TW201409320A - Touch module and a manufacturing method thereof - Google Patents

Abstract

The present disclosure provides a touch module and a manufacturing method thereof. The touch module comprises a conductive carrier plate, a reinforcing component and a housing. The conductive carrier plate has a touch function. The reinforcing component is disposed on the surrounding of the lower side of the conductive carrier plate. The housing coats the periphery of the conductive carrier plate and the reinforcing component integrally. The present disclosure provides the reinforcing component to connect the conductive carrier plate and the housing, increasing the connection between the conductive carrier plate and the housing, reducing fabrication of the end face of conductive carrier plate and thus enhance the strength of the conductive carrier board.

Description

Touch module and manufacturing method thereof

The present invention relates to the field of touch technologies, and more particularly to a touch module and a method of fabricating the same.

FIG. 1 is a schematic structural view of a touch module of the prior art. Referring to FIG. 1 , the touch module includes a conductive carrier 8 and a housing 9 . The conductive carrier 1 has an inner surface 81, an outer surface 82 and a sensing layer 83. The sensing layer 83 is disposed on the inner surface 81. The housing 9 is integrally wrapped around the end edge of the conductive carrier 8. Since the material of the casing 9 is generally plastic, and the conductive carrier 8 is mainly made of glass or the like, the casing 9 and the conductive carrier 8 have poor adhesion at the peripheral end of the contact, and are easily cracked by external force. Open or warp. In order to ensure that the conductive carrier 8 and the housing 9 are well followed, see FIGS. 2A and 2B, and FIGS. 2A and 2B are schematic views showing various shapes of the end faces of the conductive carrier in the prior art. The end faces of the conductive carrier 8 are formed in a shape such as concave, convex, oblique, or broken as shown in Figs. 2A and 2B to increase the adhesion between the conductive carrier 8 and the casing 9. However, these uneven end face structures are liable to cause the strength of the conductive carrier plate 8 to be deteriorated, and at present, the requirements of the conductive carrier plate 8 are becoming thinner and lighter, and the end faces thereof are more difficult to make various shapes to satisfy the casing 9 . Sex.

The embodiment of the invention provides a touch module and a manufacturing method thereof, and adds a reinforcement The piece connects the conductive carrier and the case to enhance the adhesion between the conductive carrier and the case.

The embodiment of the invention provides a touch module, comprising: a conductive carrier board, the conductive carrier board has a touch function; a reinforcing member is disposed on a lower side periphery of the conductive carrier board; Around the conductive carrier and the reinforcing member.

Further, the reinforcing member includes a first supporting portion and a second supporting portion connected to each other, the first supporting portion is connected to a lower side periphery of the conductive carrier, and the second supporting portion is connected to the case.

Further, the shape of the first supporting portion is designed corresponding to the shape of the conductive carrier, and the second supporting portion is formed to extend outward from opposite side edges of the first supporting portion.

Further, the second support portion is further provided with a plurality of connection holes for increasing adhesion to the housing.

Further, the housing is a molded housing, and is integrally wrapped around the conductive carrier and the reinforcing member in an in-mold injection manner.

Further, the conductive carrier includes a substrate, a sensing layer and a protective layer which are sequentially stacked, the sensing layer is located under the substrate, and the protective layer is located under the sensing layer, and The reinforcing member is connected to the lower side periphery of the protective layer.

Further, a first bonding layer is further included, and the first supporting portion is connected to the lower side periphery of the conductive carrier through the first bonding layer.

Further, the conductive carrier includes a first substrate, a second bonding layer, a sensing layer and a second substrate which are sequentially stacked, the sensing layer is located on the second substrate, and the first substrate passes The second bonding layer is connected to the sensing layer.

Further, the sensing layer includes a first direction electrode and a second direction electrode, and the first direction electrode and the second direction electrode are intersected and insulated from each other in the same plane layer.

Further, the conductive carrier includes a first substrate, a first direction electrode, a second bonding layer, a second direction electrode, and a second substrate which are sequentially stacked, and the first direction electrode is located on the first substrate a lower surface, the second direction electrode is located on an upper surface of the second substrate, and the second adhesive layer is located between the first direction electrode and the second direction electrode.

Further, the conductive carrier board includes a first substrate, a first direction electrode, a second bonding layer, a second substrate, a second direction electrode and a protective layer which are sequentially stacked, wherein the first direction electrode is located in the first a lower surface of a substrate, the second direction electrode is located on a lower surface of the second substrate, the second adhesive layer is located between the first direction electrode and the second substrate, and the protective layer is located at Below the second direction electrode.

Further, the conductive carrier includes a first substrate, a second bonding layer, a first direction electrode, a second substrate, a second direction electrode, and a third substrate which are sequentially stacked, wherein the first direction electrode is located in the On the second substrate, the second direction electrode is located on the third substrate, and the second bonding layer is located between the first direction electrode and the first substrate.

The embodiment of the present invention further provides a method for manufacturing a touch module, comprising the steps of: forming a conductive carrier, the conductive carrier has a touch function; forming a reinforcing member, wherein the reinforcing member is disposed at the a lower side perimeter of the conductive carrier; and a housing formed around the conductive carrier and the reinforcing member.

Further, the housing is a molded case, and the method further comprises the steps of: fixing the conductive carrier and the reinforcing member in a mold; and injecting a molding material into the mold The material is integrally wrapped around the conductive carrier and the reinforcing member to form the molded case.

Further, the manufacturing method further includes: fixing the reinforcing member to the conductive carrier with a bonding layer.

According to the embodiment of the invention, by connecting the conductive carrier and the housing by adding the reinforcing member, the adhesion between the conductive carrier and the housing is enhanced, and the end surface of the conductive carrier is reduced, thereby improving the conductive carrier. strength.

[study]

8‧‧‧ Conductive carrier

81‧‧‧ inner surface

82‧‧‧ outer surface

83‧‧‧Sensor layer

9‧‧‧Shell

〔this invention〕

1‧‧‧ Conductive carrier

11‧‧‧Substrate

12‧‧‧Sensor layer

121‧‧‧First direction electrode

122‧‧‧second direction electrode

13‧‧‧Protective layer

14‧‧‧Second bonding layer

15‧‧‧First substrate

16‧‧‧second substrate

17‧‧‧ Third substrate

2‧‧‧Shell

3‧‧‧Reinforcement

31‧‧‧First support

32‧‧‧Second support

33‧‧‧connection hole

4‧‧‧First bonding layer

S1~S3‧‧‧ steps

1 is a schematic structural view of a touch module of the prior art; 2A and 2B are schematic views of various shapes of an end surface of a conductive carrier in the prior art; FIG. 3 is a schematic structural view of a touch module according to a first embodiment of the present invention; 4A is a schematic structural view of a touch module according to a second embodiment of the present invention; FIG. 4B is a schematic structural view of a touch module according to a third embodiment of the present invention; FIG. 4C is a schematic structural view of a touch module according to a fourth embodiment of the present invention; 4D is a schematic structural view of a touch module according to a fifth embodiment of the present invention; FIG. 4E is a schematic structural view of a touch module according to a sixth embodiment of the present invention; FIG. 4F is a schematic structural diagram of a touch module according to a seventh embodiment of the present invention; FIG. 5 is a schematic structural view of a sensing layer according to an embodiment of the present invention; and FIG. 6 is a flow chart of a manufacturing method according to an embodiment of the present invention.

The touch module and the method of manufacturing the same according to embodiments of the present invention are described below. However, the present invention is to be understood as being limited to the details of the present invention. Furthermore, in the drawings and descriptions of the embodiments of the present invention The same reference numerals are used to denote the same or similar parts.

FIG. 3 is a schematic structural diagram of a touch module according to a first embodiment of the present invention. Referring to FIG. 3 , the touch module provided by the embodiment of the present invention includes a conductive carrier 1 , a housing 2 , and a reinforcing member 3 . The conductive carrier 1 has a touch function to provide input and detection of a touch position. The reinforcing member 3 is disposed on the lower periphery of the conductive carrier 1 , and the conductive carrier 1 is supported and connected to the reinforcing member 3 . The casing 2 is wrapped around the conductive carrier 1 and the reinforcing member 3. The housing 2 can be a molded housing that is integrally wrapped around the conductive carrier 1 and the reinforcing member 3 in a mold-injection manner.

Referring to FIG. 3, the reinforcing member 3 further includes a first support portion 31 and a second support portion 32 that are connected to each other. The shape of the first supporting portion 31 is designed corresponding to the shape of the conductive carrier 1 to ensure that the circumference of the conductive carrier 1 can be effectively supported, for example, a closed quadrilateral structure corresponding to the conductive carrier. 1 shape setting. The second support portion 32 is formed by outwardly extending at an angle from opposite side edges of the first support portion 31. The angle is greater than or equal to 90 degrees, and preferably less than or equal to 180 degrees. The first support portion 31 can be connected to the lower side periphery of the conductive carrier 1 through a first adhesive layer 4. The first adhesive layer 4 may be a sealant layer only on the periphery of the lower surface of the conductive carrier 1 (as shown in FIG. 3). The second support portion 32 is coupled to the housing 2 and is covered by the housing 2 . Thereby, the conductive carrier 1 and the casing 2 are connected together by the reinforcing member 3, thereby enhancing the adhesion between the conductive carrier 1 and the casing 2, and the end surface processing of the conductive carrier 1 can be reduced. At the same time, because the reinforcing member 3 has strong and strong support to the conductive carrier plate 1, the strength of the conductive carrier plate 1 can be improved, and the thickness of the conductive carrier plate 1 can be reduced to achieve a lighter and thinner purpose.

In another embodiment, the second supporting portion 32 is further provided with a plurality of connecting holes 33 through which the second supporting portion 32 and the housing 2 can be connected by using fasteners (not shown). To further increase the connectivity of the housing 2 and the reinforcing member 3.

4A is a schematic structural view of a touch module according to a second embodiment of the present invention. As shown in FIG. 4A , the touch module provided in this embodiment includes a conductive carrier 1 , a housing 2 , and a reinforcing member 3 . The conductive carrier 1 includes a substrate 11 and a sensing layer 12. The substrate 11 may be, for example, a glass substrate or a film, as long as it has a material that is transparent and can carry the sensing layer 12, which is not limited in the present invention. The touch object can directly act on the upper surface of the substrate 11 to perform a touch action. The sensing layer 12 is located on the lower surface of the substrate 11 to achieve sensing of a touch location. The conductive carrier 1 may also optionally include a protective layer 13 on the lower surface of the sensing layer 12 and overlying the sensing layer 12 to avoid environmental contamination and erosion of the sensing layer 12. The reinforcing member 3 is connected to the lower side periphery of the protective layer 13. In an embodiment, the reinforcing member 3 includes a first supporting portion 31 and a second supporting portion 32 connected to each other, the first supporting portion 31 is connected to the lower side periphery of the protective layer 13, and the second supporting portion 32 is connected to the housing. 2. The casing 2 is wrapped around the conductive carrier 1 and the reinforcing member 3.

FIG. 4B is a schematic structural diagram of a touch module according to a third embodiment of the present invention. As shown in FIG. 4B , the touch module provided in this embodiment is different from the touch module provided in the second embodiment ( FIG. 4A ) in that the touch module further includes a first adhesive layer 4 . The first support portion 31 of the reinforcing member 3 is connected to the lower side periphery of the conductive carrier 1 via the first adhesive layer 4, in particular to the lower side periphery of the protective layer 13. Thus, the adhesion of the reinforcing member 3 and the conductive carrier 1 is further improved by the first bonding layer 4, thereby enhancing the connectivity between the conductive carrier 1 and the casing 2.

FIG. 4C is a schematic structural diagram of a touch module according to a fourth embodiment of the present invention. The touch module provided in this embodiment includes a conductive carrier 1 , a housing 2 , a reinforcing member 3 , and a first bonding layer 4 . Compared with the third embodiment shown in FIG. 4B , the difference is that the conductive carrier 1 shown in FIG. 4C includes the first substrate 15 , the second bonding layer 14 , the sensing layer 12 and the first layer which are sequentially stacked. Two substrates 16. The first substrate 15 and the second substrate 16 may be a glass substrate or a thin film layer. The sensing layer 12 is located on the second substrate On the 16th, the first substrate 15 is connected to the sensing layer 12 through the second bonding layer 14. The second adhesive layer 14 may be a full layer of glue layer or a sealant layer only on the periphery of the lower surface of the first substrate 14. The first bonding layer 4 is disposed between the reinforcing member 3 and the second substrate 16 for fixing the reinforcing member 3 on the conductive carrier 1.

FIG. 5 is a schematic structural diagram of a sensing layer according to an embodiment of the present invention. As shown in FIG. 5, for example, in the above first to fourth embodiments, the sensing layer 12 includes a first direction electrode 121 and a second direction electrode 122, and the first direction electrode 121 and the second direction electrode 122 are crossed and insulated from each other. They are arranged in the same planar layer, for example, on the same surface of the substrate 11. The first direction and the second direction are preferably perpendicular to each other, for example, the first direction is the X-axis direction, and the second direction is the Y-axis direction, but the first direction and the second direction of the present invention are not limited thereto. Since the first direction electrode 121 and the second direction electrode 122 can be disposed on the same surface of the substrate, the conductive carrier can be made thinner and lighter.

4D is a schematic structural diagram of a touch module according to a fifth embodiment of the present invention. As shown in FIG. 4D , the touch module provided in this embodiment includes a conductive carrier 1 , a housing 2 , a reinforcing member 3 , and a first bonding layer 4 . The difference from the third embodiment shown in FIG. 4B is that the conductive carrier 1 includes the first substrate 15 , the first direction electrode 121 , the second bonding layer 14 , and the second direction electrode 122 which are sequentially stacked. The second substrate 16 is. The first direction electrode 121 is located on the lower surface of the first substrate 15. The second direction electrode 122 is located on the upper surface of the second substrate 16. The first direction and the second direction are preferably perpendicular to each other, for example, the first direction is the X-axis direction, and the second direction is the Y-axis direction, but the first direction and the second direction of the present invention are not limited thereto. The second bonding layer 14 is located between the first direction electrode 121 and the second direction electrode 122 to bond the first substrate 15 and the second substrate 16 together. The first bonding layer 4 is disposed between the reinforcing member 3 and the second substrate 16 for fixing the reinforcing member 3 on the conductive carrier 1.

FIG. 4E is a schematic structural diagram of a touch module according to a sixth embodiment of the present invention. Such as the first As shown in FIG. 4E , the touch module provided in this embodiment includes a conductive carrier 1 , a housing 2 , a reinforcing member 3 , and a first bonding layer 4 . Compared with the third embodiment shown in FIG. 4B , the difference is that the conductive carrier includes the first substrate 15 , the first direction electrode 121 , the second bonding layer 14 , the second substrate 16 , and the second layer which are sequentially stacked. Direction electrode 122 and protective layer 13. The first direction electrode 121 is located on the lower surface of the first substrate 15. The second direction electrode 122 is located on the lower surface of the second substrate 16. The second bonding layer 14 is located between the first direction electrode 121 and the second substrate 16 for connecting the first substrate 15 and the second substrate 16 together. The protective layer 13 is located on the lower surface of the second direction electrode 122 and overlies the second direction electrode 122 to prevent the second direction electrode 122 from being contaminated and eroded by the environment. The first bonding layer 4 is disposed between the reinforcing member 3 and the protective layer 13 for fixing the reinforcing member 3 on the conductive carrier 1.

FIG. 4F is a schematic structural diagram of a touch module according to a seventh embodiment of the present invention. As shown in FIG. 4F , the touch module provided in this embodiment includes a conductive carrier 1 , a housing 2 , a reinforcing member 3 , and a first bonding layer 4 . Compared with the third embodiment shown in FIG. 4B , the difference is that the conductive carrier 1 includes the first substrate 15 , the second bonding layer 14 , the first direction electrode 121 , the second substrate 16 , and the first stacked The two-direction electrode 122 and the third substrate 17. The first direction electrode 121 is located on the second substrate 16. The second direction electrode 122 is located on the third substrate 17. The second bonding layer 14 is located between the first direction electrode 121 and the first substrate 15. The first bonding layer 4 is disposed between the reinforcing member 3 and the third substrate 17 for fixing the reinforcing member 3 on the conductive carrier 1.

FIG. 6 is a flow chart of a method for manufacturing a touch module according to an embodiment of the invention. As shown in FIG. 6, the manufacturing method of the touch module of the present invention includes the following steps: S1, forming a conductive carrier; the structure of the conductive carrier may be the conductive load in the first to seventh embodiments. The board and the conductive carrier have a touch function. For the sake of brevity, the conductive load shown in Figure 4A The plate is taken as an example to illustrate the forming step. The conductive carrier 1 can be formed by forming a sensing layer 12 on the substrate 11 by sputtering, exposure, development, or the like, and then forming a protective layer 13 over the sensing layer 12 by a process such as printing.

S2, forming a reinforcing member; the reinforcing member is disposed on a lower side periphery of the conductive carrier, and the conductive carrier is connected to the reinforcing member. Still taking FIG. 4A as an example, the reinforcing member 3 includes a first support portion 31 and a second support portion 32 that are connected to each other. The shape of the first supporting portion 31 is designed corresponding to the shape of the conductive carrier 1 to ensure that the circumference of the conductive carrier 1 can be effectively supported, for example, a closed quadrilateral structure corresponding to the conductive carrier. 1 shape setting. The second support portion 32 is formed by outwardly extending at an angle from opposite side edges of the first support portion 31. The angle is greater than or equal to 90 degrees, and preferably less than or equal to 180 degrees. The first support portion 31 is located on the lower side periphery of the conductive carrier 1 .

S3, forming a casing, the casing is wrapped around the conductive carrier and the reinforcing member; the casing may be a molded casing, and in step S3, one of the embodiments First, the conductive carrier and the reinforcing member are respectively fixed in a mold; then, a molding material is injected into the mold to integrally wrap around the conductive carrier and the reinforcing member to form the shell. body. In another embodiment, the reinforcing member is first fixed on the conductive carrier through a bonding layer, and then the conductive carrier and the reinforcing member connected together are placed in the mold, and the molding material is injected into the mold. The cover plate is integrally wrapped around the conductive carrier and the reinforcing member to form the housing. Through the reinforcing member, the high temperature molding material and the mold can be directly contacted with the sensing layer on the conductive carrier, and the influence of the high temperature molding material and the mold on the sensing layer can be reduced, thereby improving the product quality and the yield.

In the above embodiments, the material of the substrate may be selected from the group consisting of glass, acrylic (PMMA), polyvinyl chloride (PVC), polypropylene (PP), polyethylene terephthalate (PET), and polynaphthalene dicarboxylic acid. Transparent materials such as ethylene glycol ester (PEN), polycarbonate (PC), and polystyrene (PS). The material of the sensing layer may include various transparent conductive materials, for example, indium tin oxide (ITO), indium zinc oxide (IZO), cadmium tin oxide (CTO), aluminum zinc oxide. (aluminum zinc oxide, AZO), indium tin zinc oxide (ITZO), zinc oxide, cadmium oxide, hafnium oxide (HfO), indium gallium zinc oxide (indium) Gallium zinc oxide, InGaZnO), indium gallium zinc magnesium oxide (InGaZnMgO), indium gallium magnesium oxide (InGaMgO) or indium gallium aluminum oxide (InGaAlO), nano silver Line and so on. The material of the protective layer may include an inorganic material such as silicon nitride, silicon oxide, and silicon oxynitride, or may be an organic material such as an acrylic resin. Other suitable materials. The reinforcing member may be a sheet metal member or a plastic member. The first adhesive layer is made of a high temperature resistant adhesive material such as a UV (ultraviolet) cured polyurethane resin. The second bonding layer is a transparent liquid glue or a solid glue, such as a transparent optical glue or a UV light-solid glue. Molding materials include thermoplastics such as polycarbonate (PC), acrylic (PMMA), acrylonitrile butadiene styrene (ABS), polyvinyl chloride (PVC), and the like.

The touch module and the manufacturing method thereof provide the connection between the conductive carrier and the casing by adding the reinforcing member to the conductive carrier and the casing, and at the same time, reduce the processing of the end surface of the conductive carrier, and further Increased strength of the conductive carrier. At the same time, the substrate and the reinforcing member can form a shielding effect on the sensing layer, thereby avoiding the high temperature molding material and the mold directly contacting the sensing layer on the conductive carrier plate, and reducing the high temperature molding material and the mold to the sensing layer. Influence, and thus improve the product Quality and yield.

Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can be modified and retouched without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.

1‧‧‧ Conductive carrier

2‧‧‧Shell

3‧‧‧Reinforcement

31‧‧‧First support

32‧‧‧Second support

33‧‧‧connection hole

4‧‧‧First bonding layer

Claims (15)

A touch module includes: a conductive carrier board having a touch function; a reinforcing member disposed on a lower side periphery of the conductive carrier; and a casing covering the conductive carrier And around the reinforcement. The touch module of claim 1, wherein the reinforcing member comprises a first supporting portion and a second supporting portion connected to each other, the first supporting portion being connected to a lower side of the conductive carrier, the first Two support portions are coupled to the housing. The touch module of claim 2, wherein the first support portion is shaped to correspond to a shape of the conductive carrier, and the second support portion is opposite to the opposite sides of the first support portion. The outer extension is formed. The touch module of claim 2, wherein the second support portion is further provided with a plurality of connection holes for increasing adhesion to the housing. The touch module of claim 1, wherein the housing is a molded housing that is integrally wrapped around the conductive carrier and the reinforcing member in an in-mold injection manner. The touch panel of claim 1, wherein the conductive carrier comprises a substrate, a sensing layer and a protective layer which are sequentially stacked, the sensing layer is located under the substrate, and the protective layer is located in the sensing layer. Below the layer, and the reinforcing member is attached to the lower side periphery of the protective layer. The touch module of claim 2, further comprising a first bonding layer, the first supporting portion being connected to the lower side periphery of the conductive carrier through the first bonding layer. The touch panel of claim 1, wherein the conductive carrier comprises a first substrate, a second bonding layer, a sensing layer and a second substrate, and the sensing layer is located on the second substrate. The first substrate is connected to the sensing layer through the second adhesive layer. The touch module of any one of the preceding claims, wherein the sensing layer comprises a first direction electrode and a second direction electrode, the first direction electrode and the second direction electrode intersect and are insulated from each other Arranged in the same plane layer. The touch panel of claim 1, wherein the conductive carrier comprises a first substrate, a first direction electrode, a second bonding layer, a second direction electrode, and a second substrate, which are sequentially stacked. The directional electrode is located on a lower surface of the first substrate, the second directional electrode is located on an upper surface of the second substrate, and the second adhesive layer is located between the first directional electrode and the second directional electrode. The touch panel of claim 1, wherein the conductive carrier comprises a first substrate, a first direction electrode, a second bonding layer, a second substrate, a second direction electrode and a protective layer. The first direction electrode is located on a lower surface of the first substrate, the second direction electrode is located on a lower surface of the second substrate, and the second adhesive layer is located between the first direction electrode and the second substrate, the protective layer Located below the second direction electrode. The touch panel of claim 1, wherein the conductive carrier comprises a first substrate, a second bonding layer, a first direction electrode, a second substrate, a second direction electrode, and a third substrate which are sequentially stacked. The first direction electrode is located on the second substrate, the second direction electrode is located on the third substrate, and the second adhesive layer is located between the first direction electrode and the first substrate. A method for manufacturing a touch module includes the following steps: Forming a conductive carrier, the conductive carrier has a touch function; forming a reinforcing member disposed on a lower side of the conductive carrier; and forming a housing, the housing is covered by the The conductive carrier and the periphery of the reinforcing member. The method of manufacturing a touch module according to claim 13 , wherein the housing is a molded case, the method further comprising the steps of: fixing the conductive carrier and the reinforcing member in a mold; The mold injection molding material is integrally wrapped around the conductive carrier and the reinforcing member to form the molded case. The method of manufacturing a touch module according to claim 13, wherein the manufacturing method further comprises: fixing the reinforcing member to the conductive carrier with a bonding layer.