狀以接收心軸12及鑽頭鑽錐14。如圖1所示,室22經構造為具有階梯23,該階梯之直徑小於室直徑以接收心軸12至室內之某一深度,該深度與將鑽製穿過並穿透PCB 16之鑽頭鑽錐14之部分相稱。實際上,室22及蓋18之下部部分24協同作用以限制心軸12在開口端室22中之向下移動。室22之下部部分25經定大小及定形狀以接收鑽頭鑽錐14,並經定位與欲鑽製之PCB 16之區域對準。 The device 10 includes a pressure cap 18 or outer casing having a side wall 20 that defines an open end chamber 22 or space. The mandrel 12 can be coupled to the pressure cap 18 by mechanical fasteners such as screws. The pressure cap 18 can be fabricated from metal or plastic. As shown in Figure 1, the chamber 22 is open at both ends and is sized and shaped to receive the mandrel 12 and the drill collar 14. As shown in FIG. 1, chamber 22 is configured to have a step 23 having a diameter smaller than the chamber diameter to receive a certain depth of the mandrel 12 to the interior, the depth being drilled with a drill bit that will be drilled through and penetrated the PCB 16. The portion of the cone 14 is commensurate. In effect, chamber 22 and lower portion 24 of cover 18 cooperate to limit the downward movement of mandrel 12 in open end chamber 22. The lower portion 25 of the chamber 22 is sized and shaped to receive the drill collar 14 and is positioned to align with the area of the PCB 16 to be drilled.
間隔部件26或插入物毗鄰外殼佈置,且如所示位在側壁20之底部表面28與PCB 16之上表面30之間。間隔件26可經形成為壓力蓋18之一部分。在鑽製期間,當鑽錐14鑽過PCB 16時,間隔件26支撐鑽頭之頭部。在某些應用期間,當壓力蓋18及間隔件26經定位用於鑽製時,間隔件可形成氣密密封以便將室22密封使與壓力蓋及PCB外部之大氣隔離。可自金屬或塑膠製造間隔件26,但通常自比製造蓋18之材料硬之材料製造。 The spacer member 26 or insert is disposed adjacent the outer casing and is positioned between the bottom surface 28 of the side wall 20 and the upper surface 30 of the PCB 16 as shown. The spacer 26 can be formed as part of the pressure cap 18. During drilling, the spacer 26 supports the head of the drill bit as the drill cone 14 is drilled through the PCB 16. During certain applications, when the pressure cap 18 and the spacer 26 are positioned for drilling, the spacer may form a hermetic seal to seal the chamber 22 from the atmosphere of the pressure cap and the exterior of the PCB. The spacer 26 can be fabricated from metal or plastic, but is typically fabricated from a material that is harder than the material from which the cover 18 is made.
壓力蓋18包括位在側壁20中之埠或通路。位在側壁20中之第一埠32或通路係用於將冷卻物質引入至開口端室22中。第二埠34或通路係用於自室22藉助(例如)排氣軟管36排放或排出大氣及任何微粒物 質。 The pressure cap 18 includes a weir or passageway in the side wall 20. The first weir 32 or passageway in the side wall 20 is for introducing a cooling substance into the open end chamber 22. The second weir 34 or passageway is used to vent or vent the atmosphere and any particulate matter from the chamber 22 by, for example, the exhaust hose 36. quality.
參照第一埠32,氣體管道38可延伸穿過第一埠並包括於室22中終止且接近鑽頭鑽錐14之末端部分40。二氧化碳(CO2)42可藉助與氣體管道38連接之管道44自遠程來源(未顯示)引入。用於氣體之閥46、流量計48及壓力計50與管道44流體連通。將閥46佈置於流量計48之上游,並將流量計佈置於壓力計50之上游,該等皆佈置於管道38之上游。 Referring to the first weir 32, the gas conduit 38 can extend through the first weir and is included in the chamber 22 to terminate and approximate the end portion 40 of the drill collar 14. Carbon dioxide (CO 2 ) 42 can be introduced from a remote source (not shown) by means of a conduit 44 connected to a gas conduit 38. Valve 46 for gas, flow meter 48, and pressure gauge 50 are in fluid communication with conduit 44. The valve 46 is disposed upstream of the flow meter 48 and the flow meter is disposed upstream of the pressure gauge 50, all of which are disposed upstream of the conduit 38.
CO2 42係作為液體CO2提供,以便在其穿過氣體管道38以自管道之末端部分40注入期間其相變化為氣體及固體(乾冰)。可將CO2作為噴霧45噴射或以脈衝方式輸送至室22中。末端部分可包括噴嘴。隨著壓力沿管道38下降,液體CO2將變化為氣體及固體之混合物,且最終固體亦將變化為氣體。CO2氣體冷卻鑽頭鑽錐14。心軸12於極高之速度下旋轉以推進鑽頭鑽錐14穿過PCB 16。冷卻係發生在當鑽頭鑽錐14自其剛在PCB 16中所鑽製之孔抽出或縮回時之期間。此乃因鑽頭鑽錐14係暴露於室22中之冷卻氣體。PCB中之孔較小且係在幾分之一秒內鑽製。亦即,當鑽頭鑽錐14自其剛在PCB 16中所鑽製之孔縮回或移除時,鑽錐立即暴露於氣態二氧化碳以冷卻鑽錐,以便其在降低溫度下用於下一欲鑽製孔,從而降低樹脂層中將發生環氧熔融及塗抹之機會。僅舉例說明,由於使用CO2,室22中之溫度係自-10℃至5℃。 The CO 2 42 system is provided as liquid CO 2 so that its phase changes to gas and solids (dry ice) as it passes through the gas conduit 38 to be injected from the end portion 40 of the conduit. The CO 2 can be sprayed as a spray 45 or pulsed into the chamber 22. The end portion can include a nozzle. As the pressure drop along the duct 38, the liquid CO 2 will vary as a mixture of gas and solids, and finally the solid gas will also change. The CO 2 gas cools the drill cone 14 . The mandrel 12 rotates at a very high speed to propel the bit drill cone 14 through the PCB 16. The cooling system occurs during the time when the drill collar 14 is withdrawn or retracted from the hole it just drilled in the PCB 16. This is because the drill collar 14 is exposed to the cooling gas in the chamber 22. The holes in the PCB are small and are drilled in fractions of a second. That is, when the drill bit 14 is retracted or removed from the hole it has just drilled in the PCB 16, the drill cone is immediately exposed to gaseous carbon dioxide to cool the drill cone so that it is used for the next desire at reduced temperatures. Drill holes to reduce the chances of epoxy melting and smearing in the resin layer. By way of example only, the temperature in chamber 22 is from -10 ° C to 5 ° C due to the use of CO 2 .
若需要,液體二氧化碳可以脈衝方式輸送並將冷卻劑CO2之噴射直接瞄準鑽頭鑽錐。實際上,當鑽頭鑽錐抽出時其已冷卻,以致其係在降低溫度下用於下一鑽製操作,由此防止摩擦熱積聚而熔融樹脂板之環氧樹脂。或者,脈衝輸送CO2以接觸鑽頭鑽錐14可發生於鑽頭鑽錐自孔一抽出並直至鑽頭鑽錐即將開始在PCB 16中鑽製下一孔之時。為提供CO2之脈衝輸送,使用用於液體CO2之幫浦43。幫浦43與 管道44流體連通,並可位在閥46之上游。幫浦43可經定時以提供CO2至室22之脈衝簇,或該幫浦可藉由自鑽頭12傳輸之信號控制。亦即,當鑽錐14正自PCB 16縮回時,鑽頭可傳輸或觸發信號至幫浦43以將CO2提供至室22。CO2注入循環亦可起始於當鑽頭鑽錐14接觸PCB 16時開始並當鑽頭鑽錐自PCB抽出時停止之液體CO2脈衝。 If desired, the liquid carbon dioxide can be pulsed conveyance and the coolant of CO 2 aimed directly at the injection cone drill bit. In fact, the drill bit is cooled when it is withdrawn so that it is used at the lower temperature for the next drilling operation, thereby preventing the frictional heat from accumulating and melting the epoxy resin of the resin sheet. Alternatively, pulsed CO 2 in contact with the cone drill bit 14 may occur in the drill bit from the tapered bore until withdrawn and a drill bit about to start of the next cone of the hole drilled in the PCB 16. To provide a pulsed CO 2, the CO 2 used for the liquid pump 43. The pump 43 is in fluid communication with the conduit 44 and may be located upstream of the valve 46. Pump 43 may be timed to provide a CO 2 to pulse cluster housing 22, or the pump control signal may be transmitted by the drill bit 12 from. That is, when drilling the cone 14 when the PCB 16 is retracted from the timing, or the drill bit may transmit a trigger signal to the pump 43 CO 2 is supplied to the chamber 22. CO 2 injection loop also begins with start and stop pulse the liquid CO 2 when the cone drill bit withdrawn from the PCB when the contact cone drill bit 14 PCB 16.
或者,噴霧45可作為噴霧、脈衝流或射流連續地提供至室22。然而,PCB 16之鑽製通常將妨礙CO2進入已鑽製孔來冷卻鑽錐14,直至當鑽錐自孔抽出之時。因此,為節約CO2,可僅當鑽錐14實際上未鑽製PCB 16時才實施向室22提供CO2。亦即,在鑽製期間向室22提供CO2對鑽製程序或PCB 16係無害的;但其將導致使用較多CO2。 Alternatively, the spray 45 can be continuously supplied to the chamber 22 as a spray, pulse stream or jet. However, PCB's drill 16 is generally interfere with CO 2 has been drilled into the drill hole to cool the cone 14, when the hole until the cone drawn from the drilling. Thus, to save CO 2, only when the drill 14 may not actually drilled PCB 16 when CO is supplied to the chamber embodiment 222 cone. That is, during drilling to provide a chamber 22 CO 2 produced on well drilling program or sound-based PCB 16; but it will result in the use of more CO 2.
參照圖2,展示安裝至管道38之末端部分40之另一類型之噴嘴52。在此噴嘴52(亦稱為同軸管噴嘴)中,將氣體或液體CO2 54引入至內管56中,同時將氮氣58(例如在3巴下)引入至與外管62或用於氮氣之管道連通之管道分支60中。內管56係佈置於外管62內。CO2 54及氮氣58沿噴嘴52流動,以便氮氣係在二氧化碳54外部,且在某些應用中當氣體離開噴嘴以提供至鑽頭鑽錐14時氮氣覆蓋二氧化碳54。氮氣將降低於鑽頭鑽錐14處及在PCB 16上之濕氣凝結。內管56與外管可係同軸的。可自不銹鋼製造管道38、噴嘴40及同軸噴嘴52。 Referring to Figure 2, another type of nozzle 52 mounted to the end portion 40 of the conduit 38 is shown. The nozzle 52 (also referred to as a coaxial tube nozzle), the gas or liquid CO 2 54 introduced into the inner tube 56, while nitrogen gas 58 (e.g. 3 bar) is introduced into the outer tube 62 for nitrogen gas or The pipe is connected to the pipe branch 60. The inner tube 56 is disposed within the outer tube 62. CO 2 54 and nitrogen 58 flow along nozzle 52 such that nitrogen is external to carbon dioxide 54 and, in some applications, nitrogen blankets carbon dioxide 54 as it exits the nozzle to provide to drill bit 14 . Nitrogen will be reduced at the drill cone 14 and the moisture on the PCB 16 will condense. The inner tube 56 and the outer tube can be coaxial. The conduit 38, the nozzle 40 and the coaxial nozzle 52 can be fabricated from stainless steel.
本發明實施例降低用已知鑽製裝置發生之膠渣並消除相同裝置所需之後續除膠渣製程。本發明實施例亦降低鑽頭鑽錐14之磨損並延長其工作壽命。由於實質上降低鑽頭鑽錐之過熱及塗抹,因此使得PCB 16中之鑽製孔表面更光滑且鑽製速度增加。 Embodiments of the present invention reduce the amount of slag that occurs with known drilling equipment and eliminate the subsequent desmear process required for the same apparatus. Embodiments of the present invention also reduce wear on the drill bit 14 and extend its operational life. The drilled hole surface in the PCB 16 is smoother and the drilling speed is increased by substantially reducing the overheating and smearing of the drill cone.
應理解,本文所述之實施例僅為例示性的,且熟習此項技術者可作出各種改變及修改,此並不背離本發明之精神及範圍。所有該等改變及修改皆意欲納入本文所述及主張之本發明範圍內。另外,所揭示之所有實施例無需呈替代方式,此乃因本發明之各實施例可組合以 提供期望之結果。 It is understood that the embodiments described herein are illustrative only and that various changes and modifications may be made without departing from the spirit and scope of the invention. All such changes and modifications are intended to be included within the scope of the invention described and claimed herein. In addition, all of the disclosed embodiments are not required to be substituted, as the various embodiments of the present invention may be combined. Provide the desired results.
10‧‧‧裝置 10‧‧‧ device
12‧‧‧心軸 12‧‧‧ mandrel
14‧‧‧鑽頭鑽錐 14‧‧‧Drill drill cone
16‧‧‧印刷電路板 16‧‧‧Printed circuit board
18‧‧‧壓力蓋 18‧‧‧ Pressure cover
20‧‧‧側壁 20‧‧‧ side wall
22‧‧‧開口端室 22‧‧‧Open end room
23‧‧‧階梯 23‧‧‧Ladder
24‧‧‧蓋之下部部分 24‧‧‧Under the cover
25‧‧‧室之下部部分 25‧‧‧ below the room
26‧‧‧間隔部件/間隔件 26‧‧‧ Spacer/spacer
28‧‧‧側壁之底部表面 28‧‧‧Bottom surface of the side wall
30‧‧‧PCB之上表面 30‧‧‧Top surface of PCB
32‧‧‧第一埠 32‧‧‧ first
34‧‧‧第二埠 34‧‧‧Second
36‧‧‧排氣軟管 36‧‧‧Exhaust hose
38‧‧‧氣體管道 38‧‧‧ gas pipeline
40‧‧‧末端部分 40‧‧‧ end part
42‧‧‧二氧化碳 42‧‧‧ Carbon dioxide
43‧‧‧幫浦 43‧‧‧
44‧‧‧管道 44‧‧‧ Pipes
45‧‧‧噴霧 45‧‧‧ spray
46‧‧‧閥 46‧‧‧Valves
48‧‧‧流量計 48‧‧‧ Flowmeter
50‧‧‧壓力計 50‧‧‧ pressure gauge
Claims (20)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/CN2012/082832 WO2014056180A1 (en) | 2012-10-12 | 2012-10-12 | Cooling apparatus and method of drills for printed circuit boards |
Publications (1)
Publication Number | Publication Date |
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TW201414555A true TW201414555A (en) | 2014-04-16 |
Family
ID=50476890
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW102125286A TW201414555A (en) | 2012-10-12 | 2013-07-15 | Cooling of drills for printed circuit boards |
Country Status (3)
Country | Link |
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CN (1) | CN104781038A (en) |
TW (1) | TW201414555A (en) |
WO (1) | WO2014056180A1 (en) |
Families Citing this family (4)
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CN105171023B (en) * | 2014-06-06 | 2018-02-02 | 大族激光科技产业集团股份有限公司 | The mechanical drilling method of Micro-probe tool and its rig of use |
CN106944647A (en) * | 2017-04-19 | 2017-07-14 | 广东工业大学 | A kind of high multi-layer PCB board deep hole drilling method |
CN110860710A (en) * | 2019-11-22 | 2020-03-06 | 深圳市文地科技有限公司 | A digit control machine tool for processing cooling of being convenient for of part |
CN114310477B (en) * | 2022-03-15 | 2022-05-20 | 四川英创力电子科技股份有限公司 | Cooling and lubricating system of drilling equipment of printed circuit board |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4529340A (en) * | 1983-03-24 | 1985-07-16 | Wheelabrator-Frye, Inc. | Drilling method and apparatus |
JP2905842B2 (en) * | 1989-05-30 | 1999-06-14 | 日立精工株式会社 | Printed circuit board drilling machine and printed circuit board holding method in this drilling machine |
WO1992021481A1 (en) * | 1991-05-30 | 1992-12-10 | Hitachi Seiko, Ltd. | Pressure foot for perforating machine for printed board |
DE4230625A1 (en) * | 1992-09-12 | 1994-03-17 | Wuerth Elektronik Gmbh & Co Kg | Method and device for drilling printed circuit boards |
CN201552324U (en) * | 2009-09-29 | 2010-08-18 | 深圳市大族激光科技股份有限公司 | Chips discharging mechanism of drilling machine of printed circuit board |
CN102059581B (en) * | 2010-11-23 | 2012-11-28 | 深南电路有限公司 | Numerical control drill head cooling device and method |
CN202087453U (en) * | 2010-12-15 | 2011-12-28 | 杭州柏年光电标饰有限公司 | Adjustable spray device |
CN202137636U (en) * | 2011-06-13 | 2012-02-08 | 广德力达电气有限公司 | Water cooling device for drilling machines |
-
2012
- 2012-10-12 CN CN201280075660.5A patent/CN104781038A/en active Pending
- 2012-10-12 WO PCT/CN2012/082832 patent/WO2014056180A1/en active Application Filing
-
2013
- 2013-07-15 TW TW102125286A patent/TW201414555A/en unknown
Also Published As
Publication number | Publication date |
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CN104781038A (en) | 2015-07-15 |
WO2014056180A1 (en) | 2014-04-17 |
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