TW201343978A - Plating system and waste water treating method - Google Patents

Plating system and waste water treating method Download PDF

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TW201343978A
TW201343978A TW101114803A TW101114803A TW201343978A TW 201343978 A TW201343978 A TW 201343978A TW 101114803 A TW101114803 A TW 101114803A TW 101114803 A TW101114803 A TW 101114803A TW 201343978 A TW201343978 A TW 201343978A
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water
washing tank
water washing
reverse osmosis
tank
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TW101114803A
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Yu-Chung Huang
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Zhen Ding Technology Co Ltd
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Abstract

The present disclosure relates to a plating system. The plating system includes a first cleaning tank, a plating tank, a second cleaning tank, and a third cleaning tank, an ion exchange device, and a reverse osmosis device. The ion exchange device includes a tower body and a chelating type ion exchange resin. The tower body is connected between the second cleaning tank and the reverse osmosis device. The chelating type ion exchange resin is configured for exchanging ion with waste water from the second cleaning tank. The reverse osmosis device includes a reverse osmosis film for reverse osmosis treating the waste water from the ion exchange device, thereby gaining permeate water and rejected water. The reverse osmosis device includes a permeate water outlet and a rejected water outlet. The permeate water outlet is connected to the third cleaning tank. The rejected water outlet is connected to the first cleaning tank. The present disclosure also relates to a waste water treating method by using the plating system.

Description

電鍍系統及其廢水處理方法Electroplating system and wastewater treatment method thereof

本發明涉及一種電鍍技術,尤其涉及一種電鍍系統及電鍍系統之廢水處理方法。The invention relates to an electroplating technology, in particular to an electroplating system and a wastewater treatment method of an electroplating system.

隨著電子產業之飛速發展,作為電子產品基本構件之電路板之製作技術顯得越來越重要。電路板一般由覆銅基板經裁切、鑽孔、電鍍、曝光、顯影、蝕刻、壓合、印刷、成型等一系列工藝製作而成。具體可參閱C.H. Steer等人在Proceedings of the IEEE, Vol.39, No.2 (2002年8月)中發表之“Dielectric characterization of printed circuit board substrates”一文。其中,電鍍係電路板製作之一重要製作工藝,其主要使用電鍍系統對電路板表面進行選擇性鍍銅以及在通孔孔壁鍍銅。惟,電鍍過程中產生之含有大量重金屬銅離子之水洗廢水不僅給環境帶來嚴重污染,而且造成大量重金屬資源之流失。With the rapid development of the electronics industry, the production technology of circuit boards, which are the basic components of electronic products, is becoming more and more important. The circuit board is generally fabricated by a series of processes such as cutting, drilling, electroplating, exposure, development, etching, pressing, printing, and molding of a copper-clad substrate. For details, see "Dielectric characterization of printed circuit board substrates" by C. H. Steer et al., Proceedings of the IEEE, Vol. 39, No. 2 (August 2002). Among them, an important manufacturing process of electroplating circuit board production mainly uses a plating system to selectively plate copper on the surface of the circuit board and copper plating on the through hole wall. However, the washing wastewater containing a large amount of heavy metal copper ions generated during the electroplating process not only causes serious pollution to the environment, but also causes a large amount of heavy metal resources to be lost.

在電路板工廠,因水洗廢水來源過於複雜,大部分企業往往採用物理方法對水洗廢水進行處理。該物理方法係利用物理作用分離廢水中呈懸浮狀態之污染物質。該處理過程並不改變物質之化學性質,如混凝沈降。混凝沈降技術係指將適當數量之混凝劑(聚合氯化鋁、聚合硫酸鐵、陽離子聚丙烯醯胺等)投入水洗廢水中,經過充分混合、反應,使廢水中微小懸浮顆粒與膠體顆粒互相產生凝聚作用,成為顆粒較大、易於沈降之絮凝體,經過沈澱加以去除,而經過混凝沈降處理後之廢水則排至外界。惟,上述方法處理後之廢水直接排至外界,污染了環境,亦浪費了大量之水資源。In circuit board factories, because the source of washing wastewater is too complicated, most companies often use physical methods to treat washing wastewater. The physical method utilizes physical action to separate pollutants in a suspended state in the wastewater. This process does not alter the chemical nature of the material, such as coagulation sedimentation. Coagulation sedimentation technology refers to the injection of an appropriate amount of coagulant (polyaluminum chloride, polyferric sulfate, cationic polydecylamine, etc.) into the washing wastewater, and after thorough mixing and reaction, the micro-suspended particles and colloidal particles in the wastewater The coagulation acts on each other and becomes a floc with large particles and easy to settle. It is removed by precipitation, and the wastewater after coagulation and sedimentation is discharged to the outside. However, the wastewater treated by the above method is directly discharged to the outside world, pollutes the environment and wastes a large amount of water resources.

故,有必要提供一種可有效地迴圈利用水洗廢水之電鍍系統及電鍍系統之廢水處理方法。Therefore, it is necessary to provide a wastewater treatment method for an electroplating system and an electroplating system that can effectively recycle water washing wastewater.

以下將以實施例說明一種電鍍系統及電鍍系統之廢水處理方法。Hereinafter, a wastewater treatment method of an electroplating system and an electroplating system will be described by way of examples.

一種電鍍系統,其包括一電鍍設備及廢水處理設備。該電鍍設備包括依次相鄰設置之第一水洗槽、電鍍槽、第二水洗槽及第三水洗槽。所述第一水洗槽用於對待電鍍工件進行水洗。所述電鍍槽用於對工件進行電鍍。所述第二水洗槽與第三水洗槽用於對電鍍後之工件進行水洗。該廢水處理設備包括離子交換裝置及逆滲透裝置。所述離子交換裝置包括塔體及收容於所述塔體內之重金屬選擇性離子交換樹脂。所述塔體具有塔體進液口及塔體出液口。所述塔體進液口與所述第二水洗槽相連。所述第二水洗槽與塔體進液口之間安裝有第一進液閥。所述塔體出液口與逆滲透裝置相連通。所述塔體出液口與逆滲透裝置之間安裝有第二進液閥。所述重金屬選擇性離子交換樹脂用於與水洗廢水進行離子交換。所述逆滲透裝置內設有逆滲透膜,用於對離子交換後之水洗廢水進行逆滲透處理,以獲得相互分離之純水及濃水。所述逆滲透裝置具有一純水流出口及一濃水流出口。所述純水流出口與所述第三水洗槽相連,用於將所述逆滲透裝置處理後產生之純水輸送至所述第三水洗槽。所述濃水流出口與所述第一水洗槽相連,用於將所述逆滲透裝置處理後產生之濃水輸送至所述第一水洗槽。An electroplating system includes an electroplating apparatus and a wastewater treatment apparatus. The electroplating apparatus includes a first water washing tank, a plating tank, a second water washing tank and a third water washing tank which are disposed adjacent to each other in sequence. The first water washing tank is used for water washing of the workpiece to be plated. The plating bath is used to plate a workpiece. The second water washing tank and the third water washing tank are used for water washing the electroplated workpiece. The wastewater treatment facility includes an ion exchange device and a reverse osmosis device. The ion exchange apparatus includes a tower body and a heavy metal selective ion exchange resin housed in the tower body. The tower body has a tower body inlet port and a tower body outlet port. The tower body inlet is connected to the second water washing tank. A first inlet valve is installed between the second water washing tank and the liquid inlet of the tower body. The tower body outlet is in communication with the reverse osmosis unit. A second inlet valve is installed between the tower body outlet and the reverse osmosis unit. The heavy metal selective ion exchange resin is used for ion exchange with water washing wastewater. The reverse osmosis device is provided with a reverse osmosis membrane for performing reverse osmosis treatment on the ion-washed wastewater after ion exchange to obtain pure water and concentrated water separated from each other. The reverse osmosis device has a pure water outlet and a concentrated water outlet. The pure water outflow port is connected to the third water washing tank for conveying pure water generated after the reverse osmosis device treatment to the third water washing tank. The concentrated water outlet is connected to the first water washing tank for conveying concentrated water generated after the reverse osmosis device treatment to the first water washing tank.

一種電鍍系統之廢水處理方法,其包括以下步驟:提供上述電鍍系統;將所述第二水洗槽產生之水洗廢水注入所述塔體;對塔體內之水洗廢水進行離子置換處理,從而得到離子置換後之水洗廢水;將所述離子置換後之水洗廢水注入所述逆滲透裝置,對所述逆滲透裝置內之水洗廢水進行逆滲透處理,從而獲得相互分離之純水及濃水;以及將獲得之純水注入所述第三水洗槽,並將獲得之濃水注入所述第一水洗槽。A wastewater treatment method for an electroplating system, comprising the steps of: providing the electroplating system; injecting the washing wastewater generated by the second water washing tank into the tower body; performing ion displacement treatment on the washing wastewater in the tower body, thereby obtaining ion replacement Then washing the wastewater; injecting the ion-washed wastewater into the reverse osmosis device, performing reverse osmosis treatment on the washing wastewater in the reverse osmosis device, thereby obtaining mutually separated pure water and concentrated water; and obtaining The pure water is injected into the third water washing tank, and the obtained concentrated water is injected into the first water washing tank.

本技術方案之電鍍系統與該電鍍系統之廢水處理方法,其先利用離子交換裝置及逆滲透裝置對水洗廢水進行處理,而後將處理後所獲得之純水及濃水分別補充至第三水洗槽及第一水洗槽內,不僅可以不斷地給第三水洗槽及第一水洗槽補充部分水,提高了水洗廢水之利用率,而且可以有效地減少水洗廢水污染環境之可能。The electroplating system of the technical solution and the wastewater treatment method of the electroplating system first treat the washing wastewater by using an ion exchange device and a reverse osmosis device, and then replenish the pure water and the concentrated water obtained after the treatment to the third water washing tank respectively. In the first water washing tank, not only the third water washing tank and the first water washing tank can be continuously added with a part of water, thereby improving the utilization rate of the washing wastewater, and effectively reducing the possibility that the washing wastewater pollutes the environment.

下面將結合附圖與實施例對本技術方案之電鍍系統及電鍍系統之廢水處理方法。Hereinafter, the wastewater treatment system of the electroplating system and the electroplating system of the present technical solution will be described with reference to the accompanying drawings and the embodiments.

請參閱圖1,本技術方案較佳實施例提供一種電鍍系統100,用於對一電路基板(圖未示)進行電鍍處理,並對電鍍處理工藝中產生之廢水進行處理,以使得處理後之廢水可以回用於電鍍處理工藝中。電鍍系統100包括電鍍設備10及與電鍍設備10相連之廢水處理設備20。Referring to FIG. 1 , a preferred embodiment of the present invention provides an electroplating system 100 for performing electroplating treatment on a circuit substrate (not shown) and processing the wastewater generated in the electroplating process to enable processing. Waste water can be reused in the electroplating process. The electroplating system 100 includes an electroplating apparatus 10 and a wastewater treatment apparatus 20 connected to the electroplating apparatus 10.

電鍍設備10用於對電路基板進行電鍍處理,其包括第一水洗槽11、第四水洗槽12、電鍍槽16、第二水洗槽13、第三水洗槽14及第五水洗槽15。第五水洗槽15位於第二水洗槽13及第三水洗槽14之間。第一水洗槽11、第四水洗槽12、電鍍槽16、第二水洗槽13、第三水洗槽14及第五水洗槽15依次相鄰設置。電路基板在進行電鍍處理時,依次進入以進行電鍍前水洗、電鍍及電鍍後水洗等製程。The electroplating apparatus 10 is used for electroplating a circuit substrate, and includes a first water washing tank 11, a fourth water washing tank 12, a plating tank 16, a second water washing tank 13, a third water washing tank 14, and a fifth water washing tank 15. The fifth washing tank 15 is located between the second washing tank 13 and the third washing tank 14. The first washing tank 11, the fourth washing tank 12, the plating tank 16, the second washing tank 13, the third washing tank 14, and the fifth washing tank 15 are sequentially disposed adjacent to each other. When the circuit substrate is subjected to the plating treatment, it is sequentially subjected to a process such as water washing before plating, plating, and water washing after plating.

第一水洗槽11與第四水洗槽12均用於對電鍍前之電路基板進行水洗。第一水洗槽11具有一第一進液口101及一第一出液口103。第一進液口101與廢水處理設備20相連。第一出液口103藉由廢液排出管105與一廢水收集池(圖未示)相連,以使第一水洗槽11內之水洗廢水可以藉由廢液排出管105流入與廢液排出管105相連之廢水收集池。第四水洗槽12具有一第四進液口121。第四進液口121藉由水洗水輸送管123與水洗水供給池125相連,以對第四水洗槽12內之水進行補給。由於第四水洗槽12內之水較第一水洗槽11內之水乾淨,因而第四水洗槽12與第一水洗槽11之間具有一溢流口107,以使第四水洗槽12內之水可溢入第一水洗槽11,以給第一水洗槽11補充部分水。Both the first washing tank 11 and the fourth washing tank 12 are used to wash the circuit board before plating. The first washing tank 11 has a first liquid inlet 101 and a first liquid outlet 103. The first liquid inlet 101 is connected to the wastewater treatment facility 20. The first liquid outlet 103 is connected to a waste water collection tank (not shown) by the waste liquid discharge pipe 105, so that the water washing waste water in the first water washing tank 11 can flow into the waste liquid discharge pipe through the waste liquid discharge pipe 105. 105 connected wastewater collection tanks. The fourth washing tank 12 has a fourth liquid inlet 121. The fourth liquid inlet 121 is connected to the water washing water supply tank 125 by the water washing water supply pipe 123 to replenish the water in the fourth water washing tank 12. Since the water in the fourth water washing tank 12 is cleaner than the water in the first water washing tank 11, an overflow port 107 is provided between the fourth water washing tank 12 and the first water washing tank 11 so that the water in the fourth water washing tank 12 is Water may overflow into the first washing tank 11 to replenish the first washing tank 11 with a portion of the water.

電鍍槽16內盛置有電鍍液,用於對電路基板進行電鍍。A plating solution is placed in the plating bath 16 for plating the circuit board.

第二水洗槽13、第三水洗槽14及第五水洗槽15均用於對電鍍後之電路基板進行水洗。第二水洗槽13具有一第二出液口132、一第二進液口133、一廢液排出口135、一反洗水出液口137、及一反洗水進液口139。第二出液口132、第二進液口133、反洗水出液口137及反洗水進液口139均與廢水處理設備20相連。廢液排出口135藉由廢液排出管136將第二水洗槽13內之部分水洗廢水注入與廢液排出管105相連之廢水收集池。第三水洗槽14具有兩個第三進液口141及143。一第三進液口141與廢水處理設備20相連。另一第三進液口143藉由水洗水輸送管123與水洗水供給池125相連,以對第三水洗槽14內之水進行補給。The second washing tank 13, the third washing tank 14, and the fifth washing tank 15 are both used for washing the plated circuit board. The second washing tank 13 has a second liquid outlet 132, a second liquid inlet 133, a waste liquid discharge port 135, a backwash water outlet port 137, and a backwash water inlet port 139. The second liquid outlet 132, the second liquid inlet 133, the backwash water outlet 137, and the backwash water inlet 139 are all connected to the wastewater treatment facility 20. The waste liquid discharge port 135 injects a part of the water washing waste water in the second water washing tank 13 into the waste water collection tank connected to the waste liquid discharge pipe 105 by the waste liquid discharge pipe 136. The third washing tank 14 has two third liquid inlets 141 and 143. A third liquid inlet 141 is connected to the wastewater treatment facility 20. The other third liquid inlet 143 is connected to the water washing water supply tank 125 by the water washing water supply pipe 123 to replenish the water in the third water washing tank 14.

由於第三水洗槽14內之水較第五水洗槽15內之水乾淨,第五水洗槽15內之水較第二水洗槽13乾淨,因而第二水洗槽13與第五水洗槽15之間具有一溢流口131、第三水洗槽14與第五水洗槽15之間具有一溢流口145,以使第三水洗槽14內之水可溢入第五水洗槽15,第五水洗槽15內之水可溢入第二水洗槽13。Since the water in the third washing tank 14 is cleaner than the water in the fifth washing tank 15, the water in the fifth washing tank 15 is cleaner than the second washing tank 13, so that between the second washing tank 13 and the fifth washing tank 15 There is an overflow port 131, an overflow tank 145 between the third water washing tank 14 and the fifth water washing tank 15, so that the water in the third water washing tank 14 can overflow into the fifth water washing tank 15, the fifth water washing tank The water in 15 can overflow into the second washing tank 13.

電路基板依次被傳送經第一水洗槽11及第四水洗槽12內之水清洗後,進入電鍍槽16內進行電鍍。電鍍後之電路基板再依次被傳送經第二水洗槽13、第五水洗槽15及第三水洗槽14內之水清洗後進入後續製程,例如曝光、顯影、蝕刻、壓合、印刷、成型等。The circuit board is sequentially transported through the water in the first water washing tank 11 and the fourth water washing tank 12, and then enters the plating tank 16 for electroplating. The circuit board after electroplating is sequentially transported through the water in the second water washing tank 13, the fifth water washing tank 15 and the third water washing tank 14, and then enters a subsequent process, such as exposure, development, etching, pressing, printing, molding, etc. .

本發明所屬技術領域具有通常知識者可以理解,第一水洗槽11與第四水洗槽12之間亦可以再設有一水洗槽、兩個水洗槽或者更多個水洗槽,主要依據待清洗之電路基板需達到之品質要求而具體設定。本發明所屬技術領域具有通常知識者還可以理解,第二水洗槽13及第三水洗槽14之間還可以具有兩個水洗槽、三個水洗槽或者更多個水洗槽,主要根據待清洗之電路基板需達到之品質要求而具體設定。It is understood by those skilled in the art that a water washing tank, two water washing tanks or more water washing tanks may be further disposed between the first water washing tank 11 and the fourth water washing tank 12, mainly according to the circuit to be cleaned. The substrate needs to meet the quality requirements and be specifically set. It is also understood by those skilled in the art that there may be two water washing tanks, three water washing tanks or more water washing tanks between the second water washing tank 13 and the third water washing tank 14 , mainly according to the water to be cleaned. The circuit board needs to meet the quality requirements and be specifically set.

請一併參閱圖圖2,廢水處理設備20用於對第二水洗槽13產生之水洗廢水進行淨化再生處理,並將淨化再生後之水回用於第三水洗槽14與第一水洗槽11。廢水處理設備20包括離子交換裝置21、連接於第二水洗槽13與離子交換裝置21之間之濾芯裝置80、逆滲透裝置50、及連接於離子交換裝置21與逆滲透裝置50之間之緩衝槽90。其中,第二水洗槽13產生之水洗廢水先經過濾芯裝置80,然後通過離子交換裝置21,再進入緩衝槽90,最後經過逆滲透裝置50回用於第三水洗槽14與第一水洗槽11。Referring to FIG. 2 together, the wastewater treatment device 20 is used for purifying and regenerating the washing wastewater generated by the second water washing tank 13, and returning the purified water to the third water washing tank 14 and the first water washing tank 11 . The wastewater treatment apparatus 20 includes an ion exchange device 21, a filter element device 80 connected between the second water washing tank 13 and the ion exchange unit 21, a reverse osmosis unit 50, and a buffer connected between the ion exchange unit 21 and the reverse osmosis unit 50. Slot 90. The water washing waste water generated by the second washing tank 13 passes through the filter core device 80, passes through the ion exchange device 21, enters the buffer tank 90, and finally passes through the reverse osmosis device 50 for the third water washing tank 14 and the first water washing tank 11 .

具體地,濾芯裝置80內安裝有過濾材料,用於將第二水洗槽13內之水洗廢水中較大顆粒之雜質在水洗廢水注入離子交換裝置21之前濾出。濾芯裝置80具有一濾芯進液口801及一濾芯出液口803。濾芯進液口801藉由第一輸液管31與第二水洗槽13之第二出液口132相連,從而使得第二水洗槽13內之水洗廢水依次經由第二出液口132、第一輸液管31、濾芯進液口801注入濾芯裝置80內。濾芯出液口803藉由第二輸液管32與離子交換裝置21相連通。第二輸液管32上安裝有第一進液閥40,從而使得經濾芯裝置80過濾後之第二水洗槽13內之水洗廢水依次經由濾芯出液口803、第二輸液管32及第一進液閥40注入離子交換裝置21。Specifically, the filter element device 80 is provided with a filter material for filtering out impurities of larger particles in the washing water in the second washing tank 13 before the washing wastewater is injected into the ion exchange device 21. The filter element device 80 has a filter inlet 801 and a filter outlet 803. The filter inlet 801 is connected to the second outlet 132 of the second washing tank 13 by the first infusion tube 31, so that the washing wastewater in the second washing tank 13 is sequentially passed through the second outlet 132 and the first infusion. The tube 31 and the filter inlet port 801 are injected into the filter element unit 80. The filter outlet port 803 communicates with the ion exchange device 21 via the second infusion tube 32. The first infusion valve 40 is mounted on the second infusion tube 32, so that the washing wastewater in the second washing tank 13 filtered by the filter device 80 is sequentially passed through the filter outlet port 803, the second infusion tube 32, and the first inlet. The liquid valve 40 is injected into the ion exchange device 21.

離子交換裝置21用於對來自第二水洗槽13之經過濾芯裝置80過濾之水洗廢水進行離子交換處理,以使得來自第二水洗槽13之經過濾芯裝置80過濾之水洗廢水中之銅離子與水洗廢水相分離。離子交換裝置21包括塔體201及收容於塔體201內之重金屬選擇性離子交換樹脂203。重金屬選擇性離子交換樹脂203用於吸附來自第二水洗槽13之經過濾芯裝置80過濾之水洗廢水中之銅離子。The ion exchange device 21 is configured to perform ion exchange treatment on the washed wastewater filtered by the filter element device 80 from the second water washing tank 13 to wash the copper ions and water in the washing wastewater filtered by the filter core device 80 from the second water washing tank 13. The wastewater phase is separated. The ion exchange device 21 includes a column body 201 and a heavy metal selective ion exchange resin 203 housed in the column body 201. The heavy metal selective ion exchange resin 203 is for adsorbing copper ions in the water washing wastewater filtered by the filter element device 80 from the second water washing tank 13.

舉例而言,塔體201可以為容積為4L之塔,重金屬選擇性離子交換樹脂203可以為含亞氨基二乙酸(IDA)基團之Amberlite IRC 748樹脂,且重金屬選擇性離子交換樹脂203之體積為2L。當然,重金屬選擇性離子交換樹脂203亦可以為聚苯乙烯三乙醇胺樹脂或三乙烯四胺型樹脂或其他重金屬選擇性樹脂。For example, the column body 201 may be a 4 L column, and the heavy metal selective ion exchange resin 203 may be an Aminodiacetic acid (IDA) group-containing Amberlite IRC 748 resin, and the volume of the heavy metal selective ion exchange resin 203. It is 2L. Of course, the heavy metal selective ion exchange resin 203 may also be a polystyrene triethanolamine resin or a triethylenetetramine type resin or other heavy metal selective resin.

塔體201具有依次連通之塔體進液口2011、內部空腔2012及塔體出液口2013。塔體進液口2011藉由第二輸液管32與濾芯出液口803相連,從而使得來自第二水洗槽13之水洗廢水依次經由第一輸液管31、濾芯裝置80、第二輸液管32、第一進液閥40及塔體進液口2011注入塔體201之內部空腔2012,以與重金屬選擇性離子交換樹脂203發生離子交換反應,從而降低水洗廢水中銅離子之含量。水洗廢水之流量為12升/小時-64升/小時。本實施方式中,水洗廢水之流量為60升/小時。The tower body 201 has a tower body inlet port 2011, an internal cavity 2012, and a tower body outlet port 2013 which are sequentially connected. The tower body inlet port 2011 is connected to the filter element outlet port 803 by the second infusion tube 32, so that the washing wastewater from the second water washing tank 13 is sequentially passed through the first infusion tube 31, the filter element device 80, the second infusion tube 32, The first inlet valve 40 and the column inlet port 2011 are injected into the internal cavity 2012 of the column body 201 to undergo an ion exchange reaction with the heavy metal selective ion exchange resin 203, thereby reducing the content of copper ions in the washing wastewater. The flow rate of the washing wastewater is from 12 liters/hour to 64 liters/hour. In the present embodiment, the flow rate of the washing wastewater is 60 liters/hour.

塔體出液口2013藉由第三輸液管33及緩衝槽90與逆滲透裝置50相連,以將經重金屬選擇性離子交換樹脂203處理過之水洗廢水注入逆滲透裝置50。第三輸液管33安裝有第二進液閥41。The tower body outlet port 2013 is connected to the reverse osmosis unit 50 via the third infusion tube 33 and the buffer tank 90 to inject the washed wastewater treated with the heavy metal selective ion exchange resin 203 into the reverse osmosis unit 50. The third infusion tube 33 is mounted with a second inlet valve 41.

離子交換裝置21還連接有一再生處理池17與一廢水收集池19。再生處理池17內盛置有再生處理液18,再生處理池17藉由第一連接管61與塔體201之塔體進液口2011相連,廢水收集池19藉由第二連接管62與塔體出液口2013相連。第一連接管61安裝有第三進液閥42,第二連接管62安裝有第四進液閥43。當重金屬選擇性離子交換樹脂203吸附能力飽和時,為了使得重金屬選擇性離子交換樹脂203再生以恢復其吸附能力,可以關閉第一進液閥40、第二進液閥41、第五進液閥44及第六進液閥45,並開啟第三進液閥42及第四進液閥43,以使再生處理液18藉由第一連接管61、第三進液閥42、塔體進液口2011進入內部空腔2012,對重金屬選擇性離子交換樹脂203進行再生處理。再生處理液18可為5%~20%(體積百分比)之硫酸或者鹽酸,且其流速範圍為4升/小時~8升/小時。優選地,本實施方式中,再生處理液18為10%硫酸,且其流速為6升/小時。再生處理液18可與重金屬選擇性離子交換樹脂203發生離子交換反應,以將吸附在重金屬選擇性離子交換樹脂203上之銅離子從重金屬選擇性離子交換樹脂203移除。發生離子交換反應後攜帶銅離子之再生處理液18依次經由塔體出液口2013、第四進液閥43及第二連接管62注入廢水收集池19,以備進行後續處理,例如重新注入電鍍槽16或者進行濃縮或者廢棄。The ion exchange unit 21 is also connected to a regeneration treatment tank 17 and a waste water collection tank 19. The regeneration treatment tank 17 is provided with a regeneration treatment liquid 18, and the regeneration treatment tank 17 is connected to the tower body inlet port 2011 of the tower body 201 by the first connection pipe 61, and the wastewater collection tank 19 is connected to the tower by the second connection pipe 62. The body outlets 2013 are connected. The first connecting pipe 61 is mounted with a third inlet valve 42, and the second connecting pipe 62 is mounted with a fourth inlet valve 43. When the adsorption capacity of the heavy metal selective ion exchange resin 203 is saturated, in order to regenerate the heavy metal selective ion exchange resin 203 to restore its adsorption capacity, the first inlet valve 40, the second inlet valve 41, and the fifth inlet valve may be closed. 44 and the sixth inlet valve 45, and the third inlet valve 42 and the fourth inlet valve 43 are opened, so that the regeneration treatment liquid 18 is fed through the first connection pipe 61, the third inlet valve 42, and the tower body. The port 2011 enters the internal cavity 2012 to regenerate the heavy metal selective ion exchange resin 203. The regeneration treatment liquid 18 may be 5% to 20% by volume of sulfuric acid or hydrochloric acid, and its flow rate ranges from 4 liters/hour to 8 liters/hour. Preferably, in the present embodiment, the regeneration treatment liquid 18 is 10% sulfuric acid, and the flow rate thereof is 6 liters/hour. The regeneration treatment liquid 18 may undergo an ion exchange reaction with the heavy metal selective ion exchange resin 203 to remove copper ions adsorbed on the heavy metal selective ion exchange resin 203 from the heavy metal selective ion exchange resin 203. The regeneration treatment liquid 18 carrying the copper ions after the ion exchange reaction occurs is sequentially injected into the wastewater collection tank 19 via the tower body outlet port 2013, the fourth inlet valve 43 and the second connection pipe 62 for subsequent processing, such as re-injection plating. The tank 16 is either concentrated or discarded.

本發明所屬技術領域具有通常知識者可以理解,再生處理池17與第三進液閥42之間、第四進液閥43與廢水收集池19之間亦可以具有高壓泵,以便於經由再生處理池17內之再生處理液18及攜帶銅離子之再生處理液18可以更容易得注入相應之塔體201及廢水收集池19。It will be understood by those skilled in the art that a high pressure pump can also be provided between the regeneration treatment tank 17 and the third inlet valve 42 and between the fourth inlet valve 43 and the waste water collection tank 19 to facilitate the regeneration treatment. The regeneration treatment liquid 18 in the tank 17 and the regeneration treatment liquid 18 carrying copper ions can be more easily injected into the corresponding column body 201 and the wastewater collection tank 19.

優選地,塔體201之塔體出液口2013還藉由第三連接管63與第二水洗槽13之反洗水出液口137相連,塔體201之塔體進液口2011還藉由第四連接管64與第二水洗槽13之反洗水進液口139相連。所述第三連接管63安裝有第五進液閥44,所述第四連接管64安裝有第六進液閥45。經過一段時間之離子交換,塔體201內會殘留一些水洗廢水帶入塔體201內之雜質及破碎之重金屬選擇性離子交換樹脂203,該些雜質及破碎之重金屬選擇性離子交換樹脂203與較大塊之重金屬選擇性離子交換樹脂203混合在一起,影響了較大塊之重金屬選擇性離子交換樹脂203對銅離子之吸附能力,為了將該些雜質及破碎之重金屬選擇性離子交換樹脂203與較大塊之重金屬選擇性離子交換樹脂203分離以提高較大塊之重金屬選擇性離子交換樹脂203之吸附能力,需要對塔體201進行反洗。反洗過程中,關閉第一進液閥40、第二進液閥41、第三進液閥42及第四進液閥43,開啟第五進液閥44及第六進液閥45,以使第二水洗槽13內之水洗廢水依次經由第五進液閥44、第三連接管63從塔體201之塔體出液口2013注入塔體201,以對塔體201進行反洗,從而使得水洗廢水將該些雜質及破碎之重金屬選擇性離子交換樹脂203從塔體201底部帶至塔體201頂部。移至塔體201頂部之該些雜質及破碎之重金屬選擇性離子交換樹脂203隨著水洗廢水從塔體進液口2011依次經由第六進液閥45及第四連接管64注入第二水洗槽13內,從而將該些雜質及破碎之重金屬選擇性離子交換樹脂203與較大塊之重金屬選擇性離子交換樹脂203分離,提高重金屬選擇性離子交換樹脂203對銅離子之吸附能力。Preferably, the tower body outlet port 2013 of the tower body 201 is also connected to the backwash water outlet port 137 of the second water washing tank 13 by the third connecting pipe 63, and the tower body inlet port 2011 of the tower body 201 is also The fourth connecting pipe 64 is connected to the backwashing water inlet 139 of the second washing tank 13. The third connecting pipe 63 is mounted with a fifth inlet valve 44, and the fourth connecting pipe 64 is mounted with a sixth inlet valve 45. After a period of ion exchange, some impurities in the tower body 201 and the broken heavy metal selective ion exchange resin 203 are left in the tower body 201, and the impurities and the broken heavy metal selective ion exchange resin 203 are compared. The bulky heavy metal selective ion exchange resin 203 is mixed together, which affects the adsorption capacity of the bulky heavy metal selective ion exchange resin 203 for copper ions, in order to separate the impurities and the broken heavy metal selective ion exchange resin 203 with The larger block of heavy metal selective ion exchange resin 203 is separated to increase the adsorption capacity of the larger bulk heavy metal selective ion exchange resin 203, and the column 201 needs to be backwashed. During the backwashing process, the first inlet valve 40, the second inlet valve 41, the third inlet valve 42 and the fourth inlet valve 43 are closed, and the fifth inlet valve 44 and the sixth inlet valve 45 are opened to The water washing waste water in the second water washing tank 13 is sequentially injected into the tower body 201 from the tower body liquid outlet port 2013 of the tower body 201 via the fifth inlet valve 44 and the third connecting pipe 63 to backwash the tower body 201, thereby The water washing wastewater is caused to bring the impurities and the broken heavy metal selective ion exchange resin 203 from the bottom of the column body 201 to the top of the column body 201. The impurities and the broken heavy metal selective ion exchange resin 203 moved to the top of the tower body 201 are sequentially injected into the second water washing tank through the sixth inlet valve 45 and the fourth connecting pipe 64 from the tower body inlet port 2011 with the washing wastewater. 13 thereby separating the impurities and the broken heavy metal selective ion exchange resin 203 from the larger heavy metal selective ion exchange resin 203 to improve the adsorption capacity of the heavy metal selective ion exchange resin 203 for copper ions.

本發明所屬技術領域具有通常知識者可以理解,第二水洗槽13與第五進液閥44之間可以具有高壓泵,以便於第二水洗槽13內之水洗廢水可以更容易地從塔體出液口2013注入塔體201;第二水洗槽13與第六進液閥45之間亦可以就有高壓泵,以便於攜帶雜質及破碎之重金屬選擇性離子交換樹脂203之水洗廢水可以更容易地從塔體進液口2011注入第二水洗槽13。It will be understood by those skilled in the art that a high pressure pump can be provided between the second water washing tank 13 and the fifth liquid inlet valve 44 so that the washing water in the second water washing tank 13 can be more easily discharged from the tower body. The liquid port 2013 is injected into the tower body 201; there may also be a high pressure pump between the second water washing tank 13 and the sixth liquid inlet valve 45, so that the washing waste water carrying the impurities and the broken heavy metal selective ion exchange resin 203 can be more easily The second water washing tank 13 is injected from the tower body inlet port 2011.

另外,對塔體201進行反洗所用之水亦可以來自第一水洗槽11、第四水洗槽12或者第五水洗槽15,反洗後之水亦可以注入第一水洗槽11、第四水洗槽12或者第五水洗槽15。In addition, the water used for backwashing the tower body 201 may also be from the first water washing tank 11, the fourth water washing tank 12 or the fifth water washing tank 15, and the backwashed water may be injected into the first water washing tank 11 and the fourth water washing tank. The tank 12 or the fifth washing tank 15.

需要說明的是,本實施例中,為使得重金屬選擇性離子交換樹脂203具有較好之離子交換品質,使用濾芯裝置80將來自第二水洗槽13之水洗廢水中較大顆粒之雜質在水洗廢水注入離子交換裝置21之前濾出,以防止重金屬選擇性離子交換樹脂203受到水洗廢水中較大顆粒雜質之衝擊而變碎,及防止水洗廢水中較大顆粒雜質包圍重金屬選擇性離子交換樹脂203而降低重金屬選擇性離子交換樹脂203對銅離子之吸附能力。當然,本發明所屬技術領域具有通常知識者可以理解,濾芯裝置80並非必要技術特徵。即使濾芯裝置80省略不要,即,離子交換裝置21直接與第二水洗槽13相連通,亦可以實現對來自第二水洗槽13之水洗廢水之離子交換處理。It should be noted that, in this embodiment, in order to make the heavy metal selective ion exchange resin 203 have better ion exchange quality, the filter element device 80 is used to wash the impurities of the larger particles in the washing wastewater from the second water washing tank 13 in the water washing wastewater. Filtered out before being injected into the ion exchange unit 21 to prevent the heavy metal selective ion exchange resin 203 from being crushed by the impact of larger particulate impurities in the water washing waste water, and preventing large particle impurities in the water washing waste water from surrounding the heavy metal selective ion exchange resin 203. The adsorption capacity of the heavy metal selective ion exchange resin 203 for copper ions is lowered. Of course, it will be understood by those skilled in the art that the filter cartridge device 80 is not a necessary technical feature. Even if the filter element device 80 is omitted, that is, the ion exchange device 21 is directly in communication with the second water washing tank 13, the ion exchange treatment of the washing wastewater from the second water washing tank 13 can be realized.

本發明所屬技術領域具有通常知識者可以理解,第二水洗槽13與濾芯裝置80之間可以具有高壓泵,以便於第二水洗槽13內之水洗廢水可以更容易地注入濾芯裝置80;濾芯裝置80與離子交換裝置21之間亦可以就有高壓泵,以便於經濾芯裝置80過濾後之水洗廢水可以更容易地從塔體進液口2011注入塔體201。It will be understood by those skilled in the art that a high pressure pump can be provided between the second washing tank 13 and the filter element device 80, so that the washing water in the second washing tank 13 can be more easily injected into the filter device 80; the filter device There may also be a high pressure pump between the 80 and the ion exchange unit 21 so that the water washing waste water filtered by the filter unit 80 can be more easily injected into the tower body 201 from the tower inlet port 2011.

緩衝槽90連接於離子交換裝置21與逆滲透裝置50之間,以將經由離子交換裝置21處理後之水洗廢水暫時存儲,從而減輕逆滲透裝置50之負荷量。緩衝槽90具有一緩衝進液口903、緩衝出液口905及一緩衝溢流口901。緩衝進液口903藉由第三輸液管33與塔體出液口2013相連,以使經由離子交換裝置21處理後之水洗廢水可以注入緩衝槽90。緩衝出液口905藉由第四輸液管34與逆滲透裝置50相連,以使緩衝槽90內之水洗廢水可以注入逆滲透裝置50。緩衝槽90藉由緩衝溢流口901及溢流連接管65與第二水洗槽13之第二進液口133相連,以使到達緩衝溢流口901之經由離子交換裝置21處理後之水洗廢水可以藉由溢流連接管65注入第二水洗槽13內。The buffer tank 90 is connected between the ion exchange device 21 and the reverse osmosis device 50 to temporarily store the washing wastewater treated by the ion exchange device 21, thereby reducing the load of the reverse osmosis device 50. The buffer tank 90 has a buffer inlet port 903, a buffer outlet port 905, and a buffer overflow port 901. The buffer inlet port 903 is connected to the column body outlet port 2013 by the third infusion tube 33 so that the washing waste water treated by the ion exchange device 21 can be injected into the buffer tank 90. The buffer outlet port 905 is connected to the reverse osmosis unit 50 by the fourth infusion tube 34 so that the washing wastewater in the buffer tank 90 can be injected into the reverse osmosis unit 50. The buffer tank 90 is connected to the second liquid inlet 133 of the second water washing tank 13 through the buffer overflow port 901 and the overflow connecting pipe 65, so that the washing water discharged to the buffer overflow port 901 via the ion exchange device 21 can be The second water washing tank 13 is injected through the overflow connecting pipe 65.

逆滲透裝置50用於對經重金屬選擇性離子交換樹脂203處理後之來自緩衝槽90之水洗廢水進行逆滲透處理,從而可以獲得相分離之純水及濃水。純水係水中之強電解質與弱電解質(如SiO2、CO2等)去除或降低到一定程度之水,其在25攝氏度之室溫下,電導率範圍為:2.0μS/cm-40.0μS/cm。濃水係將經重金屬選擇性離子交換樹脂203處理後之水洗廢水中之其他雜質及逆滲透裝置50內之雜質帶出逆滲透裝置之水。優選地,為了節約成本,本實施方式中之逆滲透裝置50可以與一般市售家用型逆滲透飲水裝置結構相近。例如,其淨水產水量可大約為7.9升/小時。The reverse osmosis device 50 is for performing reverse osmosis treatment on the washed wastewater from the buffer tank 90 after being treated with the heavy metal selective ion exchange resin 203, thereby obtaining phase-separated pure water and concentrated water. Strong electrolytes and weak electrolytes (such as SiO 2 , CO 2 , etc.) in pure water are removed or reduced to a certain extent. At 25 ° C, the conductivity range is: 2.0 μS/cm - 40.0 μS / Cm. The concentrated water brings the other impurities in the washing wastewater treated with the heavy metal selective ion exchange resin 203 and the impurities in the reverse osmosis device 50 out of the water of the reverse osmosis device. Preferably, in order to save cost, the reverse osmosis device 50 in the present embodiment may be similar in structure to a commercially available home type reverse osmosis water drinking device. For example, its purified water production can be approximately 7.9 liters per hour.

逆滲透裝置50包括一逆滲透單元51與一過濾單元53。逆滲透單元51具有一腔體502及設於腔體502內之逆滲透膜503。腔體502具有設於腔體502頂端之逆滲透進液口504、一設於腔體502底端之純水流出口505、及一設於腔體502側壁之濃水流出口507。經重金屬選擇性離子交換樹脂203處理過之水洗廢水依次經由塔體出液口2013、第三輸液管33、第二進液閥41及逆滲透進液口504注入腔體502,以使逆滲透膜503對經重金屬選擇性離子交換樹脂203處理過之水洗廢水進行過濾,從而獲得相分離之純水及濃水。The reverse osmosis unit 50 includes a reverse osmosis unit 51 and a filter unit 53. The reverse osmosis unit 51 has a cavity 502 and a reverse osmosis membrane 503 disposed in the cavity 502. The cavity 502 has a reverse osmosis inlet 504 disposed at the top end of the cavity 502, a pure water outlet 505 disposed at the bottom end of the cavity 502, and a concentrated water outlet 507 disposed at the sidewall of the cavity 502. The washed wastewater treated by the heavy metal selective ion exchange resin 203 is sequentially injected into the cavity 502 via the tower body outlet port 2013, the third infusion pipe 33, the second inlet valve 41, and the reverse osmosis inlet port 504 to reverse osmosis. The membrane 503 filters the water-washed wastewater treated with the heavy metal-selective ion exchange resin 203 to obtain phase-separated pure water and concentrated water.

經逆滲透單元51獲得之純水經由純水流出口505、純水輸送管38、及第三進液口141注入第三水洗槽14,以給第三水洗槽14不斷地補給水。由於第三水洗槽14內之水可溢入第五水洗槽15,第五水洗槽15內之水可溢入第二水洗槽13,從而使得第二水洗槽13、第三水洗槽14、及第五水洗槽15內之水可以不斷地更新。The pure water obtained by the reverse osmosis unit 51 is injected into the third water washing tank 14 through the pure water outflow port 505, the pure water delivery pipe 38, and the third liquid inlet port 141 to continuously supply water to the third water washing tank 14. Since the water in the third washing tank 14 can overflow into the fifth washing tank 15, the water in the fifth washing tank 15 can overflow into the second washing tank 13, so that the second washing tank 13, the third washing tank 14, and The water in the fifth washing tank 15 can be continuously updated.

經逆滲透單元51獲得之濃水經由濃水流出口507、濃水輸送管39及第一進液口101注入第一水洗槽11,以便於給第一水洗槽11不斷得補充一部分水。The concentrated water obtained by the reverse osmosis unit 51 is injected into the first water washing tank 11 through the concentrated water outlet 507, the concentrated water delivery pipe 39, and the first liquid inlet 101, so that the first water washing tank 11 is continuously replenished with a part of the water.

過濾單元53用於過濾經重金屬選擇性離子交換樹脂203處理過之來自緩衝槽90之水洗廢水,以去除經重金屬選擇性離子交換樹脂203處理過之水洗廢水中顆粒較大之雜質,從而減輕逆滲透單元51之負荷量。過濾單元53包括依次串聯之一微米級濾芯單元508、一顆粒活性碳濾芯單元509及一壓縮活性碳濾芯單元510。The filtering unit 53 is configured to filter the washing wastewater from the buffer tank 90 treated by the heavy metal selective ion exchange resin 203 to remove impurities of larger particles in the washing wastewater treated by the heavy metal selective ion exchange resin 203, thereby reducing the inverse The amount of load of the permeation unit 51. The filter unit 53 includes a one-micron filter element unit 508, a granular activated carbon filter unit 509, and a compressed activated carbon filter unit 510 in series.

微米級濾芯單元508內置有微米級濾芯材料。所述微米級濾芯材料指的是該濾芯材料具有複數微米級孔,以使得小於該微米級孔之孔徑之雜質可以通過該濾芯材料。本實施方式中,該微米級濾芯單元508為5微米濾芯單元。本發明所屬技術領域具有通常知識者可以理解,該微米級濾芯單元508亦可以為4微米濾芯單元、6微米濾芯單元、3微米濾芯單元等其他微米級濾芯單元,應根據實際需要來選擇。The micron-sized filter element unit 508 incorporates a micron-sized filter element material. The micron-sized filter material means that the filter material has a plurality of micron-sized pores such that impurities smaller than the pore size of the micro-scale pores can pass through the filter material. In the present embodiment, the micro-scale filter element unit 508 is a 5 micron filter element unit. It is understood by those skilled in the art that the micro-scale filter element unit 508 can also be a micron filter element unit such as a 4 micron filter element unit, a 6 micron filter element unit, a 3 micron filter element unit, etc., and should be selected according to actual needs.

微米級濾芯單元508之進液口5081藉由第四輸液管34與緩衝出液口905相連。微米級濾芯單元508之出液口5083藉由第五輸液管35與顆粒活性碳濾芯單元509之進液口5091相連。顆粒活性碳濾芯單元509之出液口5093藉由第六輸液管36與壓縮活性碳濾芯單元510之進液口5101相連。壓縮活性碳濾芯單元510之出液口5013與逆滲透單元51之逆滲透進液口504相連,從而使得經重金屬選擇性離子交換樹脂203處理過之水洗廢水依次經微米級濾芯單元508、顆粒活性碳濾芯單元509及壓縮活性碳濾芯單元510過濾後再注入逆滲透單元51,以減輕了逆滲透單元51之負荷量。當然,若逆滲透單元51之逆滲透能力較強,過濾單元53亦可以省略不要。亦即,來自於離子交換裝置21處理後之水洗廢水可以在經過緩衝槽90後直接進入逆滲透單元51,從而分離為純水與濃水。The liquid inlet port 5081 of the micro-scale filter element unit 508 is connected to the buffer liquid outlet 905 by a fourth infusion tube 34. The liquid outlet 5083 of the micro-scale filter unit 508 is connected to the liquid inlet 5091 of the granular activated carbon filter unit 509 via the fifth infusion tube 35. The liquid outlet 5093 of the granular activated carbon filter unit 509 is connected to the liquid inlet 5101 of the compressed activated carbon filter unit 510 via the sixth infusion pipe 36. The liquid outlet 5013 of the compressed activated carbon filter unit 510 is connected to the reverse osmosis inlet 504 of the reverse osmosis unit 51, so that the washed wastewater treated by the heavy metal selective ion exchange resin 203 is sequentially passed through the micron filter unit 508, and the particle activity The carbon filter unit 509 and the compressed activated carbon filter unit 510 are filtered and then injected into the reverse osmosis unit 51 to reduce the load of the reverse osmosis unit 51. Of course, if the reverse osmosis unit 51 has a strong reverse osmosis ability, the filter unit 53 can also omit unnecessary. That is, the washed wastewater from the ion exchange device 21 can directly enter the reverse osmosis unit 51 after passing through the buffer tank 90, thereby separating into pure water and concentrated water.

本發明所屬技術領域具有通常知識者可以理解,逆滲透裝置50與第一水洗槽11之間可以具有進液閥,以便於控制濃水是否注入第一水洗槽11;逆滲透裝置50與第一水洗槽11之間還可以具有高壓泵,以便於濃水可以更容易得注入第一水洗槽11。本發明所屬技術領域具有通常知識者還可以理解,逆滲透裝置50與第三水洗槽14之間可以具有進液閥,以便於控制純水是否注入第三水洗槽14;逆滲透裝置50與第三水洗槽14之間還可以具有高壓泵,以便於純水可以更容易得注入第三水洗槽14。It will be understood by those skilled in the art that the reverse osmosis device 50 and the first water washing tank 11 may have an inlet valve to facilitate control whether the concentrated water is injected into the first washing tank 11; the reverse osmosis unit 50 and the first A high pressure pump may also be provided between the washing tanks 11 so that concentrated water can be more easily injected into the first washing tank 11. It is also understood by those skilled in the art that the reverse osmosis device 50 and the third water washing tank 14 may have an inlet valve to control whether pure water is injected into the third water washing tank 14; the reverse osmosis device 50 and the A high pressure pump may also be provided between the three water washing tanks 14 so that pure water can be more easily injected into the third water washing tank 14.

本實施方式中,由於水洗廢水之流量60升/小時大於逆滲透裝置50之淨水產水量7.9升/小時,因此在離子交換裝置21與逆滲透裝置50之間設置有緩衝槽90,以將經由離子交換裝置21處理後之水洗廢水暫時存儲,從而減輕逆滲透裝置50之負荷量。本發明所屬技術領域具有通常知識者可以理解,若水洗廢水之流量等於或者小於逆滲透裝置50之淨水產水量,緩衝槽90亦可以省略不要。亦即,水洗廢水在經過離子交換裝置21後,可以直接注入逆滲透裝置50。本發明所屬技術領域具有通常知識者還可以理解,緩衝槽90與塔體201之間、緩衝槽90與逆滲透裝置50之間、緩衝槽90與第二水洗槽13之間亦可以具有進液閥,以便於控制經由離子交換裝置21處理後之水洗廢水是否可以相應地注入緩衝槽90、逆滲透裝置50及第一水洗槽11。本發明所屬技術領域具有通常知識者還可以理解,緩衝槽90與塔體201之間、緩衝槽90與逆滲透裝置50之間、緩衝槽90與第二水洗槽13之間亦可以具有高壓泵,以便於經由離子交換裝置21處理後之水洗廢水可以更容易得注入相應之緩衝槽90、逆滲透裝置50及第一水洗槽11。In the present embodiment, since the flow rate of the washing wastewater is 60 liters/hour larger than the purified water production amount of the reverse osmosis device 50 by 7.9 liters/hour, a buffer tank 90 is provided between the ion exchange device 21 and the reverse osmosis device 50 to The washed wastewater treated by the ion exchange device 21 is temporarily stored, thereby reducing the load of the reverse osmosis device 50. It is understood by those skilled in the art that if the flow rate of the washing wastewater is equal to or less than the amount of purified water produced by the reverse osmosis unit 50, the buffer tank 90 can also be omitted. That is, the washing wastewater can be directly injected into the reverse osmosis unit 50 after passing through the ion exchange unit 21. It is also understood by those skilled in the art that the buffer tank 90 and the tower body 201, between the buffer tank 90 and the reverse osmosis unit 50, and between the buffer tank 90 and the second water washing tank 13 may also have liquid inlet. The valve is adapted to control whether the washing wastewater treated by the ion exchange device 21 can be correspondingly injected into the buffer tank 90, the reverse osmosis unit 50, and the first water washing tank 11. It is also understood by those skilled in the art that a high pressure pump can also be provided between the buffer tank 90 and the tower body 201, between the buffer tank 90 and the reverse osmosis unit 50, and between the buffer tank 90 and the second water washing tank 13. Therefore, the washed wastewater treated by the ion exchange device 21 can be more easily injected into the corresponding buffer tank 90, the reverse osmosis device 50, and the first water washing tank 11.

使用上述電鍍系統100處理廢水之方法如下:首先,使第二水洗槽13內之水洗廢水從第二水洗槽13注入濾芯裝置80,以對水洗廢水進行初級過濾;接著,將經濾芯裝置80過濾後之水洗廢水注入塔體201;接著,利用塔體201內之重金屬選擇性離子交換樹脂203對注入塔體201內之水洗廢水中之銅離子進行離子置換處理,從而得到離子置換後之水洗廢水;然後,將所述離子置換後之水洗廢水注入逆滲透裝置50;接著,利用逆滲透裝置50內之逆滲透單元51對所述逆滲透裝置內之水洗廢水進行逆滲透處理,從而獲得分離後之純水及濃水;最後,將獲得之純水注入第三水洗槽14,並將獲得之濃水注入第一水洗槽11。The method of treating waste water using the above electroplating system 100 is as follows: First, the water washing waste water in the second water washing tank 13 is injected into the filter element device 80 from the second water washing tank 13 to perform primary filtration on the washing wastewater; and then, the filter unit 80 is filtered. Then, the washing wastewater is injected into the column body 201; then, the copper ions in the washing wastewater injected into the column body 201 are ion-exchanged by the heavy metal selective ion exchange resin 203 in the column body 201, thereby obtaining the water washing wastewater after ion replacement. Then, the ion-washed wastewater after the ion replacement is injected into the reverse osmosis device 50; then, the reverse osmosis unit 51 in the reverse osmosis device 50 is subjected to reverse osmosis treatment in the reverse osmosis device to obtain the separation. Pure water and concentrated water; finally, the obtained pure water is injected into the third water washing tank 14, and the obtained concentrated water is injected into the first water washing tank 11.

為了對塔體201進行反洗,電鍍系統100之廢水處理方法中,在將獲得之純水注入第三水洗槽14,並將獲得之濃水注入第一水洗槽11之後還可以包括一將第二水洗槽13內之水洗廢水依次經由經由所述反洗水出液口137、第六輸液管36、第五進液閥44及塔體出液口2013注入所述塔體201,並依次經由所述塔體進液口2011、第六進液閥45、第七輸液管37及反洗水進液口139流入第二水洗槽13內之步驟。In order to backwash the tower body 201, in the wastewater treatment method of the electroplating system 100, after the obtained pure water is injected into the third water washing tank 14, and the obtained concentrated water is injected into the first water washing tank 11, a The washing wastewater in the second washing tank 13 is injected into the tower body 201 through the backwashing water outlet 137, the sixth infusion pipe 36, the fifth inlet valve 44, and the tower body outlet port 2013, and sequentially The tower body inlet port 2011, the sixth inlet valve 45, the seventh infusion tube 37, and the backwash water inlet port 139 flow into the second water washing tank 13.

本發明所屬技術領域具有通常知識者可以理解,電鍍系統100之廢水處理方法還可以包括利用再生處理液18再生重金屬選擇性離子交換樹脂203之步驟。It is understood by those skilled in the art that the wastewater treatment method of the electroplating system 100 may further include the step of regenerating the heavy metal selective ion exchange resin 203 using the regeneration treatment liquid 18.

相對於先前技術,本技術方案之電鍍系統100及其廢水處理方法,其先利用離子交換裝置21及逆滲透裝置50對水洗廢水進行處理,而後將處理後所獲得之純水及濃水分別補充至第三水洗槽14及第一水洗槽11內,不僅可以不斷地給第三水洗槽14、第五水洗槽15、第二水洗槽13及第一水洗槽11補充部分水,提高了水洗廢水之利用率,而且可以有效地減少水洗廢水污染環境之可能。Compared with the prior art, the electroplating system 100 and the wastewater treatment method thereof of the present technical solution first treat the washing wastewater by using the ion exchange device 21 and the reverse osmosis device 50, and then supplement the pure water and the concentrated water obtained after the treatment respectively. In the third water washing tank 14 and the first water washing tank 11, not only the third water washing tank 14, the fifth water washing tank 15, the second water washing tank 13, and the first water washing tank 11 can be continuously added with water, thereby improving the washing wastewater. The utilization rate can effectively reduce the possibility that the washing wastewater pollutes the environment.

惟,以上所述者僅為本發明之較佳實施方式,自不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝之人士援依本發明之精神所作之等效修飾或變化,皆應涵蓋於以下申請專利範圍內。However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

100...電鍍系統100. . . Plating system

10...電鍍設備10. . . Plating equipment

20...廢水處理設備20. . . Wastewater treatment equipment

11...第一水洗槽11. . . First washing tank

12...第四水洗槽12. . . Fourth washing tank

16...電鍍槽16. . . Plating tank

13...第二水洗槽13. . . Second washing tank

14...第三水洗槽14. . . Third washing tank

15...第五水洗槽15. . . Fifth washing tank

21...離子交換裝置twenty one. . . Ion exchange device

31...第一輸液管31. . . First infusion tube

32...第二輸液管32. . . Second infusion tube

40...第一進液閥40. . . First inlet valve

41...第二進液閥41. . . Second inlet valve

50...逆滲透裝置50. . . Reverse osmosis device

38...純水輸送管38. . . Pure water pipe

39...濃水輸送管39. . . Concentrated water pipe

107、131、145、901...溢流口107, 131, 145, 901. . . Overflow

132...第二出液口132. . . Second outlet

133...第二進液口133. . . Second inlet

101...第一進液口101. . . First inlet

103...第一出液口103. . . First outlet

105、136...廢液排出管105, 136. . . Waste liquid discharge pipe

121...第四進液口121. . . Fourth inlet

123...水洗水輸送管123. . . Washed water pipe

125...水洗水供給池125. . . Washing water supply pool

141、143...第三進液口141, 143. . . Third inlet

201...塔體201. . . Tower body

203...重金屬選擇性離子交換樹脂203. . . Heavy metal selective ion exchange resin

2011...塔體進液口2011. . . Tower inlet

2012...內部空腔2012. . . Internal cavity

2013...塔體出液口2013. . . Tower body outlet

51...逆滲透單元51. . . Reverse osmosis unit

502...腔體502. . . Cavity

503...逆滲透膜503. . . Reverse osmosis membrane

504...逆滲透進液口504. . . Reverse osmosis inlet

505...純水流出口505. . . Pure water outlet

507...濃水流出口507. . . Concentrated water outlet

80...濾芯裝置80. . . Filter device

801...濾芯進液口801. . . Filter inlet

803...濾芯出液口803. . . Filter outlet

90...緩衝槽90. . . Buffer tank

33...第三輸液管33. . . Third infusion tube

903...緩衝進液口903. . . Buffer inlet

905...緩衝出液口905. . . Buffer outlet

17...再生處理池17. . . Regeneration pool

18...再生處理液18. . . Regeneration treatment solution

34...第四輸液管34. . . Fourth infusion tube

42...第三進液閥42. . . Third inlet valve

35...第五輸液管35. . . Fifth infusion tube

43...第四進液閥43. . . Fourth inlet valve

19...廢水收集池19. . . Wastewater collection pool

36...第六輸液管36. . . Sixth infusion tube

44...第五進液閥44. . . Fifth inlet valve

37...第七輸液管37. . . Seventh infusion tube

45...第六進液閥45. . . Sixth inlet valve

137...反洗水出液口137. . . Backwash water outlet

139...反洗水進液口139. . . Backwash water inlet

53...過濾單元53. . . Filter unit

508...微米級濾芯單元508. . . Micron filter unit

509...顆粒活性碳濾芯單元509. . . Granular activated carbon filter unit

510...壓縮活性碳濾芯單元510. . . Compressed activated carbon filter unit

5081、5091、5101...進液口5081, 5091, 5101. . . Inlet port

5083、5093、5103...出液口5083, 5093, 5103. . . Liquid outlet

61...第一連接管61. . . First connecting pipe

62...第二連接管62. . . Second connecting pipe

63...第三連接管63. . . Third connecting pipe

64...第四連接管64. . . Fourth connecting pipe

65...溢流連接管65. . . Overflow connection pipe

圖1為本技術方案實施方式提供之電鍍系統之示意圖,其包括一離子交換裝置。FIG. 1 is a schematic diagram of an electroplating system provided by an embodiment of the present technical solution, which includes an ion exchange device.

圖2為圖1中之離子交換裝置之結構示意圖。2 is a schematic structural view of the ion exchange device of FIG. 1.

100...電鍍系統100. . . Plating system

10...電鍍設備10. . . Plating equipment

20...廢水處理設備20. . . Wastewater treatment equipment

11...第一水洗槽11. . . First washing tank

12...第四水洗槽12. . . Fourth washing tank

16...電鍍槽16. . . Plating tank

13...第二水洗槽13. . . Second washing tank

14...第三水洗槽14. . . Third washing tank

15...第五水洗槽15. . . Fifth washing tank

21...離子交換裝置twenty one. . . Ion exchange device

31...第一輸液管31. . . First infusion tube

32...第二輸液管32. . . Second infusion tube

40...第一進液閥40. . . First inlet valve

41...第二進液閥41. . . Second inlet valve

50...逆滲透裝置50. . . Reverse osmosis device

38...純水輸送管38. . . Pure water pipe

39...濃水輸送管39. . . Concentrated water pipe

107、131、145、901...溢流口107, 131, 145, 901. . . Overflow

132...第二出液口132. . . Second outlet

133...第二進液口133. . . Second inlet

101...第一進液口101. . . First inlet

103...第一出液口103. . . First outlet

105、136...廢液排出管105, 136. . . Waste liquid discharge pipe

121...第四進液口121. . . Fourth inlet

123...水洗水輸送管123. . . Washed water pipe

125...水洗水供給池125. . . Washing water supply pool

141、143...第三進液口141, 143. . . Third inlet

2011...塔體進液口2011. . . Tower inlet

2013...塔體出液口2013. . . Tower body outlet

51...逆滲透單元51. . . Reverse osmosis unit

502...腔體502. . . Cavity

503...逆滲透膜503. . . Reverse osmosis membrane

504...逆滲透進液口504. . . Reverse osmosis inlet

505...純水流出口505. . . Pure water outlet

507...濃水流出口507. . . Concentrated water outlet

80...濾芯裝置80. . . Filter device

801...濾芯進液口801. . . Filter inlet

803...濾芯出液口803. . . Filter outlet

90...緩衝槽90. . . Buffer tank

33...第三輸液管33. . . Third infusion tube

903...緩衝進液口903. . . Buffer inlet

905...緩衝出液口905. . . Buffer outlet

34...第四輸液管34. . . Fourth infusion tube

35...第五輸液管35. . . Fifth infusion tube

36...第六輸液管36. . . Sixth infusion tube

44...第五進液閥44. . . Fifth inlet valve

37...第七輸液管37. . . Seventh infusion tube

45...第六進液閥45. . . Sixth inlet valve

137...反洗水出液口137. . . Backwash water outlet

139...反洗水進液口139. . . Backwash water inlet

53...過濾單元53. . . Filter unit

508...微米級濾芯單元508. . . Micron filter unit

509...顆粒活性碳濾芯單元509. . . Granular activated carbon filter unit

510...壓縮活性碳濾芯單元510. . . Compressed activated carbon filter unit

5081、5091、5101...進液口5081, 5091, 5101. . . Inlet port

5083、5093、5103...出液口5083, 5093, 5103. . . Liquid outlet

63...第三連接管63. . . Third connecting pipe

64...第四連接管64. . . Fourth connecting pipe

65...溢流連接管65. . . Overflow connection pipe

Claims (12)

一種電鍍系統,其包括一電鍍設備,該電鍍設備包括依次相鄰設置之第一水洗槽、電鍍槽、第二水洗槽及第三水洗槽,所述第一水洗槽用於對待電鍍工件進行水洗,所述電鍍槽用於對工件進行電鍍,所述第二水洗槽與第三水洗槽用於對電鍍後之工件進行水洗,其中,該電鍍系統還包括一廢水處理設備,該廢水處理設備包括離子交換裝置及逆滲透裝置,所述離子交換裝置包括塔體及收容於所述塔體內之重金屬選擇性離子交換樹脂,所述塔體具有塔體進液口及塔體出液口,所述塔體進液口與所述第二水洗槽相連,所述第二水洗槽與塔體進液口之間安裝有第一進液閥,所述塔體出液口與逆滲透裝置相連通,所述塔體出液口與逆滲透裝置之間安裝有第二進液閥,所述重金屬選擇性離子交換樹脂用於與水洗廢水進行離子交換,所述逆滲透裝置內設有逆滲透膜,用於對離子交換後之水洗廢水進行逆滲透處理,以獲得相互分離之純水及濃水,所述逆滲透裝置具有一純水流出口及一濃水流出口,所述純水流出口與所述第三水洗槽相連,用於將所述逆滲透裝置處理後產生之純水輸送至所述第三水洗槽,所述濃水流出口與所述第一水洗槽相連,用於將所述逆滲透裝置處理後產生之濃水輸送至所述第一水洗槽。An electroplating system comprising an electroplating apparatus comprising a first water washing tank, a plating tank, a second water washing tank and a third water washing tank which are disposed adjacent to each other, wherein the first water washing tank is used for washing the workpiece to be plated The electroplating tank is used for electroplating a workpiece, and the second water washing tank and the third water washing tank are used for washing the electroplated workpiece, wherein the electroplating system further comprises a wastewater treatment device, and the wastewater treatment device comprises An ion exchange device comprising a tower body and a heavy metal selective ion exchange resin contained in the tower body, wherein the tower body has a tower body inlet port and a tower body outlet port, a liquid inlet of the tower body is connected to the second water washing tank, and a first liquid inlet valve is installed between the second water washing tank and the liquid inlet of the tower body, and the liquid outlet of the tower body is connected with the reverse osmosis device. A second inlet valve is installed between the tower body outlet port and the reverse osmosis device, and the heavy metal selective ion exchange resin is used for ion exchange with the washing wastewater, and the reverse osmosis device is provided with a reverse osmosis membrane. It is used for reverse osmosis treatment of the ion-washed wastewater after ion exchange to obtain pure water and concentrated water separated from each other, the reverse osmosis device has a pure water outlet and a concentrated water outlet, the pure water outlet and the first The triple water washing tank is connected to transport the pure water produced by the treatment of the reverse osmosis device to the third water washing tank, and the concentrated water outlet is connected to the first water washing tank for using the reverse osmosis device The concentrated water produced after the treatment is delivered to the first water washing tank. 如申請專利範圍第1項所述之電鍍系統,其中,所述廢水處理設備進一步包括一連接於所述第二水洗槽與所述離子交換裝置之間之濾芯裝置,所述濾芯裝置具有一濾芯進液口及一濾芯出液口,所述濾芯進液口藉由第一輸液管與所述第二水洗槽相連,所述濾芯出液口藉由第二輸液管與所述塔體進液口相連,所述濾芯裝置用於將所述第二水洗槽內之水洗廢水中較大顆粒之雜質在水洗廢水注入所述離子交換裝置之塔體之前濾出,所述第一進液閥安裝於所述第二輸液管。The electroplating system of claim 1, wherein the wastewater treatment apparatus further comprises a filter element device connected between the second water washing tank and the ion exchange device, the filter element device having a filter element a liquid inlet and a filter outlet, the filter inlet is connected to the second water washing tank by a first infusion tube, and the filter outlet is connected to the tower body by a second infusion tube The filter device is configured to filter out impurities of larger particles in the washing wastewater in the second water washing tank before the water washing wastewater is injected into the tower body of the ion exchange device, and the first inlet valve is installed. In the second infusion tube. 如申請專利範圍第1或2項所述之電鍍系統,其中,所述廢水處理設備進一步包括一緩衝槽,所述緩衝槽具有一緩衝進液口、一緩衝出液口及一緩衝溢流口,所述緩衝進液口藉由第三輸液管與所述塔體出液口相連,所述緩衝出液口藉由第四輸液管與所述逆滲透裝置相連,所述緩衝溢流口藉由溢流連接管與所述第二水洗槽相連,所述第二進液閥安裝於所述第三輸液管。The electroplating system of claim 1 or 2, wherein the wastewater treatment apparatus further comprises a buffer tank having a buffer inlet, a buffer outlet, and a buffer overflow. The buffer inlet port is connected to the tower body outlet port by a third infusion tube, and the buffer outlet port is connected to the reverse osmosis device by a fourth infusion tube, and the buffer overflow port is borrowed Connected to the second water washing tank by an overflow connecting pipe, and the second liquid inlet valve is installed in the third infusion pipe. 如申請專利範圍第3項所述之電鍍系統,其中,所述廢水處理設備進一步包括連接於所述緩衝槽與所述第二水洗槽之間之高壓泵。The electroplating system of claim 3, wherein the wastewater treatment apparatus further comprises a high pressure pump connected between the buffer tank and the second water washing tank. 如申請專利範圍第1項所述之電鍍系統,其中,所述離子交換裝置進一步連接有一再生處理池與一廢水收集池,所述再生處理池內盛置有再生處理液,再生處理池藉由第一連接管與所述塔體進液口相連,所述第一連接管安裝有第三進液閥,所述廢水收集池藉由第二連接管與所述塔體出液口相連,所述第二連接管安裝有第四進液閥。The electroplating system of claim 1, wherein the ion exchange device is further connected to a regeneration treatment tank and a waste water collection tank, wherein the regeneration treatment tank contains a regeneration treatment liquid, and the regeneration treatment tank is used. a first connecting pipe is connected to the liquid inlet of the tower body, the first connecting pipe is installed with a third liquid inlet valve, and the waste water collecting pool is connected to the liquid outlet of the tower body by a second connecting pipe, The second connecting pipe is provided with a fourth inlet valve. 如申請專利範圍第1項所述之電鍍系統,其中,所述離子交換裝置進一步包括一第三連接管、安裝於所述第三連接管之第五進液閥、第四連接管及安裝於所述第四連接管之第六進液閥,所述第二水洗槽進一步具有一反洗水出液口及一反洗水進液口,所述第二水洗槽之反洗水出液口藉由所述第三連接管與所述塔體進液口相連,所述反洗水進液口藉由所述第四連接管與所述塔體出液口相連。The electroplating system of claim 1, wherein the ion exchange device further comprises a third connecting pipe, a fifth inlet valve installed in the third connecting pipe, a fourth connecting pipe, and a mounting a sixth inlet valve of the fourth connecting pipe, the second washing tank further has a backwash water outlet port and a backwash water inlet port, and the backwash water outlet port of the second water washing tank The backwater inlet is connected to the tower liquid inlet by the third connecting pipe, and the backwashing liquid inlet is connected to the tower body outlet by the fourth connecting pipe. 如申請專利範圍第1項所述之電鍍系統,其中,所述離子交換裝置進一步包括一第三連接管、安裝於所述第三連接管之第五進液閥、第四連接管及安裝於所述第四連接管之第六進液閥,所述第一水洗槽進一步具有一反洗水出液口及一反洗水進液口,所述第一水洗槽之反洗水出液口藉由所述第三連接管與所述塔體進液口相連,所述反洗水進液口藉由所述第四連接管與所述塔體出液口相連。The electroplating system of claim 1, wherein the ion exchange device further comprises a third connecting pipe, a fifth inlet valve installed in the third connecting pipe, a fourth connecting pipe, and a mounting a sixth inlet valve of the fourth connecting pipe, the first washing tank further has a backwashing water outlet and a backwashing water inlet, and the backwashing outlet of the first washing tank The backwater inlet is connected to the tower liquid inlet by the third connecting pipe, and the backwashing liquid inlet is connected to the tower body outlet by the fourth connecting pipe. 如申請專利範圍第1項所述之電鍍系統,其中,所述逆滲透裝置包括一過濾單元與一逆滲透單元,所述過濾單元連接於所述逆滲透單元與塔體出液口之間,用於過濾來自離子交換裝置之水洗廢水中之雜質,所述逆滲透單元具有一收容所述逆滲透膜之腔體,所述腔體具有所述純水流出口、所述濃水流出口及一逆滲透進液口,所述逆滲透進液口與所述過濾單元相連。The electroplating system of claim 1, wherein the reverse osmosis device comprises a filter unit and a reverse osmosis unit, and the filter unit is connected between the reverse osmosis unit and the liquid outlet of the tower body, For filtering impurities in the washing wastewater from the ion exchange device, the reverse osmosis unit has a cavity for accommodating the reverse osmosis membrane, the cavity having the pure water outlet, the concentrated water outlet and an inverse The liquid inlet is infiltrated, and the reverse osmosis inlet is connected to the filtering unit. 如申請專利範圍第8項所述之電鍍系統,其中,所述過濾單元包括包括依次串聯之微米級濾芯單元、顆粒活性碳濾芯單元及壓縮活性碳濾芯單元,所述微米級濾芯單元與離子交換裝置相連,所述壓縮活性碳濾芯單元與所述逆滲透單元相連。The electroplating system of claim 8, wherein the filtering unit comprises a micron-sized filter unit, a granular activated carbon filter unit and a compressed activated carbon filter unit, which are sequentially connected in series, and the micro-scale filter unit and ion exchange The apparatus is connected, and the compressed activated carbon filter unit is connected to the reverse osmosis unit. 一種電鍍系統之廢水處理方法,包括步驟:
提供如申請專利範圍第1中項所述之電鍍系統;
將所述第二水洗槽產生之水洗廢水注入所述塔體;
對塔體內之水洗廢水進行離子置換處理,從而得到離子置換後之水洗廢水;
將所述離子置換後之水洗廢水注入所述逆滲透裝置,對所述逆滲透裝置內之水洗廢水進行逆滲透處理,從而獲得相互分離之純水及濃水;以及
將獲得之純水注入所述第三水洗槽,並將獲得之濃水注入所述第一水洗槽。
A method for treating wastewater in an electroplating system, comprising the steps of:
Providing an electroplating system as described in claim 1;
Injecting the washing wastewater generated by the second water washing tank into the tower body;
The water washing wastewater in the tower body is subjected to ion replacement treatment to obtain the water washing wastewater after ion replacement;
The washed water washing wastewater is injected into the reverse osmosis device, and the water washing wastewater in the reverse osmosis device is subjected to reverse osmosis treatment to obtain mutually separated pure water and concentrated water; and the obtained pure water is injected into the water. The third water washing tank is described, and the obtained concentrated water is injected into the first water washing tank.
如申請專利範圍第10項所述之廢水處理方法,其中,在將所述第二水洗槽裏面之水洗廢水注入所述塔體之前,將所述第二水洗槽產生之水洗廢水注入一濾芯裝置,以過濾所述第二水洗槽內之水洗廢水中之雜質。The wastewater treatment method of claim 10, wherein the water washing wastewater generated in the second water washing tank is injected into a filter device before the water washing wastewater in the second water washing tank is injected into the tower body. And filtering the impurities in the washing wastewater in the second water washing tank. 如申請專利範圍第10項所述之廢水處理方法,其中,在將獲得之純水注入所述第三水洗槽,並將獲得之濃水注入所述第一水洗槽之後,還包括一將來自所述第二水洗槽之水洗廢水反方向注入所述塔體以反洗重金屬選擇性離子交換樹脂之步驟。
The wastewater treatment method according to claim 10, wherein after the obtained pure water is injected into the third water washing tank, and the obtained concentrated water is injected into the first water washing tank, a The water washing wastewater of the second water washing tank is injected into the tower body in a reverse direction to backwash the heavy metal selective ion exchange resin.
TW101114803A 2012-04-25 2012-04-25 Plating system and waste water treating method TW201343978A (en)

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