TW201336133A - Adhesive film - Google Patents

Abstract

An adhesive film used to encapsulate an organic electronic diode (OED) is provided. The adhesive film may be useful in effectively preventing penetration of moisture into an encapsulated structure of the organic electronic diode when the organic electronic diode is encapsulated, and effectively performing the encapsulation process under moderate conditions without causing damage to the organic electronic diode during the encapsulation process.

Description

Adhesive film Cross-references to related applications

The application claims the priority and the right of the Korean Patent Application No. 2011-0118478 filed on November 14, 2011, and the Korean Patent Application No. 2012-0128892 filed on Nov. 14, 2012. The full text of the case is incorporated herein by reference.

The present invention relates to an adhesive film and a method of using the same to package an organic electronic device.

An organic electronic device (OED) refers to a product or device that includes at least one organic material layer that undergoes charge transfer using holes and electrons. Generally, an organic electronic device can include a photovoltaic device, an organic light emitting diode (OLED), a rectifier, and a transmitter.

Compared to conventional light sources, organic light-emitting diodes (OLEDs) have low power consumption, fast response times, and can be easily fabricated into thin display devices or lighting devices. Organic light-emitting diodes also have excellent space utilization and are therefore expected to be used in a variety of applications, including all types of portable devices, detectors, notebook computers, and TVs.

In order to encapsulate an organic light-emitting diode formed on a substrate formed of a glass or a polymer film, a conventional method of laminating a part of a glass or a metal can is laminated on a substrate using a binder. Here, glass or The metal can can be formed into a cover having a groove for placing a getter or a moisture absorbent. With this configuration, the glass or metal has a depression or protrusion with a predetermined depth required to support the getter or moisture absorbent. Since the glass is easily damaged by mechanical impact, the overall impact resistance of the device is severely lowered. The use of metals also makes it difficult to ensure the processability required to manufacture large scale devices. Further, in the organic light-emitting device having the conventional configuration, the concave suppresses the heat spread, so that the heat generated during the driving of the display device is concentrated at the center, which becomes a serious problem when the device is scaled up. In addition, it cannot be emitted from the top (this can increase light efficiency).

Prior art patent documents

Patent Document 1: US Patent No. 6,226,890

Patent Document 2: US Patent No. 6,808,828

Patent Document 3: Japanese Patent Specification No. 2000-145627

Patent Document 4: Japanese Patent Specification No. 2001-252505

General theory of invention

The present invention relates to a method of providing an adhesive film, using the organic electronic device thereof, and packaging the organic electronic device.

One object of the present invention is to provide an adhesive film. An exemplary adhesive film can include a multilayer adhesive film. For example, the adhesive film can include a first adhesive layer comprising a moisture absorbent filler and a second adhesive layer comprising no moisture absorbent filler.

According to an exemplary embodiment, the adhesive film used herein is available To encapsulate organic electron diodes (OEDs). According to an exemplary embodiment, the adhesive film seamlessly bonds to the full surface of the OED and thus can be used to encapsulate the organic electronic diode. Here, the adhesive film of the adhesive layer directly contacting and bonding with the organic electronic diode is a second adhesive layer, and the first adhesive layer is not in contact with the organic electronic diode during the package of the organic electronic diode. Adhesive layer.

"Organic electronic diode" or "OED" refers to a product or diode comprising at least one layer of organic material that uses holes and electrons to cause charge transfer to occur between the electrodes of the facing. Here, specific embodiments of the organic electron diode include a photovoltaic device, a rectifier, an emitter, and an organic light emitting diode (OLED), but the invention is not limited thereto. According to an exemplary embodiment, the organic electron diode can be an organic light emitting diode.

Another illustrative embodiment of the invention is directed to an organic electronic device. An exemplary organic electronic device includes an organic electronic diode encapsulated by the adhesive film. According to an exemplary embodiment, in the adhesive film, a second adhesive layer, i.e., an adhesive layer that does not include a moisture absorbent filler, is present and bonded to the full surface of the organic electronic diode. The first adhesive layer, that is, the adhesive layer including the moisture absorbent filler may also be present at a position where the adhesive layer is not in contact with the organic electronic diode.

Yet another illustrative embodiment of the present invention is also directed to a method of packaging an organic electronic device. The method comprises applying an adhesive film to a substrate on which an existing organic electronic diode is formed, such that the second adhesive layer of the adhesive film can be bonded to the entire surface of the organic electronic diode; and curing the adhesive film.

Exemplary embodiments of the present invention will be described in detail below with reference to the accompanying drawings. In the description of the drawings, the same reference numerals refer to the same elements, and the description of the same elements is not repeated.

An adhesive film according to an exemplary embodiment of the present invention is used to encapsulate an organic electronic diode (OED). "Organic electronic diode" or "OED" refers to a product or diode comprising at least one layer of organic material that uses holes and electrons to cause charge transfer to occur between a pair of mutually facing electrodes. Here, specific embodiments of the organic electron diode may include a photovoltaic device, a rectifier, an emitter, and an organic light emitting diode (OLED), but the invention is not limited thereto. According to an exemplary embodiment of the invention, the organic electron diode may be an organic light emitting diode.

An exemplary adhesive film has a multilayer structure including two or more adhesive layers. Here, at least one of the two or more adhesive layers includes a moisture absorbent filler, and the other of the two or more adhesive layers does not include the moisture absorbent filler.

That is, according to an exemplary embodiment, the adhesive film includes a first adhesive layer comprising a moisture absorbent filler and a second adhesive layer not comprising a moisture absorbent filler.

According to an exemplary embodiment, the adhesive film can be seamlessly bonded to the entire surface of the organic electronic diode, that is, directly bonded to the entire surface of the organic electronic diode, and used to encapsulate the organic electronic diode. In this case, the second adhesive layer of the adhesive film not including the moisture absorbent filler may be in direct contact with the organic electron diode, and may be in the period of encapsulating the organic electron diode. In between, a first adhesive layer comprising a moisture absorbent filler is applied such that the first adhesive layer is not in direct contact with the organic electronic diode.

Figure 1 is a schematic view of an adhesive film. As shown in FIG. 1, the adhesive film 1 includes at least one first adhesive layer 11 and a second adhesive layer 12. According to an exemplary embodiment, the first and second adhesive layers 11 and 12 are configured such that they can be stacked one on another in sequence. In this case, the ratio of the thickness (T2, as shown in FIG. 1) of the second adhesive layer 12 to the thickness (T1, as shown in FIG. 1) of the first adhesive layer 11 may be in the range of 1 to 10. . According to various exemplary embodiments, the upper limit of the ratio T1/T2 may be about 50, 45, 40, 35, 30, 25, 20, 15, 10, 5 or 3. The lower limit of the ratio T1/T2 may also be, for example, 0.1, 0.5, 1.0, 1.5, 2.0, 2.5, 3.0, 3.5, 4.0 or 4.5.

When the adhesive film is used for packaging the organic electronic device, by adjusting the ratio T1/T2 of the thickness of the second adhesive layer to the thickness of the first adhesive layer to the foregoing range, moisture penetration can be effectively prevented after the OED package. Package structure. The package structure can also be imparted with excellent durability and long life. Further, in the range of T1/T2, the encapsulation method can be efficiently performed even under mild conditions.

According to an exemplary embodiment of the present invention, the first adhesive layer has a thickness of 5 microns or more, 10 microns or more, 15 microns or more, 20 microns or more, 25 microns or more, or 30 microns. Or higher. As the thickness of the first adhesive layer increases, moisture that penetrates into the diode can be effectively absorbed or removed after encapsulating the organic electronic diode. Therefore, the upper limit of the thickness is not particularly limited. However, when the thickness of the first adhesive layer is too high, the adhesive film is The lamination properties during the encapsulation process are reduced. In consideration of this fact, the upper limit of the thickness can be appropriately selected. According to an exemplary embodiment, the upper limit of the thickness may be, for example, 100 microns or less, 90 microns or less, 80 microns or less, 70 microns or less, 60 microns or less, 50 microns or more. Low, 40 microns or less, 30 microns or less, or 20 microns or less.

The thickness of the second adhesive layer may be the same as or greater than the maximum average diameter of the moisture absorbent filler included in the first adhesive layer. When the thickness of the second adhesive layer is too thin, the organic electron diode may be damaged during the encapsulation method. In consideration of this fact, the thickness of the second adhesive layer can be appropriately selected. The average diameter of the moisture absorbent filler is typically in the range of from about 3 microns to 4 microns. Therefore, the thickness of the second adhesive layer is 3 micrometers or more, 4 micrometers or more, 5 micrometers or more, 6 micrometers or more, or 7 micrometers or more. The upper limit of the thickness of the second adhesive layer may also be, for example, 20 microns or less, 15 microns or less, or 10 microns or less.

Therefore, the total thickness of the adhesive layer in the adhesive film including at least the first and second adhesive layers is, for example, 8 μm or more, 10 μm or more, 15 μm or more, 20 μm or more, 25 Micron or higher, or 30 microns or higher. The upper limit of the total thickness may also be, for example, 100 microns or less, 90 microns or less, 80 microns or less, 70 microns or less, 60 microns or less, 50 microns or less, 45 microns or more. Low, 40 microns or less, 35 microns or less, or 30 microns or less. When the total thickness of the adhesive layer is less than 8 microns, the adhesive film cannot compensate for the physical loss caused by the moisture absorbent filler or other particles. On the other hand, when the total thickness of the adhesive layer exceeds 100 μm, the moisture barrier property is lowered. Especially because of the lamination method During the period, the adhesive oozes heavily, thus damaging the lamination properties.

The adhesive film used herein may further comprise an adhesive layer as long as the adhesive layer includes at least the first and second adhesive layers.

In accordance with another exemplary embodiment of the present invention, the adhesive film may further comprise one or more adhesive layers comprising a moisture absorbent filler or one or more adhesive layers that do not include a moisture absorbent filler. That is, the adhesive film may further comprise one or more adhesive layers comprising a moisture absorbent filler or one or more adhesive layers that do not include a moisture absorbent filler.

According to an exemplary embodiment, the adhesive film 2 may include an adhesive layer having a second adhesive layer 12, a first adhesive layer 11 and a third adhesive layer 21 stacked in sequence as shown in FIG. 2 . In this case, the third adhesive layer 21 may be an adhesive layer that does not include a moisture absorbent filler.

According to another exemplary embodiment, the adhesive film 3 may include a bond having a structure in which the second adhesive layer 12, the first adhesive layer 11, the third adhesive layer 31, and the fourth adhesive layer 32 are sequentially stacked as shown in FIG. Floor. In this case, the third adhesive layer 31 may be an adhesive layer that does not include a moisture absorbent filler, and the fourth adhesive layer 32 may be an adhesive layer including a moisture absorbent filler, and vice versa.

In addition to the configurations shown in Figures 2 and 3, the adhesive film can be made in a variety of different configurations. In this case, the ratio T3/T4 of the total thickness T3 of the adhesive layer not containing the moisture absorbent filler to the total thickness T4 of the adhesive layer containing the moisture absorbent filler must satisfy the thickness ratio T1/T2.

That is, when the adhesive film includes another adhesive layer including a moisture absorbent filler in addition to the first adhesive layer, the first adhesive layer of the aforementioned thickness ratio The thickness or thickness of the first adhesive layer itself can be, for example, the total thickness of all of the adhesive layers including the moisture absorbent filler.

According to an exemplary embodiment, when the adhesive film has a multilayer structure including two or more layers, the adhesive layer not including the moisture absorbent filler may be disposed on the lowermost layer of the adhesive layer. According to another exemplary embodiment, when the adhesive film has a multilayer structure of three or more layers, the adhesive layer not containing the moisture absorbent filler may be disposed on the uppermost and lowermost layers of the adhesive layer, respectively. According to another exemplary embodiment, when the adhesive film has a multilayer structure of four or more layers, the adhesive layer containing the moisture absorbent filler and the adhesive layer not containing the moisture absorbent filler may be alternately stacked in sequence.

The specific kind of the adhesive composition for forming the first or second adhesive layer or forming another adhesive layer other than the first and second adhesive layers is not particularly limited.

According to an exemplary embodiment, the adhesive layer used herein can be formed using a curable hot melt adhesive composition comprising at least one curable resin. In this document, "curable hot-melt adhesive composition" may mean maintaining a solid or semi-solid state at room temperature and exhibiting pressure-sensitive adhesiveness by heat fusion and as a binder to strongly fix a target product upon curing. Adhesive.

For example, the viscosity of the adhesive film according to an exemplary embodiment of the present invention at room temperature may be 10 ⁶ Pa. s or higher, or 10 ⁷ Pa. s or higher. "Room temperature" means a natural temperature that is not raised or lowered, for example, from about 15 ° C to 35 ° C, from about 20 ° C to 25 ° C, or from about 25 ° C. The viscosity used herein is determined using an advanced rheological expansion system (ARES). In the encapsulation method, physical or chemical damage of the device due to curing of the resin can be avoided by adjusting the viscosity of the curable hot-melt adhesive to the aforementioned range, and the method can be smoothly carried out, and the package has a uniform thickness. Tablet.

The upper limit of the viscosity of the adhesive film (especially the adhesive layer of the adhesive film) is not particularly limited as long as the adhesive film is maintained at a solid state or a semi-solid state at room temperature. For example, considering the processability, the viscosity of the adhesive film can be controlled to about 10 ⁹ Pa. s or lower range.

The moisture barrier properties of the adhesive film used herein can be evaluated, for example, using a calcium test. The adhesive film is easily discolored by the reaction of calcium (Ca) with moisture. Therefore, when the adhesive film is exposed to high temperature/humidity conditions for the same time, the less damaged calcium means that the moisture blocking effect is better. In the calcium test, the ideal value is 6 mm, which is the thickness of the adhesive film that is penetrated by water when the adhesive film is exposed to high temperature/humidity conditions (85 ° C, and 85% relative humidity) for 1,000 hours. As shown in Fig. 4, the calcium test may be performed by, for example, thermally laminating an adhesive film on an upper glass panel having a size of 17 mm × 17 mm, and depositing calcium in a lower glass at a size of 5 mm × 5 mm. On the panel, the obtained upper glass panel is pressed against the lower glass panel, the laminated sample is thermally cured, and the relationship between the penetration depth of moisture and time is examined under a microscope, but the invention is not limited thereto.

Typically, during the combination of the panels, at the lamination temperature, adhesive outflow or bleed out occurs. In this case, the adhesive film in an uncured state is laminated on the adhesive at a temperature of 50 ° C to 100 ° C, and the degree of bleeding of the adhesive in the adhesive layer may be 1 mm or less from the original position. In addition, at a temperature of 30 ° C to 130 ° C, the difference in viscosity between the first adhesive layer and the second adhesive layer in the uncured state may be 100 Pa. s or lower, or 70 Pa. s or lower, 50 Pa. s or lower, 20 Pa. s or lower, or 10 Pa. s Or lower. In the first adhesive layer and the second adhesive layer, the viscosity of the upper layer or the lower layer may be relatively higher or lower. Basically, the difference in viscosity between the bonded sublayers can be 0 Pa. s.

Therefore, at a temperature of 30 ° C to 130 ° C, the viscosity difference between the first adhesive layer and the second adhesive layer in the uncured state is 100 Pa. s or lower, preferably 50 Pa. When s or lower, since the difference in the degree of outflow or bleed out of each adhesive layer during the lamination method is small, reliability can be ensured. As described above, at a temperature of 30 ° C to 130 ° C, when the difference between the first adhesive layer and the second adhesive layer in the uncured state is relatively low, the degree of outflow or exudation of each of the adhesive sublayers during the lamination process The difference can range from 0 microns to 300 microns. In this case, a typical lamination method is carried out in such a manner that the adhesive film is thermally laminated on the adhesive at a temperature of 50 ° C to 100 ° C and a variable pressure, but the present invention is not limited thereto. For example, lamination can be carried out at a pressure of from 0.05 MPa to 5 MPa. As described above, the degree of outflow of the binder can be controlled by controlling the viscosity of the adhesive layer in the uncured state within the heating temperature range. Therefore, when the adhesive layer is applied to the lamination method, reliability can be ensured.

The viscosity of the first adhesive layer and the second adhesive layer can be adjusted by changing the content of the component or changing the content of the component, the additive content, the type or particle size of the moisture absorbent or filler, or the conditions required for the production of the adhesive film.

The specific kind of curable resin usable in accordance with the exemplified embodiments of the present invention is not particularly limited. For example, various curable resins known in the related art, such as a thermosetting resin, a photocurable resin, or a dual curable resin can be used. "Thermosetting resin" means a resin which can be cured by appropriate application by heat or aging method, and "photocurable resin" means that it can be irradiated by electromagnetic waves. The resin which is cured by the action, and the "double-curable resin" is a resin which combines the characteristics of both the thermosetting resin and the photocurable resin and thus can be cured by irradiation with electromagnetic waves and heat application. As described above, the types of electromagnetic waves may include particle beams such as α-particle beams, proton beams, neutron beams, and electron beams, and microwaves, infrared rays (IR), ultraviolet rays (UV), X-rays, and gamma rays. One specific embodiment of the photocurable resin can be a cationic photocurable resin. The cationic photocurable resin refers to a resin which can be cured by cationic polymerization or by a cationic curing reaction induced by electromagnetic wave irradiation.

The specific kind of the curable resin is not particularly limited as long as they exhibit the aforementioned characteristics. For example, the curable resin may include a resin that cures to exhibit adhesion, such as a resin containing at least one thermally curable functional group (such as a glycidyl group, an isocyanate group, a hydroxyl group, a carboxyl group, or a decyl group), or contains At least one resin which can be cured by irradiation of electromagnetic waves such as an epoxy group, a cyclic ether group, a thio group, an acetal group or a lactone group. The specific kind of the resin may also include an acrylic resin, a polyester resin, an isocyanate resin or an epoxy resin, but the invention is not limited thereto.

An aromatic or aliphatic resin or a linear or branched epoxy resin can be used as the curable resin. According to an exemplary embodiment, an epoxy resin having at least two functional groups and having an epoxy equivalent weight of from 180 g/eq to 1,000 g/equivalent may be used. When the epoxy resin has the aforementioned epoxy equivalent, the epoxy resin can be used to effectively maintain characteristics such as the adhesion efficiency of the cured product and the glass transition temperature. Specific examples of the epoxy resin may include cresol epoxide epoxy resin, bisphenol A epoxy resin, bisphenol A varnish epoxy resin, phenol varnish Epoxy resin, tetrafunctional epoxy resin, biphenyl epoxy resin, trisphenol methane epoxy resin, alkyl modified trisphenol methane epoxy resin, naphthalene epoxy resin, dicyclopentadiene Type epoxy resins or phenolic epoxy resins modified with dicyclopentadiene, which may be used singly or in combination.

According to an exemplary embodiment, an epoxy resin having a circular structure in a molecular structure can be used as a curable resin. For example, an epoxy resin containing an aryl group such as a phenyl group can be used. When the epoxy resin contains an aryl group, the cured product can have excellent thermal and chemical stability and low moisture absorption, thereby improving the reliability of the packaged structure of the organic electronic device. Specific embodiments of the aryl-containing epoxy resin may include, but are not limited to, a biphenyl type epoxy resin, a dicyclopentadiene type epoxy resin, a naphthalene type epoxy resin, and a modification of dicyclopentadiene. Phenolic epoxy resin, cresol-based epoxy resin, diphenol-based epoxy resin, xylene (xyloc)-based epoxy resin, polyfunctional epoxy resin, phenol varnish ring An oxyresin, a trisphenol methane type epoxy resin, and an alkyl modified trisphenol methane epoxy resin may be used singly or in combination.

According to another exemplary embodiment, a decane-modified epoxy resin, for example, a decane-modified epoxy resin containing an aryl group, can be used as the epoxy resin. When an epoxy resin having a mercaptoalkyl group modified by decane is used, the adhesion to an inorganic material of an inorganic material in a glass substrate or an organic electronic device can be maximized, and moisture barrier properties, durability, and durability can be improved. reliability. The use of a specific type of epoxy resin is not particularly limited herein. Various epoxy resins known in the related art can be used as long as they satisfy the aforementioned characteristics such as water vapor transmission rate (WVTR).

The adhesive layer comprises a moisture absorbent filler, such as a first adhesive layer comprising a moisture absorbent filler in addition to the curable resin. The "moisture absorbent filler" is generally used to include all kinds of components capable of absorbing or removing moisture or water flowing in from the outside by chemical reaction with moisture. Here, the moisture absorbent filler may be referred to as a reactive moisture absorbent.

The moisture absorbent filler chemically reacts with water, moisture or oxygen flowing into the adhesive layer to absorb moisture or water. The specific kind of the moisture absorbent filler which can be used according to the exemplified embodiments of the present invention is not particularly limited, and may, for example, include a metal powder such as alumina, metal oxide, organometallic oxide, metal salt or pentoxide. Phosphorus (P ₂ O ₅ )), which may be used singly or in combination.

Specific examples of the metal oxide usable herein may include lithium oxide (Li ₂ O), sodium oxide (Na ₂ O), barium oxide (BaO), calcium oxide (CaO) or magnesium oxide (MgO), examples of metal salts. Sulphates may be included, such as lithium sulfate (Li ₂ SO ₄ ), sodium sulfate (Na ₂ SO ₄ ), calcium sulfate (CaSO ₄ ), magnesium sulfate (MgSO ₄ ), cobalt sulfate (CoSO ₄ ), gallium sulfate (Ga _{2 )} (SO ₄ ) ₃ ), titanium sulphate (Ti(SO ₄ ) ₂ ) or nickel sulphate (NiSO ₄ ), metal halides such as calcium chloride (CaCl ₂ ), magnesium chloride (MgCl ₂ ), cesium chloride (SrCl _{2 )} ), cerium chloride (YCl ₃ ), copper chloride (CuCl ₂ ), cerium chloride (CsF), cerium chloride (TaF ₅ ), cerium chloride (NbF ₅ ), lithium chloride (LiBr), bromination Calcium (CaBr ₂ ), cesium bromide (CeBr ₃ ), selenium bromide (SeBr ₄ ), vanadium bromide (VBr ₃ ), magnesium bromide (MgBr ₂ ), barium iodide (BaI ₂ ) or magnesium iodide ( MgI ₂ ), or a metal chlorate such as barium perchlorate (Ba(ClO ₄ ) ₂ ) or magnesium perchlorate (Mg(ClO ₄ ) ₂ ), but the invention is not limited thereto.

According to an exemplary embodiment of the invention, the moisture absorbent filler (e.g., metal oxide) used herein can be suitably processed and then blended with the composition. For example, the adhesive layer can be a film having a total thickness of 30 microns or less, depending on the type of organic electronic device to which the adhesive film can be applied. In this case, a method of grinding the moisture absorbent filler is required. Here, the moisture absorbent filler can be ground by using a method such as a three-roll mill, a bead mill or a ball mill. When the adhesive film is used in a top emission type organic electronic device, the penetration of the adhesive layer itself is also an extremely important factor. Therefore, the size of the moisture absorbent filler must be reduced. In this respect, these applications require grinding.

The moisture absorbent filler content of the adhesive layer may be 5 to 50 parts by weight, or 10 to 30 parts by weight, relative to 100 parts by weight of the curable resin. When the moisture absorbent filler is controlled within this content range, the moisture barrier property can be maximized without damaging the organic electron diode.

Unless specifically stated in the document, the "weight ratio" unit refers to the weight ratio between the components.

The moisture absorbent filler can be uniformly dispersed in the adhesive layer of the adhesive film.

Although the adhesive layer already includes a moisture absorbent filler, the adhesive layer of the adhesive film according to an exemplary embodiment of the present invention includes a (non-absorbent) filler, for example, an inorganic filler, in addition to the moisture absorbent filler. This (non-absorbent) filler can inhibit moisture or water penetration by extending the path of moisture or water penetration into the encapsulated structure and by interaction with the matrix structure of the curable resin. Maximum resistance to moisture and water. At the same time, the durability (such as mechanical strength) of the adhesive film can be improved.

A particular type of (non-absorbent) filler that can be used in accordance with exemplary embodiments of the present invention is not particularly limited. For example, the (non-absorbent) fillers useful herein may include clay, talc, vermiculite, barium sulfate, aluminum hydroxide, calcium carbonate, magnesium carbonate, zeolite, zirconia, titania or montmorillonite, either alone or Combined use.

To enhance the bonding effectiveness between the filler and the curable resin, the surface treated product of the organic material may serve as a filler, or the coupling agent may be further added to the curable resin.

The filler layer may have a filler content of from 3 to 50 parts by weight, or from 5 to 30 parts by weight, per 100 parts by weight of the curable resin. When the filler content is controlled to more than 3 parts by weight, the cured product is provided to have excellent moisture or water barrier properties and mechanical properties. Further, when the filler content is controlled to be less than 50 parts by weight, the adhesive layer may be formed into a film form. When the adhesive layer is formed into a film, a cured product having adhesive properties can also be provided.

The adhesive composition may further comprise a curing agent capable of forming a matrix such as a crosslinked structure by reaction with a curable resin according to the kind of the curable resin, or an initiator capable of initiating a curing reaction of the resin (for example) , cationic photopolymerization initiator).

The specific kind of curing agent used herein is not particularly limited and may be appropriately selected depending on the kind of the curable resin or the functional group contained in the curable resin. For example, when an epoxy resin is used as the curable resin, a typical curing agent for an epoxy resin known in the related art can be used as a curing agent. More specifically, various types of amine-based compounds, imidazole-based compounds, phenol-based compounds, and phosphorus-based compounds The compound or the acid anhydride-based compound may be used singly or in combination, but the invention is not limited thereto.

The content of the curing agent contained in the adhesive composition can be selected depending on the components in the composition and the contents thereof. For example, the curing agent is used in an amount of from 1 to 20 parts by weight, or from 1 to 10 parts by weight, per 100 parts by weight of the curable resin. However, the curing agent content is only one exemplary embodiment. That is, the curing agent content may be changed depending on the kind and content of the curable resin or the functional group in the curable resin, or the matrix structure or crosslinking density to be obtained.

The kind of the initiator (for example, a cationic polymerization initiator) is also not particularly limited. For example, a known cationic polymerization initiator such as an aromatic diazonium salt, an aromatic aluminum iodate, an aromatic sulfonium salt or an iron-aromatic hydrocarbon complex can be used. Among them, an aromatic onium salt can be used, but the invention is not limited thereto.

In this case, the initiator content may be in the range of, for example, 0.01 to 10 parts by weight, or 0.1 to 3 parts by weight, relative to 100 parts by weight of the curable resin. When the content of the initiator is too low, the curing method cannot be sufficiently performed. On the other hand, when the content of the initiator is too high, the durability of the binder is lowered by the content of the ionic substance after the curing method, or the optical durability is lowered by the formation of the conjugate acid, which is a characteristic of the initiator. In addition, corrosion occurs depending on the alkali used. Therefore, the initiator content can be appropriately selected in consideration of this fact.

The adhesive composition may additionally include a binder resin. When the composition is formed into a film or sheet, the binder resin can be used to improve moldability. The binder resin also acts as a high temperature viscosity control agent to adjust the fluidity during the hot melt process.

The type of the binder resin is not particularly limited as long as it is combined with another component (such as curable resin) can be compatible. Specific examples of the binder resin may include, but are not limited to, a phenoxy resin, an acrylate resin, a polymerizable epoxy resin having a weight average molecular weight of 20,000, a superpolymerized epoxy resin, a rubber having a high polarity functional group, and Reactive rubbers of highly polar functional groups, which may be used singly or in combination.

When the binder resin is included in the binder composition, the content of the binder resin can be adjusted depending on the desired physical properties, but the invention is not particularly limited thereto. For example, the binder resin may be included in an amount of about 10 to 200 parts by weight, 20 to 150 parts by weight, or about 30 to 100 parts by weight relative to 100 parts by weight of the curable resin. When the binder resin content is controlled to 10 to 200 parts by weight, the binder resin can effectively maintain compatibility with the components in the resin composition, and can be used as a binder. When the binder content is too low, the resin may bleed out during the lamination process due to the low viscosity, or the high-pressure adhesive strength at room temperature may make it difficult to adjust the mold release force. On the other hand, when the binder content is too high, the lamination property is not good. Therefore, the viscosity of each layer is adjusted by adjusting the binder resin content, and thus the difference in viscosity between the layers is lowered to ensure optimum processability and physical properties.

Further, the adhesive composition may further include a filler to improve the durability of the cured product, or an additive such as a coupling agent, a plasticizer, a UV stabilizer, and an antioxidant to improve mechanical and adhesive strength without affecting the desired effect.

The method of forming the adhesive layer using the adhesive composition is not particularly limited. For example, the adhesive composition can be appropriately selected according to the fact that each of the adhesive layers includes a moisture absorbent filler, and the adhesive layer can be formed by a method of coating and drying the coating liquid including the adhesive composition. By forming each adhesive layer and stacking The formed adhesive layer, or a layer of the adhesive layer formed by coating and drying another adhesive composition on the formed adhesive layer.

The coating of the bonding composition used herein can be carried out on a suitably processed substrate, such as a release surface of a release substrate.

If necessary, the adhesive composition can be made into a coating liquid by selecting an appropriate component and dissolving or dispersing the component in a suitable solvent. In this procedure, the epoxy resin content included in the coating liquid can be appropriately controlled according to the desired moisture barrier property and the moldability of the film. Further, when the binder resin is included in the coating liquid, the binder resin content may be adjusted in consideration of the moldability and impact resistance of the film. In this procedure, when the solvent content of the coating liquid is too high, the drying time is increased, and thus the minimum amount of solvent should be used.

When the filler is included in the coating liquid, a ball mill, a bead mill, a three-roll mill or a high-speed mill may be used alone or in combination to improve the dispersibility. The material of the ball or bead includes glass, alumina or zirconium. For good particle dispersibility, the material of the sphere or bead may be zirconium.

The kind of solvent used to manufacture the coating liquid is not particularly limited. However, when the drying time of the solvent is too long or the solvent is dried at a high temperature, the workability or durability of the adhesive film is lowered. Therefore, a solvent having a volatilization temperature of 100 ° C or lower can be used. In consideration of the moldability of the film, a small amount of a solvent having a volatilization temperature higher than the volatilization temperature range may be mixed and used. Examples of the solvent may include, but are not limited to, methyl ethyl ketone (MEK), acetone, toluene, dimethylformamide (DMF), methyl cellosolve (MCS), tetrahydrofuran (THF), and N-A. Pyrrolidone (NMP), which may be used singly or in combination.

The method of applying the aforementioned coating liquid is not particularly limited. For example, you can be unlimited Known methods such as doctor blade coating, roller coating, spray coating, gravure coating, curtain coating, comma coating or nozzle coating are used.

The coated coating liquid can be dried to form an adhesive layer. In this procedure, the adhesive layer can be formed by heating the coated coating liquid to dryness or removing the solvent. In this case, the drying conditions are not particularly limited. For example, the drying can be carried out at a temperature of from 70 ° C to 150 ° C for from 1 minute to 10 minutes.

In the structure of the adhesive film, the adhesive layer is formed on a suitable base film or release film (hereinafter referred to as "first film"). FIG. 5 is a schematic view showing that the first and second adhesive layers 11 and 12 are formed on the base film or the release film 41.

The adhesive film may further include a base film or a release film (hereinafter referred to as a "second film") formed on the adhesive layer. Figure 6 is a schematic view of the first and second adhesive layers 11 and 12 formed between the two base films or release films 41 and 51.

As shown in FIGS. 5 and 6, the adhesive film may include an adhesive layer formed on the base film or the release film or an adhesive layer formed between the base film and the release film. However, the adhesive film shown in Figures 5 and 6 is only one exemplary embodiment. For example, the structure of the adhesive film includes only an adhesive layer which is in a solid or semi-solid state at room temperature and has no load-bearing substrate. If necessary, the adhesive layer may be formed on both surfaces of a base film or a release film to form a double-sided adhesive film.

The specific type of the first film is not particularly limited. For example, a typical polymer film known in the related art can be used as the first film. For example, the base film or release film which can be used herein may include polyethylene terephthalate film, polytetrafluoroethylene film, polyethylene film, polypropylene film, polybutene film, polybutadiene film, chlorine Ethylene copolymer film, polyurethane film, ethylene-vinyl acetate film, ethylene-propylene An olefin copolymer film, an ethylene-ethyl acrylate copolymer film, an ethylene-methyl acrylate copolymer film, or a polyimide film. Further, one or both surfaces of the base film or the release film may be subjected to a suitable release treatment. Examples of the release agent used for the release treatment of the base film may include an alkyd-based release agent, a hydrazine-based release agent, a fluorine-based release agent, and an unsaturated ester-based release agent. A release agent, a polyolefin-based release agent, or a wax-based release agent. Among them, an alkyd-based release agent, a hydrazine-based release agent, or a fluorine-based release agent can be used for heat resistance, but the present invention is not limited thereto.

The kind of the second film (hereinafter referred to as "film") is also not particularly limited. For example, the same type or different kind as the first film may be used as the second film as long as it is in the general class of the aforementioned first film. The second film can also be subjected to a suitable release treatment.

The thickness of the aforementioned base film or release film is not particularly limited and may be appropriately selected depending on the use. For example, the thickness of the first film can range from about 50 microns to 500 microns, or from about 100 microns to 200 microns. When the thickness of the base film or the release film is less than 50 μm, it is difficult to automate the process of the flat plate. On the other hand, when the thickness of the base film or the release film exceeds 500 μm, the economic efficiency is lowered.

The thickness of the second film may be set, for example, to the same extent as the first film. In consideration of workability, the second film may also be set to have a thickness less than that of the first film.

Yet another illustrative embodiment of the present invention is directed to an organic electronic device. The exemplary organic electronic device can include an organic electronic device packaged via the adhesive film. According to an exemplary embodiment, the second bond in the adhesive film The layer, that is, the adhesive layer not containing the moisture absorbent filler, may exist in a state in which the second adhesive layer is bonded to the entire surface of the organic electronic device. The first adhesive layer, that is, the adhesive layer containing the moisture absorbent filler, may also be present at a location where the first adhesive layer is not in contact with the organic electronic device.

According to an exemplary embodiment, an organic electronic device may include a substrate and an organic electronic device formed on the substrate. Here, the organic electronic device can be encapsulated by an adhesive film. The organic electronic device may further include a cover substrate formed thereon.

For example, the organic electronic device can be an organic light emitting diode.

The adhesive film can be used as a structural adhesive which fixes and carries the substrate and covers the substrate and has excellent moisture barrier properties and excellent optical properties, thereby providing an encapsulation layer.

The adhesive film also exhibits excellent penetration and thus can be effectively designed to be applied to the device in a top penetration or bottom penetration mode.

Furthermore, the use of an adhesive film makes it possible to reduce the amount of degassing and etching material (i.e., metal can or glass can) used, as compared to conventional methods. Therefore, the manufacturing method can be simplified and the manufacturing cost can be reduced. The adhesive film can be used regardless of whether the device is designed to be a top penetration or a bottom penetration mode, and the finally manufactured organic light-emitting display device can be imparted with excellent durability.

7 is an illustration of an illustrative embodiment of an organic electronic device.

To manufacture an organic electronic device, for example, using a vacuum evaporation or sputtering method, a transparent electrode is formed on a glass or polymer film 61 as a substrate, and an organic electronic device 63 (for example, including a hole transfer layer, a light-emitting layer, and an electron) The organic light emitting diode layer of the transfer layer is formed on the transparent electrode. It Thereafter, an electrode layer is formed on the formed organic electronic device 63. The adhesive film including the first adhesive layer 11 and the second adhesive layer 12 may be laminated on the organic electronic device 63 of the substrate 61 by the aforementioned method to form an encapsulation layer.

The method of forming the encapsulation layer is not particularly limited. For example, a method of manufacturing a second adhesive layer including the adhesive film on a substrate having an organic electronic device formed thereon so that the second adhesive layer can be bonded to the entire surface of the organic electronic device, and curing the adhesive film can be used. Encapsulation layer.

The application of the adhesive film to the organic electronic device can be carried out by a method of laminating, hot pressing, or vacuum pressing the adhesive film, but the present invention is not particularly limited thereto. The adhesive film can be applied to the organic electronic device at a temperature of 50 ° C to 100 ° C, and the curing of the adhesive film can be performed by heating the adhesive film at a temperature of 70 ° C to 110 ° C or irradiating the adhesive film with UV rays. Additionally, the method can further include contacting the adhesive film with an additional encapsulating material such as glass or metal.

For example, a cover substrate (for example, a glass or polymer film) 62 to which the adhesive layer has been previously transferred is laminated on the organic electronic device 63 formed on the substrate 61, and is heated and pressed on the organic electronic device 63. Thereafter, when the adhesive layer is transferred onto the cover substrate 62, for example, the aforementioned adhesive film may be used to peel off the base film or the release film formed on the film. Thereafter, the adhesive layer can be transferred while being heated using a vacuum press or a vacuum laminator. In this procedure, when the binder is a thermosetting binder, the curing reaction can be extremely performed, which results in a decrease in the sealing adhesive strength or adhesion of the encapsulating material. Therefore, the process temperature and process time should be controlled within the range of about 100 ° C and 5 minutes. It Thereafter, the cover substrate 62 to which the adhesive film has been transferred is heated and pressed against the organic electronic device. In this case, the transfer method can be carried out using a vacuum press or a vacuum laminator. In this procedure, the adhesive layer can be melted to exhibit pressure-sensitive adhesiveness.

Thereafter, the encapsulation layer can be formed by subjecting the adhesive film to an additional curing process. This curing method can be carried out, for example, in a heating tank or a UV tank. In the curing method, heating conditions or electromagnetic wave irradiation conditions can be appropriately selected in consideration of the stability of the organic electronic device and the curability of the resin.

However, the aforementioned method is only one way of manufacturing an organic electronic device. Therefore, the method order and method conditions can be arbitrarily changed. For example, the order of pressure and encapsulation can be changed. That is, the adhesive film can be transferred to the organic electronic device 63 formed on the substrate 61, and the cover substrate 62 can be pressed to the organic electronic device 63.

Hereinafter, examples which fall within the scope of the invention and comparative examples which are not within the scope of the invention will be described in detail. However, it is to be understood that the scope of the invention is not limited by the examples and the comparative examples.

Example 1 1. Manufacture of a solution for the first adhesive layer

A solution containing CaO (average particle size below 5 μm) as a moisture absorbent (solid content 20%) was produced. Thereafter, the solution was uniformly dispersed to distribute CaO. In another procedure, 100 g of epoxy resin (YD-128, KukDO Chemical Co., Ltd.) and 70 g of phenoxy resin (YP-70, Tohto Kasei Co., Ltd.) were subjected to methyl ethyl ketone. The diluted solution (solids content 70%) was homogenized thereafter. 250 ml of previously prepared CaO solution To this homogenized solution, 5 g of a curing agent, imidazole (Shikoku Chemicals Corp.), was added thereto. Thereafter, the resulting mixture was stirred at a high rotation rate for one hour to manufacture a solution for the first adhesive layer.

2. Manufacture of a solution for the second adhesive layer

100 g of an epoxy resin (YD-128, KukDo Chemical Co., Ltd.) and 90 g of a phenoxy resin (YP-70, Tohto Kasei Co., Ltd.) diluted with methyl ethyl ketone were obtained. (solid content 70%) and homogenized thereafter. 5 g of a curing agent, imidazole (Shikoku Chemicals Corp.) was added to the solution, and the resulting mixture was stirred at a high rotation rate for one hour to prepare a solution for the second adhesive layer.

3. Manufacturing of adhesive film

Using a spacer, the previously prepared solution for the first adhesive layer was applied to the release surface of the release PET film and dried in a drying oven at 130 ° C for 3 minutes to form a 50 μm thick first adhesive layer. .

Using a spacer coater, the previously prepared solution for the second adhesive layer was applied to the release surface of the release PET film and dried in a drying oven at 130 ° C for 3 minutes to form a 5 μm thick second bond. Floor.

The first adhesive layer and the second adhesive layer are laminated together to produce a multilayer adhesive film (thickness ratio T1/T2=10).

Example 2

A bonded film was produced in the same manner as in Example 1 (thickness ratio T1/T2 = 4), but the first adhesive layer is made to have a thickness of 40 μm and the second adhesive layer is made to have a thickness of 10 μm.

Example 3

An adhesive film (thickness ratio T1/T2 = 2) was produced in the same manner as in Example 1, except that the first adhesive layer was formed to have a thickness of 30 μm and the second adhesive layer was formed to have a thickness of 15 μm.

Example 4

An adhesive film (thickness ratio T1/T2 = 1) was produced in the same manner as in Example 1, except that the first adhesive layer was made to have a thickness of 15 μm and the second adhesive layer was made to have a thickness of 15 μm.

Comparative example 1

An adhesive film (thickness ratio T1/T2 = 0.1) was produced in the same manner as in Example 1, except that the first adhesive layer was formed to have a thickness of 5 μm and the second adhesive layer was formed to have a thickness of 50 μm.

Comparative example 2

An adhesive film (thickness ratio T1/T2 = 20) was produced in the same manner as in Example 1, except that the first adhesive layer was formed to have a thickness of 60 μm and the second adhesive layer was formed to have a thickness of 3 μm.

Comparative example 3

An adhesive film (thickness ratio T1/T2 = 10) was produced in the same manner as in Example 1, except that the first adhesive layer was made to have a thickness of 20 μm and the second adhesive layer was made to have a thickness of 2 μm.

Comparative example 4

An adhesive film (thickness ratio T1/T2 = 5) was produced in the same manner as in Example 1, except that the first adhesive layer was made to have a thickness of 100 μm and the second adhesive layer was made to have a thickness of 20 μm.

Comparative Example 5

The adhesive film was produced in the same manner as in Example 1, except that only the first adhesive layer produced in Example 1 was formed into an adhesive film having a thickness of 45 μm.

Comparative Example 6

The adhesive film was produced in the same manner as in Example 1, except that only the second adhesive layer produced in Example 1 was formed into an adhesive film having a thickness of 45 μm.

Comparative Example 7

An adhesive film was produced in the same manner as in Example 1, except that 20 g of a phenoxy resin was used in the solution for producing the second adhesive layer in Example 1.

Experimental Example 1: Confirmation of moisture barrier

The moisture barrier properties of the adhesive films produced in Examples 1 to 4 and Comparative Examples 1 to 7 were examined by a calcium test. More specifically, calcium (Ca) is deposited in a size of Of the nine points on the lower glass panel of 100 mm x 100 mm, each point has a size of 5 mm x 5 mm and a thickness of 100 nm. Further, each of the adhesive films produced in Examples 1 to 4 and Comparative Examples 1 to 7 was heated at 80 ° C for 1 minute and laminated on an upper glass panel having a size of 17 mm × 17 mm, as shown in FIG. Thereafter, the adhesive film laminated on the upper glass panel was heated in the same manner as described above and laminated on the lower glass panel under vacuum conditions (less than 100 mTorr). Thereafter, the laminated upper/lower glass panels were cured in a high temperature drying oven at 100 ° C for 3 hours, and the resulting sample was maintained at a temperature of 85 ° C and 85% R.H. for 1,000 hours in a constant temperature/humidity chamber. Thereafter, the time required to accommodate the 6 mm thick glass cover is regarded as the time during which the calcium becomes transparent due to the penetration of moisture. The results are shown in Table 1.

Experimental Example 2: Confirmation of damage to organic electronic devices

The adhesive film produced in Examples 1 to 4 and Comparative Examples 1 to 7 was used to fabricate a 3 inch long organic light-emitting panel maintained at a temperature of 85 ° C and 85% R.H. for 1,000 hours in a constant temperature/humidity chamber. Thereafter, the damage of the organic device was examined using an optical microscope. The results are shown in Table 2 below (excluding damage caused by moisture permeation).

The 3-inch long organic light-emitting panel manufactured using the adhesive film produced in Comparative Example 3 was also maintained at a temperature of 85 ° C and 85% R.H. for 1,000 hours in a constant temperature/humidity chamber. The optical microscopic image obtained at this time is shown in Fig. 8. Referring to Fig. 8, it can be seen that since the thickness of the second adhesive layer located below is extremely small, when the device is subjected to the moisture absorbent filler contained in the first adhesive layer or the particles flowing in during the lamination process, Black spots may form due to physical damage to the device and chemical damage to the device due to the physical damage of the device.

Further, an optical microscopic image obtained by using the adhesive film simulation lamination method produced in Comparative Example 4 is shown in Fig. 9. Referring to Fig. 9, it can be seen that since the total thickness of the adhesive layer does not fall within the predetermined range, the lamination property at the time of manufacturing the panel is impaired. That is, it can be seen that the adhesive bleeds during the lamination process and affects the workability.

Experimental Example 3: Determination of viscosity difference between layers

The viscosity of the first adhesive layer and the second adhesive layer of the adhesive film obtained in Example 1 and Comparative Example 7 was measured using ARES. The viscosity at 80 ° C and the difference in viscosity between the first and second adhesive layers are shown in Table 3 below.

As shown in Table 3, it can be seen that the adhesive films manufactured in Examples 1 to 4 according to the exemplary embodiments of the present invention can be effectively used to encapsulate organic electronic devices to prevent moisture from penetrating into the organic electronic device, but when the thickness is When the ratio is unsatisfied, the absolute thickness is too small, or the total thickness is too large, it cannot be effectively used to package the organic electronic device.

The adhesive film according to an exemplary embodiment of the present invention may, for example, be used to package an organic electronic device.

1‧‧‧Adhesive film

2‧‧‧Adhesive film

3‧‧‧Adhesive film

4‧‧‧Adhesive film

5‧‧‧Adhesive film

6‧‧‧Adhesive film

11‧‧‧First adhesive layer

12‧‧‧Second adhesive layer

T1‧‧‧ thickness of the first adhesive layer

T2‧‧‧ thickness of the second adhesive layer

21‧‧‧ third adhesive layer

31‧‧‧ third adhesive layer

32‧‧‧4nd adhesive layer

41‧‧‧base film or release film

51‧‧‧base film or release film

61‧‧‧Substrate

62‧‧‧ Covering substrate

63‧‧‧Organic electronic devices

1 to 3 are illustrations of an exemplary adhesive film.

Figure 4 is a conceptual diagram of a calcium test for evaluating the moisture barrier properties of the adhesive film.

Figures 5 and 6 are illustrations of another exemplary adhesive film.

Figure 7 is a diagram illustrating an exemplary organic electronic device.

Fig. 8 is an optical microscopy obtained by using an organic light-emitting panel prepared by using the adhesive film produced in Comparative Example 3, maintained at a temperature of 85 ° C and a relative humidity (RH) of 85% for 1,000 hours in a constant temperature/humidity chamber. image.

Fig. 9 is an optical microscopic image obtained by using the adhesive film produced in Comparative Example 4 to simulate a lamination method.

1‧‧‧Adhesive film

11‧‧‧First adhesive layer

12‧‧‧Second adhesive layer

T1‧‧‧ thickness of the first adhesive layer

T2‧‧‧ thickness of the second adhesive layer

Claims (27)

An adhesive film for packaging an organic electronic device, comprising: a first adhesive layer comprising a moisture absorbent filler; and a second adhesive layer not comprising a moisture absorbent filler, wherein the second adhesive layer has a thickness T2 of the first The ratio T1 to T2 of the thickness T1 of the adhesive layer is in the range of 1.0 to 10. The adhesive film of claim 1, wherein the first adhesive layer has a thickness T1 of from 5 micrometers to 100 micrometers. The adhesive film of claim 1, wherein the second adhesive layer has a thickness T2 of from 3 micrometers to 20 micrometers. The adhesive film of claim 1, wherein the adhesive film further comprises one or more adhesive layers comprising a moisture absorbent filler or one or more adhesive layers not comprising a moisture absorbent filler, wherein the adhesive layer is not included The ratio T3/T4 of the total thickness T3 of the adhesive layer of the gas absorbent filler to the total thickness T4 of the adhesive layer containing the moisture absorbent filler is in the range of 1 to 10. The adhesive film of claim 4, wherein the adhesive layer not containing the moisture absorbent filler is disposed on the lowermost portion of the multilayer adhesive layer. The adhesive film of claim 4, wherein the adhesive layer not containing the moisture absorbent filler is disposed on the bottommost layer and the uppermost portion of the multilayer adhesive layer, respectively. For example, in the adhesive film of claim 1, wherein the adhesive layer has a room temperature viscosity of 10 ⁶ Pa. s or higher. For example, the adhesive film of the first application patent scope, wherein the first adhesive When the combined layer and the second adhesive layer are in an uncured state, the difference in viscosity between the first adhesive layer and the second adhesive layer is 100 Pa at a temperature of 30 ° C to 130 ° C. s or lower. The adhesive film of claim 1, wherein the total thickness of the adhesive layer is 100 μm or less. The adhesive film of claim 1, wherein the adhesive layer comprises a curable resin, and the curable resin is a thermosetting resin, a photocurable resin or a double curable resin. The adhesive film of claim 10, wherein the curable resin comprises an epoxy group selected from the group consisting of a glycidyl group, a hydroxyl group, an isocyanate group, a carboxyl group, a decylamino group, an epoxy group, a cyclic ether group, a sulfur group, and a At least one curable functional group of an acetal group and a lactone group. The adhesive film of claim 1, wherein the moisture absorbent filler is a reactive moisture absorbent selected from the group consisting of alumina, metal oxides, metal salts, and phosphorus pentoxide. The adhesive film of claim 1, wherein the moisture absorbent filler is selected from the group consisting of P ₂ O ₅ , Li ₂ O, Na ₂ O, BaO, CaO, MgO, Li ₂ SO ₄ , Na ₂ SO ₄ , CaSO ₄ , MgSO ₄ , CoSO ₄ , Ga ₂ (SO ₄ ) ₃ , Ti(SO ₄ ) ₂ , NiSO ₄ , CaCl ₂ , MgCl ₂ , SrCl ₂ , YCl ₃ , CuCl ₂ , CsF, TaF ₅ , NbF ₅ , LiBr, CaBr ₂ , CeBr ₃ , SeBr ₄ , VBr ₃ , MgBr ₂ , BaI ₂ , MgI ₂ , Ba(ClO ₄ ) ₂ and Mg(ClO ₄ ) ₂ . The adhesive film of claim 1, wherein the first adhesive layer has a moisture absorbent filler content of from 5 to 50 parts by weight based on 100 parts by weight of the curable resin. The adhesive film of claim 1, wherein the adhesive layer further comprises a filler. The adhesive film of claim 15, wherein the filler is selected from the group consisting of clay, talc, cerium oxide, barium sulfate, aluminum hydroxide, calcium carbonate, magnesium carbonate, zeolite, zirconia, oxidation. Titanium and montmorillonite. The adhesive film of claim 15, wherein the adhesive layer has a filler content of from 3 to 50 parts by weight based on 100 parts by weight of the curable resin. The adhesive film of claim 1, wherein the adhesive layer further comprises a curing agent. The adhesive film of claim 18, wherein the curing agent is selected from the group consisting of an amine based compound, an imidazole based compound, a phenol based compound, a phosphorus based compound, and an anhydride based Compound. The adhesive film of claim 18, wherein the adhesive layer has a curing agent content of from 1 to 10 parts by weight based on 100 parts by weight of the curable resin. The adhesive film of claim 1, wherein the adhesive layer further comprises a binder resin. An organic electronic device comprising: a substrate; an organic electron diode formed on the substrate; and the adhesive film according to any one of claims 1 to 21 An organic electronic diode is mounted, wherein the second adhesive layer of the adhesive film that does not contain the moisture absorbent filler is bonded to the entire surface of the organic electronic diode. An organic electronic device according to claim 21, wherein the organic electronic diode system organic light-emitting diode. A method of encapsulating an organic electronic device, comprising: applying a bonding film according to any one of claims 1 to 21 to a substrate on which an existing organic electronic diode is formed, so that the second bonding of the adhesive film The layer is bonded to the entire surface of the organic electron diode; and the adhesive film is cured. The method of claim 24, wherein the applying the adhesive film to the organic electron dipole system is carried out by using the adhesive film in a method such as hot rolling lamination, hot pressing or vacuum pressing. The method of claim 24, wherein the applying the adhesive film to the organic electronic dipole system is carried out at a temperature of 50 to 100 °C. The method of claim 24, wherein the curing of the adhesive film is carried out by heating the adhesive film at a temperature of 70 to 110 ° C or irradiating the adhesive film with UV rays.