TW201336109A - Fluorescent plate, light emitting module and manufacturing method of fluorescent plate - Google Patents

Abstract

A fluorescent plate includes a substrate and a fluorescent material. The substrate has a first surface, an opposite second surface and a plurality of void structures, wherein the void structures is arranged on at least one of the first surface and the second surface, and includes a gradation cavity, gradation notch, pillar cavity, pillar notch, a groove or any combination of the above. The fluorescent material is filled in the void structures of the substrate. The distribution of the fluorescent material on the above-mentioned fluorescent plate can be effectively controlled by controlling the shape and distribution of the void structures. A light emitting module including the fluorescent plate and a manufacturing method of the fluorescent plate are also disclosed.

Description

Fluorescent panel, light emitting module, and method of manufacturing the same

The invention relates to a light-emitting module, in particular to a fluorescent plate for converting an emission wavelength, a light-emitting module comprising the same, and a method for manufacturing the fluorescent plate.

A conventional Light Emitting Diode (LED) is a phosphor material formed on a light emitting diode wafer. The fluorescent material can be excited by the light emitted by the LED chip to emit light of other wavelength bands, and the light emitted by the fluorescent material and the light emitted by the LED chip can be mixed with each other to generate white light. For example, a fluorescent material that can be excited to emit yellow light is formed on the blue light emitting diode chip, and the blue light emitted by the mixed blue light emitting diode chip and the yellow light excited by the fluorescent material can generate a white light source.

However, the white light emitting diode of the above structure has the following disadvantages: 1) the amount of the phosphor powder of each of the light emitting diodes is not easily controlled, resulting in poor uniformity, so that each of the white light emitting diodes is mixed. There is a slight difference in the color rendering of white light. In the application, it is necessary to select suitable white light emitting diodes one by one; 2) the fluorescent material is formed on the light emitting diode wafer, so the heat generated by the light emitting diode is not easily dissipated, resulting in The temperature rise of the light-emitting diode causes a decrease in luminous efficiency, and the fluorescent material is subjected to heat for a long period of time, and is easily deteriorated to affect the color rendering property of white light.

In summary, how to effectively control the distribution of the fluorescent material and reduce the degree of deterioration of the fluorescent material due to the heat generated by the light-emitting diode is an extremely urgent goal.

The invention provides a method for manufacturing a fluorescent plate, a light emitting module and a fluorescent plate, wherein a plurality of pore structures are formed on the substrate, and a fluorescent material is filled in the pore structure of the substrate to form a fluorescent plate. Thus, the distribution of the phosphor material can be effectively controlled by controlling the shape and distribution of the pore structure. Preferably, maintaining the phosphor plate and the LED wafer at an appropriate spacing reduces the degree of degradation of the phosphor material due to heat generated by the LED.

A fluorescent plate according to an embodiment of the invention comprises a substrate and a fluorescent material. The substrate has a first surface, an opposite second surface, and a plurality of aperture structures, wherein the aperture structure is disposed on at least one of the first surface and the second surface, and includes a gradient recess, a gradient groove, and a pillar a recess, a columnar groove, a groove or a combination of the above. The fluorescent material is filled in the pore structure.

A light emitting module according to another embodiment of the present invention includes a fluorescent plate and a light emitting diode module. The fluorescent plate comprises a substrate and a fluorescent material. The substrate has a first surface, an opposite second surface, and a plurality of aperture structures, wherein the aperture structure is disposed on at least one of the first surface and the second surface, and includes a gradient recess, a gradient groove, and a pillar a recess, a columnar groove, a groove or a combination of the above. The fluorescent material is filled in the pore structure. The light emitting diode module is disposed on one of the light incident sides of the fluorescent plate. The LED module is configured to generate a first light comprising a first wavelength band to excite the fluorescent material to generate a second light comprising a second wavelength band.

A method of fabricating a fluorescent plate according to still another embodiment of the present invention includes preparing a substrate having a first surface, an opposite second surface, and a plurality of pore structures, wherein the pore structure is disposed on the first surface and the second surface at least One; and filling a fluorescent material in the pore structure.

The purpose, technical contents, features, and effects achieved by the present invention will become more apparent from the detailed description of the appended claims. It is to be noted that the size and proportions of the elements in the drawings are merely illustrative of the embodiments of the invention and are not intended to limit the invention.

Referring to FIG. 1 and FIG. 2, a light-emitting module according to an embodiment of the present invention is illustrated, wherein FIG. 2 is a partially enlarged structure of the circular area A in FIG. The light emitting module of one embodiment of the present invention comprises a fluorescent plate 10 and a light emitting diode module 20. Referring to FIG. 3 together, the fluorescent plate 10 includes a substrate 11 and a fluorescent material 12. The substrate 11 has a first surface 111, an opposite second surface 112, and a plurality of aperture structures 113. The pore structure 113 may be disposed on the first surface 111, the second surface 112 of the substrate 11, or both. The substrate 11 may be planar, curved, or wavy, etc., depending on actual needs. In one embodiment, the material of the substrate 11 may be polymethylmethacrylate (PMMA), polycarbonate (Polycarbonate, PC) or polyethylene terephthalate (PET). The fluorescent material 12 is filled in the pore structure 113 of the substrate 11. In one embodiment, the phosphor material 12 comprises Yttrium Aluminium Garnet phosphor powder, strontium silicate (SmOn ^4- ) phosphor powder, and borate (BxOy ^3- ) phosphor powder. one. Alternatively, the fluorescent material 12 comprises an aluminum garnet (YAG:Ce ³⁺ ) phosphor powder which is activated by a lanthanum element and contains Y and Al, and a pomegranate system which is activated by lanthanum elements (YAG: EU ^2+/3+ Fluorescent powder and at least one of pomegranate (YAG: Tb ³⁺ ) phosphors activated by Terbium elements.

The light emitting diode module 20 is disposed on the light incident side of the fluorescent plate 10. For example, taking the embodiment shown in FIG. 3 as an example, the first surface 111 side of the substrate 11 is the light incident side of the fluorescent plate 10. The LED module 20 is configured to generate a first light, such as blue light, comprising a first wavelength band to excite the fluorescent material 12 to generate a second light, such as yellow light, comprising a second wavelength band. Preferably, the center wavelength of the second band is greater than the center wavelength of the first band to obtain better light conversion efficiency. The LED module 20 includes one or more LED chips 21 disposed on the circuit board 22 and electrically connected to the circuit board 22. The LED chip 21 can obtain a power or control signal required for operation via the circuit board 22. The LED module 20 can be fabricated by conventional processes. More specifically, the LED array 21 of the LED module 20 can be in a packaged or unpackaged state.

In one embodiment, the light-emitting module can include a spacer 30 disposed between the fluorescent plate 10 and the LED module 20 to provide a gap between the fluorescent plate 10 and the LED module 20 . . The gap between the fluorescent plate 10 and the light-emitting diode module 20 can reduce the deterioration of the fluorescent material 12 by the thermal energy generated by the light-emitting diode wafer. Further, according to this configuration, the light emitting diode wafer can be in a state of being unpackaged or simply packaged. In this way, the thermal energy generated by the LED wafer can be directly transmitted to the air between the fluorescent panel 10 and the LED module 20 without the barrier of the encapsulant. In one embodiment, the spacer 30 can be a highly thermally conductive material, so that the thermal energy of the air between the fluorescent panel 10 and the LED module 20 can be conducted to the outside of the illumination module for heat dissipation.

According to the above configuration, the parameters such as the shape or distribution of the pore structure 113 of the substrate 11 can be controlled to effectively control the distribution of the fluorescent material 12 on the substrate 11. For example, as shown in FIG. 1, the pore structures 113 on the substrate 11 may be arranged in an array to uniformly distribute the phosphor material 12 on the substrate 11. However, it is not limited thereto, and the pore structures 113 on the substrate 11 may also be arranged irregularly to meet special design requirements. In addition, by controlling the depth of the pore structure 113, the thickness of the fluorescent material 12 can be controlled to adjust the ratio of the mixed light and the color rendering of the white light.

In an embodiment, the pore structure 113 can be a graded cavity or a graded groove, that is, the opening of the pore structure 113 is larger or smaller than the inner diameter thereof, such as a conical shape (as shown in FIG. 2) and a pyramid shape (as shown in the figure). 5), flared (as shown in Figure 6). The pore structure 113 can also be a columnar cavity or a columnar groove, that is, the opening of the pore structure 113 is approximately equal to its inner diameter, such as a cylindrical, multi-faceted angular column. Further, the pore structure 113 may be a groove such as a V-shaped groove (as shown in FIG. 7), a U-shaped groove, a rectangular groove, a trapezoidal groove, or the like. It should be noted that a combination of the above various pore structures 113 does not depart from the spirit of the present invention.

In one embodiment, the aperture structure 113 can penetrate the substrate 11 and a through hole 114 is formed on the second surface 112 of the substrate 11, as shown in FIGS. 2, 3, and 5. According to this configuration, when the phosphor material 12 is filled to the pore structure 113, the air in the pore structure 113 can be discharged from the perforations 114 to avoid the formation of bubbles in the pore structure 113, resulting in a decrease in the uniformity of the phosphor material 12. In general, the above-described gradation pits and columnar cavities mean that the pore structure 113 penetrates the substrate 11. The tapered groove and the columnar groove mean that the pore structure 113 does not penetrate the substrate 11. In an embodiment, the groove-like pore structure may not penetrate the substrate 11, and the perforations may be provided at an appropriate interval to facilitate air discharge.

In one embodiment, the plurality of pore structures 113 can be divided into a plurality of regions, and the pore structures 113 in each region can be filled with the same or different phosphor materials 12. For example, the position of the pore structure 113 can be precisely controlled such that the pore structure 113 in the same region corresponds to the light-emitting range of one light-emitting diode wafer, and different fluorescent materials 12 are filled in different regions. According to this structure, the light emitted by the same prescribed light-emitting diode wafer is irradiated on different fluorescent materials 12 to generate a color array of light of different wavelength bands, for example, a color array of red light R, green light G, and blue light B. As shown in Figure 4. Since the same prescribed light-emitting diode wafer is used, the degree of deterioration of the wafer is relatively uniform, and the attenuation of each color is relatively uniform. This can reduce the deterioration of the light-emitting diode of a single color and cause poor color rendering.

Referring to FIG. 8 , in an embodiment, the phosphor plate 10 can include a protective layer 115 , which is a light transmissive material. The protective layer 115 is disposed on at least one of the first surface 111 and the second surface 112 of the substrate 11 to cover the aperture structure 113. The protective layer 115 may enclose the pore structure 113 to prevent the fluorescent material 12 from being exposed to moisture to deteriorate. Alternatively, the thickness of the protective layer 115 can be used to spacing the phosphor material 12 from the light emitting diode wafer by an appropriate distance to reduce the thermal energy of the phosphor material 12 from being generated by the light emitting diode wafer.

The bevel or curved surface in the pore structure 113 has the effect of diffusing light, so that the light is more uniform, and a light source can be provided. In order to improve the uniformity of light emission, a diffusion structure 116 may be disposed on the light-emitting surface of the fluorescent plate 10, as shown in FIG. The light exit surface of the phosphor plate 10 may be a first surface 111 or a second surface 112 opposite the aperture structure 113. In one embodiment, the light-emitting module of the present invention can be applied to a direct-type backlight of a liquid crystal display device (as shown in FIG. 1) or an edge-lit backlight, as shown in FIG.

Referring to FIG. 10 , in an embodiment, the light-emitting module of the present invention comprises a light guide plate 40 having a light-emitting surface 41 , an opposite bottom surface 42 , and a light-incident surface 43 connected to the light-emitting surface 41 and the bottom surface 42 . The light guide plate 40 is disposed with its light incident surface 43 toward the light exit side of one of the fluorescent plates 10 to serve as a side light type backlight module. In one embodiment, a reflective layer (not shown) may be disposed on the bottom surface 42 side of the light guide plate 40 to reflect light to the light exit surface 41 of the light guide plate 40 to increase luminous efficiency. In an embodiment, the light-emitting surface 41 of the light guide plate 40 may be provided with a diffusion layer, such as a diffusion structure 44 or a diffusion film, to make the light output more uniform.

Referring to FIG. 11, in an embodiment, the two fluorescent plates 10a, 10b can be implemented together. In this way, a combination of different pore structures can be designed to precisely control the distribution of the fluorescent material. For example, the aperture structure of the fluorescent plate 10a is a V-shaped groove, and the aperture structure of the fluorescent plate 10b is conical, thereby making the light mixing or light-emitting more uniform. It should be noted that in the embodiment shown in Fig. 11, the phosphor material is a pore structure filled in the phosphor plates 10a and 10b. However, the present invention is not limited thereto. In one embodiment, the aperture microstructure of one of the substrates may be filled with a fluorescent material for use as a fluorescent plate, that is, to convert an emission wavelength. The microstructure of the other substrate is not filled with the fluorescent material, but only serves as a diffusion plate to make the light uniform.

In an embodiment, the light emitting module of the present invention can also be applied to general consumer lamps. Referring to FIG. 12, the fluorescent plate 10 can be bent into a curved arc shape, and the light emitting diode module 20 is disposed in the arc type as a lamp similar to a tubular lamp. It can be understood that the rectangular groove having the same opening and the inner diameter is bent so that the opening is slightly smaller than the inner diameter of the groove, so that the fluorescent material can be effectively fixed and can be used as a structure of a diffusion light source. It can be understood that when applied to a tubular tubular lamp, light is emitted outward from the outer surface of the fluorescent plate 10, and the light exiting direction is indicated by an arrow L1. However, the light-emitting diode module 20 may be provided with a reflective layer (not shown) on the outer surface of the fluorescent panel 10 when other luminaire designs or applications (such as the side light source of the backlight module). The light will first excite the fluorescent material to emit light, and after being reflected by the reflective layer, the fluorescent material is again excited to emit light as a reflection source, and the light exiting direction is indicated by an arrow L2. . Referring to FIG. 13, the light emitting module of the present invention can also be applied to a bulb. For example, the fluorescent plate 10 and the LED module 20 of the light-emitting module of the present invention are placed in the accommodating space formed by the lamp holder 50 and the ball-shaped lamp cover 60 to form a spherical bulb.

Referring to FIG. 14, a method for manufacturing a fluorescent plate according to an embodiment of the present invention includes preparing a substrate having a pore structure (S10) and filling a phosphor material in a pore structure of the substrate (S20). The detailed structure of the substrate has been described above, and will not be described herein. The pore structure of the substrate can be formed by a semiconductor process (eg, exposure development, etching, etc.), physical cutting (eg, diamond cutting), or embossing (eg, roller, die stamping). The fluorescent material can be filled in the pore structure of the substrate by capillary attraction, capillary adsorption, vacuum suction, vacuum filling, evaporation, pressure filling or coating. Preferably, the method for fabricating the phosphor plate of the present invention selectively comprises forming a protective layer of a light transmissive material on the surface of the substrate to cover the pore structure (S30). In addition, the method for fabricating the phosphor plate of the present invention optionally includes forming a reflective layer on the first surface or the second surface opposite to the aperture structure (S40) to serve as a reflective fluorescent plate having an exiting direction as shown in FIG. No. L2 is shown.

In summary, the fluorescent plate and the light-emitting module of the present invention form a plurality of pore structures on the substrate, and fill the pore structure of the substrate with the fluorescent material to form a fluorescent plate. Therefore, by controlling the shape and distribution of the pore structure, the light angle and the uniformity of distribution of the fluorescent material can be effectively controlled. In addition, maintaining a proper spacing between the phosphor plate and the LED chip can reduce the degree of degradation of the phosphor material due to heat generated by the LED, and the heat dissipation of the chip is better to provide a larger power current. Increase luminous efficiency.

The embodiments described above are only intended to illustrate the technical idea and the features of the present invention, and the purpose of the present invention is to enable those skilled in the art to understand the contents of the present invention and to implement the present invention. That is, the equivalent variations or modifications made by the spirit of the present invention should still be included in the scope of the present invention.

10. . . Fluorescent plate

11. . . Substrate

111. . . First surface

112. . . Second surface

113. . . Pore Structure

114. . . perforation

115. . . The protective layer

116. . . Diffusion structure

12. . . Fluorescent material

20. . . Light-emitting diode module

twenty one. . . Light-emitting diode chip

twenty two. . . Circuit board

30. . . Spacer

40. . . Light guide

41. . . Glossy surface

42. . . Bottom

43. . . Glossy surface

44. . . Diffusion structure

50. . . Lamp holder

60. . . Ball shade

S10~S40. . . step

1 is a perspective view showing a light emitting module according to a first embodiment of the present invention.

Figure 2 is a perspective view showing a partial enlarged view of the embodiment shown in Figure 1.

3 is a cross-sectional view showing a light emitting module according to a second embodiment of the present invention.

Figure 4 is a top plan view showing a phosphor plate of an embodiment of the present invention.

Figure 5 is a perspective view showing a partial enlarged view of a light-emitting module according to a third embodiment of the present invention.

Figure 6 is a perspective view showing a partial enlarged view of a light-emitting module according to a fourth embodiment of the present invention.

Figure 7 is a perspective view showing a partial enlarged view of a light-emitting module according to a fifth embodiment of the present invention.

Figure 8 is a perspective view showing a partial enlarged view of a light-emitting module according to a sixth embodiment of the present invention.

Figure 9 is a perspective view showing a partial enlarged view of a light-emitting module according to a seventh embodiment of the present invention.

Figure 10 is a perspective view showing a partial enlarged view of a light-emitting module according to an eighth embodiment of the present invention.

Figure 11 is a perspective view showing a partial enlarged view of a light-emitting module according to a ninth embodiment of the present invention.

Figure 12 is a perspective view showing a partial enlarged view of a light-emitting module according to a tenth embodiment of the present invention.

Figure 13 is a perspective view showing a partially enlarged view of a light-emitting module according to an eleventh embodiment of the present invention.

Figure 14 is a flow chart showing a method of manufacturing a phosphor plate according to an embodiment of the present invention.

10. . . Fluorescent plate

11. . . Substrate

111. . . First surface

112. . . Second surface

113. . . Pore Structure

114. . . perforation

12. . . Fluorescent material

20. . . Light-emitting diode module

twenty one. . . Light-emitting diode chip

twenty two. . . Circuit board

30. . . Spacer

Claims (31)

A fluorescent plate comprising: a substrate having a first surface, an opposite second surface, and a plurality of pore structures disposed on at least one of the first surface and the second surface, and the aperture The structure includes a graded recess, a graded recess, a columnar recess, a columnar groove, a groove or a combination thereof; and a phosphor material that fills the pore structure. The fluorescent plate of claim 1, wherein the aperture structure comprises a conical shape, a pyramid shape, a horn shape, a cylindrical shape, a corner column shape, a V-shaped groove, a U-shaped groove, a rectangular groove, and a Trapezoidal groove or a combination of the above. The fluorescent sheet of claim 1, wherein the pore structure extends through the substrate. The phosphor plate of claim 1, wherein the plurality of pore structures are divided into a plurality of regions, and the pore structure in each of the regions is filled with the same or different phosphor materials. The fluorescent sheet of claim 1, wherein the pore structure is arranged in a regular or irregular manner. The fluorescent plate of claim 1, wherein the substrate is planar, curved or wavy. The fluorescent sheet of claim 1, wherein the substrate comprises polymethyl methacrylate (PMMA), polycarbonate (PC) or polyethylene terephthalate (PET). The fluorescent plate according to claim 1, wherein the fluorescent material comprises Yttrium Aluminium Garnet fluorescent powder, strontium silicate (SmOn ^4- ) fluorescent powder, and borate (BxOy ^3- ) At least one of the phosphors. The fluorescent plate according to claim 1, wherein the fluorescent material comprises an aluminum garnet (YAG:Ce ³⁺ ) fluorescent powder which is activated by a lanthanum element and contains Y and Al, and a garnet which is activated by a lanthanum element. (YAG: EU ^2+/3+ ) Fluorescent powder and at least one of the pomegranate (YAG: Tb ³⁺ ) phosphors activated by the Terbium element. The luminescent panel of claim 1, further comprising: a protective layer, which is a light transmissive material, and is disposed on at least one of the first surface and the second surface to cover the pore structure. The fluorescent plate of claim 1, further comprising: a diffusion structure disposed on the first surface or the second surface opposite to the aperture structure. The fluorescent plate of claim 1, further comprising: a reflective layer disposed on the first surface or the second surface opposite to the aperture structure. A light emitting module includes: a fluorescent plate, comprising: a substrate having a first surface, an opposite second surface, and a plurality of aperture structures disposed on the first surface and the second surface At least one of the pore structures, comprising a graded recess, a graded recess, a columnar recess, a columnar groove, a groove or a combination thereof; and a phosphor material filled in the And a light emitting diode module disposed on a light incident side of the fluorescent plate, wherein the light emitting diode module is configured to generate a first light including a first wavelength band to excite the firefly The light material produces a second light comprising one of the second wavelength bands. The lighting module of claim 13, wherein a center wavelength of the second wavelength band is greater than a center wavelength of the first wavelength band. The illuminating module of claim 13, wherein the aperture structure comprises a conical shape, a pyramid shape, a horn shape, a cylindrical shape, a corner column shape, a V-shaped groove, a U-shaped groove, and a rectangular groove. A trapezoidal groove or a combination of the above. The lighting module of claim 13, wherein the aperture structure extends through the substrate. The illuminating module of claim 13, wherein the plurality of pore structures are divided into a plurality of regions, and the pore structure in each of the regions is filled with the same or different phosphor materials. The illuminating module of claim 13, wherein the illuminating plate further comprises: a protective layer which is a light transmissive material and is disposed on at least one of the first surface and the second surface to cover the aperture structure. The illuminating module of claim 13, wherein the illuminating plate further comprises: a diffusing structure disposed on the first surface or the second surface opposite to the aperture structure. The lighting module of claim 13, wherein the fluorescent plate further comprises: a reflective layer disposed on the first surface or the second surface opposite to the aperture structure. The light-emitting module of claim 13, further comprising: a light guide plate having a light-emitting surface, an opposite bottom surface, and a light-emitting surface connecting the light-emitting surface and the bottom surface, wherein the light-guiding plate receives the light The face is disposed toward the light exit side of one of the phosphor plates. The illuminating module of claim 13, further comprising: a spacer disposed between the illuminating panel and the illuminating diode module, such that the illuminating panel and the illuminating diode module have A gap. The lighting module of claim 22, wherein the spacer comprises a thermally conductive material. A method of manufacturing a fluorescent plate, comprising: preparing a substrate having a first surface, an opposite second surface, and a plurality of pore structures disposed on at least one of the first surface and the second surface And filling a phosphor material in the pore structure. A method of fabricating a fluorescent plate according to claim 24, wherein the pore structure is formed by semiconductor processing, cutting or imprinting. The method of manufacturing a fluorescent plate according to claim 24, wherein the fluorescent material is filled in the pore structure by capillary attraction, capillary adsorption, vacuum suction, vacuum filling, evaporation, pressure filling or coating. The method of manufacturing a fluorescent plate according to claim 24, wherein the pore structure penetrates the substrate. The method of manufacturing a fluorescent sheet according to claim 24, wherein the plurality of pore structures are divided into a plurality of regions, and the pore structure in each of the regions is filled with the same or different phosphor materials. The method of manufacturing a fluorescent plate according to claim 24, wherein the substrate comprises a diffusion structure disposed on the first surface or the second surface opposite to the aperture structure. The method for manufacturing a fluorescent plate according to claim 24, further comprising: forming a protective layer of a light transmissive material on at least one of the first surface and the second surface of the substrate to cover the pore structure. The method of manufacturing a fluorescent plate according to claim 24, further comprising: forming a reflective layer on the first surface or the second surface opposite to the aperture structure.