201241374 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種用於設置及運用計算機之建築物的 數據中心，且特別是有關於一種具節電用導熱管之數據中心。 【先前技術】 一直以來，隨著以伺服器為首之計算機的增加，數據中心 之耗電量也隨著增加。最近，對環保問題的意識逐漸提高，數 據中心之節能問題也被強調為重要課題。因此，對於最近之數 據中心設計，抑制用電量、管理發熱量等項目也被列入要求。 在曰本專利特開2009-257730號公報之發明中揭示一種用 於冷卻伺服器機櫃之空調系統，該空調系統用於以通道區劃手 k將至内區劃成冷通道和熱通道之室内，該通道區劃手段設有 開口部，且備有對冷通道空間供給冷空氣之空調設備，藉由控 制該空調设備之冷卻風量進行溫度管理。 最近，對環保問題及節省能源的意識更進一步的提高。並 且，於信息通信領域中，隨著網際網路利用者的激增，或SaaS 及雲端運算服務的普及，伺服器之使用也隨著急速增加。然 而，隨著伺服器本身的技術進步，比先前運轉發熱量少之計算 機，或比先前可在較高溫狀態下運轉之計算機也逐漸增加。 【發明内容】 有鑒於上述事由，本發明之目的係提供一種建設成本低廉 之數據中心，該數據中心能安定運用伺服器等之計算機，且可 期待能大量抑制運算時之消耗能量。 經發明人致力研討之結果，完成如下述之本發明： 201241374 0)—種數據中心，其係用來設置及運用計算機之建築物， 包括： 間壁，備有開口，用於將建築物内區劃成熱通道區域及冷 通道區域； 第一流路，與上述間壁開口不同一個，連接熱通道及冷通 道； 冷卻裝置，設置於上述第一流路； 第一氣流控制裝置，控制氣流，使得經設置及運用於冷通 道之計算機加熱過之空氣通過間壁開口排放到熱通道，熱通道 内空氣通過第一流路流往冷通道； 第一流路’設置於熱通道内； 第二氣流控制裝置，控制第二流路内之氣流； 且，第二流路之兩端通往建築物外，形成第二流路内空氣 與熱通道内空氣彼此互不交換之結構，第二氣流控制裝置能將 建築物外空氣從第二流路之其中一端流到另一端。 (2) 如（1)所述數據中心，其中，還具備溫度計，用於分別計 測熱通道内溫度及建築物外溫度，第二氣流控制裝置按照所計 測之建築㈣氣溫與熱通道内氣溫之差異控㈣二流路内之 氣流。 (3) 如⑴或⑺所述數據中心，纟中，第二流路具備蛇 構。 、’。 (4) 如（1)至（3)中任一所述數據中心，於熱通道 攪拌空氣之攪拌裝置。 、備用於 依據本發明，數據中心外部氣溫一般比計算機所產生之廢 熱低’利用其來補助冷卻計算機所產生之賴。此時，建築物 外空氣濕度不會給數據中，⑽空氣濕度帶來任何影響，可只期 201241374 待其冷卻效果。於第二流路附近，冷卻熱通道内空氣，即可降 低備於數據中心之冷卻裝置的輸出功率，其結果可達到減低耗 倉b量。且本發明可易於適用於現有數據中心，實現安裝成本低 廉。 依據適宜本發明之實施例，可提高第二流路附近之熱通道 内空乳之冷卻效率。 依據其他適宜實施例，可依據溫度計的量測結果來控制第 ^氣流控制裝置之運轉、輸出功率大小，即可提高熱通道内空 氣之冷卻效率’或者防止過度冷卻。 【實施方式】 為讓本發明之上述和其他目的、特徵、優點與實施例能更 :顯=懂’本說明書將特舉出—系列實施例來加以說明。但值 得注意較’此些實施例只剌以說明本發明之實施方式，而 非用以限定本發明。 本發明之一實施形態即數據中心係用於設置及運用計算 機之建築物。通常，計算機被收容於數據中心内所安裝之機櫃 而被運用，不過機櫃不係絕對必須的。對於計算機或機樞並無 特別限制’可任意選擇各種伺服器或各種形式機植。 圖1顯示本發明實施例之數據中心内部之模式的斜視圖。 數據中心1設有間壁3G。間壁30把數據中則區劃成兩個區 域。設置及運料算機之區域叫做冷通道2G，集中計算機所產 生，廢熱之區域叫做熱通道10。間壁30設有一個以上的開口。 Ί十算機所產生之廢熱加熱過之熱空氣將經由前述開口被 中到熱通道10。 在冷通道20巾’對所設置及利之計算機之布局並無特 201241374 別限制，可適宜參考先前技術。如圖丨所示，其係形成來自收 容計算機（未繪示）之機櫃21上方部分之排氣口 22之廢熱將通 過間壁30之開口流到熱通道10之結構。在此，本發 限定於這種形態。 依據本發明，具有連接熱通道1〇和冷通道2〇之流路Μ。 亦即，藉由流路41，形成空氣可從熱通道1〇流到冷通道2〇之 結構。流路41稱為第一流路。第一流路41與設置於上述間壁 3〇之開口係不同一個流路。如圖所示，把從數據中心之熱通道 1〇之壁面上所設置開口 17到冷通道2〇之壁面上所設•置開口 18之建築物外侧導管視為第一流路4卜但是， 41只要係與間壁3G之開口形成不同__個、各自獨立^ = 10與冷通道2G之間的空氣流路即可，並不限於圖示形態。 根據本發明，熱通道1〇之空氣將被流入第一流路41，隨 著需求冷卻空氣後再流到冷通道2Ge因此，於第—流路Μ備 有冷卻裝置40。對冷卻裝置4G之具體結構並無特別限制，可 適宜引用先前公知之物，不過較佳係能自由調節冷卻用輸出功 率直以來，存有此冷卻裝置4〇所需耗電量過大問題。在 此，形成本發明新採用之下述結構，即有可能盡量減少冷卻裝 置40之運轉進而促進整個數據中心1之節能。 數據中、1内空氣是在上述結構内循環，圖丄所示之箭號 顯示氣抓二氣如箭號201般地流入設置於冷通道2〇之機櫃 仏該空氣被收容於機櫃21之計算機（未繪示）所產生之廢熱加 熱後，如箭號202般地經由機櫃排氣口 22、間壁3〇之開口被 流到熱通道1〇。被加熱過之空氣如箭號2〇3般地從熱通道壁面 上所》又置開口 17流到第-流路4卜經冷卻裝置4〇冷卻，被冷 卻過之空氣如箭號204般地通過冷通道2◦壁面上所設置開口 201241374 18流進冷通道20，再度流到機櫃21。藉由這種空氣循環可以 達到冷卻計算機之目的。這種空氣循環的驅動力係靠第一氣流 控制裝置而成，對於第一氣流控制裝置的具體結構並無特別限 制，可舉例如：可把設置於數據中心内之風扇（未繪示）及控制 該風扇之控制裝置等之整體結構視為第一氣流控制裝置。對於 構築第一氣流控制裝置可適宜引用公知之氣流控制技術等。較 佳係形成冷通道20、熱通道1〇及第一流路41之密閉系統，亦 即，s史§十成與建築外空氣無任何實質往來的結構。 依據本發明，在熱通道1〇中設置第二流路12。第二流路 12内空氣與數據中心i之冷卻計算機用空氣彼此互不交換。第 二流路12係從數據中心"卜部導入空氣。更具體說明：第二 流路12之兩端通往建築外，外部空氣從其中一端流進，所流 進之空氣通過第二流路12從另一端流出到建築物外部。如圖 所示’外氣如箭號HH般地由構成數據中心之建築物外壁上所 設置風機罩11進入，如箭號102般地通過第二流路12，接著 氣流將如箭號103般地流動，最後，空氣如箭號1〇4般地從第 二流路12之另一端設置於建築物外壁上風機罩13排放到建築 物外側。此時’於第二流路12内所流通之空氣與熱通道⑺及 冷通道2 0之間並無空氣來往混合。 當經計算機加熱過被排放到熱通道1〇之空氣比外氣氣溫 高時’因為第二流4 12中通有較低溫之外氣，所以於第二流 路12附近，熱通道10之空氣有可能被冷卻◊亦即，於第二流 路12附近，熱通道10之空氣與來自第二流路12之外氣之= 發生熱交換。但是’應注意到，熱通道1〇之空氣與來自第二 流路12之外氣之間彼此並無發生物質（空氣）交換。因此，建築 物外空氣濕度不會給數據中心i内空氣濕度帶來任何影響，^ 201241374 期待其冷卻效果。於第二流路12附近，熱通道i〇之空氣被冷 卻的話’即可降低上述冷卻裝置4〇之輸出功率，進而達到降 低耗能量。 第二流路12較佳係具備蛇腹結構。具備蛇腹結構之流路， 比較容易操作，特別係例如現有數據中心’即使其設置空間有 限也較容易施工。且具備蛇腹結構可擴大第二流路12之表面 面積，達到提局上述熱交換效率的目的。對於具備蛇腹結構流 路之製造方法，可使用一般市售具蛇腹結構之管狀結構物，亦 可使用習知加工方法賦予蛇腹構造。 第二流路12較佳係具備鰭片。鰭片係指具有呈劍山狀或 蛇腹狀之板或棒之狀態。當第二流路12具有蛇腹構造時，該 蛇腹構造可視為兼具鰭片。當第二流路12具有鰭片時，則於 第二流路12附近，可期待提高於第二流路12内空氣與熱通道 10内空氣之間的熱交換效率。 路12之材質較佳係不會交換第 弟 一一 曰入 w 不 一 /瓜吩 ^ 7Γ 質’且熱交換效率局之物，具體而言，例如紹材等即是合適 質。鋁材管於安裝容易之面也非常適合。 數據中〜1具有第二氣流控制裝置，用於使第二流路 從其中-端吸取外氣，再從另-端排I如上所述：第二氣 控制裝置能隨著箭號101、102、1〇3、1〇4，讓外氣導進到第 流路12再將其排放般地控制氣流。具體而言，例如：可利 風扇（未繪示）等製造上述氣流。 數據中一 1巾較佳係具備溫度計，依據溫度計所計測之，; 度數據操作第二氣流控制裳置。具體而言，測定熱通道i〇f 溫度及數據中心1之外部溫度，按照兩者之溫度差調整第4 抓控制裝置之運轉、輸出功率。—種典型形態係：當熱通道】201241374 VI. Description of the Invention: [Technical Field] The present invention relates to a data center for building and operating a computer building, and more particularly to a data center having a heat pipe for power saving. [Prior Art] As a result of the increase in servers led by servers, the power consumption of data centers has also increased. Recently, awareness of environmental issues has gradually increased, and energy conservation issues in data centers have also been highlighted as important issues. Therefore, for the recent data center design, projects such as suppressing power consumption and managing heat generation are also included in the requirements. An air conditioning system for cooling a server cabinet is disclosed in the invention of the Japanese Patent Laid-Open Publication No. 2009-257730, which is used to divide an inner zone into a cold passage and a hot aisle chamber by a passage zone hand k. The channel division means is provided with an opening portion, and is provided with an air conditioner for supplying cold air to the cold aisle space, and temperature management is performed by controlling the cooling air volume of the air conditioning device. Recently, awareness of environmental issues and energy conservation has been further improved. Moreover, in the field of information communication, with the proliferation of Internet users, or the popularity of SaaS and cloud computing services, the use of servers has also increased rapidly. However, as the technology of the server itself advances, computers that are less heat-generating than previous ones, or computers that are previously operating at higher temperatures, are gradually increasing. SUMMARY OF THE INVENTION In view of the above, an object of the present invention is to provide a data center which is low in construction cost, and which can stably use a computer such as a server, and can expect to suppress a large amount of energy consumed in calculation. Upon the results of the inventors' efforts, the present invention is completed as follows: 201241374 0) - A data center for building and operating a computer building, including: a partition, with an opening for use in a building The first flow path is different from the above-mentioned partition opening to connect the hot channel and the cold channel; the cooling device is disposed on the first flow path; the first air flow control device controls the air flow so that the The computer-heated air disposed and used in the cold passage is discharged to the hot passage through the partition opening, and the air in the hot passage flows through the first flow path to the cold passage; the first flow path is disposed in the hot passage; the second air flow control device, Controlling the air flow in the second flow path; and, the two ends of the second flow path lead to the outside of the building, forming a structure in which the air in the second flow path and the air in the hot channel are not exchanged with each other, and the second air flow control device can The air outside the building flows from one end of the second flow path to the other end. (2) The data center according to (1), further comprising a thermometer for separately measuring the temperature in the hot aisle and the temperature outside the building, and the second airflow controlling device according to the measured building (4) temperature and temperature in the hot aisle Difference control (4) Airflow in the second flow path. (3) In the data center described in (1) or (7), the second flow path has a snake. , '. (4) A stirring device for agitating air in a hot aisle as in any one of (1) to (3). In accordance with the present invention, the temperature outside the data center is generally lower than the waste heat generated by the computer, which is used to subsidize the cooling of the computer. At this time, the air humidity outside the building will not have any effect on the air humidity in the data, (10), and it can only be cooled in 201241374. In the vicinity of the second flow path, cooling the air in the hot aisle reduces the output power of the cooling device installed in the data center, and as a result, the amount of the bunker b can be reduced. Moreover, the present invention can be easily applied to an existing data center, and the installation cost is low. According to an embodiment of the present invention, the cooling efficiency of the empty milk in the hot aisle near the second flow path can be improved. According to other suitable embodiments, the operation of the gas flow control device and the output power can be controlled according to the measurement result of the thermometer, thereby improving the cooling efficiency of the air in the hot aisle or preventing excessive cooling. [Embodiment] The above and other objects, features, advantages and embodiments of the present invention will become more apparent. However, it is to be understood that the embodiments are merely illustrative of the embodiments of the invention and are not intended to limit the invention. An embodiment of the present invention, that is, a data center is used to set up and operate a building of a computer. Usually, the computer is used in a cabinet installed in a data center, but the cabinet is not absolutely necessary. There are no special restrictions on the computer or the armature. Various servers or various forms of machine can be arbitrarily selected. 1 is a perspective view showing a mode inside a data center of an embodiment of the present invention. The data center 1 is provided with a partition 3G. The partition 30 divides the data into two areas. The area where the computer is set up and transported is called the cold aisle 2G, which is generated by a centralized computer. The area of waste heat is called the hot aisle 10. The partition 30 is provided with more than one opening. The hot air heated by the waste heat generated by the computer will be transferred to the hot aisle 10 via the aforementioned opening. The layout of the computer in the cold aisle is not limited to 201241374, and the prior art can be referred to. As shown in Fig. ,, it forms a structure in which waste heat from the exhaust port 22 of the upper portion of the cabinet 21 of the storage computer (not shown) flows through the opening of the partition wall 30 to the hot aisle 10. Here, the present invention is limited to this form. According to the invention, there is a flow path connecting the hot channel 1〇 and the cold channel 2〇. That is, by the flow path 41, a structure in which air can flow from the hot channel 1 to the cold channel 2 is formed. The flow path 41 is referred to as a first flow path. The first flow path 41 is different from the opening provided in the partition 3〇 by one flow path. As shown in the figure, the outer side duct of the building provided with the opening 18 from the opening 17 provided on the wall surface of the hot aisle 1 of the data center to the wall of the cold aisle 2 is regarded as the first flow path 4, but 41 It suffices to form an air flow path between the openings of the partitions 3G and the openings of the partition walls 3G, which are independent of each other, and the cold passages 2G, and are not limited to the illustrated form. According to the present invention, the air of the hot aisle 1 will be flown into the first flow path 41, and then cooled to the cold channel 2Ge as required, so that the cooling means 40 is provided in the first flow path. The specific structure of the cooling device 4G is not particularly limited, and a conventionally known thing can be suitably cited. However, it is preferable to be able to freely adjust the output power for cooling, and the power consumption required for the cooling device 4 is excessive. Here, the following structure newly adopted by the present invention is formed, that is, it is possible to minimize the operation of the cooling device 40 and thereby promote the energy saving of the entire data center 1. In the data, the air in the 1 is circulated in the above structure, and the arrow shown in the figure shows that the gas catches the gas as the arrow 201 flows into the cabinet disposed in the cold aisle 2〇, and the air is accommodated in the cabinet 21 After the waste heat generated by (not shown) is heated, it is flowed to the hot aisle 1 through the opening of the cabinet exhaust port 22 and the partition wall 3 as indicated by the arrow 202. The heated air flows from the wall 17 to the first flow path 4 through the cooling device 4 as shown by the arrow 2〇3, and is cooled by the cooling device 4, and the cooled air is like the arrow 204. The opening 201241374 18 provided through the wall of the cold aisle 2 flows into the cold aisle 20 and flows to the cabinet 21 again. With this air circulation, the purpose of cooling the computer can be achieved. The driving force of the air circulation is formed by the first airflow control device. The specific structure of the first airflow control device is not particularly limited. For example, a fan (not shown) disposed in the data center and The overall structure of the control device or the like that controls the fan is regarded as the first airflow control device. A known airflow control technique or the like can be suitably cited for constructing the first airflow control device. Preferably, the closed system of the cold aisle 20, the hot aisle 1 and the first flow path 41 is formed, that is, the structure of the external air without any substantial interaction with the air outside the building. According to the invention, the second flow path 12 is provided in the hot aisle 1〇. The air in the second flow path 12 and the cooling computer air in the data center i are not exchanged with each other. The second flow path 12 introduces air from the data center " More specifically, both ends of the second flow path 12 lead to the outside of the building, and outside air flows in from one end thereof, and the inflowing air flows out from the other end to the outside of the building through the second flow path 12. As shown in the figure, 'the outside air enters the fan cover 11 provided on the outer wall of the building constituting the data center as the arrow HH, and passes through the second flow path 12 as the arrow 102, and then the air flow will be like the arrow 103 The ground flows. Finally, the air is disposed on the outer wall of the building from the other end of the second flow path 12 as the arrow 1 is discharged to the outside of the building. At this time, there is no air mixing between the air flowing through the second flow path 12 and the hot aisle (7) and the cold aisle 20. When the air that is discharged to the hot aisle by the computer is higher than the temperature of the outside air, 'because the second stream 4 12 has a lower temperature and the outside air, the air of the hot aisle 10 is near the second flow path 12 It is possible to be cooled, that is, in the vicinity of the second flow path 12, heat exchange occurs between the air of the hot aisle 10 and the gas from the second flow path 12. However, it should be noted that there is no substance (air) exchange between the air in the hot aisle 1 and the air from the second flow path 12. Therefore, the ambient air humidity does not have any effect on the air humidity in the data center i, ^ 201241374 expects its cooling effect. In the vicinity of the second flow path 12, if the air in the hot channel i is cooled, the output power of the cooling device 4 can be reduced, thereby reducing the energy consumption. The second flow path 12 preferably has a bellows structure. The flow path with the bellows structure is relatively easy to operate, especially for example, in an existing data center, even if the installation space is limited, it is easier to construct. Moreover, the bellows structure can enlarge the surface area of the second flow path 12, and achieve the purpose of improving the heat exchange efficiency. For the manufacturing method having the bellows structure flow path, a tubular structure which is generally commercially available as a bellows structure can be used, and a bellows structure can be imparted by a conventional processing method. The second flow path 12 is preferably provided with fins. Fin means a state in which it has a plate or a rod of a sword-like shape or a bellows shape. When the second flow path 12 has a bellows configuration, the bellows structure can be regarded as having both fins. When the second flow path 12 has fins, it is expected that the heat exchange efficiency between the air in the second flow path 12 and the air in the hot channel 10 is improved in the vicinity of the second flow path 12. The material of the road 12 is preferably not exchanged for the first brother, and the material of the heat exchange efficiency, specifically, for example, the material is suitable. Aluminum tubes are also very suitable for easy installation. In the data, 〜1 has a second airflow control device for causing the second flow path to draw the outside air from the center thereof, and then from the other end to the row I as described above: the second gas control device can follow the arrows 101 and 102 1, 3, 1 〇 4, let the outside air lead into the first flow path 12 and then discharge it to control the air flow. Specifically, for example, a fan (not shown) or the like is used to manufacture the above airflow. Preferably, one of the data is provided with a thermometer, which is measured according to the thermometer; and the second data control operation is performed. Specifically, the temperature of the hot path i〇f and the outside temperature of the data center 1 are measured, and the operation and output power of the fourth grasping control device are adjusted in accordance with the temperature difference between the two. - a typical morphological system: when the hot channel]
S 201241374 内溫度高於數據中心1之外部溫度、較佳係3<t以上時，運轉 第二氣流控制裝置讓第二流路12中發生上述外氣導進及排放 之氣流。此外，當熱通道10内溫度低於所定值時，則冷卻熱 通道10内空氣之必要性較小，此時較佳停止運轉第二氣流控 制裝置、或僅製造微弱氣流，藉此可達到進一步的節能。例如： 於冬季或夜間外氣氣溫極低時，第二流路12内無需導進外氣 或只需導進極少量外氣即可，如此還可防止計算機之過度冷 卻。為了實施如此之控制，可於熱通道1 〇内設置溫度計14， 於數據中心1外部設置溫度計15。亦可設置更多個溫度計。 於熱通道10内之第二流路12下面較佳係備有接水盤16。 當熱通道10内空氣冷於第二流路12内空氣時，有可能會發生 起因於結露之水滴，接水盤係用於回收該水滴。對於接水盤之 材質、結構、布局等可適宜設定。 較佳可攪拌熱通道10内空氣，用以促進與第二流路12之 熱交換。熱通道10内空氣之攪拌手段可適宜使用一般地風扇 等，例如：將熱通道10内空氣吹到第二流路12達到促進熱交 換的目的。更進一步，較佳係將具有蛇腹構造或鰭片之第二流 路12安裝於數據中心1中，讓熱通道10内空氣吹到該蛇腹構 造或鰭片上般地安裝風扇（未繪示）。當數據中心1中備有溫度 計14、15時，較佳係隨著所取得之溫度數據，藉由風扇（未繪 示）控制熱通道10内空氣之攪拌。例如：當熱通道1〇内氣溫比 預料要高溫時，較佳係加強熱通道10内空氣之搜拌，反之， 當熱通道10内氣溫並不怎麼高時，可停止攪拌或低速攪拌熱 通道10内空氣。 依據本發明’在備有利用熱通道和冷通道之空氣循環之計 算機冷卻裝置之數據中心中，用簡便裝置及方法即可達到降低 201241374 耗倉匕量特別疋，其無需大大改造現有數據中心之建築物本 體’即可以低成本達到信息技術之進__步發展及環境負荷之 一步減輕。 綜上所述，雖然本發明已用較佳實施例揭露如上，然其並 非用以限定本發明，本發明所屬技術領域中具有通常知識者， 在不脫離本發明之精神和範圍内，當可作各種之更 因此本發明之保護範时視後附之申請專利範圍所界定者為 準。 【圖式簡單說明】 為讓本發明之上述和其他目的、特徵、優點與實施例能更 明顯易懂，所附圖式之詳細說明如下： 圖1顯示依照本發明之數據中心内部之模式的斜視圖。 【主要元件符號說明】 1 : 數據中心 10 :熱通道 11 、13 :風機罩 12 :第二流路 14 、15 :溫度計 16 =接水盤 17 、18 :開口 20 :冷通道 21 :機櫃 22 :排氣口 30 :間壁When the temperature in S 201241374 is higher than the external temperature of the data center 1, preferably 3 < t or more, the second air flow control device operates to cause the external air introduction and discharge airflow in the second flow path 12. In addition, when the temperature in the hot aisle 10 is lower than a predetermined value, the necessity of cooling the air in the hot aisle 10 is small, and at this time, it is preferable to stop the operation of the second airflow control device or to manufacture only a weak airflow, thereby achieving further Energy saving. For example, when the outside air temperature is extremely low in winter or at night, there is no need to introduce external air in the second flow path 12 or only a small amount of external air is introduced, so as to prevent excessive cooling of the computer. To implement such control, a thermometer 14 can be placed in the hot aisle 1 , and a thermometer 15 can be placed outside the data center 1. More thermometers can also be set. Preferably, a water receiving tray 16 is provided below the second flow path 12 in the hot aisle 10. When the air in the hot aisle 10 is cooled by the air in the second flow path 12, water droplets due to dew condensation may occur, and the water receiving tray is used to recover the water droplets. The material, structure, layout, etc. of the water tray can be appropriately set. Preferably, air in the hot aisle 10 is agitated to promote heat exchange with the second flow path 12. The stirring means of the air in the hot aisle 10 can be suitably a general fan or the like, for example, blowing air in the hot aisle 10 to the second flow path 12 for the purpose of promoting heat exchange. Furthermore, it is preferred to mount the second flow path 12 having the bellows structure or fins in the data center 1 to allow the air in the hot aisle 10 to be blown onto the bellows structure or fin to mount a fan (not shown). When the temperature meter 14, 15 is provided in the data center 1, it is preferable to control the agitation of the air in the hot aisle 10 by a fan (not shown) in accordance with the obtained temperature data. For example, when the temperature in the hot aisle 1 is higher than expected, it is better to strengthen the air in the hot aisle 10; conversely, when the temperature in the hot aisle 10 is not so high, the stirring or the low-speed stirring hot channel may be stopped. 10 air inside. According to the present invention, in a data center equipped with a computer cooling device for air circulation using a hot aisle and a cold aisle, a simple device and method can be used to achieve a reduction in the consumption of the 201241374, which does not require a major modification of the existing data center. The building ontology can achieve the low-cost information technology advancement and one step reduction of the environmental load. In the above, the present invention has been disclosed in the above preferred embodiments, and is not intended to limit the invention, and the present invention may be made without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features, advantages and embodiments of the present invention will become more <RTIgt; Oblique view. [Main component symbol description] 1 : Data center 10: Hot aisle 11 , 13 : Fan cover 12 : Second flow path 14 , 15 : Thermometer 16 = Water receiving tray 17 , 18 : Opening 20 : Cold aisle 21 : Cabinet 22 : Row Air port 30: partition
S 10 201241374 40 :冷卻裝置 41 :第一流路 101、102 ' 103 ' 104、201 ' 202、203、204 :氣流 11S 10 201241374 40 : cooling device 41 : first flow path 101 , 102 ' 103 ' 104, 201 ' 202, 203, 204 : air flow 11