TW201347105A - Integrated circuit structure and method for designing an interposer - Google Patents

Integrated circuit structure and method for designing an interposer Download PDF

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TW201347105A
TW201347105A TW102111828A TW102111828A TW201347105A TW 201347105 A TW201347105 A TW 201347105A TW 102111828 A TW102111828 A TW 102111828A TW 102111828 A TW102111828 A TW 102111828A TW 201347105 A TW201347105 A TW 201347105A
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interposer
forbidden
region
active
integrated circuit
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TW102111828A
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TWI515839B (en
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Shih-Wei Liang
Kai-Chiang Wu
Ming-Kai Liu
Chia-Chun Miao
Chun-Lin Lu
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Taiwan Semiconductor Mfg
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes)
    • H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes) consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/30—Circuit design
    • G06F30/39—Circuit design at the physical level
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76898—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics formed through a semiconductor substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/147—Semiconductor insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Evolutionary Computation (AREA)
  • Geometry (AREA)
  • General Engineering & Computer Science (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

A structure includes a substrate having a plurality of balls, a semiconductor chip, and an interposer electrically connecting the substrate and the semiconductor chip. The interposer includes a first side, a second side opposite the first side, at least one first exclusion zone, wherein the at least one first exclusion zone extends through the interposer above each ball of the plurality of balls, at least one active through via extending from the first side of the interposer to the second side of the interposer, wherein the at least one active through via is formed outside the at least one first exclusion zone and wherein no active through vias are formed within the at least one first exclusion zone, and at least one dummy through via extending from the first side of the interposer to the second side of the interposer, wherein the at least one dummy through via is formed within the at least one first exclusion zone.

Description

積體電路結構及中介層的設計方法 Integrated circuit structure and design method of interposer

本發明係有關於積體電路結構，特別有關於含有中介層的層疊封裝結構。 The present invention relates to an integrated circuit structure, and more particularly to a stacked package structure including an interposer.

從積體電路發展至今，由於各種電子元件，例如電晶體、二極體、電阻器、電容器等在集成密度上的持續改進，半導體工業經歷了持續快速的成長。在集成密度上的改進大多數來自於最小特徵尺寸的重複縮減，藉此可讓更多的元件被整合在特定的面積內。 Since the development of integrated circuits, the semiconductor industry has experienced sustained and rapid growth due to continuous improvement in integration density of various electronic components such as transistors, diodes, resistors, capacitors, and the like. Most of the improvements in integration density come from repeated reductions in the minimum feature size, which allows more components to be integrated into a specific area.

這些在集成密度上的改進實質上是二維(two-dimensional：2D)的，其中積體元件佔據的區域實質上是在半導體晶圓的表面。積體電路增加的密度以及相對減少的面積通常並非將積體電路晶片直接接合在基底上的能力所能辦到，因此，目前使用中介層(interposer)將晶片的焊球接觸區重分佈至中介層的較大區域上，更進一步地，中介層可以容許含有多個晶片的三維(three dimensional：3D)封裝。 These improvements in integration density are essentially two-dimensional (2D), where the area occupied by the integrated components is substantially at the surface of the semiconductor wafer. The increased density and relatively reduced area of the integrated circuit is generally not the ability to directly bond the integrated circuit wafer to the substrate. Therefore, an interposer is currently used to redistribute the solder ball contact area of the wafer to the intermediary. Further on the larger area of the layer, the interposer may allow a three dimensional (3D) package containing a plurality of wafers.

將晶片的焊球接觸區重分佈至中介層的較大區域上會在中介層的貫穿導通孔內導入因高度熱膨脹係數(coefficient of thermal expansion；CTE)不匹配而產生的應力，此熱膨脹係數不匹配所產生的應力會在中介層內產生缺陷，造 成有缺陷的中介層，並且最終導致含有這些有缺陷的中介層的封裝失效，因此，業界亟需一種改善的封裝系統。 Redistributing the solder ball contact area of the wafer to a larger area of the interposer introduces a stress due to a coefficient of thermal expansion (CTE) mismatch in the through via of the interposer. This coefficient of thermal expansion is not The stress generated by the matching will cause defects in the interposer. It becomes a defective interposer and eventually causes the package containing these defective interposers to fail. Therefore, there is an urgent need for an improved packaging system.

本發明之一實施例提供積體電路結構，包括：具有複數個焊球的基底、半導體晶片以及電性連接基底與半導體晶片的中介層。中介層包括：第一側；與第一側相反的第二側；至少一第一禁止區，其中至少一第一禁止區穿過中介層延伸至這些焊球的每一個焊球上方；至少一主動貫穿導通孔，從中介層的第一側延伸至中介層的第二側，其中至少一主動貫穿導通孔在至少一第一禁止區以外形成，且其中在至少一第一禁止區內無主動貫穿導通孔形成；以及至少一第一偽貫穿導通孔，從中介層的第一側延伸至中介層的第二側，其中至少一第一偽貫穿導通孔在至少一第一禁止區內形成。 An embodiment of the present invention provides an integrated circuit structure including: a substrate having a plurality of solder balls, a semiconductor wafer, and an interposer electrically connecting the substrate and the semiconductor wafer. The interposer includes: a first side; a second side opposite to the first side; at least one first forbidden area, wherein at least one first forbidden area extends through the interposer to each of the solder balls of the solder balls; at least one Actively extending through the via hole from the first side of the interposer to the second side of the interposer, wherein at least one active through via is formed outside the at least one first forbidden region, and wherein there is no active in the at least one first forbidden region And the at least one first dummy through via extends from the first side of the interposer to the second side of the interposer, wherein the at least one first dummy via is formed in the at least one first inhibit region.

本發明之一實施例提供中介層，包括：第一側；與第一側相反的第二側；至少一第一禁止區，其中至少一第一禁止區穿過中介層延伸至接受至少一焊球的至少一區域上方；至少一主動貫穿導通孔，從中介層的第一側延伸至中介層的第二側，其中至少一主動貫穿導通孔在至少一第一禁止區以外形成，且其中在至少一第一禁止區內無主動貫穿導通孔形成；以及至少一偽貫穿導通孔，從中介層的第一側延伸至中介層的第二側，其中至少一偽貫穿導通孔在至少一第一禁止區內形成。 An embodiment of the present invention provides an interposer comprising: a first side; a second side opposite the first side; at least one first forbidden area, wherein the at least one first prohibited area extends through the interposer to receive at least one solder Above at least one region of the ball; at least one active through via extending from a first side of the interposer to a second side of the interposer, wherein at least one active through via is formed outside of the at least one first exclusion region, and wherein And at least one dummy through via is formed from the first side of the interposer to the second side of the interposer, wherein the at least one pseudo through via is at least one first Formed within the prohibited zone.

本發明之一實施例還提供中介層的設計方法，此方法包括：決定在中介層內的球柵陣列區；決定在中介層內的 至少一第一禁止區，其中至少一第一禁止區係按照球柵陣列區，從中介層的第一側延伸至中介層的第二側；決定至少一主動貫穿導通孔的放置，其係從中介層的第一側延伸至中介層的第二側，其中至少一主動貫穿導通孔放置在至少一第一禁止區以外，且其中在至少一第一禁止區內無主動貫穿導通孔放置；以及決定至少一第一偽貫穿導通孔的放置，其係從中介層的第一側延伸至中介層的第二側，其中至少一第一偽貫穿導通孔放置在至少一第一禁止區內。 An embodiment of the present invention further provides a method for designing an interposer, the method comprising: determining a ball grid array region in the interposer; determining in the interposer At least one first forbidden zone, wherein at least one first forbidden zone extends from the first side of the interposer to the second side of the interposer according to the ball grid array region; determining at least one active through via hole placement The first side of the interposer extends to the second side of the interposer, wherein at least one active through via is disposed outside the at least one first forbidden region, and wherein no active through via is disposed in the at least one first inhibited region; Determining placement of at least one first dummy through via extending from a first side of the interposer to a second side of the interposer, wherein at least one first dummy via is disposed in the at least one first inhibit region.

100‧‧‧層疊封裝(PoP)結構 100‧‧‧Layered Package (PoP) Structure

102‧‧‧中介層 102‧‧‧Intermediary

104‧‧‧球柵陣列(BGA)焊球 104‧‧‧Ball Grid Array (BGA) solder balls

106、116‧‧‧禁止區 106, 116‧‧ ‧ prohibited area

108‧‧‧主動貫穿導通孔 108‧‧‧Active through-holes

110‧‧‧偽貫穿導通孔 110‧‧‧Pseudo-through vias

112‧‧‧金屬化層 112‧‧‧metallization

114‧‧‧能控制塌陷的晶片連接凸塊(C4 bumps) 114‧‧‧Can control collapsed wafer connection bumps (C4 bumps)

118‧‧‧晶片 118‧‧‧ wafer

222‧‧‧中介層的第一側 222‧‧‧ first side of the interposer

224‧‧‧中介層的第二側 224‧‧‧ second side of the interposer

226、232‧‧‧第一層間介電層 226, 232‧‧‧ first interlayer dielectric layer

228、234‧‧‧第二層間介電層 228, 234‧‧‧Second interlayer dielectric layer

220、230‧‧‧凸塊下金屬化層 220, 230‧‧‧ under bump metallization

為了讓本揭示之目的、特徵、及優點能更明顯易懂，以下配合所附圖式作詳細說明如下：第1圖顯示依據一實施例，層疊封裝(PoP)結構的上視圖；以及第2圖顯示沿著第1圖的線2-2，第1圖的層疊封裝(PoP)結構的剖面圖。 In order to make the objects, features, and advantages of the present disclosure more comprehensible, the following description will be described in detail with reference to the accompanying drawings in which: FIG. 1 shows a top view of a layered package (PoP) structure according to an embodiment; The figure shows a cross-sectional view of the package-on-package (PoP) structure of Fig. 1 along line 2-2 of Fig. 1.

以下詳述各實施例的製造與使用，然而，可以理解的是，本揭示提供許多可應用的發明概念，其可以在各種不同的特定領域中實施，在此所討論的特定實施例僅用於說明在此揭示的實施例之製造與使用的特定方式，並非用於限定不同實施例的範圍。 The making and using of the various embodiments are detailed below, however, it will be appreciated that the present disclosure provides many applicable inventive concepts that can be implemented in a variety of different specific fields, and the specific embodiments discussed herein are only used The specific manner of making and using the embodiments disclosed herein is not intended to limit the scope of the various embodiments.

以下描述的實施例係關於層疊封裝(Package on Package；PoP)結構，其包含連接具有球柵陣列(ball grid array； BGA)的基底與帶有能控制塌陷的晶片連接凸塊(controlled collapse chip connection(C4)bumps)的晶片之中介層。此外，也可以應用在其他結構的實施例上，例如貫穿中介層堆疊(through interposer stacking；TIS)結構，其包含連接具有能控制塌陷的晶片連接凸塊(C4 bumps)的基底與帶有微凸塊(micro bumps；μbumps)的晶片之中介層。 The embodiments described below relate to a package on package (PoP) structure including a connection having a ball grid array; The substrate of the BGA) is interposed with a wafer with controlled collapse chip connection (C4) bumps. In addition, it can also be applied to other structural embodiments, such as through interposer stacking (TIS) structures, which include a substrate with microbumps connected to a wafer connection bump (C4 bumps) capable of controlling collapse. The interposer of the wafer of micro bumps (μbumps).

參閱第1及2圖，其分別顯示依據一實施例之層疊封裝(PoP)結構100的上視圖，以及沿著第1圖的線2-2，層疊封裝(PoP)結構100的剖面圖。層疊封裝(PoP)結構100包含中介層102，其電性連接下方的基底(未繪出)與晶片118，此電性連接係經由在中介層102內形成的主動貫穿導通孔(active through visa)108而達成，此外，在中介層102內還形成偽貫穿導通孔(dummy through visa)110，使得中介層102內的應力達到更均勻地分佈。 Referring to Figures 1 and 2, there are shown top views of a package-on-package (PoP) structure 100 in accordance with an embodiment, and a cross-sectional view of a package-on-package (PoP) structure 100 along line 2-2 of Figure 1. The package-on-package (PoP) structure 100 includes an interposer 102 electrically connected to a lower substrate (not shown) and a wafer 118 via an active through visa formed in the interposer 102. In addition, a dummy through visa 110 is formed in the interposer 102 such that the stress in the interposer 102 is more evenly distributed.

在一實施例中，下方的基底係藉由球柵陣列(BGA)焊球104與中介層102電性連接，並且球柵陣列(BGA)焊球104與凸塊下金屬化層(under bump metallization(UBM)layer)230連接。此外，下方的基底也可以藉由例如貫穿基底的導通孔(through substrate via；TSV)或其他貫穿的導通孔與中介層102連接。在此實施例中，球柵陣列(BGA)焊球104的直徑較佳為約200μm至500μm，更佳為約200μm至300μm，球柵陣列(BGA)焊球104的間距(pitch)較佳為約300μm至500μm，更佳為約400μm至500μm。 In one embodiment, the underlying substrate is electrically connected to the interposer 102 by a ball grid array (BGA) solder ball 104, and the ball grid array (BGA) solder ball 104 and the under bump metallization layer (under bump metallization) (UBM) layer) 230 connection. In addition, the underlying substrate may also be connected to the interposer 102 by, for example, a through substrate via (TSV) or other through vias. In this embodiment, the diameter of the ball grid array (BGA) solder ball 104 is preferably from about 200 μm to 500 μm, more preferably from about 200 μm to 300 μm, and the pitch of the ball grid array (BGA) solder ball 104 is preferably It is about 300 μm to 500 μm, more preferably about 400 μm to 500 μm.

在一實施例中，晶片118係藉由在凸塊下金屬化 層(UBM layer)220上方形成的能控制塌陷的晶片連接凸塊(C4 bumps)114與中介層102電性連接，此外，晶片118也可以藉由例如微凸塊(μbumps)或銅柱(copper pillars)與中介層102電性連接。在此實施例中，能控制塌陷的晶片連接凸塊(C4 bumps)114的直徑較佳為約20μm至100μm，能控制塌陷的晶片連接凸塊(C4 bumps)114的間距較佳為小於約200μm，並且更佳為約100μm。 In one embodiment, the wafer 118 is metallized under the bumps. The bump-connecting wafer connection bumps (C4 bumps) 114 formed over the UBM layer 220 are electrically connected to the interposer 102. Further, the wafers 118 may also be formed by, for example, microbumps or copper pillars. Pillars) are electrically connected to the interposer 102. In this embodiment, the diameter of the wafer bonding bumps (C4 bumps) 114 capable of controlling collapse is preferably about 20 μm to 100 μm, and the pitch of the wafer bonding bumps (C4 bumps) 114 capable of controlling collapse is preferably less than about 200 μm. And more preferably about 100 μm.

在層疊封裝(PoP)結構100內的各種材料具有不同的熱膨脹係數(CTE)，例如球柵陣列(BGA)焊球104與中介層102之間具有不同的熱膨脹係數，以及能控制塌陷的晶片連接凸塊(C4 bumps)114與中介層102之間具有不同的熱膨脹係數，這些不同的熱膨脹係數會在中介層102內，特別是在應力集中區域內因熱膨脹係數不匹配而產生應力，此熱膨脹係數不匹配產生的應力實質上集中在球柵陣列(BGA)焊球104的上方以及能控制塌陷的晶片連接凸塊(C4 bumps)114的下方。為了降低此高熱膨脹係數不匹配引發的應力在主動貫穿導通孔108上所造成的效應，主動貫穿導通孔108在應力集中區以外的區域形成，更特別的是，主動貫穿導通孔108在如第1圖中所示之稱為禁止區(exclusion zones)106和116的範圍以外形成，禁止區106的範圍比球柵陣列(BGA)焊球104的直徑大了將近20%至30%，並且禁止區116比能控制塌陷的晶片連接凸塊(C4 bumps)114的直徑大了將近10%至20%。 The various materials within the package-on-package (PoP) structure 100 have different coefficients of thermal expansion (CTE), such as ball grid array (BGA) solder balls 104 and interposer 102 having different coefficients of thermal expansion, and wafer connections that can control collapse. The bumps (C4 bumps) 114 and the interposer 102 have different coefficients of thermal expansion. These different coefficients of thermal expansion may cause stresses in the interposer 102, particularly in the region of stress concentration due to a mismatch in thermal expansion coefficients, and the coefficient of thermal expansion is not The stress generated by the matching is substantially concentrated above the ball grid array (BGA) solder balls 104 and under the controllable wafer bumps (C4 bumps) 114. In order to reduce the effect of the stress caused by the mismatch of the high thermal expansion coefficient on the active through via 108, the active through via 108 is formed in a region other than the stress concentration region, and more particularly, the active through via 108 is as in the first 1 is formed outside the range of the exclusion zones 106 and 116, and the range of the forbidden zone 106 is approximately 20% to 30% larger than the diameter of the ball grid array (BGA) solder ball 104, and is prohibited. The area 116 is approximately 10% to 20% larger than the diameter of the wafer bumps (C4 bumps) 114 that can control collapse.

偽貫穿導通孔110較佳為在禁止區106內形成，或在禁止區116內形成(未繪出)，或者在禁止區106與禁止區 116內形成(未繪出)，在禁止區106以及/或禁止區116內形成偽貫穿導通孔110可以對層疊封裝(PoP)結構100中因各種材料的不同熱膨脹係數，例如矽中介層與銅貫穿導孔的不同熱膨脹係數所引發的局部應力產生重新分佈的效果。例如，在一實施例中可包含8至12個銅導通孔，其中銅材料因為可以變形而達到釋放應力的效果。在一實施例中，每一個球柵陣列(BGA)焊球104具有1個主動貫穿導通孔108和8個偽貫穿導通孔110，其中4個偽貫穿導通孔110與鄰近的球柵陣列(BGA)焊球104共用。在其他實施例中，每一個球柵陣列(BGA)焊球104具有1個主動貫穿導通孔108和3至4個偽貫穿導通孔110。此外，在包含能控制塌陷的晶片連接凸塊(C4 bumps)114的實施例中，也可以使用相似的偽導通孔對連接器的數量比例關係。主動貫穿導通孔108和偽貫穿導通孔110的直徑較佳為約10μm至20μm，且更佳為約10μm。 The dummy through vias 110 are preferably formed in the forbidden region 106, or formed in the forbidden region 116 (not shown), or in the forbidden region 106 and the forbidden region Formed within 116 (not shown), the formation of dummy through vias 110 in the forbidden region 106 and/or the forbidden region 116 may be different for different thermal expansion coefficients of the various materials in the package-on-package (PoP) structure 100, such as germanium interposer and copper. The local stress induced by the different thermal expansion coefficients of the through holes produces a redistribution effect. For example, in one embodiment, 8 to 12 copper vias may be included, wherein the copper material achieves the effect of releasing stress because it can be deformed. In one embodiment, each ball grid array (BGA) solder ball 104 has one active through via 108 and eight dummy vias 110, four dummy vias 110 and an adjacent ball grid array (BGA) The solder balls 104 are shared. In other embodiments, each ball grid array (BGA) solder ball 104 has one active through via 108 and three to four dummy vias 110. In addition, in embodiments including wafer bond bumps (C4 bumps) 114 that can control collapse, a similar proportional relationship of the number of dummy vias to the connectors can also be used. The diameter of the active through via 108 and the dummy through via 110 is preferably from about 10 μm to 20 μm, and more preferably about 10 μm.

如第2圖所示，中介層102可包含許多層，形成中介層的方法為在此技術領域中具有通常知識者所熟知，在此不再重述。在此實施例中，中介層102由矽形成，在其他實施例中，中介層102可由其他材料，例如玻璃、有機材料、絕緣材料或前述之組合形成。 As shown in FIG. 2, the interposer 102 can include a number of layers, and the method of forming the interposer is well known to those of ordinary skill in the art and will not be repeated here. In this embodiment, the interposer 102 is formed of tantalum, and in other embodiments, the interposer 102 can be formed of other materials, such as glass, organic materials, insulating materials, or combinations of the foregoing.

在一實施例中，中介層102的第一側222包含第一層間介電(interlayer dielectric；ILD)層226、第二層間介電(ILD)層228以及金屬化層(未繪出)，在此技術領域中具有通常知識者當可瞭解，對第2圖所示之中介層102的結構還可以額外形成其他數量、類型以及多層的組合，或者可以形成其他數 量、類型以及多層的組合以取代第2圖之中介層102結構中的一層或多層。在此實施例中，第一層間介電層226由氮化物形成，在其他實施例中，第一層間介電層226也可由任何氧化物、任何氮化物、任何高分子或前述之組合形成。在此實施例中，第二層間介電層228為高分子層，在其他實施例中，第二層間介電層228可由低溫聚苯并[口咢]唑(low temperature polybenzoxazole；LTPBO)、任何氧化物、任何氮化物、任何高分子或前述之組合形成。在此實施例中，金屬化層為銅形成的後鈍態內連線(post passivation interconnect)，在其他實施例中，金屬化層可以由銅、鋁、鎳或前述之組合形成，此外，在此技術領域中具有通常知識者所熟知的其他適合用於形成第一層間介電層226、第二層間介電層228以及金屬化層的材料也可以使用。 In one embodiment, the first side 222 of the interposer 102 includes a first interlayer dielectric (ILD) layer 226, a second interlayer dielectric (ILD) layer 228, and a metallization layer (not shown). It is understood by those skilled in the art that the structure of the interposer 102 shown in FIG. 2 may additionally form other combinations of numbers, types, and layers, or may form other numbers. A combination of quantities, types, and layers in place of one or more of the interposer 102 structures of FIG. In this embodiment, the first interlayer dielectric layer 226 is formed of nitride. In other embodiments, the first interlayer dielectric layer 226 may also be any oxide, any nitride, any polymer, or a combination thereof. form. In this embodiment, the second interlayer dielectric layer 228 is a polymer layer. In other embodiments, the second interlayer dielectric layer 228 may be a low temperature polybenzoxazole (LTPBO), any An oxide, any nitride, any polymer, or a combination of the foregoing. In this embodiment, the metallization layer is a post passivation interconnect formed by copper. In other embodiments, the metallization layer may be formed of copper, aluminum, nickel, or a combination thereof, in addition, Other materials suitable for forming the first interlayer dielectric layer 226, the second interlayer dielectric layer 228, and the metallization layer, which are well known to those skilled in the art, may also be used.

在一實施例中，中介層102的第二側224包含第一層間介電層232、第二層間介電層234以及金屬化層112，在此技術領域中具有通常知識者當可瞭解，對第2圖所示之中介層102的結構還可以額外形成其他數量、類型以及多層的組合，或者形成其他數量、類型以及多層的組合以取代第2圖之中介層102結構中的一層或多層。在此實施例中，第一層間介電層232由氧化物形成，在其他實施例中，第一層間介電層232也可由任何氧化物、任何氮化物、任何高分子或前述之組合形成。在此實施例中，第二層間介電層234為鈍態層，在其他實施例中，第二層間介電層228可由低溫聚苯并[口咢]唑(LTPBO)、任何氧化物、任何氮化物、任何高分子或前述之組 合形成。在此實施例中，金屬化層112為銅，在其他實施例中，金屬化層112可以由銅、鋁、金、銀、鎳或前述之組合形成，此外，在此技術領域中具有通常知識者所熟知的其他適合用於形成第一層間介電層232、第二層間介電層234以及金屬化層112的材料也可以使用。 In an embodiment, the second side 224 of the interposer 102 includes a first interlayer dielectric layer 232, a second interlayer dielectric layer 234, and a metallization layer 112, as will be understood by those of ordinary skill in the art. The structure of the interposer 102 shown in FIG. 2 may additionally form other combinations of numbers, types, and layers, or other combinations of numbers, types, and layers to replace one or more layers of the interposer 102 structure of FIG. . In this embodiment, the first interlayer dielectric layer 232 is formed of an oxide. In other embodiments, the first interlayer dielectric layer 232 may also be any oxide, any nitride, any polymer, or a combination thereof. form. In this embodiment, the second interlayer dielectric layer 234 is a passive layer. In other embodiments, the second interlayer dielectric layer 228 may be composed of low temperature polybenzoxazole (LTPBO), any oxide, any Nitride, any polymer or group of the foregoing Formed together. In this embodiment, the metallization layer 112 is copper. In other embodiments, the metallization layer 112 may be formed of copper, aluminum, gold, silver, nickel, or a combination thereof, and further has general knowledge in the art. Other materials well known for forming the first interlayer dielectric layer 232, the second interlayer dielectric layer 234, and the metallization layer 112 may also be used.

在此實施例中，球柵陣列(BGA)焊球104連接下方的基底(未繪出)至中介層102的第一側222，凸塊下金屬化層230設置在球柵陣列(BGA)焊球104上方，並且電性連接球柵陣列(BGA)焊球104至上述形成在中介層102內的金屬化層。凸塊下金屬化層230較佳為約250μm，在一實施例中，凸塊下金屬化層230由銅形成，在其他實施例中，凸塊下金屬化層230可由銅、鎳、金、銀、鈷或前述之組合形成，此外，在此技術領域中具有通常知識者所熟知的其他適合用於形成凸塊下金屬化層230的材料也可使用。 In this embodiment, a ball grid array (BGA) solder ball 104 connects the underlying substrate (not shown) to the first side 222 of the interposer 102, and the under bump metallization layer 230 is placed in a ball grid array (BGA) solder. Above the ball 104, and electrically connecting a ball grid array (BGA) solder ball 104 to the metallization layer formed in the interposer 102 described above. The under bump metallization layer 230 is preferably about 250 μm. In an embodiment, the under bump metallization layer 230 is formed of copper. In other embodiments, the under bump metallization layer 230 may be made of copper, nickel, gold, Silver, cobalt or a combination of the foregoing is formed, and other materials suitable for forming the under bump metallization layer 230, which are well known to those skilled in the art, may also be used.

在一實施例中，主動貫穿導通孔108和偽貫穿導通孔110由銅形成，在其他實施例中，主動貫穿導通孔108和偽貫穿導通孔110可由銅、鋁、金、銀、鎳或前述之組合形成，此外，在此技術領域中具有通常知識者所熟知的其他適合用於形成主動貫穿導通孔108和偽貫穿導通孔110的材料也可使用。 In one embodiment, the active through vias 108 and the dummy through vias 110 are formed of copper. In other embodiments, the active through vias 108 and the dummy through vias 110 may be copper, aluminum, gold, silver, nickel, or the like. Combinations of these are also possible, and other materials well known in the art to be suitable for forming the active through vias 108 and the dummy through vias 110 can be used.

能控制塌陷的晶片連接凸塊(C4 bumps)114係經由凸塊下金屬化層220電性連接晶片118至中介層102的第二側224，凸塊下金屬化層220可以由與凸塊下金屬化層230相同的材料形成，或者可由一些如前述討論的凸塊下金屬化層230 適用的其他材料形成。 The bump bonding wafer bonding bumps (C4 bumps) 114 are electrically connected to the second side 224 of the interposer 102 via the under bump metallization layer 220, and the under bump metallization layer 220 may be under the bumps The metallization layer 230 is formed of the same material, or may be under some of the under bump metallization layer 230 as discussed above. Other materials are suitable for formation.

雖然本發明已揭露較佳實施例如上，然其並非用以限定本發明，在此技術領域中具有通常知識者當可瞭解，在不脫離本發明之精神和範圍內，當可做些許更動與潤飾。因此，本發明之保護範圍當視後附之申請專利範圍所界定為準。 While the present invention has been described in its preferred embodiments, it is not intended to limit the invention, and it is understood by those of ordinary skill in the art that Retouching. Accordingly, the scope of the invention is defined by the scope of the appended claims.

100‧‧‧層疊封裝(PoP)結構 100‧‧‧Layered Package (PoP) Structure

102‧‧‧中介層 102‧‧‧Intermediary

104‧‧‧球柵陣列(BGA)焊球 104‧‧‧Ball Grid Array (BGA) solder balls

106、116‧‧‧禁止區 106, 116‧‧ ‧ prohibited area

108‧‧‧主動貫穿導通孔 108‧‧‧Active through-holes

110‧‧‧偽貫穿導通孔 110‧‧‧Pseudo-through vias

112‧‧‧金屬化層 112‧‧‧metallization

114‧‧‧能控制塌陷的晶片連接凸塊(C4 bumps) 114‧‧‧Can control collapsed wafer connection bumps (C4 bumps)

118‧‧‧晶片 118‧‧‧ wafer

Claims (10)

一種積體電路結構，包括：一基底，具有複數個焊球；一半導體晶片；以及一中介層，電性連接該基底與該半導體晶片，該中介層包括：一第一側；一與該第一側相反的第二側；至少一第一禁止區，其中該至少一第一禁止區穿過該中介層延伸至該些焊球的每一個焊球上方；至少一主動貫穿導通孔，從該中介層的該第一側延伸至該中介層的該第二側，其中該至少一主動貫穿導通孔在該至少一第一禁止區以外形成，且其中在該至少一第一禁止區內無主動貫穿導通孔形成；以及至少一第一偽貫穿導通孔，從該中介層的該第一側延伸至該中介層的該第二側，其中該至少一第一偽貫穿導通孔在該至少一第一禁止區內形成。 An integrated circuit structure comprising: a substrate having a plurality of solder balls; a semiconductor wafer; and an interposer electrically connecting the substrate and the semiconductor wafer, the interposer comprising: a first side; a second side opposite to one side; at least one first forbidden area, wherein the at least one first forbidden area extends through the interposer to each of the solder balls of the solder balls; at least one actively penetrates the via hole, from The first side of the interposer extends to the second side of the interposer, wherein the at least one active through via is formed outside the at least one first forbidden region, and wherein there is no active in the at least one first forbidden region And a first dummy through via extending from the first side of the interposer to the second side of the interposer, wherein the at least one first dummy via is at the at least one Formed in a prohibited area. 如申請專利範圍第1項所述之積體電路結構，其中該些焊球的每一個焊球的直徑為200μm至300μm，且其中該些焊球的間距為400μm至500μm。 The integrated circuit structure of claim 1, wherein each of the solder balls has a diameter of 200 μm to 300 μm, and wherein the solder balls have a pitch of 400 μm to 500 μm. 如申請專利範圍第1項所述之積體電路結構，其中該至少一第一禁止區的直徑比該些焊球的至少一焊球的直徑大20%至30%。 The integrated circuit structure of claim 1, wherein the at least one first forbidden region has a diameter that is 20% to 30% larger than a diameter of the at least one solder ball of the solder balls. 如申請專利範圍第1項所述之積體電路結構，其中該中介層 的該第一側包括一第一層間介電層，該第一層間介電層包括氧化物、氮化物、高分子或前述之組合；一第二層間介電層，該第二層間介電層包括低溫聚苯并[口咢]唑、氧化物、氮化物、高分子或前述之組合；以及一金屬化層，該金屬化層包括銅、鋁、鎳或前述之組合，其中該些焊球的至少一焊球經由一凸塊下金屬化層電性連接至該金屬化層。 The integrated circuit structure as described in claim 1, wherein the interposer The first side comprises a first interlayer dielectric layer, the first interlayer dielectric layer comprises an oxide, a nitride, a polymer or a combination thereof; a second interlayer dielectric layer, the second interlayer dielectric layer The electrical layer comprises a low temperature polybenzoxazole, an oxide, a nitride, a polymer or a combination thereof; and a metallization layer comprising copper, aluminum, nickel or a combination thereof, wherein At least one solder ball of the solder ball is electrically connected to the metallization layer via an under bump metallization layer. 如申請專利範圍第1項所述之積體電路結構，其中該半導體晶片包括複數個能控制塌陷的晶片連接凸塊，該些能控制塌陷的晶片連接凸塊的每一個凸塊的直徑為100μm，該些能控制塌陷的晶片連接凸塊的間距小於200μm，且該積體電路結構更包括至少一第二禁止區，其中該至少一第二禁止區穿過該中介層延伸至該些能控制塌陷的晶片連接凸塊的每一個凸塊下方。 The integrated circuit structure of claim 1, wherein the semiconductor wafer comprises a plurality of wafer connection bumps capable of controlling collapse, and each of the bumps capable of controlling the collapsed wafer connection bumps has a diameter of 100 μm. The pitch of the wafer connection bumps capable of controlling the collapse is less than 200 μm, and the integrated circuit structure further includes at least one second forbidden region, wherein the at least one second forbidden region extends through the interposer to the controllable The collapsed wafer is connected under each bump of the bump. 如申請專利範圍第5項所述之積體電路結構，其中該中介層的該第二側包括一第一層間介電層，該第一層間介電層包括氧化物、氮化物、高分子或前述之組合；一第二層間介電層，該第二層間介電層包括一鈍態層、低溫聚苯并[口咢]唑、氧化物、氮化物、高分子或前述之組合；以及一金屬化層，該金屬化層包括銅、鋁、金、銀、鎳或前述之組合，其中該些能控制塌陷的晶片連接凸塊的至少一凸塊經由一凸塊下金屬化層電性連接至該金屬化層。 The integrated circuit structure of claim 5, wherein the second side of the interposer comprises a first interlayer dielectric layer, the first interlayer dielectric layer comprising an oxide, a nitride, and a high a combination of molecules or a combination of the foregoing; a second interlayer dielectric layer comprising a passivation layer, a low temperature polybenzoxazole, an oxide, a nitride, a polymer, or a combination thereof; And a metallization layer comprising copper, aluminum, gold, silver, nickel or a combination thereof, wherein the at least one bump capable of controlling the collapsed wafer connection bumps is electrically connected via a bump under metallization layer Sexually connected to the metallization layer. 如申請專利範圍第5項所述之積體電路結構，其中該該至少一第二禁止區的直徑比該些能控制塌陷的晶片連接凸塊的 至少一凸塊的直徑大10%至20%。 The integrated circuit structure of claim 5, wherein the diameter of the at least one second forbidden region is greater than the diameter of the bump connecting wafers At least one of the bumps has a diameter that is 10% to 20% larger. 如申請專利範圍第5項所述之積體電路結構，其中該該至少一主動貫穿導通孔在該至少一第二禁止區以外形成，且在該至少一第二禁止區內無主動貫穿導通孔形成，且至少一第二偽貫穿導通孔在該至少一第二禁止區內形成。 The integrated circuit structure of claim 5, wherein the at least one active through via is formed outside the at least one second forbidden region, and there is no active through via in the at least one second inhibited region. Forming, and at least one second dummy through via is formed in the at least one second forbidden region. 一種中介層的設計方法，包括：決定在該中介層內的一球柵陣列區；決定在該中介層內的至少一第一禁止區，其中該至少一第一禁止區係按照該球柵陣列區，從該中介層的一第一側延伸至該中介層的一第二側；決定至少一主動貫穿導通孔的放置，其係從該中介層的該第一側延伸至該中介層的該第二側，其中該至少一主動貫穿導通孔放置在該至少一第一禁止區以外，且其中無主動貫穿導通孔放置在該至少一第一禁止區內；以及決定至少一第一偽貫穿導通孔的放置，其係從該中介層的該第一側延伸至該中介層的該第二側，其中該至少一第一偽貫穿導通孔放置在該至少一第一禁止區內。 A method for designing an interposer includes: determining a ball grid array region in the interposer; determining at least one first forbidden region in the interposer, wherein the at least one first forbidden region is in accordance with the ball grid array a region extending from a first side of the interposer to a second side of the interposer; determining a placement of at least one active through via that extends from the first side of the interposer to the interposer a second side, wherein the at least one active through via is disposed outside the at least one first forbidden region, and wherein no active through via is disposed in the at least one first forbidden region; and determining at least one first pseudo through conduction The placement of the hole extends from the first side of the interposer to the second side of the interposer, wherein the at least one first dummy through via is placed in the at least one first inhibited region. 如申請專利範圍第9項所述之中介層的設計方法，更包括：決定一能控制塌陷的晶片連接凸塊區；決定在該中介層內的至少一第二禁止區，其中該至少一第二禁止區係按照該能控制塌陷的晶片連接凸塊區，從該中介層的該第二側延伸至該中介層的該第一側；依據該至少一第二禁止區決定該至少一主動貫穿導通孔的放置，其中該至少一主動貫穿導通孔放置在該至少一第二 禁止區以外，且其中無主動貫穿導通孔放置在該至少一第二禁止區內；以及依據該至少一第二禁止區決定至少一第二偽貫穿導通孔的放置，其中該至少一第二偽貫穿導通孔放置在該至少一第二禁止區內。 The method for designing an interposer as described in claim 9 further includes: determining a wafer connection bump region capable of controlling collapse; determining at least one second forbidden region in the interposer, wherein the at least one a second forbidden zone extending from the second side of the interposer to the first side of the interposer according to the controllable wafer connection bump region; determining the at least one active penetration according to the at least one second forbidden zone Placement of a via hole, wherein the at least one active through via hole is placed in the at least one second Outside the forbidden zone, wherein no active through vias are placed in the at least one second forbidden zone; and determining placement of at least one second pseudo through via according to the at least one second forbidden zone, wherein the at least one second pseudo The through via is placed in the at least one second forbidden zone.
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