TW201314826A - Ball sucking head, ball carrying device and manufacturing method of ball sucking head - Google Patents

Ball sucking head, ball carrying device and manufacturing method of ball sucking head Download PDF

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TW201314826A
TW201314826A TW101122013A TW101122013A TW201314826A TW 201314826 A TW201314826 A TW 201314826A TW 101122013 A TW101122013 A TW 101122013A TW 101122013 A TW101122013 A TW 101122013A TW 201314826 A TW201314826 A TW 201314826A
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porous body
adsorption head
spheroid
opening
porous
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TW101122013A
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Tadashi Tomoi
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Hioki Electric Works
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Abstract

The subject of the present invention is to firmly carry the balls on the carrying object even if there are protrusions existed in the vicinity of the carrying object. The solution of the present invention comprises: a main body 21 formed with an opening 21c; a porous body 22 which is a plate and inserted in the opening 21c; and an alignment sheet 25 which is formed with through holes 51 for ball alignment and configured on the lower surface 21a of the main body 21 in the state of covering the opening 21c and the outer surface 41 of the porous body 22. The balls may be sucked at the forming portions of through holes 51 by air suction through the porous body 22. The alignment sheet 25 is fixed at the edge of the opening 21c in the lower surface 21a by pressing the press screw 26 of the porous body 22 from the inner side of the main body 21 toward the outer side, and the porous body 22 is protruded to the outside by the pressing force of the press screw 26 so that the outer surface 41 is located further outside than the lower surface 21a.

Description

球狀體吸附頭、球狀體搭載裝置以及球狀體吸附頭製造方法 Spherical adsorption head, spheroid loading device, and spheroid adsorption head manufacturing method

本發明係有關於一種吸附球狀體之球狀體吸附頭、包括該球狀體吸附頭以使球狀體搭載在搭載對象體之球狀體搭載裝置、以及製造吸附球狀體之球狀體吸附頭之球狀體吸附頭製造方法。 The present invention relates to a spheroid adsorption head that adsorbs a spherical body, a spherical body loading device including the spherical adsorption head such that the spherical body is mounted on the mounting target body, and a spherical shape for manufacturing the adsorption spherical body. A method for producing a spheroid adsorption head of a body adsorption head.

此種球狀體吸附頭,眾所周知有開示於日本專利第3228131號公報之包括在導電性球體搭載裝置上之搭載頭。此搭載頭之構成係具有本體、多孔質體及孔板。在此情形下,在本體之下表面側,形成有下部開口之真空吸引空間。又,多孔質體係呈板狀,其閉塞形成於本體之真空吸引空間的開口部,同時被嵌入固定在本體,使得多孔質體之下表面及本體之底面呈平面。又,孔板係一端部被固定在本體之底面,另一端部被連結在具有把手之螺絲,在藉旋轉把手被施加張力之狀態下,沿著多孔質體之下表面及本體之下表面組裝在本體上。 As such a spheroid adsorption head, a mounting head including a conductive ball mounting device disclosed in Japanese Patent No. 3228131 is known. The structure of the mounting head has a body, a porous body, and an orifice plate. In this case, on the lower surface side of the body, a vacuum suction space having a lower opening is formed. Further, the porous system has a plate shape, and the occlusion is formed in the opening portion of the vacuum suction space of the body, and is embedded and fixed to the body such that the lower surface of the porous body and the bottom surface of the body are flat. Further, one end of the orifice plate is fixed to the bottom surface of the body, and the other end portion is coupled to the screw having the handle, and is assembled along the lower surface of the porous body and the lower surface of the body while the tension is applied by the rotary handle. On the body.

【先行技術文獻】 [First technical literature] 【專利文獻】 [Patent Literature]

【專利文獻1】日本專利第3228131號公報(第2~3頁,第2圖) [Patent Document 1] Japanese Patent No. 3228131 (pages 2 to 3, FIG. 2)

但是,上述搭載頭有以下之問題點。亦即,在此搭載頭中,吸附有導電性球體之多孔質體下表面與本體之底面呈平面狀態。亦即,在此搭載頭中,於吸附有導電性球體之多孔質體下表面之周圍處,存在有與該下表面無高低差之本體底面。因此,在此搭載頭中,存在有例如當做為搭載對象之基板的端子附近配設有電子零件等突起物時,本體底面會接觸該突起物,而導電性球體之搭載變得困難之問題點。 However, the above-mentioned mounting head has the following problems. That is, in the mounting head, the lower surface of the porous body to which the conductive sphere is adsorbed is planar with the bottom surface of the body. In other words, in the mounting head, there is a bottom surface of the body having no difference in height from the lower surface of the lower surface of the porous body to which the conductive spherical body is adsorbed. Therefore, in the mounting head, for example, when a projection such as an electronic component is placed in the vicinity of the terminal of the substrate to be mounted, the bottom surface of the main body contacts the projection, and the mounting of the conductive sphere becomes difficult. .

本發明係鑑於上述課題而研發出者,其主要目的在於提供一種即使在搭載對象體附近存在有突起物之情形,也能確實搭載球狀體在搭載對象體上之球狀體吸附頭及球狀體搭載裝置、以及製造該球狀體吸附頭之球狀體吸附頭製造方法。 The present invention has been made in view of the above-described problems, and a main object of the present invention is to provide a spheroidal adsorption head and a ball that can accurately mount a spherical body on a target body even when a projection is present in the vicinity of the object to be mounted. A device for mounting a shape and a method for producing a spheroid adsorption head for producing the spheroid adsorption head.

欲達成上述目的之申請專利範圍第1項之球狀體吸附頭,其包括:本體部,形成有開口部;多孔質體,呈板狀,被嵌入前述開口部;以及整列片,形成有整列球狀體之貫穿孔,在覆蓋前述開口部及前述多孔質體外表面之狀態下,配設於前述本體部一面側;藉透過前述多孔質體進行之吸氣,使前述球狀體吸附在前述貫穿孔之形成部位,其特徵在於:包括自前述本體部內側往外側,按壓前述多孔質體之按壓部,前述整列片被固定在前述一面中之前述開口部緣部,前述多孔質體藉前述按壓部之按壓力突出到該 外側,使得前述外表面比前述一面還要位於前述外側。 A spheroid adsorption head according to claim 1, wherein the spheroid adsorption head includes: a body portion having an opening; a porous body having a plate shape and being embedded in the opening; and an entire column forming an entire column The through hole of the spherical body is disposed on one side of the main body portion in a state of covering the opening and the outer surface of the porous body, and the spherical body is adsorbed by the inhalation through the porous body. The formation portion of the through hole includes a pressing portion that presses the porous body from the inner side of the main body portion, and the entire row piece is fixed to the opening edge portion of the one surface, and the porous body is formed by the The pressing force of the pressing portion protrudes to the The outer side is such that the outer surface is located on the outer side than the aforementioned one side.

又,申請專利範圍第2項之球狀體吸附頭,係在申請專利範圍第1項之球狀體吸附頭中,具有被配設於前述按壓部與前述多孔質體間之板體,前述按壓部透過前述板體按壓前述多孔質體。 Further, the spheroid adsorption head according to the second aspect of the invention is the spheroid adsorption head according to the first aspect of the patent application, and has a plate body disposed between the pressing portion and the porous body, The pressing portion presses the porous body through the plate body.

又,申請專利範圍第3項之球狀體吸附頭,係在申請專利範圍第1項之球狀體吸附頭中,具有可調整之調整部,使得前述多孔質體之各側面與前述開口部內周面間之各分離距離相同。 Further, the spheroid adsorption head of the third application of the patent application is in the spheroid adsorption head of the first application of the patent application, and has an adjustable adjustment portion so that each side surface of the porous body and the opening portion are The separation distances between the circumferential surfaces are the same.

又,申請專利範圍第4項之球狀體吸附頭,係在申請專利範圍第2項之球狀體吸附頭中,具有可調整之調整部,使得前述多孔質體之各側面與前述開口部內周面間之各分離距離相同。 Further, the spheroid adsorption head of the fourth application of the patent application is in the spheroid adsorption head of the second application of the patent application, and has an adjustable adjustment portion so that each side surface of the porous body and the opening portion are The separation distances between the circumferential surfaces are the same.

又,申請專利範圍第5項之球狀體搭載裝置係包括:如申請專利範圍第1項至第4項中任一項之球狀體吸附頭;以及搬運裝置,在吸附前述球狀體之吸附位置搬運前述球狀體吸附頭,同時使吸附有前述球狀體之前述球狀體吸附頭,搬運至搭載對象體之配置位置;搭載前述球狀體在前述搭載對象體。 Further, the spheroidal body loading device of claim 5, comprising: the spheroid adsorption head according to any one of claims 1 to 4; and a conveying device for adsorbing the spheroid The spheroid adsorption head that adsorbs the spheroid is transported to the arrangement position of the object to be mounted, and the spheroid is mounted on the object to be mounted.

又,申請專利範圍第6項之球狀體吸附頭製造方法係製造包括:本體部,形成有開口部;多孔質體,呈板狀,被嵌入前述開口部;以及整列片,形成有整列球狀體之貫穿孔,在覆蓋前述開口部及前述多孔質體外表面之狀態下,配設於前述本體部一面側;藉透過前述多孔質體進行 之吸氣,使前述球狀體吸附在前述貫穿孔之形成部位之球狀體吸附頭,其特徵在於:固定前述整列片在前述一面中之前述開口部緣部,自前述本體部內側往外側按壓被嵌入前述開口部之前述多孔質體,使前述多孔質體突出到該外側,使得前述外表面比前述一面還要位於外側。 Further, the method for producing a spheroid adsorption head according to claim 6 is characterized in that the main body portion is formed with an opening portion; the porous body is plate-shaped and embedded in the opening portion; and the entire column is formed to form an entire row of balls. The through hole of the shape is disposed on one side of the main body portion in a state of covering the opening portion and the outer surface of the porous body; and the porous body is passed through the porous body a spheroid adsorption head that adsorbs the spheroids at a portion where the through holes are formed, and fixes the rim portion of the aligning sheet on the one surface from the inside to the outside of the body portion The porous body embedded in the opening portion is pressed to protrude the porous body to the outside, so that the outer surface is located outside the one surface.

又,申請專利範圍第7項之球狀體吸附頭製造方法,係在申請專利範圍第6項之球狀體吸附頭製造方法中,透過前述板體按壓前述多孔質體。 Further, in the method for producing a spheroid adsorption head according to the sixth aspect of the invention, in the method for producing a spheroid adsorption head according to claim 6, the porous body is pressed through the plate body.

又,申請專利範圍第8項之球狀體吸附頭製造方法,係在申請專利範圍第6項之球狀體吸附頭製造方法中,調整使得前述多孔質體之各側面與前述開口部內周面間之各分離距離相同,而且按壓前述多孔質體。 Further, in the method for producing a spheroid adsorption head according to the sixth aspect of the invention, in the method for producing a spheroid adsorption head according to the sixth aspect of the invention, the side surface of the porous body and the inner peripheral surface of the opening are adjusted. The separation distances are the same, and the porous body is pressed.

又,申請專利範圍第9項之球狀體吸附頭製造方法,係在申請專利範圍第7項之球狀體吸附頭製造方法中,調整使得前述多孔質體之各側面與前述開口部內周面間之各分離距離相同,而且按壓前述多孔質體。 Further, in the method for producing a spheroid adsorption head according to the seventh aspect of the invention, in the method for producing a spheroid adsorption head according to the seventh aspect of the invention, the side surface of the porous body and the inner peripheral surface of the opening are adjusted. The separation distances are the same, and the porous body is pressed.

又,申請專利範圍第10項之球狀體吸附頭製造方法,係在申請專利範圍第6項至第9項中任一項所述之球狀體吸附頭製造方法中,使用該整列片,前述整列片限制配設在前述一面側以前之狀態中之前述貫穿孔排列位置,在僅以相當於突出前述外側之狀態中之前述整列片延伸部分,縮小搭載前述球狀體之搭載對象體之配列位置之位置。 The spheroid adsorption head manufacturing method according to any one of claims 6 to 9, wherein the spheroid adsorption head is used in the method of manufacturing the spheroid adsorption head according to any one of claims 6 to 9, The aligning sheet is disposed at a position in which the through-holes are arranged in a state before the one surface side, and the mounting target body on which the spherical body is mounted is reduced in the extending portion of the aligning sheet in a state in which the outer side is protruded only Match the location of the location.

在申請專利範圍第1項所述之球狀體吸附頭、申請專 利範圍第5項所述之球狀體搭載裝置、以及申請專利範圍第6項所述之球狀體吸附頭製造方法中,固定整列片在本體部一面中之開口部的緣部,自本體部內側往外側按壓嵌入開口部之多孔質體,使多孔質體突出外側,使得外表面比一面還要位於外側,以製造球狀體吸附頭。因此,當使用此球狀體吸附頭、球狀體搭載裝置以及球狀體吸附頭製造方法時,例如即使在搭載對象體附近配設有突起物之情形,也能避免該突起物與球狀體吸附頭之接觸,同時能使被吸附在球狀體吸附頭之球狀體尖端部,非常接近搭載對象體,結果,相對於這種搭載對象體而言,能確實搭載球狀體。又,當使用此球狀體吸附頭、球狀體搭載裝置以及球狀體吸附頭製造方法時,僅使用按壓部按壓多孔質體,能很容易使多孔質體突出外側。又,在此球狀體吸附頭製造方法中,僅藉調整由按壓部所做之按壓力,能很容易變更多孔質體之突出量。因此,當使用此球狀體吸附頭、球狀體搭載裝置以及球狀體吸附頭製造方法時,能很容易製造球狀體吸附頭,結果,能充分減少球狀體吸附頭之製造成本。 The spheroid adsorption head described in the first application of the patent scope, application for In the spheroidal body loading device according to the fifth aspect of the invention, the method of manufacturing the spheroidal adsorption head according to the sixth aspect of the invention, wherein the spheroidal portion of the spheroidal body in the one surface of the body portion is fixed from the body The porous body embedded in the opening is pressed to the outside from the inside to make the porous body protrude outward, so that the outer surface is located outside the one side to manufacture the spherical adsorption head. Therefore, when the spheroid adsorption head, the spherical body mounting device, and the spheroid adsorption head manufacturing method are used, for example, even if a projection is disposed in the vicinity of the object to be mounted, the projection and the spherical shape can be avoided. The contact of the body adsorption head can be adsorbed to the apex of the spheroid adsorption head, and the target body is very close to the object to be mounted. As a result, the spheroid can be surely mounted on the object to be mounted. Further, when the spheroid adsorption head, the spherical body mounting device, and the spheroid adsorption head manufacturing method are used, the porous body can be easily protruded by pressing the porous body only by the pressing portion. Further, in the method for producing a spheroid adsorption head, the amount of protrusion of the porous body can be easily changed by merely adjusting the pressing force by the pressing portion. Therefore, when the spheroid adsorption head, the spheroid loading device, and the spheroid adsorption head manufacturing method are used, the spheroid adsorption head can be easily manufactured, and as a result, the manufacturing cost of the spheroid adsorption head can be sufficiently reduced.

當使用申請專利範圍第2項所述之球狀體吸附頭、申請專利範圍第5項所述之球狀體搭載裝置、以及申請專利範圍第7項所述之球狀體吸附頭製造方法時,藉透過配設於按壓部與多孔質體間之板體按壓多孔質體,能分散由按壓部所做之按壓力,以施加在多孔質體上。因此,當使用此球狀體吸附頭、球狀體搭載裝置以及球狀體吸附頭製造 方法時,即使多孔質體以低強度之材料製成時,多孔質體也能不會破損地確實突出到外側。 When the spheroid adsorption head according to the second aspect of the invention, the spheroid loading device according to claim 5, and the spheroid adsorption head manufacturing method according to claim 7 of the patent application are used, By pressing the porous body through the plate body disposed between the pressing portion and the porous body, the pressing force by the pressing portion can be dispersed to be applied to the porous body. Therefore, when using the spheroid adsorption head, the spheroid loading device, and the spheroid adsorption head In the method, even when the porous body is made of a material having a low strength, the porous body can surely protrude to the outside without being damaged.

又,在申請專利範圍第3,4項所述之球狀體吸附頭、申請專利範圍第5項所述之球狀體搭載裝置、以及申請專利範圍第8,9項所述之球狀體吸附頭製造方法中,調整使得多孔質體之各側面與開口部內周面間之各分離距離相同,而且按壓多孔質體。在此情形下,當多孔質體之各側面與開口部內周面間之各分離距離相同(一定)時,在多孔質體側面(開口部之內周面)中之任何位置,伴隨著多孔質體突出之整列片之延伸量概略相同。結果,在多孔質體側面(開口部之內周面)中之任何位置,由延伸所做之張力變成相同,所以,能確實防止由張力不相同造成之多孔質體傾斜,以維持水平狀態。 Further, the spheroid adsorption head according to the third and fourth aspects of the patent application, the spheroid loading device according to claim 5, and the spheroid described in claim 8 and 9. In the method for producing a sorbent head, the separation distance between each side surface of the porous body and the inner peripheral surface of the opening is adjusted to be the same, and the porous body is pressed. In this case, when the separation distance between each side surface of the porous body and the inner peripheral surface of the opening is the same (constant), any position in the side surface of the porous body (the inner peripheral surface of the opening) is accompanied by the porous material. The extension of the entire column of the body is roughly the same. As a result, the tension made by the extension becomes the same at any position on the side surface of the porous body (the inner peripheral surface of the opening), so that the inclination of the porous body caused by the difference in tension can be surely prevented to maintain the horizontal state.

又,當使用申請專利範圍第10項所述之球狀體吸附頭製造方法時,使用該整列片,前述整列片限制配設在前述一面側以前之狀態中之前述貫穿孔排列位置,在僅以相當於突出前述外側之狀態中之前述整列片延伸部分,縮小搭載對象體之配列位置之位置上,藉此,能確實使藉多孔質體之突出而整列片延伸時之各貫穿孔之配列位置與搭載對象之配列位置相同,所以,在以貫穿孔整列之狀態下,能確實使吸附在球狀體吸附頭之球狀體,搭載在搭載對象體上。 Further, when the spheroid adsorption head manufacturing method according to claim 10 is used, the aligning sheet is used, and the aligning sheet is restricted from the arrangement of the through holes in a state before the one surface side, and only By arranging the extended portion of the entire row in the state of the outer side to reduce the position of the arrangement position of the object to be mounted, it is possible to surely arrange the through holes when the sheet is extended by the protrusion of the porous body. Since the position is the same as the arrangement position of the object to be mounted, the spherical body adsorbed to the spherical body adsorption head can be surely mounted on the object to be mounted while being aligned in the through hole.

以下,參照附圖說明球狀體吸附頭、球狀體搭載裝置以及球狀體吸附頭製造方法。 Hereinafter, a spherical body adsorption head, a spherical body loading device, and a method of manufacturing a spherical body adsorption head will be described with reference to the drawings.

最初,說明第1圖所示軟焊球搭載裝置1之構成。軟焊球搭載裝置1係球狀體搭載裝置之一例,如第1圖所示,其包括吸附頭11、吸引機構12、收容容器13、搬運裝置14及控制部15,可使做為球狀體一例之微小球狀粒體之軟焊球(微小球體)300(參照第4圖),搭載在做為搭載對象體之基板400的端子401上。在此情形下,軟焊球300之構成係直徑L1(參照相同圖面)為80μm左右之球狀。又,軟焊球300藉軟焊球搭載裝置1被搭載於基板400的端子401後,被加熱熔融,藉此,在基板400上構成球柵陣列(BGA)。 First, the configuration of the solder ball loading device 1 shown in Fig. 1 will be described. The solder ball loading device 1 is an example of a spherical body mounting device, and as shown in FIG. 1, the adsorption head 11, the suction mechanism 12, the storage container 13, the conveying device 14, and the control unit 15 can be made spherical. A soft solder ball (microsphere) 300 (see FIG. 4) of a microscopic spheroidal body as an example is mounted on a terminal 401 of a substrate 400 as a mounting target. In this case, the structure of the solder ball 300 is a spherical shape having a diameter L1 (refer to the same drawing) of about 80 μm. Further, the solder ball 300 is mounted on the terminal 401 of the substrate 400 by the solder ball mounting device 1 and then heated and melted, whereby a ball grid array (BGA) is formed on the substrate 400.

吸附頭11之構成係以下述製造方法(球狀體吸附頭製造方法)製造之球狀體吸附頭之一例,如第2圖及第3圖所示,整體形成立方體狀,可吸附軟焊球300。具體說來,如第3圖及第5圖所示,吸附頭11之構成係具有本體部21、多孔質體22、按壓板(板體)23、固定構件24、整列片25、按壓螺絲26及板材27。 The configuration of the adsorption head 11 is an example of a spheroid adsorption head manufactured by the following production method (the method for producing a spheroid adsorption head). As shown in FIGS. 2 and 3, the entire shape is formed into a cube shape, and the soft solder ball can be adsorbed. 300. Specifically, as shown in FIGS. 3 and 5, the adsorption head 11 has a main body portion 21, a porous body 22, a pressing plate (plate body) 23, a fixing member 24, an entire row piece 25, and a pressing screw 26. And sheet 27.

本體部21之構成茲舉一例係以金屬形成,如第3圖及第5圖所示,具有四個側壁部31a~31d(以下,當不區別時,也稱作「側壁部31」)且整體呈立方體狀。又,在本體部21形成有自下表面(一面)21a至上表面21b連通之開口部21c。在此情形下,如第9圖所示,開口部21c在下表面21a側規定其大小,使得可嵌入多孔質體22,而 且在多孔質體22各側面43與開口部21c內周面32之間僅產生些許(做為一例係0.5mm~1mm左右)間隙。 The configuration of the main body portion 21 is formed of a metal, and as shown in FIGS. 3 and 5, has four side wall portions 31a to 31d (hereinafter, if not distinguished, also referred to as "side wall portion 31"). The whole is in the shape of a cube. Further, the main body portion 21 is formed with an opening portion 21c that communicates from the lower surface (one surface) 21a to the upper surface 21b. In this case, as shown in Fig. 9, the opening portion 21c is sized on the side of the lower surface 21a so that the porous body 22 can be embedded. Further, only a slight gap (as an example of about 0.5 mm to 1 mm) is generated between the side faces 43 of the porous body 22 and the inner peripheral surface 32 of the opening portion 21c.

又,如第3圖及第5圖所示,在構成本體部21之四個側壁部31中之一個側壁部31a處,形成有嵌入有固定構件24之段部33。又,在前述段部33之上表面形成有螺入固定螺絲24a之螺孔33a。又,在相向側壁部31a之側壁部31b中之上表面21b側的端部處,形成有突出到開口部21c中心部側之突出部34。又,在前述突出部34形成有螺入發揮按壓部功能之按壓螺絲26之複數(做為一例係兩個)螺孔34a。 Further, as shown in FIGS. 3 and 5, a segment portion 33 in which the fixing member 24 is fitted is formed in one of the four side wall portions 31a constituting the main body portion 21. Further, a screw hole 33a into which the fixing screw 24a is screwed is formed on the upper surface of the step portion 33. Further, at the end portion on the upper surface 21b side of the side wall portion 31b of the opposing side wall portion 31a, a protruding portion 34 that protrudes toward the center portion side of the opening portion 21c is formed. Further, the protruding portion 34 is formed with a plurality of screw holes 34a which are screwed into the pressing screw 26 which functions as a pressing portion.

多孔質體22茲舉一例係以連續氣泡構造之陶瓷形成,如第5圖所示,構成長方形之板狀。又,如第3圖所示,多孔質體22被嵌入形成在本體部21之開口部21c的下表面21a側。又,多孔質體22以按壓螺絲26之按壓力被突出到外側,使得外表面41比本體部21下表面21a還要位於外側(相同圖面中之下側),藉按壓螺絲26之按壓力及整列片25之張力,被保持在該狀態(突出到外側之狀態)。又,在多孔質體22各側面43(參照第9圖)與開口部21c內周面32(參照第9圖)間之間隙處,被插入相當於調整部之相同厚度之板材27,以前述板材27調整使得各側面43與各內周面32間之分離距離相同。而且,雖然能使以各種材料形成之板狀構件當作板材27使用,但是在此例中,係使以金屬形成之板狀構件(具體說來係厚度規用之構件)當作板材27使用。 The porous body 22 is formed of a ceramic having an open cell structure as shown in Fig. 5, and has a rectangular plate shape as shown in Fig. 5. Moreover, as shown in FIG. 3, the porous body 22 is fitted in the side of the lower surface 21a of the opening part 21c of the main-body part 21. Further, the porous body 22 is protruded to the outside by the pressing force of the pressing screw 26, so that the outer surface 41 is located outside (the lower side in the same plane) than the lower surface 21a of the main body portion 21, by the pressing force of the pressing screw 26. The tension of the entire sheet 25 is maintained in this state (the state of being protruded to the outside). Further, a plate 27 having the same thickness corresponding to the adjustment portion is inserted into a gap between each side surface 43 of the porous body 22 (see FIG. 9) and the inner peripheral surface 32 of the opening portion 21c (see FIG. 9). The sheet material 27 is adjusted so that the separation distance between each side surface 43 and each inner peripheral surface 32 is the same. Further, although a plate-like member formed of various materials can be used as the plate member 27, in this example, a plate-like member formed of metal (specifically, a member for thickness gauge) is used as the plate member 27. .

按壓板23構成之一例係以金屬形成,如第5圖所示,其係與多孔質體22相同程度大小之長方形板狀。如第3圖所示,前述按壓板23配設於按壓螺絲26與多孔質體22之間,藉分散由按壓螺絲26所做之按壓力,具有防止多孔質體22破損之功能。又,在按壓板23下表面側中央部形成有凹部23a。而且,在按壓板23形成有連通到凹部23a之排氣孔23b。 One example of the pressing plate 23 is formed of a metal, and as shown in Fig. 5, it is a rectangular plate having the same size as the porous body 22. As shown in Fig. 3, the pressing plate 23 is disposed between the pressing screw 26 and the porous body 22, and has a function of preventing the porous body 22 from being damaged by dispersing the pressing force by the pressing screw 26. Further, a concave portion 23a is formed at a central portion on the lower surface side of the pressing plate 23. Further, the pressing plate 23 is formed with a vent hole 23b that communicates with the recess 23a.

固定構件24構成之一例係以金屬形成,如第5圖所示,其係可嵌入本體部21的段部33之立方體狀。又,在固定構件24形成有:複數(做為一例係三個)貫穿孔24b,插入用於固定本體部21之固定螺絲24a(參照第3圖);以及複數(做為一例係三個)螺孔24c,螺入按壓螺絲26。 One example of the fixing member 24 is formed of a metal, and as shown in Fig. 5, it can be fitted into a cube shape of the segment portion 33 of the body portion 21. Further, the fixing member 24 is formed with a plurality of (three in one example) through holes 24b, and a fixing screw 24a for fixing the main body portion 21 (see FIG. 3); and a plurality (for example, three) The screw hole 24c is screwed into the pressing screw 26.

整列片25係以具有柔軟性之樹脂片(做為一例係以聚酯形成)構成。又,如第3圖及第5圖所示,整列片25係形成為比本體部21的開口部21c還要大(在本例中,係與下表面21a相同程度大小之)長方形薄板狀。又,整列片25係被配設於本體部21的下表面21a側,使得覆蓋嵌入本體部21的開口部21c之多孔質體22外表面41及開口部21c(多孔質體22與開口部21c的內周面32(參照第9圖)間之間隙)。在此情形下,整列片25以接著劑被接著固定在本體部21下表面21a中之開口部21c的緣部。 The entire sheet 25 is composed of a flexible resin sheet (formed as a polyester as an example). Further, as shown in FIGS. 3 and 5, the entire row of sheets 25 is formed in a rectangular thin plate shape larger than the opening portion 21c of the main body portion 21 (in this example, the same size as the lower surface 21a). Further, the entire line piece 25 is disposed on the lower surface 21a side of the main body portion 21 so as to cover the outer surface 41 of the porous body 22 and the opening portion 21c (the porous body 22 and the opening portion 21c) which are fitted into the opening portion 21c of the main body portion 21. The gap between the inner peripheral surface 32 (see Fig. 9)). In this case, the entire row piece 25 is subsequently fixed to the edge of the opening portion 21c in the lower surface 21a of the body portion 21 with an adhesive.

又,在整列片25形成有對合到做為搭載對象體之基板400中之端子401排列位置,具有整列軟焊球300之功能之複數貫穿孔51(參照第5圖及第6圖)。在此情形下, 如第4圖所示,貫穿孔51之直徑L2係被限制在比軟焊球300直徑L1(在本例中係80μm)還要短40μm左右。又,前述整列片25在以下述製造方法製造吸附頭11時,當使多孔質體22突出到本體部21的外側時,覆蓋多孔質體22外表面41之部分係與多孔質體22一齊突出到外側,結果,如第3圖所示,覆蓋外表面41之部分僅延伸突出量之長度。因此,為了在前述整列片25中,能防止因為延伸所造成之貫穿孔51位置之偏移,所以,在配設於本體部21下表面21a側以前之狀態之貫穿孔51排列位置,係被限制在僅以相當於突出到外側之狀態中之整列片25延伸之部分,縮小端子401排列位置之位置。 In the entire line piece 25, a plurality of through holes 51 having a function of arranging the positions of the terminals 401 in the substrate 400 as the object to be mounted and having the function of the entire row of the solder balls 300 are formed (see FIGS. 5 and 6). In this case, As shown in Fig. 4, the diameter L2 of the through hole 51 is limited to be about 40 μm shorter than the diameter L1 of the solder ball 300 (80 μm in this example). Further, when the adsorption head 11 is manufactured by the following manufacturing method, when the porous body 22 is protruded to the outside of the main body portion 21, the portion covering the outer surface 41 of the porous body 22 is protruded together with the porous body 22. To the outside, as a result, as shown in Fig. 3, the portion covering the outer surface 41 extends only by the length of the projection amount. Therefore, in order to prevent the displacement of the position of the through hole 51 due to the extension in the above-described aligning sheet 25, the arrangement position of the through hole 51 in the state before being disposed on the lower surface 21a side of the main body portion 21 is It is restricted to the position at which the positions of the terminals 401 are arranged in a position where only the entire column piece 25 in the state corresponding to the outer side is extended.

在前述吸附頭11中,以多孔質體22內表面42(參照第3圖)及按壓板23凹部23a形成之空間,藉來自排氣孔23b之排氣被減壓,藉伴隨於此之透過多孔質體22之吸氣,在被配設於多孔質體22外表面41側之整列片25中之貫穿孔51形成部位吸附軟焊球300(在本例中係吸附在貫穿孔51的緣部:參照第4圖),同時在上述空間回復常壓時(減壓被解除時),可解除軟焊球300之吸附。 In the adsorption head 11, the space formed by the inner surface 42 of the porous body 22 (see FIG. 3) and the concave portion 23a of the pressing plate 23 is decompressed by the exhaust gas from the exhaust hole 23b. The inhalation of the porous body 22 adsorbs the solder ball 300 at the portion where the through hole 51 is formed in the aligned sheet 25 disposed on the outer surface 41 of the outer surface 41 of the porous body 22 (in this example, the edge of the through hole 51 is adsorbed) Part: Refer to Fig. 4), and when the space returns to normal pressure (when the pressure is released), the adsorption of the solder ball 300 can be released.

吸引機構12之構成係具有透過配管連接到吸附頭11中之按壓板23排氣孔23b之圖面外之真空幫浦及電磁閥等,隨著控制部15之控制,自排氣孔23b吸引(排氣)以多孔質體22內表面42及按壓板23凹部23a形成之空間之空氣。 The suction mechanism 12 has a vacuum pump, a solenoid valve, and the like which are connected to the exhaust hole 23b of the pressing plate 23 in the adsorption head 11 through a pipe, and are sucked from the exhaust hole 23b as controlled by the control unit 15. (Exhaust) The air in the space formed by the inner surface 42 of the porous body 22 and the concave portion 23a of the pressing plate 23.

如第14圖所示,收容容器13之構成係可收容軟焊球 300。又,收容容器13藉來自圖面外之供氣機構之空氣供給,可浮游軟焊球300。又,在收容容器13上部安裝有用於限制(具有限制作用)由吸附頭11所做之剩餘軟焊球300之吸附之限制用板61。在此情形下,限制用板61之構成係其厚度L3(參照第4圖)比軟焊球300直徑L1(在本例中係80μm)還要薄之75μm左右之板狀。 As shown in Fig. 14, the storage container 13 is configured to receive a solder ball. 300. Further, the storage container 13 can float the solder ball 300 by the air supply from the air supply means outside the drawing. Further, a restriction plate 61 for restricting (having a restriction action) adsorption of the remaining soft solder balls 300 by the adsorption head 11 is attached to the upper portion of the storage container 13. In this case, the limiting plate 61 has a thickness L3 (see FIG. 4) which is a plate shape of about 75 μm thinner than the diameter L1 of the solder ball 300 (80 μm in this example).

又,在限制用板61處,於使吸附頭11中之整列片25接近(或接觸)限制用板61之狀態(參照第14圖)下,在相向吸附頭11中之整列片25各貫穿孔51之位置,形成有貫穿孔62。在此情形下,如第4圖所示,貫穿孔62之直徑L4係形成比軟焊球300之直徑L1(在本例中係80μm)還要長,而且比直徑L1之兩倍還要短之100μm左右。 Further, in the state of the restriction plate 61, when the alignment sheet 25 in the adsorption head 11 is brought close to (or in contact with) the restriction plate 61 (see Fig. 14), the alignment sheets 25 in the opposite adsorption heads 11 are each penetrated. A through hole 62 is formed at the position of the hole 51. In this case, as shown in Fig. 4, the diameter L4 of the through hole 62 is formed longer than the diameter L1 of the solder ball 300 (80 μm in this example) and is shorter than twice the diameter L1. About 100μm.

搬運裝置14隨著控制部15之控制,搬運吸附頭11到收容容器13之配置位置(吸附位置)及基板400之配置位置。 The conveyance device 14 conveys the arrangement position (adsorption position) of the adsorption head 11 to the storage container 13 and the arrangement position of the substrate 400 under the control of the control unit 15.

控制部15係控制構成軟焊球搭載裝置1之各構成元件。具體說來,控制部15係控制搬運裝置14,使吸附頭11搬運到收容容器13之配置位置及基板400之配置位置。又,控制部15係控制吸引機構12以吸引吸附頭11內部空間之空氣。 The control unit 15 controls the respective constituent elements constituting the solder ball loading device 1. Specifically, the control unit 15 controls the transport device 14 to transport the adsorption head 11 to the arrangement position of the storage container 13 and the arrangement position of the substrate 400. Further, the control unit 15 controls the suction mechanism 12 to suck the air in the internal space of the adsorption head 11.

接著,參照圖面說明吸附頭11之製造方法(球狀體吸附頭製造方法)。 Next, a method of manufacturing the adsorption head 11 (a method of manufacturing a spherical body adsorption head) will be described with reference to the drawings.

在此製造方法中,最初,固定整列片25在本體部21下表面21a中之開口部21c緣部。在此,在此製造方法中, 如下所述,當多孔質體22突出到本體部21外側時,覆蓋整列片25中之多孔質體22外表面41之部分,與多孔質體22一齊突出到外側,該部分係僅延伸突出量之長度。因此,在使用於本製造方法之整列片25中,貫穿孔51之配列位置係被限制在僅縮小相當於延伸長度(亦即,相當於多孔質體22之突出量之長度)之做為搭載對象體之端子401之配列位置。 In this manufacturing method, initially, the entire row piece 25 is fixed to the edge portion of the opening portion 21c in the lower surface 21a of the main body portion 21. Here, in this manufacturing method, As described below, when the porous body 22 protrudes to the outside of the body portion 21, a portion covering the outer surface 41 of the porous body 22 in the entire row of sheets 25 protrudes to the outside with the porous body 22, and the portion extends only by the amount of protrusion. The length. Therefore, in the alignment sheet 25 used in the present manufacturing method, the arrangement position of the through holes 51 is restricted to be reduced only by the length corresponding to the extension length (that is, the length corresponding to the amount of protrusion of the porous body 22). The arrangement position of the terminal 401 of the object body.

在固定整列片25時,首先,塗佈接著劑(其一例係氟樹脂系之接著劑)在本體部21下表面21a中之開口部21c緣部。接著,如第6圖及第7圖所示,配置(載置)整列片25在下表面21a,使得覆蓋開口部21c,接著,按壓接著整列片25往開口部21c之緣部(接著劑之塗佈部分)。接著,藉放置直到接著劑乾燥,固定整列片25在開口部21c之緣部。在此情形下,藉施加張力在整列片25,防止產生鬆弛。而且,在上述之例中,雖然塗佈接著劑在本體部21之下表面21a,但是,也可以塗佈接著劑在整列片25之上表面(相向本體部21下表面21a之面),也可以塗佈接著劑在本體部21下表面21a及整列片25上表面。 When the entire alignment sheet 25 is fixed, first, an adhesive (an example of a fluororesin-based adhesive) is applied to the edge portion of the opening portion 21c in the lower surface 21a of the main body portion 21. Next, as shown in Fig. 6 and Fig. 7, the entire line piece 25 is placed (mounted) on the lower surface 21a so as to cover the opening portion 21c, and then the edge portion of the entire line piece 25 is pressed toward the opening portion 21c (adhesive coating) Cloth part). Next, by placing it until the adhesive is dried, the entire row piece 25 is fixed to the edge of the opening portion 21c. In this case, by applying tension to the entire sheet 25, slack is prevented from occurring. Further, in the above example, although the adhesive is applied to the lower surface 21a of the main body portion 21, the adhesive may be applied to the upper surface of the entire alignment sheet 25 (the surface facing the lower surface 21a of the main body portion 21), The adhesive may be applied to the upper surface 21a of the body portion 21 and the upper surface of the entire sheet 25.

接著,如第8圖及第9圖所示,自本體部21上表面21b側插入多孔質體22到開口部21c,嵌入多孔質體22到開口部21c的下表面21a側。接著,如第9圖所示,插入相同厚度之板材27到多孔質體2各側面(四個側面)與開口部21c內周面32間之間隙。藉此,調整使得各側面43與內周面32間之分離距離為均等。 Then, as shown in Fig. 8 and Fig. 9, the porous body 22 is inserted into the opening 21c from the upper surface 21b side of the main body portion 21, and the porous body 22 is fitted to the lower surface 21a side of the opening portion 21c. Next, as shown in Fig. 9, a plate 27 of the same thickness is inserted into a gap between each side surface (four side faces) of the porous body 2 and the inner peripheral surface 32 of the opening portion 21c. Thereby, the adjustment is such that the separation distance between each side surface 43 and the inner circumferential surface 32 is equal.

接著,如第10圖及第11圖所示,自本體部21上表面21b側,以傾斜狀態插入按壓板23到開口部21c內。此時,隨著按壓板23尖端部(第10圖中之左側端部)接近開口部21c內周面32,使按壓板23後端部(第10圖中之右側端部)接近多孔質體22,藉此,配置(載置)在多孔質體22上方。接著,如第12圖所示,嵌入固定構件24到本體部21之段部33。接著,插入固定螺絲24a到固定構件24之貫穿孔24b,螺入固定螺絲24a到側壁部31a之螺孔33a,藉此,固定固定構件24到側壁部31a。 Next, as shown in FIGS. 10 and 11, the pressing plate 23 is inserted into the opening 21c from the upper surface 21b side of the main body portion 21 in an inclined state. At this time, as the tip end portion (the left end portion in FIG. 10) of the pressing plate 23 approaches the inner peripheral surface 32 of the opening portion 21c, the rear end portion (the right end portion in Fig. 10) of the pressing plate 23 is brought close to the porous body. 22. Thereby, it is placed (placed) above the porous body 22. Next, as shown in Fig. 12, the fixing member 24 is fitted into the segment portion 33 of the body portion 21. Next, the fixing screw 24a is inserted into the through hole 24b of the fixing member 24, and the fixing screw 24a is screwed into the screw hole 33a of the side wall portion 31a, whereby the fixing member 24 is fixed to the side wall portion 31a.

接著,如第13圖所示,螺入按壓螺絲26到形成於固定構件24之螺孔24c及形成於本體部21突出部34之螺孔34a。此時,藉螺入按壓螺絲26,按壓板23自本體部21內側朝向外側被按壓,按壓板23係朝向外側按壓多孔質體22。亦即,做為按壓部之按壓螺絲26,透過被配設於與多孔質體22間之按壓板23,按壓多孔質體22。 Next, as shown in Fig. 13, the pressing screw 26 is screwed into the screw hole 24c formed in the fixing member 24 and the screw hole 34a formed in the protruding portion 34 of the main body portion 21. At this time, the pressing plate 26 is pressed by the pressing screw 26, and the pressing plate 23 is pressed outward from the inside of the main body portion 21, and the pressing plate 23 presses the porous body 22 toward the outside. In other words, the pressing screw 26 as the pressing portion passes through the pressing plate 23 disposed between the porous body 22 and presses the porous body 22.

另外,以按壓螺絲26按壓之多孔質體22,如第3圖所示,抵抗整列片25之張力,突出使得外表面41比本體部21的下表面21a還要位於外側。又,隨著多孔質體22之突出,覆蓋整列片25中之外表面41之部分,與多孔質體22一齊突出到外側。接著,在多孔質體22僅以預先決定之突出量突出之階段,停止按壓螺絲26之螺入(由按壓螺絲26所做之按壓)。 Further, as shown in FIG. 3, the porous body 22 pressed by the pressing screw 26 is protruded against the tension of the entire row piece 25 so that the outer surface 41 is located outside the lower surface 21a of the main body portion 21. Further, as the porous body 22 protrudes, a portion covering the outer surface 41 of the entire row of sheets 25 is protruded to the outside together with the porous body 22. Next, at the stage where the porous body 22 protrudes only by a predetermined amount of protrusion, the screwing of the pressing screw 26 (the pressing by the pressing screw 26) is stopped.

在此,在此狀態下,多孔質體22藉整列片25之張力,被往本體部21的內側按壓,由前述整列片25之張力所做 之按壓力,與由按壓螺絲26所做之按壓力之平衡結果,多孔質體22被保持在突出到外側之狀態。又,在前述整列片25中,如上所述,於僅以延伸之長度縮小之位置形成有貫穿孔51。因此,藉隨著多孔質體22之突出而整列片25延伸,各貫穿孔51之配列位置(形成位置)與搭載對象之端子401之配列位置成為一致。 Here, in this state, the porous body 22 is pressed against the inner side of the main body portion 21 by the tension of the entire row piece 25, and is made by the tension of the above-mentioned entire piece 25 The pressing force is balanced with the pressing force by the pressing screw 26, and the porous body 22 is held in a state of being protruded to the outside. Further, in the above-described entire row piece 25, as described above, the through hole 51 is formed at a position where only the length of the extension is reduced. Therefore, the entire sheet piece 25 is extended by the protrusion of the porous body 22, and the arrangement position (forming position) of each of the through holes 51 coincides with the arrangement position of the terminal 401 of the mounting object.

藉此,吸附頭11之製造就算結束。在此製造方法中,僅以按壓螺絲26按壓多孔質體22,能使多孔質體22很容易突出,使得多孔質體22外表面41比本體部21下表面21a還要位於外側。又,在此製造方法中,僅藉調整按壓力(按壓螺絲26之螺入量),能很容易變更多孔質體22之突出量。 Thereby, the manufacture of the adsorption head 11 is completed. In this manufacturing method, only the porous body 22 is pressed by the pressing screw 26, so that the porous body 22 can be easily protruded, so that the outer surface 41 of the porous body 22 is located outside the lower surface 21a of the main body portion 21. Further, in this manufacturing method, the amount of protrusion of the porous body 22 can be easily changed by merely adjusting the pressing force (the amount of screwing of the pressing screw 26).

接著,參照圖面說明使用包括如上製造之吸附頭11之軟焊球搭載裝置1,搭載軟焊球300在基板400的端子401上之方法、及此時之軟焊球搭載裝置1之動作。 Next, a method of mounting the solder ball 300 on the terminal 401 of the substrate 400 and the operation of the solder ball mounting device 1 at this time using the solder ball mounting device 1 including the adsorption head 11 manufactured as described above will be described with reference to the drawings.

在前述軟焊球搭載裝置1中,當被開始操作時,控制部15控制搬運裝置14,以搬運吸附頭11到收容容器13上方,接著,如第14圖所示,下降吸附頭11,使得吸附頭11中之整列片25的下表面與收容容器13的限制用板61抵接(或接近)。接著,控制部15控制吸引機構12,自按壓板23之排氣孔23b吸引(排氣)藉多孔質體22內表面42與按壓板23凹部23a形成之空間之空氣。此時,該空間被減壓,然後透過多孔質體22內之連續氣泡,多孔質體22外表面41側之空氣被吸引(吸氣)。 In the solder ball loading device 1, when the operation is started, the control unit 15 controls the transport device 14 to transport the adsorption head 11 to the upper side of the storage container 13, and then, as shown in Fig. 14, lowers the adsorption head 11, so that the adsorption head 11 is lowered. The lower surface of the entire row piece 25 in the adsorption head 11 abuts (or approaches) the restriction plate 61 of the storage container 13. Next, the control unit 15 controls the suction mechanism 12 to suck (exhaust) air from the space formed by the inner surface 42 of the porous body 22 and the concave portion 23a of the pressing plate 23 from the exhaust hole 23b of the pressing plate 23. At this time, the space is depressurized, and then the continuous air bubbles in the porous body 22 are transmitted, and the air on the outer surface 41 side of the porous body 22 is sucked (inhaled).

接著,控制部15自圖面外之供氣機構供給氣體到收容容器13內。此時,藉空氣之供給而被收容在收容容器13之軟焊球300被浮游。又,如第15圖所示,在收容容器13內浮游之軟焊球300,以透過吸附頭11的多孔質體22進行之吸氣所伴隨之吸引力,被拉靠至多孔質體22的外表面41側,透過形成在收容容器13的限制用板61之貫穿孔62,被吸附在吸附頭11的整列片25中之貫穿孔51形成部位(貫穿孔51之緣部)。 Next, the control unit 15 supplies the gas into the storage container 13 from the air supply means outside the drawing. At this time, the solder ball 300 accommodated in the storage container 13 by the supply of air is floated. Further, as shown in Fig. 15, the solder ball 300 floating in the storage container 13 is pulled against the porous body 22 by the suction force of the air permeating through the porous body 22 of the adsorption head 11. The outer surface 41 side is permeated through the through hole 62 formed in the restricting plate 61 of the storage container 13, and is attracted to the through hole 51 forming portion (edge portion of the through hole 51) in the entire row piece 25 of the adsorption head 11.

又,軟焊球300很微小,所以,軟焊球300們相互拉引之力量相對於重量而言相對較大,結果,如第15圖所示,其他軟焊球300(以下,也將此軟焊球300稱作「剩餘之軟焊球300」)附著在被吸附於整列片25中之貫穿孔51形成部位上之軟焊球300(以下,也將此軟焊球300稱作「搭載對象之軟焊球300」)。 Further, since the solder balls 300 are minute, the strength of the solder balls 300 is relatively large with respect to the weight. As a result, as shown in Fig. 15, other solder balls 300 (hereinafter, this also The solder ball 300 is referred to as "the remaining solder ball 300") and is attached to the solder ball 300 that is adhered to the portion of the through hole 51 formed in the entire sheet 25 (hereinafter, the solder ball 300 is also referred to as "equipped Soft solder ball 300").

接著,控制部15藉停止對收容容器13之空氣供給,停止軟焊球300之浮游。接著,控制部15控制搬運裝置14,如第16圖所示,使吸附頭11移動到上方。此時,吸附頭11的整列片25自收容容器13的限制用板61分離,所以,藉中介於被吸附在貫穿孔51形成部位上之搭載對象之軟焊球300與剩餘之軟焊球300間之限制用板61之限制作用,剩餘之軟焊球300自搭載對象之軟焊球300被拉離,結果,如相同圖面所示,剩餘之軟焊球300以自重而落下。 Next, the control unit 15 stops the floating of the solder ball 300 by stopping the supply of air to the storage container 13. Next, the control unit 15 controls the conveying device 14, and as shown in Fig. 16, the adsorption head 11 is moved upward. At this time, since the entire row piece 25 of the adsorption head 11 is separated from the restriction plate 61 of the storage container 13, the soft solder ball 300 and the remaining soft solder ball 300 which are mounted on the portion where the through hole 51 is formed are interposed. The remaining soft solder ball 300 is pulled away from the solder ball 300 to be mounted, and as a result, as shown in the same figure, the remaining solder ball 300 is dropped by its own weight.

接著,控制部15控制搬運裝置14,移動吸附頭11到基板400配置位置之上方,接著,如第17圖所示,下降吸 附頭11到被吸附於吸附頭11之軟焊球300的尖端部接近基板400端子401附近之位置。 Next, the control unit 15 controls the transport device 14 to move the adsorption head 11 above the arrangement position of the substrate 400, and then, as shown in Fig. 17, the suction is lowered. The tip end 11 is at a position near the tip end portion of the solder ball 300 adsorbed to the adsorption head 11 near the terminal 401 of the substrate 400.

在此情形下,在此吸附頭11中,多孔質體22外表面41係比本體部21下表面21a還要突出到外側位置。因此,如第17圖所示,即使在基板400配設有電子零件402等突起物時,也能持續避免該突起物與吸附頭11接觸,能使被吸附在吸附頭11上之軟焊球300尖端部非常接近基板400的端子401。 In this case, in the adsorption head 11, the outer surface 41 of the porous body 22 protrudes to the outer position from the lower surface 21a of the body portion 21. Therefore, as shown in Fig. 17, even when the substrate 400 is provided with a projection such as the electronic component 402, the projection can be prevented from coming into contact with the adsorption head 11, and the solder ball adsorbed on the adsorption head 11 can be prevented. The tip end portion of the 300 is very close to the terminal 401 of the substrate 400.

接著,控制部15控制吸引機構12以停止吸引。藉此,吸附頭11之內部空間回復到常壓(減壓被解除),透過多孔質體22進行之吸氣被停止,結果,由吸附頭11所做之軟焊球300之吸附被解除,軟焊球300被搭載於端子401上。 Next, the control unit 15 controls the suction mechanism 12 to stop the suction. Thereby, the internal space of the adsorption head 11 returns to normal pressure (decompression is released), and the suction through the porous body 22 is stopped, and as a result, the adsorption of the solder ball 300 by the adsorption head 11 is released. The solder ball 300 is mounted on the terminal 401.

接著,控制部15控制搬運裝置14,在使吸附頭11移動到上方後,搬運到初期位置。藉此,使軟焊球300搭載在基板400端子401上之作業即行結束。 Next, the control unit 15 controls the transport device 14 to move the adsorption head 11 to the upper position and then transport it to the initial position. Thereby, the operation of mounting the solder ball 300 on the terminal 401 of the substrate 400 is completed.

如此一來,在吸附頭11、軟焊球搭載裝置1及球狀體吸附頭製造方法中,固定整列片25在本體部21下表面21a中之開口部21c緣部,使嵌入開口部21c之多孔質體22使用按壓螺絲26,而自本體部21內側往外側按壓,使多孔質體22突出到外側,使得外表面41比下表面21a還位於外側。因此,當使用吸附頭11、軟焊球搭載裝置1及球狀體吸附頭製造方法時,即使在做為搭載對象體之基板400的端子401附近,配設有電子零件402等突起物,能持續 避免該突起物與吸附頭11接觸,使被吸附在吸附頭11之軟焊球300的尖端部,非常接近基板400的端子401,結果,相對於這種搭載對象體而言,能確實搭載軟焊球300。又,當使用吸附頭11、軟焊球搭載裝置1及球狀體吸附頭製造方法時,僅使用做為按壓部之按壓螺絲26按壓多孔質體22,能很容易使多孔質體22突出到外側。又,在此球狀體吸附頭製造方法中,僅藉調整按壓力(按壓螺絲26之螺入量),能很容易變更多孔質體22之突出量。因此,當使用吸附頭11、軟焊球搭載裝置1及球狀體吸附頭製造方法時,能很容易製造吸附頭11,結果,能充分減少吸附頭11之製造成本。 In the adsorption head 11, the solder ball loading device 1, and the method of manufacturing the spherical body adsorption head, the entire alignment piece 25 is fixed to the edge of the opening 21c in the lower surface 21a of the main body portion 21 so as to be fitted into the opening portion 21c. The porous body 22 is pressed outward from the inside of the main body portion 21 by using the pressing screw 26, so that the porous body 22 protrudes to the outside, so that the outer surface 41 is located outside the lower surface 21a. Therefore, when the adsorption head 11, the solder ball mounting apparatus 1 and the spheroid adsorption head manufacturing method are used, even if the projections of the electronic component 402 are disposed in the vicinity of the terminal 401 of the substrate 400 as the object to be mounted, continued When the projection is prevented from coming into contact with the adsorption head 11, the tip end portion of the solder ball 300 adsorbed on the adsorption head 11 is very close to the terminal 401 of the substrate 400, and as a result, it can be reliably mounted on the object to be mounted. Solder ball 300. Moreover, when the adsorption head 11, the solder ball mounting apparatus 1, and the spherical body adsorption head manufacturing method are used, the porous body 22 can be easily protruded only by pressing the porous body 22 with the pressing screw 26 as the pressing portion. Outside. Further, in the method for producing a spheroid adsorption head, the amount of protrusion of the porous body 22 can be easily changed by merely adjusting the pressing force (the amount of screwing of the pressing screw 26). Therefore, when the adsorption head 11, the solder ball loading device 1, and the spheroid adsorption head manufacturing method are used, the adsorption head 11 can be easily manufactured, and as a result, the manufacturing cost of the adsorption head 11 can be sufficiently reduced.

又,當使用吸附頭11、軟焊球搭載裝置1及球狀體吸附頭製造方法時,透過配設於按壓螺絲26與多孔質體22間之按壓板23以按壓多孔質體22,藉此,能分散由按壓螺絲26所做之按壓力,而施加在多孔質體22上。因此,當使用吸附頭11、軟焊球搭載裝置1及球狀體吸附頭製造方法時,即使多孔質體22以低強度之材料製成時,多孔質體22也能不會破損地確實突出到外側。 Further, when the adsorption head 11, the solder ball loading device 1 and the spherical body adsorption head manufacturing method are used, the porous body 22 is pressed by the pressing plate 23 disposed between the pressing screw 26 and the porous body 22 The pressing force by the pressing screw 26 can be dispersed and applied to the porous body 22. Therefore, when the adsorption head 11, the solder ball mounting apparatus 1, and the spheroid adsorption head manufacturing method are used, even if the porous body 22 is made of a low-strength material, the porous body 22 can be surely protruded without being damaged. To the outside.

又,在吸附頭11、軟焊球搭載裝置1及球狀體吸附頭製造方法中,調整使得多孔質體22的各側面43與分別相向各側面43之內周面32間之各分離距離相同,而且按壓多孔質體22。在此情形下,當開口部21c內周面32與多孔質體22側面43間之各分離距離相同(一定)時,在多孔質體22側面43(開口部21c的內周面32)中之任何位 置,伴隨著多孔質體22突出之整列片25之延伸量概略相同。結果,在多孔質體22側面43(開口部21c之內周面32)中之任何位置,由延伸所做之張力變成相同,所以,能確實防止由張力不相同造成之多孔質體22傾斜,以維持水平狀態。 Further, in the adsorption head 11, the solder ball loading device 1, and the method of manufacturing the spherical body adsorption head, the separation distance between the side faces 43 of the porous body 22 and the inner circumferential faces 32 of the respective side faces 43 is adjusted to be the same. And the porous body 22 is pressed. In this case, when the separation distance between the inner circumferential surface 32 of the opening 21c and the side surface 43 of the porous body 22 is the same (constant), the side surface 43 of the porous body 22 (the inner circumferential surface 32 of the opening 21c) Any bit The amount of extension of the entire row of sheets 25 that protrudes along with the porous body 22 is substantially the same. As a result, at any position in the side surface 43 of the porous body 22 (the inner peripheral surface 32 of the opening portion 21c), the tension by the extension becomes the same, so that the inclination of the porous body 22 caused by the difference in tension can be surely prevented. To maintain a level.

又,當使用吸附頭11、軟焊球搭載裝置1及球狀體吸附頭製造方法時,使用整列片25,整列片25限制配設在本體部21下表面21a側以前之狀態中之貫穿孔51配列位置,在僅以相當於突出到外側之狀態中之整列片25之延伸部分,縮小端子401配列位置之位置上,藉此,以多孔質體22之突出,整列片25延伸時之各貫穿孔51配列位置,與做為搭載對象之各端子401配置位置能確實地一致,所以,在以貫穿孔51整列之狀態下,能確實使吸附在吸附頭11之軟焊球300,確實搭載在各端子401上。 When the adsorption head 11, the solder ball loading device 1 and the spherical body adsorption head manufacturing method are used, the alignment sheet 25 is used, and the alignment sheet 25 restricts the through holes in the state before being disposed on the lower surface 21a side of the main body portion 21. In the position where the alignment piece 25 is extended only to the outer side, the position of the arrangement of the terminal 401 is reduced, whereby the protrusion of the porous body 22 is used, and the entire sheet 25 is extended. Since the position of the through-holes 51 is arranged to be in the same position as the position of each of the terminals 401 to be mounted, the solder ball 300 that is adsorbed on the adsorption head 11 can be surely mounted in a state in which the through-holes 51 are arranged in a row. On each terminal 401.

而且,球狀體吸附頭、球狀體搭載裝置以及球狀體吸附頭製造方法,並不侷限於上述構成及方法。例如上述雖然係使用事先形成有貫穿孔51(在固定於本體部21之前)之整列片25之構成及方法,但是,也可以採用在固定未形成有貫穿孔51之狀態之整列片25於本體部21後,使用雷射或鑽頭以形成貫穿孔51之構成及方法,或者,在固定未形成有貫穿孔51之狀態之整列片25於本體部21,以突出多孔質體22後,使用雷射或鑽頭以形成貫穿孔51之構成及方法。 Further, the spheroid adsorption head, the spheroid loading device, and the spheroid adsorption head manufacturing method are not limited to the above configuration and method. For example, although the above-described configuration and method of the entire row piece 25 in which the through hole 51 (before being fixed to the main body portion 21) is formed in advance is used, the entire piece 25 in which the through hole 51 is not formed may be used in the body. After the portion 21, a structure or a method of forming a through hole 51 by using a laser or a drill, or a column 9 of a state in which the through hole 51 is not formed is fixed to the body portion 21 to protrude the porous body 22, and then a mine is used. A configuration or method of forming a through hole 51 by shooting or a drill.

雖然說明過使用接著劑使整列片固定在本體部21之 構成及方法,但是,也可以採用以螺絲固定本體部21之構成及方法。又,雖然說明過使用以樹脂片構成整列片25之構成及方法,但是,也可以採用以金屬等樹脂以外之材料構成整列片25之構成及方法。 Although it is explained that the entire sheet is fixed to the body portion 21 by using an adhesive. Although the configuration and method are employed, the configuration and method of fixing the main body portion 21 by screws may be employed. Further, although the configuration and method of forming the entire sheet 25 by the resin sheet have been described, the configuration and method of forming the entire sheet 25 from a material other than a resin such as metal may be employed.

又,雖然說明過在多孔質體22側面43與側壁部31內周面32之間,插入做為調整部之板材27,藉此,調整使得多孔質體22各側面43與側壁部31內周面32間之各分離距離相同之構成及方法,但是,也可以採用例如在各側壁部31形成橫向之螺孔,螺入做為調整部之螺絲到前述螺孔,以按壓多孔質體22各側面43,藉此,調整側面43與內周面32間之各分離距離之構成及方法。 Further, it has been described that the plate member 27 serving as the adjustment portion is inserted between the side surface 43 of the porous body 22 and the inner peripheral surface 32 of the side wall portion 31, whereby the side faces 43 of the porous body 22 and the inner periphery of the side wall portion 31 are adjusted. The configuration and method of the same distance between the faces 32 are the same. However, for example, a screw hole in the lateral direction may be formed in each of the side wall portions 31, and a screw as an adjusting portion may be screwed into the screw hole to press the porous body 22 The side surface 43, thereby adjusting the configuration and method of the separation distance between the side surface 43 and the inner circumferential surface 32.

又,雖然說明過規定貫穿孔51直徑L2比軟焊球300直徑L1還要短,以貫穿孔51緣部吸附軟焊球300之構成例,但是,也可以採用規定使貫穿孔51直徑L2比軟焊球300直徑L1還要長,以貫穿孔51內(貫穿孔51形成部位之另一例)吸附軟焊球300之構成。 Further, although the configuration in which the diameter L2 of the through hole 51 is shorter than the diameter L1 of the solder ball 300 and the soft solder ball 300 is sucked at the edge of the through hole 51 has been described, the diameter L2 of the through hole 51 may be specified. The solder ball 300 has a longer diameter L1 and is configured to adsorb the solder ball 300 in the through hole 51 (another example of the portion where the through hole 51 is formed).

1‧‧‧軟焊球搭載裝置 1‧‧‧Soft solder ball mounting device

11‧‧‧吸附頭 11‧‧‧Adsorption head

14‧‧‧搬運裝置 14‧‧‧Transportation device

21‧‧‧本體部 21‧‧‧ Body Department

21a‧‧‧下表面 21a‧‧‧lower surface

21c‧‧‧開口部 21c‧‧‧ openings

22‧‧‧多孔質體 22‧‧‧Porous body

23‧‧‧按壓板 23‧‧‧ Press plate

25‧‧‧整列片 25‧‧‧ hologram

26‧‧‧按壓螺絲 26‧‧‧Pushing screws

27‧‧‧厚度材 27‧‧‧ Thickness

41‧‧‧外表面 41‧‧‧ outer surface

51‧‧‧貫穿孔 51‧‧‧through holes

300‧‧‧軟焊球 300‧‧‧Soft solder balls

第1圖係表示軟焊球搭載裝置1之構成之構成圖。 Fig. 1 is a configuration diagram showing the configuration of the solder ball loading device 1.

第2圖係表示吸附頭11之構成之立體圖。 Fig. 2 is a perspective view showing the configuration of the adsorption head 11.

第3圖係第2圖以面A切斷之吸附頭11剖面圖。 Fig. 3 is a cross-sectional view of the adsorption head 11 cut along the plane A in Fig. 2.

第4圖係說明軟焊球300之直徑L1、貫穿孔51之直徑L2、限制用板體61之厚度L3及貫穿孔62之直徑L4之關係之說明圖。 Fig. 4 is an explanatory view showing the relationship between the diameter L1 of the solder ball 300, the diameter L2 of the through hole 51, the thickness L3 of the limiting plate body 61, and the diameter L4 of the through hole 62.

第5圖係吸附頭11之分解立體圖。 Fig. 5 is an exploded perspective view of the adsorption head 11.

第6圖係說明吸附頭11製造方法之第1說明圖。 Fig. 6 is a first explanatory view for explaining a method of manufacturing the adsorption head 11.

第7圖係說明吸附頭11製造方法之第2說明圖。 Fig. 7 is a second explanatory view showing a method of manufacturing the adsorption head 11.

第8圖係說明吸附頭11製造方法之第3說明圖。 Fig. 8 is a third explanatory view showing a method of manufacturing the adsorption head 11.

第9圖係說明吸附頭11製造方法之第4說明圖。 Fig. 9 is a fourth explanatory view showing a method of manufacturing the adsorption head 11.

第10圖係說明吸附頭11製造方法之第5說明圖。 Fig. 10 is a fifth explanatory diagram for explaining the method of manufacturing the adsorption head 11.

第11圖係說明吸附頭11製造方法之第6說明圖。 Fig. 11 is a sixth explanatory diagram for explaining the method of manufacturing the adsorption head 11.

第12圖係說明吸附頭11製造方法之第7說明圖。 Fig. 12 is a seventh explanatory view showing a method of manufacturing the adsorption head 11.

第13圖係說明吸附頭11製造方法之第8說明圖。 Fig. 13 is a view for explaining the eighth embodiment of the manufacturing method of the adsorption head 11.

第14圖係說明軟焊球300搭載工序之第1說明圖。 Fig. 14 is a first explanatory view showing a step of mounting the solder ball 300.

第15圖係說明軟焊球300搭載工序之第2說明圖。 Fig. 15 is a second explanatory view showing a step of mounting the solder ball 300.

第16圖係說明軟焊球300搭載工序之第3說明圖。 Fig. 16 is a third explanatory view showing a step of mounting the solder ball 300.

第17圖係說明軟焊球300搭載工序之第4說明圖。 Fig. 17 is a fourth explanatory view showing a step of mounting the solder ball 300.

11‧‧‧吸附頭 11‧‧‧Adsorption head

21‧‧‧本體部 21‧‧‧ Body Department

21a‧‧‧下表面 21a‧‧‧lower surface

21b‧‧‧上表面 21b‧‧‧ upper surface

21c‧‧‧開口部 21c‧‧‧ openings

22‧‧‧多孔質體 22‧‧‧Porous body

23‧‧‧按壓板 23‧‧‧ Press plate

23a‧‧‧凹部 23a‧‧‧ recess

23b‧‧‧排氣孔 23b‧‧‧ venting holes

24‧‧‧固定構件 24‧‧‧Fixed components

24a‧‧‧固定螺絲 24a‧‧‧ fixing screws

24b‧‧‧貫穿孔 24b‧‧‧through holes

24c‧‧‧螺孔 24c‧‧‧ screw hole

25‧‧‧整列片 25‧‧‧ hologram

26‧‧‧按壓螺絲 26‧‧‧Pushing screws

27‧‧‧厚度材 27‧‧‧ Thickness

31a,31b‧‧‧側壁部 31a, 31b‧‧‧ Side wall

33‧‧‧段部 33‧‧‧ Section

33a‧‧‧螺孔 33a‧‧‧ screw holes

34‧‧‧突出部 34‧‧‧Protruding

34a‧‧‧螺孔 34a‧‧‧ screw holes

41‧‧‧外表面 41‧‧‧ outer surface

42‧‧‧側面 42‧‧‧ side

51‧‧‧貫穿孔 51‧‧‧through holes

Claims (10)

一種球狀體吸附頭,包括:本體部,形成有開口部多孔質體,呈板狀,被嵌入前述開口部;以及整列片,形成有整列球狀體之貫穿孔,在覆蓋前述開口部及前述多孔質體外表面之狀態下,配設於前述本體部一面側;藉透過前述多孔質體進行之吸氣,使前述球狀體吸附在前述貫穿孔之形成部位,其中,包括自前述本體部內側往外側,按壓前述多孔質體之按壓部,前述整列片被固定在前述一面中之前述開口部緣部,前述多孔質體藉前述按壓部之按壓力突出到該外側,使得前述外表面比前述一面還要位於前述外側。 A spheroid adsorption head comprising: a body portion having an open porous body formed in a plate shape and embedded in the opening; and an entire row of through holes forming an entire spherical body covering the opening and a surface of the outer surface of the porous body is disposed on one side of the main body portion, and the spherical body is adsorbed to a portion where the through hole is formed by inhalation through the porous body, wherein the body portion is included The inner side of the inner side presses the pressing portion of the porous body, and the aligned sheet is fixed to the opening edge portion of the one surface, and the porous body protrudes to the outer side by the pressing force of the pressing portion, so that the outer surface ratio is The aforementioned side is also located on the aforementioned outer side. 如申請專利範圍第1項所述之球狀體吸附頭,其中,具有被配設於前述按壓部與前述多孔質體間之板體,前述按壓部透過前述板體按壓前述多孔質體。 The spheroid adsorption head according to the first aspect of the invention, wherein the spheroid adsorption head is disposed between the pressing portion and the porous body, and the pressing portion presses the porous body through the plate body. 如申請專利範圍第1項所述之球狀體吸附頭,其中,具有可調整之調整部,使得前述多孔質體的各側面與前述開口部內周面間之各分離距離相同。 The spheroid adsorption head according to claim 1, wherein the spheroid adsorption head has an adjustable adjustment portion such that each separation surface between the side faces of the porous body and the inner peripheral surface of the opening is the same. 如申請專利範圍第2項所述之球狀體吸附頭,其中,具有可調整之調整部,使得前述多孔質體的各側面與前述開口部內周面間之各分離距離相同。 The spheroid adsorption head according to claim 2, wherein the spheroid adsorption head has an adjustable adjustment portion such that the separation distance between each side surface of the porous body and the inner circumferential surface of the opening is the same. 一種球狀體搭載裝置,包括: 球狀體吸附頭,如申請專利範圍第1至4項中任一項所述者;以及搬運裝置,在吸附前述球狀體之吸附位置搬運前述球狀體吸附頭,同時使吸附有前述球狀體之前述球狀體吸附頭,搬運至搭載對象體之配置位置;搭載前述球狀體在前述搭載對象體。 A spherical body loading device comprising: a spheroid adsorption head according to any one of claims 1 to 4; and a conveying device that transports the spheroid adsorption head at an adsorption position where the spheroid is adsorbed, and simultaneously adsorbs the ball The spheroid adsorption head of the body is transported to an arrangement position of the mounted object, and the spherical body is mounted on the mounted object. 一種球狀體吸附頭製造方法,製造球狀體吸附頭,前述球狀體吸附頭包括:本體部,形成有開口部;多孔質體,呈板狀,被嵌入前述開口部;以及整列片,形成有整列球狀體之貫穿孔,在覆蓋前述開口部及前述多孔質體外表面之狀態下,配設於前述本體部一面側;藉透過前述多孔質體進行之吸氣,使前述球狀體吸附在前述貫穿孔之形成部位,其中,固定前述整列片在前述一面中之前述開口部的緣部,自前述本體部內側往外側按壓被嵌入前述開口部之前述多孔質體,使前述多孔質體突出到該外側,使得前述外表面比前述一面還要位於外側。 A method for producing a spheroid adsorption head, comprising: a spheroid adsorption head comprising: a body portion having an opening; a porous body having a plate shape and being embedded in the opening; and an entire column, a through hole in which the entire spherical body is formed, and is disposed on one surface side of the main body portion in a state of covering the opening portion and the outer surface of the porous body; and the spheroid is formed by inhalation through the porous body Adsorbed in a portion where the through-hole is formed, wherein the edge of the opening in the one surface of the aligned sheet is fixed, and the porous body embedded in the opening is pressed outward from the inside of the main body to make the porous body The body protrudes to the outside such that the aforementioned outer surface is located outside the aforementioned side. 如申請專利範圍第6項所述之球狀體吸附頭製造方法,其中,透過前述板體按壓前述多孔質體。 The method for producing a spheroid adsorption head according to claim 6, wherein the porous body is pressed through the plate body. 如申請專利範圍第6項所述之球狀體吸附頭製造方法,其中,調整使得前述多孔質體的各側面與前述開口部內周面間之各分離距離相同,而且按壓前述多孔質體。 The method for producing a spheroid adsorption head according to claim 6, wherein the separation distance between each side surface of the porous body and the inner peripheral surface of the opening is the same, and the porous body is pressed. 如申請專利範圍第7項所述之球狀體吸附頭製造方 法,其中,調整使得前述多孔質體的各側面與前述開口部內周面間之各分離距離相同,而且按壓前述多孔質體。 The spheroid adsorption head manufacturer as described in claim 7 In the method, the separation distance between each side surface of the porous body and the inner circumferential surface of the opening is the same, and the porous body is pressed. 如申請專利範圍第6至9項中任一項所述之球狀體吸附頭製造方法,其中,使用該整列片,前述整列片限制配設在前述一面側以前之狀態中之前述貫穿孔排列位置,在僅以相當於突出前述外側之狀態中之前述整列片延伸部分,縮小搭載前述球狀體之搭載對象體之配列位置之位置。 The spheroid adsorption head manufacturing method according to any one of claims 6 to 9, wherein the aligning sheet is used to restrict the arrangement of the through holes in a state before the one side In the position, the position of the arrangement position of the mounting target body on which the spherical body is mounted is reduced by the extension portion of the entire row in the state corresponding to the outer side.
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