TW201300045A - Mist generator device and cosmetic device - Google Patents

Abstract

A beautifyng apparatus for face 10 has a water supply groove storing liquid, a heat source 21 heating liquid supplied from the water supply groove, a control device 30 controlling the heat source 21, and a casing 11 accommodating the heat source 21 and the control device 30, evaporating liquid into vapor by the heat source 21, and discharging vapor out of casing 11. The control device 30 includes a circuit substrate 32 having a first surface 32a facing the heat source 21 and a second surface 32b opposite to the first surface 32a. The circuit substrate 32 includes a plurality of components 50 disposed on the first surface 32a and the second surface 32b, wherein a highest component among the components 50 is disposed on the first surface 32a.

Description

Water vapor generating device and cosmetic device

The present invention relates to a water vapor generating device and a cosmetic device including the water vapor generating device.

Heretofore, the function of the apparatus described in Patent Document 1 as a water vapor generation device has been known, and a liquid such as water is vaporized to generate warm water vapor (also referred to as "steam"), and the warm water vapor is discharged.

In the water vapor generation device, as shown in FIG. 7, a liquid storage unit 100 that stores a liquid is provided, and the heating unit 101 such as a heat source of the liquid supplied from the liquid storage unit 100 is heated. Further, a control device 103 for controlling the heating unit 101 and the like is provided in the casing 102 constituting the water vapor device.

The control device 103 includes a circuit board 106. The circuit board 106 is disposed on the first surface 104 facing the heating unit 101, and the second surface 105 on the opposite side of the first surface 104 is disposed facing the inner surface of the casing 102. The components 110 of the capacitor, the resistor, the connector, and the like are provided on the second surface 105 of the circuit board 106 without considering the height of the component. Since the component 110 is inserted into the substrate and mounted on the circuit board 106, the first surface 104 is provided with solder joints for fixing the component 110 to the circuit board 106. Here, the term "height" means a length in a direction perpendicular to the mounting surface of the circuit board (that is, the first surface 104 or the second surface 105). In addition, the term “insertion of the substrate” refers to a component terminal that is inserted through a through hole provided in the circuit board, and is fixed to a surface opposite to the surface (for example, the first surface) provided by the component by solder (for example, The second method).

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2010-187764

However, in recent years, there has been a demand for a miniaturization of a cosmetic device having a water vapor generating device. However, when the circuit board 106 having the higher height is placed on the second surface 105, the following problems may occur. That is, as the size of the cosmetic device is reduced, the casing 102 is also miniaturized, and therefore it is necessary to shorten the distance between the circuit substrate 106 and the heating portion 101. Further, on the circuit board 106, a solder joint for fixing the component 110 to the circuit board 106 is provided on the first surface 104 of the opposing heating portion 101. Therefore, the solder joint is likely to be affected by the heat from the heating portion 101 due to the distance from the heating portion 101.

Further, in the case of a water vapor generating device including a heating unit such as a heat source, not only a device for generating warm water vapor but also a device for generating cold water vapor may cause such a problem. In the apparatus for generating cold water vapor, the liquid supplied from the liquid storage unit is sterilized by heating by the heating unit, and cold water vapor is generated by the sterilized liquid. When the distance between the heating portion for sterilization of the liquid and the circuit board is close to each other, the solder joint for fixing various components on the circuit board is easily affected by heat from the heating portion.

SUMMARY OF THE INVENTION An object of the present invention is to provide a water vapor generating device and a cosmetic device which can reduce the adverse effect of a heating portion on a solder joint for a fixed component on a circuit board.

In order to achieve the above object, the present invention is a water vapor generating device, which a liquid storage unit that stores a liquid, a heating unit that heats the liquid supplied from the liquid storage unit, a control device that controls the heating unit, and a housing that houses the heating unit and the control device, and vaporizes the liquid by the heating unit Forming water vapor to discharge the water vapor out of the casing, wherein the control device includes a circuit board having: a first surface facing the heating portion; and a second surface opposite to the first surface, the The circuit board includes a plurality of components mounted on the first surface and the second surface, and among the plurality of components, the highest height component is provided on the first surface.

As a result, it is possible to suppress an increase in temperature of the circuit board due to heat from the heating unit. Therefore, compared with the above-described prior case, since the solder joints for fixing the respective components on the circuit board can be disposed away from the heating portion, the adverse effect of the heating portion on the solder joint can be reduced.

According to the present invention, it is possible to reduce the adverse effect of the heating portion on the solder joint for fixing the component on the circuit board.

Hereinafter, an embodiment of the present invention in which a beauty device having a function of a beauty device of a water vapor generating device is embodied will be described with reference to Figs. 1 to 6 . In the following description, when the "front-rear direction", the "left-right direction", and the "up-and-down direction" are described, the direction indicated by the arrow in the figure is shown.

As shown in FIG. 1, the upper end of the warm jug-shaped casing 11 of the beauty device 10 is formed with an opening portion 12 that communicates with the inside and outside of the casing 11. An example of the vapor (also referred to as "warm water vapor") of the water vapor is discharged from the opening portion 12. In addition, a switch 13 is provided on the front side of the casing 11, and when the driving of the beauty device 10 is started or the driving is stopped, For the user to operate.

Further, as shown in FIGS. 1 and 2, a groove holding portion 15 is recessed in the rear side of the opening portion 12, and a water supply tank (liquid storage portion) 14 for storing a liquid such as water is detachably housed therein. A temporary retention portion 16 that temporarily retains water flowing out of the water supply tank 14 accommodated in the groove holding portion 15 is provided below the groove holding portion 15. The water supply flow path 18 for supplying water to the steam generating mechanism 17 disposed on the front side of the temporary retention portion 16 is extended forward from the lower portion of the temporary retention portion 16.

As shown in FIGS. 2 and 3, the steam generating mechanism 17 is provided with a heating chamber region 20, and a heat source 21 disposed on the left side of the heating chamber region 20 as a function of the heating portion. The lower portion of the heating chamber region 20 forms a communication path 22, and continues the downstream end 18a of the water supply flow path 18, and extends leftward from a communication portion with the downstream end 18a of the water supply flow path 18. The water flowing in the water supply passage 18 and the communication passage 22 flows into the heating chamber 23 formed between the heating chamber region 20 and the heat source 21.

The heat source 21 of the present embodiment generates heat by the supply of a drive current, and has a positive temperature coefficient (PTC) heat source of self-control function of heat generation. The heat source 21 has a flat plate shape, and the heating surface 21a of the heat source 21 faces the opposing portion 20a of the heating chamber region 20 via the heating chamber 23. The water flowing into the heating chamber 23 is heated by the heat source 21.

The vapor flow path 24 for discharging the water (i.e., vapor) boiling in the heating chamber 23 from the outside of the heating chamber 23 is extended to the right from the upper end portion of the heating chamber 23. The downstream end (right end) of the vapor flow path 24 is connected to the return flow path 25, and is connected to a communication portion between the communication path 22 located below the vapor flow path 24 and the water supply flow path 18. The return flow path 25 is extended in the vertical direction, and the water that has become liquid at the time of the downstream end of the vapor flow path 24 is returned via the return flow path 25 Go to the communication road 22.

Further, a discharge portion 26 is provided on the upper side of the downstream end of the vapor flow path 24, and the vapor supplied from the vapor flow path 24 is refined by discharge or metal fine particles (for example, platinum) are generated. The discharge portion 26 includes a pair of first electrode portions 26a having an elongated columnar shape. The two first electrode portions 26a are respectively disposed to face their tips. Further, between the two first electrode portions 26a, an elongated cylindrical second electrode portion 26b disposed in the vertical direction is provided. The second electrode portion 26b is made of a metal member containing platinum. By discharging between the second electrode portion 26b and the first electrode portion 26a, the vapor supplied into the discharge portion 26 is made fine, and metal fine particles are generated. Thereafter, the vapor (and the metal fine particles) that has passed through the discharge portion 26 are discharged outside the casing 11 through the discharge portion 27 disposed above the discharge portion 26 and the opening portion 12 of the casing 11.

Further, as shown in FIG. 3, a control device 30 for controlling the beauty device 10 is provided on the right side in the casing 11. The control device 30 is disposed to face the heating surface 21a of the heat source 21 via the heating chamber region 20.

The control device 30 of the present embodiment includes a circuit board 32 on which a plurality of types of components 50 (50A, 50B) are mounted, and a housing case 40 that houses the circuit board 32. In the housing case 40, the circuit board 32 has a first surface 32a that faces the heating surface 21a of the heat source 21, and a second surface 32b that is located on the opposite side of the first surface 32a. That is, in the present embodiment, the circuit board 32 is disposed such that its thickness direction coincides with the left-right direction.

The storage case 40 includes a plurality of (two in the present embodiment) divided boxes 41 and 42 which are arranged in the left-right direction. Each of the divided casings 41 and 42 is made of a material having excellent heat resistance such as polycarbonate (PC) or acrylonitrile butadiene styrene (ABS) resin. Among the divided boxes 41 and 42, the first point is placed close to the position of the heat source 21 The cutting case 41 has a bottomed slightly rectangular tube shape, and includes a first bottom wall portion 41a and a rectangular tubular first tubular portion 41b located on the right side of the first bottom wall portion 41a. The front end 41c (i.e., the right end) of the first cylindrical portion 41b is located on the right side (i.e., the side away from the heat source 21) indicating the center line L1 of the center in the left-right direction of the storage case 40. Further, on the outer side surface of the first cylindrical portion 41b, an engaging convex portion 41d that protrudes outward is formed in the vicinity of the distal end 41c.

Further, the first bottom wall portion 41a is located at a position where the inside of the casing 11 is divided into a field in which the heat source 21 is disposed and in the field in which the circuit board 32 is disposed. That is, the first bottom wall portion 41a is located between the heat source 21 and the circuit substrate 32. Therefore, in the present embodiment, the first bottom wall portion 41a of the first divided case 41 serves as a function of the partition.

On the other hand, among the divided casings 41 and 42, the second divided casing (specific divided casing) 42 disposed at the position farthest from the heat source 21 has a shape of a bottomed slightly rectangular cylinder. Specifically, the second divided case 42 has a second bottom wall portion 42a that faces the second surface 32b of the circuit board 32, and a rectangular tubular portion 42b that is located on the left side of the second bottom wall portion 42a. This second cylindrical portion 42b is formed such that its inner side faces the outer side surface of the first cylindrical portion 41b. Further, the inner side surface of the second cylindrical portion 42b is formed with an engaging hook portion 42c that engages with the engaging convex portion 41d formed on the outer surface of the first cylindrical portion 41d. When the engaging hook portion 42c is engaged with the engaging convex portion 41d of the first divided casing 41, the space 43 in which the circuit board 32 is housed is almost sealed by the divided casings 41 and 42. Further, the front end of the second cylindrical portion 42b of the second divided casing 42 assembled to the first divided casing 41 is located on the right side of the center line L1 (away from the heat source 21).

Further, the second divided case 42 supports the circuit board 32. For example, the circuit board 32 is fitted into the second cylindrical portion 42b of the second divided case 42. Such as Accordingly, the first surface 32a of the circuit board 32 supported by the second divided case 42 is separated from the first bottom wall portion 41a of the first divided case 41. Further, a gap 44 is formed between the front end (ie, the left end) of each of the components 50A (50) provided on the first surface 32a of the circuit board 32 and the first bottom wall portion 41a.

Similarly, the second surface 32b of the circuit board 32 is separated from the second bottom wall portion 42a of the second divided case 42. Further, a gap 45 is formed between the front end (ie, the right end) of each of the components 50B (50) provided on the second surface 32b of the circuit board 32 and the second bottom wall portion 42a.

Next, a circuit board 32 of this embodiment will be described with reference to Figs. 4 to 6 .

As shown in FIG. 4, the two faces 32a, 32b of the circuit board 32 are provided with two parts 50A, 50B (50), respectively. In the following description, among the various components 50, the component provided on the first surface 32a is referred to as "first component 50A", and the component provided on the second surface 32b is referred to as "second component 50B".

As shown in FIGS. 4 and 5, the first surface 32a is provided with a plurality of first parts 50A including the highest height parts of all the parts 50 mounted on the circuit board 32. The first part 50A includes electronic parts such as capacitors and connectors. Further, all of the first components 50A are mounted on the circuit board 32 and inserted into the substrate. That is, a part of the first part 50A is inserted into the circuit board 32, whereby the first part 50A is mounted on the circuit board 32. Therefore, the first surface 32a is not provided with a solder joint for fixing the first component 50A to the circuit board 32. In the present embodiment, the "height" indicates the length of the component in the direction perpendicular to the mounting surface (the first surface 32a and the second surface 32b) of the circuit board 32 (that is, the left-right direction).

On the other hand, in the second surface 32b, as shown in FIGS. 4 and 6, the entire surface 50 of the circuit board 32 is provided, which is smaller than the first part 50A. The second part 50B is of low height. The second component 50B includes, for example, a resistance of a heat generating component that generates heat by itself due to the flow of current. Further, when the microcomputer is mounted on the circuit board 32, it is preferable that the microcomputer serving as the heat generating component is provided on the second surface 32b of the circuit board 32. That is, the microcomputer is preferably included in the second part 50B. In this manner, all of the second components 50B are mounted on the surface of the circuit board 32 (also referred to as "surface mounting"). For example, the resistance of one example of the second part 50B is a wafer resistance. Further, in the present embodiment, in order to avoid the heat source 21, all the resistors mounted on the circuit board 32 are provided on the second surface 32b of the circuit board 32.

Next, the influence of the heat generated by the heat source 21 on the circuit board 32 will be described.

First, the heat generated by the heat source 21 is transmitted to the storage case 40 via air or the like interposed between the heat source 21 and the control device 30. At this time, in the storage case 40, the first bottom wall portion 41a of the first divided case 41 closest to the heat source 21 has the highest temperature. Then, due to the heat of the first bottom wall portion 41a, the heat is gradually transmitted to the first cylindrical portion 41b, the second cylindrical portion 42b, and the second bottom wall portion 42a. In the present embodiment, the circuit board 32 housed in the housing case 40 is supported by the second tube portion 42b. Therefore, a part of the heat of the second cylindrical portion 42b that is heated is transmitted to the circuit board 32.

Here, a method of supporting the circuit substrate 32 instead of the second cylindrical portion 42b by the first cylindrical portion 41b is considered. At this time, a part of the heat that is heated by the first cylindrical portion 41b is transmitted to the circuit board 32. The first cylindrical portion 41b is connected to the heat transmission path from the heat source 21, and is located on the upstream side of the second cylindrical portion 42b. Therefore, the amount of heat received by the first tubular portion 41b is larger than that of the second tubular portion 42b, and as a result, the temperature of the circuit board 32 is likely to rise. In this regard, the circuit board 32 in the present embodiment is supported by the second cylindrical portion 42b. Therefore, the circuit substrate can be reduced as compared with the case where the circuit board 32 is supported by the first cylindrical portion 41b. The heat received by 32 suppresses the temperature rise of the circuit board 32.

Further, in the present embodiment, the components having the highest height are provided in the respective components 50 of the circuit board 32, and the components having the highest height are provided on the first surface 32a of the circuit board 32. Therefore, the distance between the heat source 21 and the circuit board 32 becomes longer than the previous case where all the components are provided on the second surface 32b of the circuit board 32, and the temperature rise of the circuit board 32 can be suppressed.

Further, the first surface 32a of the circuit board 32 is located at a position farther from the heat source 21 than the center line L1 indicating the center in the left-right direction of the storage case 40. Further, the first surface 32a and the first component 50A are away from the first bottom wall portion 41a of the highest temperature among the storage boxes 40. That is, heat is transmitted to the circuit board 32 and the first part 50A via the air interposed between the circuit board 32 and the first component 50A and the first bottom wall portion 41a, but the heat is not from the first bottom wall portion. 41a communicates directly. Therefore, the temperature rise of the circuit board 32 and the first component 50A can be suppressed.

Further, the component 50 mounted on the circuit board 32 includes a heat generating component (for example, a resistor) that generates heat by itself due to power supply. In the present embodiment, such a heat generating component is included in the second component 50B and is provided on the second surface 32b. That is, the heat generating component is not opposed to the heat source 12. Therefore, compared with the case where the heat generating component is provided on the first surface 32a, it is possible to suppress an excessive rise in the temperature of the heat generating component.

In the circuit board 32, the temperature rise and the temperature change are the weakest in the solder joint used when the component 50 is fixed to the circuit board 32. In the present embodiment, the first component 50A is inserted into the substrate and mounted on the circuit board 32, and the second component 50B is mounted on the circuit board 32. That is, the first face 32a is not provided with a solder joint. Therefore, the stress applied to the solder joint can be reduced as compared with the case where the solder joint is provided on the first surface 32a.

As described above, in the present embodiment, the effects shown below can be obtained.

(1) Among all the components 50 of the circuit board 32, the highest height component is included in the first component 50A, and is provided on the first surface 32a. Therefore, the circuit board 32 can be disposed at a position away from the heat source 21 as compared with the case where all the parts are provided on the second surface. As a result, it is possible to suppress an increase in temperature of the circuit board 32 due to heat from the heat source 21. Therefore, compared with the above-described prior case, since the solder joints for fixing the respective components 50 (50A, 50B) on the circuit board 32 can be disposed away from the heat source 21, the adverse effect of the heat source 21 on the solder joints 21 can be reduced.

(2) Further, each of the first components 50A provided on the first surface 32a is inserted into the substrate and mounted on the circuit board 32. That is, the pads for fixing the first component 50A to the circuit board 32 are provided on the second surface 32b. Therefore, compared with the case where the surface of the first component 50A is mounted on the circuit board 32, since the solder joint for fixing the first component 50A to the circuit substrate 32 is not opposed to the heat source 21, the solder joint can be lowered. Applied stress.

(3) Further, the surface of each of the second members 50B provided on the second surface 32b is mounted on the circuit board 32. Therefore, compared with the case where the second component 50B is inserted into the substrate and mounted on the circuit board 32, since the solder joint for fixing the second component 50B to the circuit board 32 is not opposed to the heat source 21, the The stress applied by the solder joint.

(4) In the present embodiment, a heat generating component such as a resistor that generates heat by power supply is provided on the second surface 32b of the non-opposing heat source 21. Therefore, compared with the case where the heat generating component is provided on the first surface 32a, it is possible to suppress an excessive rise in the temperature of the heat generating component.

(5) The first bottom wall portion 41a of the storage case 40 is disposed between the field in which the heat source 21 is disposed in the casing 11 and the area in which the circuit board 32 is disposed. therefore, The heat generated by the heat source 21 can be hardly transmitted to the circuit board 32, and the temperature rise of the circuit board 32 can be suppressed, compared with the case where the first bottom wall portion 41a is not provided between the respective fields.

(6) Further, the first surface 32a of the circuit board 32 is separated from the first bottom wall portion 41a. Therefore, compared with the case where the first surface 32a is in direct contact with the first bottom wall portion 41a, the heat of the first bottom wall portion 41a can be hardly transmitted to the circuit board 32, and the temperature rise of the circuit board 32 can be suppressed.

(7) Further, the front end of the first component 50A provided on the first surface 32a is separated from the first bottom wall portion 41a. Therefore, the circuit board 32 can be disposed apart from the first bottom wall portion 41a as compared with the case where the front end of the first component 50A contacts the first bottom wall portion 41a. As a result, the air layer between the first bottom wall portion 41a and the first surface 32a of the circuit board 32 can be thickened, so that the temperature rise of the circuit board 32 can be suppressed.

(8) The circuit board 32 of the present embodiment is housed in a slightly sealed space 43 formed by the storage case 40. Therefore, the waterproofness of the circuit board 32 can be improved.

(9) The circuit board 32 is supported by the second divided case 42 located farthest from the heat source 21 among the divided bodies 41 and 42 constituting the storage case 40. Therefore, compared with the case where the circuit board 32 is supported by the first divided case 41, heat is hard to be transmitted to the circuit board 32, and the temperature rise of the circuit board 32 can be suppressed.

(10) The first surface 32a of the circuit board 32 is located farther from the heat source 21 than the center in the left-right direction of the housing case 40. Therefore, compared with the case where the first surface 32a is located closer to the heat source 21 than the center in the left-right direction of the storage case 40, the air layer between the first bottom wall portion 41a and the circuit substrate 32 can be thickened, thereby suppressing The temperature of the circuit board 32 rises.

(11) Further, among the divided boxes 41 and 42, the thickness of the first divided case 41 which is closer to the position of the heat source 21 than the second divided case 42 of the support circuit board 32 is thicker than that of the second divided case 42. . That is, the heat capacity of the first divided case 41 is larger than the heat capacity of the second divided case 42. Therefore, compared with the case where the heat capacity of the first divided case 41 is equal to or smaller than the heat capacity of the second divided case 42, the amount of heat transmitted from the first divided case 41 to the second divided case 42 is small. As a result, the amount of heat transmitted to the circuit board 32 supported by the second divided case 42 is reduced, and the temperature rise of the circuit board 32 can be suppressed.

(12) Further, in the present embodiment, the second component 50B provided on the second surface 32b does not contact the second bottom wall portion 42a. Therefore, it is difficult to transmit heat from the second divided case 42 to the circuit board 32 as compared with the case where the second part 50B contacts the second bottom wall portion 42a. As a result, the temperature rise of the circuit board 32 can be suppressed.

Further, this embodiment can be changed to other embodiments as shown below.

In the ̇ implementation, the second split case 42 may also support the circuit board 32 so that the front end of at least one of the second parts 50B contacts the second bottom wall portion 42a.

In the ̇ implementation, the second divided case 42 may support the circuit board 32 via the heat insulating member.

In the ̇ implementation, when the circuit board 32 is supported by the second divided case 42, the first surface 32a may be disposed at a position closer to the heat source 21 than the center of the storage case 40 in the left-right direction. At this time, the second divided case 42 can also support the circuit substrate 32 by the support mechanism.

In the ̇ implementation, the length (ie, the thickness) of the second divided case 42 in the left-right direction may also be the length in the left-right direction of the first divided case 41. (ie thickness) above the length.

In the ̇ implementation, when the first surface 32a of the circuit board 32 is located farther from the heat source 21 than the center line L1, the circuit board 32 can be supported by the first divided box 41.

In the ̇ implementation, the sheet having a higher heat-dissipating property than the members constituting the divided case may be interposed between the abutting portions of the divided cases 41 and 42.

In the ̇ implementation, the storage case 40 may be constituted by three or more arbitrary number of divided cassettes arranged in the left-right direction. At this time, among the divided casings, the divided casing disposed closest to the position of the heat source 21 and the divided casing disposed outside the divided casing farthest from the heat source 21 may be used as the specific division of the support circuit board 32. Box. Even in such a configuration, the temperature rise of the circuit board 32 can be suppressed as compared with the case where the circuit board 32 is supported by the divided case disposed closest to the position of the heat source 21.

In the ̇ implementation type, a material (for example, metal) having electromagnetic shielding properties may be coated on the storage case 40. At this time, it is possible to suppress electromagnetic waves generated by the electronic components mounted on the circuit board 32 housed in the storage case 40 from leaking out of the storage case 40.

In the ̇ implementation, the circuit board 32 may be placed in the storage case 40, and the front end of at least one of the first components 50A may be in contact with the first bottom wall portion 41a.

In the ̇ implementation, the circuit board 32 may be disposed in the storage case 40, and the first surface 32a may be in contact with the first bottom wall portion 41a. At this time, it is preferable that the first bottom wall portion 41a is provided with a through hole that protrudes the first component 50A toward the outside of the housing case 40.

In the ̇ implementation type, the partition for providing the heat source 21 and the field in which the circuit board 32 is provided may be different from the storage box 40. Settings. The partition at this time may be a partition plate having a flat shape. Further, in the case where such a partition plate is provided, the storage case 40 that houses the circuit board 32 may not be provided.

In the ̇ implementation type, a partition for distinguishing the area in which the heat source 21 is provided and the field in which the circuit board 32 is provided may not be provided.

In the ̇ embodiment, at least one of the second members 50B provided on the second surface 32b may be a component that is mounted on the circuit board 32 by inserting a substrate. For example, the resistance provided on the second surface 32b may not be limited to the wafer resistance.

In the ̇ implementation, at least one of the resistors mounted on the circuit board 32 may be provided on the first surface 32a. At this time, the electric resistance provided on the first surface 32a is preferably an electric resistance which can be mounted on the circuit board 32 by inserting the substrate.

In the ̇ implementation, all the components 50 mounted on the circuit board 32 may be provided on the first surface 32a.

In the ̇ implementation, only the highest height of each of the components 50 may be provided on the first surface 32a, and other components may be provided on the second surface 32b.

In the ̇ implementation, the liquid supplied from the water supply tank 14 may be any liquid other than water. The liquid may be exemplified by alkaline ionized water, water containing a cosmetic liquid, electrolyzed water, and water containing a fragrance.

The water vapor generating device of the present invention can also be embodied as a device capable of generating cold water vapor in a heating portion having a heating liquid. In the apparatus for generating cold water vapor, the liquid supplied from the liquid storage unit is sterilized by heating by the heating unit, and cold water vapor is generated from the sterilized liquid. Further, cold water vapor can be generated by a method using a venturi effect or a method using ultrasonic waves or the like.

In addition, the water vapor generating device may also be a device that can be produced by both steam and cold water vapor.

The water vapor generating device of the present invention can also be embodied as a beauty device 10 Any device other than (for example, a water vapor blower, a humidifier, etc.).

10‧‧‧ Beauty device

11‧‧‧Shell

12‧‧‧ openings

13‧‧‧ switch

14‧‧‧Water supply tank (liquid storage unit)

15‧‧‧Slot retention department

16‧‧‧ Temporary Retention Department

17‧‧‧Vapor generating agency

18‧‧‧Water supply flow path

18a‧‧‧ downstream end

20‧‧‧heating room area

20a‧‧‧ opposite department

21‧‧‧heat source

21a‧‧‧ heating surface

22‧‧‧Connected Road

23‧‧‧heating room

24‧‧‧Vapor flow path

25‧‧‧ return flow path

26‧‧‧Discharge Department

26a‧‧‧First electrode section

26b‧‧‧Second electrode section

27‧‧‧Exporting Department

30‧‧‧Control device

32‧‧‧ circuit board

32a‧‧‧ first side

32b‧‧‧ second side

40‧‧‧ Containment box

41‧‧‧First split box

41a‧‧‧First bottom wall

41b‧‧‧First tube

41c‧‧‧ front end

41d‧‧‧Clamping convex parts

42‧‧‧Second split box

42a‧‧‧Second bottom wall

42b‧‧‧Second barrel

42c‧‧‧Card hook

43‧‧‧ accommodating space

44‧‧‧ gap

45‧‧‧ gap

50‧‧‧ parts

50A‧‧‧ first part

50B‧‧‧Second part

100‧‧‧Liquid Storage Department

101‧‧‧ heating department

102‧‧‧ housing

103‧‧‧Control device

104‧‧‧ first side

105‧‧‧ second side

106‧‧‧Circuit board

110‧‧‧ parts

Fig. 1 is a perspective view showing a beauty device of an embodiment of a cosmetic device including a water vapor generating device of the present invention.

Figure 2 is a cross-sectional view showing the beauty device.

Figure 3 is a cross-sectional view showing the beauty device.

4 is a side view of a circuit board provided on a beauty device.

Fig. 5 is a plan view showing a second surface of the circuit board.

Fig. 6 is a plan view showing a first surface of a circuit board.

Figure 7 is a cross-sectional view showing a prior water vapor generating device.

10‧‧‧ Beauty device

11‧‧‧Shell

17‧‧‧Vapor generating agency

18‧‧‧Water supply flow path

20‧‧‧heating room area

20a‧‧‧ opposite department

21‧‧‧heat source

21a‧‧‧ heating surface

22‧‧‧Connected Road

23‧‧‧heating room

24‧‧‧Vapor flow path

25‧‧‧ return flow path

26‧‧‧Discharge Department

26a‧‧‧First electrode section

26b‧‧‧Second electrode section

27‧‧‧Exporting Department

30‧‧‧Control device

32‧‧‧ circuit board

32a‧‧‧ first side

32b‧‧‧ second side

40‧‧‧ Containment box

41‧‧‧First split box

41a‧‧‧First bottom wall

41b‧‧‧First tube

41c‧‧‧ front end

41d‧‧‧Clamping convex parts

42‧‧‧Second split box

42a‧‧‧Second bottom wall

42b‧‧‧Second barrel

42c‧‧‧Card hook

43‧‧‧ accommodating space

44‧‧‧ gap

45‧‧‧ gap

50‧‧‧ parts

50A‧‧‧ first part

50B‧‧‧Second part

Claims (14)

A water vapor generating device comprising: a liquid storage portion for storing a liquid; a heating portion for heating the liquid supplied from the liquid storage portion; a control device for controlling the heating portion; and a casing for housing the heating portion and the control device The liquid is vaporized by the heating portion to generate water vapor, and the water vapor is discharged outside the casing, wherein the control device includes a circuit substrate, the circuit substrate has a first surface facing the heating portion, and the first portion On the second surface opposite to the other side, the circuit board includes a plurality of components mounted on the first surface and the second surface, and among the plurality of components, the highest height component is disposed on the first surface. The water vapor generating device according to claim 1, wherein the component provided on the first surface of the circuit board is mounted by inserting a part of the component into the circuit board. The water vapor generating device according to claim 1 or 2, wherein the surface of the component provided on the second surface of the circuit board is mounted on the circuit board. The water vapor generating device according to claim 1 or 2, wherein the component provided on the second surface of the circuit substrate comprises electricity An electronic component that is supplied with heat. The water vapor generating device according to claim 4, wherein the electronic component that generates heat by the power supply includes a chip resistor. The water vapor generating device according to claim 1 or 2, further comprising: a partitioning portion that divides the inside of the casing into: a field in which the heating portion is provided; and a field in which the circuit substrate is provided, the circuit board is The first surface of the circuit board is spaced apart from the partition. The water vapor generating device according to claim 6, wherein the partition portion is disposed such that a space is formed between a tip end of the component provided on the first surface of the circuit board and the partition portion. The water vapor generating device according to claim 6, wherein the control device further includes a housing case for housing the circuit board, wherein the storage box is located between the circuit board and the heating unit, and includes the function as the partition portion part. The water vapor generating device according to claim 8, wherein the storage case includes a plurality of divided boxes arranged along a thickness direction of the circuit board, and the circuit board is supported by the plurality of divided boxes. A specific divided box other than the divided case closest to the position of the aforementioned heating portion. The water vapor generating device according to claim 9, wherein the specific divided casing is disposed at a position farthest from the heating portion among the plurality of divided casings. The water vapor generating device according to claim 9, wherein the specific divided box body is disposed at a position farther from the heating portion than a center of the storage case in the thickness direction. The water vapor generating device according to claim 9, wherein the length of the specific divided casing in the thickness direction is shorter than the length in the thickness direction of the other divided casings other than the specific divided casing. The water vapor generating device according to claim 8, wherein the first surface of the circuit board is located in a thickness direction of the circuit board, and is further away from a position of the heating portion than a center of the storage case. A cosmetic device comprising the water vapor generating device according to claim 1 or 2.