TW201337154A - Light emitting diode bulb - Google Patents
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- TW201337154A TW201337154A TW101106854A TW101106854A TW201337154A TW 201337154 A TW201337154 A TW 201337154A TW 101106854 A TW101106854 A TW 101106854A TW 101106854 A TW101106854 A TW 101106854A TW 201337154 A TW201337154 A TW 201337154A
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Abstract
Description
本發明是有關於一種燈具，且特別是有關於一種發光二極體燈具。This invention relates to a light fixture, and more particularly to a light emitting diode light fixture.
發光二極體(Light-Emitting Diode)屬於半導體元件，其發光晶片之材料主要使用Ⅲ-Ⅴ族化學元素之化合物，例如磷化鎵(GaP)或砷化鎵(GaAs)，而其發光原理是將電能轉換為光能。詳細而言，發光二極體藉由對化合物半導體施加電流，以透過電子與電洞的結合將過剩的能量以光的形式釋出。由於發光二極體的發光現象不是藉由加熱發光或放電發光，因此發光二極體的壽命長達十萬小時以上。此外，發光二極體更具有反應速度快、體積小、省電、低污染、高可靠度、適合量產等優點，所以發光二極體應用的領域十分廣泛，如大型看板、交通號誌燈、手機、掃描器、傳真機之光源以及發光二極體燈具等。Light-Emitting Diode is a semiconductor component, and the material of the light-emitting chip mainly uses a compound of a group III-V chemical element, such as gallium phosphide (GaP) or gallium arsenide (GaAs), and the principle of light emission is Convert electrical energy into light energy. In detail, the light-emitting diode releases excess energy in the form of light by applying a current to the compound semiconductor to transmit a combination of electrons and holes. Since the luminescence phenomenon of the illuminating diode does not illuminate by heating or discharging, the life of the illuminating diode is as long as 100,000 hours or more. In addition, the light-emitting diode has the advantages of fast response speed, small volume, power saving, low pollution, high reliability, and suitable for mass production, so the application field of the light-emitting diode is very wide, such as a large billboard, traffic light , light sources for mobile phones, scanners, fax machines, and light-emitting diode lamps.
以發光二極體燈具而言，為了避免發光二極體發光時產生過熱的現象，可配置散熱元件。在習知的結構設計中，會以卡勾或是黏膠以結合散熱元件與發光二極體燈具之金屬燈頭的絕緣結構。然而，上述之接合方式受限於卡勾扣合的干涉量或是黏膠的品質，因此發光二極體燈具的整體結構易有脫落之風險。此外，發光二極體燈具的電路模組與金屬燈頭之電性連接通常採用電線連接，如此亦增加組裝工時。In the case of a light-emitting diode lamp, a heat dissipating component can be disposed in order to avoid overheating when the light-emitting diode emits light. In the conventional structural design, a hook or a glue is used to combine the heat dissipating component with the insulating structure of the metal lamp cap of the LED lamp. However, the above-mentioned joining manner is limited by the interference amount of the hook fastening or the quality of the adhesive, and therefore the overall structure of the light-emitting diode lamp is liable to fall off. In addition, the electrical connection between the circuit module of the LED lamp and the metal lamp head is usually connected by wires, which also increases the assembly man-hour.
本發明提供一種發光二極體燈具，其整體結構較為穩固，且具有較簡單的組裝方式以及較少的零件數量。The invention provides a light-emitting diode lamp, which has a relatively stable overall structure, a simple assembly method and a small number of parts.
本發明提出一種發光二極體燈具，包括一功能性元件、一電路模組、一電極、一燈頭與複數個第一端子。功能性元件具有一散熱部與一連接部，其中散熱部與連接部為一體成型。散熱部具有一容置開口，且連接部具有連通容置開口的複數個第一貫孔。電路模組配置於容置開口內。電極鄰近連接部。燈頭配置於功能性元件與電極之間，且燈頭與連接部組裝。這些第一端子嵌入至第一貫孔內，其中這些第一端子的其中之一接觸電極，以電性連接電極與電路模組，且這些第一端子的其中之另一接觸燈頭，以電性連接燈頭與電路模組。The invention provides a light-emitting diode lamp, which comprises a functional component, a circuit module, an electrode, a lamp cap and a plurality of first terminals. The functional component has a heat dissipating portion and a connecting portion, wherein the heat dissipating portion and the connecting portion are integrally formed. The heat dissipation portion has a receiving opening, and the connecting portion has a plurality of first through holes that communicate with the receiving opening. The circuit module is disposed in the receiving opening. The electrode is adjacent to the connection. The lamp cap is disposed between the functional element and the electrode, and the lamp cap is assembled with the connecting portion. The first terminals are embedded in the first through holes, wherein one of the first terminals contacts the electrodes to electrically connect the electrodes and the circuit module, and the other of the first terminals contacts the lamp cap to electrically Connect the lamp head to the circuit module.
在本發明之一實施例中，上述之功能性元件的材料為一非導電材料，其中此非導電材料包括一導熱塑膠或一聚對苯二甲酸丁二酯(polybutylene terephthalate,PBT)。In an embodiment of the invention, the material of the functional component is a non-conductive material, wherein the non-conductive material comprises a heat conductive plastic or a polybutylene terephthalate (PBT).
在本發明之一實施例中，發光二極體燈具更包括複數個第二端子，且電路模組包括一電路板、複數個發光二極體與一驅動電路。電路板配置於這些第二端子與驅動電路之間。這些發光二極體環繞地配置於電路板的一表面上，以與電路板電性連接。驅動電路具有複數個第一導電部與複數個第二導電部。這些第一導電部嵌入至這些第一貫孔內，以分別連接這些第一端子。這些第二導電部分別連接這些第二端子，以電性連接電路板與驅動電路。In an embodiment of the invention, the LED device further includes a plurality of second terminals, and the circuit module includes a circuit board, a plurality of LEDs, and a driving circuit. The circuit board is disposed between the second terminals and the driving circuit. The light emitting diodes are circumferentially disposed on a surface of the circuit board to be electrically connected to the circuit board. The driving circuit has a plurality of first conductive portions and a plurality of second conductive portions. The first conductive portions are embedded in the first through holes to respectively connect the first terminals. The second conductive portions are respectively connected to the second terminals to electrically connect the circuit board and the driving circuit.
在本發明之一實施例中，上述之各個第一導電部為一導電柱體，且各個第二導電部具有一開口，以將各個第二導電部分隔為複數個導電腳。第二端子嵌入至開口內，並被這些導電腳夾持。In an embodiment of the invention, each of the first conductive portions is a conductive pillar, and each of the second conductive portions has an opening to partition each of the second conductive portions into a plurality of conductive legs. The second terminal is embedded in the opening and is held by the conductive legs.
在本發明之一實施例中，發光二極體燈具更包括一絕緣蓋體，其具有一第二容置開口。驅動電路配置於第二容置開口內。此外，絕緣蓋體更具有複數個散熱面，其配置於絕緣蓋體的外圍。這些散熱面彼此鄰接，且鄰接的各散熱面之間具有一稜線。In an embodiment of the invention, the LED lamp further includes an insulating cover having a second receiving opening. The driving circuit is disposed in the second receiving opening. In addition, the insulating cover further has a plurality of heat dissipating surfaces disposed on the periphery of the insulating cover. The heat dissipating surfaces are adjacent to each other and have a ridge line between the adjacent heat dissipating surfaces.
在本發明之一實施例中，上述之散熱部更具有複數個第一開口，其配置於散熱部的外圍。這些第一開口連通容置開口，並分隔出複數個鰭片。此外，散熱部更具有複數個第二開口。各個第二開口配置於各個鰭片上，且朝向容置開口延伸。In an embodiment of the invention, the heat dissipation portion further includes a plurality of first openings disposed at a periphery of the heat dissipation portion. The first openings communicate with the receiving opening and separate the plurality of fins. In addition, the heat dissipation portion further has a plurality of second openings. Each of the second openings is disposed on each of the fins and extends toward the receiving opening.
在本發明之一實施例中，發光二極體燈具更包括一透鏡，其配置於電路模組之上且組裝至散熱部。In an embodiment of the invention, the LED lamp further includes a lens disposed on the circuit module and assembled to the heat dissipation portion.
本發明更提出一種發光二極體燈具，包括一電極、一功能性元件、一電路模組、一燈頭及二端子。功能性元件具有一大表面積範圍之散熱部以及一突出之連接部，其中功能性元件的材料為一非導電材料。電路模組配置於散熱部內，並具有至少一發光二極體。燈頭配置於功能性元件與電極之間，以容納連接部。二端子嵌入至連接部內，其中二端子的其中之一接觸電極，以電性連接電極與電路模組。且二端子的其中之另一接觸燈頭，以電性連接燈頭與電路模組。The invention further provides a light-emitting diode lamp, comprising an electrode, a functional component, a circuit module, a lamp cap and two terminals. The functional element has a heat sink portion over a large surface area and a protruding connection, wherein the material of the functional element is a non-conductive material. The circuit module is disposed in the heat dissipation portion and has at least one light emitting diode. The lamp cap is disposed between the functional component and the electrode to accommodate the connection portion. The two terminals are embedded in the connecting portion, wherein one of the two terminals contacts the electrode to electrically connect the electrode and the circuit module. And the other of the two terminals contacts the lamp cap to electrically connect the lamp cap and the circuit module.
基於上述，本發明藉由功能性元件為一體成型，並將功能性元件直接地固定至燈頭上，因此可使整體結構更為穩固，並減少零件數量。此外，這些第一端子分別接觸電極與燈頭，可使電路模組電性連接電極與燈頭。藉此，可避免使用習知電線的連接，以節省組裝時間。此外，藉此鏤空式功能性元件的設計可提升熱對流效果，因此在功能性元件與電路模組接合後，依然可藉由對流方式將電路模組的熱散出。Based on the above, the present invention is integrally formed by functional elements and directly fixes the functional elements to the base, thereby making the overall structure more stable and reducing the number of parts. In addition, the first terminals respectively contact the electrode and the lamp cap, so that the circuit module can electrically connect the electrode and the lamp cap. Thereby, the connection of the conventional electric wire can be avoided to save assembly time. In addition, the design of the hollowed-out functional component can improve the heat convection effect, so that after the functional component and the circuit module are joined, the heat of the circuit module can still be dissipated by convection.
為讓本發明之上述特徵和優點能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。The above described features and advantages of the present invention will be more apparent from the following description.
圖1為本發明一實施例之發光二極體燈具的立體圖。圖2A為圖1之發光二極體燈具的爆炸圖。圖2B為圖2A之發光二極體燈具於另一視角的爆炸圖。圖3為圖2A之發光二極體燈具沿A-A割面線於組合後的剖視圖。請參考圖1、圖2A、圖2B與圖3，在本實施例中，發光二極體燈具100包括一功能性元件110、一電路模組120、一電極130、一燈頭140(例如是一螺旋燈頭)與複數個第一端子150。功能性元件110具有一散熱部110b與一連接部110c，其中散熱部110b與連接部110c為一體成型。散熱部110b具有一容置開口112，且連接部110c具有連通容置開口112的複數個第一貫孔114。電路模組120配置於容置開口112內。燈頭140配置於功能性元件110與電極130之間，且燈頭140與連接部110c組裝。這些第一端子150嵌入至第一貫孔114內，其中這些第一端子150的其中之一個接觸電極130，以電性連接電極130與電路模組120，且這些第一端子150的其中之另一個接觸燈頭140，以電性連接燈頭140與電路模組120。1 is a perspective view of a light-emitting diode lamp according to an embodiment of the present invention. 2A is an exploded view of the light-emitting diode lamp of FIG. 1. 2B is an exploded view of the light-emitting diode lamp of FIG. 2A from another perspective. 3 is a cross-sectional view of the LED of FIG. 2A taken along the A-A cut line. Referring to FIG. 1 , FIG. 2A , FIG. 2B and FIG. 3 , in the embodiment, the LED device 100 includes a functional component 110 , a circuit module 120 , an electrode 130 , and a lamp cap 140 . The spiral head) and the plurality of first terminals 150. The functional component 110 has a heat dissipating portion 110b and a connecting portion 110c, wherein the heat dissipating portion 110b and the connecting portion 110c are integrally formed. The heat dissipation portion 110b has a receiving opening 112, and the connecting portion 110c has a plurality of first through holes 114 that communicate with the receiving opening 112. The circuit module 120 is disposed in the receiving opening 112. The base 140 is disposed between the functional element 110 and the electrode 130, and the base 140 is assembled with the connecting portion 110c. The first terminals 150 are embedded in the first through holes 114, and one of the first terminals 150 contacts the electrodes 130 to electrically connect the electrodes 130 and the circuit module 120, and the other of the first terminals 150 A contact lamp 140 is electrically connected to the lamp cap 140 and the circuit module 120.
詳細地說，本實施例的功能性元件110的材料為一非導電材料，且此非導電材料可包括一導熱塑膠或一PBT。因此，藉由散熱部110b與連接部110c採用一體成型的製造(例如為射出成型)，並將連接部110c與燈頭140組裝(例如為形變的壓合)，可使功能性元件110與燈頭140相互固定。藉此，可避免習知散熱元件與金屬燈頭的絕緣部分以卡勾的扣合或以黏膠的膠合產生脫落的風險，並提高功能性元件110與燈頭140之間的結合強度。此外，由於燈頭140可與功能性元件110組裝而直接地電性絕緣，因此可減少用於燈頭140與功能性元件110之間的絕緣零件，以節省發光二極體燈具100的組裝工時以及製造費用。再者，本實施例的發光二極體燈具100的電路模組120是經由這些第一端子150以電性連接燈頭140與電極130。因此，在組裝人員將第一端子150嵌入至連接部110c的第一貫孔114後，再將燈頭140與電極130固定至功能性元件110，這些第一端子150的搭接部152分別抵靠燈頭140與電極130，可使電路模組120及燈頭140與電極130電性連接。藉此，可節省發光二極體燈具100的組裝時間，亦可避免使用習知電線連接方式而使得電路模組120產生雜訊而影響發光二極體燈具100的發光。In detail, the material of the functional component 110 of the embodiment is a non-conductive material, and the non-conductive material may include a thermal conductive plastic or a PBT. Therefore, the functional component 110 and the base 140 can be made by integrally manufacturing the heat-dissipating portion 110b and the connecting portion 110c (for example, injection molding) and assembling the connecting portion 110c with the base 140 (for example, press-forming deformation). Fixed to each other. Thereby, the risk of the conventional heat dissipating component and the insulating portion of the metal lamp cap being detached by the hook or the glue of the adhesive can be avoided, and the bonding strength between the functional component 110 and the lamp cap 140 can be improved. In addition, since the lamp cap 140 can be directly electrically insulated from the functional component 110, the insulating component between the lamp cap 140 and the functional component 110 can be reduced to save assembly man-hours of the light-emitting diode lamp 100 and Manufacturing costs. Furthermore, the circuit module 120 of the LED device 100 of the present embodiment electrically connects the lamp cap 140 and the electrode 130 via the first terminals 150. Therefore, after the assembler inserts the first terminal 150 into the first through hole 114 of the connecting portion 110c, the base 140 and the electrode 130 are fixed to the functional component 110, and the overlapping portions 152 of the first terminals 150 respectively abut The lamp cap 140 and the electrode 130 can electrically connect the circuit module 120 and the lamp cap 140 to the electrode 130. Thereby, the assembly time of the LED device 100 can be saved, and the conventional circuit connection can be avoided to cause the circuit module 120 to generate noise and affect the illumination of the LED lamp 100.
請參考圖2A與圖2B，本實施例的發光二極體燈具100更包括複數個第二端子160，且電路模組120包括一電路板122、複數個發光二極體124與一驅動電路126。電路板122配置於這些第二端子160與驅動電路126之間。這些發光二極體124環繞地配置於電路板122的一表面122a上，以與電路板122電性連接。驅動電路126具有複數個第一導電部126a與複數個第二導電部126b。這些第一導電部126a嵌入至這些第一貫孔114內，以分別連接這些第一端子150。這些第二導電部126b分別連接這些第二端子160，以電性連接電路板122與驅動電路126。進一步地說，當外部的交流電源透過電極130與燈頭140傳遞至驅動電路126時，此交流電源藉由第一導電部126a傳遞至驅動電路126內部，並將此交流電源轉換為直流電源。接著，透過第二導電部126b將直流電源提供至電路板122以驅動發光二極體124發射出光線。Referring to FIG. 2A and FIG. 2B , the LED device 100 of the present embodiment further includes a plurality of second terminals 160 , and the circuit module 120 includes a circuit board 122 , a plurality of LEDs 124 , and a driving circuit 126 . . The circuit board 122 is disposed between the second terminals 160 and the driving circuit 126. The LEDs 124 are disposed on a surface 122a of the circuit board 122 to be electrically connected to the circuit board 122. The driving circuit 126 has a plurality of first conductive portions 126a and a plurality of second conductive portions 126b. The first conductive portions 126a are embedded in the first through holes 114 to respectively connect the first terminals 150. The second conductive portions 126b are respectively connected to the second terminals 160 to electrically connect the circuit board 122 and the driving circuit 126. Further, when an external AC power source is transmitted to the driving circuit 126 through the electrode 130 and the lamp cap 140, the AC power source is transmitted to the inside of the driving circuit 126 through the first conductive portion 126a, and the AC power source is converted into a DC power source. Then, a DC power source is supplied to the circuit board 122 through the second conductive portion 126b to drive the light emitting diode 124 to emit light.
承上述，各個第一導電部126a為一導電柱體，且各個第二導電部126b具有一開口126c，以將各個第二導電部126b分隔為複數個導電腳126d。第二端子160嵌入至開口126c內，並被這些導電腳126d夾持。藉此方式，可便於組裝人員的作業以將第一端子150與第二端子160電性連接驅動電路126。In the above, each of the first conductive portions 126a is a conductive pillar, and each of the second conductive portions 126b has an opening 126c to divide each of the second conductive portions 126b into a plurality of conductive legs 126d. The second terminal 160 is embedded in the opening 126c and is held by the conductive legs 126d. In this way, the assembly worker's work can be facilitated to electrically connect the first terminal 150 and the second terminal 160 to the driving circuit 126.
此外，電路板122具有複數個第一螺絲孔122b，且散熱部110b更具有複數個對應第一螺絲孔122b的第二螺絲孔110a，藉由複數個螺絲(未繪示)穿過第一螺絲孔122b與第二螺絲孔110a可將驅動電路126固定於電路板122功能性元件110之間。In addition, the circuit board 122 has a plurality of first screw holes 122b, and the heat dissipating portion 110b further has a plurality of second screw holes 110a corresponding to the first screw holes 122b, and the plurality of screws (not shown) pass through the first screws. The hole 122b and the second screw hole 110a can secure the drive circuit 126 between the circuit board 122 functional elements 110.
本實施例的發光二極體燈具100更包括一絕緣蓋體170，其具有一第二容置開口172。驅動電路126配置於第二容置開口172內。藉此配置，絕緣蓋體170可作為驅動電路126的絕緣媒介，以避免驅動電路126受到外界電荷影響。此外，絕緣蓋體170更具有複數個散熱面174，其配置於絕緣蓋體170的外圍。這些散熱面174彼此鄰接，且鄰接的各散熱面174之間具有一稜線174a。藉此，可加大絕緣蓋體170的散熱表面積，以使驅動電路126所產生的熱可經由這些散熱面174傳遞至外界。The LED device 100 of the present embodiment further includes an insulating cover 170 having a second receiving opening 172. The driving circuit 126 is disposed in the second receiving opening 172. With this configuration, the insulating cover 170 can serve as an insulating medium for the driving circuit 126 to prevent the driving circuit 126 from being affected by external charges. In addition, the insulating cover 170 further has a plurality of heat dissipating surfaces 174 disposed on the outer periphery of the insulating cover 170. The heat dissipating surfaces 174 are adjacent to each other, and a ridge line 174a is formed between the adjacent heat dissipating surfaces 174. Thereby, the heat dissipating surface area of the insulating cover 170 can be increased, so that the heat generated by the driving circuit 126 can be transmitted to the outside through the heat dissipating surfaces 174.
請參考圖1、圖2A與圖2B，為了提高發光二極體燈具100的散熱效率，本實施例的散熱部110b更具有複數個第一開口116，其配置於散熱部110b的外圍。這些第一開口116朝向容置開口112延伸並連通容置開口112，以使功能性元件110為一鏤空式的結構，並藉由這些第一開口116分隔出複數個鰭片118。藉此，電路模組120所產生的熱可藉由這些第一開口116迅速地排出至外界，亦可藉由些鳍片118而增加功能性元件110的散熱表面積，以快速地將熱排出至外界。此外，散熱部110b更具有複數個第二開口119。各個第二開口119配置於各個鰭片118上，且朝向容置開口112延伸。藉此，亦可增加功能性元件110的散熱表面積，更有助於提高功能性元件110的散熱效率。Referring to FIG. 1 , FIG. 2A and FIG. 2B , in order to improve the heat dissipation efficiency of the LED device 100 , the heat dissipation portion 110 b of the embodiment further includes a plurality of first openings 116 disposed on the periphery of the heat dissipation portion 110 b . The first openings 116 extend toward the accommodating opening 112 and communicate with the accommodating opening 112 to make the functional element 110 a hollow structure, and the plurality of fins 118 are separated by the first openings 116. Thereby, the heat generated by the circuit module 120 can be quickly discharged to the outside through the first openings 116, and the heat dissipation surface area of the functional component 110 can be increased by the fins 118 to quickly discharge heat to the heat. external. In addition, the heat dissipation portion 110b further has a plurality of second openings 119. Each of the second openings 119 is disposed on each of the fins 118 and extends toward the receiving opening 112 . Thereby, the heat dissipation surface area of the functional component 110 can also be increased, which further helps to improve the heat dissipation efficiency of the functional component 110.
本實施例的發光二極體燈具100更包括一透鏡180，其配置於電路模組120之上且組裝至散熱部110b。藉此，可使電路模組120的光線更為柔和，且光線可均勻的擴散至外界。此外，透鏡180可具有複數個卡勾182，用以卡合至散熱部110b，以便於透鏡180組裝至功能性元件110。The LED device 100 of the present embodiment further includes a lens 180 disposed on the circuit module 120 and assembled to the heat dissipation portion 110b. Thereby, the light of the circuit module 120 can be softened, and the light can be uniformly diffused to the outside. In addition, the lens 180 can have a plurality of hooks 182 for snapping to the heat sink 110b to facilitate assembly of the lens 180 to the functional component 110.
上述實施例中所述之發光二極體124，可以是發光二極體晶片或發光二極體封裝結構。The light-emitting diode 124 described in the above embodiments may be a light-emitting diode wafer or a light-emitting diode package structure.
上述實施例中所述之發光二極體124，可以是白光發光二極體，而白光發光二極體可以包含藍色發光二極體晶片及黃色螢光粉，更可包含紅色發光二極體晶片或紅色螢光粉。此外，白光發光二極體可以包含紅色、綠色及藍色發光二極體晶片，更可包含黃色螢光粉，更進一步可包含紅色螢光粉。另外，發光二極體燈具100可以包含紅色、綠色或藍色發光二極體。其中，上述螢光粉以均勻、不均勻或濃度梯度變化之方式分佈於上述實施例中所述之發光二極體124的透光膠體中。The light emitting diode 124 described in the above embodiment may be a white light emitting diode, and the white light emitting diode may include a blue light emitting diode chip and a yellow fluorescent powder, and may further include a red light emitting diode. Wafer or red phosphor powder. In addition, the white light emitting diode may include red, green, and blue light emitting diode chips, and may further include yellow phosphor powder, and further may include red phosphor powder. In addition, the light-emitting diode lamp 100 may include a red, green or blue light-emitting diode. The phosphor powder is distributed in the light-transmitting colloid of the light-emitting diode 124 described in the above embodiment in a uniform, non-uniform or concentration gradient manner.
上述實施例中所述之燈頭140為導電材料或金屬，不侷限是螺旋燈頭，也可以是MR16、PAR30、PAR38、A60或GU-10燈頭。The lamp cap 140 described in the above embodiment is a conductive material or metal, and is not limited to a screw cap, and may also be an MR16, PAR30, PAR38, A60 or GU-10 lamp cap.
綜上所述，本發明的功能性元件為一體成型的結構，可避免習知散熱元件與金屬燈頭的絕緣部分以卡勾或以黏膠所產生的脫落，以加強功能性元件與燈頭之間的結合強度。此外，由於燈頭可與功能性元件組裝而直接地電性絕緣，因此可減少用於燈頭與功能性元件之間的絕緣零件，以節省發光二極體燈具的組裝工時以及製造費用。另外，第一端子分別地與燈頭與電極連接。藉此配置，在第一端子嵌入至第一貫孔後，再將燈頭與電極固定至功能性元件，可便於電路模組與燈頭與電極電性連接。再者，當功能性元件的散熱部具有複數個第一開口或第二開口時，可提高功能性元件的散熱效率，且功能性元件可為一鏤空式的結構。藉此鏤空式功能性元件的設計可提升熱對流效果，因此在功能性元件與電路模組接合後，依然可藉由對流方式將電路模組的熱散出。In summary, the functional component of the present invention is an integrally formed structure, which can prevent the insulation of the conventional heat dissipating component and the metal lamp cap from being detached by the hook or the adhesive to strengthen the functional component and the lamp cap. The strength of the bond. In addition, since the lamp cap can be directly electrically insulated from the functional component assembly, the insulating component for use between the lamp cap and the functional component can be reduced to save assembly man-hours and manufacturing costs of the light-emitting diode lamp. In addition, the first terminals are respectively connected to the base and the electrode. With this configuration, after the first terminal is embedded in the first through hole, the lamp head and the electrode are fixed to the functional component, which facilitates electrical connection between the circuit module and the lamp cap and the electrode. Moreover, when the heat dissipating portion of the functional element has a plurality of first openings or second openings, the heat dissipation efficiency of the functional elements can be improved, and the functional elements can be a hollow structure. The design of the hollowed-out functional component can improve the heat convection effect, so that after the functional component and the circuit module are joined, the heat of the circuit module can still be dissipated by convection.
雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明之精神和範圍內，當可作些許之更動與潤飾，故本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.
100．．．發光二極體燈具100. . . Light-emitting diode lamp
110．．．功能性元件110. . . Functional component
110a．．．第二螺絲孔110a. . . Second screw hole
110b．．．散熱部110b. . . Heat sink
110c．．．連接部110c. . . Connection
112．．．容置開口112. . . Accommodating opening
114．．．第一貫孔114. . . First consistent hole
116．．．第一開口116. . . First opening
118．．．鰭片118. . . Fin
119．．．第二開口119. . . Second opening
120．．．電路模組120. . . Circuit module
122．．．電路板122. . . Circuit board
122a．．．表面122a. . . surface
122b．．．第一螺絲孔122b. . . First screw hole
124．．．發光二極體124. . . Light-emitting diode
126．．．驅動電路126. . . Drive circuit
126a．．．第一導電部126a. . . First conductive part
126b．．．第二導電部126b. . . Second conductive portion
126c．．．開口126c. . . Opening
126d．．．導電腳126d. . . Conductive foot
130．．．電極130. . . electrode
140．．．燈頭140. . . Lamp head
150．．．第一端子150. . . First terminal
152．．．搭接部152. . . Lap
160．．．第二端子160. . . Second terminal
170．．．絕緣蓋體170. . . Insulating cover
172．．．第二容置開口172. . . Second accommodation opening
174．．．散熱面174. . . Heat sink
174a．．．稜線174a. . . Ridge line
180．．．透鏡180. . . lens
182．．．卡勾182. . . The hook
圖1為本發明一實施例之發光二極體燈具的立體圖。1 is a perspective view of a light-emitting diode lamp according to an embodiment of the present invention.
圖2A為圖1之發光二極體燈具的爆炸圖。2A is an exploded view of the light-emitting diode lamp of FIG. 1.
圖2B為圖2A之發光二極體燈具於另一視角的爆炸圖。2B is an exploded view of the light-emitting diode lamp of FIG. 2A from another perspective.
圖3為圖2A之發光二極體燈具沿A-A割面線於組合後的剖視圖。3 is a cross-sectional view of the LED of FIG. 2A taken along the A-A cut line.
100．．．發光二極體燈具100. . . Light-emitting diode lamp
110．．．功能性元件110. . . Functional component
110a．．．第二螺絲孔110a. . . Second screw hole
110b．．．散熱部110b. . . Heat sink
110c．．．連接部110c. . . Connection
112．．．容置開口112. . . Accommodating opening
116．．．第一開口116. . . First opening
118．．．鰭片118. . . Fin
119．．．第二開口119. . . Second opening
120．．．電路模組120. . . Circuit module
122．．．電路板122. . . Circuit board
122a．．．表面122a. . . surface
122b．．．第一螺絲孔122b. . . First screw hole
124．．．發光二極體124. . . Light-emitting diode
126．．．驅動電路126. . . Drive circuit
126a．．．第一導電部126a. . . First conductive part
126b．．．第二導電部126b. . . Second conductive portion
126c．．．開口126c. . . Opening
126d．．．導電腳126d. . . Conductive foot
130．．．電極130. . . electrode
140．．．燈頭140. . . Lamp head
150．．．第一端子150. . . First terminal
152．．．搭接部152. . . Lap
160．．．第二端子160. . . Second terminal
170．．．絕緣蓋體170. . . Insulating cover
174．．．散熱面174. . . Heat sink
174a．．．稜線174a. . . Ridge line
180．．．透鏡180. . . lens
182．．．卡勾182. . . The hook
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101106854A TWI467111B (en) | 2012-03-02 | 2012-03-02 | Light emitting diode bulb |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101106854A TWI467111B (en) | 2012-03-02 | 2012-03-02 | Light emitting diode bulb |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201337154A true TW201337154A (en) | 2013-09-16 |
| TWI467111B TWI467111B (en) | 2015-01-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| TW101106854A TWI467111B (en) | 2012-03-02 | 2012-03-02 | Light emitting diode bulb |
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| TW (1) | TWI467111B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104315380A (en) * | 2014-10-30 | 2015-01-28 | 江西奥其斯科技有限公司 | Full-automatic bulb lamp |
| TWI500877B (en) * | 2013-09-27 | 2015-09-21 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN2906320Y (en) * | 2006-04-24 | 2007-05-30 | 张大光 | LED combined light source |
| EP2309177A4 (en) * | 2008-06-20 | 2012-07-25 | Sharp Kk | Connector and illuminating device provided with the connector |
| EP2395277B1 (en) * | 2009-02-04 | 2014-05-07 | Panasonic Corporation | Bulb-shaped lamp and lighting device |
| JP5601512B2 (en) * | 2009-09-14 | 2014-10-08 | 東芝ライテック株式会社 | Light emitting device and lighting device |
| CN102032479B (en) * | 2009-09-25 | 2014-05-07 | 东芝照明技术株式会社 | Bulb-shaped lamp and illuminator |
| TWI384170B (en) * | 2010-04-14 | 2013-02-01 | Cirocomm Technology Corp | Led lamp with replaceable light unit |
| TWM388732U (en) * | 2010-05-07 | 2010-09-11 |
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Cited By (2)
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| TWI500877B (en) * | 2013-09-27 | 2015-09-21 | ||
| CN104315380A (en) * | 2014-10-30 | 2015-01-28 | 江西奥其斯科技有限公司 | Full-automatic bulb lamp |
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| TWI467111B (en) | 2015-01-01 |
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