TW201343860A - Adhesive tape - Google Patents

Adhesive tape Download PDF

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Publication number
TW201343860A
TW201343860A TW102107179A TW102107179A TW201343860A TW 201343860 A TW201343860 A TW 201343860A TW 102107179 A TW102107179 A TW 102107179A TW 102107179 A TW102107179 A TW 102107179A TW 201343860 A TW201343860 A TW 201343860A
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Taiwan
Prior art keywords
acrylate
meth
adhesive tape
fatty acid
saturated fatty
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TW102107179A
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Chinese (zh)
Inventor
Toshitaka Suzuki
Shigeki Ishiguro
Takumi Yutou
Hiroki Senda
Masamichi Matsumoto
Yuka Sekiguchi
Aya Nagatomo
Fumiteru Asai
Toshimasa Sugimura
Masato Shirai
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Nitto Denko Corp
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Publication of TW201343860A publication Critical patent/TW201343860A/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836Wafer tapes, e.g. grinding or dicing support tapes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22Plastics; Metallised plastics
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/16Nitrogen-containing compounds
    • C08K5/20Carboxylic acid amides
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/10Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/122Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/40Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/40Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/41Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the carrier layer
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2427/00Presence of halogenated polymer
    • C09J2427/006Presence of halogenated polymer in the substrate
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00Presence of (meth)acrylic polymer
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)

Abstract

The purpose of the present invention is to provide an adhesive tape capable of obtaining stable adhesion and detachment properties in a variety of environments. An adhesive tape in which a pressure-sensitive-adhesive layer is formed on one surface of a thermoplastic-resin film, wherein the thermoplastic-resin film and/or the pressure-sensitive-adhesive layer contain(s) an alkylene-bis saturated fatty acid amide containing a C1-4 alkylene group and a C12-18 saturated fatty acid residue.

Description

黏著帶 Adhesive tape

本發明係關於一種黏著帶。 The present invention relates to an adhesive tape.

自先前起,作為於半導體製造製程等中可再剝離之黏著帶之基材層,使用有PVC(聚氯乙烯,PolyVinyl Chloride)膜等。黏著帶係於包含此種PVC膜等之基材層之一面塗佈黏著劑層而構成,藉由將脂肪酸醯胺添加於基材或黏著劑中(日本專利特開昭57-139163號公報),並使脂肪酸醯胺適度滲出至黏著劑面,而控制回捲性、對被接著體之接著性。 From the prior art, a PVC (PolyVinyl Chloride) film or the like is used as a base material layer of a re-peelable adhesive tape in a semiconductor manufacturing process or the like. The adhesive tape is formed by coating an adhesive layer on one surface of a base material layer containing such a PVC film, and is added to a substrate or an adhesive by a fatty acid guanamine (Japanese Patent Laid-Open Publication No. SHO 57-139163) And the fatty acid guanamine is appropriately exuded to the adhesive surface to control the rewindability and the adhesion to the adherend.

又,揭示有可藉由將脲化合物及水滑石添加於氯乙烯系樹脂中而獲得良好之剝離性及抗污染性(日本專利特開平07-276516號公報)。 Further, it has been revealed that a urea compound and hydrotalcite can be added to a vinyl chloride resin to obtain good peelability and stain resistance (Japanese Patent Laid-Open Publication No. Hei 07-276516).

但,於現狀中,其黏著特性不穩定,於將黏著帶作為捲繞體而保存之情形之回捲時之輥剝離力不穩定,或者於剝離黏著帶時之對半導體晶圓等之被接著體之污染較大。尤其是根據黏著帶之捲繞體中之保管狀態、對被接著體之貼合後之保存狀態等,存在如下情況:於自捲繞體之回捲或自被接著體剝離黏著帶時,產生難以剝離或黏著劑等污染物殘留於被接著體上等之不良情形。 However, in the present state, the adhesive property is unstable, and the roll peeling force is unstable when the adhesive tape is stored as a wound body, or the semiconductor wafer or the like is peeled off when the adhesive tape is peeled off. The pollution of the body is large. In particular, depending on the state of storage in the wound body of the adhesive tape, the state of storage after bonding of the adherend, and the like, there is a case where the adhesive tape is wound from the wound body or the adhesive tape is peeled off from the adherend. It is difficult to peel off or the adhesive or the like remains on the adherend or the like.

本發明係鑒於上述課題研究而成者,其目的在於提供一種黏著帶,該黏著帶可於各種環境下謀求黏著帶之保存及對被接著體之貼合 而保存之平衡,並獲得穩定之輥剝離力等剝離特性。 The present invention has been made in view of the above problems, and an object of the present invention is to provide an adhesive tape which can be used for preservation of an adhesive tape and adhesion to an adherend in various environments. The balance is preserved, and a peeling property such as a stable roll peeling force is obtained.

本發明者等人對現狀之可再剝離之黏著帶之黏著特性及剝離特性進行銳意研究,結果發現:於在黏著帶之基材層或黏著劑層中作為添加劑而含有之伸烷基雙脂肪酸醯胺中,因合成時之原材料等不同而存在各種雜質之問題,但市售有各種伸烷基雙脂肪酸醯胺,根據其種類,可出乎意料地,尤其是降低輥剝離力。其結果,藉由選擇適當之伸烷基雙脂肪酸醯胺尤其是其飽和之化合物作為添加劑而含有,可於各種環境下,謀求黏著帶之保存及對被接著體之貼合而保存之平衡,並獲得穩定之輥剝離力等剝離特性,從而獲得本發明之黏著帶。 The inventors of the present invention conducted intensive studies on the adhesive properties and peeling characteristics of the current re-peelable adhesive tape, and as a result, found that the alkyl di fatty acid contained as an additive in the base layer or the adhesive layer of the adhesive tape Among the guanamines, there are various impurities due to the difference in raw materials during synthesis, etc. However, various alkylene difatty acid decylamines are commercially available, and depending on the type thereof, unexpectedly, in particular, the roll peeling force can be lowered. As a result, by selecting an appropriate alkylenediamine fatty acid amide, especially a compound which is saturated as an additive, it is possible to balance the storage of the adhesive tape and the adhesion of the adherend in various environments. The peeling property such as a stable roll peeling force is obtained, thereby obtaining the adhesive tape of the present invention.

即,本發明之黏著帶之特徵在於:其係於熱塑性樹脂膜之單面形成有感壓性黏著劑層而成者,於至少熱塑性樹脂膜及感壓性黏著劑層之其中一者中含有包含碳數1~4之伸烷基及碳數12~18之飽和脂肪酸殘基之伸烷基雙飽和脂肪酸醯胺。 In other words, the adhesive tape of the present invention is characterized in that it is formed of a pressure-sensitive adhesive layer formed on one surface of a thermoplastic resin film, and is contained in at least one of a thermoplastic resin film and a pressure-sensitive adhesive layer. The alkylenedi-saturated fatty acid decylamine containing a C 1~4 alkylene group and a C12-12 fatty acid residue.

此種黏著帶較佳為具有以下之一者以上。 Such an adhesive tape preferably has one or more of the following.

伸烷基雙飽和脂肪酸醯胺係相對於熱塑性樹脂100重量份而以0.1~5.0重量份添加。 The alkylene di-saturated fatty acid amide is added in an amount of 0.1 to 5.0 parts by weight based on 100 parts by weight of the thermoplastic resin.

熱塑性樹脂膜係包括含有塑化劑之軟質聚氯乙烯之膜。 The thermoplastic resin film includes a film of a soft polyvinyl chloride containing a plasticizer.

感壓性黏著劑層含有丙烯酸系聚合物作為基礎聚合物。 The pressure-sensitive adhesive layer contains an acrylic polymer as a base polymer.

於黏著帶之感壓性黏著層側配置有剝離襯墊。 A release liner is disposed on the pressure-sensitive adhesive layer side of the adhesive tape.

根據本發明之黏著帶,可於各種環境下,謀求黏著帶之保存及對被接著體之貼合而保存之平衡,並獲得穩定之輥剝離力等剝離特性。 According to the adhesive tape of the present invention, it is possible to balance the storage of the adhesive tape and the adhesion to the adherend in various environments, and to obtain a peeling property such as a stable roll peeling force.

[黏著帶] [adhesive tape]

本發明之黏著帶係主要由作為基材層之熱塑性樹脂膜及積層於該熱塑性樹脂膜之單面之感壓性黏著劑層而形成。於該等熱塑性樹脂膜及感壓性黏著劑層之其中一者中含有伸烷基雙飽和脂肪酸醯胺。亦可使伸烷基雙飽和脂肪酸醯胺僅於感壓性黏著劑層或僅於熱塑性樹脂膜中而各自含有,亦可於感壓性黏著劑層及熱塑性樹脂膜之兩者中含有。如下所述,於熱塑性樹脂膜及/或感壓性黏著劑層為積層結構之情形時,只要於其中一層中含有即可,較佳為至少於熱塑性樹脂膜及感壓性黏著劑層彼此接觸之層中含有。 The adhesive tape of the present invention is mainly formed of a thermoplastic resin film as a base material layer and a pressure-sensitive adhesive layer laminated on one surface of the thermoplastic resin film. The alkylene di-saturated fatty acid decylamine is contained in one of the thermoplastic resin film and the pressure-sensitive adhesive layer. The alkylene di-saturated fatty acid decylamine may be contained only in the pressure-sensitive adhesive layer or only in the thermoplastic resin film, or may be contained in both the pressure-sensitive adhesive layer and the thermoplastic resin film. As described below, in the case where the thermoplastic resin film and/or the pressure-sensitive adhesive layer is a laminated structure, it may be contained in one of the layers, preferably at least the thermoplastic resin film and the pressure-sensitive adhesive layer are in contact with each other. Contained in the layer.

視需要,本發明之黏著帶適宜接觸感壓性黏著劑層而配置剝離襯墊。 The adhesive tape of the present invention is preferably provided with a release liner in contact with the pressure-sensitive adhesive layer as needed.

[伸烷基雙飽和脂肪酸醯胺] [Alkyl di-saturated fatty acid decylamine]

本發明中之伸烷基雙飽和脂肪酸醯胺含有碳數1~4之伸烷基及碳數12~18之飽和脂肪酸殘基。此處,伸烷基亦可為直鏈或支鏈之其中一者。又,所謂飽和脂肪酸殘基,係指自飽和脂肪族一元羧酸中去除羥基之基。 The alkylene di-saturated fatty acid decylamine of the present invention contains an alkylene group having 1 to 4 carbon atoms and a saturated fatty acid residue having 12 to 18 carbon atoms. Here, the alkylene group may also be one of a straight chain or a branched chain. Further, the term "saturated fatty acid residue" means a group from which a hydroxyl group is removed from a saturated aliphatic monocarboxylic acid.

此種伸烷基雙飽和脂肪酸醯胺例如可以式(II)來表示。 Such alkylene di-saturated fatty acid guanamine can be represented, for example, by the formula (II).

(式中,R係表示碳數1~4之伸烷基,R1及R2係分別獨立地表示碳數11~17之飽和烴基。) (In the formula, R represents an alkylene group having 1 to 4 carbon atoms, and R 1 and R 2 each independently represent a saturated hydrocarbon group having 11 to 17 carbon atoms.)

作為R之伸烷基,可列舉:亞甲基、伸乙基、丙烯基、伸異丙 基、n-伸丁基等。 Examples of the alkylene group of R include a methylene group, an ethyl group, an ethyl group, and an isopropyl group. Base, n-butylene, and the like.

作為R1及R2之飽和烴基,亦包含直鏈、支鏈、環狀及該等之組合之其中一種。例如可列舉:十一烷基、十二烷基、十三烷基、十四烷基、十五烷基、十六烷基、十七烷基等鏈狀烷基及該等之支鏈烷基等。 The saturated hydrocarbon group of R 1 and R 2 also includes one of a straight chain, a branched chain, a cyclic group, and a combination thereof. For example, a chain alkyl group such as undecyl, dodecyl, tridecyl, tetradecyl, pentadecyl, hexadecyl or heptadecyl, and the branched alkane thereof may be mentioned. Base.

進而,作為式(II)所表示之化合物,更佳為式(IV)所表示之化合物。 Further, the compound represented by the formula (II) is more preferably a compound represented by the formula (IV).

CH3-(CH2)n-CO-NH-(CH2)t-NH-CO-(CH2)m-CH3 (IV) CH 3 -(CH 2 ) n -CO-NH-(CH 2 ) t -NH-CO-(CH 2 ) m -CH 3 (IV)

(式中,n及m係分別獨立地表示10~16之整數,t係表示1或2。) (wherein n and m each independently represent an integer from 10 to 16, and t represents 1 or 2.)

該伸烷基雙飽和脂肪酸醯胺亦可單獨或將兩種以上組合而含有。更具體而言,式(II)所表示之化合物亦可為一種,亦可為兩種以上之混合物。R1及R2亦可彼此不同,較佳為相同。 The alkylene di-saturated fatty acid decylamine may be contained singly or in combination of two or more. More specifically, the compound represented by the formula (II) may be one type or a mixture of two or more types. R 1 and R 2 may also be different from each other, and are preferably the same.

於式(II)中,R係較佳為碳數為1~3,更佳為碳數為1或2。 In the formula (II), the R system preferably has a carbon number of 1 to 3, more preferably a carbon number of 1 or 2.

R1及R2適合直鏈或支鏈之飽和烴基,較佳為選自由碳數為11、13、15及17所組成之群中之一者以上,更佳為碳數15~17,或者更佳為十一烷基、十七烷基等。 R 1 and R 2 are preferably a linear or branched saturated hydrocarbon group, preferably one or more selected from the group consisting of 11, 13, 15 and 17 carbon atoms, more preferably 15 to 17 carbon atoms, or More preferably, it is undecyl, heptadecyl, and the like.

於式(IV)中,n及m較佳為選自由碳數為10、12、14及16所組成之群中之一者以上,更佳為碳數14~16,或者更佳為10及16。 In the formula (IV), n and m are preferably selected from one or more of the group consisting of 10, 12, 14 and 16 carbon atoms, more preferably 14 to 16 carbon atoms, or more preferably 10 or more. 16.

作為式(II)之具體之化合物,N,N'-亞甲基雙月桂酸醯胺,N,N'-亞甲基雙肉豆蔻酸醯胺,N,N'-亞甲基雙棕櫚酸醯胺,N,N'-亞甲基雙硬脂酸醯胺,N,N'-亞乙基雙月桂酸醯胺,N,N'-亞乙基雙肉豆蔻酸醯胺,N,N'-亞乙基雙棕櫚酸醯胺, N,N'-亞乙基雙硬脂酸醯胺,N,N'-丙烯雙月桂酸醯胺,N,N'-丙烯雙肉豆蔻酸醯胺,N,N'-亞丁基雙棕櫚酸醯胺,N,N'-亞丁基雙硬脂酸醯胺,其中,較佳為N,N'-亞甲基雙硬脂酸醯胺、N,N'-亞甲基雙月桂酸醯胺、N,N'-亞甲基雙棕櫚酸醯胺及該等之組合等,更佳為N,N'-亞甲基雙硬脂酸醯胺及N,N'-亞甲基雙棕櫚酸醯胺之混合物。再者,N,N'-亞甲基雙硬脂酸醯胺及N,N'-亞甲基雙棕櫚酸醯胺之含有率可列舉:亞甲基雙硬脂酸醯胺:亞甲基雙棕櫚酸醯胺=0~10:10~0左右,較佳為5~8:2~5左右。 As a specific compound of the formula (II), N,N'-methylenebisguanyl laurate, N,N'-methylenebis myristate, N,N'-methylenebispalmitine Indoleamine, N,N'-methylenebisstearate decylamine, N,N'-ethylenebisguanyl laurate decylamine, N,N'-ethylenebisbis myristate amide, N,N '-Ethylene dipalmitate decylamine, N,N'-ethylidene bis-stearate, N,N'-propylene bismuth laurate, N,N'-propylene bis-myristate, N,N'-butylene dipalmitate Indoleamine, N,N'-butylidene bis-stearate, of which N,N'-methylenebisstearate decylamine, N,N'-methylenebislaurate decylamine , N,N'-methylenebispalmitine decylamine and combinations thereof, more preferably N,N'-methylenebisstearate decylamine and N,N'-methylenebispalmitic acid a mixture of guanamine. Further, the content of N,N'-methylenebisstearate decylamine and N,N'-methylenebispalmitine decylamine may be exemplified by methylene bis-stearate decylamine: methylene Bismuth palmitate =0~10:10~0, preferably about 5~8:2~5.

通常,伸烷基雙飽和脂肪酸醯胺係如下所示藉由飽和脂肪酸醯胺與醛之反應而生成。又,飽和脂肪酸醯胺係藉由飽和脂肪酸與氨之反應而工業性地生成。 In general, an alkyl di-saturated fatty acid amide is produced by the reaction of a saturated fatty acid decylamine with an aldehyde as shown below. Further, the saturated fatty acid guanamine is industrially produced by the reaction of a saturated fatty acid with ammonia.

2Ra-CO-NH2+RbCHO→Ra-CO-NH-CH2-NH-CO-Ra 2R a -CO-NH 2 +R b CHO→R a -CO-NH-CH 2 -NH-CO-R a

Ra-CO-NH2+RbCHO→Ra-CO-NH-Rb'OH R a -CO-NH 2 +R b CHO→R a -CO-NH-R b' OH

(式中,Ra、Rb及Rb'係表示飽和或不飽和烴基) (wherein R a , R b and R b ' represent a saturated or unsaturated hydrocarbon group)

再者,於上述製造方法中,不僅雙脂肪酸醯胺,亦副生成單脂肪酸醯胺(亦包含作為原料而使用者之殘存),根據製造條件等,伸烷基雙飽和脂肪酸醯胺之純度變動,並且於工業製程中,似乎無法嚴格地控制其精度。目前,若分析作為市售品之伸烷基雙飽和脂肪酸醯胺之純度,則如以下所示,確認較多地含有雜質成分,且每製造批次之差異亦較大。 Further, in the above production method, not only the di-fatty acid decylamine but also the mono-fatty acid decylamine (including the remaining material as a raw material) is contained, and the purity of the alkyl-saturated fatty acid decylamine changes depending on the production conditions and the like. And in industrial processes, it seems that the accuracy cannot be strictly controlled. At the present time, when the purity of the alkylenedi-saturated fatty acid guanamine as a commercial product is analyzed, it is confirmed that the impurity component is contained in a large amount as described below, and the difference per manufacturing lot is also large.

亞甲基雙硬脂酸醯胺/亞甲基雙棕櫚酸醯胺 共計約70%,硬脂酸醯胺 1~4%,棕櫚酸醯胺 0.5~1.5%, 硬脂酸 1~5%,棕櫚酸 0.5~1.5%及三醯胺體 約20%。 A total of about 70% of methylene bis-stearate decylamine / methylene dipalmitate decylamine, 1 to 4% of decylamine stearate, 0.5 to 1.5% of decyl palmitate, Stearic acid 1~5%, palmitic acid 0.5~1.5% and triterpenoids about 20%.

如此,理論而言,可存在藉由飽和脂肪酸醯胺與甲醛之反應而獲得且藉由其精製而純度非常高之伸烷基雙飽和脂肪酸醯胺,但實際上,作為工業製品,不存在實質上不含有雜質之伸烷基雙飽和脂肪酸醯胺。 Thus, in theory, there may be an alkylene di-saturated fatty acid decylamine which is obtained by the reaction of a saturated fatty acid decylamine with formaldehyde and which is purified by its purity, but in fact, as an industrial product, there is no substance. An alkyl di-saturated fatty acid decylamine which does not contain impurities.

於本發明之黏著帶中,藉由含有特定之伸烷基雙飽和脂肪酸醯胺,可謀求黏著帶之保存及對被接著體之貼合而保存之平衡,尤其是可有效抑制輥剝離力之經時之上升,無需殘留黏著劑而獲得穩定之剝離特性。 In the adhesive tape of the present invention, by containing a specific alkyl di-saturated fatty acid guanamine, the balance of the storage of the adhesive tape and the adhesion to the adherend can be achieved, and in particular, the roll peeling force can be effectively suppressed. With the rise of time, stable adhesive properties are obtained without residual adhesive.

因此,用於本發明之黏著帶之伸烷基雙飽和脂肪酸醯胺係較佳為施加利用特定溶劑之萃取(亦包含清洗等)等而得以精製者。 Therefore, the alkyl di-saturated fatty acid amide compound used in the adhesive tape of the present invention is preferably purified by applying an extraction (including cleaning, etc.) using a specific solvent.

作為此處之溶劑,適合溶解作為原料而使用之飽和脂肪酸醯胺但不溶解伸烷基雙飽和脂肪酸醯胺之溶劑。再者,為了進一步提高藉由飽和脂肪酸醯胺與甲醛之反應而獲得之伸烷基雙飽和脂肪酸醯胺之純度,較佳為進而使用亦溶解作為脂肪酸醯胺之原料而使用之脂肪酸之溶劑。此處,所謂溶解,係指為了溶解溶質1 g所需之溶劑量為10 g以下,所謂不溶解,係指為了溶解溶質1 g所需之溶劑量為100 g以上。 As the solvent here, a solvent which dissolves the saturated fatty acid guanamine used as a raw material but does not dissolve the alkyl di-saturated fatty acid decylamine is suitable. Further, in order to further increase the purity of the alkylenedi-saturated fatty acid decylamine obtained by the reaction of the saturated fatty acid decylamine with formaldehyde, it is preferred to further use a solvent which dissolves the fatty acid used as a raw material of the fatty acid guanamine. Here, the term "dissolving" means that the amount of the solvent required to dissolve 1 g of the solute is 10 g or less, and the term "insoluble" means that the amount of the solvent required to dissolve 1 g of the solute is 100 g or more.

作為該溶劑,具體而言,可列舉:氯仿、乙醇、甲醇及該等之加熱溶劑等。其中,較佳為氯仿、加熱乙醇、加熱甲醇等。 Specific examples of the solvent include chloroform, ethanol, methanol, and the like. Among them, chloroform, ethanol is heated, methanol is heated, and the like.

作為萃取,亦可使用公知之方法之任一種。例如可列舉:將藉由飽和脂肪酸單醯胺與甲醛之反應而獲得之伸烷基雙飽和脂肪酸醯胺浸漬於溶劑中清洗之方法、在所獲得之伸烷基雙飽和脂肪酸醯胺中使用溶劑之索氏萃取之方法等。此時之條件並無特別限定,例如,添加 伸烷基雙飽和脂肪酸醯胺之30~100倍容量或重量左右之溶劑,進行30分鐘~數小時左右之浸漬、滲透、清洗或萃取等。根據使用之溶劑之種類,亦可於室溫~100℃左右下加熱溶劑。又,亦可視需要而重複此種操作複數次。藉由過濾等公知之方法分離所獲得之不溶物。 As the extraction, any one of known methods can also be used. For example, a method of immersing an alkylenedi-saturated fatty acid decylamine obtained by a reaction of a saturated fatty acid monodecylamine with formaldehyde in a solvent, and using a solvent in the obtained alkyl di-saturated fatty acid decylamine may be mentioned. Soxhlet extraction method, etc. The conditions at this time are not particularly limited, for example, adding The solvent of 30 to 100 times the capacity or weight of the alkyl di-saturated fatty acid decylamine is impregnated, infiltrated, washed or extracted for about 30 minutes to several hours. The solvent can also be heated at room temperature to about 100 ° C depending on the type of solvent used. Again, such operations may be repeated as many times as needed. The obtained insoluble matter is separated by a known method such as filtration.

較佳為於萃取後對不溶物進行乾燥。乾燥亦可利用該領域通常進行之方法之任一種。乾燥條件及溫度並無特別限定,較佳為適當進行調整。 It is preferred to dry the insoluble matter after the extraction. Drying can also utilize any of the methods conventionally performed in the art. The drying conditions and temperature are not particularly limited, and it is preferred to adjust them as appropriate.

具體而言,於萃取氯仿之情形時,例如,於市售之伸烷基雙飽和脂肪酸醯胺約1 g中添加氯仿40 ml,使用滲透機滲透1小時,其後,藉由抽氣過濾而分離為不溶部分及可溶部分。任意地對所獲得之氯仿不溶部分進而進行同樣之操作兩次左右,藉此可獲得精製之伸烷基雙飽和脂肪酸醯胺組合物。 Specifically, in the case of extracting chloroform, for example, 40 ml of chloroform is added to about 1 g of a commercially available alkylenedi-saturated fatty acid decylamine, and permeabilized by a permeator for 1 hour, after which it is filtered by suction. It is separated into an insoluble portion and a soluble portion. The obtained chloroform-insoluble portion is arbitrarily subjected to the same operation twice, whereby a purified alkylenedi-saturated fatty acid decylamine composition can be obtained.

又,於萃取乙醇之情形時,例如,於市售之伸烷基雙飽和脂肪酸醯胺約1 g中添加乙醇40 ml,於80℃(加熱板溫度)下加熱萃取1小時。其後,分離為上清液(可溶部分)及沈殿物(不溶部分),任意地對所獲得之乙醇不溶部分進而進行同樣之操作兩次,可獲得精製之伸烷基雙飽和脂肪酸醯胺組合物。 Further, in the case of extracting ethanol, for example, 40 ml of ethanol is added to about 1 g of a commercially available alkylenedi-saturated fatty acid decylamine, and the mixture is heated and extracted at 80 ° C (hot plate temperature) for 1 hour. Thereafter, the supernatant is separated into a supernatant (soluble portion) and a sediment (insoluble portion), and the obtained ethanol-insoluble portion is optionally subjected to the same operation twice to obtain a purified alkyl-saturated fatty acid decylamine. combination.

如此,藉由對伸烷基雙飽和脂肪酸醯胺進行溶劑萃取,可去除生成伸烷基雙飽和脂肪酸醯胺時所副生成/殘存之脂肪酸單醯胺(較佳為進而去除脂肪酸),可獲得純度較高之伸烷基雙飽和脂肪酸醯胺。 Thus, by solvent extraction of the alkylene di-saturated fatty acid decylamine, the fatty acid monodecylamine (preferably, the fatty acid removed) which is formed/remained when the alkylene di-saturated fatty acid decylamine is formed can be removed. A higher purity alkylene di-saturated fatty acid decylamine.

本發明中使用之伸烷基雙飽和脂肪酸醯胺適宜去除脂肪酸單醯胺及/或脂肪酸而實質上不含有。所謂實質上不含有,係可例示:於通常之分析設備(液相層析裝置、高速液相層析裝置等)中,脂肪酸單醯胺及/或脂肪酸以單一種類而含有,測定為未達0.5重量%,較佳為未達0.4重量%、未達0.25重量%、未達0.2重量%、未達0.1重量%、0.05重量%、檢測極限以下;或者,以複數種類而含有,其合計含量 未達2重量%,較佳為未達1.6重量%、未達1重量%、未達0.8重量%、未達0.5重量%、未達0.4重量%、未達0.3重量%、0.05重量%,檢測極限以下。 The alkylenedi-saturated fatty acid decylamine used in the present invention is suitable for removing fatty acid monoamines and/or fatty acids without substantially containing them. In the normal analysis equipment (liquid chromatography apparatus, high-speed liquid chromatography apparatus, etc.), the fatty acid monoamine and/or fatty acid are contained in a single type, and the measurement is not performed. 0.5% by weight, preferably less than 0.4% by weight, less than 0.25% by weight, less than 0.2% by weight, less than 0.1% by weight, 0.05% by weight, or less than the detection limit; or, in a plurality of types, the total content thereof Less than 2% by weight, preferably less than 1.6% by weight, less than 1% by weight, less than 0.8% by weight, less than 0.5% by weight, less than 0.4% by weight, less than 0.3% by weight, 0.05% by weight, tested Below the limit.

即,本發明中使用之伸烷基雙飽和脂肪酸醯胺宜實質上不含有因原料/製法等所產生之脂肪酸單醯胺及與其同種或異種之脂肪酸,例如:月桂酸單醯胺、硬脂酸單醯胺、油酸單醯胺、芥酸單醯胺、癸酸單醯胺、棕櫚酸單醯胺、肉豆蔻酸單醯胺、山萮酸單醯胺等。 That is, the alkylenedi-saturated fatty acid guanamine used in the present invention preferably does not substantially contain a fatty acid monoamine which is produced by a raw material, a production method, or the like, and a fatty acid of the same or different kind, such as monoamine or lauric acid. Acid monodecylamine, monodecyl oleate, monodecyl erucic acid, monodecyl citrate, monodecyl palmitate, monodecylamine myristate, monodecyl behenate, and the like.

又,本發明中使用之伸烷基雙飽和脂肪酸醯胺宜不含有因原料等所產生之脂肪酸及與其同種或異種之脂肪酸,例如:癸酸、硬脂酸、油酸、芥酸、月桂酸、棕櫚酸、肉豆蔻酸、山萮酸等,尤其是硬脂酸、油酸、棕櫚酸等。 Further, the alkylenedi-saturated fatty acid guanamine used in the present invention preferably does not contain a fatty acid produced by a raw material or the like and a fatty acid of the same or different kind, such as citric acid, stearic acid, oleic acid, erucic acid, lauric acid. , palmitic acid, myristic acid, behenic acid, etc., especially stearic acid, oleic acid, palmitic acid and the like.

於本發明之黏著帶中,伸烷基雙飽和脂肪酸醯胺之熱塑性樹脂膜中之含量係例如相對於熱塑性樹脂膜中之熱塑性樹脂100重量份,較佳為0.1~5.0重量份左右之範圍,更佳為0.1~3.0重量份左右。 In the adhesive tape of the present invention, the content of the alkyl bis-saturated fatty acid phthalamide in the thermoplastic resin film is, for example, about 0.1 to 5.0 parts by weight based on 100 parts by weight of the thermoplastic resin in the thermoplastic resin film. More preferably, it is about 0.1 to 3.0 parts by weight.

又,伸烷基雙飽和脂肪酸醯胺之感壓性黏著劑層中之含量係例如相對於下述基礎聚合物100重量份,較佳為0.1~5.0重量份左右之範圍,更佳為0.1~3.0重量份左右。 Further, the content of the pressure-sensitive adhesive layer of the alkyl bis-saturated fatty acid guanamine is, for example, preferably in the range of about 0.1 to 5.0 parts by weight, more preferably 0.1 to 100 parts by weight of the base polymer described below. 3.0 parts by weight or so.

於在熱塑性樹脂膜及/或感壓性黏著劑層兩者中含有伸烷基雙飽和脂肪酸醯胺之情形時,其總量較佳為相對於熱塑性樹脂100重量份而於0.1~5.0重量份左右之範圍內適當調整,更佳為0.1~3.0重量份左右。 In the case where the alkylene di-saturated fatty acid decylamine is contained in both the thermoplastic resin film and/or the pressure-sensitive adhesive layer, the total amount thereof is preferably from 0.1 to 5.0 parts by weight based on 100 parts by weight of the thermoplastic resin. Appropriate adjustment within the range of the left and right, preferably about 0.1 to 3.0 parts by weight.

(熱塑性樹脂膜) (thermoplastic resin film)

本發明之熱塑性樹脂膜並無特別限定,例如可列舉包括如下者之膜:低密度聚乙烯、直鏈狀聚乙烯、中密度聚乙烯、高密度聚乙烯、超低密度聚乙烯、無規共聚聚丙烯、嵌段共聚聚丙烯、均聚丙烯、聚丁烯、聚甲基戊烯等聚烯烴;乙烯-乙酸乙烯酯共聚物、離子 聚合物樹脂、乙烯-(甲基)丙烯酸共聚物、乙烯-(甲基)丙烯酸酯(無規、交替)共聚物、乙烯-丁烯共聚物、乙烯-己烯共聚物等聚烯烴系樹脂;聚胺基甲酸酯、聚對苯二甲酸乙二酯、聚萘二甲酸乙二酯等聚酯系樹脂;(甲基)丙烯酸系聚合物、聚苯乙烯、聚碳酸酯、聚醯亞胺、聚醯胺、聚醯胺醯亞胺、聚醚醯亞胺、聚碸、聚醚碸、聚氯乙烯、聚偏二氯乙烯、氟樹脂、纖維素樹脂及該等之交聯體等之熱塑性樹脂。該等熱塑性樹脂亦可視需要而使用摻合多個種類而成者。其中,較佳為氯乙烯系樹脂膜。 The thermoplastic resin film of the present invention is not particularly limited, and examples thereof include films of low density polyethylene, linear polyethylene, medium density polyethylene, high density polyethylene, ultra low density polyethylene, and random copolymerization. Polyolefin, block copolymerized polypropylene, homopolypropylene, polybutene, polymethylpentene, etc.; ethylene-vinyl acetate copolymer, ion a polyolefin resin such as a polymer resin, an ethylene-(meth)acrylic acid copolymer, an ethylene-(meth)acrylate (random, alternating) copolymer, an ethylene-butene copolymer, or an ethylene-hexene copolymer; Polyester resin such as polyurethane, polyethylene terephthalate or polyethylene naphthalate; (meth)acrylic polymer, polystyrene, polycarbonate, polyimine , polyamine, polyamidimide, polyether phthalimide, polyfluorene, polyether oxime, polyvinyl chloride, polyvinylidene chloride, fluororesin, cellulose resin, and the like, etc. Thermoplastic resin. These thermoplastic resins may also be blended with a plurality of types as needed. Among them, a vinyl chloride resin film is preferred.

氯乙烯系樹脂包含聚氯乙烯、氯乙烯共聚物、對聚氯乙烯之接枝共聚物、與其他樹脂之混合物。 The vinyl chloride resin includes a mixture of polyvinyl chloride, a vinyl chloride copolymer, a graft copolymer of polyvinyl chloride, and other resins.

作為氯乙烯共聚物中之共聚單體,例如可列舉:如乙酸乙烯酯之乙烯酯類、如乙烯乙烯醚之乙烯醚類、乙烯、丙烯、1-丁烯等α-烯烴類、丙烯酸甲酯、丙烯酸乙酯、甲基丙烯酸甲酯、甲基丙烯酸丁酯等(甲基)丙烯酸酯類、偏二氯乙烯等。 Examples of the comonomer in the vinyl chloride copolymer include vinyl esters such as vinyl acetate, vinyl ethers such as ethylene vinyl ether, α-olefins such as ethylene, propylene, and 1-butene, and methyl acrylate. And (meth) acrylates such as ethyl acrylate, methyl methacrylate and butyl methacrylate, and vinylidene chloride.

尤其是於使用氯乙烯系樹脂之情形時,較佳為添加有下述塑化劑之軟質之氯乙烯系樹脂。 In particular, in the case of using a vinyl chloride resin, a soft vinyl chloride resin to which a plasticizer described below is added is preferred.

熱塑性樹脂膜較佳為含有塑化劑,以使藉此而獲得之黏著帶顯示適度之靈活性,進而,亦可視需要而含有穩定劑、填料潤滑劑、著色劑、紫外線吸収劑、抗氧化劑等添加劑。 The thermoplastic resin film preferably contains a plasticizer so that the adhesive tape obtained thereby exhibits moderate flexibility, and further contains a stabilizer, a filler lubricant, a colorant, an ultraviolet absorber, an antioxidant, etc. as needed. additive.

塑化劑並無特別限定,例如可列舉:鄰苯二甲酸酯系、偏苯三甲酸酯系(大日本油墨(股)製造W-700,偏苯三甲酸三辛酯等)、己二酸酯系((股)j-plus製造D620,己二酸二辛酯、己二酸二異壬酯等)、磷酸酯系(磷酸三甲苯酯等)、己二酸系酯、檸檬酸酯(乙醯檸檬酸三丁酯等)、癸二酸酯、壬二酸酯、順丁烯二酸酯、苯甲酸酯、聚醚系聚酯、環氧系聚酯(環氧大豆油、環氧化亞麻仁油等)、聚酯(包括羧酸及乙二醇之低分子聚酯等)等。其中,較佳為使用酯系塑化劑。該等亦 可單獨或組合兩種以上而使用。 The plasticizer is not particularly limited, and examples thereof include a phthalic acid ester type, a trimellitic acid ester type (manufactured by Dainippon Ink Co., Ltd., W-700, trioctyl trimellitate, etc.), and Acid ester (manufactured by J-plus, D620, dioctyl adipate, diisononyl adipate, etc.), phosphate ester (tricresyl phosphate, etc.), adipic acid ester, citric acid ester (Ethyl tributyl citrate, etc.), sebacate, sebacate, maleate, benzoate, polyether polyester, epoxy polyester (epoxy soybean oil, Epoxidized linseed oil, etc., polyester (including low molecular weight polyesters of carboxylic acid and ethylene glycol, etc.). Among them, an ester-based plasticizer is preferably used. These also They may be used singly or in combination of two or more.

塑化劑係適合相對於熱塑性樹脂100重量份而例如以10~60重量份之比例使用,較佳為10~30重量份。 The plasticizer is suitably used in an amount of, for example, 10 to 60 parts by weight, preferably 10 to 30 parts by weight, per 100 parts by weight of the thermoplastic resin.

穩定劑並無特別限定,可列舉:鋇-鋅系、錫系、鈣-鋅系、鎘-鋇系等複合穩定劑。 The stabilizer is not particularly limited, and examples thereof include a composite stabilizer such as a cerium-zinc system, a tin system, a calcium-zinc system, and a cadmium-antimony system.

作為填料,可列舉:碳酸、矽土、雲母等無機填料;鐵、鉛等金屬填料等。 Examples of the filler include inorganic fillers such as carbonic acid, alumina, and mica; and metal fillers such as iron and lead.

作為著色劑,可列舉顏料、染料等。 Examples of the colorant include a pigment, a dye, and the like.

其他添加劑亦可使用該領域中公知者之任一種。 Other additives may also be used in any of those well known in the art.

熱塑性樹脂膜既可為單層膜,亦可為材料或組成不同並發揮各樹脂之優點之膜之積層體(多層膜)。 The thermoplastic resin film may be a single layer film or a laminate (multilayer film) of a film having different materials or compositions and exhibiting the advantages of each resin.

熱塑性樹脂膜之厚度可根據欲獲得之黏著帶等之物性而調節,例如可列舉:30~1000 μm,較佳為40~800 μm,進而較佳為50~500 μm,尤佳為60~200 μm。 The thickness of the thermoplastic resin film can be adjusted depending on the physical properties of the adhesive tape to be obtained, and examples thereof include 30 to 1000 μm, preferably 40 to 800 μm, more preferably 50 to 500 μm, and particularly preferably 60 to 200. Mm.

為了使熱塑性樹脂膜之正背面,尤其是上表面即設置有黏著劑層之側之面提高與黏著劑之密接性,亦可實施慣用之表面處理,例如利用電暈處理、鉻酸處理、臭氧暴露、火焰暴露、高壓電擊暴露、電離輻射處理等化學性或物理性方法之氧化處理等。 In order to improve the adhesion to the adhesive on the front side of the thermoplastic resin film, particularly the upper surface, that is, the side on which the adhesive layer is provided, a conventional surface treatment such as corona treatment, chromic acid treatment, or ozone may be performed. Oxidation of chemical or physical methods such as exposure, flame exposure, high voltage shock exposure, ionizing radiation treatment, etc.

如上所述,本發明之黏著帶尤其可降低輥剝離力,因此無需實施對熱塑性樹脂膜之背面側,即僅於製成捲繞體時黏著劑層接觸之面側之背面處理,例如,降低與黏著劑層之接觸面積之凹凸處理、脫模處理等處理,而可維持適當之輥剝離力。 As described above, the adhesive tape of the present invention can particularly reduce the peeling force of the roll, and therefore it is not necessary to carry out the backside treatment on the back side of the thermoplastic resin film, that is, only on the side of the face where the adhesive layer is in contact with the wound body, for example, lowering The treatment such as the unevenness of the contact area with the adhesive layer, the release treatment, and the like can maintain an appropriate roll peeling force.

(感壓性黏著劑層) (pressure-sensitive adhesive layer)

感壓性黏著劑(以下有時簡稱為「黏著劑」)層係藉由感壓性黏著劑而形成。作為感壓性黏著劑,並無特別限定,例如,根據構成黏著劑之基礎聚合物之種類,可列舉:橡膠系黏著劑、丙烯酸系黏著劑、 聚醯胺系黏著劑、矽酮系黏著劑、聚酯系黏著劑、胺基甲酸酯系黏著劑等,並可自該等公知之黏著劑中適當進行選擇。其中,丙烯酸系黏著劑之耐熱性、耐候性等各種特性優異,可藉由選擇構成丙烯酸系聚合物之單體成分之種類等而呈現所需之特性,因此可較佳地使用。 The pressure-sensitive adhesive (hereinafter sometimes simply referred to as "adhesive") layer is formed by a pressure-sensitive adhesive. The pressure-sensitive adhesive is not particularly limited, and examples thereof include a rubber-based adhesive and an acrylic adhesive, depending on the type of the base polymer constituting the adhesive. A polyamide-based adhesive, an anthrone-based adhesive, a polyester-based adhesive, a urethane-based adhesive, or the like can be appropriately selected from these known adhesives. Among them, the acrylic pressure-sensitive adhesive is excellent in various properties such as heat resistance and weather resistance, and can be preferably used because it can exhibit desired characteristics by selecting the type of the monomer component constituting the acrylic polymer.

丙烯酸系黏著劑係通常由以(甲基)丙烯酸烷基酯等丙烯酸系聚合物為主成分而構成之基礎聚合物而形成。 The acrylic adhesive is usually formed of a base polymer composed mainly of an acrylic polymer such as an alkyl (meth)acrylate.

作為(甲基)丙烯酸烷基酯,例如可列舉:(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸異丙酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸仲丁酯、(甲基)丙烯酸叔丁酯、(甲基)丙烯酸戊酯、(甲基)丙烯酸己酯、(甲基)丙烯酸庚酯、(甲基)丙烯酸辛酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸壬酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸癸酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸十一烷基酯、(甲基)丙烯酸十二烷基酯、(甲基)丙烯酸十三烷基酯、(甲基)丙烯酸十四烷基酯、(甲基)丙烯酸十五烷基酯、(甲基)丙烯酸十八烷基酯、(甲基)丙烯酸十九烷基酯、(甲基)丙烯酸二十烷基酯等(甲基)丙烯酸C1~C20之烷基酯(較佳為(甲基)丙烯酸C1~C12之烷基酯。進而較佳為(甲基)丙烯酸C1~C8之烷基酯)等。(甲基)丙烯酸烷基酯可選擇一種或兩種以上而使用。 Examples of the alkyl (meth)acrylate include methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, and isopropyl (meth)acrylate. ) butyl acrylate, isobutyl (meth)acrylate, sec-butyl (meth)acrylate, tert-butyl (meth)acrylate, amyl (meth)acrylate, hexyl (meth)acrylate, (A) Heptyl acrylate, octyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, isooctyl (meth) acrylate, decyl (meth) acrylate, isophthalic acid (meth) acrylate Ester, decyl (meth) acrylate, isodecyl (meth) acrylate, undecyl (meth) acrylate, dodecyl (meth) acrylate, tridecyl (meth) acrylate Ester, tetradecyl (meth) acrylate, pentadecyl (meth) acrylate, octadecyl (meth) acrylate, hexadecyl (meth) acrylate, (methyl) An alkyl ester of a C1 to C20 (meth)acrylic acid such as an amyl acrylate (preferably an alkyl ester of a C1 to C12 (meth) acrylate. Further preferably a C1 to C8 alkyl (meth) acrylate. Base ester) and the like. The alkyl (meth)acrylate may be used singly or in combination of two or more.

丙烯酸系聚合物係以凝聚力、耐熱性、交聯性等之改質為目的,亦可視需要而含有與可與(甲基)丙烯酸烷基酯共聚之其他單體成分對應之單位。 The acrylic polymer is intended to be modified by cohesive force, heat resistance, crosslinkability, etc., and may optionally contain units corresponding to other monomer components copolymerizable with the alkyl (meth)acrylate.

作為此種單體成分,例如可列舉:丙烯酸、甲基丙烯酸、羧乙基丙烯酸酯、羧基戊基丙烯酸酯、伊康酸、順丁烯二酸、反丁烯二酸、丁烯酸等含有羧基之單體;(甲基)羥基丁基丙烯酸酯、(甲基)羥基己基丙烯酸酯、(甲基)羥基辛基丙烯酸酯、(甲基)羥基癸基丙烯酸酯、(甲基)羥基十二烷基丙 烯酸酯、(4-羥甲基環己基)甲基丙烯酸甲酯等含有羥基之單體;苯乙烯磺酸、烯丙基磺酸、2-(甲基)丙烯醯胺基-2-甲基丙磺酸、(甲基)丙烯醯胺基丙磺酸、磺丙基(甲基)丙烯酸酯、(甲基)丙烯醯氧基萘磺酸等含有磺酸基之單體;2-磷酸羥乙基丙烯醯基等含有磷酸基之單體、(甲基)丙烯醯胺基、N,N-二甲基(甲基)丙烯醯胺基、N-丁基(甲基)丙烯醯胺基、N-羥甲基(甲基)丙烯醯胺基、N-羥甲基丙烷(甲基)丙烯醯胺基等(N-取代)醯胺系單體;甲基丙烯酸胺基乙酯、(甲基)丙烯酸N,N-二甲胺乙酯、(甲基)丙烯酸叔丁基胺基乙酯等(甲基)丙烯酸胺烷基系單體;(甲基)丙烯酸烷氧基烷基系單體;N-環己基馬來醯亞胺、N-異丙基馬來醯亞胺、N-月桂馬來醯亞胺、N-苯基馬來醯亞胺等馬來醯亞胺系單體;N-甲基衣康醯亞胺、N-乙基衣康醯亞胺、N-丁基衣康醯亞胺、N-辛基衣康醯亞胺、N-2-乙基己酯衣康醯亞胺、N-環己基衣康醯亞胺、N-月桂衣康醯亞胺等衣康醯亞胺系單體;N-(甲基)丙烯醯氧基亞甲基琥珀醯亞胺、N-(甲基)丙烯醯基-6-氧基六亞甲基琥珀醯亞胺、N-(甲基)丙烯醯基-8-氧基八亞甲基琥珀醯亞胺等丁二醯亞胺系單體;乙酸乙烯酯、丙酸乙烯酯、N-乙烯基吡咯啶酮、甲基乙烯基吡咯烷酮、乙烯基吡啶、乙烯基哌啶酮、乙烯基嘧啶、乙烯基哌嗪、乙烯基吡嗪、乙烯基吡咯、乙烯基咪唑、乙烯基唑、乙烯基嗎啉、N-乙烯基羧酸醯胺類、苯乙烯、α-甲基苯乙烯、N-乙烯基己內醯胺等乙烯系單體;丙烯腈、甲基丙烯腈等氰基丙烯酸酯系單體;(甲基)丙烯酸縮水甘油酯等含有環氧基之丙烯酸系單體; (甲基)丙烯酸聚丙二醇、(甲基)丙烯酸甲氧基乙二醇、(甲基)丙烯酸甲氧基聚丙二醇等乙二醇系丙烯酸酯單體;(甲基)丙烯酸四氫糠基酯、氟(甲基)丙烯酸酯、聚矽氧烷(甲基)丙烯酸酯等具有雜環、鹵素原子、矽原子等之丙烯酸酯系單體;己二醇二(甲基)丙烯酸酯、(聚)乙二醇二(甲基)丙烯酸酯、聚丙二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、季戊四醇二(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、環氧丙烯酸酯、聚酯丙烯酸酯、丙烯酸胺基甲酸酯、二乙烯苯、丁基二(甲基)丙烯酸酯、己基二(甲基)丙烯酸酯等多官能單體;異戊二烯、二丁二烯、異丁烯等烯烴系單體;乙烯醚等乙烯醚系單體等。該等之單體成分可使用一種或兩種以上。 Examples of such a monomer component include acrylic acid, methacrylic acid, carboxyethyl acrylate, carboxypentyl acrylate, itaconic acid, maleic acid, fumaric acid, crotonic acid, and the like. a monomer of a carboxyl group; (meth)hydroxybutyl acrylate, (meth) hydroxyhexyl acrylate, (meth) hydroxy octyl acrylate, (meth) hydroxy decyl acrylate, (methyl) hydroxy ten a monomer having a hydroxyl group such as a dialkyl acrylate or a methyl (4-hydroxymethylcyclohexyl)methyl acrylate; a styrenesulfonic acid, an allylsulfonic acid, or a 2-(methyl)acrylamidoamine-2 a monomer containing a sulfonic acid group such as methyl propanesulfonic acid, (meth) acrylamidopropanesulfonic acid, sulfopropyl (meth) acrylate or (meth) propylene decyl naphthalene sulfonic acid; - a phosphate group-containing monomer such as a hydroxyethyl propylene fluorenyl group, a (meth) acrylamide group, an N,N-dimethyl(meth) acrylamide group, or an N-butyl (meth) propylene group (N-substituted) guanamine monomer such as guanamine, N-methylol (meth) acrylamide, N-methylolpropane (meth) acrylamide, etc.; Ester, N,N-dimethylamine (meth)acrylate (meth)acrylic acid amine alkyl monomer such as ester, tert-butylaminoethyl (meth)acrylate; (meth)acrylic alkoxyalkyl monomer; N-cyclohexylmaleimide , N-isopropylmaleimide, N-lauric maleimide, N-phenylmaleimide, and the like, maleic imine monomer; N-methyl itaconimine, N-ethyl itaconium imine, N-butyl itaconimine, N-octyl ketimine, N-2-ethylhexyl ketamine, N-cyclohexyl amide N-(methyl) propylene oxymethylene succinimide, N-(methyl) propylene fluorenyl - N-(methyl) propylene oxymethylene succinimide a butadieneimine monomer such as 6-oxyhexamethylene succinimide, N-(methyl)propenyl-8-oxyoctamethylene succinimide; vinyl acetate, C Vinyl acetate, N-vinylpyrrolidone, methylvinylpyrrolidone, vinylpyridine, vinylpiperidone, vinylpyrimidine, vinylpiperazine, vinylpyrazine, vinylpyrrole, vinylimidazole, Vinyl A vinyl monomer such as azole, vinylmorpholine, N-vinylcarboxylic acid decylamine, styrene, α-methylstyrene or N-vinyl caprolactam; cyanide such as acrylonitrile or methacrylonitrile Acrylate-based monomer; epoxy group-containing acrylic monomer such as glycidyl (meth)acrylate; (meth)acrylic acid polypropylene glycol, (meth)acrylic acid methoxyethylene glycol, (methyl) a glycol-based acrylate monomer such as methoxypolypropylene glycol; a tetrahydrofurfuryl (meth)acrylate, a fluorine (meth) acrylate, or a polyoxyalkylene (meth) acrylate having a hetero ring; Acrylate monomer such as halogen atom or germanium atom; hexanediol di(meth)acrylate, (poly)ethylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, neopentane Diol (meth) acrylate, pentaerythritol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate , epoxy acrylate, polyester acrylate, urethane acrylate, divinyl benzene, butyl di (meth) acrylate Polyfunctional monomers hexyl di (meth) acrylate and the like; isoprene, di-butadiene, isobutylene and other olefin-based monomers; vinyl ether, vinyl ether-based monomers. These monomer components may be used alone or in combination of two or more.

丙烯酸系共聚物可藉由如下方式而製造:視需要而利用公知適當之方法對上述(甲基)丙烯酸烷基酯及其他單體施加聚合而製造。 The acrylic copolymer can be produced by subjecting the above (meth)acrylic acid alkyl ester and other monomers to polymerization by a known and appropriate method as needed.

丙烯酸系共聚物之分子量等並無特別限制,例如可使用重量平均分子量為10萬~200萬,較佳為15萬~100萬,進而較佳為30萬~100萬之範圍者。重量平均分子量係例如作為分子量標準物質,例如可設為藉由使用聚苯乙烯之凝膠滲透層析法(GPC,Gel Permeation Chromatography)而測定之值。 The molecular weight and the like of the acrylic copolymer are not particularly limited, and for example, a weight average molecular weight of from 100,000 to 2,000,000, preferably from 150,000 to 1,000,000, and more preferably from 300,000 to 1,000,000 can be used. The weight average molecular weight is, for example, a molecular weight standard material, and can be, for example, a value measured by gel permeation chromatography (GPC, Gel Permeation Chromatography) using polystyrene.

黏著劑可藉由添加能量線聚合性化合物或將能量線聚合性雙鍵導入至基礎聚合物等而成為能量線硬化型黏著劑。使用有能量線硬化型黏著劑之黏著劑層係於能量線照射前呈現充分之接著力,但於能量線照射後接著力顯著降低,無需對被接著體施加應力而可容易地剝離。再者,作為能量線,例如可列舉紫外線、電子束等。 The adhesive can be an energy ray-curable adhesive by adding an energy ray polymerizable compound or introducing an energy ray polymerizable double bond to a base polymer or the like. The adhesive layer using the energy ray-curable adhesive exhibits a sufficient adhesive force before the energy ray irradiation, but the force is remarkably lowered after the energy ray irradiation, and can be easily peeled off without applying stress to the adherend. Further, examples of the energy line include ultraviolet rays, electron beams, and the like.

作為能量線聚合性化合物,可使用於分子中具有兩個以上之能 量線聚合性碳-碳雙鍵之化合物。作為此種化合物,例如可列舉多官能丙烯酸酯系化合物。 As an energy ray polymerizable compound, it can be used for two or more kinds of energy in a molecule. A compound of a linear polymerizable carbon-carbon double bond. As such a compound, a polyfunctional acrylate type compound is mentioned, for example.

作為多官能丙烯酸酯系化合物,例如可列舉,1,4-伸丁基二(甲基)丙烯酸酯、1,5-戊二醇二(甲基)丙烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、1,9-壬二醇二(甲基)丙烯酸酯或聚乙二醇二(甲基)丙烯酸酯、聚丙二醇二(甲基)丙烯酸酯等直鏈狀脂肪族多元醇之(甲基)丙烯酸酯;環己烷二甲醇二(甲基)丙烯酸酯、三環癸烷二甲醇二丙烯酸酯等具有脂環式基之脂肪族多元醇之(甲基)丙烯酸酯;三羥甲基丙烷三(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、季戊四醇四(甲基)丙烯酸酯等支鏈狀脂肪族多元醇之(甲基)丙烯酸酯或該等之縮合物(二-三羥甲基丙烷三丙烯酸酯、二季戊四醇六丙烯酸酯等)。該等亦可單獨或組合兩種以上而使用。 Examples of the polyfunctional acrylate-based compound include 1,4-butylbutyl di(meth)acrylate, 1,5-pentanediol di(meth)acrylate, and 1,6-hexanediol. Linear aliphatic polymorphisms such as (meth) acrylate, 1,9-nonanediol di(meth)acrylate or polyethylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate a (meth) acrylate of an aliphatic monomer having an alicyclic group, such as an alcohol (meth) acrylate; cyclohexane dimethanol di(meth) acrylate; tricyclodecane dimethanol diacrylate; a (meth) acrylate of a branched aliphatic polyol such as trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate or the like (di-trimethylolpropane triacrylate, dipentaerythritol hexaacrylate, etc.). These may be used alone or in combination of two or more.

作為能量線聚合性化合物,例如亦可使用丙烯酸胺基甲酸酯系低聚物等多官能丙烯酸酯系低聚物。 As the energy ray polymerizable compound, for example, a polyfunctional acrylate oligomer such as an urethane acrylate oligomer can be used.

丙烯酸胺基甲酸酯系低聚物例如可藉由如下方式而獲得:使具有羥基之(甲基)丙烯酸烷基酯與藉由二異氰酸酯化合物與多元醇化合物之反應而獲得之胺基甲酸酯低聚物進行反應。 The urethane acrylate oligomer can be obtained, for example, by subjecting an alkyl (meth) acrylate having a hydroxyl group to an amide obtained by reacting a diisocyanate compound with a polyol compound. The ester oligomer is reacted.

作為二異氰酸酯化合物,例如可列舉:甲苯二異氰酸酯、二苯基甲烷二異氰酸酯、六亞甲基二異氰酸酯、苯二異氰酸酯、二環己基甲烷二異氰酸酯、二甲苯二異氰酸酯、四甲基苯二甲基二異氰酸酯、萘二異氰酸酯、異佛爾酮二異氰酸酯等。 Examples of the diisocyanate compound include toluene diisocyanate, diphenylmethane diisocyanate, hexamethylene diisocyanate, phenyl diisocyanate, dicyclohexylmethane diisocyanate, xylene diisocyanate, and tetramethyl benzene dimethyl group. Diisocyanate, naphthalene diisocyanate, isophorone diisocyanate, and the like.

作為多元醇化合物,可列舉:乙二醇、1,4-丁二醇、1,6-己二醇、二乙二醇、三羥甲基丙烷、二丙二醇、聚乙二醇、聚丙二醇、季戊四醇、二季戊四醇、甘油等多元醇類;藉由上述多元醇類與己二酸、癸二酸、壬二酸、順丁烯二酸等脂肪族二羧酸或對苯二甲酸、間苯二甲酸等芳香族二羧酸之縮合反應而獲得之聚酯系多元醇化合物; 聚伸乙醚二醇、聚伸丙醚二醇、聚四亞甲基醚二醇、聚六亞甲基醚二醇等聚醚系多元醇化合物;聚己內酯乙二醇、聚丙甘醇、聚乙二醇戊內酯等內酯系多元醇化合物;藉由乙二醇、丙二醇、丁二醇、戊二醇、辛二醇、壬二醇等多元醇與碳酸二乙二酯、碳酸二丙二酯等之脫醇反應而獲得之聚碳酸酯系多元醇化合物。作為含有羥基之(甲基)丙烯酸烷基酯化合物,例如可列舉:(甲基)丙烯酸2-羥乙酯、(甲基)丙烯酸3-羥丙酯、4-羥基丁基(甲基)丙烯酸酯、6-羥基己基甲基丙烯酸酯、8-羥基辛基甲基丙烯酸酯、10-羥基癸基甲基丙烯酸酯、12-月桂基羥基甲基丙烯酸酯、(4-羥甲基環己基)甲基丙烯酸甲酯等。 Examples of the polyol compound include ethylene glycol, 1,4-butanediol, 1,6-hexanediol, diethylene glycol, trimethylolpropane, dipropylene glycol, polyethylene glycol, and polypropylene glycol. a polyhydric alcohol such as pentaerythritol, dipentaerythritol or glycerin; or an aliphatic dicarboxylic acid such as adipic acid, sebacic acid, sebacic acid or maleic acid or terephthalic acid or isophthalic acid a polyester-based polyol compound obtained by a condensation reaction of an aromatic dicarboxylic acid such as formic acid; Polyether polyol compounds such as diethyl ether glycol, poly(propylene ether glycol), polytetramethylene ether glycol, and polyhexamethylene ether glycol; polycaprolactone ethylene glycol, polypropylene glycol, a lactone-based polyol compound such as polyethylene glycol valerolactone; a polyol such as ethylene glycol, propylene glycol, butanediol, pentanediol, octanediol or decanediol, and diethyl carbonate, carbonic acid A polycarbonate-based polyol compound obtained by a dealcoholization reaction such as propylene glycol. Examples of the hydroxyl group-containing (meth)acrylic acid alkyl ester compound include 2-hydroxyethyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, and 4-hydroxybutyl (meth)acrylic acid. Ester, 6-hydroxyhexyl methacrylate, 8-hydroxyoctyl methacrylate, 10-hydroxydecyl methacrylate, 12-lauryl hydroxy methacrylate, (4-hydroxymethylcyclohexyl) Methyl methacrylate and the like.

能量線聚合性化合物係可相對於基礎聚合物100重量份而例如於5~200重量份,較佳為10~100重量份,進而較佳為10~45重量份之範圍內使用。 The energy ray polymerizable compound can be used, for example, in an amount of 5 to 200 parts by weight, preferably 10 to 100 parts by weight, more preferably 10 to 45 parts by weight, per 100 parts by weight of the base polymer.

作為將能量線聚合性雙鍵導入至基礎聚合物之方法,例如可列舉如下方法:於製備作為基礎聚合物之丙烯酸系聚合物時,使具有羧基、羥基、胺基等反應性官能基之共聚性單體共聚。藉此,可將成為反應之基點之官能基導入至基礎聚合物中,並經由成為上述反應之基點之官能基而使具有能量線聚合性碳-碳雙鍵之多官能性單體或低聚物鍵結,從而可獲得於支鏈上具有能量線聚合性碳-碳雙鍵之基礎聚合物。 As a method of introducing an energy ray-polymerizable double bond to a base polymer, for example, when preparing an acrylic polymer as a base polymer, copolymerization of a reactive functional group such as a carboxyl group, a hydroxyl group or an amine group is used. Sexual monomer copolymerization. Thereby, a functional group which becomes a base point of the reaction can be introduced into the base polymer, and a polyfunctional monomer having an energy ray-polymerizable carbon-carbon double bond or oligomerization can be obtained via a functional group which becomes a base point of the above reaction. The substance is bonded to obtain a base polymer having an energy ray polymerizable carbon-carbon double bond on the branch.

能量線硬化型黏著劑亦可視需要含有光聚合起始劑。光聚合起始劑係藉由照射能量線而激發、活性化,生成自由基,促進黏著劑層之有效之聚合硬化反應。 The energy ray-curable adhesive may also contain a photopolymerization initiator as needed. The photopolymerization initiator is excited and activated by irradiation of an energy ray to generate a radical, and promotes an effective polymerization hardening reaction of the adhesive layer.

作為光聚合起始劑,例如可列舉:安息香甲醚、安息香乙醚、安息香異丙醚、安息香異丁基醚等 安息香烷基醚系起始劑;二苯甲酮、苯甲醯苯甲酸、3,3'-二甲基-4-甲氧基二苯甲酮、聚乙烯二苯甲酮等二苯甲酮系起始劑;α-羥基環己基苯基甲酮、4-(2-羥基乙氧基)苯基(2-羥基-2-丙基)酮、α-羥基-α,α'-二甲基苯乙酮、甲氧基苯乙酮、2,2-二甲氧基-2-苯基苯乙酮、2,2-二乙氧基苯乙酮等芳香族酮系起始劑;苯偶醯二甲基縮酮等芳香族縮酮系起始劑;噻噸酮、2-氯噻噸酮、2-甲基噻噸酮、2-乙基噻噸酮、2-異丙基噻噸酮、2-十二烷基噻噸酮、2,4-二氯噻噸酮、2,4-二甲基噻噸酮、2,4-二乙基噻噸酮、2,4-二異丙基噻噸酮等噻噸酮系起始劑;苄基等苄基系起始劑;安息香等安息香系起始劑;α-酮醇系化合物(2-甲基-2-羥基苯丙酮等)、芳香族磺醯氯系化合物(2-萘基磺醯氯等)、光活性肟化合物(1-苯酮-1,1-丙二酮-2-(鄰乙氧羰基)肟等)、樟腦醌、鹵代酮,醯基膦氧化物,醯基磷酸酯等。該等亦可單獨或組合兩種以上而使用。 Examples of the photopolymerization initiator include benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, and the like. Benzoin alkyl ether initiator; benzophenone, benzamidine benzoic acid, 3,3'-dimethyl-4-methoxybenzophenone, polyethylene benzophenone, etc. Starting agent; α-hydroxycyclohexyl phenyl ketone, 4-(2-hydroxyethoxy)phenyl (2-hydroxy-2-propyl) ketone, α-hydroxy-α, α'-dimethyl An aromatic ketone initiator such as acetophenone, methoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone or 2,2-diethoxyacetophenone; benzene An aromatic ketal-based initiator such as decyl dimethyl ketal; thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, 2-ethylthioxanthone, 2-isopropylthiophene Tons of ketone, 2-dodecylthioxanthone, 2,4-dichlorothioxanthone, 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, 2,4-di a thioxanthone initiator such as isopropyl thioxanthone; a benzyl initiator such as benzyl; a benzoin-based initiator such as benzoin; and an α-keto alcohol compound (2-methyl-2-hydroxypropiophenone) Etc.), aromatic sulfonium chloride-based compound (2-naphthylsulfonium chloride, etc.), photoactive ruthenium compound (1-benzophenone-1, 1-propanedione-2-(o-ethoxycarbonyl) hydrazine, etc.) , camphorquinone, halogenated ketone, mercaptophosphine oxide, sulfhydryl phosphate Acid esters, etc. These may be used alone or in combination of two or more.

黏著劑亦可藉由使用具有羧基等酸性基之聚合物作為基礎聚合物,並添加中和劑而中和基礎聚合物中之酸性基之全部或一部分來製成賦予親水性之親水性黏著劑。親水性黏著劑通常係對被接著體之糊劑殘餘較少,又,即便於產生糊劑殘餘之情形時,亦可藉由利用純水進行清洗而容易地去除。 The adhesive can also be used to form a hydrophilic hydrophilic adhesive by using a polymer having an acidic group such as a carboxyl group as a base polymer and adding a neutralizing agent to neutralize all or a part of the acidic groups in the base polymer. . The hydrophilic adhesive is usually less in the paste residue of the adherend, and can be easily removed by washing with pure water even in the case where the residue of the paste is generated.

具有酸性基之聚合物可藉由於製備基礎聚合物時對上述具有含有羧基之單體等之酸性基之單體進行共聚而獲得。 The polymer having an acidic group can be obtained by copolymerizing a monomer having an acidic group having a carboxyl group-containing monomer or the like in the preparation of the base polymer.

作為中和劑,例如可列舉:一乙胺、單乙醇胺等一級胺;二乙基胺、二乙醇胺等二級胺;三乙胺、三乙醇胺、N,N,N'-三甲基乙二胺、N-甲基二乙醇胺、N,N-二乙基羥胺等三級胺等呈現鹼性之有機胺化合物。 Examples of the neutralizing agent include primary amines such as monoethylamine and monoethanolamine; secondary amines such as diethylamine and diethanolamine; triethylamine, triethanolamine, N,N,N'-trimethylethylene A basic amine compound such as an amine, a N-methyldiethanolamine or a tertiary amine such as N,N-diethylhydroxylamine.

黏著劑亦可視需要而含有交聯劑。 The adhesive may also contain a crosslinking agent as needed.

作為交聯劑,例如可使用環氧系交聯劑、異氰酸酯系交聯劑、三聚氰胺系交聯劑、過氧化物系交聯劑、金屬醇鹽系交聯劑、金屬螯合系交聯劑、金屬鹽系交聯劑、碳二醯亞胺系交聯劑、唑啉系交聯劑、氮丙啶系交聯劑、胺系交聯劑等交聯劑,可較佳地使用環氧系交聯劑、異氰酸酯系交聯劑等。該等亦可單獨或組合兩種以上而使用。 As the crosslinking agent, for example, an epoxy crosslinking agent, an isocyanate crosslinking agent, a melamine crosslinking agent, a peroxide crosslinking agent, a metal alkoxide crosslinking agent, a metal chelate crosslinking agent can be used. , a metal salt crosslinking agent, a carbon bismuth imide crosslinking agent, As the crosslinking agent such as an oxazoline crosslinking agent, an aziridine crosslinking agent, or an amine crosslinking agent, an epoxy crosslinking agent, an isocyanate crosslinking agent, or the like can be preferably used. These may be used alone or in combination of two or more.

作為環氧系交聯劑,例如可列舉:N,N,N',N'-四縮水甘油基間苯二甲胺、二縮水甘油基苯胺、1,3-雙(N,N-縮水甘油胺甲基)環己烷、1,6-己二醇二縮水甘油醚、新戊二醇二縮水甘油醚、乙二醇二縮水甘油醚、丙二醇二縮水甘油醚、聚乙二醇二縮水甘油醚、聚丙二醇二縮水甘油醚、山梨醇聚縮水甘油醚、丙三醇縮水甘油醚、季戊四醇聚縮水甘油醚、聚丙三醇縮水甘油醚、去水山梨醇聚縮水甘油醚、三羥甲基丙烷聚縮水甘油醚、己二酸二縮水甘油基酯、鄰苯二甲酸二縮水甘油基酯、三縮水甘油基-三(2-羥乙基)異氰脲酸酯、間苯二酚二縮水甘油醚、雙酚-S-二縮水甘油醚、於分子內具有兩個以上環氧基之環氧樹脂等。 Examples of the epoxy-based crosslinking agent include N,N,N',N'-tetraglycidyl meta-xylylenediamine, diglycidylaniline, and 1,3-bis(N,N-glycidol). Amine methyl)cyclohexane, 1,6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether Ether, polypropylene glycol diglycidyl ether, sorbitol polyglycidyl ether, glycerol glycidyl ether, pentaerythritol polyglycidyl ether, polyglycerol glycidyl ether, sorbitan polyglycidyl ether, trimethylolpropane Polyglycidyl ether, diglycidyl adipate, diglycidyl phthalate, triglycidyl-tris(2-hydroxyethyl)isocyanurate, resorcinol diglycidyl Ether, bisphenol-S-diglycidyl ether, epoxy resin having two or more epoxy groups in the molecule, and the like.

作為異氰酸酯系交聯劑,例如可列舉:1,2-乙二異氰酸酯、1,4-伸丁基二異氰酸酯、1,6-六亞甲基二異氰酸酯等低級脂肪族聚異氰酸酯類;亞環戊基二異氰酸酯、環己二異氰酸酯、異佛爾酮二異氰酸酯、氫化甲苯二異氰酸酯、氫化二異氰酸二甲苯酯等脂肪族聚異氰酸酯類;2,4-甲苯二異氰酸酯、2,6-甲苯二異氰酸酯、4,4'-二苯基甲烷二異氰酸酯、苯二亞甲基二異氰酸酯等芳香族聚異氰酸酯類等。 Examples of the isocyanate crosslinking agent include lower aliphatic polyisocyanates such as 1,2-ethanediisocyanate, 1,4-butylene diisocyanate, and 1,6-hexamethylene diisocyanate; Aliphatic polyisocyanates such as diisocyanate, cyclohexyl diisocyanate, isophorone diisocyanate, hydrogenated toluene diisocyanate, hydrogenated diisocyanate; 2,4-toluene diisocyanate, 2,6-toluene An aromatic polyisocyanate such as isocyanate, 4,4'-diphenylmethane diisocyanate or benzene dimethylene diisocyanate.

黏著劑層係較佳為含有塑化劑。作為塑化劑,可列舉與上述同樣者。較佳為該情形之塑化劑之添加量係適合相對於構成黏著劑之熱塑性樹脂即基礎聚合物100重量份,而例如以10~100重量份之比例使用,較佳為10~80重量份,更佳為10~60重量份。 The adhesive layer preferably contains a plasticizer. The plasticizer is the same as the above. Preferably, the amount of the plasticizer added in this case is suitably 100 parts by weight based on the thermoplastic resin constituting the adhesive, and is used, for example, in a ratio of 10 to 100 parts by weight, preferably 10 to 80 parts by weight. More preferably, it is 10 to 60 parts by weight.

黏著劑層亦可進而視需要而含有穩定劑、填料潤滑劑、著色 劑、紫外線吸収劑、抗氧化劑、著色劑等添加劑。該等之添加劑可列舉與上述同樣者。 The adhesive layer may further contain a stabilizer, a filler lubricant, and a coloring as needed. Additives such as agents, UV absorbers, antioxidants, and colorants. The additives mentioned above may be the same as described above.

黏著劑層可藉由如下方式而形成:利用刮刀塗佈機、輥式塗佈機、凹版塗佈機、模嘴塗機、反向塗佈機等適當之方法將上述黏著劑塗佈於基材上。又,例如亦可將黏著劑層形成於對表面實施有脫模處理之膜等適當之鑄造用步驟片材上,並將該黏著劑層轉印於熱塑性樹脂膜上。 The adhesive layer can be formed by applying the above adhesive to a base by a suitable method such as a knife coater, a roll coater, a gravure coater, a die coater, a reverse coater or the like. On the material. Further, for example, the pressure-sensitive adhesive layer may be formed on a suitable casting step sheet such as a film having a release treatment on the surface, and the pressure-sensitive adhesive layer may be transferred onto the thermoplastic resin film.

黏著劑層之厚度並無特別限制,較佳為5~100 μm,進而較佳為5~60 μm,尤佳為5~30 μm。若黏著劑層之厚度為上述範圍內,則可減輕熱塑性樹脂膜之應力,並提高黏著帶之應力緩和率。 The thickness of the adhesive layer is not particularly limited, and is preferably 5 to 100 μm, more preferably 5 to 60 μm, and particularly preferably 5 to 30 μm. When the thickness of the adhesive layer is within the above range, the stress of the thermoplastic resin film can be alleviated, and the stress relaxation rate of the adhesive tape can be improved.

本發明之黏著帶係較佳為如下者:例如,無論保存之狀態如何,矽晶圓接著力於保存前後可抑制為±0.5 N/20 mm以內之變動值。又,就其他觀點而言,較佳為抑制於初期值之±70%以內,較佳為65%以內,更佳為±63%以內之變動範圍內者。藉由為此種範圍下之變動,無論保存狀態如何,可防止黏著帶之黏著力之降低,可容易地進行自被接著體之剝離。此處,所謂保存前及初期值,係指製造黏著帶(製成捲繞體)之後或製造黏著帶,並使剝離襯墊接觸黏著劑層側之後。所謂保存後,通常係指自製造時(製成捲繞體時)或使剝離襯墊接觸黏著劑層側時起經過1週左右以上之時間點之後。 The adhesive tape of the present invention is preferably such that, for example, regardless of the state of storage, the silicon wafer can be suppressed to a variation value within ±0.5 N/20 mm before and after storage. Further, from the other viewpoints, it is preferably suppressed within ±70% of the initial value, preferably within 65%, and more preferably within ±63%. By changing the range, it is possible to prevent the adhesion of the adhesive tape from being lowered regardless of the state of storage, and the peeling from the adherend can be easily performed. Here, the pre-storage and initial values refer to the production of the adhesive tape (after forming the wound body) or after the adhesive tape is formed and the release liner is brought into contact with the adhesive layer side. After the storage, it is usually referred to as a time point from the time of manufacture (when the wound body is formed) or when the release liner contacts the adhesive layer side for about one week or more.

該黏著帶可用於各種用途。例如,可於包括光學裝置、膜、樹脂、玻璃、金屬等具有板狀或曲面之製品等各種構件、半導體製程中之晶圓等固定用;半導體背面研磨用;半導體切割用;半導體封裝、玻璃、陶瓷等切割用;該等製程時之電路面等保護用時作為貼合(進而再剝離)之黏著帶等而使用。因此,本發明之黏著帶可製成適於該等用途之形狀,例如片材狀、短條狀等各種形狀及大小。 The adhesive tape can be used for various purposes. For example, it can be used for fixing various members such as optical devices, films, resins, glass, metals, and the like having a plate shape or a curved surface, wafers in a semiconductor process, etc.; semiconductor back surface polishing; semiconductor cutting; semiconductor packaging, glass For cutting such as ceramics or the like; for the protection of the circuit surface or the like during the processes, it is used as an adhesive tape for bonding (and further peeling). Therefore, the adhesive tape of the present invention can be formed into shapes suitable for such applications, such as various shapes and sizes such as a sheet shape and a short strip shape.

如此,本發明之黏著帶藉由在至少熱塑性樹脂膜及感壓性黏著 劑層之其中一者中含有特定之伸烷基雙飽和脂肪酸醯胺,可進一步謀求黏著帶之保存及對被接著體之貼合而保存之平衡,尤其是可有效抑制輥剝離力之經時之上升。又,無論保管狀態如何(即,即便於高溫下之保存或處理條件下),亦可常獲得充分之黏著力。或者,即便於作為捲繞體之保存及在貼附於矽晶圓等被接著體之狀態下之60℃左右之保存條件下(即,無論捲繞體中之及被接著體貼合後之保存狀態如何),於自捲繞體回捲時及再度自被接著體剝離時,亦可有效地防止黏著劑殘留於被接著體等上之不良情況。 Thus, the adhesive tape of the present invention is adhered to at least a thermoplastic resin film and pressure-sensitive adhesive One of the agent layers contains a specific alkyl di-saturated fatty acid guanamine, which can further balance the preservation of the adhesive tape and the adhesion to the adherend, and in particular, can effectively suppress the elapse of the roll peeling force. Rise. Further, regardless of the state of storage (that is, even under storage or processing conditions at a high temperature), sufficient adhesion can often be obtained. Or, even in the storage condition of the wound body and the storage condition of about 60 ° C in the state of being attached to the adherend such as the tantalum wafer (that is, the storage in the wound body and the bonded body) In the state of the wound body, it is possible to effectively prevent the adhesive from remaining on the adherend or the like when the film is wound from the wound body and is again peeled off from the adherend.

(剝離襯墊) (release liner)

本發明之黏著帶亦可於黏著劑層側接觸黏著劑層而配置剝離襯墊,以保護黏著劑層等。 The adhesive tape of the present invention may be provided with a release liner in contact with the adhesive layer on the side of the adhesive layer to protect the adhesive layer and the like.

作為剝離襯墊,只要為該領域中通常使用者,則可不受特別限定地使用。例如可將如下者作為基材而使用:紙、橡膠、鋁箔、銅箔、不鏽鋼箔、鐵箔、杜拉鋁箔、錫箔、鈦箔、金箔等各種金屬箔;由聚乙烯、聚丙烯、聚氯乙烯、聚酯、聚醯胺等各種樹脂而成之膜;聚胺基甲酸酯發泡體、乙烯基發泡體、聚乙烯發泡體、苯乙烯發泡體等發泡體、不織布、織布、毛氈以及利用高分子材料對該等進行層壓而成之膜等。基材之厚度並無特別限定,例如設為5 μm~5 mm,較佳為30 μm~100 μm左右較為恰當。 The release liner can be used without particular limitation as long as it is a general user in the field. For example, the following may be used as a substrate: various metal foils such as paper, rubber, aluminum foil, copper foil, stainless steel foil, iron foil, Dura aluminum foil, tin foil, titanium foil, gold foil, etc.; polyethylene, polypropylene, polychlorinated a film made of various resins such as ethylene, polyester, and polyamide; a foam such as a polyurethane foam, a vinyl foam, a polyethylene foam, or a styrene foam, or a non-woven fabric, A woven fabric, a felt, and a film obtained by laminating these materials with a polymer material. The thickness of the substrate is not particularly limited, and is, for example, 5 μm to 5 mm, preferably about 30 μm to 100 μm.

於與此種基材中之黏著劑層接觸之側之表面上以層狀塗佈矽酮系樹脂、長鏈烷基系樹脂、氟系樹脂、低分子量聚乙烯、聚丙烯、橡膠系聚合物、磷酸酯系界面活性劑等脫模劑等,可列舉該領域中公知之實施有脫模處理而成者。 The oxime-based resin, the long-chain alkyl resin, the fluorine-based resin, the low-molecular-weight polyethylene, the polypropylene, and the rubber-based polymer are applied in a layer form on the surface on the side in contact with the adhesive layer in the substrate. Examples of the release agent such as a phosphate ester surfactant include a release treatment which is well known in the art.

剝離襯墊亦可放入一根或複數根直線狀、波狀、鋸齒狀、之字形之長條(所謂嚙合),以提高向被接著體貼附黏著帶時之貼附操作性。 The release liner may also be provided with one or a plurality of straight, wavy, serrated, zigzag strips (so-called engagement) to improve the attaching operability when the adhesive tape is attached to the adherend.

[黏著帶之製法] [Method of making adhesive tape]

本發明之黏著帶可藉由如下方式而製造:將特定之伸烷基雙飽和脂肪酸醯胺添加於樹脂中而形成熱塑性樹脂膜或感壓性黏著劑層, The adhesive tape of the present invention can be produced by adding a specific alkyl bis-saturated fatty acid decylamine to a resin to form a thermoplastic resin film or a pressure-sensitive adhesive layer.

積層上述熱塑性樹脂膜及感壓性黏著劑層。 The thermoplastic resin film and the pressure-sensitive adhesive layer are laminated.

將伸烷基雙飽和脂肪酸醯胺作為添加劑添加於樹脂等中從而形成熱塑性樹脂膜或感壓性黏著劑層之方法係可利用該領域中公知之方法。 A method of adding an alkylene di-saturated fatty acid decylamine as an additive to a resin or the like to form a thermoplastic resin film or a pressure-sensitive adhesive layer can be carried out by a method known in the art.

再者,此種熱塑性樹脂膜或感壓性黏著劑層之形成及積層亦可依序進行。即,亦可藉由該領域中公知之方法而分別單獨地形成熱塑性樹脂膜及感壓性黏著劑層。因此,例如可利用熔態擠壓成形法(膨脹法、T模法等)、熔融流延法、軋光法等。又,關於黏著劑層,亦可藉由上述方法而另行形成。如此,於單獨形成熱塑性樹脂膜及感壓性黏著劑層之情形時,可藉由該領域中公知之方法而積層兩者。 Further, the formation and lamination of the thermoplastic resin film or the pressure-sensitive adhesive layer may be sequentially performed. That is, the thermoplastic resin film and the pressure-sensitive adhesive layer may be separately formed by a method known in the art. Therefore, for example, a melt extrusion molding method (expansion method, T-die method, etc.), a melt casting method, a calendering method, or the like can be used. Further, the adhesive layer may be separately formed by the above method. As described above, in the case where the thermoplastic resin film and the pressure-sensitive adhesive layer are separately formed, both of them can be laminated by a method known in the art.

熱塑性樹脂膜或感壓性黏著劑層之形成及積層亦可同時進行。即,亦可藉由共擠壓法、層壓法(擠壓層壓法、使用有接著劑之層壓法等)、熱密封法(外部加熱法、內部發熱法等)使熱塑性樹脂膜及感壓性黏著劑層為多層結構而形成。 The formation and lamination of the thermoplastic resin film or the pressure-sensitive adhesive layer can also be carried out simultaneously. In other words, the thermoplastic resin film can be formed by a co-extrusion method, a lamination method (extrusion lamination method, a lamination method using an adhesive), a heat sealing method (external heating method, internal heat generation method, etc.). The pressure-sensitive adhesive layer is formed in a multilayer structure.

剝離襯墊係通常於形成黏著帶之後而貼合於黏著劑層側,藉此可獲得附有剝離襯墊之黏著帶。 The release liner is usually attached to the side of the adhesive layer after forming the adhesive tape, whereby an adhesive tape with a release liner can be obtained.

[實施例] [Examples] (黏著帶之製作) (production of adhesive tape)

準備以下之原料,預先利用亨舍爾混合機而摻合,將塑化劑滲入至樹脂而乾透。使用藉由利用班伯裏混合機對其進行混練而獲得之聚氯乙烯混和物,並藉由軋光成膜機而獲得厚度為110 μm之熱塑性樹脂膜。 The following raw materials were prepared, blended in advance using a Henschel mixer, and the plasticizer was allowed to permeate into the resin to be dried. A polyvinyl chloride mixture obtained by kneading with a Banbury mixer was used, and a thermoplastic resin film having a thickness of 110 μm was obtained by a calender film forming machine.

作為潤滑劑,使用以下之表所示之伸烷基雙脂肪酸醯胺。潤滑 劑係於班伯裏混合機混練時而添加。 As the lubricant, an alkylene difatty acid decylamine shown in the following table was used. lubricating The agent is added during the mixing of the Banbury mixer.

利用甲苯將所獲得之黏著劑稀釋為20%,並以使乾燥後之厚度成為10 μm之方式塗佈於上述熱塑性樹脂膜上,經由150℃、1分鐘之乾燥步驟而捲繞為卷狀。 The obtained adhesive was diluted to 20% with toluene, and applied to the thermoplastic resin film so as to have a thickness of 10 μm after drying, and wound into a roll shape by a drying step at 150 ° C for 1 minute.

使用所獲得之黏著帶進行以下之評價。 The following evaluation was carried out using the obtained adhesive tape.

將卷狀黏著帶切割為20 mm寬度而製成樣品。 The rolled adhesive tape was cut to a width of 20 mm to prepare a sample.

利用Instron型拉伸試驗機並於拉伸速度0.3 m/分下對該樣品進行回捲,測定來自輥之剝離力。 The sample was rewinded using an Instron type tensile tester at a tensile speed of 0.3 m/min, and the peeling force from the roll was measured.

將剝離力未達1.0 N/20 mm設為○,將剝離力為1.0 N/20 mm以上且未達3.6 N/20 mm設為△,將剝離力為3.6 N/20 mm以上設為×。 The peeling force was less than 1.0 N/20 mm, and the peeling force was 1.0 N/20 mm or more and less than 3.6 N/20 mm was set to Δ, and the peeling force was set to 3.6 N/20 mm or more to X.

再者,剝離力之測定係分別對如下而成者進行測定:捲繞為卷狀之後者、於室溫下保存一週之後者、及於60℃之乾燥機中保存一週之後並於室溫下放置1小時而成者。 Further, the measurement of the peeling force was carried out by measuring the following: one after winding in a roll, one week after storage at room temperature, and one week after drying in a dryer at 60 ° C and at room temperature. Place it for 1 hour.

將該等之結果示於以下之表。 The results of these are shown in the table below.

表1中之各成分係如下所述。 The components in Table 1 are as follows.

實施例1之亞甲基雙硬脂酸醯胺:雙醯胺LA(日本化成(股)製造),實施例2之亞乙基雙硬脂酸醯胺:SLIPACKS E(日本化成(股)製造),實施例3之乙烯雙月桂酸醯胺:SLIPACKS L(日本化成(股)製造),比較例1之乙烯雙山萮酸醯胺:SLIPACKS B(日本化成(股)製造),比較例2之六亞甲基雙硬脂酸醯胺:SLIPACKS ZHS(日本化成(股)製造), 比較例3之乙烯雙油酸醯胺:SLIPACKS O(日本化成(股)製造),比較例4之乙烯雙芥酸醯胺:SLIPACKS R(日本化成(股)製造),比較例5之六亞甲基油酸醯胺:SLIPACKS ZHO(日本化成(股)製造)。 Methylene bis-stearate amide of Example 1: bis- decylamine LA (manufactured by Nippon Kasei Co., Ltd.), ethylene bis-stearate amide of Example 2: SLIPACKS E (manufactured by Nippon Kasei Co., Ltd.) Ethylene dilaurate decylamine of Example 3: SLIPACKS L (manufactured by Nippon Kasei Co., Ltd.), bismuth bismuthate amide of Comparative Example 1 : SLIPACKS B (manufactured by Nippon Kasei Co., Ltd.), Comparative Example 2 Hexamethylene bis-stearate amide: SLIPACKS ZHS (manufactured by Nippon Kasei Co., Ltd.), Ethylene bis-oleic acid decylamine of Comparative Example 3: SLIPACKS O (manufactured by Nippon Kasei Co., Ltd.), ethylene erucic acid decylamine of Comparative Example 4: SLIPACKS R (manufactured by Nippon Kasei Co., Ltd.), Comparative Example 5, hexa Ammonium methyl oleate: SLIPACKS ZHO (manufactured by Nippon Kasei Co., Ltd.).

[產業上之可利用性] [Industrial availability]

本發明之黏著帶可作為電子零件等各種被接著體之表面保護用帶或片材、切割時之加工用或保護用帶或片材等而廣泛地利用。 The adhesive tape of the present invention can be widely used as a surface protective tape or sheet for various kinds of adherends such as electronic parts, a processing tape or a sheet for cutting, or a protective tape or the like.

Claims (5)

一種黏著帶,其特徵在於:其係於熱塑性樹脂膜之單面形成有感壓性黏著劑層而成者,於至少熱塑性樹脂膜及感壓性黏著劑層之其中一者中含有包含碳數為1~4之伸烷基及碳數為12~18之飽和脂肪酸殘基之伸烷基雙飽和脂肪酸醯胺。 An adhesive tape comprising a pressure-sensitive adhesive layer formed on one surface of a thermoplastic resin film, and containing at least one of a thermoplastic resin film and a pressure-sensitive adhesive layer The alkyl di-saturated fatty acid decylamine is an alkylene group having 1 to 4 alkyl groups and a saturated fatty acid residue having 12 to 18 carbon atoms. 如請求項1之黏著帶,其中伸烷基雙飽和脂肪酸醯胺係相對於熱塑性樹脂100重量份而以0.1~5.0重量份添加。 The adhesive tape of claim 1, wherein the alkyl bis-saturated fatty acid amide is added in an amount of 0.1 to 5.0 parts by weight based on 100 parts by weight of the thermoplastic resin. 如請求項1或2之黏著帶,其中熱塑性樹脂膜係包括含有塑化劑之軟質聚氯乙烯之膜。 The adhesive tape of claim 1 or 2, wherein the thermoplastic resin film comprises a film of a soft polyvinyl chloride containing a plasticizer. 如請求項1至3中任一項之黏著帶,其中感壓性黏著劑層含有丙烯酸系聚合物作為基礎聚合物。 The adhesive tape according to any one of claims 1 to 3, wherein the pressure-sensitive adhesive layer contains an acrylic polymer as a base polymer. 如請求項1至4中任一項之黏著帶,其中於黏著帶之感壓性黏著層側配置有剝離襯墊。 The adhesive tape according to any one of claims 1 to 4, wherein a release liner is disposed on the pressure-sensitive adhesive layer side of the adhesive tape.
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