TW201334203A - Alignment method of patterned substrate and manufacture method of stacked films of solar cell using the same - Google Patents

Abstract

An alignment method of a patterned substrate is adapted to execute an alignment for the patterned substrate. The patterned substrate includes a substrate and a patterned film deployed on the substrate. The alignment method of the patterned substrate includes capturing multiple images of multiple corners on the patterned substrate, and each image includes a first information and a second information. The first information includes an image of a portion of a boundary of the substrate, and the second information includes an image of a portion of the patterned film. In addition, alignment marks are defined according to a relative position of the first information and the second information of each image. The patterned substrate is aligned according to a relative position of the alignment marks and a reference mark. The alignment method of the patterned substrate can be applied to a manufacture method of stacked films of a solar cell in order to facilitate other patterned films formed subsequently can be accurately superposed on the patterned substrate.

Description

Method for positioning patterned substrate and method for manufacturing stacked film layer of solar cell using same

The present invention relates to a method of positioning a substrate, and more particularly to a method of positioning a patterned substrate and a method of fabricating a stacked film layer using the same.

For the current solar cell industry, how to improve the energy conversion efficiency of batteries has become an important issue at present. In the current technology, the two processes of the selective emitter process and the two-layer metal electrode screen printing process are currently the focus of attention. Therefore, many studies have focused on the so-called stack structure of selective emitter structures and metal finger patterns. However, the formation of these structures relies on a highly accurate calibration system to achieve good pattern stacking. structure.

In the prior art, the center and edge positioning method of the germanium wafer can provide sufficient positioning capability to form a first layer pattern on the germanium wafer, and the subsequently formed second layer pattern is stacked on the first layer pattern. In the case of the upper layer, a special layout design and process must be performed on the germanium wafer to form a calibration mark or a scribe, etc., to locate the germanium wafer having the first layer pattern, and the second layer pattern can be combined with the first layer. The pattern is aligned and formed on the germanium wafer.

However, the latter positioning method requires additional preparation of specially arranged calibration marks, and the formation of calibration marks easily affects the first layer pattern, causing product differentiation, resulting in a problem of yield reduction, and because additional processes are required. To create calibration marks, it will cause a problem of reduced productivity.

The present invention provides a method of locating a patterned substrate to simplify the calibration procedure of the patterned substrate.

The invention further provides a method for manufacturing a stacked film layer of a solar cell to improve product yield and production efficiency of the solar cell.

In order to achieve the above advantages or other advantages, an embodiment of the present invention provides a method for positioning a patterned substrate, which is suitable for positioning a patterned substrate. The patterned substrate includes a substrate and a patterned film layer disposed on the substrate, and the method for positioning the patterned substrate includes: capturing a plurality of images of the plurality of corners of the patterned substrate, and each image includes the first information and the first Second information, wherein the first information comprises a partial image of a boundary of the substrate, and the second information comprises a partial image of the patterned film layer. And, positioning marks are defined according to the relative positions of the first information and the second information of each image, and the patterned substrate is positioned by the relative positions between the positioning marks and the reference marks.

In an embodiment of the invention, the patterned film layer is an electrode layer or a selective emitter film layer having a plurality of stripe patterns.

In an embodiment of the present invention, the method for defining a positioning mark includes: defining a first mark located at a boundary of a substrate according to the first information, and defining a second mark located in the different stripe pattern according to the second information, wherein The first mark is located on the same bobbin as the second mark, and the positioning mark is disposed at a center point of the first mark and the second mark.

In an embodiment of the invention, the patterned substrate is a rectangular substrate, and the positioning marks are respectively located at four corners of the rectangular substrate.

In one embodiment of the invention, the reference numerals are referred to as cross marks, and the cross marks include a transverse axis and a longitudinal axis, wherein the transverse axis is perpendicular to the longitudinal axis.

In an embodiment of the invention, the method for positioning the patterned substrate by the relative positions between the positioning marks and the reference marks comprises: according to the diagonal and horizontal axes of the positioning marks located at the corners Relative angle is used to know the deflection angle of the patterned substrate. Next, the positional offset vector of the patterned substrate is known based on the relative positions of the center points of the positioning marks located at the corners and the center point of the cross mark.

The invention further provides a method for manufacturing a stacked film layer of a solar cell, comprising: forming a first patterned film layer on a substrate to form a patterned substrate. Next, positioning the patterned substrate, and the positioning method includes: capturing a plurality of images of the plurality of corners of the patterned substrate, each image including the first information and the second information, wherein the first information includes a portion of the boundary of the substrate The image, the second information includes a partial image of the first patterned film layer. Furthermore, the positioning marks are defined according to the relative positions of the first information and the second information of each image, and the patterned substrate is positioned by the relative positions between the positioning marks and the reference marks. Next, a second patterned film layer is formed on the patterned substrate, and the second patterned film layer is placed on the first patterned film layer.

In an embodiment of the invention, the method for forming a first patterned film layer includes forming a first patterned electrode layer having a plurality of first stripe patterns, and the method of forming the second patterned film layer includes forming more a second stripe pattern and a second patterned electrode layer of the third stripe pattern, the second stripe patterns are superposed on the first stripe patterns, and the third stripe patterns are bus bars connected to the second stripe patterns (bus bar) electrode.

In one embodiment of the invention, the method of forming a first patterned film layer includes forming a selective emitter layer having a plurality of heavily doped regions to form a second patterned film layer The method includes forming a plurality of electrodes on the doped regions.

In one embodiment of the invention, the method of forming the selective emitter layer described above includes etch-back or laser doping.

In summary, the method for positioning a patterned substrate of the present invention is to define a plurality of marks by capturing images of a plurality of corners on the patterned substrate and obtaining information from the images, and then by using the respective marks. The patterned substrate is positioned relative to each other. Therefore, the positioning method of the patterned substrate provided by the invention does not require any special calibration marks to be prepared in the process, and the principle is simple and easy to use and has high precision, in addition to simplifying the process steps, improving production efficiency and reducing production cost. It also solves the problem of prioritizing products in order to make calibration marks in the prior art, thereby improving product yield. In addition, the method for manufacturing a stacked film layer of a solar cell according to the present invention is to laminate the other patterned film formed on the patterned substrate by using the above-described positioning method of the patterned substrate, thereby improving the production quality. Rate and efficiency.

The above and other objects, features and advantages of the present invention will become more <RTIgt;

1A to 1D are schematic flow charts showing a method of manufacturing a stacked film layer of a solar cell according to an embodiment of the present invention. Referring to FIG. 1A , a method for manufacturing a solar cell of the present embodiment includes the following steps: First, a first patterned film layer 120 is formed on a substrate 110 to form a patterned substrate 130 . In addition, the outer shape of the substrate 110 of the embodiment may be a circular shape, a polygonal shape or the like. In the embodiment, a rectangular shape is taken as an example. Further, the method of forming the first patterned film layer 120 includes forming a first patterned electrode layer having a plurality of first stripe patterns 122, that is, the first patterned film layer 120 is a first patterned electrode layer. The method of forming the first patterned electrode layer may be printing, but the method of forming the patterned electrode layer is not limited to the above method.

Please refer to FIG. 1B , and then the positioning of the patterned substrate 130 is performed. The positioning method includes: capturing a plurality of images of the plurality of corners of the patterned substrate 130 , and in this embodiment, drawing the rectangular patterned substrate 130 The four images 131, 132, 133, and 134 of the four corners 1301, 1302, 1303, and 1304 are taken as an example. Each of the images 131, 132, 133 or 134 includes a first information and a second information. The first information includes a partial image of a boundary of the substrate 110, and the second information includes a partial image of the first patterned film layer 120. In this embodiment, the second information includes a partial image of the plurality of first stripe patterns 122 adjacent to the boundary of the substrate 130, and in the figure, a partial image including the three first stripe patterns 122 is taken as an example, but the second The number of first stripe patterns that can be included in the information is not limited thereto. In addition, in the embodiment, for example, an image capturing device (not shown) is used to capture images of different corners of the patterned substrate 130, but in other embodiments, the image capturing device may be used first. The image of the entire patterned substrate 130 is taken, and then the images of the plurality of corners of the patterned substrate 130 are removed from the middle.

Referring to FIG. 1C, after the images of the plurality of corners of the patterned substrate 130 are extracted, the positioning marks 141 are further defined according to the relative positions of the first information and the second information of each of the images 131, 132, 133, and 134. 142, 143, 144. In the present embodiment, the positioning marks 141, 142, 143, and 144 are respectively located at the four corners 1301, 1302, 1303, and 1304 of the rectangular patterned substrate 130. Hereinafter, a method of defining a positioning mark will be described in detail, and here, a method of defining the positioning mark 143 will be exemplified, and other positioning marks 141, 142, and 144 are defined by the same positioning method. The method for defining the positioning mark 143 includes: defining a first mark 1431 located at a boundary of the substrate 110 according to the first information, and defining second marks 1432, 1433, 1434 located in the plurality of first stripe patterns 122 according to the second information, wherein The first mark 1431 and the second marks 1432, 1433, 1434 are located on the same bobbin aa ' . In the embodiment, the three second marks 1432, 1433, and 1434 are taken as an example, but the number of the second marks is not limited thereto. The positioning mark 143 is then placed at the center point of the first mark 1431 and the second marks 1432, 1433, 1434.

After the positioning marks 141, 142, 143, 144 are defined, the patterned substrate 130 is then positioned by the relative position between the positioning marks 141, 142, 143, 144 and the reference mark 150, wherein the reference mark 150 is for example It is a cross mark which includes a transverse axis L1 and a longitudinal axis L2, and the transverse axis L1 is perpendicular to the longitudinal axis L2. The reference mark 150 may be a lens preset to the image capturing device or an image processing system built in the image capturing device. The method of positioning the patterned substrate 130 by the relative positions between the positioning marks 141, 142, 143, 144 and the reference mark 150 includes: according to the positioning marks 141 located at the corners 1301, 1302, 1303, 1304, The relative angle θ between the diagonal line L3 of 142, 143, and 144 and the horizontal axis L1 is used to know the deflection angle of the patterned substrate 130. For example, the deflection angle is, for example, a 45-degree angle as a standard value, and the deflection angle and the deflection direction of the patterned substrate 130 can be known from the difference between the relative angle θ and the 45-degree angle. In addition, according to the relative positions of the center points 145 of the positioning marks 141, 132, 143, 144 located at the corners 1301, 1302, 1303, 1304 and the center point 1501 of the reference mark 150, the position of the patterned substrate 130 is known. Move the vector. The information of the position offset vector includes the offset amount and direction of the patterned substrate 130 in the horizontal direction and the offset amount and direction in the vertical direction.

Thus, since the deflection angle, the deflection direction, and the positional shift amount of the patterned substrate 130 have been obtained, the position of the patterned substrate 130 can be corrected based on these materials to facilitate the subsequent steps of manufacturing the solar cell.

FIG. 1D is a top view showing the second patterned film layer stacked on the first patterned film layer. Referring to FIG. 1D, after the positioning of the patterned substrate 130 is completed, a second patterned film layer 160 is further formed on the patterned substrate 130, and the second patterned film layer 160 is stacked as shown in FIG. 1A. On the first patterned film layer 120. In this embodiment, the method of forming the second patterned film layer 160 includes forming a second patterned electrode layer having a plurality of second stripe patterns 162 and a third stripe pattern 164, that is, the second patterned film layer 160 is The second patterned electrode layer, wherein the second stripe pattern 162 is superposed on the first stripe patterns 122 shown in FIG. 1A, and the third stripe patterns 164 are bus bar electrodes connected to the second stripe patterns 162. In addition, the method of forming the second patterned electrode layer 166 may be a screen printing method, but the method of forming the patterned electrode layer is not limited thereto.

Although the above-described method of manufacturing a stacked film of a solar cell is exemplified by manufacturing a stacked patterned electrode layer, the method of manufacturing a stacked film of the solar cell of the present invention can also be used to manufacture other stacked film layers. For example, a method of fabricating a stacked film layer of a solar cell can also be used to fabricate a selective emitter and an electrode stacked thereon. That is, the method for forming the first patterned film layer is, for example, forming a selective emitter layer (not shown) having a plurality of fourth stripe patterns, wherein the selective emitter layer has a plurality of heavily doped regions. And these heavily doped regions form these fourth stripe patterns, wherein the method of forming the selective emitter layer may be an etch back method or a laser doping method, however, the method of forming the selective emitter layer is not limited to the above method . Additionally, a method of forming a second patterned film layer can include forming a plurality of electrodes on the heavily doped regions. In addition, the electrode layer on the selective emitter layer may be formed by the method of manufacturing the stacked patterned electrode layer provided above, and the number of electrode layers on the selective emitter layer is not limited herein.

In summary, the method for locating a patterned substrate of the present invention is mainly defined by capturing a plurality of images of a plurality of corners on a patterned substrate and defining a plurality of information obtained from the plurality of images. Marking, and then positioning the patterned substrate by the relative position between each of the marks and the reference mark. The positioning method of the patterned substrate provided by the invention does not need to form an additional positioning mark on the patterned substrate, the method is simple and easy to use, and has high precision, and can be applied to the process of the selective emitter structure and the double electrode layer. In the process. In addition, because there is no need to make any special calibration marks in the process, in addition to simplifying the process steps, improving production efficiency and reducing production costs, it is also possible to avoid the problem of product differentiation due to the production of additional calibration marks. Improve product yield. In addition, the method for manufacturing a stacked film layer of a solar cell according to the present invention is to laminate the other patterned film formed on the patterned substrate by using the above-described positioning method of the patterned substrate, thereby improving the production quality. Rate and efficiency.

While the present invention has been described in its preferred embodiments, the present invention is not intended to limit the invention, and the present invention may be modified and modified without departing from the spirit and scope of the invention. The scope of protection is subject to the definition of the scope of the patent application.

110. . . Substrate

120. . . First patterned film layer

122. . . First stripe pattern

130. . . Patterned substrate

1301, 1302, 1303, 1304. . . corner

131, 132, 133, 134. . . image

141, 142, 143, 144. . . Positioning mark

1431. . . First mark

1432, 1433, 1434. . . Second mark

145, 1501. . . Center point

150. . . Reference mark

160. . . Second patterned film layer

162. . . Second stripe pattern

164. . . Third stripe pattern

Aa ' . . . Spool

L1. . . Horizontal axis

L2. . . Longitudinal axis

L3. . . diagonal

θ. . . Relative angle

1A to 1D are schematic diagrams showing the flow of a method for manufacturing a solar cell according to an embodiment of the present invention.

110. . . Substrate

120. . . First patterned film layer

122. . . First stripe pattern

130. . . Patterned substrate

131, 132, 133, 134. . . image

1301, 1302, 1303, 1304. . . corner

Claims (10)

A method for positioning a patterned substrate is suitable for positioning a patterned substrate, the patterned substrate comprising a substrate and a patterned film layer disposed on the substrate, the method for positioning the patterned substrate comprises: capturing the Patterning a plurality of images of the plurality of corners of the substrate, each of the images comprising a first information and a second information, the first information comprising a partial image of a boundary of the substrate, the second information comprising the patterned film layer a partial image; a positioning mark is defined according to a relative position of the first information and the second information of each image; and the patterned substrate is positioned by a relative position between the positioning mark and a reference mark . The method for positioning a patterned substrate according to claim 1, wherein the patterned film layer is an electrode layer or a selective emitter film layer having a plurality of stripe patterns. The method for positioning a patterned substrate according to claim 2, wherein the method for defining the positioning mark comprises: defining a first mark located at a boundary of the substrate according to the first information, and defining according to the second information And a second mark located on the different stripe patterns, the first mark and the second marks are on the same bobbin; and the positioning mark is disposed at a center point of the first mark and the second marks. The method of positioning a patterned substrate according to claim 1, wherein the patterned substrate is a rectangular substrate, and the positioning marks are respectively located at four corners of the rectangular substrate. A method of positioning a patterned substrate according to claim 4, wherein the reference mark is a cross mark comprising a transverse axis and a longitudinal axis, the transverse axis being perpendicular to the longitudinal axis. The method for positioning a patterned substrate according to claim 5, wherein the method for positioning the patterned substrate by the relative position between the positioning marks and the reference mark comprises: according to the corners a relative angle between the diagonal lines of the positioning marks and the horizontal axis to know a deflection angle of the patterned substrate; and according to a center point of the positioning marks located at the corners and a center point of the cross mark The relative position of the patterned substrate is known to be a vector offset vector. A method for manufacturing a stacked film layer of a solar cell, comprising: forming a first patterned film layer on a substrate to form a patterned substrate; positioning the patterned substrate, the positioning method comprises: capturing the pattern And a plurality of images of the plurality of corners of the substrate, each of the images comprising a first information and a second information, the first information comprising a partial image of a boundary of the substrate, the second information comprising the first patterned film a partial image of the layer; a positioning mark is defined according to a relative position of the first information and the second information of each image; and the patterned substrate is performed by a relative position between the positioning mark and a reference mark Positioning; and forming a second patterned film layer on the patterned substrate, the second patterned film layer being disposed on the first patterned film layer. The method for manufacturing a stacked film layer of a solar cell according to claim 7, wherein the method of forming the first patterned film layer comprises forming a first patterned electrode layer having a plurality of first stripe patterns, forming The second method of patterning a film layer includes forming a second patterned electrode layer having a plurality of second stripe patterns and a third stripe pattern, the second stripe patterns being superposed on the first stripe patterns, and the The third stripe patterns are bus bar electrodes connected to the second stripe patterns. The method for manufacturing a stacked film layer of a solar cell according to claim 7, wherein the method of forming the first patterned film layer comprises forming a selective emitter layer having a plurality of fourth stripe patterns, the selection The active emitter layer has a plurality of heavily doped regions, the heavily doped regions forming the fourth stripe pattern, and the method of forming the second patterned film layer includes forming a plurality of electrodes on the heavily doped regions . The method for manufacturing a stacked film layer of a solar cell according to claim 9, wherein the method of forming the selective emitter layer comprises an etch back method or a laser doping method.