TW201345001A - Light-emitting diode and light distribution module thereof - Google Patents
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Abstract
Description
本發明涉及一種發光二極體,尤其涉及一種發光二極體的光分配結構。The present invention relates to a light emitting diode, and more particularly to a light distributing structure of a light emitting diode.
發光二極體作為一種高效的光源,具有環保、省電、壽命長等諸多特點,已經被廣泛的運用於諸多領域,如生活照明、背光光源等。As a highly efficient light source, the light-emitting diode has many characteristics such as environmental protection, power saving, long life and the like, and has been widely used in many fields, such as living lighting and backlight source.
習知的發光二極體的出光角度一般為90度至120度,且其出光角中央(出光角約為0度至30度)的光線強度較強,周圍的光線強度較弱,導致整個發光二極體的出光不均勻,從而限制了其在需要均勻照明的環境中的廣泛應用。The light-emitting diode of the conventional light-emitting diode generally has an angle of light of 90 degrees to 120 degrees, and the center of the light exiting angle (the light-emitting angle is about 0 to 30 degrees) has a strong light intensity, and the surrounding light intensity is weak, resulting in the entire light-emitting. The light output of the diode is not uniform, which limits its wide application in environments where uniform illumination is required.
有鑒於此,有必要提供一種出光均勻的發光二極體光源及其光分配結構。In view of the above, it is necessary to provide a light-emitting diode light source having uniform light emission and a light distribution structure thereof.
一種發光二極體的光分配結構,包括一透鏡、一反射層及一粗糙化膜片,該粗糙化膜片與該透鏡均由透明材料製成,該反射層包括一貼合面及與該貼合面相對的一反射面,該反射面為一光滑的弧形凹面,該粗糙化膜片包括一結合面及與該結合面相對的一粗糙面,該結合面為一弧形的凸面,該結合面與該反射層的反射面無間貼合,該粗糙面上形成有粗糙結構,該粗糙結構的粗糙程度自該粗糙化膜片的中部向邊緣逐漸減小,該透鏡包括一入光面及與該入光面相對的一出光面,該入光面與該粗糙化膜片的粗糙面結合。A light distribution structure of a light-emitting diode, comprising a lens, a reflective layer and a roughened film, the roughened film and the lens are both made of a transparent material, the reflective layer comprises a bonding surface and a reflective surface opposite to the facing surface, the reflecting surface is a smooth curved concave surface, the roughened diaphragm comprises a joint surface and a rough surface opposite to the joint surface, the joint surface is a curved convex surface, The bonding surface has no adhesion to the reflecting surface of the reflective layer, and the rough surface is formed with a rough structure. The roughness of the rough structure gradually decreases from the middle to the edge of the roughened film, and the lens includes a light incident surface. And a light emitting surface opposite to the light incident surface, the light incident surface is combined with the rough surface of the roughened film.
一種發光二極體,包括一基座、設於該基座上的兩電極、與該兩電極電連接的一發光晶片,以及一光分配結構,該光分配結構包括一透鏡、一反射層及一粗糙化膜片,該粗糙化膜片與該透鏡均由透明材料製成,該反射層包括一貼合面及與該貼合面相對的一反射面,該反射面為一光滑的弧形凹面,該粗糙化膜片包括一結合面及與該結合面相對的一粗糙面,該結合面為一弧形的凸面,該結合面與該反射層的反射面無間貼合,該粗糙面上形成有粗糙結構,該粗糙結構的粗糙程度自該粗糙化膜片的中部向邊緣逐漸減小,該透鏡包括一入光面及與該入光面相對的一出光面,該入光面與該粗糙化膜片的粗糙面結合,該反射層的貼合面貼合於該基座上且至少與其中一電極絕緣,該發光晶片位於該反射層的中部。A light-emitting diode includes a base, two electrodes disposed on the base, a light-emitting chip electrically connected to the two electrodes, and a light distribution structure including a lens, a reflective layer, and a roughened film, the roughened film and the lens are both made of a transparent material, the reflective layer comprises a bonding surface and a reflecting surface opposite to the bonding surface, the reflecting surface is a smooth curved shape a concave surface, the roughened film comprises a bonding surface and a rough surface opposite to the bonding surface, the bonding surface is an arc-shaped convex surface, and the bonding surface and the reflecting surface of the reflective layer have no close contact, the rough surface Forming a rough structure, the roughness of the rough structure gradually decreases from a middle portion to an edge of the roughened film, the lens includes a light incident surface and a light emitting surface opposite to the light incident surface, the light incident surface and the light incident surface The rough surface of the roughened film is bonded, and the bonding surface of the reflective layer is attached to the pedestal and insulated from at least one of the electrodes, and the luminescent wafer is located in the middle of the reflective layer.
使用上述光分配結構的發光二極體在工作時,其粗糙化膜片上的粗糙結構可使透鏡中的光線發生漫反射,由於該粗糙化膜片上的粗糙結構的粗糙程度自該粗糙化膜片的中部向邊緣逐漸減小,故,在該粗糙化膜片與反射層共同作用下,使射向透鏡中部的光線更分散,從而使該發光二極體的出光強度更加均勻。When the light-emitting diode using the light distribution structure described above is operated, the roughened structure on the roughened film may cause diffuse reflection of light in the lens, since the roughness of the rough structure on the roughened film is from the roughening The middle portion of the diaphragm gradually decreases toward the edge. Therefore, under the action of the roughened diaphragm and the reflective layer, the light that is directed toward the middle of the lens is more dispersed, so that the light intensity of the light-emitting diode is more uniform.
以下將結合附圖對本發明作進一步之詳細說明。The invention will be further described in detail below with reference to the accompanying drawings.
請參閱圖1,所示為本發明一較佳實施例中的發光二極體100,該發光二極體100包括一基座10、設於該基座10上的兩電極20、與該兩電極20電連接的一發光晶片30及設於該發光晶片30上的一光分配結構40。Referring to FIG. 1 , a light emitting diode 100 is illustrated in a preferred embodiment of the present invention. The light emitting diode 100 includes a base 10 , two electrodes 20 disposed on the base 10 , and the two An illuminating wafer 30 electrically connected to the electrode 20 and a light distributing structure 40 disposed on the illuminating wafer 30.
請參照圖2,該基座10為絕緣基座,其由塑膠或其他適合的材料所製成,如矽(Si)、砷化鎵(GaAs)、氧化鋅(ZnO)及磷化銦(InP)等。該基座10呈平板狀,包括相對設置的一第一表面11及一第二表面12。該兩電極20相互分離且每一電極20自該基座10的第一表面11延伸至該第二表面12。Referring to FIG. 2, the susceptor 10 is an insulating base made of plastic or other suitable materials such as bismuth (Si), gallium arsenide (GaAs), zinc oxide (ZnO), and indium phosphide (InP). )Wait. The base 10 has a flat shape and includes a first surface 11 and a second surface 12 disposed opposite each other. The two electrodes 20 are separated from one another and each electrode 20 extends from the first surface 11 of the base 10 to the second surface 12.
該發光晶片30的材料可根據實際發光需求進行選擇,比如發紅光的GaAsP,發黃光的InGaAlP,發藍光的GaN,發綠光的GaP等。該發光晶片30位於該基座10的第一表面11所在的一側,且固設於其中一電極20上,該發光晶片30的兩個電觸點藉由打線的方式分別與該兩電極20電連接。在其他實施例中,該發光晶片30亦可以晶片倒裝的形式與該兩電極20形成電性連接。The material of the luminescent wafer 30 can be selected according to actual illuminating requirements, such as red-emitting GaAsP, yellow-emitting InGaAlP, blue-emitting GaN, green-emitting GaP, and the like. The illuminating chip 30 is located on the side of the first surface 11 of the pedestal 10 and is fixed on one of the electrodes 20, and the two electrical contacts of the illuminating chip 30 are respectively connected to the two electrodes 20 by wire bonding. Electrical connection. In other embodiments, the illuminating wafer 30 can also be electrically connected to the two electrodes 20 in the form of wafer flip-chip.
該光分配結構40包括自該基座10依次向上疊置的一反射層41、一粗糙化膜片42及一透鏡43。該反射層41為一金屬片體,其大小與該基座10相當,且厚度自其中部向外緣逐漸增大。該反射層41的中部貫穿設有一通孔410。該反射層41包括一貼合面411及與該貼合面411相對的一反射面412。該貼合面411呈平面狀,用以貼合該基座10。該反射層41與該兩電極20絕緣,或者至少與其中一電極20絕緣。該反射面412為一光滑的弧形凹面,其藉由衝壓或拋光工藝形成。該發光晶片30藉由該通孔410外漏,該反射面412圍繞於該發光晶片30的周圍,用以反射該發光晶片30產生的光線。在其他的實施例中,該反射層41亦可以由玻璃或耐高溫的塑膠製成,其反射面412可以藉由一次脫模形成。The light distribution structure 40 includes a reflective layer 41, a roughened film 42 and a lens 43 which are sequentially stacked upward from the susceptor 10. The reflective layer 41 is a metal sheet having a size comparable to that of the base 10 and having a thickness that gradually increases from the middle to the outer edge. A through hole 410 is formed in the middle of the reflective layer 41. The reflective layer 41 includes a bonding surface 411 and a reflecting surface 412 opposite to the bonding surface 411. The bonding surface 411 has a planar shape for attaching the susceptor 10. The reflective layer 41 is insulated from the two electrodes 20 or at least insulated from one of the electrodes 20. The reflective surface 412 is a smooth curved concave surface formed by a stamping or polishing process. The light-emitting chip 30 is leaked through the through hole 410. The reflective surface 412 surrounds the periphery of the light-emitting chip 30 for reflecting the light generated by the light-emitting chip 30. In other embodiments, the reflective layer 41 can also be made of glass or high temperature resistant plastic, and the reflective surface 412 can be formed by one demolding.
請參照圖3,該粗糙化膜片42為一透明片體,其由耐高溫的透明材料製成,如玻璃、聚碳酸酯(PC)、聚丙烯酸酯(PEA)等。該粗糙化膜片42的厚度自中部向邊緣逐漸減小,且中部貫穿設有一收容孔420。該粗糙化膜片42包括一結合面421及與該結合面421相對的一粗糙面422。該結合面421為一弧形的凸面,形狀與該反射層41的反射面412匹配。該結合面421與該反射層41的反射面412無間貼合。該粗糙面422上形成有粗糙結構423,所述粗糙結構423採用蝕刻或者印刷的方式形成,該粗糙結構423的粗糙程度自該粗糙化膜片42的中部向邊緣逐漸減小。該收容孔420圍繞於該發光晶片30周圍。Referring to FIG. 3, the roughened film 42 is a transparent sheet made of a high temperature resistant transparent material such as glass, polycarbonate (PC), polyacrylate (PEA) or the like. The thickness of the roughened film 42 gradually decreases from the middle to the edge, and a receiving hole 420 is formed in the middle portion. The roughened film 42 includes a bonding surface 421 and a rough surface 422 opposite the bonding surface 421. The bonding surface 421 is an arcuate convex surface having a shape matching the reflecting surface 412 of the reflective layer 41. The bonding surface 421 and the reflecting surface 412 of the reflective layer 41 are not bonded to each other. A roughness 423 is formed on the rough surface 422, and the roughness 423 is formed by etching or printing, and the roughness of the roughness 423 gradually decreases from the middle to the edge of the roughened film 42. The receiving hole 420 surrounds the periphery of the light emitting chip 30.
本實施例中,該粗糙結構423為多個自該粗糙面突起的複數錐狀的凸起4230,所述凸起4230圍繞該收容孔420排布,所述凸起4230的高度及跨度自該粗糙化膜片42的中部向邊緣逐漸減小。在其他的實施例中,該粗糙結構423亦可以為深度及跨度自該粗糙化膜片42的中部向邊緣逐漸減小的凹槽,或者其他形狀的凸起或凹槽,如半球形,梯台形等。In this embodiment, the roughness 423 is a plurality of conical protrusions 4230 protruding from the rough surface, and the protrusions 4230 are arranged around the receiving hole 420. The height and span of the protrusions 4230 are from The middle portion of the roughened film 42 gradually decreases toward the edge. In other embodiments, the roughness 423 may also be a groove whose depth and span gradually decrease from the middle to the edge of the roughened film 42 or other shapes of protrusions or grooves, such as a hemisphere, a ladder Table shape and so on.
該透鏡43由透明材料製成,如透明塑膠或玻璃等。本實施例中,該透鏡43由透明環氧樹脂等藉由注射成型的工藝成型於該粗糙化膜片42的粗糙面422上。該透鏡43大致呈圓餅形,其具有一蝠翼狀的縱截面。該透鏡43包括一入光面431及與該入光面431相對的一出光面432。該入光面431與該粗糙化膜片42的粗糙面422結合,該粗糙化膜片42的粗糙面422上的凸起4230伸入該透鏡43的入光面431,使該入光面431上形成與所述凸起4230對應的凹坑4310。該入光面431的中部凹設一光室433,該光室433與該粗糙化膜片42上的收容孔420連通,且該光室433的內徑與該粗糙化膜片42上的收容孔420的內徑相同,該光室433具有一圓形側壁4331及一拱形的頂壁4332,從而使該光室433具有一倒U形的縱截面,該側壁4331及頂壁4332均為光滑的反光面。該光室433位於該發光晶片30的正上方。該出光面432為一向外凸起的曲面,該出光面432的中部設有一漏斗狀的凹陷4320,從而使該透鏡43的中部為一凹透鏡的結構,而邊緣呈一凸透鏡的結構,該出光面432的邊緣部分正對所述粗糙化膜片42的粗糙面422,該出光面432的凹陷4320正對該入光面431上的光室433。The lens 43 is made of a transparent material such as transparent plastic or glass. In this embodiment, the lens 43 is formed on the rough surface 422 of the roughened film 42 by a process such as injection molding using a transparent epoxy resin or the like. The lens 43 is substantially in the shape of a pie having a batwing-like longitudinal section. The lens 43 includes a light incident surface 431 and a light exit surface 432 opposite to the light incident surface 431. The light incident surface 431 is combined with the rough surface 422 of the roughened film 42. The protrusion 4230 on the rough surface 422 of the roughened film 42 extends into the light incident surface 431 of the lens 43 to make the light incident surface 431. A pit 4310 corresponding to the protrusion 4230 is formed thereon. A light chamber 433 is disposed in the middle of the light incident surface 431. The light chamber 433 is in communication with the receiving hole 420 of the roughened film 42, and the inner diameter of the light chamber 433 and the receiving portion of the roughened film 42 are received. The inner diameter of the hole 420 is the same. The light chamber 433 has a circular side wall 4331 and an arched top wall 4332, so that the light chamber 433 has an inverted U-shaped longitudinal section, and the side wall 4331 and the top wall 4332 are both Smooth reflective surface. The light chamber 433 is located directly above the light emitting wafer 30. The light-emitting surface 432 is an outwardly convex curved surface. The middle portion of the light-emitting surface 432 is provided with a funnel-shaped recess 4320, so that the middle portion of the lens 43 is a concave lens structure, and the edge has a convex lens structure. The edge portion of the 432 faces the rough surface 422 of the roughened film 42, and the recess 4320 of the light exit surface 432 faces the light chamber 433 on the light incident surface 431.
該發光二極體100工作時,該發光晶片30發出的光線,一部分直接進入該透鏡43內,另一部分藉由該粗糙化膜片42的內壁4201進入該粗糙化膜片42中,進而被該粗糙化膜片42的結合面421處的反射層41的反射面412反射進入該透鏡43內。進入該透鏡43中的光線一部分直接藉由該透鏡43的出光面432射出,另一部分被該出光面432反射至該粗糙化膜片42的粗糙面422上,被反射至該粗糙面422上的光線一部分被該粗糙面422上的粗糙結構423漫反射再次進入該透鏡43中,另一部分則進入該粗糙化膜片42中,再次被該反射層41的反射面412反射至該透鏡43中。如此,經過多次往復,該粗糙化膜片42的粗糙面422上粗糙結構423將光線進行多次分配,從而使該透鏡43的出光面432可射出相對均勻的光線。When the light-emitting diode 100 is in operation, part of the light emitted by the light-emitting chip 30 directly enters the lens 43 and the other portion enters the roughened film 42 by the inner wall 4201 of the roughened film 42 and is further The reflecting surface 412 of the reflective layer 41 at the bonding surface 421 of the roughened film 42 is reflected into the lens 43. A portion of the light entering the lens 43 is directly emitted by the light exit surface 432 of the lens 43, and the other portion is reflected by the light exit surface 432 onto the rough surface 422 of the roughened film 42 and is reflected onto the rough surface 422. A portion of the light is diffusely reflected by the roughness 423 on the rough surface 422 into the lens 43, and another portion enters the roughened film 42 and is again reflected by the reflective surface 412 of the reflective layer 41 into the lens 43. Thus, after a plurality of reciprocations, the roughened structure 423 on the rough surface 422 of the roughened film 42 distributes the light multiple times, so that the light exiting surface 432 of the lens 43 can emit relatively uniform light.
其次,由於該發光晶片30為一點光源且位於該透鏡43的中部,故,該發光晶片30射向該透鏡43的中部的光線更多,本發明中,該粗糙化膜片42的粗糙結構423的粗糙程度自該粗糙化膜片42中部向邊緣逐漸變小,越是粗糙的結構越是可以將光線充分的漫反射,故,該粗糙化膜片42中部的粗糙結構423可以使該透鏡43中部射出的光線更分散,從而有利於使透鏡43射出的光線更均勻。同時,該反射層41的反射面412為一弧形凹面,可以將射至該反射面412的光線反射至該反射層41的中部上方,而粗糙程度相對較大的粗糙結構423位於該反射層41的反射面412的中部上方,可以更多的光線進行漫反射。Secondly, since the illuminating wafer 30 is a point source and is located in the middle of the lens 43, the illuminating wafer 30 is directed to the middle of the lens 43. In the present invention, the roughened structure 42 of the roughened film 42 is 423. The roughness is gradually reduced from the middle to the edge of the roughened film 42. The coarser the structure, the more the light can be diffusely reflected. Therefore, the rough structure 423 in the middle of the roughened film 42 can make the lens 43 The light emitted from the center is more dispersed, which is advantageous for making the light emitted from the lens 43 more uniform. At the same time, the reflective surface 412 of the reflective layer 41 is an arc-shaped concave surface, and the light incident on the reflective surface 412 can be reflected above the middle of the reflective layer 41, and the rough structure 423 having a relatively large roughness is located on the reflective layer. Above the middle of the reflecting surface 412 of 41, more light can be diffusely reflected.
再次,該透鏡43的入光面431的中部設置的光室433,使發光晶片30與透鏡43間隔開,不僅可以避免發光晶片30發出的熱量破壞透鏡43,同時該光室433的側壁4331及頂壁4332可以將發光晶片30發出的一部光線反射分配至該粗糙化膜片42中,進而減少自該透鏡43的中部射出的光線,從而有利於使透鏡43射出的光線更均勻。The light chamber 433 disposed in the middle of the light incident surface 431 of the lens 43 separates the light emitting chip 30 from the lens 43 to prevent the heat generated by the light emitting chip 30 from damaging the lens 43 while the sidewall 4331 of the light chamber 433 and The top wall 4332 can distribute a portion of the light emitted from the illuminating wafer 30 into the roughened film 42, thereby reducing the light emitted from the middle portion of the lens 43, thereby facilitating more uniform light emitted by the lens 43.
另外,本發明中的透鏡43的出光面432的中部設有一漏斗狀的凹陷4320,使該透鏡43的中部為一凹透鏡的結構,而邊緣呈一凸透鏡的結構,該凹透鏡的結構有利於光線的發散,而凸透鏡的結構有利於光線的聚集,這種結構同樣有利於使透鏡43的出光面432射出的光線趨於均勻。In addition, in the middle of the light-emitting surface 432 of the lens 43 of the present invention, a funnel-shaped recess 4320 is provided, so that the middle portion of the lens 43 is a concave lens structure, and the edge has a convex lens structure, and the structure of the concave lens is favorable for light. The divergence, while the structure of the convex lens facilitates the accumulation of light, is also advantageous in that the light emitted from the light exit surface 432 of the lens 43 tends to be uniform.
另外,本領域技術人員還可在本發明精神內做其他變化,當然,該等依據本發明精神所做之變化,都應包含在本發明所要求保護之範圍之內。In addition, those skilled in the art can make other changes in the spirit of the present invention. Of course, such changes in accordance with the spirit of the present invention should be included in the scope of the present invention.
100...發光二極體100. . . Light-emitting diode
10...基座10. . . Pedestal
11...第一表面11. . . First surface
12...第二表面12. . . Second surface
20...電極20. . . electrode
30...發光晶片30. . . Light emitting chip
40...光分配結構40. . . Light distribution structure
41...反射層41. . . Reflective layer
410...通孔410. . . Through hole
411...貼合面411. . . Fitting surface
412...反射面412. . . Reflective surface
42...粗糙化膜片42. . . Roughened diaphragm
420...收容孔420. . . Receiving hole
4201...內壁4201. . . Inner wall
421...結合面421. . . Joint surface
422...粗糙面422. . . Rough surface
423...粗糙結構423. . . Rough structure
4230...凹陷4230. . . Depression
43...透鏡43. . . lens
431...入光面431. . . Glossy surface
4310...凹坑4310. . . Pit
432...出光面432. . . Glossy surface
4320...凸起4320. . . Bulge
433...光室433. . . Light room
4331...側壁4331. . . Side wall
4332...頂壁4332. . . Top wall
圖1為本發明一較佳實施例中的發光二極體的組裝結構示意圖。1 is a schematic view showing the assembled structure of a light-emitting diode according to a preferred embodiment of the present invention.
圖2為圖1所示發光二極體的分解結構示意圖。FIG. 2 is a schematic exploded view of the light emitting diode of FIG. 1. FIG.
圖3為圖2中的粗糙化膜片的俯視圖。Figure 3 is a plan view of the roughened film of Figure 2.
10...基座10. . . Pedestal
11...第一表面11. . . First surface
12...第二表面12. . . Second surface
20...電極20. . . electrode
30...發光晶片30. . . Light emitting chip
40...光分配結構40. . . Light distribution structure
41...反射層41. . . Reflective layer
410...通孔410. . . Through hole
411...貼合面411. . . Fitting surface
412...反射面412. . . Reflective surface
42...粗糙化膜片42. . . Roughened diaphragm
420...收容孔420. . . Receiving hole
4201...內壁4201. . . Inner wall
421...結合面421. . . Joint surface
422...粗糙面422. . . Rough surface
423...粗糙結構423. . . Rough structure
4230...凹陷4230. . . Depression
43...透鏡43. . . lens
431...入光面431. . . Glossy surface
4310...凹坑4310. . . Pit
432...出光面432. . . Glossy surface
4320...凸起4320. . . Bulge
433...光室433. . . Light room
4331...側壁4331. . . Side wall
4332...頂壁4332. . . Top wall
Claims (10)
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CN201210116048.XA CN103378276B (en) | 2012-04-19 | 2012-04-19 | Light-emitting diode and light distribution structure thereof |
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TWI462349B TWI462349B (en) | 2014-11-21 |
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TW (1) | TWI462349B (en) |
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CN103943753A (en) * | 2014-03-06 | 2014-07-23 | 京东方科技集团股份有限公司 | Light emitting diode light source, manufacturing method of light emitting diode light source, backlight source and display device |
TWI610470B (en) * | 2016-06-13 | 2018-01-01 | 隆達電子股份有限公司 | Light emitting diode chip scale packaging structure, direct type backlight module, and method for manufacturing light emitting device |
DE102016224113A1 (en) * | 2016-12-05 | 2018-06-07 | Carl Zeiss Smt Gmbh | INTENSITY ADJUSTMENT FILTER FOR EUV - MICROLITHOGRAPHY AND METHOD FOR THE PRODUCTION THEREOF AND LIGHTING SYSTEM WITH A CORRESPONDING FILTER |
CN117148619A (en) * | 2022-09-28 | 2023-12-01 | 惠州视维新技术有限公司 | Lens, backlight module, display device and manufacturing method of backlight module |
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EP1453107A4 (en) * | 2001-11-16 | 2008-12-03 | Toyoda Gosei Kk | Light-emitting diode, led light, and light apparatus |
JP2004128273A (en) * | 2002-10-03 | 2004-04-22 | Sharp Corp | Light emitting element |
JP2009513021A (en) * | 2005-10-24 | 2009-03-26 | スリーエム イノベイティブ プロパティズ カンパニー | Method of manufacturing light emitting device having molded encapsulant |
US20070269586A1 (en) * | 2006-05-17 | 2007-11-22 | 3M Innovative Properties Company | Method of making light emitting device with silicon-containing composition |
JP5060172B2 (en) * | 2007-05-29 | 2012-10-31 | 岩谷産業株式会社 | Semiconductor light emitting device |
TW200913310A (en) * | 2007-09-13 | 2009-03-16 | Contrel Technology Co Ltd | LED light emitting device |
JP5209634B2 (en) * | 2007-10-11 | 2013-06-12 | 株式会社クラレ | Surface light source element array and image display device |
JP2011023204A (en) * | 2009-07-15 | 2011-02-03 | Sharp Corp | Light-emitting device, luminous flux control member, and lighting device having light-emitting device |
JP2011159767A (en) * | 2010-01-29 | 2011-08-18 | Toshiba Corp | Led package and method for manufacturing the same |
KR101637581B1 (en) * | 2010-03-09 | 2016-07-07 | 엘지이노텍 주식회사 | Light emitting device package and fabricating method thereof |
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CN103378276B (en) | 2016-02-03 |
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