201241407 ·, 六、發明說明： ’ 【發明所屬之技術領域】 本發明係有關於-種感應 種距離感應器單元之製造方法。 、 / ，尤指一 -【先前技術】 隨著電子產品的發展，許 於在電子系統内實行操作，例如按=輸入裝置目前可用 球、觸控螢幕等等。而近來觸::用建越：鼠、執跡 觸控勞幕可包括觸控面板，其可為具有觸越:遍， 板，以便作業表面覆蓋於顯示螢幕之可檢視明面 幕允許使用者藉由手指或觸严 觸控螢 並移動游標，並根觸控事⑽成運螢幕作出選擇 近接式感測器(irp，，叫則大量庫料2 :::裝置上，以用於偵測使用者的臉部與顯；螢幕之 巨離，進而達到操作上的控制效果。 、 近接式感測器可應用於手持式產品，例如當 ίΐ用寺’榮幕會自動鎖定，藉此延長軸 i螢板在使用者頭部靠近螢幕時，自動鎖 ^幕H免通話中頭部誤觸鍵盤而中斷對話 1雕長曰距離的近接式感測器可傾測距離約在2 0至8 0 c m之 否靠近’當使用者離開時可自動關閉電源功能，可 應用於顯示器等相關產品。 近接式感測器具有一訊號發射元件器（emitter·)及一 訊號偵測器（detector )，為了避免訊號的串擾（咖續）， 4/16 201241407 為知的近接式感測器結構係先以封裝材料將訊號發射元 件器及訊號偵測器加以封裝之後，再以金屬框架卡合於上 .述的封泉結構，利用金屬框架形成具有訊號隔離作用的屏 障結構^旦上述結構具有以下缺失：金屬框架的製作與結 構有其複雜性；且封裝結構上需塗膠，利用膠黏的方式固 定上述金屬框架，然而黏膠的塗佈不易控制，膠量太多將 造成&勝的問題；膠量太少，金屬框架的固定度不佳，容 易脫洛或位移，將導致訊號的隔離度不佳。 再者，在元件體積縮小化的趨勢下，金屬框架與封裝 構必須具有相當高的精度，才得以相互組接而形成高隔 離效果的感測器單元，因此製程的難度大幅提高，且產品 的良率更無法有效提升。 【發明内容】 5玄製造方法刹田指；生本跡I Λι|,口 w .201241407 ·, VI. Description of the invention: ′ Technical field to which the invention pertains The present invention relates to a method of manufacturing a sensing type distance sensor unit. , /, especially one - [Prior Art] With the development of electronic products, it is permissible to operate in electronic systems, such as pressing the input device, currently available balls, touch screens, and so on. Recently, the touch:: Jian Jian: The mouse, the trace touch screen can include a touch panel, which can be used to have a touch: the pass, the board, so that the work surface covers the display screen, the visible screen allows the user Touch the flash and move the cursor with your finger or touch it, and make a selection of the proximity sensor (irp, called the mass storage 2 ::: device for detecting The user's face and display; the screen is greatly separated, thereby achieving operational control effects. The proximity sensor can be applied to handheld products, for example, when the temple is automatically locked, the axis is extended. When the user's head is close to the screen, the auto-locking screen H avoids the head in the call and interrupts the dialogue. The proximity sensor of the long-distance distance can be tilted at about 20 to 80. Whether the cm is close to 'automatically turn off the power function when the user leaves, can be applied to related products such as monitors. The proximity sensor has a signal transmitter (emitter) and a signal detector (detector), in order to avoid Crosstalk of signals (continued), 4/16 201241407 The known proximity sensor structure first encapsulates the signal transmitting component and the signal detector with the encapsulating material, and then the metal frame is engaged with the sealing spring structure described above, and the metal frame is used to form the signal isolation function. The barrier structure has the following defects: the fabrication and structure of the metal frame has its complexity; and the package structure needs to be glued, and the metal frame is fixed by adhesive means, but the coating of the adhesive is not easy to control, the glue Too much will cause the problem of &win; the amount of glue is too small, the metal frame is not fixed, and it is easy to get detached or displaced, which will result in poor signal isolation. Moreover, under the trend of component size reduction The metal frame and the package structure must have a relatively high precision, so that they can be connected to each other to form a sensor unit with high isolation effect, so that the difficulty of the process is greatly improved, and the yield of the product cannot be effectively improved. 5 Xuan manufacturing method brake field refers to; raw trace I Λι|, mouth w.
精度的吼現隔離結構。 、本，明之目的之―，在於提供—種感應器單元之製造 號偵測 器的隔 本發明實施例係提供一 一種感應器單元之製造方法，The accuracy of the isolation structure. The purpose of the present invention is to provide a method for manufacturing a sensor unit. The embodiment of the present invention provides a method for manufacturing an inductor unit.
電路區域上；利用一模具將一封裝結構成 5/16 '' 1 . 201241407 ft該基板上，該封裝結構係包覆該至少兩個電路區域、 該至少兩個電路區域上的該訊號發射器二 :::二及每個電路區域之間所定義的-切割區 社構:-：區域之間所定義的該切割區域對該封裝 ==步於該至少兩個電路區域之間 於每一兮咸^直到曝路出該基板；以及將一隔離件組裝 板的，ϋ怎益區域’並將該隔離件設置於已曝露出該基 扳的该隔離切割谨卜 Ρ 土 發射器與該訊制測器母一個感應器區域之該訊號 本發明具有以下有益的效果··本發明 =間〜且利用㈣的方式將隔離件組裝於每庫。 本的效果;而本發明所製作的感 有絕結構，使該感應器單元具 閱以進-步瞭解本發明之特徵及技術内容，請參 #夫考^發明之詳細說明與關，然而所附圖式僅提 仏參考與況明用，並非用來對本發明加以限制者。气做 【實施方式】 。月參閱圖！至圖3,並配合圖4 感應器單元i之势土月係美供一種 方法與組梦陪施 ，^衣以方法係利用一次的模造 隔離，其具'有3進行感應器單元1的封裝與元件 裝方式之缺失制：成本之功效’更可以解決傳統的組 ^ 、 /、‘造方法包括如下步驟： 乂驟（）.提供一基板s，基板S上包含有複數個 6/16 201241407 感應器區域1 〇。如圖1所示，在本具體實施例中，該基 板S上包含有6乘6個感應器區域1 〇的陣列，而每―感 應器區域1 0在完成後述之製程後均會形成一個感應器 單元1 (如圖4、圖5所示）。每一感應器區域丄〇在該基 板S的表面與内部設有兩個獨立的電路區域丄〇丄' 1 & 2 (但該電路區域1 〇 1 ' 1〇2的數目可為兩個以上）， 而在本實施例中，感應器單元i之訊號發射器丄丄及訊號 偵測器1 2則分別安裝於每一個感應器區域χ 〇之二= 電路區域101、102上，如固晶、打線等方法，= 號發射器1 1及訊號谓測器丄2則分別電性連 域1 〇 1、1 0 2上之電路1 〇 〇 (如圖6所示）。 具體實施例中該感應器單元工係為一種近接式感廣哭 (Ρ则mity senso丨，），而該訊號發射器工工係為發光^ =mi叫，該訊號偵測器1 2則為㈣測元、 (detector) ’上述的訊號發射器2 i及訊號偵測 利用晶片黏著方法（die attaching )分別固执於 > 乙 器區域1〇之該兩電路區域1〇1:=:母-個感應 :訊歸射器"及訊號偵測器”電性連:::： 對應之该電路區域101、102之電路100。'斤 美板2 (二)·利用一模具成型-封裝結構1 〇 4㈣ = ==，_料成型於該基板； 2。請復參考圖卜在本具體實施例中，偵測器丄 未不）進行模造步，驟，以將封裝材料固化成刑抵具（圖 包覆上述之電路區域1 0 1、1 〇 2、而覆蓋、 乙说唬發射器11及 7/16 201241407 • · » » 訊號制器1 2，且電路區域工〇丄、丄〇 2之間定義有 一切割區域。而在本模造步驟中所使用的封裝材料，其特 陘必須可使訊5虎發射器11所發出的光訊號及訊號偵 ΐ 2所欲接收的光訊號穿透之，以避免影響到該感應 益早兀1的運作。舉例來說，該訊號偵測器工2可為一種 整合式.的距離與環境光源偵測元件（integrated — and P mity sens〇1 ) ’该封裝材料則為可透光之封裝材料（如 ★扣molded materia丨）；或是訊號偵測器1 2可為一種單 (IR sensor), 2裝材㈣為可讓紅外光穿透之難材料，換言之，本發 姑=不限疋封裝結構1 0 4的材f，但封裝結構1 〇 4的 根據訊號發射器11及糊測器12的規格 性下U避免封裝結構10 4造成感應器單元1的特 而，封裝結構1 Q 4可職於訊號發射器1 1 :成凸狀的封裳體’以利訊號發射器U發出電磁訊 (二）Γ^γ ). &除該模具並進行—切割步驟。待步驟 模具自該基板s 亥封#結構10 4後，將該 在此牛驟由及知除，以進行切割步驟。請參考圖2, 1 〇“邊利用刀具等切割工具沿著每-感應器區域 =3=割"形成切割道10 5,換言之，該切 域1 0 1、1 〇 2 應器區域1 〇之該兩電路區 該切割步驟更於每的感應器區域10。再者， …、丄二的該兩電路區域 汀頂先疋義的切割區域進行切割，以 8/16 201241407 :成隔離切割道1且該隔離切割道1〇3的 道10 5，該隔離切割道1 ◦3可曝露二: 割=與隔:切割道… 測次:=11,以及電路區域10 马了達成曝露出該基板S的目的，隔離切 0 3的喊係於該封裝結構丄Q 4之厚度，以使該 二〜1^ 3冋下延伸至該基板S中而曝露出基板 ，換έ之，該切割步驟除了移除封裝結構1 〇 4的好 =更向下移除該基板S的部分材料，以形成隔離切割： 、◦ 3 ’而在本具體實施例中，該切割步驟係、移除約0.2 么釐沬之該基板s,但不以上述為限。 心〉驟（四）ϋ離件13組裝於每-該感應器區 二〇 , ’/χ將該隔離件1 3設置於已曝露出基板s的該隔 ❹心1 0 3上。請參考圖3 ’在本步驟中，係提供多 们，離件1 3 ’隔離件1 3係與封裝結構1 〇 4配合，使 :離件1 3組裝於感應器區域丄〇上，並固定於隔離切割 '()3之中以形成隔離結構。由於上述隔離切割道1 〇 3 ir'將。fl號發射端（包括電路區域1 ◦ 1與訊號發射器 j 1 ) 14 Λ號接收端（電路區域與1 〇 2訊號偵測器1 2 ) 區^成兩個區域，因此，當隔離件1 3組裝於感應器區域 1 〇上之封裝結構1 〇 4 ,隔離件1 3即可用於隔離每一 固感應為單元1之該訊號發射器1 1與該訊號偵測器1 2，以避免兩元件之間的訊號串擾（crosstalk)。 9/(6 201241407 · … 再者，隔離件1 3最佳地係為可隔絕紅外光之材料所 固化成型，藉此，隔離件工3可視為一種紅外光之阻絕处 構（IR barrier)。在一具體實施例中，隔離件工3係利用。 -射出成型步驟將可隔絕紅外光之塑料成型，而如圖4、 圖5所示，隔離件工3可包括一封裝頂板工3工、_隔離 板1 3 3及多個封裝側板工3 2，該封裝頂板丄3丄上門 設有-對應該訊號發㈣！ i的發射孔位i 3 ◦ a及二 對應該訊號偵測器1 2的接收孔位丄3 〇 b。因此，在前 述組裝步驟中，封裝頂板1 3 1係對應地安裝於封裝結^ 1 0 4的頂面，並彻發射孔幻3 Q a及接收孔位工3 0 b裸露出訊號發射器工工與該訊號偵測器工2，以 訊號經過封裝結構i 〇4的頂面所產生的干擾；而封裝側 板1 3 2則可圍繞於封裝結構工◦4的側面，隔離板丄3 3則組設於隔離切割道丄Q 3以隔離每—個感應器區域 1 0之s亥訊號發射器1 1與該訊號偵測器1 2。 _再一方面，考慮到該基板S表面的平整度，為了避免 隔離板1 3 3之底面與基板s表面的接觸態樣不佳，而導 致訊號發射器1 1與訊號偵、測器1 2的訊號互相影響。因 此，在組裝步驟中，隔離切割道1 0 3係向下延伸至該基 板S中’以使得隔離板工3 3得以埋入該基板§中；如圖 7/斤示，隔離板1 3 3可延伸至該基板S内約G.2公釐（即 隔離切吾彳運1 〇 3向下延伸至該基板s内的深度），藉以 確保訊號發射器1 1與訊號偵測器1 2的訊號可達成較 佳的隔離。 請參考圖4、圖5、圖7，藉由上述步驟後，本發明之 10/16 201241407 感應器單元1的結構包括：一基板s，其上設有兩個獨立 的電路區域1 〇 1、工0 2，而該訊號發射器工工與訊號 偵測裔1 2則分別設置於該兩電路區域丄〇丄、丄〇 2 上且刀別以打線等方式電連接於該兩電路區域1 H、 1 〇 2之電路1 Q〇（如圖6);封裝結構1 0 4係設於該 基板S上以包覆於該訊號發射器11與訊號偵測器1 f ’且封裝結構1 Q 4中形成隔離切割道1 G 3以將該訊 號發射器11隔絕於該訊號偵測器12，再者，隔離件工 3係由可隔絕紅外光之樹脂、塑料等材料所成型，並將隔 離件13安裝於封裝結構1〇4上，而使訊號發射器η 與訊號偵測器12的訊號不會產生干擾。具體而言，隔離 Ilf㈣定或黏接於隔_割道1Q3，以達到隔離訊 “射器1 1與訊號偵測器1 2的目的。在本發明中’封 =結構1 04與隔離件丄3可緊密地固設結合， 挎。 《了避免封裂結構脫離後造成的訊號干 …另：方面，隔離件13之隔離板133係向下延伸至 〜板内部’使訊號可以完全地被隔 進而提高該訊號發射器u與訊號偵測器12:二 果。再者，由於封裝結構ι〇4與隔_13的‘= 故！該感應器單元1在高溫環境下操作時，可且 的可再者，基板W下表面（即 P，如導電焊塾料j )更設有多個連接點 連接點p可電連接於訊號發射器 丄丄…K#期㈠2 ’以利傳輸控制訊號及電源。 11/16 201241407 而在一變化實施例中’亦可利用模具進行第二次的模 造步驟，該模具係與封裝結構1 Q 4配合，以將樹脂、塑 料等材料填人於隔離切割道i 〇 3之中，以形成前述之隔 離件1 3。由於上述之隔離切割w Q 3係將訊號發射端 (包括電路區域1〇A與訊號發射器i1A)與訊號接收 端（電路區域與1 08訊號偵測器1 1 B)區隔成兩個區 域’因此’ #隔離件1 3固化成型，隔離件χ 3之隔離板 1 3 3即可用於隔離每—個感應器單^丄之該訊號發射 器1 1A與該訊號读測器丄丄B，以避免兩元件之間的訊 號串擾（crosstalk)。 以上所述僅為本發明之較佳可行實施例，非因此偈限 本發明之專利範圍，故舉凡運用本發明說明書及圖示内容 所為之等效技術變化，均包含於本發明之範圍内。 【圖式簡單說明】 =1係顯示本發明之將縣結構成型於隸上的示意圖。 =係顯示本發明之經過切割後之感應器區域的示意圖。 :^ ^顯不本發明之將隔離件組裝於每—感應ϋ區域的示 =4係顯示本發明之單—感應器單元的立體分解圖。 =係顯示本發明之單—感應器單元的立體組合圖。 :係顯示本發明之單一感應器單元的上視圖。 13 7係顯示本發明之單一感應器單元的側視圖。 【主要元件符號說明】 12/16 201241407On the circuit area, a package structure is formed into a 5/16"1.201241407 ft. substrate, the package structure covers the at least two circuit regions, the signal transmitter on the at least two circuit regions Two::: two and each circuit area defined - the cutting area community: -: the cutting area defined between the areas of the package == step between the at least two circuit areas兮 salt ^ until the substrate is exposed; and a spacer is assembled to the board, and the spacer is placed and the spacer is placed on the isolated cut-off earth emitter that has exposed the base plate and the signal This signal of the sensor region of the sensor has the following advantageous effects. The present invention is used to assemble the spacers in each of the banks by means of (4). The effect of the present invention; and the sensation produced by the present invention has a structure, so that the sensor unit has a step-by-step understanding of the features and technical contents of the present invention, please refer to the detailed description and description of the invention. The drawings are only for the purpose of illustration and description and are not intended to limit the invention. Gas doing [Embodiment]. See the picture for the month! As shown in Fig. 3, in conjunction with the sensor unit i of Fig. 4, the method is to provide a method and a set of dreams, and the method of the clothing is separated by a mold, which has a package of 3 for the sensor unit 1. And the missing part of the component mounting method: the cost effect can solve the traditional group ^, /, 'making method includes the following steps: Step (). Provide a substrate s, the substrate S contains a plurality of 6/16 201241407 Sensor area 1 〇. As shown in FIG. 1 , in the embodiment, the substrate S includes an array of 6 by 6 sensor regions 1 ,, and each sensor region 10 forms an induction after completing the process described later. Unit 1 (as shown in Figures 4 and 5). Each sensor region 设有 is provided with two independent circuit regions 丄〇丄 ' 1 & 2 on the surface and inside of the substrate S (but the number of the circuit regions 1 〇 1 ' 1 〇 2 may be two or more In the present embodiment, the signal transmitter 丄丄 and the signal detector 12 of the sensor unit i are respectively mounted on each of the sensor regions = = = circuit regions 101, 102, such as solid crystal The method of wiring, etc., = transmitter 1 1 and signal detector 丄 2 are electrically connected to circuit 1 〇 1, 1 0 2 circuit 1 〇〇 (as shown in Figure 6). In the specific embodiment, the sensor unit is a proximity sensor (mity senso丨), and the signal transmitter is illuminated ^^mi, and the signal detector 12 is (4) Detector, (detector) The above-mentioned signal transmitter 2 i and signal detection are die-attached by the die attaching method (die attaching) respectively. The two circuit areas of the device area 1〇1:=: mother- Inductive: signal vestigator "and signal detector" electrical connection:::: Corresponding to circuit 100 of circuit area 101, 102. '金美板2 (2) ·Using a mold forming-package structure 1 〇 4 (4) = ==, _ material is formed on the substrate; 2. Please refer to the figure. In this embodiment, the detector 丄 does not perform the molding step, the step to solidify the packaging material into a penalty (The figure covers the above circuit area 1 0 1 , 1 〇 2, and covers, B 唬 transmitter 11 and 7/16 201241407 • · » » signal controller 1 2, and circuit area work, 丄〇 2 There is a cutting area defined between them, and the packaging material used in the molding step must have the characteristics of the Tiger 5 launcher 11 The optical signal and the signal detector 2 are required to receive the optical signal to avoid affecting the operation of the sensor. For example, the signal detector 2 can be an integrated type. Distance and ambient light source detection component (integrated — and P mity sens〇1 ) 'The package material is a light transmissive package material (such as ★ buckle molded materia); or the signal detector 1 2 can be a single (IR sensor), 2 (4) is a difficult material that can penetrate infrared light. In other words, this is not limited to the material f of the package structure 104, but the package structure 1 〇4 according to the signal transmitter 11 And the specification of the paste detector 12 prevents the package structure 104 from causing the characteristics of the sensor unit 1, and the package structure 1 Q 4 can be used for the signal emitter 1 1 : a convex shaped body to emit a signal The device U emits an electromagnetic signal (2) Γ^γ). & in addition to the mold and performs a -cutting step. After the step of the mold from the substrate s hai seal # structure 10 4, the bolus is removed and removed. To carry out the cutting step. Please refer to Figure 2, 1 〇 “Using a cutting tool such as a tool along the per-sensor area=3= &Quot; scribe line 105 is formed, in other words, the two circuit region of the cut and a square field 10 1,1 2 square region of the reactor in the cutting step further region 10 of each inductor. Furthermore, the cutting areas of the two circuit regions of the second and second circuits are cut to 8/16 201241407: the road 10 is isolated from the cutting track 1 and the isolation cutting channel 1〇3, the isolation cutting Road 1 ◦3 can be exposed two: cutting = and separation: cutting road... Measured: =11, and the circuit area 10 has reached the goal of exposing the substrate S, the isolation of the 0 3 shouting in the package structure 丄Q 4 thickness, so that the two ~ 1 ^ 3 延伸 extends into the substrate S to expose the substrate, in other words, the cutting step in addition to removing the package structure 1 〇 4 better = more downward removal of the substrate A portion of the material of S is formed to form an isolating cut: ◦ 3 '. In the present embodiment, the cutting step is to remove about 0.25 centistokes of the substrate s, but is not limited thereto. The core member (4) is attached to each of the sensor regions, and the spacer 13 is disposed on the barrier core 103 that has exposed the substrate s. Please refer to FIG. 3 'In this step, the multi-pieces are provided, and the spacers 1 3 'the spacers 1 3 are matched with the package structure 1 〇 4 so that the spacers 1 3 are assembled on the sensor area , and fixed. In the isolation cut '() 3 to form an isolation structure. Due to the above isolation cut road 1 〇 3 ir' will. Fl transmitting end (including circuit area 1 ◦ 1 and signal transmitter j 1 ) 14 接收 receiving end (circuit area and 1 〇 2 signal detector 1 2 ) area ^ into two areas, therefore, when spacer 1 3 The package structure 1 〇4 assembled in the sensor area 1 can be used to isolate the signal emitter 1 1 and the signal detector 1 2 of each solid sensing unit 1 to avoid two Signal crosstalk between components. 9/(6 201241407 · Again, the spacer 13 is preferably formed by solidifying the material capable of isolating infrared light, whereby the spacer 3 can be regarded as an infrared barrier. In a specific embodiment, the spacer 3 is utilized. - The injection molding step forms a plastic that can block infrared light, and as shown in FIGS. 4 and 5, the spacer 3 can include a package top plate. _Isolation board 1 3 3 and a plurality of package side slabs 3 2, the top plate of the package 丄3 丄 is provided with a corresponding signal (4)! i is the emission hole position i 3 ◦ a and two corresponding signal detector 1 2 The receiving hole is located at 〇3 〇b. Therefore, in the foregoing assembling step, the package top plate 13 1 is correspondingly mounted on the top surface of the package junction ^ 0 4 , and the hole is oscillated 3 Q a and the receiving hole is located 3 0 b exposes the signal transmitter worker and the signal detector 2, the interference caused by the signal passing through the top surface of the package structure i 〇 4; and the package side plate 133 can surround the package structure 4 On the side, the isolation plate 丄3 3 is set in the isolation cutting channel 丄Q 3 to isolate each of the sensor regions 10 s The emitter 1 1 and the signal detector 1 2 _ on the other hand, in consideration of the flatness of the surface of the substrate S, in order to avoid the contact between the bottom surface of the spacer 133 and the surface of the substrate s is poor, resulting in The signal transmitter 1 1 interacts with the signal of the signal detector 12 . Therefore, in the assembly step, the isolation scribe line 10 3 extends downward into the substrate S to enable the isolation board 3 3 to be buried. Into the substrate §; as shown in Figure 7 / kg, the separator plate 133 can extend into the substrate S about G. 2 mm (that is, the isolation cut Wu 彳 1 〇 3 extends down into the substrate s Depth), to ensure that the signal of the signal transmitter 1 1 and the signal detector 12 can achieve better isolation. Please refer to FIG. 4, FIG. 5 and FIG. 7, after the above steps, the 10/16 201241407 of the present invention. The structure of the sensor unit 1 includes: a substrate s having two independent circuit areas 1 〇 1 and 0 0, and the signal transmitter worker and the signal detecting person 1 2 are respectively disposed on the two The circuit area 丄〇丄, 丄〇2 and the circuit are electrically connected to the circuit 1 Q of the two circuit areas 1 H, 1 〇 2 by way of wire bonding, etc. Q 〇 ( FIG. 6 ); a package structure 104 is disposed on the substrate S to cover the signal emitter 11 and the signal detector 1 f ′ and form an isolation scribe 1 G 3 in the package structure 1 Q 4 The signal transmitter 11 is isolated from the signal detector 12. Further, the spacer 3 is formed of a material that can be insulated from infrared light, plastic, and the like, and the spacer 13 is mounted on the package structure. Up, the signal transmitter η and the signal detector 12 will not interfere with the signal. Specifically, the isolation Ilf (4) is fixed or glued to the _Cut 1Q3 to achieve the isolation signal "1 1 and signal detection" The purpose of the detector 12. In the present invention, the 'sealing = structure 104 and the spacer 丄3 can be tightly fixedly bonded, 挎. "To avoid the signal caused by the detachment of the cracked structure... In addition, the isolation plate 133 of the spacer 13 extends downward to the inside of the slab" so that the signal can be completely separated to enhance the signal transmitter u and the signal Detector Detector 12: two fruits. Furthermore, due to the package structure ι〇4 and _= _=! When the sensor unit 1 is operated in a high temperature environment, the lower surface of the substrate W (ie, P, such as conductive solder material j) is further provided with a plurality of connection point connection points p to be electrically connected to the signal emission.丄丄...K# (1) 2' to facilitate the transmission of control signals and power. 11/16 201241407 In a variant embodiment, a second molding step can also be carried out using a mold which is combined with the package structure 1 Q 4 to fill the insulating cutting path with materials such as resin and plastic. 3, to form the aforementioned spacer 13. Since the above-mentioned isolation and cutting w Q 3 system separates the signal transmitting end (including the circuit area 1A and the signal transmitter i1A) and the signal receiving end (the circuit area and the 1 08 signal detector 1 1 B) into two regions. 'Therefore' #isolator 1 3 is solidified, and the spacer 1-3 of the spacer χ 3 can be used to isolate the signal transmitter 1 1A and the signal reader 丄丄B of each sensor unit. To avoid crosstalk between the two components. The above are only the preferred embodiments of the present invention, and are not intended to limit the scope of the present invention, and the equivalents of the present invention are intended to be included within the scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS =1 is a schematic view showing the formation of a county structure on the subject of the present invention. = shows a schematic representation of the diced sensor area of the present invention. Fig. 4 shows an exploded perspective view of the single-inductor unit of the present invention in which the spacer is assembled in each of the sensing regions. = shows a perspective combination of the single-sensor unit of the present invention. : shows a top view of a single inductor unit of the invention. 13 7 shows a side view of a single inductor unit of the present invention. [Main component symbol description] 12/16 201241407
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P 感應器單元 感應器區域 電路 電路區域 隔離切割道 封裝結構 切割道 訊號發射器 訊號偵測器 隔離件 發射孔位 接收孔位 封裝頂板 封裝側板 隔離板 基板 連接點 13/16P Sensor Unit Sensor Area Circuit Circuit Area Isolation Cutting Channel Package Structure Cutting Channel Signal Transmitter Signal Detector Isolator Transmitter Hole Receive Hole Location Package Top Board Package Side Board Isolation Board Substrate Connection Point 13/16