TW201315019A - Coupling feed-in loop antenna - Google Patents

Coupling feed-in loop antenna Download PDF

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TW201315019A
TW201315019A TW100133591A TW100133591A TW201315019A TW 201315019 A TW201315019 A TW 201315019A TW 100133591 A TW100133591 A TW 100133591A TW 100133591 A TW100133591 A TW 100133591A TW 201315019 A TW201315019 A TW 201315019A
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extension
loop
loop antenna
lateral
metal
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TW100133591A
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TWI492452B (en
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Wen-Shan Chen
Yi-Ting Liu
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Univ Southern Taiwan Tech
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Abstract

The invention relates to a coupling feed-in loop antenna. Primarily, it comprises a dielectric substrate, a ground plane, a radiation division of a metal loop, at least one chip inductor, a microstrip-fed transmission line and a planar metal plate. A broadband effect can be achieved by a single resonant path of the radiation division of the metal loop. Then the resonance mode of 1 λ and 1.5 λ for the single resonant path can be adjusted by the chip inductor, combining the effect of reducing frequency for planar metal plate, the resonance of 0.5 λ , 1 λ and 1.5 λ for the single resonant path can be formed as broadband at a low frequency band. Accordingly, such antenna can be operated under the frequency bands of LTE 700, GSM 850/900, PCS, DCS, UMTS, LTE 2300 and LTE 2500 without any addition of antenna volume.

Description

耦合饋入式迴圈天線Coupled feed loop antenna

  本發明係有關於一種耦合饋入式迴圈天線,尤其是指一種可於不增加天線尺寸下,將頻帶適用於LTE700(698~787MHz)、GSM850∕900(824~960MHz)、PCS(1880~1990MHz)、DCS(1710~1880MHz)、UMTS(1920~2170MHz)、LTE2300(2305~2400MHz)以及LTE2500(2500~2690MHz),且製程簡單,具製造成本優勢之耦合饋入式迴圈天線。The present invention relates to a coupled feed-through loop antenna, and more particularly to a frequency band suitable for LTE 700 (698-787 MHz), GSM850 ∕ 900 (824-960 MHz), PCS (1880~) without increasing the antenna size. 1990MHz), DCS (1710 ~ 1880MHz), UMTS (1920 ~ 2170MHz), LTE2300 (2305 ~ 2400MHz) and LTE 2500 (2500 ~ 2690MHz), and the process is simple, coupled with the manufacturing cost advantage of the feed-in loop antenna.

  按,隨著通訊技術的快速發展以及電子產品的日益普及,使得無線訊號傳輸已發展出多種通訊協定與技術,而人們對於無線通訊的需求更是與日俱增,無不希望所使用的手持式電子產品(例如:手機、PDA等)能夠收發處於不同頻帶的訊號,以具備更強大的通訊功能。According to the rapid development of communication technology and the increasing popularity of electronic products, wireless signal transmission has developed a variety of communication protocols and technologies, and the demand for wireless communication is increasing day by day, and all the handheld electronic products are used. (For example, mobile phones, PDAs, etc.) can send and receive signals in different frequency bands to have more powerful communication functions.

  一般而言,在手持式電子產品內通常設置有雙頻或三頻天線,以實現收發不同頻帶訊號之功能,而天線的形式千變萬化,可大致區分為四類:(a)線狀天線(wire antennas):常見的有單極天線(monopole)、偶極天線(dipole)和迴路天線(loop)等;(b)槽孔天線(aperture antennas):有號角天線(horn)和開槽天線(slot)等;(c)印刷電路板天線(printed antennas):例如微帶天線(micro-strip)以及印刷偶極天線(printed dipole)等;和(d)反射面天線(reflector antennas);另一方面,現今於手持式電子產品使用之通訊頻帶常見有低頻的LTE700MHz、GSM850∕900MHz,以及高頻的DCS1800MHz、PCS1900MHz和LTE2300∕2500MHz等;惟,上述習知的天線皆僅可於兩個或三個頻帶內實現訊號之收發,無法涵蓋其它的常用頻帶,例如:美國專利第6727854號揭露一種『平面倒F形天線』(planar inverted-F antenna),該天線僅能於涵蓋GSM850∕900MHz之頻帶下操作。In general, dual- or tri-band antennas are usually installed in handheld electronic products to transmit and receive signals in different frequency bands. The form of antennas is ever-changing and can be roughly classified into four categories: (a) wire antennas (wire) Antennas): common monopoles, dipoles, and loops; (b) aperture antennas: horn antennas and slotted antennas (slots) (c) printed circuit antennas: for example, micro-strips and printed dipoles; and (d) reflector antennas; Today, the communication frequency bands used in handheld electronic products are commonly low-frequency LTE700MHz, GSM850∕900MHz, High-frequency DCS1800MHz, PCS1900MHz, and LTE2300∕2500MHz, etc.; however, the above-mentioned conventional antennas can only transmit and receive signals in two or three frequency bands, and cannot cover other common frequency bands, for example, U.S. Patent No. 6,727,854 A "planar inverted-F antenna" that operates only in the frequency band covering GSM850 ∕ 900 MHz.

  再者,請參閱中華民國發明專利公告號第I254493號揭露之『一種雙頻倒F形天線』,係利用雙共振路徑調整天線之頻寬、阻抗匹配及其增益來實現雙頻或多頻之操作;然,現今使用之頻帶較傳統更低,利用此種方式增加天線之頻帶不僅導致天線的尺寸增加,無法滿足現有手持式電子產品趨向輕薄短小的需求,且使用多重路徑共振的方法亦使得天線結構較為複雜,造成製程繁瑣,製造成本過高。Furthermore, please refer to "a dual-frequency inverted-F antenna" disclosed in the Republic of China Invention Patent Publication No. I254493, which uses a dual resonance path to adjust the bandwidth, impedance matching and gain of the antenna to achieve dual or multiple frequency. Operation; however, the frequency band used today is lower than the conventional one. Increasing the frequency band of the antenna in this way not only leads to an increase in the size of the antenna, but also fails to meet the demand for the current thinness and shortness of the handheld electronic product, and the method of using multiple path resonance also makes The antenna structure is relatively complicated, resulting in cumbersome process and high manufacturing cost.

  今,發明人即是鑑於上述現有之天線在實際實施上仍具有多處之缺失,於是乃一本孜孜不倦之精神,並藉由其豐富之專業知識及多年之實務經驗所輔佐,而加以改善,並據此研創出本發明。Nowadays, the inventor is still in the light of the insatiable spirit of the existing antennas in the actual implementation, and is improved by the rich professional knowledge and years of practical experience. Based on this, the present invention has been developed.

  本發明主要目的為提供一種可於不增加天線尺寸下,將頻帶適用於LTE700(698~787MHz)、GSM850∕900(824~960MHz)、PCS(1880~1990MHz)、DCS(1710~1880MHz)、UMTS(1920~2170MHz)、LTE2300(2305~2400MHz)以及LTE2500(2500~2690MHz),且製程簡單,具製造成本優勢之耦合饋入式迴圈天線。The main object of the present invention is to provide a frequency band suitable for LTE 700 (698 to 787 MHz), GSM850 ∕ 900 (824 to 960 MHz), PCS (1880 to 1990 MHz), DCS (1710 to 1880 MHz), UMTS without increasing the antenna size. (1920 ~ 2170MHz), LTE2300 (2305 ~ 2400MHz) and LTE2500 (2500 ~ 2690MHz), and the process is simple, coupled with the manufacturing cost advantage of the feed-in loop antenna.

  為了達到上述實施目的,本發明人乃研擬如下實施技術,係主要包括一介質基板、一接地面、一金屬迴圈輻射部、至少一晶片電感、一饋入微帶傳輸線以及一平面金屬片;介質基板係具有第一表面以及與其對應之第二表面,並將接地面設置於第一表面上,以作為信號接地之用,再將金屬迴圈輻射部以印刷或蝕刻之方式形成於第一表面,且連接於接地面之一側邊緣,其中金屬迴圈輻射部係具有複數個彎折;接著,將二晶片電感分別設置於金屬迴圈輻射部之彎折處,並將饋入微帶傳輸線對應金屬迴圈輻射部平置於第二表面上,其一端為天線之訊號饋入端,另一端係一耦合端;其中耦合端係由一矩形主體部以及五個與矩形主體部連接之矩形延伸部所組成;而矩形延伸部係分別為位於矩形主體部右上端之第一延伸部、位於第一延伸部下方並與其連接之第二延伸部、位於第二延伸部下方之第三延伸部、相對於第一延伸部之第四延伸部,以及位於第四延伸部下方並與其連接之第五延伸部;最後,將平面金屬片焊接於介質基板與接地面,並與其呈正交狀態。In order to achieve the above-mentioned implementation, the inventors have developed the following implementation techniques, which mainly include a dielectric substrate, a ground plane, a metal loop radiation portion, at least one chip inductor, a feed microstrip transmission line, and a planar metal sheet; The dielectric substrate has a first surface and a second surface corresponding thereto, and the ground surface is disposed on the first surface for signal grounding, and the metal loop radiation portion is formed on the first by printing or etching. The surface is connected to one side edge of the ground plane, wherein the metal loop radiation portion has a plurality of bends; then, the two wafer inductors are respectively disposed at the bend of the metal loop radiation portion, and are fed into the microstrip transmission line The corresponding metal loop radiation portion is laid flat on the second surface, one end of which is the signal feeding end of the antenna, and the other end is a coupling end; wherein the coupling end is composed of a rectangular main body portion and five rectangles connected with the rectangular main body portion The extension portion is formed; and the rectangular extension portion is respectively a first extension portion located at the upper right end of the rectangular body portion, located below the first extension portion and connected thereto a second extension portion, a third extension portion located below the second extension portion, a fourth extension portion relative to the first extension portion, and a fifth extension portion located below and connected to the fourth extension portion; finally, a planar metal piece Soldering on the dielectric substrate and the ground plane, and being orthogonal to it.

  藉此,可透過金屬迴圈輻射部的單一共振路徑形成寬頻之功效,使其於不增加天線體積下,達到同時於LTE700、GSM850∕900、PCS、DCS、UMTS、LTE2300以及LTE2500頻帶下操作,且製程簡單,具有製造成本上的優勢;此外,位於金屬迴圈輻射部二側彎折處之晶片電感可用以調整金屬迴圈輻射部之單一路徑所共振出的1λ及1.5λ共振模態,使得由單一路徑所共振出0.5λ、1λ以及1.5λ可於低頻段形成寬頻,有別於傳統利用晶片電感作為基頻模態之降頻作用;再者,平面金屬片亦可提供降頻及阻抗匹配之功效,使得天線於低頻段有最佳的阻抗操作頻寬。Thereby, the broadband resonant effect can be formed through a single resonant path of the metal loop radiating portion, so that it can operate under the LTE700, GSM850∕900, PCS, DCS, UMTS, LTE2300, and LTE2500 bands without increasing the antenna volume. The process is simple and has the advantage of manufacturing cost; in addition, the chip inductance at the bend of the two sides of the metal loop radiation portion can be used to adjust the 1λ and 1.5λ resonance modes of the single path of the metal loop radiation portion. Therefore, 0.5λ, 1λ, and 1.5λ can be formed by a single path to form a wide frequency band in a low frequency band, which is different from the traditional use of a chip inductor as a fundamental frequency mode for frequency reduction; in addition, a planar metal piece can also be provided. The efficiency of down-conversion and impedance matching allows the antenna to have the best impedance operating bandwidth in the low frequency range.

  本發明之目的及其結構設計功能上的優點,將依據以下圖面所示之較佳實施例予以說明,俾使審查委員能對本發明有更深入且具體之瞭解。The object of the present invention and its structural design and advantages will be explained in the light of the preferred embodiments shown in the following drawings, so that the reviewing committee can have a more in-depth and specific understanding of the present invention.

  首先,請參閱第一~五圖所示,為本發明耦合饋入式迴圈天線之較佳實施例,係主要包括:First, referring to the first to fifth figures, a preferred embodiment of the coupled feed-through loop antenna of the present invention mainly includes:

  一介質基板(1),係具有一第一表面(11)以及一對應第一表面(11)之第二表面(12);其中,介質基板(1)係為FR4環氧玻璃纖維板;a dielectric substrate (1) having a first surface (11) and a second surface (12) corresponding to the first surface (11); wherein the dielectric substrate (1) is an FR4 epoxy fiberglass board;

  一接地面(2),係設置於第一表面(11)上,以作為信號接地之用;a ground plane (2) is disposed on the first surface (11) for signal grounding;

  一金屬迴圈輻射部(3),係以印刷或蝕刻之方式形成於第一表面(11)並連接於接地面(2)之一側邊緣,且金屬迴圈輻射部(3)係具有複數個彎折;a metal loop radiation portion (3) is formed on the first surface (11) by printing or etching and connected to one side edge of the ground plane (2), and the metal loop radiation portion (3) has a plurality of Bend

  至少一晶片電感(4),係設置於金屬迴圈輻射部(3)之彎折處,於本實施例中,係置放二個晶片電感(4)於金屬迴圈輻射部(3)之彎折處;At least one chip inductor (4) is disposed at a bend of the metal loop radiating portion (3). In this embodiment, two chip inductors (4) are placed on the metal loop radiating portion (3). Bending place;

  一饋入微帶傳輸線(5),係對應金屬迴圈輻射部(3)並平置於第二表面(12)上,其一端為天線之訊號饋入端(51),另一端係一耦合端(52),耦合端(52)係由一矩形主體部(6)以及五個與矩形主體部(6)連接之矩形延伸部(7)所組成;而矩形延伸部(7)係分別為位於矩形主體部(6)右上端之第一延伸部(71)、位於第一延伸部(71)下方並與其連接之第二延伸部(72)、位於第二延伸部(72)下方之第三延伸部(73)、相對於第一延伸部(71)之第四延伸部(74),以及位於第四延伸部(74)下方並與其連接之第五延伸部(75);以及a feeding microstrip transmission line (5) corresponding to the metal loop radiation portion (3) and lying on the second surface (12), one end of which is the signal feeding end (51) of the antenna, and the other end is a coupling end (52), the coupling end (52) is composed of a rectangular body portion (6) and five rectangular extensions (7) connected to the rectangular body portion (6); and the rectangular extensions (7) are respectively located a first extension portion (71) at the upper right end of the rectangular body portion (6), a second extension portion (72) located below the first extension portion (71) and connected thereto, and a third portion located below the second extension portion (72) An extension (73), a fourth extension (74) relative to the first extension (71), and a fifth extension (75) located below and coupled to the fourth extension (74);

  一平面金屬片(8),係焊接於介質基板(1)與接地面(2),使得平面金屬片(8)同時與介質基板(1)和接地面(2)同時呈現正交狀態;於本實施例中,平面金屬片(8)之橫、縱向長度分別為50mm和5mm。a planar metal piece (8) soldered to the dielectric substrate (1) and the ground plane (2) such that the planar metal piece (8) simultaneously exhibits an orthogonal state with the dielectric substrate (1) and the ground plane (2); In this embodiment, the horizontal and longitudinal lengths of the planar metal sheets (8) are 50 mm and 5 mm, respectively.

  此外,請再參閱第一~三圖所示,於本實施例中之金屬迴圈輻射部(3)於鄰近平面金屬片(8)處具有一連接段(31),於連接段(31)兩端分別再以一第一彎折段(32)連接相對稱之第一輻射段(33)與第二輻射段(34),且連接段(31)與第一、二輻射段(33)、(34)之間距係為2mm,將電感值為15nH的晶片電感(4)分別置放於第一彎折段(32);再者,第一、二輻射段(33)、(34)於第二彎折段(35)前後所形成之間距係為2mm,且第一、二輻射段(33)、(34)於第二彎折段(35)之後彎折所形成之間距係為1mm;值得注意的,於第四延伸部(74)一側之金屬迴圈輻射部(3),其與接地面(2)連接處之饋入間距係為2mm(請一併參閱第五圖所示)。In addition, referring to the first to third figures, the metal loop radiation portion (3) in the embodiment has a connecting portion (31) adjacent to the planar metal sheet (8), and the connecting portion (31) The first and second radiating sections (33) are connected to the first and second radiating sections (33) by a first bending section (32). (34) The distance between the systems is 2 mm, and the chip inductors (4) having an inductance value of 15 nH are respectively placed in the first bending section (32); further, the first and second radiation sections (33), (34) The distance between the first and second radiant sections (33) and (34) after the second bending section (35) is 2 mm, and the distance between the first and second radiant sections (33) and the third bending section (35) is 1mm; it is worth noting that the metal loop radiating portion (3) on the side of the fourth extension portion (74) has a feeding pitch of 2 mm at the junction with the ground plane (2) (please refer to the fifth diagram together) Shown).

  請參閱第六圖所示,係為本發明較佳實施例之返回損失∕頻率響應圖;於本實施例中,係進一步設置一穿設接地面(2)與介質基板(1)之接頭(9),並與饋入微帶傳輸線(5)之訊號饋入端(51)連接,以供信號饋入;請一併參閱第一圖所示,其中接頭(9)可為50歐姆的SMA接頭(9);而接地面(2)之橫向與縱向長度分別為50mm和100mm,金屬迴圈輻射部(3)之橫、縱向長度分別為50mm和14mm,且金屬迴圈輻射部(3)之路徑總長為262mm,使其路徑可產生約為570MHz之半波長共振;再者,請一併參閱第五圖所示,矩形主體部(6)之橫、縱向長度分別為4mm和10.5mm,且第一延伸部(71)之橫、縱向長度分別為1~4mm和3mm,第二延伸部(72)之橫、縱向長度分別為3.5~10.5mm和3mm,第三延伸部(73)之橫、縱向長度分別為0.1~5mm和2mm,第四延伸部(74)之橫、縱向長度分別為2.5~9.5mm和2mm,第五延伸部(75)之橫、縱向長度分別為2.5~7mm和0.5mm;由圖中之實際量測以及利用Ansoft的高頻電磁模擬軟體(HFSS,High Frequency Structure Simulator)模擬分析所得到的結果可得知,並於返回損失約為6dB的定義下,低頻段頻寬約為338MHz(693~1031MHz)之阻抗頻寬,可操作於LTE700(698~787MHz)、GSM850∕900(824~960MHz)之系統上,而高頻段的部份則是藉由低頻段0.5、1及1.5波長共振模態的高階模態所涵蓋,其高頻段係可操作於DCS(1710~1880MHz)、PCS(1880~1990MHz)、UMTS(1920~2170MHz)、LTE2300(2305~2400MHz)以及LTE2500(2500~2690MHz)系統上,其阻抗頻寬約為1113MHz(1668~2781MHz)。Referring to FIG. 6 , it is a return loss ∕ frequency response diagram of a preferred embodiment of the present invention; in this embodiment, a connector for grounding the ground plane ( 2 ) and the dielectric substrate ( 1 ) is further disposed ( 9), and connected to the signal feeding end (51) of the microstrip transmission line (5) for signal feeding; please refer to the first figure, wherein the connector (9) can be a 50 ohm SMA connector (9); and the lateral and longitudinal lengths of the ground plane (2) are 50 mm and 100 mm, respectively, and the lateral and longitudinal lengths of the metal loop radiating portion (3) are 50 mm and 14 mm, respectively, and the metal loop radiating portion (3) The total length of the path is 262mm, so that the path can generate half-wavelength resonance of about 570MHz. In addition, please refer to the fifth figure, the horizontal and vertical lengths of the rectangular main body part (6) are 4mm and 10.5mm respectively. The length of the first extending portion (71) is 1-4 mm and 3 mm, respectively, and the length of the second extending portion (72) is 3. ~10.5 mm and 3 mm, the lateral and longitudinal lengths of the third extension (73) are respectively 0.1 to 5 mm and 2 mm, and the lateral and longitudinal lengths of the fourth extension (74) are respectively 2.5 to 9.5 mm. And 2mm, the longitudinal and longitudinal lengths of the fifth extension (75) are 2.5-7mm and 0.5mm respectively; the actual measurement in the figure and the high frequency electromagnetic simulation software (HFSS, Highsoft Structure Simulator) using Ansoft The results obtained by the analog analysis show that the low-band bandwidth is about 338MHz (693~1031MHz) and the impedance bandwidth is about LTE700 (698~787MHz) and GSM850. ∕900 (824-960MHz) system, while the high-band part is covered by high-order modes of low-band 0.5, 1 and 1.5-wavelength resonant modes, and its high frequency band is operable DCS (1 The 10 ~ 1880MHz), PCS (1880 ~ 1990MHz), UMTS (1920 ~ 2170MHz), LTE2300 (2305 ~ 2400MHz), and LTE2500 (2500 ~ 2690MHz) system, the impedance bandwidth of approximately 1113MHz (1668 ~ 2781MHz).

  請再參閱第七~八圖所示,係為本發明較佳實施例分別於740MHz以及925MHz之輻射場型圖,由圖形顯示結果可看出於x-y平面具有全向輻射(Omni-directional Radiation)之特性,其y-z平面與x-z平面之輻射場型特性也有不錯的表現;請參閱第九~十一圖所示,係為本發明較佳實施例分別於1785MHz、2025MHz以及2400MHz之輻射場型圖,由圖形顯示結果可看出於x-y平面亦同樣具有不錯的輻射表現,且輻射場型有著相似的特性,使得天線在通訊傳輸上有較穩定之特性。Please refer to the seventh to eighth figures, which are radiation field diagrams of 740 MHz and 925 MHz respectively according to a preferred embodiment of the present invention. It can be seen from the graphical display that the x-y plane has omnidirectional radiation (Omni-directional). Radiation), the radiation field characteristics of the y-z plane and the x-z plane also have a good performance; please refer to the ninth to eleventh figures, which are respectively at 1785MHz, 2025MHz and The 2400MHz radiation field pattern can be seen from the graphical display results. The x-y plane also has good radiation performance, and the radiation field type has similar characteristics, which makes the antenna have stable characteristics in communication transmission.

  由上述之耦合饋入式迴圈天線與實施說明可知,本發明具有以下優點:From the above-described coupled feed-through loop antenna and the implementation description, the present invention has the following advantages:

  1. 本發明係藉由金屬迴圈輻射部的單一共振路徑形成寬頻之功效,相較於傳統利用多重路徑共振的方法以達到雙頻或多頻之方法,本發明可於不增加天線體積下,達到同時於LTE700、GSM850∕900、PCS、DCS、UMTS、LTE2300以及LTE2500頻帶下操作,且製程簡單,具有製造成本上的優勢。The invention realizes the effect of wide frequency by a single resonance path of the metal loop radiation portion, and the invention can achieve the method of multi-channel or multi-frequency by the method of using the multi-path resonance to achieve the dual-frequency or multi-frequency method. At the same time, it operates in the LTE700, GSM850∕900, PCS, DCS, UMTS, LTE2300 and LTE2500 frequency bands, and the process is simple and has the advantage of manufacturing cost.
  2. 本發明係藉由晶片電感調整金屬迴圈輻射部之單一路徑所共振出的1λ及1.5λ共振模態,使得由單一路徑所共振出0.5λ、1λ以及1.5λ可於低頻段形成寬頻,有別於傳統利用晶片電感作為基頻模態之降頻作用。The invention adopts a 1λ and 1.5λ resonance mode which is reinforced by a single path of the metal loop radiating portion of the chip inductor, so that 0.5λ, 1λ and 1.5λ can be formed in a low frequency band by resonance of a single path. Broadband is different from the traditional use of chip inductors as the fundamental frequency mode of the frequency reduction.
  3. 本發明利用平面金屬片達到降頻及阻抗匹配之功效,使得天線於低頻段有最佳的阻抗操作頻寬。The invention utilizes the planar metal piece to achieve the functions of frequency reduction and impedance matching, so that the antenna has the best impedance operation bandwidth in the low frequency band.

  綜上所述,本發明之耦合饋入式迴圈天線,的確能藉由上述所揭露之實施例,達到所預期之使用功效,且本發明亦未曾公開於申請前,誠已完全符合專利法之規定與要求。爰依法提出發明專利之申請,懇請惠予審查,並賜准專利,則實感德便。In summary, the coupled feed-in loop antenna of the present invention can achieve the intended use efficiency by the above-disclosed embodiments, and the present invention has not been disclosed before the application, and has completely complied with the patent law. Regulations and requirements.爰Issuing an application for a patent for invention in accordance with the law, and asking for a review, and granting a patent, is truly sensible.

  惟,上述所揭之圖示及說明,僅為本發明之較佳實施例,非為限定本發明之保護範圍;大凡熟悉該項技藝之人士,其所依本發明之特徵範疇,所作之其它等效變化或修飾,皆應視為不脫離本發明之設計範疇。The illustrations and descriptions of the present invention are merely preferred embodiments of the present invention, and are not intended to limit the scope of the present invention; those skilled in the art, which are characterized by the scope of the present invention, Equivalent variations or modifications are considered to be within the scope of the design of the invention.

(1)...介質基板(1). . . Dielectric substrate

(11)...第一表面(11). . . First surface

(12)...第二表面(12). . . Second surface

(2)...接地面(2). . . Ground plane

(3)...金屬迴圈輻射部(3). . . Metal loop radiation

(31)...連接段(31). . . Connection segment

(32)...第一彎折段(32). . . First bend

(33)...第一輻射段(33). . . First radiant section

(34)...第二輻射段(34). . . Second radiant section

(35)...第二彎折段(35). . . Second bend

(4)...晶片電感(4). . . Chip inductance

(5)...饋入微帶傳輸線(5). . . Feed into the microstrip transmission line

(51)...訊號饋入端(51). . . Signal feed

(52)...耦合端(52). . . Coupling end

(6)...矩形主體部(6). . . Rectangular body

(7)...矩形延伸部(7). . . Rectangular extension

(71)...第一延伸部(71). . . First extension

(72)...第二延伸部(72). . . Second extension

(73)...第三延伸部(73). . . Third extension

(74)...第四延伸部(74). . . Fourth extension

(75)...第五延伸部(75). . . Fifth extension

(8)...平面金屬片(8). . . Plane metal sheet

(9)...接頭(9). . . Connector

第一圖:本發明實施例之外觀立體圖First Figure: Appearance perspective view of an embodiment of the present invention

第二圖:本發明實施例之外觀側視圖Second Figure: Appearance side view of an embodiment of the present invention

第三圖:本發明實施例介質基板第一表面之平面圖Third: a plan view of a first surface of a dielectric substrate according to an embodiment of the present invention

第四圖:本發明實施例介質基板第二表面之平面圖Fourth: plan view of the second surface of the dielectric substrate of the embodiment of the present invention

第五圖:本發明實施例耦合端之局部放大平面圖Figure 5: Partial enlarged plan view of the coupling end of the embodiment of the present invention

第六圖:本發明實施例之返回損失∕頻率響應圖Figure 6: Return loss ∕ frequency response diagram of an embodiment of the present invention

第七圖:本發明實施例於740MHz之輻射場型圖Figure 7: Radiation pattern at 740 MHz of an embodiment of the present invention

第八圖:本發明實施例於925MHz之輻射場型圖Figure 8: Radiation pattern diagram of the embodiment of the present invention at 925 MHz

第九圖:本發明實施例於1785MHz之輻射場型圖Ninth diagram: radiation pattern diagram of the embodiment of the present invention at 1785 MHz

第十圖:本發明實施例於2025MHz之輻射場型圖Figure 11: Radiation pattern diagram of the embodiment of the present invention at 2025 MHz

第十一圖:本發明實施例於2400MHz之輻射場型圖Eleventh figure: radiation pattern diagram of the embodiment of the present invention at 2400 MHz

(1)...介質基板(1). . . Dielectric substrate

(11)...第一表面(11). . . First surface

(12)...第二表面(12). . . Second surface

(3)...金屬迴圈輻射部(3). . . Metal loop radiation

(31)...連接段(31). . . Connection segment

(32)...第一彎折段(32). . . First bend

(33)...第一輻射段(33). . . First radiant section

(34)...第二輻射段(34). . . Second radiant section

(35)...第二彎折段(35). . . Second bend

(4)...晶片電感(4). . . Chip inductance

(5)...饋入微帶傳輸線(5). . . Feed into the microstrip transmission line

(51)...訊號饋入端(51). . . Signal feed

(52)...耦合端(52). . . Coupling end

(6)...矩形主體部(6). . . Rectangular body

(8)...平面金屬片(8). . . Plane metal sheet

(9)...接頭(9). . . Connector

Claims (10)

ㄧ種耦合饋入式迴圈天線,其包括有:
  一介質基板,係具有一第一表面以及一對應該第一表面之第二表面;
  一接地面,係設置於該第一表面上,以作為信號接地之用;
  一金屬迴圈輻射部,係設置於該第一表面並連接於該接地面之一側邊緣,且該金屬迴圈輻射部具有複數個彎折;
  至少一晶片電感,係設置於該金屬迴圈輻射部之彎折處;
  一饋入微帶傳輸線,係對應該金屬迴圈輻射部並平置於該第二表面上,其一端為天線之訊號饋入端,另一端係一耦合端,該耦合端係由一矩形主體部以及五個與該矩形主體部連接之矩形延伸部所組成,該矩形延伸部係分別為位於該矩形主體部右上端之第一延伸部、位於該第一延伸部下方並與其連接之第二延伸部、位於該第二延伸部下方之第三延伸部、相對於該第一延伸部之第四延伸部,以及位於該第四延伸部下方並與其連接之第五延伸部;以及
  一平面金屬片,係正交並連接於該介質基板與該接地面。
A coupled feed-in loop antenna includes:
a dielectric substrate having a first surface and a pair of second surfaces that should be the first surface;
a grounding surface is disposed on the first surface for use as a signal grounding;
a metal loop radiation portion is disposed on the first surface and connected to one side edge of the ground plane, and the metal loop radiation portion has a plurality of bends;
At least one chip inductor is disposed at a bend of the metal loop radiation portion;
a feeding microstrip transmission line corresponding to the metal loop radiation portion and lying on the second surface, one end of which is a signal feeding end of the antenna, and the other end is a coupling end, the coupling end is a rectangular body part And a rectangular extension portion connected to the rectangular body portion, wherein the rectangular extension portion is a first extension portion located at an upper right end of the rectangular body portion, and a second extension below the first extension portion and connected thereto a third extension portion located below the second extension portion, a fourth extension portion opposite to the first extension portion, and a fifth extension portion located below and connected to the fourth extension portion; and a planar metal piece And is orthogonal to and connected to the dielectric substrate and the ground plane.
如申請專利範圍第1項所述之耦合饋入式迴圈天線,其中進一步設置一穿設該接地面與該介質基板之接頭,該接頭並與該饋入微帶傳輸線之訊號饋入端連接,以供信號饋入,且該接頭係為50歐姆的SMA接頭。The coupled feed-in loop antenna according to claim 1, wherein a joint of the ground plane and the dielectric substrate is further disposed, and the joint is connected to the signal feeding end of the feeding microstrip transmission line. For signal feed, and the connector is a 50 ohm SMA connector. 如申請專利範圍第1項所述之耦合饋入式迴圈天線,其中該介質基板係FR4環氧玻璃纖維板。The coupled feed-in loop antenna of claim 1, wherein the dielectric substrate is an FR4 epoxy fiberglass board. 如申請專利範圍第1項所述之耦合饋入式迴圈天線,其中該金屬迴圈輻射部係以印刷或蝕刻之方式形成於該第一表面上。The coupled feed-in loop antenna of claim 1, wherein the metal loop radiating portion is formed on the first surface by printing or etching. 如申請專利範圍第1項所述之耦合饋入式迴圈天線,其中該金屬迴圈輻射部於鄰近該平面金屬片處具有一連接段,該連接段兩端分別以一第一彎折段連接相對稱之第一輻射段與第二輻射段,且該連接段與該第一、二輻射段之間距係2mm,該第一彎折段係分別用以置放該晶片電感,其電感值為15nH。The coupled feed-in loop antenna according to claim 1, wherein the metal loop radiating portion has a connecting portion adjacent to the planar metal piece, and the connecting portion has a first bending portion at each end The first radiant section and the second radiant section are connected, and the distance between the connecting section and the first and second radiating sections is 2 mm, and the first bending section is used for respectively placing the chip inductor, and the inductance value thereof It is 15nH. 如申請專利範圍第5項所述之耦合饋入式迴圈天線,其中該第一、二輻射段於第二彎折段前後所形成之間距係為2mm,且該第一、二輻射段於該第二彎折段之後彎折所形成之間距係為1mm。 The coupled feed-in loop antenna according to claim 5, wherein the first and second radiating segments are formed in a distance of 2 mm between the front and the back of the second bent portion, and the first and second radiating segments are The bending distance formed after the second bending section is 1 mm. 如申請專利範圍第1項所述之耦合饋入式迴圈天線,其中位於該第四延伸部一側之該金屬迴圈輻射部,其與該接地面連接處之饋入間距係為2mm。The coupled feed-in loop antenna according to claim 1, wherein the metal loop radiating portion on the side of the fourth extending portion has a feeding pitch of 2 mm at a joint with the ground plane. 如申請專利範圍第1項所述之耦合饋入式迴圈天線,其中該接地面之橫向與縱向長度分別為50mm和100mm,該金屬迴圈輻射部之橫向與縱向長度分別為50mm和14mm,且該金屬迴圈輻射部之路徑總長為262mm。The coupled feed-in loop antenna according to claim 1, wherein the lateral and longitudinal lengths of the ground plane are 50 mm and 100 mm, respectively, and the lateral and longitudinal lengths of the metal loop radiating portion are 50 mm and 14 mm, respectively. And the total length of the path of the metal loop radiation portion is 262 mm. 如申請專利範圍第1項所述之耦合饋入式迴圈天線,其中該平面金屬片之橫向與縱向長度分別為50mm和5mm。The coupled feed-in loop antenna of claim 1, wherein the planar metal sheet has a lateral and longitudinal length of 50 mm and 5 mm, respectively. 如申請專利範圍第1項所述之耦合饋入式迴圈天線,其中該矩形主體部之橫向與縱向長度分別為4mm和10.5mm,且該第一延伸部之橫向與縱向長度分別為1~4mm和3mm,該第二延伸部之橫向與縱向長度分別為3.5~10.5mm和3mm,該第三延伸部之橫向與縱向長度分別為0.1~5mm和2mm,該第四延伸部之橫向與縱向長度分別為2.5~9.5mm和2mm,該第五延伸部之橫向與縱向長度分別為2.5~7mm和0.5mm。The coupled feed-in loop antenna according to claim 1, wherein the rectangular body portion has a lateral and longitudinal length of 4 mm and 10.5 mm, respectively, and the first and second longitudinal portions have a length of 1 and a length, respectively. ~4 mm and 3 mm, the lateral and longitudinal lengths of the second extension are respectively 3.5 to 10.5 mm and 3 mm, and the lateral and longitudinal lengths of the third extension are 0.1 to 5 mm and 2 mm, respectively. The lateral and longitudinal lengths of the extension are 2.5 to 9.5 mm and 2 mm, respectively, and the lateral and longitudinal lengths of the fifth extension are 2.5 to 7 mm and 0.5 mm, respectively.
TW100133591A 2011-09-19 2011-09-19 Coupling feed-in loop antenna TWI492452B (en)

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CN108511890A (en) * 2018-02-06 2018-09-07 深圳市摩尔环宇通信技术有限公司 A kind of 5G multi-band mobile phone antennas

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TWI700862B (en) * 2019-10-23 2020-08-01 華碩電腦股份有限公司 Loop-like dual-antenna system

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TWI327786B (en) * 2006-10-27 2010-07-21 Univ Nat Sun Yat Sen An emc internal meandered loop antenna for multiband operation

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Publication number Priority date Publication date Assignee Title
CN108511890A (en) * 2018-02-06 2018-09-07 深圳市摩尔环宇通信技术有限公司 A kind of 5G multi-band mobile phone antennas
CN108511890B (en) * 2018-02-06 2024-05-28 深圳市摩尔环宇通信技术有限公司 5G multi-band mobile phone antenna

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