TW201327636A - Heating system - Google Patents

Heating system Download PDF

Info

Publication number
TW201327636A
TW201327636A TW100149767A TW100149767A TW201327636A TW 201327636 A TW201327636 A TW 201327636A TW 100149767 A TW100149767 A TW 100149767A TW 100149767 A TW100149767 A TW 100149767A TW 201327636 A TW201327636 A TW 201327636A
Authority
TW
Taiwan
Prior art keywords
heating
heating system
module
purge gas
electrode
Prior art date
Application number
TW100149767A
Other languages
Chinese (zh)
Inventor
Cheng-Jie Yang
Zheng-Jia Fang
Original Assignee
Pinecone Material Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pinecone Material Inc filed Critical Pinecone Material Inc
Priority to TW100149767A priority Critical patent/TW201327636A/en
Publication of TW201327636A publication Critical patent/TW201327636A/en

Links

Abstract

The present invention discloses a heating system, comprises at least a heating element, at least one electrode and a purging gas module, wherein one terminal of the heating element and the electrode is coupled at a coupling location, the purging gas module is disposed around the coupling location to thereby prevent the coupling location from contacting with corrosive gases.

Description

加熱系統Heating system

  本發明係關於一種加熱系統,尤指一種化學氣相沈積裝置之加熱系統。
The present invention relates to a heating system, and more particularly to a heating system for a chemical vapor deposition apparatus.

  所謂化學氣相沈積(chemical vapor deposition, CVD) 是指利用熱能、電漿放電或紫外光照射等形式的能源,使氣態物質在固體表面上發生化學反應,並在該表面上沈積,形成穩定固態膜的過程。化學氣相沈積(CVD) 技術是半導體積體電路製程中運用極廣泛的薄膜成長方法,諸如介電質、半導體、導體等薄膜材料,幾乎都能用CVD技術完成。
  請參閱第1圖,係一般習用有機金屬化學氣相沈積裝置之示意圖。如圖所示,一般有機金屬化學氣相沈積(MOCVD)裝置包含有一進氣頭 (shower head) 12、一反應腔14、一石墨基座18、一加熱器19及至少一排氣管線17。石墨基座18上設置一載盤16後,再將基板15置於載盤16上加熱。反應氣體由進氣頭12進入反應腔14後,與高溫基板15產生反應而於基板15上形成目標材質之沈積層。反應後之殘餘氣體則由排氣管線17排除。
  請參閱第2圖及第3圖,係分別為習用加熱器之電阻片示意圖及加熱器之局部剖面圖。習用之加熱器包含有複數個電阻片22、24,各電阻片22、24通常分佈於一加熱平面20。各電阻片22、24分別包含有一第一端221、241及一第二端223、243,如第2圖所示。
  電阻片22、24之兩端(221、241)分別設有一垂直接線端321、341,各垂直接線端321、341分別與對應之電極38連接,並於連接處形成一電性耦合處386。為了避免電性耦合處386接觸腐蝕性氣體。
  習知技術藉由一輸氣管39提供吹淨氣體至電極38以及電性耦合處386附近,藉以降低腐蝕氣體接觸電性耦合處386的機會。然而,單點吹氣方式所提供氣流的分佈並不均勻,也可能因排氣管線17作業時造成氣流擾動,而使部分腐蝕氣體與電性耦合處接觸。
Chemical vapor deposition (CVD) refers to the use of energy sources such as thermal energy, plasma discharge or ultraviolet light to cause a gaseous substance to chemically react on a solid surface and deposit on the surface to form a stable solid state. The process of the membrane. Chemical vapor deposition (CVD) technology is a widely used method for film growth in semiconductor integrated circuit processes. Thin film materials such as dielectrics, semiconductors, and conductors can be almost completed by CVD.
Please refer to Fig. 1, which is a schematic diagram of a conventional organometallic chemical vapor deposition apparatus. As shown, a general organometallic chemical vapor deposition (MOCVD) apparatus includes a shower head 12, a reaction chamber 14, a graphite susceptor 18, a heater 19, and at least one vent line 17. After a carrier 16 is placed on the graphite base 18, the substrate 15 is placed on the carrier 16 for heating. After the reaction gas enters the reaction chamber 14 from the inlet head 12, it reacts with the high temperature substrate 15 to form a deposition layer of the target material on the substrate 15. The residual gas after the reaction is removed by the exhaust line 17.
Please refer to Fig. 2 and Fig. 3, which are respectively a schematic diagram of a resistor piece of a conventional heater and a partial sectional view of the heater. Conventional heaters include a plurality of resistor sheets 22, 24, each of which is typically distributed over a heating plane 20. Each of the resistor sheets 22, 24 includes a first end 221, 241 and a second end 223, 243, as shown in FIG.
The two ends (221, 241) of the resistor plates 22 and 24 are respectively provided with a vertical terminal 321 and 341. The vertical terminals 321 and 341 are respectively connected to the corresponding electrodes 38, and an electrical coupling portion 386 is formed at the connection. In order to avoid the electrical coupling 386 from contacting corrosive gases.
Conventional techniques provide a purge gas to the electrode 38 and the vicinity of the electrical coupling 386 by a gas delivery conduit 39 to reduce the chance of corrosive gases contacting the electrical coupling 386. However, the distribution of the airflow provided by the single-point air blowing method is not uniform, and the airflow may be disturbed due to the operation of the exhaust line 17, and some of the corrosive gas may be in contact with the electrical coupling.

  本發明提供一種加熱系統,包含:至少一加熱元件;至少一電極,與加熱元件之一端電性耦合於一耦合處;以及一吹淨氣體模組,吹淨氣體模組圍繞耦合處,以避免腐蝕性氣體接觸耦合處。
  上述加熱系統之一實施例,加熱元件包含一平面電阻片以及兩個垂直接線端各別連接平面電阻片之兩端。
  上述加熱系統之一實施例,平面電阻片以及兩個垂直接線端係為一體成型。
  上述加熱系統之一實施例,平面電阻片以及兩個垂直接線端係為分離部件。
  上述加熱系統之一實施例,更包含一導電固定模組,用以固定加熱元件與電極,並提供兩者導電接觸面積。
  上述加熱系統之一實施例,導電固定模組包含一螺絲鎖固元件。
  上述加熱系統之一實施例,導電固定模組包含至少一夾持固定元件。
  上述加熱系統之一實施例,導電固定模組包含一第一夾持固定元件以夾持加熱元件,一第二夾持固定元件以夾持電極,第一夾持固定元件與第二夾持固定元件藉由一連接元件彼此固定。
  上述加熱系統之一實施例,具有複數個加熱元件與複數個電極,每一電極與每一加熱元件之一端電性耦合於一耦合處,吹淨氣體模組具有至少一個氣體通道,每一氣體通道用以圍繞一耦合處。
  上述加熱系統之一實施例,更包含一冷卻模組,設置於加熱元件與吹淨氣體模組之間。
  上述加熱系統之一實施例,冷卻模組具有複數個冷卻液通道。
  上述加熱系統之一實施例,冷卻模組與吹淨氣體模組係為一體成型。
  上述加熱系統之一實施例,冷卻模組與吹淨氣體模組係為分離部件。
  上述加熱系統之一實施例,吹淨氣體模組更包含一第一出氣口,第一出氣口圍繞鄰近耦合處之加熱元件,以便於導引吹淨氣體流經耦合處後再由加熱元件一側流出。
  上述加熱系統之一實施例,吹淨氣體模組更包含一第二出氣口,第二出氣口圍繞鄰近耦合處之電極,以便於導引吹淨氣體流經電性耦合處後再由電極一側流出。
The present invention provides a heating system comprising: at least one heating element; at least one electrode electrically coupled to a coupling end of the heating element; and a purge gas module, the purge gas module surrounding the coupling to avoid Corrosive gases contact the coupling.
In one embodiment of the above heating system, the heating element comprises a planar resistor sheet and two vertical terminals are respectively connected to the two ends of the planar resistor sheet.
In one embodiment of the above heating system, the planar resistor piece and the two vertical terminals are integrally formed.
In one embodiment of the above heating system, the planar resistor piece and the two vertical terminals are separate components.
An embodiment of the heating system further includes a conductive fixing module for fixing the heating element and the electrode and providing a conductive contact area of the two.
In one embodiment of the above heating system, the conductive fixing module comprises a screw locking component.
In one embodiment of the above heating system, the conductive fixing module comprises at least one clamping fixing element.
In one embodiment of the heating system, the conductive fixing module comprises a first clamping fixing element for clamping the heating element, a second clamping fixing element for clamping the electrode, and the first clamping fixing element and the second clamping fixing The components are fixed to each other by a connecting element.
An embodiment of the above heating system has a plurality of heating elements and a plurality of electrodes, each electrode and one end of each heating element being electrically coupled to a coupling portion, the purge gas module having at least one gas passage, each gas The channel is used to surround a coupling.
An embodiment of the heating system further includes a cooling module disposed between the heating element and the purge gas module.
In one embodiment of the heating system described above, the cooling module has a plurality of coolant passages.
In one embodiment of the heating system described above, the cooling module and the purge gas module are integrally formed.
In one embodiment of the heating system described above, the cooling module and the purge gas module are separate components.
In one embodiment of the heating system, the purge gas module further includes a first air outlet, the first air outlet surrounding the heating element adjacent to the coupling portion, so as to guide the blowing gas through the coupling portion and then the heating element Side out.
In one embodiment of the heating system, the purge gas module further includes a second gas outlet, and the second gas outlet surrounds the electrode adjacent to the coupling portion, so as to guide the purge gas through the electrical coupling point and then the electrode Side out.

  請參閱第4圖及第5圖,係分別為本發明一實施例之立體圖及局部剖面圖。如圖所示,本發明之加熱系統40包含有:至少一加熱元件42、至少一電極44及一吹淨氣體模組46。其中,加熱元件42之一端與電極44電性耦合於一耦合處442,吹淨氣體模組46則圍繞該耦合處442設置,用以避免腐蝕性氣體接觸該耦合處442。
  在本發明之一實施例中,該加熱系統40可包含有複數個加熱元件42及複數個電極44。各加熱元件42分別包含有一平面電阻片421及兩個垂直接線端423。其中,各平面電阻片421分佈於一平面,各垂直接線端423分別設於各平面電阻片421之兩端,並分別與對應的各電極44電性耦合於一耦合處442而形成回路。吹淨氣體模組46具有至少一氣體通道461,每一氣體通道461圍繞一耦合處442。
  其中,各加熱元件42之平面電阻片421與對應的兩個垂直接線端423可為一體成型,亦可為分離部件,可依系統需求而選用適當形式加熱元件42。各加熱元件42與對應的電極44可藉由一導電固定模組相互固定,例如螺絲鎖固元件45,加以固定並提供兩者之導電接觸面積。
  在本發明之一實施例中,該吹淨氣體模組46可包含一第一出氣口465。該第一出氣口465圍繞鄰近耦合處442之加熱元件42或其垂直接線端423,可導引吹淨氣體流經耦合處442後,再經由該第一出氣口465由加熱元件42一側流出。其中,該第一出氣口465可設置一上蓋板467,用以控制第一出氣口465之大小。
  在本發明之一實施例中,該吹淨氣體模組46可包含有一第二出氣口466。該第二出氣口466圍繞鄰近耦合處442之電極44,可導引吹淨氣體流經耦合處442後,再經由該第二出氣口466由電極44一側流出。其中,該第二出氣口466可設置一下蓋板469,用以控制第二出氣口466之大小。
  在本發明之一實施例中,可設置一供氣裝置(未顯示)及至少一導氣管48。令導氣管48連接供氣裝置與吹淨氣體模組46,藉由供氣裝置持續提供吹淨氣體至吹淨氣體模組46中。
  請參閱第6圖,係本發明另一實施例之局部剖面圖。如圖所示,本實施例加熱系統之構造與第5圖所示實施例大致相同,惟,本實施例之於加熱系統中增設一冷卻模組66。
  其中,冷卻模組66設置於該加熱元件42與吹淨氣體模組46之間。該冷卻模組66可包含有複數個冷卻液通道661。藉由在冷卻液通道661中導入各式冷卻劑,例如水、油或冷媒等,以保護下方電極44,達到冷卻降溫的效果。
  在本發明之一實施例中,該冷卻模組66與吹淨氣體模組46可選擇為一體成型或為分離部件,皆可達到本發明之目的。
  請參閱第7圖,係本發明又一實施例之局部剖面圖。如圖所示,在本實施例中結合加熱元件42(垂直接線端423)與電極44之導電固定模組係以夾持固定元件72之形式實施。其中,吹淨氣體模組76之氣體通道761可圍繞整個包含有夾持固定元件72之耦合處442之鄰近區域。
  在本發明之一實施例中,該夾持固定元件72可包含有一第一夾持固定元件721、一第二夾持固定元件723及一連接元件(未顯示)。其中,該第一夾持固定元件721係用以夾持該加熱元件42 (垂直接線端423),該第二夾持固定元件723係用以夾持該電極44,再藉由該連接元件連接並固定該第一夾持固定元件721及該第二夾持固定元件723。
  利用本發明之加熱系統,可防止加熱元件42與電極44之耦合處442因與腐蝕性氣體接觸而變質,確保各耦合處442皆具有良好的導電率,不會因耦合處442劣化而產生額外的能源浪費的情形。
  以上所述者,僅為本發明之實施例而已,並非用來限定本發明實施之範圍,即凡依本發明申請專利範圍所述之形狀、構造、特徵、方法及精神所為之均等變化與修飾,均應包括於本發明之申請專利範圍內。
Please refer to FIG. 4 and FIG. 5, which are perspective views and partial cross-sectional views, respectively, of an embodiment of the present invention. As shown, the heating system 40 of the present invention includes at least one heating element 42, at least one electrode 44, and a purge gas module 46. The one end of the heating element 42 is electrically coupled to the electrode 44 to a coupling portion 442, and the purge gas module 46 is disposed around the coupling portion 442 to prevent corrosive gas from contacting the coupling portion 442.
In one embodiment of the invention, the heating system 40 can include a plurality of heating elements 42 and a plurality of electrodes 44. Each of the heating elements 42 includes a planar resistive sheet 421 and two vertical terminals 423. Each of the planar resistors 421 is disposed on a plane, and each of the vertical terminals 423 is disposed at each end of each of the planar resistors 421, and is electrically coupled to a corresponding electrode 44 at a coupling portion 442 to form a loop. The purge gas module 46 has at least one gas passage 461, and each gas passage 461 surrounds a coupling portion 442.
The planar resistor 421 of each heating element 42 and the corresponding two vertical terminals 423 may be integrally formed, or may be separate components, and the heating element 42 may be appropriately selected according to system requirements. The heating elements 42 and the corresponding electrodes 44 can be fixed to each other by a conductive fixing module, such as a screw locking member 45, which is fixed and provides a conductive contact area of the two.
In an embodiment of the invention, the purge gas module 46 can include a first air outlet 465. The first air outlet 465 surrounds the heating element 42 adjacent to the coupling portion 442 or its vertical terminal 423, and can guide the purge gas to flow through the coupling portion 442, and then flow out from the heating element 42 side through the first air outlet port 465. . The first air outlet 465 can be provided with an upper cover 467 for controlling the size of the first air outlet 465.
In an embodiment of the invention, the purge gas module 46 can include a second air outlet 466. The second air outlet 466 surrounds the electrode 44 adjacent to the coupling portion 442, and can guide the purge gas to flow through the coupling portion 442, and then flow out from the electrode 44 side via the second air outlet port 466. The second air outlet 466 can be provided with a cover 469 for controlling the size of the second air outlet 466.
In an embodiment of the invention, a gas supply device (not shown) and at least one airway 48 may be provided. The air guiding tube 48 is connected to the air supply device and the purge gas module 46, and the air supply device continuously supplies the purge gas to the purge gas module 46.
Please refer to Fig. 6, which is a partial cross-sectional view showing another embodiment of the present invention. As shown in the figure, the structure of the heating system of this embodiment is substantially the same as that of the embodiment shown in FIG. 5. However, in this embodiment, a cooling module 66 is added to the heating system.
The cooling module 66 is disposed between the heating element 42 and the purge gas module 46. The cooling module 66 can include a plurality of coolant channels 661. The lower electrode 44 is protected by introducing various coolants such as water, oil, or a refrigerant into the coolant passage 661 to achieve the effect of cooling and cooling.
In an embodiment of the present invention, the cooling module 66 and the purge gas module 46 may be integrally formed or separated components, and the object of the present invention can be achieved.
Please refer to Fig. 7, which is a partial cross-sectional view showing still another embodiment of the present invention. As shown, in the present embodiment, the conductive fixing module 42 in combination with the heating element 42 (vertical terminal 423) and the electrode 44 is implemented in the form of a clamping fixing member 72. Wherein, the gas passage 761 of the purge gas module 76 can surround an adjacent region including the coupling portion 442 of the clamping fixture 72.
In an embodiment of the invention, the clamping and fixing member 72 can include a first clamping and fixing member 721, a second clamping and fixing member 723, and a connecting member (not shown). The first clamping and fixing component 721 is configured to clamp the heating component 42 (vertical terminal 423), and the second clamping and fixing component 723 is configured to clamp the electrode 44, and then connected by the connecting component. The first clamping and fixing member 721 and the second clamping and fixing member 723 are fixed.
With the heating system of the present invention, it is possible to prevent the coupling portion 442 of the heating element 42 and the electrode 44 from being deteriorated by contact with the corrosive gas, ensuring that each of the coupling portions 442 has good electrical conductivity without causing an extra factor due to deterioration of the coupling portion 442. The situation of energy wastage.
The above is only the embodiment of the present invention, and is not intended to limit the scope of the present invention, that is, the equivalent changes and modifications of the shapes, structures, features, methods and spirits described in the claims of the present invention. All should be included in the scope of the patent application of the present invention.

10...有機金屬化學氣相沈積裝置10. . . Organometallic chemical vapor deposition device

12...進氣頭12. . . Intake head

14...反應腔14. . . Reaction chamber

15...基板15. . . Substrate

16...載盤16. . . Carrier

17...排氣管線17. . . Exhaust line

18...石墨基座18. . . Graphite base

19...加熱器19. . . Heater

20...加熱平面20. . . Heating plane

22...電阻片twenty two. . . Resistor

221...第一端221. . . First end

223...第二端223. . . Second end

24...電阻片twenty four. . . Resistor

241...第一端241. . . First end

243...第二端243. . . Second end

321...導電柱321. . . Conductive column

341...導電柱341. . . Conductive column

36...隔板36. . . Partition

361...穿孔361. . . perforation

363...間隙363. . . gap

38...電極38. . . electrode

386...接點386. . . contact

39...輸氣管39. . . Gas pipe

391...吹氣口391. . . Blowing port

40...加熱系統40. . . Heating system

42...加熱元件42. . . Heating element

421...平面電阻片421. . . Plane resistor

423...垂直接線端423. . . Vertical terminal

44...電極44. . . electrode

442...耦合處442. . . Coupling

45...螺絲鎖固元件45. . . Screw locking element

46...吹淨氣體模組46. . . Blowing gas module

461...氣體通道461. . . Gas passage

465...第一出氣口465. . . First air outlet

466...第二出氣口466. . . Second air outlet

467...上蓋板467. . . Upper cover

469...下蓋板469. . . Lower cover

48...導氣管48. . . Air duct

66...冷卻模組66. . . Cooling module

661...冷卻液通道661. . . Coolant channel

72...夾持固定元件72. . . Clamping fixture

721...第一夾持固定元件721. . . First clamping fixture

723...第二夾持固定元件723. . . Second clamping fixture

76...吹淨氣體模組76. . . Blowing gas module

761...氣體通道761. . . Gas passage

第1圖:係有機金屬化學氣相沈積裝置之示意圖。
第2圖:係習用加熱器電阻片之示意圖。
第3圖:係習用加熱器之局部剖面圖。
第4圖:係本發明一實施例之立體圖。
第5圖:係本發明一實施例之局部剖面圖。
第6圖:係本發明另一實施例之局部剖面圖。
第7圖:係本發明又一實施例之局部剖面圖。
Figure 1: Schematic diagram of an organometallic chemical vapor deposition apparatus.
Figure 2: Schematic diagram of a conventional heater resistor.
Figure 3: A partial cross-sectional view of a conventional heater.
Figure 4 is a perspective view of an embodiment of the present invention.
Figure 5 is a partial cross-sectional view showing an embodiment of the present invention.
Figure 6 is a partial cross-sectional view showing another embodiment of the present invention.
Figure 7 is a partial cross-sectional view showing still another embodiment of the present invention.

42...加熱元件42. . . Heating element

421...平面電阻片421. . . Plane resistor

423...垂直接線端423. . . Vertical terminal

44...電極44. . . electrode

442...耦合處442. . . Coupling

46...吹淨氣體模組46. . . Blowing gas module

461...氣體通道461. . . Gas passage

465...第一出氣口465. . . First air outlet

466...第二出氣口466. . . Second air outlet

467...上蓋板467. . . Upper cover

469...下蓋板469. . . Lower cover

Claims (15)

一種加熱系統,包含:
至少一加熱元件;
至少一電極,與該加熱元件之一端電性耦合於一耦合處; 以及
一吹淨氣體模組,該吹淨氣體模組圍繞該耦合處,以避免 腐蝕性氣體接觸該耦合處。
A heating system comprising:
At least one heating element;
At least one electrode electrically coupled to one end of the heating element to a coupling portion; and a purge gas module surrounding the coupling portion to prevent corrosive gas from contacting the coupling portion.
如申請專利範圍第1項所述之加熱系統,該加熱元件包含一平面電阻片以及兩個垂直接線端各別連接該平面電阻片之兩端。The heating system of claim 1, wherein the heating element comprises a planar resistor and two vertical terminals are respectively connected to the two ends of the planar resistor. 如申請專利範圍第2項所述之加熱系統,該平面電阻片以及兩個該垂直接線端係為一體成型。The heating resistor system of claim 2, wherein the planar resistor sheet and the two vertical terminals are integrally formed. 如申請專利範圍第2項所述之加熱系統,該平面電阻片以及兩個該垂直接線端係為分離部件。The heating resistor system of claim 2, wherein the planar resistor piece and the two vertical terminals are separate components. 如申請專利範圍第1項所述之加熱系統,更包含一導電固定模組,用以固定該加熱元件與該電極,並提供兩者導電接觸面積。The heating system of claim 1, further comprising a conductive fixing module for fixing the heating element and the electrode and providing a conductive contact area of the two. 如申請專利範圍第5項所述之加熱系統,該導電固定模組包含一螺絲鎖固元件。The heating system of claim 5, wherein the conductive fixing module comprises a screw locking component. 如申請專利範圍第5項所述之加熱系統,該導電固定模組包含至少一夾持固定元件。The heating system of claim 5, wherein the conductive fixing module comprises at least one clamping fixing element. 如申請專利範圍第5項所述之加熱系統,該導電固定模組包含一第一夾持固定元件以夾持該加熱元件,一第二夾持固定元件以夾持該電極,該第一夾持固定元件與該第二夾持固定元件藉由一連接元件彼此固定。The heating system of claim 5, wherein the conductive fixing module comprises a first clamping fixing element for clamping the heating element, and a second clamping fixing element for clamping the electrode, the first clamping The holding element and the second clamping element are fixed to each other by a connecting element. 如申請專利範圍第1項所述之加熱系統,具有複數個加熱元件與複數個電極,每一電極與每一加熱元件之一端電性耦合於一耦合處。The heating system of claim 1, comprising a plurality of heating elements and a plurality of electrodes, each electrode being electrically coupled to a coupling end at one end of each of the heating elements. 如申請專利範圍第1項所述之加熱系統,該吹淨氣體模組具有至少一氣體通道,每一氣體通道圍繞一耦合處。The heating system of claim 1, wherein the purge gas module has at least one gas passage, each gas passage surrounding a coupling. 如申請專利範圍第9項所述之加熱系統,更包含一冷卻模組,設置於該加熱元件與該吹淨氣體模組之間。The heating system of claim 9, further comprising a cooling module disposed between the heating element and the purge gas module. 如申請專利範圍第11項所述之加熱系統,該冷卻模組與該吹淨氣體模組係為一體成型。The heating system according to claim 11, wherein the cooling module and the purge gas module are integrally formed. 如申請專利範圍第11項所述之加熱系統,該冷卻模組與該吹淨氣體模組係為分離部件。The heating system according to claim 11, wherein the cooling module and the purge gas module are separate components. 如申請專利範圍第1項所述之加熱系統,該吹淨氣體模組更包含一第一出氣口,該第一出氣口圍繞鄰近該耦合處之該加熱元件,以便於導引吹淨氣體流經該耦合處後再由該加熱元件一側流出。The heating system of claim 1, wherein the purge gas module further comprises a first air outlet, the first air outlet surrounding the heating element adjacent to the coupling, so as to guide the flow of the purge gas After the coupling, the side of the heating element flows out. 如申請專利範圍第1項所述之加熱系統,該吹淨氣體模組更包含一第二出氣口,該第二出氣口圍繞鄰近該耦合處之該電極,以便於導引吹淨氣體流經該耦合處後再由該電極一側流出。The heating system of claim 1, wherein the purge gas module further comprises a second air outlet, the second air outlet surrounding the electrode adjacent to the coupling, so as to guide the flow of the purge gas through The coupling is then discharged from the side of the electrode.
TW100149767A 2011-12-30 2011-12-30 Heating system TW201327636A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW100149767A TW201327636A (en) 2011-12-30 2011-12-30 Heating system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW100149767A TW201327636A (en) 2011-12-30 2011-12-30 Heating system

Publications (1)

Publication Number Publication Date
TW201327636A true TW201327636A (en) 2013-07-01

Family

ID=49225173

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100149767A TW201327636A (en) 2011-12-30 2011-12-30 Heating system

Country Status (1)

Country Link
TW (1) TW201327636A (en)

Similar Documents

Publication Publication Date Title
US11746414B2 (en) Temperature control assembly for substrate processing apparatus and method of using same
TWI390075B (en) Touch chemical chemical vaporization device
TWI720793B (en) Showerhead with reduced backside plasma ignition
JP7105725B2 (en) PECVD ceramic heater with wide operating temperature
US20070266946A1 (en) Semiconductor device manufacturing apparatus and method of using the same
US20130337653A1 (en) Semiconductor processing apparatus with compact free radical source
US8092640B2 (en) Plasma processing apparatus and semiconductor device manufactured by the same apparatus
TW201425635A (en) Showerhead designs of a HWCVD chamber
KR101160357B1 (en) Method and apparatus for silicone oxide deposition on large area substrates
CN109314055A (en) Atomic layer growth device and atomic layer growth method
US8623173B2 (en) Substrate processing apparatus having electrode member
TW202114095A (en) Independently adjustable flowpath conductance in multi-station semiconductor processing
TW201013139A (en) Heat treating device and heat treating method
JP5179823B2 (en) Vaporizer and film forming apparatus
KR20120111108A (en) Gas injection apparatus, atomic layer deposition apparatus and the method of atomic layer deposition using the same
JP6629248B2 (en) Gas injection device for epitaxial chamber
US11434568B2 (en) Heated ceramic faceplate
TW201327636A (en) Heating system
KR20070109384A (en) Shower head of equipment for use in atomic layer deposition
TWI618112B (en) Apparatus for coupling a hot wire source to a process chamber
TW202111852A (en) Stage and plasma processing apparatus
JP2005072424A (en) Showerhead and deposition system
KR20140038107A (en) Cooling apparatus and source aupplying apparatus and substrate processing apparatus having the same
US20200258762A1 (en) Temperature control apparatus
US20220415676A1 (en) Selective oxidation on rapid thermal processing (rtp) chamber with active steam generation