TW201347215A - Method of forming a photovoltaic cell module - Google Patents

Abstract

A method of forming a photovoltaic (PV) cell module comprises the step of applying a first polymeric composition around a periphery of (i) a front face of a substrate and/or (ii) a rear face of a cover sheet to form a peripheral tie-layer on the face(s). The method further comprises the step of applying a second polymeric composition, different than the first polymeric composition, to (ii) the rear face of the cover sheet to form an inner tie-layer. The method further comprises the step of disposing a PV cell on the inner tie-layer formed from the application of the second polymeric composition. The method further comprises the step of combining the substrate and the cover sheet to form the PV cell module such that the peripheral tie-layer and the inner tie-layer are sandwiched between the substrate and the cover sheet with the PV cell encapsulated by the inner tie-layer.

Description

Method for forming photovoltaic battery module Cross-reference to related applications

The present application claims the benefit of U.S. Provisional Patent Application Serial No. 61/591,005, filed on Jan. 26, 2012, which is hereby incorporated by reference.

The present invention generally relates to a method of forming a photovoltaic (PV) battery module and a PV battery module formed in accordance with the method of the present invention.

A solar cell or a PV cell is a semiconductor device for converting light into electricity. In many applications, PV cells are sealed to form a PV cell module. The modules typically include a cover sheet (or "overlay") and a back cover sheet (or "substrate") such that the PV cell and encapsulant are sandwiched between the cover sheet and the substrate. The PV cells are operatively coupled to each other by interconnecting strips. Sealants and cover sheets protect PV cells from environmental factors such as wind, dust and rain. A commonly used sealant is ethyl vinyl acetate (EVA) and the other is polyfluorene. EVA has one or more disadvantages such as low UV resistance, degradation over time, discoloration over time, and the like. Thus, polyoxymethylene has been used in some applications to replace EVA in modules. Polyoxygenated encapsulants can be used to completely seal PV cells within the module. Typically, a lamination process is used to form the module such that the polyoxyn encapsulant is cured between the cover sheet and the back cover sheet, wherein the PV cells are sealed by a polyoxygen encapsulant. In some applications, both the cover sheet and the back cover sheet are formed from glass. A bladder press can be used for lamination to prevent damage to the sheet and to cure the polyoxygen sealant Cured.

Unfortunately, after the pressure is released, the glass sheet tends to flex at the edges and corners, especially the back cover sheet, which causes the sheet and the polyoxygen encapsulant to be applied immediately after the pressure is released or for a while thereafter. Cohesive destruction between. Such cohesive failure can damage the module or deform the module, making it unsuitable for long-term use (if fully applicable). Therefore, there is still an opportunity to provide improved module formation methods. There are also opportunities to provide improved modules such as modules with improved cohesive strength and durability.

The present invention provides a method of forming a photovoltaic (PV) battery module. The module of the present invention includes a substrate having a front surface and a back surface spaced apart from the front surface. The module also includes a cover sheet having a front face and a back face spaced from the front face of the cover sheet. An internal connection layer is disposed between the substrate and the cover sheet to couple the back surface of the cover sheet to the front surface of the substrate. The inner connecting layer has a peripheral edge. At least one PV cell is disposed within the internal connection layer. A peripheral connection layer is also disposed between the substrate and the cover sheet and is disposed around the peripheral edge of the inner connection layer to further couple the back surface of the cover sheet to the front surface of the substrate.

The method of the present invention comprises the steps of applying a first polymeric composition around i) the front side of the substrate and/or ii) the periphery of the back side of the cover sheet to form the periphery in the uncured state on the sides Connection layer. The method further comprises the step of: ii) coating the backside of the cover sheet with a second polymeric composition different from the first polymeric composition to form the inner tie layer in an uncured state. The method further includes the step of disposing the PV cell on the internal tie layer formed by coating the second polymeric composition. The method further includes the steps of: combining the substrate and the cover sheet to form the module such that the peripheral connection layer and the internal connection layer are sandwiched between the substrate and the cover sheet, wherein the PV cell is The inner connecting layer is sealed. The module can be used in a variety of applications, such as for converting many different wavelengths of light into electricity.

20‧‧‧Photovoltaic battery module/module

22‧‧‧Photovoltaic battery module array

24‧‧‧Substrate/back cover

26‧‧‧Before the substrate

28‧‧‧Back of the substrate

30‧‧‧ Covering film

32‧‧‧Before the cover sheet/photovoltaic battery

34‧‧‧Back of the cover sheet / interconnection strip

36‧‧‧Internal connection layer

38‧‧‧The surrounding edge of the inner connecting layer

40‧‧‧ Peripheral connection layer

42‧‧‧Robot distributor

44‧‧‧Nozzles

46‧‧‧Robot fixture

The invention may be readily understood by the following detailed description of the invention, in which: FIG. 1 is a pair of photovoltaics each comprising an embodiment of a PV cell module. A perspective view of a PV array; FIG. 2 is an exploded cross-sectional side view of one embodiment of a PV cell module including a PV cell; and FIG. 3 is a PV cell disposed between the internal connection layer and the peripheral connection layer FIG. 4 is a plan view of one embodiment of a PV cell module including a plurality of PV cells disposed within and between the interconnect layers; FIG. 5 is a view illustrating the coating of one embodiment of the method, An exploded cross-sectional schematic side view of the placement and combination steps; FIG. 6 is an illustration of an exploded cross-sectional schematic illustrating the application of an additional amount of the polymeric composition to the PV cell and the interconnect layer to further form the interconnect layer and the peripheral tie layer. Figure 7 is a schematic cross-sectional side elevational view showing the application of the first polymeric composition and the second polymeric composition to form the inner connecting layer and the peripheral connecting layer; Figure 8 is a view illustrating the application of the first polymerization. Compound to form a schematic side view of the surrounding connector exploded cross-sectional layers; and FIG. 9 is a second polymeric coating composition to form the inner layer of the connector exploded cross-sectional schematic side view.

Referring to the figures (where the same numbers are used throughout the drawings, the same numerals indicate the same parts), a photovoltaic (PV) battery module formed in accordance with the method of the present invention is generally shown at 20 . The PV battery module 20 is hereinafter referred to as a module 20 . The components of the module 20 of the present invention are not necessarily drawn to scale in the drawings such that they may be larger or smaller than those shown.

Referring to Figure 1, a plurality of modules 20 are connected to form a pair of arrays 22 . Array 22 can be planar or non-planar. Although shown for this configuration/configuration, the modules 20 can be used alone or in groups of two or more (eg, as shown in FIG. 1) and can be used in a variety of applications, such as structures, buildings, Vehicles, devices, etc. The invention is not limited to any particular configuration or use of module 20 or array 22 . Module 20 can be used to convert light energy into electrical energy.

Referring to FIG. 2, the module 20 includes a substrate 24 . The substrate 24 has a front face 26 and a back face 28 that are spaced apart from the front face 26 . Substrate 24 can be substantially planar or non-planar. Substrate 24 may also be referred to in the art as a back cover sheet 24 . The substrate 24 is adapted to provide support, protection and/or interface to the module 20 .

The substrate 24 can be formed from a variety of materials. Examples of suitable materials include glass, polymeric materials, composite materials, and the like. For example, the substrate 24 may be formed of glass, polyethylene terephthalate (PET), thermoplastic elastomer (TPE), polyvinyl fluoride (PVF), polyfluorene, or the like. Substrate 24 can be formed from a combination of different materials, such as polymeric materials and fibrous materials. Substrate 24 can have portions formed from one material (e.g., glass) and other portions formed from another material (e.g., polymeric material). Substrate 24 can have various thicknesses, such as on average from about 0.05 to about 5, from about 0.1 to about 4, or from about 0.125 to about 3.2 millimeters (mm), or any range between the lowest and highest of such values. . The thickness of the substrate 24 can be uniform or variable.

Other examples of suitable substrates 24 include those described in U.S. Application Publication Nos. 2008/0276983, 2011/0005066, and 2011/0061724, and WO Publication Nos. 2010/051355 and 2010/141697. Other examples of suitable substrates 24 include those described in U.S. Patent Application Serial No. 61/725,277, the entire disclosure of which is incorporated herein by reference. The above disclosure is hereinafter referred to as "incorporated references" which are hereby incorporated by reference in its entirety inso- In the event of any inconsistency between the present invention and any of the incorporated references, the subject matter of any of the incorporated references should be The references incorporated herein are incorporated by reference.

The module 20 further includes a cover sheet 30 . The cover sheet 30 has a front face 32 and a back face 34 that are spaced apart from the front face 32 . Cover sheet 30 can be substantially planar or non-planar. The cover sheet 30 is adapted to protect the module 20 from environmental conditions such as rain, snow, dust, heat, and the like. Typically, the cover sheet 30 is transparent to UV and/or visible light to concentrate light energy. In other words, the cover sheet 30 is typically optically transparent. The cover sheet 30 is generally the male side or the front side of the module 20 .

The cover sheet 30 can be formed from a variety of materials. Examples of suitable materials include those described above with respect to substrate 24 . Other examples of suitable cover sheets 30 include those described in the incorporated references. In some embodiments, the cover sheet 30 is formed from glass. Various types of glass can be utilized, such as cerium oxide glass, polymeric glass, and the like. The cover sheet 30 can be formed from a combination of different materials. The cover sheet 30 can have a portion formed of one material (e.g., glass) and other portions formed of another material (e.g., a polymeric material). The cover sheet 30 can be the same as or different from the substrate 24 . For example, both the cover sheet 30 and the substrate 24 can be formed from glass of equal or different thickness. In some embodiments, both the substrate 24 and the cover sheet 30 are formed from glass. Cover sheet 30 can have various thicknesses, such as on average from about 0.5 to about 10, from about 1 to about 7.5, from about 2.5 to about 5, or from about 3 mm, or any range between the lowest and highest of such values. . The thickness of the cover sheet 30 can be uniform or variable. Other examples of suitable cover sheets 30 include those described in the incorporated references, such as those described in the '277 application as "top panels."

Module 20 further includes at least one PV cell 32 . Typically, as shown in FIG. 4, module 20 includes a plurality of PV cells 32 . The PV cell 32 is disposed between the substrate 24 and the cover sheet 30 . PV cells 32 are typically substantially coplanar with each other. The PV cells 32 can be configured in a variety of patterns, such as a series of PV cells 32 in a grid-like pattern (such as the pattern depicted in Figure 4). The invention is not limited to any particular pattern. The PV cells 32 can be offset from each other, such as in a non-planar module 20 . In certain embodiments, PV cell 32 may be referred to as crystalline germanium PV cell 32 in the art.

The PV cells 32 can be of various sizes, are of various types and are formed of various materials. Examples of suitable PV cells 32 include those described in the incorporated references. The PV cells 32 can be the same or different from each other. PV cell 32 can have various thicknesses, such as on average from about 50 to about 250, from about 100 to about 225, from about 175 to about 225, or about 180 μιη, or any between the lowest and highest of such values. range. PV cells 32 can also have a variety of widths and lengths. Other examples of suitable PV cells 32 include those described in the incorporated references, such as those described in the '277 application.

As best shown in FIG. 4, interconnect strips 34 are disposed between PV cells 32 . The interconnect strip 34 is adapted to establish circuitry in the module 20 . A series of two or more connected PV cells 32 may be referred to in the art as a battery string. The interconnect strips 34 generally extend above and below the PV cells 32 .

The interconnect strips 34 can be formed from a variety of electrically conductive materials, such as metals, conductive polymers, or combinations thereof. Examples of other suitable materials include those described in the incorporated references. The interconnect strips 34 are adapted to connect the PV cells 32 together, as well as to other components, such as bus bars (not shown), other modules 20, and the like. The PV cells 32 may be connected by interconnecting strips 34 in series or in parallel. The interconnect strips 34 are typically connected to a busbar (not shown) to establish circuitry and carry the energy collected by the PV cells 32 .

Although referred to as interconnected strips 34 , interconnect strips 34 can have a variety of shapes and sizes, and can also be referred to in the art as interconnects, busbars, wires, or leads, depending on shape, size, location, and the like. The interconnect strips 34 can have various dimensions, such as an average of from about 0.125 to about 2 mm thick and/or wide, or any range between such values.

The module 20 further includes an internal connection layer 36 . The PV cells 32 are disposed within the inner tie layer 36 . In particular, PV cell 32 and interconnect strip 34 are sealed within internal tie layer 36 . This is not to say that the PV cell 32 and/or the interconnect strip 34 cannot be in physical or electrical contact with something other than the internal connection layer 36 , such as a junction box or another module. Internal connection layer 36 is disposed between the substrate 24 and the cover sheet 30 to the back sheet 30 is coupled to the cover 34 and the front 26 of the substrate 24. "Coupled" as used herein generally means a physical connection unless otherwise indicated. The inner connecting layer 36 has a peripheral edge 38 . The inner tie layer 36 can be formed from one or more polymeric compositions as described below. Internal tie layer 36 may also be referred to in the art as polymer inner tie layer 36 .

The inner tie layer 36 can have various thicknesses, such as on average from about 0.1 to about 1.5, from about 0.2 to about 0.75, or from about 0.25 to about 0.5 mm, or any range between the lowest and highest of the values. The thickness of the inner connecting layer 36 is generally defined between the cover sheet 30 and the substrate 24 . The thickness may also be defined by one or more intermediate layers, if present. The intermediate layer is described below. Typically, the thickness of the inner tie layer 36 is varied to minimize the amount of polymeric composition used, thereby reducing the cost of manufacturing the module 20 and at the same time bottoming out the PV cells 32 and/or interconnect strips 34 . The extent is minimized or the PV cells 32 and/or interconnect strips 34 are prevented from bottoming out.

As used herein, "bottoming" refers to the situation where PV cell 32 and/or interconnect strip 34 will contact cover sheet 30 , which can cause damage. Such a situation may occur during the manufacture and/or use of the module 20 . This situation is not desirable. Thus, the inner tie layer 36 is adapted to achieve cushioning and to protect the PV cells 32 and the interconnect strips 34 .

The module 20 further includes a perimeter connection layer 40 . Peripheral connection layer 40 is disposed between the substrate 24 and the cover sheet 30 and the inner periphery disposed around the perimeter edge 38 of the interconnect layer 36, is further coupled to the back surface 30 of the cover sheet 34 and 24 of the front substrate 26.

As best shown in FIG. 3, the perimeter tie layer 40 generally abuts the peripheral edge 38 of the inner tie layer 36 . The perimeter tie layer 40 can be disposed along either side of the perimeter edge 38 as shown in FIG. 3 or along all four sides of the perimeter edge 38 as shown in FIG. Thus, the perimeter tie layer 40 need not be completely disposed about the peripheral edge 38 of the inner tie layer 36 . The peripheral tie layer 40 can be formed from one or more polymeric compositions as described below. The perimeter connection layer 40 may also be referred to in the art as a polymeric perimeter connection layer 40 . Although a simplified PV cell 32 is shown in FIG. 3 and in several other figures, the module 20 can include a plurality of PV cells 32 .

Peripheral tie layer 40 can have various thicknesses, such as on average from about 0.1 to about 1.5, from about 0.2 to about 0.75, or from about 0.25 to about 0.5 mm, or any range between the lowest and highest of such values. The thickness of the perimeter connection layer 40 is generally defined between the cover sheet 30 and the substrate 24 . The thickness may also be defined by one or more intermediate layers, if present. Generally, the thickness of the peripheral tie layer 40 is varied to minimize the amount of polymeric composition used, thereby reducing the cost of manufacturing the module 20 and at the same time reducing the bottoming of the PV cells 32 and/or interconnect strips 34 . Minimize or prevent the PV cells 32 and/or interconnect strips 34 from bottoming out.

As used herein, "bottoming" refers to the situation where PV cell 32 and/or interconnect strip 34 will contact cover sheet 30 , which can cause damage. Such a situation may occur during the manufacture and/or use of the module 20 . This situation is not desirable. Thus, the perimeter connection layer 40 is adapted to achieve buffering and protection of the PV cells 32 and interconnect strips 34 . Additionally, the perimeter connection layer 40 can act as a spacer that is suitable for use in the fabrication of the module 20 , as described below.

Peripheral tie layer 40 can have various widths, such as an average of from about 2.5 to about 155, from about 6.5 to about 80, or from about 12 to about 25 mm, or any range between the lowest and highest of such values. The width of the perimeter tie layer 40 is generally defined between the peripheral edge 38 of the inner tie layer 36 and the outer edge of the module 20 . The width of the peripheral tie layer 40 can be varied to minimize the amount of polymeric composition used, thereby potentially reducing the manufacturing cost of the module 20 . However, the width of the perimeter tie layer 40 should be sufficient to retain the polymeric composition of the inner tie layer 36 during at least the manufacture of the module 20 , and/or sufficient to act as a spacer, as described below.

As mentioned above, the peripheral tie layer 40 is formed from a first polymeric composition and the inner tie layer 36 is formed from a second polymeric composition that is different from the first polymeric composition. The first polymeric composition and the second polymeric composition can vary in various aspects, such as being chemically and/or physically different. Typically, the first polymeric composition and the second polymeric composition differ in a manner such as providing a different modulus of elasticity. Different examples are described below.

The first polymeric composition can be formed from a variety of polymer compositions. Typically, the first polymeric composition is polyfluorene oxide, more typically a polyoxyxene elastomer. Suitable for polyoxygenation including branching and not Branches, more typically unbranched oligomeric or polymeric organooxanes. Examples of suitable polymeric compositions include rhodium hydrogenation, condensation, and rhodium hydrogenation/condensation reaction curable polydecane compositions.

In certain embodiments, the peripheral tie layer 40 is formed from a rhodium hydrogenation curable polydecaneoxy composition. In other embodiments, the first polymeric composition comprises a diorganopolyoxyalkylene having an alkenyl group (e.g., a vinyl group) and a hydrazine-bonded hydrogen atom having reactivity with the alkenyl group of the diorganopolyoxyalkylene oxide. Hydrogenated organic hydrazine. Examples of suitable diorganopolyoxyalkylenes, hydrogenated organic phosphoniums, and non-reactive organic polyoxyalkylenes include those described in the incorporated references.

The diorganopolysiloxane and the hydrogenated organogermanium will generally react to form a polyoxyl polymer in the presence of other components as appropriate. Examples of suitable components, such as catalysts, include those described in the incorporated references.

In certain embodiments, the diorganopolyoxyalkylene oxide is dimethylvinyl terminated dimethyloxane, and the hydrogenated organic hydrazine is hydrogen terminated dimethyl methoxyoxane. As described above, the first polymeric composition is different from the second polymeric composition. An example of a difference between the first polymeric composition and the second polymeric composition is that the second polymeric composition includes an unreactive organic polyoxyalkylene (described below), while the first polymeric composition does not include non-reactivity. Organic polyoxyalkylene.

In a particular embodiment, the first polymeric composition comprises, consists essentially of, or consists of: dimethylvinyl terminated polydimethyl siloxane; dimethyl hydrogen terminated poly a methyl methoxy oxane; and a trimethyl decyloxy-terminated dimethylmethylhydroquinone containing at least 3 SiH units per molecule. In other words, the peripheral tie layer 40 can be the reaction product of such components. The reaction can be catalyzed by a rhodium hydrogenation catalyst, such as a platinum ligand complex, which can be included or added to the first polymeric composition.

In the above embodiments, the components of the first polymeric composition may be included in various amounts. Typically, the first polymeric composition comprises greater than about 55, greater than about 60, or greater than about 65 parts by weight of the diorganopolyoxyalkylene, each in terms of 100 parts by weight of the first polymeric composition, or the lowest of the equivalents Any range between the highest and the highest. Typically, the first polymeric composition package Included from about 5 to about 25, from about 5 to about 20, or from about 8 to about 22.5 parts by weight of the hydrogenated organogermanium, each of 100 parts by weight of the first polymeric composition, or the lowest and highest of the equivalents Any range between.

The first polymeric composition may also include other components such as decane or decane. These components can be included in various amounts. In certain embodiments, the first polymeric composition further comprises organodecane and/or dimethylmethylhydroquinone. The components may be included in various amounts, such as less than about 5, or from about 0.1 to about 2.5 parts by weight, each of 100 parts by weight of the first polymeric composition, or the lowest and highest of the equivalents. Any range between.

In another specific embodiment, the first polymeric composition comprises, consists essentially of, or consists of: dimethyl vinyl terminated polydimethyl siloxane; and at least 3 per molecule Trimethyl decyloxy terminated dimethylmethylhydroquinoxane of one SiH unit. In other words, the peripheral tie layer 40 can be the reaction product of such components. The reaction can be catalyzed by a rhodium hydrogenation catalyst, such as a platinum ligand complex, which can be included or added to the first polymeric composition.

In the above embodiments, the components of the first polymeric composition may be included in various amounts. Typically, the first polymeric composition comprises from about 80 to about 99.9, from about 90 to about 99.9, or from about 95 to about 99.9 parts by weight of dimethylvinyl terminated polydimethyloxane (eg, dimethyloxane) , dimethylvinyl alkoxy-terminated polymer), each in terms of 100 parts by weight of the first polymeric composition, or any range between the lowest and highest of such values. Typically, the first polymeric composition comprises from about 0.01 to about 2, from about 0.05 to about 1, or from about 0.05 to about 0.5 parts by weight of a platinum ligand complex (eg, 1,3-divinyl-1,1,3, 3-tetramethyldioxane complex (Pt)), each in terms of 100 parts by weight of the first polymeric composition, or any range between the lowest and highest of such values. Typically, the first polymeric composition comprises from about 0.01 to about 7.5, from about 0.1 to about 5, or from about 0.2 to about 2.5 parts by weight of alkoxydecane (e.g., methacryloxypropyltrimethoxydecane), each of which Any range between 100 parts by weight of the first polymeric composition, or between the lowest and highest of the equivalents. Usually, first The polymeric composition comprises from about 0.05 to about 7.5, from about 0.1 to about 5, or from about 0.5 to about 2.5 parts by weight of trimethyldecyloxy-terminated dimethylmethylhydroquinoxane containing at least 3 SiH units per molecule. (eg dimethyl, methylhydroquinoxane, trimethyldecyloxy terminated), each in terms of 100 parts by weight of the first polymeric composition, or between the lowest and highest of the equivalents Any range. Typically, the first polymeric composition comprises from about 0.001 to about 2.5, from about 0.005 to about 1, or from about 0.005 to about 0.5 parts by weight of a decane (e.g., tetramethyltetravinylcyclotetraoxane), each at a weight of 100 The first polymeric composition, or any range between the lowest and highest of the values. The first polymeric composition may also be referred to in the art as a sealant composition. Examples of suitable sealant compositions, such as polyoxynoxy compositions, include those described in the incorporated references. Specific examples of suitable sealant compositions suitable for use as the first polymeric composition are available from Dow Corning Corporation (Midland, MI), such as Dow Corning® PV-6150 battery sealant. Other examples of suitable sealant compositions include those described in the incorporated references, such as those described in the '277 application as "polyoxygenated sealants."

When referring to the second polymeric composition, the second polymeric composition can be formed from a variety of polymeric compositions. Typically, the second polymeric composition is polyfluorene oxide, more typically a polyoxyxene elastomer. Examples of suitable polymeric compositions include rhodium hydrogenation, condensation, and rhodium hydrogenation/condensation reaction curable polydecane compositions.

In certain embodiments, the inner tie layer 36 is formed from a rhodium hydrogenation reaction curable composition. In other embodiments, the second polymeric composition comprises a diorganopolyoxyalkylene having an alkenyl group (e.g., a vinyl group) having a hydrazine-bonded hydrogen atom reactive with the alkenyl group of the diorganopolyoxyalkylene oxide. Hydrogenated organic hydrazine and unreactive organic polyoxyalkylene. "Non-reactive" generally means that the non-reactive organopolyoxane does not react with the diorganopolyoxane or the hydrogenated organic hydrazine. Examples of suitable diorganopolyoxyalkylenes, hydrogenated organic phosphoniums, and non-reactive organic polyoxyalkylenes include those described in the incorporated references.

Diorganopolyoxynonane and hydrogenated organic hydrazine in an unreactive organic polyoxane and depending on the situation The reaction will generally form a polyoxyl polymer in the presence of other components present. The non-reactive organopolyoxane is useful for adjusting the physical properties of the polyoxyalkylene polymer, as further described below. Examples of suitable components, such as catalysts, include those described in the incorporated references.

In certain embodiments, the diorganopolyoxyalkylene oxide is dimethylvinyl terminated dimethyloxane, the hydrogenated organic hydrazine is hydrogen terminated dimethyloxane, and the non-reactive organic polyoxane The alkane is polydimethyl methoxyoxane (PDMS).

In a particular embodiment, the second polymeric composition comprises, consists essentially of, or consists of: two different dimethylvinyl terminated polydimethyloxane; dimethyl hydrogen a blocked polydimethyl methoxy oxane; and a trimethyl decyloxy terminated dimethyl methyl hydro oxane having at least 3 SiH units per molecule. In other words, the inner tie layer 36 can be the reaction product of such components. The reaction can be catalyzed by a rhodium hydrogenation catalyst, such as a platinum ligand complex, which can be included in or added to the second polymeric composition. In this embodiment, the reaction typically occurs in the presence of PDMS, which may also be included or added to the second polymeric composition. If utilized, the PDMS is non-reactive, for example, non-reactive with the above reactants of the second polymeric composition. As mentioned above, the inclusion of components such as PDMS is suitable for modulating the physical properties of the reaction product.

In the above embodiments, the components of the second polymeric composition may be included in various amounts. Typically, the second polymeric composition comprises greater than about 45, greater than about 50, greater than about 55, greater than about 60, or greater than about 65 parts by weight of the diorganopolyoxyalkylene, each based on 100 parts by weight of the second polymeric composition, or Any range between the lowest and highest of these values. Typically, the second polymeric composition comprises from about 2.5 to about 7.5, from about 3 to about 7, or from about 3.5 to about 6.5 parts by weight of the hydrogenated organohydrazine, each based on 100 parts by weight of the second polymeric composition, or equivalent thereto. Any range between the lowest and highest. Typically, the second polymeric composition has from about 25 to about 65, or from about 30 to about 60 parts by weight of non-reactive organopolyoxane, each in terms of 100 parts by weight of the second polymeric composition, or in between Between the lowest and the highest Any range.

The second polymeric composition may also be referred to in the art as a sealant composition. Specific examples of suitable sealant compositions suitable for use as the second polymeric composition are available from Dow Corning Corporation, such as Dow Corning® PV-6100 Battery Sealant. Other examples of suitable sealant compositions include those described in the incorporated references, such as those described in the '277 application as "polyoxygenated sealants."

Generally, the elastic modulus of the inner connecting layer 36 is smaller than the elastic modulus of the peripheral connecting layer 40 . In other words, the inner tie layer 36 is generally softer than the perimeter tie layer 40 . In these embodiments, having different moduli is suitable for protecting PV cells 32 and interconnect strips 34 as described above. Additionally, the perimeter tie layer 40 can act as a spacer, as described above and described below. As mentioned above, the modulus can vary depending on the type of first polymeric composition and second polymeric composition utilized.

In certain embodiments, the peripheral connection layer 40 has a shear modulus of from about 15 to about 50, from about 17.5 to about 40, or from about 20 to about 30 kilopascals (kPa), and the internal tie layer 36 is sheared. The modulus of elasticity is from about 0.5 to about 12.5, from about 1 to about 10, from about 1 to about 7.5, from about 1 to about 5, or from about 1 to about 3 kPa, or between the lowest and highest of the values Any range. In other embodiments, the peripheral connection layer 40 has a shear modulus of from about 50 to about 2000, from about 50 to about 1750, from about 50 to about 1500, from about 50 to about 1250, from about 50 to about 1000, from about 50 to From about 750, from about 75 to about 600, from about 100 to about 500, from about 150 to about 450, from about 200 to about 400, or from about 200 to about 300 kPa, and the shear modulus of the inner tie layer 36 is as described , or any range between the lowest and highest of these values. In other embodiments, both the perimeter tie layer 40 and the inner tie layer 36 have a shear modulus of from about 50 to about 2000, from about 50 to about 1750, from about 50 to about 1500, from about 50 to about 1250, and about 50 to about 1000, from about 50 to about 750, from about 75 to about 600, from about 100 to about 500, from about 150 to about 450, from about 200 to about 400, or from about 200 to about 300 kPa, or in between Any range between the lowest and the highest. In such embodiments, the peripheral tie layer 40 may be formed first, even if it is cured, in order to subsequently retain the inner tie layer 36 in a wet or pre-cured state. As noted above, it is believed that the modulus of elasticity of the inner tie layer 36 helps maintain the orientation of the PV cells 32 when the module 20 is exposed to temperature changes (e.g., during thermal cycling, expansion/contraction, etc.).

As described above, between the inner connection layer 36 (and optionally the peripheral connection layer 40 ) and the cover sheet 30 and/or between the inner connection layer 36 (and optionally the peripheral connection layer 40 ) and the substrate 24 , There is at least one insertion layer (not shown). For example, there may be an intervening layer disposed between the inner connecting layer 36 and the peripheral connecting layer 40 and the substrate 24 . Such an insert layer is suitable for thickness and strength control of the module 20 . One example of a suitable insert layer is a non-woven fiberglass (FG) layer. If an intervening layer is included, the intervening layer can also be formed from other materials such as PET, nylon or polyoxyl. In some embodiments (not shown), the module 20 includes a non-woven FG layer disposed between the substrate 24 and the inner tie layer 36 and the peripheral tie layer 40 . Module 20 need not include such an insertion layer.

Module 20 can have a variety of shapes, sizes, and configurations. In certain embodiments, the module 20 has a length of from about 1.6 to about 2.0 meters and a width of from about 0.7 to about 1.1 meters (m), or any range between the lowest and highest of the values. Module 20 is not limited to any particular shape, length or width.

In other embodiments (not shown), the module 20 may further comprise a "polymerized strip" as described in U.S. Patent Application Serial No. 61/590,996, the entire disclosure of which is incorporated herein by reference. "Polymerized strips" as described in U.S. Patent Application Serial No. 61/59,1000 (Attorney Docket No. DC11226 PSP1; 071038.00811), the disclosure of which is hereby incorporated by the extent of The manner of full reference is incorporated herein. In the event of any inconsistency between the present invention and any of the incorporated references, the subject matter of any of the incorporated references should be The references incorporated herein are incorporated by reference.

The method of the present invention for forming the module 20 of the present invention comprises the steps of applying a first polymeric composition around the periphery of the front face 26 of the substrate 24 and/or the back face 34 of the cover sheet 30 to form a peripheral tie layer 40 on the faces 26 , 34 . . In particular, in certain embodiments, the first polymeric composition is applied around the perimeter of the front face 26 of the substrate 24 to form the peripheral tie layer 40 . In other embodiments, the first polymeric composition is applied around the perimeter of the backside 34 of the cover sheet 30 to form the perimeter tie layer 40 or portions thereof as described immediately below. In particular, in other embodiments, the first polymeric composition is also applied around the front face 30 of the substrate 24 and the periphery of the back face 34 of the cover sheet 30 to further form the remainder of the peripheral tie layer 40 .

During this coating stage, the peripheral tie layer 40 is typically in an uncured state, such as a liquid form, to facilitate ease of application. However, the first polymeric composition generally has sufficient body to prevent the outflow faces 26 , 34 and/or substantially maintain the shape of the peripheral tie layer 40 . The first polymeric composition can be applied to the faces 26 , 34 by various means, such as by spraying, dispensing, flow coating, injecting, and the like.

In other embodiments, the perimeter connection layer 40 or portions thereof are preformed and disposed on the faces 26 , 34 . For example, a polymer sheet can be made from a first polymeric composition and cut into strips to form a peripheral tie layer 40 , or a strip can be pre-made from the first polymeric composition and placed over the faces 26 , 34 to form a perimeter Connection layer 40 . In this or other embodiments, the perimeter tie layer 40 and the inner tie layer 36 can be formed from a first polymeric composition, a second polymeric composition, or a combination thereof. However, the peripheral tie layer 40 is typically formed (or disposed) prior to the inner tie layer 36 such that the perimeter tie layer 40 can retain the inner tie layer 36 that is still wet or pre-cured. For example, the inner tie layer 36 can be formed via a patterned and/or series polymerized composition, as further described below. In certain embodiments, the first polymeric composition is dispensed (or placed) on the faces 26 , 34 by a robot.

As shown in FIG. 5, the robotic dispenser 42 is shown to apply a first polymeric composition to both the cover sheet 30 and the substrate 24 . As noted above, the first polymeric composition can also be applied only to cover sheet 30 or substrate 24 , such as shown in FIG. The robotic dispenser 42 typically has one or more nozzles 44 from which the first polymeric composition is dispensed. Nozzles 44 can be selectively opened or closed to provide perimeter connection layers 40 of various widths. The nozzles 44 can also be controlled to provide perimeter connection layers 40 of various thicknesses, such as shown in FIG. Thus, one or more nozzles 44 can be used to form the perimeter connection layer 40 . The portions of the perimeter connection layer 40 can be formed independently or simultaneously, i.e., at the same or different times. The robotic dispenser 42 can be on a track and/or arm (not shown) and programmed to move along the length and/or width of the cover sheet 30 / substrate 24 to form the perimeter connection layer 40 . In the alternative, the cover sheet 30 / substrate 24 may also move relative to the robotic dispenser 42 or both may move relative to each other.

The first polymeric composition can be applied to the faces 26 , 34 in various amounts. For example, the first polymeric composition can be applied such that the peripheral tie layer 40 has an average width of from about 2.5 to about 150 mm and an average thickness of from about 0.25 to about 1.25 mm, or the lowest and highest of the equivalents. Any range between the people. If portions of the peripheral tie layer 40 are applied to each of the faces 26 , 34 , the portions can have the same or different thicknesses. In these embodiments, the thickness of the portions collectively define the thickness of the perimeter tie layer 40 as described above. For example, as shown in FIG. 5, the peripheral connection layer 40 is formed of two portions.

The method further includes the step of applying a second polymeric composition to the back side 34 of the cover sheet 30 to form the inner connecting layer 36 or portions thereof, as described below. During this coating stage, the inner tie layer 36 is typically in an uncured state, such as a liquid form, to facilitate ease of application. However, the second polymeric composition generally has sufficient body to prevent flow out of the back side 34 . The second polymeric composition can be applied to the back side 34 by various means, such as by spraying, dispensing, flow coating, injecting, and the like. In certain embodiments, the second polymeric composition is dispensed onto the back side 34 by a robot.

As shown in FIG. 5, the robotic dispenser 42 is shown to apply a second polymeric composition to both the cover sheet 30 and the substrate 24 . Portions of the inner connecting layer 36 may have the same or different thicknesses. In some embodiments, the portion of inner connection layer 36 between PV cell 32 and substrate 24 is thinner than the portion between PV cell 32 and cover sheet 30 . As described above, the second polymeric composition may also be applied only to the cover sheet 30 . The robotic dispenser 42 typically has one or more nozzles 44 from which the first polymeric composition is dispensed. Nozzles 44 can be selectively opened or closed to provide internal connection layers 36 of various thicknesses. One or more nozzles 44 can be used to form the inner tie layer 36 . The robotic dispenser 42 can be on a track and/or arm (not shown) and programmed to move along the length and/or width of the cover sheet 30 /substrate 24 to form the inner tie layer 36 . In the alternative, the cover sheet 30 / substrate 24 may also move relative to the robotic dispenser 42 or both may move relative to each other. The robotic dispenser 42 for the second polymeric composition can be the same or different than the robotic dispenser 42 for the first polymeric composition.

The second polymeric composition can be applied in various amounts to form the inner tie layer 36 . Typically, the second polymeric composition is applied such that the inner connecting layer 36 has an average thickness of from about 0.25 to about 1.25 mm or any range between such equivalents.

The peripheral tie layer 40 can retain the inner tie layer 36 if present during application of the second polymeric composition. For example, as shown in Figures 5 and 7, the polymeric composition can be applied simultaneously. Alternatively, one polymeric composition can be applied followed by another, such as shown in Figures 8 and 9. Although the cover sheet 30 is shown in FIGS. 6 through 9, the substrate 24 may have a similar coating step, that is, in FIGS. 6 through 9, the cover sheet 30 may be replaced with the substrate 24 . Various combinations of one or two polymeric compositions applied to one or both of the cover sheet 30 and the substrate 24 can be used to form the module 20 .

After the second polymeric composition is applied to the cover sheet 30 to form the inner tie layer 36 or portions thereof, the PV cells 32 are placed on the inner tie layer 36 . The inner tie layer 36 may be allowed to level before the PV cell 32 is placed to prevent gaps, voids or other problems. The PV cells 32 can be placed independently or simultaneously.

The PV cells 32 can be placed by various means, such as by hand or by a robotic gripper 46 . The robotic fixture 46 can hold the PV cell 32 using vacuum or other means. The robotic clamp 46 can be operatively coupled to a track and/or arm (not shown) for movement. PV cells can simply be placed on top of 32 inside layer 36 of connection to or slightly pressed into the inner layer 36 is connected. The pressing generally ensures that there are no gaps or voids between the inner connecting layer 36 and the PV cells 32 .

The inner tie layer 36 or portions thereof may be cured (to a final cured state or partially cured) before or after placement of the PV cells 32 . For example, the inner tie layer 36 can be cured via an oven prior to placement of the PV cell 32 . Connected to the inner layer 36 is generally applied to help heat the interior interconnect layer 36 from curing an uncured state to a final cured state. The perimeter tie layer 40 can also be cured prior to placement of the PV cells 32 , additionally or alternatively curing the interior tie layer 36 . The peripheral tie layer 40 can be cured before, after or simultaneously with the inner tie layer 36 . In certain embodiments, an additional amount of the first polymeric composition and the second polymeric composition can be applied to adequately seal the PV cell 32 , such as shown in FIG.

The method of the present invention may further comprise the step of applying a third polymeric composition to the front face 26 of the substrate 24 to further form the inner connecting layer 36 . The third polymeric composition can be the same as the second polymeric composition, such as shown in FIG. In other embodiments (not shown), the third polymeric composition can be the same as the first polymeric composition or can be different than the first polymeric composition and the second polymeric composition. For example, in some such embodiments, portions of the inner tie layer 36 disposed on the substrate 24 as shown in FIG. 5 will be swapped out with different layers formed from the third polymeric composition. The third polymeric composition can vary in various aspects, such as providing a modulus between the modulus provided by the first polymeric composition and the second polymeric composition. The third polymeric composition can be applied as described above for the first polymeric composition and the second polymeric composition. The third polymeric composition can be cured at different times. The third polymeric composition can be polyfluorene. The inner tie layer 36 can be cured before or after application of the third polymeric composition, if employed.

The method of the present invention may further comprise the step of coating a fourth polymeric composition on the PV cell 32 to further form the interconnect layer 36 . The fourth polymeric composition can be coated and or substituted for the third polymeric composition. The fourth polymeric composition can be the same as the first polymeric composition, the same as the second polymeric composition, or different from the first polymeric composition, the second polymeric composition, and the third polymeric composition. The fourth polymeric composition can vary in various aspects, such as providing a modulus between the modulus of the first polymeric composition and the second polymeric composition. The fourth polymeric composition can be applied as described above for the first polymeric composition and the second polymeric composition. The fourth polymeric composition can be cured at different times. In certain embodiments, the fourth polymeric composition comprises a polyoxygenated oil. The fourth polymeric composition can be used to ensure that bubbles are not trapped between the PV cell 32 and the internal tie layer 36 . The inner tie layer 36 can be cured before or after application of the fourth polymeric composition, if employed.

Substrate 24 and cover sheet 30 are combined to form module 20 after all of the polymeric composition has been applied. The substrate 24 and the cover sheet 30 can be combined in various ways. For example, the substrate 24 can be placed on the connection layers 36 , 40 to form the module 20 . As shown in FIG. 5, the substrate 24 and the cover sheet 30 can be pressed together to form the module 20 . As also shown, the perimeter connection layer 40 and the inner connection layer 36 are sandwiched between the substrate 24 and the cover sheet 30 , wherein the PV cells 32 are sealed by the inner connection layer 36 . The inner tie layer 36 can also have portions formed from a third polymeric composition and/or a fourth polymeric composition as described above. One or both of the tie layers 36 , 40 can be cured. Typically, the perimeter tie layer 40 is cured at least prior to pressing the module 20 .

In certain embodiments, the inner layer 36 is generally connected to a certain combination of viscosity in the substrate 30 and the cover sheet 24, this may allow any air trapped within the interior interconnect layer 36 / layer 36 is connected by an internal self wherein the outwardly entrapping migrate. In this way, bubbles are not formed and/or trapped because the bubbles may cause problems for the module 20 . The viscosity may be the initial viscosity of the second polymeric composition (i.e., prior to curing) or the higher viscosity that occurs after the inner tie layer 36 is at least partially cured. Although not required, these embodiments are applicable to the case where the module 20 is cured via a vacuum-pressure process. If the peripheral tie layer 40 has now solidified, air can still escape, such as around and/or via the substrate 24 , such as a non-woven FG layer.

The polyoxymethylene composition used to form tie layers 36 and 40 typically has a complex (dynamic) viscosity of 10,000 to 5,000,000 cP (measured at 1 ° to 5% strain at 1 radians/second at 25 ° C). More specifically, a frequency sweep was generated on a TA Instruments HR-2 parallel plate rheometer. The sample was loaded between two 25 mm parallel plates to a thickness of 2 mm. The frequency sweep was performed at 5% strain from 0.1 radians/sec to 100 radians/sec, and the dynamic (plural) viscosity (cP) was reported at 1 radians/sec. In other embodiments, the complex viscosity as measured above at 25 ° C is from 15,000 to 100,000, 20,000 to 95,000, 25,000 to 90,000, 30,000 to 85,000, 35,000 to 75,000, 40,000 to 70,000, 45,000 to 65,000, 50,000 to 60,000, or 55,000 to 60,000 cP. In other embodiments, the complex viscosity as measured above at 25 °C is 50,000 to 100,000, 55,000 to 95,000, 60,000 to 90,000, 65,000 to 85,000, 70,000 to 80,000, or 75,000 to 80,000 cP.

In other embodiments, the complex viscosity as measured above at 25 ° C is from 35,000 to 300,000, 40,000 to 295,000, 45,000 to 290,000, 50,000 to 285,000, 55,000 to 280,000, 60,000 to 275,000, 65,000 to 275,000, 70,000 to 270,000, 75,000 to 265,000, 80,000 to 260,000, 85,000 to 255,000, 90,000 to 250,000, 95,000 to 245,000, 100,000 to 240,000, 105,000 to 235,000, 110,000 to 230,000, 115,000 to 225,000, 120,000 to 220,000, 125,000 to 215,000, 130,000 to 210,000, 135,000 to 205,000, 140,000 to 200,000, 145,000 to 195,000, 150,000 to 190,000, 155,000 to 185,000, 160,000 to 180,000, 165,000 to 175,000 or 165,000 to 170,000, 80,000 to 200,000, 40,000 to 200,000, or 40,000 to 300,000 cP.

In other embodiments, the complex viscosity as measured above at 25 ° C is 100,000 to 1,000,000, 125,000 to 975,000, 150,000 to 950,000, 175,000 to 925,000, 200,000 to 900,000, 225,000 to 875,000, 250,000 to 850,000, 275,000 to 825,000, 300,000 to 800,000, 325,000 to 775,000, 350,000 to 750,000, 375,000 to 725,000, 400,000 to 700,000, 425,000 to 675,000, 450,000 to 650,000, 475,000 to 625,000, 500,000 to 600,000, 525,000 to 575,000, or 550,000 to 575,000 cP.

In even other embodiments, the complex viscosity as measured above, at 25 ° C, is 1,125,000 to 1,975,000, 1,150,000 to 1,950,000, 1,175,000 to 1,925,000, 1,200,000 to 1,900,000, 1,225,000 to 1,875,000, 1,250,000. To 1,850,000, 1,275,000 to 1,825,000, 1,300,000 to 1,800,000, 1,325,000 to 1,775,000, 1,350,000 to 1,750,000, 1,375,000 to 1,725,000, 1,400,000 to 1,700,000, 1,425,000 to 1,675,000, 1,450,000 to 1,650,000, 1,475,000 to 1,625,000, 1,500,000 to 1,600,000, 1,525,000 to 1,575,000, 1,550,000 to 1,575,000 2,125,000 to 2,975,000, 2,150,000 to 2,950,000, 2,175,000 to 2,925,000, 2,200,000 to 2,900,000, 2,225,000 to 2,875,000, 2,250,000 to 2,850,000, 2,275,000 to 2,825,000, 2,300,000 to 2,800,000, 2,325,000 to 2,775,000, 2,350,000 to 2,750,000, 2,375,000 to 2,725,000, 2,400,000 to 2,700,000, 2,425,000 To 2,675,000, 2,450,000 to 2,650,000, 2,475,000 to 2,625,000, 2,500,000 to 2,600,000, 2,525,000 to 2,575,000, 2,550,000 to 2,575,000, 3,125,000 to 3,975,000, 3,150,000 to 3,950,000, 3,175,000 to 3,925,000, 3,200,000 to 3,900,000, 3,225,000 to 3,875,000, 3,250,000 to 3,850,000, 3,275,000 to 3,825,000 , 3,300,000 to 3,800,000, 3,325,000 to 3,775,000, 3,350,000 to 3,750,000, 3,375,000 to 3,725,000, 3 , 400,000 to 3,700,000, 3,425,000 to 3,675,000, 3,450,000 to 3,650,000, 3,475,000 to 3,625,000, 3,500,000 to 3,600,000, 3,525,000 to 3,575,000, 3,550,000 to 3,575,000, 4,125,000 to 4,975,000, 4,150,000 to 4,950,000, 4,175,000 to 4,925,000, 4,200,000 to 4,900,000, 4,225,000 to 4,875,000, 4,250,000 To 4,850,000, 4,275,000 to 4,825,000, 4,300,000 to 4,800,000, 4,325,000 to 4,775,000, 4,350,000 to 4,750,000, 4,375,000 to 4,725,000, 4,400,000 to 4,700,000, 4,425,000 to 4,675,000, 4,450,000 to 4,650,000, 4,475,000 to 4,625,000, 4,500,000 to 4,600,000, 4,525,000 to 4,575,000, or 4,550,000 to 4,575,000 cP.

Any one or more of the above values can be increased by an order of magnitude. Just as an example, gather The oxygenated composition can have a complex viscosity of 10,000 to 50,000,000 cP (measured at 25 ° C as described above). In various non-limiting embodiments, any of the above values can vary, for example, by 1%, 2%, 3%, 4%, 5%, 10%, 15%, 20%, or 25+%. Accordingly, all values and ranges of values between the above values and including the above are also explicitly included in the various non-limiting embodiments. The above viscosity is the complex viscosity of the polyoxymethylene composition prior to curing. After curing, the curing reaction product is typically a solid, but may also be a gel.

In various embodiments, the second polymeric composition is coated to define at least one extends from module 20 to module 20 inside the periphery of the channel (not shown) is patterned to form an interior interconnect layer 36. The pattern is not particularly limited and may be further described as a geometric, non-geometric, uniform or non-uniform pattern. In one embodiment, the polyoxymethylene composition is deposited in one, two or a plurality of columns. One or more columns may be disposed to be substantially parallel or intersect (ie, at an angle) with one or more other columns. For example, the channels formed by the polyoxo compositions can extend to opposite or different locations on the periphery of the module 20 . This can be achieved based on the configuration of one or more columns of polyoxynoxy compositions.

In other embodiments, patterning can be used with or in place of the second polymeric composition. In general, patterning is suitable for the more viscous/heavier of the two polymeric compositions. Other examples of suitable patterning/patterning methods and their benefits include those described in the '277 application incorporated.

The passage is also not subject to any special restrictions. Typically, the channels are defined on two or more sides by depositing a polyoxymethylene composition. Channels may alternatively be described as conduits, ducts, flutings, furrows, gouges, grooves, gutters, passes. , passage, trough, channel, lane, opening, or path.

Internal passage 20 extends from module to module 20 outside (e.g., external), and may be any module 20 starting from the inside of the point. The channel can extend across the entire interior or across a portion of the interior. The channels may extend to two or more points or a single point on the periphery of the module 20 . A channel may be further defined as one, two, or a plurality of individual channels that may or may not be connected to each other in one or more portions. Air (e.g., from air bubbles) may be merged together in the deposited channel-defined polyoxo composition to fill the channels and thereby pass through the channels to the periphery of the module 20 prior to eliminating the channels. Typically, the channels are defined such that air can pass through the channels and exit the module 20 to reduce or eliminate the presence of one or more layers, such as any bubbles in the inner tie layer 36 . In other words, the channel typically allows the interior air from module 20 (e.g. from the center) toward the periphery of module 20 (e.g., an edge) flows, whereby the module 20 in any entrapped in the assembly of an air layer or minus one or more To the minimum.

Pressure and/or heat may be applied to the module 20 during and/or after assembly of the substrate 24 and the cover sheet 30 for a period of time to further form the module 20 . If both pressure and heat are employed, pressure and heat can be applied independently or simultaneously. Applying heat is suitable for curing the tie layer 36 to a final cured state. These steps may be referred to as pressure curing or lamination in the art. Examples of suitable lamination techniques include vacuum or atmospheric pressure lamination, and may include the application of heat. Specific examples of such processes (e.g., vacuum lamination) and other optional steps are described in some of the incorporated references.

In some embodiments, the module 20 is formed with the application of heat. Suitable temperatures are from about 20 to about 200, from about 40 to about 150, or from about 70 to about 110 ° C, or any range between the lowest and highest of such values.

In some embodiments, the module 20 is formed under application of pressure. For example, pressure can be applied to the module 20 via a bladder press. Other devices may also be used to apply pressure to form the module 20 . Suitable pressures are from about 7 to about 350, from about 20 to about 200, or from about 30 to about 140 kPa, or any range between the lowest and highest of such values. Various combinations of temperature and pressure may be used, or only one of temperature and pressure may be used to form module 20 .

As described above, the perimeter connection layer 40 can act as a spacer that is suitable for use during module 20 fabrication. In particular, after the pressure is withdrawn from the module 20 , the peripheral connection layer 40 compensates for the rebound. In other words, the perimeter connection layer 40 helps minimize the degree of deflection of the substrate 24 and/or the cover sheet 30 at the edges and corners of the module 20 during application and removal of pressure from the module 20 . This is especially true when both the substrate 24 and the cover sheet 30 are formed of glass. The peripheral tie layer 40 also provides a layer of material that is obtained by the pressure that may be applied to the module 20 when the substrate 24 and/or cover sheet 30 has been applied to the module 20 from pressure (e.g., after lamination) or during use. Providing a compressible tie layer at the interface with which it can be moved while relaxing can substantially prevent cohesive failure of the substrate 24 and/or the cover sheet 30 caused by the inner tie layer 36 . The perimeter tie layer 40 also prevents the PV cells 32 and the interconnect strips 34 from bottoming out, as described above. Thus, the perimeter connection layer 40 can also provide a thinner inner connection layer 36 , particularly between the substrate 24 and the PV cells 32 .

One or more of the above values may vary by ±5%, ±10%, ±15%, ±20%, ±25%, etc., as long as the deviation is still within the scope of the present invention. Unexpected results are available to members of the Markush group and are not related to all other members. Each member may be individually and/or in combination and provide sufficient support for a particular embodiment within the scope of the appended claims. The subject matter of all combinations of independent and subsidiary claims (single and multiple affiliates) is expressly covered herein. The present invention is intended to be illustrative, and not restrictive. Many modifications and variations of the present invention are possible in the light of the teachings herein.

20‧‧‧Photovoltaic battery module/module

24‧‧‧Substrate/back cover

26‧‧‧Before the substrate

28‧‧‧Back of the substrate

30‧‧‧ Covering film

32‧‧‧Before the cover sheet/photovoltaic battery

34‧‧‧Back of the cover sheet / interconnection strip

36‧‧‧Internal connection layer

38‧‧‧The surrounding edge of the inner connecting layer

40‧‧‧ Peripheral connection layer

Claims (15)

A method for forming a photovoltaic (PV) battery module, the photovoltaic battery module comprising a substrate having a front surface and a back surface, the back surface being spaced apart from the front surface; a cover sheet having a front surface and a back surface The back surface is spaced apart from the front surface of the cover sheet; an inner connecting layer is disposed between the substrate and the cover sheet to couple the back surface of the cover sheet to the front surface of the substrate, wherein the inner connection The layer has a peripheral edge; at least one PV cell disposed within the inner connecting layer; and a peripheral connecting layer disposed between the substrate and the cover sheet and disposed around the peripheral edge of the inner connecting layer a peripheral portion for further coupling the back surface of the cover sheet and the front surface of the substrate, the method comprising the steps of: coating the first surface of the front surface of the substrate and/or ii) the back surface of the back surface of the cover sheet Polymerizing the composition to form the peripheral tie layer in an uncured state on the (equal) side; optionally curing the peripheral tie layer to a cured state; ii) the backside coating of the cover sheet is different from the a second polymeric composition of a polymeric composition to form the inner tie layer in an uncured state; optionally curing the inner tie layer to a cured state; placing the PV cell in the second polymeric composition Coating the formed inner connecting layer; and combining the substrate and the cover sheet to form the PV battery module such that the peripheral connecting layer and the inner connecting layer are sandwiched between the substrate and the cover sheet, wherein the PV The battery is sealed by the inner connecting layer. The method of claim 1, wherein: a) the peripheral connection layer has a modulus of elasticity greater than the modulus of elasticity of the inner connection layer; b) the peripheral connection layer has an elastic modulus of from about 15 to about 50 kPa. And the interior The connecting layer has an elastic modulus of from about 0.5 to about 12.5 kPa; c) the peripheral connecting layer has an elastic modulus of from about 50 to about 2000 kilopascals (kPa) and the inner connecting layer has an elastic modulus of from about 0.5 to about 12.5. kPa; d) both a) and b); e) both a) and c); or f) the peripheral connection layer has an elastic modulus of from about 50 to about 2000 kilopascals (kPa) and the inner tie layer The modulus of elasticity is from about 50 to about 2000 kPa. The method of claim 1, wherein the first polymeric composition is: a) coated around the perimeter of ii) the backside of the cover sheet to form the perimeter tie layer; and/or b) surrounds i) the substrate The perimeter of the front face is coated to form the perimeter tie layer. The method of claim 1, wherein: a) curing the peripheral tie layer prior to applying the second polymeric composition; b) curing the peripheral tie layer prior to combining the substrate with the cover sheet; and/or c The internal tie layer is cured prior to placement of the PV cell. The method of claim 1, further comprising the steps of: applying pressure to the PV battery module for a period of time during and/or after combining the substrate and the cover sheet to further form the PV battery module; and/ Or applying heat to the PV cell module for a period of time during and/or after combining the substrate with the cover sheet to further form the PV cell module. The method of claim 1, wherein: a) the coating step is further defined as dispensing the polymeric composition via a robotic dispenser; and/or b) the curing step is further defined as applying heat to the layer It helps to cure the tie layer from the uncured state to the cured state. The method of claim 1, wherein: a) coating the first polymeric composition such that the peripheral tie layer has an average width of from about 2.5 to about 150 millimeters (mm) and an average thickness of from about 0.25 to about 1.25 mm; And/or b) coating the second polymeric composition such that the inner tie layer has an average thickness of from about 0.25 to about 1.25 mm. The method of claim 1, wherein: a) the cover sheet is formed of glass; and/or b) the substrate is formed of glass. The method of claim 1, wherein the first polymeric composition and the second polymeric composition are each a hydrazine hydrogenation curable polydecaneoxy composition. The method of claim 1, wherein: a) the first polymeric composition comprises greater than about 55 parts by weight of a diorganopolyoxyalkylene having an alkenyl group and from about 5 to about 25 parts by weight of the diorganopolyoxyalkylene oxide a hydrogenated organic hydrazine having a reactive hydrazine-bonded hydrogen atom, each of which is based on 100 parts by weight of the first polymeric composition; and/or b) the second polymeric composition comprising greater than about 45 parts by weight of an alkenyl group An organopolyoxyalkylene, about 2.5 to about 7.5 parts by weight of a hydrogenated organic hydrazine having a hydrazine-bonded hydrogen atom reactive with the diorganopolysiloxane, and from about 25 to about 65 parts by weight of an unreactive organopolyoxyl The alkane, each of which is based on 100 parts by weight of the second polymeric composition. The method of any one of claims 1 to 10, wherein the first polymeric composition comprises: i) dimethyl vinyl terminated polydimethyl siloxane, dimethyl hydrogen terminated polydimethyl hydrazine Oxyalkane and trimethyldecyloxy-terminated dimethylmethylhydroquinone containing at least 3 SiH units per molecule; or ii) dimethylvinyl-terminated polydimethyloxane and per molecule Trimethyldecyloxy-terminated dimethylmethylhydroquinone containing at least 3 SiH units. The method of claim 11, wherein the second polymeric composition comprises: two different dimethyl vinyl terminated polydimethyl siloxanes; dimethyl hydrogen terminated polydimethyl siloxane; Trimethyldecyloxy-terminated dimethylmethylhydroquinone per molecule containing at least 3 SiH units. A photovoltaic (PV) battery module comprising: a substrate having a front surface and a back surface, the back surface being spaced apart from the front surface; a cover sheet having a front surface and a back surface, the back surface and the back sheet The front surface is spaced apart; an inner connecting layer is disposed between the substrate and the cover sheet to couple the back surface of the cover sheet and the front surface of the substrate, wherein the inner connecting layer has a peripheral edge; at least one a PV cell disposed within the internal connection layer; and a peripheral connection layer disposed between the substrate and the cover sheet, and surrounding the peripheral edge of the internal connection layer at a periphery for further coupling The back side of the cover sheet and the front side of the substrate; wherein the peripheral tie layer is formed from a first polymeric composition, and the inner tie layer is formed from a second polymeric composition different from the first polymeric composition; The elastic modulus of the peripheral connecting layer is greater than the elastic modulus of the inner connecting layer. The module of claim 13, wherein: a) the peripheral tie layer abuts the peripheral edge of the inner tie layer; and/or b) the first polymerizable composition and the second polymerizable composition are each a hydrogenation reaction The polyoxymethylene composition is cured. The module of claim 13, wherein: a) the elastic modulus of the peripheral connecting layer is greater than the elastic modulus of the inner connecting layer; b) the peripheral connection layer has an elastic modulus of from about 15 to about 50 kPa and the internal connection layer has an elastic modulus of from about 0.5 to about 12.5 kPa; c) the peripheral connection layer has an elastic modulus of about 50 to about 2000 kPa and the internal connection layer has a modulus of elasticity of from about 0.5 to about 12.5 kPa; d) both a) and b); e) both a) and c); or f) The peripheral connecting layer has an elastic modulus of from about 50 to about 2000 kilopascals (kPa) and the inner connecting layer has an elastic modulus of from about 50 to about 2000 kPa.