TW201329009A - Controlling alkali in CIGS thin films via glass and application of voltage - Google Patents

Controlling alkali in CIGS thin films via glass and application of voltage Download PDF

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TW201329009A
TW201329009A TW101145104A TW101145104A TW201329009A TW 201329009 A TW201329009 A TW 201329009A TW 101145104 A TW101145104 A TW 101145104A TW 101145104 A TW101145104 A TW 101145104A TW 201329009 A TW201329009 A TW 201329009A
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glass substrate
alkali metal
voltage
applying
glass
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Richard Michael Fiacco
Kenneth Edward Hrdina
Melissann Ashton-Patton
James Patrick Hamilton
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Corning Inc
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    • H01L31/0392Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate
    • HELECTRICITY
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    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/0248Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
    • H01L31/036Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
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    • C03C2217/00Coatings on glass
    • C03C2217/20Materials for coating a single layer on glass
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Abstract

A method of moving alkali metal ions in a glass substrate to form a glass substrate having an intrinsic alkali metal barrier layer or an enhanced alkali metal layer by applying voltage to at least one of the surfaces of the substrate such that at least a portion of the alkali metal ions, alkaline earth metal ions, or the combination thereof in the at least one surface move into the thickness of the glass substrate.

Description

通過玻璃與電壓的應用控制鎘銦鎵硒化物薄膜內的鹼金屬 Controlling alkali metal in cadmium indium gallium selenide film by glass and voltage application 【相關申請案的交叉引用】[Cross-reference to related applications]

本專利申請案根據專利法主張於2011年11月30日提出申請的美國臨時專利申請案序號第61/565109號的優先權權益,該申請案之內容為本案所依據且該申請案之內容以引用方式全部併入本文中。 The present patent application is based on the priority of the U.S. Provisional Patent Application Serial No. 61/565,109, filed on November 30, 2011, the content of which is hereby The citations are all incorporated herein.

本揭示大體而言係關於具有擴散阻障層或增強鹼金屬層的玻璃基板,而且本發明更特定言之係關於具有鹼金屬擴散阻障層或增強鹼金屬層的玻璃基板,該玻璃基板可用於光電應用,例如薄膜光電(PV)裝置及製造該薄膜光電裝置的方法。 The present disclosure relates generally to a glass substrate having a diffusion barrier layer or a reinforced alkali metal layer, and more particularly to a glass substrate having an alkali metal diffusion barrier layer or a reinforced alkali metal layer, the glass substrate being usable For optoelectronic applications, such as thin film photovoltaic (PV) devices and methods of making the same.

現今的光電工業在發展薄膜太陽能板技術上面臨的一個問題是控制從基材進入所沉積半導體薄膜的鹼金屬傳 送。現今發展中的兩種光電薄膜技術為鎘碲化物(CdTe)和鎘銦鎵硒化物(CIGS)。在鎘碲化物的案例中,將薄膜堆疊沉積於太陽光必須通過的玻璃上板上。已經證實的是,將鹼金屬離子摻入透明導電氧化物(TCO)及/或鎘碲化物薄膜會降低裝置將太陽光轉化為電力的效率。目前最常用於鎘碲化物薄膜堆疊的阻障層係濺鍍沉積的氧化矽(SiO2)或氧化鋁(Al2O3)。這些阻障層可以抑制鹼金屬離子從玻璃上板跑出,但無法完全阻止。 One problem faced by the photovoltaic industry today in the development of thin film solar panel technology is the control of alkali metal transport from the substrate into the deposited semiconductor film. The two photovoltaic thin film technologies currently in development are cadmium telluride (CdTe) and cadmium indium gallium selenide (CIGS). In the case of cadmium telluride, a thin film stack is deposited on a glass upper plate through which sunlight must pass. It has been demonstrated that the incorporation of alkali metal ions into a transparent conductive oxide (TCO) and/or cadmium telluride film reduces the efficiency with which the device converts sunlight into electricity. At present, the barrier layer most commonly used for cadmium telluride film stacking is sputter deposited cerium oxide (SiO 2 ) or aluminum oxide (Al 2 O 3 ). These barrier layers prevent alkali metal ions from escaping from the glass plate but are not completely prevented.

在鎘銦鎵硒化物的案例中,將薄膜沉積在不直接曝露於太陽光的玻璃基板上。在沉積過程中將鈉、鉀和其他可能的鹼金屬摻入鎘銦鎵硒化物半導體薄膜中可以改變鎘銦鎵硒化物半導體薄膜的微結構,其方式最終可增強裝置將太陽光轉化為電力的效率。亦顯示的是,在鎘銦鎵硒化物薄膜中存在最適化濃度的鹼金屬離子可以產出最大的電池效率。此最適化的濃度可以依據用以製備鎘銦鎵硒化物薄膜的特定製程(例如共蒸鍍、快速熱處理、批次硒化)及製造商對既定製程的具體最適化而改變。 In the case of cadmium indium gallium selenide, the film was deposited on a glass substrate that was not directly exposed to sunlight. The incorporation of sodium, potassium and other possible alkali metals into the cadmium indium gallium selenide semiconductor film during deposition can alter the microstructure of the cadmium indium gallium selenide semiconductor film, which ultimately enhances the device's ability to convert sunlight into electricity. effectiveness. It is also shown that the presence of an optimum concentration of alkali metal ions in the cadmium indium gallium selenide film can produce maximum cell efficiency. This optimum concentration can vary depending on the particular process used to prepare the cadmium indium gallium selenide film (e.g., co-evaporation, rapid thermal processing, batch selenization) and the manufacturer's specific optimization of the custom process.

最常用於鎘碲化物和鎘銦鎵硒化物技術的基材是碳酸鈉-石灰-氧化矽(SLG)浮法玻璃。此玻璃材料被主要使用的原因是立即可得、成本低及含有高濃度的鈉。最後的這個特質對於一些鎘銦鎵硒化物製程(例如快速熱處理和共蒸鍍)是理想的,因為高濃度的鈉可以造成薄膜沉積過程中快速的鈉傳送,而且可以產出高的電池效率。通常鎘銦鎵硒化物薄膜內每cm31x1019個鈉原子的摻雜劑水準可獲得較高的電 池效率。一般的鎘銦鎵硒化物膜厚度為2.5微米(m或um)。因此,對於較薄的鎘銦鎵硒化物膜來說,每平方公分的光電電池中所需的鈉濃度可以估算為95 ng/cm2或更少。1克食鹽(NaCl)的鈉含量大約和1平方英吋、3 mm厚、一般使用浮式製程製作的碳酸鈉-石灰-氧化矽玻璃(SLG)板相同,此鈉足以將約41,000 m2的鎘銦鎵硒化物電池摻雜到1x1019原子/cm3的水準。這簡單地說明了SLG玻璃中存在足夠的鈉。 The most commonly used substrate for cadmium telluride and cadmium indium gallium selenide technology is sodium carbonate-lime-stron oxide (SLG) float glass. The reason why this glass material is mainly used is that it is immediately available, low in cost, and contains a high concentration of sodium. This last trait is ideal for some cadmium indium gallium selenide processes (such as rapid thermal processing and co-evaporation) because high concentrations of sodium can cause rapid sodium transport during film deposition and can produce high cell efficiencies. Typically the cadmium indium gallium selenide film of about 3 per cm A dopant level of 1 x 10 19 sodium atoms results in higher cell efficiencies. The general thickness of cadmium indium gallium selenide film is 2.5 microns (m or um). Therefore, for a thinner cadmium indium gallium selenide film, the sodium concentration required per square centimeter of photovoltaic cells can be estimated to be 95 ng/cm 2 or less. The sodium content of 1 gram of salt (NaCl) is approximately the same as that of a 1 square inch, 3 mm thick, sodium carbonate-lime-yttria glass (SLG) plate typically made using a floating process, which is sufficient to be about 41,000 m 2 The cadmium indium gallium selenide battery is doped to a level of 1 x 10 19 atoms/cm 3 . This simply illustrates the presence of sufficient sodium in the SLG glass.

有趣地注意到,前4 nm的表面可包含足量摻入鎘銦鎵硒化物膜所需的全部的鈉。雖然存在足夠的鈉,但需要控制總量和玻璃表面釋放速率的方法。鈉的傳送速率對一些鎘銦鎵硒化物製程(例如批次硒化)顯得太快,並且更重要的是無法控制。由於SLG玻璃在環境條件的溫度和濕度下會老化,SLG玻璃之表面化學性質改變而導致在鎘銦鎵硒化物薄膜沉積過程中有空間不均勻的鈉釋放。 It is interesting to note that the first 4 nm surface may contain all of the sodium required to incorporate a cadmium indium gallium selenide film. Although there is sufficient sodium, there is a need to control the total amount and the rate at which the glass surface is released. The sodium transfer rate appears too fast for some cadmium indium gallium selenide processes (eg, batch selenization) and, more importantly, uncontrollable. Since SLG glass ages under ambient conditions of temperature and humidity, the surface chemistry of the SLG glass changes, resulting in a spatially non-uniform sodium release during the deposition of the cadmium indium gallium selenide film.

結果,一些整合外部摻雜劑層的解決方案正被研究中,該外部摻雜劑層以可控制的方式傳送所有所需的鈉進入鎘銦鎵硒化物膜。在這些產品設計中,理想的是完全防止鹼金屬從下方的玻璃基板跑出。為了做到這一點,正在開發防止鹼金屬從玻璃基板擴散進入外部鹼金屬摻雜劑層和鎘銦鎵硒化物膜的阻障層。阻障層也必須防止或最小化鹼金屬離子從外部摻雜劑層擴散回到自身,使得所有的鹼金屬離子皆可用於擴散進入鎘銦鎵硒化物膜。目前最常見的、用於鎘銦鎵硒化物薄膜堆疊的阻障層為濺鍍沉積的氧化矽或氧化鋁。這些阻障層可以抑制鹼金屬離子從玻璃基板跑出,但不能完全 阻止。此外,這些阻障層已被發現無法有效防止來自外部摻雜劑層的鹼金屬向後擴散回到自身。 As a result, some solutions are being investigated that integrate an external dopant layer that delivers all of the desired sodium into the cadmium indium gallium selenide film in a controlled manner. In these product designs, it is desirable to completely prevent alkali metal from escaping from the underlying glass substrate. In order to achieve this, a barrier layer that prevents alkali metal from diffusing from the glass substrate into the external alkali metal dopant layer and the cadmium indium gallium selenide film is being developed. The barrier layer must also prevent or minimize the diffusion of alkali metal ions from the outer dopant layer back to itself such that all of the alkali metal ions are available for diffusion into the cadmium indium gallium selenide film. At present, the most common barrier layer for cadmium indium gallium selenide film stack is sputter deposited yttrium oxide or aluminum oxide. These barrier layers can inhibit alkali metal ions from running out of the glass substrate, but not completely prevent. In addition, these barrier layers have been found to be ineffective in preventing the alkali metal from the external dopant layer from diffusing back to itself.

玻璃基板或上板的額外需求是具有與鎘銦鎵硒化物或鎘碲化物薄膜類似的熱膨脹係數(CTE),以最大化黏附性並防止膜分層。在大多數的鎘碲化物和鎘銦鎵硒化物光電模組的產品設計中,使用兩片玻璃作為基板和上板材料。理想的是至少一個玻璃片為SLG浮法玻璃,因為其成本低。在這樣的產品架構中,兩個玻璃片的熱膨脹係數(CTE)應該是相似的,以防止在層壓製程過程中產生機械性變形。 An additional requirement for the glass substrate or the upper plate is to have a similar coefficient of thermal expansion (CTE) as the cadmium indium gallium selenide or cadmium telluride film to maximize adhesion and prevent film delamination. In the design of most cadmium telluride and cadmium indium gallium selenide photovoltaic modules, two sheets of glass are used as the substrate and the upper plate material. It is desirable that at least one of the glass sheets is SLG float glass because of its low cost. In such a product architecture, the coefficient of thermal expansion (CTE) of the two glass sheets should be similar to prevent mechanical deformation during the lamination process.

進一步理想的玻璃性質是在高溫下的穩定性。在較高的處理溫度下可以增強鎘碲化物和鎘銦鎵硒化物電池的性能。最能說明玻璃中這種溫度抗性的性質是應變點和退火點。設計一個可以同時有效地滿足所有的熱膨脹、溫度抗性及可變鹼金屬傳送要求的單一玻璃組成是非常困難的。滿足這些相互矛盾的要求的一種方法是設計滿足熱膨脹係數和熱穩定性要求的玻璃組合物,然後設計其表面化學性質來控制鹼金屬的傳送。 A further desirable glass property is stability at elevated temperatures. The performance of cadmium telluride and cadmium indium gallium selenide batteries can be enhanced at higher processing temperatures. The nature that best describes this temperature resistance in glass is the strain point and the annealing point. It is very difficult to design a single glass composition that can effectively meet all of the thermal expansion, temperature resistance, and variable alkali metal transfer requirements. One way to meet these conflicting requirements is to design a glass composition that meets the thermal expansion coefficient and thermal stability requirements and then design its surface chemistry to control the transport of the alkali metal.

將在以下的實施方式中提出另外的特徵與優點,而且對於本技術領域中具有通常知識者而言,從該描述即可顯而易見部分的該等特徵與優點,或是可藉由實施書面說明和申請專利範圍中描述的本發明來理解該等特徵與優點。 Additional features and advantages will be set forth in the <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; The present invention described in the claims is intended to understand such features and advantages.

由於鈉的擴散受到抑制或鈉的濃度受到玻璃中存在 的濃度限制,典型的光電鎘銦鎵硒化物處理(未施加電壓者)產生的鈉濃度限於鎘銦鎵硒化物層和鉬(Mo)層。本揭示優於以往的光電電池之改良在於加速了鈉的擴散速率,並且將電池中的鈉含量提高到超過玻璃的水準。所施加的電壓藉由施加電壓而提高了鈉物種的擴散速率。其次,施加電壓用以在電壓施加處產生豐富的鈉,並因而可以提高鉬和鎘銦鎵硒化物層中的鈉濃度。 Due to the inhibition of sodium diffusion or the concentration of sodium is present in the glass The concentration limit of the typical photo-cadmium indium gallium selenide treatment (when no voltage is applied) is limited to the cadmium indium gallium selenide layer and the molybdenum (Mo) layer. An improvement over the prior art photovoltaic cells is that the diffusion rate of sodium is accelerated and the sodium content in the battery is increased beyond the level of the glass. The applied voltage increases the rate of diffusion of the sodium species by applying a voltage. Second, a voltage is applied to produce abundant sodium at the voltage application, and thus the sodium concentration in the molybdenum and cadmium indium gallium selenide layers can be increased.

施加負電壓到玻璃表面將會導致移動的、帶正電的鹼金屬和鹼土金屬離子往玻璃表面遷移/擴散,並產生富含這些物種的表面層。相反地,施加正電壓到玻璃表面將會導致移動的、帶正電的鹼金屬和鹼土金屬離子遷移/擴散離開玻璃表面,並產生耗乏這些物種的表面層。所施加的電壓可用以產生富含鹼金屬的表面層或耗乏鹼金屬的表面層。此外,可以修改該技術而視需要控制鹼金屬的豐富或耗乏程度(例如部分豐富或部分耗乏),以控制從玻璃表面釋放進入後續沉積的薄膜之鹼金屬量和速率。富含或耗乏的表面層之厚度可以在幾個奈米到約10微米的範圍中,例如從3奈米到10微米,例如從10奈米到1微米。 Applying a negative voltage to the glass surface will cause the moving, positively charged alkali and alkaline earth metal ions to migrate/diffuse toward the glass surface and create a surface layer rich in these species. Conversely, applying a positive voltage to the glass surface will cause the moving, positively charged alkali and alkaline earth metal ions to migrate/diffuse away from the glass surface and create a surface layer that is depleted of these species. The applied voltage can be used to produce an alkali metal-rich surface layer or an alkali metal-depleted surface layer. In addition, the technique can be modified to control the richness or depletion of the alkali metal (e.g., partially rich or partially depleted) as needed to control the amount and rate of alkali metal released from the glass surface into the subsequently deposited film. The thickness of the rich or depleted surface layer can range from a few nanometers to about 10 microns, such as from 3 nanometers to 10 microns, such as from 10 nanometers to 1 micrometer.

一個實施例為一種移動玻璃基板中的鹼金屬離子以形成具有固有鹼金屬阻障層的玻璃基板之方法,該方法包含以下步驟:提供玻璃基板,該玻璃基板包含鹼金屬離子、鹼土金屬離子或上述物質之組合,且該玻璃基板具有至少二相對表面和介於該等表面間的厚度;及 對該基板之該二表面施加電壓,使得在至少一表面中至少一部分的該鹼金屬離子、鹼土金屬離子或上述物質之組合移動深入該厚度,以形成具有該固有鹼金屬阻障層的該玻璃基板。 One embodiment is a method of moving an alkali metal ion in a glass substrate to form a glass substrate having an intrinsic alkali metal barrier layer, the method comprising the steps of: providing a glass substrate comprising an alkali metal ion, an alkaline earth metal ion, or a combination of the foregoing, and the glass substrate has at least two opposing surfaces and a thickness interposed between the surfaces; Applying a voltage to the two surfaces of the substrate such that at least a portion of the alkali metal ions, alkaline earth metal ions, or a combination of the above materials in at least one surface moves deeper into the thickness to form the glass having the intrinsic alkali metal barrier layer Substrate.

另一個實施例為一種移動玻璃基板中的鹼金屬離子以形成具有增強鹼金屬層的玻璃基板之方法,該方法包含以下步驟:提供玻璃基板,該玻璃基板包含鹼金屬離子、鹼土金屬離子或上述物質之組合,且該玻璃基板具有至少二相對表面和介於該等表面間的厚度;及對該基板之該二表面施加電壓,使得在至少一表面附近的至少一部分該鹼金屬離子、鹼土金屬離子或上述物質之組合移動離開負電壓且前往在相對表面上的正電壓,以形成具有該增強鹼金屬層的該玻璃基板。 Another embodiment is a method of moving an alkali metal ion in a glass substrate to form a glass substrate having a reinforced alkali metal layer, the method comprising the steps of: providing a glass substrate comprising an alkali metal ion, an alkaline earth metal ion, or the like a combination of materials, and the glass substrate has at least two opposing surfaces and a thickness interposed between the surfaces; and applying a voltage to the two surfaces of the substrate such that at least a portion of the alkali metal ions, alkaline earth metals in the vicinity of at least one surface The ions or a combination of the above species move away from the negative voltage and go to a positive voltage on the opposite surface to form the glass substrate with the reinforcing alkali metal layer.

另一個實施例為一種包含玻璃基板的物品,該玻璃基板具有耗乏的鹼金屬離子、鹼土金屬離子或上述物質之組合的第一區域;及具有濃度大致均勻的鹼金屬離子、鹼土金屬離子或上述物質之組合的第二區域,該第二區域與該第一區域實體接觸,其中該玻璃基板不具有有濃度增加的鹼金屬離子、鹼土金屬離子或上述物質之組合的第三區域。 Another embodiment is an article comprising a glass substrate having a first region of depleted alkali metal ions, alkaline earth metal ions or a combination thereof; and an alkali metal ion, an alkaline earth metal ion having a substantially uniform concentration or A second region of the combination of the foregoing materials, the second region being in physical contact with the first region, wherein the glass substrate does not have a third region having an increased concentration of alkali metal ions, alkaline earth metal ions, or a combination thereof.

應瞭解到,前面的一般性描述和以下的實施方式皆僅為本發明之例示,並且意圖提供概述或架構來瞭解如本發明所主張的本發明之本質與特性。 It is to be understood that the foregoing general description and the following embodiments are merely illustrative of the embodiments of the invention

附圖被涵括以提供對本發明的進一步瞭解,而且將 附圖併入,並使附圖構成本說明書之一部分。圖式說明本發明之一或多個實施例,並且圖式與描述一起用以說明本發明之原則與操作。 The accompanying drawings are included to provide a further understanding of the invention and The figures are incorporated in and constitute a part of this specification. The drawings illustrate one or more embodiments of the invention, and are in the

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88‧‧‧導電材料 88‧‧‧Electrical materials

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92‧‧‧主動光電媒體 92‧‧‧Active Photoelectric Media

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201‧‧‧特徵 201‧‧‧Characteristics

從以下實施方式單獨或與附圖一起可以瞭解本發明。 The invention may be understood from the following embodiments, either alone or in conjunction with the drawings.

1圖為圖示將玻璃基板放入含鉀的鹽浴時鈉擴散出玻璃基板的最終結果圖。 FIG sodium diffusion final result of the first glass substrate 1 graph illustrating the glass substrate into the salt bath of potassium.

2圖為依據一些實施例的方法之示意圖。 Figure 2 is a schematic illustration of a method in accordance with some embodiments.

3圖為圖示進行離子交換製程時從玻璃傳送的預測鈉總量(單位為ng)作為時間與溫度的涵數之圖。 Figure 3 is a graph showing the total amount of predicted sodium (in ng) delivered from the glass as the time and temperature are plotted during the ion exchange process.

4A圖、第4B圖及第4C圖為依據一些實施例的例示性方法步驟之示意圖。 4A , 4B, and 4C are schematic diagrams of illustrative method steps in accordance with some embodiments.

5圖為SLG型玻璃之電流作為時間的函數之圖。 Figure 5 is a plot of the current of the SLG-type glass as a function of time.

6圖為藉由二次離子質譜法(SIMS)在SLG玻璃的非錫側上取得的鈉分佈圖。 Figure 6 is a graph of sodium distribution taken on the non-tin side of SLG glass by secondary ion mass spectrometry (SIMS).

7圖為藉由SIMS量測實例1的鎘銦鎵硒化物和鉬膜的鈉分佈圖。 7 photo shows measured by SIMS example cadmium indium gallium selenide and sodium profile molybdenum film 1.

8圖為對實例1和實例2施加50伏特的電場之電流表現圖。 Figure 8 is a graph showing the current performance of an electric field of 50 volts applied to Examples 1 and 2.

9圖為藉由SIMS量測的實例2之鈉分佈圖。 Figure 9 is a graph of the sodium distribution of Example 2 as measured by SIMS.

10圖為藉由SIMS量測實例2的鎘銦鎵硒化物和鉬膜的鉀分佈圖。 Figure 10 is a graph showing the potassium distribution of cadmium indium gallium selenide and molybdenum film of Example 2 by SIMS.

11圖為藉由SIMS量測的實例3之鈉分佈圖。 Figure 11 is a graph of the sodium distribution of Example 3 as measured by SIMS.

12圖為藉由SIMS量測的實例4之鈉分佈圖。 Figure 12 is a graph of the sodium distribution of Example 4 as measured by SIMS.

13圖為藉由SIMS量測的實例5之鈉分佈圖。 Figure 13 is a graph of the sodium distribution of Example 5 as measured by SIMS.

14圖圖示依據一個實施例的光電裝置之特徵。 Figure 14 illustrates features of an optoelectronic device in accordance with one embodiment.

15圖圖示依據一些實施例的玻璃基板之特徵。 Figure 15 illustrates features of a glass substrate in accordance with some embodiments.

現將詳述本發明之各種實施例。 Various embodiments of the invention will now be described in detail.

視光電電池的結構而定,本文中使用的術語「基板」可以用來描述基板或上板。例如,若組裝到光電電池時在光電電池的光入射側上,則基板是一個上板。上板可以保護光電材料不受撞擊和環境降解,同時允許適當波長的太陽光譜傳輸。另外,可以將多個光電電池配置成光電模組。光電裝置可以描述電池、模組任一者或兩者。 Depending on the structure of the photovoltaic cell, the term "substrate" as used herein may be used to describe a substrate or an upper plate. For example, if assembled to a photovoltaic cell on the light incident side of the photovoltaic cell, the substrate is an upper plate. The upper plate protects the photovoltaic material from impact and environmental degradation while allowing the proper wavelength of solar spectrum transmission. In addition, a plurality of photovoltaic cells can be configured as a photovoltaic module. The optoelectronic device can describe either or both of the battery and the module.

本文中使用的術語「相鄰」可以被定義為在鄰近處。相鄰的結構可能會或可能不會彼此有實體接觸。相鄰的結構中間可以設置有其他的層及/或結構。 The term "adjacent" as used herein may be defined as being in the vicinity. Adjacent structures may or may not be in physical contact with each other. Other layers and/or structures may be provided in the middle of adjacent structures.

一個實施例為一種移動玻璃基板中的鹼金屬離子以形成具有固有鹼金屬阻障層的玻璃基板之方法,該方法包含以下步驟:提供玻璃基板,該玻璃基板包含鹼金屬離子、鹼土金屬離子或上述物質之組合,且該玻璃基板具有至少二相對表面和介於該等表面間的厚度;及對該基板之該二表面施加電壓,使得在至少一表面中至 少一部分的該鹼金屬離子、鹼土金屬離子或上述物質之組合移動深入該厚度,以形成該具有該固有鹼金屬阻障層的玻璃基板。 One embodiment is a method of moving an alkali metal ion in a glass substrate to form a glass substrate having an intrinsic alkali metal barrier layer, the method comprising the steps of: providing a glass substrate comprising an alkali metal ion, an alkaline earth metal ion, or a combination of the foregoing, and the glass substrate has at least two opposing surfaces and a thickness interposed between the surfaces; and applying a voltage to the two surfaces of the substrate such that in at least one surface A small portion of the alkali metal ion, alkaline earth metal ion or a combination of the above substances moves deeper into the thickness to form the glass substrate having the intrinsic alkali metal barrier layer.

另一個實施例為一種移動玻璃基板中的鹼金屬離子以形成具有增強鹼金屬層的玻璃基板之方法,該方法包含以下步驟:提供玻璃基板,該玻璃基板包含鹼金屬離子、鹼土金屬離子或上述物質之組合,且該玻璃基板具有至少二相對表面和介於該等表面間的厚度;及對該基板之該二表面施加電壓,使得在至少一表面附近的至少一部分該鹼金屬離子、鹼土金屬離子或上述物質之組合移動離開負電壓且前往在相對表面上的正電壓,以形成具有該增強鹼金屬層的該玻璃基板。 Another embodiment is a method of moving an alkali metal ion in a glass substrate to form a glass substrate having a reinforced alkali metal layer, the method comprising the steps of: providing a glass substrate comprising an alkali metal ion, an alkaline earth metal ion, or the like a combination of materials, and the glass substrate has at least two opposing surfaces and a thickness interposed between the surfaces; and applying a voltage to the two surfaces of the substrate such that at least a portion of the alkali metal ions, alkaline earth metals in the vicinity of at least one surface The ions or a combination of the above species move away from the negative voltage and go to a positive voltage on the opposite surface to form the glass substrate with the reinforcing alkali metal layer.

依據揭示的方法製作的該玻璃基板可以具有耗乏的鹼金屬離子、鹼土金屬離子或上述物質之組合的第一區域;及具有濃度大致均勻的鹼金屬離子、鹼土金屬離子或上述物質之組合的第二區域,該第二區域與該第一區域實體接觸,其中該玻璃基板不具有有濃度增加的鹼金屬離子、鹼土金屬離子或上述物質之組合的第三區域。 The glass substrate produced according to the disclosed method may have a first region of a depleted alkali metal ion, an alkaline earth metal ion or a combination thereof; and an alkali metal ion, an alkaline earth metal ion or a combination thereof a second region in contact with the first region entity, wherein the glass substrate does not have a third region having an increased concentration of alkali metal ions, alkaline earth metal ions, or a combination thereof.

另一個實施例為一種物品,該物品包含玻璃基板,該玻璃基板具有耗乏的鹼金屬離子、鹼土金屬離子或上述物質之組合的第一區域;及具有濃度大致均勻的鹼金屬離子、鹼土金屬離子或上述物質之組合的第二區域,該第二區域與該第一區域實體接觸,其中該玻璃基板不具有有濃度增加的 鹼金屬離子、鹼土金屬離子或上述物質之組合的第三區域。 Another embodiment is an article comprising a glass substrate having a first region of depleted alkali metal ions, alkaline earth metal ions or a combination thereof; and an alkali metal ion or alkaline earth metal having a substantially uniform concentration a second region of ions or a combination of the foregoing, the second region being in physical contact with the first region, wherein the glass substrate does not have an increased concentration A third region of an alkali metal ion, an alkaline earth metal ion, or a combination thereof.

正和負電壓皆可用於控制玻璃基板中發生的鹼金屬遷移之量,及之後從該玻璃基板進入例如鎘銦鎵硒化物光電電池的鹼金屬量。在一些實施例中,將位準在+10 kv和-100 kv範圍中的電壓施加於具有或不具額外層的玻璃基板,例如將位準在-0.5伏特至-100 kv範圍中的電壓施加於具有或不具額外層的玻璃基板,例如將位準在-0.5伏特至-10 kv範圍中的電壓施加於具有或不具額外層的玻璃基板,例如將位準在從-0.5伏特至-1 kv範圍中的電壓施加於具有或不具額外層的玻璃基板,或例如將位準在-5伏特至-100 kv範圍中的電壓施加於具有或不具額外層的玻璃基板,例如將位準在從-5伏特至-10 kv範圍中的電壓施加於具有或不具額外層的玻璃基板,例如將位準在-5伏特至-1 kv範圍中的電壓施加於具有或不具額外層的玻璃基板。 Both positive and negative voltages can be used to control the amount of alkali metal migration that occurs in the glass substrate, and then enter the amount of alkali metal from the glass substrate, for example, a cadmium indium gallium selenide photovoltaic cell. In some embodiments, voltages in the range of +10 kv and -100 kv are applied to a glass substrate with or without additional layers, for example, a voltage in the range of -0.5 volts to -100 kv is applied to Glass substrates with or without additional layers, for example, applying a voltage in the range of -0.5 volts to -10 kV to a glass substrate with or without additional layers, for example at a level ranging from -0.5 volts to -1 kv The voltage in is applied to a glass substrate with or without additional layers, or for example a voltage in the range of -5 volts to -100 kv is applied to a glass substrate with or without additional layers, for example at a level from -5 A voltage in the range of volts to -10 kv is applied to a glass substrate with or without additional layers, for example a voltage in the range of -5 volts to -1 kv is applied to a glass substrate with or without additional layers.

在一些實施例中,施加位準為1 kv或更低的電壓於具有或不具額外層的玻璃基板,例如施加位準為750伏特或更低的電壓於具有或不具額外層的玻璃基板,例如施加位準為700伏特或更低的電壓於具有或不具額外層的玻璃基板,例如施加位準為650伏特或更低的電壓於具有或不具額外層的玻璃基板,例如施加位準為600伏特或更低的電壓於具有或不具額外層的玻璃基板,例如施加位準為550伏特或更低的電壓於具有或不具額外層的玻璃基板,例如施加位準為500伏特或更低的電壓於具有或不具額外層的玻璃基板,例如施加位準為450伏特或更低的電壓於具有或不具額外層的玻璃 基板,例如施加位準為400伏特或更低的電壓於具有或不具額外層的玻璃基板,例如施加位準為350伏特或更低的電壓於具有或不具額外層的玻璃基板,例如施加位準為300伏特或更低的電壓於具有或不具額外層的玻璃基板,例如施加位準為250伏特或更低的電壓於具有或不具額外層的玻璃基板。 In some embodiments, a voltage of 1 kV or less is applied to a glass substrate with or without additional layers, such as applying a voltage of 750 volts or less to a glass substrate with or without additional layers, such as Applying a voltage of 700 volts or less to a glass substrate with or without additional layers, for example applying a voltage of 650 volts or less to a glass substrate with or without additional layers, for example a level of 600 volts applied. Or lower voltage on a glass substrate with or without additional layers, for example applying a voltage of 550 volts or less to a glass substrate with or without additional layers, for example applying a voltage of 500 volts or less. Glass substrate with or without additional layers, for example, applying a voltage of 450 volts or less to the glass with or without additional layers Substrate, for example, applying a voltage of 400 volts or less to a glass substrate with or without additional layers, for example applying a voltage of 350 volts or less to a glass substrate with or without additional layers, such as applying a level A voltage of 300 volts or less is applied to a glass substrate with or without additional layers, for example, a voltage of 250 volts or less is applied to a glass substrate with or without additional layers.

在一些實施例中,施加位準為-5伏特至1 kv的電壓於具有或不具額外層的玻璃基板,例如施加位準為從-5伏特至750伏特的電壓於具有或不具額外層的玻璃基板,例如施加位準為從-5伏特至700伏特的電壓於具有或不具額外層的玻璃基板,例如施加位準為從-5伏特至650伏特的電壓於具有或不具額外層的玻璃基板,例如施加位準為從-5伏特至600伏特的電壓於具有或不具額外層的玻璃基板,例如施加位準為從-5伏特至550伏特的電壓於具有或不具額外層的玻璃基板,例如施加位準為從-5伏特至500伏特的電壓於具有或不具額外層的玻璃基板,例如施加位準為從-5伏特至450伏特的電壓於具有或不具額外層的玻璃基板,例如施加位準為從-5伏特至400伏特的電壓於具有或不具額外層的玻璃基板,例如施加位準為從-5伏特至350伏特的電壓於具有或不具額外層的玻璃基板,例如施加位準為從-5伏特至300伏特的電壓於具有或不具額外層的玻璃基板,例如施加位準為從-5伏特至250伏特的電壓於具有或不具額外層的玻璃基板。 In some embodiments, a voltage of -5 volts to 1 kV is applied to the glass substrate with or without additional layers, such as applying a voltage from -5 volts to 750 volts to the glass with or without additional layers. Substrate, for example, applying a voltage from -5 volts to 700 volts to a glass substrate with or without additional layers, such as applying a voltage from -5 volts to 650 volts to a glass substrate with or without additional layers, For example, applying a voltage from -5 volts to 600 volts to a glass substrate with or without additional layers, for example applying a voltage from -5 volts to 550 volts to a glass substrate with or without additional layers, such as application The level is from -5 volts to 500 volts on a glass substrate with or without additional layers, for example, applying a voltage from -5 volts to 450 volts to a glass substrate with or without additional layers, such as applying a level For a voltage from -5 volts to 400 volts on a glass substrate with or without additional layers, for example, applying a voltage from -5 volts to 350 volts to a glass substrate with or without additional layers, such as Voltage level from -5 volts to 300 volts to the glass substrate with or without additional layers, such as the level applied to the glass substrate with or without an additional layer having a voltage from -5 volts to 250 volts.

在一些實施例中,施加位準為1伏特至1000伏特的電壓,例如施加位準為1伏特至950伏特的電壓,例如施加位準為1伏特至900伏特的電壓,例如施加位準為1伏特 至900伏特的電壓,例如施加位準為1伏特至850伏特的電壓,例如施加位準為1伏特至800伏特的電壓,例如施加位準為1伏特至750伏特的電壓,例如施加位準為1伏特至700伏特的電壓,例如施加位準為1伏特至650伏特的電壓,例如施加位準為1伏特至600伏特的電壓,例如施加位準為1伏特至550伏特的電壓,例如施加位準為1伏特至500伏特的電壓,例如施加位準為2伏特至500伏特的電壓,例如施加位準為3伏特至500伏特的電壓,例如施加位準為4伏特至500伏特的電壓,例如施加位準為5伏特至500伏特的電壓。 In some embodiments, a voltage of from 1 volt to 1000 volts is applied, such as a voltage from 1 volt to 950 volts, such as a voltage from 1 volt to 900 volts, such as an applied level of 1 volt A voltage of up to 900 volts, for example a voltage of 1 volt to 850 volts, for example a voltage of 1 volt to 800 volts, for example a voltage of 1 volt to 750 volts, for example a applied level A voltage of 1 volt to 700 volts, for example a voltage of 1 volt to 650 volts is applied, for example a voltage of 1 volt to 600 volts is applied, for example a voltage of 1 volt to 550 volts, such as a applied level. A voltage of from 1 volt to 500 volts is applied, for example, a voltage of 2 volts to 500 volts is applied, for example, a voltage of 3 volts to 500 volts is applied, for example, a voltage of 4 volts to 500 volts is applied, for example A voltage of 5 volts to 500 volts is applied.

各種電壓可被施加不同長度的時間。負電壓將有助於傳送鹼金屬,而正電壓可以關閉或減緩鹼金屬遷移的速率或量。施加電壓的時間可以在1奈秒和數天之間變化。在某溫度範圍中施加的總電流可被用來測定玻璃的離子遷移量。 Various voltages can be applied for different lengths of time. A negative voltage will help to transport the alkali metal, while a positive voltage can turn off or slow the rate or amount of alkali metal migration. The time during which the voltage is applied can vary between 1 nanosecond and several days. The total current applied in a certain temperature range can be used to determine the amount of ion migration of the glass.

可以用數種不同的方式施加電壓,包括:在鎘銦鎵硒化物沉積過程中於鉬膜上施加電壓;在鎘銦鎵硒化物沉積之後但在高溫熱處理過程中於鎘銦鎵硒化物或鉬膜上施加電壓;於鉬膜上施加電壓然後加熱玻璃/鉬膜到超過50℃的溫度;在20℃和400℃之間的溫度下施加電壓於多層膜,以改變電池中的鹼金屬含量;在施加鎘銦鎵硒化物之後但在沉積最終覆蓋層(如CdS及/或ZnO)之前施加電壓;或在已經施加全部的多層塗層之後施加電壓和熱低溫處理。 The voltage can be applied in several different ways, including: applying a voltage to the molybdenum film during the deposition of the cadmium indium gallium selenide; after the deposition of the cadmium indium gallium selenide but during the high temperature heat treatment, the cadmium indium gallium selenide or molybdenum Applying a voltage to the film; applying a voltage to the molybdenum film and then heating the glass/molybdenum film to a temperature exceeding 50 ° C; applying a voltage to the multilayer film at a temperature between 20 ° C and 400 ° C to change the alkali metal content in the battery; A voltage is applied after application of the cadmium indium gallium selenide but prior to deposition of the final cover layer (eg, CdS and/or ZnO); or application of a voltage and thermal low temperature treatment after all of the multilayer coating has been applied.

該方法可以包含施加電壓於素玻璃,該素玻璃在施加鉬膜之前被加熱,以產生富含鹼金屬的表面。作為實例, 在加熱時可將塗覆金、銀、石墨、鉑、鈀、銅、鋁或其他本技術領域中具有通常知識者習知的金屬合金的電極壓製於玻璃表面。 The method can include applying a voltage to the plain glass that is heated prior to applying the molybdenum film to produce an alkali metal-rich surface. As an example, Electrodes coated with gold, silver, graphite, platinum, palladium, copper, aluminum or other metal alloys known to those of ordinary skill in the art may be pressed onto the glass surface upon heating.

習知鹼金屬-矽酸鹽玻璃(像是用於本揭示的玻璃)為離子導體。在室溫玻璃是絕緣體,然而,在升高的溫度下,單價的陽離子變成可在玻璃中移動。當玻璃處於升高的溫度下(T>75℃)、含有高濃度的可移動離子及/或處於電場存在下,鹼金屬離子將會朝向玻璃的一個表面並遠離另一個表面移動而穿過玻璃網絡。例如,具有大量鈉的玻璃(像是市售的碳酸鈉石灰矽酸鹽)在溫度>50℃但<100℃下會自然地在玻璃表面上形成富鈉層。電場存在可提高的鹼金屬遷移後方的驅動力係優於僅使用溫度,並允許測定遷移的方向,例如正鹼金屬離子將會往負偏壓的表面移動並遠離正偏壓的表面。 Conventional alkali metal-tellurate glasses (such as the glasses used in the present disclosure) are ionic conductors. At room temperature the glass is an insulator, however, at elevated temperatures, the monovalent cations become mobile in the glass. When the glass is at an elevated temperature (T > 75 ° C), contains a high concentration of mobile ions and / or is in the presence of an electric field, the alkali metal ions will move toward one surface of the glass and away from the other surface through the glass The internet. For example, glass with a large amount of sodium (such as commercially available soda lime citrate) will naturally form a sodium-rich layer on the glass surface at temperatures > 50 ° C but < 100 ° C. The driving force behind the presence of an enhanced alkali metal migration is superior to the temperature only and allows for the determination of the direction of migration, for example, the alkali metal ions will move toward the negatively biased surface and away from the positively biased surface.

弱電解質理論表示,離子的導電度為移動離子的濃度與導電離子的移動率之積[式1]:σ=n*zeu 式1其中σ為離子導電度,n*為單位體積中移動離子的數量,z為移動離子的電荷,e為電子電荷,及u為離子的移動率。本揭示的一個重點為保持鹼金屬離子的導電度,但降低n*,玻璃主體中單位體積的移動離子數量。鈉究竟為何可提高電池效率仍存在爭議,但鈉的確可以提高電池效率。也許有多種效應。本揭示確認製程可以使用種類廣泛的玻璃。作為實例,具有較少鹼金屬的玻璃可以允許鎘銦鎵硒化物製造在較高的 溫度下。此可藉由產生性能更好的晶體結構或改變晶粒尺寸或晶粒中或晶粒邊界的鈉含量來改良效率。 The theory of weak electrolytes indicates that the conductivity of ions is the product of the concentration of mobile ions and the mobility of conductive ions [Equation 1]: σ = n * zeu Equation 1 where σ is the ionic conductivity and n * is the mobile ion per unit volume The number, z is the charge of the moving ion, e is the electron charge, and u is the mobility of the ion. One of the focuses of the present disclosure is to maintain the conductivity of the alkali metal ions, but to reduce n *, the number of mobile ions per unit volume in the glass body. It is still controversial why sodium can improve battery efficiency, but sodium does improve battery efficiency. There may be multiple effects. This disclosure confirms that a wide variety of glasses can be used in the process. As an example, glass with less alkali metal can allow cadmium indium gallium selenide to be fabricated at higher temperatures. This can be improved by producing a better performing crystal structure or by changing the grain size or the sodium content in the grain or grain boundaries.

為了保持離子在玻璃表面的導電度,我們提出使用電場來將玻璃主體中的鹼金屬吸引到表面,鎘銦鎵硒化物層將會被置於玻璃之該表面上。玻璃中的正鹼金屬離子會被吸引到陰極,可以經由溫度、時間及施加穿過玻璃的電壓強度來操控離子的移動速率,因而允許修改表面的鹼金屬分佈。修改玻璃中的鹼金屬分佈容許在表面有高的移動離子濃度、保持與高鹼金屬含量的玻璃類似的導電度、但將玻璃主體中的鹼金屬保持在低量,因此可獲得高應變點玻璃的技術優勢。 In order to maintain the conductivity of the ions on the glass surface, we propose to use an electric field to attract the alkali metal in the glass body to the surface, and the cadmium indium gallium selenide layer will be placed on the surface of the glass. The alkali metal ions in the glass are attracted to the cathode, and the rate of movement of the ions can be manipulated via temperature, time, and voltage intensity applied across the glass, thus allowing modification of the alkali metal distribution of the surface. Modifying the alkali metal distribution in the glass allows for a high mobile ion concentration on the surface, maintaining a conductivity similar to that of a high alkali metal content glass, but keeping the alkali metal in the glass body low, thus obtaining a high strain point glass Technical advantage.

1圖為圖示將玻璃基板放入含鉀的鹽浴時鈉擴散出玻璃基板的最終結果圖。在此實例中,將含鈉的玻璃基板放在鉀鹽浴中並加熱到600℃持續一段固定長度的時間,例如40分鐘。最終結果為鈉擴散出玻璃基板-線12。第1圖中圖示的鹽浴擴散數據為預測的玻璃中的鈉分佈,其模型係使用與在同一玻璃基板上施加鎘銦鎵硒化物塗層所使用的相同的熱分佈。然而,第1圖圖示,與在鹽浴中進行離子交換的玻璃表面所預期的相比,在鎘銦鎵硒化物膜下方的玻璃表面之實際鈉分佈-線10實際上沒有可偵測的鈉損失。這說明了標準的鎘銦鎵硒化物處理(即未涉及施加電壓或可離子交換物種者)會產生非常少的鈉遷移。 FIG sodium diffusion final result of the first glass substrate 1 graph illustrating the glass substrate into the salt bath of potassium. In this example, the sodium-containing glass substrate is placed in a potassium salt bath and heated to 600 ° C for a fixed length of time, such as 40 minutes. The end result is the diffusion of sodium out of the glass substrate - line 12 . The salt bath diffusion data illustrated in Figure 1 is the predicted sodium distribution in the glass using the same heat profile as used for applying the cadmium indium gallium selenide coating on the same glass substrate. However, Figure 1 shows that the actual sodium distribution - line 10 of the glass surface below the cadmium indium gallium selenide film is virtually undetectable compared to what is expected for the surface of the glass ion exchanged in the salt bath. Sodium loss. This demonstrates that standard cadmium indium gallium selenide treatment (ie, those that do not involve the application of voltage or ion exchange species) produces very little sodium migration.

2圖為依據一些實施例的方法之示意圖。繪示在熱處理過程中電壓正被施加於鉬膜,以控制進入鎘銦鎵硒化物膜的鈉量。在熱處理過程中可將電壓V施加於鉬膜16及玻 璃基板14之至少一個表面。可以藉由施加電壓於鉬膜而控制進入鎘銦鎵硒化物膜的鈉量。 Figure 2 is a schematic illustration of a method in accordance with some embodiments. It is shown that a voltage is being applied to the molybdenum film during the heat treatment to control the amount of sodium entering the cadmium indium gallium selenide film. A voltage V may be applied to at least one surface of the molybdenum film 16 and the glass substrate 14 during the heat treatment. The amount of sodium entering the cadmium indium gallium selenide film can be controlled by applying a voltage to the molybdenum film.

3圖為圖示從玻璃傳送到多層(例如鎘銦鎵硒化物層)的預測鈉總量(單位為ng)作為時間與溫度的涵數之圖。線24、22、20及18分別圖示225℃、250℃、350℃及500℃之溫度曲線。此預測係在500℃和600℃向下外推較低溫的鈉擴散數據。其假設施加電壓可以產生與在鹽浴中類似的擴散速率。事實上,施加更大的電壓可以實際地增強深一層的擴散,而且相對於外推值,實際的擴散值可能大於圖中圖示的那些。有許多的鈉可被從鎘銦鎵硒化物層提取出,甚至是在低於400℃的溫度下。該圖圖示在低溫下摻雜該多層的確可以在合理長度的時間中進行。此處圖示的外推數據指出,可以在1天之內在250℃或更高的溫度下達到1x1019鈉原子/cm3(~95 ng鈉/cm2的電池、2.5 um厚的鎘銦鎵硒化物層)的摻雜水準。預期大部分的鈉會分佈在晶粒邊界。 Figure 3 is a graph showing the predicted total amount of sodium (in ng) from the glass to the multilayer (e.g., cadmium indium gallium selenide layer) as the number of time and temperature. Lines 24, 22, 20, and 18 illustrate temperature profiles of 225 ° C, 250 ° C, 350 ° C, and 500 ° C, respectively. This prediction is to extrapolate lower temperature sodium diffusion data at 500 ° C and 600 ° C. It is assumed that the applied voltage can produce a similar diffusion rate as in a salt bath. In fact, applying a larger voltage can actually enhance the diffusion of the deeper layer, and the actual diffusion value may be larger than those illustrated in the figure with respect to the extrapolated value. There is a lot of sodium that can be extracted from the cadmium indium gallium selenide layer, even at temperatures below 400 °C. The figure shows that doping the multilayer at low temperatures does indeed take place over a reasonable length of time. The extrapolated data shown here indicates that 1 x 10 19 sodium atoms/cm 3 (~95 ng sodium/cm 2 cells, 2.5 um thick cadmium indium gallium) can be achieved at 250 ° C or higher within 1 day. The doping level of the selenide layer). Most of the sodium is expected to be distributed at the grain boundaries.

可以藉由施加正電壓然後不施加電壓或甚至是施加負電壓持續不同長度的時間和溫度來客製化玻璃中的鹼金屬分佈,如第4A圖、第4B圖及第4C圖中示意性繪示的,或是藉由施加含鹼金屬膜或含鹼金屬浴及後續在有或無熱下施加電壓。 The alkali metal distribution in the glass can be customized by applying a positive voltage and then applying no voltage or even applying a negative voltage for different lengths of time, as schematically illustrated in Figures 4A , 4B and 4C . Or by applying an alkali metal containing film or an alkali metal containing bath and subsequently applying a voltage with or without heat.

4A圖、第4B圖及第4C圖為依據一些實施例的例示性方法步驟之示意圖。該方法步驟可用以在玻璃基板之表面上或鄰近處產生增強的鹼金屬層。第4A圖圖示初製成的玻璃在任何處理之前在表面和主體各處具有大致均勻的鈉水 準-線21。第4B圖圖示在例示性步驟1的過程中,使玻璃基板的表面23富含鹼金屬,並且在電壓存在下加熱樣品時主體開始耗乏鹼金屬。第4C圖圖示在例示性步驟2的過程中,在加熱下逆轉偏壓或移除偏壓可驅動鹼金屬進入表面-線25 4A , 4B, and 4C are schematic diagrams of illustrative method steps in accordance with some embodiments. The method steps can be used to create a reinforced alkali metal layer on or adjacent the surface of the glass substrate. Figure 4A illustrates that the as-prepared glass has a substantially uniform sodium level-line 21 throughout the surface and body prior to any treatment. 4B illustrates that during the exemplary step 1, the surface 23 of the glass substrate is enriched with an alkali metal, and the body begins to consume alkali metal when the sample is heated in the presence of a voltage. 4C illustrates that during the exemplary step 2, reversing the bias or removing the bias under heating can drive the alkali metal into the surface-line 25 .

在一個實施例中,如第14圖所圖示,光電裝置之特徵101包含玻璃基板86,玻璃基板86具有依據本文描述的方法製作的固有鹼金屬阻障層或增強鹼金屬層90。該光電裝置可以包含一個以上的玻璃基板,例如作為基板及/或作為上板。在一個實施例中,光電裝置101包含作為基板及/或上板86的玻璃片、與基板相鄰的導電材料88及與導電材料相鄰的主動光電媒體92。在一個實施例中,該主動光電媒體包含鎘銦鎵硒化物層。在一個實施例中,該主動光電媒體包含鎘碲化物(CdTe)層。在一個實施例中,該光電裝置包含功能性層,該功能性層包含銅銦鎵二硒化物或鎘碲化物。在一個實施例中,該光電裝置之該功能性層為銅銦鎵二硒化物。在一個實施例中,該功能性層為鎘碲化物。 In one embodiment, as illustrated in FIG. 14, wherein the optoelectronic device 101 includes a glass substrate 86, a glass substrate 86 has an inherent alkali metal barrier layer produced according to the methods described herein, or an alkali metal reinforcing layer 90. The optoelectronic device may comprise more than one glass substrate, for example as a substrate and/or as an upper plate. In one embodiment, optoelectronic device 101 includes a glass sheet as a substrate and/or upper plate 86 , a conductive material 88 adjacent the substrate, and an active photo-electric medium 92 adjacent the conductive material. In one embodiment, the active photovoltaic medium comprises a cadmium indium gallium selenide layer. In one embodiment, the active photovoltaic medium comprises a cadmium telluride (CdTe) layer. In one embodiment, the optoelectronic device comprises a functional layer comprising copper indium gallium diselenide or cadmium telluride. In one embodiment, the functional layer of the optoelectronic device is copper indium gallium diselide. In one embodiment, the functional layer is a cadmium telluride.

在鎘銦鎵硒化物中,可將鉬背接觸導電層直接沉積於玻璃基板上(與該阻障層相鄰)並介於玻璃基板與該鎘銦鎵硒化物功能性層之間。此鉬膜可以是第14圖中的層88In the cadmium indium gallium selenide, the molybdenum back contact conductive layer may be directly deposited on the glass substrate (adjacent to the barrier layer) and interposed between the glass substrate and the cadmium indium gallium selenide functional layer. This molybdenum film may be layer 88 in Figure 14 .

在一個實施例中,該阻障層與透明導電氧化物(TCO)層相鄰,其中該透明導電氧化物層位於該功能性層和該阻障層之間或與該功能性層和該阻障層相鄰。透明導電氧化物可存在包含鎘碲化物功能性層的光電裝置中。 In one embodiment, the barrier layer is adjacent to a transparent conductive oxide (TCO) layer, wherein the transparent conductive oxide layer is between the functional layer and the barrier layer or with the functional layer and the resistor The barrier is adjacent. The transparent conductive oxide may be present in an optoelectronic device comprising a cadmium telluride functional layer.

在一個實施例中,玻璃基板86之特徵201係圖示於 第15圖中。該玻璃基板可以具有耗乏的鹼金屬離子、鹼土金屬離子或上述物質之組合的第一區域94;及具有濃度大致均勻的鹼金屬離子、鹼土金屬離子或上述物質之組合的第二區域96,第二區域96與該第一區域實體接觸,其中該玻璃基板不具有有濃度增加的鹼金屬離子、鹼土金屬離子或上述物質之組合的第三區域。在施加電壓之前,該第二區域中鹼金屬離子、鹼土金屬離子或上述物質之組合的濃度可以與主體玻璃或初製成的玻璃中發現的相同。 In one embodiment, feature 201 of glass substrate 86 is illustrated in Figure 15 . The glass substrate may have a first region 94 of depleted alkali metal ions, alkaline earth metal ions or a combination thereof; and a second region 96 having a substantially uniform concentration of alkali metal ions, alkaline earth metal ions or a combination thereof. The second region 96 is in physical contact with the first region, wherein the glass substrate does not have a third region having an increased concentration of alkali metal ions, alkaline earth metal ions, or a combination thereof. The concentration of the alkali metal ion, the alkaline earth metal ion or a combination of the above in the second region may be the same as found in the bulk glass or the initially formed glass before the voltage is applied.

在另一個實施例中,該玻璃基板可以進一步包含另一個區域98,區域98具有濃度增加的鹼金屬離子、鹼土金屬離子或上述物質之組合,其中該濃度增加層與該第二區域實體接觸,並且在施加電壓之前該濃度增加層可以具有與主體玻璃或初製成玻璃中發現的相同的濃度。在此實施例中,該第一區域可以不存在。 In another embodiment, the glass substrate may further comprise another region 98, region 98 having an increased concentration of alkali metal ions, alkaline earth metal ion or a combination of the foregoing, wherein the concentration increases physical contact with the second layer region, And the concentration increasing layer may have the same concentration as found in the bulk glass or the initially formed glass before the voltage is applied. In this embodiment, the first area may not be present.

在一個實施例中,該玻璃片為光學透明的。在一個實施例中,作為基板及/或上板的該玻璃片為光學透明的。 In one embodiment, the glass sheet is optically transparent. In one embodiment, the glass sheet as the substrate and/or the upper plate is optically transparent.

依據一些實施例,該玻璃基板具有4.0 mm或更小的厚度,例如該玻璃基板具有3.5 mm或更小的厚度,例如該玻璃基板具有3.2 mm或更小的厚度,例如該玻璃基板具有3.0 mm或更小的厚度,例如該玻璃基板具有2.5 mm或更小的厚度,例如該玻璃基板具有2.0 mm或更小的厚度,例如該玻璃基板具有1.9 mm或更小的厚度,例如該玻璃基板具有1.8 mm或更小的厚度,例如該玻璃基板具有1.5 mm或更小的厚度,例如該玻璃基板具有1.1 mm或更小的厚度,例如該玻璃基板 具有0.5 mm至2.0 mm的厚度,例如該玻璃基板具有0.5 mm至1.1 mm的厚度,例如該玻璃基板具有0.7 mm至1.1 mm的厚度。雖然這些是例示性的厚度,但該玻璃片的厚度可以是任何包括小數位的數值,且在0.1 mm以上和包括4.0 mm的範圍內。 According to some embodiments, the glass substrate has a thickness of 4.0 mm or less, for example the glass substrate has a thickness of 3.5 mm or less, for example the glass substrate has a thickness of 3.2 mm or less, for example the glass substrate has 3.0 mm Or a smaller thickness, for example, the glass substrate has a thickness of 2.5 mm or less, for example, the glass substrate has a thickness of 2.0 mm or less, for example, the glass substrate has a thickness of 1.9 mm or less, for example, the glass substrate has a thickness of 1.8 mm or less, for example, the glass substrate has a thickness of 1.5 mm or less, for example, the glass substrate has a thickness of 1.1 mm or less, such as the glass substrate It has a thickness of 0.5 mm to 2.0 mm, for example, the glass substrate has a thickness of 0.5 mm to 1.1 mm, for example, the glass substrate has a thickness of 0.7 mm to 1.1 mm. Although these are exemplary thicknesses, the thickness of the glass sheet can be any value including decimal places, and is in the range of 0.1 mm or more and 4.0 mm.

本文中描述的實施例可以提供一或多個以下的優點:可以藉由控制電池中的鹼金屬水準或控制鹼金屬存在多層電池中的位置和時間來改良鎘銦鎵硒化物電池的效率。例如,該製程使鈉存在於鎘銦鎵硒化物膜之生長過程中或生長之後。迄今為止,尚未明確地知道效率是否取決於形成鎘銦鎵硒化物電池的過程中鈉存在的時間;在各種組成的玻璃上皆可獲得改良的效率。因此,允許使用更便宜的玻璃或具有較高應變點的玻璃,具有較高應變點的玻璃允許在較高的溫度下進行處理。此可促進處理速度或在獲得的鎘銦鎵硒化物或鉬膜中有較佳的溫度相關微結構;可藉由提高鹼金屬(如鈉和鉀)的擴散速率而促進處理速度;使用電壓將可形成更強大的、可重複的製程,與樣品的先前經歷較不相關,如玻璃的老化效應或對玻璃進行清洗、洗滌、研磨或拋光程序之影響;較低的鹼金屬含量及/或較少的移動鹼金屬含量的玻璃將會改良玻璃在處理之前的上架壽命,因而減少庫存並允許更好的供應鏈;及/或可以在不同的裝置製造製程中修改鹼金屬的含量,以使特定的處理經歷更好地最大化電池效率。一個實例可以是2分鐘的製程對比1小時的製程對比需要非常低水準的鹼金屬的製程。 Embodiments described herein may provide one or more of the following advantages: The efficiency of a cadmium indium gallium selenide battery can be improved by controlling the level of alkali metal in the cell or controlling the position and time in which the alkali metal is present in the multilayer cell. For example, the process allows sodium to be present during or after growth of the cadmium indium gallium selenide film. To date, it has not been clearly known whether efficiency depends on the time during which sodium is formed in the process of forming a cadmium indium gallium selenide battery; improved efficiency can be obtained on glass of various compositions. Thus, it is permissible to use less expensive glass or glass with a higher strain point, and glass with a higher strain point allows processing at higher temperatures. This can promote processing speed or have better temperature-dependent microstructures in the obtained cadmium indium gallium selenide or molybdenum film; the processing speed can be promoted by increasing the diffusion rate of alkali metals such as sodium and potassium; A more robust, repeatable process can be formed that is less relevant to the previous experience of the sample, such as the aging effect of the glass or the cleaning, washing, grinding or polishing process of the glass; lower alkali metal content and/or Less moving alkali metal content glass will improve the shelf life of the glass prior to processing, thereby reducing inventory and allowing for a better supply chain; and/or modifying the alkali metal content in different device manufacturing processes to make specific The processing experience better maximizes battery efficiency. An example would be a 2 minute process versus a 1 hour process versus a very low level alkali metal process.

本揭示優於濺鍍沉積的阻障層之優點在於耗乏層對於玻璃係固有的且係主體玻璃結構的延伸。這減少了由於表面層和主體玻璃之間缺乏尖銳的界面而產生的任何黏附或分層的問題。耗乏的表面層另外的優點在於其顯著地改善了該玻璃表面之化學耐用性並防止或最小化鹼金屬及/或鹼土金屬經過長時間曝露後跑到環境中(尤其是水蒸汽)。此種保護方案將可改良光電模組的電可靠度,並得以在該模組的壽命期間更好地維持光轉化效率。藉由施加電壓來修改玻璃表面也可以提供設計玻璃表面以控制鹼金屬傳送的方法,並移除對主體玻璃組成的限制。這極大地增加了玻璃的組成空間,可以採用該玻璃組成空間來最適化其他的主體玻璃性質,例如熱膨脹係數、應變點、熔化、成型、成本等。 An advantage of the present disclosure over sputter deposited barrier layers is that the depletion layer is inherent to the glass system and extends the bulk of the body glass structure. This reduces the problem of any sticking or delamination due to the lack of a sharp interface between the surface layer and the body glass. An additional advantage of the depleted surface layer is that it significantly improves the chemical durability of the glass surface and prevents or minimizes the alkali metal and/or alkaline earth metal from escaping into the environment (especially water vapor) after prolonged exposure. This protection scheme will improve the electrical reliability of the photovoltaic module and allow for better light conversion efficiency during the life of the module. Modifying the glass surface by applying a voltage can also provide a means of designing the glass surface to control the transfer of the alkali metal and removing the restrictions on the composition of the body glass. This greatly increases the compositional space of the glass, which can be used to optimize other host glass properties such as coefficient of thermal expansion, strain point, melting, forming, cost, and the like.

實例 Instance

實例1:將兩個表面濺鍍金的碳酸鈉-石灰-氧化矽玻璃(SLG)在空氣中加熱20分鐘升溫至400℃,並保持溫度10分鐘。然後施加50 V的直流電壓通過兩個面,且正導線在玻璃的非錫側上。在400℃施加電壓10分鐘後,在30分鐘內將樣品冷卻至100℃並將電壓保持在50伏特。然後移除電壓並使樣品冷卻到室溫。從在此樣品上施加電壓的時間點開始的電流表現係圖示於第5圖的線26。第5圖為SLG型玻璃之電流作為時間的函數之圖。由此數據計算通過樣品的總庫侖流為0.042 C/cm2,然後允許預估將形成的耗乏深度。基於玻璃的組成,假設鈉分佈為方形,預估耗乏深度為388 nm, 圖示為線26下方的區域28。線26上的點30表示玻璃開始冷卻的點。 Example 1: Two surface-sputtered gold carbonate-lime-yttria glass (SLG) were heated in air for 20 minutes to 400 ° C and held at a temperature of 10 minutes. A 50 V DC voltage is then applied across the two faces and the positive wire is on the non-tin side of the glass. After applying a voltage for 10 minutes at 400 ° C, the sample was cooled to 100 ° C in 30 minutes and the voltage was maintained at 50 volts. The voltage was then removed and the sample was allowed to cool to room temperature. The current representation from the point in time at which the voltage is applied to the sample is shown in line 26 of Figure 5 . Figure 5 is a plot of the current of the SLG-type glass as a function of time. From this data, the total Coulomb flow through the sample was calculated to be 0.042 C/cm 2 and then allowed to predict the depth of depletion that would be formed. Based on the composition of the glass, assuming that the sodium distribution is square, the estimated depletion depth is 388 nm, which is shown as the area 28 below line 26 . Point 30 on line 26 represents the point at which the glass begins to cool.

以第6圖中圖示的這些量測取得玻璃中的SIMS鈉分佈。第6圖為藉由二次離子質譜法(SIMS)在SLG玻璃的非錫側上取得的鈉分佈圖。線32圖示玻璃之斷裂面上的鈉分佈,線34圖示經電壓處理後正偏壓玻璃表面上的鈉分佈,及線35圖示經電壓處理後正偏壓玻璃表面上的氫分佈。產生了125 nm的耗乏深度,然後鈉逐漸增加回到主體水準。 The SIMS sodium distribution in the glass was taken from these measurements as illustrated in Figure 6 . Figure 6 is a graph of sodium distribution taken on the non-tin side of SLG glass by secondary ion mass spectrometry (SIMS). Line 32 illustrates the distribution of sodium on the fracture surface of the glass, line 34 illustrates the distribution of sodium on the surface of the positively biased glass after voltage treatment, and line 35 illustrates the distribution of hydrogen on the surface of the positively biased glass after voltage treatment. A depletion depth of 125 nm is produced, and then the sodium gradually increases back to the subject level.

將金從類似的樣品移除。然後洗滌樣品,將鉬濺鍍塗覆於耗乏的表面上,接著共蒸鍍沉積鎘銦鎵硒化物於鉬的頂部。然後對薄膜進行SIMS量測,結果圖示於第7圖。第7圖為藉由SIMS量測實例1的鎘銦鎵硒化物和鉬膜中的鈉分佈圖。與非電壓處理的SLG玻璃標準片之線42比較,數據顯示SLG玻璃表面中電壓耗乏的鈉-線44已經在鉬(線36)和鎘銦鎵硒化物膜中產生降低水準的鈉。線38表示鎘銦鎵硒化物膜中的銦(In),且線40表示來自玻璃表面的氧。 Remove gold from a similar sample. The sample is then washed, and molybdenum is sputter coated onto the depleted surface, followed by co-evaporation deposition of cadmium indium gallium selenide on top of the molybdenum. The film was then subjected to SIMS measurements and the results are shown in Figure 7 . The picture shows a seventh example of measurement by SIMS profile sodium cadmium indium gallium selenide and a molybdenum film 1 in. Compared to the line 42 of the non-voltage treated SLG glass standard sheet, the data shows that the voltage depleted sodium-line 44 in the SLG glass surface has produced reduced levels of sodium in the molybdenum (line 36 ) and cadmium indium gallium selenide films. Line 38 represents indium (In) in the cadmium indium gallium selenide film, and line 40 represents oxygen from the glass surface.

實例2:將無鈉、富含鉀且兩個表面濺鍍金的矽酸鹽玻璃在空氣中加熱20分鐘升溫到400℃並保持溫度10分鐘。然後施加50 V的直流電壓通過兩個面。在400℃施加電壓10分鐘後,在30分鐘內將樣品冷卻至100℃並將電壓保持在50伏特。然後移除電壓並使樣品冷卻到室溫。從在此樣品上施加電壓的時間點開始的電流表現係圖示於第8圖。第8圖為對實例1和實例2施加50伏特的電場之電流表現圖,分別為線4648。由此數據計算通過樣品的總庫侖流為0.071 cm2,然後得以預估將形成的耗乏深度。基於玻璃的組成,假設鈉分佈為方形,預估耗乏深度為388 nm,圖示為線46下方的區域50。基於玻璃的組成,假設鉀分佈為方形,預估耗乏深度為733 nm,圖示線48下方的區域52。以這些量測取得玻璃中的SIMS鉀分佈並圖示於第9圖。線54圖示鉀斷面,且線56圖示正電壓側上的鉀分佈。產生了600 nm的耗乏深度,然後鉀逐漸增加回到主體水準。 Example 2: Sodium-free, potassium-rich and two surface sputtered gold tellurite glasses were heated in air for 20 minutes to 400 ° C and held at a temperature of 10 minutes. A 50 V DC voltage is then applied across both faces. After applying a voltage for 10 minutes at 400 ° C, the sample was cooled to 100 ° C in 30 minutes and the voltage was maintained at 50 volts. The voltage was then removed and the sample was allowed to cool to room temperature. The current expression from the point in time at which the voltage is applied to the sample is shown in Fig. 8 . Figure 8 is a graph showing the currents of an electric field of 50 volts applied to Examples 1 and 2, lines 46 and 48 , respectively. From this data, the total Coulomb flow through the sample was calculated to be 0.071 cm 2 , and then the depletion depth that would be formed was estimated. Based on the composition of the glass, assuming that the sodium distribution is square, the estimated depletion depth is 388 nm, which is shown as the area 50 below line 46 . Based on the composition of the glass, assuming that the potassium distribution is square, the estimated depletion depth is 733 nm, and the area 52 below the line 48 is shown. The SIMS potassium distribution in the glass was obtained by these measurements and is shown in Fig. 9 . Line 54 illustrates the potassium cross section and line 56 illustrates the potassium distribution on the positive voltage side. A depletion of 600 nm is produced, and then potassium gradually increases back to the main level.

將金從類似的樣品中移除,然後洗滌樣品並將鉬濺鍍塗覆於耗乏的表面上,接著共蒸鍍沉積鎘銦鎵硒化物於鉬的頂部。之後對薄膜進行SIMS量測,結果圖示於第10圖。第10圖為藉由SIMS量測實例2的鎘銦鎵硒化物和鉬膜的鉀分佈圖。與未處理的玻璃標準片之線64比較,數據顯示玻璃表面中電壓耗乏的鉀-線60已經在鉬(線58)和鎘銦鎵硒化物膜(In線66,O線62)中產生水準明顯降低的鉀。 The gold was removed from a similar sample, then the sample was washed and the molybdenum was sputter coated onto the depleted surface, followed by co-evaporation of the deposited cadmium indium gallium selenide on top of the molybdenum. The film was then subjected to SIMS measurement and the results are shown in Fig. 10 . Figure 10 is a graph showing the potassium distribution of cadmium indium gallium selenide and molybdenum film of Example 2 by SIMS. Compared to the untreated glass standard sheet 64 , the data shows that the voltage-depleted potassium-line 60 in the glass surface has been produced in the molybdenum (line 58 ) and cadmium indium gallium selenide films (In line 66 , O line 62 ). The level of potassium is significantly reduced.

實例3:將兩個表面濺鍍金的碳酸鈉-石灰-氧化矽玻璃(SLG)在空氣中加熱1.5小時升溫至425℃,並保持溫度10分鐘。然後施加25 V的直流電壓通過兩個面。在425℃施加電壓10分鐘後,關閉電壓並在8小時內將樣品冷卻至100℃且未施加電壓。據信施加電壓可將鈉拉到(-)電極區域介於金和玻璃之間的表面。預期緩慢冷卻可允許鈉擴散回到玻璃內,以豐富玻璃的表面。 Example 3: Two surface-sputtered gold carbonate-lime-yttria glass (SLG) were heated in air for 1.5 hours to 425 ° C and held at a temperature of 10 minutes. A 25 V DC voltage is then applied across both faces. After applying a voltage for 10 minutes at 425 ° C, the voltage was turned off and the sample was cooled to 100 ° C in 8 hours and no voltage was applied. It is believed that applying a voltage pulls sodium to the surface of the (-) electrode region between gold and glass. Slow cooling is expected to allow sodium to diffuse back into the glass to enrich the surface of the glass.

然後在玻璃樣品上、玻璃的(+)和(-)導線兩側皆進行SIMS,分別為線7268,將結果及未處理的玻璃片之結果-線70圖示於第11圖。玻璃的正導線側仍為鈉耗乏的, 而玻璃的(-)導線側已經變為富含鈉。 SIMS is then applied to both sides of the glass sample, the (+) and (-) wires of the glass, lines 72 and 68 , respectively, and the results and the results of the untreated glass piece - line 70 are shown in Figure 11 . The positive side of the glass is still sodium depleted, while the (-) side of the glass has become rich in sodium.

實例4:將兩個表面濺鍍金、富含鈉的氧化矽玻璃在空氣中加熱1.5小時升溫至425℃,並保持溫度10分鐘,然後施加25 V的直流電壓通過兩個面。在425℃施加電壓10分鐘後,關閉電壓並在10分鐘內將樣品快速冷卻至100℃且未施加電壓。發現施加電壓可將鈉拉到(-)電極區域介於金和玻璃之間的表面。玻璃本身在(-)電極側中的鈉顯示具有與主體玻璃在靠近表面區域處大約相等的鈉水準。玻璃的正電極側具有的鈉耗乏區域到達約200 nm的深度。 Example 4: Two surface-sputtered, sodium-rich yttria glass were heated in air for 1.5 hours to 425 ° C and held at a temperature of 10 minutes, and then a DC voltage of 25 V was applied across both faces. After applying a voltage for 10 minutes at 425 ° C, the voltage was turned off and the sample was rapidly cooled to 100 ° C in 10 minutes and no voltage was applied. It was found that the applied voltage could pull sodium to the surface of the (-) electrode region between gold and glass. The sodium of the glass itself in the (-) electrode side is shown to have approximately the same sodium level as the body glass near the surface area. The sodium-depleted region on the positive electrode side of the glass reaches a depth of about 200 nm.

12圖為藉由SIMS量測實例4之鈉分佈圖。然後在玻璃樣品上、玻璃的(+)和(-)導線兩側皆進行SIMS,分別為線7874,將結果及未處理的玻璃片之結果線76圖示於第12圖。玻璃的正導線側為鈉耗乏的。 Figure 12 is a graph showing the sodium distribution of Example 4 by SIMS. SIMS is then applied to both sides of the glass sample, the (+) and (-) wires of the glass, lines 78 and 74 , respectively, and the resulting line 76 of the untreated glass is shown in Figure 12 . The positive side of the glass is sodium depleted.

實例5:將兩個表面濺鍍金、富含鈉的氧化矽玻璃在空氣中加熱1.5小時升溫至425℃,並保持溫度10分鐘,然後施加5 V的直流電壓通過兩個面。在425℃施加電壓10分鐘後,關閉電壓並在10分鐘內將樣品快速冷卻至100℃且未施加電壓。發現施加電壓可將鈉拉到(-)電極區域介於金和玻璃之間的表面。玻璃本身在(-)電極側中的鈉顯示具有與主體玻璃在靠近表面區域處大約相等的鈉水準。玻璃的正電極側具有的鈉耗乏區域到達約100 nm的深度。 Example 5: Two surface-sputtered gold-rich, sodium-rich yttria glass were heated in air for 1.5 hours to 425 ° C and held at a temperature of 10 minutes, and then a 5 V DC voltage was applied across both faces. After applying a voltage for 10 minutes at 425 ° C, the voltage was turned off and the sample was rapidly cooled to 100 ° C in 10 minutes and no voltage was applied. It was found that the applied voltage could pull sodium to the surface of the (-) electrode region between gold and glass. The sodium of the glass itself in the (-) electrode side is shown to have approximately the same sodium level as the body glass near the surface area. The sodium-depleted region on the positive electrode side of the glass reaches a depth of about 100 nm.

13圖為藉由SIMS量測實例5之鈉分佈圖。之後在玻璃樣品上、玻璃的(+)和(-)導線兩側皆進行SIMS,分別為線8480,將結果及未處理的玻璃片之結果-線82圖 示於第12圖。玻璃的正導線側為鈉耗乏的。 Figure 13 is a graph showing the sodium distribution of Example 5 by SIMS. SIMS is then applied to both sides of the glass sample, the (+) and (-) wires of the glass, lines 84 and 80 , respectively, and the results and the results of the untreated glass piece - line 82 are shown in Fig. 12. The positive side of the glass is sodium depleted.

對於本技術領域中具有通常知識者而言,在不偏離本發明的精神和範疇下對本發明做出的各種修改和變化都將是顯而易見的。因此,只要本發明之各種修改和變化落入所附申請專利範圍及其均等物之範疇內,則意圖使本發明涵蓋本發明的該等修改和變化。 Various modifications and alterations of the present invention will be apparent to those skilled in the art without departing from the scope of the invention. Therefore, it is intended that the present invention cover the modifications and variations of the invention

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Claims (23)

一種移動一玻璃基板中的鹼金屬離子以形成一具有一固有鹼金屬阻障層的玻璃基板之方法,該方法包含以下步驟:提供一玻璃基板,該玻璃基板包含鹼金屬離子、鹼土金屬離子或上述物質之組合,且該玻璃基板具有至少二相對表面和一介於該等表面間的厚度;以及對該基板之該二表面施加電壓,使得在至少一表面中至少一部分的該鹼金屬離子、鹼土金屬離子或上述物質之組合移動深入該厚度,以形成具有該固有鹼金屬阻障層的該玻璃基板。 A method for moving an alkali metal ion in a glass substrate to form a glass substrate having an intrinsic alkali metal barrier layer, the method comprising the steps of: providing a glass substrate comprising an alkali metal ion, an alkaline earth metal ion or a combination of the above materials, and the glass substrate has at least two opposing surfaces and a thickness interposed between the surfaces; and applying a voltage to the two surfaces of the substrate such that at least a portion of the alkali metal ions, alkaline earth in at least one surface The metal ions or a combination of the above substances moves deeper into the thickness to form the glass substrate having the intrinsic alkali metal barrier layer. 如請求項1所述之方法,進一步包含在該施加之前、在該施加過程中或在該施加之前及在該施加過程中皆加熱該玻璃基板。 The method of claim 1, further comprising heating the glass substrate prior to the applying, during the applying, or prior to the applying, and during the applying. 如請求項2所述之方法,其中該加熱包含在一溫度下加熱,該溫度係在20℃至600℃的範圍中。 The method of claim 2, wherein the heating comprises heating at a temperature in the range of 20 ° C to 600 ° C. 如請求項1所述之方法,其中該施加包含在鎘銦鎵硒化物沉積過程中於一鉬膜上施加電壓。 The method of claim 1, wherein the applying comprises applying a voltage to a molybdenum film during deposition of the cadmium indium gallium selenide. 如請求項1所述之方法,其中該施加包含在鎘銦鎵硒化物沉積之後於一鎘銦鎵硒化物或一鉬膜上施加電壓。 The method of claim 1, wherein the applying comprises applying a voltage to the cadmium indium gallium selenide or the molybdenum film after the deposition of the cadmium indium gallium selenide. 如請求項5所述之方法,其中該施加包含於該鉬膜上施加電壓,之後加熱該玻璃基板與該鉬膜至50℃或更高的一溫度。 The method of claim 5, wherein the applying comprises applying a voltage to the molybdenum film, and then heating the glass substrate and the molybdenum film to a temperature of 50 ° C or higher. 如請求項1所述之方法,其中該施加包含在加熱該玻璃基板時對該玻璃基板施加電壓。 The method of claim 1, wherein the applying comprises applying a voltage to the glass substrate while heating the glass substrate. 如請求項1所述之方法,其中該固有鹼金屬阻障層從該玻璃基板之至少一表面進入該玻璃基板之主體具有一厚度,該厚度係從3奈米至10微米。 The method of claim 1, wherein the intrinsic alkali metal barrier layer has a thickness from at least one surface of the glass substrate into the body of the glass substrate, the thickness being from 3 nm to 10 μm. 一種物品,包含依據請求項1所製作的該玻璃基板,該玻璃基板具有一固有鹼金屬阻障層。 An article comprising the glass substrate produced according to claim 1, the glass substrate having an intrinsic alkali metal barrier layer. 一種光電裝置,包含依據請求項1所製作的該玻璃基板,該玻璃基板具有一固有鹼金屬阻障層。 An optoelectronic device comprising the glass substrate produced according to claim 1, the glass substrate having an intrinsic alkali metal barrier layer. 如請求項9所述之光電裝置,包含一功能性層,該功能性層包含鄰近該固有鹼金屬阻障層的銅銦鎵二硒化物或鎘碲化物。 The photovoltaic device of claim 9 comprising a functional layer comprising copper indium gallium diselenide or cadmium telluride adjacent to the intrinsic alkali metal barrier layer. 一種移動一玻璃基板中的鹼金屬離子以形成一具有一增強鹼金屬層的玻璃基板之方法,該方法包含以下步驟: 提供一玻璃基板,該玻璃基板包含鹼金屬離子、鹼土金屬離子或上述物質之組合,且該玻璃基板具有至少二相對表面和一介於該等表面間的厚度;及對該基板之該二表面施加電壓,使得在至少一表面附近的至少一部分該鹼金屬離子、鹼土金屬離子或上述物質之組合移動離開一負電壓且前往在一相對表面上的一正電壓,以形成具有該增強鹼金屬層的該玻璃基板。 A method of moving an alkali metal ion in a glass substrate to form a glass substrate having a reinforced alkali metal layer, the method comprising the steps of: Providing a glass substrate comprising an alkali metal ion, an alkaline earth metal ion, or a combination thereof, wherein the glass substrate has at least two opposing surfaces and a thickness interposed between the surfaces; and applying the two surfaces of the substrate The voltage is such that at least a portion of the alkali metal ion, alkaline earth metal ion, or a combination of the foregoing species in the vicinity of at least one surface moves away from a negative voltage and proceeds to a positive voltage on an opposite surface to form a layer having the reinforcing alkali metal layer. The glass substrate. 如請求項12所述之方法,進一步包含在該施加之前、在該施加過程中或在該施加之前及在該施加過程中皆加熱該玻璃基板。 The method of claim 12, further comprising heating the glass substrate prior to the applying, during the applying, or prior to the applying and during the applying. 如請求項13所述之方法,其中該加熱包含在一溫度下加熱,該溫度係在20℃至600℃的範圍中。 The method of claim 13, wherein the heating comprises heating at a temperature in the range of 20 ° C to 600 ° C. 如請求項12所述之方法,其中該施加包含在鎘銦鎵硒化物沉積過程中於一鉬膜上施加電壓。 The method of claim 12, wherein the applying comprises applying a voltage to a molybdenum film during deposition of the cadmium indium gallium selenide. 如請求項12所述之方法,其中該施加包含在鎘銦鎵硒化物沉積之後於一鎘銦鎵硒化物或一鉬膜上施加電壓。 The method of claim 12, wherein the applying comprises applying a voltage to the cadmium indium gallium selenide or the molybdenum film after the deposition of the cadmium indium gallium selenide. 如請求項16所述之方法,其中該施加包含於該鉬膜上施加電壓,之後加熱該玻璃基板與該鉬膜至50℃或更高的一溫度。 The method of claim 16, wherein the applying comprises applying a voltage to the molybdenum film, and then heating the glass substrate and the molybdenum film to a temperature of 50 ° C or higher. 如請求項12所述之方法,其中該施加包含在加熱該玻璃基板時對該玻璃基板施加電壓。 The method of claim 12, wherein the applying comprises applying a voltage to the glass substrate while heating the glass substrate. 如請求項12所述之方法,其中該增強鹼金屬層從該玻璃基板之至少一表面進入該玻璃基板之主體具有一厚度,該厚度係從3奈米至10微米。 The method of claim 12, wherein the reinforcing alkali metal layer has a thickness from at least one surface of the glass substrate into the body of the glass substrate, the thickness being from 3 nm to 10 μm. 一種物品,包含依據請求項12所製作的該玻璃基板,該玻璃基板具有一固有鹼金屬阻障層。 An article comprising the glass substrate produced in accordance with claim 12, the glass substrate having an intrinsic alkali metal barrier layer. 一種光電裝置,包含依據請求項12所製作的該玻璃基板,該玻璃基板具有一增強鹼金屬層。 An optoelectronic device comprising the glass substrate produced in accordance with claim 12, the glass substrate having a reinforced alkali metal layer. 如請求項21所述之光電裝置,包含一功能性層,該功能性層包含鄰近該增強鹼金屬層的銅銦鎵二硒化物或鎘碲化物。 The photovoltaic device of claim 21, comprising a functional layer comprising copper indium gallium diselenide or cadmium telluride adjacent to the enhanced alkali metal layer. 一種物品,包含一玻璃基板,該玻璃基板具有耗乏的鹼金屬離子、鹼土金屬離子或上述物質之組合的一第一區域;及具有濃度大致均勻的鹼金屬離子、鹼土金屬離子或上述物質之組合的一第二區域,該第二區域與該第一區域實體接觸,其中該玻璃基板不具有有一濃度增加的鹼金屬離子、鹼土金屬離子或上述物質之組合的一第三區域。 An article comprising a glass substrate having a first region of a spent alkali metal ion, an alkaline earth metal ion or a combination thereof; and an alkali metal ion, an alkaline earth metal ion or a substance having a substantially uniform concentration A second region of the combination, the second region being in physical contact with the first region, wherein the glass substrate does not have a third region having an increased concentration of alkali metal ions, alkaline earth metal ions, or a combination thereof.
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