TW201344407A - Heat dissipating apparatus - Google Patents

Heat dissipating apparatus Download PDF

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Publication number
TW201344407A
TW201344407A TW101115647A TW101115647A TW201344407A TW 201344407 A TW201344407 A TW 201344407A TW 101115647 A TW101115647 A TW 101115647A TW 101115647 A TW101115647 A TW 101115647A TW 201344407 A TW201344407 A TW 201344407A
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TW
Taiwan
Prior art keywords
heat dissipating
support frame
positioning
component
dissipating device
Prior art date
Application number
TW101115647A
Other languages
Chinese (zh)
Inventor
Xu Yang
Original Assignee
Hon Hai Prec Ind Co Ltd
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Publication date
Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd
Publication of TW201344407A publication Critical patent/TW201344407A/en

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/001Casings in the form of plate-like arrangements; Frames enclosing a heat exchange core
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/007Auxiliary supports for elements
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A heat dissipating apparatus includes a case and a heat dissipating component. The case includes two opposite side plates and a supporting frame for supporting the dissipating component. An air inlet and an air outlet are defined in the case. The supporting frame is located between the air inlet and the air outlet. A positioning post protrudes from each sidewall of the heat dissipating component. A complementary guiding groove is defined in each side plate. The positioning post is received in the guiding groove and engaged with the guiding groove thereby mounting the heat dissipating component to the case.

Description

散熱裝置Heat sink

本發明涉及一種散熱裝置,尤指一種具有熱交換機的散熱裝置。The invention relates to a heat dissipating device, in particular to a heat dissipating device having a heat exchanger.

在大型伺服器應用領域,基於管理、維護和安全的需要,若干伺服器往往會集中安裝於一個機櫃中,由於伺服器的長時間運轉會持續產生大量的熱量,這樣,就需要利用多個散熱元件,如熱交換機等來進行散熱。熱交換機具有體積大、品質重等特點,安裝人員在將熱交換機安裝到殼體中時不易準確地定位,從而導致安裝時的費時費力。In the field of large-scale server applications, based on the needs of management, maintenance and security, several servers are often installed in a single cabinet. Since the server will continue to generate a large amount of heat for a long time, it is necessary to use multiple heat dissipation. Components, such as heat exchangers, are used to dissipate heat. The heat exchanger has the characteristics of large volume and high quality. The installer is not easy to accurately position the heat exchanger when it is installed in the housing, which leads to time-consuming and laborious installation.

鑒於以上內容,有必要提供一種方便且可靈活安裝的散熱裝置。In view of the above, it is necessary to provide a heat sink that is convenient and flexible to install.

一種散熱裝置,包括有殼體及散熱元件,所述殼體包括有兩相對的側板,兩所述側板之間安裝有支撐框,且設有進風口及出風口,所述支撐框位於所述進風口及所述出風口之間,所述散熱元件包括兩相對的外側面,所述外側面上設有定位柱,所述側板上設有導向槽,安裝時,所述定位柱對準並滑入所述導向槽,所述散熱元件在所述定位柱與所述導向槽配合作用下沿靠近所述支撐架的方向移動,直到所述散熱元件抵靠在所述支撐框上,從而所述散熱元件固定在支撐框及兩所述側板上。A heat dissipating device includes a housing and a heat dissipating component, the housing includes two opposite side plates, and a support frame is disposed between the two side plates, and an air inlet and an air outlet are disposed, and the support frame is located at the Between the air inlet and the air outlet, the heat dissipating component includes two opposite outer sides, and the outer side surface is provided with a positioning post, and the side plate is provided with a guiding slot. When the positioning is aligned, the positioning post is aligned and Sliding into the guiding slot, the heat dissipating component moves in a direction close to the support frame when the positioning post cooperates with the guiding slot until the heat dissipating component abuts on the support frame, thereby The heat dissipating component is fixed on the support frame and the two side plates.

優選地,所述支撐框所在平面垂直於所述側板,且與水平面成一銳角。Preferably, the plane of the support frame is perpendicular to the side plate and is at an acute angle to the horizontal plane.

優選地,所述定位柱為從所述外側面側向延伸出來的柱體。Preferably, the positioning post is a cylinder extending laterally from the outer side surface.

優選地,所述導向槽為沿豎直方向延伸的凹槽,且一端延伸出所述側板的上邊緣。Preferably, the guiding groove is a groove extending in a vertical direction, and one end extends out of an upper edge of the side plate.

優選地,所述外側面上設有四個定位柱,所述側板設有四個導向槽。Preferably, the outer side surface is provided with four positioning posts, and the side plates are provided with four guiding grooves.

優選地,所述四個定位柱分別位於所述外側面上的一梯形区域的四個頂點上。Preferably, the four positioning posts are respectively located on four vertices of a trapezoidal area on the outer side surface.

優選地,所述四個導向槽相互分離且相互平行。Preferably, the four guiding grooves are separated from each other and parallel to each other.

優選地,所述側板上設有定位孔,所述外側面上設有固定件,安裝時,所述固定件收容固定於所述定位孔中。Preferably, the side plate is provided with a positioning hole, and the outer side surface is provided with a fixing member. When the device is installed, the fixing member is received and fixed in the positioning hole.

優選地,所述散熱元件有兩個,所述支撐框包括有第一支撐框及第二支撐框,一所述散熱元件固定在所述第一支撐框上,另一所述散熱元件固定在所述第二支撐框上。Preferably, there are two heat dissipating components, the support frame includes a first support frame and a second support frame, one heat dissipating component is fixed on the first support frame, and the other heat dissipating component is fixed on the The second support frame.

優選地,所述第一支撐框的位置高於所述第二支撐框的位置。Preferably, the position of the first support frame is higher than the position of the second support frame.

與習知技術相比,在上述散熱裝置中,藉由所述定位柱和所述導向槽的配合作用,使得所述散熱元件在安裝至所述殼體的過程中易於準確定位,並且藉由所述進風口和所述出風口的設計,所述散熱元件固定在所述殼體後也可獲得非常良好的通風效果,確保高效率的散熱能力。這樣,就只需要經過一次組裝,便可將所述殼體用於一伺服器機櫃或其他電子裝置中的多個位置,不需要再重複裝卸體積大、品質重的散熱元件,使用起來方便靈活。Compared with the prior art, in the above heat dissipating device, by the cooperation of the positioning post and the guiding groove, the heat dissipating component is easily and accurately positioned in the process of being mounted to the housing, and by The air inlet and the air outlet are designed, and the heat dissipating component is fixed to the casing to obtain a very good ventilation effect, thereby ensuring high efficiency heat dissipation capability. In this way, the housing can be used in a plurality of positions in a server cabinet or other electronic devices after only one assembly, and the large-sized and heavy-weight heat dissipating components need not be repeatedly loaded and unloaded, and the utility model is convenient and flexible to use. .

請參閱圖1至圖3,在本發明的一較佳實施例中,一散熱裝置包括一殼體10、兩散熱元件20、一支撐板30及一隔板50。Referring to FIG. 1 to FIG. 3, in a preferred embodiment of the present invention, a heat sink includes a housing 10, two heat dissipating components 20, a support plate 30, and a partition 50.

所述殼體10包括一底板11及兩相對的側板13。在一實施方式中,所述底板11連接且大致垂直兩所述側板13。兩所述側板13之間安裝一第一橫樑151、一第二橫樑152及一操作梁16。所述第一橫樑151及所述第二橫樑152連接於兩所述側板13的大致垂直所述底板11的側邊緣之間。在一實施方式中,所述操作梁16大致平行所述底板11,用以方便移動所述殼體10。The housing 10 includes a bottom plate 11 and two opposite side plates 13. In an embodiment, the bottom plate 11 is connected and substantially perpendicular to the two side plates 13. A first beam 151, a second beam 152 and an operating beam 16 are mounted between the two side plates 13. The first beam 151 and the second beam 152 are connected between the side edges of the two side plates 13 substantially perpendicular to the bottom plate 11. In an embodiment, the operating beam 16 is substantially parallel to the bottom plate 11 for facilitating movement of the housing 10.

兩所述側板13之間裝設一第一支撐框17及一第二支撐框18。所述第一支撐框17所在平面及所述第二支撐框18所在平面均大致垂直於所述側板13。所述第一支撐框17所在平面與所述第二支撐框18所在平面相互平行,且相對所述底板11是傾斜的,傾斜角度為一銳角,例如為45度角。所述第一支撐框17包括兩相對的第一側桿171。所述第一側桿171通過焊接、螺絲鎖固等固定方式固定在所述側板13上。所述第二支撐框18包括兩相對的第二側桿181。所述第二側桿181固定在所述側板13上。所述第一支撐框17的位置高於所述第二支撐框18的位置。A first support frame 17 and a second support frame 18 are disposed between the two side plates 13 . The plane of the first support frame 17 and the plane of the second support frame 18 are substantially perpendicular to the side plate 13 . The plane of the first support frame 17 and the plane of the second support frame 18 are parallel to each other, and are inclined with respect to the bottom plate 11, and the inclination angle is an acute angle, for example, an angle of 45 degrees. The first support frame 17 includes two opposite first side bars 171. The first side bar 171 is fixed to the side plate 13 by welding, screwing, or the like. The second support frame 18 includes two opposite second side bars 181. The second side bar 181 is fixed to the side plate 13. The position of the first support frame 17 is higher than the position of the second support frame 18.

所述第一橫樑151、所述底板11與兩所述側板13之間形成一進風口19。所述第二橫樑152、所述底板11與兩所述側板13之間形成一出風口191。每一側板13在靠近所述第一支撐框17及所述第二支撐框18處分別開設兩固定孔131。所述第一支撐框17開設有一第一風口175。所述第二支撐框18開設有一第二風口185。An air inlet 19 is formed between the first beam 151, the bottom plate 11 and the two side plates 13. An air outlet 191 is formed between the second beam 152, the bottom plate 11 and the two side plates 13. Two fixing holes 131 are respectively defined in the first support frame 17 and the second support frame 18 . The first support frame 17 defines a first air outlet 175. The second support frame 18 defines a second air outlet 185.

所述散熱元件20用於對一電子裝置進行散熱。一所述散熱元件20可用以安裝在所述第一支撐框17上。另一所述散熱元件20可用以安裝在所述第二支撐框18上。所述散熱元件20包括兩相對的外側面22,每一外側面22的上邊緣上設有一鎖固片21。所述鎖固片21開設通孔211。所述通孔211用以安裝一固定件23。在一實施方式中,兩所述散熱元件20分別為一熱交換機,所述固定件23為一伸縮螺絲。The heat dissipating component 20 is configured to dissipate heat from an electronic device. A heat dissipating component 20 can be used to mount on the first support frame 17. Another of the heat dissipating members 20 can be mounted on the second support frame 18. The heat dissipating component 20 includes two opposite outer side surfaces 22, and a locking piece 21 is disposed on an upper edge of each outer side surface 22. The locking piece 21 defines a through hole 211. The through hole 211 is for mounting a fixing member 23 . In one embodiment, the two heat dissipating components 20 are respectively a heat exchanger, and the fixing component 23 is a telescopic screw.

每一散熱元件20的所述外側面22上設有向外側凸出的四個定位柱221,所述四個定位柱221分別位於所述外側面22上的一梯形区域的四個頂點上。對應於每一外側面22上的四個所述定位柱221,所述側板13上設有四個導向槽132,所述導向槽132為沿豎直方向延伸的凹槽,且一端延伸出所述側板13的上邊緣,形成一上開口133。所述四個導向槽132相互分離且相互平行,每一個導向槽132可對應於一個定位柱221。The outer side surface 22 of each of the heat dissipating members 20 is provided with four positioning posts 221 protruding outwardly, and the four positioning posts 221 are respectively located at four vertices of a trapezoidal region on the outer side surface 22. Corresponding to the four positioning posts 221 on each of the outer side surfaces 22, the side plate 13 is provided with four guiding grooves 132, the guiding grooves 132 are grooves extending in the vertical direction, and one end extends out An upper edge of the side panel 13 defines an upper opening 133. The four guiding grooves 132 are separated from each other and parallel to each other, and each of the guiding grooves 132 may correspond to one positioning post 221 .

所述支撐板30的兩短邊分別固定在所述側板13上,一長邊與所述第一支撐框17相接,另一長邊與所述隔板50相接。所述支撐板30與所述底板11平行。The two short sides of the support plate 30 are respectively fixed on the side plate 13, a long side is in contact with the first support frame 17, and the other long side is in contact with the partition plate 50. The support plate 30 is parallel to the bottom plate 11.

所述隔板50的兩短邊分別固定在所述側板13上,一長邊與所述支撐板30相接,另一長邊與所述第二支撐框18相接。所述隔板50所在平面與所述支撐板30所在平面的夾角為銳角。The two short sides of the partition plate 50 are respectively fixed on the side plate 13, a long side is in contact with the support plate 30, and the other long side is in contact with the second support frame 18. The angle between the plane of the partition 50 and the plane of the support plate 30 is an acute angle.

請參閱圖4至圖6,組裝時,將一所述散熱元件20抬放至在所述第一支撐框17的上方,將所述散熱元件20的每一外側面22上的四個定位柱221分別與所述側板13上的四個導向槽132的上開口133對齊,將所述散熱元件20豎直向下移動,將每一定位柱221從對應的導向槽132的上開口133滑入,在所述導向槽132對所述定位柱221施加的限位元導向作用下,所述散熱元件20繼續向下移動,直到所述散熱元件20的下底面接觸到所述支撐板30及一側面接觸到所述第一支撐框17,再將所述散熱元件20上的所述固定件23收容固定於所述固定孔131中,此時,所述散熱元件20被固定在所述第一支撐框17和所述側板13上。用同樣的方法,將另一所述散熱元件20固定在所述第二支撐框18和所述側板上。這樣,兩所述散熱元件20被固定在所述殼體10中,且其中一所述散熱元件20的位置高於另一所述散熱元件20(如圖6所示)。所述殼體10用以安裝在一伺服器機櫃或其他電子裝置中。這樣,在安裝時,只需將所述殼體10安裝在伺服器機櫃或其他電子裝置中的對應位置即可。Referring to FIG. 4 to FIG. 6 , when assembling, a heat dissipating component 20 is lifted onto the first support frame 17 to position four positioning posts on each outer side 22 of the heat dissipating component 20 . 221 is respectively aligned with the upper opening 133 of the four guiding grooves 132 on the side plate 13, and the heat dissipating member 20 is vertically moved downward, and each positioning post 221 is slid into the upper opening 133 of the corresponding guiding groove 132. Under the guiding of the limiting element applied by the guiding slot 132 to the positioning post 221, the heat dissipating component 20 continues to move downward until the lower bottom surface of the heat dissipating component 20 contacts the supporting plate 30 and The side surface is in contact with the first support frame 17, and the fixing member 23 on the heat dissipating component 20 is received and fixed in the fixing hole 131. At this time, the heat dissipating component 20 is fixed at the first Support frame 17 and said side plate 13. In the same manner, another of the heat dissipating members 20 is fixed to the second support frame 18 and the side plates. Thus, the two heat dissipating members 20 are fixed in the casing 10, and one of the heat dissipating members 20 is positioned higher than the other of the heat dissipating members 20 (as shown in FIG. 6). The housing 10 is intended to be mounted in a server cabinet or other electronic device. Thus, at the time of installation, it is only necessary to mount the housing 10 at a corresponding position in a server cabinet or other electronic device.

請參閱圖4至圖6,使用時,風流自所述進風口19進入所述殼體10,由於兩所述散熱元件20一高一低,導致風流部分從所述第一風口175流入較高位置的所述散熱元件20然後從所述出風口191流出,部分從所述第二風口185流入較低位置的所述散熱元件20然後從所述出風口191流出。在這個過程中,由於所述隔板50的阻隔作用,從所述較高位置的所述散熱元件20流出的風流不會由所述第二風口185流入較低位置的所述散熱元件20,避免了兩所述散熱元件20工作時相互的干擾。Referring to FIG. 4 to FIG. 6 , in use, a wind flow enters the housing 10 from the air inlet 19 , and the air flow portion flows from the first air outlet 175 to a higher level due to the high and low heat dissipation elements 20 . The heat dissipating member 20 at the position then flows out of the air outlet 191, partially from the second tuyere 185 into the lower position of the heat dissipating member 20 and then flows out from the air outlet 191. In this process, due to the blocking action of the partition 50, the wind current flowing from the higher position of the heat dissipating member 20 does not flow from the second tuyere 185 into the lower position of the heat dissipating member 20, The mutual interference of the two heat dissipating elements 20 during operation is avoided.

綜上所述,本發明確已符合發明專利要求,爰依法提出專利申請。惟,以上所述者僅為本發明之較佳實施方式,舉凡熟悉本發明技藝之人士,爰依本發明之精神所作之等效修飾或變化,皆應涵蓋於以下之申請專利範圍內。In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above-mentioned preferred embodiments of the present invention are intended to be within the scope of the following claims.

10...殼體10. . . case

11...底板11. . . Bottom plate

13...側板13. . . Side panel

131...固定孔131. . . Fixed hole

132...導向槽132. . . The guide groove

133...上開口133. . . Upper opening

151...第一橫樑151. . . First beam

152...第二橫樑152. . . Second beam

16...操作梁16. . . Operating beam

17...第一支撐框17. . . First support frame

171...第一側桿171. . . First side rod

175...第一風口175. . . First air outlet

18...第二支撐框18. . . Second support frame

181...第二側桿181. . . Second side bar

185...第二風口185. . . Second air outlet

19...進風口19. . . Inlet

191...出風口191. . . Air outlet

20...散熱元件20. . . Heat sink

21...鎖固片twenty one. . . Locking piece

211...通孔211. . . Through hole

22...外側面twenty two. . . Outer side

221...定位柱221. . . Positioning column

23...固定件twenty three. . . Fastener

30...支撐板30. . . Support plate

50...隔板50. . . Partition

圖1是本發明散熱裝置一較佳實施例的立體分解圖。BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a perspective exploded view of a preferred embodiment of a heat sink of the present invention.

圖2是圖1的局部放大圖。Fig. 2 is a partial enlarged view of Fig. 1;

圖3是圖1的另一視角的立體圖。3 is a perspective view of another perspective of FIG. 1.

圖4是圖1的立體組裝圖。Fig. 4 is an assembled, isometric view of Fig. 1;

圖5是圖4的另一視角的立體圖。Figure 5 is a perspective view of another perspective of Figure 4.

圖6是圖4的又一視角的立體圖。Figure 6 is a perspective view of still another view of Figure 4.

10...殼體10. . . case

11...底板11. . . Bottom plate

13...側板13. . . Side panel

131...固定孔131. . . Fixed hole

132...導向槽132. . . The guide groove

133...上開口133. . . Upper opening

151...第一橫樑151. . . First beam

152...第二橫樑152. . . Second beam

16...操作梁16. . . Operating beam

17...第一支撐框17. . . First support frame

171...第一側桿171. . . First side rod

175...第一風口175. . . First air outlet

18...第二支撐框18. . . Second support frame

181...第二側桿181. . . Second side bar

185...第二風口185. . . Second air outlet

19...進風口19. . . Inlet

191...出風口191. . . Air outlet

20...散熱元件20. . . Heat sink

21...鎖固片twenty one. . . Locking piece

211...通孔211. . . Through hole

22...外側面twenty two. . . Outer side

221...定位柱221. . . Positioning column

23...固定件twenty three. . . Fastener

30...支撐板30. . . Support plate

Claims (10)

一種散熱裝置,包括有殼體及散熱元件,所述殼體包括有兩相對的側板,兩所述側板之間安裝有支撐框,且設有進風口及出風口,所述支撐框位於所述進風口及所述出風口之間,所述散熱元件包括兩相對的外側面,所述外側面上設有定位柱,所述側板上設有導向槽,安裝時,所述定位柱對準並滑入所述導向槽,所述散熱元件在所述定位柱與所述導向槽配合作用下沿靠近所述支撐架的方向移動,直到所述散熱元件抵靠在所述支撐框上,從而所述散熱元件固定在支撐框及兩所述側板上。A heat dissipating device includes a housing and a heat dissipating component, the housing includes two opposite side plates, and a support frame is disposed between the two side plates, and an air inlet and an air outlet are disposed, and the support frame is located at the Between the air inlet and the air outlet, the heat dissipating component includes two opposite outer sides, and the outer side surface is provided with a positioning post, and the side plate is provided with a guiding slot. When the positioning is aligned, the positioning post is aligned and Sliding into the guiding slot, the heat dissipating component moves in a direction close to the support frame when the positioning post cooperates with the guiding slot until the heat dissipating component abuts on the support frame, thereby The heat dissipating component is fixed on the support frame and the two side plates. 如申請專利範圍第1項所述之散熱裝置,其中所述支撐框所在平面垂直於所述側板,且與水平面成一銳角。The heat dissipating device of claim 1, wherein the support frame is located perpendicular to the side plate and at an acute angle to the horizontal plane. 如申請專利範圍第1項所述之散熱裝置,其中所述定位柱為從所述外側面側向延伸出來的柱體。The heat dissipating device of claim 1, wherein the positioning post is a cylinder extending laterally from the outer side surface. 如申請專利範圍第1項所述之散熱裝置,其中所述導向槽為沿豎直方向延伸的凹槽,且一端延伸出所述側板的上邊緣。The heat dissipating device of claim 1, wherein the guiding groove is a groove extending in a vertical direction, and one end extends from an upper edge of the side plate. 如申請專利範圍第1項所述之散熱裝置,其中所述外側面上設有四個定位柱,所述側板設有四個導向槽。The heat dissipating device of claim 1, wherein the outer side surface is provided with four positioning posts, and the side plates are provided with four guiding grooves. 如申請專利範圍第5項所述之散熱裝置,其中所述四個定位柱分別位於所述外側面上的一梯形区域的四個頂點上。The heat dissipating device of claim 5, wherein the four positioning posts are respectively located at four vertices of a trapezoidal region on the outer side surface. 如申請專利範圍第5項所述之散熱裝置,其中所述四個導向槽相互分離且相互平行。The heat dissipating device of claim 5, wherein the four guiding grooves are separated from each other and parallel to each other. 如申請專利範圍第1項所述之散熱裝置,其中所述側板上設有定位孔,所述外側面上設有固定件,安裝時,所述固定件收容固定於所述定位孔中。The heat dissipating device of claim 1, wherein the side plate is provided with a positioning hole, and the outer side surface is provided with a fixing member. When the device is installed, the fixing member is received and fixed in the positioning hole. 如申請專利範圍第1項所述之散熱裝置,其中所述散熱元件有兩個,所述支撐框包括有第一支撐框及第二支撐框,一所述散熱元件固定在所述第一支撐框上,另一所述散熱元件固定在所述第二支撐框上。The heat dissipation device of claim 1, wherein the heat dissipation component has two, the support frame includes a first support frame and a second support frame, and the heat dissipation component is fixed to the first support On the frame, another heat dissipating component is fixed on the second support frame. 如申請專利範圍第9項所述之散熱裝置,其中所述第一支撐框的位置高於所述第二支撐框的位置。The heat dissipating device of claim 9, wherein the position of the first support frame is higher than the position of the second support frame.
TW101115647A 2012-04-27 2012-05-02 Heat dissipating apparatus TW201344407A (en)

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