TW201408438A - Super abrasive-grain grinding wheel using ceramic binder and wafer manufacturing method using the grinding wheel - Google Patents

Abstract

To provide a super abrasive-grain grinding wheel using ceramic binder which exhibits stable grinding performance. A super abrasive-grain grinding wheel using ceramic binder is produced by bonding layers of super abrasive grains 13 containing super abrasive grains 10 bonded with ceramic binders (20, 30), wherein the layers of super abrasive grains 13 contain a first layer of super abrasive grains 11 which comprise super abrasive grains 10 bonded with ceramic binder 20 and a second layer of super abrasive grains 12 formed by aggregating clusters of super abrasive grains that are made by bonding the super abrasive grains with the ceramic binder 30.

Description

Ultra-abrasive grinding wheel using ceramic bonding agent and manufacturing method of wafer using the same

The present invention relates to a superabrasive grinding wheel using a ceramic bonding agent having pores combined with superabrasive grains by a ceramic bonding agent.

It is known that superabrasive grains (diamond abrasive grains, CBN abrasive grains), general abrasive grains (SiC abrasive grains, AL2O3 abrasive grains), and the like are used as abrasive grains, and the ceramic bonding agent is used for superabrasive bonding by ceramic bonding agents. Grinding wheel.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 54-39292

[Patent Document 2] Japanese Patent Laid-Open No. 59-161269

[Patent Document 3] Japanese Patent Laid-Open No. 3-187471

However, when the polishing process is performed by a superabrasive grinding wheel using a ceramic bond in the related art, there is a problem that the polishing resistance value becomes high and the polishing resistance value is unstable as the processing continues.

Moreover, the use of ultrafine particles having an average particle diameter of 1 μm or less In the superabrasive grinding wheel using the ceramic bond of the abrasive grains, since the abrasion rate of the superabrasive layer is fast, there is a problem that the polishing performance is unstable.

In order to solve the above problems, the present invention relates to a superabrasive grinding wheel using a ceramic binder in which a superabrasive layer of superabrasive grains is bonded by a ceramic binder, wherein the superabrasive layer contains a ceramic binder. The first superabrasive layer and the superabrasive layer combined with the superabrasive grains are the second superabrasive layer formed by the aggregate superabrasive grains due to the ceramic binder.

In the superabrasive grinding wheel using the ceramic bonding agent configured as described above, the first and second superabrasive grains can function to achieve stable polishing performance.

Whether or not the group is judged to be in the superabrasive layer, if the superabrasive grains surrounded by the ceramic binder are joined in a continuous ten or more cases, the bonding is considered to be a group. However, the superabrasive grains present in the outer periphery of the dough are not necessarily encased by the ceramic binder.

Preferably, the degree of bonding of the first superabrasive layer is lower than that of the second superabrasive layer.

The degree of bonding is the ratio of the superabrasive particles to the ceramic binder, which is determined by the ratio of the area of the superabrasive particles to the binder in the cross-sectional structure. Specifically, the electronic information of the photograph obtained from the SEM (scanning electron microscope) of the tissue section is classified into the superabrasive portion, the binder portion, and the pore portion by the pattern analysis software, and the difference is obtained. The area ratio can be calculated.

Preferably, in the first superabrasive layer, the superabrasive grains are joined by a bridge of a width smaller than the particle diameter of the superabrasive grain. Hehe.

Regarding the size of the bonding bridge, it is a connecting line at the closest connection distance between adjacent abrasive grains, and the length extending in the ceramic bond at the middle point of the connecting line to the vertical line of the connecting line is used as a bonding bridge. The size.

Preferably, in the second superabrasive layer, the abrasive grains are bonded by a bonding bridge having a width larger than that of the superabrasive grains.

Preferably, the second superabrasive layer is encapsulated in the pores.

Preferably, for the entire area of the superabrasive layer, the ratio of the superabrasive particles to the total amount of the ceramic binder in the first superabrasive layer is 10 to 50% by volume, in the second superabrasive layer. The ratio of the superabrasive grains to the total amount of the above ceramic binder is 5 to 30% by volume.

Regarding these volumes, in the cross-sectional structure, the area ratio of the superabrasive grains, the ceramic binder, and the pores was determined by image analysis, and the area ratio was made into a volume ratio.

Preferably, the ceramic bond has a softening temperature of from 600 to 900 °C.

Preferably, it is used for polishing of a wafer containing at least one of ruthenium, sapphire, and a compound semiconductor.

Preferably, the method of manufacturing the wafer is to polish a wafer containing at least one of ruthenium, sapphire, and a compound semiconductor using any of the above-described superabrasive grinding wheels using only a ceramic bond.

1‧‧‧Super abrasive grinding wheel with ceramic bond

10‧‧‧Superabrasive

11‧‧‧First superabrasive layer

12‧‧‧Second superabrasive layer

20,30‧‧‧Ceramic bonding agent

50‧‧‧ vent

51‧‧‧ holes

Fig. 1 is a cross-sectional view showing a portion of an enlarged superabrasive grain of a superabrasive grinding wheel using a ceramic bond according to an embodiment of the present invention.

Figure 2 is a cross-sectional view of the first superabrasive layer.

Figure 3 is a cross-sectional view of the second superabrasive layer.

Figure 4 is a cross-sectional view for explaining the bonding bridge.

Fig. 5 is a schematic view showing a manner in which a wafer is polished by a flat grinding disc.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiments, the same reference numerals are given to the same or corresponding parts.

Fig. 1 is a cross-sectional view showing a portion of an enlarged superabrasive grain of a superabrasive grinding wheel using a ceramic bond according to an embodiment of the present invention. Figure 2 is a cross-sectional view of the first superabrasive layer. Figure 3 is a cross-sectional view of the second superabrasive layer. Figure 4 is a cross-sectional view showing the coupling bridge for illustration.

Referring to Figs. 1 to 4, a superabrasive grinding wheel 1 using a ceramic bond having a superabrasive layer 13 in which superabrasive grains 10 are bonded by ceramic binders 20, 30 is dispersed in superabrasive grains 13, The first superabrasive layer 11 in which the superabrasive grains 10 are bonded by the ceramic binder 20 and the superabrasive layer 12 formed by the superabrasive grains in which the superabrasive grains are agglomerated by the ceramic binder are disposed. .

By superposing the first superabrasive particles 11 and the superabrasive particles 10 to form the second superabrasive layer 12 formed by the superabrasive particles by the ceramic binder 20, the superabrasive using the ceramic binder can be used. Grinding wheel 1 Sexuality varies widely. Therefore, it is possible to select a type of grinding wheel that is most suitable for the type of the workpiece, the polishing conditions, and the type of the grinding device.

As the ceramic binders 20, 30, a ceramic bond of a known composition can be used. For example, a ceramic binder of the following composition can be applied.

SiO2: 30 to 50% by mass, Al2O3: 2 to 10% by mass, B2O3: 40 to 60% by mass, RO (RO is one or more oxides selected from CaO, MgO, and BaO): 1 to 10% by mass R2O (R2O is at least one oxide selected from Li2O, Na2O, and K2O): 2 to 5% by mass.

Further, of course, the ceramic binder other than the above may be used in the present invention.

In the superabrasive grinding wheel 1 using a ceramic binder, it is preferable that the degree of bonding of the first superabrasive layer 11 is lower than that of the second superabrasive layer 12.

The degree of bonding of the first superabrasive layer 11 is lower than that of the second superabrasive layer 12, and the first superabrasive layer 11 can be worn back at a preferred speed during the grinding process. Therefore, since only the second superabrasive layer 12 is protruded and contributes to the grinding process, the stable cutting feeling can be maintained for a long period of time.

In particular, in the vertical axis plane polishing apparatus of the rotary table type, a cup-shaped grinding wheel (for example, the 6A2 type specified in JIS B4131) can select even the first and second super-abrasive grains. The contact area between the layers 11 and 12 and the workpiece becomes large, and the grinding wheel of a good cutting feeling can be continued for a long period of time.

In the superabrasive grinding wheel 1 using a ceramic bonding agent, it is preferable that in the first superabrasive layer 11, the superabrasive grains 10 are passed between The superabrasive particles 10 are combined with a bridge having a small particle diameter.

As shown in Fig. 4, regarding the size of the bonding bridge, the connection distance is the closest to the adjacent abrasive grains 10 as the connecting line 18, and the intermediate point of the connecting line 18 is perpendicular to the connecting line 18 in the ceramic. The length L extending within the bonding agent 20 is taken as the size of the bonding bridge.

For the first superabrasive layer 11, in order to make the degree of bonding lower than that of the second superabrasive layer 12, the first superabrasive layer 11 and the superabrasive particles 10 are separated by the particle size of the superabrasive particles 10. A combination of small width bridges.

In the superabrasive grinding wheel 1 using a ceramic binder, in the second superabrasive layer 12, the superabrasive grains 10 are bonded by a bonding bridge having a width larger than the particle diameter of the superabrasive grain 10 described above. .

The second superabrasive layer 12 is bonded to the first superabrasive layer 11 by a bonding bridge having a width larger than the particle diameter of the superabrasive grain 10. In order to increase the degree of bonding, the gap between the superabrasive grains is not formed with pores (pores) and the gap is filled with the ceramic binder.

In the superabrasive grinding wheel 1 using a ceramic bond, the dough encloses the pores 50. In this group, a plurality of superabrasive particles 10 are agglomerated or clustered by a ceramic binder 30. Since the group constitutes the second superabrasive layer 12 which contributes to the grinding process, when the improvement of the cutting feeling, the improvement of the cooling effect of the cooling material, and the improvement of the discharge of the chips are required, the package is included in the group. The vent 50 is preferred. In the superabrasive layer 13, if the superabrasive grains surrounded by the ceramic bond 30 are joined in a continuous ten or more cases, the bonding is considered to be a mass. However, the superabrasive grains present in the outer periphery of the dough are not necessarily encased by the ceramic binder.

In the first abrasive grain layer 11, there are a plurality of voids 51. The diameter of a circle having the same area as the area of the void 51 contains a smaller average particle diameter than the superabrasive grain 10. On the other hand, the air hole 50 has a larger diameter than the air hole 51. The diameter of the circle having the same area as the area of the pores 50 is larger than the average particle diameter of the superabrasive grains 10.

In the first superabrasive layer 11, since there are a large number of voids 51, there is no place where the superabrasive grains are joined by the bonding bridge. In this regard, since the second superabrasive layer 12 does not have pores, the superabrasive grains 10 are continuously joined by 10 or more.

In the superabrasive grinding wheel 1 using a ceramic binder, it is preferable that the total amount of superabrasive particles and ceramic binder in the first superabrasive layer 11 is occupied by the entire volume of the superabrasive layer 13. The ratio is 10 to 50% by volume, and in the second superabrasive layer 12, the ratio of the superabrasive grains to the total amount of the ceramic binder is 5 to 30% by volume.

In the first superabrasive layer 11, the ratio of the superabrasive grains to the ceramic binder is 20 to 40% by volume, and in the second superabrasive layer 12, the ratio of the superabrasive grains to the ceramic binder is Preferably, it is 10 to 30% by volume. In the first superabrasive layer 11, the ratio of the superabrasive grains to the total amount of the ceramic binder is 30 to 40% by volume, and in the second superabrasive layer 12, superabrasive The ratio of the granules to the ceramic binder is preferably 15 to 25% by volume.

In the superabrasive grinding wheel 1 using the ceramic bond of the present invention, it is preferred that the ceramic bonding agent 20, 30 has a softening temperature of 600 to 900 °C. In particular, when polishing various wafers such as tantalum, sapphire, and compound semiconductor, the softening temperature of the ceramic binders 20, 30 is preferably 600 to 800 ° C. 600~700 °C is the best. Further, if the softening temperature of the ceramic binders 20, 30 is less than 600 ° C, the holding strength of the superabrasive grains is lowered, and if it exceeds 900 ° C, the superabrasive grains may be thermally damaged.

The composition of the ceramic bond 20 and the ceramic bond 30 may be the same or different.

As long as the superabrasive grinding wheel 1 using the ceramic bonding agent is used, the stable cutting feeling can be maintained for a long period of time.

(Example 1)

The details of the superabrasive grinding wheel using the ceramic bond of Example 1 are as follows.

The composition of the ceramic bond is as follows.

SiO2: 40.5 mass%, Al2O3: 6.5% by mass, B2O3: 48.2% by mass

RO (RO is one or more oxides selected from CaO, MgO, and BaO): 1.8% by mass, R2O (R2O is at least one oxide selected from Li2O, Na2O, and K2O): 3.0% by mass .

As the superabrasive grain, a diamond abrasive grain having an average particle diameter of 1 μm was used as a pore-forming material, and the material was starch or resin, and the shape was a block shape or a spherical shape, and those having an average particle diameter of 5 μm and 20 μm and 100 μm were used.

First, in order to form the first abrasive grain layer 11, 20% of the ceramic binder, 40% by volume of the diamond abrasive grains, and 40% by volume of the pore-forming material of 20 μm are mixed with a known binder, and then dried and pulverized. A given granulated powder is obtained.

Next, in order to fabricate the second abrasive grain layer 12, the ceramic bond is used. 30%, 30% by volume of the diamond abrasive grains, and 40% by volume of the pore-forming material of 5 μm, and after mixing with a known binder, a predetermined granulated powder was obtained by dry pulverization.

60% by volume of the granulated powder of the first superabrasive layer 11 thus obtained and 30% by volume of the granulated powder of the second superabrasive layer 12 were dry-mixed with 10 μ% of the pore-forming material of 100 μm, and then added. The formed body was formed into a sheet shape, subjected to debonding treatment, and then fired at a temperature of 750 °C.

The formed sheet is fired, and an adhesive is used, followed by a base metal made of an aluminum alloy, and the conventional grinding stone is used for shaping. The finishing was carried out by using the diamond grinding wheel of the ceramic bond of Example 1 (super abrasive abrasive wheel 1 using a ceramic bond).

The size of the grinding wheel is 200 mm in outer diameter, the width of the superabrasive layer 13 is 4 mm, and the superabrasive layer 13 is a segment-shaped cup-shaped grinding wheel (JIS B4131 6A7S type) having a thickness of 5 mm.

The completed diamond grinding wheel using the ceramic bond can be confirmed to have a second abrasive grain layer composed of a combination of a pore of 5 μm and a bridge having a larger particle size than the abrasive grain at the periphery thereof, and is moderately dispersed. The first abrasive grain layer combined with the small bridge of the particle size exists.

Here, the above contents are the results of observing the cut surface of the previously prepared abrasive grain layer by a scanning electron microscope.

The diamond grinding wheel using the ceramic bond of the first embodiment was placed on a flat grinding disc of a vertical rotary table type, and the enamel wafer was polished to confirm the effect of the present invention.

Figure 5 shows the processing of wafers by planar grinding discs. Mode diagram of the way. Referring to Fig. 5, in the polishing processing method 100, a wafer 120 formed of a crucible as a workpiece is fixed on a work table 110. The work table 110 is rotatable in the direction indicated by the arrow 110R. The superabrasive grinding wheel 1 using a ceramic bond can be rotated in the direction indicated by the arrow 1R. Moreover, the direction indicated by the arrow 1F is the notch direction.

Polishing is performed using the polishing method 100 shown in Fig. 5, and it is found that the cutting feeling is good and stable, and the amount of abrasion in the thickness direction of the superabrasive layer 13 is also small. After the completion of the polishing process, the amount of abrasion in the thickness direction of the superabrasive layer 13 was measured and found to be 0.5 μm. Further, the load current value of the spindle motor during the grinding process was 8.8 A. Moreover, the difference in the load current values is 0.1A. On the surface after the processing of the wafer of the workpiece, the maximum value PV of the height difference (the height difference between the highest point and the lowest point in the sample) was 21.2 nm, and the surface roughness Ra was 2.1 nm.

(Example 2)

The details of the superabrasive grinding wheel using the ceramic bond of Example 2 are as follows.

The composition of the ceramic bond was the same as in Example 1. The superabrasive particles and the pore-forming material were used in the same manner as in Example 1. First, in order to form the first abrasive grain layer 11, 20% of the ceramic binder, 40% by volume of the diamond abrasive grains, and 40% by volume of the pore-forming material of 20 μm are mixed with a known binder, and then dried and pulverized. A given granulated powder is obtained.

Next, in order to form the first abrasive grain layer 12, 30% of the ceramic binder, 30% by volume of the diamond abrasive grains, and 40% by volume of the pore-forming material of 5 μm are mixed with a known binder, and then dried and pulverized. Get the established granulation powder.

50% by volume of the granulated powder of the first superabrasive layer 11 thus obtained and 40% by volume of the granulated powder of the second superabrasive layer 12 are dry-mixed with 10% by volume of the pore-forming material of 100 μm, and then added. The formed body was formed into a sheet shape, subjected to debonding treatment, and then fired at a temperature of 750 °C.

The formed sheet is fired, and an adhesive is used, followed by a base metal made of an aluminum alloy, and the conventional grinding stone is used for shaping. The finishing was carried out by using the diamond grinding wheel of the ceramic bond of Example 2 (super abrasive abrasive wheel 1 using a ceramic bond).

The size of the grinding wheel is 200 mm in outer diameter, the width of the superabrasive layer 13 is 4 mm, and the superabrasive layer 13 is a segment-shaped cup-shaped grinding wheel (JIS B4131 6A7S type) having a thickness of 5 mm.

The completed diamond grinding wheel using the ceramic bond can be confirmed to have a second abrasive grain layer composed of a combination of a pore of 5 μm and a bridge having a larger particle size than the abrasive grain at the periphery thereof, and is moderately dispersed. The first abrasive grain layer combined with the small bridge of the particle size exists.

Here, the above contents are the results of observing the cut surface of the previously prepared abrasive grain layer by a scanning electron microscope.

The diamond grinding wheel using the ceramic bond of the second embodiment was placed on a flat grinding disc of a vertical rotary table type, and the enamel wafer was polished to confirm the effect of the present invention.

Polishing is performed using the polishing method 100 shown in Fig. 5, and it is found that the cutting feeling is good and stable, and the amount of abrasion in the thickness direction of the superabrasive layer 13 is also small. The superabrasive layer 13 is measured after the end of the grinding process The amount of wear in the thickness direction was 0.4 μm. Further, the load current value of the spindle motor during the grinding process was 8.7 A. Moreover, the difference in the load current values is 0.2A. On the surface after the processing of the wafer of the workpiece, the maximum value PV of the height difference (the height difference between the highest point and the lowest point in the sample) was 20.7 nm, and the surface roughness Ra was 2.2 nm.

(Example 3)

The details of the superabrasive grinding wheel using the ceramic bond of Example 3 are as follows.

The composition of the ceramic bond was the same as in Example 1. The superabrasive particles and the pore-forming material were used in the same manner as in Example 1. First, in order to form the first abrasive grain layer 11, 20% of the ceramic binder, 40% by volume of the diamond abrasive grains, and 40% by volume of the pore-forming material of 20 μm are mixed with a known binder, and then dried and pulverized. A given granulated powder is obtained.

Next, in order to form the first abrasive grain layer 12, 40% of the ceramic binder, 20% by volume of the diamond abrasive grains, and 40% by volume of the pore-forming material of 5 μm are mixed with a known binder, and then dried and pulverized. A given granulated powder is obtained.

60% by volume of the granulated powder of the first superabrasive layer 11 thus obtained and 30% by volume of the granulated powder of the second superabrasive layer 12 were dry-mixed with 10 μ% of the pore-forming material of 100 μm, and then added. The formed body was formed into a sheet shape, subjected to debonding treatment, and then fired at a temperature of 750 °C.

The formed sheet is fired, and an adhesive is used, followed by a base metal made of an aluminum alloy, and the conventional grinding stone is used for shaping. Trimming, the diamond grinding wheel using ceramic bond of Example 3 (super abrasive grain using ceramic bonding agent) Grinding wheel 1) is completed.

The size of the grinding wheel is 200 mm in outer diameter, the width of the superabrasive layer 13 is 4 mm, and the superabrasive layer 13 is a segment-shaped cup-shaped grinding wheel (JIS B4131 6A7S type) having a thickness of 5 mm.

The completed diamond grinding wheel using the ceramic bond can be confirmed to have a second abrasive grain layer composed of a combination of a pore of 5 μm and a bridge having a larger particle size than the abrasive grain at the periphery thereof, and is moderately dispersed. The first abrasive grain layer combined with the small bridge of the particle size exists.

Here, the above contents are the results of observing the cut surface of the previously prepared abrasive grain layer by a scanning electron microscope.

The diamond grinding wheel using the ceramic bond of the third embodiment was placed on a flat grinding disc of a vertical rotary table type, and the enamel wafer was polished to confirm the effect of the present invention.

Polishing is performed using the polishing method 100 shown in Fig. 5, and it is found that the cutting feeling is good and stable, and the amount of abrasion in the thickness direction of the superabrasive layer 13 is also small. After the completion of the polishing process, the amount of abrasion in the thickness direction of the superabrasive layer 13 was measured and found to be 0.2 μm. Further, the load current value of the spindle motor during the grinding process was 8.7 A. Moreover, the difference in the load current values is 0.1A. On the surface after the processing of the wafer on the workpiece, the maximum value PV of the height difference (the height difference between the highest point and the lowest point in the sample) was 21 nm, and the surface roughness Ra was 2 nm.

(Example 4)

The details of the superabrasive grinding wheel using the ceramic bond of Example 4 are as follows.

The composition of the ceramic bond was the same as in Example 1. The superabrasive particles and the pore-forming material were used in the same manner as in Example 1. First, in order to form the first abrasive grain layer 11, 10% of the ceramic binder, 40% by volume of the diamond abrasive grains, and 40% by volume of the pore-forming material of 20 μm are mixed with a known binder, and then dried and pulverized. A given granulated powder is obtained.

Next, in order to form the first abrasive grain layer 12, 30% of the ceramic binder, 30% by volume of the diamond abrasive grains, and 40% by volume of the pore-forming material of 5 μm are mixed with a known binder, and then dried and pulverized. A given granulated powder is obtained.

60% by volume of the granulated powder of the first superabrasive layer 11 thus obtained and 30% by volume of the granulated powder of the second superabrasive layer 12 were dry-mixed with 10 μ% of the pore-forming material of 100 μm, and then added. The formed body was formed into a sheet shape, subjected to debonding treatment, and then fired at a temperature of 750 °C.

The formed sheet is fired, and an adhesive is used, followed by a base metal made of an aluminum alloy, and the conventional grinding stone is used for shaping. The finishing was carried out by using the diamond grinding wheel of the ceramic bond of Example 4 (super abrasive grinding wheel 1 using a ceramic bond).

The size of the grinding wheel is 200 mm in outer diameter, the width of the superabrasive layer 13 is 4 mm, and the superabrasive layer 13 is a segment-shaped cup-shaped grinding wheel (JIS B4131 6A7S type) having a thickness of 5 mm.

The completed diamond grinding wheel using the ceramic bond can be confirmed to have a second abrasive grain layer composed of a combination of a pore of 5 μm and a bridge having a larger particle size than the abrasive grain at the periphery thereof, and is moderately dispersed. The first abrasive grain layer combined with the small bridge of the particle size exists.

Here, the above contents are the results of observing the cut surface of the previously prepared abrasive grain layer by a scanning electron microscope.

The diamond grinding wheel using the ceramic bond of the fourth embodiment was placed on a flat grinding disc of a vertical rotary table type, and the enamel wafer was polished to confirm the effect of the present invention.

Polishing is performed using the polishing method 100 shown in Fig. 5, and it is found that the cutting feeling is good and stable, and the amount of abrasion in the thickness direction of the superabrasive layer 13 is also small. After the completion of the polishing process, the amount of abrasion in the thickness direction of the superabrasive layer 13 was measured and found to be 0.7 μm. Further, the load current value of the spindle motor during the grinding process was 8.5 A. Moreover, the difference in the load current values is 0.2A. On the surface after the processing of the wafer of the workpiece, the maximum value PV of the height difference (the height difference between the highest point and the lowest point in the sample) was 22.3 nm, and the surface roughness Ra was 2.3 nm.

(Comparative Example 1)

On the other hand, the superabrasive grinding wheel using the ceramic bond of Comparative Example 1 was obtained by mixing 90% by volume of the granulated powder of the second superabrasive layer 12 of Example 1 and 10% by volume of the pore-forming material of 100 μm.

Then, the polishing process in the same manner as in Example 1 was carried out, and it was found that the cutting feeling was good, and the amount of abrasion in the thickness direction of the superabrasive layer 13 was also small. After the completion of the polishing process, the amount of abrasion in the thickness direction of the superabrasive layer 13 was measured and found to be 0.1 μm. Further, the load current value of the spindle motor during the grinding process was 7.8 A. Moreover, the difference in the load current value is 0.8A. On the surface after the processing of the wafer of the workpiece, the maximum value PV of the height difference (the height difference between the highest point and the lowest point in the sample) was 39.1 nm, and the surface roughness Ra was 4.1 nm.

(Comparative Example 2)

Further, the superabrasive grinding wheel using the ceramic bond of Comparative Example 2 was obtained by mixing 90% by volume of the granulated powder of the first superabrasive layer 11 of Example 1 and 10% by volume of the pore-forming material of 100 μm.

Then, the polishing process in the same manner as in Example 1 was carried out, and it was found that the abrasion in the thickness direction of the abrasive grain layer 13 was large, and the cutting feeling was not stable. After the completion of the polishing process, the amount of abrasion in the thickness direction of the superabrasive layer 13 was measured to be 3 μm, and the load current value of the spindle motor during the polishing process was 8.4 A. Moreover, the difference in load current values is 0.5A. On the surface after processing of the wafer on the workpiece, the maximum value PV of the height difference (the height difference between the highest point and the lowest point in the sample) was 20.6 nm, and the surface roughness Ra was 2.2 nm.

(Comparative Example 3)

The details of the superabrasive grinding wheel using the ceramic bond of Comparative Example 3 are as follows.

The composition of the ceramic bond was the same as in Example 1. The superabrasive particles and the pore-forming material were used in the same manner as in Example 1. First, in order to form the first abrasive grain layer 11, 20% of the ceramic binder, 40% by volume of the diamond abrasive grains, and 40% by volume of the pore-forming material of 20 μm are mixed with a known binder, and then dried and pulverized. A given granulated powder is obtained.

Next, in order to form the first abrasive grain layer 12, 50% of the ceramic binder and 50% by volume of the diamond abrasive grains are mixed with a known binder, and then dried and pulverized to obtain a predetermined granulated powder. No pore forming material was used.

60 vol% of the granulated powder of the first superabrasive layer 11 thus obtained and 30 vol% of the granulated powder of the second superabrasive layer 12, and 100 μm After 10% by volume of the pore-forming material was dry-mixed, the formed body was formed into a sheet shape by pressurization, and debonding treatment was performed, followed by firing at a temperature of 750 °C.

The formed sheet is fired, and an adhesive is used, followed by a base metal made of an aluminum alloy, and the conventional grinding stone is used for shaping. Trimming was carried out to make a diamond grinding wheel (super abrasive abrasive wheel 1 using a ceramic bond) of Comparative Example 3 using a ceramic bond.

The size of the grinding wheel is 200 mm in outer diameter, the width of the superabrasive layer 13 is 4 mm, and the superabrasive layer 13 is a segment-shaped cup-shaped grinding wheel (JIS B4131 6A7S type) having a thickness of 5 mm.

The completed diamond grinding wheel using the ceramic bond can confirm the second abrasive grain layer formed by the combination bridge which is larger than the abrasive grain size, and is moderately dispersed in the combination of the smaller bridge by the smaller particle size. Exist in an abrasive layer. No pores due to the average particle diameter of the pore-forming material of 5 μm were provided in the second superabrasive layer.

Here, the above contents are the results of observing the cut surface of the previously prepared abrasive grain layer by a scanning electron microscope.

The diamond grinding wheel using the ceramic bond of Comparative Example 3 was placed on a flat grinding disc of a vertical rotary table type, and the enamel wafer was polished to confirm the effect of the present invention.

Polishing was performed using the polishing method 100 shown in Fig. 5, and it was found that the cutting feeling was unstable. The amount of wear of the superabrasive layer 13 in the thickness direction is small. After the completion of the polishing process, the amount of abrasion in the thickness direction of the superabrasive layer 13 was measured and found to be 0.4 μm. Further, the load current value of the spindle motor during the grinding process was 9 A. Moreover, the difference in the load current values is 0.4A. Wafer wafer On the surface after the processing, the maximum value PV of the height difference (the height difference between the highest point and the lowest point in the sample) was 29.8 nm, and the surface roughness Ra was 3.1 nm.

(Comparative Example 4)

The details of the superabrasive grinding wheel using the ceramic bond of Comparative Example 4 are as follows.

The composition of the ceramic bond was the same as in Example 1. The superabrasive particles and the pore-forming material were used in the same manner as in Example 1. First, in order to form the first abrasive grain layer 11, 33% of the ceramic binder and 67% by volume of the diamond abrasive grains are mixed with a known binder, and then dried and pulverized to obtain a predetermined granulated powder. No pore forming material was used.

Next, in order to form the first abrasive grain layer 12, 30% of the ceramic binder, 30% by volume of the diamond abrasive grains, and 40% by volume of the pore-forming material of 5 μm are mixed with a known binder, and then dried and pulverized. A given granulated powder is obtained.

60% by volume of the granulated powder of the first superabrasive layer 11 thus obtained and 30% by volume of the granulated powder of the second superabrasive layer 12 were dry-mixed with 10 μ% of the pore-forming material of 100 μm, and then added. The formed body was formed into a sheet shape, subjected to debonding treatment, and then fired at a temperature of 750 °C.

The formed sheet is fired, and an adhesive is used, followed by a base metal made of an aluminum alloy, and the conventional grinding stone is used for shaping. Trimming was carried out to make a diamond grinding wheel (superabrasive grinding wheel 1 using a ceramic bond) of Comparative Example 4 using a ceramic bond.

The size of the grinding wheel is 200 mm in outer diameter, the width of the superabrasive layer 13 is 4 mm, and the segment of the superabrasive layer 13 is 5 mm. The cup-shaped grinding wheel (JIS) B4131 6A7S type).

The completed diamond grinding wheel using the ceramic bond can be confirmed to have a second abrasive grain layer composed of a combination of a pore of 5 μm and a bridge having a larger particle size than the abrasive grain at the periphery thereof, and is moderately dispersed. The first abrasive grain layer combined with the small bridge of the particle size exists. No pores due to the average particle diameter of the pore-forming material of 20 μm were provided in the first superabrasive layer.

Here, the above contents are the results of observing the cut surface of the previously prepared abrasive grain layer by a scanning electron microscope.

The diamond grinding wheel using the ceramic bond of Comparative Example 4 was placed on a flat grinding disc of a vertical rotary table type, and the enamel wafer was polished to confirm the effect of the present invention.

Polishing was performed using the polishing method 100 shown in Fig. 5, and it was found that the cutting feeling was unstable. The amount of wear of the superabrasive layer 13 in the thickness direction is small. After the completion of the polishing process, the amount of abrasion in the thickness direction of the superabrasive layer 13 was measured and found to be 0.3 μm. Further, the load current value of the spindle motor during the grinding process was 9.2 A. Moreover, the difference in load current values is 0.5A. On the surface after the processing of the wafer of the workpiece, the maximum value PV of the height difference (the height difference between the highest point and the lowest point in the sample) was 25.2 nm, and the surface roughness Ra was 2.8 nm.

(Comparative Example 5)

The details of the superabrasive grinding wheel using the ceramic bond of Comparative Example 5 are as follows.

The composition of the ceramic bond was the same as in Example 1. The superabrasive particles and the pore-forming material were used in the same manner as in Example 1. First, in order to form the first abrasive grain layer 11, 20% of the ceramic binder, 40% by volume of the diamond abrasive grains, and 20 μm of gas The pore-forming material was 40% by volume, and after mixing with a known binder, it was dried and pulverized to obtain a predetermined granulated powder.

Next, in order to form the first abrasive grain layer 12, 30% of the ceramic binder, 30% by volume of the diamond abrasive grains, and 40% by volume of the pore-forming material of 5 μm are mixed with a known binder, and then dried and pulverized. A given granulated powder is obtained.

65 mol% of the granulated powder of the first superabrasive layer 11 thus obtained and 35 vol% of the granulated powder of the second superabrasive layer 12 were dry-mixed. No pore forming material was added. Thereafter, the formed body was formed into a sheet shape by pressurization, and debonding treatment was performed, followed by firing at a temperature of 750 °C.

The formed sheet is fired, and an adhesive is used, followed by a base metal made of an aluminum alloy, and the conventional grinding stone is used for shaping. The dressing was carried out by using the diamond grinding wheel of the ceramic bond of Example 3 (super abrasive abrasive wheel 1 using a ceramic bond).

The size of the grinding wheel is 200 mm in outer diameter, the width of the superabrasive layer 13 is 4 mm, and the superabrasive layer 13 is a segment-shaped cup-shaped grinding wheel (JIS B4131 6A7S type) having a thickness of 5 mm.

The completed diamond grinding wheel using the ceramic bond can be confirmed to have a second abrasive grain layer composed of a combination of a pore of 5 μm and a bridge having a larger particle size than the abrasive grain at the periphery thereof, and is moderately dispersed. The first abrasive grain layer combined with the small bridge of the particle size exists. No pores due to the average particle diameter of the pore-forming material of about 100 μm were provided.

Here, the above contents are the results of observing the cut surface of the previously prepared abrasive grain layer by a scanning electron microscope.

The diamond grinding wheel using the ceramic bond of the third embodiment was placed on a flat grinding disc of a vertical rotary table type, and the enamel wafer was polished to confirm the effect of the present invention.

Polishing was performed using the polishing method 100 shown in Fig. 5, and it was found that the cutting feeling became unstable at an early stage, and it was necessary to stop the processing.

The results of the examples and comparative examples are shown in Table 1.

In the judgment column of Table 1, "○" indicates a good result, and "X" indicates a bad result. In addition, "porosity (20 μm)" indicates the ratio of the pore-forming material having an average particle diameter of 20 μm, and "porosity (5 μm)" indicates the ratio of the pore-forming material having an average particle diameter of 5 μm, and "porosity (100 μm)" indicates the average. The ratio of the pore-forming material of 100 μm.

The embodiments and examples disclosed herein are to be considered as illustrative and not restrictive. The scope of the present invention is defined by the scope of the claims, and is intended to be

1‧‧‧Super abrasive grinding wheel with ceramic bond

10‧‧‧Superabrasive

11‧‧‧First superabrasive layer

12‧‧‧Second superabrasive layer

13‧‧‧Superabrasive layer

20,30‧‧‧Ceramic bonding agent

50‧‧‧ vent

51‧‧‧ holes

Claims (9)

A superabrasive grinding wheel using a ceramic bond, comprising a superabrasive layer in which superabrasive grains are combined by a ceramic binder, wherein the superabrasive layer contains the superabrasive by the ceramic binder The first superabrasive layer combined with the granules and the superabrasive granules formed as a second superabrasive granule formed by the aggregate superabrasive grains due to the ceramic binder. The superabrasive grinding wheel using the ceramic bonding agent according to the first aspect of the invention, wherein the first superabrasive layer has a lower degree of bonding than the second superabrasive layer. A superabrasive grinding wheel using a ceramic bond according to the first or second aspect of the patent application, wherein in the first superabrasive layer, the abrasive grains are further separated by a particle diameter of the superabrasive grain A combination of small widths combined with bridges. The superabrasive grinding wheel using a ceramic bonding agent according to any one of claims 1 to 3, wherein in the second superabrasive layer, the abrasive grains are separated by the super abrasive grains. The combination of the width and the width of the bridge is combined. A superabrasive grinding wheel using a ceramic bond according to any one of claims 1 to 4, wherein the second superabrasive layer is coated with pores. A superabrasive grinding wheel using a ceramic bonding agent according to any one of claims 1 to 5, wherein the superabrasive grain and the superabrasive grain in the first superabrasive layer are The total amount of the ceramic binders is 10 to 50% by volume, in the second super-grinding In the granule layer, the ratio of the superabrasive grains to the total amount of the above-mentioned ceramic binder is 5 to 30% by volume. The superabrasive grinding wheel using a ceramic bond according to any one of claims 1 to 6, wherein the ceramic bonding agent has a softening temperature of 600 to 900 °C. A superabrasive grinding wheel using a ceramic bond according to any one of claims 1 to 7, which is used for polishing a wafer containing at least one of ruthenium, sapphire, and a compound semiconductor. A method of manufacturing a wafer using a superabrasive grinding wheel using a ceramic bond as disclosed in any one of claims 1 to 7, and grinding a wafer containing at least one of tantalum, sapphire, and a compound semiconductor machining.