TW201312810A - Light emitting device cell, light emitting device, and light emitting device cell manufacturing method - Google Patents

Light emitting device cell, light emitting device, and light emitting device cell manufacturing method Download PDF

Info

Publication number
TW201312810A
TW201312810A TW101131053A TW101131053A TW201312810A TW 201312810 A TW201312810 A TW 201312810A TW 101131053 A TW101131053 A TW 101131053A TW 101131053 A TW101131053 A TW 101131053A TW 201312810 A TW201312810 A TW 201312810A
Authority
TW
Taiwan
Prior art keywords
wall portion
main wall
light
glass
emitting device
Prior art date
Application number
TW101131053A
Other languages
Chinese (zh)
Inventor
Shoji Yamada
Sotohiro Nakajima
Original Assignee
Nippon Electric Glass Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Glass Co filed Critical Nippon Electric Glass Co
Publication of TW201312810A publication Critical patent/TW201312810A/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/06Joining glass to glass by processes other than fusing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52Encapsulations
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

Provided are a light emitting device cell and a light emitting device which are difficult to damage even when deformed. A lateral partition part (14) comprises a first lateral partition part (14a), a second lateral partition part (14b), and a connecting part (16b). The first lateral partition part (14a) is positioned along one side each (12a, 13a) of first and second primary partition parts (12, 13). The first lateral partition part (14a) is welded to both the first and second primary partition parts (12, 13) to extend from one lateral end part to another lateral end part in the longitudinal direction for a portion of the latitudinal direction. The second lateral partition part (14b) is positioned along another side each (12b, 13b) of the first and second primary partition parts (12, 13) which are adjacent to the one side each (12a, 13a). The second lateral partition part (14b) is positioned such that one end part (14b2) abuts the first lateral partition part (14a). The second lateral partition part (14b) is welded to both the first and second lateral partition parts (12, 13) to extend from one lateral end part to another lateral end part in the longitudinal direction for a portion of the latitudinal direction.

Description

發光裝置用單元、發光裝置及發光裝置用單元之製造方法 Light-emitting device unit, light-emitting device, and method for manufacturing light-emitting device unit

本發明係關於一種發光裝置用單元、發光裝置及發光裝置用單元之製造方法。 The present invention relates to a unit for a light-emitting device, a light-emitting device, and a method for manufacturing a unit for a light-emitting device.

先前,眾所周知有使用量子點等發光體之發光裝置(例如參照專利文獻1)。此種發光裝置通常係將發光體封入單元內。 Heretofore, a light-emitting device using a light-emitting body such as a quantum dot has been known (for example, see Patent Document 1). Such a light-emitting device typically encloses the illuminator in the unit.

[先前技術文獻] [Previous Technical Literature] [專利文獻] [Patent Literature]

專利文獻1:日本專利特表2010-533976號公報 Patent Document 1: Japanese Patent Laid-Open Publication No. 2010-533976

根據發光裝置之用途,存在發光裝置之使用時等,單元受到較大外力之情形。若發光裝置受到較大外力,則存在單元彎曲之情形。因此,對於發光裝置用單元,要求既便彎曲時亦不易破損。 Depending on the use of the light-emitting device, there is a case where the unit is subjected to a large external force when the light-emitting device is used. If the illuminating device is subjected to a large external force, there is a case where the unit is bent. Therefore, it is required that the unit for a light-emitting device is not easily damaged even when it is bent.

本發明之主要目的在於提供一種既便變形時亦不易破損之發光裝置用單元。 SUMMARY OF THE INVENTION A primary object of the present invention is to provide a unit for a light-emitting device which is not easily damaged even when deformed.

本發明之發光裝置用單元係包括第1主壁部及第2主壁部。第1主壁部與第2主壁部係隔開間隔相互對向。第1主壁部及第2主壁部具有多邊形狀。於第1主壁部與第2主壁部之間配置有側壁部。側壁部係與第1主壁部及第2主壁部 一起區劃形成將發光體封入之內部空間。側壁部係包括第1側壁部、第2側壁部、及連接部。第1側壁部係沿著第1主壁部及第2主壁部之一邊配置。第1側壁部係於寬度方向之一部分以自長度方向之一側端部到達另一側端部為止之方式與第1主壁部及第2主壁部分別熔合。第2側壁部係沿著第1主壁部及第2主壁部之與一邊鄰接之其他邊配置。第2側壁部係以一端部臨近第1側壁部之方式配置。第2側壁部係於寬度方向之一部分以自長度方向之一側端部到達另一側端部為止之方式與第1主壁部及第2主壁部分別熔合。連接部係與第2側壁部之一端部及第1側壁部連接。連接部係與第1主壁部及第2主壁部分別熔合。連接部係寬度方向尺寸小於第2側壁部。 The unit for a light-emitting device of the present invention includes a first main wall portion and a second main wall portion. The first main wall portion and the second main wall portion face each other with a space therebetween. The first main wall portion and the second main wall portion have a polygonal shape. A side wall portion is disposed between the first main wall portion and the second main wall portion. Side wall portion and first main wall portion and second main wall portion A division is formed together to form an internal space in which the illuminator is enclosed. The side wall portion includes a first side wall portion, a second side wall portion, and a connecting portion. The first side wall portion is disposed along one side of the first main wall portion and the second main wall portion. The first side wall portion is fused to each of the first main wall portion and the second main wall portion so as to extend from one end portion in the longitudinal direction to the other end portion in one of the width direction portions. The second side wall portion is disposed along the other side of the first main wall portion and the second main wall portion that are adjacent to one side. The second side wall portion is disposed such that one end portion is adjacent to the first side wall portion. The first side wall portion is fused to each of the first main wall portion and the second main wall portion so as to extend from one end portion in the longitudinal direction to the other end portion in one of the width direction portions. The connection portion is connected to one end portion of the second side wall portion and the first side wall portion. The connection portion is fused to each of the first main wall portion and the second main wall portion. The connecting portion has a dimension in the width direction smaller than that of the second side wall portion.

於本發明之發光裝置用單元中,第2側壁部之一端部與第1側壁部之間之間隔亦可為0.1~1.0 mm。 In the unit for a light-emitting device of the present invention, the interval between one end portion of the second side wall portion and the first side wall portion may be 0.1 to 1.0 mm.

於本發明之發光裝置用單元中,側壁部亦可為包含玻璃者。 In the unit for a light-emitting device of the present invention, the side wall portion may be glass-containing.

於本發明之發光裝置用單元中,連接部亦可與第2側壁部之一端部之寬度方向上之外側部分及第1側壁部連接。進而,連接部亦可整體熔合於第1主壁部及第2主壁部之各者。 In the unit for a light-emitting device according to the present invention, the connecting portion may be connected to the outer side portion and the first side wall portion in the width direction of one end portion of the second side wall portion. Further, the connecting portion may be integrally fused to each of the first main wall portion and the second main wall portion.

本發明之發光裝置包括發光裝置用單元及封入內部空間內之發光體。 The light-emitting device of the present invention includes a unit for a light-emitting device and an illuminator enclosed in the internal space.

於本發明之發光裝置中,發光體亦可為包含無機螢光體者。 In the light-emitting device of the present invention, the illuminant may be an inorganic phosphor.

於本發明之發光裝置中,無機螢光體亦可為包含量子點者。 In the light-emitting device of the present invention, the inorganic phosphor may also be a quantum dot.

本發明之發光裝置用單元之製造方法係製作如下積層體,該積層體包括:第1玻璃板;第2玻璃板,其隔開間隔與第1玻璃板對向;複數條玻璃帶,其等於第1玻璃板與第2玻璃板之間沿著第1玻璃板及第2玻璃板之複數條邊之各邊配置;且,複數條玻璃帶包括:第1玻璃帶,其沿著第1玻璃板及第2玻璃板之第1邊配置;及第2玻璃帶,其沿著第1玻璃板及第2玻璃板之與第1邊鄰接之第2邊配置;且第2玻璃帶之第1邊側之端部插入於第2邊與第1玻璃帶之間。進行熔合步驟,即,沿著積層體之複數條邊之各邊,自該邊之一側端部至另一側端部為止掃描雷射光,藉此,使第1玻璃板及第2玻璃板之各者與複數條玻璃帶熔合。於熔合步驟中,自第2邊之相反側朝向第2邊側進行沿著第1邊之雷射光之掃描。 The manufacturing method of the unit for a light-emitting device according to the present invention is to produce a laminate comprising: a first glass sheet; a second glass sheet facing the first glass sheet with a space therebetween; and a plurality of glass ribbons, which are equal to The first glass plate and the second glass plate are disposed along each of a plurality of sides of the first glass plate and the second glass plate; and the plurality of glass ribbons include: a first glass ribbon along the first glass plate And the first side of the second glass sheet; and the second glass ribbon disposed along the second side of the first glass sheet and the second glass sheet adjacent to the first side; and the first side of the second glass ribbon The end of the side is inserted between the second side and the first glass ribbon. Performing a fusing step of scanning the laser light from one side of the side to the other end along the sides of the plurality of sides of the laminated body, thereby making the first glass plate and the second glass plate Each is fused with a plurality of glass ribbons. In the fusing step, scanning of the laser light along the first side is performed from the opposite side of the second side toward the second side.

於本發明之發光裝置用單元之製造方法中,第2玻璃帶之第1邊側之端部與第1玻璃帶之間隔較佳為0.1 mm~1.0 mm。 In the method for producing a light-emitting device unit of the present invention, the distance between the end portion on the first side of the second glass ribbon and the first glass ribbon is preferably 0.1 mm to 1.0 mm.

根據本發明,可提供一種即便變形時亦不易破損之發光裝置用單元及發光裝置。 According to the present invention, it is possible to provide a light-emitting device unit and a light-emitting device which are less likely to be damaged even when deformed.

以下,對實施本發明之較佳形態之一例進行說明。其中,下述之實施形態僅為例示。本發明並不受下述實施形 態任何限定。 Hereinafter, an example of a preferred embodiment of the present invention will be described. However, the following embodiments are merely illustrative. The present invention is not subject to the following embodiments State is any limit.

又,於實施形態等中所參照之各圖式中,實質上具有相同功能之構件以相同之符號進行參照。又,實施形態等中所參照之圖式係示意性記載者,且存在圖式中描繪之物體之尺寸之比率等與現實物體之尺寸之比率等不同之情形。於圖式相互之間,亦存在物體之尺寸比率等不同之情形。具體性物體之尺寸比率等應參酌以下之說明進行判斷。 In the respective drawings referred to in the embodiments and the like, members having substantially the same functions are referred to by the same reference numerals. In addition, the drawings referred to in the embodiments and the like are schematically described, and the ratio of the size of the object drawn in the drawing to the ratio of the size of the real object or the like is different. Between the drawings, there are also cases where the size ratio of the objects is different. The size ratio of specific objects, etc., should be judged by considering the following instructions.

(第1實施形態) (First embodiment)

圖1係第1實施形態之發光裝置之示意性立體圖。圖2係第1實施形態之發光裝置之示意性平面圖。圖3係圖2之線III-III之示意性剖面圖。圖4係圖2之線IV-IV之示意性剖面圖。圖5係將發光裝置沿x方向彎曲時之圖4之V部分放大所得之示意性剖面圖。一面參照圖1~5,一面對本實施形態之發光裝置1之構成進行說明。再者,於圖2及下述之圖13中,對熔合部14a1、14b1、14c1、14d1標註有影線,但標註有影線之部分不表示剖面。 Fig. 1 is a schematic perspective view of a light-emitting device of a first embodiment. Fig. 2 is a schematic plan view of a light-emitting device of a first embodiment. Figure 3 is a schematic cross-sectional view taken along line III-III of Figure 2. Figure 4 is a schematic cross-sectional view taken along line IV-IV of Figure 2. Fig. 5 is a schematic cross-sectional view showing an enlarged portion V of Fig. 4 when the light-emitting device is bent in the x direction. The configuration of the light-emitting device 1 of the present embodiment will be described with reference to Figs. 1 to 5 . Further, in Fig. 2 and Fig. 13 described below, the fusion portions 14a1, 14b1, 14c1, and 14d1 are hatched, but the portions marked with hatching do not indicate the cross section.

發光裝置1係於激發光入射時,出射波長與激發光不同之光的裝置。發光裝置1亦可為使激發光之一部分通過,出射激發光與藉由激發光之照射而產生之光的混合光者。 The light-emitting device 1 is a device that emits light having a wavelength different from that of the excitation light when the excitation light is incident. The light-emitting device 1 may be a light-mixing device that transmits a part of the excitation light and emits the light generated by the excitation light and the irradiation of the excitation light.

發光裝置1係包含單元10。如圖2所示,單元10係包含內部空間10a。內部空間10a之厚度例如為5~500 μm左右,較佳為10~100 μm左右。 The light-emitting device 1 comprises a unit 10. As shown in FIG. 2, the unit 10 includes an internal space 10a. The thickness of the internal space 10a is, for example, about 5 to 500 μm, preferably about 10 to 100 μm.

於內部空間10a內封入有發光體。具體而言,於內部空間10a內封入有包含分散介質、及分散於分散介質中之發 光體之發光構件11。分散介質只要可使發光體較佳地分散,則並無特別限定。分散介質既可為液體,亦可為樹脂、玻璃等。 An illuminant is enclosed in the internal space 10a. Specifically, the inner space 10a is sealed with a dispersion medium and dispersed in the dispersion medium. Light-emitting member 11 of a light body. The dispersion medium is not particularly limited as long as the illuminant is preferably dispersed. The dispersion medium can be either a liquid or a resin, glass or the like.

發光體之種類並無特別限定。作為發光體,例如可列舉無機螢光體、有機螢光體等螢光體。該等之中,較佳為無機螢光體。 The type of the illuminant is not particularly limited. Examples of the illuminant include phosphors such as inorganic phosphors and organic phosphors. Among these, an inorganic phosphor is preferred.

作為若照射波長300~440 nm之紫外~近紫外之激發光則發出藍色之可見光(波長440~480 nm之螢光)的無機螢光體之具體例,可列舉Sr5(PO4)3Cl:Eu2+、(Sr、Ba)MgAl10O17:Eu2+等。作為若照射波長300~440 nm之紫外~近紫外之激發光則發出綠色之可見光(波長為500 nm~540 nm之螢光)的無機螢光體之具體例,可列舉SrAl2O4:Eu2+、SrGa2S4:Eu2+等。作為若照射波長440~480 nm之藍色之激發光則發出綠色之可見光(波長為500 nm~540 nm之螢光)的無機螢光體之具體例,可列舉SrAl2O4:Eu2+、SrGa2S4:Eu2+等。作為若照射波長300~440 nm之紫外~近紫外之激發光則發出黃色之可見光(波長為540 nm~595 nm之螢光)的無機螢光體之具體例,可列舉ZnS:Eu2+等。作為若照射波長440~480 nm之藍色之激發光則發出黃色之可見光(波長為540 nm~595 nm之螢光)的無機螢光體之具體例,可列舉Y3(Al、Gd)5O12:Ce2+等。作為若照射波長300~440 nm之紫外~近紫外之激發光則發出紅色之可見光(波長為600 nm~700 nm之螢光)的無機螢光體之具體例,可列舉Gd3Ga4O12:Cr3+、CaGa2S4:Mn2+等。作為若照射 波長440~480 nm之藍色之激發光則發出紅色之可見光(波長為600 nm~700 nm之螢光)的無機螢光體之具體例,可列舉Mg2TiO4:Mn4+、K2SiF6:Mn4+等。再者,無機螢光體可使用粒徑為5 μm~50 μm左右者。 Specific examples of the inorganic phosphor that emits blue visible light (fluorescence having a wavelength of 440 to 480 nm) when irradiated with ultraviolet to near-ultraviolet excitation light having a wavelength of 300 to 440 nm include Sr 5 (PO 4 ) 3 Cl. : Eu 2+ , (Sr, Ba) MgAl 10 O 17 : Eu 2+ and the like. Specific examples of the inorganic phosphor that emits green visible light (fluorescence having a wavelength of 500 nm to 540 nm) when irradiated with ultraviolet to near-ultraviolet excitation light having a wavelength of 300 to 440 nm include SrAl 2 O 4 :Eu 2 . + , SrGa 2 S 4 : Eu 2+ and the like. Specific examples of the inorganic phosphor that emits green visible light (fluorescence having a wavelength of 500 nm to 540 nm) when irradiated with blue excitation light having a wavelength of 440 to 480 nm include SrAl 2 O 4 :Eu 2+ . SrGa 2 S 4 : Eu 2+ or the like. Specific examples of the inorganic phosphor that emits yellow visible light (fluorescence having a wavelength of 540 nm to 595 nm) when irradiated with ultraviolet to near-ultraviolet excitation light having a wavelength of 300 to 440 nm include ZnS:Eu 2+ and the like. Specific examples of the inorganic phosphor that emits yellow visible light (fluorescence having a wavelength of 540 nm to 595 nm) when irradiated with blue excitation light having a wavelength of 440 to 480 nm include Y 3 (Al, Gd) 5 O. 12 : Ce 2+ and so on. Specific examples of the inorganic phosphor that emits red visible light (fluorescence having a wavelength of 600 nm to 700 nm) when irradiated with ultraviolet to near-ultraviolet excitation light having a wavelength of 300 to 440 nm include Gd 3 Ga 4 O 12 : Cr 3+ , CaGa 2 S 4 : Mn 2+ and the like. Specific examples of the inorganic phosphor that emits red visible light (fluorescence having a wavelength of 600 nm to 700 nm) when irradiated with blue excitation light having a wavelength of 440 to 480 nm include Mg 2 TiO 4 : Mn 4+ . K 2 SiF 6 : Mn 4+ or the like. Further, as the inorganic phosphor, those having a particle diameter of about 5 μm to 50 μm can be used.

無機螢光體亦可為量子點。量子點係於激發光入射時,出射與激發光不同波長之光者。自量子點出射之光之波長係依存於量子點之粒徑。即,藉由改變量子點之粒徑,可調整所得之光之波長。因此,使量子點之粒徑為與需要獲得之光之波長對應之粒徑。 The inorganic phosphor can also be a quantum dot. A quantum dot is a light that emits light of a different wavelength from the excitation light when the excitation light is incident. The wavelength of light emerging from the quantum dots depends on the particle size of the quantum dots. That is, the wavelength of the obtained light can be adjusted by changing the particle diameter of the quantum dot. Therefore, the particle diameter of the quantum dot is made to correspond to the wavelength of the wavelength of light to be obtained.

作為量子點,例如可使用粒徑為2 nm~10 nm左右者。例如,作為若照射波長300 nm~440 nm之紫外~近紫外之激發光則發出藍色之可見光(波長400~440 nm之螢光)的量子點之具體例,可列舉粒徑為2.0 nm~3.0 nm左右之CdSe之微晶等。作為若照射波長300~440 nm之紫外~近紫外之激發光或波長440 nm~480 nm之藍色之激發光則發出綠色之可見光(波長為500 nm~540 nm之螢光)的量子點之具體例,可列舉粒徑為3.0 nm~3.3 nm左右之CdSe之微晶等。作為若照射波長300 nm~440 nm之紫外~近紫外之激發光或波長440 nm~480 nm之藍色之激發光則發出黃色之可見光(波長為540 nm~595 nm之螢光)的量子點之具體例,可列舉粒徑為3.3 nm~4.5 nm左右之CdSe之微晶等。作為若照射波長300 nm~440 nm之紫外~近紫外之激發光或波長440 nm~480 nm之藍色之激發光則發出紅色之可見光(波長為600 nm~700 nm之螢光)的量子點之具體例,可列舉粒徑為4.5 nm~10 nm左右之CdSe之微晶等。 As the quantum dot, for example, a particle diameter of about 2 nm to 10 nm can be used. For example, a specific example of a quantum dot which emits blue visible light (fluorescence of a wavelength of 400 to 440 nm) when irradiated with ultraviolet to near ultraviolet light having a wavelength of 300 nm to 440 nm, and a particle diameter of 2.0 nm to 3.0 is exemplified. Crystallites of CdSe around nm. The specificity of a quantum dot emitting green visible light (fluorescence with a wavelength of 500 nm to 540 nm) when irradiated with ultraviolet to near-ultraviolet excitation light having a wavelength of 300 to 440 nm or blue excitation light having a wavelength of 440 nm to 480 nm. Examples thereof include crystallites of CdSe having a particle diameter of about 3.0 nm to 3.3 nm. As the excitation light of ultraviolet to near-ultraviolet light having a wavelength of 300 nm to 440 nm or the blue excitation light having a wavelength of 440 nm to 480 nm, a quantum dot of yellow visible light (fluorescence with a wavelength of 540 nm to 595 nm) is emitted. Specific examples include crystallites of CdSe having a particle diameter of about 3.3 nm to 4.5 nm. As an excitation light of ultraviolet to near-ultraviolet light having a wavelength of 300 nm to 440 nm or blue light having a wavelength of 440 nm to 480 nm, a quantum dot of red visible light (fluorescence with a wavelength of 600 nm to 700 nm) is emitted. Specific examples include a particle size of 4.5 Microcrystals of CdSe at around nm~10 nm.

於內部空間10a內,配合激發光之波長區域或欲發光之顏色,封入1種或複數種發光體。 One or a plurality of illuminants are enclosed in the internal space 10a in accordance with the wavelength region of the excitation light or the color to be illuminated.

如圖3及圖4所示,單元10係包括第1主壁部12及第2主壁部13。第1主壁部12與第2主壁部13係於x、y方向上隔開間隔相互對向。第1主壁部12與第2主壁部13係平行。第1主壁部12及第2主壁部13各自具有多邊形狀。具體而言,第1主壁部12及第2主壁部13各自具有四邊形狀。 As shown in FIGS. 3 and 4, the unit 10 includes a first main wall portion 12 and a second main wall portion 13. The first main wall portion 12 and the second main wall portion 13 are opposed to each other at intervals in the x and y directions. The first main wall portion 12 is parallel to the second main wall portion 13. Each of the first main wall portion 12 and the second main wall portion 13 has a polygonal shape. Specifically, each of the first main wall portion 12 and the second main wall portion 13 has a rectangular shape.

第1主壁部12及第2主壁部13之兩者並非必需均為使激發光及自發光體發出之光穿透者。然而,第1主壁部12及第2主壁部13之至少一者必需為使激發光穿透者。又,第1主壁部12及第2主壁部13之至少一者必需為使自發光體發出之光穿透者。例如,第1主壁部12可為使激發光穿透者,且第2主壁部13可為使自發光體發出之光穿透者。 It is not necessary for both the first main wall portion 12 and the second main wall portion 13 to penetrate the excitation light and the light emitted from the self-illuminating body. However, at least one of the first main wall portion 12 and the second main wall portion 13 must be such that the excitation light is transmitted. Further, at least one of the first main wall portion 12 and the second main wall portion 13 must be a light penetrating light emitted from the light-emitting body. For example, the first main wall portion 12 may be a person who transmits the excitation light, and the second main wall portion 13 may be a light penetrating light emitted from the self-illuminating body.

作為構成第1主壁部12及第2主壁部13之材料,例如可列舉玻璃、樹脂、陶瓷等。玻璃係光之穿透性較高,且加工性、耐候性亦優異。因此,第1主壁部12及第2主壁部13較佳為包含玻璃者。 Examples of the material constituting the first main wall portion 12 and the second main wall portion 13 include glass, resin, ceramics, and the like. The glass system has high light transmittance and is excellent in workability and weather resistance. Therefore, it is preferable that the first main wall portion 12 and the second main wall portion 13 include glass.

第1主壁部12及第2主壁部13各自之厚度並無特別限定,但例如可設為0.02 mm~10 mm左右。 The thickness of each of the first main wall portion 12 and the second main wall portion 13 is not particularly limited, and may be, for example, about 0.02 mm to 10 mm.

於第1主壁部12與第2主壁部13之間配置有側壁部14。藉由該側壁部14、第1主壁部12及第2主壁部13,而區劃形成將發光構件11封入之內部空間10a。 A side wall portion 14 is disposed between the first main wall portion 12 and the second main wall portion 13. The side wall portion 14, the first main wall portion 12, and the second main wall portion 13 are formed to define an internal space 10a in which the light-emitting member 11 is sealed.

作為構成側壁部14之材料,例如可列舉玻璃、樹脂、陶 瓷等。就光之穿透性、加工性、耐候性等觀點而言,側壁部14較佳為包含玻璃者。 Examples of the material constituting the side wall portion 14 include glass, resin, and ceramics. Porcelain, etc. The side wall portion 14 preferably contains glass in terms of light penetration, workability, weather resistance, and the like.

側壁部14係包含4個側壁部14a、14b、14c、14d。 The side wall portion 14 includes four side wall portions 14a, 14b, 14c, and 14d.

側壁部14a係沿著第1主壁部12及第2主壁部13之一邊12a、13a配置。側壁部14a係y1側端部14a3到達第1主壁部12及第2主壁部13之y1側端面,另一方面,y2側端部14a2未到達y2側端面。側壁部14d位於側壁部14a之y2側端部14a2與第1主壁部12及第2主壁部13之y2側端面之間。於側壁部14a之y2側端部14a2與側壁部14d之間設置有間隔W3。 The side wall portion 14a is disposed along one of the first main wall portion 12 and the second main wall portion 13 side 12a, 13a. The side wall portion 14a y1 side end portion 14a3 reaches the y1 side end surface of the first main wall portion 12 and the second main wall portion 13, and the y2 side end portion 14a2 does not reach the y2 side end surface. The side wall portion 14d is located between the y2-side end portion 14a2 of the side wall portion 14a and the first main wall portion 12 and the y2-side end surface of the second main wall portion 13. A space W3 is provided between the y2 side end portion 14a2 of the side wall portion 14a and the side wall portion 14d.

側壁部14b係沿著第1主壁部12及第2主壁部13之與邊12a、13a鄰接之邊12b、13b配置。側壁部14b係x1側端部14b3到達第1主壁部12及第2主壁部13之x1側端面,另一方面,x2側端部14b2未到達x2側端面。側壁部14a位於側壁部14b之x2側端部14b2與第1主壁部12及第2主壁部13之x2側端面之間。於側壁部14b之x2側端部14b2與側壁部14a之間設置有間隔W1。 The side wall portion 14b is disposed along the sides 12b and 13b of the first main wall portion 12 and the second main wall portion 13 adjacent to the sides 12a and 13a. The side wall portion 14b is formed on the x1 side end surface 14b3 and reaches the x1 side end surface of the first main wall portion 12 and the second main wall portion 13, and the x2 side end portion 14b2 does not reach the x2 side end surface. The side wall portion 14a is located between the x2 side end portion 14b2 of the side wall portion 14b and the first main wall portion 12 and the x2 side end surface of the second main wall portion 13. A space W1 is provided between the x2 side end portion 14b2 of the side wall portion 14b and the side wall portion 14a.

側壁部14c係沿著第1主壁部12及第2主壁部13之與邊12b、13b鄰接之邊12c、13c配置。側壁部14c係y2側端部14c3到達第1主壁部12及第2主壁部13之y2側端面。另一方面,y1側端部14c2未到達y1側端面。側壁部14b位於側壁部14c之y1側端部14c2與第1主壁部12及第2主壁部13之y1側端面之間。於側壁部14c之y1側端部14c2與側壁部14b之間設置有間隔W2。 The side wall portion 14c is disposed along the sides 12c and 13c of the first main wall portion 12 and the second main wall portion 13 adjacent to the sides 12b and 13b. The side wall portion 14c y2 side end portion 14c3 reaches the y2 side end faces of the first main wall portion 12 and the second main wall portion 13. On the other hand, the y1 side end portion 14c2 does not reach the y1 side end surface. The side wall portion 14b is located between the y1 side end portion 14c2 of the side wall portion 14c and the first main wall portion 12 and the y1 side end surface of the second main wall portion 13. A space W2 is provided between the y1 side end portion 14c2 of the side wall portion 14c and the side wall portion 14b.

側壁部14d係沿著第1主壁部12及第2主壁部13之與邊12c、13c鄰接之邊12d、13d配置。側壁部14d係x2側端部14d3到達第1主壁部12及第2主壁部13之x2側端面,另一方面,x1側端部14d2未到達x1側端面。側壁部14c位於側壁部14d之x1側端部14d2與第1主壁部12及第2主壁部13之x1側端面之間。於側壁部14d之x1側端部14d2與側壁部14c之間設置有間隔W4。 The side wall portion 14d is disposed along the sides 12d and 13d of the first main wall portion 12 and the second main wall portion 13 adjacent to the sides 12c and 13c. The side wall portion 14d is at the x2 side end portion 14d3 and reaches the x2 side end surface of the first main wall portion 12 and the second main wall portion 13, and the x1 side end portion 14d2 does not reach the x1 side end surface. The side wall portion 14c is located between the x1 side end portion 14d2 of the side wall portion 14d and the first main wall portion 12 and the second main wall portion 13 at the x1 side end surface. A space W4 is provided between the x1 side end portion 14d2 of the side wall portion 14d and the side wall portion 14c.

間隔W1~W4各自較佳為0.1~1.0 mm,更佳為0.1~0.5 mm。間隔W1~W4彼此既可相等,亦可不同。 Each of the intervals W1 to W4 is preferably 0.1 to 1.0 mm, more preferably 0.1 to 0.5 mm. The intervals W1 to W4 may be equal to each other or different.

側壁部14b係以一端部14b2臨近側壁部14a之方式配置。更詳細而言,側壁部14b係以一端部14b2與側壁部14a之端部14a3對向之方式配置。側壁部14c係以一端部14c2臨近側壁部14b之端部14b3之方式配置。側壁部14d係以一端部14d2臨近側壁部14c之端部14c3之方式配置。 The side wall portion 14b is disposed such that the one end portion 14b2 is adjacent to the side wall portion 14a. More specifically, the side wall portion 14b is disposed such that the one end portion 14b2 faces the end portion 14a3 of the side wall portion 14a. The side wall portion 14c is disposed such that the one end portion 14c2 is adjacent to the end portion 14b3 of the side wall portion 14b. The side wall portion 14d is disposed such that the one end portion 14d2 is adjacent to the end portion 14c3 of the side wall portion 14c.

側壁部14a係包含熔合部14a1。熔合部14a1係設置於側壁部14a之寬度方向即x方向之一部分。熔合部14a1係以自側壁部14a之長度方向即y方向之一側端部到達另一側端部為止之方式設置。熔合部14a1之整體熔合於第1主壁部12及第2主壁部13之各者。側壁部14a之熔合部14a1以外之部分未與第1主壁部12及第2主壁部13分別熔合。即,側壁部14a係於側壁部14a之寬度方向即x方向之一部分,與第1主壁部12及第2主壁部13分別熔合。 The side wall portion 14a includes a fusion portion 14a1. The fusion portion 14a1 is provided in a portion of the width direction of the side wall portion 14a, that is, in the x direction. The fusion portion 14a1 is provided so as to extend from the longitudinal direction of the side wall portion 14a, that is, the one end portion in the y direction to the other end portion. The entire fusion portion 14a1 is fused to each of the first main wall portion 12 and the second main wall portion 13. The portion other than the welded portion 14a1 of the side wall portion 14a is not fused to the first main wall portion 12 and the second main wall portion 13, respectively. In other words, the side wall portion 14a is fused to the first main wall portion 12 and the second main wall portion 13 in a part of the width direction of the side wall portion 14a, that is, in the x direction.

側壁部14b係包含熔合部14b1。熔合部14b1係設置於側壁部14b之寬度方向即y方向之一部分。熔合部14b1係以自 側壁部14b之長度方向即x方向之一側端部到達另一側端部為止之方式設置。熔合部14b1之整體熔合於第1主壁部12及第2主壁部13。側壁部14b之熔合部14b1以外之部分未與第1主壁部12及第2主壁部13分別熔合。即,側壁部14b係於側壁部14b之寬度方向即y方向之一部分,與第1主壁部12及第2主壁部13分別熔合。 The side wall portion 14b includes a fusion portion 14b1. The fusion portion 14b1 is provided in a portion of the width direction of the side wall portion 14b, that is, in the y direction. The fusion part 14b1 is self-contained The longitudinal direction of the side wall portion 14b, that is, the one end portion in the x direction reaches the other end portion. The entire fusion portion 14b1 is fused to the first main wall portion 12 and the second main wall portion 13. The portion other than the welded portion 14b1 of the side wall portion 14b is not fused to the first main wall portion 12 and the second main wall portion 13, respectively. In other words, the side wall portion 14b is fused to the first main wall portion 12 and the second main wall portion 13 in a part of the width direction of the side wall portion 14b, that is, in the y direction.

側壁部14c係包含熔合部14c1。熔合部14c1係設置於側壁部14c之寬度方向即x方向之一部分。熔合部14c1係以自側壁部14c之長度方向即y方向之一側端部到達另一側端部為止之方式設置。熔合部14c1之整體熔合於第1主壁部12及第2主壁部13之各者。側壁部14c之熔合部14c1以外之部分未與第1主壁部12及第2主壁部13分別熔合。即,側壁部14c係於側壁部14c之寬度方向即x方向之一部分,與第1主壁部12及第2主壁部13分別熔合。 The side wall portion 14c includes a fusion portion 14c1. The fusion portion 14c1 is provided in a portion of the width direction of the side wall portion 14c, that is, in the x direction. The fusion portion 14c1 is provided so as to extend from one end side in the y direction of the side wall portion 14c to the other end portion. The entire fusion portion 14c1 is fused to each of the first main wall portion 12 and the second main wall portion 13. The portion other than the welded portion 14c1 of the side wall portion 14c is not fused to the first main wall portion 12 and the second main wall portion 13, respectively. In other words, the side wall portion 14c is fused to the first main wall portion 12 and the second main wall portion 13 in a part of the width direction of the side wall portion 14c, that is, in the x direction.

側壁部14d係包含熔合部14d1。熔合部14d1係設置於側壁部14a之寬度方向即y方向之一部分。熔合部14d1係以自側壁部14d之長度方向即x方向之一側端部到達另一側端部為止之方式設置。熔合部14d1之整體熔合於第1主壁部12及第2主壁部13之各者。側壁部14d之熔合部14d1以外之部分未與第1主壁部12及第2主壁部13分別熔合。即,側壁部14d係於側壁部14d之寬度方向即y方向之一部分,與第1主壁部12及第2主壁部13分別熔合。 The side wall portion 14d includes a fusion portion 14d1. The fusion portion 14d1 is provided in a portion of the width direction of the side wall portion 14a, that is, in the y direction. The fusion portion 14d1 is provided from the longitudinal direction of the side wall portion 14d, that is, the one end portion in the x direction to the other end portion. The entire fusion portion 14d1 is fused to each of the first main wall portion 12 and the second main wall portion 13. The portion other than the welded portion 14d1 of the side wall portion 14d is not fused to the first main wall portion 12 and the second main wall portion 13, respectively. In other words, the side wall portion 14d is fused to the first main wall portion 12 and the second main wall portion 13 in a part of the width direction of the side wall portion 14d, that is, in the y direction.

側壁部14a之y2側端部14a2與側壁部14d係例如藉由利用雷射等之加熱相互熔合,形成連接部16a而連接。連接部 16a之整體熔合於第1主壁部12及第2主壁部13之各者。連接部16a之寬度方向(x方向)上之尺寸小於側壁部14a之寬度方向(x方向)上之尺寸。連接部16a之寬度方向(x方向)上之尺寸較佳為側壁部14a之寬度方向(x方向)上之尺寸之0.5倍以下,更佳為0.2倍以下。具體而言,連接部16a係將側壁部14a之y2側端部14a2之寬度方向上之外側部分與側壁部14d連接。側壁部14a之y2側端部14a2之寬度方向上之內側部分與側壁部14d未藉由連接部16a連接。 The y2 side end portion 14a2 and the side wall portion 14d of the side wall portion 14a are fused to each other by heating by a laser or the like, for example, and the connection portion 16a is formed and connected. Connection The entirety of 16a is fused to each of the first main wall portion 12 and the second main wall portion 13. The dimension in the width direction (x direction) of the connecting portion 16a is smaller than the dimension in the width direction (x direction) of the side wall portion 14a. The dimension in the width direction (x direction) of the connecting portion 16a is preferably 0.5 times or less, more preferably 0.2 times or less the dimension in the width direction (x direction) of the side wall portion 14a. Specifically, the connecting portion 16a connects the outer side portion in the width direction of the y2-side end portion 14a2 of the side wall portion 14a to the side wall portion 14d. The inner portion in the width direction of the y2-side end portion 14a2 of the side wall portion 14a and the side wall portion 14d are not connected by the connecting portion 16a.

側壁部14b之x2側端部14b2與側壁部14a係藉由連接部16b而連接。連接部16b之整體熔合於第1主壁部12及第2主壁部13之各者。連接部16b之寬度方向(y方向)上之尺寸小於側壁部14b之寬度方向(y方向)上之尺寸。連接部16b之寬度方向(y方向)上之尺寸較佳為側壁部14b之寬度方向(y方向)之尺寸之0.5倍以下,更佳為0.2倍以下。具體而言,連接部16b係將側壁部14b之x2側端部14b2之寬度方向上之外側部分與側壁部14a連接。側壁部14b之x2側端部14b2之寬度方向上之內側部分與側壁部14a未藉由連接部16b連接。 The x2 side end portion 14b2 of the side wall portion 14b and the side wall portion 14a are connected by the connecting portion 16b. The entire connecting portion 16b is fused to each of the first main wall portion 12 and the second main wall portion 13. The dimension in the width direction (y direction) of the connecting portion 16b is smaller than the dimension in the width direction (y direction) of the side wall portion 14b. The dimension in the width direction (y direction) of the connecting portion 16b is preferably 0.5 times or less, more preferably 0.2 times or less the dimension of the width direction (y direction) of the side wall portion 14b. Specifically, the connecting portion 16b connects the outer side portion in the width direction of the x2 side end portion 14b2 of the side wall portion 14b to the side wall portion 14a. The inner portion in the width direction of the x2 side end portion 14b2 of the side wall portion 14b and the side wall portion 14a are not connected by the connecting portion 16b.

側壁部14c之y1側端部14c2與側壁部14b係藉由連接部16c而連接。連接部16c之整體熔合於第1主壁部12及第2主壁部13之各者。連接部16c之寬度方向(x方向)之尺寸小於側壁部14c之寬度方向(x方向)之尺寸。連接部16c之寬度方向(x方向)之尺寸較佳為側壁部14c之寬度方向(x方向)之尺寸之0.5倍以下,更佳為0.2倍以下。具體而言,連接部16c係將側壁部14c之y1側端部14c2之寬度方向之外側部分與 側壁部14b連接。側壁部14c之y1側端部14c2之寬度方向之內側部分與側壁部14b未藉由連接部16c連接。 The y1 side end portion 14c2 and the side wall portion 14b of the side wall portion 14c are connected by a connecting portion 16c. The entire connecting portion 16c is fused to each of the first main wall portion 12 and the second main wall portion 13. The dimension of the connecting portion 16c in the width direction (x direction) is smaller than the dimension of the width direction (x direction) of the side wall portion 14c. The dimension of the width direction (x direction) of the connecting portion 16c is preferably 0.5 times or less, more preferably 0.2 times or less the dimension of the width direction (x direction) of the side wall portion 14c. Specifically, the connecting portion 16c is an outer side portion in the width direction of the y1 side end portion 14c2 of the side wall portion 14c. The side wall portions 14b are connected. The inner side portion in the width direction of the y1 side end portion 14c2 of the side wall portion 14c and the side wall portion 14b are not connected by the connecting portion 16c.

於側壁部14d之x1側端部14d2與側壁部14c之間,構成有與內部空間10a連通之開口10b。該開口10b係用以將發光構件11注入至內部空間10a內。開口10b係藉由密封構件15而密封。 An opening 10b communicating with the internal space 10a is formed between the x1 side end portion 14d2 of the side wall portion 14d and the side wall portion 14c. The opening 10b is for injecting the light emitting member 11 into the internal space 10a. The opening 10b is sealed by the sealing member 15.

具體而言,於本實施形態中,單元10之第1主壁部12及第2主壁部13分別包含玻璃板。側壁部14a~14d分別包含玻璃帶。 Specifically, in the present embodiment, each of the first main wall portion 12 and the second main wall portion 13 of the unit 10 includes a glass plate. The side wall portions 14a to 14d each include a glass ribbon.

且說,發光裝置1之單元10中存在受到彎曲應力之情形。如圖5所示,若單元10中受到彎曲應力,單元10彎曲,則例如存在端部14b2與側壁部14a之最短距離縮短之情形。此處,於端部14b2與側壁部14a接觸之情形時,存在不與第1主壁部12及第2主壁部13熔合之端部14b2之熔合部14b1以外之部分與側壁部14a之熔合部14a1以外之部分接觸,導致破損之虞。 Moreover, there is a case where the unit 10 of the light-emitting device 1 is subjected to bending stress. As shown in FIG. 5, if the unit 10 is subjected to bending stress and the unit 10 is bent, for example, the shortest distance between the end portion 14b2 and the side wall portion 14a is shortened. Here, when the end portion 14b2 is in contact with the side wall portion 14a, the portion other than the fusion portion 14b1 of the end portion 14b2 that is not fused to the first main wall portion 12 and the second main wall portion 13 is fused with the side wall portion 14a. The part other than the part 14a1 is in contact, resulting in damage.

相對於此,發光裝置1係於端部14b2、14c2、14d2、14a2與側壁部14a、14b、14c、14d之間設置有間隔。因此,即便單元10彎曲,端部14b2、14c2、14d2、14a2與側壁部14a、14b、14c、14d亦不易接觸。因此,可抑制側壁部14a~14d產生損傷。 On the other hand, the light-emitting device 1 is provided with a space between the end portions 14b2, 14c2, 14d2, and 14a2 and the side wall portions 14a, 14b, 14c, and 14d. Therefore, even if the unit 10 is bent, the end portions 14b2, 14c2, 14d2, 14a2 and the side wall portions 14a, 14b, 14c, 14d are not easily contacted. Therefore, damage to the side wall portions 14a to 14d can be suppressed.

於側壁部14a~14d包含玻璃之情形時,側壁部14a~14d容易因接觸而破損,因此,可抑制本實施形態之側壁部14a~14d之破損的技術於側壁部14a~14d包含玻璃之情形尤 其有效。 When the side wall portions 14a to 14d include glass, the side wall portions 14a to 14d are easily broken by contact. Therefore, the technique of suppressing the damage of the side wall portions 14a to 14d of the present embodiment is such that the side wall portions 14a to 14d contain glass. especially It works.

其次,對實施形態之發光裝置1之製造方法之一例進行說明。其中,以下之製造方法僅為一例,本發明之發光裝置之製造方法並不受以下之製造方法任何限定。 Next, an example of a method of manufacturing the light-emitting device 1 of the embodiment will be described. However, the following manufacturing methods are merely examples, and the method of manufacturing the light-emitting device of the present invention is not limited to the following production methods.

圖6係用以說明本實施形態之發光裝置之製造方法之示意性平面圖。圖7係用以說明本實施形態之發光裝置之製造方法之示意性平面圖。圖8係圖7之線VII-VII之示意性剖面圖。圖9係用以說明本實施形態之發光裝置之製造方法之示意性剖面圖。 Fig. 6 is a schematic plan view for explaining a method of manufacturing the light-emitting device of the embodiment. Fig. 7 is a schematic plan view for explaining a method of manufacturing the light-emitting device of the embodiment. Figure 8 is a schematic cross-sectional view taken along line VII-VII of Figure 7. Fig. 9 is a schematic cross-sectional view for explaining a method of manufacturing the light-emitting device of the embodiment.

其次,一面參照圖6~圖9,一面對本實施形態之發光裝置1之製造方法之一例進行說明。其中,以下之製造方法僅為一例,本發明之發光裝置1之製造方法並不受以下之製造方法任何限定。 Next, an example of a method of manufacturing the light-emitting device 1 of the present embodiment will be described with reference to Figs. 6 to 9 . However, the following manufacturing method is merely an example, and the manufacturing method of the light-emitting device 1 of the present invention is not limited to the following manufacturing methods.

(發光裝置之製造方法) (Manufacturing method of light emitting device)

首先,準備用以構成主壁部12、13之第1玻璃板及第2玻璃板20、21。其次,如圖6所示,於玻璃板21之周緣部配置用以構成側壁部14a~14d之玻璃帶30a~30d。此時,於玻璃帶30a~30d之端部30a2、30b2、30c2、30d2與玻璃帶30d、30a、30b、30c之間分別預先設置間隔W30、W10、W20、W40。 First, the first glass sheets and the second glass sheets 20 and 21 for constituting the main wall portions 12 and 13 are prepared. Next, as shown in Fig. 6, the glass ribbons 30a to 30d for constituting the side wall portions 14a to 14d are disposed on the peripheral edge portion of the glass sheet 21. At this time, intervals W30, W10, W20, and W40 are provided in advance between the end portions 30a2, 30b2, 30c2, and 30d2 of the glass ribbons 30a to 30d and the glass ribbons 30d, 30a, 30b, and 30c, respectively.

其次,如圖7、圖8所示,於第2玻璃板21上插入玻璃帶30a、30b、30c、30d,積層第1玻璃板20。藉此,獲得依序積層有第2玻璃板21、玻璃帶30a、30b、30c、30d、及第1玻璃板20之積層體40。 Next, as shown in FIGS. 7 and 8, the glass ribbons 30a, 30b, 30c, and 30d are inserted into the second glass sheet 21, and the first glass sheet 20 is laminated. Thereby, the laminated body 40 in which the second glass plate 21, the glass ribbons 30a, 30b, 30c, and 30d and the first glass plate 20 are laminated in this order is obtained.

第1玻璃板20與第2玻璃板21係隔開間隔而對向。於第1玻璃板20與第2玻璃板21之間,玻璃帶30a~30d沿著第1玻璃板20及第2玻璃板21之複數條邊20a~20d、21a~21d之各邊,配置成環狀。具體而言,玻璃帶30b係沿著第1玻璃板20及第2玻璃板21之邊20b、21b配置。玻璃帶30a係沿著第1玻璃板及第2玻璃板之與邊20b、21b鄰接之邊20a、21a配置。玻璃帶30d係沿著第1玻璃板20及第2玻璃板21之與邊20a、21a鄰接之邊20d、21d配置。玻璃帶30c係沿著第1玻璃板20及第2玻璃板21之與邊20d、21d鄰接之第2邊20c、21c配置。 The first glass plate 20 and the second glass plate 21 are opposed to each other with a space therebetween. Between the first glass plate 20 and the second glass plate 21, the glass ribbons 30a to 30d are arranged along the sides of the plurality of sides 20a to 20d and 21a to 21d of the first glass plate 20 and the second glass plate 21, and are arranged in a ring. shape. Specifically, the glass ribbon 30b is disposed along the sides 20b and 21b of the first glass sheet 20 and the second glass sheet 21. The glass ribbon 30a is disposed along the sides 20a and 21a of the first glass sheet and the second glass sheet adjacent to the sides 20b and 21b. The glass ribbon 30d is disposed along the sides 20d and 21d of the first glass sheet 20 and the second glass sheet 21 adjacent to the sides 20a and 21a. The glass ribbon 30c is disposed along the second sides 20c and 21c of the first glass sheet 20 and the second glass sheet 21 adjacent to the sides 20d and 21d.

玻璃帶30a之邊20b、21b側之端部30a3係插入於邊20a、21a與玻璃帶30b之間。更詳細而言,於玻璃帶30b之邊20a、21a側之端部30b2與邊20a、21a之間配置玻璃帶30a之端部30a3。此時,於玻璃帶30b之端部30b2與玻璃帶30a之間設置間隔W10。 The end portions 30a3 on the sides 20b and 21b of the glass ribbon 30a are inserted between the sides 20a, 21a and the glass ribbon 30b. More specifically, the end portion 30a3 of the glass ribbon 30a is disposed between the end portion 30b2 on the side 20a, 21a side of the glass ribbon 30b and the sides 20a, 21a. At this time, a space W10 is provided between the end portion 30b2 of the glass ribbon 30b and the glass ribbon 30a.

玻璃帶30b之邊20c、21c側之端部30b3係插入於邊20b、21b與玻璃帶30c之間。更詳細而言,於玻璃帶30c之邊20b、21b側之端部30c2與邊20b、21b之間配置玻璃帶30b之端部30b3。此時,於玻璃帶30c之端部30c2與玻璃帶30b之間設置間隔W20。 The end portions 30b3 on the sides 20c and 21c of the glass ribbon 30b are inserted between the sides 20b and 21b and the glass ribbon 30c. More specifically, the end portion 30b3 of the glass ribbon 30b is disposed between the end portion 30c2 on the sides 20b and 21b side of the glass ribbon 30c and the sides 20b and 21b. At this time, a space W20 is provided between the end portion 30c2 of the glass ribbon 30c and the glass ribbon 30b.

玻璃帶30c之邊20d、21d側之端部30c3係插入於邊20c、21c與玻璃帶30d之間。更詳細而言,於玻璃帶30d之邊20c、21c側之端部30d2與邊20c、21c之間配置玻璃帶30c之端部30c3。此時,於玻璃帶30d之端部30d2與玻璃帶30c 之間設置間隔W40。 The end portions 30c3 on the sides 20d and 21d of the glass ribbon 30c are inserted between the sides 20c, 21c and the glass ribbon 30d. More specifically, the end portion 30c3 of the glass ribbon 30c is disposed between the end portion 30d2 on the sides 20c and 21c side of the glass ribbon 30d and the sides 20c and 21c. At this time, at the end 30d2 of the glass ribbon 30d and the glass ribbon 30c Set the interval W40 between.

玻璃帶30d之邊20a、21a側之端部30d3係插入於邊20d、21d與玻璃帶30a之間。更詳細而言,於玻璃帶30a之邊20d、21d側之端部30a2與邊20d、21d之間配置玻璃帶30d之端部30d3。此時,於玻璃帶30a之端部30a2與玻璃帶30d之間設置間隔W30。 The end portion 30d3 on the sides 20a and 21a of the glass ribbon 30d is inserted between the sides 20d and 21d and the glass ribbon 30a. More specifically, the end portion 30d3 of the glass ribbon 30d is disposed between the end portion 30a2 on the sides 20d and 21d of the glass ribbon 30a and the sides 20d and 21d. At this time, a space W30 is provided between the end portion 30a2 of the glass ribbon 30a and the glass ribbon 30d.

間隔W10~W40各自較佳為0.1 mm~1.0 mm,更佳為0.1 mm~0.5 mm。間隔W10~W40既可彼此相等,亦可彼此不同。 The interval W10 to W40 is preferably 0.1 mm to 1.0 mm, more preferably 0.1 mm to 0.5 mm. The intervals W10 to W40 may be equal to each other or different from each other.

於積層體40中,第1玻璃板20及第2玻璃板21之外側側面20a3~20d3、21a3~21d3與玻璃帶30a~30d之外側側面30a1~30d1分別為同一面。 In the laminated body 40, the outer side surfaces 20a3 to 20d3, 21a3 to 21d3 of the first glass sheet 20 and the second glass sheet 21 and the outer side surfaces 30a1 to 30d1 of the glass ribbons 30a to 30d have the same surface.

其次,於熔合步驟中,藉由對積層體40照射雷射光50而使玻璃帶30a~30d與玻璃板20、21熔合。 Next, in the fusing step, the glass ribbons 30a to 30d are fused with the glass sheets 20 and 21 by irradiating the laminated body 40 with the laser light 50.

雷射光50係沿著積層體40之邊20a、21a、邊20b、21b、邊20c、21c、邊20d、21d之各邊,自該邊之一側端部20a1、21a1、20b1、21b1、20c1、21c1、20d1、21d1分別掃描至另一側端部20a2、21a2、20b2、21b2、20c2、21c2、20d2、21d2為止。 The laser light 50 is along the sides 20a, 21a, the sides 20b, 21b, the sides 20c, 21c, and the sides 20d, 21d of the laminated body 40, from one side end portions 20a1, 21a1, 20b1, 21b1, 20c1 21c1, 20d1, and 21d1 are scanned to the other side end portions 20a2, 21a2, 20b2, 21b2, 20c2, 21c2, 20d2, and 21d2, respectively.

此時,沿著第1玻璃板20及第2玻璃板21之邊20c、21c之雷射光50之掃描係自與邊20b、21b為相反側之y2側朝向邊20b、21b側即y1側進行。更詳細而言,如圖7、圖9所示,沿著第1玻璃板20及第2玻璃板21之邊20c、21c之雷射光50之掃描係自玻璃帶30c之外側側面30c1之y2側端部30c3朝 向y1側依序進行。藉此,玻璃帶30c之y1側端部30c2與玻璃帶30b分別熔解而連接。 At this time, the scanning of the laser light 50 along the sides 20c and 21c of the first glass sheet 20 and the second glass sheet 21 is performed on the y1 side from the side opposite to the sides 20b and 21b toward the sides 20b and 21b, that is, the y1 side. . More specifically, as shown in FIGS. 7 and 9, the scanning of the laser light 50 along the sides 20c and 21c of the first glass sheet 20 and the second glass sheet 21 is performed on the y2 side of the outer side surface 30c1 of the glass ribbon 30c. End 30c3 towards The sequence is performed on the y1 side. Thereby, the y1 side end portion 30c2 of the glass ribbon 30c and the glass ribbon 30b are respectively melted and connected.

沿著第1玻璃板20及第2玻璃板21之邊20b、21b之雷射光50之掃描係自與邊20a、21a為相反側之x1側朝向邊20a、21a側即x2側進行。更詳細而言,沿著第1玻璃板20及第2玻璃板21之邊20b、21b之雷射光50之掃描係自玻璃帶30b之外側側面30b1之x1側端部30b3朝向x2側依序進行。藉此,玻璃帶30b之x2側端部30b2與玻璃帶30a分別熔解而連接。 The scanning of the laser light 50 along the sides 20b and 21b of the first glass sheet 20 and the second glass sheet 21 is performed on the x1 side from the side opposite to the sides 20a and 21a toward the sides 20a and 21a, that is, on the x2 side. More specifically, the scanning of the laser light 50 along the sides 20b and 21b of the first glass sheet 20 and the second glass sheet 21 is sequentially performed from the x1 side end portion 30b3 of the outer side surface 30b1 of the glass ribbon 30b toward the x2 side. . Thereby, the x2 side end portion 30b2 of the glass ribbon 30b and the glass ribbon 30a are respectively melted and connected.

沿著第1玻璃板20及第2玻璃板21之邊20a、21a之雷射光50之掃描係自與邊20d、21d為相反側之y1側朝向邊20d、21d側即y2側進行。更詳細而言,沿著第1玻璃板20及第2玻璃板21之邊20a、21a之雷射光50之掃描係自玻璃帶30a之外側側面30a1之y1側端部30a3朝向y2側依序進行。藉此,玻璃帶30a之y1側端部30a2與玻璃帶30d分別熔解而連接。 The scanning of the laser light 50 along the sides 20a and 21a of the first glass sheet 20 and the second glass sheet 21 is performed on the side of the y1 side opposite to the sides 20d and 21d toward the sides 20d and 21d, that is, the y2 side. More specifically, the scanning of the laser light 50 along the sides 20a and 21a of the first glass sheet 20 and the second glass sheet 21 is sequentially performed from the y1 side end portion 30a3 of the outer side surface 30a1 of the glass ribbon 30a toward the y2 side. . Thereby, the y1 side end portion 30a2 of the glass ribbon 30a and the glass ribbon 30d are respectively melted and connected.

沿著第1玻璃板20及第2玻璃板21之邊20d、21d之雷射光50之掃描係自與玻璃板20、21之邊20c、21c為相反側之x2側朝向邊20c、21c側即x1側進行。沿著第1玻璃板20及第2玻璃板21之邊20d、21d之雷射光50之掃描係自玻璃帶30d之外側側面30d1之x2側端部30d3朝向x1側依序進行。不對積層體40之端部30d2與玻璃帶30c之間之間隔W40所在之部分照射雷射光50。即,玻璃帶30a與玻璃帶30b相互不連接。其原因在於,在發光裝置1設置有貫通孔10b。 The scanning of the laser light 50 along the sides 20d and 21d of the first glass sheet 20 and the second glass sheet 21 is performed on the x2 side opposite to the sides 20c and 21c of the glass sheets 20 and 21 toward the sides 20c and 21c. The x1 side is performed. The scanning of the laser light 50 along the sides 20d and 21d of the first glass sheet 20 and the second glass sheet 21 is sequentially performed from the x2 side end portion 30d3 of the outer side surface 30d1 of the glass ribbon 30d toward the x1 side. The portion where the interval W40 between the end portion 30d2 of the laminated body 40 and the glass ribbon 30c is not irradiated with the laser light 50. That is, the glass ribbon 30a and the glass ribbon 30b are not connected to each other. This is because the light-emitting device 1 is provided with the through hole 10b.

熔合第1玻璃板20及第2玻璃板21與玻璃帶30a、30b、30c、30d之各者之順序並無特別限定。例如,可以如下之順序進行。即,連續地進行第1玻璃板20及第2玻璃板21之不相鄰之邊20a、21a與邊20c、21c之熔合。其次,連續地進行第1玻璃板20及第2玻璃板21之不相鄰之邊20b、21b與邊20d、21d之熔合。此時,與不相鄰之邊20a、21a及邊20c、21c之兩邊相鄰之邊20b、21b及邊20d、21d之熔合較佳為藉由以將邊20a、21a與邊20c、21c熔合時之雷射光50之輸出之70%左右~95%左右,照射複數次雷射光50而進行。藉此,可更均勻地進行第1玻璃板20及第2玻璃板21之邊20a~20d、21a~21d之玻璃板20、21與玻璃帶30a~30d之熔合。 The order in which each of the first glass sheet 20 and the second glass sheet 21 and the glass ribbons 30a, 30b, 30c, and 30d are fused is not particularly limited. For example, it can be performed in the following order. That is, the non-adjacent sides 20a and 21a of the first glass sheet 20 and the second glass sheet 21 are continuously fused with the sides 20c and 21c. Next, the non-adjacent sides 20b and 21b of the first glass sheet 20 and the second glass sheet 21 are continuously fused with the sides 20d and 21d. At this time, the fusion of the sides 20b, 21b and the sides 20d, 21d adjacent to the sides 20a, 21a and the sides 20c, 21c which are not adjacent are preferably fused by the sides 20a, 21a and the sides 20c, 21c. At about 70% of the output of the laser light 50 is about 95%, and the laser light 50 is irradiated for a plurality of times. Thereby, the glass plates 20 and 21 of the sides 20a-20d and 21a-21d of the 1st glass plate 20 and the 2nd glass plate 21 and the glass ribbons 30a-30d can fuse more uniformly.

再者,雷射光50之照射可藉由使用雷射光照射裝置51,進行CO2雷射等照射而進行。 Further, the irradiation of the laser light 50 can be performed by irradiation with a CO 2 laser or the like by using the laser light irradiation device 51.

可藉由以上處理而完成單元10。 The unit 10 can be completed by the above processing.

其次,自貫通孔10b將發光體封入至內部空間10a內。發光體之封入方法並無特別限定。作為較佳地使用之發光體之封入方法,例如可列舉於使內部空間10a成為減壓環境之狀態下,將包含分散有發光體之液體之發光構件11供給至內部空間10a之方法。 Next, the illuminator is sealed into the internal space 10a from the through hole 10b. The method of encapsulating the illuminant is not particularly limited. The method of encapsulating the illuminant which is preferably used is, for example, a method in which the light-emitting member 11 including the liquid in which the illuminant is dispersed is supplied to the internal space 10a while the internal space 10a is in a reduced-pressure environment.

最後,以覆蓋貫通孔(封入孔)10b之方式配置密封構件15,藉由照射雷射而使密封構件15熔合於單元10,藉此,阻塞貫通孔10b。可藉由以上步驟而製造發光裝置1。 Finally, the sealing member 15 is disposed so as to cover the through hole (sealing hole) 10b, and the sealing member 15 is fused to the unit 10 by irradiation of the laser, thereby blocking the through hole 10b. The light-emitting device 1 can be manufactured by the above steps.

且說,亦可考慮例如使沿著第1玻璃板20及第2玻璃板21 之邊20c、21c之雷射光50之照射自y1側端部20c2、21c2經由玻璃帶30c之y1側端部30c2與玻璃帶30b之間之間隔W20所在之部分,朝向y2側端部30c3依序進行。然而,於此情形時,照射雷射光時,玻璃帶或玻璃板容易碎裂。可認為其原因在於,當雷射光50之照射開始後,玻璃帶不連續之部分(間隔W20附近)立即受到加熱,容易局部性地產生較大之溫度差或熱膨脹差。 Furthermore, it is also conceivable, for example, to make the first glass sheet 20 and the second glass sheet 21 along the first glass sheet 20 and the second glass sheet 21 The irradiation of the laser light 50 of the sides 20c and 21c is performed from the y1 side end portions 20c2, 21c2 via the portion where the interval W20 between the y1 side end portion 30c2 of the glass ribbon 30c and the glass ribbon 30b is located, toward the y2 side end portion 30c3. get on. However, in this case, the glass ribbon or the glass sheet is easily broken when the laser light is irradiated. The reason for this is considered to be that when the irradiation of the laser light 50 is started, the discontinuous portion of the glass ribbon (near the interval W20) is immediately heated, and it is easy to locally generate a large temperature difference or a difference in thermal expansion.

相對於此,於本實施形態之製造方法中,沿著第1玻璃板20及第2玻璃板21之邊20c、21c之雷射光50之掃描係自與邊20b、21b為相反側之y2側朝向邊20b、21b側之y1側依序進行。繼而,於玻璃帶30c中,最後進行雷射光50對y1側端部30c2與玻璃帶30b之間之間隔W20所在之部分之照射。即,於進行雷射光50對玻璃帶不連續之部分(間隔W20附近)之照射之前,連續地實施沿著第1玻璃板20及第2玻璃板21之邊20c、21c之加熱及膨脹。此時,於間隔W20附近由雷射光直接加熱之前,間隔W20附近之溫度上升。因此,於間隔W20附近由雷射光直接加熱時,可抑制產生急遽之溫度差或熱膨脹。該情形於沿著第1玻璃板20及第2玻璃板21之邊20a、21a、邊20b、21b之雷射光50之照射中亦為相同。因此,本實施形態之製造方法係於使用雷射光50之積層體40之熔合步驟中,發揮玻璃板20、21或玻璃帶30a~30d不易破損之優異效果。 On the other hand, in the manufacturing method of the present embodiment, the scanning of the laser light 50 along the sides 20c and 21c of the first glass sheet 20 and the second glass sheet 21 is on the y2 side opposite to the sides 20b and 21b. The y1 side toward the sides 20b and 21b is sequentially performed. Then, in the glass ribbon 30c, the portion of the laser light 50 to which the interval W20 between the y1 side end portion 30c2 and the glass ribbon 30b is located is finally irradiated. That is, heating and expansion along the sides 20c and 21c of the first glass sheet 20 and the second glass sheet 21 are continuously performed before the irradiation of the portion where the laser light 50 is discontinuous (near the space W20). At this time, the temperature in the vicinity of the interval W20 rises before the laser beam is directly heated in the vicinity of the interval W20. Therefore, when directly heated by the laser light in the vicinity of the interval W20, it is possible to suppress a sudden temperature difference or thermal expansion. In this case, the irradiation of the laser light 50 along the sides 20a and 21a and the sides 20b and 21b of the first glass sheet 20 and the second glass sheet 21 is also the same. Therefore, in the fusing step of the laminated body 40 using the laser light 50, the manufacturing method of the present embodiment exhibits an excellent effect that the glass sheets 20 and 21 or the glass ribbons 30a to 30d are not easily broken.

且說,例如,如圖10所示於玻璃帶30c之外側側面30c1相較玻璃板20、21之外側側面20c3、21c3較大地位於外側 之情形時、如圖11所示於玻璃帶30c之外側側面30c1相較玻璃板20、21之外側側面20c3、21c3較大地位於內側之情形時、及如圖12所示於第1玻璃板20之外側側面20c3相較第2玻璃板21之外側側面21c3較大地位於外側之情形時,僅突出之部分容易受到過度加熱,因此,玻璃板或玻璃帶容易碎裂。因此,圖10所示之距離W50較佳為0.3 mm以下。圖11所示之距離W51較佳為0.3 mm以下。圖12所示之距離W52較佳為0.3 mm以下。進而,玻璃板20之端面、玻璃板21之端面、及玻璃帶之端面較佳為同一面。 Further, for example, as shown in FIG. 10, the outer side surface 30c1 of the glass ribbon 30c is located larger outside than the outer side surfaces 20c3, 21c3 of the glass sheets 20, 21. In the case where the outer side surface 30c1 of the glass ribbon 30c is located larger inside than the outer side surfaces 20c3 and 21c3 of the glass sheets 20 and 21, as shown in FIG. 11, and in the first glass sheet 20 as shown in FIG. When the outer side surface 20c3 is located larger outside than the outer side surface 21c3 of the second glass sheet 21, only the protruding portion is easily overheated, so that the glass plate or the glass ribbon is easily broken. Therefore, the distance W50 shown in Fig. 10 is preferably 0.3 mm or less. The distance W51 shown in Fig. 11 is preferably 0.3 mm or less. The distance W52 shown in Fig. 12 is preferably 0.3 mm or less. Further, the end surface of the glass plate 20, the end surface of the glass plate 21, and the end surface of the glass ribbon are preferably the same surface.

再者,於圖10~圖12所示之參考例中,對具有與上述實施形態實質上相同之功能之構件以同樣之符號進行參照,省略說明。 In the reference examples shown in FIGS. 10 to 12, members having substantially the same functions as those of the above-described embodiments are denoted by the same reference numerals, and description thereof will be omitted.

以下,對本發明之較佳實施形態之其他例進行說明。於以下之說明中,對具有與上述第1實施形態實質上共通之功能之構件以共通之符號進行參照,省略說明。 Hereinafter, other examples of preferred embodiments of the present invention will be described. In the following description, members having functions substantially the same as those in the first embodiment are referred to by the same reference numerals, and description thereof will be omitted.

(第2實施形態) (Second embodiment)

圖13係第2實施形態中之發光裝置2之示意性平面圖。於上述第1實施形態中,如圖2所示,對於側壁部14d之一側端部14d2與側壁部14c之間形成貫通孔10b及密封構件15之例進行了說明。相對於此,本實施形態係如圖13所示,於主壁部12之內面設置有貫通孔10b。而且,貫通孔10b係藉由熔合於主壁部12之密封構件15而密封。 Fig. 13 is a schematic plan view of a light-emitting device 2 in a second embodiment. In the first embodiment, as shown in FIG. 2, an example in which the through hole 10b and the sealing member 15 are formed between the one end portion 14d2 and the side wall portion 14c of the side wall portion 14d has been described. On the other hand, in the present embodiment, as shown in FIG. 13, the through hole 10b is provided on the inner surface of the main wall portion 12. Further, the through hole 10b is sealed by the sealing member 15 fused to the main wall portion 12.

側壁部14d之一端部14d2與側壁部14c係藉由連接部16d而連接。於包含此種構成之發光裝置中,亦可發揮與上述 第1實施形態同樣之效果。 One end portion 14d2 of the side wall portion 14d and the side wall portion 14c are connected by a connecting portion 16d. In the light-emitting device including the above configuration, the above The same effect as in the first embodiment.

於上述第1及第2實施形態中,對主壁部12、13分別為四邊形狀之情形進行了說明。本發明並不限定於此。於本發明中,主壁部12、13只要分別為多邊形狀即可,例如亦可為三角形狀、五邊形狀、六邊形狀、七邊形狀、八邊形狀等。 In the first and second embodiments described above, the case where the main wall portions 12 and 13 have a quadrangular shape has been described. The present invention is not limited to this. In the present invention, the main wall portions 12 and 13 may have a polygonal shape, and may be, for example, a triangular shape, a pentagonal shape, a hexagonal shape, a seven-sided shape, or an octagonal shape.

1、2‧‧‧發光裝置 1, 2‧‧‧ illuminating devices

10‧‧‧單元 10‧‧‧ unit

10a‧‧‧內部空間 10a‧‧‧Internal space

10b‧‧‧貫通孔 10b‧‧‧through hole

11‧‧‧發光構件 11‧‧‧Lighting components

12、13‧‧‧主壁部 12, 13‧‧‧ main wall

12a、12b、12c、12d‧‧‧主壁部之邊 12a, 12b, 12c, 12d‧‧‧ the side of the main wall

13a、13b、13c、13d‧‧‧主壁部之邊 13a, 13b, 13c, 13d‧‧‧ the side of the main wall

14、14a、14b、14c、14d‧‧‧側壁部 14, 14a, 14b, 14c, 14d‧‧‧ side wall

14a1、14b1、14c1、14d1‧‧‧熔合部 14a1, 14b1, 14c1, 14d1‧‧‧ fusion

14a2、14b2、14c2、14d2‧‧‧側壁部之端部 14a2, 14b2, 14c2, 14d2‧‧‧ end of the side wall

14a3、14b3、14c3、14d3‧‧‧側壁部之端部 14a3, 14b3, 14c3, 14d3‧‧‧ end of the side wall

15‧‧‧密封構件 15‧‧‧ Sealing members

16a、16b、16c‧‧‧連接部 16a, 16b, 16c‧‧‧ Connections

20、21‧‧‧玻璃板 20, 21‧‧‧ glass plates

20a、20b、20c、20d‧‧‧玻璃板之邊 20a, 20b, 20c, 20d‧‧‧ sides of the glass plate

21a、21b、21c、21d‧‧‧玻璃板之邊 21a, 21b, 21c, 21d‧‧‧ side of the glass plate

20a1、20b1、20c1、20d1‧‧‧玻璃板之端部 20a1, 20b1, 20c1, 20d1‧‧ ‧ end of glass plate

20a2、20b2、20c2、20d2‧‧‧玻璃板之端部 20a2, 20b2, 20c2, 20d2‧‧‧ end of glass plate

20a3、20b3、20c3、20d3‧‧‧玻璃板之外側側面 20a3, 20b3, 20c3, 20d3‧‧‧ outside side of the glass plate

21a1、21b1、21c1、21d1‧‧‧玻璃板之端部 21a1, 21b1, 21c1, 21d1‧‧ ‧ end of glass plate

21a2、21b2、21c2、21d2‧‧‧玻璃板之端部 21a2, 21b2, 21c2, 21d2‧‧ ‧ end of glass plate

21a3、21b3、21c3、21d3‧‧‧玻璃板之外側側面 21a3, 21b3, 21c3, 21d3‧‧‧ outside side of the glass plate

30a、30b、30c、30d‧‧‧玻璃帶 30a, 30b, 30c, 30d ‧ ‧ glass ribbon

30a1、30b1、30c1、30d1‧‧‧玻璃帶之外側側面 30a1, 30b1, 30c1, 30d1‧‧‧ outside side of the glass ribbon

30a2、30b2、30c2、30d2‧‧‧玻璃帶之端部 30a2, 30b2, 30c2, 30d2‧‧ ‧ end of glass ribbon

30a3、30b3、30c3、30d3‧‧‧玻璃帶之端部 30a3, 30b3, 30c3, 30d3‧‧ ‧ end of glass ribbon

40‧‧‧積層體 40‧‧‧Layered body

50‧‧‧雷射光 50‧‧‧Laser light

51‧‧‧雷射光照射裝置 51‧‧‧Laser light irradiation device

W1、W2、W3、W4‧‧‧間隔 W1, W2, W3, W4‧‧‧ interval

W10、W20、W30、W40‧‧‧間隔 W10, W20, W30, W40‧‧‧ interval

W50、W51、W52‧‧‧距離 W50, W51, W52‧‧‧ distance

圖1係第1實施形態之發光裝置之示意性立體圖。 Fig. 1 is a schematic perspective view of a light-emitting device of a first embodiment.

圖2係第1實施形態之發光裝置之示意性平面圖。 Fig. 2 is a schematic plan view of a light-emitting device of a first embodiment.

圖3係圖2之線III-III之示意性剖面圖。 Figure 3 is a schematic cross-sectional view taken along line III-III of Figure 2.

圖4係圖2之線IV-IV之示意性剖面圖。 Figure 4 is a schematic cross-sectional view taken along line IV-IV of Figure 2.

圖5係將發光裝置沿x方向彎曲時之圖4之V部分放大所得之示意性剖面圖。 Fig. 5 is a schematic cross-sectional view showing an enlarged portion V of Fig. 4 when the light-emitting device is bent in the x direction.

圖6係用以說明本發明之一實施形態之發光裝置之製造方法的示意性平面圖。 Fig. 6 is a schematic plan view for explaining a method of manufacturing a light-emitting device according to an embodiment of the present invention.

圖7係用以說明本發明之一實施形態之發光裝置之製造方法的示意性平面圖。 Fig. 7 is a schematic plan view for explaining a method of manufacturing a light-emitting device according to an embodiment of the present invention.

圖8係圖7之線VII-VII之示意性剖面圖。 Figure 8 is a schematic cross-sectional view taken along line VII-VII of Figure 7.

圖9係用以說明本發明之一實施形態之發光裝置之製造方法的示意性剖面圖。 Fig. 9 is a schematic cross-sectional view for explaining a method of manufacturing a light-emitting device according to an embodiment of the present invention.

圖10係用以說明第1參考例之示意性剖面圖。 Fig. 10 is a schematic cross-sectional view for explaining a first reference example.

圖11係用以說明第2參考例之示意性剖面圖。 Fig. 11 is a schematic cross-sectional view for explaining a second reference example.

圖12係用以說明第3參考例之示意性剖面圖。 Fig. 12 is a schematic cross-sectional view for explaining a third reference example.

圖13係第2實施形態之發光裝置之示意性平面圖。 Fig. 13 is a schematic plan view of a light-emitting device of a second embodiment.

1‧‧‧發光裝置 1‧‧‧Lighting device

10‧‧‧單元 10‧‧‧ unit

10a‧‧‧內部空間 10a‧‧‧Internal space

11‧‧‧發光構件 11‧‧‧Lighting components

12、13‧‧‧主壁部 12, 13‧‧‧ main wall

14a2‧‧‧側壁部之端部 14a2‧‧‧End of the side wall

14c‧‧‧側壁部 14c‧‧‧ Sidewall

14c1‧‧‧熔合部 14c1‧‧‧Fuse Department

16a‧‧‧連接部 16a‧‧‧Connecting Department

Claims (10)

一種發光裝置用單元,其包括:多邊形狀之第1主壁部及第2主壁部,其等隔開間隔地相互對向;及側壁部,其配置於上述第1主壁部與上述第2主壁部之間,且與上述第1主壁部及第2主壁部一起區劃形成將發光體封入之內部空間;上述側壁部包括:第1側壁部,其沿著上述第1主壁部及第2主壁部之一邊配置,且於寬度方向之一部分以自長度方向之一側端部到達另一側端部為止之方式與上述第1主壁部及第2主壁部分別熔合;第2側壁部,其以沿著上述第1主壁部及第2主壁部之與上述一邊鄰接之其他邊,且一端部臨近第1側壁部之方式配置,且於寬度方向之一部分以自長度方向之一側端部到達另一側端部為止之方式與上述第1主壁部及第2主壁部分別熔合;及連接部,其與上述第2側壁部之一端部及上述第1側壁部連接,並且與上述第1主壁部及第2主壁部分別熔合,且寬度方向尺寸小於上述第2側壁部。 A unit for a light-emitting device, comprising: a first main wall portion and a second main wall portion having a polygonal shape, which are opposed to each other at intervals; and a side wall portion disposed in the first main wall portion and the first portion Between the main wall portions, the first main wall portion and the second main wall portion are partitioned together to form an internal space in which the illuminator is sealed, and the side wall portion includes a first side wall portion along the first main wall. The first main wall portion and the second main wall portion are respectively fused to one of the second main wall portions and one of the width direction directions from the one end portion in the longitudinal direction to the other end portion. The second side wall portion is disposed along the other side of the first main wall portion and the second main wall portion adjacent to the one side, and the one end portion is adjacent to the first side wall portion, and is formed in one of the width directions One of the first main wall portion and the second main wall portion is fused to each other from the one end portion in the longitudinal direction to the other end portion; and the connecting portion and one end portion of the second side wall portion and the first portion a side wall portion is connected to each other, and is fused to each of the first main wall portion and the second main wall portion, and Direction is smaller than the size of the second side wall portion. 如請求項1之發光裝置用單元,其中上述第2側壁部之一端部與上述第1側壁部之間之間隔為0.1~1.0 mm。 The unit for a light-emitting device according to claim 1, wherein an interval between one end of the second side wall portion and the first side wall portion is 0.1 to 1.0 mm. 如請求項1或2之發光裝置用單元,其中上述側壁部係包含玻璃。 The unit for a light-emitting device according to claim 1 or 2, wherein the side wall portion comprises glass. 如請求項1或2之發光裝置用單元,其中上述連接部係連 接於上述第2側壁部之一端部之寬度方向上之外側部分及上述第1側壁部,且整體熔合於上述第1主壁部及第2主壁部之各者。 The unit for a light-emitting device according to claim 1 or 2, wherein the connecting portion is connected The outer side portion and the first side wall portion in the width direction of one end portion of the second side wall portion are integrally fused to each of the first main wall portion and the second main wall portion. 如請求項3之發光裝置用單元,其中上述連接部係連接於上述第2側壁部之一端部之寬度方向上之外側部分及上述第1側壁部,且整體熔合於上述第1主壁部及第2主壁部之各者。 The unit for a light-emitting device according to claim 3, wherein the connecting portion is connected to the outer side portion in the width direction of the end portion of the second side wall portion and the first side wall portion, and is integrally fused to the first main wall portion and Each of the second main wall portions. 一種發光裝置,其包括:如請求項1至5中任一項之發光裝置用單元、及封入於上述內部空間內之發光體。 A light-emitting device comprising: the light-emitting device unit according to any one of claims 1 to 5; and an illuminant enclosed in the internal space. 如請求項6之發光裝置,其中上述發光體係包含無機螢光體。 The light-emitting device of claim 6, wherein the luminescent system comprises an inorganic phosphor. 如請求項7之發光裝置,其中上述無機螢光體係包含量子點。 The light-emitting device of claim 7, wherein the inorganic fluorescent system comprises quantum dots. 一種發光裝置用單元之製造方法,其包括如下步驟:製作如下積層體,該積層體包括:第1玻璃板;第2玻璃板,其隔開間隔地與上述第1玻璃板對向;複數條玻璃帶,其等於上述第1玻璃板與第2玻璃板之間,沿著上述第1玻璃板及第2玻璃板之複數條邊之各邊配置;且上述複數條玻璃帶包括:第1玻璃帶,其沿著上述第1玻璃板及第2玻璃板之第1邊配置;及第2玻璃帶,其沿著上述第1玻璃板及第2玻璃板之與上述第1邊鄰接之第2邊配置;且上述第2玻璃帶之上述第1邊側之端部係插入於上述第2邊與上述第1玻璃帶之間;及 熔合步驟,其係沿著上述積層體之複數條邊之各邊,自該邊之一側端部至另一側端部為止掃描雷射光,藉此,使上述第1玻璃板及第2玻璃板之各者與上述複數條玻璃帶熔合;於上述熔合步驟中,自上述第2邊之相反側朝向上述第2邊側進行沿著上述第1邊之上述雷射光之掃描。 A method for manufacturing a unit for a light-emitting device, comprising the steps of: forming a laminated body comprising: a first glass sheet; and a second glass sheet facing the first glass sheet at intervals; a glass ribbon disposed between each of the first glass sheet and the second glass sheet and disposed along each of a plurality of sides of the first glass sheet and the second glass sheet; and the plurality of glass ribbons include: a first glass ribbon And disposed along the first side of the first glass plate and the second glass plate; and the second glass ribbon along the second side of the first glass plate and the second glass plate adjacent to the first side And the end portion of the first side of the second glass ribbon is inserted between the second side and the first glass ribbon; and a fusing step of scanning the laser light from one side of the side to the other end along the sides of the plurality of sides of the laminated body, thereby forming the first glass plate and the second glass plate Each of the plurality of glass ribbons is fused to the plurality of glass ribbons; and in the fused step, the scanning of the laser light along the first side is performed from the opposite side of the second side toward the second side. 如請求項9之發光裝置用單元之製造方法,其中上述第2玻璃帶之上述第1邊側之端部與上述第1玻璃帶之間隔為0.1 mm~1.0 mm。 The method of manufacturing a light-emitting device unit according to claim 9, wherein an interval between the end portion on the first side of the second glass ribbon and the first glass ribbon is 0.1 mm to 1.0 mm.
TW101131053A 2011-09-05 2012-08-27 Light emitting device cell, light emitting device, and light emitting device cell manufacturing method TW201312810A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011192356 2011-09-05
JP2011192357 2011-09-05

Publications (1)

Publication Number Publication Date
TW201312810A true TW201312810A (en) 2013-03-16

Family

ID=47831937

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101131053A TW201312810A (en) 2011-09-05 2012-08-27 Light emitting device cell, light emitting device, and light emitting device cell manufacturing method

Country Status (3)

Country Link
JP (1) JP6015446B2 (en)
TW (1) TW201312810A (en)
WO (1) WO2013035485A1 (en)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007324337A (en) * 2006-05-31 2007-12-13 Citizen Electronics Co Ltd Linear light emitter and its manufacturing method, and light emitting device using the same
JP5418762B2 (en) * 2008-04-25 2014-02-19 ソニー株式会社 Light emitting device and display device
JP2010225373A (en) * 2009-03-23 2010-10-07 Sony Corp Color conversion sheet, illumination device, and display device

Also Published As

Publication number Publication date
WO2013035485A1 (en) 2013-03-14
JPWO2013035485A1 (en) 2015-03-23
JP6015446B2 (en) 2016-10-26

Similar Documents

Publication Publication Date Title
TWI537514B (en) Luminescent device, cell for luminescent device and method for producing the luminescent device
JP5724684B2 (en) Cell for light emitting device and light emitting device
JP5226774B2 (en) Light emitting device
JP2005260229A (en) Led display device with overlay
JP6421952B2 (en) Light-emitting diode color conversion substrate and method for manufacturing the same
US10193033B2 (en) Light emitting device
KR20170007239A (en) Light emitting device and method for manufacturing same
WO2015190242A1 (en) Light-emitting device
JP2016001669A (en) Light source apparatus and projector
JP5724685B2 (en) Method for manufacturing cell for light emitting device and method for manufacturing light emitting device
JP6652025B2 (en) Light emitting device and method of manufacturing the same
JP6421951B2 (en) Method for manufacturing substrate for color conversion of light emitting diode
TW201312810A (en) Light emitting device cell, light emitting device, and light emitting device cell manufacturing method
TW201624775A (en) Color conversion substrate for LED and method of fabricating the same
JP2019114765A (en) Light emitting device and method of manufacturing the same
JP6427816B2 (en) Light-emitting diode color conversion substrate and method for manufacturing the same
US9291884B2 (en) Method of regulating light wavelength for projection device
CN101271884B (en) Luminous source encapsulation body
JP5701635B2 (en) Manufacturing method of light emitting diode
CN117117062A (en) Color conversion structure, micro LED structure and preparation method
KR20140044140A (en) Display device