TW201301668A - Electric connector - Google Patents
Electric connector Download PDFInfo
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- TW201301668A TW201301668A TW101109116A TW101109116A TW201301668A TW 201301668 A TW201301668 A TW 201301668A TW 101109116 A TW101109116 A TW 101109116A TW 101109116 A TW101109116 A TW 101109116A TW 201301668 A TW201301668 A TW 201301668A
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- terminal
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- bottom wall
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
- H01R4/028—Soldered or welded connections comprising means for preventing flowing or wicking of solder or flux in parts not desired
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/82—Coupling devices connected with low or zero insertion force
- H01R12/85—Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures
- H01R12/88—Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures acting manually by rotating or pivoting connector housing parts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
- H01R13/629—Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure electrical locking indicators, manufacturing tolerances
- H01R13/62983—Linear camming means or pivoting lever for connectors for flexible or rigid printed circuit boards, flat or ribbon cables
- H01R13/62988—Lever acting directly on flexible or rigid printed circuit boards, flat or ribbon cables, e.g. recess provided to this purposeon the surface or edge of the flexible or rigid printed circuit boards, flat or ribbon cables
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- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
Abstract
Description
本發明是關於電連接器,尤其是關於一種配置在電路基板上,而且端子等可焊接在電路基板的連接器。 The present invention relates to an electrical connector, and more particularly to a connector that is disposed on a circuit substrate and that can be soldered to the circuit substrate.
這種連接器已知有例如專利文獻1所揭示的連接器。 A connector such as disclosed in Patent Document 1 is known as such a connector.
該專利文獻1的連接器是藉由殼體的底壁載置於電路基板上,該殼體是形成高度較低的大致立方體外形,並且保持著沿著該殼體之底壁排列的複數個端子,在其排列方向兩端測也保持著固定金屬配件。端子及固定金屬配件是插入並裝入在於殼體之後壁形成開口的對應插入孔。 The connector of Patent Document 1 is placed on a circuit substrate by a bottom wall of a casing which is formed into a substantially cubic shape having a low height and which is held in plural along the bottom wall of the casing. The terminals are also fixed with metal fittings measured at both ends of the arrangement direction. The terminal and the fixing metal fitting are corresponding insertion holes that are inserted into and mounted in the wall behind the casing to form an opening.
上述殼體是使與電路基板相對向的底壁之下面形成平坦面,端子及固定金屬配件是維持以上述排列方向為板厚的金屬板之板面而作成。這些端子及固定金屬配件在裝入殼體的狀態下,端子的焊料連接部及固定金屬配件的焊料固定部是分別朝殼體外向後方突出,這些的下端緣是與電路基板的對應焊墊面接,且可焊料連接及焊料固定。 The casing is formed such that a flat surface is formed on a lower surface of a bottom wall facing the circuit board, and the terminal and the fixing metal fitting are formed by maintaining a plate surface of the metal plate having the thickness in the arrangement direction. When the terminals and the fixing metal fittings are mounted in the housing, the solder connecting portions of the terminals and the solder fixing portions of the fixing metal fittings protrude toward the rear of the housing, and the lower end edges of the terminals are connected to the corresponding pads of the circuit board. And can be soldered and soldered.
[專利文獻1]日本專利第4215265號 [Patent Document 1] Japanese Patent No. 4215265
進行焊料連接部及焊料固定部之焊接時會使用助焊劑,但常常會有助焊劑上升的問題。由於助焊劑的熔點比焊料低,黏度也低,因此會在上述焊料連接部及焊料固定部的表面流動而上升,在與殼體的間隙還會因為毛細現象更為上升而到達電子零件等,有時會形成發生接點不良、動作不良等情況的原因。尤其,固定金屬配件為了獲得固定強度,相較於端子會使用更多的焊料,因此助焊劑也多,因而容易發生助焊劑上升。再者,在連接器的使用者側,有時也會以較連接器製造者之建議焊料量更多的量對連接器進行焊裝,在該情況下,助焊劑的量也會隨著焊料量而增加,因此容易發生助焊劑上升。 Flux is used for soldering the solder joint and the solder joint, but there is often a problem that the flux rises. Since the melting point of the flux is lower than that of the solder and the viscosity is also low, it flows on the surface of the solder joint portion and the solder fixing portion, and rises in the gap with the casing, and the capillary phenomenon increases to reach the electronic component. There are cases where contact failure, malfunction, etc. occur. In particular, in order to obtain a fixed strength, the fixing metal fitting uses more solder than the terminal, so that there are many fluxes, and thus the flux rises easily. Furthermore, on the user side of the connector, the connector is sometimes soldered in a larger amount than the solder manufacturer recommends, in which case the amount of flux will also follow the solder. The amount increases, so the flux rises easily.
專利文獻1的連接器當中,助焊劑的若干量會從焊料連接部及焊料固定部的表面,朝向接近的殼體之底壁的後端緣流動,並且因為「浸潤現象」在該底壁的下面移動,但因為該下面是全面都為平坦面,因此其移動範圍會停在上述後端緣附近,發生助焊劑上升的大部分助焊劑最後會在與上述殼體的間隙上升,並形成上述不良情況的發生原因。 In the connector of Patent Document 1, a certain amount of flux flows from the surface of the solder joint portion and the solder fixing portion toward the rear end edge of the bottom wall of the approaching casing, and because the "wetting phenomenon" is on the bottom wall Moving below, but because the lower surface is all flat, the moving range will stop near the rear end edge, and most of the flux that rises in flux will eventually rise in the gap with the above casing, and form the above. The cause of the bad situation.
本發明之課題在於提供一種盡量抑制這種助焊劑上升,且可防止因此所導致的不良情況的連接器。 An object of the present invention is to provide a connector which can suppress such an increase in flux as much as possible and can prevent such a problem from being caused.
根據本發明,上述課題可藉由以下的第1發明或第2發明得到解決。 According to the present invention, the above problems can be solved by the first invention or the second invention described below.
第1發明對於想要在端子之焊料連接部上升的助焊劑相當有效。 The first invention is quite effective for a flux that is intended to rise at the solder joint portion of the terminal.
第1發明之電連接器是具備:由電性絕緣材料作成,並藉由底壁配置在電路基板上的殼體;以及排列並保持在該殼體的複數個端子,該殼體是沿著上述底壁排列形成有在該殼體形成開口的端子保持凹槽,端子是插入在上述端子保持凹槽,其位置是使焊料連接部朝殼體外突出而得以與上述電路基板上的對應焊料電路部連接。 An electrical connector according to a first aspect of the present invention includes: a housing made of an electrically insulating material and disposed on a circuit board by a bottom wall; and a plurality of terminals arranged and held in the housing, the housing being along The bottom wall is formed with a terminal holding groove in which an opening is formed in the casing, and the terminal is inserted into the terminal holding groove at a position such that the solder connecting portion protrudes outward of the casing to be corresponding to the solder circuit on the circuit substrate. Department connection.
在該電連接器當中,本發明的上述殼體是在其底壁的下面,在端子之排列方向對應於上述端子的焊料連接部之範圍之至少一部分的範圍,形成有形成在底壁,並且從接近上述對應焊料電路部或與其連接的位置延伸的凹槽部,該凹槽部是由凹槽底部形成角落部。 In the electrical connector, the housing of the present invention is formed on the lower surface of the bottom wall, at least a part of a range in which the terminal arrangement direction corresponds to the solder connection portion of the terminal, formed on the bottom wall, and A groove portion extending from a position corresponding to the above-described corresponding solder circuit portion or connected thereto is formed by a bottom portion of the groove.
根據這種構成的本發明,當端子要藉由其焊料連接部焊接在電路基板之對應焊料電路部時,從焊料連接部上升的助焊劑在到達殼體與端子之間的間隙之前,會到達形成在殼體之底壁之下面的凹槽部附近,並浸潤該凹槽部入口。該浸潤助焊劑會因為表面張力而在凹槽部角落部形成圓角狀的堆積,並且朝凹槽部延伸的方向行進。由於該圓角狀助焊劑之堆積的形成及行進,要在焊料連接部上升的大部分助焊劑會被吸引,該結果,助焊劑進入比上述凹槽部更上方之上述間隙的量會變成零,或是驟減。因此可避 免因為助焊劑上升所導致的不良情況。 According to the invention of this configuration, when the terminal is to be soldered to the corresponding solder circuit portion of the circuit substrate by the solder joint portion, the flux rising from the solder joint portion reaches before reaching the gap between the case and the terminal. Formed in the vicinity of the groove portion below the bottom wall of the casing, and infiltrated the groove portion inlet. The infiltrating flux forms a rounded pile at the corner portion of the groove portion due to the surface tension, and travels in a direction in which the groove portion extends. Due to the formation and travel of the stack of the fillet-shaped flux, most of the flux that is to be raised at the solder joint portion is attracted, and as a result, the amount of the flux entering the gap above the groove portion becomes zero. Or a sudden drop. So avoidable Avoid the bad conditions caused by the rise of flux.
本發明當中,端子可為形成以排列方向為板厚方向之板狀的形態,在該情況,亦可使端子的焊料連接部從底壁的端緣進入凹槽部內。假設是這種形態,要在焊料連接部上升的助焊劑會因為毛細現象,容易地進入凹槽部內的焊料連接部的部分與凹槽部內面之間,並且被引導而進入凹槽內。 In the present invention, the terminal may be formed in a plate shape in which the arrangement direction is the plate thickness direction. In this case, the solder connection portion of the terminal may enter the groove portion from the end edge of the bottom wall. Assuming this form, the flux to be raised at the solder joint portion easily enters between the portion of the solder joint portion in the groove portion and the inner surface of the groove portion due to the capillary phenomenon, and is guided into the groove.
本發明當中,連接器除了端子之外,亦可具有插入在形成於殼體之金屬配件保持凹槽的固定金屬配件。 In the present invention, in addition to the terminals, the connector may have a fixing metal fitting inserted into the metal fitting retaining groove formed in the housing.
第2發明當中,連接器除了端子之外也具有固定金屬配件的情況,對於想要在該固定金屬配件之焊料固定部上升的助焊劑相當有效,而且依形態的不同,甚至對於如第1發明想要在端子的焊料連接部上升的助焊劑也相當有效。 In the second aspect of the invention, the connector has a fixing metal fitting in addition to the terminal, and is effective for the flux which is intended to rise in the solder fixing portion of the fixing metal fitting, and depending on the form, even for the first invention A flux that wants to rise at the solder joint of the terminal is also quite effective.
第2發明之電連接器是具備:由電性絕緣材料作成,並藉由底壁配置在電路基板上的殼體;以及排列並保持在該殼體的複數個端子,或是除了該端子之外的固定金屬配件,該殼體形成有在該殼體形成開口並且沿著底壁排列的端子保持凹槽,或是除了該端子保持凹槽之外在端子排列範圍外的金屬配件保持凹槽,端子及固定金屬配件是插入在上述端子保持凹槽及金屬配件保持凹槽,其位置是使焊料連接部及焊料固定部分別朝殼體外突出而得以與上述電 路基板上的對應焊料電路部連接。 An electrical connector according to a second aspect of the present invention includes: a housing made of an electrically insulating material and disposed on a circuit board by a bottom wall; and a plurality of terminals arranged and held in the housing, or in addition to the terminal An outer fixing metal fitting, the housing is formed with a terminal holding groove formed in the housing and arranged along the bottom wall, or a metal fitting retaining groove outside the terminal arrangement range except the terminal holding groove The terminal and the fixing metal fitting are inserted into the terminal holding groove and the metal fitting retaining groove, and the position is such that the solder connecting portion and the solder fixing portion protrude outwardly from the housing, respectively, and the electric The corresponding solder circuit portions on the substrate are connected.
在該電連接器當中,本發明的上述殼體是在其底壁的下面,在對應於上述固定金屬配件的焊料固定部之範圍之至少一部分的範圍,在底壁的下面形成有從接近上述對應焊料電路部或與其連接的位置延伸的凹槽部,該凹槽部是在凹槽底部形成有角落部。 In the electrical connector, the housing of the present invention is formed on the lower surface of the bottom wall, at least a portion of a range corresponding to the solder fixing portion of the fixed metal fitting, and is formed from the lower surface of the bottom wall. Corresponding to the solder circuit portion or a groove portion extending at a position connected thereto, the groove portion is formed with a corner portion at the bottom of the groove.
根據這種構成的本發明,與第1發明之端子之焊料連接部的情況相同,沿著固定金屬配件的焊料固定部之面而上升的助焊劑在到達殼體與固定金屬配件之間的間隙之前會被導入上述凹槽部,並且在凹槽部的角落部形成圓角狀而行進。如此,助焊劑就幾乎不會進入上述間隙。 According to the present invention having such a configuration, as in the case of the solder connecting portion of the terminal of the first aspect of the invention, the flux which rises along the surface of the solder fixing portion of the fixing metal fitting reaches the gap between the housing and the fixing metal fitting. It is introduced into the groove portion before, and is formed in a rounded shape at the corner portion of the groove portion. In this way, the flux hardly enters the above gap.
在本發明當中,殼體在其底壁的下面,在端子之排列方向對應於該端子的焊料連接部之範圍之至少一部分的範圍,也可形成有從接近對應焊料電路部或與其連接的位置延伸的凹槽部。藉此,不僅是固定金屬配件的焊料固定部,還可藉由與第1發明相同的要領防止端子之焊料連接部的助焊劑上升。尤其,當凹槽部是形成至與對應焊料電路部連接的位置時,助焊劑會從對應焊料電路部直接被引導至凹槽部。 In the present invention, the housing may be formed under the bottom wall thereof at a position corresponding to at least a portion of the range of the solder connection portion of the terminal in the direction in which the terminals are arranged, or may be formed from a position close to or adjacent to the corresponding solder circuit portion. An extended groove portion. Thereby, not only the solder fixing portion of the fixing metal fitting but also the flux of the solder connecting portion of the terminal can be prevented from rising in the same manner as in the first invention. In particular, when the groove portion is formed to a position connected to the corresponding solder circuit portion, the flux is directly guided from the corresponding solder circuit portion to the groove portion.
本發明當中,端子及固定金屬配件當中的至少端子可為形成以端子之排列方向為板厚方向之板狀的形態,在該情況,亦可使端子的焊料連接部及固定金屬配件的焊料固定部的一部分從底壁的端緣進入凹槽部內。 In the present invention, at least the terminals of the terminal and the fixing metal fitting may be formed in a plate shape in which the terminal arrangement direction is the thickness direction. In this case, the solder connection portion of the terminal and the solder fixing of the fixing metal fitting may be fixed. A portion of the portion enters the groove portion from the end edge of the bottom wall.
假設為這種形態,在焊料連接部及焊料固定部上升的 助焊劑會分別因為毛細現象容易地進入凹槽部內的焊料連接部及焊料固定部的部分與凹槽部內面之間,並且被引導而進入凹槽內。這與第1發明之同樣形態的焊料連接部的情況相同。 It is assumed that this form is raised in the solder joint portion and the solder fixing portion. The flux easily enters between the solder joint portion in the groove portion and the portion of the solder fixing portion and the inner surface of the groove portion due to the capillary phenomenon, and is guided into the groove. This is the same as the case of the solder joint portion of the same aspect of the first invention.
第1發明及第2發明的凹槽部本身可為如下的形態。 The groove portion of the first invention and the second invention itself can be in the following form.
‧凹槽部是相對於殼體之底壁的端緣朝直角方向延伸。 ‧ The groove portion extends in a right angle direction with respect to the end edge of the bottom wall of the casing.
‧凹槽部是相對於殼體之底壁的端緣以傾角延伸。 ‧ The groove portion extends at an oblique angle with respect to the end edge of the bottom wall of the casing.
‧凹槽部同時存在有兩種傾角,全體是形成格子狀而延伸。 ‧ There are two kinds of inclination angles at the same time, and all of them form a lattice shape and extend.
‧凹槽部在連接器配置於電路基板上時,是從電路基板之對應電路部的範圍內延伸至範圍外。根據該形態,亦可將附著在對應電路部的助焊劑吸起至凹槽部。本發明當中,包含設在電路基板的焊墊、貫穿孔等可供連接器之端子焊接的電路部。 ‧ When the connector is placed on the circuit board, the groove portion extends from the range of the corresponding circuit portion of the circuit board to the outside of the range. According to this aspect, the flux adhering to the corresponding circuit portion can be sucked up to the groove portion. In the present invention, a circuit portion that can be soldered to a terminal of a connector such as a pad or a through hole of a circuit board is included.
本發明是如以上所述,在殼體之底壁的下面形成從該底壁之後端緣延伸的凹槽部,並且在端子排列方向使端子的焊料連接部及固定金屬配件的焊料固定部之至少一部分位在凹槽部的範圍,因此在與上述後端緣相鄰的上述焊料連接部及焊料固定部之表面流動而上升的助焊劑會被引導至殼體之間隙前方的位置,並且因為表面張力在凹槽部的 角落部形成圓角狀的浸潤堆積,並且使大部分的助焊劑朝凹槽部前方行進,結果,助焊劑進入殼體之間隙的量會消失或驟減,甚至就不會有上升而到達電子零件的助焊劑。 According to the present invention, as described above, a groove portion extending from the rear edge of the bottom wall is formed on the lower surface of the bottom wall of the casing, and the solder joint portion of the terminal and the solder fixing portion of the fixing metal fitting are arranged in the terminal arrangement direction. At least a portion is located in the range of the groove portion, so that the flux that rises on the surface of the solder joint portion and the solder fixing portion adjacent to the rear end edge is guided to a position in front of the gap of the casing, and because Surface tension in the groove The corner portion forms a rounded infiltrated deposit, and most of the flux travels toward the front of the groove portion. As a result, the amount of flux entering the gap of the casing disappears or decreases, and even rises without reaching the electron. The flux of the part.
以下,根據所附圖面來說明本發明之實施形態。 Hereinafter, embodiments of the present invention will be described based on the drawings.
本實施形態之電連接器是配置在電路基板上,端子及固定金屬配件可焊接及焊料固定在電路基板之焊墊的電路基板用的電連接器,第1圖是從上方觀看該連接器的斜視圖,第2圖是從下方觀看的斜視圖,第3圖是該連接器的剖面圖,(A)是端子位置的剖面,(B)是固定金屬配件位置的剖面,第4圖及第5圖是殼體之底壁下面的部分放大斜視圖,第4圖是從焊料連接部側(第2圖的相反側),第5圖是從固定金屬配件之焊料固定部側(第2圖的同側)觀看的圖。 The electrical connector of the present embodiment is an electrical connector for a circuit board that is disposed on a circuit board and has a terminal and a fixed metal fitting that can be soldered and soldered to the pad of the circuit board. FIG. 1 is a view of the connector viewed from above. Oblique view, Fig. 2 is a perspective view from below, and Fig. 3 is a cross-sectional view of the connector, (A) is a cross section of the terminal position, (B) is a cross section of the fixed metal fitting position, Fig. 4 and 5 is a partially enlarged perspective view of the lower surface of the bottom wall of the casing, FIG. 4 is from the side of the solder joint portion (opposite side of FIG. 2), and FIG. 5 is from the side of the solder fixing portion of the fixed metal fitting (Fig. 2) The ipsilateral) view of the figure.
第1、2圖所示的本實施形態之電路基板用的連接器1(以下稱為「連接器1」)是配置在電路基板P(參照第3圖),並且可從後方(第1圖的左上方)連接平型導體(未圖示)的高速傳送用的連接器,如第1圖具有:連接器主體10、以及支持在該連接器主體10而可轉動的可動構件40。可動構件40可以在可將平型導體從後方朝前方插入連接器主體10的打開位置、與壓住所插入的平型導體的關閉位置之間轉動。第1圖至第3圖當中,可動構件40是位於關閉位置並形成橫躺姿勢,因此連接器1的外形是 形成大致立方體。 The connector 1 for a circuit board (hereinafter referred to as "connector 1") of the present embodiment shown in FIGS. 1 and 2 is disposed on the circuit board P (see FIG. 3) and can be viewed from the rear (Fig. 1). The upper left side of the connector for connecting a flat conductor (not shown) for high-speed transmission has a connector main body 10 and a movable member 40 rotatably supported by the connector main body 10 as shown in FIG. The movable member 40 is rotatable between an open position in which the flat conductor can be inserted from the rear toward the front into the connector main body 10 and a closed position in which the inserted flat conductor is pressed. In the first to third figures, the movable member 40 is in the closed position and forms a lying posture, so the outer shape of the connector 1 is Form a rough cube.
連接器主體10具有:由電性絕緣材料作成的殼體11;藉由該殼體11而保持的端子20及固定金屬配件30。端子20是以殼體11之長邊方向為排列方向,並藉由該殼體11保持有複數個,又,固定金屬配件30是位在這些複數個端子20之排列範圍的兩外側而受到保持。 The connector body 10 has a housing 11 made of an electrically insulating material, a terminal 20 held by the housing 11, and a fixing metal fitting 30. The terminal 20 is arranged in the longitudinal direction of the casing 11, and is held by the casing 11 in a plurality, and the fixing metal fitting 30 is held on both outer sides of the arrangement range of the plurality of terminals 20. .
上述殼體11一體具有:配置在電路基板上,並且與該電路基板相對向的底壁12;在端子排列方向位於兩端,並且從上述底壁12豎起的側壁13;位於前部的前壁14;以及從該前壁14之上部延伸至後方的上壁15。又,如第3圖所示,在該殼體11的後半部是在上述底壁12更上方,在兩方的側壁13之間形成有朝上方及後方開放的開口部16。該開口部16的功能是作為平型導體插入用的收容部、以及上述可動構件40之配置及可動所需的空間。 The housing 11 integrally includes: a bottom wall 12 disposed on the circuit substrate and opposed to the circuit substrate; sidewalls 13 located at both ends in the terminal arrangement direction and rising from the bottom wall 12; a wall 14; and an upper wall 15 extending from an upper portion of the front wall 14 to a rear portion. Further, as shown in FIG. 3, in the rear half of the casing 11, the opening portion 16 which is opened upward and rearward is formed between the side walls 13 at the upper side of the bottom wall 12. The function of the opening portion 16 is as a housing portion for inserting a flat conductor and a space required for the arrangement and movement of the movable member 40.
在殼體11是沿著上述側壁13的內面,朝前後方向貫穿形成有由金屬板作成之固定金屬配件30用的金屬配件保持凹槽17,在此從後方安裝有固定金屬配件30。該固定金屬配件30是如第3圖(B),維持著金屬板之平坦的板面,對該金屬板沖孔而作成,並且具有:朝前後方向延伸的腕狀部31;以及在其後端與該腕狀部31平行地朝前方延伸的焊料固定部32。另一方面,在上述殼體11的後半部(第3圖(A)、(B)的左半部)如以上所述形成有開口部16,在該殼體的前半部(第3圖(B)的右半部),在上下方 向的上壁15與底壁12之間朝前後貫穿形成有上述金屬配件保持凹槽17。在該金屬配件保持凹槽17可插入上述固定金屬配件30的腕狀部31,但是在該腕狀部31的上緣形成有卡止突起31A,該卡止突起31A會卡進金屬配件保持凹槽17的上面而實現固定金屬配件30的防脫。又,可藉由上述腕狀部31的下緣及上述焊料固定部32的上緣夾住殼體11的底壁12而謀求固定金屬配件30對於殼體11的固定。該焊料固定部32是從殼體11之底壁12的下面朝下方若干突出,並且可與作為電路基板P之對應焊料電路部的對應焊墊(以下稱為「對應焊墊」)P1焊料固定而用在殼體11之固定。本實施形態是如第3圖(B),該焊料固定部32是位在該對應焊墊P1的範圍內。 The case 11 is formed along the inner surface of the side wall 13, and a metal fitting holding groove 17 for fixing the metal fitting 30 made of a metal plate is formed in the front-rear direction, and the fixing metal fitting 30 is attached from the rear. The fixed metal fitting 30 is a flat plate surface of the metal plate as shown in FIG. 3(B), is formed by punching the metal plate, and has a wrist portion 31 extending in the front-rear direction; and thereafter A solder fixing portion 32 whose end extends forward in parallel with the wrist portion 31. On the other hand, in the rear half of the casing 11 (the left half of the third drawing (A) and (B)), the opening portion 16 is formed as described above, in the front half of the casing (Fig. 3 (Fig. 3 ( B) right half), above and below The above-described metal fitting holding groove 17 is formed between the upper wall 15 and the bottom wall 12 in the front and rear direction. The metal fitting retaining groove 17 can be inserted into the wrist portion 31 of the fixing metal fitting 30, but a locking projection 31A is formed at the upper edge of the wrist portion 31, and the locking projection 31A is caught in the metal fitting to be concave. The upper surface of the groove 17 achieves the prevention of the fixing of the metal fitting 30. Further, the fixing of the metal fitting 30 to the casing 11 can be achieved by sandwiching the lower edge of the wrist portion 31 and the upper edge of the solder fixing portion 32 with the bottom wall 12 of the casing 11. The solder fixing portion 32 protrudes downward from the lower surface of the bottom wall 12 of the casing 11, and can be soldered to a corresponding pad (hereinafter referred to as "corresponding pad") P1 as a corresponding solder circuit portion of the circuit board P. It is used for fixing the housing 11. In the present embodiment, as shown in Fig. 3(B), the solder fixing portion 32 is located within the range of the corresponding pad P1.
殼體11是在上述雙方側壁13之分別位於內側的上述金屬配件保持凹槽17彼此之間,如第1圖所示,排列形成有用來收容並保持端子20的複數個端子保持凹槽18。端子20與上述固定金屬配件30同樣是維持金屬板之平坦的板面而作成,因此上述端子保持凹槽18也是形成適合其板厚的開縫狀凹槽。該端子保持凹槽18是如第3圖(A)所示,在與紙面為直角的方向,以相當於上述端子20之板厚的凹槽寬度排列形成有複數個,並且朝前後方向(第3圖(A)的左右方向)貫穿。 The casing 11 is formed between the metal fitting holding grooves 17 on the inner side of the side walls 13 respectively. As shown in Fig. 1, a plurality of terminal holding grooves 18 for accommodating and holding the terminals 20 are arranged. Similarly to the above-described fixing metal fitting 30, the terminal 20 is formed by maintaining a flat plate surface of the metal plate, and therefore the terminal holding groove 18 is also formed into a slit-like groove suitable for the thickness thereof. The terminal holding groove 18 is formed in a direction perpendicular to the plane of the paper as shown in FIG. 3(A), and is formed in a plurality of groove widths corresponding to the thickness of the terminal 20, and is oriented in the front-rear direction. 3 (A) in the left-right direction).
上述端子保持凹槽18是在位於殼體11之前半部的上壁15與底壁12之間朝前後貫穿前壁14,並且以延伸至形成有開口部16之後半部的上述底壁12之上面的方式貫 穿該開口部16。 The terminal holding groove 18 penetrates the front wall 14 forward and backward between the upper wall 15 and the bottom wall 12 of the front half of the casing 11, and extends to the above-mentioned bottom wall 12 in which the rear half of the opening 16 is formed. The above way The opening portion 16 is worn.
由上述端子保持凹槽18所保持的端子20是可轉動地支持可動構件40的端子,如第3圖(A)所示,該端子20具有:下腕21、在該下腕部21之上方位置朝前後方向延伸的上腕部22、連結上述下腕部21及上腕部22之前端部彼此的連結部23、以及從該連結部朝前方突出的焊料連接部24。該焊料連接部24是使其下緣與電路基板的對應焊墊P2面接,並且位在該對應焊墊P2的範圍。 The terminal 20 held by the terminal holding groove 18 is a terminal that rotatably supports the movable member 40, and as shown in FIG. 3(A), the terminal 20 has a lower wrist 21 above the lower arm 21. The upper arm portion 22 that extends in the front-rear direction, the connecting portion 23 that connects the front end portions of the lower arm portion 21 and the upper arm portion 22, and the solder connecting portion 24 that protrudes forward from the connecting portion. The solder connecting portion 24 has its lower edge surface-contacted with the corresponding pad P2 of the circuit board, and is located in the range of the corresponding pad P2.
上述下腕部21在後端具有突狀的接觸部21A。該下腕部21的寬度較為狹窄,在後部能以與底壁12的上面之間的間隙量彈性撓曲。 The lower arm portion 21 has a projecting contact portion 21A at the rear end. The lower arm portion 21 has a narrow width and is elastically deflectable at a rear portion by a gap amount from the upper surface of the bottom wall 12.
藉由上述連結部23連結的上述上腕部22是從該連結部23的上端朝後方與上述下腕部21大致平行地延伸。該上腕部22是朝後方延伸,並且在後端側的下緣形成有凹彎曲狀的支持部22B。又,在該上腕部22的上緣設有會與由上述上壁15形成的端子保持凹槽18之凹槽上面卡止的兩個卡止突起22A。該上腕部22的寬度(圖面的上下方向尺寸)比位在其下方的上述下腕部21寬,並且被製作成高剛性。 The upper arm portion 22 coupled by the connecting portion 23 extends rearward from the upper end of the connecting portion 23 substantially parallel to the lower arm portion 21. The upper arm portion 22 extends rearward, and a concave curved support portion 22B is formed on the lower edge of the rear end side. Further, at the upper edge of the upper arm portion 22, two locking projections 22A which are locked to the upper surface of the recess of the terminal holding recess 18 formed by the upper wall 15 are provided. The width of the upper arm portion 22 (the vertical dimension of the drawing surface) is wider than the lower arm portion 21 located below it, and is made high rigidity.
可動構件40是由與殼體11同樣的電性絕緣材料作成,如第1圖及第2圖所示,具有橫跨該殼體11之兩側壁13間的寬度,並且配置在殼體11的開口部16。該可動構件40是如以上所述,轉動自如地支持在打開位置與關閉位置之間。關閉位置是如第3圖(A)、(B)所示可動構 件40處在橫躺姿勢時,打開位置是可動構件40在由端子20之上腕部22的支持部22B支持的狀態下,繞著該支持部22B的中心從第3圖(A)、(B)的姿勢形成朝順時針方向轉動大約90°的縱向姿勢時。該可動構件40在關閉位置是如第3圖(A)所示,在端子排列方向(紙面的直角方向)對應於端子20的位置,在形成右部的部分形成有開縫凹槽部41。該開縫凹槽部41在第3圖(A)是朝上下貫穿,並且在右端位置設有用來連結開縫凹槽部41之相對向(在紙面的直角方向之相對向)凹槽內面彼此的軸部42。該軸部42具有大致圓形的周面,並且轉動自如地支持在以凹彎曲狀形成在上述端子20之上腕部22的支持部22B內。上述可動構件40在其寬度方向(端子排列方向)兩端也是藉由未圖示的軸部轉動自如地支持在殼體。上述可動構件40在第3圖(A)、(B)未形成有開縫凹槽部41的左部是形成操作部43,在形成第3圖之橫躺姿勢的關閉位置是位在與殼體11之上壁15同一水平位置,但是在形成縱向姿勢的打開位置是比該上壁15更朝上方突出。可動構件40可藉由該操作部43接受操作力而在打開位置與關閉位置之間轉動移動。 The movable member 40 is made of the same electrically insulating material as the casing 11, and has a width spanning between the side walls 13 of the casing 11 as shown in Figs. 1 and 2, and is disposed in the casing 11. Opening portion 16. The movable member 40 is rotatably supported between the open position and the closed position as described above. The closed position is a movable structure as shown in Fig. 3 (A) and (B). When the member 40 is in the lying posture, the open position is the state in which the movable member 40 is supported by the support portion 22B of the wrist portion 22 above the terminal 20, and the center of the support portion 22B is taken from the third figure (A), (B). The posture is formed when the longitudinal posture is rotated by approximately 90° in the clockwise direction. In the closed position, the movable member 40 is formed at a position corresponding to the terminal 20 in the terminal arrangement direction (the direction perpendicular to the paper surface) as shown in FIG. 3(A), and a slit portion 41 is formed in a portion forming the right portion. The slit groove portion 41 is vertically penetrated in Fig. 3(A), and is provided at the right end position for the opposite direction of the slit groove portion 41 (opposite direction in the direction perpendicular to the plane of the paper). The shaft portions 42 of each other. The shaft portion 42 has a substantially circular peripheral surface, and is rotatably supported in a support portion 22B formed in a concavely curved shape on the wrist portion 22 above the terminal 20. The movable member 40 is rotatably supported by the housing at both ends in the width direction (terminal arrangement direction) by a shaft portion (not shown). The movable member 40 is formed in the left portion where the slit portion 41 is not formed in FIGS. 3(A) and (B), and is formed in the closed position in the closed position in which the third figure is formed. The upper wall 15 of the body 11 is at the same horizontal position, but protrudes upward from the upper wall 15 in the open position forming the longitudinal posture. The movable member 40 is rotatable between the open position and the closed position by the operation portion 43 receiving the operating force.
上述可動構件40,從第3圖(A)所示的關閉位置的右端下邊部到操作部43的下面,是形成在該關閉位置壓住平型導體(未圖示)的加壓部。 The movable member 40 is a pressurizing portion that presses a flat conductor (not shown) at the closed position from the lower end portion of the right end of the closed position shown in Fig. 3(A) to the lower surface of the operating portion 43.
殼體11的底壁12是如第2圖所示,在其下面形成有凹槽部12A、12B。該凹槽部12A及凹槽部12B是在端子 排列方向分別對應於各端子20及各固定金屬配件30的位置朝前後方向延伸而形成。 The bottom wall 12 of the casing 11 is as shown in Fig. 2, and groove portions 12A and 12B are formed on the lower surface thereof. The groove portion 12A and the groove portion 12B are at the terminals The arrangement direction is formed corresponding to the position of each of the terminals 20 and the respective fixing metal fittings 30 extending in the front-rear direction.
上述凹槽部12A是從接近位於前方的端子20之焊料連接部24的底壁12的前端緣朝向後方延伸,並且延伸至中間部。該凹槽部12A是以相對於上述底壁12的前端緣為直角的方向朝後方延伸,並且如第4圖(B),其剖面是形成在凹槽底部具有角落部12A-1的矩形。 The groove portion 12A extends rearward from the front end edge of the bottom wall 12 of the solder joint portion 24 of the terminal 20 located at the front side, and extends to the intermediate portion. The groove portion 12A extends rearward in a direction perpendicular to the front end edge of the bottom wall 12, and as shown in Fig. 4(B), the cross section is a rectangle having a corner portion 12A-1 formed at the bottom of the groove.
相對於此,凹槽部12B是從位於後方的固定金屬配件30之焊料固定部32的前端位置朝前方延伸而形成。上述殼體11之底壁12的下面,在端子排列方向上述固定金屬配件30所在的區域,比起端子20的排列範圍是沒入成段狀,並且在上述區域形成具有比端子之排列區域低的位準之突出量的兩條平行的突條部12C,藉此在兩突條部12C間形成上述凹槽部12B。該凹槽部12B亦如第5圖所示,形成與固定金屬配件30之板厚相同的凹槽寬度,因此,凹槽寬度比上述凹槽部12A大。該凹槽部12B,換言之,上述突條部12C是在前後方向,從包含上述固定金屬配件30的焊料固定部32之前端側之一部分的位置延伸至底壁12的前端緣。該凹槽部12B朝向相對於底壁12之前端緣的直角方向延伸,以及其凹槽底部具有角落部皆與上述凹槽部12A相同。本實施形態的上述固定金屬配件30是如以上所述,腕狀部31是插入在殼體11的金屬配件保持凹槽17而由該殼體11保持,但是同時,固定金屬配件30的腕狀焊料固定部32會在殼體11之底壁12的下面進入 上述凹槽部12B,因此在固定金屬配件30之安裝插入時會受到該凹槽部12B的引導,並且由上述腕狀部31及焊料固定部32夾住底壁12,因而有助於安裝之強度的提升、及位置的確保。 On the other hand, the groove portion 12B is formed to extend forward from the front end position of the solder fixing portion 32 of the fixed metal fitting 30 located at the rear. The lower surface of the bottom wall 12 of the casing 11 is in a region where the fixing metal fitting 30 is located in the terminal arrangement direction, and is arranged in a segment shape compared with the terminal 20, and is formed in the above-mentioned region to have a lower arrangement area than the terminal. The two parallel rib portions 12C of the protruding amount of the level are formed, whereby the groove portion 12B is formed between the two ridge portions 12C. Also as shown in Fig. 5, the groove portion 12B has the same groove width as that of the fixing metal fitting 30, and therefore, the groove width is larger than the groove portion 12A. In the groove portion 12B, in other words, the rib portion 12C extends from the position on the front end side of the solder fixing portion 32 including the fixing metal fitting 30 to the front end edge of the bottom wall 12 in the front-rear direction. The groove portion 12B extends in a direction perpendicular to the front end edge of the bottom wall 12, and the bottom portion of the groove has the same corner portion as the groove portion 12A. In the above-described fixed metal fitting 30 of the present embodiment, as described above, the wrist portion 31 is inserted into the metal fitting holding groove 17 of the casing 11 and held by the casing 11, but at the same time, the wrist of the metal fitting 30 is fixed. The solder fixing portion 32 will enter under the bottom wall 12 of the housing 11. The groove portion 12B is thus guided by the groove portion 12B when the fixing metal fitting 30 is inserted and inserted, and the bottom wall 12 is sandwiched by the wrist portion 31 and the solder fixing portion 32, thereby facilitating the mounting. Increased strength and positional assurance.
本實施形態的連接器1是如第3圖(A)、(B)所示,端子20可藉由其焊料連接部24在電路基板P之對應焊墊P2的範圍與該對應焊墊P2焊接(參照焊料W2)。焊接時,熔點比焊料本身低的助焊劑會因為其流動性及黏性,從上述對應焊墊P2在焊料連接部24的面上升。但是,助焊劑在到達焊料連接部24的上緣之前,在其下方的位置會在形成於殼體11的底壁12之下面的上述凹槽部12A的前緣側入口部分進入該凹槽部12A,並且在凹槽部12A內形成助焊劑的堆積。該堆積是如第4圖(B),在凹槽部12A之凹槽底部的角落部12A-1因為助焊劑的表面張力附著成圓角狀(參照第4圖(B)的符號F)而形成較大的量。然後,助焊劑的堆積會在凹槽部12A朝後方進行而延伸其範圍。因此,要在焊料連接部24上升的大部分助焊劑會被引導至上述凹槽部12A內,因而不會到達上述焊料連接部24的上緣。該結果,助焊劑並不會達到端子20的接觸部21A,也不會發生因為助焊劑上升所導致的不良情況。 In the connector 1 of the present embodiment, as shown in FIGS. 3(A) and 3(B), the terminal 20 can be soldered to the corresponding pad P2 in the range of the corresponding pad P2 of the circuit board P by the solder connecting portion 24. (Refer to solder W2). At the time of soldering, the flux having a lower melting point than the solder itself rises from the surface of the solder joint portion 24 from the corresponding pad P2 because of its fluidity and viscosity. However, before reaching the upper edge of the solder joint portion 24, the flux enters the groove portion at the leading edge side inlet portion of the groove portion 12A formed under the bottom wall 12 of the casing 11 at a position below it. 12A, and accumulation of flux is formed in the groove portion 12A. This stacking is as shown in Fig. 4(B), and the corner portion 12A-1 at the bottom of the groove of the groove portion 12A is rounded by the surface tension of the flux (refer to symbol F of Fig. 4(B)). A larger amount is formed. Then, the accumulation of the flux extends toward the rear of the groove portion 12A to extend its range. Therefore, most of the flux to be raised at the solder joint portion 24 is guided into the above-described groove portion 12A, and thus does not reach the upper edge of the above-described solder joint portion 24. As a result, the flux does not reach the contact portion 21A of the terminal 20, and the trouble caused by the rise of the flux does not occur.
另一方面,固定金屬配件30可藉由其焊料連接部32在電路基板P之對應焊墊P1的範圍與該對應焊墊P1焊接(參照焊料W1)。該時,與端子20之情況同樣的,助焊劑 會在上述焊料固定部32的面上升,但由於焊料固定部32的前端部是延伸至上述凹槽部12B內,因此助焊劑會因為毛細現象而進入其前端部與凹槽部12B的內面之間微小的間隙。被吸引至該間隙的助焊劑會朝向接連於其目標的凹槽部12B行進,並且與凹槽部12A之情況同樣,在凹槽部12B更進一步朝目標,也就是朝前方行進。如此,大部分的助焊劑會在該凹槽部12B形成堆積並且被引導至凹槽部12B,與端子20之情況同樣可避免因為助焊劑上升所導致的不良情況。 On the other hand, the fixed metal fitting 30 can be soldered to the corresponding pad P1 by the solder connecting portion 32 in the range of the corresponding pad P1 of the circuit board P (refer to the solder W1). At this time, as in the case of the terminal 20, the flux The surface of the solder fixing portion 32 rises, but since the front end portion of the solder fixing portion 32 extends into the groove portion 12B, the flux enters the front end portion and the inner surface of the groove portion 12B due to the capillary phenomenon. A slight gap between them. The flux attracted to the gap travels toward the groove portion 12B that is connected to the target thereof, and as in the case of the groove portion 12A, the groove portion 12B further moves toward the target, that is, toward the front. Thus, most of the flux is deposited in the groove portion 12B and guided to the groove portion 12B, and as in the case of the terminal 20, the trouble caused by the rise of the flux can be avoided.
本發明是在殼體11之底壁12的上側排列形成有端子保持凹槽18及金屬配件保持凹槽17,但由於在底壁12的下側(下面)對應形成有凹槽部12A、12B,因此在殼體之塑模成形時等,在底壁12的上側形成凹狀的彎曲傾向得以消除或減少。 In the present invention, the terminal holding groove 18 and the metal fitting retaining groove 17 are formed on the upper side of the bottom wall 12 of the casing 11, but the groove portions 12A, 12B are formed correspondingly on the lower side (lower side) of the bottom wall 12. Therefore, in the molding of the casing or the like, the tendency to form a concave shape on the upper side of the bottom wall 12 can be eliminated or reduced.
本發明並不限定於第2圖至第5圖之圖示及說明的凹槽部的形態,而可有各種變更。 The present invention is not limited to the form of the groove portion illustrated and described in FIGS. 2 to 5, and various modifications are possible.
例如,第2圖至第5圖所示的形態當中,從接近端子20之焊料連接部24及固定金屬配件30之焊料固定部32的位置延伸的凹槽部12A、12B是相對於殼體11之底壁12的前端緣朝直角的方向延伸,但是第6圖所示的形態當中,相對於第2圖至第5圖的凹槽部12A所延伸的方向X,凹槽部12A’是僅以角度θ的傾角延伸。由於具有該傾角,即使是殼體11之底壁12之前後方向尺寸小的連接器,除了排列方向端部的凹槽部以外,也可增加大多凹 槽部12’的長度。 For example, in the form shown in FIGS. 2 to 5, the groove portions 12A, 12B extending from the position of the solder connecting portion 24 of the terminal 20 and the solder fixing portion 32 of the fixing metal fitting 30 are relative to the housing 11. The front end edge of the bottom wall 12 extends in a right angle direction, but in the form shown in Fig. 6, the groove portion 12A' is only the direction X extending from the groove portion 12A of Figs. 2 to 5 Extends at an inclination of the angle θ. With this inclination angle, even if the bottom wall 12 of the casing 11 has a small front and rear direction, the connector can be enlarged in addition to the groove portion at the end of the arrangement direction. The length of the groove portion 12'.
接下來,第7圖的形態是相對於第6圖的上述方向X朝兩側彼此以相反的傾角延伸,使凹槽部12”全體形成格子狀。藉此,即使在端子之排列方向位於端部的凹槽部也可充分確保其長度。 Next, the form of Fig. 7 is extended at an opposite inclination angle to the both sides with respect to the above-described direction X of Fig. 6, so that the entire groove portion 12" is formed in a lattice shape. Thereby, even in the arrangement direction of the terminals is located at the end The groove portion of the portion can also sufficiently ensure its length.
這種傾角不僅是接近端子之焊料連接部的凹槽部,在接近固定金屬配件之焊料固定部的凹槽部也可適用。本發明的凹槽部亦可接近上述焊料連接部或焊料固定部,或是容許這些的一部分進入。 This angle of inclination is not only a groove portion close to the solder joint portion of the terminal but also a groove portion close to the solder fixing portion of the fixed metal fitting. The groove portion of the present invention may also be adjacent to the solder joint portion or the solder fixing portion, or allow a part of these to enter.
再者,凹槽部亦可接近焊料連接部或焊料固定部所在的電路基板之對應焊墊而設置,或是進入上述對應焊墊之範圍而連接地設置。進入對應焊墊之範圍而連接的情況,助焊劑不僅會經由焊料連接部或焊料固定部進入凹槽部,也會從對應焊墊直接被引導至凹槽部。 Furthermore, the groove portion may be provided close to the corresponding pad of the circuit substrate where the solder connection portion or the solder fixing portion is located, or may be connected to the range of the corresponding pad. In the case where the connection is made in the range corresponding to the pad, the flux not only enters the groove portion via the solder connection portion or the solder fixing portion, but also is directly guided from the corresponding pad to the groove portion.
再者,本發明也可適用在只有端子而不具有固定金屬配件的連接器,或是具有兩者的連接器,在該情況,亦可為了兩者的任一方而設置凹槽部,或是為了兩者而設置。本發明並不限於圖面所示的連接器,只要是可焊裝在電路基板的連接器皆可適用,例如,亦可為將連接器焊裝分別安裝在兩個電路基板,並且彼此嵌合,使電路基板彼此電性連接的連接器。 Furthermore, the present invention is also applicable to a connector having only a terminal without a fixed metal fitting, or a connector having both, and in this case, a groove portion may be provided for either of the two, or Set for both. The present invention is not limited to the connector shown in the drawings, and any connector that can be soldered to a circuit board can be applied. For example, the connector can be separately mounted on two circuit substrates and fitted to each other. A connector that electrically connects the circuit substrates to each other.
再者,本發明當中,形成在殼體之底壁的下面的凹槽部,其剖面亦可並非矩形狀,而是三角形狀,例如V形凹槽,只要具有角落部即可。 Further, in the present invention, the groove portion formed on the lower surface of the bottom wall of the casing may not have a rectangular shape in cross section, but may have a triangular shape, for example, a V-shaped groove, as long as it has a corner portion.
1‧‧‧連接器 1‧‧‧Connector
11‧‧‧殼體 11‧‧‧Shell
12‧‧‧底壁 12‧‧‧ bottom wall
12A,12’,12”‧‧‧凹槽部 12A, 12’, 12” ‧‧‧ Groove
12A-1‧‧‧角落部 12A-1‧‧‧ corner
17‧‧‧金屬配件保持凹槽 17‧‧‧Metal fittings keep grooves
18‧‧‧端子保持凹槽 18‧‧‧ terminal retention groove
20‧‧‧端子 20‧‧‧ terminals
24‧‧‧焊料連接部 24‧‧‧ solder joint
30‧‧‧固定金屬配件 30‧‧‧Fixed metal fittings
32‧‧‧焊料固定部 32‧‧‧ Solder fixing department
P‧‧‧電路基板 P‧‧‧ circuit substrate
P1,P2‧‧‧對應焊墊 P1, P2‧‧‧ corresponding pads
第1圖是從上方觀看本發明之一實施形態的連接器的斜視圖。 Fig. 1 is a perspective view of a connector according to an embodiment of the present invention as seen from above.
第2圖是從下方觀看第1圖之連接器的斜視圖。 Fig. 2 is a perspective view of the connector of Fig. 1 viewed from below.
第3圖是第1圖及第2圖所示的連接器的剖面圖,(A)是端子位置、(B)是固定金屬配件位置的圖。 Fig. 3 is a cross-sectional view showing the connector shown in Fig. 1 and Fig. 2, wherein (A) is a terminal position and (B) is a position at which a metal fitting is fixed.
第4圖(A)是對應於端子所形成的凹槽部的放大斜視圖,(B)是凹槽部的放大剖面圖。 Fig. 4(A) is an enlarged perspective view of a groove portion formed corresponding to the terminal, and Fig. 4(B) is an enlarged cross-sectional view of the groove portion.
第5圖是對應於固定金屬配件所形成的凹槽部的放大斜視圖。 Fig. 5 is an enlarged perspective view corresponding to a groove portion formed by a fixing metal fitting.
第6圖是本發明之其他形態的凹槽部的斜視圖。 Fig. 6 is a perspective view showing a groove portion of another embodiment of the present invention.
第7圖是本發明之又其他形態的凹槽部的斜視圖。 Fig. 7 is a perspective view showing a groove portion of still another embodiment of the present invention.
1‧‧‧連接器 1‧‧‧Connector
11‧‧‧殼體 11‧‧‧Shell
12‧‧‧底壁 12‧‧‧ bottom wall
12A‧‧‧凹槽部 12A‧‧‧ Groove
12B‧‧‧凹槽部 12B‧‧‧ Groove
12C‧‧‧突條部 12C‧‧‧Bulge
20‧‧‧端子 20‧‧‧ terminals
24‧‧‧焊料連接部 24‧‧‧ solder joint
30‧‧‧固定金屬配件 30‧‧‧Fixed metal fittings
32‧‧‧焊料固定部 32‧‧‧ Solder fixing department
40‧‧‧可動構件 40‧‧‧ movable components
Claims (12)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2011079208A JP5349522B2 (en) | 2011-03-31 | 2011-03-31 | Electrical connector |
Publications (2)
Publication Number | Publication Date |
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TW201301668A true TW201301668A (en) | 2013-01-01 |
TWI500215B TWI500215B (en) | 2015-09-11 |
Family
ID=46993676
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW101109116A TWI500215B (en) | 2011-03-31 | 2012-03-16 | Electrical connector |
Country Status (4)
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JP (1) | JP5349522B2 (en) |
KR (1) | KR101463655B1 (en) |
CN (1) | CN102738636B (en) |
TW (1) | TWI500215B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10063024B2 (en) | 2015-06-01 | 2018-08-28 | Foxconn Interconnect Technology Limited | Electrical connector having improved insulative housing |
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Publication number | Priority date | Publication date | Assignee | Title |
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JP6526363B1 (en) * | 2018-06-28 | 2019-06-05 | 三菱電機株式会社 | Connector and electronic device system |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH01137072U (en) * | 1988-03-15 | 1989-09-19 | ||
JP2005327519A (en) * | 2004-05-13 | 2005-11-24 | Staf Corp | Electronic component, movable coaxial connector and electronic apparatus using it |
JP4215265B2 (en) * | 2006-04-28 | 2009-01-28 | ヒロセ電機株式会社 | Electrical connector for flat conductor and electrical connector with flat conductor |
TWM348354U (en) * | 2008-04-21 | 2009-01-01 | Hon Hai Prec Ind Co Ltd | Electrical card connector |
-
2011
- 2011-03-31 JP JP2011079208A patent/JP5349522B2/en not_active Expired - Fee Related
-
2012
- 2012-03-16 TW TW101109116A patent/TWI500215B/en not_active IP Right Cessation
- 2012-03-27 KR KR1020120031122A patent/KR101463655B1/en active IP Right Grant
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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US10063024B2 (en) | 2015-06-01 | 2018-08-28 | Foxconn Interconnect Technology Limited | Electrical connector having improved insulative housing |
Also Published As
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KR20120112107A (en) | 2012-10-11 |
KR101463655B1 (en) | 2014-11-19 |
JP5349522B2 (en) | 2013-11-20 |
JP2012216317A (en) | 2012-11-08 |
CN102738636A (en) | 2012-10-17 |
CN102738636B (en) | 2015-08-19 |
TWI500215B (en) | 2015-09-11 |
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