TW201411427A - Touch panel and its manufacturing method - Google Patents

Abstract

The present invention relates to a touch panel and its manufacturing method, wherein the touch panel of this invention has an integrated flexible substrate to achieve the functions of touch, wiring and electrical connection. The flexible substrate comprises a touch region, a connection terminal region, and a wiring region. The wiring region at least partially surrounds the touch region. The connection terminal region is integrally protruded from one side of the flexible substrate for electrically connecting to a motherboard. Accordingly, the touch panel of this invention can completely eliminate the requirement of a flexible substrate additionally attached to the conventional touch panel. The manufacturing method of touch panel of this invention can simultaneously form the sensing rows of the touch region and the wirings of the wiring region and the connection terminal region on the integrated flexible substrate, so as to greatly reduce the cost, reduce the process time and human resource, and improve the yield rate.

Description

Touch panel and method of manufacturing same

The present invention relates to a touch panel and a method of fabricating the same, and more particularly to a touch panel suitable for a touch screen and a method of fabricating the same.

Please refer to FIG. 7 first. FIG. 7 is an exploded view of a conventional touch panel. As shown in the figure, the conventional touch panel 1 mainly includes a substrate 10 and a flexible circuit board 11. The substrate 10 is provided with a plurality of touch element arrays 12 and a plurality of leads 13 , and one end of the plurality of leads 13 is electrically connected to the plurality of touch element arrays 12 , and the other end of the plurality of leads 13 extends to a junction area. 14.

On the other hand, the same number of wires 111 as the plurality of leads 13 are disposed on the flexible circuit board 11, and the flexible circuit board 11 is adhered to the land portion 14 of the substrate 10, and the plurality of the plurality of leads 13 are attached. One end of each of the plurality of wires 111 is electrically connected to each other to form a conventional touch panel 1. Accordingly, the conventional touch panel 1 is electrically connected to other circuit boards or controllers through the flexible circuit board 11 to achieve the purpose of touch.

However, in order to cooperate with the arrangement relationship between the components in the electronic device, the flexible circuit board 11 often needs to be bent, and when the flexible circuit board 11 is bent and deformed, stress is easily generated and used for a long time. This may damage the bonding of the flexible circuit board 11 to the substrate 10. In addition, the conventional touch panel 1 has many components of the flexible circuit board 11, which not only has high process cost, but also consumes human resources and man-hours, and easily affects the process yield.

The main object of the present invention is to provide a touch panel and a manufacturing method thereof, which can form a touch, a wire, and an electrical connection function by an integrated flexible substrate, thereby eliminating the conventional touch. The flexible circuit board attached to the panel greatly reduces the cost, reduces the man-hours and manpower of the process, and greatly increases the yield.

To achieve the above objective, a touch panel of the present invention mainly comprises: a flexible substrate, and a cover. The flexible substrate includes a touch area, a connection terminal area, and a routing area, and the wiring area at least partially surrounds the touch area, and the connection terminal area is integrally protruded from the flexible substrate. One side is used to electrically connect to a motherboard. As for the cover, the cover is disposed at least on the touch area of the flexible substrate. Furthermore, the touch area includes a plurality of X-axis sensing columns and a plurality of Y-axis sensing columns, and the routing area includes a plurality of traces, and one of the plurality of traces is electrically connected to the plurality of X-axis sensing columns and the plurality of Y-axis sensing columns respectively. At one end, the other end of the plurality of traces extends to the connection terminal area.

In addition, the plurality of X-axis sensing columns and the plurality of Y-axis sensing columns of the present invention may be crossed and spaced apart from each other in a touch area on one surface of the flexible substrate, or may be divided into two phases of the flexible substrate. Corresponding to the touch area of the surface. Accordingly, the present invention can be applied to a touch panel in which a single surface cloth is provided with a touch sensing array or a double-sided cloth with a touch sensing array.

Preferably, in the present invention, the thickness of the plurality of traces located in the connection terminal region is thicker than the thickness of the plurality of traces located in the trace region, so that the present invention can be connected by a thicker trace structure in the connection terminal region. Strengthen the resistance to stress caused by deformation and improve the service life.

In addition, the present invention provides a flexible base that can be used in one piece. The method of manufacturing the sensing column of the touch area and the routing of the wiring area and the connection terminal area simultaneously on the board, not only completely eliminating the extra components of the conventional flexible circuit board, but also reducing the process Steps, and significantly reduce costs, but also improve process yield.

The method for manufacturing the touch panel provided by the present invention mainly includes the following steps. First, a flexible substrate is provided, which includes a touch area, a connection terminal area, and a routing area. The line area is at least partially surrounding the touch area, and the connection terminal area is integrally protruded from one side of the flexible substrate; then, a first conductive layer is formed on the flexible substrate; and further, a second is formed. The conductive layer is on the first conductive layer; further, the first conductive layer and the second conductive layer are patterned to form a plurality of traces in the trace region and the connection terminal region, and a plurality of sensing columns are formed in the touch region; and a second conductive layer in the touch area.

In addition, another manufacturing method of the touch panel provided by the present invention mainly includes the following steps: First, a flexible substrate is provided, which includes a touch area, a connection terminal area, and a routing area, and The line area is at least partially surrounding the touch area, and the connection terminal area is integrally protruded from one side of the flexible substrate; then, a first conductive layer is formed on the flexible substrate, and a second conductive layer is formed. On the first conductive layer; and, the patterned conductive region and the second conductive layer connecting the terminal regions form a plurality of traces, and expose the first conductive layer to the touch region; and the first conductive layer of the patterned touch region The layer is formed to form a plurality of sensing columns, and the patterned wiring region and the first conductive layer connecting the terminal regions form the plurality of traces.

Moreover, the present invention can deposit a conductive thick layer on the plurality of traces connecting the terminal regions, thereby increasing the thickness of the traces in the connection terminal region. It can strengthen the resistance to stress caused by deformation and improve the service life. As for the method of depositing the conductive thick layer, it can be achieved by sputtering, evaporation, vacuum ion plating, water plating, or other equivalent processes.

Moreover, in the method of manufacturing a touch panel provided by the present invention, the steps of forming the first conductive layer and the second conductive layer, and patterning the first conductive layer and the second conductive layer may be respectively applied to the flexible substrate Corresponding to the two surfaces or the same surface. In other words, the present invention is applicable to any form of touch panel.

The following is only a description of the capacitive touch panel. However, the present invention is not limited thereto. The present invention is also applicable to a resistive touch panel or other touch panel that needs to have both a substrate and a connection terminal. 1 and FIG. 2, FIG. 1 is a front view of a preferred embodiment of the touch panel of the present invention, and FIG. 2 is a schematic view of the touch panel of the present invention disposed on the liquid crystal panel.

As shown in the figure, the touch panel of the present embodiment mainly includes a flexible substrate 2 and a cover 4, wherein the flexible substrate 2 includes a touch area 21, a connection terminal area 22, and a walk. The line area 23 is surrounded by the touch area 21, and the connection terminal area 22 is integrally protruded from one side of the flexible substrate 2 for electrically connecting to a motherboard 3, and the cover 4 is The touch area 21 is covered on the flexible substrate 2.

The touch area 21 includes a plurality of X-axis sensing columns 211 and a plurality of Y-axis sensing columns 212 that are intersected and spaced apart from each other on the upper surface 201 of the touch area 2 . Moreover, the routing area 23 includes a plurality of traces 231, one end of the plurality of traces 231 is electrically connected to one of the plurality of X-axis sensing columns 211 and the plurality of Y-axis sensing columns 212, and the other end of the plurality of traces 231 extends to even Connect terminal area 22. That is, in the present embodiment, a touch sensing column is formed on a single surface of the flexible substrate 2.

As shown in FIG. 2, it is an aspect of the internal arrangement of the electronic device using the touch panel of the embodiment, wherein the flexible substrate 2 is disposed above the liquid crystal panel 5, and the flexible substrate 2 is not required to be used. In the case of the circuit board, the motherboard 3 below the liquid crystal panel 5 is directly bent and electrically connected. Accordingly, in this embodiment, the integrated flexible substrate 2 constitutes a function of touching, routing, and providing electrical connection, thereby eliminating the need for a flexible circuit for additional connection of the conventional touch panel. Boards, while significantly reducing costs, reducing process steps and working hours, and human resources, can significantly increase yield.

Further, in the present embodiment, the thickness of the plurality of traces 231 located in the connection terminal region 22 is thicker than the thickness of the plurality of traces 231 located in other regions. Therefore, in the embodiment, the thicker wire structure can be used to strengthen the stress caused by the deformation and improve the service life.

Please refer to FIG. 3. FIG. 3 is an exploded view of another preferred embodiment of the touch panel of the present invention. The main difference between the present embodiment and the previous embodiment is that the plurality of X-axis sensing columns 211 and the plurality of Y-axis sensing columns 212 of the embodiment are disposed on the surface 201 of the flexible substrate 2 and corresponding thereto. The touch area on the surface 202. In other words, in this embodiment, a plurality of X-axis sensing columns 211 and a plurality of Y-axis sensing columns 212 are respectively formed on the corresponding surfaces of the flexible substrate 2; and the former embodiment forms a complex X-axis on the same surface. The sensing column 211 and the complex Y-axis sensing column 212. Accordingly, the present invention can be applied to a touch panel in which a single surface cloth is provided with a touch sensing array or a double-sided cloth with a touch sensing array.

4A-4F and FIG. 5, FIG. 4A is a front view of a flexible substrate of the touch panel of the present invention, and FIGS. 4B-4F are a BB line of the first embodiment of the touch panel manufacturing method of the present invention. FIG. 5 is a flow chart showing a first embodiment of a method for manufacturing a touch panel of the present invention.

First, in step S100, a flexible substrate 2 is provided, which includes a touch area 21, a connection terminal area 22, and a routing area 23, and the wiring area 23 is at least partially wrapped around the touch area 21, and is connected. The terminal region 22 is integrally protruded from one side of the flexible substrate 2 as shown in FIG. 4A. However, the flexible substrate 2 of the present embodiment is made of polyester (Polythylene terephthalate, PET), and has the characteristics of transparency, flexibility, and insulation. However, the present invention is not limited to this material, and other materials have the same properties. Materials such as polymethylmethacrylate (PMMA), or polycarbonate (PC) can be suitably used in the present invention. Next, in step S105 and step S110, a first conductive layer 601 is formed on the flexible substrate 2, and a second conductive layer 602 is formed on the first conductive layer 601, as shown in FIGS. 4B and 4C.

In this embodiment, the first conductive layer 601 may be a transparent conductive material, such as indium tin oxide (ITO), indium zinc oxide (IZO), cadmium tin oxide (CTO). ), aluminum zinc oxide (AZO), indium tin zinc oxide (ITZO), zinc oxide, cadmium oxide, hafnium oxide (HfO), oxidation Indium gallium zinc oxide (InGaZnO), indium gallium zinc magnesium oxide (InGaZnMgO), indium gallium magnesium (indium gallium magnesium) Oxide, InGaMgO) or indium gallium aluminum oxide (InGaAlO), etc.; in addition, the second conductive layer 602 can use the same transparent conductive material, and can also use metal wires such as gold wire, silver wire, copper. Wire, or other non-metallic conductor.

Next, in step S115, the first conductive layer 601 and the second conductive layer 602 are patterned, and a plurality of traces 231 are formed in the trace region 23 and the connection terminal region 22, and a plurality of sensing columns 211, 212 are formed in the touch region 21. , as shown in Figure 4D. In this embodiment, as shown in the embodiment of the embodiment shown in FIG. 1, the plurality of sensing columns 211, 212 includes a plurality of X-axis sensing columns 211, and a plurality of Y-axis sensing columns 212, a plurality of X-axis sensing columns 211 and a complex Y-axis sensing. The columns 212 are insulated from each other. Each of the X-axis sensing columns 211 includes a plurality of first conductive patterns 213 and is electrically connected to each other. Each of the Y-axis sensing columns 212 includes a plurality of second conductive patterns 214 and is electrically connected to each other.

Here, the plurality of sensing columns 211 and 212 are mainly used for sensing touch, and the plurality of wires 231 are for electrical connection for transmitting electrical signals. In addition, in step S120, the second conductive layer 602 in the touch area 21 is removed, as shown in FIG. 4E. Finally, in step S125, a conductive thickening layer 603 is deposited on the plurality of traces 231 of the connection terminal region 22, that is, the thickness of the plurality of traces 231 in the connection terminal region 22 is increased to enhance the strength of the traces in the region. Herein, the present invention deposits the conductive thick layer 603 by water plating, but the invention is not limited thereto, and may be completed by sputtering, evaporation, vacuum ion plating, or other equivalent processes. Moreover, the material of the conductive thick layer 603 may be the same as the second conductive layer 602 to increase mutual compatibility and joint strength.

However, step S125 is not limited to the last step, and it can also be used in steps. Step S100 or step S115 is performed. In addition, the plurality of sensing columns 211 and 212 and the plurality of traces 231 of the present embodiment are formed on the same surface of the flexible substrate 2. Of course, the present invention does not limit the complex X-axis sensing column 211 and the complex Y-axis sensing column 212 of the plurality of sensing columns 211 and 212 to the corresponding surfaces 201 and 202 of the flexible substrate 2, respectively. That is, the embodiment shown in FIG. Accordingly, the method provided in this embodiment can simultaneously form the sensing columns 211 and 212 of the touch area 21 and the traces 231 of the wiring area 23 and the connection terminal area 22 on the integrated flexible substrate 2, which not only The additional components of the conventional flexible circuit board can be completely eliminated, the process steps can be reduced, the cost can be greatly reduced, and the process yield can be improved.

In addition, please refer to FIG. 6, which is a flow chart of a second embodiment of a method for manufacturing a touch panel of the present invention. The main difference between the second embodiment and the first embodiment is that the process steps for forming the complex sense columns 211, 212 and the plurality of traces 231 are different, as for the components described in the second embodiment of the manufacturing method. The symbols can also be referred to FIG. 4A to FIG. 4F. In detail, the second embodiment includes the following steps. First, in step S200, a flexible substrate 2 is provided, which includes a touch area 21, a connection terminal area 22, and a trace area 23, and a trace area 23 At least partially surrounding the touch area 21, the connection terminal area 22 integrally protrudes from one side of the flexible substrate 2. Next, in step S205 and step S210, a first conductive layer 601 is formed on the flexible substrate 2, and a second conductive layer 602 is formed on the first conductive layer 601.

Moreover, in step S215, the patterned wiring region 23 and the second conductive layer 602 connecting the terminal regions 22 form a plurality of traces 231, and are etched to expose the first conductive layer 601 to the touch region 21. In other words, in this step, the trace 231 is directly formed, and the first conductive layer 601 in the touch region 21 is removed. For subsequent patterning steps. In addition, in step 220, the first conductive layer 601 of the touch area 21 is patterned to form a plurality of sensing columns 211, 212, and the first conductive layer 601 of the wiring region 23 and the connection terminal region 22 is patterned to form the plurality of traces 231. . Finally, in step S225, a conductive thick layer 603 is deposited on the plurality of traces 231 connecting the terminal regions 22. It can be seen from the above that the manufacturing method provided by the second embodiment differs from the manufacturing method provided by the first embodiment only in steps S215 and S220, and according to the present invention, it is generally provided by those skilled in the art according to the present invention. The method, which can be easily changed or combined, is intended to be encompassed within the scope of the invention.

The above-mentioned embodiments are merely examples for convenience of description, and the scope of the claims is intended to be limited to the above embodiments.

1‧‧‧Learning touch panel

10‧‧‧Substrate

11‧‧‧Flexible circuit board

111‧‧‧Wire

12‧‧‧Touch element array

13‧‧‧ lead

14‧‧‧ junction area

2‧‧‧Flexible substrate

201‧‧‧ upper surface

202‧‧‧lower surface

21‧‧‧ touch area

211‧‧‧X-axis induction column

212‧‧‧Y-axis induction column

213‧‧‧First conductive pattern

214‧‧‧Second conductive pattern

22‧‧‧Connecting terminal area

23‧‧‧Drop area

231‧‧‧ Trace

3‧‧‧ motherboard

4‧‧‧ Cover

5‧‧‧LCD panel

601‧‧‧First conductive layer

602‧‧‧Second conductive layer

603‧‧‧ Conductive thickening layer

1 is a front elevational view of a preferred embodiment of a touch panel of the present invention.

2 is a schematic view showing a touch panel of the present invention disposed on a liquid crystal panel.

3 is an exploded view of another preferred embodiment of the touch panel of the present invention.

4A is a front view of a flexible substrate of the touch panel of the present invention.

4B-4F are cross-sectional views of a line B-B of the first embodiment of the method of manufacturing the touch panel of the present invention.

FIG. 5 is a flow chart of a first embodiment of a method of manufacturing a touch panel of the present invention.

6 is a flow chart of a second embodiment of a method of manufacturing a touch panel of the present invention.

FIG. 7 is an exploded view of a conventional touch panel.

2‧‧‧Flexible substrate

201‧‧‧ upper surface

21‧‧‧ touch area

211‧‧‧X-axis induction column

212‧‧‧Y-axis induction column

213‧‧‧First conductive pattern

214‧‧‧Second conductive pattern

22‧‧‧Connecting terminal area

23‧‧‧Drop area

231‧‧‧ Trace

Claims (12)

A touch panel includes a flexible substrate including a touch area, a connection terminal area, and a routing area, the wiring area at least partially surrounding the touch area, the connection terminal area An integral portion of the flexible substrate is electrically connected to a motherboard; and a cover is disposed at least on the flexible substrate; wherein the touch region is The method includes a plurality of X-axis sensing columns and a plurality of Y-axis sensing columns; the routing area includes a plurality of wires, and one end of the plurality of wires is electrically connected to the plurality of X-axis sensing columns and one end of the complex Y-axis sensing column, The other end of the plurality of traces extends to the connection terminal area. The touch panel of claim 1, wherein the plurality of X-axis sensing columns and the plurality of Y-axis sensing columns are spaced apart from each other and disposed on a surface of one of the flexible substrates In the district. The touch panel of claim 1, wherein the plurality of X-axis sensing columns and the plurality of Y-axis sensing columns are disposed in the touch area of the corresponding surface of the flexible substrate . The touch panel of claim 1, wherein the thickness of the plurality of traces located in the connection terminal region is thicker than the thickness of the plurality of traces located in the trace region. A method for manufacturing a touch panel includes the following steps: A. providing a flexible substrate, comprising: a touch area, a connection terminal area, and a routing area, the wiring area at least partially surrounding In the touch area, the connection terminal area integrally protrudes from one side of the flexible substrate; B. forms a first conductive layer on the flexible substrate; C. forms a second conductive layer on the first D. patterning the first conductive layer and the second conductive layer, forming a plurality of traces in the trace region and the connection terminal region, forming a plurality of sensing columns in the touch region; and E. The second conductive layer in the touch area is removed. A method for manufacturing a touch panel includes the following steps: A. providing a flexible substrate, comprising: a touch area, a connection terminal area, and a routing area, the wiring area at least partially surrounding the a touch area, the connection terminal area integrally protrudes from one side of the flexible substrate; B. forms a first conductive layer on the flexible substrate; C. forms a second conductive layer on the first D. patterning the trace region and the second conductive layer of the connection terminal region to form a plurality of traces, and exposing the first conductive layer to the touch region; and E. patterning the touch region The first conductive layer forms a plurality of sensing columns, and the first conductive layer of the wiring region and the connection terminal region is patterned to form the plurality of traces. The method for manufacturing a touch panel according to the fifth or sixth aspect of the invention, wherein the step D further comprises a step d1: d1. depositing a conductive thick layer on the plurality of traces of the connection terminal region. . The method for manufacturing a touch panel according to the fifth or sixth aspect of the invention, wherein the step E further comprises a step e1: e1. depositing a conductive thick layer on the plurality of traces of the connection terminal region. . The method for manufacturing a touch panel according to claim 7, wherein the method of depositing the conductive thick layer on the plurality of traces in the connection terminal region is selected from the group consisting of sputtering, evaporation, and vacuum ion plating. And at least one of the groups consisting of water plating. The method for manufacturing a touch panel according to claim 8, wherein the method of depositing the conductive thick layer on the plurality of traces in the connection terminal region is selected from the group consisting of sputtering, evaporation, and vacuum ion plating. And at least one of the groups consisting of water plating. The method for manufacturing a touch panel according to the fifth or sixth aspect of the invention, wherein the step B to the step E are performed on one surface of the flexible substrate; repeating the step E after the step E Step B to step E are on the other surface of the flexible substrate. The method of manufacturing a touch panel according to claim 5, wherein the plurality of sensing columns comprises a plurality of X-axis sensing columns, and a plurality of Y-axis sensing columns, the complex X-axis sensing columns and the complex Y The shaft sensing columns are insulated from each other, and each of the X-axis sensing columns includes a plurality of first conductive patterns and are electrically connected to each other, and each of the Y-axis sensing columns includes a plurality of second conductive patterns and is electrically connected to each other.