TW201327795A - Organic light emitting diode display and manufacturing method thereof - Google Patents

Abstract

An organic light emitting diode (OLED) display comprises: a substrate; a display formed on the substrate and including a common power line and a common electrode; a junction layer provided outside the display on the substrate; and a sealing substrate fixed to the substrate by the junction layer. The sealing substrate includes: a support film; a first metal layer provided on one side of the support film toward the substrate; a plurality of second metal layers provided on the first metal layer and being conductive with the first metal layer; and a third metal layer provided on the first metal layer and being insulated from the first metal layer. The second metal layers supply a first electric signal to the common power line, and the third metal layer supplies a second electric signal to the common electrode. A method of manufacturing such an OLED display is also disclosed.

Description

Organic light emitting diode display and method of manufacturing same

The present invention generally relates to organic light emitting diode (OLED) displays. More particularly, the present invention relates to a sealing substrate for sealing a display and a method of manufacturing the same.

An organic light emitting diode (OLED) display within a display device is flat and emits light by itself.

An organic light emitting diode (OLED) display is a self-luminous display that provides an organic light emitting diode that can emit light by itself to display an image. The function of the display unit includes a plurality of organic light-emitting elements which may reduce the penetration of external moisture and oxygen, so that the technique for sealing the display unit for suppressing the penetration of external oxygen and moisture is very important.

The present invention has been developed to provide an organic light emitting diode (OLED) display for increasing the sealing function of a display.

The present invention also strives to develop a method of manufacturing an organic light emitting diode (OLED) display for low cost fabrication of a sealed substrate.

An exemplary embodiment of the present invention provides an organic light emitting diode (OLED) display including: a substrate; a display formed on the substrate and including a common power line and a common electrode; and a junction layer provided thereon An outer surface of the display on the substrate; and a sealing substrate fixed to the substrate by the bonding layer.

The sealing substrate includes: a support film; a first metal layer provided on a side facing the support film of the substrate; a plurality of second metal layers provided on the first metal layer but with the first metal layer Conducting and supplying a first electrical signal to the common power line; and a third metal layer provided on the first metal layer but insulated from the first metal layer and supplying a second electrical signal to the common electrode.

The first metal layer is the same size as the support film.

The sealing substrate further includes: a plurality of conductive layers formed on the first metal layer and the second metal layer; and an insulating layer formed between the first metal layer and the third metal layer.

The conductive layer has the same thickness as the insulating layer and is formed of a conductive tape or an anisotropic conductive film.

The second metal layer is provided separately from each other along an edge of the sealing substrate, and the third metal layer includes: an intermediate unit facing the display; and a plurality of extenders provided on the edge of the sealing substrate Between two metal layers.

The junction layer is a conductive junction layer and the second metal layer and the extender contact the conductive junction layer.

The conductive junction layer has conductivity in the thickness direction of the substrate and has insulation in a direction other than the thickness direction.

The organic light emitting diode display further includes a plurality of first pads provided outside of the display on the substrate and connected to a common power line.

The first liner contacts the conductive junction layer and is electrically connected to the second metal layer through the conductive junction layer.

The organic light emitting diode display further includes a plurality of second pads provided outside the display on the substrate and connected to the common electrode.

The second liner contacts the conductive junction layer and is electrically connected to the extender through the conductive junction layer.

The common power line includes a first common power line and a second common cross of the power line. The common power line includes a first common power line and a second common power line that cross each other.

The first liner and the second liner are provided on four edges of the substrate.

The first metal layer, the second metal layer, and the third metal layer are formed of a metal foil including copper or aluminum.

The second metal layer and the third metal layer form an oxidation resistant film.

Another embodiment of the present invention provides a method of fabricating an organic light emitting diode (OLED) display, the method comprising the steps of: (a) forming a first metal layer on a support film; and (b) forming a first metal Forming an insulating layer having a plurality of openings on the layer; (c) forming a plurality of conductive layers on the first metal layer exposed through the opening; and (d) forming a plurality of second metal layers on the conductive layer, And forming a third metal layer on the insulating layer to manufacture a sealing substrate.

The support film is flexible and passes through steps (a) through (d) in sequence, which is transmitted in one direction by the first drive roll and the second drive roll.

The method includes the step of applying an adhesive on the support film, unwinding the first metal sheet from the spiral wound roll, and stacking the unrolled first metal sheet on the support film.

After the step (d), the support film and the first metal piece are cut, and the first metal piece becomes the first metal layer.

In step (b), the insulating layer is screen-printed on the first metal layer by using a printer.

In the step (c), the conductive layer is formed to have the same thickness as the insulating layer, and is formed of a conductive tape or an anisotropic conductive film.

Step (d) includes unrolling a second metal sheet from the spiral wound roll to stack the expanded second metal sheet on the insulating layer and the conductive layer, and blanking and forming the second metal sheet to It is divided into a second metal layer and a third metal layer.

The step (d) further includes the step of applying heat and pressure to the second metal layer and the third metal layer using a hot pressing device after cutting and forming the second metal piece.

An organic light emitting diode (OLED) display according to an exemplary embodiment is a large display and increases the brightness uniformity of the screen, and also simplifies the entire structure and manufacturing process by reducing grain on the film (COF) or The number of flexible circuit boards (FPC) and bonding processes. The sealing substrate of an organic light emitting diode (OLED) display is manufactured in accordance with a roll-to-roll continuous process so that it can be mass-produced at low cost.

The invention will be described more fully hereinafter with reference to the accompanying drawings, in which exemplary embodiments of the invention are shown. The described embodiments may be modified in various different ways without departing from the spirit and scope of the invention.

Schema and description are to be regarded as illustrative and not limiting. Throughout the specification, like reference numerals refer to like elements. Moreover, the size and thickness of the components shown in the drawings are selectively determined for better understanding and ease of illustration, and the invention is not limited to the examples shown in the drawings.

It will be appreciated that when an element such as a layer, a film, a region or a substrate is referred to as being "on" another element, it can be presented directly on the other element or the intermediate element. Throughout the specification and claims, when an element is referred to as "coupled" to another element, it can be "directly coupled" to the other element or "electrically coupled" to the other element through the third element.

1 is a cross-sectional view of an organic light emitting diode (OLED) display, in accordance with an exemplary embodiment of the present invention.

Referring to FIG. 1, an organic light emitting diode (OLED) display 100 includes a substrate 10; a display 20 formed on the substrate 10; a conductive junction layer 30 surrounding the display 20; and a sealing substrate 40 by conductive bonding The top layer 30 is fixed to the substrate 10.

Display 20 includes a plurality of pixels, each of which includes an organic light emitting element and a driver circuit. The organic light emitting element includes a pixel electrode, an organic light emitting layer, and a common electrode 22. The drive circuit includes at least two thin film transistors (including switched thin film transistors and thin film transistors) and at least one capacitor.

A gate line, a data line, and a common power line 21 are positioned on each pixel. The gate line transmits the scan signal and the data line transmits the data signal. The common power line 21 applies a common voltage to the driving thin film transistor. The common power line 21 includes a first common power line and a second common power line that are parallel or intersect with the data line.

The detailed description of the display unit 20 will be described later, and FIG. 1 schematically illustrates the display unit 20, which is where the common power supply line 21 and the common electrode 22 are formed.

The substrate 10 is made of transparent glass or transparent plastic, and light emitted from the display 20 is discharged to the outside through the substrate 10. The pad region 101 is provided on the edge of the substrate 10 outside the conductive junction layer 30. A pad electrode connected to various electrodes and wires is provided in the pad region 101 of the configuration display 20, and a chip on film (COF) or a flexible printed circuit board (FPC) is attached to the pad Apply an electrical signal to the pad electrode on the electrode.

The conductive junction layer 30 is formed of an ultraviolet (UV) setting resin or a thermosetting resin including a conductive member. In the state of the thermosetting resin, the conductive junction layer 30 may include an epoxy resin. 1 shows a state in which a conductive junction layer 30 is provided on the outside of the display 20, and an insulating junction layer may be formed on the inside, the outside, or both sides of the conductive junction layer 30.

Inside the conductive junction layer 30, a moisture absorbing filler (not shown) may be provided between the substrate 10 and the sealing substrate 40, and an absorbent (not shown) may be provided between the display 20 and the conductive junction layer 30.

2 is a top plan view of a substrate in an organic light emitting diode (OLED) display as shown in FIG. 1.

Referring to FIGS. 1 and 2, a first pad 51 and a second pad 52 are provided outside the display 20. The first pad 51 is connected to the common power line 21 of the display 20 and the second pad 52 is connected to the common electrode 22 of the display 20. The first pad 51 and the second pad 52 are formed on both the long side and the short side of the substrate 10, and they may be alternately arranged in one direction of the substrate 10. In FIG. 2, the second pad 52 is shown as a dot pattern to distinguish it from the second pad 51.

A first pad 51 (from among the plurality of first pads 51) on the long side of the substrate 10 is connected to the first common power line, and a first pad 51 on the short side of the substrate 10 is connected to the first Two common power lines. The first pad 51 and the second pad 52 shown in Fig. 2 are an example, and their positions and numbers are not limited to this example.

The first pad 51 and the second pad 52 are formed at positions corresponding to the conductive junction layer 30. In this case, the conductive junction layer 30 shows conductivity in the thickness direction of the substrate 10 (with respect to the vertical direction of FIG. 1), and shows no conductivity in other directions. To this end, when a conductive junction layer 30 contacts the first liner 51 and the second liner 52, the first liner 51 and the second liner 52 are not short-circuited to each other.

3 is a top plan view of the inside of the sealing substrate in the organic light emitting diode (OLED) display shown in FIG. 1, and FIG. 4 is a cross section of the sealing substrate taken along the line IV-IV in FIG. view. Figure 1 also shows the form of the line IV-IV cut in Figure 3.

Referring to FIGS. 1 through 4, a sealing substrate 40 is formed to cover other regions of the substrate 10 including the pad region 101. The sealing substrate 40 includes a support film 41, a first metal layer 42, an insulating layer 43, a conductive layer 44, a second metal layer 45, and a third metal layer 46.

The organic light emitting diode (OLED) display 100 uses the first metal layer 42, the conductive layer 44, and the second metal layer 45 to supply a first electrical signal to the common power line 21, and employs a third metal layer 46 to supply a second The electrical signal is to the common electrode 22. To this end, the common power source line 21 and the common electrode 22 are not connected to the COF or FPC attached to the pad region 101, and a corresponding electrical signal is obtained from the sealing substrate 40.

The support film 41 is formed of a polymer resin and is formed to be thicker than the first metal layer 42, the insulating layer 43, the second metal layer 45, and the third metal layer 46. The support film 41 may include a polymer resin having an internal temperature in which an internal temperature is greater than a hardening temperature of the conductive junction layer 30, for example, polyimide (PI) or polyterephthalic acid. Ethylene glycol ester (PET).

The first metal layer 42 is formed on the entire side of the support film 41 facing the substrate 10. The first metal layer 42 comprises copper or aluminum and it may be formed of a metal foil comprising copper or aluminum. The first metal layer 42 has a very low electrical resistance and substantially blocks moisture and oxygen.

The insulating layer 43 is formed on one side of the first metal layer 42 facing the substrate 10 and covers the first metal layer 42.

Figure 5 is a top plan view of the inside of the insulating layer of the sealing substrate shown in Figure 4. Referring to FIG. 5, the insulating layer 43 has a plurality of openings 431 for exposing the first metal layer 42 on the edges. In this case, the position of the respective opening 431 corresponds to the position of the first pad 51 shown in FIG. 2.

Referring again to FIGS. 1 through 4, a conductive layer 44 is provided on the first metal layer 42 for each opening 431 of the insulating layer 43, and a second metal layer 45 is provided on the conductive layer 44. Therefore, the second metal layer 45 is electrically connected to the first metal layer 42 through the conductive layer 44. The conductive layer 44 has the same thickness as the insulating layer 43, and is formed as a conductive tape which is formed on both sides of the metal foil by coating a conductive adhesive, or is formed as an anisotropic conductive film including a conductive ball. .

The third metal layer 46 is formed separately from the second metal layer 45 on the insulating layer 43. The third metal layer 46 is formed on the insulating layer 43, except that a portion spaced apart from the second metal layer 45 by a distance is provided in the middle of the insulating layer 43. The third metal layer 46 includes: an intermediate unit 461 (FIG. 3) provided in the middle of the sealing substrate 40; and a plurality of extenders 462 provided between the second metal layers 45 on the edges of the sealing substrate 40 .

The second metal layer 45 and the third metal layer 46 may be made of the same material as the first metal layer 42. For example, the second metal layer 45 and the third metal layer 46 may be formed of a metal foil including copper or aluminum. In this case, when the sealing substrate 40 is manufactured, since the second metal layer 45 and the third metal layer 46 are exposed to the air, the oxidation resistant film 47 (see FIG. 4) may be formed on the surface thereof. The oxidation resistant film 47 can be formed by a tin plating layer or a nickel plating layer.

The second metal layer 45 and the third metal layer 46 have very low electrical resistance and block moisture and oxygen in a good manner. Therefore, moisture and oxygen on the outside of the organic light emitting diode (OLED) display 100 are initially blocked by the first metal layer 42 and then blocked by the second metal layer 45 and the third metal layer 46. The sealing substrate 40 has a metal layer that is configured in a dual manner such that the sealing function of the display 20 is increased, resulting in suppression of deterioration of the display 20 and increasing its life.

The second metal layer 45 faces the first spacer 51 in the thickness direction of the substrate 10, and the extender 462 of the third metal layer 46 faces the second spacer 52 in the thickness direction of the substrate 10. A conductive junction layer 30 is provided between the second metal layer 45 and the first liner 51 to electrically connect the second metal layer 45 and the first liner 51, and is an extender provided on the third metal layer 46 462 and a second liner 52 to electrically connect the third metal layer 46 and the second liner 52.

An external access terminal (not shown) is coupled to one of the plurality of second metal layers 45 and one of the extenders 462. The first electrical signal applied to the second metal layer 45 by the external access terminal is supplied to the common power line 21 of the display 20 through the conductive via layer 30 and the first pad 51, and applied to the third metal layer 46. The second electrical signal of the extender 462 is supplied to the common electrode 22 of the display 20 through the conductive junction layer 30 and the second liner 52.

In this case, since the second metal layer 45 is electrically connected to each other by the conductive layer 44 and the first metal layer 42, when the external access terminal is connected to the second metal layer 45, the first electrical signal is used by all The second metal layer 45 is shared. The third metal layer 46 is formed as a single layer such that the second electrical signal is shared by all of the extenders 462.

Therefore, the first electrical signal and the second electrical signal can be uniformly applied to the plurality of first pads 51 and the plurality of second pads 52, which are provided on the four sides of the substrate 10. Thus, the organic light emitting diode (OLED) display 100 achieves a wide display and improved brightness uniformity.

Further, the width of the second metal layer 45 is substantially 2 mm, wherein the organic light emitting diode (OLED) display 100 is within an allowable range when it is manufactured. When the second metal layer 45 is not connected to the first metal layer 42, the second metal layer 45 cannot supply a current capacity greater than 20 A because of high wire resistance. However, since the first metal layer 42 having the same area as the support film 41 is connected to the plurality of second metal layers 45 in the organic light emitting diode (OLED) display 100, the wire resistance of the second metal layer 45 is lowered and A current capacity greater than 20 A is supplied.

Metal layers 42, 45 and 46, which are provided on the sealing substrate 40, have a sealing function for preventing penetration of moisture and oxygen into the display 20, and a wire function for supplying the first electrical signal and the second electrical signal. Since the brightness uniformity of the screen is deteriorated, when the large screen display 20 is realized, the electric signal is supplied by forming the pad region 101 on the four edges of the substrate 10 and using the COF or FPC attached to the pad region 101. .

However, the organic light emitting diode (OLED) display 100 can uniformly supply corresponding electrical signals to the common power line 21 and the common electrode 22 without forming the pad region 101 on the four edges of the substrate 10. Thus, the overall configuration and fabrication process of the organic light emitting diode (OLED) display 100 can be simplified by reducing the number of COF and FPC and bonding processes.

6 to 8 are partial enlarged cross-sectional views of the organic light emitting diode (OLED) display shown in Fig. 1.

FIG. 6 shows the first common power line 211 and the first pad 51 in detail, and FIG. 7 shows the second common power line 212 and the first pad 51 in detail. FIG. 8 shows the common electrode 22 and the second pad 52 in detail. 6 through 8 illustrate this state in which an insulating junction layer 31 is provided between the display and the conductive junction layer 30.

Referring to FIGS. 6 through 8, the organic light emitting element 25 and the driving circuit are formed for each pixel in the screen. The drive circuit includes at least two thin film transistors and at least one capacitor. 6 to 8 show that the thin film transistor 60 and the organic light emitting element 25 are provided on the display. The organic light-emitting element 25 and the thin film transistor 60 are not limited to the examples and are variable in many respects.

The thin film transistor 60 includes a semiconductor layer 61, a gate electrode 62, a source electrode 63, and a drain electrode 64. The semiconductor layer 61 is formed of a polysilicon layer and includes a channel region 611, a source region 612, and a drain region 613. The channel region 611 is an impurity-non-doped intrinsic semiconductor, and the source region 612 and the drain region 613 are impurity-doped impurity semiconductors.

The gate electrode 62 is provided in the channel region 611 of the semiconductor layer 61 with the gate insulating layer 11 disposed therebetween. A source electrode 63 and a drain electrode 64 are provided on the gate electrode 62 with the interlayer insulating layer 12 disposed therebetween, and are respectively connected to the source region 612 and the drain region through contact holes formed in the interlayer insulating layer 12. 613. The planarization layer 13 is formed on the source electrode 63 and the drain electrode 64, and the pixel electrode 23 is provided on the planarization layer 13. The pixel electrode 23 is connected to the drain electrode 64 through a contact hole of the planarization layer 13.

A pixel defining layer 14 is formed on the pixel electrode 23 and the planarization layer 13. The pixel defining layer 14 forms an opening for each pixel to expose a portion of the pixel electrode 23. The organic light emitting layer 24 is formed on the exposed pixel electrode 23, and the common electrode 22 is formed on the display to cover the organic light emitting layer 24 and the pixel defining layer 14. The pixel electrode 23, the organic light-emitting layer 24, and the common electrode 22 form the organic light-emitting element 25.

The pixel electrode 23 may be a hole injection electrode, and the common electrode 22 may be an electron injection electrode. In this case, the organic light-emitting layer 24 includes a hole injection layer (HIL), a hole transport layer (HTL), a light-emitting layer, an electron transport layer (ETL), and an electron injection layer (EIL) sequentially stacked from the pixel electrode 23. . When holes and electrons are injected from the pixel electrode 23 and the common electrode 22 to the organic light-emitting layer 24, and when excitons (this is a combination of injection holes and electrons) are changed from the excited state to the ground state, light is emitted.

The pixel electrode 23 is formed of a pleasant conductive layer, and the common electrode 22 is formed of a reflective conductive layer. The light emitted from the organic light-emitting layer 24 is reflected by the common electrode 22, and is emitted to the outside through the pixel electrode 23 and the substrate 10. The above-mentioned light emitting structure is referred to as a rear light emitting structure. The pixel electrode 23 may be formed of three layers of indium tin oxide (ITO) / silver (Ag) / ITO, and the common electrode 22 may include silver (Ag), aluminum (Al), a silver alloy, or an aluminum alloy.

The first common power line 211 and the second common power line 212 may be formed in the same layer as the gate electrode 62 or the source/drain electrodes 63 and 64. 6 shows that the first common power line 211 is formed on the same layer as the homologous/drain electrodes 63 and 64, and is formed of the same material, and FIG. 7 shows that the second common power line 212 is formed like a gate. The pole electrode 62 is on the same layer and is formed of the same material.

Referring to FIGS. 6 and 7, both ends of the first common power line 211 and the second common power line 212 extend to the outside of the display. At least one of the four insulating layers formed on the display may extend to the outside of the display. For example, the end of the first common power line 211 is covered by the planarization layer 13, and the end of the second common power line 212 is covered by the interlayer insulating layer 12 and the planarization layer 13.

The planarization layer 13 has a first opening 131 to expose an end of the first common power line 211, and the first pad conductive layer 151 is formed on the planarization layer 13 and connected to the first common power line 211 through the first opening 131. . The first pad 51 (which is provided on the long side of the substrate 10) may be defined as a first pad conductive layer 151.

The interlayer insulating layer 12 and the planarization layer 13 have a second opening 16 to expose the end of the second common power line 212, and the second pad conductive layer 152 is formed on the planarization layer 13 and connected to the second through the second opening 16 Two common power lines 212. The first liner 51 (which is provided on the short side of the substrate 10) may be defined as a second liner conductive layer 152. The first pad conductive layer 151 and the second pad conductive layer 152 may be formed on the same layer as the pixel electrode 23, and formed of the same material.

Referring to FIG. 8, a common electrode 22 is provided inside the insulating junction layer 31, and a second liner 52 is formed on the inner side and the outer side of the insulating junction layer 31 to electrically connect the common electrode 22 and the conductive junction layer 30. The second liner 52 includes a third liner conductive layer 153, a fourth liner conductive layer 154, and a fifth liner conductive layer 155.

The third pad conductive layer 153 is provided inside the insulating junction layer 31 and contacts the common electrode 22. The fourth pad conductive layer 154 is connected to the third pad conductive layer 153 through the third opening 132 of the planarization layer 13 and is provided on the inner side and the outer side of the insulating junction layer 31. A fifth pad conductive layer 155 is provided between the conductive junction layer 30 and the planarization layer 13 and is connected to the fourth pad conductive layer 154 through the fourth opening 133 of the planarization layer 13.

The third pad conductive layer 153 and the fifth pad conductive layer 155 may be formed on the same layer as the pixel electrode 23, and formed of the same material. The fourth pad conductive layer 154 may be formed on the same layer as the gate electrode 62 or the source/drain electrodes 63 and 64, and formed of the same material. Fig. 8 exemplifies this state in which the fourth pad conductive layer 154 is formed on the same layer as the homologous/drain electrodes 63 and 64. The detailed configuration of the second pad 52 is not limited to the above description, and any configuration for electrically connecting the common electrode 22 and the conductive junction layer 30 of the display is applicable.

Further, a method for manufacturing the sealing substrate 40 will be explained.

9A through 9D are cross-sectional views of a sealing substrate for demonstrating a process of manufacturing a sealing substrate, according to an exemplary embodiment of the present invention.

Referring to FIGS. 9A to 9D, a method for manufacturing the sealing substrate 40 includes providing a support film 41 and forming a first metal layer 42 on the support film 41 (first stage), forming an insulating layer 43 having a plurality of openings 431 at On a metal layer 42 (second stage), a conductive layer 44 is formed on the first metal layer 42 exposed by the opening 431 (third stage), and a second metal layer 45 is formed on the conductive layer 44 and formed The third metal layer 46 separated by the second metal layer 45 is on the insulating layer 43 (fourth stage).

In the first stage, the support film 41 can be controlled in advance according to the size of the sealing substrate 40. The first metal layer 42, the insulating layer 43, the conductive layer 44, the second metal layer 45, and the third metal layer 46 are sequentially stacked on the support film 41. The insulating layer 43 can be formed by screen printing, and the conductive layer 44 can be formed by a conductive tape or an anisotropic conductive film. The second metal layer 45 and the third metal layer 46 may be formed by arranging a single metal layer on the insulating layer 43 and the conductive layer 44 and cutting and forming them.

Further, the support film 41 is flexible so that the sealing substrate 40 can be manufactured by using a roll-to-roll decimal process.

Figure 10 is a schematic illustration of a process for making a sealed substrate to where a roll-to-roll process is applied.

Referring to Figure 10, a support film 41 is provided to the manufacturing system while it is wound on the first spiral wound roll 71. The support film 41 (which is not wound with the first spirally wound roll 71) is transported in one direction by the first drive roll 72 and the second drive roll 73, and sequentially passes through the first to fourth stages. The support film 41 may include polyimide (PI) or polyethylene terephthalate (PET).

The first stage includes a first sheet of metal 48 that is not wound with the second spiral wound roll 74 and is stacked on the support film 41. The first metal sheet 48 can be a metal foil including copper or aluminum. The adhesive is applied to the support film 41 by using the nozzle 76 before the first metal piece 48 is stacked on the support film 41. The stacked support film 41 and the first metal piece 48 are firmly bonded while using a hardening device using hot air (not shown).

The second stage includes inputting the support film 41 and the first metal piece 48 to the printer 77, and screen printing the insulating layer 43 on the first metal piece 48. In this case, as shown in FIG. 5, the insulating layer 43 has a plurality of openings 431 on its edges to partially expose the first metal piece 48.

The third stage includes attaching the conductive layer 44 to the first metal sheet 48 by the input stack structure to the conductive layer attacher 78, which is exposed by the opening 431 of the insulating layer 43, wherein the stacked structure includes the support film 41, A metal piece 48 and an insulating layer 43. Conductive layer 44 can be a conductive tape produced by coating a conductive adhesive on either side of the metal foil or an anisotropic conductive film comprising a conductive ball. Conductive layer 44 can have the same thickness as insulating layer 43.

The fourth stage includes a second metal sheet 49 that is not wound with the third spiral wound roll 79 and a stack of the entire upper half of the stacked structure, that is, the insulating layer 43 and the plurality of conductive layers 44, and the input stack The structure is formed into the former 80 to cut and form a second metal plate 49.

As shown in FIG. 3, the second metal piece 49 is divided into a plurality of second metal layers 45 and third metal layers 46 by a cutting and forming process. That is, the outer portion of the second metal layer 45 (between the second metal sheets 49) is removed by a predetermined thickness, and the second metal sheet 49 is divided into the second metal layer 45 and the third metal. Layer 46. In this case, the second metal layer 45 is electrically connected to each other by the conductive layer 44 and the first metal plate 48.

The second metal piece 49 may be a metal foil including copper or aluminum. The second metal piece 49 can be easily oxidized because it is exposed to the air before the completed sealing substrate 40 is bonded to the substrate. Therefore, the second metal piece 49 may have an oxidation resistant film such as a tin plating layer or a nickel plating layer on the surface thereof.

The stacked structure of the fourth stage having crystal grains is input to the heat pressing device 81 and pressurized at a predetermined temperature. Therefore, the second metal layer 45 and the third metal layer 46 are bonded to the conductive layer 44 and the insulating layer 43, respectively. The stacked structure is input to a cutter (not shown) and divided into individual sealing substrates 40, and the first metal piece 48 is made into the first metal layer 42.

According to this, the sealing substrate 40 can be mass-produced at a low cost because it is manufactured by the roll-to-roll decimal process. That is to say, the product cost can be reduced without including an expensive process because the first metal layer 42 and the second metal layer 45 can conduct but not pattern the via holes, and the etching process or the plating process for forming the wires does not include of.

While the disclosure of the present invention has been described in connection with what is currently considered to be a practical exemplary embodiment, it is to be understood that the invention is not limited to the disclosed embodiments, but is instead intended to cover the application Various modifications and equivalent arrangements of spirits and scopes and equivalents thereof.

10. . . Substrate

11. . . Gate insulation

12. . . Interlayer insulation

13. . . Flattening layer

14. . . Pixel definition layer

16. . . Second opening

20. . . monitor

twenty one. . . Common power cord

twenty two. . . Common electrode

twenty three. . . Pixel electrode

twenty four. . . Organic light emitting layer

25. . . Organic light-emitting element

30. . . Conductive junction layer

31. . . Insulating joint layer

40. . . Sealing substrate

41. . . Support film

42. . . First metal layer

43. . . Insulation

44. . . Conductive layer

45. . . Second metal layer

46. . . Third metal layer

47. . . Antioxidant film

48. . . First piece of metal

49. . . Second piece of metal

51. . . First pad

52. . . Second pad

60. . . Thin film transistor

61. . . Semiconductor layer

62. . . Gate electrode

63. . . Source electrode

64. . . Bipolar electrode

71. . . First spiral wound volume

72. . . First drive volume

73. . . Second drive volume

74. . . Second spiral wound volume

76. . . nozzle

77. . . Printing machine

78. . . Conduction layer attachment

79. . . Third spiral wound volume

80. . . Former

81. . . Hot pressing device

100. . . Organic light emitting diode display

101. . . Substrate

131. . . First opening

132. . . Third opening

151. . . First pad conductive layer

152. . . Second pad conductive layer

153. . . Third pad conductive layer

154. . . Fourth pad conductive layer

155. . . Fifth pad conductive layer

211. . . First common power cord

212. . . Second common power cord

431. . . Opening

461. . . Intermediate unit

462. . . Extender

611. . . Channel area

612. . . Source area

613. . . Bungee area

A more complete appreciation of the present invention, and the advantages of the present invention will become apparent from the <RTIgt; A similar component, wherein: FIG. 1 is a cross-sectional view of an organic light emitting diode (OLED) display according to an exemplary embodiment of the present invention; FIG. 2 is an organic light emitting diode (OLED) display as shown in FIG. Top plan view of the substrate; FIG. 3 is a top plan view of the inside of the sealing substrate in the organic light emitting diode (OLED) display shown in FIG. 1; FIG. 4 is taken along the line IV-IV in FIG. Cross-sectional view of the sealing substrate; FIG. 5 is a top plan view of the inner side of the insulating layer of the sealing substrate shown in FIG. 4; FIGS. 6 to 8 are organic light emitting diode (OLED) displays as shown in FIG. Portion enlarged cross-sectional view; FIGS. 9A to 9D are cross-sectional views of a sealing substrate for demonstrating a process of manufacturing a sealing substrate, according to an exemplary embodiment of the present invention; and FIG. 10 is for manufacturing a sealing substrate to a roll The roll process should be A schematic diagram of the process at.

10. . . Substrate

20. . . monitor

twenty one. . . Common power cord

twenty two. . . Common electrode

30. . . Conductive junction layer

40. . . Sealing substrate

41. . . Support film

42. . . First metal layer

43. . . Insulation

44. . . Conductive layer

45. . . Second metal layer

46. . . Third metal layer

100. . . Organic light emitting diode display

101. . . Substrate

Claims (20)

An organic light emitting diode (OLED) display comprising: a substrate; a display provided on the substrate and including a common power line and a common electrode; a junction layer provided on the outside of the display on the substrate; and a sealing substrate, The substrate is fixed on the substrate by the bonding layer; wherein the sealing substrate comprises: a supporting film; a first metal layer provided on a side facing the supporting film of the substrate; and a plurality of second metal layers, Providing on the first metal layer and conducting with the first metal layer, and supplying a first electrical signal to the common power line; and a third metal layer provided on the first metal layer and with the first metal The layer is insulated and a second electrical signal is supplied to the common electrode. The organic light emitting diode display of claim 1, wherein the first metal layer has the same size as the support film. The organic light emitting diode display according to claim 1, wherein the sealing substrate comprises: a plurality of conductive layers provided between the first metal layer and the second metal layer; and an insulating layer provided Between the first metal layer and the third metal layer. An organic light emitting diode display according to claim 3, wherein the conductive layer has the same thickness as the insulating layer and is formed of one of a conductive tape and an anisotropic conductive film. The organic light emitting diode display according to claim 1, wherein the second metal layer is provided separately from each other along an edge of the sealing substrate, and the third metal layer comprises: an intermediate unit facing the display; And a plurality of extenders provided between the second metal layers on the edges of the sealing substrate. The organic light emitting diode display of claim 5, wherein the junction layer is a conductive junction layer, and the second metal layer and the extender contact the conductive junction layer. The organic light emitting diode display according to claim 6, wherein the conductive junction layer exhibits conductivity in a thickness direction of the substrate and exhibits insulation in a direction other than the thickness direction. The organic light emitting diode display of claim 6, further comprising a plurality of first pads provided outside the display on the substrate and connected to the common power line, wherein the first pad contacts the conductive connection a surface layer and is electrically connected to the second metal layer through the conductive junction layer. The OLED display of claim 8 further comprising a plurality of second pads provided on the outside of the display on the substrate and connected to the common electrode, wherein the second pad contacts the conductive interface A layer is electrically connected to the extender through the conductive junction layer. The OLED display of claim 9, wherein the common power line includes a first common power line and a second common power line that cross each other, and the first pad and the second pad are Provided on the four edges of the substrate. The organic light emitting diode display according to claim 1, wherein the first metal layer, the second metal layer, and the third metal layer are formed of a metal foil including one of copper and aluminum. The organic light emitting diode display according to claim 11, wherein the second metal layer and the third metal layer form an oxidation resistant film. A method of fabricating an organic light emitting diode (OLED) display, comprising the steps of: (a) forming a first metal layer on a support film; (b) forming an insulating layer having a plurality of openings on the first metal layer; (c) forming a plurality of conductive layers on the first metal layer exposed through the opening; and (d) forming a plurality of second metal layers on the conductive layer, and forming a third metal layer on the insulating layer To manufacture a sealed substrate. The method of claim 13, wherein the support film is flexible and sequentially passes through steps (a) to (d), wherein the first drive roll and the second drive roll are in one direction transfer. The method of claim 14, wherein the method further comprises the step of applying an adhesive on the support film, unwinding the first metal piece by the spiral wound roll, and stacking the unfolded first metal piece on the support film . The method of claim 15, wherein after the step (d), the support film and the first metal piece are cut, and the first metal piece becomes the first metal layer. The method of claim 14, wherein the step (b) comprises screen-printing the insulating layer on the first metal layer by using a printer. The method of claim 14, wherein the step (c) comprises forming the conductive layer having the same thickness as the insulating layer and having one of a conductive tape and an anisotropic conductive film. The method of claim 14, wherein the step (d) comprises unrolling the second metal sheet from the spiral wound coil, stacking the unrolled second metal sheet on the insulating layer and the conductive layer, and cutting and forming The second metal piece is divided into a second metal layer and a third metal layer. The method of claim 19, wherein the step (d) further comprises applying heat and pressure to the second metal layer and the third metal layer using a hot pressing device after cutting and forming the second metal sheet. .