TW201411971A - Method and structure of solder terminal hung with solder and connector thereof - Google Patents
Method and structure of solder terminal hung with solder and connector thereof Download PDFInfo
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- TW201411971A TW201411971A TW101132860A TW101132860A TW201411971A TW 201411971 A TW201411971 A TW 201411971A TW 101132860 A TW101132860 A TW 101132860A TW 101132860 A TW101132860 A TW 101132860A TW 201411971 A TW201411971 A TW 201411971A
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 79
- 238000000034 method Methods 0.000 title claims description 20
- 238000005476 soldering Methods 0.000 claims description 93
- 238000005253 cladding Methods 0.000 claims description 18
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 238000003466 welding Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 238000005452 bending Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
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- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
Abstract
Description
本發明是有關於一種焊料件的掛設方法、其掛設結構及連接器,尤指一種焊料件與焊接端子之掛設方法、其掛設結構及連接器。 The invention relates to a hanging method of a soldering member, a hanging structure thereof and a connector, in particular to a hanging method of a soldering member and a soldering terminal, a hanging structure thereof and a connector.
隨著科技的進步,電子元件日益的微型化,為了使這些日益微型化的電子元件被精確地焊接於電路板上,表面黏著技術(Surface Mount Technology,SMT)亦面臨著越來越大的挑戰。 With the advancement of technology, electronic components are becoming more and more miniaturized. In order to make these increasingly miniaturized electronic components accurately soldered to the circuit board, Surface Mount Technology (SMT) is also facing increasing challenges. .
為了將焊料件固著於焊接端子上,習知的手法不外乎利用焊接端子的尖端插接一焊料球,然而此法卻存在著焊料球極易掉落的隱憂,而導致焊接品質不佳或漏焊的問題。 In order to fix the soldering member to the soldering terminal, the conventional method is to insert a solder ball by the tip of the soldering terminal. However, this method has the hidden problem that the solder ball is easily dropped, resulting in poor soldering quality. Or the problem of missing soldering.
另外亦有透過側掛的方式,將焊料設置於焊接端子側邊平面,然而此舉將導致焊料的實際位置偏離於焊接端子,進而造成焊接時準確定位的不便、需要重新設定定位以及微調。更有甚者,在現今電子元件微型化的趨勢下,如遇到欲焊位置附近有其他零件阻礙時,透過此法將在焊接作業進行時感受到極大的不方便。 In addition, the solder is placed on the side surface of the soldering terminal by means of a side-hanging method. However, this will cause the actual position of the solder to deviate from the soldering terminal, thereby causing inconvenience in accurate positioning during soldering, requiring repositioning and fine adjustment. What's more, in the current trend of miniaturization of electronic components, if there are other parts in the vicinity of the location to be soldered, this method will feel great inconvenience during the welding operation.
緣是,本發明人有感上述之課題,乃特潛心研究並配合學理之運用,終於提出一種設計合理且有效改善上述缺失之本發明。 The reason is that the present inventors have felt the above-mentioned problems, and have devoted themselves to research and cooperated with the application of the theory, and finally proposed a present invention which is rational in design and effective in improving the above-mentioned defects.
本發明之主要目的,在於提供一種焊接材料與焊接 端子之掛設方法、其掛設結構及連接器,以解決習知焊接方法容易遭遇焊料脫落或是焊料因為側掛而造成定位偏移上的不便。 The main object of the present invention is to provide a welding material and welding The terminal hanging method, the hanging structure and the connector are used to solve the inconvenience that the conventional soldering method is susceptible to solder detachment or the positioning offset of the solder due to the side hang.
為達上述目的,本發明提供一種焊接材料與焊接端子之掛設方法,包含以下步驟:提供一焊接端子,該焊接端子具有一第一正視面、一第二正視面以及一底邊,對該焊接端子穿設有一連通該第一正視面及該第二正視面的鏤空部;提供一焊料件,該焊料件具有一包覆基部,且該焊料件自該包覆基部更延伸出一延伸部;使該延伸部穿設於該鏤空部,同時彎折該延伸部靠近該包覆基部之一端,使該包覆基部得以沿該第一正視面、該底邊以及該第二正視面彎折而包覆該焊接端子;以及彎折該延伸部遠離該包覆基部之一端,使該延伸部呈一勾狀。 In order to achieve the above object, the present invention provides a method for attaching a solder material and a soldering terminal, comprising the steps of: providing a soldering terminal having a first front view surface, a second front view surface, and a bottom side, The soldering terminal is provided with a hollow portion connecting the first front view surface and the second front view surface; a soldering member is provided, the solder member has a coating base portion, and the solder member extends from the covering base portion to extend Passing the extension portion to the hollow portion while bending the extension portion near one end of the coating base portion to bend the coating base portion along the first front view surface, the bottom side and the second front view portion Folding and covering the soldering terminal; and bending the extending portion away from one end of the covering base to make the extending portion have a hook shape.
為達上述目的,本發明亦提供一種焊接材料與焊接端子之掛設結構,包含:一焊接端子,該焊接端子具有一第一正視面、一第二正視面以及一底邊,該焊接端子更穿設有一連通該第一正視面及該第二正視面的鏤空部;以及一焊料件,該焊料件具有一包覆基部,且自該包覆基部延伸出一延伸部,該包覆基部沿該第一正視面、該底邊以及該第二正視面彎折而包覆該焊接端子,該延伸部呈勾狀地穿設於該鏤空部。 In order to achieve the above object, the present invention also provides a mounting structure of a soldering material and a soldering terminal, comprising: a soldering terminal having a first front view surface, a second front view surface and a bottom side, the solder terminal further a hollow portion connected to the first front view surface and the second front view surface; and a solder member having a cladding base and extending from the cover base an extension portion, the cover base portion The soldering terminal is covered along the first front view surface, the bottom side, and the second front view surface, and the extended portion is formed in a hook shape through the hollow portion.
為達上述目的,本發明更進一步提供一種連接器,包含:一絕緣部;以及一焊接端子介面總成,該焊接端子介面總成延伸自該絕緣部,其中,該焊接端子介 面總成包含:數個焊接端子,該數個焊接端子分別具有一第一正視面、一第二正視面以及一底邊,該數個焊接端子穿設有一連通該第一正視面及該第二正視面的鏤空部;以及數個焊料件,該數個焊料件具有一包覆基部,且自該包覆基部延伸出一延伸部,該延伸部呈勾狀地穿設於該鏤空部,該包覆基部沿該第一正視面、該底邊以及該第二正視面彎折而包覆該焊接端子,該包覆基部更包含有一底彎折部,該底彎折部用以包覆該底邊。 In order to achieve the above object, the present invention further provides a connector comprising: an insulating portion; and a solder terminal interface assembly extending from the insulating portion, wherein the solder terminal is interposed The surface assembly includes: a plurality of soldering terminals respectively having a first front view surface, a second front view surface and a bottom side, wherein the plurality of solder terminals are provided with a first front view surface and the first front view surface a hollow portion of the second front view; and a plurality of solder members having a cladding base, and an extension extending from the cover base, the extension being hooked through the hollow portion The covering base is bent along the first front view surface, the bottom side and the second front view surface to cover the soldering terminal, and the covering base further includes a bottom bent portion for wrapping Cover the bottom edge.
綜上所述,本發明可有效提升焊接材料與焊接端子之間連接上的穩定性,大量減少焊接材料自焊接端子脫落的機率,因此包含有本發明技術內容的連接器,也理所當然具有更可靠的連接效果。 In summary, the present invention can effectively improve the stability of the connection between the solder material and the solder terminal, and greatly reduce the probability of the solder material falling off from the solder terminal. Therefore, the connector including the technical content of the present invention is of course more reliable. Connection effect.
為使能更進一步瞭解本發明之特徵及技術內容,請參閱以下有關本發明之詳細說明與附圖,然而所附圖式僅提供參考與說明用,並非用來對本發明加以限制者。 For a better understanding of the features and technical aspects of the present invention, reference should be made to the accompanying drawings.
請參閱圖1所繪示,本發明提供一種焊料件與焊接端子的掛設方法,包含以下步驟提供一焊接端子10,焊接端子10具有一第一正視面11、一第二正視面12以及一底邊13,焊接端子10穿設有一連通第一正視面11及第二正視面12的鏤空部14(步驟S101);提供一焊料件20,焊料件20具有一包覆基部21,且焊料件20自包覆基部21更延伸出一延伸部211(步驟S103) ;使延伸部211穿設於鏤空部14,隨後彎折延伸部211靠近包覆基部21之一端,使包覆基部21得以沿第一正視面11、底邊13以及第二正視面12彎折而包覆焊接端子10(步驟S105);以及彎折延伸部211遠離該包覆基部21之一端,使該延伸部211呈一勾狀(步驟S107)。 Please refer to FIG. 1 , the present invention provides a soldering device and a soldering terminal mounting method, comprising the steps of providing a soldering terminal 10 having a first front view surface 11 , a second front view surface 12 , and a solder terminal 10 . The bottom edge 13, the soldering terminal 10 is provided with a hollow portion 14 that communicates with the first front view surface 11 and the second front view surface 12 (step S101); a solder member 20 is provided, the solder member 20 has a cladding base portion 21, and the solder The member 20 extends from the covering base 21 to an extending portion 211 (step S103) The extension portion 211 is disposed through the hollow portion 14, and then the bent extension portion 211 is adjacent to one end of the cladding base portion 21, so that the coating base portion 21 is bent along the first front view surface 11, the bottom side 13 and the second front view surface 12. The soldering terminal 10 is covered (step S105); and the bent extension portion 211 is away from one end of the coating base portion 21, so that the extending portion 211 has a hook shape (step S107).
承上,請同時參考圖1、圖3B及圖3C所繪示,其中步驟S105所述的包覆基部21更包含有一經過底邊13且在底邊13形成彎折的底彎折部212,底彎折部212可進一步穿設有至少一底鏤空部2120,底鏤空部2120的目的在於使底彎折部212的結構強度被適當地減弱,以使底彎折部212可以輕易地形成,然而底彎折部212並非一定要穿設有底鏤空部2120,因此可在執行本發明的掛設方法時視焊料件20本身的狀況等而定。 As shown in FIG. 1 , FIG. 3B and FIG. 3C , the covering base 21 of the step S105 further includes a bottom bent portion 212 that passes through the bottom edge 13 and is bent at the bottom edge 13 . The bottom bent portion 212 may further be provided with at least one bottom hollow portion 2120. The purpose of the bottom hollow portion 2120 is to appropriately weaken the structural strength of the bottom bent portion 212, so that the bottom bent portion 212 can be easily formed. However, the bottom bent portion 212 does not necessarily have to be provided with the bottom hollow portion 2120, and therefore can be determined depending on the condition of the solder material 20 itself or the like when performing the hanging method of the present invention.
較佳地,請參閱圖1、圖2B及圖3B,底彎折部212在形成且包覆於焊接端子10時,可以與底邊13間隔一空隙地或無間隔一空隙地包覆於底邊13,因此本處的包覆,並非僅限定於具有接觸性的貼附,亦包含可在間隔一空隙(不具接觸性)的狀況下讓底彎折部212包覆於底邊13。 Preferably, referring to FIG. 1 , FIG. 2B and FIG. 3B , when the bottom bent portion 212 is formed and covered on the soldering terminal 10 , the bottom bent portion 212 can be covered with the bottom edge 13 with a gap or without a gap. Since the side 13 is covered, the covering of the present portion is not limited to the contact with the contact, and the bottom bent portion 212 can be covered by the bottom edge 13 in a gap (without contact).
而當延伸部211穿過鏤空部14時,延伸部211遠離包覆基部21之一端可抵接於或融合於包覆基部21,以便形成一種勾狀或是環勾的結構,使焊料件20可更穩固地掛設於焊接端子10。 When the extending portion 211 passes through the hollow portion 14, the one end of the extending portion 211 away from the covering base portion 21 can abut or be fused to the covering base portion 21 to form a hook or ring hook structure, so that the solder member 20 It can be more stably hung on the soldering terminal 10.
本發明亦提供一種焊料件與焊接端子之掛設結構,如 圖2A及2B所繪示,焊料件與焊接端子的掛設結構包含:一焊接端子10及一焊料件20。 The invention also provides a hanging structure of a soldering piece and a soldering terminal, such as 2A and 2B, the mounting structure of the soldering member and the soldering terminal comprises: a soldering terminal 10 and a soldering member 20.
焊接端子10具有一第一正視面11、一第二正視面12以及一底邊13,焊接端子10更穿設有一連通第一正視面11及第二正視面12的鏤空部14,鏤空部14可供焊料件20的掛設之用。 The soldering terminal 10 has a first front view surface 11, a second front view surface 12 and a bottom side 13. The solder terminal 10 is further provided with a hollow portion 14 connecting the first front view surface 11 and the second front view surface 12, and the hollow portion 14 can be used for the mounting of the solder member 20.
焊料件20可以是任何形式的焊料,較佳地可為一焊錫條或呈片條狀的焊錫,當焊料件20較佳地可依照前述之掛設方法,而讓焊料件20掛設於焊接端子10上,焊料件20的結構具有一包覆基部21,且自包覆基部21延伸出一延伸部211,包覆基部21沿著焊接端子10的第一正視面11、底邊13以及第二正視面12彎折而包覆、貼附於焊接端子10,可以圖式中的施力方向F作為示意,但不以此為限,而延伸部211則呈勾狀地穿設於鏤空部14,用以負責使焊料件20可穩固地掛設於焊接端子10。 The solder member 20 may be any form of solder, preferably a solder strip or a strip of solder. When the solder member 20 is preferably mounted in accordance with the mounting method described above, the solder member 20 is attached to the solder. On the terminal 10, the solder member 20 has a cladding base portion 21, and an extension portion 211 extends from the cladding base portion 21. The cladding base portion 21 is along the first front view surface 11, the bottom edge portion 13 of the solder terminal 10. The two front view faces 12 are bent and covered and attached to the welding terminal 10, and the direction of the biasing force F in the drawing can be used as an illustration, but not limited thereto, and the extending portion 211 is hooked through the hollow portion. 14. It is responsible for making the solder member 20 stably hung on the solder terminal 10.
承上所述,包覆基部21位於焊接端子10底面13附近的部位更包含有一底彎折部212,尤指包覆基部21正要從焊接端子10的第一正視面11翻折越過底邊13要到達第二正視面12的底邊13附近部位,包覆於該底邊13的即為底彎折部212。 As described above, the portion of the covering base portion 21 located near the bottom surface 13 of the soldering terminal 10 further includes a bottom bent portion 212, and in particular, the covering base portion 21 is about to be folded from the first front viewing surface 11 of the soldering terminal 10 over the bottom edge. 13 is to reach the vicinity of the bottom edge 13 of the second front view surface 12, and the bottom bent portion 212 is covered by the bottom edge 13.
如圖2B繪示,所述底彎折部212無間隔一空隙地包覆於底邊13,意味著底彎折部212在包覆底邊13時與底邊13為接觸性的包覆,如此由於焊料件20與底邊13相互接觸到,可以使焊料件20更完善地受到焊接端子10所傳達的熱,有助於焊料的熔融。 As shown in FIG. 2B , the bottom bent portion 212 is covered on the bottom edge 13 without any gap, which means that the bottom bent portion 212 is in contact with the bottom edge 13 when covering the bottom edge 13 . Thus, since the solder member 20 and the bottom edge 13 are in contact with each other, the solder member 20 can be more perfectly subjected to the heat transmitted by the solder terminal 10, contributing to the melting of the solder.
而為了使所述掛設結構更加穩固,延伸部211遠離包 覆基部21之一端可抵接於或融合於包覆基部21,而以圖2B為例,則屬於延伸部211融合於包覆基部21的示範。 In order to make the hanging structure more stable, the extension portion 211 is away from the package. One end of the base portion 21 can abut or be fused to the cladding base portion 21, and in the case of FIG. 2B, an example in which the extension portion 211 is fused to the cladding base portion 21 is shown.
請參閱圖3B、3C及3D所繪示,為本發明焊料件與焊接端子之掛設結構另一實施例的示範,本實施例與前述實施例不同之處主要在於,焊料件20本身的形狀與前述實施例明顯不同,很容易可以區分出延伸部211、包覆基部21以及底彎折部212的結構差異,此外底彎折部212又進一步可具有底鏤空部2120。 3B, 3C and 3D, which illustrate another embodiment of the mounting structure of the soldering member and the soldering terminal of the present invention, the difference between the embodiment and the foregoing embodiment is mainly in the shape of the soldering member 20 itself. Significantly different from the foregoing embodiment, it is easy to distinguish the structural difference between the extension portion 211, the cladding base portion 21, and the bottom bent portion 212. Further, the bottom bent portion 212 may further have a bottom hollow portion 2120.
從本實施例觀之,可以了解到本實施例之掛設結構具有較為龐大的包覆基部21,因此在焊接時,將會比前述實施例提供更多更充足的焊料,以因應需要大量焊料時的需求,而因為包覆基部21的體積、面積都較為龐大,故可能造成包覆基部21在底邊13形成底彎折部212時在彎折上產生困難,因此可以事先在焊料件20上對應於底彎折部212部位之處,事先穿設好至少一底鏤空部2120,如此即可使底彎折部212的結構強度稍微相對地減弱,而令此掛設結構順利形成。 It can be understood from the present embodiment that the hanging structure of the embodiment has a relatively large cladding base 21, so that when soldering, more and more solder will be provided than the foregoing embodiment, so that a large amount of solder is required in response to the need. Since the volume and the area of the coating base portion 21 are relatively large, the coating base portion 21 may cause difficulty in bending when the bottom edge portion 13 forms the bottom bent portion 212, so that the solder member 20 may be previously used. At least the bottom hollow portion 2120 is disposed in advance at the portion corresponding to the bottom bent portion 212. Thus, the structural strength of the bottom bent portion 212 is slightly weakened, and the hanging structure is smoothly formed.
如圖3B所繪示,本實施例之延伸部211在穿過鏤空部14形成一勾狀的掛勾結構後,延伸部211採抵接的方式而抵接於包覆基部21的一端,但並不以此方式為限。此外底彎折部212亦可與底邊13之間間隔著一間隙,可讓此較為龐大的包覆基部21在彎折的過程中,提供一彎折應力上的裕度以避免斷裂,以增加掛設結構成形的成功率以及穩定性。 As shown in FIG. 3B, after the extension portion 211 of the present embodiment forms a hook-like hook structure through the hollow portion 14, the extension portion 211 abuts against one end of the cladding base portion 21, but This is not limited to this method. In addition, the bottom bent portion 212 can also be spaced apart from the bottom edge 13 to allow the relatively large cladding base portion 21 to provide a margin of bending stress during the bending process to avoid breakage. Increase the success rate and stability of the hanging structure.
請參閱圖4所繪示,根據上述的焊料件與焊接端子之 掛設結構以進一步運用,本發明更提供一種連接器C,包含:一絕緣部Q以及一焊接端子介面總成W。 Please refer to FIG. 4, according to the above soldering member and soldering terminal The connector structure is further utilized. The present invention further provides a connector C comprising: an insulating portion Q and a solder terminal interface assembly W.
絕緣部Q較佳地可為電性絕緣的塑料,並且可供握持;焊接端子介面總成W延伸自絕緣部Q,且焊接端子介面總成W更包含:數個焊接端子10以集數個焊料件20。 The insulating portion Q is preferably an electrically insulating plastic and is usable for holding; the soldering terminal interface assembly W extends from the insulating portion Q, and the soldering terminal interface assembly W further includes: a plurality of soldering terminals 10 in a set number Solder pieces 20.
所述數個焊接端子10同樣分別具有第一正視面11、第二正視面12以及底邊13,在所述焊接端子10還穿設有一連通第一正視面11及第二正視面12的鏤空部14。 The plurality of soldering terminals 10 also have a first front view surface 11 , a second front view surface 12 and a bottom side 13 respectively. The solder terminal 10 is further provided with a first front view surface 11 and a second front view surface 12 . Hollow section 14.
所述數個焊料件,同樣具有包覆基部21,且自包覆基部21延伸出有延伸部211,延伸部211呈勾狀地穿設於鏤空部14,包覆基部21沿第一正視面11、底邊13以及第二正視面12彎折而包覆於焊接端子10,所述包覆基部21更包含有底彎折部212,且所述底彎折部212用以包覆於所述焊接端子10的底邊13,藉此以在絕緣部Q上形成焊接端子介面總成W。 The plurality of soldering members also have a covering base portion 21, and an extending portion 211 extends from the covering base portion 21. The extending portion 211 is hooked through the hollow portion 14 and the covering base portion 21 is along the first front surface. 11. The bottom edge 13 and the second front view surface 12 are bent and covered on the soldering terminal 10. The covering base portion 21 further includes a bottom bent portion 212, and the bottom bent portion 212 is used for covering the bottom portion. The bottom edge 13 of the solder terminal 10 is described, whereby the solder terminal interface assembly W is formed on the insulating portion Q.
因此本發明之連接器C可採用如上兩個實施例所述之焊料件與焊接端子之掛設結構,以作為本連接器C的焊接端子介面總成W。 Therefore, the connector C of the present invention can employ the mounting structure of the solder member and the solder terminal as described in the above two embodiments as the solder terminal interface assembly W of the connector C.
較佳地,每個掛設結構中的底彎折部212可間隔一空隙地或無間隔一空隙地包覆於每個焊接端子10的底邊13。而所述掛設結構在形成時,所述延伸部211遠離包覆基部21之一端可抵接於或融合於所述的包覆基部21。 Preferably, the bottom bent portion 212 of each of the hanging structures may be wrapped around the bottom edge 13 of each soldering terminal 10 with a gap or without a gap. When the hanging structure is formed, the extending portion 211 can abut or be fused to the covering base 21 away from one end of the covering base 21 .
綜上所述,本發明之焊料件與焊接端子之掛設方法、其掛設結構及連接器,可使焊料件有效地設置於焊接端子之上,不佔過大的空間體積,亦不會需要於焊接時另外調 整定位,可有效簡化焊接的步驟,因此可有效確保焊接的效率。惟以上所述僅為本發明之較佳實施例,非意欲侷限本發明的專利保護範圍,故舉凡運用本發明說明書或圖式內容所為的等效變化,均同理皆包含於本發明的權利保護範圍內,合予陳明。 In summary, the soldering method of the soldering member and the soldering terminal of the present invention, the mounting structure thereof and the connector enable the soldering member to be effectively disposed on the soldering terminal without occupying an excessive space volume, and need not be required Additional adjustment during welding The entire positioning can effectively simplify the welding step, thus effectively ensuring the efficiency of welding. However, the above description is only the preferred embodiment of the present invention, and is not intended to limit the scope of the invention, and the equivalents thereof are all included in the scope of the present invention. Within the scope of protection, it is given to Chen Ming.
10‧‧‧焊接端子 10‧‧‧ soldering terminal
11‧‧‧第一正視面 11‧‧‧First front view
12‧‧‧第二正視面 12‧‧‧Second front view
13‧‧‧底邊 13‧‧‧Bottom
14‧‧‧鏤空部 14‧‧‧镂空部
20‧‧‧焊料件 20‧‧‧Solders
21‧‧‧包覆基部 21‧‧‧Covering base
211‧‧‧延伸部 211‧‧‧Extension
212‧‧‧底彎折部 212‧‧‧ bottom bend
2120‧‧‧底鏤空部 2120‧‧‧Bottom of the Ministry
C‧‧‧連接器 C‧‧‧Connector
F‧‧‧施力方向 F‧‧‧ Direction of force
Q‧‧‧絕緣部 Q‧‧‧Insulation
W‧‧‧焊接端子介面總成 W‧‧‧ solder terminal interface assembly
圖1為本發明焊料件與焊接端子之掛設方法之流程圖;圖2A為本發明焊料件與焊接端子之掛設結構之實施例的掛設前分解示意圖;圖2B;為本發明焊料件與焊接端子之掛設結構之實施例的掛設後立體示意圖;圖3A為本發明焊料件與焊接端子之掛設結構之另一實施例的掛設前示意圖;圖3B為本發明焊料件與焊接端子之掛設結構之另一實施例的掛設後立體示意圖(一);圖3C為本發明焊料件與焊接端子之掛設結構之另一實施例的掛設後立體示意圖(二);圖3D為本發明焊料件與焊接端子之掛設結構之另一實施例的掛設後立體示意圖(三)以及圖4為本發明連接器的立體示意圖。 1 is a flow chart of a method for hanging a soldering member and a soldering terminal according to the present invention; FIG. 2A is a schematic exploded view of a mounting structure of a soldering member and a soldering terminal according to the present invention; FIG. 2B is a soldering member of the present invention; 3A is a schematic perspective view of a mounting structure of a soldering terminal; FIG. 3A is a front view of a mounting structure of a soldering member and a soldering terminal according to another embodiment of the present invention; FIG. FIG. 3C is a perspective view of a second embodiment of a mounting structure of a soldering terminal according to another embodiment of the mounting structure of the soldering terminal; FIG. 3D is a perspective view (3) of the mounting of the soldering member and the soldering terminal according to another embodiment of the present invention, and FIG. 4 is a perspective view of the connector of the present invention.
10‧‧‧焊接端子 10‧‧‧ soldering terminal
11‧‧‧第一正視面 11‧‧‧First front view
12‧‧‧第二正視面 12‧‧‧Second front view
13‧‧‧底邊 13‧‧‧Bottom
14‧‧‧鏤空部 14‧‧‧镂空部
20‧‧‧焊料件 20‧‧‧Solders
21‧‧‧包覆基部 21‧‧‧Covering base
211‧‧‧延伸部 211‧‧‧Extension
212‧‧‧底彎折部 212‧‧‧ bottom bend
2120‧‧‧底鏤空部 2120‧‧‧Bottom of the Ministry
Claims (10)
Priority Applications (1)
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TW101132860A TWI460945B (en) | 2012-09-07 | 2012-09-07 | Method and structure of solder terminal hung with solder and connector therof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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TW101132860A TWI460945B (en) | 2012-09-07 | 2012-09-07 | Method and structure of solder terminal hung with solder and connector therof |
Publications (2)
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TW201411971A true TW201411971A (en) | 2014-03-16 |
TWI460945B TWI460945B (en) | 2014-11-11 |
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Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
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AU6337998A (en) * | 1997-02-28 | 1998-09-18 | Cornell Research Foundation Inc. | Self-assembled low-insertion force connector assembly |
EP2117082B1 (en) * | 2006-10-27 | 2016-05-18 | Asahi Denka Kenkyusho Co., Ltd. | Electrical connection structure |
TWM350121U (en) * | 2008-06-30 | 2009-02-01 | Hon Hai Prec Ind Co Ltd | Electrical contact |
JP2011070787A (en) * | 2009-09-24 | 2011-04-07 | Sumitomo Wiring Syst Ltd | Board terminal and printed circuit board with the same, and method of manufacturing printed circuit board |
CN102324647B (en) * | 2011-09-05 | 2013-06-12 | 番禺得意精密电子工业有限公司 | Electric connector terminal assembly method |
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