TW201352052A - Support member, heating plate support device comprising the same, and heating device - Google Patents

Abstract

The present invention provides a support member, a heating-plate support device and a heating device used in a bolster capable of inhibiting temperature difference and deformation caused by the part inside the heating plate. The support member 10 supporting the heating plate 20 is disposed on a plurality of parts of the bolster 30, and the support heating plate 20 is carried and supported by means of the upper surface 11a of the first supporting plate 11. The supporting member 10 includes: a first support plate 11, a support frame 12, and a second support plate 13. An upper surface 11a of the first support plate 11 works as a carrier surface S carrying the heating plate 20. The support frame 12 is the member as follows, which is disposed between the first support plate 11 and the second support plate 13, and becomes the heat resistance inhibitiing the heat flowing from the heating plate 20 through the support member 10 to the bolster 30. A horizontal contact surface area of the support frame 12 and the support plate 11 can be formed to be smaller than the carrier surface S.

Description

Support member, heating plate support device and heating device therewith

The present invention relates to a support member used in a carrier for suppressing deformation of a heating plate, a heating plate supporting device including the same, and a heating device.

In order to heat the flat-shaped object to be heated, a heating plate having a heating means such as a sheath heater is used to form a flat plate. The material of the heating plate is made of metal, ceramics, etc., but it is mostly made of metal for reasons such as cost. Among them, since copper or aluminum has a large thermal conductivity, the temperature distribution of the heating surface tends to be uniform, and the power density is easily increased, so that it is widely used as a material for a heating plate.

However, since the Young's modulus of the materials is low, the deflection caused by the self-weight or the external force is large, and it is easy to generate creep deformation at a lower use temperature. Therefore, the support plate is sometimes supported by the rigid plate. Suppress deformation. Here, in the case where the support plate is used to support the entire surface of the heating plate, if there is a portion where the surface contact is insufficiently contacted and the portion where the contact is not made, there is a possibility that a large temperature distribution and deflection occur due to the difference in the heat conduction pattern. . Thereby, the flatness of the heating surface of the heating plate may be lowered. Especially in the case of use in a vacuum, the heat conduction form of the non-contact portion is only radiation, and therefore, the temperature difference with the contact portion may increase and cause a larger temperature difference and deflection.

As a method of improving the temperature distribution, two methods can be considered: as in the technique described in Patent Document 1, a plurality of cylindrical support members are provided between the carrier plate and the heating plate, A space is provided between the two, or a support member having a pointed shape such as a cone or a hemispherical shape is used as in the technique described in Patent Document 2.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. Hei 10-95637

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2002-246286

However, the technique described in Patent Document 1 has a problem in that the amount of heat movement from the heating plate toward the carrier plate is increased in the portion where the support member is provided, and the temperature distribution is locally uneven.

Further, the technique described in Patent Document 2 has a problem that the thermal resistance is increased by the contact portion of the heating plate and the supporting member, whereby the heat transfer can be suppressed, but the front surface of the supporting member is raised because the surface pressure of the supporting heating plate is increased. Will be embedded in the heating plate, in addition, will hinder the relative movement caused by the difference in thermal expansion between the carrier and the heating plate, resulting in new deformation or stress.

Accordingly, it is an object of the present invention to provide a support member for use in a support plate capable of suppressing temperature difference and deformation of a heating plate, a heating plate support device including the same, and a heating device.

In order to achieve the above object, the present invention uses the following technical means, and the invention described in claim 1 is a supporting member for supporting a flat heating plate on which a heating object is placed and suppressing deformation of the heating plate. The flat plate is separated by one or more supporting plates, which are formed in a flat shape smaller than the heating plate; and one The above support frame supports the support plate; the support plate and the support frame are alternately laminated with one or more layers; the heating plate is placed and supported on the upper surface of the uppermost support plate, and the support is provided The contact area of the board with the support frame is smaller than the area of the mounting surface.

According to the invention described in claim 1 of the patent application, by the support member The heating plate is supported separately from the carrier plate, so that the temperature difference caused by the portion inside the heating plate can be reduced as compared with the case where the heating plate directly contacts the carrier plate, and the deformation can be suppressed effectively.

Since the heating plate is surface-supported by the support plate, the supporting member is not embedded in the heating plate, or the relative movement caused by the difference in thermal expansion between the carrier plate and the heating plate is not hindered, and deformation and support of the heating plate can be suppressed.

Further, since the support member can generate a large thermal resistance by the support frame, the heat flowing from the heating plate to the carrier can be suppressed.

Thereby, the temperature difference and deformation caused by the portion in the heating plate can be suppressed.

In the invention described in the second aspect of the invention, the invention described in claim 2 uses the following technical means: chamfering the end portion of the upper surface of the uppermost support plate.

According to the invention described in the second aspect of the patent application, even when the heating plate is relatively moved with respect to the support plate, excessive stress is not generated at the end portion of the upper surface of the support plate which is in contact with the heating plate. Preferably.

In the invention described in claim 3, the invention described in claim 3 uses the following technical means: the support plate is integrally formed with the support frame.

According to the invention described in claim 3 of the patent application, the support member can be reduced The number of parts makes it possible to save labor in the step of arranging the support member on the carrier.

In the invention described in claim 4, the invention described in claim 4 uses the following technical means: the support plate and the support frame constitute a ball seat.

The support member is configured as in the invention described in the fourth aspect of the invention, whereby the heating plate is automatically aligned when it is placed on the support member, so that the support can be stably performed.

The invention described in claim 5 uses the following technical means: the invention includes a plurality of support members and a support plate for a support plate according to any one of claims 1 to 4, The upper surface of the support plate at the uppermost portion of the support member constitutes a mounting surface on which the heating plate is placed and supported, and the size of the mounting surface and the arrangement of the support member in the carrier plate are such that deformation of the heating plate can be suppressed The way it is structured.

As in the invention described in the fifth aspect of the invention, a plurality of supporting members are appropriately disposed on the carrier, whereby a heating plate supporting device capable of suppressing deformation of the heating plate can be constructed.

According to the heating plate supporting device of the fifth aspect of the invention, the invention described in claim 6 uses the following technical means: when the heating plate is made of a metal material, the weight of the heating plate is divided by the load. The surface pressure obtained by the area of the surface is below the safety limit of 0.2% of the service temperature.

According to the invention described in the sixth aspect of the invention, the surface pressure is equal to or less than 0.2% of the service temperature, whereby the deformation of the vicinity of the contact portion of the heating plate in contact with the support member can be more effectively suppressed. .

The invention described in claim 7 uses the following technical means of a heating device having the heating plate support described in claim 5 or 6. Set and the above heating plate.

According to the invention of the seventh aspect of the invention, since the deformation of the heating plate and the temperature difference can be suppressed, a heating device having a high flatness of the heating plate and uniform heating can be formed.

S‧‧‧ mounting surface

1‧‧‧heating device

2‧‧‧Heating plate support device

10‧‧‧Support components

11‧‧‧1st support board

11a‧‧‧ upper surface

11b‧‧‧ lower surface

11c‧‧‧Receiving Department

11d‧‧‧End

12‧‧‧Support framework

12a‧‧‧ Ontology

12b‧‧‧Protruding

13‧‧‧2nd support board

13a‧‧‧Upper surface

13b‧‧‧ lower surface

13c‧‧‧Receiving Department

20‧‧‧heating plate

20a‧‧‧ upper surface

30‧‧‧ board

30a‧‧‧ upper surface

30b‧‧‧Fixed Department

Fig. 1 is a cross-sectional explanatory view showing a structure of a supporting member, a heating plate supporting device and a heating device including the same according to the present invention.

Fig. 2 is an explanatory view showing the configuration of a supporting member. Fig. 2(A) is a cross-sectional explanatory view, and Fig. 2(B) is an A-A arrow view of Fig. 2(A).

Fig. 3 is an explanatory view showing a modified example of the arrangement of the support members. Fig. 3(A) is a cross-sectional explanatory view, and Fig. 3(B) is an A-A arrow view of Fig. 3(A).

4 is an explanatory view showing a modified example of the structure of the support member. In Fig. 4(A), the upper drawing is a cross-sectional explanatory view showing a configuration in which a plurality of first support plates and a support frame are alternately provided, and the lower view is an A-A arrow view of the above figure. Fig. 4(B) is a cross-sectional explanatory view showing a configuration in which the support frame is directly placed on the carrier.

Fig. 5 is a cross-sectional explanatory view showing a modified example of the structure of the support member.

The supporting member of the present invention, the heating plate supporting device including the same, and the heating device will be described with reference to the drawings.

As shown in Fig. 1, the heating device 1 includes a heating plate 20 that mounts the object to be heated as a heating surface upper surface 20a and heats it, and a support member 10 for supporting The carrier 30 and the heating plate 20 for suppressing deformation of the heating plate 20. Here, the carrier 30 and the support member 10 constitute a heating plate support device 2 that supports the heating plate 20. The heating device 1 is housed in a chamber or the like, and can also heat the object to be heated under environmental control.

The heating plate 20 is formed into a flat heater unit, and a sheath heater is embedded in a metal plate such as copper or aluminum to perform uniform surface heating. As the heating method, a method of recycling by a heat medium such as heated oil, a method of self-heating by electromagnetic induction, or the like may be employed.

The carrier 30 is a flat member for suppressing deformation such as creep deformation of the heating plate 20. For the carrier 30, the deflection caused by its own weight, external force, temperature difference, etc., must be small and must be thermally stable. Specifically, the carrier 30 is required to have a large Young's modulus, a light specific gravity, a small thermal expansion coefficient, and excellent creep resistance, and the carrier 30 is preferably made of a ceramic material. In the present embodiment, the alumina carrier plate 30 is used, and the material can be appropriately selected in consideration of the use temperature of the heater plate 20, the use environment, the material, and the like. For example, a ceramic material, particularly a ceramic material such as alumina, mullite, zirconia, tantalum nitride, tantalum carbide, or aluminum nitride, has a large Young's modulus and a light specific gravity. A material having a small coefficient of thermal expansion and excellent creep resistance. Further, a heat resistant alloy can also be used.

The support member 10 is provided at a plurality of portions of the carrier 30, and the mounting surface S is formed by the upper surface 11a of the first support plate 11, and the mounting surface S is placed and supported by the heating plate 20. Thereby, the carrier 30 can support the heating plate 20 in a state where it is separated from the heating plate 20 via a plurality of supporting members 10 at a plurality of locations. Thereby, in the heat transfer from the heating plate 20 toward the carrier 30, the radiation and the convection dominate, so that the contact between the heating plate 20 and the carrier 30 can be caused by the portion inside the heating plate. The temperature difference is reduced, and deformation can be suppressed more effectively.

The support member 10 is disposed on the carrier 30 such that the flatness of the upper surface 20a of the heating plate 20 is maintained at a predetermined accuracy. Here, from the viewpoint of improving the temperature distribution and maintaining the flatness of the upper surface 20a of the heater board 20, it is preferable to dispose the support members 10 as small as possible without a large offset. In the present embodiment, the four support members 10 are symmetrically arranged, but the present invention is not limited thereto.

In order to reduce the amount of heat released to the outside and suppress the temperature difference, the gap between the heating plate 20 and the carrier 30 is preferably set as small as possible. For example, when the gap between the two plates is set to be large, the amount of heat dissipation due to convection and radiation from the gap around the entire circumference of the two plates toward the periphery thereof increases, and the temperature of the entire side of the side is lowered, and the two plates are lowered. Both are prone to deformation caused by temperature distribution. Thereby, the smaller the gap, the more the deformation can be suppressed. Further, when it is necessary to set the gap to be large depending on the structure or assembly, a heat insulating material such as ceramic wool may be filled between the heating plate 20 and the carrier 30 to suppress heat dissipation from the gap toward the periphery.

FIG. 2 shows the configuration of the support member 10. The support member 10 is positioned and configured in such a manner that the upper surface 11a is on the upper surface of the self-supporting plate 30 at the fixing portion 30b formed at a predetermined position of the carrier 30 and having a through hole having a recess or a step. 30a is slightly protruding.

The support member 10 includes a first support plate 11 , a support frame 12 , and a second support plate 13 . The material constituting the support member 10 can be made of the same material as the carrier 30, and alumina is used in the present embodiment.

The first support plate 11 is formed in a disk shape, and the upper surface 11a serves as a mounting surface S on which the heating plate 20 is placed. A receiving portion 11c for positioning the support frame 12 is formed on the lower surface 11b.

In order to transfer heat from the heating plate 20 to the carrier 30 via the support member 10 It is preferable to reduce the area of the upper surface 11a of the first support plate 11, and to suppress deformation of the heating plate 20, for example, the first support plate 11 is embedded in the heating plate 20 softened by high temperature, and it is necessary to prevent surface pressure. Raise. For example, the surface pressure is determined by dividing the weight of the heating plate 20 by the total area of the mounting surface S by setting the pressure to be lower than the safety limit of 0.2% of the use temperature. . Thereby, the deformation of the heating plate 20 can be suppressed more effectively.

The upper surface 11a is finished to a surface roughness that does not hinder the movement of the heating plate 20 in the horizontal direction. Further, it is preferable that chamfering is performed on the end portion 11d of the upper surface 11a by corner rounding. Thereby, even when the heating plate 20 is relatively moved with respect to the first support plate 11, the excessive stress is not generated at the end portion of the upper surface 11a. Instead of corner rounding, chamfering can be performed by chamfering.

Here, as long as the upper surface 11a is a flat surface, the outer peripheral shape of the first support plate 11 may have a shape other than a disk shape, and may be an ellipse or a polygon.

The second support plate 13 is formed into a circular flat plate shape similarly to the first support plate 11, and the lower surface 13b is supported by the carrier plate 30. A receiving portion 13c for positioning the support frame 12 is formed on the upper surface 13a. In the present embodiment, the shape is the same as that of the first support plate 11. However, the shape of the first support plate 11 can be appropriately supported via the support frame 12. However, if the shape is large, the fixing portion 30b of the receiving plate 30 must be made large, and the strength of the receiving plate 30 may be lowered. Therefore, it is not preferable if the shape is too large. Here, it is preferable that the second support plate 13 is made of the same material as the carrier plate 30 so that the stress caused by the difference in thermal expansion does not occur between the second support plate 13 and the carrier plate 30.

The support frame 12 is a member interposed between the first support plate 11 and the second support plate 13 and is configured to suppress heat flowing from the heating plate 20 to the carrier plate 30 via the support member 10. Thermal resistance. In the present embodiment, the support frame 12 has projections 12b at both end portions of the cylindrical body 12a, and the projections 12b are fitted to the receiving portions 11c of the first support plate 11 and the second support plate 13 respectively. The portion 13c is positioned and disposed between the first support plate 11 and the second support plate 13.

The support frame 12 is formed such that the contact area between the support frame 12 and the horizontal surface of the first support plate 11 is smaller than the area of the upper surface 11a of the first support plate 11, that is, the mounting surface S. The support frame 12 functions as a large heat resistance for the heat flow transmitted from the heating plate 20 toward the first support plate 11 and toward the carrier plate 30, so that heat flowing from the heating plate 20 to the carrier plate 30 via the support member 10 can be reduced. . Thereby, the temperature difference and deformation caused by the portion in the heating plate 20 can be suppressed.

In the environment in which the heating device 1 is used, if the support frame 12 has sufficient structural strength as a member of the support member 10, it is preferable to form the support frame 12 in such a manner that the cross-sectional shape in the horizontal direction is as small as possible to increase Thermal resistance. Here, in the present embodiment, the cross-sectional shape of the support frame 12 is formed in a circular shape, but the shape is not limited thereto, and various shapes may be employed.

The support frame 12 is preferably positioned such that the receiving portion 11c of the first support plate 11 and the receiving portion 13c of the second support plate 13 are combined with each other, and the positioning method is not particularly limited. The support frame 12 may be formed in a cylindrical shape without the protruding portion 12b, and the receiving portion 11c and the receiving portion 13c may be formed in a shape matching the cylindrical shape. Moreover, as long as the first support plate 11 can be stably supported by the support frame 12, the receiving portion or the like is not necessarily provided.

In order to increase the thermal resistance, the number of the support frames 12 supporting one first support board 11 is preferably as small as possible, but in order to obtain a stable support state, it is preferable to use a plurality of support frames 12, as shown in FIG. Better to support with 3 support frameworks. Here, the area in which the plurality of support frames 12 and the first support plate 11 are in contact with each other on the horizontal surface is smaller than that of the first support plate 11 and The area in which the hot plate 20 contacts.

In order to further suppress heat conduction from the heating plate 20 toward the carrier 30, as shown in FIG. 4(A), the first support plate 11 and the support frame 12 may be alternately stacked in a plurality of layers. Here, the three support frames 12 of the first layer and the three support frames 12 of the second layer are connected at a point on the line connecting the center lines of the respective columns of the first support plate and the second support plate as a midpoint. Symmetrically configured.

Further, as shown in FIG. 4(B), the support frame 12 may be directly provided on the carrier 30 to support the first support plate 11.

As shown in FIG. 5, the support member 10 can be formed by the first support plate 11 and the second support plate 13 and the support frame 12 forming a ball seat. Thereby, when the heating plate 20 is placed on the support member 10, the core is automatically aligned by the ball seat, so that the heating plate 20 can be stably supported.

The first support plate 11 or the second support plate 13 and the support frame 12 may be integrally formed. Thereby, the number of parts of the support member 10 can be reduced, and labor saving can be achieved in the step of disposing the support member 10 on the carrier 30.

(Effects of the embodiment)

According to the support member 10 of the present invention, since the heating plate 20 is supported spaced apart from the carrier 30, the temperature difference caused by the portion inside the heating plate can be reduced as compared with the case where the heating plate 20 is directly in contact with the carrier 30. Small, and can effectively suppress deformation.

Since the heating plate 20 is surface-supported by the support plate 11, the support member 10 is not embedded in the heating plate 20, or the relative movement caused by the difference in thermal expansion between the carrier 30 and the heating plate 20 is not hindered, and the heating plate can be suppressed. 20 deformation and support.

Further, since the support member 10 can be made to have a large thermal resistance by the support frame 12, the amount of heat flowing from the heating plate 20 to the carrier 30 can be suppressed.

Thereby, the temperature difference and deformation caused by the portion in the heating plate 20 can be suppressed. Further, the hot plate supporting device 2 including the plurality of supporting members 10 and the carrier 30 is configured to appropriately arrange the plurality of supporting members 10 on the carrier 30, thereby configuring the heating plate supporting device capable of suppressing deformation of the heating plate 20. . Further, since the heating device 1 including the heating plate supporting device 2 and the heating plate 20 can suppress the deformation of the heating plate 20 and the temperature difference caused by the portion inside the heating plate, the flatness of the heating plate 20 can be formed and uniform Heating device for heating.

S‧‧‧ mounting surface

11‧‧‧1st support board

11a‧‧‧ upper surface

11b‧‧‧ lower surface

11c‧‧‧Receiving Department

11d‧‧‧End

12‧‧‧Support framework

12a‧‧‧ Ontology

12b‧‧‧Protruding

13‧‧‧2nd support board

13a‧‧‧Upper surface

13b‧‧‧ lower surface

13c‧‧‧Receiving Department

20‧‧‧heating plate

30‧‧‧ board

30a‧‧‧ upper surface

30b‧‧‧Fixed Department

Claims (7)

A support member for supporting a flat heating plate on which a heating object is placed is supported and separated from a flat plate that suppresses deformation of the heating plate, and is characterized in that: one or more support plates are formed, and the support member is formed as a flat plate shape smaller than the heating plate; and one or more support frames supporting the support plate; the support plate and the support frame are alternately laminated one or more layers; and the heating plate is placed on the uppermost plate and supported on the uppermost portion The upper surface of the support plate is such that the contact area between the support plate and the support frame is smaller than the area of the mounting surface. A support member according to claim 1, wherein the end portion of the upper surface of the uppermost support plate is chamfered. A support member according to claim 1 or 2, wherein the support plate is integrally formed with the support frame. A support member according to claim 1 or 2, wherein the support plate and the support frame constitute a ball seat. A heating plate supporting device comprising a plurality of supporting members and a supporting plate according to any one of claims 1 to 4, wherein the upper surface of the supporting plate at the uppermost portion of each supporting member is configured to mount the heating The mounting surface supported by the plate, the size of the mounting surface, and the arrangement of the support member in the carrier are configured to suppress deformation of the heating plate. The heating plate supporting device of claim 5, wherein the heating plate is made of a metal material, and the weight of the heating plate is divided by the area of the mounting surface. The surface pressure is below the safety limit of 0.2% of the service temperature. A heating device comprising: a heating plate supporting device according to claim 5 or 6 of the patent application; and the heating plate.