TW201320856A - Electronic device - Google Patents

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Publication number
TW201320856A
TW201320856A TW100141060A TW100141060A TW201320856A TW 201320856 A TW201320856 A TW 201320856A TW 100141060 A TW100141060 A TW 100141060A TW 100141060 A TW100141060 A TW 100141060A TW 201320856 A TW201320856 A TW 201320856A
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Taiwan
Prior art keywords
electronic device
foot pad
disk body
disk
connecting portion
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TW100141060A
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Chinese (zh)
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TWI516185B (en
Inventor
Jing-Tang Wu
Chien-Ping Kuo
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Wistron Corp
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Priority to TW100141060A priority Critical patent/TWI516185B/en
Priority to CN201110378170.XA priority patent/CN103108512B/en
Publication of TW201320856A publication Critical patent/TW201320856A/en
Application granted granted Critical
Publication of TWI516185B publication Critical patent/TWI516185B/en

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Abstract

The present invention provides an electronic device disposed on a mounting surface. The electronic device comprises a shell, an electronic assembly and a damping cushion. The shell defines an accommodating space and is formed with an opening. The electronic assembly is connected to the shell and is disposed in the accommodating space. The damping cushion is provided on the shell, extends through the opening and includes a cushion body exposed from the shell and abutting against the mounting surface, and a connecting portion interconnecting the cushion body and the electronic assembly. The damping cushion transfers vibration produced by the electronic assembly in operation to the mounting surface so as to restrain vibration produced by the electronic assembly from being transferred to other assembly of the electronic device through the shell.

Description

電子裝置Electronic device

本發明是有關於一種電子裝置,特別是指一種能減少其電子組件於做動時產生的震動傳遞至其餘組件的電子裝置。The present invention relates to an electronic device, and more particularly to an electronic device capable of reducing the transmission of vibration generated by an electronic component thereof during operation to the remaining components.

一般的喇叭裝置於固定結構上設有吸震墊片,吸震墊片係用以吸收喇叭裝置於做動時產生的震動以避免所產生的震動傳遞至其他元件而影響其他元件做動,如美國發明專利公開第2009/0242322A1號「DAMPER AND FIXING DEVICE USING THE SAME」所揭露者。然而,通過吸震墊片後未被吸收的震動仍會經由供喇叭裝置設置的底座傳遞至設置於底座上的其他元件,而對其他元件產生影響。因此,如何發展出一種電子裝置,其喇叭裝置(或其他會產生震動的電子組件)所產生的震動能被有效地吸收以避免影響其他組件,將成為本案進一步要探討的主題。The general horn device is provided with a shock absorbing pad on the fixed structure, and the shock absorbing pad is used for absorbing the vibration generated by the horn device during the operation to prevent the generated vibration from being transmitted to other components and affecting other components to operate, such as the invention of the United States. Patent Publication No. 2009/0242322A1, "DAMPER AND FIXING DEVICE USING THE SAME". However, shocks that are not absorbed after the shock absorbing pad are still transmitted to other components disposed on the base via the base provided by the horn device, thereby affecting other components. Therefore, how to develop an electronic device whose vibrations generated by the horn device (or other electronic components that generate vibration) can be effectively absorbed to avoid affecting other components will become a subject to be further explored in this case.

因此,本發明之目的,即在提供一種能減少電子組件所產生的震動傳遞至其他組件的電子裝置。Accordingly, it is an object of the present invention to provide an electronic device that reduces the transmission of vibrations generated by electronic components to other components.

於是,本發明電子裝置,設置於一承載面,該電子裝置包含一殼體、一電子組件及一吸震腳墊。該殼體界定一容置空間,該殼體形成有一穿孔。該電子組件連接於該殼體並位於該容置空間內。該吸震腳墊穿設於該穿孔,該吸震腳墊包括一外露於該殼體且抵接於該承載面的腳墊本體,及一連接於該腳墊本體與該電子組件之間的連接部,該吸震腳墊能將該電子組件於作動時產生的震動傳遞至該承載面。Therefore, the electronic device of the present invention is disposed on a carrying surface, and the electronic device comprises a casing, an electronic component and a shock absorbing pad. The housing defines an accommodating space, and the housing is formed with a through hole. The electronic component is connected to the housing and located in the accommodating space. The shock absorbing pad is disposed on the through hole, the shock absorbing pad includes a foot pad body exposed to the housing and abutting the bearing surface, and a connecting portion connected between the foot pad body and the electronic component The shock absorbing pad can transmit the vibration generated when the electronic component is actuated to the bearing surface.

該吸震腳墊還包括一設置於該連接部的彈性體,該彈性體的彈性係數小於該腳墊本體及該連接部。The shock absorbing pad further includes an elastic body disposed on the connecting portion, the elastic body having a modulus of elasticity smaller than the foot pad body and the connecting portion.

該連接部呈柱狀,該連接部遠離該腳墊本體的一端面軸向地凹陷形成有一容置槽,該彈性體是容置於該容置槽內。The connecting portion has a columnar shape, and the connecting portion is axially recessed away from an end surface of the foot pad body to form a receiving groove. The elastic body is received in the receiving groove.

該電子組件具有一凸耳,該凸耳形成有一卡槽,該連接部呈柱狀且包括一連接於該腳墊本體的第一段、一第二段,及一連接於該第一段與第二段之間的縮頸段,該縮頸段的外徑小於該第一段及第二段,該縮頸段能卡合於該卡槽並使該凸耳抵接於該第一段與第二段之間。The electronic component has a lug, and the lug is formed with a card slot. The connecting portion is columnar and includes a first segment and a second segment connected to the pad body, and a first segment is coupled to the first segment a necking section between the second sections, the outer diameter of the necking section being smaller than the first section and the second section, the necking section being engageable with the card slot and abutting the lug to the first section Between the second paragraph.

該腳墊本體包括一盤體,及一連接於該盤體與該第一段之間且外徑小於該盤體的柱體,該盤體具有一環形的內表面,該內表面黏合於該殼體的外表面鄰近該穿孔處。The foot pad body includes a disk body, and a cylinder connected between the disk body and the first segment and having an outer diameter smaller than the disk body, the disk body having an annular inner surface, the inner surface being adhered thereto An outer surface of the housing is adjacent the perforation.

或者,該腳墊本體還包括一形成於該柱體外表面的凸環,該柱體能卡合於該殼體鄰近該穿孔處並使該殼體鄰近該穿孔處抵接於該盤體的內表面與該凸環之間。Or the pad body further includes a convex ring formed on the outer surface of the column, the cylinder being engageable with the housing adjacent to the through hole and abutting the inner surface of the disk adjacent to the through hole Between the convex ring and the convex ring.

該盤體的內表面設有複數個減震凸塊。The inner surface of the disc body is provided with a plurality of damping bumps.

或者,該腳墊本體還包括複數個形成於該柱體外表面的凸翼,該柱體能卡合於該殼體鄰近該穿孔處並使該殼體鄰近該穿孔處抵接於該盤體的內表面與該等凸翼之間。該盤體的內表面設有複數個減震凸塊。Or the pad body further includes a plurality of convex wings formed on the outer surface of the column, the column can be engaged with the housing adjacent to the through hole, and the housing abuts the inner side of the disk body adjacent to the through hole Between the surface and the lobes. The inner surface of the disc body is provided with a plurality of damping bumps.

或者,該彈性體是卡合於該縮頸段並具有一第一彈性部、一第二彈性部,及一連接該第一彈性部及該第二彈性部的頸部,該頸部能卡合於該卡槽,並使該凸耳抵接於該第一彈性部及該第二彈性部之間。Alternatively, the elastic body is engaged with the constricted section and has a first elastic portion, a second elastic portion, and a neck connecting the first elastic portion and the second elastic portion, the neck can be stuck The card slot is engaged with the lug and abuts between the first elastic portion and the second elastic portion.

該腳墊本體包括一盤體,及一連接於該盤體與該第一段之間且外徑小於該盤體的柱體,該盤體具有一環形的內表面。The foot pad body comprises a disk body, and a cylinder connected between the disk body and the first segment and having an outer diameter smaller than the disk body, the disk body having an annular inner surface.

該腳墊本體還包括複數個形成於該柱體外表面的凸翼,該柱體能卡合於該殼體鄰近該穿孔處並使該殼體鄰近該穿孔處抵接於該盤體的內表面與該等凸翼之間。The foot pad body further includes a plurality of convex wings formed on an outer surface of the column, the column body being engageable with the housing adjacent to the through hole and abutting the hole adjacent to the inner surface of the disk body Between the lobes.

或者,該腳墊本體還包括一形成於該柱體外表面的凸環,該柱體能卡合於該殼體鄰近該穿孔處並使該殼體鄰近該穿孔處抵接於該盤體的內表面與該凸環之間。該盤體的內表面設有複數個減震凸塊。Or the pad body further includes a convex ring formed on the outer surface of the column, the cylinder being engageable with the housing adjacent to the through hole and abutting the inner surface of the disk adjacent to the through hole Between the convex ring and the convex ring. The inner surface of the disc body is provided with a plurality of damping bumps.

該盤體的內表面設有複數個減震凸塊。The inner surface of the disc body is provided with a plurality of damping bumps.

或者,該腳墊本體形成有一插槽,該連接部可分離地插設於該插槽內。Alternatively, the foot pad body is formed with a slot, and the connecting portion is detachably inserted into the slot.

該連接部包括一呈柱狀的連接部本體及至少一形成於該連接部本體外表面的定位凸塊,該腳墊本體形成有至少一連通該插槽並對應該定位凸塊的定位槽。The connecting portion includes a columnar connecting portion body and at least one positioning protrusion formed on the outer surface of the connecting portion. The foot pad body is formed with at least one positioning groove that communicates with the slot and should position the protruding block.

該電子組件具有一凸耳,該凸耳形成有一卡槽,該連接部還包括至少二相間隔地形成於該連接部本體外表面的定位環,該連接部的柱體能卡合於該卡槽並使該凸耳抵接於該等定位環之間。The electronic component has a lug, and the lug is formed with a card slot. The connecting portion further includes a positioning ring formed at least two spaced apart from the outer surface of the connecting portion, and the post of the connecting portion can be engaged with the card slot. And the lug is abutted between the positioning rings.

該腳墊本體包括一盤體,及一連接於該盤體且外徑小於該盤體的柱體,該插槽及該定位槽是形成於該柱體,該盤體具有一環形的內表面。The foot pad body includes a disk body, and a cylinder connected to the disk body and having an outer diameter smaller than the disk body. The slot and the positioning groove are formed on the column body, and the disk body has an annular inner surface. .

該腳墊本體還包括一形成於該柱體外表面的凸環,該柱體能卡合於該殼體鄰近該穿孔處並使該殼體鄰近該穿孔處抵接於該盤體的內表面與該凸環之間。The foot pad body further includes a convex ring formed on an outer surface of the column, the cylinder being engageable with the housing adjacent to the through hole and abutting the inner surface of the disk adjacent to the through hole Between the convex rings.

或者,該腳墊本體還包括複數個形成於該柱體外表面的凸翼,該柱體能卡合於該殼體鄰近該穿孔處並使該殼體鄰近該穿孔處抵接於該盤體的內表面與該等凸翼之間。Or the pad body further includes a plurality of convex wings formed on the outer surface of the column, the column can be engaged with the housing adjacent to the through hole, and the housing abuts the inner side of the disk body adjacent to the through hole Between the surface and the lobes.

該盤體的內表面設有複數個減震凸塊。The inner surface of the disc body is provided with a plurality of damping bumps.

該電子組件為一喇叭裝置、一風扇或一儲存裝置。The electronic component is a speaker device, a fan or a storage device.

本發明之功效在於藉由吸震腳墊穿設於殼體且連接於電子組件,使得電子組件於做動時產生的震動能經由吸震腳墊傳遞至承載面,從而減少吸震腳墊未吸收的震動經由殼體傳遞至其他組件。The utility model has the advantages that the shock-absorbing foot pad is disposed in the casing and is connected to the electronic component, so that the vibration generated by the electronic component during the movement can be transmitted to the bearing surface via the shock-absorbing foot pad, thereby reducing the shock absorption of the shock-absorbing foot pad. Transfer to other components via the housing.

有關本發明之前述及其他技術內容、特點與功效,在以下配合參考圖式之九個實施例的詳細說明中,將可清楚的呈現。The foregoing and other technical aspects, features and advantages of the present invention will be apparent from the Detailed Description of the <RTIgt;

在本發明被詳細描述之前,要注意的是,在以下的說明內容中,類似的元件是以相同的編號來表示。Before the present invention is described in detail, it is noted that in the following description, similar elements are denoted by the same reference numerals.

參閱圖1,是本發明電子裝置之第一實施例。電子裝置100設置於一承載面200(見圖2),電子裝置100包含一殼體1、一電子組件2,及一吸震腳墊3。在本實施例中,電子組件2為一喇叭裝置。電子組件2也可以是一風扇或一儲存裝置等需透過減震結構與殼體1結合之組件。電子裝置100可以是具有喇叭裝置及其他電子組件(圖未示)的筆記型電腦或桌上型電腦。Referring to Figure 1, there is shown a first embodiment of an electronic device of the present invention. The electronic device 100 is disposed on a carrying surface 200 (see FIG. 2). The electronic device 100 includes a housing 1, an electronic component 2, and a shock absorbing pad 3. In this embodiment, the electronic component 2 is a horn device. The electronic component 2 can also be a component such as a fan or a storage device that needs to be coupled to the housing 1 through a shock absorbing structure. The electronic device 100 can be a notebook computer or a desktop computer having a speaker device and other electronic components (not shown).

參閱圖1至圖3,殼體1界定一容置空間11,殼體1形成有一穿孔12。電子組件2連接於殼體1並位於容置空間11內。電子組件2具有一凸耳21,凸耳21形成有一卡槽211。Referring to FIGS. 1 to 3, the housing 1 defines an accommodation space 11, and the housing 1 is formed with a through hole 12. The electronic component 2 is connected to the housing 1 and located in the accommodating space 11. The electronic component 2 has a lug 21 formed with a card slot 211.

吸震腳墊3穿設於穿孔12,其包括一外露於殼體1且抵接於承載面200的腳墊本體31、一連接於腳墊本體31與電子組件2之間的連接部32,及一設置於連接部32的彈性體33。腳墊本體31包括一盤體311,及一連接於盤體311且外徑小於盤體311的柱體313,盤體311具有一環形的內表面312,內表面312能透過膠體(圖未示)黏合於殼體1的外表面鄰近穿孔12處,使吸震腳墊3設置於殼體1。連接部32呈柱狀且包括一連接於腳墊本體31柱體313的第一段322、一第二段323,及一連接於第一段322與第二段323之間的縮頸段324,縮頸段324的外徑小於第一段322及第二段323,縮頸段324能卡合於凸耳21上的卡槽211並使凸耳21抵接於第一段322與第二段323之間。連接部32遠離腳墊本體31的端面軸向地凹陷形成有一容置槽321,彈性體33是容置於容置槽321內。彈性體33呈柱狀且其彈性係數小於腳墊本體31及連接部32。在本實施例中,彈性體33、腳墊本體31及連接部32皆是以橡膠為材料製成,其中彈性體33是以彈性係數小於腳墊本體31及連接部32的軟性橡膠製成,藉以提升吸收震動的效果。因此,吸震腳墊3不僅提供一般腳墊的功能,吸震腳墊3還透過彈性體33吸收電子組件2於作動時產生的震動,並透過連接部32及腳墊本體31將未被彈性體33吸收的震動傳遞至承載面200,從而降低傳遞至殼體1的震動以避免影響其他電子組件(圖未示)。於組裝時,先將連接部32伸入穿孔12並將盤體311內表面312黏合於殼體1外表面鄰近穿孔12處,接著將電子組件2的凸耳21與連接部32縮頸段324相互卡合即完成組裝。The shock absorbing pad 3 is disposed in the through hole 12 , and includes a pad body 31 exposed to the housing 1 and abutting the bearing surface 200 , and a connecting portion 32 connected between the pad body 31 and the electronic component 2 , and An elastic body 33 disposed at the connecting portion 32. The pad body 31 includes a disk body 311, and a cylinder 313 connected to the disk body 311 and having an outer diameter smaller than the disk body 311. The disk body 311 has an annular inner surface 312, and the inner surface 312 can pass through the colloid (not shown). The outer surface of the casing 1 is adhered to the perforation 12 so that the shock absorbing pad 3 is disposed on the casing 1. The connecting portion 32 is columnar and includes a first segment 322 connected to the cylinder 313 of the foot pad body 31, a second segment 323, and a constricted portion 324 connected between the first segment 322 and the second segment 323. The outer diameter of the neck portion 324 is smaller than the first segment 322 and the second segment 323. The neck portion 324 can be engaged with the slot 211 of the lug 21 and the lug 21 abuts the first segment 322 and the second portion. Between segments 323. The receiving portion 32 is axially recessed away from the end surface of the foot pad body 31 to form a receiving groove 321 , and the elastic body 33 is received in the receiving groove 321 . The elastic body 33 has a columnar shape and has a modulus of elasticity smaller than that of the foot pad body 31 and the connecting portion 32. In the present embodiment, the elastic body 33, the foot pad body 31 and the connecting portion 32 are all made of rubber, wherein the elastic body 33 is made of soft rubber having a smaller elastic modulus than the foot pad body 31 and the connecting portion 32. In order to enhance the effect of absorbing vibration. Therefore, the shock absorbing pad 3 not only provides the function of the general foot pad, but also absorbs the vibration generated by the electronic component 2 during the operation through the elastic body 33, and is not elasticized through the connecting portion 32 and the foot pad body 31. The absorbed shock is transmitted to the bearing surface 200, thereby reducing the shock transmitted to the housing 1 to avoid affecting other electronic components (not shown). When assembling, the connecting portion 32 is firstly inserted into the through hole 12 and the inner surface 312 of the disk body 311 is adhered to the outer surface of the casing 1 adjacent to the through hole 12, and then the lug 21 of the electronic component 2 and the connecting portion 32 are narrowed to the neck portion 324. Assembly is completed by mutual engagement.

參閱圖4及圖5,是本發明電子裝置之第二實施例。第二實施例與第一實施例相近,其主要差異說明如下。Referring to Figures 4 and 5, there is shown a second embodiment of the electronic device of the present invention. The second embodiment is similar to the first embodiment, and the main differences are explained below.

在本實施例中,腳墊本體31還包括一形成於柱體313外表面的凸環315,柱體313能卡合於殼體1鄰近穿孔12處並使殼體1鄰近穿孔12處抵接於盤體311的內表面312與凸環315之間。藉此,本實施例中的腳墊本體31不需透過膠體(圖未示)設置於殼體1,而能透過凸環315卡合於殼體1。In this embodiment, the foot pad body 31 further includes a convex ring 315 formed on the outer surface of the cylinder 313. The cylinder 313 can be engaged with the housing 1 adjacent to the through hole 12 and abut the housing 1 adjacent to the through hole 12. Between the inner surface 312 of the disk 311 and the convex ring 315. Therefore, the foot pad body 31 of the present embodiment can be disposed in the casing 1 through the convex ring 315 without passing through a rubber body (not shown).

此外,盤體311的內表面312設有複數個減震凸塊314。減震凸塊314能減少腳墊本體31與殼體1的接觸面積,進而減少經由腳墊本體31傳遞至殼體1的震動。再者,當承載面200使電子裝置100處於不平穩的狀態時,減震凸塊314能產生調節高度的作用。In addition, the inner surface 312 of the disk 311 is provided with a plurality of damping bumps 314. The damper bump 314 can reduce the contact area of the foot pad body 31 with the casing 1, thereby reducing the vibration transmitted to the casing 1 via the foot pad body 31. Moreover, when the carrying surface 200 causes the electronic device 100 to be in an unstable state, the damper bump 314 can produce an effect of adjusting the height.

參閱圖6及圖7,是本發明電子裝置之第三實施例。第三實施例與第二實施例相近,只是凸環315(見圖4)是以複數個環設於柱體313外表面的凸翼316取代。在本實施例中,凸翼316的數目為二,且分別形成於柱體313的兩相反側,殼體1形成有二連通穿孔12且對應凸翼316的導槽13。於組裝時,可將凸翼316對準導槽13地將連接部32伸入穿孔12直到內表面312抵接於殼體1外表面,接著旋轉吸震腳墊3使凸翼316抵接於殼體1內表面,即可將腳墊本體31卡合於殼體1。補充說明的是,由於凸翼316與殼體1的接觸面積較凸環315(見圖4)與殼體1的接觸面積小,因此亦能減少經由吸震腳墊3傳遞至殼體1的震動。前述凸翼316與對應的導槽13之數量僅為本發明之一實施例,但本發明不以此為限,例如三個凸翼316與對應的三個導槽13亦可適用。Referring to Figures 6 and 7, a third embodiment of the electronic device of the present invention is shown. The third embodiment is similar to the second embodiment except that the collar 315 (see Fig. 4) is replaced by a plurality of lobes 316 provided on the outer surface of the cylinder 313. In the present embodiment, the number of the cams 316 is two, and are respectively formed on opposite sides of the cylinder 313, and the casing 1 is formed with two communicating perforations 12 and corresponding to the guiding grooves 13 of the protruding wings 316. When assembling, the protruding wing 316 can be aligned with the guiding groove 13 to extend the connecting portion 32 into the through hole 12 until the inner surface 312 abuts against the outer surface of the casing 1, and then the shock absorbing pad 3 is rotated to abut the convex wing 316 against the shell. The inner surface of the body 1 can be engaged with the housing 1 . It is to be noted that since the contact area of the convex wing 316 with the casing 1 is smaller than the contact area of the convex ring 315 (see FIG. 4) with the casing 1, the vibration transmitted to the casing 1 via the shock absorbing pad 3 can also be reduced. . The number of the aforementioned ribs 316 and the corresponding guide slots 13 is only one embodiment of the present invention, but the invention is not limited thereto. For example, the three lobes 316 and the corresponding three guide slots 13 can also be applied.

參閱圖8及圖9,是本發明電子裝置之第四實施例。第四實施例與第三實施例相近,只是彈性體33與連接部32有所不同。Referring to Figures 8 and 9, a fourth embodiment of the electronic device of the present invention is shown. The fourth embodiment is similar to the third embodiment except that the elastic body 33 is different from the connecting portion 32.

在本實施例中,彈性體33是卡合於縮頸段324,且彈性體33的縱剖切面概成「I」形並具有一第一彈性部331、一第二彈性部332,及一連接第一彈性部331及第二彈性部332的頸部333,頸部333能卡合於卡槽211,使凸耳21抵接於第一彈性部331及第二彈性部332之間。也就是說,本實施例的連接部32是透過彈性體33與凸耳21彼此卡合,因此本實施例的第一段322與縮頸段324的比例與第三實施例有所不同。由於本實施例的彈性體33是直接抵接於凸耳21,因此能夠進一步提升吸震的效果。In the present embodiment, the elastic body 33 is engaged with the neck portion 324, and the longitudinal section of the elastic body 33 is "I" shaped and has a first elastic portion 331, a second elastic portion 332, and a The neck portion 333 of the first elastic portion 331 and the second elastic portion 332 is connected, and the neck portion 333 can be engaged with the card slot 211 such that the lug 21 abuts between the first elastic portion 331 and the second elastic portion 332. That is to say, the connecting portion 32 of the present embodiment is engaged with the lug 21 through the elastic body 33, and therefore the ratio of the first segment 322 to the constricted portion 324 of the present embodiment is different from that of the third embodiment. Since the elastic body 33 of the present embodiment directly abuts against the lug 21, the shock absorbing effect can be further improved.

參閱圖10,是本發明電子裝置之第五實施例。該第五實施例與第四實施例相近,只是第四實施例中的凸翼316以凸環315取代。Referring to Figure 10, there is shown a fifth embodiment of the electronic device of the present invention. This fifth embodiment is similar to the fourth embodiment except that the convex wing 316 in the fourth embodiment is replaced by a convex ring 315.

參閱圖11到圖13,是本發明電子裝置之第六實施例。與前述實施例主要的差異是,第一至第五實施例的腳墊本體31與連接部32是一體成形,而本實施例的腳墊本體31與連接部32則是透過卡合結構相互組裝而成。Referring to Figures 11 through 13, there is a sixth embodiment of the electronic device of the present invention. The main difference from the foregoing embodiment is that the foot pad body 31 and the connecting portion 32 of the first to fifth embodiments are integrally formed, and the foot pad body 31 and the connecting portion 32 of the present embodiment are assembled to each other through the engaging structure. Made.

連接部32包括一呈柱狀的連接部本體325、二形成於連接部本體325外表面的定位凸塊326,及至少二相間隔地形成於連接部本體325外表面的定位環327(於本實施例中定位環327的數目為二)。定位凸塊326與定位環327分形成於連接部本體325位於兩相反側的端部。腳墊本體31的柱體313遠離盤體311的端面凹陷形成有一供連接部本體325插置的插槽317,柱體313還形成有二連通插槽317並對應定位凸塊326的定位槽318。於組裝時,首先將腳墊本體31組裝於殼體1,並將連接部32組裝於電子組件2,其中,腳墊本體31是透過凸環315卡設於殼體1鄰近穿孔12處,連接部32是將連接部本體325卡合於凸耳21的卡槽211,並使凸耳21抵接於該等定位環327之間;接著,將連接部本體325形成有定位凸塊326的端部伸入腳墊本體31的插槽317內,並使定位凸塊326伸入定位槽318內,使得連接部32連同電子組件2組裝於腳墊本體31,至此即完成組裝。藉由連接部32與腳墊本體31可相互組裝的結構設計,可降低組裝工序,降低生產的時間與成本。前述定位凸塊326與對應的定位槽318之數量僅為本發明之一實施例,但本發明不以此為限,例如一個定位凸塊326與對應的一個定位槽318,或三個定位凸塊326與對應的三個定位槽318亦可適用。The connecting portion 32 includes a columnar connecting portion body 325, two positioning protrusions 326 formed on the outer surface of the connecting portion body 325, and a positioning ring 327 formed at least two spaced apart from the outer surface of the connecting portion body 325. The number of positioning rings 327 in the embodiment is two). The positioning projection 326 and the positioning ring 327 are formed at the ends of the connecting portion body 325 on opposite sides. The cylinder 313 of the foot pad body 31 is recessed away from the end surface of the disk body 311 to form a slot 317 for inserting the connecting portion body 325. The column body 313 is further formed with two connecting slots 317 and corresponding to the positioning slot 318 of the positioning protrusion 326. . At the time of assembly, the foot pad body 31 is first assembled to the housing 1 and the connecting portion 32 is assembled to the electronic component 2 . The foot pad body 31 is inserted through the protruding ring 315 to the housing 1 adjacent to the through hole 12 and connected. The portion 32 is a card slot 211 for engaging the connecting portion body 325 with the lug 21, and the lug 21 abuts between the positioning rings 327; then, the connecting portion body 325 is formed with the end of the positioning protrusion 326. The portion protrudes into the slot 317 of the foot pad body 31, and the positioning protrusion 326 is inserted into the positioning groove 318, so that the connecting portion 32 is assembled with the electronic component 2 to the foot pad body 31, and the assembly is completed. By the structural design that the connecting portion 32 and the foot pad body 31 can be assembled with each other, the assembly process can be reduced, and the time and cost of production can be reduced. The number of the positioning protrusions 326 and the corresponding positioning slots 318 is only one embodiment of the present invention, but the invention is not limited thereto, for example, one positioning protrusion 326 and a corresponding one of the positioning slots 318, or three positioning protrusions. Block 326 and corresponding three positioning slots 318 are also applicable.

參閱圖14,是本發明電子裝置之第七實施例。第七實施例與第六實施例相近,只是盤體311的內表面312設有複數個減震凸塊314。Referring to Figure 14, there is shown a seventh embodiment of the electronic device of the present invention. The seventh embodiment is similar to the sixth embodiment except that the inner surface 312 of the disk body 311 is provided with a plurality of shock absorbing bumps 314.

參閱圖15,是本發明電子裝置之第八實施例。第八實施例與第七實施例相近,只是第七實施例中的凸環315以凸翼316取代。Referring to Figure 15, there is shown an eighth embodiment of the electronic device of the present invention. The eighth embodiment is similar to the seventh embodiment except that the convex ring 315 in the seventh embodiment is replaced by a convex wing 316.

參閱圖16,是本發明電子裝置之第九實施例。第九實施例與第六實施例相近。在本實施例中,電子裝置還包含另一連接於殼體1並位於容置空間11內電子組件4。電子組件4具有一凸耳41,凸耳41形成有一卡槽411。連接部32的定位環327之數目為三。於組裝時,連接部本體325是卡合於凸耳21的卡槽211並凸耳41的卡槽411,使凸耳21及凸耳41抵接於兩兩定位環327之間。藉此,連接部32能用以連接複數個組件。Referring to Figure 16, there is shown a ninth embodiment of the electronic device of the present invention. The ninth embodiment is similar to the sixth embodiment. In this embodiment, the electronic device further includes another electronic component 4 connected to the housing 1 and located in the accommodating space 11 . The electronic component 4 has a lug 41 formed with a card slot 411. The number of the positioning rings 327 of the connecting portion 32 is three. During assembly, the connecting portion body 325 is engaged with the latching groove 211 of the lug 21 and the latching groove 411 of the lug 41, so that the lug 21 and the lug 41 abut against the two positioning rings 327. Thereby, the connecting portion 32 can be used to connect a plurality of components.

綜上所述,本發明電子裝置藉由吸震腳墊3連接於電子組件2,使電子組件2於做動時產生的震動能經由被吸震腳墊3吸收,且未被吸收的震動能經由吸震腳墊3傳遞至外部的承載面200,進而減少傳遞至殼體1的震動以避免其餘設置在殼體1的組件受到震動的影響;此外,藉由彈性體33的設置能提升吸震腳墊3的吸震效果,且透過減震凸塊314的結構設計能減少傳遞至殼體1的震動;再者,透過可組裝的腳墊本體31與連接部32可減少生產工序以降低成本,故確實能達成本發明之目的。In summary, the electronic device of the present invention is connected to the electronic component 2 by the shock absorbing pad 3, so that the vibration energy generated by the electronic component 2 during the operation can be absorbed by the shock absorbing pad 3, and the unabsorbed vibration energy can be absorbed by the shock. The foot pad 3 is transmitted to the outer bearing surface 200, thereby reducing the vibration transmitted to the housing 1 to prevent the remaining components disposed in the housing 1 from being affected by the vibration; moreover, the shock absorbing pad 3 can be improved by the arrangement of the elastic body 33. The shock absorbing effect and the structural design of the damper bump 314 can reduce the vibration transmitted to the casing 1; furthermore, the assembled foot pad body 31 and the connecting portion 32 can reduce the production process to reduce the cost, so The object of the invention is achieved.

惟以上所述者,僅為本發明之實施例而已,當不能以此限定本發明實施之範圍,即大凡依本發明申請專利範圍及發明說明內容所作之簡單的等效變化與修飾,皆仍屬本發明專利涵蓋之範圍內。However, the above is only the embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are still It is within the scope of the patent of the present invention.

100...電子裝置100. . . Electronic device

1...殼體1. . . case

11...容置空間11. . . Housing space

12...穿孔12. . . perforation

13...導槽13. . . Guide slot

2...電子組件2. . . Electronic component

21...凸耳twenty one. . . Lug

211...卡槽211. . . Card slot

3...吸震腳墊3. . . Shock absorber foot pad

31...腳墊本體31. . . Foot pad body

311...盤體311. . . Disk body

312...內表面312. . . The inner surface

313...柱體313. . . Cylinder

314...減震凸塊314. . . Damping bump

315...凸環315. . . Convex ring

316...凸翼316. . . Convex wing

317...插槽317. . . Slot

318...定位槽318. . . Positioning slot

32...連接部32. . . Connection

321...容置槽321. . . Locating slot

322...第一段322. . . First paragraph

323...第二段323. . . Second paragraph

324...縮頸段324. . . Neck section

325...連接部本體325. . . Connection body

326...定位凸塊326. . . Positioning bump

327...定位環327. . . Locating ring

33...彈性體33. . . Elastomer

331...第一彈性部331. . . First elastic part

332...第二彈性部332. . . Second elastic part

333...頸部333. . . neck

4...電子組件4. . . Electronic component

41...凸耳41. . . Lug

411...卡槽411. . . Card slot

200...承載面200. . . Bearing surface

圖1是本發明電子裝置的第一實施例的一立體分解圖;1 is an exploded perspective view of a first embodiment of an electronic device of the present invention;

圖2是該第一實施例的一剖視圖;Figure 2 is a cross-sectional view of the first embodiment;

圖3是該第一實施例的一吸震腳墊的一立體圖;Figure 3 is a perspective view of a shock absorbing pad of the first embodiment;

圖4是本發明電子裝置的第二實施例的吸震腳墊的一立體圖;4 is a perspective view of a shock absorbing foot pad of a second embodiment of the electronic device of the present invention;

圖5是該第二實施例的一剖視圖;Figure 5 is a cross-sectional view of the second embodiment;

圖6是本發明電子裝置的第三實施例的吸震腳墊的一立體圖;Figure 6 is a perspective view of a shock absorbing foot pad of a third embodiment of the electronic device of the present invention;

圖7是該第三實施例的一立體圖;Figure 7 is a perspective view of the third embodiment;

圖8是本發明電子裝置的第四實施例的吸震腳墊的一立體分解圖;8 is an exploded perspective view of a shock absorbing foot pad of a fourth embodiment of the electronic device of the present invention;

圖9是該第四實施例的一剖視圖;Figure 9 is a cross-sectional view of the fourth embodiment;

圖10是本發明電子裝置的第五實施例的一立體分解圖;Figure 10 is an exploded perspective view showing a fifth embodiment of the electronic device of the present invention;

圖11是本發明電子裝置的第六實施例的一立體分解圖;Figure 11 is an exploded perspective view showing a sixth embodiment of the electronic device of the present invention;

圖12是該第六實施例的一剖視圖;Figure 12 is a cross-sectional view of the sixth embodiment;

圖13是該第六實施例的吸震腳墊的一立體分解圖;Figure 13 is an exploded perspective view of the shock absorbing foot pad of the sixth embodiment;

圖14是本發明電子裝置的第七實施例的一立體分解圖;Figure 14 is an exploded perspective view showing a seventh embodiment of the electronic device of the present invention;

圖15是本發明電子裝置的第八實施例的一立體分解圖;及Figure 15 is an exploded perspective view showing an eighth embodiment of the electronic device of the present invention; and

圖16是本發明電子裝置的第九實施例的一剖視圖。Figure 16 is a cross-sectional view showing a ninth embodiment of the electronic device of the present invention.

1...殼體1. . . case

11...容置空間11. . . Housing space

12...穿孔12. . . perforation

2...電子組件2. . . Electronic component

21...凸耳twenty one. . . Lug

211...卡槽211. . . Card slot

31...腳墊本體31. . . Foot pad body

312...內表面312. . . The inner surface

322...第一段322. . . First paragraph

323...第二段323. . . Second paragraph

324...縮頸段324. . . Neck section

33...彈性體33. . . Elastomer

200...承載面200. . . Bearing surface

Claims (19)

一種電子裝置,設置於一承載面,該電子裝置包含:一殼體,界定一容置空間並形成有一穿孔;一電子組件,連接於該殼體並位於該容置空間內;一吸震腳墊,穿設於該穿孔,該吸震腳墊包括一外露於該殼體且抵接於該承載面的腳墊本體,及一連接於該腳墊本體與該電子組件之間的連接部,該吸震腳墊能將該電子組件於作動時產生的震動傳遞至該承載面。An electronic device is disposed on a carrying surface, the electronic device includes: a casing defining an accommodating space and forming a through hole; an electronic component connected to the casing and located in the accommodating space; a shock absorbing pad The perforating foot pad includes a foot pad body exposed to the housing and abutting the bearing surface, and a connecting portion connected between the foot pad body and the electronic component, the shock absorption The foot pad can transmit the vibration generated by the electronic component when it is actuated to the bearing surface. 依據申請專利範圍第1項所述之電子裝置,其中,該吸震腳墊還包括一設置於該連接部的彈性體,該彈性體的彈性係數小於該腳墊本體及該連接部。The electronic device of claim 1, wherein the shock absorbing pad further comprises an elastic body disposed on the connecting portion, the elastic body having a modulus of elasticity smaller than the foot pad body and the connecting portion. 依據申請專利範圍第2項所述之電子裝置,其中,該連接部呈柱狀,該連接部遠離該腳墊本體的端面軸向地凹陷形成有一容置槽,該彈性體是容置於該容置槽內。The electronic device of claim 2, wherein the connecting portion has a columnar shape, and the connecting portion is axially recessed away from an end surface of the foot pad body to form a receiving groove, and the elastic body is accommodated in the Included in the tank. 依據申請專利範圍第2項所述之電子裝置,其中,該電子組件具有一凸耳,該凸耳形成有一卡槽,該連接部呈柱狀且包括一連接於該腳墊本體的第一段、一第二段,及一連接於該第一段與第二段之間的縮頸段,該縮頸段的外徑小於該第一段及第二段,該縮頸段能卡合於該卡槽並使該凸耳抵接於該第一段與第二段之間。The electronic device of claim 2, wherein the electronic component has a lug, the lug is formed with a card slot, the connecting portion is columnar and includes a first segment connected to the pad body a second section, and a constricted section connected between the first section and the second section, the outer diameter of the constricted section being smaller than the first section and the second section, the constricted section being engageable The card slot and the lug abut between the first segment and the second segment. 依據申請專利範圍第4項所述之電子裝置,其中,該腳墊本體包括一盤體,及一連接於該盤體與該第一段之間且外徑小於該盤體的柱體,該盤體具有一環形的內表面,該內表面黏合於該殼體的外表面鄰近該穿孔處。The electronic device of claim 4, wherein the foot pad body comprises a disk body, and a cylinder connected between the disk body and the first segment and having an outer diameter smaller than the disk body, The disk body has an annular inner surface that is bonded to the outer surface of the housing adjacent the perforation. 依據申請專利範圍第4項所述之電子裝置,其中,該腳墊本體包括一盤體,及一連接於該盤體與該第一段之間且外徑小於該盤體的柱體,該盤體具有一環形的內表面,該腳墊本體還包括一形成於該柱體外表面的凸環,該柱體能卡合於該殼體鄰近該穿孔處並使該殼體鄰近該穿孔處抵接於該盤體的內表面與該凸環之間。The electronic device of claim 4, wherein the foot pad body comprises a disk body, and a cylinder connected between the disk body and the first segment and having an outer diameter smaller than the disk body, The disk body has an annular inner surface, and the foot pad body further includes a convex ring formed on the outer surface of the column, the column body being engageable with the housing adjacent to the through hole and abutting the housing adjacent to the through hole Between the inner surface of the disk and the convex ring. 依據申請專利範圍第4項所述之電子裝置,其中,該腳墊本體包括一盤體,及一連接於該盤體與該第一段之間且外徑小於該盤體的柱體,該盤體具有一環形的內表面,該腳墊本體還包括複數個形成於該柱體外表面的凸翼,該柱體能卡合於該殼體鄰近該穿孔處並使該殼體鄰近該穿孔處抵接於該盤體的內表面與該等凸翼之間。The electronic device of claim 4, wherein the foot pad body comprises a disk body, and a cylinder connected between the disk body and the first segment and having an outer diameter smaller than the disk body, The tray body has an annular inner surface, and the foot pad body further includes a plurality of convex wings formed on the outer surface of the column, the cylinder body being engageable with the housing adjacent to the perforation and the housing adjacent to the perforation Connected between the inner surface of the disk and the convex wings. 依據申請專利範圍第6項或第7項所述之電子裝置,其中,該盤體的內表面設有複數個減震凸塊。The electronic device according to claim 6 or 7, wherein the inner surface of the disk body is provided with a plurality of damping bumps. 依據申請專利範圍第4項所述之電子裝置,其中,該彈性體是卡合於該縮頸段並具有一第一彈性部、一第二彈性部,及一連接該第一彈性部及該第二彈性部的頸部,該頸部能卡合於該卡槽,並使該凸耳抵接於該第一彈性部及該第二彈性部之間。The electronic device of claim 4, wherein the elastic body is engaged with the neck portion and has a first elastic portion, a second elastic portion, and a first elastic portion and the first elastic portion a neck portion of the second elastic portion, the neck portion being engageable with the card slot, and the lug abutting between the first elastic portion and the second elastic portion. 依據申請專利範圍第9項所述之電子裝置,其中,該腳墊本體包括一盤體,及一連接於該盤體與該第一段之間且外徑小於該盤體的柱體,該盤體具有一環形的內表面,該腳墊本體還包括複數個形成於該柱體外表面的凸翼,該柱體能卡合於該殼體鄰近該穿孔處並使該殼體鄰近該穿孔處抵接於該盤體的內表面與該等凸翼之間。The electronic device of claim 9, wherein the foot pad body comprises a disk body, and a cylinder connected between the disk body and the first segment and having an outer diameter smaller than the disk body, The tray body has an annular inner surface, and the foot pad body further includes a plurality of convex wings formed on the outer surface of the column, the cylinder body being engageable with the housing adjacent to the perforation and the housing adjacent to the perforation Connected between the inner surface of the disk and the convex wings. 依據申請專利範圍第9項所述之電子裝置,其中,該腳墊本體包括一盤體,及一連接於該盤體與該第一段之間且外徑小於該盤體的柱體,該盤體具有一環形的內表面,該腳墊本體還包括一形成於該柱體外表面的凸環,該柱體能卡合於該殼體鄰近該穿孔處並使該殼體鄰近該穿孔處抵接於該盤體的內表面與該凸環之間。The electronic device of claim 9, wherein the foot pad body comprises a disk body, and a cylinder connected between the disk body and the first segment and having an outer diameter smaller than the disk body, The disk body has an annular inner surface, and the foot pad body further includes a convex ring formed on the outer surface of the column, the column body being engageable with the housing adjacent to the through hole and abutting the housing adjacent to the through hole Between the inner surface of the disk and the convex ring. 依據申請專利範圍第10項或第11項所述之電子裝置,其中,該盤體的內表面設有複數個減震凸塊。The electronic device of claim 10, wherein the inner surface of the disk body is provided with a plurality of damping bumps. 依據申請專利範圍第1項所述之電子裝置,其中,該腳墊本體形成有一插槽,該連接部可分離地插設於該插槽內。The electronic device of claim 1, wherein the foot pad body is formed with a slot, and the connecting portion is detachably inserted into the slot. 依據申請專利範圍第13項所述之電子裝置,其中,該連接部包括一呈柱狀的連接部本體及至少一形成於該連接部本體外表面的定位凸塊,該腳墊本體形成有至少一連通該插槽並對應該定位凸塊的定位槽。The electronic device of claim 13, wherein the connecting portion comprises a columnar connecting portion body and at least one positioning protrusion formed on a surface of the outer surface of the connecting portion, the foot pad body being formed with at least A locating slot that connects the slot and should position the bump. 依據申請專利範圍第14項所述之電子裝置,其中,該電子組件具有一凸耳,該凸耳形成有一卡槽,該連接部還包括至少二相間隔地形成於該連接部本體外表面的定位環,該連接部的柱體能卡合於該卡槽並使該凸耳抵接於該等定位環之間。The electronic device of claim 14, wherein the electronic component has a lug, the lug is formed with a card slot, and the connecting portion further comprises at least two spaced apart portions formed on the outer surface of the connecting portion a positioning ring, the column of the connecting portion can be engaged with the card slot and the lug abuts between the positioning rings. 依據申請專利範圍第15項所述之電子裝置,其中,該腳墊本體包括一盤體,及一連接於該盤體且外徑小於該盤體的柱體,該插槽及該定位槽是形成於該柱體,該盤體具有一環形的內表面,該腳墊本體還包括一形成於該柱體外表面的凸環,該柱體能卡合於該殼體鄰近該穿孔處並使該殼體鄰近該穿孔處抵接於該盤體的內表面與該凸環之間。The electronic device of claim 15, wherein the foot pad body comprises a disk body, and a cylinder connected to the disk body and having an outer diameter smaller than the disk body, the slot and the positioning slot are Formed in the cylinder, the disc body has an annular inner surface, the foot pad body further includes a convex ring formed on the outer surface of the column, the cylinder can be engaged with the housing adjacent to the perforation and the shell The body abuts between the inner surface of the disk body and the convex ring adjacent to the through hole. 依據申請專利範圍第15項所述之電子裝置,其中,該腳墊本體包括一盤體,及一連接於該盤體且外徑小於該盤體的柱體,該插槽及該定位槽是形成於該柱體,該盤體具有一環形的內表面,該腳墊本體還包括複數個形成於該柱體外表面的凸翼,該柱體能卡合於該殼體鄰近該穿孔處並使該殼體鄰近該穿孔處抵接於該盤體的內表面與該等凸翼之間。The electronic device of claim 15, wherein the foot pad body comprises a disk body, and a cylinder connected to the disk body and having an outer diameter smaller than the disk body, the slot and the positioning slot are Formed on the cylinder, the disc body has an annular inner surface, the foot pad body further includes a plurality of convex wings formed on the outer surface of the cylinder, the cylinder can be engaged with the casing adjacent to the perforation and The housing abuts between the inner surface of the disk body and the convex wings adjacent to the through hole. 依據申請專利範圍第16項或第17項所述之電子裝置,其中,該盤體的內表面設有複數個減震凸塊。The electronic device of claim 16 or 17, wherein the inner surface of the disk body is provided with a plurality of shock absorbing bumps. 依據申請專利範圍第1項所述之電子裝置,其中,該電子組件為一喇叭裝置、一風扇或一儲存裝置。The electronic device of claim 1, wherein the electronic component is a speaker device, a fan or a storage device.
TW100141060A 2011-11-10 2011-11-10 Electronic device TWI516185B (en)

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CN105704951B (en) * 2014-11-27 2018-08-28 英业达科技有限公司 The protective device of data transmission card
CN205647984U (en) 2016-05-26 2016-10-12 高创(苏州)电子有限公司 Sound production subassembly and display device
WO2017210859A1 (en) * 2016-06-07 2017-12-14 3M Innovative Properties Company Foot for electronic device, electronic device including the foot and method of manufacturing the foot

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