TW201335336A - Luminescent material - Google Patents

Luminescent material Download PDF

Info

Publication number
TW201335336A
TW201335336A TW101131175A TW101131175A TW201335336A TW 201335336 A TW201335336 A TW 201335336A TW 101131175 A TW101131175 A TW 101131175A TW 101131175 A TW101131175 A TW 101131175A TW 201335336 A TW201335336 A TW 201335336A
Authority
TW
Taiwan
Prior art keywords
light
luminescent material
luminescent
emitting
emits
Prior art date
Application number
TW101131175A
Other languages
Chinese (zh)
Other versions
TWI515285B (en
Inventor
Yumi Fukuda
Iwao Mitsuishi
Keiko Albessard
Original Assignee
Toshiba Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Kk filed Critical Toshiba Kk
Publication of TW201335336A publication Critical patent/TW201335336A/en
Application granted granted Critical
Publication of TWI515285B publication Critical patent/TWI515285B/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7715Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing cerium
    • C09K11/7716Chalcogenides
    • C09K11/7718Chalcogenides with alkaline earth metals
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/0883Arsenides; Nitrides; Phosphides
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/55Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing beryllium, magnesium, alkali metals or alkaline earth metals
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/59Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing silicon
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/64Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing aluminium
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7715Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing cerium
    • C09K11/7716Chalcogenides
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7715Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing cerium
    • C09K11/77218Silicon Aluminium Nitrides or Silicon Aluminium Oxynitrides
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/12Light sources with substantially two-dimensional radiating surfaces
    • H05B33/14Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144Gold (Au) as principal constituent
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

Abstract

According to one embodiment, the luminescent material exhibits a luminescence peak in a wavelength ranging from 500 to 600 nm when excited with light having an emission peak in a wavelength ranging from 250 to 500 nm. The luminescent material has a composition represented by Formula 1 below: (M1-xCex)2yAlzSi10-zOuNw Formula 1 wherein M represents Sr and a part of Sr may be substituted by at least one selected from Ba, Ca, and Mg; x, y, z, u, and w satisfy following conditions: 0 < x ≤ 1, 0.8 ≤ y ≤ 1.1, 2 ≤ z ≤ 3.5, u ≤ 1 1.8 ≤ z-u, and 13 ≤ u+w ≤ 15.

Description

發光材料 Luminescent material

本文所述之具體例概括關於發光材料、發光裝置及製造發光材料之方法。 Specific examples described herein outline luminescent materials, illuminating devices, and methods of making luminescent materials.

白色發光裝置係藉由組合例如以藍色光激發而發射紅色光之發光材料、以藍色光激發而發射綠光之發光材料和藍色LED而建構。當使用以藍色光激發而發射黃色之發光材料時,白色發光裝置可藉由使用較少的發光材料種類而建構。已知例如經Eu-活化之原矽酸鹽發光材料作為此發射黃色之發光材料。 The white light-emitting device is constructed by combining, for example, a light-emitting material that emits red light by excitation with blue light, a light-emitting material that emits green light by excitation with blue light, and a blue LED. When a luminescent material that emits yellow light by excitation with blue light is used, the white light-emitting device can be constructed by using fewer luminescent material species. For example, an Eu-activated orthosilicate luminescent material is known as the yellow-emitting luminescent material.

對發射黃色之發光材料越來越有需要,以改進溫度性質、量子效率和發光發射光譜半寬度。 There is an increasing need to emit yellow luminescent materials to improve temperature properties, quantum efficiency, and half-width of the luminescent emission spectrum.

根據一個具體例,通常發光材料係在以具有波長範圍從250至500奈米之發射波峰的光激發時展現波長範圍從500至600奈米之發光波峰,而因此其為能夠發射在黃-綠色至橘色區域內的光之發光材料。因為此具體例之發光材料主要發射黃色區域內的光,所以在下文稱為〝發射黃色之發光材料〞。發光材料包括具有晶體結構實質上與Sr2Si7Al3ON13之晶體結構相同的母體材料。母體材料係以Ce活化。根據此具體例的發射黃色之發光材料的組成 物係以下式1代表。 According to a specific example, generally, the luminescent material exhibits an emission peak having a wavelength ranging from 500 to 600 nm when excited by light having a wavelength range of from 250 to 500 nm, and thus it is capable of being emitted in yellow-green. Light-emitting material to the orange area. Since the luminescent material of this specific example mainly emits light in the yellow region, it is hereinafter referred to as ytterbium emitting yellow luminescent material 〞. The luminescent material includes a parent material having a crystal structure substantially identical to that of Sr 2 Si 7 Al 3 ON 13 . The parent material is activated with Ce. The composition of the yellow-emitting luminescent material according to this specific example is represented by the following formula 1.

(M1-xCex)2yAlzSi10-zOuNw 式1(其中M代表Sr及一部分的Sr可以至少一種選自Ba、Ca及Mg者取代。x、y、z、u和w滿足以下條件:0<x1,0.8y1.1,2z3.5,u1,1.8z-u和13u+w15)。 (M 1-x Ce x ) 2y Al z Si 10-z O u N w Formula 1 (wherein M represents Sr and a part of Sr may be substituted by at least one selected from the group consisting of Ba, Ca and Mg. x, y, z, u And w satisfy the following conditions: 0<x 1,0.8 y 1.1, 2 z 3.5, u 1,1.8 Zu and 13 u+w 15).

如以上式1中所示,發光中心元素Ce取代至少一部分的M。M代表Sr及一部分的Sr可以至少一種選自Ba、Ca及Mg者取代。即使至少一種選自Ba、Ca及Mg者的內含量係以M總量為基準計為15原子%,更希望為10原子%或更少,亦不容易產生多相。 As shown in the above formula 1, the luminescent center element Ce replaces at least a part of M. M represents Sr and a part of Sr may be substituted with at least one selected from the group consisting of Ba, Ca and Mg. Even if the internal content of at least one selected from the group consisting of Ba, Ca, and Mg is 15 atom% based on the total amount of M, more desirably 10 atom% or less, it is not easy to produce a multiphase.

當至少0.1莫耳%之M以Ce取代時,則可獲得充足的發光效率。M之總量可以Ce取代(x=1)。當x小於0.5時,則可儘可能地壓制減低的發光可能性(濃度驟減)。因此,x較佳為從0.001至0.5。當含有發光中心元素Ce時,則此具體例之發光材料展現在黃-綠色至橘色區域內的發光,亦即當以具有波長範圍在250至500奈米之發射波峰的光激發時具有波長範圍從500至600奈米之波峰的發光。關於此點,含有以Ce總量為基準計為15原子%,更希望為10原子%或更少的其他元素(諸如不可避免的雜質)不會損害所欲特性。其實例包括Tb、Eu和Mn。 When at least 0.1 mol% of M is substituted with Ce, sufficient luminous efficiency can be obtained. The total amount of M can be replaced by Ce (x = 1). When x is less than 0.5, the reduced luminescence possibility (concentration sharp drop) can be suppressed as much as possible. Therefore, x is preferably from 0.001 to 0.5. When the luminescent center element Ce is contained, the luminescent material of this specific example exhibits luminescence in a yellow-green to orange region, that is, when excited with light having a wavelength range of 250 to 500 nm. Luminescence from a peak of 500 to 600 nm. In this regard, other elements (such as unavoidable impurities) containing 15 atom% based on the total amount of Ce, more desirably 10 atom% or less, do not impair the desired characteristics. Examples thereof include Tb, Eu, and Mn.

當y小於0.8時,則使晶體缺陷增加,其導致效率減 低。另一方面,當y超過1.1時,則過量的鹼土金屬沉澱為多相,其導致發光性質減低。y較佳為從0.85至1.06。 When y is less than 0.8, the crystal defects are increased, which leads to a decrease in efficiency. low. On the other hand, when y exceeds 1.1, the excess alkaline earth metal precipitates as a multiphase, which results in a decrease in luminescent properties. y is preferably from 0.85 to 1.06.

當z小於2時,則過量的Si沉澱為多相,其導致發光性質減低。另一方面,當z超過3.5時,則過量的Al沉澱為多相,其導致發光性質減低。z較佳為從2.5至3.3。 When z is less than 2, excess Si precipitates into a multiphase, which results in a decrease in luminescent properties. On the other hand, when z exceeds 3.5, excess Al precipitates into a multiphase, which results in a decrease in luminescent properties. z is preferably from 2.5 to 3.3.

當u超過1時,則以增加之晶體缺陷減低效率。u較佳為從0.001至0.8。 When u exceeds 1, the efficiency is reduced with increased crystal defects. u is preferably from 0.001 to 0.8.

當(z-u)小於1.8時,則變得不可能維持此具體例的晶體結構。在一些例子中產生多相,而因此發揮不了此具體例的效果。當(u+w)小於13或超過15時,則同樣變得不可能維持此具體例的晶體結構。在一些例子中產生多相,而因此發揮不了此具體例的效果。(z-u)較佳為2或更大及(u+w)較佳為從13.2至14.2。 When (z-u) is less than 1.8, it becomes impossible to maintain the crystal structure of this specific example. In some cases, multiple phases are produced, and thus the effect of this specific example cannot be exerted. When (u + w) is less than 13 or exceeds 15, it is also impossible to maintain the crystal structure of this specific example. In some cases, multiple phases are produced, and thus the effect of this specific example cannot be exerted. (z-u) is preferably 2 or more and (u+w) is preferably from 13.2 to 14.2.

因為根據此具體例之發光材料具有所有的條件,所以其在以具有波長範圍從250至500奈米之發射波峰的光激發時可以高效率發射具有寬的發光發射光譜半寬度的光。因此,獲得現色性質極佳的白色光。另外,根據此具體例的發射黃色之發光材料具有好的溫度性質。 Since the luminescent material according to this specific example has all the conditions, it can emit light having a wide half width of the luminescent emission spectrum with high efficiency when excited with light having a wavelength range of from 250 to 500 nm. Therefore, white light with excellent color properties is obtained. Further, the yellow-emitting luminescent material according to this specific example has good temperature properties.

根據此具體例的發射黃色之發光材料可藉由使用Sr2Al3Si7ON13群晶體作為基本材料,以其他元素取代Sr、Si、Al、O或N(晶體的成分元素)及溶解其他的金屬元素(諸如Ce)而獲得。晶體結構可藉由此取代而修改。然而,其中原子位置大幅改變至骨架原子之間的化學鍵分裂的此程度之例子不常見。原子位置係由晶體結構定出,位置 係由原子及其配位佔據。 The yellow-emitting luminescent material according to this specific example can be obtained by using Sr 2 Al 3 Si 7 ON 13 group crystal as a basic material, replacing Sr, Si, Al, O or N (component elements of crystal) with other elements and dissolving other Obtained by a metal element such as Ce. The crystal structure can be modified by this substitution. However, an example in which the atomic position greatly changes to the degree of chemical bond splitting between the skeleton atoms is not common. The position of the atom is determined by the crystal structure, and the position is occupied by the atom and its coordination.

此具體例之效果可在不改變此具體例的發射黃色之發光材料的基本晶體結構之範圍內發揮。根據此具體例之發光材料的晶格常數及M-N和M-O之化學鍵長度(鄰近的原子間距離)可與Sr2Al3Si7ON13的該等不同。若變化少於±15%之Sr2Al3Si7ON13的晶格常數及Sr2Al3Si7ON13中的化學鍵長度(Sr-N和Sr-O),則此例子被定義為未改變之晶體結構。晶格常數可由X-射線繞射或中子繞射來測定,而M-N和M-O之化學鍵長度(鄰近的原子距離)可從原子配位來計算。 The effect of this specific example can be exerted without changing the basic crystal structure of the yellow-emitting luminescent material of this specific example. The lattice constant of the luminescent material according to this specific example and the chemical bond length of MN and MO (adjacent distance between atoms) may be different from those of Sr 2 Al 3 Si 7 ON 13 . If the variation is less than ± 15% of the Sr 2 Al 3 Si 7 ON 13 of the lattice constant and Sr 2 Al 3 Si 7 ON 13 chemical bonds in length (Sr-N and Sr-O), then this example is defined as No Change the crystal structure. The lattice constant can be determined by X-ray diffraction or neutron diffraction, and the chemical bond lengths of MN and MO (adjacent atomic distances) can be calculated from atomic coordination.

Sr2Al3Si7ON13之晶體具有斜方晶體系統且其晶格常數如下:a=11.8埃,b=21.6埃及c=5.01埃。再者,晶體係屬於空間群Pna 21。在Sr2Al3Si7ON13中的化學鍵長度(Sr-N和Sr-O)可從以下表1中所示之原子配位來計算。 The crystal of Sr 2 Al 3 Si 7 ON 13 has an orthorhombic crystal system and its lattice constant is as follows: a = 11.8 angstroms, b = 21.6 Egypt c = 5.01 angstroms. Furthermore, the crystal system belongs to the space group Pna 21. The chemical bond lengths (Sr-N and Sr-O) in Sr 2 Al 3 Si 7 ON 13 can be calculated from the atomic coordination shown in Table 1 below.

基本上此具體例的發射黃色之發光材料具有此晶體結構。當化學鍵長度的改變超出範圍時,則化學鍵分裂且轉換成不同的晶體。不可能獲得本發明具體例的效果。 Basically, the yellow-emitting luminescent material of this specific example has this crystal structure. When the change in the length of the chemical bond is out of range, the chemical bond splits and is converted into a different crystal. It is impossible to obtain the effects of the specific examples of the present invention.

此具體例的發射黃色之發光材料包括具有晶體結構實質上與Sr2Al3Si7ON13相同的無機化合物作為基本材料且 一部分的成分元素M以發光中心離子Ce取代。各元素之組成規定在預定的範圍內。在此例子中,發光材料展現較佳的特性,諸如高效率、寬的發光發射光譜半寬度和溫度性質。 The yellow-emitting luminescent material of this specific example includes an inorganic compound having a crystal structure substantially the same as that of Sr 2 Al 3 Si 7 ON 13 as a basic material and a part of the component element M is substituted with a luminescent center ion Ce. The composition of each element is specified within a predetermined range. In this example, the luminescent material exhibits preferred characteristics such as high efficiency, wide luminescence emission spectrum half-width, and temperature properties.

Sr2Al3Si7ON13之晶體結構係基於以上表1中所示之原子配位而如圖1A、1B和1C中所示。圖1A為軸方向c的投影圖,圖1B為軸方向b的投影圖,及圖1C為軸方向a的投影圖。在圖中,301代表Sr原子且其周圍被Si原子或Al原子302及O原子或N原子303圍繞。Sr2Al3Si7ON13之晶體可以XRD和中子繞射鑑證。 The crystal structure of Sr 2 Al 3 Si 7 ON 13 is based on the atomic coordination shown in Table 1 above as shown in Figs. 1A, 1B and 1C. 1A is a projection view in the axial direction c, FIG. 1B is a projection view in the axial direction b, and FIG. 1C is a projection view in the axial direction a. In the figure, 301 represents an Sr atom and is surrounded by Si atoms or Al atoms 302 and O atoms or N atoms 303. The crystal of Sr 2 Al 3 Si 7 ON 13 can be verified by XRD and neutron diffraction.

此具體例之發光材料具有以上式1代表的組成物。發光材料在使用Cu-Kα線之Bragg-Brendano方法的X-射線繞射圖案中具有特定的繞射角(2θ)之波峰。亦即其具有至少10個在15.05-15.15,23.03-23.13,24.87-24.97,25.7-25.8,25.97-26.07,29.33-29.43,30.92-31.02,31.65-31.75,31.88-31.98,33.02-33.12,33.59-33.69,34.35-34.45,35.2-35.3,36.02-36.12,36.55-36.65,37.3-37.4和56.5-56.6之繞射角(2θ)的波峰。 The luminescent material of this specific example has the composition represented by the above formula 1. The luminescent material has a specific diffraction angle (2θ) peak in the X-ray diffraction pattern using the Bragg-Brendano method of the Cu-Kα line. That is, it has at least 10 at 15.05-15.15, 23.03-23.13, 24.87-24.97, 25.7-25.8, 25.97-26.07, 29.33-29.43, 30.92-31.02, 31.65-31.75, 31.88-31.98, 33.02-33.12, 33.59- The peaks of the diffraction angle (2θ) of 33.69, 34.35-34.45, 35.2-35.3, 36.02-36.12, 36.55-36.65, 37.3-37.4 and 56.5-56.6.

根據此具體例的發射黃色之發光材料可藉由將含有各元素的原料粉末混合且將其加熱而製得。 The yellow-emitting luminescent material according to this specific example can be obtained by mixing and heating a raw material powder containing each element.

M原料可選自M之氮化物和碳化物。Al原料可選自Al之氮化物、氧化物和碳化物,及Si原料可選自Si之氮化物、氧化物和碳化物。發光中心元素Ce之原料可選自Ce之氧化物、氮化物和碳酸鹽。 The M starting material may be selected from the group consisting of nitrides and carbides of M. The Al raw material may be selected from the nitrides, oxides, and carbides of Al, and the Si raw material may be selected from the nitrides, oxides, and carbides of Si. The raw material of the luminescent center element Ce may be selected from the oxides, nitrides and carbonates of Ce.

關於此點,氮可藉由氮化物原料或在含氮之氛圍中加熱而獲得,而氧可自氧化物原料和氮化物原料的表面氧化膜而獲得。 In this regard, nitrogen can be obtained by heating a nitride raw material or in a nitrogen-containing atmosphere, and oxygen can be obtained from the surface oxide film of the oxide raw material and the nitride raw material.

例如,將Sr3N2、AlN、Si3N4、Al2O3、AlN和CeO2的意欲之起始組成物混合、可使用Sr2N、SrN或其混合物替換Sr3N2。為了獲得均勻的混合粉末,希望將各原料粉末以質量漸增之順序乾式混合。 For example, an intended starting composition of Sr 3 N 2 , AlN, Si 3 N 4 , Al 2 O 3 , AlN, and CeO 2 may be mixed, and Sr 3 N 2 may be replaced with Sr 2 N, SrN, or a mixture thereof. In order to obtain a uniform mixed powder, it is desirable to dry-mix each raw material powder in an order of increasing mass.

可將原料使用研缽在例如手套箱中混合。將混合之粉末放入坩鍋中且在預定的條件下加熱,以獲得根據此具體例之發光材料。未特別限制坩鍋的材料且其材料可選自氮化硼、氮化矽、碳化矽、碳、氮化鋁、sialon、氧化鋁、鉬和鎢。 The raw materials can be mixed using a mortar in, for example, a glove box. The mixed powder is placed in a crucible and heated under predetermined conditions to obtain a luminescent material according to this specific example. The material of the crucible is not particularly limited and its material may be selected from the group consisting of boron nitride, tantalum nitride, tantalum carbide, carbon, aluminum nitride, sialon, alumina, molybdenum, and tungsten.

希望將混合之粉末在超過大氣壓之壓力下加熱。在超過大氣壓之壓力下加熱在氮化矽不易分解之事實方面是有利的。為了壓制氮化矽在高溫下分解,壓力較佳為5大氣壓或更大及加熱溫度較佳為從1500至2000℃。當加熱係在此等條件下進行時,則獲得目標之燒結體而不引起任何麻煩,諸如材料或產物昇華。加熱溫度較佳為從1800至2000℃。 It is desirable to heat the mixed powder at a pressure above atmospheric pressure. Heating at a pressure exceeding atmospheric pressure is advantageous in the fact that tantalum nitride is not easily decomposed. In order to suppress the decomposition of tantalum nitride at a high temperature, the pressure is preferably 5 atm or more and the heating temperature is preferably from 1,500 to 2,000 °C. When the heating is carried out under such conditions, the intended sintered body is obtained without causing any trouble such as sublimation of the material or product. The heating temperature is preferably from 1800 to 2000 °C.

為了避免AlN氧化,希望加熱在氮氛圍中進行。在氛圍中的氫量可高達約90原子%。 In order to avoid oxidation of AlN, it is desirable to carry out the heating in a nitrogen atmosphere. The amount of hydrogen in the atmosphere can be as high as about 90 atom%.

較佳的是將混合之粉末在上述溫度下加熱0.5至4小時,將燒結之材料自坩鍋取出且在相同的條件下再弄碎及加熱。當取出、弄碎及加熱粉末的一系列過程重複至多約 10次時,則輕易地得到在晶體粒子之間小熔合之粉末及均勻的組成物和晶體結構之優點。 Preferably, the mixed powder is heated at the above temperature for 0.5 to 4 hours, the sintered material is taken out from the crucible and pulverized and heated under the same conditions. A series of processes for removing, crushing and heating the powder are repeated up to about At 10 times, the advantages of a powder which is smallly fused between crystal particles and a uniform composition and crystal structure are easily obtained.

在加熱之後,若必要時進行後處理,諸如清潔方法,以獲得根據一個具體例之發光材料。可使用例如以純水清潔、以酸清潔或類似者作為清潔方法。可用的酸實例包括無機酸,諸如硫酸、硝酸、氫氯酸和氫氟酸;有機酸,諸如甲酸、乙酸和草酸;及其混合酸。 After heating, post-treatment, such as a cleaning method, is performed if necessary to obtain a luminescent material according to a specific example. For example, cleaning with pure water, acid cleaning or the like can be used as a cleaning method. Examples of useful acids include inorganic acids such as sulfuric acid, nitric acid, hydrochloric acid, and hydrofluoric acid; organic acids such as formic acid, acetic acid, and oxalic acid; and mixed acids thereof.

在以酸清潔之後,若必要時可進行後退火處理。後退火處理可在例如含有氮和氫之還原氛圍中進行。結晶度及發光效率係藉由進行後退火處理而改進。 After cleaning with an acid, post-annealing may be performed if necessary. The post annealing treatment can be carried out, for example, in a reducing atmosphere containing nitrogen and hydrogen. Crystallinity and luminous efficiency are improved by performing post-annealing treatment.

根據一個具體例之發光裝置包括含有發光材料和激發發光材料之發光元件的發光層。圖2為顯示根據一個具體例之發光裝置的結構之示意圖。 A light-emitting device according to a specific example includes a light-emitting layer containing a light-emitting element of a light-emitting material and an excitation light-emitting material. Fig. 2 is a schematic view showing the structure of a light-emitting device according to a specific example.

在圖2中所示之發光裝置中,將鉛101和102及封裝杯(package cup)103排列在基材100上。基材100和封裝杯103係自樹脂形成。封裝杯103具有上部位比其底部寬的凹部105。凹部的側壁充當反射表面104。 In the light-emitting device shown in FIG. 2, lead 101 and 102 and a package cup 103 are arranged on a substrate 100. The substrate 100 and the package cup 103 are formed of a resin. The package cup 103 has a recess 105 whose upper portion is wider than the bottom portion thereof. The sidewall of the recess acts as a reflective surface 104.

將發光元件106以Ag糊安裝在凹部105的近乎環狀底部之中心部位上。欲使用之發光元件106發射具有波長範圍從400至500奈米之發射波峰的光。發光元件的實例包括發光二極體和雷射二極體。尤其使用半導體發光元件,諸如GaN型LED,然而未特別受限於此。 The light-emitting element 106 is mounted as an Ag paste on the central portion of the nearly annular bottom portion of the recess 105. The light-emitting element 106 to be used emits light having an emission peak having a wavelength ranging from 400 to 500 nm. Examples of the light emitting element include a light emitting diode and a laser diode. In particular, a semiconductor light emitting element such as a GaN type LED is used, but is not particularly limited thereto.

發光元件106的p和n電極(未顯示)係經由Au及類似者所形成之接合線107和108分別與鉛101和鉛102連 接。可隨意地修改該等鉛101和102的排列。 The p and n electrodes (not shown) of the light-emitting element 106 are connected to lead 101 and lead 102 via bonding wires 107 and 108 formed by Au and the like, respectively. Pick up. The arrangement of the leads 101 and 102 can be arbitrarily modified.

亦有可能使用其中n電極和p電極係配置在其相同表面上的尖端翻轉(flip tip)結構作為發光元件106。在此例子中,有可能克服與配線有關的問題,諸如電線切斷或脫離及由電線的光吸收,從而容許製造具有極佳的可信度和發光強度的半導體發光裝置。使用具有n-型基材的發光元件可形成以下結構。n電極係形成於發光元件的n-型基材之背表面上及p電極係形成於疊置在基材上的p-型半導體層之上表面上。n電極係安裝在鉛上及p電極係以電線與其他的鉛連接。 It is also possible to use a flip tip structure in which the n-electrode and the p-electrode are disposed on the same surface thereof as the light-emitting element 106. In this example, it is possible to overcome wiring-related problems such as wire cutting or detachment and light absorption by the wires, thereby permitting the manufacture of a semiconductor light-emitting device having excellent reliability and luminous intensity. The following structure can be formed using a light-emitting element having an n-type substrate. The n-electrode is formed on the back surface of the n-type substrate of the light-emitting element and the p-electrode is formed on the upper surface of the p-type semiconductor layer stacked on the substrate. The n-electrode system is mounted on lead and the p-electrode is connected to other lead wires by wires.

將含有根據一個具體例之發光材料110的發光層109配置在封裝杯103的凹部105內。在發光層109中,例如5至60質量%之發光材料110內含在聚矽氧樹脂所形成之樹脂層111內。如上述,根據此具體例之發光材料含有Sr2Al3Si7ON13作為母體材料。此氧氮化物具有高的共價鍵結性質。因此,根據此具體例之發光材料為疏水性且與樹脂具有好的相容性。因此,在樹脂層與發光材料之間的界面上之散射受到顯著地壓制且改進光提取效率。 The light-emitting layer 109 containing the luminescent material 110 according to a specific example is disposed in the recess 105 of the package cup 103. In the light-emitting layer 109, for example, 5 to 60% by mass of the light-emitting material 110 is contained in the resin layer 111 formed of the polyoxyn resin. As described above, the luminescent material according to this specific example contains Sr 2 Al 3 Si 7 ON 13 as a matrix material. This oxynitride has high covalent bonding properties. Therefore, the luminescent material according to this specific example is hydrophobic and has good compatibility with the resin. Therefore, the scattering at the interface between the resin layer and the luminescent material is significantly suppressed and the light extraction efficiency is improved.

根據此具體例的發射黃色之發光材料具有好的溫度性質且可以高效率發射具有寬的發光發射光譜半寬度之黃色光。具有極佳的發光性質之白色發光裝置係藉由與發射具有波長範圍從400至500奈米之發射波峰的光之發光元件組合而獲得。 The yellow-emitting luminescent material according to this specific example has good temperature properties and can emit yellow light having a wide half width of the luminescent emission spectrum with high efficiency. A white light-emitting device having excellent luminescent properties is obtained by combining with a light-emitting element that emits light having a wavelength range of from 400 to 500 nm.

可隨意地修改發光元件106的大小和種類以及凹部 105的大小和形狀。 The size and type of the light-emitting element 106 and the recess can be arbitrarily modified 105 size and shape.

根據一個具體例之發光裝置不限於圖2中所示之封裝杯型,但可隨意地修改。特定言之,在子彈形LED和表面安裝型LED之例子中,可使用具體例之發光材料獲得相同的效果。 The light-emitting device according to a specific example is not limited to the package cup type shown in Fig. 2, but can be arbitrarily modified. In particular, in the case of the bullet-shaped LED and the surface mount type LED, the same effect can be obtained using the specific example of the luminescent material.

圖3為顯示根據另一具體例之發光裝置的結構之示意圖。在所示之發光裝置中,p和n電極(未顯示)係形成於熱耗散絕緣基材201之預定區域內且發光元件202被排列在該基材上。熱耗散絕緣基材的材料物質可為例如AlN。 Fig. 3 is a schematic view showing the structure of a light-emitting device according to another specific example. In the illustrated light-emitting device, p and n electrodes (not shown) are formed in predetermined regions of the heat dissipating insulating substrate 201 and the light emitting elements 202 are arranged on the substrate. The material material of the heat dissipating insulating substrate may be, for example, AlN.

在發光元件202中的電極之一係形成於底部表面上且與熱耗散絕緣基材201的n電極以電連接。在發光元件202中的另一電極係經由金線203與熱耗散絕緣基材201上的p電極(未顯示)連接。使用發射具有波長範圍從400至500奈米之發射波峰的光之發光二極體作為發光元件202。 One of the electrodes in the light-emitting element 202 is formed on the bottom surface and is electrically connected to the n-electrode of the heat-dissipating insulating substrate 201. The other electrode in the light-emitting element 202 is connected to a p-electrode (not shown) on the heat-dissipating insulating substrate 201 via a gold wire 203. As the light-emitting element 202, a light-emitting diode that emits light having a emission peak having a wavelength ranging from 400 to 500 nm is used.

半球形內部透明樹脂層204、發光層205和外部透明樹脂層206依序形成於發光元件202上。內部透明樹脂層204和外部透明樹脂層206可使用例如聚矽氧形成。在發光層205中,此具體例的發射黃光之發光材料207內含在例如由聚矽氧樹脂所形成之樹脂層208中。 The hemispherical inner transparent resin layer 204, the light emitting layer 205, and the outer transparent resin layer 206 are sequentially formed on the light emitting element 202. The inner transparent resin layer 204 and the outer transparent resin layer 206 may be formed using, for example, polyfluorene oxide. In the light-emitting layer 205, the yellow-emitting light-emitting material 207 of this specific example is contained in a resin layer 208 formed, for example, of a polyoxyxene resin.

在圖3中所示之發光裝置中,含有根據此具體例的發射黃色之發光材料的發光層205可使用諸如真空印刷或以配送器滴塗之程序簡單地製得。另外,發光層205係夾在內部透明樹脂層204與外部透明樹脂層206之間,而因此 獲得改進提取效率的效果。 In the light-emitting device shown in Fig. 3, the light-emitting layer 205 containing the yellow-emitting luminescent material according to this specific example can be simply produced using a procedure such as vacuum printing or dispensing by a dispenser. In addition, the light emitting layer 205 is sandwiched between the inner transparent resin layer 204 and the outer transparent resin layer 206, and thus The effect of improving extraction efficiency is obtained.

關於此點,根據此具體例之發光裝置的發光層可含有以藍色光激發而發射綠色光之發光材料及以藍色光激發而發射紅色光之發光材料連同此具體例的發射黃光之發光材料。在此例子中,獲得極佳的現色性質之白色發光裝置。 In this regard, the light-emitting layer of the light-emitting device according to this specific example may contain a light-emitting material that emits green light by excitation with blue light and a light-emitting material that emits red light by excitation with blue light, together with the light-emitting material that emits yellow light of this specific example. In this example, a white light-emitting device with excellent color rendering properties is obtained.

甚至在根據此具體例的發射黃色之發光材料以在紫外線區域內具有波長範圍從250至400奈米之發射波峰的光激發時,亦獲得黃色發光。因此,白色發光裝置可藉由例如組合根據此具體例之發光材料、以紫外線激發而發射藍色光之發光材料與發光元件(諸如紫外線發射二極體)而建構。在白色發光裝置中的發光層可含有以紫外線激發而發射具有另一波長之波峰的光之發光材料連同此具體例的發射黃色之發光材料。其實例包括以紫外線激發而發射紅色光之發光材料及以紫外線激發而發射綠色光之發光材料。 Even when the yellow-emitting luminescent material according to this specific example is excited with light having a wavelength range of from 250 to 400 nm in the ultraviolet region, yellow luminescence is also obtained. Therefore, the white light-emitting device can be constructed by, for example, combining a light-emitting material according to this specific example, a light-emitting material that emits blue light by ultraviolet light, and a light-emitting element such as an ultraviolet light-emitting diode. The luminescent layer in the white illuminating device may contain a luminescent material that emits ultraviolet light to emit light having a peak of another wavelength, together with the yellow-emitting luminescent material of this specific example. Examples thereof include a luminescent material that emits red light by ultraviolet light and a luminescent material that emits green light by ultraviolet light.

如上述,此具體例之發光材料具有好的溫度性質且可以高效率發射具有寬的發光發射光譜半寬度之黃色光。當組合此具體例的發射黃色之發光材料與發射波長範圍從250至500奈米之發射波峰的光之發光元件時,可使用幾種發光材料獲得具有極佳的發射性質之白色發光裝置。 As described above, the luminescent material of this specific example has good temperature properties and can emit yellow light having a wide half width of the luminescent emission spectrum with high efficiency. When the yellow-emitting luminescent material of this specific example is combined with a light-emitting element that emits light having a wavelength of from 250 to 500 nm, several luminescent materials can be used to obtain a white light-emitting device having excellent emission properties.

在下文顯示發光材料和發光裝置的特定實例。 Specific examples of luminescent materials and illuminating devices are shown below.

將Sr3N2、CeO2、Si3N4和AlN製備成Sr原料、Ce原料、Si原料和Al原料,且將該等材料在真空手套箱中秤 重。Sr3N2、CeO2、Si3N4和AlN的摻合質量分別為2.680公克,0.147公克、5.086公克和1.691公克。將摻合之原料粉末在瑪瑙研缽中以乾式摻合。 Sr 3 N 2 , CeO 2 , Si 3 N 4 and AlN were prepared into Sr raw materials, Ce raw materials, Si raw materials and Al raw materials, and the materials were weighed in a vacuum glove box. The blending masses of Sr 3 N 2 , CeO 2 , Si 3 N 4 and AlN were 2.680 grams, 0.147 grams, 5.086 grams and 1.691 grams, respectively. The blended raw material powder was dry blended in an agate mortar.

將獲得的混合物放入氮化硼(BN)坩鍋中且在具有7.5大氣壓之氮氛圍下以1800℃加熱2小時。將燒結之材料自坩鍋取出且在瑪瑙研缽中弄碎。將弄碎且燒結之材料再放入坩鍋中且以1800℃加熱2小時。將取出、弄碎及加熱粉末的一系列過程再重複兩次,以獲得實例1之發光材料。 The obtained mixture was placed in a boron nitride (BN) crucible and heated at 1800 ° C for 2 hours under a nitrogen atmosphere of 7.5 atm. The sintered material was taken out of the crucible and broken in an agate mortar. The crushed and sintered material was placed in a crucible and heated at 1800 ° C for 2 hours. A series of processes of taking out, crushing, and heating the powder were repeated twice more to obtain the luminescent material of Example 1.

所獲得的發光材料為具有黃實體色之粉末。當其以黑色光激發時,經證實為黃色發光。 The luminescent material obtained is a powder having a yellow solid color. When it was excited by black light, it was confirmed to be yellow light.

將發光材料之XRD圖案顯示於圖4中。XRD圖案在本文係藉由使用Cu-Kα線之Bragg-Brendano方法的X-射線繞射為基準來測定。如圖4中所示,波峰出現在15.05-15.15,23.03-23.13,24.87-24.97,25.7-25.8,25.97-26.07,29.33-29.43,30.92-31.02,31.65-31.75,31.88-31.98,33.02-33.12,33.59-33.69,34.35-34.45,35.2-35.3,36.02-36.12,36.55-36.65,37.3-37.4和56.5-56.6之繞射角(2θ)。 The XRD pattern of the luminescent material is shown in FIG. The XRD pattern is determined herein by reference to X-ray diffraction using the Bragg-Brendano method of the Cu-Kα line. As shown in Figure 4, the peaks appear at 15.05-15.15, 23.03-23.13, 24.87-24.97, 25.7-25.8, 25.97-26.07, 29.33-29.43, 30.92-31.02, 31.65-31.75, 31.88-31.98, 33.02-33.12, Diffraction angles (2θ) of 33.59-33.69, 34.35-34.45, 35.2-35.3, 36.02-36.12, 36.55-36.65, 37.3-37.4 and 56.5-56.6.

將圖4中所示之波峰的相對強度總結於以下表2中。 The relative intensities of the peaks shown in Figure 4 are summarized in Table 2 below.

當發光材料以來自氙燈在450奈米之發射波長分散的光激發時,將發光發射光譜顯示於圖5中。在圖5中,在接近450奈米具有窄的半寬度之發射為激發光反射,並不是發光材料發光。經證實具有551奈米之波峰波長的高發光強度。以瞬間多通道光譜儀計算之半寬度為117奈米。半寬度為由發光裝置所產生的白色光之現色性質的指標之一。通常當半寬度越寬,則輕易地獲得極佳的現色性質之白色光。因為半寬度為117奈米,所以建議使用實例1之發光材料可輕易地獲得極佳的現色性質之白色光。 The luminescence emission spectrum is shown in Fig. 5 when the luminescent material is excited by light from a xenon lamp dispersed at an emission wavelength of 450 nm. In Figure 5, the emission with a narrow half width near 450 nm is the excitation light reflection, not the luminescent material. It has been confirmed to have a high luminous intensity of a peak wavelength of 551 nm. The half width calculated by the instantaneous multi-channel spectrometer was 117 nm. The half width is one of the indicators of the color properties of white light produced by the illuminating device. Generally, when the half width is wider, white light of excellent color rendering properties is easily obtained. Since the half width is 117 nm, it is recommended to use the luminescent material of Example 1 to easily obtain white light of excellent color rendering properties.

圖6顯示發光材料之溫度性質。溫度性質係由以下方式測定。將發光材料以加熱器加熱且獲得在T℃之預定溫度下的發光強度(IT)。使用瞬間多通道光譜儀測量發光強 度。使用在25℃之發光強度(I25)且從(IT/I25)x100之公式計算。如圖6中所示,發現在150℃下獲得0.88或更大的強度滯留且降低的發光強度不多,即使溫度增加。 Figure 6 shows the temperature properties of the luminescent material. The temperature properties were determined in the following manner. The luminescent material is heated by a heater and the luminescence intensity (I T ) at a predetermined temperature of T ° C is obtained. Luminous intensity was measured using an instantaneous multichannel spectrometer. The luminescence intensity at 25 ° C (I 25 ) was used and calculated from the formula of (I T /I 25 )x100. As shown in Fig. 6, it was found that a strength retention of 0.88 or more was obtained at 150 ° C and the reduced luminescence intensity was small, even if the temperature was increased.

具有圖3中所示之結構的發光裝置係使用此實例的發光材料製得。 A light-emitting device having the structure shown in Fig. 3 was produced using the luminescent material of this example.

製備具有8平方毫米之AlN基材作為熱耗散絕緣基材201,其中p和n電極(未顯示)係形成於預定區域內。將具有460奈米波長的發射波峰之發光二極體作為發光元件202以焊料結合至基材。在發光元件202中的電極之一係形成於底部表面上且與AlN基材201的n電極以電連接。在發光元件202中的其他電極係經由以金線203與AlN基材201上的p電極(未顯示)連接。 An AlN substrate having 8 mm 2 was prepared as the heat dissipating insulating substrate 201 in which p and n electrodes (not shown) were formed in a predetermined region. A light-emitting diode having an emission peak of a wavelength of 460 nm was used as the light-emitting element 202 to be bonded to the substrate by solder. One of the electrodes in the light-emitting element 202 is formed on the bottom surface and is electrically connected to the n-electrode of the AlN substrate 201. The other electrodes in the light-emitting element 202 are connected via a gold wire 203 to a p-electrode (not shown) on the AlN substrate 201.

內部透明樹脂層204、發光層205和外部透明樹脂層206依序在發光元件202上形成半球形且製得此實例之發光裝置。聚矽氧樹脂被用作為內部透明樹脂層204的材料且該層係以配送器形成。使用含有50質量%的此實例之發光材料的透明樹脂形成發光層205。所使用之透明樹脂為聚矽氧樹脂。再者,使用與內部透明樹脂層204之例子相同的聚矽氧樹脂在發光層205上形成外部透明樹脂層206。 The inner transparent resin layer 204, the light-emitting layer 205, and the outer transparent resin layer 206 sequentially form a hemispherical shape on the light-emitting element 202 and the light-emitting device of this example is obtained. Polyoxyphthalic resin is used as the material of the inner transparent resin layer 204 and the layer is formed by a dispenser. The light-emitting layer 205 was formed using a transparent resin containing 50% by mass of the luminescent material of this example. The transparent resin used is a polyoxymethylene resin. Further, an outer transparent resin layer 206 is formed on the light-emitting layer 205 using the same polyoxyxene resin as the example of the inner transparent resin layer 204.

當發光裝置被安置在整合球中且在20毫安培和3.3伏特下驅動時,色溫為6300 K,發光效率為180 lm/W和Ra等於76。色溫、發光效率和Ra係從瞬間多通道光譜儀獲得。 When the illuminating device was placed in an integrated sphere and driven at 20 mA and 3.3 volts, the color temperature was 6300 K, the luminous efficiency was 180 lm/W, and Ra was equal to 76. Color temperature, luminous efficiency, and Ra are obtained from an instantaneous multi-channel spectrometer.

此實例之白色發光裝置係藉由組合此實例之發光材料 與具有460奈米波長的發射波峰之藍色LED而獲得。白色發光裝置的使用容許形成用於高動力應用之白色LED,具有高發光效率及高現色性質。 The white light-emitting device of this example is a combination of the luminescent materials of this example. Obtained with a blue LED having an emission peak of 460 nm wavelength. The use of white light-emitting devices allows the formation of white LEDs for high power applications with high luminous efficiency and high color rendering properties.

實例2至17及比較例1和2之發光材料係與實例1中所述者相同的程序獲得,除了改變原料和摻合質量以外,如以下表3和4中所示。 The luminescent materials of Examples 2 to 17 and Comparative Examples 1 and 2 were obtained by the same procedure as described in Example 1, except that the materials and blending qualities were changed, as shown in Tables 3 and 4 below.

實例2至17之發光材料為具有黃實體色之粉末。當該等以黑色光激發時,經證實為黃色發光。該等發光材料之XRD圖案依序顯示於圖7至22中。選自XRD圖案的10個按強度順序遞減的波峰經證實為最強的波峰。繞射角(2θ)以表5和6中的〝○〞表示。 The luminescent materials of Examples 2 to 17 were powders having a yellow solid color. When these were excited by black light, it was confirmed to be yellow light. The XRD patterns of the luminescent materials are shown in sequence in Figures 7-22. Ten peaks in descending order of intensity selected from the XRD pattern were confirmed to be the strongest peaks. The diffraction angle (2θ) is represented by 〝○〞 in Tables 5 and 6.

在實例中的發光材料之任一者中,發現10個最強的波峰屬於15.05-15.15°,23.03-23.13°,24.87-24.97°,25.7-25.8°,25.97-26.07°,29.33-29.43°,30.92-31.02°,31.65-31.75°,31.88-31.98°,33.02-33.12°,33.59-33.69°,34.35-34.45°,35.2-35.3°,36.02-36.12°,36.55-36.65°,37.3-37.4°和56.5-56.6°之繞射角(2θ)的任一者。 In any of the luminescent materials in the examples, the 10 strongest peaks were found to be 15.05-15.15°, 23.03-23.13°, 24.87-24.97°, 25.7-25.8°, 25.97-26.07°, 29.33-29.43°, 30.92. -31.02°, 31.65-31.75°, 31.88-31.98°, 33.02-33.12°, 33.59-33.69°, 34.35-34.45°, 35.2-35.3°, 36.02-36.12°, 36.55-36.65°, 37.3-37.4° and 56.5 Any of the diffraction angles (2θ) of -56.6°.

與上述相同的方式檢查關於實例2至17之發光材料及比較例1和2之發光材料的發光性質。將結果與實例1之發光材料的發光性質一起總結於以下表7中。表7中的強度顯示當實例1之發光強度被定義為1時的相對強度。色度(Cx,Cy)係以整合球型總發光分析儀獲得。 The luminescent properties of the luminescent materials of Examples 2 to 17 and the luminescent materials of Comparative Examples 1 and 2 were examined in the same manner as described above. The results are summarized in Table 7 below together with the luminescent properties of the luminescent material of Example 1. The intensity in Table 7 shows the relative intensity when the luminous intensity of Example 1 was defined as 1. The chromaticity (Cx, Cy) was obtained with an integrated spherical total luminescence analyzer.

如以上表7中所示,實例1至17之發光材料具有波長範圍從544至555奈米之發光波峰且獲得0.85或更大的高發光強度。此外,獲得具有116奈米或更大的發光發射半寬度之寬發光。另一方面,比較例1至2之發光材料具有0.32至0.52之發光強度且未獲得足夠的亮度。 As shown in Table 7 above, the luminescent materials of Examples 1 to 17 had luminescence peaks having a wavelength ranging from 544 to 555 nm and obtained a high luminescence intensity of 0.85 or more. Further, a wide luminescence having a half width of the luminescent emission of 116 nm or more was obtained. On the other hand, the luminescent materials of Comparative Examples 1 to 2 had an illuminating intensity of 0.32 to 0.52 and sufficient brightness was not obtained.

與上述相同的程序檢查關於實例2至17之發光材料的溫度性質。經證實實例2至17之所有發光材料在150℃ 下具有0.81或更大的強度滯留且具有好的溫度性質,類似於實例1之例子。將一些結果顯示於以下表8及圖23中。 The same procedure as above was examined for the temperature properties of the luminescent materials of Examples 2 to 17. All of the luminescent materials of Examples 2 to 17 were confirmed at 150 ° C It has a strength retention of 0.81 or more and has good temperature properties, similar to the example of Example 1. Some results are shown in Table 8 below and Figure 23.

當以感應耦合電漿(ICP)對實例1至17及比較例1至2之發光材料進行化學分析時,將結果總結於以下表9中。表9中所示之數值為以Al量與Si量之總和設定至10且使分析元素之量標準化所獲得的莫耳比。 When the luminescent materials of Examples 1 to 17 and Comparative Examples 1 to 2 were chemically analyzed by inductively coupled plasma (ICP), the results are summarized in Table 9 below. The numerical values shown in Table 9 are the molar ratios obtained by setting the sum of the amount of Al and the amount of Si to 10 and normalizing the amount of the analysis element.

表9中的x、y、z、u和w對應於以下式1中的x、y、z、u和w。 x, y, z, u, and w in Table 9 correspond to x, y, z, u, and w in the following Formula 1.

(M1-xCex)2yAlzSi10-zOuNw 式1 (M 1-x Ce x ) 2y Al z Si 10-z O u N w

如以上表9中所示,在實例1至17之發光材料的任一者中,x、y、z、u和w係在以下的範圍內:0<x1,0.8y1.1,2z3.5,u1,1.8z-u和13u+w15。 As shown in the above Table 9, in any of the luminescent materials of Examples 1 to 17, x, y, z, u, and w are within the following ranges: 0 < x 1,0.8 y 1.1, 2 z 3.5, u 1,1.8 Zu and 13 u+w 15.

因為實例之發光材料具有預定的組成物,所以其可以高效率得到具有寬的發光發射光譜半寬度之黃色發光及具有好的溫度性質。另一方面,在其中未獲得足夠亮度的比較例1中,z-u是小到1.39至1.41。再者,在比較例2中,z是大到3.56及u是大到2.17。 Since the luminescent material of the example has a predetermined composition, it can obtain yellow light having a wide half width of the luminescent emission spectrum with high efficiency and has good temperature properties. On the other hand, in Comparative Example 1 in which sufficient brightness was not obtained, z-u was as small as 1.39 to 1.41. Further, in Comparative Example 2, z is as large as 3.56 and u is as large as 2.17.

接著準備市場上可取得的經Eu活化之原矽酸鹽發光材料作為比較例3之發光材料。 Next, an Eu-activated orthosilicate luminescent material obtainable on the market was prepared as the luminescent material of Comparative Example 3.

比較例4至11之發光材料係以與實例1之發光材料相同的組合物合成,除了式1中的下列組成物之各者如以下表10中所示方式改變以外。 The luminescent materials of Comparative Examples 4 to 11 were synthesized in the same composition as the luminescent material of Example 1, except that each of the following compositions in Formula 1 was changed as shown in Table 10 below.

比較例3至11之發光材料的XRD圖案係與上述相同的方式測定。結果,在該等比較例之發光材料中,波峰不總是出現在15.05-15.15,23.03-23.13,24.87-24.97,25.7-25.8,25.97-26.07,29.33-29.43,30.92-31.02,31.65-31.75,31.88-31.98,33.02-33.12,33.59-33.69,34.35-34.45,35.2-35.3,36.02-36.12,36.55-36.65,37.3-37.4和56.5-56.6之繞射角(2θ)。 The XRD patterns of the luminescent materials of Comparative Examples 3 to 11 were measured in the same manner as described above. As a result, in the luminescent materials of the comparative examples, the peaks do not always appear at 15.05-15.15, 23.03-23.13, 24.87-24.97, 25.7-25.8, 25.97-26.07, 29.33-29.43, 30.92-31.02, 31.65-31.75, Diffraction angles (2θ) of 31.88-31.98, 33.02-33.12, 33.59-33.69, 34.35-34.45, 35.2-35.3, 36.02-36.12, 36.55-36.65, 37.3-37.4 and 56.5-56.6.

再者,比較例3至11之發光材料係藉由與上述相同的方式發射具有450奈米波長的光而激發。檢查發光性質且測定各發光材料的溫度性質。經證實比較例之所有發光材料不可能組合發光性質與溫度性質。 Further, the luminescent materials of Comparative Examples 3 to 11 were excited by emitting light having a wavelength of 450 nm in the same manner as described above. The luminescent properties were examined and the temperature properties of each luminescent material were determined. It was confirmed that all of the luminescent materials of the comparative examples were impossible to combine luminescent properties and temperature properties.

特定言之,經Eu活化之原矽酸鹽發光材料(比較例3)具有窄到約70奈米之半寬度。即使將發光材料與藍色發光二極體組合,仍未獲得具有好的現色性質之發光裝置。另外,明顯降低在高溫下的發光強度。在具有約300毫瓦或更大的動力供應之高輸出發光裝置之例子中,使效率減低。 In particular, the Eu-activated protoporphydate luminescent material (Comparative Example 3) has a half width as narrow as about 70 nm. Even if a luminescent material is combined with a blue light-emitting diode, a light-emitting device having good color-developing properties is not obtained. In addition, the luminous intensity at high temperatures is significantly reduced. In the case of a high output lighting device having a power supply of about 300 milliwatts or more, the efficiency is reduced.

當式1中的y值小於0.8(比較例4)時,則Sr+Ce之量太少且使結晶度降低,導致低效率。另一方面,當y值超過1.1(比較例5)時,則Sr+Ce之量太多且過量之Sr+Ce形成多相,導致低效率。 When the y value in Formula 1 is less than 0.8 (Comparative Example 4), the amount of Sr+Ce is too small and the crystallinity is lowered, resulting in low efficiency. On the other hand, when the y value exceeds 1.1 (Comparative Example 5), the amount of Sr+Ce is too large and the excess Sr+Ce forms a multi-phase, resulting in low efficiency.

當式1中的z值小於2(比較例6)時,則Al量太少。因此,維持不了晶體結構且轉換成不同的晶體結構,導致 不足的特性。另一方面,當z值超過3.5(比較例7)時,則Al量太多且使晶體結構轉換成含有過量Al之不同的晶體結構,導致不足的特性。 When the z value in Formula 1 is less than 2 (Comparative Example 6), the amount of Al is too small. Therefore, the crystal structure cannot be maintained and converted into a different crystal structure, resulting in Insufficient features. On the other hand, when the z value exceeds 3.5 (Comparative Example 7), the amount of Al is too large and the crystal structure is converted into a crystal structure containing a large amount of Al, resulting in insufficient characteristics.

當式1中的u值為1或更大(比較例8)時,則O量太多。因此,使共價鍵結性質減低,波長變短及效率變低,導致不足的溫度性質。另一方面,當z-u值小於1.8(比較例9)時,則與Al相比的O量太多,維持不了晶體結構且轉換成不同的晶體結構。因此未獲得所欲特性。 When the u value in Formula 1 is 1 or more (Comparative Example 8), the amount of O is too large. Therefore, the covalent bonding property is lowered, the wavelength is shortened, and the efficiency is lowered, resulting in insufficient temperature properties. On the other hand, when the z-u value is less than 1.8 (Comparative Example 9), the amount of O compared with Al is too large, the crystal structure is not maintained, and it is converted into a different crystal structure. Therefore, the desired characteristics are not obtained.

當式1中的u+w值小於13(比較例10)時,則陰離子量太少且破壞電荷平衡。因此,維持不了晶體結構且轉換成不同的晶體結構,導致不足的特性。另一方面,當u+w值超過15(比較例11)時,則陰離子量太多且破壞電荷平衡。因此,維持不了晶體結構且轉換成不同的晶體結構,導致不足的特性。 When the value of u + w in Formula 1 is less than 13 (Comparative Example 10), the amount of anion is too small and the charge balance is broken. Therefore, the crystal structure cannot be maintained and converted into a different crystal structure, resulting in insufficient characteristics. On the other hand, when the u+w value exceeds 15 (Comparative Example 11), the amount of anions is too large and the charge balance is broken. Therefore, the crystal structure cannot be maintained and converted into a different crystal structure, resulting in insufficient characteristics.

根據本發明的具體例,其係提供具有好的溫度性質且可以高效率發射具有寬的發光發射光譜半寬度之黃色光的發光材料。此具體例的發射黃色之發光材料與藍色LED的組合能夠獲得具有極佳的現色性質及好的發光性質之白色發光裝置。 According to a specific example of the present invention, it is possible to provide a luminescent material which has good temperature properties and can emit yellow light having a wide half width of a luminescent emission spectrum with high efficiency. The combination of the yellow-emitting luminescent material and the blue LED of this specific example enables a white light-emitting device having excellent color rendering properties and good luminescent properties to be obtained.

雖然已說明特定的具體例,但是該等具體例僅以實例方式呈現,並不意欲限制本發明之範圍。事實上,本文所述之新穎具體例可以各種其他形式具體化;此外,可進行本文所述之具體例形式的各種省略、取代和變化而不違背本發明的精神。意欲以所附之申請專利範圍和其對等物涵 蓋將會落在本發明之範圍和精神內的此等形式或修改。 The specific examples are presented by way of example only and are not intended to limit the scope of the invention. In fact, the novel embodiments described herein may be embodied in a variety of other forms, and various other omissions, substitutions and changes can be made without departing from the spirit of the invention. It is intended to be in the scope of the attached patent application and its equivalent. Such forms or modifications of the cover will fall within the scope and spirit of the invention.

100‧‧‧基材 100‧‧‧Substrate

101、102‧‧‧鉛 101, 102‧‧‧ lead

103‧‧‧封裝杯 103‧‧‧Package cup

104‧‧‧反射表面 104‧‧‧Reflective surface

105‧‧‧凹部 105‧‧‧ recess

106、202‧‧‧發光元件 106, 202‧‧‧Lighting elements

107、108‧‧‧接合線 107, 108‧‧‧ Bonding wire

109‧‧‧發光層 109‧‧‧Lighting layer

110‧‧‧發光材料 110‧‧‧ luminescent materials

111,208‧‧‧樹脂層 111,208‧‧‧ resin layer

301‧‧‧Sr原子 301‧‧‧Sr atom

302‧‧‧Si原子或Al原子 302‧‧‧Si atom or Al atom

303‧‧‧O原子或N原子 303‧‧‧O atoms or N atoms

201‧‧‧熱耗散絕緣基材 201‧‧‧Heat dissipative insulation substrate

203‧‧‧金線 203‧‧‧ Gold wire

204‧‧‧內部透明樹脂層 204‧‧‧Internal transparent resin layer

205‧‧‧黃色發光層 205‧‧‧Yellow luminescent layer

206‧‧‧外部透明樹脂層 206‧‧‧External transparent resin layer

207‧‧‧發射黃光之發光材料 207‧‧‧Silver emitting yellow light

圖1A、1B和1C為顯示Sr2Al3Si7ON13之晶體結構的圖;圖2為顯示根據一個具體例之發光裝置的結構之示意圖;圖3為顯示根據另一具體例之發光裝置的結構之示意圖;圖4顯示實例1之發光材料的XRD圖案;圖5為顯示實例1之發光材料的發光發射光譜之圖;圖6為顯示實例1之發光材料的溫度性質之圖;圖7顯示實例2之發光材料的XRD圖案;圖8顯示實例3之發光材料的XRD圖案;圖9顯示實例4之發光材料的XRD圖案;圖10顯示實例5之發光材料的XRD圖案;圖11顯示實例6之發光材料的XRD圖案;圖12顯示實例7之發光材料的XRD圖案;圖13顯示實例8之發光材料的XRD圖案;圖14顯示實例9之發光材料的XRD圖案;圖15顯示實例10之發光材料的XRD圖案;圖16顯示實例11之發光材料的XRD圖案;圖17顯示實例12之發光材料的XRD圖案;圖18顯示實例13之發光材料的XRD圖案;圖19顯示實例14之發光材料的XRD圖案;圖20顯示實例15之發光材料的XRD圖案; 圖21顯示實例16之發光材料的XRD圖案;圖22顯示實例17之發光材料的XRD圖案;及圖23為顯示實例13之發光材料的溫度性質之圖。 1A, 1B and 1C are views showing a crystal structure of Sr 2 Al 3 Si 7 ON 13 ; Fig. 2 is a schematic view showing a structure of a light-emitting device according to a specific example; and Fig. 3 is a view showing a light-emitting device according to another specific example Figure 4 is a view showing the XRD pattern of the luminescent material of Example 1, Figure 5 is a view showing the luminescence emission spectrum of the luminescent material of Example 1, and Figure 6 is a diagram showing the temperature properties of the luminescent material of Example 1; The XRD pattern of the luminescent material of Example 2 is shown; FIG. 8 shows the XRD pattern of the luminescent material of Example 3; FIG. 9 shows the XRD pattern of the luminescent material of Example 4; FIG. 10 shows the XRD pattern of the luminescent material of Example 5; 6 shows the XRD pattern of the luminescent material; FIG. 12 shows the XRD pattern of the luminescent material of Example 7; FIG. 13 shows the XRD pattern of the luminescent material of Example 8; FIG. 14 shows the XRD pattern of the luminescent material of Example 9; XRD pattern of the luminescent material; Fig. 16 shows the XRD pattern of the luminescent material of Example 11; Fig. 17 shows the XRD pattern of the luminescent material of Example 12; Fig. 18 shows the XRD pattern of the luminescent material of Example 13, and Fig. 19 shows the luminescent material of Example 14. X RD pattern; FIG. 20 shows an XRD pattern of the luminescent material of Example 15; FIG. 21 shows an XRD pattern of the luminescent material of Example 16, FIG. 22 shows an XRD pattern of the luminescent material of Example 17, and FIG. 23 shows the luminescent material of Example 13. A diagram of the nature of temperature.

100‧‧‧基材 100‧‧‧Substrate

101‧‧‧鉛 101‧‧‧ lead

102‧‧‧鉛 102‧‧‧ Lead

103‧‧‧封裝杯 103‧‧‧Package cup

104‧‧‧反射表面 104‧‧‧Reflective surface

105‧‧‧凹部 105‧‧‧ recess

107‧‧‧接合線 107‧‧‧bonding line

108‧‧‧接合線 108‧‧‧bonding line

109‧‧‧發光層 109‧‧‧Lighting layer

110‧‧‧發光材料 110‧‧‧ luminescent materials

111‧‧‧樹脂層 111‧‧‧ resin layer

106‧‧‧發光元件 106‧‧‧Lighting elements

Claims (15)

一種發光材料,其在以具有波長範圍從250至500奈米之發射波峰的光激發時展現波長範圍從500至600奈米之發光波峰,該發光材料具有以下式1代表的組成物:(M1-xCex)2yAlzSi10-zOuNw 式1其中M代表Sr及一部分的Sr可以至少一種選自Ba、Ca及Mg者取代;x、y、z、u和w滿足以下條件:0<x1,0.8y1.1,2z3.5,u1,1.8z-u和13u+w15。 A luminescent material exhibiting an emission peak having a wavelength ranging from 500 to 600 nm when excited by light having a wavelength range of from 250 to 500 nm, the luminescent material having a composition represented by the following formula 1: (M 1-x Ce x ) 2y Al z Si 10-z O u N w Formula 1 wherein M represents Sr and a part of Sr may be substituted with at least one selected from the group consisting of Ba, Ca and Mg; x, y, z, u and w satisfy The following conditions: 0<x 1,0.8 y 1.1, 2 z 3.5, u 1,1.8 Zu and 13 u+w 15. 根據申請專利範圍第1項之之發光材料,其中該發光材料在使用Cu-Kα線之Bragg-Brendano方法的X-射線繞射中具有至少10個在15.05-15.15,23.03-23.13,24.87-24.97,25.7-25.8,25.97-26.07,29.33-29.43,30.92-31.02,31.65-31.75,31.88-31.98,33.02-33.12,33.59-33.69,34.35-34.45,35.2-35.3,36.02-36.12,36.55-36.65,37.3-37.4和56.5-56.6之繞射角(2θ)的波峰。 The luminescent material according to claim 1, wherein the luminescent material has at least 10 in the X-ray diffraction using the Bragg-Brendano method of Cu-Kα line at 15.05-15.15, 23.03-23.13, 24.87-24.97 , 25.7-25.8, 25.97-26.07, 29.33-29.43, 30.92-31.02, 31.65-31.75, 31.88-31.98, 33.02-33.12, 33.59-33.69, 34.35-34.45, 35.2-35.3, 36.02-36.12, 36.55-36.65, 37.3 The peak of the diffraction angle (2θ) of -37.4 and 56.5-56.6. 根據申請專利範圍第1項之發光材料,其中x為從0.001至0.5。 A luminescent material according to the first aspect of the patent application, wherein x is from 0.001 to 0.5. 根據申請專利範圍第1項之發光材料,其中y為從0.85至1.06。 A luminescent material according to the first aspect of the patent application, wherein y is from 0.85 to 1.06. 根據申請專利範圍第1項之發光材料,其中z為從2.5至3.3。 According to the luminescent material of claim 1, wherein z is from 2.5 to 3.3. 根據申請專利範圍第1項之發光材料,其中u為從0.001至0.8。 According to the luminescent material of claim 1, wherein u is from 0.001 to 0.8. 根據申請專利範圍第1項之發光材料,其中z-u為2或更大。 A luminescent material according to the first aspect of the patent application, wherein z-u is 2 or more. 根據申請專利範圍第1項之發光材料,其中u+w為從13.2至14.2。 According to the luminescent material of claim 1, wherein u+w is from 13.2 to 14.2. 根據申請專利範圍第1至8項中任一項之發光材料,其中將15原子%或更少的Ce以另一元素替換。 The luminescent material according to any one of claims 1 to 8, wherein 15 atom% or less of Ce is replaced with another element. 根據申請專利範圍第1至9項中任一項之發光材料,其中該發光材料具有斜方晶體結構。 The luminescent material according to any one of claims 1 to 9, wherein the luminescent material has an orthorhombic crystal structure. 一種發光裝置,其包含:發光元件,其發射具有波長範圍從在250至500奈米之發射波峰的光;及包含該發光材料之發光層,該發光材料係藉由接收來自該發光元件的光而發射黃色光,發射黃色光之該發光材料包含申請專利範圍第1至10項中任一項之發光材料。 A light-emitting device comprising: a light-emitting element that emits light having a wavelength range of from 250 to 500 nm; and a light-emitting layer comprising the light-emitting material, the light-emitting material receiving light from the light-emitting element The luminescent material that emits yellow light and emits yellow light includes the luminescent material of any one of claims 1 to 10. 根據申請專利範圍第11項之發光裝置,其進一步包含:熱耗散絕緣基材,將發光元件安置在該基材上,其中該發光層呈半球形。 The illuminating device of claim 11, further comprising: a heat dissipating insulating substrate on which the luminescent element is disposed, wherein the luminescent layer is hemispherical. 根據申請專利範圍第11項之發光裝置,其中該發光層進一步包含至少一種選自以藍色光激發而發射綠色光之發光材料及以藍色光激發而發射紅色光之發光材料。 The illuminating device of claim 11, wherein the luminescent layer further comprises at least one luminescent material selected from the group consisting of a luminescent material that emits green light by blue light and a red light that emits red light. 根據申請專利範圍第11項之發光裝置,其中該發 光元件發射具有波長範圍從250至400奈米之波峰的紫外線,且該發光層進一步包含以紫外線激發而發射藍色光之發光材料。 According to the illuminating device of claim 11, wherein the hair luminaire The light element emits ultraviolet light having a peak having a wavelength ranging from 250 to 400 nm, and the light emitting layer further includes a light emitting material that emits blue light by ultraviolet light. 一種製造申請專利範圍第1至10項中任一項之發光材料的方法,其包含:將選自M之氮化物和碳化物之M原料、選自Al之氮化物、氧化物和碳化物之Al原料、選自Si之氮化物、氧化物和碳化物之Si原料與選自Ce之氧化物、氮化物和碳酸鹽之Ce原料混合以得到混合物;及將該混合物加熱。 A method of producing a luminescent material according to any one of claims 1 to 10, which comprises: an M material selected from the group consisting of nitrides and carbides of M, a nitride selected from the group consisting of nitrides, oxides and carbides of Al The Al raw material, the Si raw material selected from the nitrides, oxides and carbides of Si are mixed with the Ce raw material selected from the oxides, nitrides and carbonates of Ce to obtain a mixture; and the mixture is heated.
TW101131175A 2011-11-16 2012-08-28 Luminescent material TWI515285B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011250599A JP5762929B2 (en) 2011-11-16 2011-11-16 Phosphor, light emitting device, and method of manufacturing phosphor

Publications (2)

Publication Number Publication Date
TW201335336A true TW201335336A (en) 2013-09-01
TWI515285B TWI515285B (en) 2016-01-01

Family

ID=47115241

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101131175A TWI515285B (en) 2011-11-16 2012-08-28 Luminescent material

Country Status (6)

Country Link
US (1) US9133391B2 (en)
EP (1) EP2597129A1 (en)
JP (1) JP5762929B2 (en)
KR (2) KR20130054123A (en)
CN (1) CN103113895B (en)
TW (1) TWI515285B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8987986B2 (en) 2012-09-25 2015-03-24 Kabushiki Kaisha Toshiba Fluorescent substance, light-emitting device and method for producing fluorescent substance

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6081235B2 (en) 2013-03-07 2017-02-15 株式会社東芝 White light emitting device
JP2014177592A (en) * 2013-03-15 2014-09-25 Toshiba Corp Phosphor and light-emitting device using the same
JP2014181260A (en) * 2013-03-18 2014-09-29 Toshiba Corp Phosphor, light-emitting device and method for producing phosphor
JP2014224182A (en) 2013-05-15 2014-12-04 株式会社東芝 Phosphor, light-emitting device, and production method of phosphor
JP2015157919A (en) * 2014-02-25 2015-09-03 株式会社東芝 Phosphor, light-emitting device and method for producing phosphor
JP2015166416A (en) * 2014-03-03 2015-09-24 株式会社東芝 Phosphor, production method of phosphor, and light-emitting device using the same
JP2015187250A (en) * 2014-03-12 2015-10-29 株式会社東芝 Phosphor, method for producing the same, and light-emitting device employing the same
JP2015211202A (en) * 2014-04-30 2015-11-24 株式会社東芝 Light-emitting device
JP6645429B2 (en) * 2014-08-07 2020-02-14 三菱ケミカル株式会社 Phosphor, light emitting device, image display device and lighting device
JP2016060845A (en) * 2014-09-18 2016-04-25 株式会社東芝 Phosphor, process for producing phosphor, and light-emitting device using the same
JP2016060844A (en) * 2014-09-18 2016-04-25 株式会社東芝 Phosphor, light-emitting device and process for producing phosphor
WO2017051457A1 (en) * 2015-09-24 2017-03-30 株式会社 東芝 Fluorescent substance, process for producing same, and light-emitting device including said fluorescent substance
CN108922955B (en) * 2018-06-25 2024-04-16 欧普照明股份有限公司 Light source module and lighting device comprising same

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10146719A1 (en) * 2001-09-20 2003-04-17 Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh Lighting unit with at least one LED as a light source
DE10147040A1 (en) * 2001-09-25 2003-04-24 Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh Lighting unit with at least one LED as a light source
US7524437B2 (en) * 2005-03-04 2009-04-28 Dowa Electronics Materials Co., Ltd. Phosphor and manufacturing method of the same, and light emitting device using the phosphor
US7887718B2 (en) 2005-03-04 2011-02-15 Dowa Electronics Materials Co., Ltd. Phosphor and manufacturing method therefore, and light emission device using the phosphor
JP4975269B2 (en) * 2005-04-28 2012-07-11 Dowaホールディングス株式会社 Phosphor and method for producing the same, and light emitting device using the phosphor
KR101264580B1 (en) * 2005-09-27 2013-05-14 미쓰비시 가가꾸 가부시키가이샤 Fluorescent substance, process for producing the same, and light emitting device using said fluorescent substance
JP2009510230A (en) * 2005-09-30 2009-03-12 ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア Nitrido and oxynitridocerium-based phosphor materials for solid-state lighting applications
WO2007105631A1 (en) 2006-03-10 2007-09-20 Kabushiki Kaisha Toshiba Phosphor and light-emitting device
US8469760B2 (en) * 2006-03-31 2013-06-25 Dowa Electronics Materials Co., Ltd. Light emitting device and method for producing same
JP4869317B2 (en) * 2008-10-29 2012-02-08 株式会社東芝 Red phosphor and light emitting device using the same
JP5185421B2 (en) 2010-09-09 2013-04-17 株式会社東芝 Red light emitting phosphor and light emitting device using the same
US8414795B2 (en) 2010-09-09 2013-04-09 Kabushiki Kaisha Toshiba Red light-emitting fluorescent substance and light-emitting device employing the same
JP5746672B2 (en) * 2012-09-25 2015-07-08 株式会社東芝 Phosphor, light emitting device, and method of manufacturing phosphor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8987986B2 (en) 2012-09-25 2015-03-24 Kabushiki Kaisha Toshiba Fluorescent substance, light-emitting device and method for producing fluorescent substance

Also Published As

Publication number Publication date
US20130241387A1 (en) 2013-09-19
CN103113895B (en) 2015-08-19
JP2013104041A (en) 2013-05-30
EP2597129A1 (en) 2013-05-29
TWI515285B (en) 2016-01-01
JP5762929B2 (en) 2015-08-12
KR101575531B1 (en) 2015-12-07
US9133391B2 (en) 2015-09-15
KR20130054123A (en) 2013-05-24
CN103113895A (en) 2013-05-22
KR20140130078A (en) 2014-11-07

Similar Documents

Publication Publication Date Title
TWI515285B (en) Luminescent material
KR101429345B1 (en) Luminescent material
EP2778211A1 (en) Phosphor and light-emitting device employing the same
JP2015157919A (en) Phosphor, light-emitting device and method for producing phosphor
JP2015166416A (en) Phosphor, production method of phosphor, and light-emitting device using the same
KR101603007B1 (en) Phosphor
TWI507507B (en) Luminescent material
TWI516570B (en) Phosphor and light-emitting device
JP6546304B2 (en) Phosphor and light emitting device
EP2781576A1 (en) Phosphor, light-emitting device and method for producing the phosphor
JP2016056241A (en) Phosphor, production method therefor, and light-emitting device using said phosphor
US20160083648A1 (en) Phosphor, method for producing the same, and light-emitting device using the same
JP2017036392A (en) Fluophor, light-emitting device and manufacturing method of fluophor
JP2016060844A (en) Phosphor, light-emitting device and process for producing phosphor
JP2015187250A (en) Phosphor, method for producing the same, and light-emitting device employing the same

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees