201245274 六、發明說明： 【發明所屬之技術領域】 本發明係關於/一種薄板收納搬送容器用之芳香族聚碳酸 酯樹脂組成物，其係使用於用以收納或搬運加工成磁碟^ 體電路晶片的晶圓等者。進-步詳細言之，係關於—種薄板收 納搬送容器用之樹脂組成物，其成形時之脫模性 releasability)優異、且在半導體晶圓或磁碟之表面污染 制金屬原子及揮發性氣體之發生至未致障礙之程度。、 【先前技術】 一般用以收納搬運對晶圓或磁碟等對表面污染敏感的薄 板之容器，能經常保持晶圓表面清淨來輸送是重要的。/ 因此合成樹脂’例如：來自聚丙烯、聚乙烯、丙烯腈.丁 二烯•苯乙烯、聚縮醛等之通用樹脂，係以聚醯胺、聚對苯二 :酸丁二醇酯、聚碳酸酯、聚砜、氟系樹脂、液晶聚合物、聚 苯硫、聚醚砜、聚醚酮等之高功能或超高功能樹脂材料所成 形。其中均勻的機械物性、成形性、利用約〇9之比重的輕量 f生，再加上儘管在合成樹脂之中仍可大量生產，價格上有利的 經濟性等，基於各式各樣的觀點，由於總合的成本效益(⑺贫 performance)良好，故在先前係使用聚丙烯樹脂(專利文獻u。 但是’將聚丙稀作為基本材料’添加各種之添加劑，使晶 圓收納搬送容器成形之情形，會自該容器使有機物或離子性雜 質漏出，並有污染半導體晶圓之虞。又，聚丙烯因表面硬度比 較低，故將半導體晶圓自容器取出放進時等，該等互相接觸並 摩擦時，則發生微粒，而有造成半導體晶圓污染之虞。 又，揭示一種矽晶圓容器，其係由規定進行特定熱處理時 揮發氣體之量’與在水中溶離之驗金屬之量的聚酯樹脂所構成 (專利文獻2)。此等聚酯樹脂雖可防止某一程度的矽晶圓之污 染，但仍然不夠，而且，就連在供應容器強度之面也不能稱得 上足夠。 Λ 201245274 對^容器至晶圓表面之污染的要求隨著近來 之大口徑化而更趨嚴格，同時已尋求古 出 :僅晶圓，縱使關於磁碟收納搬送容器:有‘樣之:求接J年 樹作為主成分之 者=可能性的所有雜f成分自材料悔u id。i是，將對石夕晶圓等馳造成影響的雜質種類 t以抑制至無實質性損害的程度。而且，應該 庫\音=^在加熱時，於揮發成分贼時所酬之物中， ϋί成》為何，接著是關於作為目的材料的揮發量要減到 ㈣ϊί 「自聚碳_樹脂或者將聚碳_作為材料之 ^形°°漏出的有機物或無機雜質之種類」與「晶圓表面之污染 無明確的資訊’要就成形材料進行最適之選擇 在現在疋處在極端困難的狀態。 π 文獻3及專利文獻4 ’揭示—種薄板收納搬 送今器’其係由減低了特定雜質量的聚碳酸賴脂所形成。 5，係揭示一種氣離子，其係存在於組裝為薄 板收納搬送谷器之被收納物的石夕晶圓等，或者因已加工之物產 ii=iammction)之原因，而自聚碳酸醋樹脂製之收納 f ί、?揮的氣離子。又，藉蚊用含絲碳_樹脂與環 氧匕σ物的樹脂組成物作為精密構件收納容器之基材，則可捕 捉該氣離子。 、但是’該等發明’就防止被收納物之污染，雖可確認效果， 卻就成形時之生產性改善尚無定論。 最近’伴隨半導體晶圓之大口徑化，亦進行薄板收納搬送 =大型化。但是由保f場所、物流f用、_原材料費等 點觀之’較佳為避免超出必要之大型化，並將容器之拔模角 4 201245274 (draft angle)設計成盡可能的小。成形品越大型化，且拔模 小，則成形品在脫模時之脫模負荷變大。由於此種理由， 來有根據材料尋求高脫模性的傾向。 '^卞 此外’以糊讀5所揭紅添加於料_旨樹脂組 的環乳化合物而言’基本上將其視為可適聽 之物的全部。在環氧化合物之中，如職化大豆油 麻仁油，以作為塑化劑為人所熟知，藉由將其添加，則亦可 待有生產性的改善。但是’細料環氧化合物 ，形品因界限應力降低，故要添加至如薄板收納^容文西器曰$ 關 且ΐΐ的形狀’且殘留應力比較大的成形品之原料，則誘 ^成形品龜裂發生之可能性極高，反而很可能與生產性降低有 (專利文獻1)曰本特開平08_250581號公報 (專利文獻2)曰本特開平1〇_116889號公報 (專利文獻3)日本專利第3995346號公報 (專利文獻4)日本特開2〇1〇_275465號公報 (專利文獻5)日本專利第3282584號公報 【發明内容】 祕本：係提供—種薄減驗送容11狀樹脂組 Ϊ Λ f污綠感的轉體晶，磁碟等之薄板 表面5米，且成形時之脫模性優異之物。 範牿首先雜芳香族聚碳酸酯樹脂組成物，規 化學結構的脫模劑，而可達成上述目的，完成本|明具有 亦即，根據本發明，係提供： 有：1.-種薄板收納搬送容器用樹脂組絲，該樹脂組成物含 [I] 100重量份芳香族聚碳酸g旨樹脂；及 5 201245274 [II] 0.01至0.5重量份(B重量份)之酯化合物類，係由多元 醇及咼級脂肪酸所構成，其平均I旨化度(A%)為全醋之至 99%， 其中該樹脂組成物之特徵為滿足下列條件： W氣原子含量為5ppm以下、 (ii) 四氯化碳含量為3ppm以下、 (iii) %_數為6至18之齡化合物合計含量為4〇ppm以下、 (iv) 納及鐵原子之含量合計為〇jppm以下、且 (v) 下述式(1) 0.1 ^(100-Α)χΒ^ 1〇.〇 ⑴。 又根據本發明’係提供一種提高薄板收納搬送容器成形時 之脫模性(moldreleasability)之方法，該方法包含下列各步驟： (i) 準備成形材料； (ii) 使成形材料在鎮模内成形，獲得薄板收納搬送容器， 其中成形材料係含有下列之樹脂組成物： [I] 100重量份芳香族聚碳酸酯樹脂；及 [II] 0.01至0.5重量份(B重量份)之酯化合物類，係由多元 醇及高級脂肪酸所構成，其平均酯化度(A%)為全酯之30至 99%， 其中該樹脂組成物之特徵為使用滿足下列條件之樹脂組 成物： (0氣原子含量為5ppm以下、 (ii)四氣化碳含量為3ppm以下、 (in)碳數為6至18之紛化合物，合計含量為40ppm以下、 (iv) 納及鐵原子含量合計為〇 ippm以下、且 (v) 下述式(1) 0.1 ^(100-A)xB^ 1〇.〇 (1)。 【實施方式】 (芳香族聚碳酸酯樹脂） 201245274 、本發明所使用之芳香族聚碳酸酯樹脂，係以溶液法或熔融 法’使二元酚與碳酸酯先質反應所得之物。在此所使用之二元 酚之代表例而言，可例示為：2,2-雙(4-羥苯基)丙烷(通稱雙酚 A)、卞4·經苯基)甲燒、雙(4_經苯基)乙烧、U-雙(4-經苯 基)環己院二2,2-雙(4_羥基_3,5_二甲基苯基)丙院、2,2_雙(4_羥基 ，5_二漠苯基)丙院、2,2_雙(4-經基_3·甲基苯基)丙烧、雙(4-經 笨基)醚、4,4-二羥二苯基、雙(4_羥苯基)硫化物、雙(4_羥苯基） 硬等。$佳之二元酚為雙(4_經苯基)烷類，其中特佳為雙酚A。 以反酉夂酉曰先質而吕，可使用幾基鹵、碳酸西旨(carb〇nate ester) 或i甲酸自旨等，具體言之可示m碳酸二苯喊二元紛 之二_曱酸酯等。 在，由溶液法或熔融法，使上述二元酚與碳酸酯先質反應 來製造芳香族聚碳酸酯樹脂時，二元酚可單獨使用，或使用二 種以上’亦可依照需要，使用觸媒、封端劑、二元酚之抗氧化 j等。又，芳香族聚碳酸酯樹脂可為使三官能以上之多官能性 芳香族化合物經共聚的分支聚碳酸酯樹脂、芳香族或脂肪族， 較佳為：將碳數為8以上之芳香族或脂肪族之二官能性羧酸經 共聚的聚酯碳酸酯樹脂，進一步亦可為二種以上芳香族聚碳酸 酯樹脂之混合物。 、a在本發明，特別適合使用溶液法，此等溶液法所致反應， 通常為二7G酚與光氣之反應，並在酸結合劑及有機溶劑之存在 下予以反應。以酸結合劑而言，可使用例如：氫氧化鈉、氫氧 ^卸等之驗金屬氫氧化物或辦等之胺化合物。財機溶劑而 言，可使用例如：二氯甲烷、氯苯等之鹵化烴。又，為了促進 反應，亦可使用例如：三級胺或四級録鹽等之觸媒。 應溫度通常為〇至贼，反應時間為數分鐘至m時右反 又’此等聚合反應’可使用單官能盼類作為封端劑。以 官能酚類作為封端劑，一般係使用於分子量之調節，又所得之 聚碳酸酯樹脂，因係依據末端係單官能酚類為主之基團而 鏈，故相較於非此類型之物，熱穩定性優異。以此等單官能酚 7 201245274 類來說’一般而言，係酚或低級烷基取代酴，其可以下述式⑴ 所代表的之單官能酚類來表示。201245274 VI. [Technical Field] The present invention relates to an aromatic polycarbonate resin composition for a thin plate storage and transport container, which is used for storage or handling into a magnetic disk circuit. Wafer wafers, etc. Further, the resin composition for a thin-plate storage and transport container is excellent in mold release releasability during molding, and is contaminated with metal atoms and volatile gases on the surface of a semiconductor wafer or a disk. It happened to the extent that it did not cause obstacles. [Prior Art] It is generally important to store a container that transports a sheet that is sensitive to surface contamination such as wafers or disks, and it is important to keep the surface of the wafer clean and transport. / Therefore synthetic resin 'for example: general-purpose resin from polypropylene, polyethylene, acrylonitrile, butadiene, styrene, polyacetal, etc., is polyamine, polyparaphenylene: butylene glycol, poly High-functionality or ultra-high-performance resin materials such as carbonate, polysulfone, fluorine-based resin, liquid crystal polymer, polyphenylene sulfide, polyethersulfone, and polyetherketone are formed. Among them, uniform mechanical properties, formability, and light weight of about 〇9, combined with mass production in synthetic resin, favorable economics in price, etc., based on various viewpoints Because the cost-effectiveness of the total ((7) poor performance) is good, polypropylene resin was used in the past (Patent Document u. However, the addition of various additives to the use of polypropylene as a basic material to shape the wafer storage container) The organic substance or ionic impurities may leak from the container and contaminate the semiconductor wafer. Moreover, since the surface hardness of the polypropylene is relatively low, when the semiconductor wafer is taken out from the container, etc., the contacts are in contact with each other. When rubbing, particles are generated, which causes contamination of the semiconductor wafer. Further, a crucible wafer container is disclosed which is defined by the amount of the volatile gas specified in the specific heat treatment and the amount of the metal which is dissolved in water. It is composed of an ester resin (Patent Document 2). Although these polyester resins can prevent a certain degree of contamination of the silicon wafer, they are still insufficient, and even in the supply container. The surface of the degree can not be said to be sufficient. Λ 201245274 The requirements for contamination of the container to the wafer surface have become stricter with the recent large diameter, and have been sought out: only wafers, even with regard to disk storage Transfer container: There is a kind of sample: the J-year tree is the main component = all the mis-components of the possibility are from the material regret u id. i is the impurity type t that will affect the Shi Xi wafer. It is suppressed to the extent of no substantial damage. Moreover, it should be reduced to (4) 库 挥发 库 成 ^ ^ 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在"Self-polycarbon_resin or the type of organic or inorganic impurities that leaks polycarbon_ as a material" and "no clear information on the contamination of the wafer surface" is the best choice for forming materials. It is in an extremely difficult state. π Document 3 and Patent Document 4 'Disclosed - a kind of thin-plate storage and transporting device' is formed by reducing the specific impurity quality of polycarbonate lysate. 5, revealing a gas ion, its system Exists in assembly The thin plate accommodates the Shihwa wafer or the like of the stored object of the grain container, or the gas ion of the condensed product made of polycarbonate resin, which is stored in the ii=iammction of the processed product. The resin composition containing the silk carbon-resin and the epoxy ruthenium as the base material of the precision member storage container can capture the gas ions. However, the 'the inventions' prevent the contamination of the stored objects, although In addition, it is inconclusive as to the improvement of the productivity at the time of the formation. Recently, with the large diameter of the semiconductor wafer, the thin plate storage and transportation is also carried out = large-scale. However, it is used by the maintenance site, the logistics f, and the raw material fee. It is better to avoid exceeding the necessary size and to design the draft angle 4 201245274 (draft angle) as small as possible. As the molded article becomes larger and the draft is small, the mold release load at the time of demolding of the molded article becomes large. For this reason, there is a tendency to seek high mold release depending on the material. '^卞 In addition, it is considered to be all that is apt to listen to in the case of the ring-shaped milk compound which is added to the material-reagent group. Among the epoxy compounds, such as soybean oil, hemp oil is well known as a plasticizer, and by adding it, it is also possible to improve productivity. However, the fine material epoxy compound and the shaped product are reduced in the boundary stress, so it is added to the raw material of the molded article such as the thin plate containing the shape of the material and the residual stress is relatively large. In the case of the occurrence of cracks, the possibility of cracking is extremely high, and it is likely to be inferior in productivity. (Patent Document 1) Japanese Patent Laid-Open Publication No. Hei 08-250581 (Patent Document 2) pp. Japanese Patent No. 3,995, 346 (Patent Document 4) Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. 2,275,465 (Patent Document 5) Japanese Patent No. 3282584 (Summary of the Invention) Secret Book: Providing a thin reduction test capacity 11 The resin group Ϊ Λ f is a green-colored rotating crystal, and the surface of a thin plate such as a disk is 5 meters, and the mold release property at the time of molding is excellent. Fan Yu first of the heteroaromatic polycarbonate resin composition, a chemical structure of the release agent, and can achieve the above purpose, the completion of the present, that is, according to the present invention, provides: There are: 1.- kinds of thin plate storage a resin composition yarn for conveying a container containing [I] 100 parts by weight of an aromatic polycarbonate-based resin; and 5 201245274 [II] 0.01 to 0.5 parts by weight (B parts by weight) of an ester compound, which is a plurality of It is composed of an alcohol and a hydrazine fatty acid, and its average I degree (A%) is 99% of the total vinegar, wherein the resin composition is characterized by satisfying the following conditions: W gas atom content is 5 ppm or less, (ii) four The total content of the compound having a carbon chloride content of 3 ppm or less, (iii) % to 6 to 18 years old is 4 〇 ppm or less, and (iv) the total content of sodium and iron atoms is 〇jppm or less, and (v) Formula (1) 0.1 ^(100-Α)χΒ^ 1〇.〇(1). According to the present invention, there is provided a method for improving the mold releasability of a sheet storage container, which comprises the following steps: (i) preparing a molding material; (ii) forming a molding material in a molding die. Obtaining a thin plate storage transfer container, wherein the molding material contains the following resin composition: [I] 100 parts by weight of an aromatic polycarbonate resin; and [II] 0.01 to 0.5 part by weight (B parts by weight) of an ester compound, It is composed of a polyol and a higher fatty acid, and its average degree of esterification (A%) is 30 to 99% of the total ester, wherein the resin composition is characterized by using a resin composition that satisfies the following conditions: (0 gas atom content a compound having a gas content of 5 ppm or less, (ii) a carbonized carbon content of 3 ppm or less, and a (in) carbon number of 6 to 18, a total content of 40 ppm or less, (iv) a total content of sodium and iron atoms of 〇i ppm or less, and (v) The following formula (1): 0.1 ^(100-A)xB^1〇.〇(1). [Embodiment] (Aromatic polycarbonate resin) 201245274 The aromatic polycarbonate used in the present invention Resin, using solution or melting method to make dihydric phenols The product obtained by the acid ester precursor reaction. Representative examples of the dihydric phenol used herein can be exemplified by 2,2-bis(4-hydroxyphenyl)propane (commonly known as bisphenol A), 卞4· Phenyl)methane, bis(4-phenylene)ethene, U-bis(4-phenylene)cyclohexanyl 2,2-bis(4-hydroxy-3,5-dimethylbenzene Base) propyl, 2,2_bis (4-hydroxyl, 5-di-diphenyl) propyl, 2,2_bis(4-carbyl-3-methylphenyl)propane, double (4- Ester, 4,4-dihydroxydiphenyl, bis(4-hydroxyphenyl) sulfide, bis(4-hydroxyphenyl), and the like. The preferred dihydric phenol is a bis(4-phenylene) alkane, of which bisphenol A is particularly preferred. In order to use ruthenium and ruthenium, it is possible to use a few base halogens, carb〇nate esters or i formic acid, etc., in particular, it can be said that m-carbonated diphenyl is called binary two. Acid esters, etc. When the aromatic diol resin is produced by reacting the above dihydric phenol with a carbonate precursor by a solution method or a melting method, the dihydric phenol may be used singly or in combination of two or more. Medium, blocking agent, anti-oxidation of dihydric phenol, etc. Further, the aromatic polycarbonate resin may be a branched polycarbonate resin obtained by copolymerizing a trifunctional or higher polyfunctional aromatic compound, an aromatic or an aliphatic group, and preferably an aromatic group having a carbon number of 8 or more. The polyester carbonate resin in which the aliphatic difunctional carboxylic acid is copolymerized may further be a mixture of two or more kinds of aromatic polycarbonate resins. , a In the present invention, it is particularly suitable to use a solution method, and the reaction by the solution method is usually a reaction of bis 7G phenol with phosgene, and is carried out in the presence of an acid binder and an organic solvent. As the acid binder, for example, a metal hydroxide or an amine compound such as sodium hydroxide or hydrogen hydroxide can be used. For the solvent, a halogenated hydrocarbon such as dichloromethane or chlorobenzene can be used. Further, in order to promote the reaction, for example, a catalyst such as a tertiary amine or a quaternary salt may be used. The temperature should be usually from thief to thief, and the reaction time is from several minutes to m, and the right side can be used as a blocking agent. The functional phenols are used as the terminal blocking agent, and are generally used for the adjustment of the molecular weight, and the obtained polycarbonate resin is chained according to the terminal monofunctional phenol-based group, so compared with the non-type Excellent thermal stability. Such a monofunctional phenol 7 201245274 is generally referred to as a phenol or a lower alkyl substituted hydrazine, which can be represented by a monofunctional phenol represented by the following formula (1).
(式中，R表示氫原子或碳數為1至9’較佳為1至§之烷 基；m表示〇至5，較佳為〇至3之整數）。 以s亥單官能盼類之具體例而言’可例示為例如：紛、對三 級丁酚、對異丙苯基紛(p-cumyl phen〇i)及異辛酚等。 熔融法所致反應’通常係二元酚與碳酸二苯酯之酯交換反 應，在惰性氣體之存在下，將二元酚與碳酸二苯酯混合，較佳 為為了加速聚合速度，而使用驗(土類)金屬化合物等之聚合觸 媒，在減壓下通常於120至350。(：反應。減壓度予以階段性變 化，最終設為ImmHg以下，使生成的酚類除去於系統外。反 應時間通常為1至4小時左右。 芳香族聚碳酸酯樹脂之分子量，以黏度平均分子量(M)較 佳為1.4χ1〇4至3·〇χ104之範圍，更佳為1 6xl〇4至2.5x104之 範圍’進一步更佳為1.7χ104至2·4χ1〇4之範圍，特佳為j 8χ1〇4 至2.3χ104之範圍。具有此等黏度平均分子量的芳香族聚碳酸 酯樹脂，具有一定機械強度，且成形時之流動性亦為良好較 佳。分子量小於1·4χ104之情形，在成形品無顯現強度，故難 以獲得實用上的材料，分子量超過3.〇xl〇4之情形，易於產生 成形流動性劣化的問題。進一步在此情形，會產生形成石夕晶圓 等薄板污染之原因的盼化合物或氣系有機溶劑，在押出加工中 自樹脂中難以揮發的問題，欲消除此問題，而提高押出溫度 時，雖可減低氣系有機溶劑，不過樹脂之分解進行，造成酚化 合物量增加之結果。 201245274 fύI 11 · —·— 所黏度平均分*量⑽，絲2。。。雜。.7g芳香(wherein R represents a hydrogen atom or an alkyl group having a carbon number of 1 to 9', preferably 1 to §; m represents 〇 to 5, preferably 〇 to an integer of 3). Specific examples of the singular monofunctionality can be exemplified by, for example, tris-butyl butyric acid, p-cumyl phen〇i, and isooctylphenol. The reaction caused by the melting method is usually a transesterification reaction of a dihydric phenol with diphenyl carbonate, and the dihydric phenol is mixed with diphenyl carbonate in the presence of an inert gas, preferably for accelerating the polymerization rate. The polymerization catalyst of a (metal) metal compound or the like is usually from 120 to 350 under reduced pressure. (Reaction: The degree of decompression is changed stepwise, and finally it is set to 1 mmHg or less, and the generated phenols are removed from the system. The reaction time is usually about 1 to 4 hours. The molecular weight of the aromatic polycarbonate resin is averaged by viscosity. The molecular weight (M) is preferably in the range of 1.4χ1〇4 to 3·〇χ104, more preferably in the range of 16×1〇4 to 2.5×104, and even more preferably in the range of 1.7χ104 to 2·4χ1〇4, particularly preferably The range of j 8χ1〇4 to 2.3χ104. The aromatic polycarbonate resin having such a viscosity average molecular weight has a certain mechanical strength, and the fluidity at the time of molding is also good. The molecular weight is less than 1-4,104. Since the molded article has no apparent strength, it is difficult to obtain a practical material, and when the molecular weight exceeds 3. 〇xl 〇 4, the problem of deterioration of the molding fluidity is liable to occur. Further, in this case, the formation of a thin plate contamination such as a stone wafer is generated. The reason is that the compound or the gas-based organic solvent is difficult to volatilize from the resin in the extrusion process, and the problem is to be eliminated, and when the extrusion temperature is raised, the gas organic solvent can be reduced, but the resin is used. Decomposition proceeds, resulting in an increase in the amount of phenolic compound. 201245274 fύI 11 · —· — Average viscosity of the product* (10), silk 2... Miscellaneous. 7g aroma
(何η]為極限黏度)(何η] is the ultimate viscosity)
Olsp)，插入次式而求得。 T)sp/ 〇=[η]+0.45 χ [η]2ς [η〕=1.23χ10·4Μ083 c=0.7 (酉旨化合物類） 本發明之樹脂組成物’相對於励重量份芳香族聚碳酸醋 树脂’含有0Ό1至0.5重量份(B重量份），由多元醇及高級脂 肪酸所構成，其平均醋化度為全酿之3〇至99%(A%)的醋化合 物類’且滿足 〇·1$(1〇〇-Α)χΒ$ι〇〇。 酯化合物類之平均酯化度過低時，因降低成形時之耐熱 性，且使聚碳酸酯樹脂分解，故就會使酚化合物量增大，或引 起樹脂，分子降低或色調不良。一方面，酯化合物類之平均酯 化度過高時，則無法顯現起因於氣系化合物分解而發生的氣離 子捕捉效果，無法抑制薄板之污染。 又，酯化合物類之含量，相對於1〇〇重量份芳香族聚碳酸 醋樹脂’較佳為0.015至0.3重量份、更佳為0 02至重量 份。酯化合物類之量過少時，則作為脫模劑之效果不充分，過 多時，則不僅降低成形時之耐熱性、成形品之透明性及機械強 度，而且很可能與酯化合物類本身或其分解物之昇華所致薄板 之污染有關。 進一步，在本發明非常重要的是，選擇酯化合物類之種類 與添加量，以能滿足0.1$(10〇-Α)χΒ$1〇·〇。若(1〇〇·Α)χΒ之 值較0.1更小時，則作為脫模劑之效果不充分，而且無法顯現 起因於氯系化合物分解而發生的氣離子捕捉效果，無法抑制薄 板之污染。（100-Α)χΒ之值較1〇.〇更大時，由於成形時之耐熱 性降低’且聚碳酸酯樹脂分解，就會使酚化合物量增大，或引 起樹脂之分子量降低或色調不良。（100-A)xB之下限值較佳為 9 201245274 v " 〇·5 ’更佳為l.o。又上限值較佳為7·0、更佳為5.0。此外，酯 化合物類之平均酯化度及含量，係根據1H-NMR法測定。 又，在本發明進一步以滿足下述式(2)為佳。 0.001 ^(1〇〇-Α)χηχΒ/Μη^0.1 (2) (式中，η表示酯化合物類之原料中多元醇一分子中羥基之 數；Μη表示酯化合物類之數量平均分子量）。 (100-Α)χηχΒ/Μη之值為0.001以上時，則作為脫模劑之 效果充分，可顯現起因於氣系化合物分解而發生的氣離子捕捉 效果’並抑制薄板之污染。（1〇〇·Α)χηχΒ/Μη之值為0.1以下 時’則因成形時之耐熱性優異、聚碳酸酯樹脂難以分解，故可 抑制酚化合物量之增大，較不會引起樹脂分子量降低或色調不 良。（100-Α)χηχΒ/Μη之下限值較佳為〇.〇1、更佳為〇.〇3。又 上限值較佳為0.08，更佳為0.05。此外，酯化合物類之數量平 均分子量係根據1H-NMR法測定。 以多元醇而言，較佳為碳原子數係3至32之物。此等多 元醇之具體例而言，可例示為：甘油、二甘油、聚甘油(例如： 十甘油等）、新戊四醇、二新戊四醇、二乙二醇及丙二醇等。 高級脂肪酸係指碳原子數為10至32之脂肪族羧酸，以其 具體例而言，可例示為：癸酸、•一酸、十二酸、十三酸、十 四酸、十五酸、十六酸(棕櫚酸）、十七酸、十八酸(硬脂酸）、 十九酸、二十酸、二十二酸、二十六酸等之飽和脂肪族羧酸； 以及軟脂油酸(palmitoleic acid)、油酸、亞麻油酸、亞麻脂酸、 二十碳稀酸、二十碳五稀酸(eicosapentaenoic acid)、錄蠛缔酸 (cetoleic acid)等之不飽和脂肪族羧酸。該等中，以脂肪族羧酸 而言，較佳為：碳原子數為10至22之物，更佳為碳原子數 14至20之物。尤其是碳原子數14至20之飽和脂肪族羧酸、 特佳為硬脂酸及棕櫚酸。如同硬脂酸之脂肪族羧酸’通常多是 含有碳原子數不同之其他羧酸成分的混合物。在該飽和脂肪酸 酯’較佳可使用由硬脂酸或由棕櫚酸所得之酯化合物，此等酸 201245274 係由含有自此等天脑賴所製触其他細t成分的混合物 之形態所構成。 ^以該酯化合物類之具體例而言，可例示為：例如將單硬脂 酸甘油酯、二硬脂酸甘油酯、三硬脂酸甘油酯、單蘿酸甘油酯、 四硬脂酸新戊四醇自旨、單硬脂酸丙二_旨等作為域分之物。 其中較佳可使用將單硬脂酸甘油酯或四硬脂酸新戊四醇酯作 為主成分·^物。氯離子捕捉效果，因二級醇較一級醇為高，故 特佳為將單硬脂酸甘油s旨作為主成分使用。該等目旨化合物類只 要在本發明規定之範圍内，則可單獨或者混合二種以上使用。 士外’在混合二種以上使用之情形，平均酯化度係設為各酯化 δ物類之加權平均，含量則成為各酯化合物類之合計含量。 (樹脂組成物中特定成分之含量） 本發明之樹脂組成物中氣原子含量，相對於樹脂組成物為 5ppm^以下，較佳為3ppm以下。以氣原子而言，在製造中使 用的前述氣系有機溶劑大部分係殘留於芳香族聚碳酸酯樹脂 中之物，除此以外，在原料光氣中含有作為雜質的四氣化碳、 或來自殘留於聚合物鏈的微量未反應之氣甲酸基 (chloroformate)之物。若殘存之氣系有機溶劑變多，則因氣系 有機溶劑本身或㈣有機賴之分解而生成的鹽酸自樹脂漏 出’而污染晶圓等之薄板。 殘留於聚合物鏈的未反應之氣甲酸基，其本身並不自聚合 物漏出，不過其量變多時’則在成形加工，可微妙地促進聚^ 物之分解，增加低分子量部分，亦即增加揮發成分，結果盥& 板污染密切相關。 ~ 本發明之樹脂組成物中四氣化碳含量，相對於樹脂組成物 為3ppm以下，較佳為2ppm以下，更佳為lppm以下，進一 步較佳為0.5ppm以下，特佳為0.3ppm以下，最佳為〇 lppm 以下。殘存於芳香族聚碳酸酯樹脂中的氣系有機溶劑變多時， 在成形時經加熱的情形，因氣系有機溶劑之分解而產生鹽酸。 為人所熟知的是：在溶液法生成芳香族聚碳酸酯樹脂製二中， 11 201245274 ，較於作為溶劑最常“般使用的二氯甲烷，四氣化碳分解性 向。亦即，本發明中芳香族聚碳酸酯樹脂中氣成分之中，特別 減低四氣化碳含量，會與自薄板收納搬送容器抑制鹽酸發生有 關。 *在本發明，碳數為6至18之酚化合物，係指在芳香族聚 石炭酸酯樹脂之製造時所使用之末端封鏈用之一元酚化合物、原 料之二元酚及添加劑之構成的酚化合物。 允匕該等係因使未反應酚化合物殘留之物、或者因芳香族聚碳 酸酯樹脂或添加劑之分解之結果，碳數超過18之酚化合物因 揮發性變低，故即使僅碳數超過18的齡化合物之含量增加， 對本發明之達成之影響亦小。 义本發明中之碳數6至18之酚化合物，具體言之，可例示 為刚述原料之二元酚，尤其是雙酚A，或前述使用作為封端劑 的屬一元酚的酚、對三級丁酚、對異丙苯基酚(p_cumyl phen〇1) 及異辛盼等。 在本發明，相對於樹脂組成物，碳數為ό至18之酚化合 物之合含量為40ppm以下，較佳為35ppm以下。含量超過 40ppm時，則揮發之酚化合物量亦變多，會污染晶圓等薄板。 在本發明，相對於樹脂組成物，鈉及鐵原子含量合計為 O.lppm以下’較佳為0 〇5ppm以下。超過〇 lppm時，在根據 此等金屬之樹脂組成物之成形加工，易於促進樹脂之分解，結 果易於產生污染薄板表面之揮發成分。 此外’在本發明中薄板，係指加工成光碟、硬碟或M〇所 代表的磁碟及積體電路晶片的晶圓等，對表面污染敏感的薄板 之意。 …本發明之樹脂組成物中氣原子含量，係根據燃燒氣法測 疋又’四氣化石及含量’係根據頂空氣相層析法（headSpace莒批 chromatography )測定。又，齡化合物含量係根據高速液體 層析法測定。又，鈉及鐵原子之含量，係在加熱灰化處理後， 根據電感偶合電漿•質量分析法(ICP_MS法)測定。 12 201245274 (樹脂組成物中特定成分之減低方法） 在本發明，以減少殘存於樹脂組成物中氯系有機溶劍或碳 數為6 18之酚化合物的方法而言，可例示為：例如強化芳 香族，碳_旨樹絲狀方法；將絲Φ觀大的芳香族聚碳 酸酯樹丨旨錢之方法；料良·進行芳香絲碳_旨樹脂粉 粒體洗淨之方法’歸，在料麵聚碳麵麟粉粒體予以 炼融押出時’強化去揮發之方法等。 、曰=強化芳香族聚碳酸酯樹脂乾燥之方法而言，具體言之， 以提昇乾燥溫度較有效。但是，設定於芳香族聚碳酸酯樹脂之 軟化溫度以上之溫度並不佳，通常係在9〇至14(rc進行乾燥。 又，有延長乾燥時間、或提昇乾燥中芳香族聚碳酸酯樹 拌效率之方法。 現 要加大^香知聚奴酸g旨樹脂之表面積，具體言之，較佳 製成使芳香族聚碳酸酯樹脂之粒徑減小的粉末形狀，因此， 使巧強化芳香族聚碳酸酯樹脂之粉碎等之方法。尤其是 乾燥的樹料，_子過硬，而鱗惡化，故較佳是將製= 之t有有機溶劑或水的漿液狀態之物予以粉碎。又，製成多孔 質粉末亦為有效’例如，有將溶解於良好溶劑的芳香 醋樹脂溶液，設定於較該良好溶劑之_相當高的溫度，滴;P 至某種不良溶劑，同時予以攪拌，並製粒之方法。人4 —藉由採用以不良溶劑進行芳香族聚碳酸酯樹脂，尤其H ^樹脂粉末之洗淨之方法，而絲；I；族雜g《軸 = 2，取至不良溶劑。進一步，該方法亦有使此等不良= 取代方香族聚碳酸酯樹脂中之氣系有機溶劑，並減少 =劑之效果。以不良溶劑而言，可例示為：丙酮、甲'醇、、 等’其中較佳為使用丙酮。 元 以在將芳香族聚碳酸酯樹脂粉粒體進行熔融押出 發’。具體言之，可使用雜融押出機内之去揮 13 201245274 之方^亦有設定去揮發壓力為低，或使用水等之去揮發助劑 據ίΐ驗成物中四氣化碳之方法而言，刊示為··根 法Γ具和中四氣化碳紐之減低，喊少四氣化碳帶入之方 钱為：因活性碳所致四氯化碳之吸附除去； ^77離除去等。又，以使用四氣化碳含量少的二氣曱烧之方 連續且循環使用二氣甲燒之情形，將循環使用之二 中所二藉由蒸館等之操作’來除去二氣甲炫 以減少芳香族聚碳酸酯樹脂中氣甲酸基方 ΐ 取彳^合咖等使聚合胁1 束= ^或將方香族聚碳酸g旨樹脂以NaoH水溶液等之驗性 進仃洗淨處理之方法。 魅5二以減少金屬原子之方法而S，可使用將溶解於良好溶 劑，方香族聚碳酸酯樹脂溶液與純水混合，重複進行分液予以 洗淨之方法；或以過濾器過濾之方法等。 (樹脂組成物之評估） —在本發明之樹脂組成物，將其以8〇〇c之純水經24小時加 y萃取之情形，所萃取的氣化物離子量，相對於使用於測定的 ^'香族聚故酸醋樹脂組成物，較佳為3〇ppb以下，更佳為2〇DDb 以下，再佳為15Ppb以下，特佳㈣ppb以下。 化物離子濃度超過3〇ppb的樹脂組成物時，不僅污染晶圓等之 薄板’而且很可能與成形機或鑄鮮之金屬鋪腐仙關連。 此外，樹脂組成物之溶離氣化物離子濃度，係根據離子層析法 (濃縮柱法)測定。 本發明之樹月曰組成物’脫模負荷係使用玻璃杯狀之脫模性 評估用鑄模，在將射出成型品脫模時，藉由負荷單元〇〇ad cdl) 測定。脫模負荷較佳為250kgf以下’更佳為2〇〇kgf以下，再 佳為150kgf以下。 201245274 的絲i發之^驗成物，為了_是否為適合於本發明目的 雜觸角亦大巾§變化，故可使祕闕便的評估法 明之芳香族聚韻j旨樹脂組成物所得之純水對收納於 晶圓用收納搬送容器的晶圓之接觸角，根據Θ/2法來測定。 (樹脂組成物之添加劑） 在本發明，熱穩定劑、抗氧化劑等之各種添加劑，較佳是 不使用，或者儘量減少使用量。 θ熱穩定劑，在芳香族聚碳酸酯樹脂之成形時，為了防止分 子量降低或色調惡化，並防止樹脂之劣化，亦可少量調配，較 佳為相對於^香族聚碳酸酯樹脂為5〇ppm以下，更佳為1〇至 50ppm，再佳為1〇至4〇ppm之調配量。在此等範圍内，根據 熱穩定劑之揮發或熱穩定劑之變質物之揮發，尤其是並無矽晶 圓表面污染之虞》較佳。 以此等熱穩定劑而言，可例示為：亞磷酸、磷酸、亞膦酸 (phosphonous acid)、膦酸(phosphonic acid)及該等g旨等，具體言 之’可例示為：亞磷酸三苯酯、亞磷酸三(2,4-二-三級丁基苯 基)酯、亞磷酸三癸酯、亞磷酸三辛酯、亞磷酸三·十八酯、亞 磷酸二癸基單苯酯、亞磷酸二辛基單苯酯、亞磷酸二異丙基單 苯酯、亞磷酸單丁基二苯酯、亞磷酸單癸基二苯酯、亞磷酸單 辛基二苯酯、二亞磷酸雙(2,6-二-三級丁基-4-曱基苯基)新戊四 醇酯、亞鱗酸2,2-亞曱雙(4,6-二-三級丁基苯基)辛酯、二亞磷 酸雙(2,4-二-三級丁基苯基)新戊四醇酯、二亞磷酸二硬脂醯基 新戊四醇酯、磷酸三丁酯、磷酸三乙酯、磷酸三曱酯、磷酸三 苯酯、磷酸二苯基單鄰聯苯酯、磷酸二丁酯、磷酸二辛酯、磷 酸二異丙酯、4,4'-聯伸苯基二膦酸四(2,4-二-三級丁基苯基）、 苯膦酸二甲酯、苯膦酸二乙酯、苯膦酸二丙酯等。其中，較佳 15 201245274 ' 、 為使用4,4’-聯伸苯基二膦酸四(2,4-二-三級丁基苯基）、構酸三 甲醋、亞磷酸三(2,4-二-三級丁基苯基)酯及苯膦酸二甲酯。該 等熱穩定劑，可單獨使用，或者混合二種以上使用。 在本發明之樹脂組成物，在不損及本發明目的之範圍，其 他樹脂或彈性體，亦即只要是極少比率即可調配。 、 以此等其他樹脂而言，可例示為：例如聚對苯二甲酸乙烯 酯、聚對苯二甲酸丁二醇酯等之聚酯樹脂；聚醢胺樹脂、聚醯 亞f樹脂、聚醚醯亞胺樹脂、聚胺甲酸酯樹脂、聚伸苯醚樹脂、 聚苯硫樹脂、聚碗樹脂、聚乙烯、聚丙烯等之聚烯烴樹脂；聚 苯乙烯樹脂、丙烯腈/苯乙烯共聚物(AS樹脂）、丙烯腈/丁二烯 /苯乙烯共聚物(ABS樹脂）、聚甲基丙烯酸酯樹脂、酴樹 氧樹脂等之樹脂。 < 又，彈性體而言，可例示為：例如異丁烯/異戊二烯橡膠、 苯乙稀/丁二烯橡膠、乙締/丙烯橡膠、丙烯酸系彈性體、聚矽 氧橡膠、聚酯系彈性體、聚醯胺系彈性體、為芯殼型之彈性體 的MBS(甲基丙烯酸甲g旨/苯乙稀/丁二稀)橡膠、隐8(甲基 酸甲酯/丙烯腈/苯乙烯)橡膠等。 在本發明之樹脂組成物，要摻合該等得採用任意之方法。 例如可適當地使用以滾動機(tumbler)、v型混合器、超級混人 機(super mixer)、諾塔混合機(nauta mixer)、班布里混合& 〇(Olsp), obtained by inserting a subtype. T) sp / 〇 = [η] + 0.45 χ [η] 2 ς [η] = 1.23 χ 10 · 4 Μ 083 c = 0.7 (Related compound) The resin composition of the present invention 'relative to the part by weight of the aromatic polycarbonate The resin 'containing 0Ό1 to 0.5 parts by weight (B parts by weight), composed of a polyol and a higher fatty acid, has an average degree of acetification of 3 to 99% (A%) of the whole vinegar compound' and satisfies 〇· 1$(1〇〇-Α)χΒ$ι〇〇. When the average degree of esterification of the ester compound is too low, the polycarbonate resin is decomposed by lowering the heat resistance during molding, so that the amount of the phenol compound is increased, or the resin is caused, and the molecule is lowered or the color tone is poor. On the other hand, when the average degree of esterification of the ester compound is too high, the gas trapping effect due to decomposition of the gas compound cannot be exhibited, and contamination of the thin plate cannot be suppressed. Further, the content of the ester compound is preferably 0.015 to 0.3 part by weight, more preferably 0 to 2 parts by weight, per part by weight of the aromatic polycarbonate resin. When the amount of the ester compound is too small, the effect as a release agent is insufficient. When the amount is too large, the heat resistance at the time of molding, the transparency and mechanical strength of the molded article are lowered, and it is likely to be related to the ester compound itself or its decomposition. It is related to the pollution of thin plates caused by the sublimation of things. Further, it is very important in the present invention to select the kind and amount of the ester compound to satisfy 0.1$(10〇-Α)χΒ$1〇·〇. When the value of (1〇〇·Α) is less than 0.1, the effect as a release agent is insufficient, and the gas ion trapping effect due to decomposition of the chlorine-based compound cannot be exhibited, and contamination of the sheet cannot be suppressed. When the value of (100-Α)χΒ is larger than 1〇.〇, the heat resistance during molding is lowered, and the polycarbonate resin is decomposed, so that the amount of the phenol compound is increased, or the molecular weight of the resin is lowered or the color tone is poor. . (100-A) The lower limit of xB is preferably 9 201245274 v " 〇·5 ‘ is preferably l.o. Further, the upper limit is preferably 7·0, more preferably 5.0. Further, the average degree of esterification and content of the ester compounds were measured by a 1H-NMR method. Further, in the present invention, it is preferable to further satisfy the following formula (2). 0.001 ^(1〇〇-Α)χηχΒ/Μη^0.1 (2) (wherein η represents the number of hydroxyl groups in one molecule of the polyol in the raw material of the ester compound; Μη represents the number average molecular weight of the ester compound). When the value of (100-Α) χηχΒ/Μη is 0.001 or more, the effect as a mold release agent is sufficient, and the gas ion trapping effect caused by the decomposition of the gas compound can be exhibited, and the contamination of the thin plate can be suppressed. (1〇〇·Α) When the value of χηχΒ/Μη is 0.1 or less, the heat resistance at the time of molding is excellent, and the polycarbonate resin is hardly decomposed, so that the amount of the phenol compound can be suppressed from increasing, and the molecular weight of the resin is not lowered. Or poor color tone. The lower limit of (100-Α) χηχΒ/Μη is preferably 〇.〇1, more preferably 〇.〇3. Further, the upper limit is preferably 0.08, more preferably 0.05. Further, the number average molecular weight of the ester compound is determined by a 1H-NMR method. In the case of a polyhydric alcohol, it is preferred that the number of carbon atoms is from 3 to 32. Specific examples of such a polyol include glycerin, diglycerin, polyglycerin (e.g., decaglycerin), pentaerythritol, dipentaerythritol, diethylene glycol, and propylene glycol. The higher fatty acid means an aliphatic carboxylic acid having 10 to 32 carbon atoms, and specific examples thereof may be exemplified by citric acid, monoacid, dodecanoic acid, tridecanoic acid, tetradecanoic acid, and pentadecanoic acid. a saturated aliphatic carboxylic acid such as palmitic acid (palmitic acid), heptadecanoic acid, octadecanoic acid (stearic acid), octadecanoic acid, icosonic acid, behenic acid, or hexamic acid; and soft fat Acidic carboxylic acid, such as palmitole acid, oleic acid, linoleic acid, linoleic acid, eicosaric acid, eicosapentaenoic acid, ceteleic acid, etc. . In the above, the aliphatic carboxylic acid is preferably a compound having 10 to 22 carbon atoms, more preferably 14 to 20 carbon atoms. In particular, it is a saturated aliphatic carboxylic acid having 14 to 20 carbon atoms, particularly preferably stearic acid and palmitic acid. The aliphatic carboxylic acid as the stearic acid is usually a mixture of other carboxylic acid components having different numbers of carbon atoms. In the saturated fatty acid ester, it is preferred to use an ester compound obtained from stearic acid or palmitic acid, and the acid 201245274 is composed of a mixture containing a mixture of other fine t components from the celestial brain. . ^ Specific examples of the ester compound can be exemplified by, for example, glyceryl monostearate, glyceryl distearate, glyceryl tristearate, glyceryl monostearate, and new stearic acid. Pentaerythritol is intended to be a domain of mono-stearic acid. Among them, glyceryl monostearate or neopentyl glycol stearate can be preferably used as a main component. Since the chloride ion capture effect is higher than that of the primary alcohol, it is particularly preferable to use the monostearic acid glycerol as a main component. These target compounds may be used singly or in combination of two or more kinds as long as they are within the scope of the present invention. In the case where two or more kinds are used in combination, the average degree of esterification is a weighted average of the respective esterified δ species, and the content is the total content of each ester compound. (Content of Specific Component in Resin Composition) The content of the gas atom in the resin composition of the present invention is 5 ppm by weight or less, preferably 3 ppm or less, based on the resin composition. In the gas atom, most of the gas-based organic solvent used in the production remains in the aromatic polycarbonate resin, and the raw material phosgene contains tetra-carbonized carbon as an impurity, or A trace of unreacted chloroformate remaining from the polymer chain. When the amount of the remaining organic solvent is increased, the vapor-based organic solvent itself or (4) the hydrochloric acid formed by the decomposition of the organic solvent leaks from the resin to contaminate the thin plate such as the wafer. The unreacted gas formic acid group remaining in the polymer chain does not leak out of the polymer itself, but when it is increased in quantity, it is formed in a form process, which can subtly promote the decomposition of the polymer and increase the low molecular weight portion, that is, The addition of volatile components results in a close correlation between 盥& plate contamination. The content of the four vaporized carbon in the resin composition of the present invention is 3 ppm or less, preferably 2 ppm or less, more preferably 1 ppm or less, further preferably 0.5 ppm or less, and particularly preferably 0.3 ppm or less, based on the resin composition. The best is below ppmlppm. When the amount of the gas-based organic solvent remaining in the aromatic polycarbonate resin increases, hydrochloric acid is generated by decomposition of the gas-based organic solvent when heated during molding. It is well known that in the solution method to produce an aromatic polycarbonate resin, 11 201245274, compared with the most commonly used methylene chloride as a solvent, four gasified carbon decomposability. Among the gas components in the aromatic polycarbonate resin, the content of the four-gasified carbon is particularly reduced, which is related to the inhibition of hydrochloric acid from the thin-plate storage container. * In the present invention, the phenol compound having a carbon number of 6 to 18 means a phenolic compound composed of a monovalent phenol compound for terminal chain sealing, a dihydric phenol of a raw material, and an additive used in the production of an aromatic polycarbonate resin, which allows the unreacted phenol compound to remain. Or, as a result of the decomposition of the aromatic polycarbonate resin or the additive, the phenolic compound having a carbon number of more than 18 is low in volatility, so even if the content of the compound having only a carbon number exceeding 18 is increased, the effect on the achievement of the present invention is also The phenol compound having a carbon number of 6 to 18 in the present invention, specifically, may be exemplified as a dihydric phenol which is a raw material, particularly bisphenol A, or a genus which is used as a terminal blocking agent as described above. Phenol, p-tert-butylphenol, p-cumyl phen〇1, iso-isoprene, etc. In the present invention, the phenolic compound having a carbon number of from ό to 18 is compared with the resin composition. 40 ppm or less, preferably 35 ppm or less. When the content exceeds 40 ppm, the amount of volatile phenolic compound is also increased, which may contaminate a thin plate such as a wafer. In the present invention, the total content of sodium and iron atoms is O. Lppm or less is preferably 0 〇 5 ppm or less. When it exceeds 〇1 ppm, in the molding process of the resin composition according to these metals, decomposition of the resin is easily promoted, and as a result, volatile components which contaminate the surface of the sheet are easily generated. The medium-thin plate refers to a disk which is processed into a disk, a hard disk or a disk represented by an M-disk and an integrated circuit chip, etc., which is sensitive to surface contamination. The gas atom content in the resin composition of the present invention, According to the combustion gas method, the 'four gas fossils and the content' are determined by headspace chromatography (headspace), and the age compound content is determined by high speed liquid chromatography. The content of sodium and iron atoms is determined by the inductively coupled plasma mass spectrometry (ICP_MS method) after heating and ashing. 12 201245274 (Method for reducing specific components in the resin composition) In the present invention, to reduce residual In the resin composition, a chlorine-based organic solvent-smelting or a phenol compound having a carbon number of 6 to 18 can be exemplified by, for example, a method of strengthening aromatics, a carbon-like tree-like method, and an aromatic polymerization of a large amount of filaments Φ. Carbonate tree 丨 丨 钱 ; ; ; ; 进行 进行 进行 进行 进行 进行 进行 进行 进行 进行 进行 芳香 芳香 芳香 芳香 芳香 芳香 芳香 芳香 芳香 芳香 芳香 芳香 芳香 芳香 芳香 芳香 芳香 芳香 芳香 芳香 芳香 芳香 芳香 芳香 芳香 芳香 芳香 芳香 芳香 芳香 芳香 芳香Etc., 曰 = method for strengthening the drying of the aromatic polycarbonate resin, in particular, to increase the drying temperature is more effective. However, the temperature set above the softening temperature of the aromatic polycarbonate resin is not good, and it is usually dried at 9 to 14 (r). Further, the drying time is extended, or the aromatic polycarbonate tree is mixed in the drying process. The method of efficiency. It is necessary to increase the surface area of the resin of the scented polysuccinic acid, and in particular, it is preferable to form a powder shape which reduces the particle size of the aromatic polycarbonate resin, thereby making it possible to strengthen the fragrance. A method of pulverizing a family of polycarbonate resins, etc., especially in a dry tree material, in which the _ sub-hardness is too hard and the scale is deteriorated, it is preferred to pulverize the material in a slurry state in which the organic solvent or water is produced. It is also effective to form a porous powder. For example, a solution of an aromatic vinegar resin dissolved in a good solvent is set at a temperature which is relatively high compared to the good solvent, and a P is added to a poor solvent while stirring. Method for granules. Human 4 - by using a method of washing an aromatic polycarbonate resin, in particular, a H ^ resin powder with a poor solvent, and a wire; I; a group of impurities, "axis = 2, taken to a poor solvent. Further, the method is also There is such a problem that it is preferable to replace the gas-based organic solvent in the aromatic polycarbonate resin and reduce the effect of the agent. In terms of the poor solvent, it may be exemplified by acetone, methyl alcohol, etc. In order to use acetone, the element is used to melt the aromatic polycarbonate resin powder granules. In particular, it can be used in the ablation extruder 13 201245274, and the de-volatilization pressure is set to be low. Or use a de-evaporation aid such as water. According to the method of four-gasification carbon in the test, it is published as the reduction of the root-curing cookware and the medium-four gasification carbon, and shouting less gasified carbon ribbon. The incoming money is: adsorption removal of carbon tetrachloride by activated carbon; ^77 removal, etc. In addition, continuous use of two gas smoldering is carried out using a gas with a low gas content of four gas. In the case of recycling, the second of the two uses the operation of the steaming hall to remove the dioxane to reduce the gas formate base in the aromatic polycarbonate resin. = ^ or the Fangxiang polycarbonate carbonate resin is treated with an aqueous solution such as NaoH aqueous solution. Method 5: In order to reduce the metal atom, S can be used by dissolving in a good solvent, mixing the Fangxiang polycarbonate resin solution with pure water, and repeating the liquid separation to wash; or filtering by a filter Method, etc. (Evaluation of Resin Composition) - In the case where the resin composition of the present invention is extracted with 8 〇〇c of pure water over 24 hours plus y, the amount of vapor ions extracted is relative to the use. The composition of the fragrant polyacetate resin is preferably 3 〇 ppb or less, more preferably 2 〇 DDb or less, more preferably 15 Ppb or less, and particularly preferably less than 4 ppb. The ion concentration of the compound exceeds 3 〇 ppb. When the resin composition is used, it not only contaminates the thin plate of the wafer, etc., but is also likely to be associated with the metal of the forming machine or the cast metal. In addition, the dissolved ion concentration of the resin composition is based on ion chromatography (concentration column). Method). In the mold release load of the present invention, the mold release load is measured by using a glass mold-like mold for evaluation of mold release property, and when the injection molded product is released from the mold, it is measured by a load unit 〇〇ad cdl). The mold release load is preferably 250 kgf or less, more preferably 2 〇〇 kgf or less, and still more preferably 150 kgf or less. 201245274 The silk i 之 验 验 , , , , 为了 为了 为了 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 The contact angle of the water to the wafer accommodated in the wafer storage container was measured by the Θ/2 method. (Additive of Resin Composition) In the present invention, various additives such as a heat stabilizer and an antioxidant are preferably not used, or the amount of use is minimized. The θ heat stabilizer may be formulated in a small amount in order to prevent a decrease in molecular weight, deterioration of color tone, and prevention of deterioration of the resin during molding of the aromatic polycarbonate resin, preferably 5 Å with respect to the scented polycarbonate resin. Below ppm, more preferably from 1 to 50 ppm, and even more preferably from 1 to 4 ppm. Within these ranges, it is preferred that the volatilization of the heat stabilizer or the volatilization of the heat stabilizer, especially the absence of contamination of the rounded surface of the twin. Examples of such heat stabilizers include: phosphorous acid, phosphoric acid, phosphonic acid, phosphonic acid, and the like, and specifically, 'may be exemplified as: phosphorous acid tri Phenyl ester, tris(2,4-di-tert-butylphenyl) phosphite, tridecyl phosphite, trioctyl phosphite, tridecyl phosphite, didecyl monophenyl phosphite , dioctyl monophenyl phosphite, diisopropyl monophenyl phosphite, monobutyl diphenyl phosphite, monodecyl diphenyl phosphite, monooctyl diphenyl phosphite, diphosphoric acid Bis(2,6-di-tris-butyl-4-mercaptophenyl)neopentyl glycol ester, bis(2,2-indenylene) bis(4,6-di-tert-butylphenyl) Octyl ester, bis(2,4-di-tert-butylphenyl)pentaerythritol diphosphite, distearyl neopentyl glycol diphosphite, tributyl phosphate, triethyl phosphate , tridecyl phosphate, triphenyl phosphate, diphenyl mono-diphenyl phosphate, dibutyl phosphate, dioctyl phosphate, diisopropyl phosphate, 4,4'-linked phenyl diphosphonic acid (2,4-di-tertiary butylphenyl), dimethyl phenylphosphonate, diethyl phenylphosphonate, Phosphonic acid ester and the like. Among them, preferably 15 201245274 ', to use 4,4'-linked phenyldiphosphonic acid tetrakis(2,4-di-tert-butylphenyl), triacetate, triphosphoric acid (2,4) -Di-tertiary butylphenyl) ester and dimethyl phenylphosphonate. These heat stabilizers may be used singly or in combination of two or more. In the resin composition of the present invention, other resins or elastomers, i.e., at a very small ratio, can be blended without departing from the scope of the object of the present invention. The other resin may be exemplified by a polyester resin such as polyethylene terephthalate or polybutylene terephthalate; a polyamide resin, a polyfluorene resin, and a polyether. Polyolefin resin, urethane resin, polyphenylene sulfide resin, polyphenylene sulfide resin, poly-bowl resin, polyethylene, polypropylene, etc.; polyolefin resin; acrylonitrile/styrene copolymer (AS resin), acrylonitrile/butadiene/styrene copolymer (ABS resin), polymethacrylate resin, eucalyptus resin, and the like. < Further, the elastomer may, for example, be an isobutylene/isoprene rubber, a styrene/butadiene rubber, an ethylene/propylene rubber, an acrylic elastomer, a polyoxyethylene rubber, or a polyester system. An elastomer, a polyamide-based elastomer, an elastomer of a core-shell type, MBS (methyl methacrylate/styrene/butadiene) rubber, and 8 (methyl methyl methacrylate/acrylonitrile/benzene) Ethylene) rubber and the like. In the resin composition of the present invention, any method may be employed in order to blend the same. For example, a tumbler, a v-type mixer, a super mixer, a nauta mixer, a Bamburi mixture &
Banbury mixer)、混練輥（blending roll)、押出機等混合之 方法。如此所得芳香族聚碳酸酯樹脂組成物，可照原樣，戈以 熔融押出機一次製成顆粒狀之後，以射出成型法、押成 法、壓縮成，法等之通常為人所熟知的方法，製成成形品。此 外三為了提高對芳香族聚碳酸酯樹脂之調配成分之分散，獲得 穩定的脫模性或各物性，較佳為在熔融押出使用二轴押 (薄板收納搬送容器） 本發明包含由該樹脂組成物所成形的薄板收納搬送容器。 薄板收納搬送容器較佳為半導體晶圓用收納搬送容器二 201245274 薄板收納搬送容器’較佳為稱為F〇SB(晶圓運輸盒(Fr〇nt Opening Shipping B〇x))的薄板收納搬送容器，其可收納搬送複 數片（10至40片左右、較佳為20至3〇片左右)之3〇〇mm或 450_之半導體晶圓。容器之大小為寬35〇咖至6〇〇mm， 縱深300mm至550mm、高度300mm至500mm左右。又，該 容器具有如日本特開2008-141080或日本特開2012-56639之 公開專利所記載之形狀。 (提高離形性之方法） 提高本發明之薄板收納搬送容器在成形時之脫模性之方 法，包含下列各步驟：（0準備成形材料；（ii)將成形材料在鑄 模内成形，獲得薄板收納搬送容器。 使用該樹脂組成物作為成形材料。 成形材料，較佳為在80至140Ϊ乾燥1小時以上為理想。 ,更彳圭為在10〇至130°C，乾燥3至24小時為理想。乾燥 後之成形材料，較佳為在圓筒溫度23〇至33〇〇c之範圍，在鑄 40至100。。之範圍予以射出成型，獲得薄板收納搬送 谷益為理想。 更佳為在圓筒溫度260至30(TC之範圍、鑄模溫度60至 8〇C之範圍進行射出成型，並獲得薄板收納搬送容器為理想。 在圓筒溫度230至330t及鎮模溫度40至1〇〇。(：之範圍 ^，成形品之表面平滑性為良好，根據因與收納之晶圓面之摩 產生之微粒子’而難以污染，又，賴鮮之添加劑難以 洛發(vaporize)故較佳。 實施例 舉實關為麟細下，但本發魏無受該等之任 何限疋。此外，評估係依照下述之方法。 (l)li度平均分子量 將0.7g芳香族聚碳酸酯粉粒體溶解於1〇〇ml二氣甲烷， 洛液在2G°C使用奥士華(0stwakl)黏度計求得比黏度， 乂下述式求得黏度平均分子量(M)。 201245274 比黏度 〇lSP)=(H〇)/t〇 [t〇為一氯甲烧之洛下秒數· t為試料溶液之落下秒數] 1sp/c=[n]+0.45x[n]2c (但[η]為極限黏度） [η] =1.23xlO'4M083 c=0.7 (2)氣原子含量 使用三菱化學股份有限公司製之氣硫分析裝置Tsxl〇 型，根據燃燒氣法測定。具體言之’以電爐(92〇。〇加熱試樣(顆 粒），予以全量氣化，將經氣化的氣體通過硫酸予以脫水後， 吸附於氣用之電解液(乙酸鈉）。將以吸附產生的電位差以電位 滴定回復至原來電位。根據回復至原來電位為必須的能量計算 氯量。 (3) 四氣化碳含量 在120ml之不銹鋼製容器，裝入5g顆粒予以塞緊，在25( °C加熱2小時後，將lml頂部空間氣體注入附有電子捕擔 (electron capture)型檢測器的氣體層析裝置（日立製作所公 263型），予以測定。 (4) 酚化合物含量 將顆粒溶解於二氯甲烷’添加乙腈，使聚合物析出，就溶 液部分’根據液體層析法測定來求得。 ’' (5) 鈉、鐵之各金屬量 將顆粒進行加熱灰化處理後，進行電感偶合電漿_暂吾八 析法(ICP-MS法)所致測定。 刀 (6) 酯化合物類含量、平均酯化度及數量平均分子田 將3g顆粒溶解於30ml二氣甲烷，依照50m丨丙^2〇〇mi 己烷之順序滴下溶劑。接著，過濾析出物予以除去、 並乾涸，獲得萃取物。將萃取物以規定内部標準的丨如气^翕 仿(Deuterated chloroform)予以溶解’進行1h-nmr測定^藉由 以酯化合物類之波峰及内部標準波峰之積分值之比，' 笪^ 合物類量，來求得酯化合物類含量。又，由所得之 18 201245274 測定結果’計算各醋化合物(部分酯及全酯)之所含莫耳比，以 了述式(3)求得平均酯化度，而以下述式(4)求得數量平均分子 量。此外，在表1係表示相對於全酯之平均酯化度(％)。刀 一 η i=2 (iXNi/100) (3) (式中：i表示平均酯化度；n表示原料中多元醇一分子中 之經基數；i表示多元醇高級脂肪酸酯之酯化度；初表示醋化 度為i之多元醇高級脂肪酸酯之全酯化合物類中之莫耳％) η Μη = Σ (MiXNi/100) (4) i = 1 (式中’ Μη表示數量平均分子量；n表示原料中多元醇一 分子中之經基數；i表示多元醇高級脂肪酸酯之酯化度， 表示酯化度為i之多元醇高級脂肪酸酯之分子量；Ni表示酯化 度為i之多元醇高級脂肪酸酯之全酯化合物類中莫耳％)。 (7)溶離氣化物離子濃度 在清淨的聚烯烴製容器，裝入所得之5〇g顆粒及50mL超 純水予以塞緊，在8(TC放置24小時後，就所得之溶液，使用 具備Dionex公司製分離柱IonPacAS12A的Dionex公司製離 子層析儀DX-120 ’測定氣化物離子濃度，自所得之結果計算 顆粒中之濃度。 ⑻脫模負荷 在將顆粒於120°C經5小時乾燥後，使用射出成型機(住友 重機械工業股份有限公司製：SS75)，於圓筒溫度320度、鑄 模溫度90度，使用玻璃杯狀(開口部外徑：7〇mm、底面外徑： 63mm、高度：20mm、厚度：4mm)之脫模性評估用鑄模，予 以射出成型，並藉由負荷單元，測定脫模時之突出負荷。該值 越小則脫模性越優異。 (9)接觸角 201245274 將顆粒在120°C乾燥5小時後，以圓筒溫度28〇。〇、鑄模 度70 C、成形循環約130秒予以射出成型，獲得3〇〇mm半 導體晶圓用收納搬送容器(F〇SB)。 在s亥半導體晶圓用收納搬送容器’插入預定片數之半導體 曰曰圓，在密閉容器内常溫保持1週後，取出半導體晶圓，在表 面之五處，依照@/2法測定純水與晶圓表面之接觸角。此外， 在實施例及比較例，放置於容器前之接觸角均為4。。 實施例1 在附有溫度計、授摔機及回流冷卻器之反應器，裝入2194 ^離子交換水、402份之48%氫氧化鈉水溶液，^中溶解575 份之2,2-雙(4_經苯基)丙烷及i 2份酸性亞硫酸鹽(hydr〇sulfite) 後，添加1810份二氣甲烷，將經活性碳處理的283份光氣在 授拌下於15至25t需經40分鐘吹入。在光氣吹入完成後， 添;^ 72份之48%氫氧化鈉水溶液及18 5份對三級丁酚，予以 攪拌並乳化’在10分鐘後以均混合器處理後，在無授摔狀•離， 於溫度30至331：之範圍，放置3小時，完成反應。〜 反應完成後，添加1810份二氣甲烷，予以攪拌混合2〇分 鐘後，予以靜置，將聚碳酸酯樹脂之有機溶劑溶液相與水相分 離。^對於經分離的聚碳酸酯樹脂之有機溶劑溶液丨份，添加 離^父換水1份’將洗淨及分液重複三次至水相之導電率與離 子父換水幾乎相同為止。將洗淨的該聚碳酸醋樹脂有機溶 精* _之SUS3()4製_器猶後，添加相對 =聚樹脂為25ppm之量之4，-聯伸苯基二膦酸四(2,4_二_ 二級丁基本基_)酉旨。 。，著，將所得之聚碳酸酯樹脂有機溶劑溶液，在裝入45 C之溫水(佔有捏合機（deader)内部空間容量1〇% ^ 下，經1小時投入’ 一面吹入蒸汽，一邊在内 /孤45 C洛發除去二氣甲烷，獲得聚碳酸酯粉粒體與 物。將此等粉粒體與水之混合物通過粉碎機予以粉,= 控制於水溫95t的喊拌機熱水處理槽，添加水，以成為又25 201245274 份粉粒體、75份水之混合比，並經30分鐘攪拌機混人。將嗲 粉粒體與水之混合物以離心分離機分離，獲得含有二氣甲^ 3.5重量％、水10重量％的粉粒體。接著，將該粉粒^在控& 於140°C的SUS316L製傳導受熱式溝型二軸攪拌連續乾燥 機，以。50kg/Hr(換算聚碳酸酯樹脂)之速度予以連續供給，丄 平均乾燥時間8小時之條件予以乾燥，獲得黏度平均&子量 1·85χ1〇4、二氣甲烧含量50ppm之粉粒體。 接著，在所得之聚碳«粉粒體中添加相對於聚碳酸醋樹 脂為lOOOppm之理研Vitamin股份有限公司 S-100A(商品名)(主成分：單硬脂酸甘油酯） 权20μΐη碟型螢幕的二軸押出機（日本製鋼所公司 yEX30o〇 ’將使用諾塔混合器，經2〇分鐘櫈摔混合之物，自 2料供^口以3Gkg/Hi·之速度供給，在螺旋旋轉 30〇rpm、樹脂溫度280它、通氣真空度lkpa之押出條件，ς 融押出股線。將經熔融押出的股細冷卻浴冷 切斷，獲得直徑3咖、長3mm之顆粒。此外^離 =口，將作為去揮發卿之離子交換水，供給相對於1〇〇重 =聚碳酸S旨樹脂組成物為α5重量份。Banbury mixer), blending roll, extruder, etc. The aromatic polycarbonate resin composition thus obtained can be formed into a pellet form once by a melt extruder as it is, and is usually known by a method such as injection molding, extrusion, compression, or the like. It is made into a molded article. Further, in order to improve the dispersion of the blending component of the aromatic polycarbonate resin, and to obtain stable mold release property or physical properties, it is preferred to use a biaxial charge (thin sheet storage transport container) for melt extrusion. The present invention comprises a resin composed of the resin. The thin plate formed by the object accommodates the transfer container. The thin plate storage and transport container is preferably a semiconductor wafer storage and transfer container 2 201245274. The thin plate storage transfer container is preferably a thin plate storage transfer container called F〇SB (Fr〇nt Opening Shipping B〇x). It can accommodate a semiconductor wafer of 3 mm or 450 mm carrying a plurality of sheets (about 10 to 40 pieces, preferably about 20 to 3 pieces). The size of the container is from 35 至 to 6 〇〇 mm, from 300 mm to 550 mm in depth and from 300 mm to 500 mm in height. Further, the container has a shape as disclosed in Japanese Laid-Open Patent Publication No. 2008-141080 or Japanese Laid-Open Patent Publication No. 2012-56639. (Method for improving the release property) The method for improving the mold release property of the sheet storage container of the present invention at the time of molding comprises the following steps: (0 preparing a molding material; (ii) forming a molding material in a mold to obtain a sheet The resin container is used as a molding material. The molding material is preferably dried at 80 to 140 Torr for 1 hour or more. It is ideal for drying at 3 to 24 hours at 10 to 130 ° C. The formed material after drying is preferably in the range of 23 to 33 〇〇c in the cylinder temperature, and is injection-molded in the range of 40 to 100 in the range of casting, and it is preferable to obtain a thin plate for carrying and transporting the grain. It is preferable that the cylinder temperature is 260 to 30 (the range of TC, the mold temperature is 60 to 8 〇C), and it is preferable to obtain a sheet-storage transfer container. The cylinder temperature is 230 to 330 t and the mold temperature is 40 to 1 Torr. (The range of ^ is good, the surface smoothness of the molded article is good, and it is difficult to be contaminated by the microparticles generated by the wafer surface to be accommodated, and it is preferable that the additive of the glazing is difficult to vaporize. Example It is fine for the lining, but the hair is not subject to any limitation. In addition, the evaluation is carried out according to the following method: (l) Li average molecular weight 0.7 g of aromatic polycarbonate granules are dissolved in 1 〇 〇ml di-halogen methane, Lok solution using Oswald (0stwakl) viscometer to obtain specific viscosity at 2G °C, 黏 to obtain the viscosity average molecular weight (M). 201245274 Specific viscosity 〇lSP)=(H〇) /t〇[t〇 is the number of seconds of the chloroform, t is the number of seconds of the sample solution] 1sp/c=[n]+0.45x[n]2c (but [η] is the ultimate viscosity) [ η] =1.23xlO'4M083 c=0.7 (2) The gas atom content is determined by the gas-sulfur analyzer Tsxl〇 type manufactured by Mitsubishi Chemical Corporation, according to the combustion gas method. Specifically, it is heated by an electric furnace (92〇.〇). The sample (particles) is completely vaporized, and the vaporized gas is dehydrated by sulfuric acid, and then adsorbed to the gas electrolyte (sodium acetate), and the potential difference generated by the adsorption is returned to the original potential by potentiometric titration. Revert to the original potential as the necessary energy to calculate the amount of chlorine. (3) Four gasified carbon in a 120ml stainless steel container, filled with 5g of particles Immediately after heating at 25 ° C for 2 hours, 1 ml of the headspace gas was injected into a gas chromatography apparatus (Model 263, Hitachi, Ltd.) equipped with an electron capture type detector, and was measured. (4) Phenol The content of the compound is dissolved in methylene chloride 'addition of acetonitrile to precipitate the polymer, and the solution portion is determined by liquid chromatography. '' (5) The amount of each metal of sodium and iron heats the particles After the treatment, the measurement was carried out by an inductively coupled plasma method (ICP-MS method). Knife (6) Ester compound content, average esterification degree, and number average molecular field 3 g of the particles were dissolved in 30 ml of di-methane, and the solvent was added in the order of 50 m of ^2〇〇mi hexane. Next, the precipitate was filtered, removed, and dried to obtain an extract. The extract is dissolved in a predetermined internal standard such as Deuterated chloroform for 1 h-nmr measurement by the ratio of the peak value of the ester compound to the internal standard peak, '笪 compound The amount of the compound is used to determine the content of the ester compound. Further, from the results of the measurement of 18 201245274 obtained, 'the molar ratios of the respective vinegar compounds (partial esters and full esters) were calculated, and the average degree of esterification was determined by the above formula (3), and the following formula (4) was used. The number average molecular weight is obtained. Further, Table 1 shows the average degree of esterification (%) with respect to the full ester. Knife η i=2 (iXNi/100) (3) (wherein: i represents the average degree of esterification; n represents the number of bases in a molecule of the polyol in the starting material; i represents the degree of esterification of the higher fatty acid ester of the polyol ; initially indicates the molar % of the full ester compound of the higher fatty acid ester of the polyol having a degree of acetification i) η Μη = Σ (MiXNi/100) (4) i = 1 (wherein Μη represents the number average molecular weight n represents the base number in a molecule of the polyol in the raw material; i represents the degree of esterification of the higher fatty acid ester of the polyol, and represents the molecular weight of the higher fatty acid ester of the polyol having a degree of esterification i; Ni represents the degree of esterification i % of the full ester compound of the polyol higher fatty acid ester. (7) Dissolved vaporized ion concentration In a clean polyolefin container, the obtained 5 〇g granules and 50 mL of ultrapure water were placed and stoppered, and after 8 hours of TC standing, the obtained solution was used with Dionex. The ion chromatograph DX-120 of the Dionex company manufactured by the company's separation column IonPacAS12A was used to determine the vapor ion concentration, and the concentration in the pellet was calculated from the obtained result. (8) The mold release load was dried after the pellet was dried at 120 ° C for 5 hours. An injection molding machine (SS75 manufactured by Sumitomo Heavy Industries, Ltd.) was used. The cylinder temperature was 320 degrees and the mold temperature was 90 degrees. The glass was used (opening diameter: 7 mm, bottom diameter: 63 mm, height). : 20 mm, thickness: 4 mm) The mold for mold release evaluation was injection molded, and the load at the time of demolding was measured by a load cell. The smaller the value, the more excellent the mold release property. (9) Contact angle 201245274 After drying the pellets at 120 ° C for 5 hours, the pellets were molded at a cylinder temperature of 28 Torr, a mold temperature of 70 C, and a molding cycle of about 130 seconds to obtain a 3 mm semiconductor storage container for a semiconductor wafer (F〇SB). s. Semiconductor wafer The storage container is inserted into a predetermined number of semiconductor turns, and after holding in a sealed container at room temperature for one week, the semiconductor wafer is taken out, and at five places on the surface, the contact angle of the pure water with the wafer surface is measured according to the @/2 method. In addition, in the examples and comparative examples, the contact angle before placing in the container was 4. Example 1 In a reactor equipped with a thermometer, a drop machine and a reflux cooler, 2194 ^ ion-exchanged water, 402 was charged. After dissolving 575 parts of 2,2-bis(4-phenyl)propane and i 2 parts of hydrated sulfite in 48% aqueous sodium hydroxide solution, 1810 parts of di-methane was added. 283 parts of phosgene treated with activated carbon was blown in for 15 minutes at 15 to 25 t. After the phosgene blowing was completed, 72 parts of 48% aqueous sodium hydroxide solution and 18 5 parts were added. The third-grade butanol is stirred and emulsified. After being treated with a homomixer after 10 minutes, it is left untreated at a temperature of 30 to 331: for 3 hours to complete the reaction. Add 1810 parts of di-methane, stir and mix for 2 minutes, then let stand and put polycarbonate tree The organic solvent solution phase is separated from the aqueous phase. ^ For the separated organic solvent solution of the polycarbonate resin, add 1 part of the water to the parent's water, and wash and separate the liquid three times to the conductivity and ion of the aqueous phase. The father changed the water almost the same. The washed polycarbonate resin was dissolved in the organic solvent * _ SUS3 () 4 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Acid tetra (2,4_di-t-butyl butyl group), the resulting polycarbonate resin organic solvent solution, charged with 45 C of warm water (occupying the inside of the dedeer) Under the space capacity of 1〇% ^, the steam is injected for one hour, while the second gas methane is removed from the inner/gull 45 C to obtain polycarbonate granules and materials. The mixture of the granules and water is powdered by a pulverizer, and is controlled by a hot water treatment tank of a shouting machine with a water temperature of 95t, and water is added to become a mixture ratio of 25 201245274 parts of granules and 75 parts of water. And mixed with a mixer for 30 minutes. The mixture of the granules and the water was separated by a centrifugal separator to obtain a granule containing 2.3% by weight of dimethicone and 10% by weight of water. Next, the powder was subjected to a SUS316L conduction heating type groove type two-shaft stirring continuous dryer controlled at 140 °C. The speed of 50 kg/Hr (converted polycarbonate resin) was continuously supplied, and the average drying time was dried for 8 hours to obtain a powder having a viscosity average & minute amount of 1.85χ1〇4 and a gas content of 50 ppm. . Next, in the obtained polycarbon «fine granules, Riken Vitamin Co., Ltd. S-100A (trade name) (main component: glyceryl monostearate) is added to the polyvinyl carbonate resin at a ratio of 100 ppm. The two-axis extruder (Nippon Steel Works Co., Ltd. yEX30o〇' will use the Nota Mixer, which will be mixed with the stool after 2 minutes. It will be supplied at the speed of 3Gkg/Hi· from the supply of 2 materials, and rotated 30 times in the spiral. Rpm, resin temperature 280, venting vacuum lkpa extrusion conditions, 融 melted strands. The melted strands of the strands were cooled and cooled to obtain particles with a diameter of 3 coffee and a length of 3 mm. The ion-exchanged water to be decarboxylated was supplied in an amount of 5 parts by weight based on 1 Torr = polycarbonate resin composition.
定、進行評估，其結—係S 實施例2 f實施例1，除了對_三級丁基酴之 外，其他與實施例1同樣地進行。 巧 物以 實施例3 々k Ϊ實施ΐ 1 ’除了不進行作為原料用光氣之活性碳處理以 外，其他與實_ 1同樣_行。 峨理以 實施例4 21 201245274 在實施例1 ’除了實施例1所得之聚碳酸酯粉粒體；與後 述之比較例4所得之聚碳酸酯粉粒體以丨：i摻合之物使用 為聚碳酸酯粉粒體以外，其他與實施例i同樣的進 實施例5 在實施例卜除了實施例i所得之聚碳酸醋粉粒體與後述 之比較例5所得之聚碳酸酯粉粒體以丨：丨摻合之物使用 聚碳酸酯粉粒體以外，其他與實施例丨同樣的進 實施例6 在實施例1，除了將理研Vitamin股份有限公司 S-100A(商品名)之添加量改為3〇〇ppm以外 實 同樣的進行。 丹貝他1夕J丄 實施例7 在實施例1，除了將理研Vitamin股份有限公司製:趾⑽沿 S-100A(商品名)之添加量改為2〇〇〇_以外，其他與實施例i 同樣地進行。 貫施例 在實施例1 ’除了添加姆於聚碳g罐樹麟3 理研Vitamin股财时3Ί製：Rikestar_EW彻(商品 2四硬驗赋四醇醋）’㈣代相對於聚碳酸酿樹脂 Oppm之理研Vuamin股份有限公司製:趾副孓 品名）以外，其他與實施例1同樣的進行。 實施例9 在實施例1，除了添加理研Vitamin股有 隱職品名），進—步添加姆於聚碳㈣樹月1 之理研Vitamin股份魏公⑽:Rik_i_Ew_4 时名)以外，其他與實施例1同樣的進行。 比較例1 在實施例1，除了在熔融押出時，使 助劑以外，其他與實施例i同樣的進行使用#作為去揮' 比較例2 22 e e201245274 在比較例1，除了不進行作為原料使用之光氣之活性碳處 理以外，其他與比較例1同樣的進行。 比較例3 在實施例1 ’除了將光氣之添加量改為276份以外，其他 與實施例1同樣的進行。 、 比較例4 在實施例1，除了將反應完成後水相與分離的聚碳酸醋樹 脂之有機溶劑溶液之離子交換水所致洗淨及分液次數改為j 次以外，其他與實施例1同樣的進行。 比較例5 在實施例1，除了將傳導受熱式溝型二軸攪拌連續乾燥機 之材質改為SUS304以外，其他與實施例丨同樣的進行。 比較例6 在實施例1，除了不添加理研Vitamin股份有限公司製： RikemalS_100A(商品名)以外，其他與實施例！同樣的進行。 比較例7 在實施例1 ’除了添加相對於聚碳酸酯樹脂為50ppm之 3,4-%氧％己烯基甲基-3'，4'-環氧環己烯叛酸酉旨，以替代相對於 聚碳酸酯樹脂為lOOOppm之理研vitamin股份有限公司製： RikemalS-ΙΟΟΑ(商品名)以外，其他與實施例1同樣的進行。 比較例8 在實施例1，除了將理研Vitamin股份有限公司製:Rikemal S-100A(商品名)之添加量改為3〇〇〇ppm以外，其他與實施例1 同樣的進行。 比較例9 在實施例1，除了添加相對於聚碳酸酯樹脂為300ppm之 理研Vitamin股份有限公司製：Rikestar_EW_4〇〇(商品名），以 替代添加相對於聚碳酸酯樹脂為1⑽Qppm之理研仰膽匕股份 有限公司製：Rikemal S-100A(商品名）以外，其他與實施例j 同樣的進行。 23 201245274 比較例l〇 在實施例1 ’除了添加彳目胁雜__旨為6_ppm之 理研Vitamin股份有限公司製：Rikestar_EW_4⑻(商品名），以 替代添加相對於聚碳酸酯樹脂為lOOOppm之理研Vitamin股份 有限公司製：Rikemal S-100A(商品名)以外，其他與實施例1 同樣的進行。 、 24 201245274 产 I< 實施例3 00 ί—Η in CN σ\ (N 0.02 0.02 0.07 卜 — 359 0.039 1 1 1 1 1 0.07 卜 寸 0.039 Os 實施例2 2.20 g (N ro 0.02 0.02 0.07 卜 寸 359 0.039 1 1 1 1 1 0.07 卜 寸 0.039 卜 130 寸 實施例1 IT) 00 m g 卜 «Ν 0.02 0.02 0.07 卜 寸 359 0.039 1 幽 1 1 1 0.07 卜 寸 0.039 寸 Μ 1.4 〜3.0 5以下 3以下 合計 40以下 合計 0.1以下 30-99 0.01-0.5 0.1-10.0 1 0.001-0.1 30 〜99 0.01 〜0.5 0.1-10.0 1 0.001 〜0.1 30-99 0.01~0.5 0.1-10.0 0.001-0.1 1 1 1 單位 X ppm ppm ppm ppm ppm ppm 1 1 1 1 1 1 1 1 "α- α. 〇 黏度平均分子量 氣原子 四氣化碳(檢測界線：0.05) 對三級丁酚 健酚A 签 黎 平均酯化度(A) 含量（B) (100-A) xB Μη (100-Α) χηχΒ/Μη 平均酯化度(Α) 含量（Β) (100-A) xB 1 (100-Α) χηχΒ/Μη 平均酯化度(A) 含量（Β) (100-A) xB (100-Α) χηχΒ/Μη m 脫模負荷 接觸角 第一種 第二種 合計 *«r -O m 效 酌·化合物 1 酯化合物類 顆粒 晶圓 顆粒 評估結果 201245274 §Ι< 實施例6 1.85 g 00 <N 0.02 0.02 ro 0.02 359 0.011 1 1 1 I 1 ΓΛ 0.02 r-H 0.011 00 200 寸 實施例5 1.85 ro g 00 Ο 0.02 0.08 0.07 359 0.039 幽 1 1 1 1 0.07 卜 0.039 m 實施例4 1.85 § 卜 CN 0.08 0.02 ΓΛ m 0.07 卜 寸 359 0.039 1 1 1 1 1 ro 0.07 卜 寸 0.039 範圍 1.4 〜3.0 5以下 3以下 合計 40以下 合計 0.1以下 30 〜99 0.01-0.5 0.1-10.0 1 0.001-0.1 30-99 0.01~0.5 0.1-10.0 1 0.001-0.1 30-99 0.01~0.5 0.1-10.0 0.001 〜0.1 1 1 1 單位 X ppm ppm Ppm 卯m ppm ppm 1 1 1 1 1 1 1 1 a. G0 Μ 0 黏度平均分子量 氣原子 四氣化碳(檢測界線：0.05) 對三級丁酚 雙酚A % 平均酯化度(A) 含量（B) (100-Α) χΒ 1 (100-Α) χηχΒ/Μη 平均酯化度(Α) 含量（Β) (100-Α) χΒ i (100-Α) χηχΒ/Μη 平均酯化度(A) 含量（Β) (100-Α) χΒ C OQ X c X /-N < ό o T-H 溶離氯化物離子 脫模負荷 接觸角 第一種 tlAil Ί 城 « 合計 紛化合物 酯化合物類 顆粒 晶圓 顆粒 評估結果 201245274 §I< 實施例9 1.84 g 卜 CN 0.02 〇 〇 0.07 卜 359 0.039 00 0.35 卜 〇 1176 0.002 0.42 寸 iT) 0.041 (Ν iTi Os 實施例8 1.84 g 卜 0.02 0.02 00 Os 0.27 〇 1176 0.002 1 1 1 1 1 00 〇\ 0.27 Ο 0.002 (Ν 150 v〇 實施例7 00 g 00 0.02 0.02 0.14 寸 〇\ 359 0.078 1 1 1 1 1 ΓΛ 0.14 寸 Os 0.078 CN Ό 範圍 1.4〜3.0 5以下 3以下 合計 40以下 合計 0.1以下 〇\ C\ Ϊ 〇 0.01 〜0.5 0.1 〜10.0 1 0.001 〜0.1 30-99 0.01 〜0.5 0.1 〜10.0 1 0.001 〜0.1 30 〜99 0.01 〜0.5 0.1 〜10.0 0.001 〜0.1 I 1 1 單位 1—Η ppm ppm ppm ppm ppm ppm 1 1 t 1 1 1 幽 1 Έ- α. 〇 黏度平均分子量 氣原子 四氣化碳(檢測界線：0.05) 對三級丁酚 雙酚A 平均酯化度(A) 含量（B) (100-Α) χΒ I (100-Α) χηχΒ/Μη 平均酯化度(A) 含量（B) CQ X < 〇 〇 Μη (100-Α) χηχΒ/Μη 平均酯化度(A) 含量（B) (100-Α) χΒ (100-Α) χηχΒ/Μη 溶離氣化物離子 脫模負荷 接觸角 第一種 Ψ Ί 姝 合計 盼化合物 酯化合物類 j 顆粒 晶圓 顆粒 評估結果 201245274 (wl < 比較例3 CN 00 g 00 0.02 0.02 0.07 卜 寸· 359 0.039 1 1 1 1 1 cn r^) 0.07 卜 寸 0.039 寸 比較例2 1.85 〇 (N 00 CS 0.02 0.02 C^i m 0.07 卜 寸· 359 0.039 1 1 1 1 1 m 0.07 卜 寸· 0.039 00 00 比較例1 1.85 »Τί Ο 〇 0.02 0.02 ro 0.07 卜 寸 359 0.039 1 1 1 1 1 m 0.07 卜 寸_ 0.039 iT) v〇 00 範圍 〇 1 寸 5以下 3以下 合計 40以下 合計 0.1以下 30 〜99 0.01 〜0.5 0.1 〜10.0 1 0.001 〜0.1 30 〜99 0.01 〜0.5 0.1 〜10.0 1 0.001 〜0.1 30 〜99 0.01〜0.5 0.1 〜10.0 0.001〜0.1 1 1 1 單位 X ppm ppm ppm ppm ppm ppm 1 t 1 1 幽 1 1 1 "α- α. 〇 黏度平均分子量 氣原子 四氣化碳(檢測界線:〇·〇5) 對三級丁酚 雙酚A 敏 平均酯化度(A) 含量（B) (100-Α) χΒ 1 (100-Α) χηχΒ/Μη 平均酯化度(Α) 含量（Β) (100-Α) χΒ I (100-Α) χηχΒ/Μη 平均酯化度(A) 含量（B) PQ X /-N < ό 〇 (100-Α) χηχΒ/Μη 溶離氣化物離子 脫模負荷 接觸角 第一種 第二種 合計 盼化合物 酯化合物類 顆粒 晶圓 顆粒 評估結果 201245274 (憋) 比較例6 1_L85I ND 卜 0.02 0.02 1 1 1 1 1 1 1 1 I 1 t 1 1 1 00 340 寸 比較例5 1.85 § 00 〇\ <N 0.02 0.15 m cn 0.07 卜 寸 359 0.039 1 幽 1 1 1 m ΓΛ 0.07 卜 0.039 寸 比較例4 1.85 g 卜 0.14 0.02 0.07 卜 寸 359 0.039 1 1 1 1 1 ΓΛ 0.07 卜 — 0.039 (N I-H 1.4 〜3.0 5以下 3以下 合計 40以下 合計 0.1以下 30 〜99 0.01 〜0.5 0.1 〜10.0 1 0.001 〜0.1 30 〜99 0.01 〜0.5 0.1 — 10.0 1 0.001 〜0.1 30 〜99 0.01 〜0.5 0.1 〜10.0 0.001 〜0.1 1 1 1 單位 xlO4 ppm ppm ppm ppm ppm ppm 1 1 1 幽 1 1 1 1 a α- t+H C50 0 黏度平均分子量 氣原子 四氣化碳(檢測界線:0.05) 對三級丁酚 雙酚A 黎 平均酯化度(A) 含量（B) (100-Α) χΒ Μη (100-Α) χηχΒ/Μη 平均酯化度(Α) 含量（Β) (100-Α) χΒ 1 (100-Α) χηχΒ/Μη 平均酯化度(A) 含量（B) (100-Α) χΒ (100-Α) χηχβ/Μη 溶離氯化物離子 脫模負荷 接觸角 第一種 Ψ Ί 姝 合計 盼化合物 化合物類 顆粒 晶圓 顆粒 評估結果 201245274 §ι< 比較例10 00 g 卜 〇 CS 0.02 0.02 00 〇\ 0.55 1176 0.004 1 1 1 1 1 00 〇> 0.55 0.004 〇 比較例9 1.85 g v〇 CS 0.02 0.02 00 0.03 0.06 11176__I 0.0002 1 1 1 1 1 00 Os 0.03 0.016 0.0002 ON 比較例8 1.80 m g 00 0.02 0.02 m m 0.21 14.1 359 0.118 1 1 1 1 1 ro 0.21 14.1 0.118 <N 比較例7 iT) 00 g v〇 (N 0.02 0.02 1 幽 1 1 1 1 1 1 1 1 1 1 1 1 画 1.4—3.0 5以下 3以下 合計 40以下 合計 0.1以下 30 〜99 0.01-0.5 0.1 〜10.0 1 0.001 〜0.1 30 〜99 0_01 〜0.5 0.1 〜10.0 幽 0.001 〜0.1 30 〜99 0.01 〜0.5 0.1 〜10.0 0.001 〜0.1 1 單位 ppm ppm ppm ppm ppm ppm 1 1 1 1 1 1 1 1 t 黏度平均分子量 氯原子 四氣化碳(檢測界線:0.05) 對三級丁酚 雙酚A 签 Μ 平均酯化度(A) 含量（B) (100-Α) χΒ Μη (100-Α) χηχΒ/Μη 平均酯化度(Α) 含量（B) (100-Α) χΒ I (100-Α) χηχΒ/Μη 平均酯化度(A) 含量（B) (100-Α) χΒ (100-Α) χηχΒ/Μη 溶離氣化物離子 第一種 USul '1 城 合計 紛化合物 酯化合物類 顆粒 顆粒 評估結果 οε 201245274 ο 330 ^Τ) § 寸 1-Η 340 寸 1 1 iso 〇 1脫模負荷 接觸角 固 < 201245274 發明效果 ^ 本發明之樹脂組成物’成形時之脫模性優異。又本發明之 薄板收納搬送容器，可減低對表面污染敏感的半導體晶圓或磁 碟等之薄板表面污染’其可達賴玉業上效果格外優良。 產業上可利用性 本發明之薄板收納搬送容 板之收納搬送容器極為有用。 器作為半導體晶圓或磁碟等薄 【圖式簡單說明】 無。 【主要元件符號說明】 無。 32The evaluation was carried out in the same manner as in Example 1 except that Example 1 was carried out in the same manner as in Example 1 except that the third-stage butyl hydrazine was used. The exemplification of Example 3 々k ΐ 1 ′ is the same as the actual _ 1 except that the activated carbon treatment of phosgene as a raw material is not carried out. Treatment Example 4 21 201245274 In Example 1 'The polycarbonate granules obtained in addition to Example 1; and the polycarbonate granules obtained in Comparative Example 4 described later were used as y:i blends. Other than the polycarbonate granules, the same Example 5 as in Example i was used in the examples except for the polycarbonate granules obtained in Example i and the polycarbonate granules obtained in Comparative Example 5 described later.丨: In addition to the use of polycarbonate granules in the blend of ruthenium, the same as in Example 进 Example 6 was carried out in Example 1, except that the addition amount of Riken Vitamin Co., Ltd. S-100A (trade name) was changed. It is carried out in the same manner as 3 〇〇 ppm. Danbetan 1 丄 Example 7 In Example 1, except that the amount of the toe (10) manufactured by Riken Vitamin Co., Ltd. was changed to 2 〇〇〇_ along the S-100A (trade name), the other examples were i does the same. The example in the example 1 'in addition to the addition of m in the poly carbon g tank tree Lin 3 Riken Vitamin wealth 3 system: Rikestar_EW Che (commodity 2 four hard test four alcohol vinegar) 'four generations relative to the polycarbonate resin Oppm The same procedure as in Example 1 was carried out except that the company was manufactured by Vaughan Co., Ltd.: the name of the toe and the product. Example 9 In the first embodiment, except that the Riken Vitamin stock has a hidden product name, and the step of adding the Mercury (four) tree month 1 to the Riken Vitamin Share (Wei Gong (10): Rik_i_Ew_4), and the other embodiment 1 The same goes on. Comparative Example 1 In Example 1, except that the auxiliary agent was used in the case of melting and extruding, the same procedure as in Example i was carried out using # as the de-swing 'Comparative Example 2 22 e e201245274 In Comparative Example 1, except that it was not used as a raw material. The same procedure as in Comparative Example 1 was carried out except for the activated carbon treatment of phosgene. Comparative Example 3 The same procedure as in Example 1 was carried out except that the amount of phosgene added was changed to 276 parts. Comparative Example 4 In Example 1, except that the number of washing and liquid separation times of the aqueous phase and the ion exchange water of the organic solvent solution of the separated polycarbonate resin after the completion of the reaction was changed to j times, the same as Example 1 The same goes on. Comparative Example 5 In the same manner as in Example 1, except that the material of the conduction heating type groove type two-axis stirring continuous dryer was changed to SUS304. Comparative Example 6 In Example 1, except that Rikemal S_100A (trade name) manufactured by Riken Vitamin Co., Ltd. was not added, the other examples were carried out! The same goes on. Comparative Example 7 In Example 1 'In addition to the addition of 3,4-% oxygen % hexenylmethyl-3',4'-epoxycyclohexene oxetate 50 ppm relative to the polycarbonate resin, It was carried out in the same manner as in Example 1 except that Rikemal S-ΙΟΟΑ (trade name) was used for a polycarbonate resin of 1000 ppm. Comparative Example 8 The same procedure as in Example 1 was carried out except that the amount of Rikemal S-100A (trade name) manufactured by Riken Vitamin Co., Ltd. was changed to 3 〇〇〇 ppm. Comparative Example 9 In Example 1, except that Rikestar_EW_4〇〇 (trade name) was prepared by Riken Vitamin Co., Ltd., which was 300 ppm with respect to the polycarbonate resin, instead of adding 1 (10) Qppm relative to the polycarbonate resin. The company's production system: Rikemal S-100A (trade name) was carried out in the same manner as in the example j. 23 201245274 Comparative Example 1 In Example 1 'In addition to the addition of 彳目胁 ______________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________________ Other than the Rikemal S-100A (trade name), the same procedure as in the first embodiment was carried out. 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 24 0.039 1 1 1 1 1 0.07 Bu inch 0.039 Bu 130 inch Example 1 IT) 00 mg Bu «Ν 0.02 0.02 0.07 Bu inch 359 0.039 1 sec 1 1 1 0.07 Bu inch 0.039 inch Μ 1.4 ～3.0 5 or less 3 or less total 40 The following total 0.1 or less 30-99 0.01-0.5 0.1-10.0 1 0.001-0.1 30 ～ 99 0.01 〜 0.5 0.1-10.0 1 0.001 〜 0.1 30-99 0.01~0.5 0.1-10.0 0.001-0.1 1 1 1 Unit X ppm ppm ppm Ppm ppm ppm 1 1 1 1 1 1 1 1 "α- α. 〇 Viscosity average molecular weight gas atom four gasification carbon (detection boundary: 0.05) average esterification degree of tertiary butyl phenol phenol A (A) Content (B) (100-A) xB Μη (100-Α) χηχΒ/Μη Average esterification degree (Α) Content (Β) (100-A) xB 1 (100-Α) χηχΒ/Μη Average esterification degree ( A) Content (Β) (100-A) xB (100-Α) χηχΒ/Μη m Release load contact angle First type second total *«r -O m Effect · Compound 1 Ester compound particle wafer particle evaluation result 201245274 § Ι < Example 6 1.85 g 00 < N 0.02 0.02 ro 0.02 359 0.011 1 1 1 I 1 ΓΛ 0.02 rH 0.011 00 200 inch Example 5 1.85 ro g 00 Ο 0.02 0.08 0.07 359 0.039 幽1 1 1 1 0.07 卜 0.039 m Example 4 1.85 § 卜 CN 0.08 0.02 ΓΛ m 0.07 寸 inch 359 0.039 1 1 1 1 1 ro 0.07 卜 inch 0.039 range 1.4 ～3.0 5 or less 3 or less total 40 or less Total 0.1 or less 30 to 99 0.01-0.5 0.1-10.0 1 0.001-0.1 30-99 0.01~0.5 0.1-10.0 1 0.001-0.1 30-99 0.01~0.5 0.1-10.0 0.001 ~0.1 1 1 1 Unit X ppm ppm Ppm 卯m ppm ppm 1 1 1 1 1 1 1 1 1 a. G0 Μ 0 Viscosity average molecular weight gas atom four gasified carbon (detection boundary: 0.05) for tertiary butyl bisphenol A % average esterification degree (A) content (B ) (100-Α) χΒ 1 (100-Α) χηχΒ/Μη Average esterification degree (Α) Content (Β) (100-Α) χΒ i (100-Α) χηχΒ/Μη Average esterification degree (A) Content (Β) (100-Α) χΒ C OQ X c X /-N < ό o TH Dissociated chloride ion release load contact angle The first type of tlAil «城« Total compound ester compound particle wafer particle evaluation result 201245274 § I< Example 9 1.84 g 卜CN 0.02 〇〇0.07 卜 359 0.039 00 0.35 〇1176 0.002 0.42 inch iT) 0.041 (Ν iTi Os Example 8 1.84 g Bu 0.02 0.02 00 Os 0.27 〇1176 0.002 1 1 1 1 1 00 〇\ 0.27 Ο 0.002 (Ν 150 v〇Example 7 00 g 00 0.02 0.02 0.14 inch 〇 \ 359 0.078 1 1 1 1 1 ΓΛ 0.14 inch Os 0.078 CN 范围 range 1.4 to 3.0 5 or less 3 or less total 40 or less total 0.1 or less C \ C\ Ϊ 〇 0.01 ～ 0.5 0.1 〜10.0 1 0.001 〜 0.1 30-99 0.01 〜 0.5 0.1 〜10.0 1 0.001 〜 0.1 30 ～99 0.01 ～0.5 0.1 〜10.0 0.001 ～0.1 I 1 1 Unit 1—Η ppm ppm ppm ppm ppm ppm 1 1 t 1 1 1 幽1 Έ- α. 〇 Viscosity average molecular weight gas atom four gasification carbon (detection Boundary line: 0.05) Average esterification degree (A) of tertiary butyl bisphenol A (B) (100-Α) χΒ I (100-Α) χηχΒ/Μη Average esterification degree (A) Content (B) CQ X < 〇〇Μη (100-Α) χηχΒ/Μη Average esterification degree (A) Content (B) (100-Α) χΒ (100-Α) χηχΒ/Μη Dissolved vaporized ion ion release load contact angle First type Ψ 姝 计 化合物 化合物 化合物 化合物 化合物 化合物Particle Wafer Particle Evaluation Results 201245274 (wl < Comparative Example 3 CN 00 g 00 0.02 0.02 0.07 Bu inch · 359 0.039 1 1 1 1 1 cn r^) 0.07 Bu inch 0.039 inch Comparative Example 2 1.85 〇 (N 00 CS 0.02 0.02 C^im 0.07 卜· 359 0.039 1 1 1 1 1 m 0.07 卜· 0.039 00 00 Comparative example 1 1.85 »Τί Ο 〇0.02 0.02 ro 0.07 寸 inch 359 0.039 1 1 1 1 1 m 0.07 寸_ 0.039 iT) v〇00 range 〇1 inch 5 or less 3 or less total 40 or less total 0.1 or less 30 to 99 0.01 to 0.5 0.1 to 10.0 1 0.001 to 0.1 30 to 99 0.01 to 0.5 0.1 to 10.0 1 0.001 to 0.1 30 to 99 0.01 0.5 0.1 〜10.0 0.001~0.1 1 1 1 Unit X ppm ppm ppm ppm ppm ppm 1 t 1 1 幽1 1 1 "α- α. 〇 Viscosity average molecular weight gas atom four gasified carbon (detection boundary: 〇·〇5 ) for tertiary butyl bisphenol A Average esterification degree (A) Content (B) (100-Α) χΒ 1 (100-Α) χηχΒ/Μη Average esterification degree (Α) Content (Β) (100-Α) χΒ I (100-Α) χηχΒ /Μη average esterification degree (A) content (B) PQ X /-N < ό 〇(100-Α) χηχΒ/Μη Dissolved gasification ion release load contact angle The first second type of compound ester compound Particle-like wafer particle evaluation result 201245274 (憋) Comparative Example 6 1_L85I ND 0.02 0.02 1 1 1 1 1 1 1 1 I 1 t 1 1 00 340 inch Comparative Example 5 1.85 § 00 〇\ <N 0.02 0.15 m Cn 0.07 卜寸359 0.039 1 幽1 1 1 m ΓΛ 0.07 卜 0.039 inch comparative example 1.85 g 卜 0.14 0.02 0.07 寸 inch 359 0.039 1 1 1 1 1 ΓΛ 0.07 卜 — 0.039 (N IH 1.4 ～3.0 5 or less 3 or less Total 40 or less total 0.1 or less 30 to 99 0.01 to 0.5 0.1 to 10.0 1 0.001 to 0.1 30 to 99 0.01 to 0.5 0.1 — 10.0 1 0.001 to 0.1 30 to 99 0.01 to 0.5 0.1 to 10.0 0.001 to 0.1 1 1 1 Unit xlO4 ppm Ppm ppm ppm ppm ppm 1 1 1 幽1 1 1 1 a α- t+H C50 0 Degree average molecular weight gas atom four gasification carbon (detection boundary: 0.05) to tertiary butyl bisphenol A average esterification degree (A) content (B) (100-Α) χΒ Μη (100-Α) χηχΒ/Μη Average esterification degree (Α) Content (Β) (100-Α) χΒ 1 (100-Α) χηχΒ/Μη Average esterification degree (A) Content (B) (100-Α) χΒ (100-Α) χηχβ/ Μη Dissociated chloride ion release load contact angle First Ψ 姝 计 化合物 化合物 化合物 化合物 化合物 化合物 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 1 1 00 〇> 0.55 0.004 〇Comparative Example 9 1.85 gv〇CS 0.02 0.02 00 0.03 0.06 11176__I 0.0002 1 1 1 1 1 00 Os 0.03 0.016 0.0002 ON Comparative Example 8 1.80 mg 00 0.02 0.02 mm 0.21 14.1 359 0.118 1 1 1 1 1 ro 0.21 14.1 0.118 <N Comparative Example 7 iT) 00 gv〇(N 0.02 0.02 1 幽1 1 1 1 1 1 1 1 1 1 1 1 Drawing 1.4-3.0 5 or less 3 or more total 40 or less total 0.1 or less 30 ~99 0.01-0.5 0.1 ~10.0 1 0.001 ~0.1 30 ~99 0_01 ~0 .5 0.1 〜10.0 sec 0.001 〜0.1 30 〜99 0.01 〜0.5 0.1 〜10.0 0.001 〜1 1 unit ppm ppm ppm ppm ppm ppm 1 1 1 1 1 1 1 1 t Viscosity average molecular weight chlorine atom four gasification carbon (detection boundary :0.05) For the third-grade butanol bisphenol A, the average esterification degree (A) content (B) (100-Α) χΒ Μη (100-Α) χηχΒ/Μη average esterification degree (Α) content (B) (100-Α) χΒ I (100-Α) χηχΒ/Μη Average esterification degree (A) Content (B) (100-Α) χΒ (100-Α) χηχΒ/Μη Dissolved vaporized ion first USul '1 City total compound ester compound particle particle evaluation result οε 201245274 ο 330 ^Τ) § inch 1-Η 340 inch 1 1 iso 〇1 release load contact angle solid < 201245274 effect of the invention ^ resin composition of the invention 'forming Excellent release properties at the time. Further, the thin plate accommodating and conveying container of the present invention can reduce the surface contamination of a thin plate such as a semiconductor wafer or a disk which is sensitive to surface contamination. Industrial Applicability The storage and conveyance container of the sheet storage and conveyance container of the present invention is extremely useful. The device is thin as a semiconductor wafer or a disk. [Simple description of the drawing] None. [Main component symbol description] None. 32