TW201351056A - Optical imaging arrangement with vibration decoupled support units - Google Patents

Abstract

There is provided an optical imaging arrangement comprising an optical projection system and a support structure system. The optical projection system comprises a group of optical elements configured to transfer, in an exposure process using exposure light along an exposure light path, an image of a pattern of a mask supported by a mask support structure onto a substrate supported by a substrate support structure. The mask support structure and the substrate support structure form a primary source of vibration. The support structure system comprises a base support structure, an optical element support structure and at least one secondary vibration source support structure of a secondary vibration source other than the primary source of vibration. The optical element support structure supports the optical elements. The at least one secondary vibration source support structure supports the secondary vibration source, the secondary vibration source being a source of a secondary vibration disturbance comprising structure borne vibration energy and the secondary vibration source being located internal to the optical imaging arrangement. The base support structure supports the optical element support structure and the secondary vibration source support structure in such a manner that a structural path of the structure borne vibration energy from the secondary vibration source to the optical element support structure only exists through the base support structure.

Description

Optical imaging configuration with vibration decoupling support unit

The present invention relates to optical imaging configurations for use in exposure processes, and more particularly to optical imaging configurations for lithography systems. The invention further relates to a method of supporting a component of an optical projection unit. The present invention can be used to fabricate microelectronic devices (especially semiconductor devices) in the context of photolithographic processes, or in the context of fabricating devices such as masks or reticles. Used during the process.

In general, an optical system used in the context of fabricating a microelectronic device, such as a semiconductor device, includes a plurality of optical element units disposed in the optical path of the optical system, including optical elements such as lenses and mirrors. These optical components typically cooperate in an exposure process to transfer an image of a pattern formed on a mask, reticle or the like onto a substrate such as a wafer. These optical elements are typically combined in one or more functionally distinct optical element groups. These distinct sets of optical elements can be held by distinct optical exposure units. Especially for systems that rely primarily on refraction, such optical exposure units are typically constructed with a stack of optical element modules that hold one or more optical components. These optical component modules typically comprise an outer substantially circular shape A support device that supports one or more optical element holders, each of which holds the optical element.

A group of optical elements comprising at least a refractive-based optical element, such as a lens, mostly have a straight common axis of symmetry of the optical elements, commonly referred to as the "optical axis." In addition, optical exposure units that hold such groups of optical elements typically have a narrow, substantially tubular design that, due to this design, is also commonly referred to as a "lens barrel."

As semiconductor devices continue to be miniaturized, there is always a need to enhance the resolution of the optical systems used to fabricate these semiconductor devices. This need for enhanced resolution significantly drives the need to increase the numerical aperture (NA) and increase the imaging accuracy of the optical system.

One way to enhance resolution is to reduce the wavelength of light used in the exposure process. In recent years, several methods have been developed to use light in the extreme ultraviolet (EUV) range, which uses wavelengths between 5 nm and 20 nm (typically about 13 nm). In this EUV range, it is no longer possible to use common refractive optics. This is due to the fact that in this EUV range, materials commonly used for refractive optical elements exhibit too high an absorbance to obtain high quality exposure results. Therefore, in the EUV range, a reflection system including a reflective member such as a mirror or the like is used in an exposure process to transfer an image of a pattern formed on the mask onto a substrate such as a wafer.

Switching to a high numerical aperture (eg, NA > 0.4 to 0.5) reflection system in the EUV range poses considerable challenges to the design of optical imaging configurations.

An important precision requirement is the positioning accuracy of the image on the substrate, which is also known as "line of sight (LoS) accuracy." The line of sight accuracy is generally approximately proportional to the reciprocal of the numerical aperture. Therefore, the line-of-sight accuracy of the optical imaging configuration with numerical aperture NA = 0.45 is optical imaging configuration with a numerical aperture NA = 0.33. The line of sight accuracy is 1.4 times smaller. In general, the numerical accuracy of the numerical aperture NA = 0.45 is below 0.5 nm. If double patterning is also considered in the exposure process, the accuracy must generally be reduced by a factor of 1.4. Therefore, in this case, the line of sight accuracy will be even lower than 0.3 nm.

Among other requirements, the above requirements place particularly stringent demands on the relative positioning of components involved in the exposure process. Furthermore, in order to reliably obtain a high quality semiconductor device, it is not only necessary to provide an optical system that exhibits high imaging accuracy, but also to maintain the accuracy of this height throughout the exposure process and during use of the system. As a result, optical imaging configuration components (ie, masks, optical components, and wafers) that cooperate, for example, in an exposure process, must be supported in a defined manner to likewise maintain between the optical imaging configuration components. Predetermined spatial relationship to provide a high quality exposure process.

To maintain a predetermined spatial relationship between the optical imaging configuration components throughout the exposure process, even in a ground structure via a support configuration and/or via internal sources of vibration disturbances (such as accelerated masses, such as Under the influence of the introduction of this optical imaging configuration caused by vibrations, moving components, turbulent fluid flow, etc., and under the influence of thermally induced position alteration, it is necessary to capture at least from time to time in the optical imaging configuration. The spatial relationship between the particular components, and the positioning of at least one component of the optical imaging configuration is adjusted based on the results of the capture process.

In the conventional system, the process of extracting the spatial relationship between the components collaborating in the exposure process is completed by using a metrology system using the optical projection system and the central support structure of the substrate system as a common reference, so as to be able to make The imaging configuration actively adjusts the motion synchronization of the part.

On the other hand, an increase in numerical aperture generally results in an increase in the size of the optical component used (also referred to as the "optical footprint" of the optical component). The increased optical coverage of the optical components used has a detrimental effect on its dynamic nature and the control system used to achieve the above adjustments. In addition, the increased optical footprint generally results in a larger ray incidence angle. However, at this increased incident angle of light, the transmissivity of the multilayer coating typically used to create the reflective surface of the optical component is substantially reduced, significantly resulting in undesirable optical power loss and optical components. The heating due to absorption increases. As a result, in order to achieve this imaging on a commercially acceptable scale, even larger optical components must be used. These conditions all result in a relatively large optical imaging configuration of the optical elements with an optical footprint of up to 1 m x 1 m and result in these optical elements being placed in close proximity to each other with a distance of less than 60 mm.

There are several problems due to this situation. First, regardless of the so-called aspect ratio of the optical component (ie, the ratio of thickness to diameter), larger optical components generally exhibit a lower resonant frequency. For example, a mirror having an optical coverage of 150 mm (diameter) and a thickness of 25 mm generally has a resonance frequency of 4000 Hz or more, and a mirror having an optical coverage of 700 mm is generally difficult to achieve a resonance frequency of 1500 Hz or more even at a thickness of 200 mm. In addition, the increase in the size and weight of the optical element also means an increase in the static deformation of the gravitational constant at different positions in the world, thereby impairing the imaging performance at the time of uncorrection.

In conventional support systems that support optical components with maximum stiffness (ie, the maximum resonant frequency of the support system), the lower resonant frequency of the optical components themselves will result in reduced adjustment control bandwidth and thus accurate positioning. Degree is reduced.

In addition, the larger optical elements that cause the object to shift the image more often result in a larger and less rigid support structure for the optical system. This less rigid support structure not only adjusts the control control performance Further restrictions are imposed, and residual errors are formed due to quasi-static deformation of the structure due to residual low frequency vibration disturbances. Therefore, the negative effects of vibration interference become even more pronounced.

Finally, the increased thermal load (due to light energy absorption) of the optical components used in such systems and the increased throughput require increased cooling effort, especially with higher flow rates. Cooling fluid. This increased cooling flow rate tends to result in increased vibrational interference into the system, which in turn leads to reduced line of sight accuracy.

Accordingly, it is an object of the present invention to overcome the above disadvantages at least to some extent and to provide good and long term reliable imaging properties of the optical imaging arrangements used in the exposure process.

Another object of the present invention is to reduce the amount of work required for an optical imaging configuration while maintaining at least the imaging accuracy of the optical imaging configuration used in the exposure process.

These objects are achieved in accordance with the present invention, which is based on the teachings of the following art: if abandoning the best efforts to achieve a common support for forming a central support structure (to achieve stable and accurate global positioning of the projection system and substrate system) and The metrology strategy, with the following modifications: the support of the optical components of the optical projection system and the internal secondary vibration interference sources that are not derived from the main vibration interference of the mask support and the substrate support (ie the components that cause vibration interference within the optical imaging configuration) The mechanical coupling is decoupled to reduce the overall effort required for the optical imaging configuration while maintaining at least the imaging accuracy of the optical imaging configuration.

It should be noted that in the sense of the present invention, components internal to the optical imaging configuration will define the components that participate in the optical imaging process performed by the optical imaging configuration. This participation can be direct (such as in the case of active components of an optical system or substrate system) or Indirect (such as the case of a fluid circulation system (such as a cooling system or an immersion system of an optical imaging configuration). In contrast, in the sense of the present invention, components external to the optical imaging configuration will define components that do not participate in the optical imaging process performed by the optical imaging configuration. Such external components include, inter alia, components of adjacent optical imaging configurations.

This can be accomplished by supporting the support structure of the optical projection system (ie, the support structure of the optical component) on the base structure and the support structure of such secondary vibration disturbance source, resulting in optical projection There is no immediate structural connection between the support structure of the system and the support structure of the secondary vibration interference source. Thus, the structurally generated vibration of such a secondary vibrational interference source detours in an advantageous manner via the base structure, thereby advantageously increasing the secondary vibrational interference that must travel to reach the structural path of the optical projection system The length, and thus advantageously, increases the attenuation of secondary vibrational disturbances.

Preferably, at least the support structure of the optical component is supported on the base structure via a vibration isolation device to reduce the introduction of vibrational interference energy in the support structure. Even more preferably, the support structure of the secondary vibration interference source is also supported by the base structure via a comparable vibration isolation device to reduce the amount of vibrational interference energy introduced into the base structure.

It will be appreciated that in the sense of the present invention, the optical element unit may consist solely of optical elements such as mirrors. However, such optical component units may also include other components, such as a bracket that holds such optical components.

Thus, in accordance with a first aspect of the present invention, there is provided an optical imaging configuration comprising an optical projection system and a support structure system. The optical projection system includes a group of optical elements configured to use an exposure light along an exposure light path in an exposure process to pattern a mask supported by the mask support structure The image is transferred to a substrate supported by the substrate support structure. The mask supporting structure and the substrate supporting structure form a main vibration source (primary source of vibration). The support structure system includes a base support structure, an optical component support structure, and at least one secondary vibration source support structure of a secondary vibration source of the non-primary vibration source. The optical component support structure supports the optical components. The at least one secondary vibration source support structure supports a secondary vibration source, the secondary vibration source comprising a secondary vibrational interference source of structure borne vibration energy, and the secondary vibration source is located in the optical imaging Configure internal. The base support structure supports the optical element support structure and the secondary vibration source support structure such that the structurally generated vibration energy from the secondary vibration source to the optical element support structure is only present through the base support structure.

According to a second aspect of the present invention, there is provided a method of supporting an optical projection system for an optical imaging system having a plurality of optical elements configured to use exposure light along an exposure light path during an exposure process, The image of the pattern of the mask supported by the mask support structure is transferred onto a substrate supported by the substrate support structure, the mask support structure and the substrate support structure forming a primary source of vibration. The method includes supporting an optical element on a base support structure via an optical element support structure, and supporting a secondary vibration source from a base support structure via a secondary vibration source support structure, the secondary vibration source comprising a secondary generation of vibration energy generated by the structure The source of vibrational interference and the secondary source of vibration are internal to the optical imaging configuration. The optical element support structure and the secondary vibration source support structure are supported such that structural energy generated by the structure from the secondary vibration source to the optical element support structure is only present through the base support structure.

According to a third aspect of the invention there is provided an optical imaging arrangement comprising an optical projection system and a support structure system. The optical projection system includes a plurality of optical components configured to use an exposure light along an exposure light path in an exposure process to transfer an image of a pattern of a mask supported by the mask support structure to a substrate supported by the substrate support structure on. The mask support structure and the substrate support structure Become the main source of vibration. The support structure system includes a base support structure, an optical component support structure, and at least one secondary vibration source support structure. The optical component support structure supports the optical components, and the at least one secondary vibration source support structure supports a primary vibration source, the secondary vibration source comprising a secondary vibrational interference source that generates vibration energy from the structure, and the secondary vibration The source location is inside the optical imaging configuration. The base support structure supports the optical component support structure and the secondary vibration source support structure such that the secondary vibration source support structure is mechanically decoupled from the optical component support structure via at least one vibration isolation device.

According to a fourth aspect of the present invention, there is provided a method of an optical projection system supporting an optical imaging system having a plurality of optical elements configured to use exposure light along an exposure light path during an exposure process, The image of the pattern of the mask supported by the mask support structure is transferred onto a substrate supported by the substrate support structure, the mask support structure and the substrate support structure forming a primary source of vibration. The method includes supporting an optical element on a base support structure via an optical element support structure, and supporting a secondary vibration source from a base support structure via a secondary vibration source support structure, the secondary vibration source comprising a secondary generation of vibration energy generated by the structure The source of vibrational interference and the secondary source of vibration are internal to the optical imaging configuration. The base support structure supports the optical component support structure and the secondary vibration source support structure such that the secondary vibration source support structure is mechanically decoupled from the optical component support structure via at least one vibration isolation device.

According to a fifth aspect of the invention there is provided an optical imaging arrangement comprising an optical projection system and a support structure system. The optical projection system includes a plurality of optical components configured to use an exposure light along an exposure light path in an exposure process to transfer an image of a pattern of a mask supported by the mask support structure to a substrate supported by the substrate support structure on. The support structure system includes a base support structure and an optical component support structure and a projection system metering support structure. The optical component The support structure supports the optical components that are supported on the base support structure via a first vibration isolation device. The projection system metering support structure supports at least one metering device associated with the group of optical element groups and configured to retrieve a variable representative of a state of at least one optical element of the group of optical elements ( Variable). The projection system metering support structure is supported on the optical element support structure via a second vibration isolation device.

According to a sixth aspect of the present invention, there is provided a method of an optical projection system supporting an optical imaging system having a population of optical elements configured to use exposure light along an exposure light path in an exposure process, The image of the pattern of the mask supported by the mask support structure is transferred to a substrate supported by the substrate support structure. The method includes supporting the optical elements on a base support structure via an optical element support structure, using a projection system metering support structure to support at least one metering device associated with the group of optical elements on the optical element support structure, and via a second A vibration isolation device supports the projection system metering support structure on the optical element support structure. The at least one metering device is configured to retrieve a variable representative of a state of at least one optical component of the group of optical components.

Further aspects and specific embodiments of the present invention will be apparent from the description of the appended claims. All combinations of the disclosed features are within the scope of the invention, whether or not explicitly recited in the scope of the claims.

101‧‧‧Optical imaging configuration

102‧‧‧Optical projection unit

102.1‧‧‧Projection Optics Box Structure (POB)

102.2‧‧‧ openings or recesses

103‧‧‧Mask unit

103.1‧‧‧ mask

103.2‧‧‧ masking table

103.3‧‧‧Mask table support device

104‧‧‧Substrate unit

104.1‧‧‧Substrate

104.2‧‧‧ substrate table

104.3‧‧‧Substrate table support device

105‧‧‧Irradiation system

105.1‧‧‧Main light/exposure light

106.1-106.6‧‧‧Optical component unit/mirror

106.7‧‧‧First optical component subgroup

106.8‧‧‧Second optical component subgroup

107‧‧‧Base structure

108.1-108.6‧‧‧Support device

109‧‧‧Control unit

110‧‧‧Measuring configuration

110.1‧‧‧Measuring unit

110.2-110.5‧‧‧Measuring device

110.6‧‧‧Reference components

112‧‧‧Projection system metering support structure

112.1‧‧‧Projection System Metering Support Structure

112.2‧‧‧Substrate system metering support structure

113‧‧‧First vibration isolation device

114‧‧‧Second vibration isolation device

115‧‧‧Internal cooling unit

115.1‧‧‧Internal cooling device support structure

115.2‧‧‧ openings or recesses

116‧‧‧dotted outline

117.1‧‧‧Vibration balance mass unit

117.2‧‧‧Connecting device

117.3‧‧‧dotted outline

118‧‧‧ Third vibration isolation device

201‧‧‧Optical imaging configuration

202.1‧‧‧Projection Optics Box Structure (POB)

202.3‧‧‧First projection optics box structure

202.4‧‧‧Second projection optics box structure

208.1-208.6‧‧‧Support device

219‧‧‧4th vibration isolation device

301‧‧‧ lithography equipment / optical imaging configuration

302.1‧‧‧Projection Optics Box Structure (POB)

302.3‧‧‧First projection optics box structure

302.4‧‧‧Second projection optics box structure

308.1-308.6‧‧‧Support device

312‧‧‧Projection system metering support structure

317.1‧‧‧Vibration Balanced Quality Unit

317.2‧‧‧Connecting device

1 is a schematic illustration of a preferred embodiment of an optical imaging configuration in accordance with the present invention with which a preferred embodiment of the method in accordance with the present invention can be performed.

2 is another schematic view of the optical imaging configuration of FIG. 1.

3 is a block diagram of a preferred embodiment of a method of supporting an optical projection system that can be performed with the optical imaging configuration of FIG. 1.

4 is a schematic illustration of another preferred embodiment of an optical imaging configuration in accordance with the present invention with which other preferred embodiments of the method in accordance with the present invention may be performed.

Figure 5 is a schematic illustration of another preferred embodiment of an optical imaging configuration in accordance with the present invention with which other preferred embodiments of the method in accordance with the present invention may be performed.

[First embodiment]

Hereinafter, a preferred first embodiment of an optical imaging configuration 101 in accordance with the present invention will be described with reference to Figures 1 through 3, with which a preferred embodiment of the method in accordance with the present invention may be performed. To help understand the following illustration, an xyz coordinate system is used in the figure, where the z direction represents the vertical direction (ie, the direction of gravity).

1 is a schematic diagram of an optical imaging configuration in the form of an optical exposure apparatus 101, which is not drawn to scale, and the optical exposure apparatus 101 operates in an EUV range of wavelengths of 13 nm. The optical exposure apparatus 101 includes an optical projection unit 102 adapted to transfer an image of a pattern formed on the mask 103.1 (on the mask stage 103.2 of the mask unit 103) to the substrate 104.1 (the substrate disposed on the substrate unit 104) On the platform 104.2). To this end, the optical exposure apparatus 101 includes an illumination system 105 that illuminates the reflective mask 103.1 via a suitable light guide system (not shown). Optical projection unit 102 receives light reflected from mask 103.1 (represented by its chief ray 105.1) and projects an image of the pattern formed on mask 103.1 onto substrate 104.1 (eg, wafer or the like).

To this end, the optical projection unit 102 holds the optical component unit 106.1 Optical element unit group 106 to 106.6. This optical element unit group 106 is held within the optical element support structure 102.1. The optical component support structure 102.1 can take the form of an outer casing structure of the optical projection unit 102, which is hereinafter also referred to as a "projection optics box structure (POB)" 102.1. However, it should be understood that this optical element support structure does not necessarily form a complete or even tight seal of the optical element unit group 106. Rather, it may also be formed locally as an open structure, as is the case with this example.

The projection optics box structure 102.1 is supported on the base structure 107 in a vibration isolated manner. The base structure 107 also supports the mask stage 103.2 via the mask stage support device 103.3 and the substrate stage 104.2 via the substrate stage support device 104.3. Since the mask stage 103.2, the mask stage support device 103.3, the substrate stage 104.2, and the substrate stage support device 104.3 form or contain a main source of vibration interference, in the sense of the present invention, the mask stage support device 103.3 and the substrate stage support device 104.3 Each of the main vibration source support structures that form a primary vibration source together.

It will be appreciated that the projection optics housing structure 102.1 can be supported in a cascaded manner via a plurality of vibration isolation devices and at least one intermediate support structure unit to achieve good vibration isolation. In general, these vibration isolation devices can have different isolation frequencies to achieve good vibration isolation in a wide frequency range, as explained in more detail below.

The optical element unit group 106 comprises a total of six optical element units, namely: a first optical element unit 106.1, a second optical element unit 106.2, a third optical element unit 106.3, a fourth optical element unit 106.4, and a fifth optical element unit 106.5. And a sixth optical element unit 106.6. In the present embodiment, each of the optical element units 106.1 to 106.6 is composed of an optical element in the form of a mirror. The sixth optical element 106.6 forms a first optical element sub-group 106.7, while the first to fifth optical elements 106.1 to 106.5 form a second optical element sub-group 106.8.

However, it should be understood that in other embodiments of the invention, the respective optical component unit (in addition to the optical component itself) may also include more components, such as an aperture stop, a holding optical component, and a final connection. A bracket or a retainer for the interface of the optical element unit and the support unit of the support structure.

Additionally, it should be appreciated that in other embodiments of the invention, another number of optical element units can be used. Preferably four to eight optical element units are provided.

Each of the mirrors 106.1 through 106.6 is supported by the associated support devices 108.1 through 108.6 on a support structure formed by the projection optics box structure 102.1. Each of the support devices 108.1 through 108.6 is formed as an active device such that each of the mirrors 106.1 through 106.6 is actively supported at a defined control bandwidth.

In the present example, optical element unit 106.6 is a larger and heavier component that forms the first optical element unit of optical element unit group 106, and other optical element units 106.1 through 106.5 form a plurality of optical element unit groups 106. Second optical element unit. Actively supporting the first optical element unit 106.6 at a lower first control bandwidth and actively supporting the second optical element unit 106.1 to 106.5 at a second control bandwidth to substantially maintain the second optical element unit 106.1 to 106.5 Each is given a given spatial relationship with respect to the first optical element unit 106.6.

In this example, a similar active support concept is selected for the mask station support device 103.3 and the substrate table support device 104.3, and the two support devices are actively supported at the third and fourth control bandwidths, respectively, to substantially maintain the cover. The mask table 103.2 and the substrate stage 104.2 are respectively in a given spatial relationship with respect to the first optical element unit 106.6. However, it should be understood that in other embodiments of the invention, another support concept may be selected for the mask station and/or the substrate table.

As will be explained in further detail below, the control unit 109 is based on The signal of metering configuration 110 controls the active support devices 108.1 through 108.6, 103.3, and 104.3. The components participating in the imaging process are subjected to adjustment control in the following manner.

To achieve active low frequency wide support, the first optical component unit 106.6, the first support device 108.6 of the first optical component unit 106.6 is configured and controlled for a first adjustment between 5 Hz and 100 Hz, preferably between 40 Hz and 100 Hz. Under control bandwidth, an adjustment of the first optical component unit 106.6 relative to one of the metering configurations 110 is provided.

In addition, in order to achieve active support, each of the second optical component units 106.1 to 106.5, the mask stage 103.2 and the substrate stage 104.2, and the second support devices 108.1 to 108.5 of the second optical element units 106.1 to 106.5 are respectively configured and controlled. And the mask support device 103.3 and the substrate support device 104.3 respectively provide corresponding correlations at the second, third, and fourth adjustment control bandwidths respectively ranging from 5 Hz to 400 Hz (preferably between 200 Hz and 300 Hz) Adjustment of the optical element units 106.1 to 106.5, the mask stage 103.2, and the substrate stage 104.2. It will be appreciated that in certain embodiments of the invention, the second control bandwidth may vary among the second support devices 108.1 through 108.5.

Compared with the conventional design, the specific embodiment follows a modified support strategy according to which the active support is relatively large in a low-frequency mode (the control of the optical component unit 106.6 can be easily achieved under this bandwidth) in a controlled manner. And a heavier first optical component unit 106.6 (which causes the most serious problem when achieving the high control bandwidth typically required in EUV lithography) while controlling other components involved in the exposure process, namely: the second optical component unit 106.1 to 106.5, the mask table 103.2 and the substrate stage 104.2 to maintain a sufficiently stable and precise spatial relationship with respect to the first optical element unit 106.6 and thus relative to each other.

Thus, although in this example, all components participating in the imaging process (ie, mirrors 106.1 to 106.6, mask 103.1, and substrate 104.1) are actively controlled, However, the need for a substantial relaxation of the adjustment control bandwidth of the first optical component unit 106.6 is more important than the cost increase of actively supporting individual components. In particular, compared to conventional systems in which an adjustment control bandwidth of 200 Hz to 300 Hz is generally considered and deemed necessary (due to the lower resonant frequency of larger optical footprint components, it is difficult for such components to reach this control bandwidth) The adjustment control of a larger optical footprint assembly such as the sixth mirror 106.6 (with an optical coverage of up to 1.5 m x 1.5 m and a mass of up to 350 kg) is greatly facilitated.

According to this support strategy, one of the components of the optical system (generally the larger and/or heavier of these components) is used as an inertial reference, and one or more other components (up to all other components) can refer to Inertial reference for measurement and final adjustment. In the present example, the sixth mirror 106.6 of the larger optical footprint is used as the inertial reference, and all other components 106.1 through 106.5, 103.1, and 104.1 participating in the imaging process are referenced to the inertial reference, as explained in further detail below. However, it should be understood that in other embodiments of the invention, any suitable component other than the optical component unit that was last hit by the exposure light may be used as this inertial reference, depending on the optical design.

The image of the pattern formed by the mask 103.1 is typically reduced in size before being transferred to several target areas of the substrate 104.1. Depending on the design of the optical exposure apparatus 101, the image of the pattern formed on the mask 103.1 can be transferred to the corresponding target area on the substrate 104.1 in two different ways. If the optical exposure apparatus 101 is designed as a so-called wafer stepper apparatus, the entire pattern image is transferred to the corresponding target area on the substrate 104.1 in a single step by irradiating the entire pattern formed on the mask 103.1. If the optical exposure device 101 is designed as a so-called step-scan device, the pattern formed on the mask 103.1 and thus the mask 103.1 is scanned progressively under the projection beam, and the substrate table 104.2 and thus the substrate 104.1 are simultaneously implemented. Corresponding to the scanning movement, the pattern image is transferred to the corresponding target area on the substrate 104.1.

In both cases, in order to achieve high quality imaging results, the components involved in the exposure process must be placed (ie, between the optical elements of the optical element unit group 106 (ie, the mirrors 106.1 to 106.6) relative to each other). And maintaining a predetermined limit with respect to the mask 103.1 and a given spatial relationship with respect to the substrate 104.1.

During operation of the optical exposure apparatus 101, the relative positioning of the mirrors 106.1 to 106.6 with respect to each other and with respect to the mask 103.1 and the substrate 104.1 is susceptible to changes due to intrinsic and extrinsic disturbances introduced into the system. . Such interference may be mechanical interference caused by forces introduced within the system itself and also via the system (e.g., the base support structure 107, which itself is supported on the ground structure 111), such as in the form of vibration. Such interference can also be thermally induced interference, such as a change in positioning due to thermal expansion of system components.

In order to maintain the above predetermined limits of the mirrors 106.1 to 106.6 with respect to each other and with respect to the spatial relationship of the mask 103.1 and the substrate 104.1, each of the mirrors 106.1 to 106.6 is actively positioned in space via its support devices 108.1 to 108.6, respectively. Similarly, the mask table 103.2 and the substrate table 104.2 are actively positioned in space via respective support devices 103.3 and 104.3, respectively.

Hereinafter, the control concept of the spatial adjustment of the components 106.1 to 106.6, 103.1, and 104.1 participating in the imaging process will be described with reference to FIGS. 1 and 2. As mentioned above, each of the support devices 108.1 to 108.6, 103.3 and 104.3 is provided to the support devices 108.1 to 108.6, 103.3 and 104.3 using the connected control unit 109 and the specific adjustment control bandwidth described above (in Figure 1 as the control unit) 109 and the solid and dashed lines at the respective support devices) control the adjustment of components 106.1 through 106.6, 103.1 and 104.1 with all six degrees of freedom.

Control unit 109 retrieves each of components 106.1 through 106.6, 103.1, and 104.1 in accordance with all six degrees of freedom (indicated by dashed lines in Figures 1 and 2) The metering signal of the positioning and orientation metering configuration 110 produces its control signal. As mentioned above, the metering arrangement 110 uses the sixth mirror 106.6 of the larger optical footprint as the inertial reference (ie, as the reference optical element unit), and all other components 106.1 through 106.5, 103.1, and 104.1 participating in the imaging process refer to this. Inertial reference. As can be seen from Fig. 1, when the pattern image formed on the mask 103.1 is transferred onto the substrate 104.1, the sixth mirror 106.6 in the light path is the final mirror unit that is finally hit by the exposure light 105.1.

For this purpose, the metering arrangement uses: a metering unit 110.1 comprising a plurality of metering devices 110.2, 110.3 and 110.4 mechanically connected to the projection system metering support structure 112.1 (which in turn is supported by the projection optics box structure 102.1); A metering device 110.5 mechanically coupled to the substrate system metering support structure 112.2 is shown in Figure 1 (highly schematic) and in Figure 2. In the present embodiment, each metering device 110.2, 110.3, 110.4, and 110.5 includes a sensing head that is coupled to the projection system metering support structure 112.1 or the substrate system metering support structure 112.2, respectively, and is mechanically coupled directly to The reference elements 110.6, the mask stage support device 103.3, the substrate system metering support structure 112.2, and the substrate stage support device 104.3 of the respective mirrors 106.1 to 106.6 cooperate.

The term "directly connected mechanically" in the sense of the invention shall be taken to mean a direct connection between two parts, including (if any) a short distance between the parts, thereby allowing one part to be measured by Positioning reliably determines the positioning of another part. In particular, this term means other parts that are not involved in positioning decisions such as introducing uncertainty due to thermal or vibrational effects. It should be understood that in a particular embodiment of the invention, the reference element is not necessarily a separate component that is coupled to the mirror, but may be formed directly or integrally on the surface of the mirror, such as after fabrication of the mirror as a separate process. A grating or the like is formed.

In this embodiment, the metering device 110.2, 110.3, 110.4 And 110.5 operates according to an encoder principle, that is, the sensing head emits a sensing beam toward the structured surface and then detects the reading beam reflected from the structured surface of the reference element. The structured surface may for example be a grating comprising a series of parallel lines (one-dimensional gratings) or grids (two-dimensional gratings) of mutually oblique lines. The change in position is basically captured from the line through which the sensing beam is passed, which can be derived from the signal achieved via the reading beam.

However, it should be understood that in other embodiments of the invention, in addition to the encoder principle, any other type of contactless measurement principle (such as interferometric measurement principle, capacitance) may be used alone or in any combination. Measurement principle, induction measurement principle, etc.). However, it should also be appreciated that any other contact metering configuration may be utilized in other embodiments of the invention. As the contact working principle, for example, a magnetostrictive or electrostrictive working principle or the like can be used. In particular, the principle of operation can be chosen according to the accuracy requirements.

The metering device 110.2 associated with the sixth mirror 106.6 (in all six degrees of freedom) captures a first spatial relationship between the projection system metering support structure 112.1 and the sixth mirror 106.6 forming the inertial reference. In addition, metering devices 110.2, 110.3, 110.4, and 110.5 associated with other components 106.1 through 106.5, 103.1, and 104.1 participating in the imaging process (in all six degrees of freedom) are captured in the projection system metering support structure 112.1 and associated components 106.1 Individual second spatial relationship to 106.5, 103.1, and 104.1.

In the case of the substrate 104.1, this uses a metering device 110.4 mechanically connected to the projection system metering support structure 112.1 in a series connection (see Fig. 2) (in combination with a reference element mechanically connected directly to the substrate system metering support structure 112.2) 110.6) and a substrate system metering device 110.5 mechanically coupled to the substrate system metering support structure 112.2 (in combination with a mechanically directly attached to the substrate table support device 104.3) Reference element 110.6) is done.

Finally, the metering arrangement 110 uses the first spatial relationship and the second spatial relationship to determine the spatial relationship between the sixth mirror 106.6 and the corresponding other components 106.1 through 106.5, 103.1, and 104.1. The corresponding metering signals are then provided to the control unit 109, which in turn generates corresponding control signals for the respective support devices 108.1 to 108.6, 103.3 and 104.3 based on these metering signals.

It should be understood that in other embodiments of the present invention, any one of the reference optical component (eg, the sixth mirror) and the corresponding other components participating in the imaging process may be directly measured (eg, mirrors 106.1 to 106.5, masking) The spatial relationship between the cover 103.1 and the substrate 104.1). Any combination of this direct and indirect measurement can also be used depending on the spatial boundary condition.

In the particular embodiment shown, the control unit 109 generates a sixth mirror 106.6 (in the sense of the invention, ie the first optics), based on a metering signal representative of the first spatial relationship between the metering structure and the sixth mirror 106.6 Corresponding control signal of the first supporting device 108.6 of the component unit) to measure the supporting structure with respect to the projection system of the measuring unit 110.1 under the first adjustment control bandwidth (between 5 Hz and 100 Hz, preferably between 40 Hz and 100 Hz) 112.1, adjusting the sixth mirror 106.6.

This low frequency wide control of the critical first optical element unit 106.6 provides a low bandwidth drift control of the first optical element unit 106.6 relative to the metering structure of the metering unit 110.1. In other words, it allows the first optical element unit 106.6 to follow the corresponding low frequency motion of the metering structure of the metering unit 110.1, which takes the spatial relationship between the first optical element unit 106.6 and the projection system metering support structure 112.1 of the metering unit 110.1 (corresponding) Low-frequency motion). In this way, the excessive relative transport between the first optical component unit 106.6 and the projection system metering support structure 112.1 of the metering unit 110.1 beyond the sampling unit of the metering unit 110.1 can be avoided in a highly advantageous manner. Move, or in other words, avoid sensor range issues.

It will be appreciated that the spatial relationship between substrate stage 104.2 and substrate 104.1 is known, for example, due to measurement operations directly prior to the exposure process. The same principle can be applied to the spatial relationship between the mask table 103.2 and the mask 103.1. Accordingly, the respective reference elements 110.6 that are respectively coupled to the mask stage 103.2 and the substrate stage 104.2 also allow for the spatial relationship between the reference mirror 106.6 and the mask 103.1 and the substrate 104.1, respectively.

As a result, while it is generally necessary to actively control all components participating in the exposure process, the control bandwidth requirements of the most critical first optical component unit 106.6 can be substantially relaxed in a highly advantageous manner. The value of this positive effect is generally more important than the cost of actively supporting all components.

Therefore, for example, compared with a conventional optical system unit that generally uses an adjustment control bandwidth of 200 Hz to 300 Hz and this adjustment control bandwidth is considered necessary, in the present invention, the critical first optical element unit 106.6 can be used significantly. a lower adjustment control bandwidth, such as between 5 Hz and 100 Hz, preferably between 40 Hz and 100 Hz, while participating in all other components of the imaging process (ie, optical component units 106.1 to 106.5, mask unit 103.1, and substrate) Unit 104.1) can then be controlled with the desired higher adjustment control bandwidth (e.g., 200 Hz to 400 Hz) to provide proper alignment with respect to the inertial reference formed by first optical element unit 106.6.

It should be further understood that the above (indirect) measurement concept has the following advantages: the instantaneous rigid body positioning and orientation of the projection system of the metering unit 110.1, especially the vibration interference introduced into the metering structure of the metering unit 110.1, is basically irrelevant, as long as The projection system metering support structure 112.1 is sufficiently rigid to substantially avoid dynamic deformation of the metering structure. In particular, the amount of work required to stabilize the positioning and/or orientation of the metering support structure in space in the projection system must be reduced. However, usually, As in the present embodiment, the projection system metering support structure itself can still be supported by the projection optics box structure 102.1 in a vibration isolation manner.

As described above, in order to reduce the amount of vibrational interference energy introduced into the projection optics housing structure 102.1 (and thus into the projection system), and ultimately to reduce the adverse effects of this vibrational interference energy, in accordance with the present invention, a support concept is provided in which projection The optics box structure 102.1 is supported on the base support structure 107 via the first vibration isolation device 113, while the substrate system metering support structure 112.2 is supported on the base support structure 107 via the second vibration isolation device 114.

By thereby supporting the projection optics box structure 102.1 and the substrate system metering support structure 112.2 separately, the optical elements 106.1 to 106.6 are mechanically and the substrate system metering support structure 112.2 secondary internal sources of vibration interference (such as cooling circuits, not shown in more detail) Supported decoupling of secondary vibrational interference and secondary vibrational interference energy due to turbulent flow on the cooling medium, respectively.

This mechanical decoupling is achieved by supporting both the projection optics box structure 102.1 and the substrate system metering support structure 112.2 via the vibration isolation devices 113 and 114, respectively, resulting in between the projection optics box structure 102.1 and the substrate system metering support structure 112.2. There are no immediate structural connections. In other words, the projection optics box structure 102.1 and the substrate system metering support structure 112.2 are supported in such a manner that the structurally generated vibrational energy from the substrate system metering support structure 112.2 to the projection optics box structure 102.1 is only transmitted through the base support structure 107. presence.

Thus, on the one hand, the secondary vibration energy is generated in an advantageous manner around the structure via the base support structure 107, thereby advantageously increasing the length of the structural path that the secondary vibration interference must travel to reach the optical projection system, and thus advantageously increase Attenuation of secondary vibration disturbances.

On the other hand, the vibration isolating device 114 additionally reduces the structure in the introduction base support structure 107 to generate secondary vibration interference energy, while the vibration isolation device 113 even reduces the amount of vibrational interference energy generated by the structure of the substrate system metering support structure 112.2 (otherwise introduced into the projection optics box structure 102.1 from the base support structure 107).

It should be appreciated that, preferably, a similar approach is selected to support the primary source of vibration interference (such as substrate table support device 104.3) and the support mask support device 103.3, and the mask support device 103.3 is also via the corresponding vibration isolation device (not shown in more detail) Supported on the base support structure 107.

As can be seen from Figure 2, a similar support strategy is also selected for the internal cooling device 115 of the optical projection unit 102 (which in the sense of the present invention also forms an internal secondary vibrational interference source). The internal cooling device 115 is a sleeve that surrounds the optical elements 106.1 to 106.6. The internal cooling device 115 is designed to be in physical contact with the optical elements 106.1 through 106.6, its associated support devices 108.1 through 108.6, and the projection optics housing structure 102.1. The internal cooling device 115 has immediate physical or structural contact with the base structure 107 via only the internal cooling device support structure 115.1. It will be appreciated that the internal cooling device support structure 115.1 can also be supported on the base support structure 107 via another vibration isolation device (not shown in more detail).

As can be seen from Figure 2, to avoid this immediate physical or structural contact, the internal cooling device 115 has a corresponding opening or recess 115.2, and the support devices 108.1 through 108.6 can each extend through the corresponding opening or recess 115.2 without contacting the internal cooling. Device 115. In addition, the internal cooling device support structure 115.1 extends through the corresponding opening or recess 102.2 provided within the projection optics housing structure 102.1 without physically contacting the projection optics housing structure 102.1.

It should be appreciated that one or more other cooling devices, particularly external cooling devices surrounding the projection optics housing structure 102.1, may be provided and supported on the base support structure 107 in a manner similar to the internal cooling device 115 (ie, with the optical component 106.1) Up to 106.6, its associated support devices 108.1 to 108.6 and projection optics The box structure 102.1 has no immediate physical or structural contact) as shown by the dashed outline 116 in FIG.

The first vibration isolating device 113 has a first vibration isolation resonant frequency of about 0.5 Hz, whereby advantageous low pass vibration isolation is achieved at this location. It should be understood that in other preferred embodiments of the present invention, the first vibration isolation resonant frequency may be selected to be in the range of 0.05 Hz to 8.0 Hz, in the range of 0.1 Hz to 1.0 Hz, or in the range of 0.2 Hz to 0.6 Hz. in. In either of these cases, advantageous low pass vibration isolation is achieved.

In the present example, the same principle can be applied to the second vibration isolation resonant frequency of the second vibration isolating device 114, which is also about 0.5 Hz. Here as well, the second vibration isolation resonance frequency can be selected to be in the range of 0.05 Hz to 8.0 Hz, in the range of 0.2 Hz to 1.0 Hz, or in the range of 0.2 Hz to 0.6 Hz. In either of these cases, advantageous low pass vibration isolation is achieved.

In order to further improve the vibration behavior of the projection optics box structure 102.1, each of the support devices 108.1 to 108.5 of the second optical element subgroup 106.8 comprises a vibration balance mass unit connected to the projection optics box structure 102.1 via a connection device 117.2 ( Vibration balancing mass unit) 117.1.

Preferably, each of the vibration balancing mass units 117.1 and its connecting means 117.2 are associated with actuator means (actuator means for supporting means 108.1 to 108.5, respectively) for actuating the optical elements 106.1 to 106.5, respectively, and The state provides an at least partial reaction force that counteracts the actuator forces that respectively actuate the optical elements 106.1 through 106.5. In other words, the vibration balance mass unit 117.1 forms an actuator reaction force canceling unit.

The vibration balance system formed by the vibration balance mass unit 117.1 and the connection device 117.2 is due to the vibration behavior of the vibration balance system and the projection optics box The modification of the vibrational behavior on the structure 102.1 advantageously provides an advantageous vibration balance resulting in an overall reduction in the amplitude seen at the level of the optical elements 106.1 to 106.6.

In the present embodiment, the vibration balance mass unit 117.1 and the connection device 117.2 define a balancing resonant frequency of about 25 Hz. However, it should be understood that in other embodiments of the present invention, depending on the vibration behavior of the projection optics housing structure, a balanced resonant frequency range of 1 Hz to 40 Hz, a range of 5 Hz to 40 Hz, or a range of 15 Hz to 25 Hz may be selected. Balance the resonant frequency.

In this particular embodiment, no such vibration balancing mass unit is associated with the first optical element 106.6. However, in other embodiments of the invention, the following configuration may also be employed: this vibration balancing mass unit is associated with the first optical element 106.6 as shown by the dashed outline 117.3 in FIG.

Moreover, in the present embodiment, the respective vibration balance mass unit 117.1 includes a plurality of balance mass elements held by the attachment means 117.2, such that it is kinematically in series disposed in the projection optics housing structure 102.2 and associated The optical elements are connected between 106.1 and 106.5.

Preferably, the number of balanced mass elements is selected in accordance with the vibration behavior of the support structure of the respective optical component. In the present example, six balanced mass elements distributed around the periphery of respective optical elements 106.1 through 106.5 are provided. It will be appreciated that in other embodiments of the invention, any suitable number of balanced mass elements may be provided.

However, it should be understood that in other embodiments of the invention, a single balanced mass element per optical component is sufficient. Furthermore, not all optical elements, especially all of the optical elements of the second subgroup 106.8, must have such a vibration balanced mass unit, depending on the vibrational behavior of the support structure of the optical element.

In this example, to provide a beneficial effect on the vibration behavior of the projection optics housing structure 102.1, each connection device 117.2 is configured to be at approximately 1% of the Damping of the vibration of the associated vibration balance mass unit 117.1 is provided at a damping ration. It will be appreciated that another first damping ratio may be selected depending on the vibration behavior of the support structure of the optical element. Preferably, the first damping ratio is selected from the range of 0.2% to 15%, 0.2% to 5%, and 1.0% to 3.0%.

As can also be seen from FIG. 2, the projection system metering support structure 112.1 is supported on the projection optics housing structure 102.1 (and thus on the base support structure 107) via a third vibration isolation device 118. The third vibration isolation device 118 has a third vibration isolation resonant frequency of about 3 Hz.

It should be understood that in other preferred embodiments of the present invention, the third vibration isolation resonant frequency may also be selected to be in the resonant frequency range of 1 Hz to 30 Hz, the range of 2 Hz to 10 Hz, or the range of 3 Hz to 8 Hz. In particular, the appropriate third vibration isolation resonant frequency can be selected in accordance with the vibration behavior of the projection system metering support structure 112.1.

In the present example, the third vibration-isolated resonant frequency and the balanced resonant frequency can be tuned to each other with each other separated by a frequency gap. This proper wide frequency slot is useful for avoiding interference effects and instability of the final vibrating system.

It will be appreciated that the frequency gap width is selected in accordance with the vibration behavior of at least one of the projection optics box structure 102.1, the optical elements 106.1 to 106.6, the balance mass unit 117.1, the connection device 117.2, and the projection system metering support structure 112.1. Preferably, the frequency slot is selected from the range of 1 Hz to 40 Hz, the range of 10 Hz to 25 Hz, or the range of 100% to 400% of the third vibration isolation resonance frequency.

Moreover, in the present example, to provide a beneficial effect on the vibration behavior of the projection system metering support structure 112.1, the third vibration isolation device 118 is configured to provide a projection system metering support structure 112.1 at a second damping ratio of about 20%. Vibration Dynamic damping.

It will be appreciated that another second damping ratio may be selected depending on the vibration behavior of the projection system metering support structure 112.1. Preferably, the second damping ratio is selected from the range of 5% to 60%, 10% to 30%, and 20% to 25%.

In addition, it should be appreciated that this two-stage vibration isolation support (via vibration isolation devices 118 and 113) of the support structure 112.1 by the projection system on the base structure 107 achieves support with primary sources of vibration interference (such as substrate table support device 104.3). At least two stages of vibration isolation, and in many cases even three stages, of the support of the mask station support device 103.3 and the secondary sources of vibration interference, such as the substrate system metering support structure 112.2 and the optical cooling unit 115 of the optical projection unit 102 Vibration isolation.

In other words, on the one hand, the primary and secondary vibrational interference energy generated by the structure is advantageously bypassed via the base support structure 107 and the projection optics box structure 102.1 before reaching, if any, the projection system metering support structure 112.1, Thereby advantageously increasing the length of the structural path that the primary and secondary vibration disturbances must travel to reach the projection system metering support structure 112.1, and thus advantageously increase the attenuation of primary and secondary vibration disturbances.

This ultimately results in a particularly high vibration stability of the projection system metering support structure 112.1, thus contributing to the control efficiency of the system.

It should be understood that any desired and suitable material may be selected for the corresponding support structure. For example, for a corresponding support structure, particularly a support structure that requires a lower weight and a higher rigidity, a metal such as aluminum can be used. It will be appreciated that the material supporting the structure is selected, preferably depending on the type or function of the support structure.

In particular, for the projection optics housing structure 102.1, it is preferred to use steel, aluminum (Al), titanium (Ti), so-called iron-nickel alloy (Invar-alloy) (ie Ni accounted for There are 33% to 36% iron-nickel alloys such as Fe64Ni36) and suitable tungsten alloys (such as DENSIMET® and INERMET® composites, ie heavy metals with a tungsten content greater than 90% and NiFe or NiCu adhesives).

In addition, for the projection system metering support structure 112.1, the following materials may also be advantageously used, such as: silicon infiltrated silicon carbide (SiSiC), tantalum carbide (SiC), germanium (Si), carbon fiber reinforcement Tantalum carbide (C/CSiC), alumina (Al2O3), Zerodur® (lithium aluminosilicate glass-ceramic), ULE® glass (titania silicate glass), quartz , Cordierite (magnesium iron aluminium cyclosilicate) or another ceramic material having a low coefficient of thermal expansion and a high modulus of elasticity.

In the present example, the projection optics box structure 102.1 is made of steel as a first material having a first stiffness. In this way, the weight is increased by a factor of three compared to a conventional support structure, for example made of aluminum, which is generally undesirable in conventional systems. However, due to the non-custom support strategy in accordance with the present invention, the weight increase of the projection optics housing structure 102.1 is advantageous in terms of vibration behavior.

Furthermore, the projection metering support structure 112.1 is made of a second material having a second stiffness that is higher than the first stiffness of the steel material of the projection optics box structure 102.1. As already described above, this high rigidity of the projection metrology support structure 112.1 is advantageous.

It will be appreciated that with the lithography apparatus 101 of the present embodiment, line of sight accuracy at 100 pm or less in all relevant degrees of freedom (typically in the x and y directions) can be obtained. As a general illustration, it can be noted that the lower third resonant frequency of the third vibration isolating device 118 provides better line of sight accuracy.

In the optical imaging device 101 of Figures 1 and 2, a preferred embodiment of a method of supporting an assembly of an optical projection unit in accordance with the present invention and The method of taking the image of the transfer pattern onto the substrate by taking the spatial relationship between the optical element unit and the reference unit will be described below with reference to FIGS. 1 to 3.

In the transfer step of this method, the image of the pattern formed on the mask 103.1 is transferred onto the substrate 104.1 using the optical projection unit 102 of the optical imaging arrangement 101.

To this end, in the step 119.3 of the transfer step, the spatial relationship between the components 106.1 to 106.6, 103.1 and 104.1 participating in the imaging process is extracted using a method of extracting the spatial relationship between the optical element unit and the reference unit. , as already described above.

In the control step 119.4 of the transfer step, the positioning of the substrate stage 104.2, the mask stage 103.2 and the other mirrors 106.1 to 106.5 with respect to the sixth mirror 106.6 is controlled according to the spatial relationship previously extracted in the step 119.3. Or orientation and positioning and/or orientation of the sixth mirror 106.6 relative to the metering structure of the metering unit 110.1, as already described above. In the exposure step, immediately after or after the control step 119.4, the control step 119.4 is overlaid, and then the image of the pattern formed on the mask 103.1 is exposed on the substrate 104.1 using the optical imaging arrangement 1.

In a partial step of the control step 119.4, the previously provided mask unit 103 having the mask 103.1 and the substrate unit 104 having the substrate 104.1 are adjusted in space. It should be understood that the mask 103.1 and the substrate 104.1 may be inserted into the mask unit 103 and the substrate unit 104 at a later time point before the actual positioning capture or even at a later time point before the exposure step.

In accordance with a preferred embodiment of the method of supporting an assembly of optical projection units in accordance with the present invention, at step 119.1, components of optical projection unit 102 are first provided, and then at step 119.2, the components are supported, as already described above. To this end, in this step 119.2, the mirror 106.1 of the optical projection unit 102 is supported and positioned within the projection optics box structure 102.1 of the optical projection unit 102 to 106.6. In step 119.4, the mirrors 106.1 through 106.6 are then actively supported in the projection optics box structure 102.1 at the respective control bandwidths to provide the configuration as explained above in the background of Figures 1 and 2.

At step 119.3, a metering configuration 110 (previously provided in the configuration as described above in the background of Figures 1 and 2) is used. It will be appreciated that the reference elements may be provided at an earlier point in time along with the respective mirrors 106.1 to 106.6 on which the reference elements are disposed. However, in other embodiments of the invention, the reference element may be provided with other components of the metering configuration 110 at a later point in time prior to actual positioning.

In the capture step 119.3, the actual spatial relationship between the sixth mirror 106.6 and the substrate table 104.2, the mask table 103.2, and the other mirrors 106.1 through 106.5, which are the central inertial reference of the optical imaging configuration 101, is taken, as already described above. .

It should be understood that the actual spatial relationship between the sixth mirror 106.6 and the substrate stage 104.2, the mask stage 103.2 and the other mirrors 106.1 to 106.5 and the sixth mirror 106.6 relative to the metering unit 110.1 can be continuously captured throughout the exposure process. The actual spatial relationship of the metering structure. In control step 119.4, the latest results of the continuous retrieval process are then retrieved and used.

As described above, in the control step 119.4, the spatial relationship is extracted according to the exposure step previously exposed on the substrate 104.1 on the image formed on the mask 103.1 to control the substrate stage 104.2, the mask stage 103.2, and Positioning of mirrors 106.1 to 106.6.

[Second embodiment]

Hereinafter, a preferred second embodiment of an optical imaging configuration 201 in accordance with the present invention will be described with reference to FIG. 4, which may be performed in accordance with the optical imaging configuration Preferred embodiments of the method of the invention. The optical imaging configuration 201 generally corresponds in its basic design and functionality to the optical imaging configuration 101 such that the differences and differences herein. In particular, the same components have been given the same reference numerals, and similar components are given the same reference numerals with the value of 100. Unless explicitly stated otherwise below, the explanations set forth above in the context of the first specific embodiment of these components are explicitly referred to.

The main difference between the optical imaging configuration 201 and the optical imaging configuration 101 is that the design of the projection optics box structure 202.1 is different. It should be appreciated that the projection optics housing structure 202.1 can replace the projection optics housing structure 102.1 in the optical imaging configuration 101.

In the illustrated embodiment, the projection optics housing structure 202.1 has a two-part design formed by a first projection optics housing structure 202.3 that supports the second projection optics housing structure 202.4, and a projection system Metering support structure 112.1. The second projection optics box structure 202.4 is connected to the support devices 208.1 to 208.6 of the optical elements 106.1 to 106.6. Thus, the second projection optics housing structure 202.4 supports the optical components 106.1 through 106.6.

The second projection optics housing structure 202.4 is supported on the first projection optics housing structure 202.3 via a fourth vibration isolation device 219 having a fourth vibration isolation resonant frequency in the vibration isolation resonant frequency range of 20 Hz to 30 Hz. It should be appreciated that in other embodiments of the invention, the fourth vibration isolation resonant frequency may be selected from the range of 1 Hz to 30 Hz, the range of 1 Hz to 8 Hz, the range of 1 Hz to 40 Hz, or the range of 25 Hz to 30 Hz.

In addition, it should be appreciated that this two-stage vibration isolation support (via vibration isolation devices 219 and 113) by the second projection optics housing structure 202.4 on the base structure 107 achieves a source of primary vibration interference (such as substrate table support device 104.3). Support and support for the mask support device 103.3) and secondary sources of vibration interference (such as At least two-stage vibration isolation of the panel system metering support structure 112.2 and the internal cooling device 115 of the optical projection unit 102, in many cases even three-stage vibration isolation.

In other words, the primary and secondary vibrational interference energy generated by the structure bypasses the base projection optic structure 202.3 in an advantageous manner prior to reaching, if any, the second projection optics housing structure 202.4. Thereby, the length of the structural path that the primary and secondary vibration disturbances must travel to reach the second projection optics box structure 202.4 is advantageously increased, and thus the attenuation of the primary and secondary vibrational disturbances is advantageously increased.

This ultimately results in a particularly high vibration stability of the second projection optics box structure 202.4 (and thus the optical elements 106.1 to 106.6), which is also highly advantageous for the controllability of the system.

As for the other vibration isolating devices 113, 114 and 118, these are the same as the first embodiment. Accordingly, the explanations provided above in the context of the first embodiment are equally applicable here.

Another difference between this example and the first embodiment is that the support means 208.1 to 208.5 of the second optical element subgroup 106.8 do not have a vibration balance mass unit. However, as shown in the corresponding dashed outline in Figure 4, any desired number of vibration balanced mass units can be provided for any desired element of optical elements 106.1 through 106.6.

It will be appreciated that with the lithography apparatus 201 of the present embodiment, line of sight accuracy at 100 pm or less in all relevant degrees of freedom (typically in the x and y directions) can be obtained. As a general description, it should be noted that here again, the lower third resonant frequency of the third vibration isolating device 118 provides improved line of sight accuracy.

It should be understood that, as such, any desired and suitable materials may be selected for the respective support structure. For example, for a corresponding support structure, particularly a support structure that requires a lower weight and a higher rigidity, a metal such as aluminum can be used. can Other materials, such as those mentioned in the background of the first embodiment, are selected, particularly depending on the type and/or function of the respective support structure. In this example, both substructures of the projection optics box structure 202.1 are made of aluminum.

[Third embodiment]

Hereinafter, a preferred third embodiment of an optical imaging configuration 301 in accordance with the present invention will be described with reference to FIG. 5, with which a preferred embodiment of the method in accordance with the present invention may be performed. The optical imaging configuration 301 generally corresponds in its basic design and functionality to the optical imaging configuration 101 such that the differences are discussed herein. In particular, the same components have been given the same reference numerals, and similar components are given the same reference numerals with the value of 200. Unless explicitly stated otherwise below, the explanations set forth above in the context of the first specific embodiment of these components are explicitly referred to.

The main difference between the optical imaging configuration 301 and the optical imaging configuration 101 is the difference in the design of the projection optics box structure 302.1. It should be appreciated that the projection optics box structure 302.1 can replace the projection optics box structure 102.1 in the optical imaging configuration 101.

In the particular embodiment shown, the projection optics housing structure 302.1 has a first projection optics supported by a second projection optics housing structure 302.4 that simultaneously forms the projection system metering support structure 312 such that a very compact and compact design is achieved. The two-part design formed by the box structure 302.3. The second projection optics box structure 302.4 is connected to the support devices 308.1 to 308.6 of the optical elements 106.1 to 106.6. Thus, the second projection optics box structure 302.4 supports the optical elements 106.1 through 106.6.

The second projection optics box structure 302.4 is via a third vibration isolation in a vibration isolation resonant frequency range having a third vibration isolation resonant frequency of about 3 Hz The off device 318 is supported on the first projection optics box structure 302.3. It will be appreciated that in other embodiments of the invention, the third vibration isolation resonant frequency may be selected from the ranges given above in the context of the first embodiment.

As for the other vibration isolating devices 113 and 114, these are the same as the first embodiment. Accordingly, the explanations provided above in the context of the first embodiment are equally applicable here.

Another difference between this example and the first embodiment is that all of the support devices 308.1 through 308.6 have a vibration balance mass unit 317.1 connected to the projection optics box structure 302.4 via the connection device 317.2.

In the present embodiment, each of the vibration balancing mass units 317.1 and its associated connecting means 317.2 define a balanced resonant frequency of about 15 Hz. However, it should be understood that in other embodiments of the present invention, a balanced resonant frequency range of 1 Hz to 40 Hz, a range of 5 Hz to 40 Hz, or a range of 15 Hz to 25 Hz may be selected depending on the vibration behavior of the projection optics box structure 302.1. Balanced resonant frequency.

In the present example, to provide a beneficial effect on the vibration behavior of the projection optics box structure 302.1, each connection device 317.2 is configured to provide vibration of the associated vibration balance mass unit 317.1 at a first damping ratio of about 1%. Damping. It will be appreciated that another first damping ratio may be selected depending on the vibration behavior of the support structure of the optical element. Preferably, the first damping ratio is selected from the range of 0.2% to 15%, 0.2% to 5%, and 1.0% to 3.0%.

It will be appreciated that with the lithography apparatus 301 of the present embodiment, line of sight accuracy of less than 1 nm at all relevant degrees of freedom (typically in the x and y directions) can be obtained. As a general description, it should be noted that here again, the lower third resonant frequency of the third vibration isolating device 118 provides improved line of sight accuracy. In addition, it should be noted that the rigidity of the second projection optics box structure 302.4 can be increased to increase the line of sight. Accuracy.

It should be understood that, as such, any desired and suitable materials may be selected for the respective support structure. For example, for a corresponding support structure, particularly a support structure that requires a lower weight and a higher rigidity, a metal such as aluminum can be used. Other materials may be selected, such as those mentioned in the background of the first embodiment, particularly depending on the type and/or function of the respective support structure. In this example, both substructures of the projection optics box structure 302.1 are made of aluminum.

Although a specific embodiment of the invention has been described above in which the optical element is solely a reflective element, it will be appreciated that in other embodiments of the invention, the optical element of the optical element unit may use reflective, refractive or diffractive elements. Or any combination thereof.

101‧‧‧Optical imaging configuration

102‧‧‧Optical projection unit

102.1‧‧‧Projection Optics Box Structure (POB)

102.2‧‧‧ openings or recesses

103‧‧‧Mask unit

104‧‧‧Substrate unit

104.3‧‧‧Substrate table support device

105‧‧‧Irradiation system

106.1‧‧‧Optical component unit/mirror

106.5-106.6‧‧‧Optical component unit/mirror

106.7‧‧‧First optical component subgroup

106.8‧‧‧Second optical component subgroup

107‧‧‧Base structure

108.1‧‧‧Support device

108.5-108.6‧‧‧Support device

110‧‧‧Measuring configuration

110.1‧‧‧Measuring unit

110.2-110.5‧‧‧Measuring device

112.1‧‧‧Projection System Metering Support Structure

112.2‧‧‧Substrate system metering support structure

113‧‧‧First vibration isolation device

114‧‧‧Second vibration isolation device

115‧‧‧Internal cooling unit

115.1‧‧‧Internal cooling device support structure

115.2‧‧‧ openings or recesses

116‧‧‧dotted outline

117.1‧‧‧Vibration balance mass unit

117.2‧‧‧Connecting device

117.3‧‧‧dotted outline

118‧‧‧ Third vibration isolation device

Claims (36)

An optical imaging arrangement comprising: - an optical projection system; and - a support structure system; - the optical projection system comprising a plurality of optical elements configured to use exposure light along an exposure light path in an exposure process, Transferring an image of a pattern covered by a mask support structure to a substrate supported by a substrate support structure; - the mask support structure and the substrate support structure form a main vibration source; The support structure system includes a base support structure, an optical component support structure, and at least one secondary vibration source support structure that is not a primary vibration source of the primary vibration source; - the optical component support structure supports the optical components; A secondary vibration source support structure supports the secondary vibration source, the secondary vibration source comprising a primary vibrational interference source for generating vibrational energy of the structure, and the secondary vibration source is located inside the optical imaging configuration; - the base supports The structure supports the optical element supporting structure and the secondary vibration source supporting structure, such that the structure generates vibration energy from the secondary vibration source A structural path to the optical component support structure exists only through the base support structure. The optical imaging configuration of claim 1, wherein - the secondary vibration source is a member of a secondary vibration source group; - the secondary vibration source group consists of a component of a metering system, a cooling unit of the metering system, a component of the optical projection system, a moving component of the optical projection system, and a cooling unit of the optical projection system Composition; - The secondary vibration source support structure is supported on the base support structure, in particular, in a vibration isolation manner. The optical imaging arrangement of claim 1 or 2, wherein - the optical element support structure comprises at least one optical element support unit; - the at least one optical element support unit supports the optical elements; - the at least one optical The component support unit is supported on the base support structure via a vibration isolation device. The optical imaging arrangement of claim 3, wherein the vibration isolating device has a vibration isolation resonant frequency in a vibration isolation resonant frequency range; - the vibration isolation resonant frequency range is selected from a vibration isolation resonance Frequency range group; - The vibration isolation resonance frequency range group consists of one of a range of 0.05 Hz to 8.0 Hz, a range of 0.1 Hz to 1.0 Hz, and a range of 0.2 Hz to 0.6 Hz. The optical imaging arrangement of claim 3, wherein the at least one optical component supporting unit is a first supporting unit; the vibration isolating device has a first vibration isolation resonant frequency first a vibration isolation device; and - the optical element support structure includes at least one second support unit; - the at least one second support unit supports the optical elements; - the at least one second support unit is supported on the first support unit via a second vibration isolation device. The optical imaging configuration of claim 5, wherein the second vibration isolating device has a second vibration-isolated resonant frequency in a vibration-isolated resonant frequency range; - the second vibration-isolated resonant frequency range is Selecting from a second vibration isolation resonance frequency range group; - the second vibration isolation resonance frequency range group is from a range of 1 Hz to 30 Hz, a range of 1 Hz to 8 Hz, a range of 1 Hz to 40 Hz, and 25 Hz to 30 Hz One of the range components. The optical imaging arrangement of any one of claims 3 to 6, wherein - the optical element support structure comprises at least one vibration balance mass unit; - the vibration balance mass unit is connected to the optical element via a connection means a support unit; - the connection device has a balanced resonant frequency in a balanced resonant frequency range; - the balanced resonant frequency range is selected from a group of balanced resonant frequency ranges; - the balanced resonant frequency range is from 1 Hz to 40 Hz One range, one range of 5 Hz to 40 Hz, and one of 15 Hz to 25 Hz. An optical imaging configuration as described in claim 7 wherein - the at least one vibration balancing mass unit comprises at least one vibration balancing mass element; - the vibration balancing mass element is kinematically arranged in series between the optical element supporting unit and one of the optical elements of the group of optical elements. The optical imaging arrangement of claim 7 or 8, wherein the group of optical elements comprises at least one of a first subgroup of optical elements and a second subgroup of optical elements; - the first subgroup optical element comprises at least one first optical element; - none of the at least one vibration balancing mass element is associated with the at least one first optical element; - the second subgroup optical element A plurality of second optical elements are included; - at least one vibration balancing mass element of the at least one vibration balancing mass unit is associated with each of the second optical elements. The optical imaging arrangement of claim 9, wherein - the plurality of vibration balancing mass elements are associated with at least one of the second optical elements; - the plurality of vibration balancing mass elements comprising at least two vibration balances At least one of a mass element and two to six vibration balanced mass elements. The optical imaging configuration of any one of clauses 7 to 10, wherein the connection device is configured to provide damping of vibration of the at least one vibration-balanced mass unit at a damping ratio; - the damping ratio Is selected from a damping ratio range of one of the damping ratio range groups; - The damping ratio range group is composed of a range of 0.2% to 15%, a range of 0.2% to 5%, and a range of 1.0% to 3.0%. The optical imaging configuration of any of claims 3 to 11, wherein - the support structure system comprises a projection system metering support structure; - the projection system metering support structure supports at least one metering device, the at least one a metering device associated with the group of optical elements and configured to retrieve a variable representative of a state of one of the at least one optical element of the group of optical elements; - wherein at least one of the following is true: the at least one projection system is metered The support structure is supported on the base support structure via another vibration isolation device, and the at least one projection system metering support structure is supported on the base support structure via at least two kinematically arranged vibration isolation devices. The optical imaging configuration of claim 12, wherein - the other vibration isolating device has another vibration-isolated resonant frequency in another vibration-isolated resonant frequency range; - the other vibration-isolated resonant frequency range is Selected from another group of vibration-isolated resonant frequency ranges; - the other group of vibration-isolated resonant frequency ranges consists of one of a range of 1 Hz to 30 Hz, a range of 2 Hz to 10 Hz, and a range of 3 Hz to 8 Hz. An optical imaging configuration as described in claims 7 and 13 wherein - the further vibration-isolated resonant frequency and the balanced resonant frequency are separated by a frequency slot; - the frequency slot is selected from a frequency slot range of a frequency-gap range group; - the frequency-gap range group is from 1 Hz to 40 Hz One range, one range of 10 Hz to 25 Hz, and one of 100% to 400% of the other vibration isolation resonant frequency. The optical imaging configuration of any one of clauses 12 to 14, wherein the another vibration isolating device is configured to provide damping of vibration of the at least one projection system metering support structure at a damping ratio; - the damping ratio is selected from a damping ratio range of one of the damping ratio range groups; - the damping ratio range group is from one of 5% to 60%, one of 10% to 30%, and 20% to 25 One of the ranges consists of %. The optical imaging arrangement of any one of claims 3 to 15, wherein - at least one of the at least one optical element support unit and a projection system metering support structure is selected from a material of a material group Made; - the material group consists of steel, aluminum (Al), titanium (Ti), iron-nickel alloy, one tungsten alloy, one ceramic material, bismuth samarium carbide (SiSiC), tantalum carbide (SiC),矽(Si), carbon fiber reinforced tantalum carbide (C/CSiC), alumina (Al ₂ O ₃ ), Zerodur®, ULE® glass, quartz, and cordierite. The optical imaging configuration of claim 5, wherein the first support unit is made of a first material having a first rigidity; - the second support unit is made of a second material having a second stiffness; - the second stiffness is higher than the first stiffness. The optical imaging arrangement of any one of clauses 1 to 17, wherein at least one of the following is true: - configured to use microscopic exposure light using one of a range of UV exposures And the - the exposure light has a wavelength between 5 nm and 20 nm; and - the optical elements of the group of optical elements are reflective optical elements. A method of supporting an optical projection system of an optical imaging system having a plurality of optical components configured to use exposure light along an exposure light path in an exposure process, supported by a mask support structure An image of a pattern of one of the masks is transferred to a substrate supported by a substrate supporting structure, the mask supporting structure and the substrate supporting structure forming a main vibration source, the method comprising: - supporting via an optical component The structure supports the optical components on a base support structure; - supporting a primary vibration source that is not the primary vibration source via a primary vibration source support structure from the base support structure, the secondary vibration source system comprising a structure generating vibration energy One time to vibrate the source of interference, and the secondary source of vibration is inside the optical imaging configuration; - the optical element support structure and the secondary vibration source support structure are supported such that the structure generates vibrational energy from the secondary vibration source to a structural path of the optical element support structure only through the base support structure. The method of claim 19, wherein - the optical element support structure comprises at least one optical element support unit; - the at least one optical element support unit supports the optical elements; - the at least one optical element support unit is One of the vibration isolation resonant frequency ranges is supported by the vibration isolation mode in a vibration isolation manner on the base support structure; the vibration isolation resonance frequency range is selected from a vibration isolation resonance frequency range group; - the vibration isolation The resonance frequency range group is composed of one of a range of 0.05 Hz to 8.0 Hz, a range of 0.1 Hz to 1.0 Hz, and a range of 0.2 Hz to 0.6 Hz. The method of claim 20, wherein - the at least one optical component supporting unit is a first supporting unit; - the vibration isolation resonant frequency is a first vibration isolation resonant frequency; and - the optical component supporting structure Including at least one second support unit; - the at least one second support unit supports the optical elements; - the at least one second support unit is at a second vibration isolation resonance frequency of one of the second vibration isolation resonance frequency ranges a vibration isolation mode is supported on the first support unit; - the second vibration isolation resonance frequency range is selected from a second vibration isolation resonance frequency range group; - The second vibration-isolated resonance frequency range group consists of a range of 1 Hz to 30 Hz, a range of 1 Hz to 8 Hz, a range of 1 Hz to 40 Hz, and a range of 25 Hz to 30 Hz. The method of any one of claims 20 or 21, wherein - at least one vibration balancing mass unit is coupled to the optical element supporting unit to provide a balanced resonant frequency in a balanced resonant frequency range At least one of a balancing effect and a damping effect of a vibration at a damping ratio; - the balanced resonant frequency range is selected from the group of balanced resonant frequency ranges; - the balanced resonant frequency The range group is composed of a range of 1 Hz to 40 Hz, a range of 5 Hz to 40 Hz, and a range of 15 Hz to 25 Hz; - the damping ratio is selected from a damping ratio range of one damping ratio range group; - the damping ratio The range group consists of a range of 0.2% to 15%, a range of 0.2% to 5%, and a range of 1.0% to 3.0%. The method of any one of claims 20 to 22, wherein - the projection system metering support structure is supported in a vibration isolation manner at another vibration isolation resonance frequency in another vibration isolation resonance frequency range The base support structure; the projection system metering support structure supports at least one metering device associated with the group of optical elements and configured to capture one of the at least one optical element representing the group of optical elements a variable of the state; - the other vibration-isolated resonant frequency range is selected from another group of vibration-isolated resonant frequency ranges; - The further vibration-isolated resonance frequency range group consists of a range of 1 Hz to 30 Hz, a range of 2 Hz to 10 Hz, and a range of 3 Hz to 8 Hz. An optical imaging arrangement comprising: - an optical projection system; and - a support structure system; - the optical projection system comprising an optical grouping element configured to use exposure light along an exposure light in an exposure process a path for transferring an image of a pattern covered by a mask support structure to a substrate supported by a substrate support structure; the mask support structure and the substrate support structure form a main vibration source; The support structure system comprises a base support structure, an optical component support structure and at least one secondary vibration source support structure that is not a primary vibration source of the primary vibration source; - the optical component support structure supports the optical components; The at least one secondary vibration source support structure supports the secondary vibration source, the secondary vibration source comprising a primary vibrational interference source that generates vibration energy from the structure, and the secondary vibration source is located within the optical imaging configuration; a base support structure supporting the optical component support structure and the secondary vibration source support structure, such that the secondary vibration source support structure is mechanically At least one vibration isolating device is decoupled from the optical component support structure. The optical imaging configuration of claim 24, wherein - the secondary vibration source is one of a component of the vibration source group; - the secondary vibration source group consists of a component of a metering system, a cooling unit of the metering system, a component of the optical projection system, a moving component of the optical projection system, and a cooling unit of the optical projection system Composition; - The secondary vibration source support structure is supported on the base support structure via a vibration isolation device, in particular in a vibration isolation manner. The optical imaging arrangement of claim 24 or 25, wherein - the optical element support structure comprises at least one optical element support unit; - the at least one optical element support unit supports the optical elements; - the at least one optical The component support unit is supported on the base support structure via a vibration isolation device. The optical imaging arrangement of claim 26, wherein the vibration isolating device has a vibration isolation resonant frequency in a vibration isolation resonant frequency range; - the vibration isolation resonant frequency range is selected from a vibration isolation resonance Frequency range group; - The vibration isolation resonance frequency range group consists of one of a range of 0.05 Hz to 8.0 Hz, a range of 0.1 Hz to 1.0 Hz, and a range of 0.2 Hz to 0.6 Hz. The optical imaging configuration of claim 26 or 27, wherein - the at least one optical component supporting unit is a first supporting unit; - the vibration isolating device is a first vibration isolating device; and - the optical component The support structure includes at least one second support unit; - the at least one second support unit supports the optical elements; - the at least one second support unit is supported on the first support unit via a second vibration isolating device. The optical imaging arrangement of claim 28, wherein - the second vibration isolating device has a vibration isolation resonant frequency in a vibration isolation resonant frequency range; - the second vibration isolation resonant frequency range is selected from a second vibration isolation resonance frequency range group; - the second vibration isolation resonance frequency range group is in a range of 1 Hz to 30 Hz, a range of 1 Hz to 8 Hz, a range of 1 Hz to 40 Hz, and one of 25 Hz to 30 Hz The composition of the scope. The optical imaging arrangement of any one of clauses 26 to 29, wherein - the optical element support structure comprises at least one vibration balance mass unit; - the vibration balance mass unit is connected to the optical element via a connection means a support unit; - the connection device has a balanced resonant frequency in a balanced resonant frequency range; - the balanced resonant frequency range is selected from a group of balanced resonant frequency ranges; - the balanced resonant frequency range is from 1 Hz to 40 Hz One range, one range of 5 Hz to 40 Hz, and one of 15 Hz to 25 Hz. The optical imaging configuration of any one of claims 26 to 30, wherein - the support structure system comprises a projection system metering support structure; - the projection system metering support structure supports at least one metering device associated with the group of optical elements and configured to capture a variable representative of a state of one of the at least one optical element of the group of optical elements; At least one of the following is true: the at least one projection system metering support structure is supported on the base support structure via another vibration isolation device, and the at least one projection system metering support structure is coupled in series via at least two kinematics The configured vibration isolating device is supported on the base support structure. The optical imaging arrangement of claim 31, wherein - the other vibration isolating device has another vibration-isolated resonant frequency in another vibration-isolated resonant frequency range; - the other vibration-isolated resonant frequency range is Selected from another group of vibration-isolated resonant frequency ranges; - the other group of vibration-isolated resonant frequency ranges consists of one of a range of 1 Hz to 30 Hz, a range of 2 Hz to 10 Hz, and a range of 3 Hz to 8 Hz. The optical imaging arrangement of any one of claims 26 to 32, wherein - at least one of the at least one optical element support unit and a projection system metering support structure is selected from a material selected from the group of materials Made; - the material group consists of steel, aluminum (Al), titanium (Ti), iron-nickel alloy, one tungsten alloy, one ceramic material, bismuth samarium carbide (SiSiC), tantalum carbide (SiC),矽(Si), carbon fiber reinforced tantalum carbide (C/CSiC), alumina (Al ₂ O ₃ ), Zerodur®, ULE® glass, quartz, and cordierite. A method of supporting an optical projection system of an optical imaging system having a plurality of optical components configured to use exposure light along an exposure light path in an exposure process, supported by a mask support structure An image of a pattern of one of the masks is transferred to a substrate supported by a substrate supporting structure, the mask supporting structure and the substrate supporting structure forming a main vibration source, the method comprising: - supporting via an optical component The structure supports the optical components on a base support structure; - supporting a primary vibration source that is not the primary vibration source via a primary vibration source support structure from the base support structure, the secondary vibration source system comprising a structure generating vibration energy a vibration interference source, and the secondary vibration source is located inside the optical imaging configuration; - the base support structure supports the optical component support structure and the secondary vibration source support structure, such that the secondary vibration source support structure is The optical element support structure is mechanically decoupled via at least one vibration isolating device. An optical imaging arrangement comprising: - an optical projection system; and - a support structure system; - the optical projection system comprising a plurality of optical elements configured to use exposure light along an exposure light path in an exposure process, Transferring an image of a pattern covered by a mask support structure to a substrate supported by a substrate support structure; the support structure system includes a base support structure and an optical component support structure and a projection System metering support structure; - the optical element support structure supports the optical elements; - the optical element support structure is supported on the base support structure via a first vibration isolating device; - the projection system metering support structure supports at least one metering device, the at least one metering A device associated with the group of optical elements and configured to retrieve a variable representative of a state of one of the at least one optical element of the group of optical elements; - the projection system metering support structure is supported by the second vibration isolation device The optical component supports the structure. A method of supporting an optical projection system of an optical imaging system having a plurality of optical components configured to use exposure light along an exposure light path in an exposure process, supported by a mask support structure Passing an image of a pattern of a mask onto a substrate supported by a substrate support structure, the method comprising: - supporting the optical components on a base support structure via an optical component support structure; and - using A projection system metering support structure supports at least one metering device associated with the group of optical elements on the optical element support structure; - supporting the projection system metering support structure via the second vibration isolating device to the optical element support structure The at least one metering device is configured to take a variable representative of one of the states of the at least one optical component of the group of optical elements.