TW201403975A - Stacked electrical card connector and method of manufacturing the same - Google Patents

Abstract

A stacked electrical card connector, includes an insulative housing, a plurality of contacts retained in the insulative housing, a metal shell covering the insulative housing. The insulative housing and the metal shell define a receiving room to receive the electrical card. The insulative housing includes a first base plate and a second base plate below the first base plate. The stacked electrical card connector also includes a supporter to support the insulative housing. The supporter includes an upper inserted block, a lower inserted block and a connect stick connecting the upper inserted block with the lower inserted block. The upper inserted block is inserted in the first base plate. The lower inserted block is inserted in the second base plate. When the contacts are soldered with the PCB, the supporter supports the insulative housing to avoid distortion.

Description

Stacked electronic card connector and manufacturing method thereof

The present invention relates to a stacked electronic card connector and a manufacturing method thereof, and more particularly to a stacked electronic card connector for connecting an electronic card and a printed circuit board in a mobile phone and a manufacturing method thereof.

With the rapid development of technology and economy, people's quality of life continues to improve, mobile phones have become more and more popular, and their use is increasing. SIM card connectors installed in mobile phones for connecting SIM (Subscriber Identity Module) cards It is also widely used. However, with the promotion of dual card dual standby technology, connectors that can insert multiple SIM cards are also widely used.

The stacked electronic card connector of the prior art generally includes an insulative housing, a conductive terminal held in the insulating body, and a shielding housing that is wrapped around the insulating body. The insulating body includes a first flat substrate, a second flat substrate under the first flat substrate, side walls on both sides of the first flat substrate and the second flat substrate, and a rear side of the first flat substrate and the second flat substrate Limit stop block. The first flat substrate, the side wall, the limiting stop block and the shielding shell cooperate to define a first receiving space. The second flat base, the side wall, the limiting stop and the first flat base are cooperatively defined to form a second receiving space. The first receiving space and the second receiving space are both for receiving a SIM card. The conductive terminal includes a first conductive terminal and a second conductive terminal. The first conductive terminal is retained in the first flat substrate, and the second conductive terminal is retained in the second flat substrate. The first conductive terminal includes a first soldering portion, and the second conductive terminal includes a second soldering portion; the first soldering portion is bent to protrude from a rear end of the second flat substrate, and the second soldering portion protrudes from the second flat substrate front end. However, when soldering, the first flat substrate and the second flat substrate are deformed by heat.

Therefore, it is necessary to provide a new stacked electronic card connector to overcome the above drawbacks.

It is an object of the present invention to provide a stacked electronic card connector and a method of fabricating the same that can reduce the heat shape of the insulating body and even prevent the insulating body from being thermally deformed.

To achieve the above object, the stacked electronic card connector of the present invention comprises an insulating body, a conductive terminal held in the insulating body, and a shielding case covered on the outside of the insulating body. The insulative housing and the shielding shell cooperate to define a receiving space for receiving the corresponding electronic card. The insulative housing includes a first flat substrate and a second flat substrate below the first flat substrate. The conductive terminal is provided with an abutting portion, and the abutting portion protrudes into the receiving space to be electrically connected to the corresponding electronic card. The stacked electronic card connector is further provided with a support for supporting the insulative housing, and the support member includes an upper buried block and a lower buried block and a connecting portion connecting the upper buried block and the lower buried block. The upper embedded block is embedded in the first flat substrate, and the lower embedded block is embedded in the second flat substrate.

Compared with the prior art, the stacked electronic card connector of the present invention has at least the following beneficial effects: a support member is added between the first flat substrate and the second flat base of the insulating body, and the support supports the insulating body during soldering, The heat-induced deformation of the small insulating body even prevents the insulating body from being deformed by heat.

Hereinafter, a specific embodiment of the stacked electronic card connector 100 of the present invention will be described in detail with reference to the drawings. In the following description, the description of the orientations referred to is referred to in the fourth figure.

Referring to the first to seventh embodiments, in the present embodiment, the stacked electronic card connector 100 of the present invention is a double-layer electronic card connector, which can be used to insert two SIM cards 5. The stacked electronic card connector 100 includes an insulative housing 1 , a conductive terminal 2 held in the insulative housing 1 , a shielding shell 3 covering the insulative housing 1 , and an insulative housing 1 . Support member 4 in 1.

Referring to FIG. 2 to FIG. 5 , the first insulative housing 1 is disposed in two layers, and includes a first flat substrate 11 , a second flat substrate 12 located below the first flat substrate 11 , and a first flat substrate 11 . And a side wall 13 on both sides of the second flat base 12 and a limit stop 14 on the rear side of the first flat base 11 and the second flat base 12. The first flat substrate 11 is slightly larger than the second flat substrate 12 and the two are disposed in parallel. The first flat substrate 11 and the second flat substrate 12 are provided with a plurality of conductive terminal receiving grooves 111 and 121. After the SIM card 5 is inserted, the SIM card 5 presses the conductive terminal 2, so that the conductive terminal 2 is received in the conductive terminal. The inside of the storage slots 111 and 121. The bottom surface of the second flat substrate 12 is provided with a recess 122 on both sides of the side wall 13 . The side wall 13 connects the first flat substrate 11 and the second flat substrate 12. The rear wall 13 is provided with a boss 131 at the rear, and a buckle recess 132 is provided at the lower end of the middle portion. The limiting stop block 14 is provided with two and is separately connected to the side walls 13 . The first flat base body 11 , the side wall 13 , the limiting stop block 14 and the shielding shell 3 are cooperatively defined to form a first receiving space 110 . The second flat base 12 , the side wall 13 , the limiting stop 14 and the first flat base 11 are cooperatively defined to form a second receiving space 120 . The first receiving space 110 and the second receiving space 120 are both for receiving the SIM card 5 .

The conductive terminal 2 is injection molded into the insulative housing 1 and is divided into a first conductive terminal 21 and a second conductive terminal 22. The first conductive terminal 21 is held in the first flat substrate 11 and includes a first soldering portion 211 extending outside the insulating body 1 and a first mating portion 212 suspended above the conductive terminal receiving slot 111. The second conductive terminal 22 is held in the second flat substrate 12 , and includes a second soldering portion 221 extending from the outside of the insulative housing 1 and a second mating portion 222 suspended above the conductive terminal receiving slot 112 . The first soldering portion 211 is bent and protruded from the rear end of the second flat substrate 12, and the second soldering portion 221 protrudes from the front end of the second flat substrate 12. The first abutting portion 212 and the second abutting portion 222 extend obliquely upward toward the rear end of the insulative housing 1 and protrude into the first receiving space 110 and the second receiving space 120 respectively. When the SIM card 5 is inserted, the first docking portion 212 and the second docking portion 222 guide the SIM card 5, facilitating the insertion of the SIM card 5. After the SIM card 5 is inserted into the first receiving space 110, the SIM card 5 presses the first butting portion 212 of the first conductive terminal 21, so that the first butting portion 212 is deformed and received in the conductive terminal receiving groove 111. After the SIM card 5 is inserted into the second receiving space 120, the SIM card 5 presses the second butting portion 222 of the second conductive terminal 22, so that the second butting portion 222 is deformed and received in the conductive terminal receiving groove 121.

The shielding shell 3 is formed by stamping and bending a metal plate, and includes a body portion 31 and side portions 32 on both sides of the body portion 31. The front end of the main body portion 31 is provided with a guiding portion 311 which is tilted upward, and the guiding portion 311 guides the SIM card 5 into the first receiving space 110. The side portion 32 is provided with an inwardly and forwardly extending snap tab 321 with respect to the latching recess 132 of the insulative housing 1 . The bottom ends of the two side portions 32 are provided with a buckle portion 322 which is bent inward and extends toward each other. The width of the side portion 32 is slightly larger than the width of the side wall 13 of the insulative housing 1, and the distance between the side portions 32 is also slightly larger than the distance between the side walls 13. The shielding shell 3 is assembled from the front end to the rear end of the insulating body 1. Referring to the first and sixth figures in detail, after the assembly is completed, the two side portions 32 are respectively wrapped around the side wall 13, so that the shielding case 3 and the insulative housing 1 are stably held in the left-right direction. The body portion 31 abuts against the top surface of the side wall 13 , and the fastening portion 322 catches the recess portion 122 of the insulative housing 1 . Therefore, the shield case 3 and the insulative housing 1 are stably held in the up and down direction. The rear end of the side portion 32 abuts against the boss 131 of the side wall 13 , and the snap tab 321 is received in the latching recess 132 and abuts against the front end surface of the latching recess 132 . Therefore, the shield case 3 and the insulative housing 1 are stably held in the front-rear direction. So far, the shielding case 3 and the insulating body 1 are stably held.

Referring to the fourth to fifth figures, the support member 4 is generally made of a plurality of materials (such as metal, thermosetting resin, heat-resistant rubber, etc.) having good heat resistance, and each support member 4 includes an upper buried block. 41. The buried block 42 and a connecting portion 43 connecting the upper buried block 41 and the lower buried block 42. The upper embedded block 41 is injection molded into the first flat substrate 11 of the insulative housing 1 . The lower embedded block 42 is injection molded into the second flat substrate 12 of the insulative housing 1 . In other embodiments, the insulative housing 1 is provided with a recess to receive the upper embedding block 41 and the lower embedding block 42. In the case where the supporting action is not affected, the connection portion 43 and the connection between the upper embedded block 41 and the lower embedded block 42 are thinned or cut, and the connecting portion 43 and the upper buried block 41 and the lower buried block 42 are connected. Try to break as easily as possible. In other embodiments, the connecting portion 43 and the upper embedded block 41 and the lower embedded block 42 may be simply connected by glue or connected by other methods in which the connecting portion 43 is easily detached. In this embodiment, the support member 4 is provided with four, and the four support members 4 are respectively located on the outer sides of the conductive terminals 2. During welding, the four support members 4 will support the insulative housing 1, reducing the heat-receiving variables of the insulative housing 1, and even avoiding the thermal deformation of the insulative housing 1. After the welding is completed, the SIM card 5 (or the corresponding electronic card model) is inserted into the second accommodating space 120, and the connecting portion 43 is pushed to fall off, and the connecting portion 43 is discarded. Then, the stacked electronic card connector 100 will enable the connection of the two SIM cards 5 to the circuit board. In other embodiments, the support member (not shown) may be provided with only one, including an upper embedded block (not shown), a lower buried block (not shown), and a plurality of connections and supporting the upper and lower burying. The connection part of the block (not shown). Before the welding, the support member is inserted into the second receiving space 120 and abuts between the first flat substrate 11 and the second flat substrate 12 (the upper embedded block abuts the first flat substrate 11 and the lower embedded The block abuts the second flat substrate 12) to achieve a reduction in the heat shape variable of the insulative housing 1. After the welding is completed, the support member is taken out from the second receiving space 120.

The above is a description of the structure of the stacked electronic card connector 100 of the present invention. The method of manufacturing the stacked electronic card connector 100 of the present invention will be described in detail below.

The first embodiment includes the following steps:

(a) providing a conductive terminal 2 formed by stamping a metal plate;

(b) providing a support member 4 made of a heat-resistant material, the support member 4 includes an upper embedded block 41, a lower embedded block 42 and a connecting portion 43 connecting the upper buried block 41 and the lower embedded block 42;

(c). The conductive terminal 2 and the support member 4 are injection molded into the insulative housing 1. The insulative housing 1 includes a first flat substrate 11 and a second flat substrate 12 located below the first flat substrate 11. The block 41 is embedded in the first flat substrate 11, and the lower embedded block 42 is embedded in the second flat substrate 12;

(d) providing a shielding shell 3, the shielding housing 3 is assembled and held outside the insulating body 1;

(e) soldering the conductive terminal 2 to a circuit board (not shown);

(f). A plate-like member (not shown) is provided, and the plate-like member is inserted into the second receiving space 120 defined by the first flat substrate 11 and the second flat substrate 12, and the connecting portion 43 of the supporting member 4 is broken. .

The second embodiment includes the following steps:

(a) providing a conductive terminal 2 formed by stamping a metal plate;

(b) injection molding the conductive terminal 2 into the insulative housing 1, the insulative housing 1 comprising a first flat substrate 11 and a second flat substrate 12 under the first flat substrate 11, the first flat substrate 11 and The second flat substrate 12 defines a second receiving space 120;

(c) providing a shielding shell 3, and assembling the shielding shell 3 to the outside of the insulating body 1;

(d) providing a support member (not shown) made of a heat-resistant material, the support member being inserted into the second receiving space 120 and abutting the first flat substrate 11 and the second flat substrate 12 between;

(e) soldering the conductive terminal 2 to the circuit board;

(f). The support member is taken out from the second receiving space 120.

A support member 4 is added between the first flat substrate 11 and the second flat base 12 of the insulative housing 1. When soldering, the support member 4 supports the insulative housing 1 to reduce the heat deformation of the insulative housing 1 and even avoid the insulative body 1 Deformed by heat.

The above description is only one embodiment of the present invention, and not all of the embodiments, any equivalent changes taken by those skilled in the art by reading the specification of the present invention are the scope of patent application of the present invention. Covered.

100. . . Stacked electronic card connector

1. . . Insulating body

11. . . First flat substrate

110. . . First containment space

111, 121. . . Conductive terminal receiving slot

12. . . Second flat substrate

120. . . Second containment space

122. . . Depression

13. . . Side wall

131. . . Boss

132. . . Buckle groove

14. . . Limit stop block

2. . . Conductive terminal

twenty one. . . First conductive terminal

211. . . First weld

212. . . First docking

twenty two. . . Second conductive terminal

221. . . Second weld

222. . . Second docking

3. . . Shaded housing

31. . . Body part

311. . . Guide

32. . . Side

321. . . Buckle shrapnel

322. . . Buckle department

4. . . supporting item

41. . . Buried block

42. . . Buried block

43. . . Connection

5. . . SIM card

The first figure is a perspective assembled view of the stacked electronic card connector of the present invention.

The second figure is a schematic diagram of the separation of the shielded housing of the stacked electronic card connector of the present invention.

The third figure is another perspective view of the separation of the shielded housing of the stacked electronic card connector of the present invention.

The fourth figure is an exploded perspective view of the stacked electronic card connector of the present invention.

The fifth figure is another perspective exploded view of the stacked electronic card connector of the present invention.

The sixth figure is a schematic view of the stacked electronic card connector of the present invention after the connection portion is detached.

The seventh figure is a schematic diagram of inserting two SIM cards into the stacked electronic card connector of the present invention.

100. . . Stacked electronic card connector

1. . . Insulating body

2. . . Conductive terminal

221. . . Second weld

3. . . Shaded housing

32. . . Side

4. . . supporting item

Claims (10)

A stacked electronic card connector comprising:
An insulating body comprising a first flat substrate and a second flat substrate under the first flat substrate;
The conductive terminal is fixed in the insulating body, and is provided with an abutting portion;
The shielding shell is wrapped on the outside of the insulating body, and the insulating body and the shielding shell cooperate to define a receiving space for receiving the corresponding electronic card, and the butting portion protrudes into the receiving space to correspond to the corresponding electronic card And a support member for supporting the insulating body, comprising: a buried block and a buried block supported on the insulating body;
The upper embedded block is embedded in the first flat substrate, and the lower buried block is embedded in the second flat substrate. The stacked electronic card connector of claim 1, wherein the support member has better heat resistance than the heat resistance of the insulating body. A stacked electronic card connector comprising:
Insulating body
The conductive terminal is fixed in the insulating body, and is provided with an abutting portion;
The shielding shell is wrapped on the outside of the insulating body, and the insulating body and the shielding shell cooperate to define a receiving space for receiving the corresponding electronic card, and the butting portion protrudes into the receiving space to correspond to the corresponding electronic card And a support member for supporting the insulative housing, comprising: a buried portion on the insulating body, a buried block, and a connecting portion connecting the buried block and the lower buried block. The stacked electronic card connector of claim 3, wherein the insulative housing comprises a first flat substrate and a second flat substrate below the first flat substrate; the upper buried block is embedded in the first flat panel In the substrate, the lower buried block is embedded in the second flat substrate. The stacked electronic card connector of claim 4, wherein the connecting portion is connected to the upper buried block and the lower embedded block in a connection manner that is easily broken at the joint. The stacked electronic card connector of claim 3, wherein the support member has better heat resistance than the heat resistance of the insulating body. The stacked electronic card connector of claim 3, wherein the support member is provided in plurality and respectively located outside the conductive terminal, and each support member comprises an upper buried block, a lower buried block and a A connection portion between the buried block and the lower buried block is connected. The stacked electronic card connector of claim 3, wherein the support member is provided with one and includes an upper buried block, a lower buried block, and a plurality of connecting portions connecting the upper buried block and the lower buried block; The insulative housing comprises a first flat substrate and a second flat substrate below the first flat substrate; the upper embedded block abuts the first flat substrate, and the lower embedded block abuts the second flat substrate. A method for manufacturing a stacked electronic card connector includes the following steps:
(a) providing a conductive terminal formed by stamping a metal plate;
(b) providing a support member made of a heat-resistant material, the support member comprising an upper buried block, a lower buried block, and a connecting portion connecting the upper buried block and the lower buried block;
(c) injection molding the conductive terminal and the support member into the insulating body, the insulating body comprising a first flat substrate and a second flat substrate under the first flat substrate, the upper buried block being embedded in the first flat base In the body, the lower buried block is embedded in the second flat substrate;
(d) providing a shielding shell, and clamping the shielding shell assembly to the outside of the insulating body;
(e) soldering the conductive terminals to the circuit board;
(f) providing a plate-like member that is inserted into the second receiving space defined by the first flat substrate and the second flat substrate to break the joint of the support. A method for manufacturing a stacked electronic card connector includes the following steps:
(a) providing a conductive terminal formed by stamping a metal plate;
(b) injection molding the conductive terminal into the insulating body, the insulating body comprising a first flat substrate and a second flat substrate under the first flat substrate, wherein the first flat substrate and the second flat substrate are defined Second containment space;
(c) providing a shielding shell, and clamping the shielding shell assembly to the outside of the insulating body;
(d) providing a support member made of a heat-resistant material, the support member is inserted into the second receiving space and abuts between the first flat substrate and the second flat substrate;
(e) soldering the conductive terminals to the circuit board;
(f). The support member is taken out from the second receiving space.