TW201311365A - Surface coatings - Google Patents

Surface coatings Download PDF

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TW201311365A
TW201311365A TW101126343A TW101126343A TW201311365A TW 201311365 A TW201311365 A TW 201311365A TW 101126343 A TW101126343 A TW 101126343A TW 101126343 A TW101126343 A TW 101126343A TW 201311365 A TW201311365 A TW 201311365A
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cycle
pressure
compound
formula
chamber
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TW101126343A
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Blaquiere Paul De
Warren Lee
Delwyn Evans
Stephen Coulson
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P2I Ltd
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12Chemical modification
    • C08J7/16Chemical modification with polymerisable compounds
    • C08J7/18Chemical modification with polymerisable compounds using wave energy or particle radiation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00Processes for applying liquids or other fluent materials
    • B05D1/62Plasma-deposition of organic layers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/08Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain an anti-friction or anti-adhesive surface
    • B05D5/083Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain an anti-friction or anti-adhesive surface involving the use of fluoropolymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/46Polymerisation initiated by wave energy or particle radiation
    • C08F2/52Polymerisation initiated by wave energy or particle radiation by electric discharge, e.g. voltolisation
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D4/00Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
    • DTEXTILES; PAPER
    • D06TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
    • D06MTREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
    • D06M10/00Physical treatment of fibres, threads, yarns, fabrics, or fibrous goods made from such materials, e.g. ultrasonic, corona discharge, irradiation, electric currents, or magnetic fields; Physical treatment combined with treatment with chemical compounds or elements
    • D06M10/02Physical treatment of fibres, threads, yarns, fabrics, or fibrous goods made from such materials, e.g. ultrasonic, corona discharge, irradiation, electric currents, or magnetic fields; Physical treatment combined with treatment with chemical compounds or elements ultrasonic or sonic; Corona discharge
    • D06M10/025Corona discharge or low temperature plasma
    • DTEXTILES; PAPER
    • D06TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
    • D06MTREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
    • D06M14/00Graft polymerisation of monomers containing carbon-to-carbon unsaturated bonds on to fibres, threads, yarns, fabrics, or fibrous goods made from such materials
    • D06M14/18Graft polymerisation of monomers containing carbon-to-carbon unsaturated bonds on to fibres, threads, yarns, fabrics, or fibrous goods made from such materials using wave energy or particle radiation
    • DTEXTILES; PAPER
    • D06TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
    • D06MTREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
    • D06M2200/00Functionality of the treatment composition and/or properties imparted to the textile material
    • D06M2200/10Repellency against liquids
    • D06M2200/11Oleophobic properties
    • DTEXTILES; PAPER
    • D06TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
    • D06MTREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
    • D06M2200/00Functionality of the treatment composition and/or properties imparted to the textile material
    • D06M2200/10Repellency against liquids
    • D06M2200/12Hydrophobic properties

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Physics & Mathematics (AREA)
  • Textile Engineering (AREA)
  • Toxicology (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
  • Polymerisation Methods In General (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Paints Or Removers (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

A method of forming a liquid repellent coating on a surface of a substrate, where the surface is exposed to a monomer in a plasma deposition process under conditions that maintain the monomer in situ for a period of time to allow a polymeric layer to form on the surface, wherein the conditions comprise at least one cycle of varying pressure.

Description

表面塗層 Surface coating

本發明係關於一種表面塗層,特定而言係關於防油及防水表面的製造方法;及由此獲得之塗層物件。 The present invention relates to a surface coating, in particular to a method of making an oil and water repellent surface; and a coated article obtained thereby.

已知藉由諸多不同方法來塗佈防水及防油塗層。該等塗層通常包含氟碳鏈,其中防油性及防水性之程度係可適合可用空間之氟碳基團或部份之數量及長度的函數。 It is known to apply water and oil repellent coatings by a number of different methods. Such coatings typically comprise a fluorocarbon chain wherein the degree of oil repellency and water repellency is a function of the number and length of fluorocarbon groups or moieties that are suitable for the available space.

電漿沉積技術係已相當廣泛地用於使聚合物塗層沉積於一系列表面上。與習知濕式化學方法相比,此技術係被認為產生極少廢物之清潔乾燥的技術。使用此方法,自於低壓條件下經受離子化電場之小有機分子產生電漿。當此係在基板之存在下完成時,含於該電漿中之單體之離子、自由基及激發分子在氣相中聚合,且與該基板上之生長聚合物薄膜反應。習知聚合物合成法趨於製備含有與該單體種類極為類似之重複單元的結構,而使用電漿產生之聚合物網絡可係極其複雜。 Plasma deposition techniques have been used quite extensively to deposit polymer coatings on a range of surfaces. This technique is considered to produce a clean and dry technique with minimal waste compared to conventional wet chemical methods. Using this method, a small organic molecule that undergoes an ionizing electric field under low pressure conditions produces a plasma. When this is done in the presence of the substrate, the ions, free radicals and excitation molecules of the monomers contained in the plasma are polymerized in the gas phase and reacted with the growing polymer film on the substrate. Conventional polymer synthesis tends to produce structures containing repeating units that are very similar to the monomer species, while polymer networks produced using plasma can be extremely complex.

美國專利案6,551,950揭示電漿聚合作用於使用長鏈烴及氟碳化合物形成防油或防水表面之用途。 U.S. Patent No. 6,551,950 discloses the use of plasma polymerization for the formation of oil-repellent or water-repellent surfaces using long chain hydrocarbons and fluorocarbons.

申請者已發現藉由增加單體在處理室內之停留時間,可提高塗層品質及其沉積效率。 Applicants have discovered that coating quality and deposition efficiency can be improved by increasing the residence time of the monomer in the processing chamber.

停留時間係顆粒在特定系統中經歷的平均時間量。停留時間可由以下等式定義:τ=C/Q [1] 其中τ係停留時間,C係該處理室之容量,且Q係氣體於該室內之壓力下通過該系統之流速。 The residence time is the average amount of time that the particles experience in a particular system. The dwell time can be defined by the following equation: τ = C / Q [1] Where τ is the residence time, C is the capacity of the treatment chamber, and the Q system gas passes through the flow rate of the system under the pressure of the chamber.

自以上等式可見,就任何特定氣體流速而言,腔室尺寸增加導致停留時間延長。同樣地,氣體流速越慢,則停留時間越長。因此,慢流速及大腔室將產生長停留時間。 As can be seen from the above equation, the increase in chamber size results in an extended residence time for any particular gas flow rate. Similarly, the slower the gas flow rate, the longer the residence time. Therefore, slow flow rates and large chambers will result in long residence times.

分子在該處理室內停留得越久,則其將經歷沉積方法(如聚合作用)及附著至表面的可能性越大。 The longer the molecule stays in the chamber, the more likely it will be to undergo deposition methods (such as polymerization) and adhesion to the surface.

本發明之第一態樣提供一種於基板表面上形成液體拒斥塗層之方法,該方法包括在電漿沉積方法中於使單體在原位維持一段時間之條件下使該表面暴露於該單體以使聚合物層形成於該表面上,其中該等條件包括變化壓力之至少一個循環。 A first aspect of the present invention provides a method of forming a liquid repellent coating on a surface of a substrate, the method comprising: exposing the surface to the surface in a plasma deposition method while maintaining the monomer in situ for a period of time The monomer is such that a polymer layer is formed on the surface, wherein the conditions include at least one cycle of varying pressure.

使用可變壓力循環增加停留時間,在此期間單體分子係遍佈於處理室內。此係由於該循環使壓力維持在最佳範圍內。可希望該室維持在最佳壓力範圍內以使聚合作用最大化。 The variable pressure cycle is used to increase the residence time during which the monomeric molecules are distributed throughout the processing chamber. This is because the cycle maintains the pressure within the optimum range. It may be desirable to maintain the chamber within an optimum pressure range to maximize polymerization.

與在靜態壓力下塗佈相比,使用可變壓力循環提高塗層均勻性、減少處理時間、且使用較少單體製備特定厚度之塗層。 Variable pressure cycling is used to increase coating uniformity, reduce processing time, and use less monomer to prepare a coating of a particular thickness compared to coating under static pressure.

該處理室可具有諸如排氣門之閥門,其在引入單體期間係關閉態。該排氣門可調節為開啟、關閉或部份開啟。 The processing chamber may have a valve such as an exhaust valve that is in a closed state during the introduction of the monomer. The exhaust valve can be adjusted to open, close or partially open.

該至少一個循環可包括將單體連續引入該處理室中(例如藉由注射)及允許壓力上升。可在各循環結束時自該處 理室排出廢氣。 The at least one cycle can include continuously introducing monomer into the processing chamber (e.g., by injection) and allowing pressure to rise. Can be from there at the end of each cycle The chamber exhausts the exhaust gas.

可在各循環開始時將該處理室至少部份抽真空,此可使其達到最適合形成聚合物塗層之低壓。 At least a portion of the processing chamber may be evacuated at the beginning of each cycle to achieve a low pressure that is most suitable for forming a polymeric coating.

當在各循環結束時排出氣體時,可排出諸如水蒸氣之廢氣而不影響於該循環開始時實現之低壓。 When the gas is exhausted at the end of each cycle, the exhaust gas such as water vapor can be discharged without affecting the low pressure achieved at the beginning of the cycle.

雖然在該方法期間使該室之排氣門保持關閉確保可容易實現最佳壓力,但單體輸入與自處理產物脫氣的組合導致該室內之壓力逐步增加,直至其超過最佳水準。相反地,若該閘門在該方法期間保持開啟,則可有效移除脫氣產物;此允許將壓力降低至最佳水準。然而,顯著量的輸入單體將僅流動通過該室而不經歷聚合作用。使用可變壓力循環允許非所欲之脫氣產物自該室排出,但在排氣之後,關閉該閘門以使該室恢復至最佳壓力範圍之下限。於該循環中之特定時間點關閉閘門對使單體保持在原位(增加其停留時間)以使得可發生聚合作用而言係重要。 While keeping the exhaust valve of the chamber closed during the process ensures that optimal pressure can be easily achieved, the combination of monomer input and degassing from the treated product causes the pressure in the chamber to gradually increase until it exceeds an optimum level. Conversely, if the gate remains open during the process, the degassed product can be effectively removed; this allows the pressure to be reduced to an optimum level. However, a significant amount of input monomer will only flow through the chamber without undergoing polymerization. The use of a variable pressure cycle allows undesired outgassing products to exit the chamber, but after venting, the gate is closed to return the chamber to the lower end of the optimal pressure range. It is important to close the gate at a particular point in the cycle to keep the monomer in place (increasing its residence time) so that polymerization can occur.

該至少一個變化壓力循環可包括基於時間之循環。例如,在於各循環中經歷預定時間之後,可將該處理室至少部份抽真空。時間循環係特別有利,因為其允許單體保持在原位以增加停留時間,此有助於改善該塗佈方法。 The at least one varying pressure cycle can include a time based cycle. For example, the chamber may be at least partially evacuated after a predetermined period of time in each cycle. The time cycle is particularly advantageous because it allows the monomer to remain in place to increase residence time, which helps to improve the coating process.

該變化壓力之至少一個循環可包括基於壓力之循環。例如,若該壓力超出最佳範圍時,則可將該處理室至少部份抽真空。該處理室可包括壓力感應器以測定該室內之壓力。可使用來自該壓力感應器之反饋調節該處理室之排氣門。例如,若該壓力降至最佳範圍以下時,則可關閉該排 氣門,且若該壓力上升至最佳範圍以上時,則可開啟該排氣門。 At least one cycle of the varying pressure can include a pressure based cycle. For example, if the pressure is outside the optimum range, the processing chamber can be at least partially evacuated. The processing chamber can include a pressure sensor to determine the pressure within the chamber. The exhaust valve from the process chamber can be adjusted using feedback from the pressure sensor. For example, if the pressure falls below the optimal range, the row can be closed. The valve, and if the pressure rises above the optimal range, the exhaust valve can be opened.

基於壓力之系統係適用於低除氣產品(如助聽器及移動電話),因為其產生在所需壓力範圍內之長時間循環。對於高除氣產品(如鞋)而言,基於壓力之循環可係過短。然而,可設計基於時間之循環,以允許該循環具有良好長度、提供單體良好的停留時間且同時仍保持接近最佳壓力。 Pressure-based systems are suitable for low outgassing products such as hearing aids and mobile phones because they produce long periods of circulation within the required pressure range. For high degassing products such as shoes, the pressure based cycle can be too short. However, a time-based cycle can be designed to allow the cycle to have a good length, provide a good residence time for the monomer while still maintaining near optimum pressure.

可將該可變壓力維持在最大壓力以下。例如,該最大壓力可等於或低於150 mTorr。適宜地,該最大壓力可等於或低於125 mTorr。 The variable pressure can be maintained below the maximum pressure. For example, the maximum pressure can be equal to or lower than 150 mTorr. Suitably, the maximum pressure can be equal to or lower than 125 mTorr.

各循環可係在45至75秒之間。各循環可係約60秒。 Each cycle can be between 45 and 75 seconds. Each cycle can be about 60 seconds.

該方法可包括使表面暴露於兩個或更多個變化壓力之循環,且特定而言為至多四個循環。該兩個或更多個循環可包括5至12個循環。或者,該兩個或更多個循環可包括8或9個循環。 The method can include exposing the surface to a cycle of two or more varying pressures, and in particular up to four cycles. The two or more cycles can include from 5 to 12 cycles. Alternatively, the two or more cycles may include 8 or 9 cycles.

在一實施例中,該沉積方法係氣體方法。該沉積方法可係電漿方法,例如電漿聚合方法。 In one embodiment, the deposition method is a gas method. The deposition method can be a plasma process, such as a plasma polymerization process.

當該沉積方法為電漿聚合方法時,可使用脈衝式電漿塗佈該塗層。 When the deposition method is a plasma polymerization method, the coating can be applied using pulsed plasma.

該液體拒斥塗層可包括防油或防水塗層。 The liquid repellent coating can include an oil or water repellent coating.

該聚合物層可係均勻。然而,形成非均勻聚合物層(例如當該塗層係用於生物陣列時)亦可係有利。 The polymer layer can be homogeneous. However, it may also be advantageous to form a non-uniform polymer layer, such as when the coating is used in a bioarray.

該液體拒斥塗層係適用於一系列基板(例如織物、金 屬、玻璃、陶瓷、紙或聚合物基板)之表面。諸如服裝(包括鞋類)、實驗室消耗品(包括移液管尖嘴)、濾膜、電子裝置(包括移動電話、音訊設備、膝上型電腦及助聽器)、微流體裝置及光伏打模組(如太陽能面板)之物品均可適宜地使用本發明方法來處理。 The liquid repellent coating is suitable for a range of substrates (eg fabric, gold) The surface of a genus, glass, ceramic, paper or polymer substrate. Such as clothing (including footwear), laboratory consumables (including pipette tips), filters, electronic devices (including mobile phones, audio devices, laptops and hearing aids), microfluidic devices and photovoltaic modules Articles such as solar panels can be suitably treated using the method of the invention.

通常藉由使塗層形成前驅物在低壓條件下經受離子化電場來產生電漿聚合物。當藉由電場對該前驅物之作用所產生的激發物種(自由基、離子、激發分子等)在氣相中聚合且與用於形成生長聚合物薄膜之基板表面反應時,發生沉積。 The plasma polymer is typically produced by subjecting the coating forming precursor to an ionizing electric field under low pressure conditions. Deposition occurs when excited species (free radicals, ions, excited molecules, etc.) generated by the action of the precursor by the electric field are polymerized in the gas phase and reacted with the surface of the substrate used to form the grown polymer film.

適用於本文所述之方法的電漿包括非平衡電漿,如彼等由射頻(RF)、微波或直流電流(DC)產生之電漿。如此項技術中已知,其等可在大氣壓或低於大氣壓下操作。然而,特定言之,其等係由射頻(RF)產生。 Plasmas suitable for use in the methods described herein include unbalanced plasmas such as those produced by radio frequency (RF), microwave or direct current (DC). As is known in the art, they can be operated at or below atmospheric pressure. However, in particular, they are generated by radio frequency (RF).

可使用各種形式之設備來產生氣態電漿。此等通常包括其中可產生電漿之容器或電漿室。該設備之特定實例係描述於(例如)WO2005/089961及WO02/28548中,但亦可使用諸多其他習知之電漿產生裝置。 Various forms of equipment can be used to produce gaseous plasma. These typically include a vessel or plasma chamber in which plasma can be produced. Specific examples of such devices are described in, for example, WO 2005/089961 and WO 02/28548, but many other conventional plasma generating devices can also be used.

通常,將待處理之物品與待沉積之氣態材料共同置於電漿室中,在該室內引發輝光放電且施加適宜的電壓(其可係脈衝式)。 Typically, the item to be treated is placed in a plasma chamber together with the gaseous material to be deposited, causing a glow discharge in the chamber and applying a suitable voltage (which may be pulsed).

該電漿內所用之氣體可僅包含單體化合物蒸氣,但其可與載體氣體(特定而言為諸如氦氣或氬氣之惰性氣體)組合。特定而言,氦氣係較佳載體氣體,因為其可使該單體 之裂解最小化。 The gas used in the plasma may contain only monomeric compound vapor, but it may be combined with a carrier gas, specifically an inert gas such as helium or argon. In particular, helium is a preferred carrier gas because it allows the monomer to The cracking is minimized.

當用作混合物時,根據此項技術中習知之步驟適宜地測定該單體蒸氣對載體氣體之相對含量。單體之添加量將在一定程度上取決於所使用之特定單體之性質、所處理之基板之性質、及電漿室之尺寸等。通常,就習知室而言,以50至600 mg/min之含量(例如100至150 mg/min之速率)遞送單體。以恆定速率(例如5至90 sccm(例如15至30 sccm)之速率)適宜地遞送載體氣體(如氦氣)。在某些情況下,單體對載體氣體之比例將係100:1至1:100,例如10:1至1:100,且特定而言為約1:1至1:10。所選定的精確比例將確保實現該方法所需之流速。 When used as a mixture, the relative amount of the monomer vapor to the carrier gas is suitably determined according to the procedures conventional in the art. The amount of monomer added will depend to some extent on the nature of the particular monomer used, the nature of the substrate being processed, and the size of the plasma chamber. Typically, the monomer is delivered at a level of from 50 to 600 mg/min (e.g., a rate of from 100 to 150 mg/min) in the case of a conventional chamber. The carrier gas (e.g., helium) is suitably delivered at a constant rate (e.g., at a rate of 5 to 90 sccm (e.g., 15 to 30 sccm). In some cases, the ratio of monomer to carrier gas will range from 100:1 to 1:100, such as from 10:1 to 1:100, and specifically from about 1:1 to 1:10. The precise ratio chosen will ensure the flow rate required to achieve the method.

在某些情況下,可在該室內施加初期連續功率電漿達(例如)0.5至10分鐘,例如約4分鐘。此可用作表面預處理步驟,以確保單體本身容易附著至該表面上,以使得當聚合作用發生時,塗層於該表面上「生長」。可在將單體引入該室之前,僅於惰性氣體之存在下實施該預處理步驟。 In some cases, an initial continuous power plasma can be applied to the chamber for, for example, 0.5 to 10 minutes, such as about 4 minutes. This can be used as a surface pretreatment step to ensure that the monomer itself readily adheres to the surface such that when polymerization occurs, the coating "grows" on the surface. This pretreatment step can be carried out only in the presence of an inert gas prior to introduction of the monomer into the chamber.

然後,至少在該單體存在時,將該電漿適宜地轉換成脈衝式電漿,以允許聚合作用進行。 The plasma is then suitably converted to a pulsed plasma, at least in the presence of the monomer, to allow polymerization to proceed.

在所有情況下,適宜地藉由施加高頻電壓(例如13.56 MHz)引發輝光放電。適宜地使用電極來施加此電壓,該等電極可位於該室之內部或外部,但在較大室之情況下係位於內部。 In all cases, glow discharge is suitably initiated by the application of a high frequency voltage (e.g., 13.56 MHz). Electrodes are suitably used to apply this voltage, which may be located inside or outside the chamber, but in the case of larger chambers.

適宜地,以至少1標準立方釐米/分鐘(sccm)且較佳1至100 sccm之速率供應該氣體、蒸氣或氣體混合物。 Suitably, the gas, vapor or gas mixture is supplied at a rate of at least 1 standard cubic centimeters per minute (sccm) and preferably from 1 to 100 sccm.

就單體蒸氣而言,此係根據該單體之性質適宜地以80至300 mg/min(例如約120 mg/min)之速率來供應,且同時施加脈衝式電壓。 In the case of monomer vapors, this is suitably supplied at a rate of from 80 to 300 mg/min (e.g., about 120 mg/min) depending on the nature of the monomer, and a pulsed voltage is applied simultaneously.

可將氣體或蒸氣抽吸或泵送至電漿區內。特定而言,當使用電漿室時,由於使用抽氣泵所引起的室內壓力降低,可將氣體或蒸氣抽吸至該室內,或如液體操作中所常見,可將其等泵入或注入該室內。 Gas or vapor can be pumped or pumped into the plasma zone. In particular, when a plasma chamber is used, gas or vapor can be drawn into the chamber due to a decrease in chamber pressure caused by the use of an air pump, or can be pumped or injected into the chamber as is common in liquid operation. indoor.

使用式(I)化合物之蒸氣(其係維持於40至150 mTorr,適宜為約80至120 mTorr之壓力範圍內)適宜地實現聚合作用。 The polymerization is suitably effected using a vapor of the compound of formula (I) which is maintained at a pressure in the range of from 40 to 150 mTorr, suitably from about 80 to 120 mTorr.

所施加之電場適宜地具有0.2 w至20 w,更適宜為約2 w之功率(以脈衝場形式施加)。此等功率係適用於體積為50 cm3之腔室。就較大或較小腔室而言,可使用提供相同功率密度之適宜功率。就沉積聚合物層而言,以產生極低平均功率之順序,適宜地以最高達10%之負載循環(即開:關比最高達10%)施加該等脈衝。更適宜地,該負載循環為0.1%至1%。該等開啟脈衝可係較長或較短。 The applied electric field suitably has a power of 0.2 w to 20 w, more preferably about 2 w (applied in the form of a pulsed field). These power systems are suitable for chambers with a volume of 50 cm 3 . For larger or smaller chambers, suitable power can be used that provides the same power density. In the case of depositing polymer layers, such pulses are suitably applied in a sequence that produces very low average power, suitably at up to 10% duty cycle (i.e., on: off ratio up to 10%). More suitably, the duty cycle is from 0.1% to 1%. These turn-on pulses can be longer or shorter.

根據式(I)化合物及處理物品的性質等,適宜地施加30秒至90分鐘,較佳5至60分鐘之電場。 An electric field of from 30 seconds to 90 minutes, preferably from 5 to 60 minutes, is suitably applied according to the nature of the compound of the formula (I) and the treated article.

所使用之電漿室適宜地具有足以容納多個物品之體積。 The plasma chamber used suitably has a volume sufficient to accommodate a plurality of articles.

用於製備本發明物品之特別適宜之裝置及方法係描述於WO2005/089961中,該案之內容係以引用的方式併入本文中。 Particularly suitable apparatus and methods for preparing the articles of the present invention are described in WO2005/089961, the disclosure of which is incorporated herein by reference.

特定而言,當使用此類型之高體積腔室時,使用呈脈衝 場形式之電壓,以0.001至500 w/m3(例如0.001至100 w/m3,且適用於功能層為0.005至0.5 w/m3)之平均功率產生電漿。 In particular, when using a high volume chamber of this type, a voltage in the form of a pulsed field is used, in the range of 0.001 to 500 w/m 3 (eg 0.001 to 100 w/m 3 and suitable for a functional layer of 0.005 to 0.5) The average power of w/m 3 ) produces plasma.

此等條件係特別適用於在大腔室內沉積品質良好的均勻塗層,例如在其中電漿區之體積大於500 cm3(例如0.5 m3或更大,如0.5 m3至10 m3且適宜為約1 m3)之腔室內。以此方式形成之層具有良好的機械強度。 These conditions are particularly suitable for depositing a uniform coating of good quality in a large chamber, for example where the volume of the plasma zone is greater than 500 cm 3 (eg 0.5 m 3 or greater, such as 0.5 m 3 to 10 m 3 and suitable) It is about 1 m 3 ) in the chamber. The layer formed in this way has good mechanical strength.

將選擇該室之尺寸以容納經處理之特定物品。例如,立方體腔室通常可適用於一系列應用,但若需要,則可建立細長或矩形腔室,或其等係實際上圓柱形或具有其他任何適宜形狀。 The chamber will be sized to accommodate the particular item being processed. For example, a cubic chamber can generally be adapted for a range of applications, but if desired, an elongated or rectangular chamber can be created, or the like can be substantially cylindrical or have any other suitable shape.

該室可係可密封容器以允許進行分批方法,或其可包括用於該等物品(例如紗)之入口及出口,以允許其用於連續方法。特定而言,在後者之情況下,如(例如)具有「嘯聲洩露」之裝置中所習知,使用高體積泵控制用於在該室內產生電漿放電所需之壓力條件。然而,亦可在大氣壓或接近大氣壓下處理某些物品,以取消對「嘯聲洩露」之需求。 The chamber may be a sealable container to allow for a batch process, or it may include an inlet and an outlet for such items (e.g., yarn) to allow it to be used in a continuous process. In particular, in the latter case, as is known, for example, in devices having "whistling leaks", high volume pumps are used to control the pressure conditions required to generate a plasma discharge in the chamber. However, certain items may also be disposed of at or near atmospheric pressure to eliminate the need for "whistling leaks."

該單體可包含式(I)化合物: 其中R1、R2及R3係獨立地選自氫、烷基、鹵代烷基或視需要經鹵基取代之芳基;且R4係基團X-R5,其中R5係烷基或 鹵代烷基,且X係鍵、式-C(O)O(CH2)nY-基團(其中n係1至10之整數,且Y係鍵或磺醯胺基)、或基團-(O)pR6(O)q(CH2)t-(其中R6係視需要經鹵基取代之芳基,p係0或1,q係0或1且t係0或1至10之整數,限制條件為當q係1時,t不為0)。 The monomer may comprise a compound of formula (I): Wherein R 1 , R 2 and R 3 are independently selected from hydrogen, alkyl, haloalkyl or, optionally, halo-substituted aryl; and R 4 is a group XR 5 wherein R 5 is alkyl or haloalkyl And an X-bond, a -C(O)O(CH 2 ) n Y- group (wherein n is an integer from 1 to 10, and a Y-bond or a sulfonylamino group), or a group -(O) p R 6 (O) q (CH 2 ) t - (wherein R 6 is an aryl group which is optionally substituted with a halogen group, p is 0 or 1, q is 0 or 1 and t is 0 or an integer of 1 to 10, The constraint is that when q is 1, t is not 0).

所使用之單體係選自上述式(I)單體。適用於R1、R2、R3、R4及R5之鹵代烷基係氟烷基。該等烷基鏈可係直鏈或分支鏈且可包含環狀基團。 The single system used is selected from the monomers of formula (I) above. Suitable are haloalkyl fluoroalkyl groups for R 1 , R 2 , R 3 , R 4 and R 5 . The alkyl chains may be straight or branched and may comprise cyclic groups.

就R5而言,該等烷基鏈適宜地包含2個或更多個碳原子,適宜為2至20個碳原子且較佳為6至12個碳原子。 With respect to R 5 , the alkyl chains suitably comprise 2 or more carbon atoms, suitably 2 to 20 carbon atoms and preferably 6 to 12 carbon atoms.

就R1、R2及R3而言,烷基鏈通常以具有1至6個碳原子較佳。 In the case of R 1 , R 2 and R 3 , the alkyl chain is usually preferably 1 to 6 carbon atoms.

R5較佳係鹵代烷基,且更佳為全鹵代烷基,特定而言為式CmF2m+1全氟烷基,其中m係1或更大,適宜為1至20,且較佳為4至12(如4、6或8)之整數。 R 5 is preferably a haloalkyl group, and more preferably a perhaloalkyl group, specifically a formula C m F 2m+1 perfluoroalkyl group, wherein m is 1 or more, suitably 1 to 20, and preferably An integer from 4 to 12 (eg 4, 6 or 8).

適用於R1、R2及R3之烷基具有1至6個碳原子。 Suitable alkyl groups for R 1 , R 2 and R 3 have from 1 to 6 carbon atoms.

在一實施例中,R1、R2及R3中之至少一者係氫。在一特定實施例中,R1、R2及R3均係氫。然而,在另一實施例中,R3係烷基,如甲基或丙基。 In one embodiment, at least one of R 1 , R 2 and R 3 is hydrogen. In a particular embodiment, R 1 , R 2 and R 3 are both hydrogen. However, in another embodiment, R 3 is an alkyl group such as methyl or propyl.

當X係基團-C(O)O(CH2)nY-時,n係提供適宜間隔基之整數。特定而言,n係1至5,較佳為約2。 When the X group is -C(O)O(CH 2 ) n Y-, n is an integer providing a suitable spacer. In particular, n is from 1 to 5, preferably about 2.

就Y而言,適宜之磺醯胺基包括彼等式-N(R7)SO2 -之基團,其中R7係氫或烷基,如C1-4烷基,特定而言為甲基或乙基。 In the case of Y, a suitable sulfonamide group includes a group of the formula -N(R 7 )SO 2 - wherein R 7 is hydrogen or an alkyl group, such as a C 1-4 alkyl group, specifically a Base or ethyl.

在一實施例中,該式(I)化合物係以下式(II)化合物: CH2=CH-R5 (II)其中R5係如上在式(I)中所定義。 In one embodiment, the compound of formula (I) is a compound of formula (II): CH 2 =CH-R 5 (II) wherein R 5 is as defined above in formula (I).

在式(II)化合物中,式(I)中之X係鍵。 In the compound of formula (II), the X bond in formula (I).

然而,在一較佳實施例中,式(I)化合物係式(III)丙烯酸酯:CH2=CR7C(O)O(CH2)nR5 (III)其中n及R5係如上在式(I)中所定義,且R7係氫、C1-10烷基或C1-10鹵代烷基。特定言之,R7係氫或C1-6烷基(如甲基)。式(III)化合物之一特定實例係式(IV)化合物: 其中R7係如上所定義,且特定而言為氫,且x係1至9(例如4至9且較佳為7)之整數。在該情況下,該式(IV)化合物係1H,1H,2H,2H-丙烯酸十七氟癸酯。 However, in a preferred embodiment, the compound of formula (I) is an acrylate of formula (III): CH 2 =CR 7 C(O)O(CH 2 ) n R 5 (III) wherein n and R 5 are as defined above Defined in formula (I), and R 7 is hydrogen, C 1-10 alkyl or C 1-10 haloalkyl. In particular, R 7 is hydrogen or C 1-6 alkyl (such as methyl). A specific example of a compound of formula (III) is a compound of formula (IV): Wherein R 7 is as defined above, and is specifically hydrogen, and x is an integer from 1 to 9 (eg, 4 to 9 and preferably 7). In this case, the compound of the formula (IV) is 1H, 1H, 2H, 2H-heptadecafluorodecyl acrylate.

在一實施例中,該式(IV)化合物係式(V)化合物: 其中R8係氫或甲基、乙基或丙基;且n=1至5。 In one embodiment, the compound of formula (IV) is a compound of formula (V): Wherein R 8 is hydrogen or methyl, ethyl or propyl; and n = 1 to 5.

本發明之第二態樣係提供一種疏水性及/或疏油性基板,其包含已藉由該方法塗覆之聚合物塗層。 A second aspect of the invention provides a hydrophobic and/or oleophobic substrate comprising a polymeric coating that has been coated by the method.

該基板可包括(例如)織物或包含該織物之服裝(包括鞋類)物品。此外,該基板可包括電子裝置、微流體裝置、 實驗室消耗品或光伏打模組。 The substrate can include, for example, a fabric or an article of clothing (including footwear) containing the fabric. In addition, the substrate may include an electronic device, a microfluidic device, Laboratory consumables or photovoltaic modules.

本發明之第二態樣之較佳特徵可如上針對第一態樣所述。 Preferred features of the second aspect of the invention may be as described above for the first aspect.

在本說明書之描述及申請專利範圍中,字詞「包含」及「含有」及該等字詞之變型意指「包括但不限於」,且不排除其他基團、添加劑、組分、整數或步驟。 The words "including" and "comprising" and variations of the words "including, but not limited to," in the context of the description and the scope of the claims are intended to be inclusive, and do not exclude other groups, additives, components, integers or step.

在本說明書之描述及申請專利範圍中,除非文中另有要求,否則單數包括複數。特定而言,除非文中另有要求,否則當使用非限定性冠詞時,本說明書應被理解為涵蓋複數性及單數性。 In the description of the specification and the claims, the singular includes the plural. In particular, the description should be understood to cover the plural and singular, when the non-limiting articles are used.

本發明之其他特徵將自以下實例變得明顯。通常而言,本發明延伸至本發明說明書(包括任何隨附申請專利範圍及附圖)中所揭示之特徵的任何新穎者或任何新穎組合。因此,除非無法與其相容,否則連同本發明之特定態樣、實施例或實例描述的特徵、整數、特性、化合物、化學部份或基團應被理解為可適用於本文所述之任何其他態樣、實施例或實例。 Other features of the invention will become apparent from the following examples. In general, the invention extends to any novel or any novel combination of features disclosed in the description of the invention, including any accompanying claims and drawings. Therefore, features, integers, characteristics, compounds, chemical moieties or groups described in connection with a particular aspect, embodiment or example of the invention are to be construed as being applicable to any other Aspect, embodiment or example.

此外,除非另有規定,否則本文所揭示之任何特徵可由用於相同或類似目的之另一特徵代替。 In addition, any feature disclosed herein may be replaced by another feature for the same or similar purpose, unless otherwise specified.

現將參考附圖,以實例方式特定地描述本發明。 The invention will now be described, by way of example, with reference to the accompanying drawings.

用於形成聚合物塗層之裝置係以簡化形式顯示於圖1中。處理室10具有含於其內之處理區12及出入門14。未顯示用於在該處理室內產生電漿之設備。 The apparatus for forming a polymer coating is shown in simplified form in Figure 1. The processing chamber 10 has a processing zone 12 and an access opening 14 contained therein. Equipment for producing plasma in the processing chamber is not shown.

提供流體入口16,以允許將單體引入該室內。亦可經由此流體入口引入其他流體,例如載體氣體或預處理氣體。 A fluid inlet 16 is provided to allow introduction of monomer into the chamber. Other fluids, such as carrier gases or pretreatment gases, may also be introduced via this fluid inlet.

該處理室10係經由閘閥20連接至真空泵18。該閘閥20可關閉或開啟(部份或完全)。當開啟時,該閘閥允許廢氣排出,且在與該真空泵組合使用時可降低該處理區內之壓力。 The processing chamber 10 is connected to the vacuum pump 18 via a gate valve 20. The gate valve 20 can be closed or opened (partial or complete). When open, the gate valve allows exhaust gas to be vented and, when used in combination with the vacuum pump, reduces the pressure within the processing zone.

該裝置亦具有控制該流體入口、閘閥及真空泵之控制器22。該控制器可係微處理器、PC或任何其他適宜裝置。 The device also has a controller 22 that controls the fluid inlet, gate valve, and vacuum pump. The controller can be a microprocessor, a PC or any other suitable device.

圖2顯示循環期間之事件順序。在第一步驟24中,開啟該閘閥,且該真空泵將該處理室部份抽真空。特定而言,使該處理室內之壓力降低至所需低壓。該低壓允許增加單體在該處理室內的停留時間,因為其/其等無法自該閥門逸散並隨排出氣體流向下游。在第二步驟26中,關閉(或至少部份關閉)該閘閥且打開該流體入口,此允許將單體引入該室內。該室內之壓力逐漸增加,且特定而言,此係引入該室內之單體蒸發的結果。在第三步驟28中,開啟該閘閥以使廢氣可排出。在各循環中之此等步驟期間,該控制器控制該真空泵、閘閥及流體入口之活動。重複該循環以維持該單體之所需停留時間。可藉由達到特定壓力所需之時間或藉由使單體轉化成聚合物所需之持續時間來選擇循環速率。所使用之典型循環數為四個。此外,使用該循環允許沉積速率在該室內移動,以使塗層更均勻。特定而言,使該沉積自該室邊緣移動至中心,以改良塗層。 Figure 2 shows the sequence of events during the loop. In a first step 24, the gate valve is opened and the vacuum pump partially evacuates the processing chamber. In particular, the pressure within the processing chamber is reduced to the desired low pressure. This low pressure allows for an increase in the residence time of the monomer within the process chamber because it cannot escape from the valve and flow downstream with the exhaust gas. In a second step 26, the gate valve is closed (or at least partially closed) and the fluid inlet is opened, which allows the introduction of monomer into the chamber. The pressure in the chamber is gradually increased, and in particular, this is the result of the evaporation of the monomer introduced into the chamber. In a third step 28, the gate valve is opened to allow exhaust gas to be exhausted. The controller controls the activity of the vacuum pump, gate valve, and fluid inlet during such steps in each cycle. This cycle is repeated to maintain the desired residence time of the monomer. The circulation rate can be selected by the time required to reach a particular pressure or by the duration required to convert the monomer to the polymer. The typical number of cycles used is four. In addition, the use of this cycle allows the deposition rate to move within the chamber to make the coating more uniform. In particular, the deposition is moved from the edge of the chamber to the center to improve the coating.

該等循環可係基於時間或基於壓力。就基於時間之循環 而言,該控制器另外包括時鐘或計數器,其係用於控制各循環之長度及各循環中之事件的定時。 These cycles may be based on time or based on pressure. Time-based cycle In other words, the controller additionally includes a clock or counter that is used to control the length of each cycle and the timing of events in each cycle.

若使用基於壓力之循環,則該處理區內具有一或多個壓力感應器,其中將壓力數據輸出至該控制器。在此情況下,當該處理區內之壓力達到預定值時,發生各步驟。 If a pressure based cycle is used, there is one or more pressure sensors in the processing zone, wherein pressure data is output to the controller. In this case, each step occurs when the pressure in the treatment zone reaches a predetermined value.

實例1Example 1

在第一實例中,使用以下式VI單體塗佈助聽器: In a first example, a hearing aid is coated with a monomer of the following formula VI:

在具有大於6×10-9 mol s-1之洩露速率及4 mg/min或3.2 mol s-1之單體流速的感應耦合輝光放電反應器中塗佈電漿聚合塗層。此係經由液氮冷卻收集器、熱電偶壓力計及含有單體之單體管連接至二級愛德華茲(Edwards)旋轉泵。使用13.56 MHz之射頻(RF)產生器以提供放電動力。 The plasma polymerized coating is applied in an inductively coupled glow discharge reactor having a leakage rate greater than 6 x 10 -9 mol s -1 and a monomer flow rate of 4 mg/min or 3.2 mol s -1 . This is connected to a secondary Edwards rotary pump via a liquid nitrogen cooled collector, a thermocouple pressure gauge, and a monomer tube containing the monomer. A 13.56 MHz radio frequency (RF) generator is used to provide discharge power.

將具有結構化ABS塑膠外表面之助聽器置於該室之中心,然後將該室抽真空至20 mTorr。 A hearing aid with a structured ABS plastic outer surface was placed in the center of the chamber and the chamber was then evacuated to 20 mTorr.

引發輝光放電且使該室接受150 W之連續波(CW)達30 s,在此期間將單體分兩次(間隔3秒)注射至該室內。 A glow discharge was initiated and the chamber was subjected to a 150 W continuous wave (CW) for 30 s, during which time the monomer was injected twice (3 seconds apart) into the chamber.

然後,在將單體注射至該室內的同時,以35微秒開啟及10毫秒關閉之負載循環(0.35%)施加450 W之脈衝波(PW);操作140次,各操作之間間隔3秒。 Then, while injecting the monomer into the chamber, a 450 W pulse wave (PW) was applied with a load cycle (0.35%) of 35 microseconds on and 10 milliseconds off; operation was performed 140 times, with an interval of 3 seconds between operations. .

在該PW階段期間,使該室內之壓力如下循環:一旦該室之壓力達到50 mTorr,則關閉該閘閥60秒。60秒過後, 以固定百分比(50%至100%)開啟該閘門。當壓力降至50 mTorr時,再次關閉該閘門60秒且重複該循環。重複此循環達該PW循環之持續時間(即約420秒)。 During this PW phase, the pressure in the chamber was cycled as follows: once the pressure in the chamber reached 50 mTorr, the gate valve was closed for 60 seconds. After 60 seconds, The gate is opened at a fixed percentage (50% to 100%). When the pressure drops to 50 mTorr, the gate is closed again for 60 seconds and the cycle is repeated. This cycle is repeated for the duration of the PW cycle (i.e., about 420 seconds).

在無壓力循環之情況下重複此方法。除使該閘閥在該連續波階段及PW階段之持續時間內保持開啟外,條件係與上文完全相同。 Repeat this method without a pressure cycle. The conditions are identical to the above except that the gate valve is kept open for the duration of the continuous wave phase and the PW phase.

然後,測定電漿沉積對處理基板之表面能的影響。將水施加至經處理之助聽器之表面上,且測量接觸角。於該塗層助聽器之表面上及於該塗層經歷1,000次磨蝕之後(使用如實例2之相同測試)實施該等測試。使用壓力循環及不使用壓力循環所塗佈之塗層的結果係列於下表中。 Then, the effect of plasma deposition on the surface energy of the treated substrate was measured. Water was applied to the surface of the treated hearing aid and the contact angle was measured. The tests were performed on the surface of the coated hearing aid and after the coating was subjected to 1,000 abrasions (using the same test as in Example 2). The results of the coatings applied using pressure cycling and without pressure cycling are summarized in the table below.

自表1中可見,使用壓力循環實現較大接觸角(最初及磨蝕之後均如此)。此顯示使用壓力循環比不使用壓力循環更快地實現塗層之所需性能水準。 It can be seen from Table 1 that a larger contact angle is achieved using a pressure cycle (both initially and after abrasion). This shows that using a pressure cycle achieves the desired level of performance of the coating faster than without using a pressure cycle.

實例2Example 2

在第二實例中,塗佈包含塑膠、玻璃及金屬之不同基板之移動電話。使用如實例1中所述之相同裝置及單體。 In a second example, a mobile phone comprising different substrates of plastic, glass and metal is applied. The same apparatus and monomers as described in Example 1 were used.

將該室抽真空至20 mTorr,然後引發輝光放電且使該室經歷150 W之連續波(CW)達30 s,在此期間將該單體分兩 次(間隔3秒)注射至該室內。 The chamber was evacuated to 20 mTorr, then a glow discharge was initiated and the chamber was subjected to a 150 W continuous wave (CW) for 30 s, during which time the monomer was split into two Injections (3 seconds apart) were injected into the chamber.

然後,在將單體注射至該室內的同時,以35微秒開啟及10毫秒關閉之負載循環(0.35%)施加300 W之脈衝波(PW);操作140次,各操作之間間隔3秒。 Then, while injecting the monomer into the chamber, a 300 W pulse wave (PW) was applied in a load cycle (0.35%) of 35 microseconds on and 10 milliseconds off; operation was performed 140 times, with an interval of 3 seconds between operations. .

在該PW階段期間,使該室內之壓力如下循環:一旦該室之壓力達到50 mTorr,則關閉該閘閥60秒。60秒過後,以固定百分比(50%至100%)開啟該閘門。當壓力降至50 mTorr時,再次關閉該閘門60秒且重複該循環。重複此循環達該PW循環之持續時間(即約420秒)。 During this PW phase, the pressure in the chamber was cycled as follows: once the pressure in the chamber reached 50 mTorr, the gate valve was closed for 60 seconds. After 60 seconds, the gate is opened at a fixed percentage (50% to 100%). When the pressure drops to 50 mTorr, the gate is closed again for 60 seconds and the cycle is repeated. This cycle is repeated for the duration of the PW cycle (i.e., about 420 seconds).

在無壓力循環之情況下重複此方法。 Repeat this method without a pressure cycle.

然後,測定電漿沉積對處理基板之表面能的影響。將水施加至經處理之助聽器之表面上,且測量接觸角。於該塗層助聽器之表面上及在使用具有標準Martindate磨損織物(500 g重量及1英寸磨損路徑)之泰伯爾(Taber)5750線性磨損試驗機使該塗層經歷1,000次磨蝕之後實施該等測試。使用壓力循環及不使用壓力循環所塗佈之塗層的結果係列於下表中。 Then, the effect of plasma deposition on the surface energy of the treated substrate was measured. Water was applied to the surface of the treated hearing aid and the contact angle was measured. These coatings were applied to the surface of the coated hearing aid and after a thousand abrasions of the coating using a Taber 5750 linear abrasion tester with standard Martinate abrasion fabric (500 g weight and 1 inch wear path). test. The results of the coatings applied using pressure cycling and without pressure cycling are summarized in the table below.

如先前實例,使用壓力循環塗佈之塗層產生較大接觸 角。該接觸角在磨蝕後變化極少。如上所述,據信此係由於該塗層形成得更快。 As in the previous examples, the use of a pressure cycle coated coating produced greater contact angle. This contact angle changes little after abrasion. As noted above, this is believed to be due to the faster formation of the coating.

實例3Example 3

在第三實例中,塗佈包含塑膠、玻璃及金屬之不同基板之移動電話。使用如實例1中所述之相同裝置及單體。 In a third example, a mobile phone comprising different substrates of plastic, glass and metal is applied. The same apparatus and monomers as described in Example 1 were used.

將該室抽真空至20 mTorr,然後引發輝光放電且使該室經歷150 W之連續波(CW)達30 s,在此期間將該單體一次性注射至該室內。 The chamber was evacuated to 20 mTorr, then a glow discharge was initiated and the chamber was subjected to a 150 W continuous wave (CW) for 30 s during which time the monomer was injected once into the chamber.

然後,在將單體注射至該室內的同時,以35微秒開啟及10毫秒關閉之負載循環(0.35%)施加450 W之脈衝波(PW);操作130次,各操作之間間隔3秒。 Then, while injecting the monomer into the chamber, a 450 W pulse wave (PW) was applied with a load cycle (0.35%) of 35 microseconds on and 10 milliseconds off; 130 operations were performed, with an interval of 3 seconds between operations. .

在該PW階段期間,藉由交替地開啟及關閉該閘閥60秒之時間,使該室內之壓力循環。 During the PW phase, the pressure in the chamber is circulated by alternately opening and closing the gate valve for a period of 60 seconds.

在無壓力循環之情況下重複此方法,在此期間,使該閘門於該CW及PW階段之持續時間內保持開啟。 This method is repeated without a pressure cycle during which the gate remains open for the duration of the CW and PW phases.

然後,使用如實例2中所述之相同方法測定該電漿沉積對處理基板之表面能的影響。 Then, the effect of the plasma deposition on the surface energy of the treated substrate was measured using the same method as described in Example 2.

表3顯示:與無循環之情況相比,當使用壓力循環時,該電話內部上之沉積大幅增加。 Table 3 shows that the deposition on the inside of the phone is greatly increased when pressure cycling is used compared to the case without circulation.

如該等實例所示,使用可變壓力循環加快實現所需性能 水準之方法,即其加快處理時間。 As shown in these examples, use variable pressure cycles to accelerate the desired performance The standard method is to speed up processing time.

如實例3中所示,不僅在產品之外部上,且亦在複雜產品之內部上觀察到改良。使用非循環方法獲得相同結果將需要更長的處理時間及更多的單體(然而可能仍達不到相同的性能水準)。 As shown in Example 3, improvements were observed not only on the exterior of the product, but also on the interior of the complex product. Using the acyclic method to achieve the same result will require longer processing times and more monomer (although it may still not reach the same level of performance).

藉由加快該處理時間,壓力循環亦具有使用較少單體之效應。其他優點包括改良之塗層均勻性。此外,所需的性能水準係於整個處理室中出現。 By speeding up the processing time, the pressure cycle also has the effect of using fewer monomers. Other advantages include improved coating uniformity. In addition, the required level of performance occurs throughout the processing chamber.

停留時間之增加具有其他優點,例如提高該等塗層進入(例如)電子裝置中之角落及縫隙內的滲透性。此外,停留時間之增加允許自於習知條件下不良好聚合之單體(例如短鏈單體,如1H,1H,2H,2H-丙烯酸十三氟辛酯)形成塗層。 The increase in residence time has other advantages, such as increasing the permeability of such coatings into, for example, corners and gaps in electronic devices. In addition, an increase in residence time allows the formation of a coating from monomers that are not well polymerized under conventional conditions, such as short chain monomers such as 1H, 1H, 2H, 2H-tridecafluorooctyl acrylate.

10‧‧‧處理室 10‧‧‧Processing room

12‧‧‧處理區 12‧‧‧Processing area

14‧‧‧出入門 14‧‧‧Getting started

16‧‧‧流體入口 16‧‧‧ fluid inlet

18‧‧‧真空泵 18‧‧‧ vacuum pump

20‧‧‧閘閥 20‧‧‧ gate valve

22‧‧‧控制器 22‧‧‧ Controller

24‧‧‧第一步驟 24‧‧‧First steps

26‧‧‧第二步驟 26‧‧‧ second step

28‧‧‧第三步驟 28‧‧‧ third step

圖1顯示用於實施本發明之裝置;及圖2係顯示各可變壓力循環中之事件的流程圖。 Figure 1 shows a device for practicing the invention; and Figure 2 is a flow chart showing events in various variable pressure cycles.

24‧‧‧第一步驟 24‧‧‧First steps

26‧‧‧第二步驟 26‧‧‧ second step

28‧‧‧第三步驟 28‧‧‧ third step

Claims (25)

一種於基板表面上形成液體拒斥塗層之方法,該方法包括在電漿沉積方法中於使單體在原位維持一段時間之條件下使該表面暴露於該單體以使聚合物層形成於該表面上,其中該等條件包括變化壓力之至少一個循環。 A method of forming a liquid repellent coating on a surface of a substrate, the method comprising: exposing the surface to the monomer to form a polymer layer in a plasma deposition process while maintaining the monomer in situ for a period of time On the surface, wherein the conditions comprise at least one cycle of varying pressure. 如請求項1之方法,其中使該基板於處理室中暴露於電漿,且在各循環開始時將該處理室至少部份抽真空。 The method of claim 1 wherein the substrate is exposed to the plasma in the processing chamber and the processing chamber is at least partially evacuated at the beginning of each cycle. 如請求項1或請求項2之方法,其中各循環包括將該單體連續引入處理室內及允許壓力上升。 The method of claim 1 or claim 2, wherein each cycle comprises continuously introducing the monomer into the processing chamber and allowing the pressure to rise. 如請求項2或請求項3之方法,其中於各循環結束時自該處理室排出廢氣。 The method of claim 2 or claim 3, wherein the exhaust gas is discharged from the processing chamber at the end of each cycle. 如先前請求項中任一項之方法,其中使用閥門控制該處理室內外之壓力,其中該閥門係用於增加該單體在該室內之停留時間以允許聚合物層形成。 The method of any of the preceding claims, wherein a valve is used to control the pressure inside and outside the process, wherein the valve is used to increase the residence time of the monomer in the chamber to allow formation of a polymer layer. 如先前請求項中任一項之方法,其中最大壓力係等於或低於150 mTorr,且更特定而言係等於或低於125 mTorr。 The method of any of the preceding claims, wherein the maximum pressure is equal to or lower than 150 mTorr, and more specifically equal to or lower than 125 mTorr. 如先前請求項中任一項之方法,其中該變化壓力之至少一個循環可包括基於時間之循環及/或基於壓力之循環。 The method of any of the preceding claims, wherein the at least one cycle of the varying pressures comprises a time based cycle and/or a pressure based cycle. 如先前請求項中任一項之方法,其中各循環係在45至75秒之間。 The method of any of the preceding claims, wherein each cycle is between 45 and 75 seconds. 如先前請求項中任一項之方法,其中使該表面暴露於變化壓力之至少一個循環包括使該表面暴露於變化壓力之兩個或更多個循環,且特定而言,該兩個或更多個循環包括5至12個循環,且更特定言之8或9個循環。 The method of any of the preceding claims, wherein exposing the surface to at least one cycle of varying pressure comprises exposing the surface to two or more cycles of varying pressure, and in particular, the two or more Multiple cycles include 5 to 12 cycles, and more specifically 8 or 9 cycles. 如先前請求項中任一項之方法,其中該單體係式(I)化合物: 其中R1、R2及R3係獨立地選自氫、烷基、鹵代烷基或視需要經鹵基取代之芳基;且R4係基團X-R5,其中R5係烷基或鹵代烷基,且X係鍵、式-C(O)O(CH2)nY-基團(其中n係1至10之整數,且Y係鍵或磺醯胺基)、或基團-(O)pR6(O)q(CH2)t-(其中R6係視需要經鹵基取代之芳基,p係0或1,q係0或1且t係0或1至10之整數,限制條件為當q係1時,t不為0)。 The method of any of the preceding claims, wherein the single system (I) compound: Wherein R 1 , R 2 and R 3 are independently selected from hydrogen, alkyl, haloalkyl or, optionally, halo-substituted aryl; and R 4 is a group XR 5 wherein R 5 is alkyl or haloalkyl And an X-bond, a -C(O)O(CH 2 ) n Y- group (wherein n is an integer from 1 to 10, and a Y-bond or a sulfonylamino group), or a group -(O) p R 6 (O) q (CH 2 ) t - (wherein R 6 is an aryl group which is optionally substituted with a halogen group, p is 0 or 1, q is 0 or 1 and t is 0 or an integer of 1 to 10, The constraint is that when q is 1, t is not 0). 如請求項10之方法,其中該式(I)化合物係式(II)化合物:CH2=CH-R5 (II)其中R5係如請求項10中所定義;或式(III)化合物:CH2=CR7C(O)O(CH2)nR5 (III)其中n及R5係如請求項10中所定義,且R7係氫、C1-10烷基或C1-10鹵代烷基。 The method of claim 10, wherein the compound of formula (I) is a compound of formula (II): CH 2 =CH-R 5 (II) wherein R 5 is as defined in claim 10; or a compound of formula (III): CH 2 =CR 7 C(O)O(CH 2 ) n R 5 (III) wherein n and R 5 are as defined in claim 10, and R 7 is hydrogen, C 1-10 alkyl or C 1- 10 haloalkyl. 如請求項11之方法,其中該式(I)化合物係式(III)化合物。 The method of claim 11, wherein the compound of formula (I) is a compound of formula (III). 如請求項12之方法,其中該式(III)化合物係式(IV)化合物: 其中R7係如請求項11中所定義,且x係1至9之整數。 The method of claim 12, wherein the compound of formula (III) is a compound of formula (IV): Wherein R 7 is as defined in claim 11 and x is an integer from 1 to 9. 如請求項13之方法,其中該式(IV)化合物係1H,1H,2H,2H-丙烯酸十七氟癸酯。 The method of claim 13, wherein the compound of the formula (IV) is 1H, 1H, 2H, 2H-heptadecafluorodecyl acrylate. 如請求項13之方法,其中該式(IV)化合物係式(V)化合物: 其中R8係氫或甲基、乙基或丙基,且n=1至5。 The method of claim 13, wherein the compound of formula (IV) is a compound of formula (V): Wherein R 8 is hydrogen or methyl, ethyl or propyl, and n = 1 to 5. 如先前請求項中任一項之方法,其中該電漿沉積方法係電漿聚合方法,且使用脈衝式電漿來塗佈該塗層。 The method of any of the preceding claims, wherein the plasma deposition method is a plasma polymerization method, and the coating is applied using a pulsed plasma. 如請求項16之方法,其中該脈衝序列包括1:200至1:1500之開:關比例。 The method of claim 16, wherein the pulse sequence comprises an on ratio of 1:200 to 1:1500. 如請求項16或17中任一項之方法,其中該脈衝序列包括通電20至50 μs及斷電500 μs至30000 μs。 The method of any one of claims 16 or 17, wherein the pulse sequence comprises energizing 20 to 50 μs and powering down 500 μs to 30,000 μs. 如先前請求項中任一項之方法,其中該等平均功率水準係1 W至1 kW,且更特定而言為300 W至500 W。 The method of any of the preceding claims, wherein the average power level is from 1 W to 1 kW, and more specifically from 300 W to 500 W. 如先前請求項中任一項之方法,其中在初期步驟中,將連續功率電漿施加至該表面。 The method of any of the preceding claims, wherein in the initial step, continuous power plasma is applied to the surface. 如請求項20之方法,其中該初期步驟係於惰性氣體之存在下進行。 The method of claim 20, wherein the initial step is carried out in the presence of an inert gas. 如先前請求項中任一項之方法,其中該液體拒斥塗層包 括防油或防水塗層。 The method of any of the preceding claims, wherein the liquid repels the coating package Includes oil or water resistant coating. 如先前請求項中任一項之方法,其中該表面係織物、金屬、玻璃、陶瓷、紙或聚合物基板之表面。 The method of any of the preceding claims, wherein the surface is a surface of a fabric, metal, glass, ceramic, paper or polymer substrate. 一種液體拒斥基板,其包含已藉由如先前請求項中任一項之方法塗佈的聚合物塗層。 A liquid repellent substrate comprising a polymeric coating that has been coated by the method of any of the preceding claims. 如請求項24之基板,其包括織物,且特定而言為服裝物品。 The substrate of claim 24, which comprises a fabric, and in particular an article of clothing.
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