TW201326308A - Polyamide resin composition having improved physical properties including thin-wall moldability - Google Patents
Polyamide resin composition having improved physical properties including thin-wall moldability Download PDFInfo
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- TW201326308A TW201326308A TW101150783A TW101150783A TW201326308A TW 201326308 A TW201326308 A TW 201326308A TW 101150783 A TW101150783 A TW 101150783A TW 101150783 A TW101150783 A TW 101150783A TW 201326308 A TW201326308 A TW 201326308A
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- Taiwan
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- resin composition
- weight
- polyamide resin
- polyamine resin
- polyamine
- Prior art date
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- 239000011342 resin composition Substances 0.000 title claims abstract description 81
- 229920006122 polyamide resin Polymers 0.000 title claims abstract description 52
- 230000000704 physical effect Effects 0.000 title description 5
- 229920005989 resin Polymers 0.000 claims abstract description 68
- 239000011347 resin Substances 0.000 claims abstract description 68
- 239000011256 inorganic filler Substances 0.000 claims abstract description 27
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 27
- 239000012463 white pigment Substances 0.000 claims abstract description 25
- 229920006020 amorphous polyamide Polymers 0.000 claims abstract description 14
- 229920006039 crystalline polyamide Polymers 0.000 claims abstract description 4
- 229920000768 polyamine Polymers 0.000 claims description 68
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims description 34
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 claims description 34
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 28
- -1 benzophenone compound Chemical class 0.000 claims description 28
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 claims description 25
- 150000001875 compounds Chemical class 0.000 claims description 18
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 claims description 15
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 14
- 238000000113 differential scanning calorimetry Methods 0.000 claims description 12
- 230000009477 glass transition Effects 0.000 claims description 12
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 10
- 230000008018 melting Effects 0.000 claims description 10
- 238000002844 melting Methods 0.000 claims description 10
- 125000003118 aryl group Chemical group 0.000 claims description 9
- 238000002425 crystallisation Methods 0.000 claims description 9
- 230000008025 crystallization Effects 0.000 claims description 9
- 239000000126 substance Substances 0.000 claims description 9
- 239000004611 light stabiliser Substances 0.000 claims description 8
- 239000003365 glass fiber Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 239000001488 sodium phosphate Substances 0.000 claims description 7
- 229910000162 sodium phosphate Inorganic materials 0.000 claims description 7
- 235000011008 sodium phosphates Nutrition 0.000 claims description 7
- 239000011787 zinc oxide Substances 0.000 claims description 7
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 claims description 6
- 150000004985 diamines Chemical class 0.000 claims description 6
- JRBPAEWTRLWTQC-UHFFFAOYSA-N dodecylamine Chemical compound CCCCCCCCCCCCN JRBPAEWTRLWTQC-UHFFFAOYSA-N 0.000 claims description 6
- 238000000465 moulding Methods 0.000 claims description 6
- 230000008859 change Effects 0.000 claims description 5
- GYQBBRRVRKFJRG-UHFFFAOYSA-L disodium pyrophosphate Chemical compound [Na+].[Na+].OP([O-])(=O)OP(O)([O-])=O GYQBBRRVRKFJRG-UHFFFAOYSA-L 0.000 claims description 5
- 239000004575 stone Substances 0.000 claims description 5
- JCUZDQXWVYNXHD-UHFFFAOYSA-N 2,2,4-trimethylhexane-1,6-diamine Chemical compound NCCC(C)CC(C)(C)CN JCUZDQXWVYNXHD-UHFFFAOYSA-N 0.000 claims description 4
- IGSBHTZEJMPDSZ-UHFFFAOYSA-N 4-[(4-amino-3-methylcyclohexyl)methyl]-2-methylcyclohexan-1-amine Chemical compound C1CC(N)C(C)CC1CC1CC(C)C(N)CC1 IGSBHTZEJMPDSZ-UHFFFAOYSA-N 0.000 claims description 4
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 claims description 4
- 229910052791 calcium Inorganic materials 0.000 claims description 4
- 239000011575 calcium Substances 0.000 claims description 4
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 claims description 4
- 235000019820 disodium diphosphate Nutrition 0.000 claims description 4
- 238000002347 injection Methods 0.000 claims description 4
- 239000007924 injection Substances 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- HQHCYKULIHKCEB-UHFFFAOYSA-N tetradecanedioic acid Natural products OC(=O)CCCCCCCCCCCCC(O)=O HQHCYKULIHKCEB-UHFFFAOYSA-N 0.000 claims description 4
- IHWDSEPNZDYMNF-UHFFFAOYSA-N 1H-indol-2-amine Chemical compound C1=CC=C2NC(N)=CC2=C1 IHWDSEPNZDYMNF-UHFFFAOYSA-N 0.000 claims description 3
- WTKWFNIIIXNTDO-UHFFFAOYSA-N 3-isocyanato-5-methyl-2-(trifluoromethyl)furan Chemical compound CC1=CC(N=C=O)=C(C(F)(F)F)O1 WTKWFNIIIXNTDO-UHFFFAOYSA-N 0.000 claims description 3
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims description 3
- 239000004952 Polyamide Substances 0.000 claims description 3
- 239000005083 Zinc sulfide Substances 0.000 claims description 3
- OJMOMXZKOWKUTA-UHFFFAOYSA-N aluminum;borate Chemical compound [Al+3].[O-]B([O-])[O-] OJMOMXZKOWKUTA-UHFFFAOYSA-N 0.000 claims description 3
- 239000012965 benzophenone Substances 0.000 claims description 3
- 239000012964 benzotriazole Substances 0.000 claims description 3
- 239000013078 crystal Substances 0.000 claims description 3
- BNIILDVGGAEEIG-UHFFFAOYSA-L disodium hydrogen phosphate Chemical compound [Na+].[Na+].OP([O-])([O-])=O BNIILDVGGAEEIG-UHFFFAOYSA-L 0.000 claims description 3
- 229910000403 monosodium phosphate Inorganic materials 0.000 claims description 3
- 235000019799 monosodium phosphate Nutrition 0.000 claims description 3
- TVIDDXQYHWJXFK-UHFFFAOYSA-N n-Dodecanedioic acid Natural products OC(=O)CCCCCCCCCCC(O)=O TVIDDXQYHWJXFK-UHFFFAOYSA-N 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- 229920002647 polyamide Polymers 0.000 claims description 3
- 229960001860 salicylate Drugs 0.000 claims description 3
- AJPJDKMHJJGVTQ-UHFFFAOYSA-M sodium dihydrogen phosphate Chemical compound [Na+].OP(O)([O-])=O AJPJDKMHJJGVTQ-UHFFFAOYSA-M 0.000 claims description 3
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 3
- NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 claims description 3
- 229910000368 zinc sulfate Inorganic materials 0.000 claims description 3
- 229960001763 zinc sulfate Drugs 0.000 claims description 3
- 229910052984 zinc sulfide Inorganic materials 0.000 claims description 3
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 claims description 3
- 239000005997 Calcium carbide Substances 0.000 claims description 2
- 239000011133 lead Substances 0.000 claims description 2
- FQENQNTWSFEDLI-UHFFFAOYSA-J sodium diphosphate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]P([O-])(=O)OP([O-])([O-])=O FQENQNTWSFEDLI-UHFFFAOYSA-J 0.000 claims description 2
- 229940048086 sodium pyrophosphate Drugs 0.000 claims description 2
- CLZWAWBPWVRRGI-UHFFFAOYSA-N tert-butyl 2-[2-[2-[2-[bis[2-[(2-methylpropan-2-yl)oxy]-2-oxoethyl]amino]-5-bromophenoxy]ethoxy]-4-methyl-n-[2-[(2-methylpropan-2-yl)oxy]-2-oxoethyl]anilino]acetate Chemical compound CC1=CC=C(N(CC(=O)OC(C)(C)C)CC(=O)OC(C)(C)C)C(OCCOC=2C(=CC=C(Br)C=2)N(CC(=O)OC(C)(C)C)CC(=O)OC(C)(C)C)=C1 CLZWAWBPWVRRGI-UHFFFAOYSA-N 0.000 claims description 2
- 235000019818 tetrasodium diphosphate Nutrition 0.000 claims description 2
- 239000001577 tetrasodium phosphonato phosphate Substances 0.000 claims description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims 4
- DPQHRXRAZHNGRU-UHFFFAOYSA-N 2,4,4-trimethylhexane-1,6-diamine Chemical compound NCC(C)CC(C)(C)CCN DPQHRXRAZHNGRU-UHFFFAOYSA-N 0.000 claims 1
- MWQMEVXZIGDFEW-UHFFFAOYSA-N 4-(4-amino-3-methylcyclohexyl)-2-methylcyclohexan-1-amine Chemical group C1CC(N)C(C)CC1C1CC(C)C(N)CC1 MWQMEVXZIGDFEW-UHFFFAOYSA-N 0.000 claims 1
- 238000005259 measurement Methods 0.000 claims 1
- 238000004383 yellowing Methods 0.000 abstract description 12
- 238000001579 optical reflectometry Methods 0.000 description 21
- 125000004432 carbon atom Chemical group C* 0.000 description 13
- 239000012756 surface treatment agent Substances 0.000 description 11
- 239000004408 titanium dioxide Substances 0.000 description 11
- 229920006111 poly(hexamethylene terephthalamide) Polymers 0.000 description 9
- 239000000203 mixture Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 239000000654 additive Substances 0.000 description 6
- 239000007822 coupling agent Substances 0.000 description 6
- HNRMPXKDFBEGFZ-UHFFFAOYSA-N ethyl trimethyl methane Natural products CCC(C)(C)C HNRMPXKDFBEGFZ-UHFFFAOYSA-N 0.000 description 6
- 238000005562 fading Methods 0.000 description 6
- 235000019738 Limestone Nutrition 0.000 description 5
- 239000004954 Polyphthalamide Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 239000006028 limestone Substances 0.000 description 5
- 238000006068 polycondensation reaction Methods 0.000 description 5
- 229920006375 polyphtalamide Polymers 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 229920005992 thermoplastic resin Polymers 0.000 description 5
- 230000000996 additive effect Effects 0.000 description 4
- 150000001412 amines Chemical class 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 4
- 230000007062 hydrolysis Effects 0.000 description 4
- 238000006460 hydrolysis reaction Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 3
- 229920002302 Nylon 6,6 Polymers 0.000 description 3
- 235000021355 Stearic acid Nutrition 0.000 description 3
- MCMNRKCIXSYSNV-UHFFFAOYSA-N ZrO2 Inorganic materials O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 3
- 125000001931 aliphatic group Chemical group 0.000 description 3
- 239000010425 asbestos Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- YQLZOAVZWJBZSY-UHFFFAOYSA-N decane-1,10-diamine Chemical compound NCCCCCCCCCCN YQLZOAVZWJBZSY-UHFFFAOYSA-N 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- 239000010445 mica Substances 0.000 description 3
- 229910052618 mica group Inorganic materials 0.000 description 3
- 238000001053 micromoulding Methods 0.000 description 3
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical class CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 3
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 229920006128 poly(nonamethylene terephthalamide) Polymers 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000009719 polyimide resin Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 229910052895 riebeckite Inorganic materials 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- DZIHTWJGPDVSGE-UHFFFAOYSA-N 4-[(4-aminocyclohexyl)methyl]cyclohexan-1-amine Chemical compound C1CC(N)CCC1CC1CCC(N)CC1 DZIHTWJGPDVSGE-UHFFFAOYSA-N 0.000 description 2
- GVNWZKBFMFUVNX-UHFFFAOYSA-N Adipamide Chemical compound NC(=O)CCCCC(N)=O GVNWZKBFMFUVNX-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 229920000106 Liquid crystal polymer Polymers 0.000 description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 2
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- ANBBXQWFNXMHLD-UHFFFAOYSA-N aluminum;sodium;oxygen(2-) Chemical compound [O-2].[O-2].[Na+].[Al+3] ANBBXQWFNXMHLD-UHFFFAOYSA-N 0.000 description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000004927 clay Substances 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- 238000005401 electroluminescence Methods 0.000 description 2
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000006081 fluorescent whitening agent Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000002667 nucleating agent Substances 0.000 description 2
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920006139 poly(hexamethylene adipamide-co-hexamethylene terephthalamide) Polymers 0.000 description 2
- 229920006123 polyhexamethylene isophthalamide Polymers 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 150000003254 radicals Chemical class 0.000 description 2
- 239000012779 reinforcing material Substances 0.000 description 2
- YGSDEFSMJLZEOE-UHFFFAOYSA-M salicylate Chemical compound OC1=CC=CC=C1C([O-])=O YGSDEFSMJLZEOE-UHFFFAOYSA-M 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 229910001388 sodium aluminate Inorganic materials 0.000 description 2
- BPILDHPJSYVNAF-UHFFFAOYSA-M sodium;diiodomethanesulfonate Chemical compound [Na+].[O-]S(=O)(=O)C(I)I BPILDHPJSYVNAF-UHFFFAOYSA-M 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- 239000000454 talc Substances 0.000 description 2
- 229910052623 talc Inorganic materials 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 239000001993 wax Substances 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- ALNDHUXNYOMYIH-UHFFFAOYSA-N 1,3-benzoxazole;stilbene Chemical class C1=CC=C2OC=NC2=C1.C1=CC=C2OC=NC2=C1.C=1C=CC=CC=1C=CC1=CC=CC=C1 ALNDHUXNYOMYIH-UHFFFAOYSA-N 0.000 description 1
- 125000001989 1,3-phenylene group Chemical group [H]C1=C([H])C([*:1])=C([H])C([*:2])=C1[H] 0.000 description 1
- PXGZQGDTEZPERC-UHFFFAOYSA-N 1,4-cyclohexanedicarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)CC1 PXGZQGDTEZPERC-UHFFFAOYSA-N 0.000 description 1
- RLEQVGMLDNITBW-UHFFFAOYSA-N 2,4,4-trimethylhexanedioic acid Chemical compound OC(=O)C(C)CC(C)(C)CC(O)=O RLEQVGMLDNITBW-UHFFFAOYSA-N 0.000 description 1
- WAXJSQREIWGYCB-UHFFFAOYSA-N 2-[4-(carboxymethyl)cyclohexyl]acetic acid Chemical compound OC(=O)CC1CCC(CC(O)=O)CC1 WAXJSQREIWGYCB-UHFFFAOYSA-N 0.000 description 1
- SOTPOQQKAUOHRO-BQYQJAHWSA-N 2-[4-[(e)-2-[4-(1,3-benzoxazol-2-yl)phenyl]ethenyl]phenyl]-5-methyl-1,3-benzoxazole Chemical compound C1=CC=C2OC(C3=CC=C(C=C3)/C=C/C3=CC=C(C=C3)C=3OC4=CC=C(C=C4N=3)C)=NC2=C1 SOTPOQQKAUOHRO-BQYQJAHWSA-N 0.000 description 1
- XBVFRINUJXHFCH-UHFFFAOYSA-N 2-butylbenzene-1,3-dicarboxylic acid Chemical compound CCCCC1=C(C(O)=O)C=CC=C1C(O)=O XBVFRINUJXHFCH-UHFFFAOYSA-N 0.000 description 1
- JZUHIOJYCPIVLQ-UHFFFAOYSA-N 2-methylpentane-1,5-diamine Chemical compound NCC(C)CCCN JZUHIOJYCPIVLQ-UHFFFAOYSA-N 0.000 description 1
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 1
- WVDRSXGPQWNUBN-UHFFFAOYSA-N 4-(4-carboxyphenoxy)benzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1OC1=CC=C(C(O)=O)C=C1 WVDRSXGPQWNUBN-UHFFFAOYSA-N 0.000 description 1
- VTDMBRAUHKUOON-UHFFFAOYSA-N 4-[(4-carboxyphenyl)methyl]benzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1CC1=CC=C(C(O)=O)C=C1 VTDMBRAUHKUOON-UHFFFAOYSA-N 0.000 description 1
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- JOIPGYAFSWSMAB-UHFFFAOYSA-N CCO[Si](OCC)(OCC)CCCOCC1CO1.CCO[Si](OCC)(OCC)CCCOCC1CO1 Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1.CCO[Si](OCC)(OCC)CCCOCC1CO1 JOIPGYAFSWSMAB-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical compound O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 description 1
- 235000017858 Laurus nobilis Nutrition 0.000 description 1
- 229910000503 Na-aluminosilicate Inorganic materials 0.000 description 1
- 229920000571 Nylon 11 Polymers 0.000 description 1
- 229920000299 Nylon 12 Polymers 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- 229920000305 Nylon 6,10 Polymers 0.000 description 1
- 229920000572 Nylon 6/12 Polymers 0.000 description 1
- 229920000393 Nylon 6/6T Polymers 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000004115 Sodium Silicate Substances 0.000 description 1
- PJANXHGTPQOBST-VAWYXSNFSA-N Stilbene Natural products C=1C=CC=CC=1/C=C/C1=CC=CC=C1 PJANXHGTPQOBST-VAWYXSNFSA-N 0.000 description 1
- 235000005212 Terminalia tomentosa Nutrition 0.000 description 1
- 244000125380 Terminalia tomentosa Species 0.000 description 1
- FAOMZVDZARKPFJ-UHFFFAOYSA-N WIN 18446 Chemical compound ClC(Cl)C(=O)NCCCCCCCCNC(=O)C(Cl)Cl FAOMZVDZARKPFJ-UHFFFAOYSA-N 0.000 description 1
- 229910000004 White lead Inorganic materials 0.000 description 1
- OXIKYYJDTWKERT-UHFFFAOYSA-N [4-(aminomethyl)cyclohexyl]methanamine Chemical compound NCC1CCC(CN)CC1 OXIKYYJDTWKERT-UHFFFAOYSA-N 0.000 description 1
- QCEUXSAXTBNJGO-UHFFFAOYSA-N [Ag].[Sn] Chemical compound [Ag].[Sn] QCEUXSAXTBNJGO-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- WNLRTRBMVRJNCN-UHFFFAOYSA-L adipate(2-) Chemical compound [O-]C(=O)CCCCC([O-])=O WNLRTRBMVRJNCN-UHFFFAOYSA-L 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- HZBXPDNXGZYKOD-UHFFFAOYSA-K aluminum;sodium;2-hydroxypropane-1,2,3-tricarboxylate Chemical compound [Na+].[Al+3].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O HZBXPDNXGZYKOD-UHFFFAOYSA-K 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 229910052586 apatite Inorganic materials 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 238000005282 brightening Methods 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 238000003763 carbonization Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- VKIRRGRTJUUZHS-UHFFFAOYSA-N cyclohexane-1,4-diamine Chemical compound NC1CCC(N)CC1 VKIRRGRTJUUZHS-UHFFFAOYSA-N 0.000 description 1
- KBFICOCXSYMXRY-UHFFFAOYSA-N decanedioic acid;nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O.OC(=O)CCCCCCCCC(O)=O KBFICOCXSYMXRY-UHFFFAOYSA-N 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- GWZCCUDJHOGOSO-UHFFFAOYSA-N diphenic acid Chemical compound OC(=O)C1=CC=CC=C1C1=CC=CC=C1C(O)=O GWZCCUDJHOGOSO-UHFFFAOYSA-N 0.000 description 1
- XPPKVPWEQAFLFU-UHFFFAOYSA-J diphosphate(4-) Chemical compound [O-]P([O-])(=O)OP([O-])([O-])=O XPPKVPWEQAFLFU-UHFFFAOYSA-J 0.000 description 1
- 235000011180 diphosphates Nutrition 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- QFTYSVGGYOXFRQ-UHFFFAOYSA-N dodecane-1,12-diamine Chemical compound NCCCCCCCCCCCCN QFTYSVGGYOXFRQ-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- WGBBUURBHXLGFM-UHFFFAOYSA-N hexan-2-amine Chemical compound CCCCC(C)N WGBBUURBHXLGFM-UHFFFAOYSA-N 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 150000003951 lactams Chemical class 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000011859 microparticle Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- ZETYUTMSJWMKNQ-UHFFFAOYSA-N n,n',n'-trimethylhexane-1,6-diamine Chemical compound CNCCCCCCN(C)C ZETYUTMSJWMKNQ-UHFFFAOYSA-N 0.000 description 1
- ORECYURYFJYPKY-UHFFFAOYSA-N n,n'-bis(2,2,6,6-tetramethylpiperidin-4-yl)hexane-1,6-diamine;2,4,6-trichloro-1,3,5-triazine;2,4,4-trimethylpentan-2-amine Chemical compound CC(C)(C)CC(C)(C)N.ClC1=NC(Cl)=NC(Cl)=N1.C1C(C)(C)NC(C)(C)CC1NCCCCCCNC1CC(C)(C)NC(C)(C)C1 ORECYURYFJYPKY-UHFFFAOYSA-N 0.000 description 1
- ABMFBCRYHDZLRD-UHFFFAOYSA-N naphthalene-1,4-dicarboxylic acid Chemical compound C1=CC=C2C(C(=O)O)=CC=C(C(O)=O)C2=C1 ABMFBCRYHDZLRD-UHFFFAOYSA-N 0.000 description 1
- DFFZOPXDTCDZDP-UHFFFAOYSA-N naphthalene-1,5-dicarboxylic acid Chemical compound C1=CC=C2C(C(=O)O)=CC=CC2=C1C(O)=O DFFZOPXDTCDZDP-UHFFFAOYSA-N 0.000 description 1
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 1
- WPUMVKJOWWJPRK-UHFFFAOYSA-N naphthalene-2,7-dicarboxylic acid Chemical compound C1=CC(C(O)=O)=CC2=CC(C(=O)O)=CC=C21 WPUMVKJOWWJPRK-UHFFFAOYSA-N 0.000 description 1
- SXJVFQLYZSNZBT-UHFFFAOYSA-N nonane-1,9-diamine Chemical compound NCCCCCCCCCN SXJVFQLYZSNZBT-UHFFFAOYSA-N 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 150000002923 oximes Chemical class 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- VSIIXMUUUJUKCM-UHFFFAOYSA-D pentacalcium;fluoride;triphosphate Chemical compound [F-].[Ca+2].[Ca+2].[Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O VSIIXMUUUJUKCM-UHFFFAOYSA-D 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 229920006131 poly(hexamethylene isophthalamide-co-terephthalamide) Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920002098 polyfluorene Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 229940048084 pyrophosphate Drugs 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000000429 sodium aluminium silicate Substances 0.000 description 1
- 235000012217 sodium aluminium silicate Nutrition 0.000 description 1
- URGAHOPLAPQHLN-UHFFFAOYSA-N sodium aluminosilicate Chemical compound [Na+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O URGAHOPLAPQHLN-UHFFFAOYSA-N 0.000 description 1
- 239000001509 sodium citrate Substances 0.000 description 1
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 229910052911 sodium silicate Inorganic materials 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 235000021286 stilbenes Nutrition 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
- C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/32—Phosphorus-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/10—Polyamides derived from aromatically bound amino and carboxyl groups of amino-carboxylic acids or of polyamines and polycarboxylic acids
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133603—Direct backlight with LEDs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/32—Phosphorus-containing compounds
- C08K2003/321—Phosphates
- C08K2003/324—Alkali metal phosphate
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- Nonlinear Science (AREA)
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- General Engineering & Computer Science (AREA)
- Mathematical Physics (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
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- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
本發明是有關於一種聚醯胺樹脂組成物,此聚醯胺樹脂組成物可具有增進的薄壁造模性以及例如光反射性、耐衝擊強度、耐熱性與耐黃變性的其他物理特性。 The present invention relates to a polyamide resin composition which has improved thin wall moldability and other physical properties such as light reflectivity, impact strength, heat resistance and yellowing resistance.
聚醯胺(polyamide,PA)樹脂作為工程塑膠(engineering plastic)的歷史接近40年,然而對此仍保持有高需求。對聚醯胺樹脂的不間斷的需求,至少一部分由於廣泛種類的聚醯胺樹脂的類型,例如:PA 6、PA 66、PA 610、PA 612、PA 11、PA 12、PA6T、PA6I、PA9T、及其類似物,以及其共聚合物(copolymer)或其混合物(blend),各自具有有用的特性以及各種各樣的性能特徵(performance characteristic)。 Polyamide (PA) resin has been used as engineering plastics for nearly 40 years, but there is still a high demand for this. The uninterrupted demand for polyamide resins is due, at least in part, to the wide variety of polyamine resins, such as PA 6, PA 66, PA 610, PA 612, PA 11, PA 12, PA6T, PA6I, PA9T, And their analogs, as well as their copolymers or blends, each have useful properties and a wide variety of performance characteristics.
藉由添加例如玻璃纖維的無機增強材料(inorganic reinforcing material),聚醯胺樹脂的機械特性(mechanical property)以及耐熱性可被增進。增強聚醯胺樹脂組成物可被用於例如汽車結構材料(structural material)以及內部零件與外部零件的應用。 The mechanical property and heat resistance of the polyamide resin can be enhanced by adding an inorganic reinforcing material such as glass fiber. The reinforced polyamide resin composition can be used, for example, in automotive structural materials as well as in internal and external parts applications.
近來,作為照明設備的例如發光二極體(light emitting diode,LED)以及電致發光(electro luminescence,EL)裝置的新光源增加,因此顯示器(display)及其類似物具有低功率消耗(power consumption)、長壽命期及其類似性質。 Recently, new light sources such as light emitting diodes (LEDs) and electroluminescence (EL) devices have been added as illumination devices, and thus displays and the like have low power consumption (power consumption). ), long life and similar properties.
特別地,藉由玻璃纖維以及於改質聚醯胺(modified polyamide)系樹脂的主鏈中具有芳香族環增強的高耐熱改質聚醯胺系樹脂,亦即聚鄰苯二甲醯胺(polyphthalamide,PPA)系樹脂,普遍地被用作用於各種各樣的具有優異的能源效率(energy efficiency)以及能源壽命(energy lifespan)的LED構件的生產的材料,LED構件例如反射器、反射碗(reflector cup)、擾頻器(scrambler)、外殼(housing)及其類似物。因為樹脂可禁得起用於LED的生產的高溫度,且展現具有高白度指數(whiteness index)的優異的光反射性(light reflectance)、微小的起因於黃變的白度的劣化,以及可更進一步地阻止電的流動。 In particular, a glass fiber and a highly heat-resistant modified polyamido resin having an aromatic ring reinforced in a main chain of a modified polyamide resin, that is, polyphthalamide ( Polyphthalamide, PPA) resin, commonly used as a material for the production of various LED components having excellent energy efficiency and energy lifespan, such as reflectors, reflector bowls ( Reflector cup), scrambler, housing, and the like. Because the resin can withstand high temperatures for the production of LEDs, and exhibits excellent light reflectance with a high whiteness index, slight deterioration of whiteness due to yellowing, and more The flow of electricity is further prevented.
由於環保管制(Environmental regulation),無鉛焊料(lead-free solder),例如由錫-銀合金製成的焊料,越來越重要。無鉛焊料一般具有較傳統的含鉛焊料高的熔點(大約260℃)。適用於無鉛焊料的材料的實例被限定為液晶聚合物(liquid crystal polymer,LCP)、聚苯硫(polyphenylene sulfide,PPS)以及聚鄰苯二甲醯胺(PPA)。 Due to environmental regulation, lead-free solder, such as solder made of tin-silver alloy, is becoming more and more important. Lead-free solders generally have a higher melting point (about 260 ° C) than conventional lead-containing solders. Examples of materials suitable for lead-free solder are defined as liquid crystal polymer (LCP), polyphenylene sulfide (PPS), and polyphthalamide (PPA).
LED一般包括發光的半導體、引線(lead wire)、作為外殼的反射器、以及透明的密封材料。反射器可由各種各樣的材料例如陶瓷或耐熱塑膠製成。然而,陶瓷可能會具有生產率的問題,而且耐熱塑膠可能會具有降低的光學光反射性,降低的光學光反射性起因於顏色上的變化,此顏色上的變化可能是於注射成型製程(injection molding process)、密封產物的硬化製程(curing process)或實際上用於此領域的期間發生。 LEDs typically include a light-emitting semiconductor, a lead wire, a reflector as a housing, and a transparent sealing material. The reflector can be made of a variety of materials such as ceramic or heat resistant plastic. However, ceramics may have productivity problems, and heat-resistant plastics may have reduced optical light reflectivity, and reduced optical light reflectivity may result from changes in color, which may be due to injection molding processes (injection molding) The process, the curing process of the sealed product or the actual use in this field occurs.
為了使用聚醯胺系樹脂作為例如LED、半導體及其類似物的電子構件的材料,例如耐熱性(heat resistance)、耐衝擊強度(impact strength)及其類似性質的物理特性不會劣化,而且增進了薄壁造模性、光反射性、耐黃變性(yellowing resistance)。作為此目的而創作本發明。 In order to use a polyamide resin as a material of an electronic member such as an LED, a semiconductor, and the like, physical properties such as heat resistance, impact strength, and the like are not deteriorated, and are improved. Thin wall moldability, light reflectivity, and yellowing resistance. The present invention has been made for this purpose.
本發明提供一種可具有好的薄壁造模性的聚醯胺樹脂組成物。本發明又提供一種可具有好的光反射性的聚醯胺樹脂組成物。本發明更提供一種可具有好的耐黃變性的聚醯胺樹脂組成物。本發明更再提供一種可具有好的薄壁造模性、光反射性以及耐黃變性,而不具有劣化的例如耐熱性、耐衝擊強度及其類似性質的機械特性的聚醯胺樹脂組成物。 The present invention provides a polyamide resin composition which can have good thin wall moldability. The present invention further provides a polyamide resin composition which can have good light reflectivity. The present invention further provides a polyamide resin composition which can have good yellowing resistance. The present invention further provides a polyamide resin composition which can have good thin wall moldability, light reflectivity, and yellowing resistance without deterioration of mechanical properties such as heat resistance, impact strength, and the like. .
本發明的聚醯胺樹脂組成物可包括(A)10重量%至70重量%的結晶型(crystalline)聚醯胺樹脂;(B)10重量%至70重量%的非晶(amorphous)聚醯胺樹脂;(C)5重量%至30重量%的無機填料(inorganic filler);以及(D)10重量%至50重量%的白色顏料(white pigment),各自以(A)、(B)、(C)以及(D)的總重量(100重量%)為根基。 The polyamide resin composition of the present invention may comprise (A) 10% by weight to 70% by weight of a crystalline polyamine resin; (B) 10% by weight to 70% by weight of amorphous polyfluorene An amine resin; (C) 5 wt% to 30 wt% of an inorganic filler; and (D) 10 wt% to 50 wt% of a white pigment, each of which is (A), (B), The total weight (100% by weight) of (C) and (D) is the base.
根據100重量份的(A)至(D),本發明的聚醯胺樹脂組成物可更包括(E)0.01重量份至2重量份的光安定劑(light stabilizer)。 The polyamine resin composition of the present invention may further comprise (E) 0.01 part by weight to 2 parts by weight of a light stabilizer, based on 100 parts by weight of (A) to (D).
根據100重量份的(A)至(D),本發明的聚醯胺樹脂組成物可更包括(F)0.01重量份至2重量份的磷酸鈉鹽(sodium phosphate salt)。 The polyamine resin composition of the present invention may further comprise (F) 0.01 part by weight to 2 parts by weight of a sodium phosphate salt, based on 100 parts by weight of (A) to (D).
本發明的結晶型聚醯胺樹脂(A)可具有重複單元,上述重複單元源自於包括芳香族二羧酸的二羧酸(dicarboxylic acid)以及脂肪族二胺(aliphatic diamine)、環脂族二胺(cycloaliphatic diamine)、或其組合。 The crystalline polyamine resin (A) of the present invention may have a repeating unit derived from a dicarboxylic acid including an aromatic dicarboxylic acid, and an aliphatic diamine, a cycloaliphatic group. A cycloaliphatic diamine, or a combination thereof.
本發明的結晶型聚醯胺樹脂(A)可具有高於200℃的熔點以及由
如下的化學式3所表示的重複單元:
於上述的化學式3中,m為由4至12的範圍的整數,並且n為由50至500的範圍的整數。 In the above Chemical Formula 3, m is an integer ranging from 4 to 12, and n is an integer ranging from 50 to 500.
本發明的結晶型聚醯胺樹脂(A)可具有藉由微差掃描熱量法(differential scanning calorimetry,DSC)測量為260至320℃的結晶化溫度以及低於130℃的玻璃轉移溫度(glass transition temperature)。 The crystalline polyamine resin (A) of the present invention may have a crystallization temperature of 260 to 320 ° C as measured by differential scanning calorimetry (DSC) and a glass transition temperature of less than 130 ° C (glass transition) Temperature).
本發明的非晶聚醯胺樹脂(B)可具有藉由微差掃描熱量法(DSC)測量為110至200℃的玻璃轉移溫度。 The amorphous polyamide resin (B) of the present invention may have a glass transition temperature of 110 to 200 ° C as measured by a differential scanning calorimetry (DSC).
本發明非晶聚醯胺樹脂(B)可包括由對苯二甲酸(terephthalic acid)以及2,2,4-三甲基六亞甲基二胺或2,4,4-三甲基六亞甲基二胺製備的聚醯胺;由異苯二甲酸以及1,6-六亞甲基二胺製備的聚醯胺;由對苯二甲酸/異苯二甲酸以及1,6-六亞甲基二胺的組合製備的共聚醯胺(copolyamide);由異苯二甲酸(isophthalic acid)、3,3’-二甲基-4,4’-二胺基二環已基甲烷以及月桂內醯胺(laurolactam)或內醯胺(lactam)製備的共聚醯胺;由1,12-十二烷二酸以及4,4’-二胺基二環已基甲烷製備的聚醯胺;由對苯二甲酸/異苯二甲酸、3,3’-二甲基-4,4’-二胺基二環已基甲烷以及月桂內醯胺的組合製備的共聚醯胺;或其組合。 The amorphous polyamidamide resin (B) of the present invention may comprise terephthalic acid and 2,2,4-trimethylhexamethylenediamine or 2,4,4-trimethylhexa Polyamine prepared by methyl diamine; polyamine prepared from isophthalic acid and 1,6-hexamethylenediamine; from terephthalic acid/isophthalic acid and 1,6-hexamethylene Copolyamide prepared by a combination of bis-diamine; isophthalic acid, 3,3'-dimethyl-4,4'-diaminodicyclohexylmethane, and laurel Copolyamine prepared from laurolactam or lactam; polyamine prepared from 1,12-dodecanedioic acid and 4,4'-diaminodicyclohexylmethane; from phenylene Copolyamide prepared by a combination of dicarboxylic acid/isophthalic acid, 3,3'-dimethyl-4,4'-diaminodicyclohexylmethane and laurylamine; or a combination thereof.
本發明的無機填料(C)可包括玻璃纖維、矽灰石(wollastonite)、鈦酸鉀晶鬚(potassium titanate whisker)、硼酸鋁晶鬚(aluminum boric acid whisker)、氧化鋅晶鬚(zinc oxide whisker)、鈣晶鬚(calcium whisker)、或其組合。 The inorganic filler (C) of the present invention may include glass fiber, wollastonite, potassium titanate whisker, aluminum boric acid (aluminum boric acid) Whisker), zinc oxide whisker, calcium whisker, or a combination thereof.
本發明的無機填料(C)可具有0.1μm至11μm的平均長度。 The inorganic filler (C) of the present invention may have an average length of from 0.1 μm to 11 μm.
本發明的白色顏料(D)可包括氧化鈦(titanium oxide)、氧化鋅(zinc oxide)、硫化鋅(zinc sulfide)、鉛白(white lead)、硫酸鋅(zinc sulfate)、硫酸鋇(barium sulfate)、碳化鈣(calcium carbonate)、氧化鋁(aluminum oxide)、或其組合。 The white pigment (D) of the present invention may include titanium oxide, zinc oxide, zinc sulfide, white lead, zinc sulfate, barium sulfate. ), calcium carbonate, aluminum oxide, or a combination thereof.
本發明的光安定劑(E)可包括二苯甲酮系化合物、水楊酸酯系化合物、苯并三唑系化合物、丙烯腈系化合物、受阻胺(hindered amine)系化合物、受阻酚(hindered phenol)系化合物、或其組合。 The photo-stabilizer (E) of the present invention may include a benzophenone-based compound, a salicylate-based compound, a benzotriazole-based compound, an acrylonitrile-based compound, a hindered amine-based compound, and a hindered phenol (hindered). A phenol) compound, or a combination thereof.
本發明的磷酸鈉鹽(F)可包括磷酸一氫鈉(sodium monohydrogen phosphate)、磷酸二氫鈉(sodium dihydrogen phosphate)、磷酸鈉、酸式焦磷酸鈉(sodium acid pyrophosphate)、焦磷酸鈉(sodium pyrophosphate)、或其組合。 The sodium phosphate salt (F) of the present invention may include sodium monohydrogen phosphate, sodium dihydrogen phosphate, sodium phosphate, sodium acid pyrophosphate, sodium sodium pyrophosphate (sodium). Pyrophosphate), or a combination thereof.
本發明的聚醯胺樹脂組成物可具有於440nm波長光測量為高於92%的初始光反射性;在試樣於固定的溫度以及濕度條件下,而且特別是於85℃的溫度以及85%的相對濕度的爐,被LED光源照射達200小時後於440nm的波長光測量為低於5%的光反射性減少;以及在試樣於固定的溫度以及濕度條件下,而且特別是於85℃的溫度以及85%的相對濕度的爐,被LED光源照射達200小時後測量為低於3的黃色指數(△YI)的變化。 The polyamine resin composition of the present invention may have an initial light reflectance of greater than 92% measured at a wavelength of 440 nm; at a fixed temperature and humidity condition of the sample, and particularly at a temperature of 85 ° C and 85% The relative humidity of the furnace, after being illuminated by the LED light source for 200 hours, the light reflectance at 440 nm is reduced to less than 5%; and the sample is at a fixed temperature and humidity, and especially at 85 ° C. The temperature and the 85% relative humidity of the furnace were measured by the LED light source for 200 hours and measured as a change in yellow index (ΔYI) below 3.
本發明的聚醯胺樹脂組成物可具有於金屬模具中以130℃的塑造溫度(molding temperature)以及330℃的注射溫度(injection temperature)測量為高於100mm的螺旋流動長度(spiral flow length),上述金屬模具具有螺旋形狀孔洞,上述螺旋形狀孔洞具有5mm x 0.5mm的尺寸。 The polyamide resin composition of the present invention may have a spiral flow length of more than 100 mm measured in a mold at a molding temperature of 130 ° C and an injection temperature of 330 ° C. The metal mold has a spiral-shaped hole, and the spiral-shaped hole has a size of 5 mm x 0.5 mm.
本發明的聚醯胺樹脂組成物可具有依照使用具有1/8英吋的厚度的試樣(specimen)的ASTM D256測量為高於2kgf‧cm/cm的落錘衝擊強度。 The polyamide resin composition of the present invention may have a drop impact strength of more than 2 kgf ‧ cm/cm as measured by ASTM D256 using a sample having a thickness of 1/8 inch.
本發明的聚醯胺樹脂組成物可具有於1.82 MPa的壓力下依照使用具有1/4英吋的厚度的試樣的ASTM D648測量為高於200℃的HDT。 The polyamide resin composition of the present invention may have an HDT measured at a pressure of 1.82 MPa in accordance with ASTM D648 using a sample having a thickness of 1/4 inch.
本發明現在將被更完全地描述於如下的發明的詳細描述,其中一些但並非全部的發明實施例被描述。當然,此發明可以許多不同的形式被具體實施而且不應侷限於本案中所提出的實施例;更確切地說,所提供的這些實施例使得本公開內容將滿足合用的法律上需求。 The invention will now be described more fully in the following detailed description of the invention, in which some but not all embodiments of the invention are described. Of course, the invention may be embodied in many different forms and should not be limited to the embodiments set forth in the present disclosure; rather, these embodiments are provided so that this disclosure will satisfy the legal requirements of the combination.
本發明有關於可具有增進的薄壁造模性以及例如耐衝擊強度、耐熱性、光反射性與耐黃變性的物理特性的聚醯胺樹脂組成物。 The present invention relates to a polyamide resin composition which can have improved thin wall moldability and physical properties such as impact strength, heat resistance, light reflectivity and yellowing resistance.
本發明的聚醯胺樹脂組成物包括(A)10重量%至70重量%的結晶型聚醯胺樹脂,(B)10重量%至70重量%的非晶聚醯胺樹脂,(C)5重量%至30重量%的無機填料,以及(D)10重量%至50重量%的白色顏料。 The polyamide resin composition of the present invention comprises (A) 10% by weight to 70% by weight of a crystalline polyamide resin, (B) 10% by weight to 70% by weight of an amorphous polyamide resin, (C) 5 From 0.01% by weight to 30% by weight of the inorganic filler, and (D) from 10% by weight to 50% by weight of the white pigment.
(A)結晶型聚醯胺樹脂 (A) crystalline polyamine resin
結晶型聚醯胺樹脂(A)可於其主鏈中包括芳香族環,並且可藉由包括10mol%至100mol%的芳香族二羧酸的二羧酸以及脂肪族二胺、環脂族二胺、或其組合的聚縮合(polycondensation)來製造。 The crystalline polyamine resin (A) may include an aromatic ring in its main chain, and may be composed of a dicarboxylic acid including an aliphatic dicarboxylic acid and an aliphatic diamine, a cycloaliphatic group including 10 mol% to 100 mol%. Manufactured by polycondensation of an amine, or a combination thereof.
芳香族二羧酸的實例可包括但不限於:由如下的化學式1所表示 的對苯二甲酸(TPA)、由如下的化學式2所表示的異苯二甲酸(IPA)及其類似物,以及其組合。 Examples of the aromatic dicarboxylic acid may include, but are not limited to, represented by the following Chemical Formula 1 Terephthalic acid (TPA), isophthalic acid (IPA) represented by the following Chemical Formula 2, and the like, and combinations thereof.
對苯二甲酸(TPA) Terephthalic acid (TPA)
異苯二甲酸(IPA) Isophthalic acid (IPA)
脂肪族或環脂族二胺具有4碳原子至20碳原子。 The aliphatic or cycloaliphatic diamine has from 4 carbon atoms to 20 carbon atoms.
於例示實施例中,結晶型聚醯胺樹脂(A)為由化學式3所表示:
於上述化學式3中,m為由4至12的範圍的整數,並且n為由50至500的範圍的整數。 In the above Chemical Formula 3, m is an integer ranging from 4 to 12, and n is an integer ranging from 50 to 500.
結晶型聚醯胺樹脂(A)的實例包括但不限於:PA6T(m為6)、PA10T(m為10)及其類似物,以及其組合。PA6T為藉由六亞甲基二胺以及對苯二甲酸的聚縮合所製備。PA10T為藉由1,10-癸烷二胺(1,10-decane diamine)以及對苯二甲酸的聚縮合所製備。 Examples of the crystalline polyamine resin (A) include, but are not limited to, PA6T (m is 6), PA10T (m is 10), and the like, and combinations thereof. PA6T is prepared by polycondensation of hexamethylenediamine and terephthalic acid. PA10T is prepared by polycondensation of 1,10-decane diamine and terephthalic acid.
結晶型聚醯胺樹脂(A)的其他實例包括但不限於:聚對苯二甲醯己二胺(polyhexamethylene terephthalamide,PA6T)、聚己醯胺(polycaproamide)/聚對苯二甲醯己二胺共聚合物(PA6/6T)、聚己二醯己二胺(polyhexamethylene adipamide)/聚對苯二甲醯己二胺共聚合物(PA66/6T)、聚己二醯己二胺/聚間苯二甲醯己二胺(polyhexamethylene isophthalamide)共聚合物(PA66/6I)、聚對苯二甲醯己二胺/聚間苯二甲醯己二胺共聚合物(PA6T/6I)、聚對苯二甲醯己二胺/聚月桂醯胺(polydodecanamide)共聚合物(PA6T/12)、聚己二醯己二胺/聚對苯二甲醯己二胺/聚間苯二甲醯己二胺共聚合物(PA66/6T/6I)、聚對苯二甲醯己二胺/聚(2-甲基對苯二甲醯戊二胺)(poly(2-methylpentamethylene terephthalamide))共聚合物(PA6T/PAM5T)、聚對苯二甲醯壬二胺(polynonamethylene terephthalamide)(PA9T)、聚對苯二甲醯癸二胺(polydecamethylene terephthalate)(PA10T)及其類似物,以及其組合。 Other examples of the crystalline polyamine resin (A) include, but are not limited to, polyhexamethylene terephthalamide (PA6T), polycaproamide/polyparaxyl hexamethylenediamine Copolymer (PA6/6T), polyhexamethylene adipamide/poly(p-xylylenediamine adipamide) (PA66/6T), polyhexamethylenediamine/poly-m-phenylene Polyhexamethylene isophthalamide copolymer (PA66/6I), polyparaphenylene hexamethylenediamine/poly-m-xylylenediamine adipamide (PA6T/6I), polyparaphenylene Dimethyl hexamethylenediamine/polydodecanamide copolymer (PA6T/12), polyhexamethylenediamine/polyparaxyl hexamethylenediamine/poly(m-xylylenediamine hexamethylenediamine) Copolymer (PA66/6T/6I), poly(2-methylpentamethylene terephthalamide) (poly(2-methylpentamethylene terephthalamide)) copolymer (PA6T) /PAM5T), polynonamethylene terephthalamide (PA9T), polydecamethylene terephthalate (PA10T) and the like, and combinations thereof .
結晶型聚醯胺樹脂(A)可具有如同藉由微差掃描熱量法(DSC)測量為高於200℃的熔點,例如260℃至350℃,以及作為另一實例290℃至335℃。並且,結晶型聚醯胺樹脂(A)可具有藉由微差掃描熱量法(DSC)測量為260℃至320℃的結晶化溫度,例如270℃至300℃。結晶型聚醯胺樹脂(A)可具有藉由微差掃描熱量法(DSC)測量為低於130℃的玻璃轉移溫度。當熔點以及結晶化溫度在上述範圍內時,則結晶型聚醯胺樹脂可具有好的耐熱性。 The crystalline polyamine resin (A) may have a melting point higher than 200 ° C as measured by differential scanning calorimetry (DSC), for example, 260 ° C to 350 ° C, and as another example 290 ° C to 335 ° C. Further, the crystalline polyamine resin (A) may have a crystallization temperature of 260 ° C to 320 ° C as measured by a differential scanning calorimetry (DSC), for example, 270 ° C to 300 ° C. The crystalline polyamine resin (A) may have a glass transition temperature of less than 130 ° C as measured by differential scanning calorimetry (DSC). When the melting point and the crystallization temperature are within the above range, the crystalline polyamide resin can have good heat resistance.
具有上述特徵的結晶型聚醯胺樹脂(A)的實例包括但不限於:由Mitsui Chemical Company(Japan)製造的C3200以及由Solvay Company(Belgium)製造的A4002。 Examples of the crystalline polyamine resin (A) having the above characteristics include, but are not limited to, C3200 manufactured by Mitsui Chemical Company (Japan) and A4002 manufactured by Solvay Company (Belgium).
根據100重量份的結晶型聚醯胺樹脂(A)、非晶聚醯胺樹脂(B)、無機填料(C)以及白色顏料(D),本發明的熱塑性樹脂組成物可以10重量%至70重量%的量而包括結晶型聚醯胺樹脂(A)。 The thermoplastic resin composition of the present invention may be 10% by weight to 70% based on 100 parts by weight of the crystalline polyamine resin (A), the amorphous polyamide resin (B), the inorganic filler (C), and the white pigment (D). The crystalline polyamine resin (A) is included in an amount by weight %.
(B)非晶聚醯胺樹脂 (B) Amorphous polyamide resin
非晶聚醯胺樹脂(B)可藉由使用如下的單體製備:具有6碳原子至14碳原子的線型(linear)或支鏈型(branched)的二胺,例如1,6-六亞甲基二胺、2-甲基-1,5-二胺基戊烷、2,2,4-三甲基六亞甲基二胺、2,4,4-三甲基六亞甲基二胺、1,9-壬二胺(1,9-nonamethylene diamine)、1,10-癸二胺(1,10-decamethylene diamine)、1,12-十二亞甲基二胺(1,12-dodecamethylene diamine)及其類似物,以及其組合;具有6碳原子至22碳原子的環脂族二胺,例如4,4’-二胺基二環己基甲烷、3,3’-二甲基-4,4’-二胺基環已基甲烷、4,4’-二胺基環已基-2,2-丙烷、1,4-二胺基環己烷(1,4-diaminocyclohexane)、1,4-雙(胺甲基)環己烷、雙(胺甲基)降莰烷(bis(aminomethyl)norbomane)、3-胺甲基-3,5,5-三甲基環己胺及其類似物,以及其組合;具有6碳原子至22碳原子的芳香族脂肪族二胺,例如間二甲苯二胺(m-xylene diamine)、對二甲苯二胺、2,2-雙(4-胺苯基)丙烷及其類似物,以及其組合;具有6碳原子至22碳原子的線型或支鏈型的脂肪族二羧酸,例如己二酸(adipic acid)、2,2,4-三甲基己二酸、2,4,4-三甲基己二酸、壬二酸 (azelaic acid)、癸二酸(sebacic acid)、1,12-十二烷二酸(dodecanedioic acid)及其類似物,以及其組合;具有6碳原子至22碳原子的環脂肪族二羧酸,例如環己烷-1,4-二羧酸、4,4’-二羧基環己基丙烷、1,4-雙(羧甲基)環己烷及其類似物,以及其組合;具有8碳原子至22碳原子的芳香族脂肪族二羧酸,例如二苯基甲烷-4,4’-二羧酸;具有8碳原子至22碳原子的芳香族二羧酸,例如異苯二甲酸、第三丁基異苯二甲酸、對苯二甲酸、1,4-萘二羧酸、1,5-萘二羧酸、2,6-萘二羧酸、2,7-萘二羧酸、聯苯二甲酸(diphenic acid)、二苯基醚-4,4’-二羧酸及其類似物,以及其組合;以及具有6碳原子至12碳原子的內醯胺或月桂內醯胺、ω-胺基二羧酸、ε-己內醯胺(ε-caprolactam)、ε-己胺酸、ω-胺十二碳酸及其類似物,以及其組合。 The amorphous polyamine resin (B) can be produced by using a monomer having a linear or branched diamine having 6 carbon atoms to 14 carbon atoms, for example, 1,6-hexa Methyl diamine, 2-methyl-1,5-diaminopentane, 2,2,4-trimethylhexamethylenediamine, 2,4,4-trimethylhexamethylene Amine, 1,9-nonamethylene diamine, 1,10-decamethylene diamine, 1,12-dodeethylenediamine (1,12- Dodecamethylene diamine) and its analogs, and combinations thereof; cycloaliphatic diamines having 6 to 22 carbon atoms, such as 4,4'-diaminodicyclohexylmethane, 3,3'-dimethyl- 4,4'-diaminocyclohexylmethane, 4,4'-diaminocyclohexyl-2,2-propane, 1,4-diaminocyclohexane, 1 , 4-bis(aminomethyl)cyclohexane, bis(aminomethyl)norbomane, 3-aminomethyl-3,5,5-trimethylcyclohexylamine and Analogs, and combinations thereof; aromatic aliphatic diamines having 6 carbon atoms to 22 carbon atoms, such as m-xylene diamine, p-xylene diamine, 2,2-bis (4- Amine phenyl)propane Analogs thereof, and combinations thereof; linear or branched aliphatic dicarboxylic acids having 6 carbon atoms to 22 carbon atoms, such as adipic acid, 2,2,4-trimethyl adipate , 2,4,4-trimethyladipate, sebacic acid (azelaic acid), sebacic acid, 1,12-dodecanedioic acid and its analogues, and combinations thereof; cycloaliphatic dicarboxylic acids having 6 to 22 carbon atoms , for example, cyclohexane-1,4-dicarboxylic acid, 4,4'-dicarboxycyclohexylpropane, 1,4-bis(carboxymethyl)cyclohexane, and the like, and combinations thereof; having 8 carbons An aromatic aliphatic dicarboxylic acid having an atom to 22 carbon atoms, such as diphenylmethane-4,4'-dicarboxylic acid; an aromatic dicarboxylic acid having 8 to 22 carbon atoms, such as isophthalic acid, Third butyl isophthalic acid, terephthalic acid, 1,4-naphthalene dicarboxylic acid, 1,5-naphthalene dicarboxylic acid, 2,6-naphthalene dicarboxylic acid, 2,7-naphthalene dicarboxylic acid, Diphenic acid, diphenyl ether-4,4'-dicarboxylic acid and the like, and combinations thereof; and an indoleamine or laurylamine having 6 to 12 carbon atoms, Omega-aminodicarboxylic acid, ε-caprolactam, ε-hexylamine, ω-amine dodecanoic acid, and the like, and combinations thereof.
於例示實施例中,非晶聚醯胺樹脂(B)的實例可包括而不具限制:由對苯二甲酸以及2,2,4-三甲基六亞甲基二胺或2,4,4-三甲基六亞甲基二胺製備的聚醯胺;由異苯二甲酸以及1,6-六亞甲基二胺製備的聚醯胺;由對苯二甲酸/異苯二甲酸以及1,6-六亞甲基二胺的組合製備的共聚醯胺;由異苯二甲酸、3,3’-二甲基-4,4’-二胺基二環已基甲烷以及月桂內醯胺或內醯胺製備的共聚醯胺;由1,12-dodecandicarboxylic acid以及4,4’-二胺基二環甲烷製備的聚醯胺;由對苯二甲酸/異苯二甲酸、3,3’-二甲基-4,4’-二胺基二環已基甲烷以及月桂內醯胺的組合製備的共聚醯胺;及其類似物,以及其組合。 In the illustrated embodiment, examples of the amorphous polyamine resin (B) may include, without limitation, from terephthalic acid and 2,2,4-trimethylhexamethylenediamine or 2,4,4 Polyamine prepared by trimethylhexamethylenediamine; polyamine prepared from isophthalic acid and 1,6-hexamethylenediamine; from terephthalic acid/isophthalic acid and 1 Copolyamine prepared by a combination of 6-hexamethylenediamine; from isophthalic acid, 3,3'-dimethyl-4,4'-diaminodicyclohexylmethane, and laurylamine Or copolyamine prepared by indoleamine; polyamine prepared from 1,12-dodecandicarboxylic acid and 4,4'-diaminobicyclomethane; from terephthalic acid/isophthalic acid, 3,3' - Copolyamine prepared by a combination of dimethyl-4,4'-diaminodicyclohexylmethane and laurylamine; and analogs thereof, and combinations thereof.
非晶聚醯胺樹脂(B)可具有如同藉由微差掃描熱量法(DSC)測量為110℃至200℃的玻璃轉移溫度,例如140℃至180℃。 The amorphous polyamide resin (B) may have a glass transition temperature of, for example, 140 ° C to 200 ° C as measured by differential scanning calorimetry (DSC), for example, 140 ° C to 180 ° C.
具有上述特徵的非晶聚醯胺樹脂(B)的實例包括但不限於:由 Evonik Company(Germany)製造的CX7323以及由ARKEMA Company(France)製造的G170。 Examples of the amorphous polyamine resin (B) having the above characteristics include, but are not limited to: CX7323 manufactured by Evonik Company (Germany) and G170 manufactured by ARKEMA Company (France).
根據100重量份的結晶型聚醯胺樹脂(A)、非晶聚醯胺樹脂(B)、無機填料(C)以及白色顏料(D),本發明的熱塑性樹脂組成物可以10重量%至70重量%的量而包括非晶聚醯胺樹脂(B)。 The thermoplastic resin composition of the present invention may be 10% by weight to 70% based on 100 parts by weight of the crystalline polyamine resin (A), the amorphous polyamide resin (B), the inorganic filler (C), and the white pigment (D). The amorphous polyamine resin (B) is included in an amount by weight %.
(C)無機填料 (C) inorganic filler
本發明的聚醯胺樹脂組成物,為了增進機械特性、耐熱性以及樹脂組成物的尺寸穩定性(dimensional stability),可包括各種各樣的形狀的無機填料(C),例如但不限於:纖維(fiber)、粉末、微粒、薄片(flake)、針狀晶體(needle)、織物(cloth)、氈(mat)及其類似物,以及其組合。 The polyamine resin composition of the present invention may include various shapes of inorganic fillers (C) in order to improve mechanical properties, heat resistance, and dimensional stability of the resin composition, such as, but not limited to, fibers. (fiber), powder, microparticles, flakes, needles, cloth, mats, and the like, and combinations thereof.
於本發明中,可使用任何常見的無機填料。例示的無機填料(C)包括但不限於:碳纖維、玻璃纖維、硼纖維、玻璃珠(glass bead)、玻璃薄片、炭黑、矽藻土(diatomaceous earth)、黏土、高嶺土、滑石、雲母、碳化鈣、針狀晶體形狀的填料及其類似物,以及其組合。針狀晶體形狀填料的實例包括而不具限制:玻璃纖維、矽灰石、鈦酸鉀晶鬚、硼酸鋁晶鬚、氧化鋅晶鬚、鈣晶鬚及其類似物,以及其組合。 In the present invention, any common inorganic filler can be used. Exemplary inorganic fillers (C) include, but are not limited to, carbon fibers, glass fibers, boron fibers, glass beads, glass flakes, carbon black, diatomaceous earth, clay, kaolin, talc, mica, carbonization. Calcium, needle-like crystal shaped fillers and the like, and combinations thereof. Examples of the needle-like crystal shaped filler include, without limitation, glass fiber, ash stone, potassium titanate whisker, aluminum borate whisker, zinc oxide whisker, calcium whisker, and the like, and combinations thereof.
當聚醯胺樹脂組成物包括無機填料(C)時,則由聚醯胺樹脂組成物製備的製品可具有好的機械特性,例如抗拉強度(tensile strength)、抗撓強度(flexural strength)以及撓曲模數(flexural modulus),以及耐熱性,例如熱變形溫度(Heat deflection temperature,HDT)。 When the polyamide resin composition includes the inorganic filler (C), the article prepared from the polyamide resin composition may have good mechanical properties such as tensile strength, flexural strength, and Flexural modulus, and heat resistance, such as heat deflection temperature (HDT).
於例如樹脂組成物的薄壁塑模的微塑模區中,提供高流動的樹脂組成物是重要的。於例示實施例中,本發明的聚醯胺樹脂組成物可包括矽灰石,以增進薄壁造模性。當於微塑模區使用矽灰石時,該微塑模區用於樹脂組成物的薄壁塑模例如需要低於1mm的厚度的應用,則可保持基底樹 脂的好的耐熱性以及機械特性而且可增進薄壁造模性。 In a micro-molding zone such as a thin-walled mold of a resin composition, it is important to provide a highly flowing resin composition. In the illustrated embodiment, the polyamide resin composition of the present invention may include a limestone to enhance thin wall moldability. When the ash stone is used in the micro-molding area, the micro-molding area is used for a thin-wall molding of a resin composition, for example, an application requiring a thickness of less than 1 mm to maintain the base tree The good heat resistance and mechanical properties of the grease can also improve the thin wall moldability.
矽灰石可具有0.1μm至11μm的平均長度。矽灰石可具有0.1g/cm3至2g/cm3的視密度(apparent density),例如0.1g/cm3至1g/cm3。矽灰石的切面可為四邊形(quadrangle),但矽灰石的形狀不受限制,並且具有通常知識者可依照組成物的最終用途(end use),而變更以及選擇。 The limestone may have an average length of from 0.1 μm to 11 μm. Silicon limestone may have 0.1g / cm3 to 2g / cm apparent density (apparent density) 3, for example 0.1g / cm 3 to 1g / cm 3. The cut surface of the asbestos may be a quadrangle, but the shape of the asbestos is not limited, and those having ordinary knowledge may change and select according to the end use of the composition.
無機填料(C)可塗覆有機化合物以增進與聚醯胺樹脂的黏著(adhesion)。於例示實施例中,矽灰石、玻璃纖維、鈦酸鉀晶鬚及/或硼酸鋁晶鬚可用於提供高白度。 The inorganic filler (C) may be coated with an organic compound to enhance adhesion to the polyamide resin. In the illustrated embodiment, apatite, glass fiber, potassium titanate whiskers, and/or aluminum borate whiskers can be used to provide high whiteness.
根據100重量份的結晶型聚醯胺樹脂(A)、非晶聚醯胺樹脂(B)、無機填料(C)以及白色顏料(D),本發明的熱塑性樹脂組成物可以包括5重量%至30重量%的無機填料(C)。 The thermoplastic resin composition of the present invention may include 5% by weight to 100 parts by weight of the crystalline polyamine resin (A), the amorphous polyamide resin (B), the inorganic filler (C), and the white pigment (D). 30% by weight of inorganic filler (C).
(D)白色顏料 (D) white pigment
本發明的聚醯胺樹脂組成物可包括白色顏料(D)(其不同於無機填料(C))以最小化黃變以及給予好的光反射性。 The polyamide resin composition of the present invention may include a white pigment (D) which is different from the inorganic filler (C) to minimize yellowing and impart good light reflectivity.
白色顏料(D)的實例可包括但不限於:氧化鈦、氧化鋅、硫化鋅、鉛白、硫酸鋅、硫酸鋇、碳化鈣、氧化鋁及其類似物。白色顏料可以其單獨地或其組合地使用。 Examples of the white pigment (D) may include, but are not limited to, titanium oxide, zinc oxide, zinc sulfide, lead white, zinc sulfate, barium sulfate, calcium carbide, aluminum oxide, and the like. The white pigments may be used singly or in combination.
進而,白色顏料可以偶合劑(coupling agent)來表面處理,偶合劑例如矽烷偶合劑、鈦偶合劑及其類似物,以及其組合。偶合劑的實例可包括但不限於:乙烯基三乙氧基矽烷(vinyltriethoxysilane)、3-胺基丙基三乙氧基矽烷(3-aminopropyltriethoxysilane)、3-環氧丙氧基丙基三乙氧基矽烷(3-glycidoxypropyltriethoxysilane)及其類似物,以及其組合。 Further, the white pigment may be surface-treated with a coupling agent such as a decane coupling agent, a titanium coupling agent, and the like, and combinations thereof. Examples of the coupling agent may include, but are not limited to, vinyltriethoxysilane, 3-aminopropyltriethoxysilane, 3-glycidoxypropyltriethoxysilane 3-glycidoxypropyltriethoxysilane and its analogs, and combinations thereof.
於例示實施例中,白色顏料可為二氧化鈦(titanium dioxide,TiO2),其可增進例如光反射性以及隱藏特性(hiding property)的光學特性。 任何常見的二氧化鈦可使用於本發明的二氧化鈦。二氧化鈦不限制於任何製造其的特定方法,而且可使用常見的製備方法。進而,本發明的二氧化鈦不受微粒尺寸限制。 In the illustrated embodiment, the white pigment may be titanium dioxide (TiO 2 ), which enhances optical properties such as light reflectivity and hiding properties. Any of the usual titanium dioxide can be used in the titanium dioxide of the present invention. Titanium dioxide is not limited to any particular method of making it, and common preparation methods can be used. Further, the titanium dioxide of the present invention is not limited by the particle size.
於例示實施例中,可使用藉由無機或有機表面處理劑處理的二氧化鈦。無機表面處理劑的實例可包括但不限於:氧化鋁(礬土(alumina),Al2O3)、二氧化矽(silicon dioxide)(矽土(silica),SiO2)、二氧化鋯(zircon dioxide)(鋯土(zirconia),ZrO2)、矽酸鈉(sodium silicate)、鋁酸鈉(sodium aluminate)、矽酸鋁鈉(sodium aluminosilicate)、氧化鋅、雲母及其類似物。無機表面處理劑可以其單獨地或其組合地使用。有機表面處理劑的實例可包括但不限於:聚二甲基矽氧烷、三甲基丙烷(TMP)、季戊四醇(pentaerythritol)及其類似物。有機表面處理劑可以其單獨地或其組合地使用。 In the illustrated embodiment, titanium dioxide treated with an inorganic or organic surface treatment agent can be used. Examples of the inorganic surface treatment agent may include, but are not limited to, alumina (alumina, Al 2 O 3 ), silicon dioxide (silica, SiO 2 ), zirconium dioxide (zircon) Dioxide) (zirconia, ZrO 2 ), sodium silicate, sodium aluminate, sodium aluminosilicate, zinc oxide, mica and the like. The inorganic surface treatment agent may be used singly or in combination. Examples of the organic surface treatment agent may include, but are not limited to, polydimethyl methoxy olefin, trimethyl propane (TMP), pentaerythritol, and the like. The organic surface treatment agent may be used singly or in combination.
依據100重量份的二氧化鈦,二氧化鈦可塗覆有低於5重量份的無機或有機表面處理劑。於例示實施例中,依據100重量份的二氧化鈦,二氧化鈦可塗覆有低於2重量份的Al2O3作為無機表面處理劑。 The titanium dioxide may be coated with less than 5 parts by weight of an inorganic or organic surface treatment agent, based on 100 parts by weight of titanium dioxide. In the illustrated embodiment, the titanium dioxide may be coated with less than 2 parts by weight of Al 2 O 3 as an inorganic surface treatment agent in accordance with 100 parts by weight of titanium dioxide.
塗覆有Al2O3二氧化鈦可更塗覆有另一無機表面處理劑,例如但不限於:SiO2、ZrO2、矽酸鈉、鋁酸鈉、矽酸鋁鈉、雲母及其類似物,以及其組合,及/或有機表面處理劑,例如但不限制於:聚二甲基矽氧烷、三甲基丙烷(TMP)、季戊四醇及其類似物,以及其組合。 The coating of Al 2 O 3 titanium dioxide may be further coated with another inorganic surface treatment agent such as, but not limited to, SiO 2 , ZrO 2 , sodium citrate, sodium aluminate, sodium aluminum citrate, mica and the like. And combinations thereof, and/or organic surface treatment agents such as, but not limited to, polydimethyl methoxy olefin, trimethyl propane (TMP), pentaerythritol, and the like, and combinations thereof.
根據100重量份的結晶型聚醯胺樹脂(A)、非晶聚醯胺樹脂(B)、無機填料(C)以及白色顏料(D),本發明的熱塑性樹脂組成物可以10重量%至50重量%的量而包括白色顏料(D)。 The thermoplastic resin composition of the present invention may be 10% by weight to 50% based on 100 parts by weight of the crystalline polyamine resin (A), the amorphous polyamide resin (B), the inorganic filler (C), and the white pigment (D). The amount of % by weight includes the white pigment (D).
當白色顏料(D)的量低於10重量%時,則可能使光阻劣化。當白色顏料(D)的量高於50重量%時,則可能使衝擊阻力劣化。 When the amount of the white pigment (D) is less than 10% by weight, the photoresist may be deteriorated. When the amount of the white pigment (D) is more than 50% by weight, the impact resistance may be deteriorated.
(E)光安定劑 (E) light stabilizer
本發明的聚醯胺樹脂組成物可更包括光安定劑(E)以防止褪色(discoloration)以及抑制光反射性的衰退。光安定劑的實例可包括但不限於:能吸收UV的化合物,例如二苯甲酮系化合物、水楊酸酯系化合物、苯并三唑系化合物、丙烯腈系化合物、其他包含共振結構(resonance structure)的化合物及其類似物;能捕捉自由基的化合物,例如受阻胺系化合物、受阻酚系化合物及其類似物;以及其組合。於結晶型聚醯胺樹脂(A)以及非晶聚醯胺樹脂(B)的混合物中可使用具有高可溶性(solubility)、具有優異的耐熱性、以及於分子中具有醯胺鍵(amide bond)的化合物。並且,能吸收UV的化合物以及能捕捉自由基的化合物兩者皆使用,可增加光穩定性(light stability)。 The polyamide resin composition of the present invention may further include a light stabilizer (E) to prevent discoloration and to suppress deterioration of light reflectivity. Examples of the photosensitizer may include, but are not limited to, compounds capable of absorbing UV, such as benzophenone-based compounds, salicylate-based compounds, benzotriazole-based compounds, acrylonitrile-based compounds, and other resonance-containing structures (resonance) Compounds and analogs thereof; compounds capable of capturing free radicals, such as hindered amine-based compounds, hindered phenolic compounds, and the like; and combinations thereof. It has high solubility (solubility), excellent heat resistance, and amide bond in the molecule in a mixture of the crystalline polyamine resin (A) and the amorphous polyimide resin (B). compound of. Further, both a compound capable of absorbing UV and a compound capable of capturing a radical can be used to increase light stability.
依照聚醯胺樹脂組成物的防止褪色以及抑制光反射性的減少的結果而定,根據100重量份的結晶型聚醯胺樹脂(A)、非晶聚醯胺樹脂(B)、無機填料(C)以及白色顏料(D),聚醯胺樹脂組成物可以更包括0.01重量份至2重量份(例如0.1重量份至2重量份)的光安定劑(E)。 Depending on the result of preventing the fading of the polyimide resin composition and suppressing the decrease in light reflectivity, 100 parts by weight of the crystalline polyamine resin (A), the amorphous polyamide resin (B), and the inorganic filler ( C) and the white pigment (D), the polyamide resin composition may further comprise 0.01 part by weight to 2 parts by weight (for example, 0.1 part by weight to 2 parts by weight) of the light stabilizer (E).
(F)磷酸鈉鹽 (F) sodium phosphate salt
本發明的聚醯胺樹脂組成物可更包括磷酸鈉鹽(F),以給予好的聚醯胺樹脂組成物的光反射性以及熱褪色穩定性、水解安定性(hydrolysis stability)以及光穩定性。當白色顏料(D)以及磷酸鈉鹽(F)兩者皆使用時,則聚醯胺樹脂組成物可具有好的白度以及熱褪色穩定性。由於磷酸鈉鹽(F)可具有優異的白度,因此聚醯胺樹脂組成物可具有好的光反射性。並且,由於聚醯胺樹脂組成物包括具有好的熱褪色穩定性以及水解安定性的磷酸鈉 鹽(F),因此聚醯胺樹脂組成物可具有好的熱褪色穩定性以及水解安定性。 The polyamidamide resin composition of the present invention may further comprise a sodium phosphate salt (F) to impart light reflectivity and thermal fading stability, hydrolytical stability, and photostability of a good polyamide resin composition. . When both the white pigment (D) and the sodium phosphate (F) are used, the polyamide resin composition can have good whiteness and thermal fading stability. Since the sodium phosphate salt (F) can have excellent whiteness, the polyamide resin composition can have good light reflectivity. Also, since the polyamide resin composition includes sodium phosphate having good thermal fading stability and hydrolysis stability Salt (F), and thus the polyamide resin composition can have good thermal fading stability as well as hydrolysis stability.
磷酸鈉鹽(F)的實例可包括但不限於:磷酸一氫鈉、磷酸二氫鈉、磷酸鈉、酸式焦磷酸鈉、焦磷酸鈉及其類似物,以及其組合。磷酸鈉鹽(F)可以其單獨地或其組合地使用。 Examples of the sodium phosphate salt (F) may include, but are not limited to, sodium monohydrogen phosphate, sodium dihydrogen phosphate, sodium phosphate, sodium acid pyrophosphate, sodium pyrophosphate, and the like, and combinations thereof. The sodium phosphate salt (F) may be used singly or in combination.
而且,磷酸鈉鹽(F)可消除於使用聚醯胺樹脂組成物的塑模製程中可能產生的酸,如此可增進熱褪色穩定性以及水解安定性。 Moreover, the sodium phosphate salt (F) can be eliminated from the acid which may be generated in the molding process using the polyamide resin composition, which can improve thermal fading stability and hydrolysis stability.
磷酸鈉鹽(F)不受微粒尺寸限制。磷酸鈉鹽可經表面處理劑處理,以增進其與聚醯胺樹脂的相容性(compatibility)以及於聚醯胺樹脂基質中的磷酸鈉鹽的分散度(dispersion)。 The sodium phosphate salt (F) is not limited by the particle size. The sodium phosphate salt can be treated with a surface treatment agent to enhance its compatibility with the polyamide resin and the dispersion of the sodium phosphate salt in the polyamide resin matrix.
表面處理劑的實例可包括但不限於:例如矽烷(silane)的矽烷偶合劑、環氧矽烷(epoxy silane)及其類似物、鈦偶合劑、有機酸、聚醇(polyol)、矽酮(silicone)及其類似物,以及其組合。 Examples of the surface treatment agent may include, but are not limited to, a decane coupling agent such as silane, epoxy silane and the like, a titanium coupling agent, an organic acid, a polyol, a silicone. And its analogues, as well as combinations thereof.
根據100重量份的結晶型聚醯胺樹脂(A)、非晶聚醯胺樹脂(B)、無機填料(C)以及白色顏料(D),本發明的熱塑性樹脂組成物可以更包括0.01重量份至2重量份(例如0.1重量份至2重量份)的磷酸鈉鹽(F)。 The thermoplastic resin composition of the present invention may further comprise 0.01 parts by weight based on 100 parts by weight of the crystalline polyamine resin (A), the amorphous polyamide resin (B), the inorganic filler (C), and the white pigment (D). Up to 2 parts by weight (for example, 0.1 part by weight to 2 parts by weight) of the sodium phosphate salt (F).
當磷酸鈉鹽(F)的量低於0.01重量份時,則可能使樹脂組成物的光反射性劣化。當磷酸鈉鹽(F)的量高於2重量份時,則可能使樹脂組成物的耐衝擊強度以及耐黃變性劣化。 When the amount of the sodium phosphate salt (F) is less than 0.01 parts by weight, the light reflectivity of the resin composition may be deteriorated. When the amount of the sodium phosphate (F) is more than 2 parts by weight, the impact strength and yellowing resistance of the resin composition may be deteriorated.
(G)添加劑 (G) additive
本發明的聚醯胺樹脂組成物可更包括一個或多個添加劑,例如但不限於:螢光增白劑(fluorescence brightening agent)、潤滑劑(lubricant)、脫模劑(release agent)、成核劑(nucleating agent)、抗靜電劑(antistatic agent)、穩定劑(stabilizer)、增強材料、無機添加劑、例如染料或顏料的著色劑(colorant)及其類似物,以及其組合。只要添加劑不會顯著地折衷樹脂組成物的其他 渴望的特性,添加劑可以常見的量使用。熟練技工可依照組成物的使用以及其渴望的附加特性容易地選擇添加劑的型式以及量而不需過度的實驗。 The polyamide resin composition of the present invention may further comprise one or more additives such as, but not limited to, a fluorescent brightening agent, a lubricant, a release agent, and a nucleation. A nucleating agent, an antistatic agent, a stabilizer, a reinforcing material, an inorganic additive, a colorant such as a dye or a pigment, and the like, and combinations thereof. As long as the additive does not significantly compromise the resin composition of the other Desirable properties, additives can be used in the usual amounts. The skilled artisan can readily select the type and amount of additive depending on the use of the composition and the additional characteristics desired therefrom without undue experimentation.
螢光增白劑可扮演提高聚醯胺樹脂組成物的光反射性的角色。例示螢光增白劑包括而不具限制:例如4-(2-苯并噁唑基)-4'-(5-甲基-2-苯并噁唑基)二苯乙烯、4,4'-雙(2-苯并噁唑基)二苯乙烯的二苯乙烯-雙苯并噁唑(stilbene-bis benzoxazole)衍生物及其類似物,以及其組合。 Fluorescent whitening agents can act to enhance the light reflectivity of the polyamide resin composition. Exemplary fluorescent whitening agents include, but are not limited to, for example, 4-(2-benzoxazolyl)-4'-(5-methyl-2-benzoxazolyl)stilbene, 4,4'- A stilbene-bis benzoxazole derivative of bis(2-benzoxazolyl)stilbene and analogs thereof, and combinations thereof.
例示脫模劑包括而不具限制:含有氟的聚合物、矽酮油、硬脂酸的金屬鹽、二十八酸的金屬鹽、二十八酸的酯蠟、聚乙烯蠟及其類似物,以及其組合。 Exemplary release agents include, but are not limited to, fluorine-containing polymers, oxime oils, metal salts of stearic acid, metal salts of octadecanoic acid, ester waxes of octadecanoic acid, polyethylene waxes, and the like, And its combination.
例示成核劑包括但不限於:滑石、黏土及其類似物,以及其組合。 Exemplary nucleating agents include, but are not limited to, talc, clay, and the like, and combinations thereof.
本發明的聚醯胺樹脂組成物可具有於金屬模具中以130℃的塑造溫度以及330℃的注射溫度下測量為高於100mm的螺旋流動長度,上述金屬模具具有螺旋形狀孔洞,上述螺旋形狀孔洞具有5mm x 0.5mm的尺寸。 The polyamidamide resin composition of the present invention may have a spiral flow length of more than 100 mm measured in a mold at a molding temperature of 130 ° C and an injection temperature of 330 ° C, the above-mentioned metal mold having a spiral-shaped hole, and the above-mentioned spiral-shaped hole Available in 5mm x 0.5mm sizes.
本發明的聚醯胺樹脂組成物可具有於440nm波長光測量為高於92%的初始光反射性;在試樣於固定的溫度以及濕度條件下,而且特別是於85℃的溫度以及85%的相對濕度的爐,被LED光源照射達200小時後於440nm波長光測量為低於5%的光反射性減少;以及於85℃的溫度以及85%的相對濕度下在試樣被LED光源照射達200小時後測量為低於3的黃色指數(yellow index)(△YI)的變化。 The polyamine resin composition of the present invention may have an initial light reflectance of greater than 92% measured at a wavelength of 440 nm; at a fixed temperature and humidity condition of the sample, and particularly at a temperature of 85 ° C and 85% The relative humidity of the furnace, after being illuminated by the LED light source for 200 hours, the light reflectance at 440 nm wavelength is reduced to less than 5%; and the sample is illuminated by the LED light source at a temperature of 85 ° C and a relative humidity of 85% A change in yellow index (ΔYI) below 3 was measured after 200 hours.
本發明的聚醯胺樹脂組成物可具有依照使用具有1/8英吋的厚度的試樣的ASTM D256測量為高於2kgf‧cm/cm的落錘衝擊強度(Izod impact strength)。 The polyamide resin composition of the present invention may have an Izod impact strength of more than 2 kgf ‧ cm/cm as measured by ASTM D256 using a sample having a thickness of 1/8 inch.
本發明的聚醯胺樹脂組成物可具有於1.82 MPa的壓力下依照使用具有1/4英吋的厚度的試樣的ASTM D648測量為高於200℃的熱變形溫 度(HDT)。 The polyamidamide resin composition of the present invention may have a heat distortion temperature higher than 200 ° C measured according to ASTM D648 using a sample having a thickness of 1/4 inch at a pressure of 1.82 MPa. Degree (HDT).
因此,本發明的聚醯胺樹脂組成物可使用於需要好的薄壁造模性的製品中,除此之外,還有好的光反射性、耐熱性、耐衝擊強度、以及耐黃變性。進而,本發明的聚醯胺樹脂組成物藉由包括適當的白色顏料(D)以及磷酸鈉鹽(F)的量,可展現優異的光反射性以及耐衝擊強度,而且同樣地也可增進耐熱性以及水解抗性(hydrolysis resistance),伴隨由組成物暴露於進行的固定溫度以及固定濕度(亦即,85℃以及85%的相對濕度)後而展現的於光反射性的微小衰退以及微小的黃變。因此,本發明的聚醯胺樹脂組成物可用作連續不斷地暴露於高溫度以及高濕度環境的LED反射器材料。 Therefore, the polyamide resin composition of the present invention can be used in articles requiring good thin wall moldability, in addition to good light reflectivity, heat resistance, impact strength, and yellowing resistance. . Further, the polyamidamide resin composition of the present invention can exhibit excellent light reflectivity and impact strength by including an appropriate amount of white pigment (D) and sodium phosphate salt (F), and can also promote heat resistance in the same manner. Sexuality and hydrolysis resistance, accompanied by a slight decay of light reflectance and a slight deterioration of the composition after exposure of the composition to the fixed temperature and fixed humidity (ie, 85 ° C and 85% relative humidity) Yellowing. Therefore, the polyamide resin composition of the present invention can be used as an LED reflector material which is continuously exposed to a high temperature and high humidity environment.
本發明的聚醯胺樹脂組成物不僅可適用於LED應用,而且可適用於其他反射光束的應用。例如,聚醯胺樹脂組成物作為用於反射器的材料,可使用於光發射裝置,例如各種各樣的電器/電子產品、室內燈(indoor lighting)、指示器(indicator)、戶外燈(outdoor lighting)、汽車燈(automobile lighting)、顯示器裝置、前照燈(headlight)及其類似物。 The polyamine resin composition of the present invention is applicable not only to LED applications, but also to other applications of reflected light beams. For example, the polyamide resin composition can be used as a material for a reflector, and can be used for a light-emitting device, such as various electrical/electronic products, indoor lighting, indicators, outdoor lights (outdoor) Lighting), automobile lighting, display devices, headlights and the like.
藉由參照如下的實例,可更好地理解本發明,該實例的本意是說明的目的,而且將不被解釋為於任何方面限制本發明的範圍,而本發明的範圍定義於之後所附的申請專利範圍中。 The invention may be better understood by reference to the following examples, which are not intended to limit the scope of the invention in any way, and the scope of the invention is defined Apply for a patent.
實例Instance
於以下的實例以及比較例中的各成分的詳述提供如下。 The details of the components in the following examples and comparative examples are provided below.
結晶型聚醯胺樹脂 Crystalline polyamine resin
(A1)PA10T (A1) PA10T
使用藉由對苯二甲酸以及1,10-癸烷二胺的聚縮合所製備的於主鏈中包括芳香族環的結晶型聚醯胺樹脂(PA10T)。該結晶型聚醯胺樹脂具有藉由DSC測量為315℃的熔點、280℃的結晶化溫度以及120℃的玻璃轉 移溫度。 A crystalline polyamine resin (PA10T) comprising an aromatic ring in the main chain prepared by polycondensation of terephthalic acid and 1,10-decanediamine is used. The crystalline polyamine resin has a melting point of 315 ° C as measured by DSC, a crystallization temperature of 280 ° C, and a glass transition of 120 ° C. Move the temperature.
(A2)PA6T (A2) PA6T
使用藉由對苯二甲酸以及六亞甲基二胺的聚縮合而製備的於主鏈中包括芳香族環的結晶型聚醯胺樹脂(PA6T)。該結晶型聚醯胺樹脂具有藉由DSC測量為325℃的熔點、295℃的結晶化溫度以及90℃的玻璃轉移溫度。 A crystalline polyamine resin (PA6T) comprising an aromatic ring in the main chain prepared by polycondensation of terephthalic acid and hexamethylenediamine is used. The crystalline polyamine resin had a melting point of 325 ° C as measured by DSC, a crystallization temperature of 295 ° C, and a glass transition temperature of 90 ° C.
(B)非晶聚醯胺樹脂 (B) Amorphous polyamide resin
使用由Arkema Company of France製造的非晶聚醯胺樹脂(產品名稱:G170)。非晶聚醯胺樹脂具有藉由DSC測量為158℃的玻璃轉移溫度而且不具有結晶化溫度。 An amorphous polyamine resin (product name: G170) manufactured by Arkema Company of France was used. The amorphous polyamine resin has a glass transition temperature of 158 ° C as measured by DSC and does not have a crystallization temperature.
(C)無機填料 (C) inorganic filler
(C1)使用由NYCO Company of U.S.A.製造的矽灰石(產品名稱:NYAD 5000)。矽灰石具有2.2μm的平均長度以及0.77g/cm3視密度。 (C1) A ash stone (product name: NYAD 5000) manufactured by NYCO Company of USA was used. The limestone has an average length of 2.2 μm and an apparent density of 0.77 g/cm 3 .
(C2)使用由NYCO Company of U.S.A.製造的矽灰石(產品名稱:NYGLOS 12)。矽灰石具有12μm的平均長度以及0.60g/cm3的視密度。 (C2) A ash stone (product name: NYGLOS 12) manufactured by NYCO Company of USA was used. The limestone has an average length of 12 μm and an apparent density of 0.60 g/cm 3 .
(D)白色顏料 (D) white pigment
使用由KRONOS Company of U.S.A.製造的二氧化鈦(產品名稱:KRONOS 2233)。 Titanium dioxide (product name: KRONOS 2233) manufactured by KRONOS Company of U.S.A. was used.
(E)光安定劑 (E) light stabilizer
使用由BASF Company of Germany製造的光安定劑(產品名稱:CHIMASSORB 944)。 A light stabilizer (product name: CHIMASSORB 944) manufactured by BASF Company of Germany was used.
(F)磷酸鈉鹽 (F) sodium phosphate salt
使用由Innophos Company製造的酸式焦磷酸鈉。 Sodium acid pyrophosphate manufactured by Innophos Company was used.
實例1至7以及比較例1至4 Examples 1 to 7 and Comparative Examples 1 to 4
於下表1中所示的成分的量,透過常見的擠壓機(extruder)加熱240℃至350℃而被擠壓出;以及製備用於樹脂組成物的顆粒。於130℃的溫度持續高於5小時乾燥所製備的顆粒後,使用注射成型機加熱240℃至330℃而製備試樣。 The amounts of the components shown in the following Table 1 were extruded by heating at a common extruder of 240 ° C to 350 ° C; and pellets for the resin composition were prepared. After drying the prepared pellets at a temperature of 130 ° C for more than 5 hours, a sample was prepared by heating 240 ° C to 330 ° C using an injection molding machine.
於下表1中,(A)、(B)、(C)以及(D)的量是根據100重量%的(A)、(B)、(C)以及(D),而且(E)以及(F)的量是根據100重量份的(A)、(B)、(C)以及(D)。 In Table 1 below, the amounts of (A), (B), (C), and (D) are based on 100% by weight of (A), (B), (C), and (D), and (E) and The amount of (F) is based on 100 parts by weight of (A), (B), (C), and (D).
物理特性藉由如下的方法測量,而且結果表示於表2:熔點(Tm,℃):使用由Perkin Elemer Company製造的DSC7,將溫度保持於330℃持續5分鐘、溫度以10℃/min的速率下降至23℃以及溫度以10℃/min的速率上升。測定當分解時的熱吸收峰值(absorption peak)作為熔點。 The physical properties were measured by the following method, and the results are shown in Table 2: Melting point (Tm, ° C): using a DSC7 manufactured by Perkin Elemer Company, the temperature was maintained at 330 ° C for 5 minutes, and the temperature was at a rate of 10 ° C / min. It dropped to 23 ° C and the temperature rose at a rate of 10 ° C / min. The heat absorption peak at the time of decomposition was measured as a melting point.
結晶化溫度(Tc,℃):使用由Perkin Elemer Company製造的DSC7,將溫度保持於330℃持續5分鐘。測定溫度以10℃/min的速率下降至23℃時發生的相轉變溫度(phase transition temperature)的峰值作為結晶化溫度。 Crystallization temperature (Tc, ° C): The temperature was maintained at 330 ° C for 5 minutes using DSC7 manufactured by Perkin Elemer Company. The peak value of the phase transition temperature which occurred when the temperature was lowered to 23 ° C at a rate of 10 ° C/min was measured as the crystallization temperature.
玻璃轉移溫度(Tg,℃):使用由Perkin Elemer Company製造的DSC7,將溫度保持於330℃持續5分鐘、溫度以10℃/min的速率下降至23℃以及溫度以10℃/min的速率上升。測定熔點前的二階吸熱的轉變點作為玻璃轉移溫度。 Glass transition temperature (Tg, °C): using DSC7 manufactured by Perkin Elemer Company, maintaining the temperature at 330 ° C for 5 minutes, the temperature dropping to 23 ° C at a rate of 10 ° C / min, and the temperature rising at a rate of 10 ° C / min . The second-order endothermic transition point before the melting point was measured as the glass transition temperature.
薄壁造模性(螺旋流動長度,mm):使用由Sumitomo Company製造的注射器,使用具有螺旋形狀孔洞的金屬模具,上述螺旋形狀孔洞具有5mm x 0.5mm的尺寸,於130℃的塑造溫度以及注射溫度330℃下注射樹脂。測定螺旋流動長度作為塑模產物的長度。 Thin-wall moldability (spiral flow length, mm): using a syringe manufactured by Sumitomo Company, using a metal mold having a spiral-shaped hole having a size of 5 mm x 0.5 mm, a molding temperature at 130 ° C, and an injection The resin was injected at a temperature of 330 °C. The spiral flow length was measured as the length of the molded product.
耐熱性(HDT,℃):於1.82 MPa的壓力下依照使用具有1/4英吋的厚度的試樣的ASTM D648,測量HDT。 Heat resistance (HDT, ° C): HDT was measured at a pressure of 1.82 MPa in accordance with ASTM D648 using a sample having a thickness of 1/4 inch.
光反射性(%):依照CIE Lab色差評估準則使用Minolta 3600D分光光度計,測量於440nm的波長的初始光反射性(包含鏡面反射光(specular component included,SCI)),而且接著在保持試樣於85℃的溫度以及85%相對濕度的條件下持續200小時後,再次測量光反射性。評估於光反射性的減少。 Light reflectivity (%): The initial light reflectance (including specular component included (SCI)) at a wavelength of 440 nm was measured using a Minolta 3600D spectrophotometer according to the CIE Lab color difference evaluation rule, and then the sample was held. After 200 hours at a temperature of 85 ° C and 85% relative humidity, the light reflectance was measured again. Evaluate the reduction in light reflectivity.
黃色指數(YI):依照CIE Lab色差評估準則使用Minolta 3600D分光光度計,測量初始黃色指數,而且接著在保持試樣於85℃的溫度以及85%相對濕度的條件下持續200小時後,再次測量黃色指數。評估黃色指數(△YI)的變化。 Yellow Index (YI): The initial yellowness index was measured using a Minolta 3600D spectrophotometer according to the CIE Lab color difference evaluation criteria, and then measured again after maintaining the sample at a temperature of 85 ° C and 85% relative humidity for 200 hours. Yellow index. The change in the yellow index (ΔYI) was evaluated.
落錘衝擊強度(kgf‧cm/cm):依照使用具有1/8英吋的厚度的試樣 的ASTM D256,測量落錘衝擊強度。 Drop hammer impact strength (kgf ‧ cm / cm): according to the use of a sample with a thickness of 1 / 8 inch ASTM D256, measuring drop impact strength.
如表2中所示,相較於比較例2以及4,包括結晶型聚醯胺樹脂(A)以及非晶聚醯胺樹脂(B)兩者、以及具有0.1μm至11μm的平均長度與0.1g/cm3至2g/cm3的視密度的矽灰石的實例1至4,薄壁造模性增進了。 As shown in Table 2, both the crystalline polyamine resin (A) and the amorphous polyamide resin (B) were included as compared with Comparative Examples 2 and 4, and had an average length of 0.1 μm to 11 μm and 0.1. Examples 1 to 4 of the asbestos of the apparent density of g/cm3 to 2 g/cm3, the thin wall moldability was improved.
實例3在實例1的聚醯胺樹脂組成物中更包括光安定劑(E)以及磷酸鈉鹽(F)、以及實例4在實例2的聚醯胺樹脂組成物中更包括磷酸鈉鹽(F),實例3以及實例4不會劣化耐熱性以及耐衝擊強度,而且增加薄壁造模性、光反射性以及耐黃變性。 Example 3 further included a light stabilizer (E) and a sodium phosphate (F) in the polyamide resin composition of Example 1, and Example 4 further included a sodium phosphate salt in the polyimide resin composition of Example 2. Example 3 and Example 4 did not deteriorate heat resistance and impact strength, but also increased thin wall moldability, light reflectivity, and yellowing resistance.
然而,於不具有本發明的無機填料(C1)的比較例1中,耐熱性劣化。於比較例3中,其以在本發明的範圍之外的量包括無機填料(C1),薄壁造模性以及初始光反射性劣化了。 However, in Comparative Example 1 which does not have the inorganic filler (C1) of the present invention, heat resistance is deteriorated. In Comparative Example 3, the inorganic filler (C1) was included in an amount outside the range of the present invention, and the thin wall moldability and the initial light reflectivity were deteriorated.
本發明的許多變型以及其他實施例對於一個此發明相關領域中的熟練者而言,將成為具有呈現於前面的描述中的教示的利益的主意。因此,可理解本發明不被限制於所揭露的特定實施例及其變型,而且其他實施例將被包括於所附的申請專利的範圍中。儘管文中採用了特定的術語,但它們僅以一般性以及說明性的意義來使用,而不是出於限制的目的,本發明的範圍定義於申請專利範圍中。 Many variations and other embodiments of the invention will be apparent to those skilled in the <RTIgt; Therefore, it is to be understood that the invention is not limited to the particular embodiment disclosed and the modifications thereof, and other embodiments are included in the scope of the appended claims. The specific terms are used herein, and are used in a generic and descriptive sense only, and not for the purpose of limitation, the scope of the invention is defined in the scope of the claims.
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